JP7475791B2 - Method for producing addition-curable silicone composition - Google Patents
Method for producing addition-curable silicone composition Download PDFInfo
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- JP7475791B2 JP7475791B2 JP2021006597A JP2021006597A JP7475791B2 JP 7475791 B2 JP7475791 B2 JP 7475791B2 JP 2021006597 A JP2021006597 A JP 2021006597A JP 2021006597 A JP2021006597 A JP 2021006597A JP 7475791 B2 JP7475791 B2 JP 7475791B2
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- component
- addition
- curable silicone
- silicone composition
- fatty acid
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- 239000000203 mixture Substances 0.000 title claims description 62
- 229920001296 polysiloxane Polymers 0.000 title claims description 43
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- -1 acetylene alcohol compound Chemical class 0.000 claims description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 37
- 239000000843 powder Substances 0.000 claims description 34
- 150000004665 fatty acids Chemical class 0.000 claims description 31
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 30
- 239000000194 fatty acid Substances 0.000 claims description 30
- 229930195729 fatty acid Natural products 0.000 claims description 30
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 16
- 239000000377 silicon dioxide Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 125000003342 alkenyl group Chemical group 0.000 claims description 12
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 10
- 230000003014 reinforcing effect Effects 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 5
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 229910000077 silane Inorganic materials 0.000 claims description 5
- 230000001476 alcoholic effect Effects 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 29
- 239000002184 metal Substances 0.000 description 29
- 239000007789 gas Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- 238000003860 storage Methods 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 230000007774 longterm Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 239000011593 sulfur Substances 0.000 description 6
- 229910052717 sulfur Inorganic materials 0.000 description 6
- 239000002318 adhesion promoter Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- YWWVWXASSLXJHU-AATRIKPKSA-N (9E)-tetradecenoic acid Chemical compound CCCC\C=C\CCCCCCCC(O)=O YWWVWXASSLXJHU-AATRIKPKSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910052681 coesite Inorganic materials 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 229910052906 cristobalite Inorganic materials 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- KEMQGTRYUADPNZ-UHFFFAOYSA-N heptadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)=O KEMQGTRYUADPNZ-UHFFFAOYSA-N 0.000 description 4
- XMHIUKTWLZUKEX-UHFFFAOYSA-N hexacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O XMHIUKTWLZUKEX-UHFFFAOYSA-N 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 229910052682 stishovite Inorganic materials 0.000 description 4
- VHOCUJPBKOZGJD-UHFFFAOYSA-N triacontanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O VHOCUJPBKOZGJD-UHFFFAOYSA-N 0.000 description 4
- 229910052905 tridymite Inorganic materials 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052909 inorganic silicate Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- FRPZMMHWLSIFAZ-UHFFFAOYSA-N 10-undecenoic acid Chemical compound OC(=O)CCCCCCCCC=C FRPZMMHWLSIFAZ-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- YWWVWXASSLXJHU-UHFFFAOYSA-N 9E-tetradecenoic acid Natural products CCCCC=CCCCCCCCC(O)=O YWWVWXASSLXJHU-UHFFFAOYSA-N 0.000 description 2
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- 235000021353 Lignoceric acid Nutrition 0.000 description 2
- CQXMAMUUWHYSIY-UHFFFAOYSA-N Lignoceric acid Natural products CCCCCCCCCCCCCCCCCCCCCCCC(=O)OCCC1=CC=C(O)C=C1 CQXMAMUUWHYSIY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 235000021314 Palmitic acid Nutrition 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000013006 addition curing Methods 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000005370 alkoxysilyl group Chemical group 0.000 description 2
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 2
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 2
- KHAVLLBUVKBTBG-UHFFFAOYSA-N caproleic acid Natural products OC(=O)CCCCCCCC=C KHAVLLBUVKBTBG-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- FARYTWBWLZAXNK-WAYWQWQTSA-N ethyl (z)-3-(methylamino)but-2-enoate Chemical compound CCOC(=O)\C=C(\C)NC FARYTWBWLZAXNK-WAYWQWQTSA-N 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- 229940033355 lauric acid Drugs 0.000 description 2
- 229960004488 linolenic acid Drugs 0.000 description 2
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 229960002446 octanoic acid Drugs 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 235000021313 oleic acid Nutrition 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229940098695 palmitic acid Drugs 0.000 description 2
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 2
- 229960002703 undecylenic acid Drugs 0.000 description 2
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 229910004738 SiO1 Inorganic materials 0.000 description 1
- 229910020489 SiO3 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- DSVRVHYFPPQFTI-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane;platinum Chemical compound [Pt].C[Si](C)(C)O[Si](C)(C=C)C=C DSVRVHYFPPQFTI-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- YGZSVWMBUCGDCV-UHFFFAOYSA-N chloro(methyl)silane Chemical class C[SiH2]Cl YGZSVWMBUCGDCV-UHFFFAOYSA-N 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- QBERHIJABFXGRZ-UHFFFAOYSA-M rhodium;triphenylphosphane;chloride Chemical compound [Cl-].[Rh].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QBERHIJABFXGRZ-UHFFFAOYSA-M 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011949 solid catalyst Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical class S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 1
- 229910052815 sulfur oxide Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 239000011995 wilkinson's catalyst Substances 0.000 description 1
- UTODFRQBVUVYOB-UHFFFAOYSA-P wilkinson's catalyst Chemical compound [Cl-].C1=CC=CC=C1P(C=1C=CC=CC=1)(C=1C=CC=CC=1)[Rh+](P(C=1C=CC=CC=1)(C=1C=CC=CC=1)C=1C=CC=CC=1)P(C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 UTODFRQBVUVYOB-UHFFFAOYSA-P 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Description
本発明は、付加硬化型シリコーン組成物の製造方法に関する。 The present invention relates to a method for producing an addition-curable silicone composition.
電子部品のシール材及び接着剤として使用される付加硬化型シリコーンに関する要求特性は年々厳しさを増している。本来シリコーンは気体透過性が高いために、硫黄含有ガスがシリコーンを透過してしまい、電子部品が損傷する。そこで、付加硬化型シリコーン組成物に金属粉末(特に銅粉、銅メッキ粉末)が充填され、これらが自己犠牲的に硫黄含有ガスと反応し電子部品を保護する技術が知られている。 The required properties for addition-curing silicones used as sealants and adhesives for electronic components are becoming more stringent every year. Silicones are inherently highly gas permeable, so sulfur-containing gases can permeate silicone and damage electronic components. Therefore, a technology is known in which metal powders (particularly copper powder and copper-plated powder) are filled into addition-curing silicone compositions, which then react self-sacrificially with the sulfur-containing gas to protect electronic components.
また、窒素酸化物や硫黄酸化物に代表される酸性ガスも電子部品を腐食させる。これを解決する手段として、シリコーンゴム組成中に塩基性充填剤を予め添加しておき、これらが反応することで内部の電子部品を保護する機能を発現する技術が知られている。 In addition, acidic gases such as nitrogen oxides and sulfur oxides also corrode electronic components. To solve this problem, a technology is known in which a basic filler is added to the silicone rubber composition in advance, and the reaction between these materials results in the function of protecting the internal electronic components.
硫黄含有ガスと酸性ガスの双方を1つの材料で捕捉させるには、金属粉末と塩基性充填剤を共存させることが望ましい。金属粉末(特に銅)の表面は粉末同士の凝集を防ぐために表面処理剤で処理されている。この表面処理剤は脂肪酸を使用するのが一般的である。塩基性充填剤とこの脂肪酸で処理された金属粉末が共存していると中和反応が生じ、脂肪酸が金属粉末表面からなくなってしまう。このような状態になった金属粉末は白金触媒に作用し触媒としての機能が著しく低下してしまう。
なお、本発明に関連する従来技術として、下記文献が挙げられる。
In order to capture both sulfur-containing gases and acidic gases with one material, it is desirable to have a metal powder and a basic filler coexist. The surface of the metal powder (especially copper) is treated with a surface treatment agent to prevent the powder from agglomerating. This surface treatment agent generally uses a fatty acid. When a basic filler coexists with a metal powder treated with this fatty acid, a neutralization reaction occurs, and the fatty acid disappears from the surface of the metal powder. Metal powder in this state acts on the platinum catalyst, significantly reducing its catalytic function.
The following documents are cited as examples of prior art related to the present invention.
したがって、本発明は、脂肪酸で処理された金属粉末と塩基性充填剤とが共存する場合においても、長期保存後の硬化性が良好なシリコーン組成物の製造方法を提供することを目的とする。 The present invention therefore aims to provide a method for producing a silicone composition that exhibits good curing properties after long-term storage, even when a metal powder treated with a fatty acid and a basic filler coexist.
本発明者らは、上記課題を解決するために鋭意研究を重ねた結果、脂肪酸で処理された塩基性充填剤(炭酸カルシウム)等を予め熱処理を行ったものを使用することで、金属粉末が共存する組成でも長期保存後の硬化性が確保されることを見出し、本発明を完成した。
すなわち、本発明は、下記の付加硬化型シリコーン組成物の製造方法を提供するものである。
[1]
(A)一分子中に2個以上のアルケニル基を有するオルガノポリシロキサン、
(B)ケイ素原子に結合する水素原子を一分子中に2個以上有するオルガノハイドロジェンポリシロキサン、
(C)ヒドロシリル化反応触媒、
(D)表面が脂肪酸で処理された金属粉末及び表面が脂肪酸で処理された金属めっき粉末から選ばれる1種以上、
(E)表面が脂肪酸で処理された炭酸カルシウム粉末、
並びに
(F)アセチレンアルコール化合物及び該化合物のアルコール性水酸基がシランまたはシロキサンにより変性された化合物から選ばれる1種以上
を含有する物を混合する付加硬化型シリコーン組成物の製造方法であって、
前記(A)成分と前記(E)成分とを混合した後、熱処理する工程及び
前記熱処理する工程で得られた熱処理物と残りの成分とを混合する工程
を有する付加硬化型シリコーン組成物の製造方法。
[2]
前記(D)成分が、表面が脂肪酸で処理された銅粉末及び表面が脂肪酸で処理された銅めっき粉末から選ばれる1種以上である[1]に記載の付加硬化型シリコーン組成物の製造方法。
[3]
付加硬化型シリコーン組成物が、更に、(G)補強性シリカを含む[1]又は[2]に記載の付加硬化型シリコーン組成物の製造方法。
[4]
熱処理する工程において、前記(A)成分及び前記(E)成分に加え、更に前記(G)成分を混合する[3]に記載の付加硬化型シリコーン組成物の製造方法。
As a result of extensive research to solve the above problems, the inventors discovered that by using a basic filler (calcium carbonate) or the like that has been treated with a fatty acid and that has been heat-treated in advance, hardenability after long-term storage can be ensured even in a composition that also contains metal powder, and thus completed the present invention.
That is, the present invention provides the following method for producing an addition-curable silicone composition.
[1]
(A) an organopolysiloxane having two or more alkenyl groups in one molecule;
(B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms in each molecule;
(C) a hydrosilylation reaction catalyst;
(D) at least one selected from a metal powder having a surface treated with a fatty acid and a metal-plated powder having a surface treated with a fatty acid;
(E) calcium carbonate powder whose surface has been treated with a fatty acid;
and (F) a substance containing one or more compounds selected from the group consisting of an acetylene alcohol compound and a compound in which the alcoholic hydroxyl group of said compound is modified with a silane or a siloxane,
A method for producing an addition-curable silicone composition, comprising: a step of mixing the component (A) and the component (E) and then heat-treating the mixture; and a step of mixing a heat-treated product obtained in the heat-treating step with the remaining components.
[2]
The method for producing an addition-curable silicone composition according to [1], wherein the component (D) is at least one selected from the group consisting of copper powder the surface of which has been treated with a fatty acid and copper-plated powder the surface of which has been treated with a fatty acid.
[3]
The method for producing an addition-curable silicone composition according to [1] or [2], wherein the addition-curable silicone composition further comprises (G) a reinforcing silica.
[4]
The method for producing an addition-curable silicone composition according to [3], wherein in the heat treatment step, in addition to the components (A) and (E), the component (G) is further mixed.
本発明の製造方法により製造される付加硬化型シリコーン組成物は、脂肪酸で処理された金属粉末と塩基性充填剤とが共存する場合においても、長期保存後の硬化性が良好である。したがって、本発明の製造方法により、長期保存可能な一液型付加硬化性シリコーン組成物を得ることができる。 The addition-curable silicone composition produced by the manufacturing method of the present invention has good curability even after long-term storage, even when a metal powder treated with a fatty acid and a basic filler are present. Therefore, the manufacturing method of the present invention makes it possible to obtain a one-part addition-curable silicone composition that can be stored for long periods of time.
以下、本発明をより詳細に説明する。
本発明は、下記(A)~(F)成分及び必要に応じて(G)成分並びにその他の成分を混合する付加硬化型シリコーン組成物の製造方法である。
まず、組成物の各成分について説明する。
The present invention will now be described in more detail.
The present invention relates to a method for producing an addition-curable silicone composition by mixing the following components (A) to (F), and, if necessary, component (G) and other components.
First, each component of the composition will be described.
(A)オルガノポリシロキサン
(A)成分は、1分子中に2個以上のアルケニル基を有するオルガノポリシロキサンである。このオルガノポリシロキサンの分子構造については特に制限はなく、直鎖状、分岐状、環状及び三次元網状構造のうち、いずれであってもよい。
Component (A) is an organopolysiloxane having two or more alkenyl groups in one molecule. There are no particular limitations on the molecular structure of this organopolysiloxane, and it may have a linear, branched, cyclic, or three-dimensional network structure.
アルケニル基としては、ビニル基、アリル基、ブテニル基、ペンテニル基、ヘキセニル基、ヘプテニル基等が挙げられ、特に、ビニル基であることが好ましい。また、分子中のアルケニル基は分子主鎖末端のケイ素原子及び分子鎖途中のケイ素原子のいずれに結合したものであってもよいし、この両方に結合したものであってもよい。 Examples of alkenyl groups include vinyl groups, allyl groups, butenyl groups, pentenyl groups, hexenyl groups, and heptenyl groups, with vinyl groups being particularly preferred. Furthermore, the alkenyl groups in the molecule may be bonded to either the silicon atoms at the ends of the molecular main chain or to silicon atoms in the middle of the molecular chain, or may be bonded to both.
アルケニル基以外のケイ素原子に結合する有機基としては、例えば、メチル基、エチル基、ブロピル基、プチル基、ペンチル基、ヘキシル基、ヘプチル基等のアルキル基;フェニル基、トリル基、キシリル基、ナフチル基等のアリール基;ベンジル基、フェネチル基等のアラルキル基;クロロメチル基、3-クロロプロピル基、3,3,3-トリフロロプロピル基等のハロゲン化アルキル基が挙げられ、特に、メチル基及びフェニル基が好ましい。 Examples of organic groups bonded to silicon atoms other than alkenyl groups include alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, and heptyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups such as benzyl and phenethyl; and halogenated alkyl groups such as chloromethyl, 3-chloropropyl, and 3,3,3-trifluoropropyl. Methyl and phenyl groups are particularly preferred.
このような(A)成分のオルガノポリシロキサンとしては、例えば、分子鎖両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン共重合体、分子鎖両末端トリメチルシロキシ基封鎖メチルビニルポリシロキサン、分子鎖両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン・メチルフェニルシロキサン共重合体、分子鎖両末端ジメチルビニルシロキシ基封鎖ジメチルポリシロキサン、分子鎖両末端ジメチルビニルシロキシ基封鎖メチルビニルポリシロキサン、分子鎖両末端ジメチルビニルシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン共重合体、分子鎖両末端ジメチルビニルシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン・メチルフエニルシロキサン共重合体、分子鎖両末端トリビニルシロキシ基封鎖ジメチルポリシロキサン、
式:R1
3SiO0.5で示されるシロキサン単位と式:R1
2R2SiO0.5で示されるシロキサン単位と式:R1
2SiOで示される単位と式:SiO2で示されるシロキサン単位からなるオルガノポリシロキサン共重合体、
式:R1
2R2SiO0.5で示されるシロキサン単位と式:SiO2で示されるシロキサン単位からなるオルガノポリシロキサン共重合体、
式:R1
3SiO0.5で示されるシロキサン単位と式:R1
2R2SiO0.5で示されるシロキサン単位と式:SiO2で示されるシロキサン単位からなるオルガノポリシロキサン共重合体、
式:R1
2R2SiO0.5で示されるシロキサン単位と式:R1
2SiOで示されるシロキサン単位と式:SiO2で示されるシロキサン単位からなるオルガノポリシロキサン共重合体、
式:R1R2SiOで示されるシロキサン単位と式:R1SiO1.5で示されるシロキサン単位もしくは式:R2SiO1.5で示されるシロキサン単位からなるオルガノポリシロキサン共重合体
及びこれらのオルガノポリシロキサンの2種以上からなる混合物が挙げられる。上記式中のR1はアルケニル基以外の有機基であり、R2はアルケニル基であり、それぞれ前記例示されたものが挙げられる。
Examples of such organopolysiloxanes of component (A) include dimethylsiloxane-methylvinylsiloxane copolymers capped at both molecular chain terminals with trimethylsiloxy groups, methylvinylpolysiloxanes capped at both molecular chain terminals with trimethylsiloxy groups, dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymers capped at both molecular chain terminals with trimethylsiloxy groups, dimethylpolysiloxanes capped at both molecular chain terminals with dimethylvinylsiloxy groups, methylvinylpolysiloxanes capped at both molecular chain terminals with dimethylvinylsiloxy groups, dimethylsiloxane-methylvinylsiloxane copolymers capped at both molecular chain terminals with dimethylvinylsiloxy groups, dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymers capped at both molecular chain terminals with dimethylvinylsiloxy groups, and dimethylpolysiloxanes capped at both molecular chain terminals with trivinylsiloxy groups.
an organopolysiloxane copolymer comprising a siloxane unit represented by the formula: R13SiO0.5 , a siloxane unit represented by the formula: R12R2SiO0.5, a unit represented by the formula: R12SiO , and a siloxane unit represented by the formula: SiO2 ;
an organopolysiloxane copolymer comprising a siloxane unit represented by the formula R12R2SiO0.5 and a siloxane unit represented by the formula SiO2 ;
an organopolysiloxane copolymer comprising a siloxane unit represented by the formula: R13SiO0.5 , a siloxane unit represented by the formula: R12R2SiO0.5 , and a siloxane unit represented by the formula: SiO2 ;
an organopolysiloxane copolymer comprising a siloxane unit represented by the formula: R12R2SiO0.5 , a siloxane unit represented by the formula: R12SiO , and a siloxane unit represented by the formula: SiO2 ;
Examples include organopolysiloxane copolymers consisting of siloxane units represented by the formula R1R2SiO and siloxane units represented by the formula R1SiO1.5 or siloxane units represented by the formula R2SiO1.5 , and mixtures consisting of two or more of these organopolysiloxanes. In the above formula, R1 is an organic group other than an alkenyl group, and R2 is an alkenyl group, and examples thereof include those given above.
(A)成分の25℃における動粘度は、得られる硬化物の物理的特性及び組成物の作業性の観点から、100~500,000mm2/sの範囲内であることが好ましく、特に、300~100,000mm2/sの範囲内であることが好ましい。なお、本明細書において、動粘度は25℃でキャノンフェンスケ型粘度計により測定した値である。 From the viewpoints of the physical properties of the resulting cured product and the workability of the composition, the kinetic viscosity of component (A) at 25°C is preferably in the range of 100 to 500,000 mm2 /s, and particularly preferably in the range of 300 to 100,000 mm2 /s. In this specification, the kinetic viscosity is a value measured at 25°C using a Cannon-Fenske viscometer.
(B)オルガノハイドロジェンポリシロキサン
(B)成分は、1分子中に2個以上、好ましくは3~100個のケイ素原子に結合する水素原子(即ち、Si-H基)を有するオルガノハイドロジェンポリシロキサンである。このオルガノハイドロジェンポリシロキサンの分子構造については特に制限はなく、直鎖状、分岐状、環状及び三次元網状構造のうち、いずれであってもよい。
(B) Organohydrogenpolysiloxane Component (B) is an organohydrogenpolysiloxane having two or more, and preferably from 3 to 100, hydrogen atoms bonded to silicon atoms (i.e., Si—H groups) per molecule. There are no particular limitations on the molecular structure of this organohydrogenpolysiloxane, and it may have any of a linear, branched, cyclic, and three-dimensional network structure.
このようなオルガノハイドロジェンポリシロキサンとしては、例えば、下記平均組成式(2)で表されるものが好ましい。
HaR3
bSiO(4-a-b)/2 (2)
式(2)中、R3は、独立に脂肪族不飽和結合を有しない非置換又は置換の1価炭化水素基であり、a及びbは、0<a<2、0.8≦b≦2かつ0.8<a+b≦3となる数であり、好ましくは0.05≦a≦1、1.5≦b≦2かつ1.8≦a+b≦2.7となる数である
As such an organohydrogenpolysiloxane, for example, one represented by the following average composition formula (2) is preferred.
H a R 3 b SiO (4-ab)/2 (2)
In formula (2), R 3 is independently an unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturated bond, and a and b are numbers satisfying 0<a<2, 0.8≦b≦2, and 0.8<a+b≦3, and preferably 0.05≦a≦1, 1.5≦b≦2, and 1.8≦a+b≦2.7.
R3の脂肪族不飽和結合を有しない非置換又は置換の1価炭化水素基としては、前記成分(A)においてアルケニル基以外のケイ素原子に結合する有機基として例示したものと同様のものが挙げられ、代表的なものは炭素原子数が1~10、特に炭素原子数が1~7のものであり、好ましくはメチル基等の炭素原子数1~3のアルキル基、フェニル基、3,3,3-トリフルオロプロピル基である。 Examples of the unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturated bond for R3 include the same as those exemplified as the organic group bonded to a silicon atom other than an alkenyl group in component (A) above. Representative examples are those having 1 to 10 carbon atoms, particularly 1 to 7 carbon atoms, and preferably an alkyl group having 1 to 3 carbon atoms, such as a methyl group, a phenyl group, and a 3,3,3-trifluoropropyl group.
(B)成分の例としては、例えば、1,1,3,3-テトラメチルジシロキサン、1,3,5,7-テトラメチルテトラシクロシロキサン、1,3,5,7,8-ペンタメチルペンタシクロシロキサン等のシロキサンオリゴマー;分子鎖両末端トリメチルシロキシ基封鎖メチルハイドロジェンポリシロキサン、分子鎖両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチルハイドロジェンシロキサン共重合体、分子鎖両末端シラノール基封鎖メチルハイドロジェンポリシロキサン、分子鎖両末端シラノール基封鎖ジメチルシロキサン・メチルハイドロジェンシロキサン共重合体、分子鎖両末端ジメチルハイドロジェンシロキシ基封鎖ジメチルポリシロキサン、分子鎖両末端ジメチルハイドロジェンシロキシ基封鎖メチルハイドロジェンポリシロキサン、分子鎖両末端ジメチルハイドロジェンシロキシ基封鎖ジメチルシロキサン・メチルハイドロジェンシロキサン共重合体等;R3(H)SiO1/2単位とSiO4/2単位からなり、任意にR3SiO1/2単位、R3 2SiO2/2単位、R3(H)SiO2/2単位、(H)SiO3/2単位又はR3SiO3/2単位を含み得るシリコーンレジン(式中、R3は前記と同じである)等が挙げられる。 Examples of component (B) include siloxane oligomers such as 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethyltetracyclosiloxane, and 1,3,5,7,8-pentamethylpentacyclosiloxane; methylhydrogenpolysiloxanes capped with trimethylsiloxy groups at both molecular chain terminals, dimethylsiloxane-methylhydrogensiloxane copolymers capped with trimethylsiloxy groups at both molecular chain terminals, methylhydrogenpolysiloxanes capped with silanol groups at both molecular chain terminals, dimethylsiloxane-methylhydrogensiloxane copolymers capped with silanol groups at both molecular chain terminals, dimethylpolysiloxanes capped with dimethylhydrogensiloxy groups at both molecular chain terminals, methylhydrogenpolysiloxanes capped with dimethylhydrogensiloxy groups at both molecular chain terminals, dimethylsiloxane-methylhydrogensiloxane copolymers capped with dimethylhydrogensiloxy groups at both molecular chain terminals, and the like ; Examples of such silicone resins include silicone resins which are composed of (H)SiO1 /2 units and SiO4 /2 units and may optionally contain R3SiO1 /2 units , R32SiO2 /2 units , R3 (H)SiO2/2 units, (H)SiO3 /2 units or R3SiO3 /2 units (wherein R3 is the same as defined above).
(B)成分の使用量は、(B)成分由来のSi-H基が(A)成分由来のアルケニル基1個に対して好ましくは0.1~5.0個となる量、より好ましくは0.1~2.0個となる量である。
本発明の組成物中、(A)成分及び(B)成分の含有量は、40~95質量%が好ましく、45~90質量%がより好ましく、50~85質量%がさらに好ましい。
The amount of component (B) used is preferably an amount such that the number of Si—H groups derived from component (B) is 0.1 to 5.0, and more preferably 0.1 to 2.0, per alkenyl group derived from component (A).
In the composition of the present invention, the content of the components (A) and (B) is preferably from 40 to 95% by mass, more preferably from 45 to 90% by mass, and even more preferably from 50 to 85% by mass.
(C)ヒドロシリル化反応触媒
(C)成分は、(A)成分由来のアルケニル基と、(B)成分由来のヒドロシリル基(Si-H基)との付加反応を促進するための触媒であり、ヒドロシリル化反応に用いられる触媒として周知の触媒を用いることができる。その具体例としては、例えば、白金(白金黒を含む)、ロジウム、パラジウム等の白金族金属単体;H2PtCl4・nH2O、H2PtCl6・nH2O、NaHPtCl6・nH2O、KaHPtCl6・nH2O、Na2PtCl6・nH2O、K2PtCl4・nH2O、PtCl4・nH2O、PtCl2、Na2HPtCl4・nH2O(但し、式中、nは0~6の整数であり、好ましくは0又は6である)等の塩化白金、塩化白金酸及び塩化白金酸塩;アルコール変性塩化白金酸(米国特許第3,220,972号明細書参照);塩化白金酸とオレフィンとのコンプレックス(米国特許第3,159,601号明細書、同第3,159,662号明細書、同第3,775,452号明細書参照);白金黒、パラジウム等の白金族金属を酸化アルミニウム、シリカ、カーボン等の担体に担持させたもの;ロジウム-オレフィンコンプレックス;クロロトリス(トリフェニルフォスフィン)ロジウム(ウィルキンソン触媒);塩化白金、塩化白金酸又は塩化白金酸塩とビニル基含有シロキサン、特にビニル基含有環状シロキサンとのコンプレックスなどが挙げられる。
(C) Hydrosilylation reaction catalyst Component (C) is a catalyst for promoting the addition reaction between the alkenyl group derived from component (A) and the hydrosilyl group (Si-H group) derived from component (B), and any of the well-known catalysts for hydrosilylation reactions can be used. Specific examples of such catalysts include platinum group metals such as platinum (including platinum black), rhodium, and palladium; H 2 PtCl 4.nH 2 O, H 2 PtCl 6.nH 2 O, NaHPtCl 6.nH 2 O, KaHPtCl 6.nH 2 O, Na 2 PtCl 6.nH 2 O, K 2 PtCl 4.nH 2 O, PtCl 4.nH 2 O, PtCl 2 , Na 2 HPtCl 4.nH 2 and the like. Examples of suitable platinum complexes include platinum chloride, chloroplatinic acid and chloroplatinate salts such as chloroplatinic acid 100 (wherein n is an integer of 0 to 6, preferably 0 or 6); alcohol-modified chloroplatinic acid (see U.S. Pat. No. 3,220,972); complexes of chloroplatinic acid and olefins (see U.S. Pat. Nos. 3,159,601, 3,159,662 and 3,775,452); platinum black, palladium or other platinum group metals supported on aluminum oxide, silica, carbon or other carriers; rhodium-olefin complexes; chlorotris(triphenylphosphine)rhodium (Wilkinson's catalyst); and complexes of platinum chloride, chloroplatinic acid or chloroplatinate salts with vinyl group-containing siloxanes, particularly vinyl group-containing cyclic siloxanes.
これらの触媒の使用にあたっては、それが固体触媒であるときには固体状で使用することも可能であるが、本発明の組成物を均一に硬化させるためには、塩化白金酸や上記錯体及び上記化合物を、例えば、トルエンやエタノール等の適切な溶剤に溶解させて使用することが好ましい。 When using these catalysts, if they are solid catalysts, they can be used in solid form, but in order to cure the composition of the present invention uniformly, it is preferable to use chloroplatinic acid, the above complexes, and the above compounds dissolved in a suitable solvent such as toluene or ethanol.
(C)成分の使用量は、所謂触媒量でよく、(A)成分に対する白金族金属元素の質量換算で、0.1~500ppmが好ましく、0.5~200ppm程度がより好ましい。 The amount of component (C) used may be a so-called catalytic amount, preferably 0.1 to 500 ppm, and more preferably 0.5 to 200 ppm, in terms of the mass of platinum group metal element relative to component (A).
(D)表面が脂肪酸で処理された金属粉末又は金属めっき粉末
(D)成分は、表面が脂肪酸で処理された金属粉末、表面が脂肪酸で処理された金属めっき粉末又はその両方である。
金属としては、金、銀、銅、鉄、ニッケル、アルミニウム、錫、亜鉛などが例示される。硫黄含有ガスによって硫化されることにより、硫黄含有ガスの電気・電子部品への到達を防止又は遅延する効果があるものであればよいが、金属の安定性や価格面から銅が好ましい。
金属めっき粉末は、シリカ等の金属酸化物粉末及び有機樹脂粉末等に、上記した金属粉末で例示した金属をめっきしたものであり、めっきする金属としては金、銀、銅が好ましく、特に銅が好ましい。
(D) Metal Powder or Metal Plated Powder Surface-Treated with Fatty Acid Component (D) is a metal powder surface-treated with a fatty acid, a metal plated powder surface-treated with a fatty acid, or both.
Examples of metals include gold, silver, copper, iron, nickel, aluminum, tin, zinc, etc. Any metal may be used as long as it is sulfurized by a sulfur-containing gas to prevent or delay the sulfur-containing gas from reaching electric or electronic components, but copper is preferred in terms of metal stability and cost.
The metal-plated powder is prepared by plating a metal oxide powder such as silica or an organic resin powder with a metal such as one of the metal powders described above. The preferred metals for plating are gold, silver, and copper, with copper being particularly preferred.
本発明で用いられる金属粉末及び金属めっき粉末は、脂肪酸で表面処理されているものであり、脂肪酸としては、カプリル酸、ウンデシレン酸、ラウリル酸、ミリスチン酸、バルミチン酸、マーガリン酸、ステアリン酸、アラギン酸、リグノセリン酸、セロチン酸、メリシン酸、ミリストレイン酸、オレイン酸、リノール酸、リノレン酸などが例示される。 The metal powder and metal plating powder used in the present invention are surface-treated with a fatty acid, and examples of the fatty acid include caprylic acid, undecylenic acid, lauric acid, myristic acid, palmitic acid, margaric acid, stearic acid, allaginic acid, lignoceric acid, cerotic acid, melissic acid, myristoleic acid, oleic acid, linoleic acid, and linolenic acid.
脂肪酸の表面処理方法は特に限定されず、公知の方法で金属粉末又は金属めっき粉末に脂肪酸を表面処理したものを(D)成分として用いることができる。また、(D)成分の形状は、特に限定されないが、樹枝状のものが好ましい。なお、組成物の流動性及び補強性を考慮すると、(D)成分の体積基準の粒度分布におけるメジアン径(D50)が好ましくは0.05~50μmであり、より好ましくは0.5~30μmである。 The method of surface treatment with fatty acid is not particularly limited, and a metal powder or metal plating powder surface-treated with fatty acid by a known method can be used as component (D). In addition, the shape of component (D) is not particularly limited, but dendritic shape is preferable. In consideration of the fluidity and reinforcing properties of the composition, the median diameter (D50) in the volume-based particle size distribution of component (D) is preferably 0.05 to 50 μm, more preferably 0.5 to 30 μm.
(D)成分の添加量は、(A)成分100質量部に対して0.1~50質量部が好ましく、より好ましくは1~30質量部である。 The amount of component (D) added is preferably 0.1 to 50 parts by mass, and more preferably 1 to 30 parts by mass, per 100 parts by mass of component (A).
(E)表面が脂肪酸で処理された炭酸カルシウム粉末
(E)成分は、塩基性を有する炭酸カルシウム粉末表面が脂肪酸で処理されているものであり、表面処理に用いる脂肪酸としては、カプリル酸、ウンデシレン酸、ラウリル酸、ミリスチン酸、バルミチン酸、マーガリン酸、ステアリン酸、アラギン酸、リグノセリン酸、セロチン酸、メリシン酸、ミリストレイン酸、オレイン酸、リノール酸、リノレン酸などが例示される。
(E) Calcium carbonate powder surface-treated with fatty acid Component (E) is a calcium carbonate powder having basicity, the surface of which has been treated with a fatty acid. Examples of the fatty acid used for the surface treatment include caprylic acid, undecylenic acid, lauric acid, myristic acid, palmitic acid, margaric acid, stearic acid, allaginic acid, lignoceric acid, cerotic acid, melissic acid, myristoleic acid, oleic acid, linoleic acid, and linolenic acid.
(E)成分の粒子径は、組成物の流動性及び補強性を考慮すると、体積基準の粒度分布におけるメジアン径(D50)が好ましくは0.05~50μmであり、より好ましくは0.5~30μmである。 Considering the fluidity and reinforcing properties of the composition, the particle size of component (E) is preferably 0.05 to 50 μm, more preferably 0.5 to 30 μm, in terms of the median size (D50) in the volume-based particle size distribution.
このような炭酸カルシウム粉末としては、市販品を使用することができ、例えば、丸尾カルシウム(株)製のMCコートS-20等を用いることができる。 Commercially available calcium carbonate powders can be used, such as MC Coat S-20 manufactured by Maruo Calcium Co., Ltd.
(E)成分の添加量は、(A)成分100質量部に対して0.1~200質量部が好ましく、より好ましくは1~100質量部である。 The amount of component (E) added is preferably 0.1 to 200 parts by mass, and more preferably 1 to 100 parts by mass, per 100 parts by mass of component (A).
(F)アセチレンアルコール化合物又はその誘導体
(F)成分は、アセチレンアルコール化合物又は該化合物のアルコール性水酸基がシランもしくはシロキサンにより変性された化合物であり、付加硬化型シリコーン組成物において付加反応制御剤として作用する。
(F) Acetylene Alcohol Compound or Derivative Thereof Component (F) is an acetylene alcohol compound or a compound in which the alcoholic hydroxyl group of such a compound has been modified with silane or siloxane, and acts as an addition reaction inhibitor in the addition-curable silicone composition.
アセチレンアルコール化合物としては、エチニル基と水酸基が同一分子内に存在するものであればよいが、エチニル基と水酸基は同一炭素原子に結合しているものが好ましい。その具体例としては下記構造式で表される化合物等が挙げられる。
また、アセチレンアルコール化合物のアルコール性水酸基がシラン又はシロキサンにより変性された化合物とは、アセチレンアルコールの水酸基の水素原子がSi-O-C結合に置換された形でシランもしくはシロキサン部分と結合したものである。その具体例としては下記構造式で表される化合物等が挙げられる。
(F)成分は、1種単独または2種以上を組み合わせて使用してもよい。その配合量は、(A)成分100質量部に対して、好ましくは0.0001~5質量部、より好ましくは0.001~3質量部、更に好ましくは0.01~1質量部である。 Component (F) may be used alone or in combination of two or more. The amount of component (F) to be used is preferably 0.0001 to 5 parts by mass, more preferably 0.001 to 3 parts by mass, and even more preferably 0.01 to 1 part by mass, per 100 parts by mass of component (A).
(G)補強性シリカ
前記組成物には、機械的強度を補強するため、補強性シリカを配合してもよい。補強性シリカとしては、例えば煙霧質シリカ、沈降シリカ、焼成シリカ、石英粉末、珪藻土などが挙げられる。また、BET法による比表面積が50m2/g以上、特に50~500m2/gの微粉末シリカが好ましく、このような微粉末シリカはそのまま使用してもよいが、組成物に流動性を付与させるため、メチルクロロシラン類、ジメチルポリシロキサン、ヘキサメチルジシラザンなどの有機ケイ素化合物で処理した微粉末シリカを使用することが好ましい。
(G) Reinforcing Silica The composition may contain reinforcing silica to reinforce the mechanical strength. Examples of reinforcing silica include fumed silica, precipitated silica, calcined silica, quartz powder, and diatomaceous earth. In addition, finely powdered silica having a specific surface area of 50 m 2 /g or more, particularly 50 to 500 m 2 /g, as measured by the BET method, is preferred. Although such finely powdered silica may be used as is, it is preferred to use finely powdered silica treated with an organosilicon compound such as methylchlorosilanes, dimethylpolysiloxane, or hexamethyldisilazane in order to impart fluidity to the composition.
(G)成分は、1種単独または2種以上を組み合わせて使用してもよい。(G)成分を使用する場合の配合量は、(A)成分100質量部に対して、好ましくは0.1~200質量部、より好ましくは1~100質量部である。 The (G) component may be used alone or in combination of two or more types. When using the (G) component, the blending amount is preferably 0.1 to 200 parts by mass, more preferably 1 to 100 parts by mass, per 100 parts by mass of the (A) component.
(H)接着性付与剤
また、硬化物に金属や有機樹脂に対する接着性が必要な場合は、接着性付与剤を配合してもよい。接着性付与剤としては、シランカップリング剤やエポキシ基、アルコキシシリル基、(メタ)アクリル基等の反応性基を有するシロキサンが例示され、エポキシ基、アルコキシシリル基、(メタ)アクリル基等のカルボニル基から選ばれる少なくとも1種の官能基を有する、シラン及びシロキサンから選ばれる接着性付与剤が好ましい。
(H) Adhesion promoter If the cured product requires adhesion to metals or organic resins, an adhesion promoter may be blended in. Examples of the adhesion promoter include silane coupling agents and siloxanes having reactive groups such as epoxy groups, alkoxysilyl groups, and (meth)acrylic groups, and an adhesion promoter selected from silanes and siloxanes having at least one functional group selected from carbonyl groups such as epoxy groups, alkoxysilyl groups, and (meth)acrylic groups is preferred.
接着性付与剤を配合する場合の添加量としては、(A)成分100質量部に対して0.5質量部以上であることが好ましく、ゴム弾性、接着性を考慮すると、0.5~10質量部であることが好ましい。 When an adhesion promoter is added, the amount added is preferably 0.5 parts by mass or more per 100 parts by mass of component (A), and taking into account rubber elasticity and adhesion, it is preferably 0.5 to 10 parts by mass.
前記組成物には、上記した成分に加え、本発明の目的を損なわない範囲で、更に、補強性のシリコーンレジン;ケイ酸カルシウム、二酸化チタン、酸化第二鉄、カーボンブラック等の(G)成分以外の無機充填剤等を配合してもよい。 In addition to the above-mentioned components, the composition may further contain reinforcing silicone resins; inorganic fillers other than component (G), such as calcium silicate, titanium dioxide, ferric oxide, and carbon black, within the scope of the present invention.
[工程1:熱処理工程]
本発明の付加硬化型シリコーン組成物の製造方法は、前記(A)一分子中に2個以上のアルケニル基を有するオルガノポリシロキサンの一部又は全部と前記(E)表面が脂肪酸で処理された炭酸カルシウム粉末とを混合し、好ましくは50℃以上、より好ましくは80℃~200℃で、更に好ましくは100℃~180℃で熱処理する工程を有することを特徴とする。この熱処理工程において、減圧条件下で熱処理を行うことが好ましい。
この熱処理工程を行わない場合、組成物が長期保存後の硬化性に劣るものとなる。
[Step 1: Heat treatment step]
The method for producing an addition-curable silicone composition of the present invention is characterized by comprising the step of mixing all or a part of (A) the organopolysiloxane having two or more alkenyl groups in one molecule with (E) the calcium carbonate powder having a surface treated with a fatty acid, and heat-treating the mixture at a temperature of preferably 50° C. or higher, more preferably 80° C. to 200° C., and even more preferably 100° C. to 180° C. In this heat-treatment step, the heat treatment is preferably performed under reduced pressure conditions.
If this heat treatment step is not carried out, the composition will have poor curability even after long-term storage.
本熱処理工程において、ヒドロシリル化反応が起こる組み合わせでない限り、前記(A)成分及び前記(E)成分以外の成分を混合してもよく、例えば、前記(A)成分、前記(E)成分及び前記(G)成分を用いることが好ましいものとして挙げられる。 In this heat treatment process, components other than the components (A) and (E) may be mixed as long as the combination does not cause a hydrosilylation reaction. For example, it is preferable to use the components (A), (E) and (G).
[工程2:混合工程]
前記熱処理工程に次いで、前記熱処理工程で得られた熱処理物と、残りの前記各成分とを均一に混合することにより付加硬化型シリコーン組成物が得られる。混合方法は、従来公知の方法に従えばよく、混合する装置としては、プラネタリーミキサー等が挙げられる。
本発明の製造方法により得られた付加硬化型シリコーン組成物は、通常の付加反応硬化型シリコーン組成物と同様に、2液に分け、使用時にこの2液を混合して硬化させる所謂二液型の組成物としてもよいが、組成物を使用する際の作業性等の点から一液型とすることが好ましい。
一液型の付加硬化性シリコーン組成物とする場合、前記熱処理工程後の混合物と、熱処理工程に(A)成分の一部を供した場合は残部の(A)成分を含む残りの各成分とを混合する。残りの各成分の添加順は特に問わない。
このような方法により、長期保存後の硬化性が良好である一液型付加硬化性シリコーン組成物を得ることができる。さらに、本発明の製造方法により得られる付加硬化性シリコーン組成物は、電子部品のシール材及び接着剤として、硫黄含有ガス及び酸性ガスにさらされる環境下においても、電子部品を保護可能な材料として使用することができる。
[Step 2: Mixing step]
Following the heat treatment step, the heat-treated product obtained in the heat treatment step is mixed uniformly with the remaining components to obtain an addition-curable silicone composition. The mixing method may be any method known in the art, and examples of the mixing device include a planetary mixer.
The addition-curable silicone composition obtained by the production method of the present invention may be, like ordinary addition-reaction-curable silicone compositions, divided into two liquids, which are mixed and cured at the time of use, to form a so-called two-liquid composition; however, from the standpoint of workability when using the composition, etc., it is preferable to form the composition as a one-liquid type.
When preparing a one-liquid addition-curable silicone composition, the mixture obtained after the heat treatment step is mixed with the remaining components, including the remainder of component (A) if only a portion of component (A) was added to the heat treatment step. The order in which the remaining components are added is not particularly important.
By using such a method, it is possible to obtain a one-part addition-curable silicone composition that exhibits good curability even after long-term storage. Furthermore, the addition-curable silicone composition obtained by the production method of the present invention can be used as a sealing material or adhesive for electronic components, and as a material that can protect electronic components even in environments exposed to sulfur-containing gases and acidic gases.
本発明の製造方法により得られる付加硬化型シリコーン組成物は、公知の硬化型シリコーンゴム組成物と同様の方法、条件で硬化し得、例えば常温でも十分硬化し得るが、必要に応じて加熱してもよい。加熱する場合、通常加熱温度60~200℃、特に80~170℃で硬化させることが好ましい。硬化時間は、硬化温度や成形方法等により異なるが、通常1分~24時間程度である。 The addition-curable silicone composition obtained by the manufacturing method of the present invention can be cured in the same manner and under the same conditions as known curable silicone rubber compositions. For example, it can be sufficiently cured at room temperature, but it may be heated if necessary. When heating, it is usually preferable to cure at a heating temperature of 60 to 200°C, and particularly 80 to 170°C. The curing time varies depending on the curing temperature and molding method, but is usually about 1 minute to 24 hours.
以下に、実施例及び比較例を示し、本発明をさらに具体的に説明する。 The following examples and comparative examples will explain the present invention in more detail.
[実施例1~3、比較例1~4]
表1に示す配合量(質量部)で下記(A)~(F)成分を用い、以下の手順で付加硬化型シリコーン組成物を製造した。なお、(D)成分のD50は、Microtrac MT3000(日機装社製)を用いて測定した体積基準の粒度分布における値である。
各組成中のうち(A)成分の一部(50質量部)、(E)成分、及び(G)成分(使用する場合)を混合し、150℃2時間の熱処理工程を行った。熱処理工程の際の圧力は、0.08MPa以下であった。(A)成分、(E)成分、及び(G)成分の混合物を、25℃、大気圧まで戻した後、残りの(A)成分、(C)成分、(F)成分、(B)成分、(H)成分(使用する場合)、(D)成分の順で添加し、混合を行った後、減圧脱泡処理を行い、組成物を得た。
[比較例5]
実施例1において熱処理工程を実施しない以外は実施例1と同様の手順で、すなわち、(A)成分の一部(50質量部)、(E)成分、及び(G)成分の混合物に、残りの(A)成分、(C)成分、(F)成分、(B)成分、(D)成分の順で添加し、混合を行った後、減圧脱泡処理を行い、組成物を得た。
[比較例6]
実施例2において熱処理工程を実施しない以外は実施例2と同様の手順で、すなわち、(A)成分の一部(50質量部)、(E)成分、及び(G)成分の混合物に、残りの(A)成分、(C)成分、(F)成分、(B)成分、(H)成分、(D)成分の順で添加し、混合を行った後、減圧脱泡処理を行い、組成物を得た。
[Examples 1 to 3, Comparative Examples 1 to 4]
An addition-curable silicone composition was produced according to the following procedure using the components (A) to (F) in the amounts (parts by mass) shown in Table 1. Note that the D50 of component (D) is a value in the volume-based particle size distribution measured using a Microtrac MT3000 (manufactured by Nikkiso Co., Ltd.).
Of each composition, a portion (50 parts by mass) of component (A), component (E), and component (G) (if used) were mixed and subjected to a heat treatment step at 150° C. for 2 hours. The pressure during the heat treatment step was 0.08 MPa or less. After the mixture of components (A), (E), and (G) was returned to 25° C. and atmospheric pressure, the remaining components (A), (C), (F), (B), (H) (if used), and (D) were added in this order and mixed, followed by a degassing treatment under reduced pressure to obtain a composition.
[Comparative Example 5]
The same procedure as in Example 1 was repeated except that the heat treatment step in Example 1 was not performed. In other words, the remaining components (A), (C), (F), (B) and (D) were added in this order to a mixture of a portion (50 parts by mass) of the component (A), the component (E), and the component (G); the mixture was mixed, and then subjected to a degassing treatment under reduced pressure to obtain a composition.
[Comparative Example 6]
The same procedure as in Example 2 was followed except that the heat treatment step was not performed. In other words, the remaining components (A), (C), (F), (B), (H) and (D) were added in this order to a mixture of a portion (50 parts by mass) of the component (A), the component (E), and the component (G); the mixture was mixed, and then subjected to a degassing treatment under reduced pressure to obtain a composition.
(A)成分:
(A-1)分子鎖両末端ジメチルビニルシロキシ基封鎖ジメチルシロキサン(25℃における動粘度10,000mm2/s)
(A-2)Vi(Me)2SiO1/2単位とSiO4/2単位とからなるポリシロキサンレジン(25℃における動粘度5,000mm2/s、SiO4/2単位に対するVi(Me)2SiO1/2単位のモル比:0.8)
Component (A):
(A-1) Dimethylsiloxane terminated at both molecular chain ends with dimethylvinylsiloxy groups (kinematic viscosity at 25°C: 10,000 mm 2 /s)
(A-2) Polysiloxane resin consisting of Vi(Me) 2SiO1 /2 units and SiO4 /2 units (kinematic viscosity at 25°C: 5,000 mm2 /s, molar ratio of Vi(Me)2SiO1/ 2 units to SiO4 / 2 units: 0.8)
(B)成分:下記式で表されるオルガノハイドロジェンポリシロキサン
(C)成分:白金-ジビニルテトラメチルジシロキサン錯体のトルエン溶液(白金元素含有量0.5質量%) Component (C): Toluene solution of platinum-divinyltetramethyldisiloxane complex (elemental platinum content: 0.5% by mass)
(D)成分:
(D-1)銅粉末(福田金属箔粉工業(株)製FCC-SP-99、樹枝状電解銅粉、脂肪酸処理、D50(μm)<13)
(D-2)銅粉末(D-1(市販品)の脂肪酸処理を無しとしたもの)
Component (D):
(D-1) Copper powder (FCC-SP-99, dendritic electrolytic copper powder, fatty acid treatment, D50 (μm) <13, manufactured by Fukuda Metal Foil and Powder Co., Ltd.)
(D-2) Copper powder (D-1 (commercial product) not treated with fatty acid)
(E)成分:
(E-1)表面が脂肪酸にて処理された重質炭酸カルシウム(丸尾カルシウム(株)製MCコートS-20)
(E-2)表面が無処理の炭酸カルシウム(白石カルシウム(株)製ホワイトンSSB)
Component (E):
(E-1) Ground calcium carbonate whose surface has been treated with a fatty acid (MC Coat S-20, manufactured by Maruo Calcium Co., Ltd.)
(E-2) Calcium carbonate with untreated surface (Whiten SSB, manufactured by Shiraishi Calcium Co., Ltd.)
(F)成分:エチニルシクロヘキサノール (F) Ingredient: Ethynylcyclohexanol
(G)成分:ヘキサメチルジシラザンで表面処理された煙霧質シリカ(BET比表面積300m2/g) Component (G): Fumed silica surface-treated with hexamethyldisilazane (BET specific surface area: 300 m2 /g)
(H)成分:下記構造式で表される化合物
[硬化性の評価]
製造直後及び5℃で6か月保管後の各組成物について、アルファテクノロジー社製レオメーターMDR2000を用いて、各組成物を100℃で加熱し、加熱終了時と比較して10%のトルクに到達した時間をT10、90%のトルクに到達した時間をT90として測定し、組成物の硬化性を下記の指標により評価した。
〇:T10が15分以内かつT90が30分以内
△:T10が30分以内かつT90が30分を超えて60分以内
又はT10が15分を超えて30分以内かつT90が30分以内
×:硬化しない、またはT10が30分を超える
[Evaluation of Curability]
Each composition was heated at 100°C using an Alpha Technology MDR2000 rheometer immediately after production and after storage at 5°C for 6 months. The time at which the torque reached 10% compared to the time at the end of heating was measured as T10, and the time at which the torque reached 90% was measured as T90. The curability of the composition was evaluated using the following index.
◯: T10 is 15 minutes or less and T90 is 30 minutes or less. △: T10 is 30 minutes or less and T90 is more than 30 minutes and less than 60 minutes, or T10 is more than 15 minutes and less than 30 minutes and T90 is 30 minutes or less. ×: Not cured, or T10 exceeds 30 minutes.
表1に示されるとおり、本発明の製造方法により得られた組成物は長期保管後の硬化性が維持されていた。
一方、表面に脂肪酸処理を行っていない炭酸カルシウムを用いた比較例1、2では、初期および長期保管後の硬化性が劣り、表面に脂肪酸処理を行っていない銅粉末を用いた比較例3、4、並びに(A)成分と(E)成分との混合物の熱処理工程を行っていない比較例5、6では、長期保管後の硬化性が不十分なものとなった。
As shown in Table 1, the composition obtained by the production method of the present invention maintained its curability even after long-term storage.
On the other hand, in Comparative Examples 1 and 2, which used calcium carbonate whose surface was not treated with a fatty acid, the initial hardening property and the hardening property after long-term storage were poor, and in Comparative Examples 3 and 4, which used copper powder whose surface was not treated with a fatty acid, and in Comparative Examples 5 and 6, which did not undergo a heat treatment step of the mixture of component (A) and component (E), the hardening property after long-term storage was insufficient.
Claims (3)
(B)ケイ素原子に結合する水素原子を一分子中に2個以上有するオルガノハイドロジェンポリシロキサン、
(C)ヒドロシリル化反応触媒、
(D)表面が脂肪酸で処理された銅粉末及び表面が脂肪酸で処理された銅めっき粉末から選ばれる1種以上、
(E)体積基準の粒度分布におけるメジアン径(D50)が0.5~30μmである、表面が脂肪酸で処理された炭酸カルシウム粉末、
並びに
(F)アセチレンアルコール化合物及び該化合物のアルコール性水酸基がシランまたはシロキサンにより変性された化合物から選ばれる1種以上
を含有する物を混合する付加硬化型シリコーン組成物の製造方法であって、
前記(A)成分と前記(E)成分とを混合した後、80℃~200℃で熱処理する工程及び
前記熱処理する工程で得られた熱処理物と残りの成分とを混合する工程
を有する付加硬化型シリコーン組成物の製造方法。 (A) an organopolysiloxane having two or more alkenyl groups in one molecule;
(B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms in each molecule;
(C) a hydrosilylation reaction catalyst;
(D) at least one selected from copper powder having a surface treated with a fatty acid and copper-plated powder having a surface treated with a fatty acid;
(E) A calcium carbonate powder having a surface treated with a fatty acid, the surface of which has a median diameter (D50) in a volume-based particle size distribution of 0.5 to 30 μm.
and (F) a substance containing one or more compounds selected from the group consisting of an acetylene alcohol compound and a compound in which the alcoholic hydroxyl group of said compound is modified with a silane or a siloxane,
A method for producing an addition-curable silicone composition, comprising: a step of mixing the component (A) and the component (E) and then heat-treating the mixture at 80°C to 200°C; and a step of mixing the heat-treated product obtained in the heat-treating step with the remaining components.
3. The method for producing an addition-curable silicone composition according to claim 2 , wherein in the heat treatment step, component (G) is further mixed in addition to components (A) and (E).
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