JP7474255B2 - イオン注入システムおよび方法 - Google Patents

イオン注入システムおよび方法 Download PDF

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Publication number
JP7474255B2
JP7474255B2 JP2021529313A JP2021529313A JP7474255B2 JP 7474255 B2 JP7474255 B2 JP 7474255B2 JP 2021529313 A JP2021529313 A JP 2021529313A JP 2021529313 A JP2021529313 A JP 2021529313A JP 7474255 B2 JP7474255 B2 JP 7474255B2
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Japan
Prior art keywords
workpiece
ion beam
scanner
correction device
beamlets
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JP2021529313A
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English (en)
Japanese (ja)
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JPWO2020123063A5 (https=
JP2022512302A5 (https=
JP2022512302A (ja
Inventor
アイズナー,エドワード
ヴァンデンヴァーグ,ボ
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Axcelis Technologies Inc
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Axcelis Technologies Inc
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Publication of JP2022512302A5 publication Critical patent/JP2022512302A5/ja
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/153Electron-optical or ion-optical arrangements for the correction of image defects, e.g. stigmators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1472Deflecting along given lines
    • H01J37/1474Scanning means
    • H01J37/1475Scanning means magnetic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/05Arrangements for energy or mass analysis
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15Means for deflecting or directing discharge
    • H01J2237/152Magnetic means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/153Correcting image defects, e.g. stigmators
    • H01J2237/1536Image distortions due to scanning
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/31701Ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/31701Ion implantation
    • H01J2237/31703Dosimetry
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/31701Ion implantation
    • H01J2237/31706Ion implantation characterised by the area treated
    • H01J2237/31708Ion implantation characterised by the area treated unpatterned

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electron Sources, Ion Sources (AREA)
JP2021529313A 2018-12-13 2019-11-06 イオン注入システムおよび方法 Active JP7474255B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/218,884 2018-12-13
US16/218,884 US10553392B1 (en) 2018-12-13 2018-12-13 Scan and corrector magnet designs for high throughput scanned beam ion implanter
PCT/US2019/060084 WO2020123063A1 (en) 2018-12-13 2019-11-06 Scan and corrector magnet designs for high throughput scanned beam ion implanter

Publications (4)

Publication Number Publication Date
JP2022512302A JP2022512302A (ja) 2022-02-03
JPWO2020123063A5 JPWO2020123063A5 (https=) 2023-10-26
JP2022512302A5 JP2022512302A5 (https=) 2023-10-26
JP7474255B2 true JP7474255B2 (ja) 2024-04-24

Family

ID=69160019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021529313A Active JP7474255B2 (ja) 2018-12-13 2019-11-06 イオン注入システムおよび方法

Country Status (6)

Country Link
US (2) US10553392B1 (https=)
JP (1) JP7474255B2 (https=)
KR (1) KR102751449B1 (https=)
CN (1) CN113169011B (https=)
TW (1) TWI827743B (https=)
WO (1) WO2020123063A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170005013A1 (en) * 2015-06-30 2017-01-05 Varian Semiconductor Equipment Associates, Inc. Workpiece Processing Technique
US10553392B1 (en) * 2018-12-13 2020-02-04 Axcelis Technologies, Inc. Scan and corrector magnet designs for high throughput scanned beam ion implanter
US11217427B1 (en) * 2020-11-27 2022-01-04 Applied Materials, Inc. System, apparatus and method for bunched ribbon ion beam
US11560995B1 (en) 2021-07-28 2023-01-24 Hyundai Mobis Co., Ltd. Lamp for vehicle and vehicle including the same
CN117476431B (zh) * 2023-12-28 2024-04-12 杭州泽天春来科技股份有限公司 四极杆射频电源扫描控制方法、系统及可读存储介质

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000039478A (ja) 1998-07-22 2000-02-08 Nissin Electric Co Ltd 荷電粒子ビームの分布測定方法およびそれに関連する方法
JP2013529360A (ja) 2010-04-28 2013-07-18 アクセリス テクノロジーズ, インコーポレイテッド 高効率な磁気走査システム
US20150108362A1 (en) 2013-10-22 2015-04-23 Varian Semiconductor Equipment Associates, Inc. Apparatus to control an ion beam
US20150187450A1 (en) 2013-12-26 2015-07-02 Varian Semiconductor Equipment Associates, Inc. Cold stripper for high energy ion implanter with tandem accelerator
US20160351372A1 (en) 2015-05-27 2016-12-01 Nissin Ion Equipment Co., Ltd. Ion Beam Scanner for an Ion Implanter
JP2017539062A (ja) 2014-12-26 2017-12-28 アクセリス テクノロジーズ, インコーポレイテッド ビーム減速を伴うイオン注入器におけるビーム角度調整のためのシステムおよび方法
JP2018516434A (ja) 2015-04-23 2018-06-21 ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド 注入処理制御装置及び方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4922106A (en) 1986-04-09 1990-05-01 Varian Associates, Inc. Ion beam scanning method and apparatus
US5834786A (en) * 1996-07-15 1998-11-10 Diamond Semiconductor Group, Inc. High current ribbon beam ion implanter
US7550751B2 (en) * 2006-04-10 2009-06-23 Axcelis Technologies, Inc. Ion beam scanning control methods and systems for ion implantation uniformity
US7615763B2 (en) * 2006-09-19 2009-11-10 Axcelis Technologies, Inc. System for magnetic scanning and correction of an ion beam
WO2009045722A1 (en) * 2007-09-28 2009-04-09 Varian Semiconductor Equipment Associates, Inc. Two-diemensional uniformity correction for ion beam assisted etching
US20110272567A1 (en) * 2010-05-05 2011-11-10 Axcelis Technologies, Inc. Throughput Enhancement for Scanned Beam Ion Implanters
US8637838B2 (en) * 2011-12-13 2014-01-28 Axcelis Technologies, Inc. System and method for ion implantation with improved productivity and uniformity
CN102779711B (zh) * 2012-08-01 2014-11-05 西安工业大学 具有超大离子束发散角的离子源
JP6195538B2 (ja) * 2014-04-25 2017-09-13 住友重機械イオンテクノロジー株式会社 イオン注入方法及びイオン注入装置
US9679739B2 (en) 2014-12-26 2017-06-13 Axcelis Technologies, Inc. Combined electrostatic lens system for ion implantation
JP6517163B2 (ja) * 2016-03-18 2019-05-22 住友重機械イオンテクノロジー株式会社 イオン注入装置及びスキャン波形作成方法
US10553392B1 (en) * 2018-12-13 2020-02-04 Axcelis Technologies, Inc. Scan and corrector magnet designs for high throughput scanned beam ion implanter

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000039478A (ja) 1998-07-22 2000-02-08 Nissin Electric Co Ltd 荷電粒子ビームの分布測定方法およびそれに関連する方法
JP2013529360A (ja) 2010-04-28 2013-07-18 アクセリス テクノロジーズ, インコーポレイテッド 高効率な磁気走査システム
US20150108362A1 (en) 2013-10-22 2015-04-23 Varian Semiconductor Equipment Associates, Inc. Apparatus to control an ion beam
JP2016538685A (ja) 2013-10-22 2016-12-08 ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド イオンビームを制御するための装置
US20150187450A1 (en) 2013-12-26 2015-07-02 Varian Semiconductor Equipment Associates, Inc. Cold stripper for high energy ion implanter with tandem accelerator
JP2017539062A (ja) 2014-12-26 2017-12-28 アクセリス テクノロジーズ, インコーポレイテッド ビーム減速を伴うイオン注入器におけるビーム角度調整のためのシステムおよび方法
JP2018516434A (ja) 2015-04-23 2018-06-21 ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド 注入処理制御装置及び方法
US20160351372A1 (en) 2015-05-27 2016-12-01 Nissin Ion Equipment Co., Ltd. Ion Beam Scanner for an Ion Implanter
JP2016225283A (ja) 2015-05-27 2016-12-28 日新イオン機器株式会社 磁気偏向システム、イオン注入システム、イオンビームを走査する方法

Also Published As

Publication number Publication date
KR102751449B1 (ko) 2025-01-07
TWI827743B (zh) 2024-01-01
KR20210099036A (ko) 2021-08-11
CN113169011A (zh) 2021-07-23
US20200194221A1 (en) 2020-06-18
TW202038287A (zh) 2020-10-16
WO2020123063A1 (en) 2020-06-18
CN113169011B (zh) 2024-07-02
JP2022512302A (ja) 2022-02-03
US11037754B2 (en) 2021-06-15
US10553392B1 (en) 2020-02-04

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