JP7471812B2 - 半導体装置および機器 - Google Patents

半導体装置および機器 Download PDF

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Publication number
JP7471812B2
JP7471812B2 JP2019229328A JP2019229328A JP7471812B2 JP 7471812 B2 JP7471812 B2 JP 7471812B2 JP 2019229328 A JP2019229328 A JP 2019229328A JP 2019229328 A JP2019229328 A JP 2019229328A JP 7471812 B2 JP7471812 B2 JP 7471812B2
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semiconductor device
section
capacitance
circuit
semiconductor
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Japanese (ja)
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JP2020141397A (ja
JP2020141397A5 (enExample
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恒一 中村
善一 山崎
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Canon Inc
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Canon Inc
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Priority to US16/798,929 priority Critical patent/US11424282B2/en
Publication of JP2020141397A publication Critical patent/JP2020141397A/ja
Priority to US17/866,691 priority patent/US11798970B2/en
Publication of JP2020141397A5 publication Critical patent/JP2020141397A5/ja
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JP2019229328A 2019-02-25 2019-12-19 半導体装置および機器 Active JP7471812B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US16/798,929 US11424282B2 (en) 2019-02-25 2020-02-24 Semiconductor apparatus and equipment
US17/866,691 US11798970B2 (en) 2019-02-25 2022-07-18 Semiconductor apparatus and equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019031801 2019-02-25
JP2019031801 2019-02-25

Publications (3)

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JP2020141397A JP2020141397A (ja) 2020-09-03
JP2020141397A5 JP2020141397A5 (enExample) 2022-12-27
JP7471812B2 true JP7471812B2 (ja) 2024-04-22

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230096986A (ko) * 2020-10-28 2023-06-30 소니 세미컨덕터 솔루션즈 가부시키가이샤 고체 촬상 장치 및 전자 기기
JP7654415B2 (ja) * 2021-02-04 2025-04-01 キヤノン株式会社 光電変換装置、機器
JP2023053806A (ja) * 2021-10-01 2023-04-13 キヤノン株式会社 撮像装置及び電子機器
JP7759804B2 (ja) * 2021-12-28 2025-10-24 シャープセミコンダクターイノベーション株式会社 固体撮像素子及び電子装置
JPWO2023131997A1 (enExample) * 2022-01-05 2023-07-13
WO2023210324A1 (ja) * 2022-04-27 2023-11-02 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および電子機器

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006147795A (ja) 2004-11-18 2006-06-08 Matsushita Electric Ind Co Ltd 固体撮像装置
JP2012089739A (ja) 2010-10-21 2012-05-10 Sony Corp 固体撮像装置及び電子機器
JP2012124318A (ja) 2010-12-08 2012-06-28 Sony Corp 固体撮像素子の製造方法、固体撮像素子、および電子機器
JP2013016963A (ja) 2011-07-01 2013-01-24 Olympus Corp 固体撮像装置、固体撮像装置の制御方法、および撮像装置
JP2013172279A (ja) 2012-02-21 2013-09-02 Hitachi Ltd 固体撮像装置
JP2015139199A (ja) 2014-01-24 2015-07-30 オリンパス株式会社 固体撮像装置および撮像装置
WO2019031089A1 (ja) 2017-08-10 2019-02-14 ソニーセミコンダクタソリューションズ株式会社 撮像装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006147795A (ja) 2004-11-18 2006-06-08 Matsushita Electric Ind Co Ltd 固体撮像装置
JP2012089739A (ja) 2010-10-21 2012-05-10 Sony Corp 固体撮像装置及び電子機器
JP2012124318A (ja) 2010-12-08 2012-06-28 Sony Corp 固体撮像素子の製造方法、固体撮像素子、および電子機器
JP2013016963A (ja) 2011-07-01 2013-01-24 Olympus Corp 固体撮像装置、固体撮像装置の制御方法、および撮像装置
JP2013172279A (ja) 2012-02-21 2013-09-02 Hitachi Ltd 固体撮像装置
JP2015139199A (ja) 2014-01-24 2015-07-30 オリンパス株式会社 固体撮像装置および撮像装置
WO2019031089A1 (ja) 2017-08-10 2019-02-14 ソニーセミコンダクタソリューションズ株式会社 撮像装置

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