JP7466703B2 - IMAGING DEVICE, ELECTRONIC DEVICE, AND CONTROL METHOD - Google Patents

Description

CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims priority to Chinese Patent Application No. 202010448464.4, filed in China on May 25, 2020, the entire contents of which are incorporated herein by reference.

The present invention relates to the field of communications technology, and in particular to an imaging device, an electronic device, and a control method.

When taking pictures with electronic devices, camera shake causes the camera to tilt slightly, which causes the observation angle of the camera lens to change, resulting in the captured image being unstable due to camera shake. In the related art, the photographing devices generally all have a fixed chip and achieve the purpose of vibration isolation by moving the lens. When the lens is relatively heavy, it is relatively difficult to move the lens to achieve vibration isolation.

The embodiments of the present invention provide an imaging device, electronic device, and control method that can solve the problem of the difficulty of moving the lens when implementing image stabilization by moving the lens.

To solve the above technical problems, the present invention is realized as follows.

According to a first aspect, an embodiment of the present invention provides an imaging apparatus, the apparatus comprising:
With a pedestal,
a lens module attached to the base and fixed to the base, the lens module including a lens body;
a photosensitive chip module attached to the lens module, located on a side of the lens module adjacent to the base, and movable within a first plane parallel to the lens body;
The optical system further comprises a driving module connected to the lens module and the photosensitive chip module, respectively, for driving the photosensitive chip module to move within the first plane.

According to a second aspect, an embodiment of the present invention provides an electronic device. The electronic device includes, for example, the imaging device described in the first aspect.

According to a third aspect, an embodiment of the present invention discloses a method for controlling an image capture device, the method comprising:
Receiving user input;
In response to the input, the drive module drives the photosensitive chip module to move in the first plane to achieve vibration isolation.

In an embodiment of the present invention, the lens module is fixed to a base, and the driving module drives the photosensitive chip module to move in a plane parallel to the lens body, thereby achieving vibration isolation, avoiding the need to move the lens module, and making it relatively easy to achieve vibration isolation even when the lens is relatively heavy.

1 is a schematic cross-sectional view of an imaging device disclosed in an embodiment of the present invention. 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is a schematic diagram of a part of the structure of an imaging device disclosed in an embodiment of the present invention; 1 is an exploded schematic view of an imaging device disclosed in an embodiment of the present invention.

In order to make the objectives, technical solutions and advantages of the present invention clearer, the following clearly and completely describes the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained based on the embodiments of the present application without the need for creative efforts by those skilled in the art are within the scope of protection of the present application.

The following describes in detail the imaging device according to the embodiment of the present application using specific examples and application scenarios, with reference to the drawings.

As shown in Figures 1 to 26, an embodiment of the present invention discloses an imaging device. The imaging device includes a base 12, a lens module, a photosensitive chip module, and a driving module.

The base 12 is a basic component of the imaging device and can provide a mounting base for other components of the imaging device.

Optionally, the base 12 is an injection molded plastic member.

The lens module is attached to a base 12, and the lens module is fixed to the base 12. The lens module includes a lens body 1, and the lens body 1 is used to transmit light.

Regarding the photosensitive chip module, the photosensitive chip module is attached to the lens module, the photosensitive chip module is located on the side of the lens module that is close to the base 12, the photosensitive chip module can move within a first plane, the first plane is a plane parallel to the lens body 1, the photosensitive chip module receives light transmitted through the lens body 1 and converts the optical signal into an electrical signal, and the photosensitive chip module can correct the shake when moving, thereby making the image of the subject clearer, i.e., realizing vibration prevention.

The first plane is a plane parallel to the lens body 1, that is, the first plane is a plane perpendicular to the main optical axis of the lens body 1. Here, the main optical axis is a straight line that passes through the optical center and is perpendicular to the lens body 1, and the point located in the center of the lens body 1 is called the optical center.

Regarding the driving module, the driving module is respectively connected to the lens module and the photosensitive chip module, and the driving module drives the photosensitive chip module to move in a first plane. That is, the driving module provides power to the photosensitive chip module, causing the photosensitive chip module to move in a plane parallel to the lens body 1, thereby correcting the shake, that is, the driving module drives the photosensitive chip module to realize the vibration isolation.

The lens module is fixed to the base 12, and vibration isolation can be achieved by driving and moving the photosensitive chip module with the drive module. No relative displacement occurs in the lens module, and compared to related art aspects in which vibration isolation is achieved by moving the lens module, the vibration isolation method of this aspect requires only moving the photosensitive chip module, without the need to move the lens module, and therefore vibration isolation can be easily achieved regardless of the weight of the lens module. Furthermore, because the lens module is fixed, the reliability of the imaging device is improved.

According to some embodiments of the present invention, the photosensitive chip module includes a first substrate 8 and a photosensitive chip 6. The photosensitive chip 6 is attached to the first substrate 8, the photosensitive chip 6 faces the lens body 1, and the photosensitive chip 6 is electrically connected to the first substrate 8;
Here, the drive module is connected to the first substrate 8, the drive module is electrically connected to the first substrate 8, and the drive module drives the first substrate 8 to move in a first plane so as to move the photosensitive chip 6.

Optionally, the first substrate 8 may be a circuit board providing electrical connection to other assemblies, and the first substrate 8 may be any one of a single-sided substrate, a double-sided substrate, and a multi-layer wiring board, but is not limited thereto in the embodiments of the present invention.

Therefore, the first substrate 8 can fix the photosensitive chip 6 and provide an electrical connection to the photosensitive chip 6, and the first substrate 8 can also provide an electrical connection to the driving module. The driving module is connected to the first substrate 8, and the driving module drives and moves the first substrate 8, which moves the photosensitive chip 6 to move in a first plane, thereby realizing vibration isolation. The photosensitive chip 6 faces the lens body 1, and the photosensitive chip 6 receives the light transmitted from the lens body 1 and converts the optical signal into an electrical signal, and then transmits the electrical signal to the first substrate 8, which can be combined with other image processing devices to realize imaging.

When the driving module drives the first substrate 8 to move the photosensitive chip 6 within the first plane, the direction of movement of the photosensitive chip 6 within the first plane may be opposite to the direction of vibration, so that the vibration can be corrected, thereby making the image of the subject clearer, i.e., realizing vibration reduction.

According to some embodiments of the present invention, the driving module includes an electrostrictive assembly 7, which is connected to the lens module and the first substrate 8, and the electrostrictive assembly 7 is electrically connected to the first substrate 8. When the electrostrictive assembly 7 is energized, the electrostrictive assembly 7 generates a deformation and drives the first substrate 8 to move in a first plane, and the first substrate 8 moves and displaces the photosensitive chip 6.

Optionally, the electrostrictive assembly 7 may be a shape memory alloy material.

In an embodiment of the present invention, the electrostrictive assembly 7 is used as a driving force to drive the photosensitive chip module to move inward on the first plane. The driving force generated by the electrostrictive assembly 7 is relatively large, generally more than five times that of a magnetoelectric type of the same size, and since the electrostrictive assembly 7 does not cause magnetic interference and there are no magnets in the entire imaging device, there is no need to consider the magnetic interference problem in the assembly of the finished product, and the size of the multi-camera module can have a size advantage.

In addition, by controlling the magnitude and direction of the current passing through the electrostrictive assembly 7, the length and direction of deformation of the electrostrictive assembly 7 can be controlled. This allows the distance and direction of movement of the photosensitive tip 6 in the first plane to be controlled, thereby allowing for flexible vibration isolation.

According to some embodiments of the present invention, the drive module further includes a bracket 10, which is connected to the first substrate 8 and the electrostrictive assembly 7, respectively, and the electrostrictive assembly 7 is electrically connected to the first substrate 8 by the bracket 10.

The bracket 10 can support the first board 8. Also, when the photographing device is hit, it will collide with the bracket 10 first, protecting the photosensitive chip 6 and improving the reliability of the photographing device. The bracket 10 is connected to the driving module and the first board 8, respectively, thereby realizing a connection and conduction between the driving module and the first board 8.

For example, as shown in Figures 14, 15, 16, and 17, the bracket 10 includes a conductive member 10AB and an injection-molded member 10AA, and the conductive member 10AB and the injection-molded member 10AA are integrally fitted together and injection-molded by insert injection molding technology. The conductive member 10AB includes metal surfaces AB1, AB2, AB3, AB4, AB5, AB6, AB7, and AB8, and the injection-molded member 10AA includes grooves AA1, AA2, AA3, and AA4. , groove AA5, groove AA6, groove AA7, and groove AA8, where metal surface AB1 and groove AA1 form the welding area A11, metal surface AB2 and groove AA2 form the welding area A12, metal surface AB3 and groove AA3 form the welding area A13, metal surface AB4 and groove AA4 form the welding area A14, metal surface AB5 and groove AA5 form the welding area A21, metal surface AB6 and groove AA6 form the welding area A22, metal surface AB7 and groove AA7 form the welding area A23, and metal surface AB8 and groove AA8 form the welding area A24. In this way, when the electrical connection relationship of the bracket 10 is ensured, the weight of the entire bracket 10 can be reduced.

In some optional embodiments, the electrostrictive assembly 7 includes a first deformation member, which is connected to the first substrate 8 and the lens module, respectively, and the first deformation member extends along a first direction, and when the first deformation member is energized, the first deformation member can deform to drive the first substrate 8 to move in the first direction, and the first substrate 8 moves and displaces the photosensitive chip 6.

Optionally, the first deformable member may be a shape memory alloy material.

The first deformation member is connected to the first substrate 8, and the first substrate 8 can provide an electrical connection to the first deformation member. Optionally, one end of the first deformation member is connected to the first substrate 8 and the other end is connected to the lens module, and the lens module is fixed to the base 12, so that when the first deformation member is energized, the first deformation member generates a deformation and drives the first substrate 8 to move in a first direction in the first plane of the first deformation member, and since the first substrate 8 is connected to the photosensitive chip 6, the photosensitive chip 6 can move in the first direction, thereby achieving vibration isolation.

According to some embodiments of the present invention, the electrostrictive assembly 7 includes a second deformation member, which is connected to the first substrate 8 and the lens module, respectively, and the second deformation member extends along a second direction, and when the second deformation member is energized, the second deformation member can be deformed to drive the first substrate 8 to move in the second direction, and the first substrate 8 moves and displaces the photosensitive chip 6.

Here, the second direction and the first direction are both within the first plane, and the second direction intersects with the first direction.

The second deformation member is similar in principle to the first deformation member described above, so it will not be described further here.

Since the second direction and the first direction are both within the first plane, and the second direction intersects with the first direction, the first deformation member can act together with the second deformation member, so that the photosensitive chip 6 can move in either direction within the first plane; that is, if vibration occurs in either direction, the imaging device can correct the vibration in either direction, thereby achieving vibration prevention.

In some optional embodiments, the first deformation members are multiple and the multiple first deformation members are arranged parallel to and spaced apart from one another, and the second deformation members are multiple and the multiple second deformation members are arranged parallel to and spaced apart from one another.

Here, multiple may be two or more. The first deformation members are multiple and arranged parallel to each other with a gap between them, and can provide a stronger and more stable driving force in a first direction; similarly, the second deformation members are multiple and arranged parallel to each other with a gap between them, and can provide a stronger and more stable driving force in a second direction, and can further drive and move the photosensitive chip 6 more easily, and increase stability.

As an example, the electrostrictive member includes two first deformable members and two second deformable members. As shown in FIG. 18, the electrostrictive assembly 7 includes fixed blocks, which are fixed blocks 711, 712, 713, 714, 721, 722, 723, and 724, respectively. The electrostrictive member 7 includes a first deformable member 731, a second deformable member 732, a first deformable member 733, and a second deformable member 734. The first deformable member and the second deformable member are made of shape memory alloy material. Since the shape memory alloy material has a shape memory effect, after the shape memory alloy material is energized, the shape memory alloy material itself generates heat, the temperature changes, and the metal The shape of the metal itself changes, and by controlling the magnitude of the current in the controlled shape memory alloy material, the first deforming member 731 and the first deforming member 733 are deformed, respectively, and the first deforming member 731 and the first deforming member 733 act as a driving force to move the entire imaging device in a first direction, and by controlling the magnitude of the current, the second deforming member 732 and the second deforming member 734 are deformed, respectively, and the second deforming member 732 and the second deforming member 734 act as a driving force to move the entire imaging device in a second direction, and the first deforming member 731, the first deforming member 733, the second deforming member 732, and the second deforming member 734 move the first substrate 8 and the photosensitive chip 6 to realize movement within the first plane, thereby achieving vibration isolation.

According to some embodiments of the present invention, the imaging device further includes an elastic member 11, which is connected to the base 12 and the first substrate, respectively, and which drives the first substrate to return to its original position.

When the first substrate 8 is displaced, the elastic member 11 drives the first substrate 8 to return to the position before the displacement, that is, the elastic member 11 drives the first substrate 8 to return to its original position. The function of the elastic member 11 is to suspend the first substrate 8 relative to the base 12 so that the first substrate 8 is allowed to move.

It should be noted that the original position is a preset position of the first substrate 8 in a free state, i.e. when the first substrate 8 is located in a preset position, the drive module is not actuated and the elastic member 11 is in a free state.

During the vibration-proof movement process of the imaging device, the elastic member 11 can provide a traction force in the opposite direction, and when the electrostrictive assembly is disconnected or no deformation occurs, the elastic member 11 can drive the photosensitive chip 6 to rapidly return to its original position.

Optionally, the elastic member 11 may be connected to the base 12 and the first substrate 8 by a method such as heat crimping or adhesive bonding.

According to some embodiments of the present invention, the elastic member 11 includes a first fixing part, a second fixing part, and an elastic connecting arm, the first fixing part is attached to the base 12 and the first fixing part is fixed to the base 12, the second fixing part is attached to the first substrate 8 and the second fixing part is fixed to the first substrate 8, where one of the first fixing part and the second fixing part is a hollow structure and the other of them is located within the hollow structure, and for the elastic connecting arm, the elastic connecting arm is located between the first fixing part and the second fixing part, and the elastic connecting arm is connected to the first fixing part and the second fixing part respectively, and the elastic connecting arm can be deformed.

It is advantageous for one of the first and second fixed parts to be a hollow structure and for the other to be located within the hollow structure, which is also advantageous for the movement of the elastic member 11, i.e., for the movement of the elastic connecting arm.

Optionally, the first fixing portion is a hollow structure and the second fixing portion is located within the hollow structure.

Or, the second fixing part is a hollow structure and the first fixing part is located within the hollow structure.

Optionally, the number of elastic connection arms is multiple, and the multiple elastic connection arms are installed at intervals along the circumferential direction of the first substrate 8. Multiple refers to two or more. Optionally, the multiple elastic connection arms may be installed at equal intervals, so that the mass is uniformly distributed and the stability is high. For example, in the illustrated example, the number of elastic connection arms is four, and the four elastic connection arms are respectively located around the first fixed part. Of course, other installation methods also fall within the scope of protection of the present invention.

For example, as shown in FIG. 21, the elastic member 11 includes a first fixing portion B16, a second fixing portion B17, and an elastic connecting arm B15.

According to some embodiments of the present invention, the elastic member 11 has a first mounting portion, the base 12 includes a bottom plate and a side wall plate, the bottom plate is provided with a second mounting portion, the second mounting portion is fitted into the first mounting portion, the side wall plate is installed around the bottom plate and is installed on the edge of the bottom plate, the lens module is attached to the side wall plate, the lens module forms a mounting cavity together with the bottom plate and the side wall plate, and the elastic member 11, the photosensitive chip module and the driving module are all located in the mounting cavity.

As is clear from the above, the elastic member 11 has a first mounting portion, and a second mounting portion is provided on the bottom plate, which is engaged with the first mounting portion, whereby the elastic member 11 is connected to the base 12 by the first mounting portion and the second mounting portion. The lens module, together with the bottom plate and the side wall plate, forms a mounting cavity, and the elastic member 11, the photosensitive chip module and the driving module are all located within the mounting cavity, and the elastic member 11, the photosensitive chip module and the driving module can move within the mounting cavity, providing high stability and reliability.

Optionally, one of the first mounting portion and the second mounting portion is a mounting hole and the other is a mounting post that fits into the mounting hole.

Optionally, the first mounting portion is a mounting hole and the second mounting portion is a mounting post.

Optionally, the first mounting portion is a mounting post and the second mounting portion is a mounting hole.

Optionally, the mounting holes and mounting posts are a plurality of one-to-one correspondences, and the plurality may be two or more. The elastic member 11 can be fixedly connected to the base 12 by fitting the mounting holes and mounting posts together. When a plurality of mounting holes and mounting posts are provided, the fixation between the elastic member 11 and base 12 can be improved, thereby enhancing the stability of the imaging device.

For example, as shown in FIG. 21 and FIG. 22, the elastic member 11 includes a metal ring B2, the bracket 10 includes a bottom surface A4, and the metal ring B2 is connected and fixed to the bottom surface A4 by a method such as an adhesive, thereby realizing fixing one end of the elastic member 11 to the bracket 10;
21, 22, 23, and 24, exemplarily, the elastic member 11 includes a fixing hole B11, a fixing hole B12, a fixing hole B13, and a fixing hole B14, the base 12 includes a fixing column C11, a fixing column C12, a fixing column C13, and a fixing column C14, the fixing hole B11 corresponds to the fixing column C11 and is fixed by a form such as heat crimping or an adhesive, the fixing hole B12 corresponds to the fixing column C12 and is fixed by a form such as heat crimping or an adhesive, the fixing hole B13 corresponds to the fixing column C13 and is fixed by a form such as heat crimping or an adhesive, the fixing hole B14 corresponds to the fixing column C14 and is fixed by a form such as heat crimping or an adhesive, the elastic member 11 includes a metal ring B3, the base 12 includes a bump C21, a bump C22, a bump C23, and a bump C24. The metal ring B3 is attached to the plane formed by the bumps C21, C22, C23, C24, C31, C32, C33, and C34, and the fixing strength of the elastic member 11 can be reinforced by, for example, increasing the amount of adhesive on the bumps C21, C22, C23, C24, C31, C32, C33, and C34. In this manner, one end of the elastic member 11 is fixed to the bracket 10, and the other end of the elastic member 11 is fixed to the base 12, thereby achieving the suspension of the bracket 10, the first substrate 8, the photosensitive chip 6, and the like by the elastic member 11.

As shown in Figures 7, 23 and 25, the base 12 includes a bottom plate C4, and the frame 4 includes a side wall plate 47. The bottom plate C4 and the side wall plate 47 are fixed by adhesive or other means to realize adhesive fixation between the base 12 and the frame 4, thereby surrounding and protecting the movable device. The base 12 includes a groove C5, and the frame 4 includes a groove 49. The space formed by the groove C5 and the groove 49 is advantageous in that the movable part 82 of the first substrate 8 is not interfered with during operation.

According to some embodiments of the present invention, the lens module includes a frame 4, the frame 4 is used to mount the lens body 1, and the electrostrictive assembly 7 is connected to the frame 4 and the first substrate 8, respectively.

Optionally, the frame 4 is an injection-molded plastic member used to mount the lens body 1 and form a mounting cavity together with the base 12, and can accommodate the photosensitive chip module, driving module and elastic member 11 in the mounting cavity, fulfilling the role of enclosing and protecting the photosensitive chip module, driving module and elastic member 11, and further preventing the photographing device from being interfered with by the outside world.

3, 4, 5, 6 and 7, the frame 4 includes a conductive member 4A and an injection molded member 4B, and the conductive member 4A and the injection molded member 4B are integrally fitted and injection molded by insert injection molding technology, and optionally, the conductive member 4A may be a metal member. The embodiment of the present invention is not specifically limited thereto. The conductive member 4A includes a metal surface 4A1, a metal surface 4A2, a metal surface 4A3, a metal surface 4A4, a metal surface 4A5, a metal surface 4A6, a metal surface 4A7, and a metal surface 4A8. The injection molded member 4B includes a groove 4B1, a groove 4B2, a groove 4B3, a groove 4B4, a groove 4B5, a groove 4B6, a groove 4B7, and a groove 4B8. The metal surface 4A1 and the groove 4B1 form a welding area 411. The metal surface 4A2 and the groove 4B2 form a welding area 412. The metal surface 4A3 and the groove 4B3 form a welding area 413. The metal surface 4A4 and the groove 4B4 form a welding area 414. , metal surface 4A5 and groove 4B5 form welding area 451, metal surface 4A6 and groove 4B6 form welding area 452, metal surface 4A7 and groove 4B7 form welding area 453, and metal surface 4A8 and groove 4B8 form welding area 454. As shown in FIG. 6, frame 4 includes grooves 421, 422, 423, 424, 425, 426, 427, 428, and 429, and the purpose is to reduce the weight of the entire frame 4 and reduce the deformation rate of the entire frame 4.

Optionally, the photographing device further includes an optical filter 5, which performs a filtering process on the light transmitted through the lens body 1, and is advantageous for the photosensitive chip 6 to achieve a better imaging effect.

Optionally, the photographing device further includes a heat sink 9, which is installed on the first substrate 8, for example, on the bottom of the photosensitive chip 6. The photosensitive chip 6 generates a large amount of heat during operation, and the heat sink 9 guides the heat generated by the photosensitive chip 6 and dissipates it into the air, reducing the impact of the heat on the imaging effect of the device. At the same time, the photosensitive chip 6 can be protected from impact. Optionally, the heat sink 9 can be a metal member.

As shown in Figures 12, 13, and 25, the first substrate 8 includes a fixing plate 83, which is a multi-layer flexible circuit board, and the photosensitive chip 6 is mounted on the fixing plate 83 by surface mounting technology. The module steel plate 9 is fixed to the fixed plate 83 by adhesive or other methods. The first substrate 8 includes a movable part 82, which is a two-layer (not limited to two-layer) S-shaped flexible circuit board. The middle part of the movable part 82 includes a through hole 821 and a through hole 822, which is advantageous for reducing the resistance torque generated when the movable part 82 is operated. The movable part 82 includes a side 823, and the frame 4 includes a side 44, which is bonded and fixed to the side 823 and the side 44 by adhesive or other methods, which is advantageous for controlling the movable range of the movable part 82. The first substrate 8 includes a connector 81, which is engaged with the connector 81 and the external connector of the finished product to be conductive and realize a part of the current-carrying function of the device.

5, 13, 17, 18, 19, and 20, the module steel plate 9 includes an adhesive surface 91, and the bracket 10 includes an adhesive surface A3, and the adhesive surface 91 and the adhesive surface A3 are bonded and fixed together by a method such as an adhesive, thereby realizing the integral fixing of the photosensitive chip 6, the first substrate 8, and the module steel plate 9 to the bracket 10. The fixing block 721 included in the electrostrictive assembly 7 corresponds to the welding area A21 included in the bracket 10 and is fixed and conductive by a welding method. The fixing block 722 included in the electrostrictive assembly 7 corresponds to the welding area A22 included in the bracket 10 and is fixed and conductive by a welding method. The fixing block 723 included in the electrostrictive assembly 7 corresponds to the welding area A23 included in the bracket 10 and is fixed and conductive by a welding method. The fixing block 724 included in the electrostrictive assembly 7 corresponds to the welding area A24 included in the bracket 10. The fixed block 711 included in the electrostrictive assembly 7 corresponds to the welding area 454 included in the bracket 10 and is fixed and conductive by a welding method, the fixed block 712 included in the electrostrictive assembly 7 corresponds to the welding area 451 included in the bracket 10 and is fixed and conductive by a welding method, the fixed block 713 included in the electrostrictive assembly 7 corresponds to the welding area 452 included in the bracket 10 and is fixed and conductive by a welding method, and the fixed block 714 included in the electrostrictive assembly 7 corresponds to the welding area 453 included in the bracket 10 and is fixed and conductive by a welding method. By the above methods, both ends of the electrostrictive assembly 7 are fixed to the bracket 10, respectively, and are connected to the first board 8 and the focus alignment board 3, respectively, and are simultaneously realized to be conductive, and the conduction of the current circuit of the entire imaging device is realized.

Optionally, the lens module may include a focus matching board 3 and a motor 2, thereby realizing focus matching. The lens body 1 is an optical component made of one or more curved optical glass or plastic members, which can receive optical signals and collect the optical signals on the surface of the photosensitive chip 6. It is an essential optical element in a camera, which directly affects the quality of the imaging and affects the realization and effect of the algorithm. The motor 2 is a driving structure assembled from multiple members, which can drive and move the lens body 1, thereby realizing the automatic focus matching of the photographing device, and the motor 2 and the lens body 1 as a whole can be the driving part of the automatic focus matching of the entire vibration isolation device by a fixing method such as adhesive. This embodiment is described as a case of one closed loop motor 2, but the embodiment of the invention is not limited to the closed loop driving motor, but also includes an open loop motor and an intermediate motor. The focus matching board 3 is a flexible circuit board, which is connected to the motor 2, provides an electrical connection relationship for the motor 2, and realizes the conduction between the motor 2 and the external connector, thereby realizing the conduction between the automatic focus matching part of the photographing device and the outside world, and realizes the function of automatic focus matching.

Optionally, the lens body 1 and the motor 2 may be connected by a viscose method.

2, 6, 8, 9, 10 and 11, the focus matching board 3 is fixedly connected to the adhesive surface 43 of the frame 4 by the adhesive surface 34, and the focus matching board 3 is integrally attached to the motor 2 by the adhesive surface 36, thereby realizing the automatic focus matching part of the entire photographing device to be integrally fixed to the frame 4, and the focus matching board 3 includes welding holes, which are respectively welding holes 351, 352, 353 and 354, the welding hole 351 corresponds to the welding area 411 and realizes connection and conduction by a method such as welding, the welding hole 352 corresponds to the welding area 412 and realizes connection and conduction by a method such as welding, the welding hole 353 corresponds to the welding area 413 and realizes connection and conduction by a method such as welding, and the welding hole 354 corresponds to the welding area 414 and realizes connection and conduction by a method such as welding. to realize connection and conduction, the focus alignment board 3 includes welding areas, which are respectively welding areas 331, 332, 333, and 334, the motor 2 includes welding terminals, which are respectively welding terminals 21, 22, 23, and 24, the welding area 331 corresponds to the welding terminal 21 and realizes conduction by a method such as welding, the welding area 332 corresponds to the welding terminal 22 and realizes conduction by a method such as welding, the welding area 333 corresponds to the welding terminal 23 and realizes conduction by a method such as welding, the welding area 334 corresponds to the welding terminal 24 and realizes conduction by a method such as welding, the focus alignment board 3 includes a connector 31, and the connector 31 and the connector of the finished product are engaged with each other to realize conduction, thereby realizing the current-carrying function of part of the imaging device.

Based on the imaging device disclosed in the embodiment of the present invention, the embodiment of the present invention discloses an electronic device. The disclosed electronic device includes the imaging device.

Based on the electronic device disclosed in the embodiment of the present invention, the embodiment of the present invention further discloses a control method for an image capture device. The disclosed control method for an image capture device includes the following steps a and b.

Step a: Receive user input.

Optionally, the user input may be an input to trigger anti-shake, including but not limited to touch input, voice input, or an input to an anti-shake control component in a preview interface where the user takes a picture.

Step b: In response to the input, the drive module drives the photosensitive chip module to move in a first plane to achieve vibration isolation.

In an embodiment of the present invention, based on the electronic device, by receiving a user input, in response to the input, the driving module drives the photosensitive chip module to move in a first plane parallel to the lens body to achieve vibration isolation.

Based on the above-mentioned control method for an imaging device, an embodiment of the present invention further provides an apparatus for the control method, the apparatus comprising:
a receiving module for receiving a user input;
In response to the input, the drive module can include a control module for driving the light sensitive chip module to move in a first plane to provide vibration isolation.

In an embodiment of the present invention, the driving module drives the photosensitive chip module to move in a first plane parallel to the lens body to achieve vibration isolation.

An embodiment of the present invention further discloses an electronic device. The electronic device includes a processor, a memory, and a computer program stored on the memory and operable on the processor, the computer program implementing the steps of the control method described in any of the above embodiments when executed by the processor.

An embodiment of the present invention further discloses a computer-readable storage medium. A computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the control method described in any of the above embodiments are realized.

As can be recognized by those skilled in the art, each example unit and algorithm step described in connection with the embodiments disclosed herein can be realized in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in a hardware manner or a software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can implement the described functions using different methods for each specific application, but such implementation should not be considered beyond the scope of the present disclosure.
As can be clearly understood by those skilled in the art, for convenience and conciseness of description, the specific operating processes of the above-described systems, devices and units may be referred to the corresponding processes in the above-described method embodiments, and will not be further described herein.

In the embodiments of the present application, it should be understood that the disclosed apparatus and method may be realized in other ways. For example, the above-described apparatus embodiments are merely exemplary, and the division of the units is merely a logical functional division, and in actual implementation, there may be other division ways, for example, multiple units or assemblies may be combined or integrated into another system, or some features may be ignored or not implemented. Also, the couplings or direct couplings or communication connections between the shown or discussed may be indirect couplings or communication connections through some interfaces, devices or units, and may be electrical, mechanical, or other types.

The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, located in one location, or distributed across multiple network units. Some or all of the units may be selected to achieve the objective of the solution of this embodiment according to actual needs.

Furthermore, each functional unit in each embodiment of the present disclosure may be integrated into a single processing unit, each unit may exist physically alone, or two or more units may be integrated into a single unit.

When the function is realized in the form of a software functional unit and sold or used as an independent product, it may be stored in a computer-readable storage medium. With this understanding in mind, the technical solution of the present disclosure may be substantially embodied in the form of a software product, or a part of the technical solution may be substantially embodied in the form of a software product. The computer software product is stored in a storage medium and includes some instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or some of the steps of the method according to each embodiment of the present disclosure. The aforementioned storage medium includes various media capable of storing program codes, such as a U disk, a mobile hard disk, a ROM, a RAM, a magnetic disk, or an optical disk.

As can be understood by those skilled in the art, the realization of all or part of the flow of the method of the above embodiment can be completed by controlling the relevant hardware with a computer program, and the program may be stored in a computer-readable storage medium, and when the program is executed, it may include the flow of each of the above method embodiments. Here, the storage medium may be a magnetic disk, an optical disk, a read-only memory (ROM), a random access memory (RAM), etc.

The electronic devices disclosed in the embodiments of the present invention may be devices such as smartphones, tablet computers, e-book readers, wearable devices (e.g., smart watches), electronic game consoles, etc., and the embodiments of the present invention do not limit the specific types of electronic devices. The above embodiments of the present invention have been described with emphasis on the differences between the embodiments, and the optimal features of the differences between the embodiments can be configured by combining any of the more preferred embodiments, unless there is a contradiction, and for the sake of brevity, will not be described further here.

The above is merely an embodiment of the present invention, and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

1-lens body, 2-motor, 3-focus alignment board, 4-frame, 5-optical filter, 6-photosensitive chip, 7-electrostrictive assembly, 731/733-first deformation member, 732/734-second deformation member, 8-first board, 9-module steel plate, 10-bracket, 11-elastic member, B16-first fixing part, B17-second fixing part, B15-elastic connecting arm, 12-base, C4-bottom plate, 47-side wall plate.

Claims (12)

An imaging device,
With a pedestal,
a lens module attached to the base and fixed to the base, the lens module including a lens body;
a photosensitive chip module attached to the lens module, located on a side of the lens module adjacent to the base, and movable within a first plane parallel to the lens body;
a driving module connected to the lens module and the photosensitive chip module, respectively, for driving the photosensitive chip module to move within the first plane ;
The photosensitive chip module includes:
A first substrate;
a photosensitive chip attached to the first substrate, facing the lens body, and electrically connected to the first substrate;
The driving module is connected to the first substrate, the driving module is electrically connected to the first substrate, and the driving module drives the first substrate to move in the first plane so as to move the photosensitive chip;
The photographing device further includes an elastic member, the elastic member being connected to the base and the first substrate, and the elastic member being configured to drive the first substrate to its original position;
The elastic member is
A first fixing portion attached to the base and fixed to the base;
a second fixing portion attached to the first substrate and fixed to the first substrate, one of the first fixing portion and the second fixing portion being a hollow structure, and the other of the first fixing portion and the second fixing portion being located within the hollow structure;
a deformable elastic connecting arm located between the first fixed portion and the second fixed portion and connected to the first fixed portion and the second fixed portion, respectively;
Filming equipment. The drive module includes:
2. The imaging device of claim 1, further comprising an electrostrictive assembly, the electrostrictive assembly being connected to the lens module and the first substrate respectively, the electrostrictive assembly being electrically connected to the first substrate, and when the electrostrictive assembly is energized, the electrostrictive assembly can be deformed to drive the first substrate to move within the first plane, and the first substrate moves and displaces the photosensitive chip. The drive module includes:
3. The imaging device of claim 2, further comprising a bracket, the bracket being connected to the first substrate and the electrostrictive assembly, respectively, the electrostrictive assembly being electrically connected to the first substrate by the bracket. The electrostrictive assembly comprises:
3. The imaging device of claim 2, further comprising: a first deformation member, the first deformation member being connected to the first substrate and the lens module respectively, the first deformation member extending along a first direction, when the first deformation member is energized, the first deformation member being deformable to drive the first substrate to move in the first direction, and the first substrate moving and displacing the photosensitive chip. The electrostrictive assembly comprises:
The second deformation member is connected to the first substrate and the lens module respectively, and the second deformation member extends along a second direction. When the second deformation member is energized, the second deformation member can be deformed to drive the first substrate to move in the second direction, and the first substrate moves and moves the photosensitive chip;
The imaging device according to claim 4 , wherein the second direction and the first direction are both within the first plane, and the second direction intersects with the first direction. 6. The imaging device according to claim 5, wherein the first deformation members are multiple, the multiple first deformation members being arranged parallel to each other and spaced apart, and the second deformation members are multiple, the multiple second deformation members being arranged parallel to each other and spaced apart. The imaging device according to claim 1 , wherein the elastic connection arms are multiple, and the multiple elastic connection arms are installed at intervals along a circumferential direction of the first substrate. The elastic member has a first mounting portion, and the base has
a bottom plate provided with a second mounting portion that is fitted to the first mounting portion;
2. The photographing device of claim 1, further comprising: a side wall plate that is installed around the bottom plate and connected to an edge of the bottom plate, the lens module is attached to the side wall plate, the lens module forms a mounting cavity together with the bottom plate and the side wall plate, and the elastic member, the photosensitive chip module and the driving module are all located within the mounting cavity. 9. The imaging device according to claim 8, wherein one of the first mounting portion and the second mounting portion is a mounting hole, and the other is a mounting post fitted into the mounting hole. The imaging device according to claim 2 , wherein the lens module includes a frame for mounting the lens body, and the electrostrictive assembly is connected to the frame and the first substrate, respectively. An electronic device comprising the imaging device according to any one of claims 1 to 10. A control method for the photographing device according to any one of claims 1 to 10, comprising:
Receiving user input;
In response to the input, the driving module drives the photosensitive chip module to move within the first plane to achieve vibration isolation.