CN106791289B - Camera module and its optical anti-vibration element and anti-fluttering method - Google Patents
Camera module and its optical anti-vibration element and anti-fluttering method Download PDFInfo
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- CN106791289B CN106791289B CN201510816961.4A CN201510816961A CN106791289B CN 106791289 B CN106791289 B CN 106791289B CN 201510816961 A CN201510816961 A CN 201510816961A CN 106791289 B CN106791289 B CN 106791289B
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- movable part
- circuit board
- fixed part
- optical anti
- camera module
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Adjustment Of Camera Lenses (AREA)
- Studio Devices (AREA)
Abstract
The present invention discloses a camera module and its optical anti-vibration element and anti-fluttering method, one optical anti-vibration element is installed on to the sensitive chip end of camera module, in shooting process, the optical anti-vibration element obtained using semi-conducting material manufacturing technique drives the movement of the sensitive chip by the variation of voltage, and then realize optical anti-vibration, fast response time, anti-shake effect is good, and product cost is low.
Description
Technical field
The present invention relates to camera module field more particularly to the optical anti-vibration element and optical anti-vibration method of camera module,
To realize optical anti-vibration effect when shooting.
Background technique
Mobile phone market, which remains unchanged, at present keeps the trend of rapid growth, and wherein the growth of smart phone is swifter and more violent, as mesh
The quantity demand of the camera of preceding smart phone standard configuration is more and more, and the brilliant pursuit of the performance of camera module is had become
The keen competition key technology area of major mobile-phone manufacturers.
Auto-focusing (AF) the mould group of the performance of mobile phone camera module from initial fixed-focus mould group finally, to current master
Optical anti-vibration (OIS) mould group of power discussion, with the explosive increase and high-resolution of the functional mobile phone camera of auto-focusing
Realization, in the activity such as public trip, tourism, party, mobile phone is gradually instead of card camera.Present optical anti-vibration
Performance the realization function that will gradually enable a slim and graceful smart phone of fuselage have single-lens reflex camera, with consumer demand,
The research and development speed of such marginal period mobile phone optical anti-vibration camera module to be promoted.
The optical anti-vibration technology of traditional mobile phone is the mobile stabilization technology of the driving camera lens of the motor based on VCM, is such as schemed
Shown in 1A and Figure 1B, this kind of traditional technology is broadly divided into two kinds from structure: (1) X-Y translates stabilization；(2) it tilts
(Tilt) stabilization.Traditional stabilization technology, because VCM has the following disadvantages the reason of structure is complicated and bottleneck: artificial investment is big,
Human cost is high；Complex procedures, process costs are high；The effect phase is long, and precision is low, and process consistency is poor；Moving displacement is limited, mobile
Slowly, anti-shake effect is bad；Mobile slow, power consumption is high, and size is larger, so that integrated level is low, it is big to take up space.
In addition, with the continuous development of science and technology, other all trades and professions all occur needing the feelings of Application Optics camera lens
Shape, such as medicine, military affairs, field, it may be said that the application of optical anti-vibration technology will more extensively.Therefore, it is badly in need of developing corresponding
Technology so that these disadvantages of traditional optical anti-vibration technology are improved, and then the optics for being improved camera module is anti-
The fruit trembled reduces cost, simplifies technique, so that the application of optical anti-vibration technology is more universal.
Summary of the invention
It is an object of the present invention to provide a camera module and its optical anti-vibration element and anti-fluttering method, by by light
It learns stabilization element and is set to that one end of sensitive chip, realize optical anti-vibration effect when shooting.
Another object of the present invention is to provide a camera module and its optical anti-vibration elements and anti-fluttering method and traditional
Optical anti-vibration mould group is compared, and integrated level is higher, and size is small, is taken up space smaller, and power consumption is lower, is conducive to optical anti-vibration camera shooting mould
The miniaturization production of group.
Another object of the present invention is to provide a camera module and its optical anti-vibration elements and anti-fluttering method, can be effective
It shortens the construction period, reduces human cost.
Another object of the present invention is to provide a camera module and its optical anti-vibration elements and anti-fluttering method, and optics is prevented
Integration production of the element for mobile phone camera module factory is trembled, process consistency is good, is greatly improved the yield of product.
Another object of the present invention is to provide a camera module and its optical anti-vibration elements and anti-fluttering method, utilize COB
With the advantage of automation, whole production cycle of camera module product can be effectively shortened, improve the competitiveness of product in market.
Another object of the present invention is to provide a camera module and its optical anti-vibration element and anti-fluttering method, wherein optics
Stabilization element is manufactured using semiconductor material and semiconductor technology manufacturing technology, is easy to be mass produced, and can guarantee compared with
High yield.
Another object of the present invention is to provide a camera module and its optical anti-vibration element and anti-fluttering method, optical anti-vibrations
Cost is relatively low for element, precision is high, consistency is good, fast response time.
Another object of the present invention is to provide a camera module and its optical anti-vibration elements and anti-fluttering method, pass through voltage
Variation, drive sensitive chip moved, moving displacement is changeable, so realize optical anti-vibration effect, optical anti-vibration effect
Fruit is good.
Another object of the present invention is to provide a camera module and its optical anti-vibration element and anti-fluttering method, technique letters
It is single, at low cost, anti-shake effect is good, can satisfy the demand in market.
To meet object above and other objects of the present invention and advantage of the invention, the present invention provides a camera shooting mould
Group comprising:
One camera module main body a comprising camera lens and a sensitive chip；And
One optical anti-vibration element drives the photosensitive core wherein the optical anti-vibration element is connected to the sensitive chip
Piece is mobile, and then realizes optical anti-vibration in shooting process.
In one embodiment, the optical anti-vibration element have preset electric conductivity and including an at least movable part,
An at least fixed part and multiple connectors, the movable part and the fixed part are apart from one another by ground arrangement, multiple connectors
The movement for allowing the movable part between the movable part and the fixed part and while connection function is provided is extended,
The movable part is connected to the sensitive chip, in this way in driving voltage of the optical anti-vibration element in input variation, institute
It is mobile to drive the sensitive chip mobile to state movable part.
In one embodiment, the fixed part of the optical anti-vibration element includes that one first fixed part and one second are solid
Portion is determined, wherein the movable part is set between first and second fixed part and fixes respectively with described first and second
Portion apart from one another by ground arrange, and by it is multiple apart from one another by the connector be connected with first and second fixed part
It connects, there is the connector preset flexibility the movable part to be enable to move.
In one embodiment, the optical anti-vibration element is installed on the rear side of the sensitive chip.
In one embodiment, the camera module further comprises a printed circuit board comprising a hard circuit board
With the flexible circuit board for being electrically connected to the hard circuit board, wherein the hard circuit board has a groove, wherein described
Optical anti-vibration element is installed in the groove.
In one embodiment, the flexible circuit board, first fixed part are fixed in second fixed part bottom side
The hard circuit board is electrically connected to receive the driving voltage from the hard circuit board.
In one embodiment, the camera module further comprises a hard circuit board, wherein the optical anti-vibration is first
Part is connected to the surface of the hard circuit board.
In one embodiment, the bottom side of first fixed part and second fixed part is both secured to the hardness electricity
Road plate, and first fixed part is electrically connected at the hard circuit board to receive the driving electricity from the hard circuit board
Pressure.
In one embodiment, the connector is arranged so that the movable part and the flexible circuit board have spacing
To be in vacant state.
In one embodiment, raised electric elements and the connector are arranged so that institute on the hard circuit board
Stating movable part and the hard circuit board has spacing in vacant state.
In one embodiment, the movable part and second fixed part are annular in shape, and second fixed part bottom
The flexible circuit board is further fixed in side.
In one embodiment, the movable part is adhered to the bottom side of the sensitive chip.
In one embodiment, the movable part and first and second fixed part are made of semiconductor material, institute
It states connector to use with predetermined flexible and electric conductivity and be capable of providing the material of support and connection function and be made, to allow
State the movement of movable part.
In one embodiment, the movable part generates translational displacement under the action of the driving voltage, to drive
It is mobile to state sensitive chip.
In one embodiment, further by glue when routing is bonded between the hard circuit board and the sensitive chip
Envelope.
According to a further aspect of the invention, the present invention provides an optical anti-vibration element, is suitable for the application of in camera module,
Optical anti-vibration is carried out, wherein the optical anti-vibration element has preset electric conductivity and includes:
An at least movable part is connected to a sensitive chip of the camera module；
An at least fixed part；And
Multiple connectors, wherein the movable part and the fixed part are apart from one another by ground arrangement and multiple connectors
It extends between the movable part and the fixed part and for allowing the movable part under the action of driving voltage of variation
Movement is to drive the sensitive chip mobile.
In one embodiment, in above-mentioned optical anti-vibration element, the optical anti-vibration element is installed on the camera shooting mould
In the groove that the hard circuit board that group includes has, and the top side of the movable part is adhered to the bottom of the sensitive chip
Side.
In one embodiment, the optical anti-vibration element is installed on the hard circuit board that the camera module includes
Surface, and the top side of the movable part is adhered to the bottom side of the sensitive chip.
In one embodiment, in above-mentioned optical anti-vibration element, the fixed part includes one first fixed part and one the
Two fixed parts, first fixed part and second fixed part be located at the inner side and outer side of the movable part and with it is described
Movable part is arranged apart from one another by ground, and is connected by the connector with the movable part.
In one embodiment, in above-mentioned optical anti-vibration element, the fixed part includes one first fixed part and one the
Two fixed parts, first fixed part and second fixed part be located at the inner side and outer side of the movable part and with it is described
Movable part is arranged apart from one another by ground, and is connected by the connector with the movable part.
In one embodiment, in above-mentioned optical anti-vibration element, the connector has default flexible in offer connection
The movable part is set to move when with supporting role, and the movable part is set to described first and second in vacant state
Between fixed part.
According to a further aspect of the invention, the present invention also provides an optical anti-vibration methods, applied to a camera module
Optical anti-vibration, the method comprise the steps that
(A) in camera module shooting process, a conductive optical anti-vibration element, which receives, comes from hard circuit board
The driving voltage of the variation of input；
(B) movable part of the optical anti-vibration element is moved according to the variation of voltage；And
(C) sensitive chip that the movable part drives the camera module to include is moved, and realizes optical anti-vibration.
In one embodiment, in the above-mentioned methods, one second fixed part is further comprised the steps of: to receive from the hardness electricity
The driving voltage of road plate simultaneously passes to the movable part in vacant state, the driving voltage of the movable part
The lower translation of effect, to drive the sensitive chip mobile.
In one embodiment, in the above-mentioned methods, it further comprises the steps of: and institute is arranged in the movable part vacant state
It states and is arranged between the second fixed part and one first fixed part and respectively with first and second fixed part apart from one another by ground, it is more
A connector extends between the movable part and first and second fixed part and conducts the driving voltage.
In one embodiment, in the above-mentioned methods, it further comprises the steps of: and the movable part is adhered to the sensitive chip
Bottom side, and the flexible circuit board is fixed in first and second fixed part bottom side.
In one embodiment, in the above-mentioned methods, it further comprises the steps of: and the optical anti-vibration element is installed on described take the photograph
As the hard circuit board of mould group a groove in, and make the position of the movable part in the bottom side of the sensitive chip.
In one embodiment, in the above-mentioned methods, it further comprises the steps of: and the optical anti-vibration element is installed on described take the photograph
As the surface of the hard circuit board of mould group, and make the position of the movable part in the bottom side of the sensitive chip.
Detailed description of the invention
Figure 1A and Figure 1B is the structural schematic diagram according to traditional optical anti-vibration technology.
Fig. 2 is the camera module structural section schematic diagram of first preferred embodiment according to the present invention.
Fig. 3 A is the schematic top plan view of the optical anti-vibration component structure of above-mentioned first preferred embodiment according to the present invention.
Fig. 3 B is the optical anti-vibration element knot of a deformation implementation of above-mentioned first preferred embodiment according to the present invention
The schematic top plan view of structure.
Fig. 4 is the schematic cross-section of the camera module structure of second preferred embodiment according to the present invention.
Fig. 5 is the schematic top plan view of the optical anti-vibration component structure of above-mentioned second preferred embodiment according to the present invention.
Fig. 6 is the schematic cross-section of the camera module structure of third preferred embodiment according to the present invention.
Fig. 7 is the schematic top plan view of the optical anti-vibration component structure of above-mentioned third preferred embodiment according to the present invention.
Fig. 8 is the schematic cross-section of the camera module of the 4th preferred embodiment according to the present invention.
Fig. 9 is the schematic cross-section of the camera module of the 5th preferred embodiment according to the present invention.
Figure 10 is the flow diagram of the optical anti-vibration method of above preferred embodiment according to the present invention.
Figure 11 is the manufacturing method flow diagram of the camera module of above preferred embodiment according to the present invention.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.It is excellent in being described below
Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description
Basic principle of the invention can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back
Other technologies scheme from the spirit and scope of the present invention.
Fig. 2 and Fig. 3 show first preferred embodiment of the invention.As shown in Figures 2 and 3, which illustrate a camera shootings
Mould group comprising a camera module main body, the camera module main body include a motor (VCM) 10, one camera lens (Lens) 20, one
The printing of 40, one sensitive chip (Sensor) 50, one of cutoff filter (IR Cut Filter) 30, one microscope base (Holder)
Circuit board 60 and an optical anti-vibration element 70, the printed circuit board 60 further comprise hard circuit board (PCB) 61 and electrical property
It is connected to the flexible circuit board (FPC) 62 of the hard circuit board 61.In this embodiment in accordance with the invention, the optical anti-vibration
Element 70 is connected to the sensitive chip 50 to play the role of stabilization.It is understood that the camera module further includes gyro
The devices such as instrument sensor (not shown) incude the jitter direction and amplitude of the camera module by the gyroscope, then
These data transmissions to processor are screened, are amplified by the gyro sensor, and the described of shake can be offset by calculating
Then it is mobile to drive the optical anti-vibration element 70 for the displacement of sensitive chip 50, thus drive the sensitive chip mobile, with
Reach anti-shake effect.
The camera lens 20 is connected in the motor 10, and the motor 10 passes through the microscope base 40 and the printed circuit board
60 hard circuit board 61 is connected, and the cutoff filter 30 is connected in the microscope base 40 by its bracket,
And the print is electrically connected at positioned at the front side of the sensitive chip 50 and the rear side of the camera lens 20, the sensitive chip 50
The hard circuit board 61 of printed circuit board 60 sets a groove 63 among the hard circuit board 61, by the optical anti-vibration member
Part 70 is installed in the groove 63, and the sensitive chip 50 is set to the front side of the optical anti-vibration element 70, as shown in Figure 2
Situation when, the sensitive chip 50 is set to the top of the optical anti-vibration element 70, wherein the sensitive chip 50 is by beating
The mode of line bonding is electrically connected to the hard circuit board 61, for the transmitting of signal.The groove 63 can penetrate described hard
Property circuit board 61, is also possible to not penetrate the hard circuit board 61.In Fig. 2 to example shown in fig. 7, the groove 63
It is the top surface and bottom surface that the hard circuit board 61 is extended across along the thickness direction of the hard circuit board 61
Perforation.In the example shown in Fig. 8, the groove 63 is to extend across institute along the thickness direction of the stealthy circuit board 61
The top surface of answering property circuit board 61 is stated, but does not reach bottom surface, belongs to blind hole.
The optical anti-vibration element 70 is set in the groove 63, and is electrically connected to around the optical anti-vibration element 70
The middle part of the hard circuit board 61 of the printed circuit board 60, the optical anti-vibration element 70 is connected to the sensitive chip
50, the sensitive chip 50 as described in being adhered to by glue realizes anti-shake effect to drive the sensitive chip 50 mobile.?
It is to drive camera lens is mobile to realize stabilization, but the movement for driving camera lens mobile by motor by motor in traditional stabilization technology
Range is smaller, and anti-shake effect is not very good, and in the present invention, camera lens is without movement, it is only necessary to pass through the optical anti-vibration
Stabilization can be realized to move the sensitive chip 50 in the movement of element 70, and movement is sensitiveer, and moving range is larger, when shooting
Anti-shake effect is more preferable.
It is noted that the shape of the optical anti-vibration element 70 is adapted with the shape of the groove 63, in order to
The optical anti-vibration element 70 is stably mounted in the groove 63.
In this preferred embodiment, as shown in Figure 3A, the optical anti-vibration element 70, is made of semiconductor material,
Ring shaped movable portion 71, a fixed part 72 and at least a connection piece 73 to suspend including one, the movable part 71 and the fixed part
There is gap between 72, i.e., has a reserved space 74 between the described movable part 71 and the fixed part 72, in order to the movable part
71 are moved accordingly, wherein being connected between the movable part 71 and the fixed part 72 by the connector 73.
In the preferred embodiment, the connector 73 is preferably implemented as having predetermined flexible thread, can be by institute
It states movable part 71 to be connected with the fixed part 72 to provide support and connection function, and the shifting of the movable part 71 will not be hindered
Dynamic and reset.
The movable part 71 is adhered to the sensitive chip 50, the interior change by driving voltage of the optical anti-vibration element 70
The displacement that changing makes the movable part 71 generate horizontal direction drives the sensitive chip 50 mobile, and then realizes optical anti-vibration effect
Fruit.The fixed part 72 is electrically connected at the hard circuit board 61, and the optical anti-vibration element 70 is electrically connected at institute
Printed circuit board 60 is stated to receive driving voltage and generate movement, and the optical anti-vibration element 70 is fixed on described recessed
In slot 61, the movable part 71 is able to be connected to the fixed part 72 by the connector 73, but due to the movable part 71
There is the reserved space 74 between the fixed part 72, and the connector 73 has certain flexibility, therefore, the activity
Portion 71 can be move freely in the range of reserved space 74, and the sensitive chip 50 is connected with the movable part 71,
And the movable part 71 can support the sensitive chip 50, and be adjusted by the variation of voltage, the movable part 71 can be
It is moved in shooting process, when the movable part 71 is mobile, is able to that the sensitive chip 50 is driven to be moved accordingly,
And then optical anti-vibration function is realized in shooting process.
It is noted that the connector 73 is made of flexible material, and is also designed to have elasticity, it is described
Movable part 71 is in vacant state, i.e., the top surface of the described movable part 71 is connected to the sensitive chip 50, the movable part 71
Bottom surface and the groove 61 bottom keep a spacing, in other words, top surface, bottom surface and the institute of the movable part 71
The top surface of fixed part 72, bottom surface are stated in same plane, can also not in the same plane, the movable part 71 is in outstanding
Floating state, and have activity space along front and rear sides.
In the preferred embodiment, the fixed part 72 includes one first fixed part 721 and one second fixed part 722, institute
The inside that the first fixed part 721 is located at the movable part 71 is stated, second fixed part 722 is annular in shape, and is located at the activity
The outside in portion 72, and described in first fixed part 721 and second fixed part 722 keep between the movable part 71
Reserved space 74, and the size of the reserved space 74 changes according to the movement of the movable part 71.In other words, described
One fixed part 721, the movable part 71 and second fixed part 722 successively arrange from inside to outside, are all provided between three
State reserved space 74.The movable part 72 of annular passes through between first and second fixed part 721 and 722
It is multiple apart from one another by flexible connecting member 73 be connected with first and second fixed part 721 and 722.
In this preferred embodiment, more specifically, 721 bottom side of the first fixed part is adhered to the flexible circuit board
62, thus fixed, second fixed part 722 is electrically connected to the interior of the formation groove 63 of the hard circuit board 61
Wall, and preferably, 722 bottom side of the second fixed part is also further adhered to the flexible circuit board 62, thus described
Flexible circuit board 62 is provided a supporting role to first and second fixed part 721 and 722.In addition, the optical anti-vibration element
All with preset electric conductivity, when the driving voltage of variation is sent to the optical anti-vibration element 70 from the hard circuit board 61
When, drive the movable part 71 of suspension to generate the translation of horizontal direction, to drive the sensitive chip 50 mobile, to realize
Anti-shake effect.
It is noted that the surface of first fixed part 721, the movable part 71 and second fixed part 722
It can be not at same plane, for the face that the optical anti-vibration element 70 is connected with the sensitive chip 50, such as
Shown in Fig. 2, the connector 73 between the movable part 71 and first fixed part 721 can be inclined, and
And position is lower than the connector 73 arranged in horizontal direction between the movable part 71 and second fixed part 722,
So that bottom surface and second fixed part 722 of the bottom surface of the movable part 71 also above first fixed part 721
Bottom surface, in this way, the sensitive chip 50 will not be touched when the sensitive chip 50 is mobile with the movable part 71
To first fixed part 721 and second fixed part 722, the sensitive chip 50 is protected, it is safer, meanwhile, institute
The bottom surface for stating movable part 721 will not touch the flexible circuit board 62, this but also the movement of the movable part 71 more
Conveniently and flexibly.In other words, the movable part 71 is in vacant state, and top surface is mutually Nian Jie with the sensitive chip 50,
Its bottom surface has a spacing apart from the bottom portion of groove, and left surface, right surface, front surface and rear surface and described first are fixed
Remain with the reserved space 74 between portion 721 and second fixed part 722, and the top table of first fixed part 721
Face and the sensitive chip 50 keep certain spacing, the bottom of the bottom surface of first fixed part 721 and the groove 61
It is connected, side is connected with the movable part 71 by the connector simultaneously, firmly in order to the movable part 71
It is mobile.Second fixed part is connected to the printed circuit board 60, further guarantees moving freely for the movable part 71.
It is noted that the optical anti-vibration element 70 is carried out using semiconductor material and semiconductor technology manufacturing technology
Manufacture is equipped with corresponding electric elements wherein, and in this way during the camera module is shot, the movable part 71 can
By the variation of voltage, the sensitive chip 50 is driven to be moved, according to the actual situation, carry out vertical direction movement or
The movement of horizontal direction or between inclination movement both vertically and horizontally, to realize optical anti-vibration function.
Specifically, as shown in Figure 10, in the camera module shooting process, the optical anti-vibration element 70 detects electricity
The variation of pressure, and the direction moved as needed and distance push the movable part 71 to be moved accordingly, in the activity
During portion 71 is mobile, it will drive the sensitive chip 50 and moved accordingly, for example, the movement in horizontal displacement, into
And the camera module is made to realize optical anti-vibration effect in shooting process.
To sum up, optical anti-vibration method provided by the invention the following steps are included:
(A) in the camera module shooting process, the optical anti-vibration element 70 receives the change from hard circuit board
The driving voltage (1001) of change；
(B) movable part 71 that the optical anti-vibration element 70 includes carries out mobile (1002) according to the variation of voltage；
And
(C) sensitive chip 50 that the movable part 71 drives the camera module to include is moved, and realizes optics
Stabilization (1003).
Due to there is the reserved space 74 between the movable part 71 and the fixed part 72, the movable part 71
It can move freely, mobile distance and direction are determined according to the variation of voltage, and the change threshold of voltage is pre-filled with institute
It states in optical anti-vibration element 70, is moved accordingly according to predetermined threshold, movement is more accurate, therefore, optical anti-vibration effect
Preferably.
As shown in figure 11, in the manufacturing process of the camera module provided by the invention, using following steps system
Make: (1101) carry out the surface mount and fluting of PCB61 under certain process conditions；(1102) the optical anti-vibration component
70 preparation and attaching；(1103) attaching of the sensitive chip 50；(1104) routing is bonded；(1105) patch of the microscope base 40
It is attached；(1106) installation of the motor 10；And after the completion of the manufacture of (1107) camera module, carry out the test of optical anti-vibration.
The manufacturing process of camera module of the invention is that the optical anti-vibration element 70 at the end Sensor is directly applied to mobile phone
The integration production of camera module factory (CCM), using the advantage of COB and automation, can greatly improve camera module product
Yield shortens the production cycle of product, improves the production efficiency of product, promotes the competitiveness of product in all its bearings.And institute
Optical anti-vibration element 70 is stated set on the end Sensor, relatively traditional OIS-VCM component, the cost of the camera module entirety is more
Low, precision is higher, and consistency is more preferable, response speed also faster so that the sensitive chip 50 has biggish displacement space, energy
It is enough to reach preferable optical anti-vibration effect on the basis of lower cost.In addition, by PCB recessing 63, by the optics
Stabilization element 70 is installed in groove 63, and is connected to the sensitive chip 50, i.e., is set to the optical anti-vibration element 70
The end Sensor it is smaller so that the integrated level of camera module is higher, moved freely by the variation of voltage, power consumption compared with
It is low, be conducive to economize on resources.
Further, since routing is connected between the sensitive chip 50 and the printed circuit board 60, to keep the two
Status of electrically connecting can carry out gluing sealing on the routing and its corresponding pad, the routing is sealed up, to protect
Its stable state is held, prevents the movable part 71 during driving the sensitive chip 50 mobile, routing offset occurs, collapses
Situations such as line, disabler, at the same can prevent the routing and air for a long time, come into contact in a large area, reduce the routing
Oxidation rate not only can choose more inexpensive wire rod as routing material, and protection that can be more intact images mould
The safety of group, so that also can be carried out under the particular surroundings such as camera module is in high-intensitive physical impact, high temperature and high humidity can
The work leaned on.
In the preferred embodiment, the shape of the optical anti-vibration element 70 and the groove 60 matches, in order to incite somebody to action
The optical anti-vibration element 70 is installed on the groove 61, as shown in fig. 2 and fig. 3 a, the groove 61 and the stabilization element 70
It is rectangular, as shown in Figure 3B deformation implementation, the groove 61A and the stabilization element 70A are set as round, i.e., and described the
One fixed part 721A, the second fixed part 722A, the movable part 71A and the reserved space 74A are circle, and described
It is connected between one fixed part 721A, the second fixed part 722A and the movable part 71A by the connector 73A.Value
One be mentioned that, when the shape Incomplete matching of the optical anti-vibration element 70 and the groove 61, at least so that described the
The shape of the outer rim of two fixed parts 722 and the shape of the groove 61 match, for example, when the groove 61 is rectangular, institute
State the second fixed part 722 outer rim be it is rectangular, match with the groove 61, and the inner edge of second fixed part 722, described
Movable part 71, first fixed part 721 and the reserved space 74 are circle, or when the groove 61 is round,
The outer rim of second fixed part 722 is circle, is matched with the groove 61, and the inner edge of second fixed part 722, institute
State movable part 71, first fixed part 721 and the reserved space 74 be it is rectangular, both modes equally can will be described
Optical anti-vibration element 70 is securely connected in the printed circuit board 60, and the movable part 71 is made to keep good activity,
To drive the sensitive chip 50 mobile, good optical anti-vibration effect is realized.
Fig. 4 and Fig. 5 show second preferred embodiment of the invention.As shown in Figure 4 and Figure 5, an optical anti-vibration element
70B, including a movable part 71B, a fixed part 72B and multiple connector 73B, wherein the connector 73B is connected to the work
Between the dynamic portion 71B and fixed part 72B, there is a reserved space 74B between the movable part 71B and the fixed part 72B, make
It obtains and keeps certain spacing between the movable part 71B and the fixed part 72B, the connector 73B has certain stretch
Property, the size of the reserved space 74B between the movable part 71B and the fixed part 72B can be changed, so that institute
Stating movable part 71B can move freely, meanwhile, and without departing from the fixed part 72B, safer, movement is also more convenient
With it is sensitive.Also, by the size that the reserved space 74B is arranged, with change that the movable part 71B can move it is maximum away from
From so that the movable part 71B mobile distance freely can be designed and be adjusted according to the actual situation.
It is noted that top surface, the bottom table of the top surface of the movable part 71B, bottom surface and the fixed part 72B
Not in the same plane, i.e., the described movable part 71B is in vacant state, can move freely in face.
The top surface of the movable part 71B is adhered to the sensitive chip 50, obtains so that the movable part 71B is electrically connected to
The sensitive chip 50, in shooting process, when voltage changes, the movable part 71B can be moved, and then drive the sense
Optical chip 50 is moved accordingly, realizes the optical anti-vibration function of the camera module in shooting process.
Fig. 6 and Fig. 7 show third preferred embodiment of the invention.As shown in Figure 6 and Figure 7, an optical anti-vibration element
70C, including a movable part 71C, a fixed part 72C and multiple flexible connecting member 73C, wherein the movable part 71C is described in
Connector 73C is connected with the fixed part 72C, and is maintained one between the movable part 71C and the fixed part 72C
Fixed spacing, and then it is convenient for the movement of the movable part 71C, it is reserved that one is equipped between the movable part 71C and the fixed part 72C
Space 74C, convenient for the activity of the movable part 71C.
In the preferred embodiment, the movable part 71C includes one first movable part 711C and one second movable part 712C,
The fixed part 72C includes one first fixed part 721C and one second fixed part 722C, wherein first movable part 711C
In the most intermediate position of the optical anti-vibration element 70C, it is then sequentially connected the first fixed part 721C, second work
Dynamic portion 712C and the second fixed part 722C, the second fixed part 722C are set on the outermost of the optical anti-vibration element 70C
Side is connected with the hard circuit board 61, is able to for the optical anti-vibration element 70 being safely installed in the groove 63.
In other words, the first movable part 711C, the first fixed part 721C, the second movable part 712C and described second are consolidated
Determine portion 722C successively to be connected outward by interior, wherein the first movable part 711C and the first fixed part 721C passes through the company
Fitting 73C is connected, and the first fixed part 721C is connected with the second movable part 712C by the connector 73C,
The second movable part 712C is connected with the second fixed part 722C by the connector 73C, and first activity
Between portion 711C and the first fixed part 721C, between the first fixed part 721C and the second movable part 712C, institute
It states and all remains with the reserved space 74C between the second movable part 712C and the second fixed part 722C, in order to described
The movement of one movable part 711C and the second movable part 712C.
It is noted that the first movable part 711C and the second movable part 712C are in vacant state, i.e.,
The top surface of the first movable part 711C and the second movable part 712C, bottom surface with the first fixed part 721C and
The top surface of the second fixed part 722C, bottom surface not in the same plane so that the first movable part 711C with
The second movable part 712C is in vacant state, is moved freely.The first fixed part 721C and described second is fixed
Portion 722C is able to position the first movable part 711C and second movable part by the connection of the flexible connecting member 73C
712C, while will not influence the movement of the first movable part 711C and the second movable part 712C again.
The top surface of the top surface of the first movable part 711C and the second movable part 712C are all connected to the sense
Optical chip 50, when the first movable part 711C and the second movable part 712C is under the variation of voltage, can move when
It waits, will drive the movement of the sensitive chip 50, and then realize optical anti-vibration function in shooting process.
Fig. 8 is the 4th preferred embodiment provided by the invention.As shown in figure 8, optical anti-vibration element 70D, by partly leading
Body material is made, ring shaped movable portion 71D, a fixed part 72D and at least a connection piece 73D to suspend including one, the movable part
There is gap between fixed part 72D described in 71D, i.e., have a reserved space 74D between the described movable part 71D and the fixed part 72D,
In order to which the movable part 71D is moved accordingly, wherein by described between fixed part 72D described in the movable part 71D
Connector 73D is connected.
The sensitive chip 50D is electrically connected at the hard circuit board 61D of the printed circuit board 60D, described hard
A groove 63D is set among property circuit board 61D, the optical anti-vibration element 70D is installed in the groove 63D, it is described photosensitive
Chip 50D is set to the front side of the optical anti-vibration element 70D, and when situation as shown in Figure 8, the sensitive chip 50D is set to
The top of the optical anti-vibration element 70D, wherein the sensitive chip 50 be electrically connected in such a way that routing is bonded it is described hard
Property circuit board 61D, for the transmitting of signal.The groove 63D does not penetrate the hard circuit board 61D.
The first fixed part 721D, the movable part 71D and the second fixed part 722D are arranged at intervals, described
The default flexibility of connector 73D makes the movable part 71D be in vacant state, is able to carry out corresponding movement.
In this preferred embodiment, more specifically, the bottom side the first fixed part 721D is adhered to the rigid circuit
Plate 61D, thus fixed, the second fixed part 722D is electrically connected to the formation groove of the hard circuit board 61D
The inner wall of 63D, and preferably, the bottom side the second fixed part 722D is also further adhered to the hard circuit board 61D,
To which the hard circuit board 61D is provided a supporting role to the first and second fixed parts 721D and 722D.In addition, the light
Stabilization element 70D is learned all with preset electric conductivity, when the driving voltage of variation is sent to the light from the hard circuit board 61D
When learning stabilization element 70D, the movable part 71D of suspension is driven to generate the translation of horizontal direction, to drive the photosensitive core
Piece 50 is mobile, to realize anti-shake effect.
Fig. 9 is the 5th preferred embodiment provided by the invention.As shown in figure 9, optical anti-vibration element 70E, by semiconductor
Material is made comprising ring shaped movable portion 71E, a fixed part 72E and at least a connection piece 73E to suspend, the movable part
There is gap between fixed part 72E described in 71E, i.e., have a reserved space 74E between the described movable part 71E and the fixed part 72E,
In order to which the movable part 71E is moved accordingly, wherein by described between fixed part 72E described in the movable part 71E
Connector 73E is connected.
The sensitive chip 50E is electrically connected at the hard circuit board 61E of the printed circuit board 60E, the light
The surface that stabilization element 70E is connected to the hard circuit board 61E is learned, the electric appliance of protrusion on the hard circuit board 61E is passed through
The optical anti-vibration element 70E is installed between the sensitive chip 50 and the hard circuit board 61E by element, i.e., the described sense
Optical chip 50E is set to the front side of the optical anti-vibration element 70E, and when situation as shown in Figure 8, the sensitive chip 50E is set
In the top of the optical anti-vibration element 70E, wherein the sensitive chip 50 be electrically connected in such a way that routing is bonded it is described
Hard circuit board 61E, for the transmitting of signal.
In this preferred embodiment, more specifically, the bottom side the first fixed part 721E is adhered to the rigid circuit
Plate 61E, thus fixed, the second fixed part 722E is electrically connected to the hard circuit board 61E, and preferably, institute
It states the second bottom side fixed part 722E and is also further adhered to the hard circuit board 61E, so that the hard circuit board 61E gives
First and second the fixed parts 721E and 722E are provided a supporting role.It is noted that the optical anti-vibration element 70E is viscous
It is connected to the hard circuit board 61E, due to the effect of the component of hard circuit board 61E protrusion, so that described first is solid
Determine portion 721E and the second fixed part 722E is able to be fixed on the hard circuit board 61E, while making the movable part
There is certain preset clearance between 71E and the hard circuit board 61E, the movable part 71E is enabled there are enough skies
Between move freely moved so that the optical anti-vibration element 70E is able to drive the sensitive chip 50.In addition, institute
Optical anti-vibration element 70E is stated all with preset electric conductivity, when the driving voltage of variation is sent to institute from the hard circuit board 61E
When stating optical anti-vibration element 70E, the movable part 71E of suspension is driven to generate the translation of horizontal direction, to drive the sense
Optical chip 50E is mobile, to realize anti-shake effect.
In the example shown in Fig. 9, and not set groove, it is electric appliance member by protrusion on the hard circuit board 61E
Part forms groove, so that having spacing, the in addition connector between the movable part 71E and the hard circuit board 61E
The flexible effect of 73E, so that the movable part 71E is in vacant state, so that the optical anti-vibration element 70E is able to band
It moves the sensitive chip 50E to be moved accordingly, realizes stabilization in shooting process.
It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating
And it is not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.Function and structural principle of the invention exists
It shows and illustrates in embodiment, under without departing from the principle, embodiments of the present invention can have any deformation or modification.
Claims (32)
1. a camera module characterized by comprising
One camera module main body a comprising camera lens and a sensitive chip；And
One optical anti-vibration element drives the sensitive chip to move wherein the optical anti-vibration element is connected to the sensitive chip
It is dynamic, and then realize optical anti-vibration in shooting process, wherein the optical anti-vibration element have preset electric conductivity and including
An at least movable part, at least a fixed part and multiple connectors, the movable part and the fixed part are arranged apart from one another by ground, more
A connector extends between the movable part and the fixed part and described in allowing while providing connection function
The movement of movable part, the movable part are connected to the sensitive chip, in this way in the optical anti-vibration element in input variation
When driving voltage, the movable part is mobile to drive the sensitive chip mobile, wherein the optical anti-vibration element is described solid
Determine portion include one first fixed part and one second fixed part, wherein the movable part be set to first and second fixed part it
Between and respectively with first and second fixed part apart from one another by ground arrange, and by it is multiple apart from one another by the connection
Part is connected with first and second fixed part, and there is the connector preset flexibility the movable part to be enable to move.
2. camera module according to claim 1, wherein after the optical anti-vibration element is installed on the sensitive chip
Side.
3. camera module according to claim 2, wherein the camera module further comprises a printed circuit board, packet
A hard circuit board and the flexible circuit board for being electrically connected to the hard circuit board are included, wherein the hard circuit board has one
Groove, wherein the optical anti-vibration element is installed in the groove.
4. camera module according to claim 3, wherein the flexible circuit board is fixed in second fixed part bottom side,
First fixed part is electrically connected at the hard circuit board to receive the driving voltage from the hard circuit board.
5. camera module according to claim 2, wherein the camera module further comprises a hard circuit board, wherein
The optical anti-vibration element is connected to the surface of the hard circuit board.
6. camera module according to claim 5, wherein the bottom side of first fixed part and second fixed part is equal
It is fixed on the hard circuit board, and first fixed part is electrically connected at the hard circuit board with from the rigid circuit
Plate receives the driving voltage.
7. camera module according to claim 3 or 4, wherein the connector be arranged so that the movable part with it is described
Flexible circuit board has spacing to be in vacant state.
8. camera module according to claim 5 or 6, wherein electric elements raised on the hard circuit board and described
Connector is arranged so that the movable part and the hard circuit board have spacing in vacant state.
9. camera module according to claim 3 or 4, wherein the movable part and second fixed part are annular in shape, and
And the flexible circuit board is further fixed in second fixed part bottom side.
10. camera module according to claim 3 or 4, wherein the movable part and second fixed part are in Fang Huanzhuan
Or it is circular, and the bottom side of first and second fixed part is adhered to the flexible circuit board.
11. according to claim 1 to any camera module in 6, wherein the movable part is adhered to the sensitive chip
Bottom side.
12. camera module according to claim 10, wherein the movable part is adhered to the bottom side of the sensitive chip.
13. according to claim 1 to any camera module in 6, wherein the movable part and described first and second is consolidated
Determine portion to be made of semiconductor material, the connector, which uses, to be had predetermined flexible and electric conductivity and be capable of providing support and company
The material for connecing effect is made, to allow the movement of the movable part.
14. camera module according to claim 12, wherein the movable part and first and second fixed part use
Semiconductor material is made, and the connector uses with predetermined flexible and electric conductivity and is capable of providing support and connection function
Material is made, to allow the movement of the movable part.
15. according to claim 1 to any camera module in 6, wherein work of the movable part in the driving voltage
With lower generation translational displacement, to drive the sensitive chip mobile.
16. camera module according to claim 11, wherein the movable part generates under the action of the driving voltage
Translational displacement, to drive the sensitive chip mobile.
17. camera module according to claim 13, wherein the movable part generates under the action of the driving voltage
Translational displacement, to drive the sensitive chip mobile.
18. according to any camera module of claim 3 to 6, wherein the hard circuit board and the sensitive chip it
Between routing be bonded when further sealed by glue.
19. an optical anti-vibration element, is suitable for the application of in camera module, optical anti-vibration is carried out, which is characterized in that the optics is anti-
Element is trembled with preset electric conductivity and includes:
An at least movable part is connected to a sensitive chip of the camera module；
An at least fixed part；And
Multiple connectors, wherein the movable part and the fixed part are arranged apart from one another by ground and multiple connectors extend
Between the movable part and the fixed part and for allowing the movable part to move under the action of the driving voltage of variation
To drive the sensitive chip mobile, wherein the fixed part includes one first fixed part and one second fixed part, described the
One fixed part and second fixed part be located at the inner side and outer side of the movable part and with the movable part apart from one another by
Ground arrangement, and be connected by the connector with the movable part.
20. optical anti-vibration element according to claim 19, wherein the optical anti-vibration element is installed on the camera shooting mould
In the groove that the hard circuit board that group includes has, and the top side of the movable part is adhered to the bottom of the sensitive chip
Side.
21. optical anti-vibration element according to claim 19, wherein the optical anti-vibration element is installed on the camera shooting mould
The surface for the hard circuit board that group includes, and the top side of the movable part is adhered to the bottom side of the sensitive chip.
22. 9 to 21 any optical anti-vibration element according to claim 1, wherein there is the connector default flexibility to exist
There is provided connection and when supporting role enables the movable part to move, and the movable part is set to described the in vacant state
One and second between fixed part.
23. 9 to 21 any optical anti-vibration element according to claim 1, wherein the movable part and described second is fixed
Portion is annular in shape.
24. optical anti-vibration element according to claim 23, wherein the camera module further include be electrically connected to it is described hard
Property circuit board a flexible circuit board, wherein first fixed part is fixed on the flexible circuit board top side, described second is solid
Determine portion and is electrically connected at hard circuit board to receive the driving voltage from the hard circuit board.
25. optical anti-vibration element according to claim 24, wherein first and second fixed part bottom side is adhered to institute
State flexible circuit board.
26. 9 to 21 any optical anti-vibration element according to claim 1, wherein the movable part and described first and the
Two fixed parts are made of semiconductor material, and the connector, which uses, to be had predetermined flexible and electric conductivity and be capable of providing support
It is made with the material of connection function, to allow the movement of the movable part.
27. optical anti-vibration element according to claim 26, wherein the movable part is under the action of the driving voltage
It can be moved in translation to drive the sensitive chip mobile.
28. an optical anti-vibration method, the optical anti-vibration applied to a camera module, which is characterized in that the method includes following
Step:
(A) in camera module shooting process, a conductive optical anti-vibration element is received to be inputted from hard circuit board
Variation driving voltage；
(B) movable part of the optical anti-vibration element is moved according to the variation of voltage；And
(C) sensitive chip that the movable part drives the camera module to include is moved, and realizes optical anti-vibration；One second
Fixed part receives the driving voltage from the hard circuit board and passes to the movable part in vacant state, institute
It states and translates under the action of the driving voltage of movable part, to drive the sensitive chip mobile；The movable part is hanging
State it is arranged between second fixed part and one first fixed part and mutual with first and second fixed part respectively
It arranges at intervals, multiple connectors extend between the movable part and first and second fixed part and conduct the drive
Dynamic voltage.
29. according to the method for claim 28, further comprising the steps of: the bottom that the movable part is adhered to the sensitive chip
Side, and a flexible circuit board is fixed in first and second fixed part bottom side, wherein the flexible circuit board is electrically connected
In the hard circuit board.
30. the method according to claim 28 or 29 further comprises the steps of: the optical anti-vibration element being installed on described take the photograph
As the hard circuit board of mould group a groove in, and make the position of the movable part in the bottom side of the sensitive chip.
31. the method according to claim 28 or 29 further comprises the steps of: the optical anti-vibration element being installed on described take the photograph
As the surface of the hard circuit board of mould group, and make the position of the movable part in the bottom side of the sensitive chip.
32. the method according to claim 28 or 29, wherein the movable part and second fixed part are annular in shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510816961.4A CN106791289B (en) | 2015-11-20 | 2015-11-20 | Camera module and its optical anti-vibration element and anti-fluttering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510816961.4A CN106791289B (en) | 2015-11-20 | 2015-11-20 | Camera module and its optical anti-vibration element and anti-fluttering method |
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| Publication Number | Publication Date |
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| CN106791289A CN106791289A (en) | 2017-05-31 |
| CN106791289B true CN106791289B (en) | 2019-10-18 |
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| CN110784625B (en) * | 2018-07-25 | 2022-04-15 | 台湾东电化股份有限公司 | Driving mechanism of photosensitive assembly |
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| CN112312000B (en) * | 2019-07-30 | 2023-01-06 | 格科微电子（上海）有限公司 | Optical anti-shake realization method |
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| CN112995450A (en) * | 2019-12-16 | 2021-06-18 | 中芯集成电路（宁波）有限公司 | Imaging module and manufacturing method thereof |
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