CN111182193B - Camera module and electronic device - Google Patents
Camera module and electronic device Download PDFInfo
- Publication number
- CN111182193B CN111182193B CN202010168686.0A CN202010168686A CN111182193B CN 111182193 B CN111182193 B CN 111182193B CN 202010168686 A CN202010168686 A CN 202010168686A CN 111182193 B CN111182193 B CN 111182193B
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- Prior art keywords
- lens
- camera module
- chip
- photosensitive chip
- sensitization
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/58—Means for changing the camera field of view without moving the camera body, e.g. nutating or panning of optics or image sensors
Abstract
The invention discloses a camera module and an electronic device, wherein the camera module comprises: a housing; the lens is arranged on the shell; the photosensitive chip is arranged on the shell; and the driving structure is arranged on the shell and connected with the photosensitive chip so as to drive the photosensitive chip to be close to or far away from the lens to move. The camera module provided by the technical scheme of the invention has the advantages of small size, light weight and strong product competitiveness.
Description
Technical Field
The present invention relates to the field of electronic devices, and in particular, to a camera module and an electronic device having the same.
Background
In an electronic device (such as a mobile phone, a tablet computer, etc.) with a photographing or shooting function, when a camera is adjusted to focus, an image distance needs to be changed synchronously due to the change of an object distance, so that the focusing purpose is achieved. Among the correlation technique, be equipped with the motor in the camera to promote the camera lens through the motor and remove adjustment focus, however, along with making a video recording the pixel requirement is higher and higher, the camera lens also can be bigger and bigger, and the motor size is also bigger, leads to size, the weight of whole camera module to all can increase, influences the competitiveness of product.
The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.
Disclosure of Invention
The invention provides a camera module with small size and light weight, which is used for improving the competitiveness of products.
In order to achieve the above object, the present invention provides a camera module, including:
a housing;
the lens is arranged on the shell;
the photosensitive chip is arranged on the shell; and
the drive structure is arranged on the shell and connected with the photosensitive chip to drive the photosensitive chip to be close to or far away from the lens to move.
The invention also provides an electronic device, which comprises a camera module;
the camera module includes:
a housing;
the lens is arranged on the shell;
the photosensitive chip is arranged on the shell; and
the drive structure is arranged on the shell and connected with the photosensitive chip to drive the photosensitive chip to be close to or far away from the lens to move.
In the camera module of this application technical scheme, through setting up the drive structure at the casing, make drive structure and sensitization chip be connected to order about the sensitization chip through the drive structure and be close to or keep away from the camera lens motion, and then make the distance change between sensitization chip and the camera lens, the image distance changes promptly, realizes focusing. The design of above-mentioned structure has cancelled the motor that drives the camera lens motion among the relevant scheme, consequently makes size, the weight of whole camera module all diminish, the effectual market competition who improves the product.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is an exploded view of a camera module according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a camera module according to an embodiment of the present invention, with a photo sensor chip in a retracted state;
FIG. 3 is a cross-sectional view of the sensor chip of FIG. 2 in an extended state;
FIG. 4 is a cross-sectional view of a camera module according to another embodiment of the present invention, showing a contracted state of a photo sensor chip;
fig. 5 is a sectional view of the sensing chip of fig. 4 in an extended state.
The reference numbers illustrate:
reference numerals | Name (R) | Reference numerals | Name (R) |
100 | |
110 | |
120 | |
200 | |
300 | |
400 | |
410 | |
420 | |
500 | |
1000 | Camera module |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
In an electronic device with an image capturing function, in the process of capturing an image of a subject by using the camera module 1000 and focusing, the principle of focusing is based on the lens imaging formula 1/u + 1/v-1/f, where u is an object distance, v is an image distance, and f is a focal length. For some electronic devices, such as mobile phones, tablet computers, etc., the focal length f of the lens 200 is fixed, so during the focusing process, the object distance u changes, and the image distance v needs to be changed synchronously, that is, the lens 200 or the photosensitive chip 300 is moved. Therefore, when the object is in a long-distance view and a short-distance view respectively, the corresponding imaging positions are different, and the distance between the lens 200 and the photosensitive chip 300 can always obtain a clear imaging effect by changing the distance between the lens 200 and the photosensitive chip, so that the object can be automatically focused.
Referring to fig. 1 to 5 in combination, in the embodiment of the present application, the camera module 1000 includes a housing 100, a lens 200, a photosensitive chip 300 and a driving structure 400, wherein the lens 200 is disposed in the housing 100; the photosensitive chip 300 is disposed on the housing 100; the driving structure 400 is disposed on the housing 100 and connected to the photosensitive chip 300 to drive the photosensitive chip 300 to move toward or away from the lens 200.
In this application, a containing cavity (not shown) may be disposed in the housing 100, and a through outlet 110 communicating with the containing cavity may be disposed on the housing 100, the lens 200 may be mounted on the housing 100 and disposed opposite to the through outlet 110, or a part of the lens 200 is located in the containing cavity, and another part of the lens extends out of the containing cavity through the through outlet 110. The photosensitive chip 300 and the driving structure 400 can be disposed in the accommodating cavity, for example, the photosensitive chip 300 and the driving structure 400 are fixed in the accommodating cavity by dispensing, so that when the driving structure 400 drives the photosensitive chip 300 to move, the photosensitive chip can approach or move away from the lens 200.
The driving structure 400 is connected to the photosensitive chip 300 and is used for directly driving the photosensitive chip 300 to move. Specifically, the driving structure 400 may be a small motor for driving the photosensitive chip 300 to move, and the motor can drive the photosensitive chip 300 to reciprocate when being powered on, so as to change the distance between the photosensitive chip 300 and the lens 200 to realize focusing.
Therefore, in the camera module 1000 according to the present application, the driving structure 400 is disposed on the housing 100, so that the driving structure 400 is connected to the photosensitive chip 300, and the driving structure 400 drives the photosensitive chip 300 to move close to or away from the lens 200, so that the distance between the photosensitive chip 300 and the lens 200 is changed, that is, the image distance is changed, and the focusing is achieved. Due to the design of the structure, a motor for driving the lens 200 to move in the related scheme is omitted, so that the size and the weight of the whole camera module 1000 are reduced, and the market competitiveness of the product is effectively improved.
In some embodiments of the present application, the driving structure 400 includes an expansion member 410 and a power member 420 disposed on the housing 100, the expansion member 410 is connected to the photosensitive chip 300, and the power member 420 is electrically connected to the expansion member 410 to drive the photosensitive chip 300 to move through the expansion member 410.
In the above embodiment, the expansion element 410 and the power element 420 may be mounted on the housing 100 by dispensing, the expansion element 410 may be made of an electrostrictive material, and the power element 420 is a pcb (printed Circuit board) disposed on the housing 100. Meanwhile, the photosensitive chip 300 is also electrically connected to the power component 420, so as to provide power for the photosensitive chip 300 through the power component 420. Electrostrictive materials, some polycrystalline materials such as lead zirconate titanate ceramics and the like, have spontaneously formed molecular clusters, i.e., domains, which have a certain polarization and tend to have a length in the direction of polarization different from that in other directions. When an external electric field acts, the electric domain rotates, so that the polarization direction of the electric domain is rotated to be consistent with the direction of the external electric field as much as possible, and the length of the electrostrictive material along the direction of the external electric field changes. Therefore, after the telescopic member 410 is powered on, the telescopic member itself generates telescopic motion, so as to drive the photosensitive chip 300 to move to be close to or far from the lens 200, that is, the image distance is changed, and automatic focusing is realized. The design of this structure directly drives sensitization chip 300 through extensible member 410 and moves, therefore need not the motor and drive the action of camera lens 200, the effectual size and the weight that has reduced camera module 1000 improve the market competition of product. Simultaneously, the design of motor is cancelled, can effectively avoid appearing the risk of striking dust because the motor motion became invalid for the effect of camera module 1000 formation of image is better.
Referring to fig. 2 and fig. 3 in combination, in an embodiment of the present application, the telescopic element 410 is a plate-shaped structure, the power element 420 is located on a side of the photosensitive chip 300 away from the lens 200 and electrically connected to the plate-shaped structure, and the plate-shaped structure is located between the photosensitive chip 300 and the power element 420 and abuts against the photosensitive chip 300. In this embodiment, the plate-shaped structure is adapted to the shape of the photosensitive chip 300, and the size of the plate-shaped structure can be adaptively designed according to the size of the photosensitive chip 300. The plate-shaped telescopic member 410 and the power supply member 420 can be directly abutted to each other to achieve electrical conduction connection, and the photosensitive chip 300 and the power supply member 420 can be electrically connected through a connecting wire (such as a gold wire), so that the photosensitive chip 300 and the power supply member 420 are flexibly connected, and the photosensitive chip 300 cannot be disconnected in the movement process. Photosensitive chip 300, extensible member 410 and power piece 420 from top to bottom and set gradually, and from this, extensible member 410 drives photosensitive chip 300 up-and-down motion and focuses for casing 100 inner space is compacter, is favorable to the small and exquisite, the light design of camera module 1000.
Further, in an embodiment of the present application, the plate-shaped structure is disposed opposite to the photosensitive chip 300. Wherein the plate-shaped structure abuts against the photosensitive chip 300. So set up for platelike structure's extensible member 410 has great area of contact with sensitization chip 300, thereby can steadily promote sensitization chip 300 motion, and then more reliable at the in-process of focusing, and sensitization chip 300 imaging effect is better.
Referring to fig. 1, 4 and 5, in another embodiment of the camera module 1000 of the present application, the telescopic member 410 is a cylindrical structure, and the cylindrical structure abuts against one surface of the photosensitive chip 300 and is electrically connected to the power member 420.
In the above embodiment, the expansion member 410 may be a cylindrical structure, an elliptic cylindrical structure, or a square cylindrical structure, and the length and other dimensions of the cylindrical structure may be adaptively designed according to actual situations, the cylindrical structure may abut against a surface of the photo sensor chip 300 away from the lens, and the cylindrical structure may be in abutting contact with the power source 420 to achieve electrical conduction. In practical application, when the expansion member 410 is powered on, the expansion member 410 contracts or extends along the length direction thereof, so as to push the abutting photosensitive chip 300 to move to change the image distance for focusing. Set up to the columnar structure through extensible member 410, can make the columnar structure butt drive sensitization chip 300 in, can save the preparation material cost of extensible member 410 to effectual saving manufacturing cost, and the reliability that promotes sensitization chip 300 motion is strong.
Further, referring to fig. 1, in an embodiment, the number of the pillar structures is multiple, and the multiple pillar structures are disposed on the surface of the power component 420 at intervals. In this embodiment, the plurality of pillar structures may be uniformly spaced on the surface of the power device 420, and the plurality of pillar structures may be arranged to form a rectangle or the like, so as to be adapted to the shape of the photo sensor chip 300. So set up, can increase the area of contact of sensitization chip 300 and columnar structure, sensitization chip 300 atress is even moreover to can steadily promote sensitization chip 300 motion through a plurality of columnar structure, and then more reliable at the in-process of focusing, sensitization chip 300 imaging effect is better.
In the above embodiment, the material of the expansion member 410 is an electroactive polymer or a piezoelectric ceramic. Among them, the electroactive Polymer (DEAP) is also a Dielectric Elastomer (DE), which is an intelligent material, and has a large strain capacity, a light weight, a high driving efficiency, and a good anti-seismic performance. Piezoelectric ceramics are a class of electronic ceramic materials with piezoelectric properties, and the main differences from typical piezoelectric quartz crystals containing no ferroelectric component are: the crystal phases constituting the main components thereof are all grains having ferroelectricity, and since the ceramics are polycrystalline aggregates in which the grains are randomly oriented, the spontaneous polarization vectors of the respective ferroelectric grains therein are also disoriented. In order to make the piezoelectric ceramic exhibit macroscopic piezoelectric properties, the piezoelectric ceramic must be subjected to polarization treatment under a strong direct current electric field after being fired and being subjected to counterelectrode on the end face, so that the respective polarization vectors of the original disordered orientations are preferentially oriented along the direction of the electric field, and the piezoelectric ceramic after polarization treatment retains certain macroscopic residual polarization intensity after the electric field is cancelled, so that the ceramic has certain piezoelectric properties. In addition, the piezoelectric ceramic has a property of spontaneous polarization, and the spontaneous polarization can be transformed under the action of an external electric field. Therefore, when an external electric field is applied to a dielectric having piezoelectricity, the piezoelectric ceramic is deformed. However, the piezoelectric ceramic is deformed because the polarization intensity is enhanced when the same external electric field as the spontaneous polarization is applied. The increase in the polarization causes the piezoelectric ceramic sheet to elongate in the polarization direction. Conversely, if a reverse electric field is applied, the ceramic sheet shortens in the direction of polarization. This phenomenon, which is converted into a mechanical effect due to an electrical effect, is an inverse piezoelectric effect. On the other hand, the piezoelectric ceramic also has a sensitive characteristic, and deforms after being electrified, so that the photosensitive chip 300 can accurately perform actions.
Referring to fig. 1, in an embodiment of the camera module 1000 of the present application, the camera module 1000 further includes a filter 500, the photosensitive chip 300 is located below the lens 200, and the filter 500 is located between the photosensitive chip 300 and the lens 200. The optical filter 500 has the functions of blue glass and a coating film, so that when light enters the lens 200 of the camera module 1000 and is refracted by the lens 200, visible light and infrared light can be imaged on different target surfaces, the visible light is imaged as a color image, and the infrared light is imaged as a black-and-white image. Therefore, infrared light can be filtered by using a film coating method or blue glass, and the real color of an object is reduced, so that the problem of image color distortion is solved. In addition, the light filter 500 can also increase the light transmittance, so that the camera module 1000 can image more clearly.
In an embodiment of the present invention, the housing 100 is recessed with a mounting step 120 at the periphery of the through opening 110, and the filter 500 is mounted in the mounting step 120. It can be understood that, by providing the mounting step 120, the optical filter 500 can be accommodated in the mounting step 120 without protruding the surface of the housing 100 to interfere with the mounting of the lens 200. Meanwhile, the filter 500 can be stably fixed in the installation step 120, thereby ensuring the stability of installation.
In an embodiment of the present application, centers of the lens 200, the filter 500 and the photo sensor 300 are located on a same line. For example, the lens 200, the filter 500 and the photosensitive chip 300 can be sequentially disposed from top to bottom, such that the light penetrating into the lens 200 can completely penetrate through the filter 500 to form an image on the photosensitive chip 300, thereby making the image of the photosensitive chip 300 more clear.
The present application further provides an electronic device, which includes the camera module 1000, and the specific structure of the camera module 1000 refers to the above embodiments, and since the electronic device adopts all technical solutions of all the above embodiments, the electronic device at least has all beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein. The electronic device may be a single-camera electronic device, a dual-camera electronic device, or a multi-camera electronic device. The mobile phone with the shooting function, the tablet computer or the electronic game terminal can be used.
The above description is only an alternative embodiment of the present application, and not intended to limit the scope of the present application, and all modifications and equivalents of the technical solutions that can be directly or indirectly applied to other related fields without departing from the spirit of the present application are intended to be included in the scope of the present application.
Claims (5)
1. The utility model provides a camera module which characterized in that includes:
a housing;
the lens is arranged on the shell;
the photosensitive chip is arranged on the shell; and
drive structure, drive structure is including locating the extensible member and the power spare of casing, the extensible member is platelike structure, platelike structure is located sensitization chip with between the power spare, and with sensitization chip looks butt, platelike structure is just right sensitization chip sets up, and the shape with sensitization chip's shape looks adaptation, the extensible member is made for electrostrictive material, the power spare is located sensitization chip deviates from one side of camera lens, and with platelike structure electric connection, in order to order about sensitization chip is close to or keeps away from the camera lens motion.
2. The camera module of claim 1, wherein the material of the expansion member is an electroactive polymer or a piezoelectric ceramic.
3. The camera module according to claim 1 or 2, further comprising an optical filter, wherein the photosensitive chip is located below the lens, and the optical filter is located between the photosensitive chip and the lens.
4. The camera module according to claim 3, wherein centers of the lens, the filter and the photo sensor chip are located on a same straight line.
5. An electronic device, characterized by comprising the camera module according to any one of claims 1 to 4.
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CN202010168686.0A CN111182193B (en) | 2020-03-11 | 2020-03-11 | Camera module and electronic device |
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CN202010168686.0A CN111182193B (en) | 2020-03-11 | 2020-03-11 | Camera module and electronic device |
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CN111182193B true CN111182193B (en) | 2022-02-01 |
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Families Citing this family (5)
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CN114629975A (en) * | 2020-12-11 | 2022-06-14 | 宁波舜宇光电信息有限公司 | Camera module and preparation method thereof |
WO2022135205A1 (en) * | 2020-12-22 | 2022-06-30 | 宁波舜宇光电信息有限公司 | Telescopic camera module and electronic device |
CN112822376B (en) * | 2021-01-27 | 2023-02-28 | 维沃移动通信有限公司 | Camera module and electronic equipment |
CN113194232B (en) * | 2021-04-22 | 2022-05-20 | 维沃移动通信有限公司 | Camera, electronic equipment and control method and control device thereof |
CN113242376B (en) * | 2021-06-18 | 2023-04-14 | 维沃移动通信有限公司 | Camera module and electronic equipment |
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CN109819152A (en) * | 2019-02-27 | 2019-05-28 | 维沃移动通信有限公司 | Focusing camera mould group and terminal device |
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CN106791289B (en) * | 2015-11-20 | 2019-10-18 | 宁波舜宇光电信息有限公司 | Camera module and its optical anti-vibration element and anti-fluttering method |
CN209881887U (en) * | 2019-03-15 | 2019-12-31 | 宁波舜宇光电信息有限公司 | Camera device and SMA driver thereof |
CN208940074U (en) * | 2018-10-30 | 2019-06-04 | 维沃移动通信(杭州)有限公司 | Camera module and electronic equipment |
CN109348104B (en) * | 2018-10-30 | 2021-01-08 | 维沃移动通信(杭州)有限公司 | Camera module, electronic equipment and shooting method |
CN110650281A (en) * | 2019-10-30 | 2020-01-03 | 维沃移动通信(杭州)有限公司 | Camera module and electronic equipment |
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CN109819152A (en) * | 2019-02-27 | 2019-05-28 | 维沃移动通信有限公司 | Focusing camera mould group and terminal device |
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