WO2020103688A1

WO2020103688A1 - Imaging apparatus and terminal device

Info

Publication number: WO2020103688A1
Application number: PCT/CN2019/115852
Authority: WO
Inventors: 王伟; 郭利德
Original assignee: 华为技术有限公司
Priority date: 2018-11-23
Filing date: 2019-11-06
Publication date: 2020-05-28

Abstract

The embodiment of the present application provides an imaging apparatus and terminal device. The imaging apparatus comprises: an image sensor and an image stabilization module; wherein the image sensor includes a photosensitive region and the image stabilization module includes a base, a carrier, a flexible connector and a set of actuators. The base comprises a recessed cavity. A depth of the recessed cavity is greater than or equal to a thickness of the image sensor. The carrier and the image sensor are disposed within the recessed cavity. The base provides support to the carrier through the flexible connector. The carrier comprises a through hole. A dimension of the through hole is greater than or equal to the photosensitive region. The carrier is separately electrically connected to the image sensor and the base. A bottom face of the carrier is fixedly connected with a front face of the image sensor. Each actuator of the set of actuators comprises a fixed end and a movable end. The fixed end of each actuator of the set of actuators is connected with the base. The movable end of each actuator of the set of actuators drives the carrier to move by moving in a direction approaching or receding from the base, and also drives the image sensor to move.

Description

Imaging device and terminal equipment

Cross-reference of related applications

This application requires the priority of the Chinese patent application submitted to the State Intellectual Property Office of China on November 23, 2018, with the application number 201811415352.8 and the application name of "an imaging device and terminal equipment", and is required to be filed on December 1, 2018. The priority of the Chinese patent application filed by the State Intellectual Property Office of China with the application number 201811460672.5 and the application name as "an imaging device and terminal equipment" is incorporated in this application by reference.

Technical field

The present application relates to the technical field of photographing, in particular to an imaging device and terminal equipment.

Background technique

The mobile phone camera module can obtain a clear image on the image sensor when the camera body is stable. However, during the photographing process, the camera body is shaken due to hand shaking, which causes the image of the object to be photographed to be shifted in the image sensor, which results in the blurred image.

Optical image stabilization (OIS) technology can suppress the image blur caused by hand shake by using optical methods such as moving lens groups or moving image sensors, so as to improve the picture quality of mobile phone camera modules. In the prior art, an optical image stabilizer is proposed, which includes a fixed base and a movable stage. The movable stage can be pushed by an actuator, which in turn drives the image sensor on the movable stage to produce displacement.

However, in this technical solution, the image sensor is directly stacked on the optical image stabilizer. When the lens group in the camera module is unchanged, the height of the imaging surface of the image sensor is raised, that is, the distance between the lens group and the imaging surface In order to keep closer, in order to maintain the original imaging effect, the distance between the lens group and the imaging surface needs to be extended, which will additionally increase the overall height of the camera module.

Summary of the invention

The embodiments of the present application provide an imaging device and a terminal device. The image sensor can move in its plane to achieve anti-shake compensation, and the height of the imaging surface of the image sensor is not raised, so that the imaging device has an anti-shake function. It can be made thinner on the basis.

In a first aspect, an embodiment of the present application provides an imaging device. The imaging device includes: an image sensor and an anti-shake module, wherein the image sensor includes a photosensitive region, and the photosensitive region is disposed on the front of the image sensor, and the anti-shake module includes a base, a stage, a flexible connector, and an actuator set;

The substrate includes a concave cavity, the depth of the concave cavity is greater than or equal to the thickness of the image sensor, the carrier is disposed in the cavity, the substrate provides support for the carrier through a flexible connector, and the number of flexible connectors is greater than or equal to 1;

The stage includes a through hole, the size of the through hole is greater than or equal to the photosensitive area, the stage is electrically connected to the image sensor and the substrate, the bottom surface of the stage is fixedly connected to the front surface of the image sensor, and the image sensor is disposed in the cavity;

The actuator set includes at least a first actuator, a second actuator, a third actuator, and a fourth actuator. The first actuator and the second actuator are arranged along the first coordinate axis. The third actuator and the fourth actuator are arranged along the second coordinate axis, the first coordinate axis and the second coordinate axis are in the same plane, and the angle between the first coordinate axis and the second coordinate axis is 90 degrees , Each actuator in the actuator set includes a fixed end and a movable end;

The fixed end of each actuator in the actuator set is connected to the base, and the movable end of each actuator in the actuator set moves the stage by moving toward or away from the base, and Drive the image sensor to move.

In this embodiment, the image sensor can move in its plane to achieve anti-shake compensation, and because the image sensor and the stage are disposed in the cavity of the substrate, where the depth of the cavity is greater than or equal to the thickness of the image sensor, so The height of the imaging surface of the image sensor will not be raised, so that the imaging device can be made thinner based on the anti-shake function.

Optionally, in some possible implementations, the image sensor further includes a pad, the pad is disposed on the front of the image sensor, and the number of pads is greater than or equal to 1; the stage further includes a first front pad, the first front The pads are arranged on the front of the stage, the first front pads are electrically connected to the pads, and the number of the first front pads is greater than or equal to 1. In this embodiment, an implementation method for achieving electrical connection between the image sensor and the carrier is provided, which can lead the signal of the image sensor to the carrier, which improves the achievability of the solution.

Optionally, in some possible implementations, the stage further includes a first conductive through hole and a first bottom surface pad, the first bottom surface pad is disposed on the bottom surface of the stage, and the first conductive through hole is used to connect the first The front pad and the first bottom pad, the first bottom pad and the pad are welded together, and the number of the first conductive vias and the first bottom pad are greater than or equal to 1. In this embodiment, an implementation method of electrical connection between the pad on the front of the stage and the pad of the image sensor is provided, and no wire bonding operation is required between the stage and the image sensor, thereby avoiding wire bonding The impact of the process on each device reduces the possibility of damage to each device.

Optionally, in some possible implementations, the first front pad is electrically connected to the pad by wire bonding, and the bottom surface of the stage is bonded to the front surface of the image sensor. In this embodiment, another implementation manner of electrical connection between the pad on the front surface of the stage and the pad of the image sensor is provided, which improves the flexibility of the solution.

Optionally, in some possible implementations, the substrate further includes a second front pad, the second front pad is disposed on the front of the substrate, and the first front pad is electrically connected to the second front pad through a flexible connector, The number of second front pads is greater than or equal to 1. In this embodiment, a method for achieving electrical connection between the stage and the substrate is provided, and the signal of the image sensor can be led out to the substrate through the stage, which further improves the achievability of the solution.

Optionally, in some possible implementations, the imaging device further includes a printed circuit board PCB, the PCB is fixedly connected to the bottom surface of the substrate, the substrate further includes a second conductive via and a second bottom surface pad, and the second bottom surface pad is provided On the bottom surface of the substrate, the second conductive vias are used to connect the second front surface pads and the second bottom surface pads, the second bottom surface pads are soldered together with the PCB, the number of the second conductive vias and the second bottom surface pads are both Greater than or equal to 1. In this embodiment, an implementation method of electrical connection between the pad on the front surface of the substrate and the PCB is provided, and the signal of the image sensor can be further led out to the PCB without wire bonding between the substrate and the PCB. Therefore, the impact of the wire bonding process on each device is avoided, and the possibility of damage to each device is reduced.

Optionally, in some possible implementations, the imaging device further includes a PCB, the PCB is fixedly connected to the bottom surface of the substrate, and the second front pad is electrically connected to the PCB through wire bonding. In this embodiment, another implementation method of electrical connection between the pad on the front surface of the substrate and the PCB is provided, which increases the flexibility of the solution.

Optionally, in some possible implementations, the imaging device further includes a set of cantilever beams, the set of cantilever beams includes at least a first cantilever beam, a second cantilever beam, a third cantilever beam, and a fourth cantilever beam, the first cantilever beam and The second cantilever beam is arranged along the first coordinate axis, the third cantilever beam and the fourth cantilever beam are arranged along the second coordinate axis, the movable end of the first actuator is connected to the stage through the first cantilever beam, the second The movable end of the actuator is connected to the stage through the second cantilever beam, the movable end of the third actuator is connected to the stage through the third cantilever beam, and the movable end of the fourth actuator is through the fourth cantilever beam Connect to the stage. In this embodiment, an implementation manner in which the actuator drives the stage and the image sensor through the cantilever beam is provided, which improves the achievability of the solution.

Optionally, in some possible embodiments, one end of the flexible connector is connected to the substrate, and the other end of the flexible connector is connected to the stage. Or one end of the flexible connector is connected to the base, and the other end of the flexible connector is connected to at least one cantilever beam in the cantilever beam set. Or, one end of the flexible connector is connected to the substrate, and the other end of the flexible connector is connected to the movable end of at least one actuator in the actuator set. In this embodiment, a variety of specific connection methods of flexible connectors are provided to increase the flexibility of this solution.

Optionally, in some possible implementations, the fixed end and the movable end of each actuator in the actuator set are electrostatic comb-shaped structures. In this embodiment, a specific structure of an actuator is provided, which improves the achievability of this solution.

Optionally, in some possible implementations, the first actuator and the second actuator move in the same direction, and drive the stage and the image sensor to move along the first coordinate axis. In this embodiment, the image sensor can move along the first coordinate axis, and the anti-shake function in the direction of the first coordinate axis can be realized.

Optionally, in some possible implementation manners, the third actuator and the fourth actuator move in the same direction, and drive the stage and the image sensor to move along the second coordinate axis. In this embodiment, the image sensor can move along the second coordinate axis, and the anti-shake function in the direction of the second coordinate axis can be realized.

Optionally, in some possible embodiments, the first actuator and the second actuator move in opposite directions and / or the third actuator and the fourth actuator move in opposite directions, and drive The stage and the image sensor respectively rotate in the corresponding plane. In this embodiment, the image sensor can also rotate in the plane where it is located, which can realize the anti-shake function in the direction of the Roll axis.

In a second aspect, an embodiment of the present application provides a terminal device, the terminal device includes: a processor, a controller, a memory, a bus, and an imaging device, where the processor, controller, memory, and imaging device communicate with each other through a bus Connection, where the memory is used to store programs and instructions, the processor is used to call the programs and instructions stored in the memory, and the processor is also used to control the imaging device through the controller;

The imaging device includes: an image sensor and an anti-shake module, wherein the image sensor includes a photosensitive area, and the photosensitive area is disposed on the front of the image sensor, and the anti-shake module includes a base, a stage, a flexible connector, and an actuator set;

BRIEF DESCRIPTION

Figure 1 is a schematic diagram of the camera shaking on the Roll axis;

2 is a schematic structural diagram of an anti-shake camera in the prior art solution;

3 is a schematic diagram of an imaging beam passing through an imaging mirror group and imaging on an image sensor;

4 is a schematic cross-sectional structural diagram of an imaging device in an embodiment of the present application;

5 is a schematic diagram of a front stereo structure of an imaging device in an embodiment of the present application;

6 (a) is a schematic diagram of the image sensor moving along the first coordinate axis;

6 (b) is a schematic diagram of the image sensor moving along the second coordinate axis;

6 (c) is a schematic diagram of the image sensor rotating in its plane;

7 is a schematic diagram of a stereo structure of an image sensor;

8 is a schematic diagram of an electrical connection between a carrier and an image sensor;

9 is a schematic diagram of another electrical connection between the carrier and the image sensor;

10 is a schematic diagram of an electrical connection between a substrate and a PCB;

11 is a schematic diagram of another substrate and PCB to achieve electrical connection;

12 is a schematic structural diagram of a terminal device of the present application.

detailed description

The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of this application and the above drawings are used to distinguish similar objects without using To describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments described herein can be implemented in an order other than what is illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, processes, methods, systems, products or devices that contain a series of steps or units need not be limited to those clearly listed Those steps or units, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or equipment.

The embodiments of the present application may be applied to a camera including an imaging device, where the camera may be integrated on a terminal device, and the terminal device may specifically be a mobile phone, a tablet computer, a wearable device, augmented reality (augmented reality (AR) \ virtual reality ( Virtual reality (VR) equipment, notebook computers, ultra-mobile personal computers (UMPCs), netbooks, personal digital assistants (PDAs), and other user equipments with shooting functions. No restrictions.

The camera can get a clear image on the image sensor when the camera body is stable. However, during the photographing process, the camera body is shaken due to hand shaking, which causes the image of the object to be photographed to be shifted in the image sensor, which results in the blurred image. Optical image stabilization (OIS) technology can suppress the image blur caused by hand shake by using optical methods such as moving lens groups or moving image sensors, so as to improve the picture quality of mobile phone camera modules. The OIS of the moving lens group is implemented by driving devices such as actuators or motors to move the lens group in the opposite direction of the body shake to achieve anti-shake. The OIS of the image sensor is implemented by driving devices such as actuators or motors to move the image sensor in the opposite direction of the shaking of the body to achieve anti-shake.

In order to enable the camera to achieve X, Y, Pitch, Yaw and Roll five-axis hand shake compensation, it is not enough to use the OIS technology of the moving lens group. Please refer to FIG. 1, which shows that the camera shakes on the Roll axis It can be seen that if you want to compensate the anti-shake on the Roll axis, the rotation of the lens group will not work, and the anti-shake on the Roll axis can only be achieved by the rotation of the image sensor. For this reason, OIS technology that uses an image sensor on a camera is essential.

In order to realize the OIS technology of the image sensor, please refer to FIG. 2, which is a schematic structural diagram of an anti-shake camera in the prior art solution. The structure of the camera usually includes a lens group, a base, an actuator, a movable stage, and a The image sensor on the stage and the movable stage can be pushed by the actuator, which in turn drives the image sensor on the movable stage to produce displacement. However, in this scheme, the stage and the image sensor are stacked on the substrate, so that the height of the imaging surface of the image sensor is raised when the distance between the substrate and the lens group is constant, that is, the lens group and the imaging surface The distance between them has been shortened. In order to maintain the original imaging effect, the distance between the lens group and the imaging surface needs to be extended, which will additionally increase the overall height of the camera module. Based on the current available user equipment The trend towards a lighter and thinner direction is difficult to accept.

For this reason, the present application provides an imaging device, so that the imaging device can be made thinner on the basis of having an anti-shake function.

Please refer to FIG. 3, which is a schematic diagram of an imaging beam passing through an imaging lens group and imaging on an image sensor. FIG. 3 is illustrated by taking the mobile phone camera module as an example. It should be noted that the imaging device in the embodiment of the present application may be the complete mobile phone camera module shown in FIG. 3, which includes the An imaging mirror group and an imaging device. The imaging device further includes an image sensor. In addition, since the present application is mainly based on the improvement of the image sensor OIS technology, the imaging device in the embodiments of the present application may not include the imaging mirror group. limited.

The specific structure of the imaging device in the embodiment of the present application will be described below with reference to the drawings:

Please refer to FIG. 4. FIG. 4 is a schematic cross-sectional structural diagram of an imaging device in an embodiment of the present application. The imaging device 400 includes an image sensor 401 and an anti-shake module 402. A photosensitive area 4011 is provided on the front of the image sensor 401, and the anti-shake module 402 includes The base 403, the stage 404, the flexible connector 405, and the actuator set 406.

Wherein, the substrate includes a cavity, and the stage and the image sensor are both arranged in the cavity. In order to avoid the image sensor imaging surface from being lifted, the depth of the cavity is greater than or equal to the thickness of the image sensor, because the stage is suspended In the cavity, the base provides support for the stage through at least one flexible connecting member. It should be noted that in the embodiment of the present application, the actuator will push or pull the carrier and drive the image sensor to move. Therefore, a flexible connector is required to provide support to the carrier, that is, the connection part is allowed to axially expand, contract, and The connection method with a certain displacement in the vertical axis.

The bottom surface of the stage is fixedly connected to the front surface of the image sensor, so that the movement of the carrier can drive the image sensor to move, and the stage is also electrically connected to the image sensor and the substrate respectively, so that the signal of the image sensor can be led out to the substrate; in addition, the stage Including through holes, the size of the through holes is greater than or equal to the photosensitive area of the image sensor, that is, the stage will not block the photosensitive area from receiving the imaging beam.

The actuator set in the imaging device is described below:

Please refer to FIG. 5. FIG. 5 is a schematic front view of the imaging device according to an embodiment of the present application. The actuator set includes at least a first actuator 4061, a second actuator 4062, a third actuator 4063, and The fourth actuator 4064, the first actuator and the second actuator are arranged along the first coordinate axis, the third actuator and the fourth actuator are arranged along the second coordinate axis, the first coordinate axis is The second coordinate axis is in the same plane, and the angle between the first coordinate axis and the second coordinate axis is 90 degrees. Each actuator in the actuator set includes a fixed end and a movable end. The fixed end of each actuator in the actuator set is connected to the substrate. The movable end of each actuator in the actuator set moves the stage and moves the image by moving toward or away from the substrate The sensor moves.

In the embodiment of the present application, the image sensor can move in its plane to achieve anti-shake compensation, and since the image sensor and the stage are disposed in the cavity of the substrate, the depth of the cavity is greater than or equal to the thickness of the image sensor, so The height of the imaging surface of the image sensor will not be raised, so that the imaging device can be made thinner based on the anti-shake function.

It should be noted that the image sensor in the embodiment of the present application must not only be able to move along the first coordinate axis or the second coordinate axis in the plane where it is located, but also need to enable the image sensor to rotate in its plane, therefore, actuation The actuator set needs to include at least 4 actuators, and each actuator can realize bidirectional translation along the axis where it is located.

The following describes the possible movement modes of the image sensor in the embodiments of the present application:

Referring to FIG. 5, in a possible implementation, the imaging device further includes a set of cantilever beams, and each actuator is connected to the stage through a corresponding cantilever beam, that is, one end of the cantilever beam is connected to the actuator The movable end is connected, and the other end of the cantilever beam is connected to the stage. Specifically, the cantilever beam set includes at least a first cantilever beam 4071, a second cantilever beam 4072, a third cantilever beam 4073, and a fourth cantilever beam 4074. The first cantilever beam and the second cantilever beam are disposed along the first coordinate axis. The three cantilever beam and the fourth cantilever beam are arranged along the second coordinate axis, the movable end of the first actuator is connected to the stage through the first cantilever beam, and the movable end of the second actuator is connected to the carrier through the second cantilever beam The stage is connected, the movable end of the third actuator is connected to the stage through the third cantilever beam, and the movable end of the fourth actuator is connected to the stage through the fourth cantilever beam. It can be understood that the cantilever beam in the embodiment of the present application may generate a certain amount of deformation in a plane parallel to the image sensor.

In a possible implementation manner, the fixed end and the movable end of each actuator in the actuator set are electrostatic comb-tooth structures, and the actuators of the electrostatic comb-tooth structure generally use a micro-electromechanical system (micro -electro-mechanical system (MEMS) technology, which can change the attractive force between the movable end and the fixed end of the actuator by changing the electric potential of the movable end and the fixed end of the actuator, so that the actuator pushes or pulls the stage , So that the carrier drives the image sensor to move along the first coordinate axis or the second coordinate axis in the plane where it is located, or makes the carrier drive the image sensor to rotate in the plane where it is located. The following describes the motion modes of the above three image sensors:

Please refer to FIG. 6 (a), which is a schematic diagram of the image sensor moving along the first coordinate axis. The first actuator and the second actuator move in the same direction along the first coordinate axis, thereby driving the stage and the image sensor to move along the first coordinate axis. For example, the first actuator pushes the stage and the second actuator pulls the stage, thereby driving the image sensor to move toward the first coordinate axis, or the first actuator pulls the stage and the second actuator The stage is pushed to drive the image sensor to move in the reverse direction toward the first coordinate axis.

Please refer to FIG. 6 (b), which is a schematic diagram of the image sensor moving along the second coordinate axis. The third actuator and the fourth actuator move in the same direction along the second coordinate axis, thereby driving the stage and the image sensor to move along the second coordinate axis. For example, the third actuator pushes the stage and the fourth actuator pulls the stage, thereby driving the image sensor to move forward toward the second coordinate axis, or the third actuator pulls the stage and the fourth actuator The stage is pushed to drive the image sensor to move in the opposite direction to the second coordinate axis.

Please refer to FIG. 6 (c), which is a schematic diagram of the image sensor rotating in its plane. The first actuator and the second actuator move in opposite directions along the first coordinate axis, or the third actuator and the fourth actuator move in opposite directions along the second coordinate axis, or either The actuator and the second actuator move in the opposite direction along the first coordinate axis while the third actuator and the fourth actuator move in the opposite direction along the second coordinate axis, thereby driving the stage And the image sensor rotates in its plane. For example, both the first and second actuators move away from the substrate and / or the third and fourth actuators move away from the substrate, thereby driving the stage and the image sensor respectively Rotate clockwise in the corresponding plane, or both the first and second actuators move toward the substrate and / or the third and fourth actuators move toward the substrate Move in the direction to drive the stage and the image sensor to rotate counterclockwise in the corresponding plane.

It should be noted that, in a possible implementation manner, the clockwise and counterclockwise directions described above can also be changed, that is, both the first actuator and the second actuator move away from the base and / Or both the third actuator and the fourth actuator move away from the substrate, thereby driving the stage and the image sensor to rotate counterclockwise in the corresponding planes, or the first actuator and the second actuator The actuators move toward the substrate and / or the third actuator and the fourth actuator move toward the substrate, thereby driving the stage and the image sensor to rotate clockwise in the corresponding planes .

In the embodiment of the present application, the image sensor can not only move along the first coordinate axis or the second coordinate axis in its plane, but also rotate in its plane, so that the anti-shake function in various directions can be realized, which improves user experience.

In order for the signal of the image sensor to be led out to the substrate, the stage needs to be electrically connected to the image sensor and the substrate respectively. The embodiments of the present application provide a variety of different implementations for this purpose, which are described below:

First, the electrical connection between the stage and the image sensor is introduced. Please refer to FIG. 7. FIG. 7 is a schematic diagram of the stereo structure of the image sensor. In addition to the photosensitive area 4011, the image sensor 401 also includes a solder provided on the front of the image sensor. In the disk 4012, the number of pads is greater than or equal to 1. It can be understood that the positions of the pads are located around the photosensitive area and will not coincide with the photosensitive area.

In addition, a first front pad 4041 is also provided on the front of the stage 404, and the first front pad and the pad of the image sensor are electrically connected. There can be two different implementation methods, which are described below:

The first implementation is shown in FIG. 8, the stage 404 further includes a first conductive via 4043 and a first bottom pad 4042 provided on the bottom of the stage, wherein the first conductive via is used to connect the first front pad It is soldered to the first bottom surface pad, the first bottom surface pad and the image sensor pad. Since the first front surface pad and the first bottom surface pad are electrically connected through the first conductive via, the first A front pad is electrically connected to the pad of the image sensor. It should be noted that the number of first front pads, first conductive vias, and first bottom pads are all greater than or equal to 1, and the first front pad, first conductive via, first bottom pad, and image The pads on the sensor can be one-to-one correspondence.

The second implementation is shown in Figure 9. The first front pad on the stage is electrically connected to the pad on the image sensor by wire bonding, and the bottom surface of the stage can be bonded to the front surface of the image sensor. It acts as a fixed image sensor.

In the embodiments of the present application, different methods are provided to realize the electrical connection between the stage and the image sensor, which improves the realizability and flexibility of the present application. In addition, the first implementation manner described above is relative to the second implementation manner No wiring operation between the stage and the image sensor is required, thereby avoiding the impact of the wiring process on each device and reducing the possibility of damage to each device.

The following describes the electrical connection between the carrier and the substrate. Please refer to FIG. 5. The substrate further includes a second front pad 4031 provided on the front of the substrate. The first front pad 4041 of the carrier can be connected to The second front pads 4031 of the substrate are electrically connected, the number of the second front pads is greater than or equal to 1, and the first front pads and the second front pads may be in one-to-one correspondence. Specifically, the lead wire drawn from the first front pad may be electrically connected to the second front pad along the flexible connector. It can be understood that, if there are multiple flexible connectors, preferably, the first front pad 4041 can be electrically connected to the second front pad 4031 along the closest flexible connector, of course The first front pad 4041 can be electrically connected to the second front pad 4031 along other flexible connectors, which is not specifically limited herein.

It should be noted that, in a possible embodiment, since the flexible connector serves to provide support for the stage, in addition, the movable end of the actuator can be connected to the stage through the cantilever beam, so the actuation The movable end of the actuator, the cantilever beam and the carrier can be regarded as a whole structure, then one end of the flexible connector is connected to the base, and the other end can be connected to the carrier or the movable end of the actuator, or it can be The connection of the cantilever beam is not limited here.

In a possible implementation manner, the imaging device further includes a printed circuit board (PCB), the PCB is fixedly connected to the bottom surface of the substrate, and the signal of the image sensor is further led to the PCB on the basis of the signal to the substrate. Therefore, electrical connection must also be achieved between the substrate and the PCB. There can be two different implementation methods, which are described below:

The first implementation is shown in FIG. 10, the substrate further includes a second bottom pad 4032 and a second conductive via 4033 disposed on the bottom of the substrate, wherein the second conductive via is used to connect the second front pad and the second The bottom surface pad, the second bottom surface pad and the PCB are soldered together. Since the second front surface pad and the second bottom surface pad are electrically connected through the second conductive through hole, the second front surface pad and the PCB can be realized Electrical connection. It should be noted that the number of second front pads, second conductive vias, and second bottom pads are all greater than or equal to 1, and the second front pads, second conductive vias, and second bottom pads may be corresponding.

The second implementation is shown in Figure 11. The front pad on the substrate is electrically connected to the PCB by wire bonding.

In the embodiments of the present application, different methods are provided to realize the electrical connection between the substrate and the PCB, which improves the realizability and flexibility of the present application. In addition, the first implementation manner described above is different from the second implementation manner. Conduct the wire bonding operation between the substrate and the PCB, thereby avoiding the impact of the wire bonding process on each device and reducing the possibility of damage to each device.

The imaging apparatus provided in the embodiment of the present application may be a component part of a terminal device, and the following uses the terminal device as a mobile phone as an example for introduction:

FIG. 12 is a block diagram showing a partial structure of a mobile phone related to an imaging device provided by an embodiment of the present application. Referring to FIG. 12, the mobile phone includes: a memory 1220, an input unit 1230, a display unit 1240, a controller 1250, an imaging device 1260, a processor 1270, and a power supply 1280. Those skilled in the art may understand that the structure of the mobile phone shown in FIG. 12 does not constitute a limitation on the mobile phone, and may include more or fewer components than shown, or combine some components, or arrange different components.

The following describes each component of the mobile phone in detail with reference to FIG. 12:

The memory 1220 may be used to store software programs and modules. The processor 1270 executes various functional applications and data processing of the mobile phone by running the software programs and modules stored in the memory 1220. The memory 1220 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, application programs required by at least one function (such as a sound playback function, an image playback function, etc.), etc .; the storage data area may store Data created by the use of mobile phones (such as audio data, phone books, etc.), etc. In addition, the memory 1220 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other volatile solid-state storage devices.

The input unit 1230 may be used to receive input numeric or character information, and generate key signal input related to user settings and function control of the mobile phone. Specifically, the input unit 1230 may include a touch panel 1231 and other input devices 1232. The touch panel 1231, also known as a touch screen, can collect user's touch operations on or near it (for example, the user uses any suitable objects or accessories such as fingers, stylus, etc. on the touch panel 1231 or near the touch panel 1231. Operation), and drive the corresponding connection device according to the preset program. Optionally, the touch panel 1231 may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, and detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device and converts it into contact coordinates, and then sends To the processor 1270, and can receive the command sent by the processor 1270 and execute it. In addition, the touch panel 1231 can be implemented in various types such as resistive, capacitive, infrared, and surface acoustic waves. In addition to the touch panel 1231, the input unit 1230 may also include other input devices 1232. Specifically, other input devices 1232 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), trackball, mouse, joystick, and so on.

The display unit 1240 can be used to display the information input by the user or the information provided to the user and various menus of the mobile phone. In the embodiment of the present application, it is mainly used to display the captured image. The display unit 1240 may include a display panel 1241. Alternatively, the display panel 1241 may be configured in the form of a liquid crystal display (Liquid Crystal) (LCD), an organic light emitting diode (Organic Light-Emitting Diode, OLED), or the like. Further, the touch panel 1231 can cover the display panel 1241. When the touch panel 1231 detects a touch operation on or near it, it is transmitted to the processor 1270 to determine the type of touch event, and then the processor 1270 according to the touch event The type provides corresponding visual output on the display panel 1241. Although in FIG. 12, the touch panel 1231 and the display panel 1241 are two separate components to realize the input and input functions of the mobile phone, in some embodiments, the touch panel 1231 and the display panel 1241 may be integrated and Realize the input and output functions of the mobile phone.

The controller 1250 can be used to control the actuator of the imaging device to move, thereby driving the carrier and the image sensor to move, so as to realize the anti-shake function of the imaging device.

The imaging device 1260 may be the imaging device described in any of the embodiments corresponding to FIG. 3 to FIG. 12 described above.

The processor 1270 is the control center of the mobile phone, and uses various interfaces and lines to connect the various parts of the entire mobile phone, by running or executing the software programs and / or modules stored in the memory 1220, and calling the data stored in the memory 1220 to execute Various functions and processing data of the mobile phone to monitor the mobile phone as a whole. In the embodiment of the present application, the processor is mainly used to call programs and instructions stored in the memory and control the imaging device through the controller. Optionally, the processor 1270 may include one or more processing units; preferably, the processor 1270 may integrate an application processor and a modem processor, where the application processor mainly processes an operating system, a user interface, and application programs, etc. The modem processor mainly handles wireless communication. It can be understood that the foregoing modem processor may not be integrated into the processor 1270. In the embodiment of the present application, the processor 1270 may also perform processing such as denoising, enhancing, and segmenting blurring on the image according to the acquired signal of the image sensor.

The mobile phone also includes a power supply 1280 (such as a battery) that supplies power to various components. Preferably, the power supply can be logically connected to the processor 1270 through a power management system, so as to implement functions such as charging, discharging, and power management through the power management system.

It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or equivalently replace some of the technical features; and these Modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

An imaging device, characterized by comprising: an image sensor and an anti-shake module, wherein the image sensor includes a photosensitive region, the photosensitive region is provided on the front of the image sensor, and the anti-shake module includes a substrate , Carrier, flexible connector and actuator assembly;

The base includes a cavity, the depth of the cavity is greater than or equal to the thickness of the image sensor, the carrier is disposed in the cavity, the substrate is provided to the carrier through the flexible connector Support, the number of the flexible connecting parts is greater than or equal to 1;

The stage includes a through hole, the size of the through hole is greater than or equal to the photosensitive area, the stage is electrically connected to the image sensor and the substrate, and the bottom surface of the stage is connected to the image sensor The front of the is fixedly connected, and the image sensor is disposed in the cavity;

The actuator set includes at least a first actuator, a second actuator, a third actuator, and a fourth actuator. The first actuator and the second actuator are along the first A coordinate axis, the third actuator and the fourth actuator are arranged along a second coordinate axis, the first coordinate axis and the second coordinate axis are in the same plane, and the first The angle between a coordinate axis and the second coordinate axis is 90 degrees, and each actuator in the actuator set includes a fixed end and a movable end;

The fixed end of each actuator in the set of actuators is connected to the base, and the movable end of each actuator in the set of actuators approaches the base or moves away from the base To move the stage and the image sensor.
The imaging device according to claim 1, wherein the image sensor further comprises a pad, the pad is disposed on the front of the image sensor, and the number of the pad is greater than or equal to 1;

The stage further includes a first front pad, the first front pad is disposed on the front of the stage, the first front pad is electrically connected to the pad, and the first front pad The number is greater than or equal to 1.
The imaging device according to claim 2, wherein the stage further comprises a first conductive via and a first bottom surface pad, the first bottom surface pad is disposed on the bottom surface of the stage, the The first conductive via is used to connect the first front pad and the first bottom pad, the first bottom pad and the pad are welded together, the first conductive via and the The number of the first bottom surface pads is greater than or equal to 1.
The imaging device according to claim 2, wherein the first front pad is electrically connected to the pad by wire bonding, and the bottom surface of the stage is bonded to the front surface of the image sensor.
The imaging device according to claim 2, wherein the substrate further comprises a second front pad, the second front pad is disposed on the front of the substrate, and the first front pad passes through the The flexible connector is electrically connected to the second front pad, and the number of the second front pad is greater than or equal to 1.
The imaging device according to claim 5, wherein the imaging device further comprises a printed circuit board PCB, the PCB is fixedly connected to the bottom surface of the substrate, the substrate further comprises a second conductive through hole and a second A bottom surface pad, the second bottom surface pad is provided on the bottom surface of the substrate, the second conductive via is used to connect the second front surface pad and the second bottom surface pad, the second bottom surface The pads and the PCB are soldered together, and the number of the second conductive vias and the second bottom pads is greater than or equal to 1.
The imaging device according to claim 5, wherein the imaging device further comprises a PCB, the PCB is fixedly connected to the bottom surface of the substrate, and the second front pad is electrically connected to the PCB by wire bonding .
The imaging device according to any one of claims 1 to 7, wherein the imaging device further includes a cantilever beam set, and the cantilever beam set includes at least a first cantilever beam, a second cantilever beam, and a third cantilever beam A beam and a fourth cantilever beam, the first cantilever beam and the second cantilever beam are arranged along the first coordinate axis, and the third cantilever beam and the fourth cantilever beam are along the second coordinate The shaft is provided, the movable end of the first actuator is connected to the carrier through the first cantilever beam, and the movable end of the second actuator is connected to the carrier through the second cantilever beam Stage, the movable end of the third actuator is connected to the stage through the third cantilever beam, and the movable end of the fourth actuator is connected to the carrier through the fourth cantilever beam台连接。 Taiwan connection.
The imaging device according to any one of claims 1 to 7, wherein the fixed end and the movable end of each actuator in the actuator set are of an electrostatic comb-tooth structure.
The imaging device according to claim 9, wherein the first actuator and the second actuator move in the same direction, and drive the stage and the image sensor along the first A coordinate axis moves.
The imaging device according to claim 9, wherein the third actuator and the fourth actuator move in the same direction, and drive the stage and the image sensor along the first The two coordinate axes move.
The imaging device according to claim 9, wherein the first actuator and the second actuator move in opposite directions and / or the third actuator and the fourth actuator The actuator moves in the opposite direction, and drives the stage and the image sensor to rotate in the corresponding planes, respectively.
A terminal device is characterized by comprising a processor, a controller, a memory, a bus and an imaging device, wherein the processor, the controller, the memory and the imaging device communicate with each other through the bus Connection, wherein the memory is used to store programs and instructions, the processor is used to call the programs and instructions stored in the memory, and the processor is also used to control the imaging device through the controller;

The imaging device includes: an image sensor and an anti-shake module, wherein the image sensor includes a photosensitive region, the photosensitive region is disposed on the front of the image sensor, and the anti-shake module includes a substrate, a stage, and a flexible Connection piece and actuator assembly;

The base includes a cavity, the depth of the cavity is greater than or equal to the thickness of the image sensor, the carrier is disposed in the cavity, the substrate is provided to the carrier through the flexible connector Support, the number of the flexible connecting parts is greater than or equal to 1;

The stage includes a through hole, the size of the through hole is greater than or equal to the photosensitive area, the stage is electrically connected to the image sensor and the substrate, and the bottom surface of the stage is connected to the image sensor The front of the is fixedly connected, and the image sensor is disposed in the cavity;

The actuator set includes at least a first actuator, a second actuator, a third actuator, and a fourth actuator. The first actuator and the second actuator are along the first A coordinate axis, the third actuator and the fourth actuator are arranged along a second coordinate axis, the first coordinate axis and the second coordinate axis are in the same plane, and the first The angle between a coordinate axis and the second coordinate axis is 90 degrees, and each actuator in the actuator set includes a fixed end and a movable end;

The fixed end of each actuator in the set of actuators is connected to the base, and the movable end of each actuator in the set of actuators approaches the base or moves away from the base To move the stage and the image sensor.