JP7465612B2 - 半導体発光素子チップ集積装置およびその製造方法 - Google Patents

半導体発光素子チップ集積装置およびその製造方法 Download PDF

Info

Publication number
JP7465612B2
JP7465612B2 JP2024509569A JP2024509569A JP7465612B2 JP 7465612 B2 JP7465612 B2 JP 7465612B2 JP 2024509569 A JP2024509569 A JP 2024509569A JP 2024509569 A JP2024509569 A JP 2024509569A JP 7465612 B2 JP7465612 B2 JP 7465612B2
Authority
JP
Japan
Prior art keywords
electrode
emitting element
semiconductor light
chip
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024509569A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023181246A1 (https=
Inventor
元伸 竹谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ULDTEC CO., LTD.
Original Assignee
ULDTEC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ULDTEC CO., LTD. filed Critical ULDTEC CO., LTD.
Publication of JPWO2023181246A1 publication Critical patent/JPWO2023181246A1/ja
Application granted granted Critical
Publication of JP7465612B2 publication Critical patent/JP7465612B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
JP2024509569A 2022-03-24 2022-03-24 半導体発光素子チップ集積装置およびその製造方法 Active JP7465612B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/013902 WO2023181246A1 (ja) 2022-03-24 2022-03-24 半導体発光素子チップ集積装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2023181246A1 JPWO2023181246A1 (https=) 2023-09-28
JP7465612B2 true JP7465612B2 (ja) 2024-04-11

Family

ID=88100630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024509569A Active JP7465612B2 (ja) 2022-03-24 2022-03-24 半導体発光素子チップ集積装置およびその製造方法

Country Status (2)

Country Link
JP (1) JP7465612B2 (https=)
WO (1) WO2023181246A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016512347A (ja) 2013-03-15 2016-04-25 ルクスビュー テクノロジー コーポレイション 冗長性スキームを備えた発光ダイオードディスプレイ、及び統合欠陥検出検査を備えた発光ダイオードディスプレイを製造する方法
WO2020029657A1 (zh) 2018-08-10 2020-02-13 林宏诚 一种二极管装置、显示面板及柔性显示器
US20210033240A1 (en) 2019-07-31 2021-02-04 Lg Display Co., Ltd. Display apparatus
JP6886213B1 (ja) 2020-06-20 2021-06-16 アルディーテック株式会社 半導体発光素子チップ集積装置およびその製造方法
JP2023520120A (ja) 2020-03-30 2023-05-16 ジェイド バード ディスプレイ(シャンハイ) リミテッド 接合構造が積層されたマルチカラーledのシステム及び方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016512347A (ja) 2013-03-15 2016-04-25 ルクスビュー テクノロジー コーポレイション 冗長性スキームを備えた発光ダイオードディスプレイ、及び統合欠陥検出検査を備えた発光ダイオードディスプレイを製造する方法
WO2020029657A1 (zh) 2018-08-10 2020-02-13 林宏诚 一种二极管装置、显示面板及柔性显示器
US20210033240A1 (en) 2019-07-31 2021-02-04 Lg Display Co., Ltd. Display apparatus
JP2023520120A (ja) 2020-03-30 2023-05-16 ジェイド バード ディスプレイ(シャンハイ) リミテッド 接合構造が積層されたマルチカラーledのシステム及び方法
JP6886213B1 (ja) 2020-06-20 2021-06-16 アルディーテック株式会社 半導体発光素子チップ集積装置およびその製造方法

Also Published As

Publication number Publication date
JPWO2023181246A1 (https=) 2023-09-28
WO2023181246A1 (ja) 2023-09-28

Similar Documents

Publication Publication Date Title
JP6694222B1 (ja) 半導体チップ集積装置の製造方法、半導体チップ集積装置、半導体チップインクおよび半導体チップインク吐出装置
JP6842783B1 (ja) マイクロledディスプレイの製造方法およびマイクロledディスプレイ
WO2021084783A1 (ja) 半導体チップ集積装置の製造方法、半導体チップ集積装置、半導体チップ集積装置集合体、半導体チップインクおよび半導体チップインク吐出装置
US12376427B2 (en) Display device using semiconductor light emitting diode
JP6803595B1 (ja) 半導体発光素子チップ集積装置およびその製造方法
US9825202B2 (en) Display with surface mount emissive elements
CN114144309B (zh) 喷墨印刷装置、用于使双极元件对准的方法和制造显示装置的方法
US20220230999A1 (en) Display device
EP4094946B1 (en) Inkjet printing device, method for printing bipolar elements, and method for manufacturing display device
JP6886213B1 (ja) 半導体発光素子チップ集積装置およびその製造方法
JP2021125544A (ja) 半導体チップ集積装置の製造方法、半導体チップ集積装置および半導体チップ集積装置集合体
JP7465612B2 (ja) 半導体発光素子チップ集積装置およびその製造方法
JP2021072290A (ja) マイクロledバックライトおよびその製造方法ならびにマイクロled照明装置およびその製造方法
US20220115565A1 (en) Ink including light-emitting elements, display device and method of fabricating the same
JP7422449B1 (ja) 発光ダイオードチップ集積装置
US12622323B2 (en) Semiconductor light emitting element chip integrated device and manufacturing method thereof
JP2021093430A (ja) 半導体チップ集積装置の製造方法および半導体チップ集積装置
KR20210056480A (ko) 잉크젯 프린팅 장치, 쌍극성 소자의 정렬 방법 및 표시 장치의 제조 방법
KR20230123028A (ko) 잉크젯 프린팅 장치
EP3352210A1 (en) Light emitting diodes adapted for the fluidic assembly of emissive displays

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240220

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20240220

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240322

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240325

R150 Certificate of patent or registration of utility model

Ref document number: 7465612

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150