JP7464837B2 - Method for manufacturing a light emitting device - Google Patents

Description

This disclosure relates to a method for manufacturing a light-emitting device.

It is disclosed that when manufacturing a light-emitting device, the LED is peeled off from the stretchable support sheet while being sucked by a suction member while the stretchable support sheet is stretched.

JP 2014-168033 A

Therefore, an object of the embodiment of the present disclosure is to provide a method for manufacturing a light-emitting device that can easily position a first member laterally on the side of a light-emitting element.

A method for manufacturing a light emitting device according to an embodiment of the present disclosure includes the steps of stretching a stretchable sheet against an elastic force, placing at least one light emitting element in a predetermined area of the stretchable sheet in a stretched state, supplying a first member to the side of a side of the light emitting element on the stretchable sheet, and releasing the stretched state by the elastic force of the stretchable sheet.

The manufacturing method of the light emitting device according to the embodiment of the present disclosure allows the first member to be easily positioned to the side of the side surface of the light emitting element.

1 is a perspective view showing a schematic view of a light emitting device according to a first embodiment. 1 is a plan view illustrating a schematic view of a light emitting device according to a first embodiment. 1C is a cross-sectional view taken along line IC-IC in FIG. 1B. 4 is a flowchart showing the steps of a method for manufacturing the light emitting device according to the first embodiment. 4 is a plan view showing a schematic state in which the stretchable sheet is stretched in the manufacturing method for the light emitting device according to the first embodiment. FIG. 4 is a plan view showing a schematic state of placing a light emitting element in the manufacturing method for the light emitting device according to the first embodiment. FIG. 4 is a plan view illustrating a state in which a first member is supplied between light emitting elements in the manufacturing method for the light emitting device according to the first embodiment. FIG. FIG. 3C2 is a cross-sectional view taken along line IIICII-IIICII in FIG. 4 is a plan view showing a schematic state in which the stretchable sheet is released in the manufacturing method for the light emitting device according to the first embodiment. FIG. FIG. 3D2 is a cross-sectional view taken along line IIIDII-IIIDII in FIG. 3D1. 4 is a plan view showing a schematic state in which the stretchable sheet is peeled off and the light emitting element is placed on the support substrate in the manufacturing method of the light emitting device according to the first embodiment. FIG. 4 is a plan view showing a schematic state in which the light emitting element on the supporting substrate is covered with the arrangement member in the manufacturing method for the light emitting device according to the first embodiment. FIG. This is a cross-sectional view taken along line IIIFII-IIIFII in Figure 3F1. 4 is a plan view illustrating a state in which the arrangement member is ground to expose element electrodes in the manufacturing method of the light emitting device according to the first embodiment. FIG. FIG. 3G2 is a cross-sectional view taken along line IIIGII-IIIGII in FIG. 4 is a plan view illustrating a state in which the support substrate is peeled off in the manufacturing method of the light emitting device according to the first embodiment. FIG. FIG. 3H1 is a cross-sectional view taken along line IIIHII-IIIHII in FIG. FIG. 11 is a perspective view illustrating a light emitting device according to a second embodiment. 10 is a flowchart showing the steps of a method for manufacturing a light emitting device according to a second embodiment. 13 is a plan view showing a schematic state in which wiring is formed of an elastic material on an elastic sheet in a manufacturing method for a light emitting device according to a second embodiment. FIG. FIG. 11 is a plan view illustrating a state in which a stretchable sheet having wiring formed thereon is stretched in a manufacturing method for a light emitting device according to a second embodiment. 13 is a plan view showing a schematic state in which a light emitting element is placed on wiring in a manufacturing method for a light emitting device according to a second embodiment. FIG. 13 is a plan view showing a state in which placement members are provided between and around the light emitting elements in the manufacturing method for the light emitting device according to the second embodiment. FIG. This is a cross-sectional view taken along line VIDII-VIDII in FIG. 6D1. 13 is a plan view showing a schematic state in which the stretchable sheet is released in the manufacturing method for the light emitting device according to the second embodiment. FIG. FIG. 6E2 is a cross-sectional view taken along line VIEII-VIEII in FIG. FIG. 13 is a perspective view illustrating a modified example of the light emitting device. 10A to 10C are cross-sectional views each showing a schematic state of supplying a first member in a first modified example of the manufacturing method of each embodiment. FIG. 11 is a cross-sectional view illustrating a schematic state of a first member in a releasing step in a first modified example of the manufacturing method of each embodiment. 11 is a cross-sectional view illustrating a state in which the first member is polished to expose the wavelength conversion member in a first modified example of the manufacturing method of each embodiment. FIG. 11A to 11C are cross-sectional views each showing a schematic state of supplying a first member in a second modified example of the manufacturing method of each embodiment. FIG. 11 is a cross-sectional view illustrating a schematic state of the first member in a releasing step in a second modified example of the manufacturing method of each embodiment. 13 is a plan view of a stretchable sheet used in a manufacturing method for a light emitting device according to another embodiment. FIG. FIG. 10B is a plan view showing a schematic state in which wiring is formed on the stretchable sheet of FIG. 10A. FIG. 10C is a plan view showing a schematic state in which the light emitting element is placed on the wiring in FIG. 10B. FIG. 10C is a plan view showing a schematic state in which the stretchable sheet is stretched with the light emitting element placed on the wiring. FIG. 10D is a plan view showing a state in which a first member is supplied to the side of the side surface of the light emitting element of the stretched elastic sheet in FIG. FIG. 10E is a plan view showing a state in which the stretchable sheet is released from the stretched state and the first member is disposed to face the side of the light-emitting element with a narrow gap therebetween. FIG. 2 is an explanatory diagram showing a schematic cross-sectional view of a configuration in which wiring is formed on the lower surface of a stretchable sheet in each embodiment.

The embodiments will be described below with reference to the drawings. However, the embodiments shown below are merely examples of a method for manufacturing a light-emitting device to embody the technical idea of the present embodiment, and are not limited to the following. Furthermore, unless otherwise specified, the dimensions, materials, shapes, and relative positions of the components described in the embodiments are merely examples and are not intended to limit the scope of the present invention. Note that the sizes and positional relationships of the components shown in each drawing may be exaggerated to clarify the explanation.
The first member refers to a member provided on the side of the light emitting element or a member covering the side surface of the light emitting element. The height of the first member is appropriately adjusted depending on the member to be supplied.

First Embodiment
[Light-emitting device]
First, the light emitting device will be described.
Fig. 1A is a perspective view diagrammatically illustrating the light emitting device according to the first embodiment, Fig. 1B is a plan view diagrammatically illustrating the light emitting device according to the first embodiment, and Fig. 1C is a cross-sectional view diagrammatically illustrating the light emitting device according to the first embodiment along the line IC-IC in Fig. 1A.
The light emitting device 100 includes a light emitting element 1 as a semiconductor element, an arrangement member 2A, and a wavelength conversion member 3. The light emitting device 100 has four light emitting elements 1 arranged in a matrix direction of two rows and two columns. The light emitting device 100 also includes, as the arrangement member 2A, a first member 2A1 formed between the light emitting elements 1, and a second member 2A2 surrounding all the light emitting elements 1 in a frame shape.
Hereinafter, each component of the light emitting device will be described first, and then a method for manufacturing the light emitting device will be described.

(Light Emitting Element)
A semiconductor light-emitting element is used as an example of the light-emitting element 1. The light-emitting element 1 may be any element structure made of various semiconductors and provided with a pair of positive and negative element electrodes 11, 12. In particular, the light-emitting element 1 is preferably a nitride semiconductor (In _x Al _y Ga _1-x-y N, 0≦x, 0≦y, x+y≦1) capable of efficiently exciting a phosphor. Alternatively, the light-emitting element 1 may be a zinc sulfide-based semiconductor, a zinc selenide-based semiconductor, or a silicon carbide-based semiconductor.
The light-emitting element 1 may be, for example, a regular square with a side length of 100 μm or more and 2 mm or less in plan view, but a polygon such as a triangle, a square, a pentagon, a hexagon, or an octagon may also be used, and these polygons may be combined in various ways. Here, the light-emitting element 1 is formed into a square assembly using four regular squares. The arrangement of the light-emitting elements 1 may be a rectangular assembly using six squares in two rows and three columns, or an octagonal or circular assembly with two light-emitting elements 1 in the first row, four in the second row, four in the third row, and two in the fourth row. Furthermore, the light-emitting elements 1 may be arranged in an L-shape by arranging three squares and a triangular light-emitting element inside the L-shape, so that the overall shape is a pentagon. It is preferable to determine the shape of the light-emitting element 1 in consideration of the state in which a plurality of light-emitting elements 1 are combined.

The spacing between the light-emitting elements 1 in the light-emitting device 100 is preferably 20 μm or more and 100 μm or less, and more preferably 20 μm or more and 50 μm or less. If the spacing between the light-emitting elements is 20 μm or more, the light-emitting device 100 is easier to manufacture, and by making the spacing between the light-emitting elements 1 smaller through the first member 2A1, the light-emitting elements 1 can be arranged densely with no gaps between them and the first member 2A1 abutting against each other, or with the light-emitting elements 1 facing closely at a predetermined spacing. On the other hand, if the spacing between the light-emitting elements 1 or the spacing between the light-emitting elements 1 and the first member 2A1 is 100 μm or less, the light-emitting elements 1 can be arranged even more densely, and the light-emitting device 100 can be made smaller.

(Placement member: first member)
The placement member 2A is a member that mainly covers the side surface of the light-emitting element 1, or a member that is placed to the side of the side surface of the light-emitting element 1. The placement member 2A may be a reflective member that contains a reflective material and reflects light emitted by the light-emitting element 1 and traveling laterally or downwardly toward the wavelength conversion member 3 side, which is the light-emitting region of the light-emitting device 100.
The arrangement member 2A is provided on the side of the light emitting element 1, the side of the wavelength conversion member 3, and the lower surface of the light emitting element 1 except for the lower surfaces of the element electrodes 11 and 12. The arrangement member 2A is provided so as to face and abut against the side of the light emitting element. By providing the arrangement member 2A so as to abut against the side of the light emitting element 1, it is possible to improve the visibility. The arrangement member 2A only needs to cover at least a part of the side of the light emitting element 1, but it is preferable that the height of the arrangement member 2A is at least higher than the light emitting layer of the light emitting element 1. Furthermore, the height of the arrangement member 2A is preferably 5 μm or more and 150 μm or less, and particularly preferably 5 μm or more and 50 μm or less. The arrangement member 2A is provided as a first member 2A1 between the light emitting elements 1, and is provided with a second member 2A2 arranged in a frame shape that becomes the outer side surface surrounding the entire aligned light emitting elements 1. The first member 2A1 and the second member 2A2 used here are formed of the same material, as an example. The arrangement member 2A is also provided between the element electrodes 11 and 12 of the light-emitting element 1, but the lower surfaces of the element electrodes 11 and 12 are exposed from the arrangement member 2A.
The placement member 2A may be made of, for example, resin, ceramics, glass, etc., and may contain a reflective material. The placement member 2A may be configured such that a filler is contained in the base material or the resin serving as a binder, in addition to the reflective material.

The binder is a resin for binding the reflective material or filler to the light-emitting element 1 as the placement member 2A. Examples of the resin that can be used as the binder include polycarbonate resin, epoxy resin, phenol resin, silicone resin, acrylic resin, TPX resin, polynorbornene resin, and urethane resin. Examples of the resin that can be used as the binder include modified resins of these resins and hybrid resins containing one or more of these resins. Among these, silicone resin or modified resins thereof are preferred because they have excellent heat resistance and light resistance and experience little volumetric shrinkage after curing.

The reflective material is a material that reflects the light emitted by the light-emitting element 1. Examples of the reflective material include silica, titanium oxide, silicon oxide, aluminum oxide, potassium titanate, zinc oxide, boron nitride, etc. Furthermore, a resin powder such as silicone powder may also be used.
The filler is added for reasons such as increasing the strength of the arrangement member 2A, which is a resin layer, or increasing the thermal conductivity of the arrangement member 2A. Examples of the filler include glass fiber, whiskers, aluminum oxide, silicon oxide, boron nitride, zinc oxide, and aluminum nitride.
The arrangement member 2A may be formed with the first member 2A1 and the second member 2A2 being separate members. For example, the first member 2A1 may be a member having a higher content of reflective material than the second member 2A2. Since the first member 2A1 is formed thinner than the second member 2A2, the first member 2A1 is less susceptible to the influence of light from the adjacent light-emitting element 1 by including a larger amount of reflective material than the second member 2A2.

(Wavelength conversion member)
The wavelength conversion member 3 is a member containing a wavelength conversion substance that absorbs a part of the light of a wavelength emitted by the light emitting element 1 and converts it into light of a different wavelength and emits it. The wavelength conversion substance used in the wavelength conversion member 3 is, for example, a phosphor. The wavelength conversion member 3 is provided on the light emitting surface of the light emitting element 1.
The base material or binder of the wavelength conversion member 3 is preferably formed of a light-transmitting resin. Examples of the resin include the resin that is the base material or binder of the arrangement member 2A described above. Among them, silicone resin or modified resin thereof is preferable because it has excellent heat resistance and light resistance and has little volume shrinkage after curing. The base material or binder of the wavelength conversion member 3 may be formed of ceramics or glass in addition to resin. The wavelength conversion member 3 may be formed by sintering only the wavelength conversion material without using a binder, or may be formed by fixing the wavelength conversion material using a small amount of a binder such as alumina. Furthermore, the wavelength conversion member 3 may be a phosphor sheet.

Examples of phosphors contained in the wavelength conversion member 3 include yttrium aluminum garnet activated with cerium, lutetium aluminum garnet activated with cerium, terbium aluminum garnet activated with cerium, nitrogen-containing calcium aluminosilicate activated with one or two of europium and chromium, europium-activated sialon, europium-activated silicate, manganese-activated potassium fluorosilicate, and europium-activated nitride phosphors.

The light emitting device 100 may be configured to include a substrate having a base material on which wiring is formed. The base material used for the substrate may be a stretchable sheet or a rigid sheet with high hardness.

[Method of manufacturing the light-emitting device]
Next, an example of a method for manufacturing a light emitting device will be described.
FIG. 2 is a flow chart showing the procedure of the manufacturing method of the light emitting device according to the first embodiment. FIG. 3A is a plan view showing a state in which the elastic sheet is stretched in the manufacturing method of the light emitting device according to the first embodiment. FIG. 3B is a plan view showing a state in which the light emitting element is placed in the manufacturing method of the light emitting device according to the first embodiment. FIG. 3C1 is a plan view showing a state in which the first member is supplied between the light emitting elements in the manufacturing method of the light emitting device according to the first embodiment. FIG. 3C2 is a cross-sectional view taken along line IIICII-IIICII in FIG. 3C1. FIG. 3D1 is a plan view showing a state in which the stretchable sheet is released in the manufacturing method of the light emitting device according to the first embodiment. FIG. 3D2 is a cross-sectional view taken along line IIIDII-IIIDII in FIG. 3D1. FIG. 3E is a plan view showing a state in which the elastic sheet is peeled off and the light emitting element is placed on the support substrate in the manufacturing method of the light emitting device according to the first embodiment. FIG. 3F1 is a plan view showing a state in which the light emitting element on the support substrate is covered with an arrangement member in the manufacturing method of the light emitting device according to the first embodiment. Fig. 3F2 is a cross-sectional view taken along line IIIFII-IIIFII in Fig. 3F1. Fig. 3G1 is a plan view showing a state in which the arrangement member is ground to expose the element electrodes in the manufacturing method for the light-emitting device according to the first embodiment. Fig. 3G2 is a cross-sectional view taken along line IIIGII-IIIGII in Fig. 3G1. Fig. 3H1 is a plan view showing a state in which the support substrate is peeled off in the manufacturing method for the light-emitting device according to the first embodiment. Fig. 3H2 is a cross-sectional view taken along line IIIHII-IIIHII in Fig. 3H1.

The method for manufacturing the light emitting device includes a step (stretching step) S11 of stretching the stretchable sheet 20 against an elastic force, a step (placing step) S12 of placing at least one (here, multiple) light emitting element 1 in a pre-set area of the stretchable sheet 20 in a stretched state, a step (supply step) S13 of supplying a first member 2A1 to the side of the side of the light emitting element 1 on the stretchable sheet 20, and a step (release step) S14 of releasing the stretched state by the elastic force of the stretchable sheet 20. The method for manufacturing the light emitting device further includes a step of placing the element electrodes 11 and 12 of the light emitting element 1 on the support substrate 21 (placement on the support substrate step) S15, a step of peeling off the stretchable sheet 20 to expose the element electrodes (peeling step) S16, a step of covering the light emitting device on the support substrate with a placement member (placement member molding step) S17, a step of polishing the placement member 2A to expose the element electrodes 11 and 12 (element electrode exposure step) S18, a step of peeling off the support substrate (support substrate peeling step) S19, and a step of singulating the light emitting elements into predetermined groups (singulation step) S20, with each step being performed in this order.

In the manufacturing method of this light-emitting device, when multiple light-emitting elements 1 are placed on a stretched elastic sheet 20, the distance (d2) between at least two light-emitting elements 1 after the stretched state is released is set to be narrower than the distance (d1) between at least two light-emitting elements 1.
Each step will be described below. Note that the materials and arrangement of each member are the same as those described above in connection with the light emitting device 100, and therefore will not be described here as appropriate.

(Stretching process)
The stretching step S11 is a step of stretching the stretchable sheet 20 against an elastic force. In this stretching step S11, the stretchable sheet 20 is attached to a fixing device 30, and the fixing device 30 stretches the stretchable sheet 20. Alternatively, the stretchable sheet 20 is stretched, and the stretchable sheet 20 is fixed to the fixing device 30 in the stretched state. Here, it is assumed that the stretchable sheet 20 is in a stretched state by the fixing device 30.
In addition, in the stretching step S11, the stretchable sheet 20 may be stretched in a radial direction from the center of the stretchable sheet 20.
Furthermore, in this stretching step S11, the elastic sheet 20 may be stretched in either of two directions, one along the X direction and the other, or in two directions, one along the Y direction perpendicular to the X direction.
In addition, in the stretching step S11, the elastic sheet 20 may be stretched in four directions: two directions along the X direction, one (X-positive direction) and the other (X-negative direction), and two directions along the Y direction, one (Y-positive direction) and the other (Y-negative direction), which is perpendicular to the X direction.

It is preferable that the stretchable sheet 20 is stretched so that the stretch rate is the same in the radial direction or in all four directions. By making all the stretch rates the same, it becomes easier to adjust the mounting interval of the light-emitting elements 1 in the stretched state and the mounting interval of the light-emitting elements 1 after the stretched state is released, and it becomes easier to mount the light-emitting elements 1. The stretch rate may be set appropriately in consideration of the mounting interval of the light-emitting elements 1 in the stretched state and the mounting interval of the light-emitting elements 1 after the stretched state is released. Preferably, when the mounting interval of the light-emitting elements 1 in the light-emitting device 100 after the stretch is released is set to 100%, the mounting interval of the light-emitting elements 1 in the stretched state can be set to 110% to 500%. More preferably, it can be set to 130% to 300%.
In addition, the spacing between the light emitting elements 1 in the light emitting device 100 is set to be, for example, 20 μm or more and 100 μm or less. In the stretching step, the stretch width in two opposing directions when the elastic sheet 20 is stretched is preferably set to be 100 μm or more and 500 μm or less so that the light emitting elements 1 are spaced apart from one another. If the stretch width is 100 μm or more, it becomes easier to place the light emitting element 1 and the first member 2A1 on the elastic sheet 20. On the other hand, if the stretch width is 500 μm or less, it is possible to suppress distortion in the mounting portion of the light emitting element 1. The stretch width is more preferably 100 μm or more and 300 μm or less.

The stretchable sheet 20 may be any material that has a sufficient elongation rate to ensure the desired clearance (the distance between the light-emitting elements 1) and can mount the light-emitting elements 1 without any problems. Examples of materials for the stretchable sheet 20 include UV tape, various plastics, rubber, and the like. The thickness of the stretchable sheet 20 is preferably, for example, 10 μm or more and 500 μm or less, and more preferably, 20 μm or more and 200 μm or less. The elongation rate of the stretchable sheet 20 is preferably 700% or less, more preferably 500% or less, and particularly preferably 300% or less. By using a stretchable sheet 20 with an elongation rate of more than 500%, the light-emitting elements 1 can be arranged at a high density. In addition, by suppressing the elongation rate of the stretchable sheet 20 to 300% or less, the stretchable sheet 20 can be used for wiring, etc., and breakage of the stretchable sheet 20 can be suppressed. In addition, as the fixing device 30, a fixing device 30 known in the art can be used. In addition, the elastic sheet 20 can be used in the same manner as the above-mentioned range of elongation values if its physical properties are an elastic modulus of about 1-100 MPa and a Young's modulus of about 1 to 50 MPa.

(Placement process)
The placing step S12 is a step of placing at least one light emitting element 1 in a predetermined area of the stretchable sheet 20 in a stretched state. In this placing step S12, as an example, four light emitting elements 1 are placed as one set, and each set of light emitting elements 1 is placed in a matrix direction. Then, each set including four light emitting elements 1 is placed as one column, and the light emitting elements 1 are placed in four rows and four columns in the matrix direction. Here, 16 sets are placed in the matrix direction, and 64 light emitting elements 1 are placed.
In the placing step S12, for example, the light emitting elements 1 of each set are placed such that the distance between them when the stretchable sheet 20 is released is 20 μm or more and 100 μm or less via the first member 2A1. Here, in the placing step S12, the light emitting elements 1 are placed such that the distance between them when the stretchable sheet 20 is stretched is 100 μm or more and 500 μm or less, so that the distance between them when the stretchable sheet 20 is released is 20 μm or more and 100 μm or less. In the placing step S12, the light emitting elements 1 are placed on the stretchable sheet 20 such that the element electrodes 11, 12 face the stretchable sheet 20.

(Supply process)
The supply step S13 is a step of supplying the first member 2A1 to the side of the side surface of the light emitting element 1 on the elastic sheet 20. In this supply step S13, for example, the first member 2A1 that becomes the arrangement member 2A is supplied between the light emitting elements 1 via a supply nozzle. The supply amount of the first member 2A1 supplied in the supply step S13 is set so that the height is equal to the height of the light emitting element 1 when the stretch of the elastic sheet 20 is released. In the supply step S13, as shown in FIG. 3C2, the first member 2A1 is supplied to the side of the side surfaces of the light emitting elements 1, that is, at least a part of the position facing the side surface, as an example, in contact with the side surface of the light emitting element 1. In the supply step S13, it is previously examined how the first member 2A1 is formed when the stretch state of the elastic sheet 20 is released and the first member 2A1 is mounted at the mounting interval between the light emitting elements 1 of the light emitting device 100. Therefore, the supply amount of the first member 2A1 can be set in advance to be appropriate for the mounting interval.

In the supply step S13, the first member 2A1 is supplied when the interval between the light-emitting elements 1 is wider than the mounting interval, so that no air bubbles enter inside. In other words, if the interval between the light-emitting elements 1 is narrow, the first member 2A1 does not enter between the light-emitting elements 1 well, and air bubbles may remain, but in this embodiment, the interval between the light-emitting elements 1 can be made wide, so that the first member 2A1 can fill the gap between the light-emitting elements 1 without leaving any air bubbles. In addition, in the supply step S13, the nozzle that supplies the first member 2A1 moves up, down, left, right, front and back, and the mounting table on which the elastic sheet 20 is placed moves up, down, left, right, front and back to supply the first member 2A1. In addition, even if the first member 2A1 overflows from the side of the light-emitting element 1 to the outside, it is further covered by the arrangement member 2A in a later step, so there is no particular problem with the overflowing state to the side of the light-emitting element 1. Note that the side of the side of the light-emitting element 1 includes both cases where the first member 2A1 is supplied so as to abut or contact the side of the light-emitting element 1, and cases where it is supplied without contact with the side of the light-emitting element 1 with a gap therebetween. In addition, facing at least a portion of the side of the light-emitting element 1 includes both cases where the first member 2A1 faces the entire side of the light-emitting element 1 when supplied, and cases where it faces a portion of the side of the light-emitting element 1.

(Release process)
The release step S14 is a step of releasing the stretched state by the elastic force of the stretchable sheet 20. In this release step S14, the stretchable sheet 20 is removed from the fixing device 30 in the stretched state, or the stretched state is released together with the fixing device 30 by the elastic force of the stretchable sheet 20. In this release step S14, the distance (d2) between the light-emitting elements 1 after the stretched state of the stretchable sheet 20 is released is narrower than the distance (d1) between the light-emitting elements 1 mounted in the mounting step S12, and the distance (d2) between the light-emitting elements 1 of the light-emitting device 100 is set as the mounting distance. Here, the distance between the four light-emitting elements 1 in each set is narrowed to set the mounting distance of the light-emitting elements 1. In addition, in a state in which the stretched state is maintained, the distance between the light-emitting elements 1 of a set adjacent to the four light-emitting elements 1 is wider than the distance between the adjacent light-emitting elements 1 in one set, so that the four light-emitting elements 1 can be easily divided into one set when the stretched state is released. In this release step S14, it is preferable to set the mounting interval of each set of light emitting elements 1 via the first member 2A1 after the stretched state of the elastic sheet 20 is released to a range of 20 μm to 100 μm. It is preferable to carry out a step of hardening the supplied first member after the release step S14.

As described above, by forming the first member 2A1 between the light-emitting elements 1 while the elastic sheet 20 is stretched, the density of the light-emitting elements 1 can be increased, and even when mounted at high density, the elastic film can be stretched, so the thickness of the applied reflective resin can be reduced, and the first member 2A1 can be formed between the light-emitting elements 1 without air bubbles. In other words, when the light-emitting elements 1 are placed, there is a risk that they may collide with adjacent light-emitting elements, so the light-emitting elements must be spaced apart by a certain distance or more, but by using the elastic sheet, the light-emitting elements can be spaced closer together after being placed, so multiple light-emitting elements 1 can be placed at high density. In addition, it is difficult to place the first member 2A1 between adjacent light-emitting elements 1 when the elastic sheet 20 has returned to its original position, that is, when the spacing between adjacent light-emitting elements 1 is narrow, but if the elastic sheet 20 is stretched, the spacing between adjacent light-emitting elements is wide, so it is relatively easy to place the first member 2A between adjacent light-emitting elements 1. Therefore, it is possible to set a narrower mounting spacing than before. Even if the stretchable sheet 20 becomes slightly warped when the stretched state of the stretchable sheet 20 is released, this does not cause a problem because the stretchable sheet 20 is peeled off and transferred to the support substrate 21 during the manufacturing process of the light emitting device, as described below.

(Step of placing on supporting substrate)
Next, in the method for manufacturing the light emitting device, after forming the first member 2A1 between the light emitting elements in the light emitting device 100 with the mounting interval therebetween, the light emitting element 1 is placed on the support substrate 21 so that the surface opposite the element electrodes 11, 12 faces the support substrate 21, in step S15. In this step S15, first, with the light emitting element 1 placed on the stretchable sheet 20, the light emitting element 1 is placed on the support substrate 21 so that the wavelength conversion member 3 of the light emitting element 1 is adhered to the support substrate 21.
The support substrate 21 may be, for example, a polyimide film, a PET film, or the like.
The thickness of the support substrate 21 is, for example, preferably 5 μm or more and 300 μm or less, and more preferably 10 μm or more and 150 μm or less.

(Peeling process)
The peeling step S16 is a step of peeling off the elastic sheet 20 to expose the element electrodes 11, 12. In the peeling step S16, the elastic sheet 20 in contact with the element electrodes 11, 12 is peeled off with the wavelength conversion member 3 facing the support substrate 21, and the element electrodes are exposed upward. By performing this peeling step S16, the light emitting element 1 placed on the elastic sheet 20 is transferred by being placed in an inverted state on the support substrate 21. Therefore, the light emitting element 1 is placed on the support substrate 21 with the wavelength conversion member 3 of the light emitting element 1 facing the support substrate 21 and the element electrodes 11, 12 facing upward.

(Placement component molding process)
The arrangement member forming step S17 is a step of covering the light emitting element 1 with the arrangement member 2A so as to cover the element electrodes 11 and 12. In this arrangement member forming step S17, the entire light emitting element 1 including the element electrodes 11 and 12 is covered with the arrangement member 2A. In this step S17, when covering the light emitting element 1, for example, on the upper side of the fixed support substrate 21, a discharge device (dispenser) that can be moved (moved) in the vertical direction or horizontal direction relative to the support substrate 21 can be used. The light emitting element 1 can be covered by filling the support substrate 21 with a resin or the like that is the second member 2A2 constituting the arrangement member 2A using a discharge device. It is also possible to cover by a compression molding method, a transfer molding method, or the like. The second member (arrangement member) 2A2 used in the arrangement member forming step S17 may be the same member as the first member 2A1, and further, the amount of the reflective material contained may be different between the first member 2A1 and the second member 2A2.

(Device electrode exposure process)
The element electrode exposure step S18 is a step of polishing or grinding the arrangement member 2A to expose the element electrodes 11, 12. In the element electrode exposure step S18, when a part of the arrangement member 2A is polished or the like to expose the bottom surfaces of the element electrodes 11, 12, the work may be performed by moving the support substrate 21, the work may be performed by fixing the support substrate 21 and moving the polishing mechanism side, or the work may be performed by moving both the support substrate and the polishing mechanism. After the element electrode exposure step S18 is completed, it is preferable to perform a step of washing the polished arrangement member 2A with a shower or a step of blowing it off with a blower to remove polishing powder.

(Support substrate peeling process)
The support substrate peeling step S19 is a step of polishing the arrangement member 2A to expose the element electrodes 11 and 12, and then peeling off the support substrate 21. In the support substrate peeling step S19, the arrangement member 2A and the support substrate 21 may be pressed from the outside to peel off the support substrate 21 by mechanical force, or the support substrate 21 may be peeled off from the arrangement member 2A and the wavelength conversion member 3 side of the light emitting element 1 by irradiating ultraviolet light of a predetermined wavelength.

(Singulation process)
The singulation step S20 is a step of singulating the light-emitting elements 1 into groups of a preset number. In this singulation step S20, the molded body having the element electrodes 11, 12 exposed in predetermined regions is cut along the cutting lines 15 to obtain individual light-emitting devices 100. The cutting can be performed by a conventionally known method, such as a dicing method in which cutting is performed with a blade. Here, the singulation step S20 results in a light-emitting device 100 having four light-emitting elements 1.

Second Embodiment
[Light-emitting device]
Next, a light emitting device according to a second embodiment and a method for manufacturing the same will be described.
First, the light emitting device will be described mainly with reference to FIG. 4 and also with reference to FIGS. 6A to 6E2 as appropriate.
FIG. 4 is a perspective view illustrating a light emitting device according to the second embodiment.
The light emitting device 100B includes a stretchable sheet 20B, wiring 40, a light emitting element 1, a placement member 2B, and a wavelength conversion member 3. This light emitting device 100B differs from the first embodiment in that the wiring 40 is formed on the stretchable sheet 20B and used as a substrate for the light emitting device 100B.

The elastic sheet 20B can be the same as the elastic sheet 20 described in the first embodiment. Although the arrangement of the light-emitting element 1 is different, the light-emitting element 1 and the wavelength conversion member 3 can be the same as those described in the light-emitting device 100 of the first embodiment. Furthermore, the arrangement member 2B can be the same as that used in the first embodiment, although the arrangement of the first member 2B1 and the second member 2B2 is different.
The light emitting elements 1 are arranged in a line in a straight line, and are arranged via the first member 2B1 so that the spacing between the light emitting elements 1 is 20 μm or more and 100 μm or less. If the spacing between the light emitting elements 1 is 20 μm or more, the stretchable sheet 20B can be stretched over a wide distance, making it easier to form the first member 2B1 and easier to manufacture the light emitting device 100B. On the other hand, if the spacing between the light emitting elements 1 is 100 μm or less, the light emitting elements 1 can be arranged at a high density, and the light emitting device 100B can be made smaller.

(wiring)
The wiring 40 is formed by forming a pair of wiring patterns 41 in a plurality of pairs. The pair of wiring patterns 41 is arranged on the elastic sheet 20 with a predetermined interval between two linear wiring parts 42, 43 so that their ends face each other. Then, wiring pads 42b, 43b with a wiring area wider than the linear part are formed at the opposing ends of the wiring parts 42, 43. Here, the wiring 40 is formed such that four pairs of wiring patterns 41 are provided in parallel, and the areas for mounting the light-emitting element 1 are arranged in parallel at equal intervals. The pair of wiring patterns 41 is such that one element electrode 11 of the light-emitting element 1 is bonded to one wiring pad 42b, and the other element electrode 12 of the light-emitting element 1 (see FIG. 6C) is bonded to the other wiring pad 43b. As a result, the light-emitting element 1 is placed in parallel across the pair of wiring patterns 41.
The wiring 40 may be made of a metallic material such as copper, a conductive paste, a stretchable paste, or the like. This allows the electrical connection between the electrodes 11, 12 and the wiring pads 42b, 43b to be maintained even if the spacing between the wiring pads 42b, 43b expands or contracts. It is preferable to use a stretchable paste for the wiring 40.
In the light emitting device 100B having such a configuration, the light emitting elements 1 can be easily seen when they are turned on independently, and it is possible to realize a compact device. In addition, since the stretchable sheet 20B stretches in only one direction, the difference in the distance between the light emitting elements 1 can be reduced.

[Method of manufacturing the light-emitting device]
Next, an example of a method for manufacturing a light emitting device will be described with reference to FIGS.
FIG. 5 is a flow chart showing the procedure of the method for manufacturing the light emitting device according to the second embodiment. FIG. 6A is a plan view showing a state in which wiring is formed on a stretchable sheet with a stretchable material in the method for manufacturing the light emitting device according to the second embodiment. FIG. 6B is a plan view showing a state in which the stretchable sheet on which wiring is formed is stretched in the method for manufacturing the light emitting device according to the second embodiment. FIG. 6C is a plan view showing a state in which light emitting elements are placed on wiring in the method for manufacturing the light emitting device according to the second embodiment. FIG. 6D1 is a plan view showing a state in which a placement member is supplied between the light emitting elements and around the light emitting elements in the method for manufacturing the light emitting device according to the second embodiment. FIG. 6D2 is a cross-sectional view taken along the line VIDII-VIDII in FIG. 6D1. FIG. 6E1 is a perspective view showing a state in which the stretchable sheet is released from tension in the method for manufacturing the light emitting device according to the second embodiment. FIG. 6E2 is a cross-sectional view taken along the line VIEII-VIEII in FIG. 6E1.

In the second embodiment, the stretchable sheet 20B used in the light emitting device becomes the substrate of the light emitting device 100B. The method for manufacturing the light emitting device includes a wiring formation process S2, a stretching process S21, a placement process S22, a supplying process S23, and a release process S24, which are performed in this order. Each process will be described below. Note that the description of the same processes as in the first embodiment may be omitted as appropriate.

First, the wiring formation step S2 is a step of forming wiring 40 on the stretchable sheet 20B. Here, in the wiring formation step S2, a pair of wiring patterns 41 each having an area for mounting the light-emitting element 1 is formed at equal intervals so that the areas for mounting the light-emitting element 1 are arranged in parallel.
In the wiring formation step S2, a pair of wiring patterns 41 each having an area for mounting the light emitting element 1 are formed at equal intervals so that the areas for mounting the light emitting element 1 are arranged in parallel.
Specifically, two linear wiring parts 42, 43 are arranged on the stretchable sheet 20B with a predetermined gap between them so that their ends face each other, forming four pairs of wiring patterns 41. Note that wiring pads 42b, 43b, whose wiring area is wider than that of the linear parts, are formed on the opposing ends of the wiring parts 42, 43. The element electrodes 11, 12 of the light-emitting element 1 are electrically connected to the wiring pads 42b, 43b.
The wiring 40 can be formed, for example, by bonding copper foil to the surface of the stretchable sheet 20B and performing etching, or by applying a conductive paste or a stretchable paste to the surface of the stretchable sheet 20B.

In addition, in the wiring formation process S2, the wiring 40 can be formed on the lower surface of the stretchable sheet 20B. The wiring 40 has a via that penetrates the stretchable sheet 20B in the area where the light-emitting element 1 is placed, and the wiring pattern extending along the lower surface of the stretchable sheet 20B is electrically connected to the element electrode of the light-emitting element 1 through the penetrating via. A wiring pad can also be formed on the upper surface of the stretchable sheet 20B, and the wiring pad and the element electrode of the light-emitting element can be electrically connected.

The width (line) of the pair of wiring patterns 41, i.e., the width of one wiring portion 42, 43, is preferably 20 μm or more and 500 μm or less. If the width of the pair of wiring patterns 41 is 20 μm or more, it becomes easier to place the light-emitting element 1 on the pair of wiring patterns 41. On the other hand, if the width of the pair of wiring patterns 41 is 500 μm or less, it becomes easier to adjust the mounting interval of the light-emitting element 1 after the stretched state is released. The width of the pair of wiring patterns 41 is more preferably 50 μm or more and 200 μm or less.
The pattern width (space) between the pair of wiring patterns 41 is preferably 20 μm or more and 500 μm or less. If the pattern width is in this range, it becomes easy to adjust the mounting interval of the light-emitting elements 1 after the stretched state is released. The pattern width is more preferably 50 μm or more and 200 μm or less.
6D2 and 6E2, in the light emitting device 100B, the distance (d2) between the light emitting elements after the stretched state of the elastic sheet 20B is released is narrower than the distance (d1) between the light emitting elements 1 immediately after the light emitting elements 1 are placed, and the distance (d2) between the light emitting elements of the light emitting device 100B is set as the mounting distance. Therefore, the width and pattern width of the wiring pattern 41 are set so as to be within the range of the mounting distance between the light emitting elements 1.

(Stretching process)
The stretching step S21 is a step of stretching the stretchable sheet 20B against the elastic force. In this stretching step S21, the stretchable sheet 20B is attached to a fixing device 31B, and the fixing device 31B stretches the stretchable sheet 20B. In this stretching step S21, the stretchable sheet 20B may be stretched in either one of two directions along the X direction, or one of two directions along the Y direction perpendicular to the X direction. By stretching in this way, the stretchable sheet 20B is stretched in only one direction, so that the difference in the interval between the light-emitting elements 1 can be reduced.
Furthermore, in the stretching step S21, the stretchable sheet 20B may be stretched in a radial direction from the center of the stretchable sheet 20B.
In addition, in the stretching process S21, the elastic sheet 20B may be stretched in four directions: two directions along the X direction, one (X-positive direction) and the other (X-negative direction), and two directions along the Y direction, one (Y-positive direction) and the other (Y-negative direction), which is perpendicular to the X direction.
Here, the stretchable sheet 20B is stretched in four directions: two directions along the X direction (X plus direction) and the other direction (X minus direction), and two directions along the Y direction perpendicular to the X direction (Y plus direction) and the other direction (Y minus direction). In the stretching step S21, the wiring 40 also stretches together with the stretching of the stretchable sheet 20B, so that the wiring is not broken by the stretching of the stretchable sheet 20B.

In this stretching step S21, a fixing device 31B is attached to a predetermined region of the stretchable sheet 20B, the stretchable sheet 20B is stretched by the fixing device 31B against the elastic force, and the stretchable sheet 20B in the stretched state is fixed to the fixing device 31B. Alternatively, the stretchable sheet 20B may be fixed to the fixing device in the stretched state.
Specifically, the elastic sheet 20B is fixed to the fixing fixture 31B in a stretched state in which the elastic sheet 20B is stretched in two opposing directions so that the gap between a pair of adjacent wiring patterns 41 is widened.
The elastic sheet 20B can be fixed in a stretched state by pushing up the elastic sheet from the back side of the elastic sheet 20B with a pushing-up member of the fixing device 31B, and then fixing the pushed-up portion from the front side of the elastic sheet 20B with a fixing member of the fixing device 31B.
Here, both left and right sides of the wiring 40 are pushed up, thereby stretching the stretchable sheet 20B in two directions, left and right.

(Placement process)
The placing step S22 is a step of placing the light-emitting element 1 at a distance on the wiring 40 formed on the stretchable sheet 20B in a state in which the stretchable sheet 20B is stretched against the elastic force. Here, the light-emitting element 1 is mounted so that the element electrodes 11, 12 are electrically connected to the opposing wiring pads 42b, 43b of the wiring 40. In the placing step S22, the light-emitting elements 1 are placed so that the spacing between adjacent light-emitting elements 1 is the same and within a range of 100 μm to 500 μm.

The spacing between a pair of adjacent wiring patterns 41 is adjusted in the placement process S22 in which the light-emitting elements 1 are placed so that the spacing between the light-emitting elements 1 is within a desired range. The spacing between a pair of adjacent wiring patterns 41 can be adjusted by the amount of stretch of the stretchable sheet 20B, and the amount of stretch of the stretchable sheet 20B can be adjusted by the height of the push-up by the push-up member 31a.

In addition, when the distance between the light-emitting elements 1 in the light-emitting device 100B is 100 μm or less, the stretch width in two opposing directions when the stretchable sheet 20B is stretched is preferably 100 μm or more and 500 μm or less. If the stretch width is 100 μm or more, it becomes easier to place the light-emitting element 1 on the stretchable sheet 20B. On the other hand, if the stretch width is 500 μm or less, it is possible to suppress the occurrence of distortion in the mounting portion of the light-emitting element 1. The stretch width is more preferably 100 μm or more and 300 μm or less.

In the placement process S22, the element electrodes 11, 12 of the light-emitting element 1 are placed and connected to the wiring pads 42b, 43b so as to straddle the pair of wiring patterns 41. The light-emitting element 1 is connected to the wiring pads 42b, 43b, and is arranged in parallel on the wiring pattern 41. Here, as an example, four light-emitting elements 1 are placed in parallel. In this placement process S22, the light-emitting elements 1 are placed so that the distance between the light-emitting elements 1 is, for example, 100 μm or more and 500 μm or less.

(Supply process)
The supply step S23 is a step of supplying the first member 2B1 on the elastic sheet 20B so as to face at least a part or all of the side surface of the light emitting element 1. In this supply step S23, the first member 2B1 to be the arrangement member 2B is supplied between the light emitting elements 1, for example, via a supply nozzle. The supply amount of the first member 2B1 supplied in the supply step S23 is set here so that the height is equal to the height of the light emitting element 1 when the stretch of the elastic sheet 20B is released. The arrangement member 2B only needs to cover at least a part of the side surface of the light emitting element 1, but it is preferable that the height of the arrangement member 2B is at least higher than the light emitting layer of the light emitting element 1. In the supply step S23, as shown in FIG. 6D1 and FIG. 6D2, the first member is supplied in a state of abutting (contacting) the side surface so as to face at least a part of the side surface of the light emitting element 1 at a position where the side surfaces of the light emitting elements 1 face each other.

Furthermore, in the supply step S23, the second member 2B2 may be supplied in a frame shape around the light-emitting elements 1 arranged in a row. The second member 2B2 used here is the same member as the first member 2B1. The second member 2B2 is supplied facing the side of the light-emitting element with a gap therebetween. In this supply step S23, it is known in advance how the gap between the light-emitting element 1 and the first member 2B1 and the second member 2B2 supplied when the stretchable sheet 20B is in a predetermined stretched state will be formed when the stretched state is released. Therefore, the supply amount of the first member 2B1 and the gap between the second member 2B2 and the side of the light-emitting element 1 are set in advance to be appropriate for the mounting gap. In the supply step S23, the first member 2B1 is supplied when the gap between the light-emitting elements 1 is wider than the mounting gap, so that no air bubbles will get inside.

(Release process)
The release step S24 is a step of releasing the stretched state by the elastic force of the stretchable sheet 20B. In this release step S24, the stretchable sheet 20B is removed from the fixing fixture 31B in the stretched state, and the stretched state is released by the elastic force of the stretchable sheet 20B. Specifically, the stretched state of the stretchable sheet 20B is released by removing the fixing member of the fixing fixture 31B and returning the pushing up of the pushing up member to its original state. By removing the fixing fixture 31B and releasing the stretched state, the distance (d2) between the light-emitting elements 1 after the stretched state of the stretchable sheet 20B is released is narrower than the distance (d1) between the light-emitting elements 1 immediately after the light-emitting elements 1 are placed, and the distance (d2) between the light-emitting elements 1 is set to the mounting distance in a state where the first member 2B1 is interposed. In addition, the second member 2B2 is in a state of abutting against the side surface of the light-emitting element 1, and the periphery of the four light-emitting elements 1 is in a frame-like state. As a result, a light-emitting device 100B including four light-emitting elements 1 is obtained. Furthermore, it is preferable to carry out a step of hardening the first member 2B1 and the second member 2B2 after the releasing step S24.

After the formation of the first member 2B1 in the supplying step S23, the second member 2B2 may not be formed, and the second member 2B2 may be formed after the releasing step S24. When the second member 2B2 is formed after the releasing step S24, the second member 2B2 may be supplied in a frame shape around the light-emitting element 1 as in the supplying step S23, or may be formed by pouring the second member 2B2 using a frame-shaped tool of a desired shape. In addition, in the supplying step S23, the first member 2B1 may be supplied not only between the light-emitting elements 1 but also to the side surfaces of the light-emitting elements 1 at both ends of the light-emitting device 100B, and the second member 2B2 may be supplied in a frame shape around the light-emitting element 1 after the releasing step S24. When the first member 2B1 is supplied to the side surfaces of the light-emitting elements 1 at both ends of the light-emitting device 100B, it is likely to be formed with a lower height than the first member 2B1 between the light-emitting elements 1. In that case, the shape of the light-emitting device 100B can be adjusted by supplying the second member 2B2 after the releasing step S24.

<First Modification of First Embodiment>
Next, a first modification of the light emitting device according to each embodiment will be described.
The light emitting device 100C may be configured to include three light emitting elements 1. In the light emitting device 100C, the light emitting elements 1 may be arranged so that the light emitted from the light emitting elements 1 is RGB. A first member 2C1 is formed between the light emitting elements 1 at positions where the light emitting elements 1 face each other, and a second member 2C2 is provided around the light emitting elements 1. Here, the arrangement member 2C is formed by the first member 2C1 and the second member 2C2.
In the light emitting device 100C, three light emitting elements 1 are arranged so that a line virtually connecting the centers of the three light emitting elements 1 forms a triangle. That is, in the light emitting device 100C, two of the three light emitting elements 1 are placed in parallel, and the remaining one is placed to the side of each of the two light emitting elements 1.

The three light emitting elements 1 are a first semiconductor element that emits red light, a second semiconductor element that emits blue light, and a third semiconductor element that emits green light. Such a light emitting device 100C enables full color display using RGB.
The light emitting element 1 for blue (light with a wavelength of 430 to 490 nm) and green (light with a wavelength of 495 to 565 nm) can be made of a nitride-based semiconductor ( _{InXAlYGa1 -X-YN ,} 0≦X, 0≦Y, X+Y≦1), GaP, etc. The light emitting element 1 for red (light with a wavelength of 610 to 700 nm) can be made of GaAlAs, AlInGaP, etc. in addition to a nitride-based semiconductor element.
Such a light emitting device 100C can be manufactured by the same steps as those of the manufacturing method for the light emitting device already described (see, for example, FIG. 2 and FIG. 3A to FIG. 3H2).

<First Modification of Supplying Step>
In each embodiment, a first modified example of the supplying step will be described with reference to FIGS. 8A to 8C, and a second modified example of the supplying step will be described with reference to FIGS. 9A and 9B.
In a first modified example of the supplying step, the first member 2D1 is supplied to fill the gap between the light emitting elements 1 placed on the stretched stretchable sheet 20. Then, in the releasing step, the stretching of the stretchable sheet 20 is released to set the gap between the light emitting elements 1 to the mounting gap. When the stretching of the stretchable sheet 20 is released in the releasing step, the first member 2D1 is pushed by the side of the light emitting elements 1 between the light emitting elements 1, overflowing from between the light emitting elements 1 and covering the upper surface of the wavelength conversion member 3. Then, by performing a new polishing step, the first member 2D1 covering the wavelength conversion member 3 is removed, and the first member 2D1 is filled in the gap that is the mounting gap between the light emitting elements 1. In this way, in the supplying step, the stretchable sheet 20 is stretched to supply the first member 2D1 between the light emitting elements 1, and the overflowing member on the wavelength conversion member 3 side is polished, so that the wavelength conversion member 3 is exposed and the first member 2D1 can be formed between the light emitting elements 1. In the supply step, by performing the first member polishing step of polishing the first member after the release step, it becomes unnecessary to strictly adjust the supply amount of the first member 2D1 in advance.

<Second Modification of Supplying Step>
Next, a description will be given of a case where the first member 2E1 is supplied close to the side of the light-emitting element 1 in the manufacturing method of the light-emitting device according to each embodiment. When the first member (placement member) 2E1 is placed close to the side of the light-emitting element 1, the stretchable sheet 20 is stretched and the first member 2E1 having a certain degree of viscosity is placed at a preset position with a distance d1. Then, by releasing the stretchable sheet 20, the distance between the first member 2E1 and the side of the light-emitting element 1 is shortened and the first member 2E1 can be placed close to the side of the light-emitting element 1. It is preferable that the height of the first member 2E1 is at least higher than the light-emitting layer of the light-emitting element 1. In this way, by forming a light-emitting device while maintaining the first member 2E1 and the side of the light-emitting element 1 in a state where they are close to each other without abutting (contacting each other), light from the light-emitting device can be irradiated from the side of the light-emitting element, and light extraction can be improved. When attempting to supply the first member close to the side of the light-emitting element 1 without covering it, it is difficult to suppress the wetting and spreading to the side of the light-emitting element 1 unless the first member is supplied at a position somewhat separated from the light-emitting element 1. However, by using the stretchable sheet 20 , it becomes possible to place it closer to the side surface of the light emitting element 1 .

The light emitting device can be configured so that the first member 2E1 or the second member 2E2 does not come into contact with the side of the light emitting element 1 when the stretchable sheet is released, whether the light emitting element 1 is one or multiple. In addition, in the supplying step of supplying the first member 2E1, as an example, the first member 2E1 is supplied so that the distance between the light emitting element 1 and the first member 2E1 is 200 μm or more and 500 μm or less, and in the releasing step S14 of releasing the stretched state of the stretchable sheet 20, the mounting distance between the light emitting element 1 and the first member 2E1 is set to 50 μm or more and 200 μm or less.

<Method of manufacturing light emitting device according to second modified example of supplying step>
Next, an example of a method for manufacturing a light emitting device according to a second modified example of the supplying step will be described with reference to FIGS. 10A to 10F.
Fig. 10A is a plan view of a stretchable sheet used in a manufacturing method of a light-emitting device according to another embodiment. Fig. 10B is a plan view showing a state in which wiring is formed on the stretchable sheet of Fig. 10A. Fig. 10C is a plan view showing a state in which a light-emitting element is placed on the wiring in Fig. 10B. Fig. 10D is a plan view showing a state in which the stretchable sheet in Fig. 10C is stretched with the light-emitting element placed on the wiring. Fig. 10E is a plan view showing a state in which a first member is supplied to the side of the side surface of the light-emitting element of the stretched stretchable sheet in Fig. 10D. Fig. 10F is a plan view showing a state in which the stretchable sheet is released from the stretched state in Fig. 10E, and the first member is placed facing the side of the light-emitting element with a narrow gap.

As shown in Figures 10A to 10F, the first member 2F1 may be arranged close to the four sides of the light-emitting element 1 with a predetermined interval between them. An example of a method for manufacturing a light-emitting device according to the second modified example of the supplying step includes the steps of: drawing wiring on a stretchable sheet and placing the light-emitting element thereon; stretching the stretchable sheet on which the light-emitting element is placed using a fixing device or fixing the stretched stretchable sheet with a fixing device; supplying the first member 2F1 onto the stretched stretchable sheet; and releasing the stretching of the stretchable sheet. It is preferable that the step of releasing the stretching of the stretchable sheet is performed after the shape of the first member 2F1 has stabilized.

In this embodiment, first, the elastic sheet 20F is prepared and the wiring 40F is formed on the upper surface of the elastic sheet 20F. As already described, the wiring 40F is preferably formed of a material having elasticity. After forming the wiring 40F, the light-emitting element 1 is electrically connected to the wiring 40F. Then, the elastic sheet 20F with the light-emitting device 1 connected to the wiring is stretched as already described. Furthermore, the first member 2F1 is supplied to the stretched elastic sheet 20F with a preset interval (d1). Here, the first member 2F1 is supplied to the four side surfaces of the light-emitting element 1 with the same interval (d1). After that, by releasing the stretched state of the elastic sheet 20F, the light-emitting element 1 and the first member 2F1 become the mounting interval (d2), and it is possible to form the first member 2F1 facing the vicinity of the side surface of the light-emitting element 1, and the light-emitting device 100F can be formed. In this way, the manufacturing method for a light emitting device is also effective when there is a large gap between the light emitting elements 1 and it is desired to place the first member 2F1 close to the four side surfaces of the light emitting element 1.

<Application Example 1 of the embodiment>
Next, a description will be given of an example of a method for manufacturing a light emitting device according to Application Examples 1 to 8 of the embodiment. In Application Examples 1 to 8 below, the same effect can be achieved by switching the order of the steps already described or by adding a new step to the order of the steps already described.
The manufacturing method of the light emitting device according to the application example 1 of the embodiment includes the stretching step S11, the placing step S12, the supplying step S13, and the releasing step S14 described in the manufacturing method of the light emitting device according to the first embodiment, and further includes the step S15 of placing on a supporting substrate, and the peeling step S16 of peeling off the stretchable sheet 20 to expose the element electrodes, which are performed in this order. That is, the light emitting device has the supporting substrate 21, does not have the arrangement member 2A, and is a non-individualized light emitting device.

<Application Example 2 of the embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Example 2 of the embodiment will be described.
The manufacturing method of the light emitting device according to the second application example of the embodiment includes the stretching step S11, the placing step S12, the supplying step S13, the releasing step S14, the arrangement member forming step S17, the peeling step S16 for peeling off the elastic sheet, and the singulation step S20, which are described in the manufacturing method of the light emitting device according to the first embodiment, and are performed in this order. In the arrangement member forming step S17, the arrangement member 2A as the second member 2A2 provided on the periphery of the light emitting element 1 is filled to a height that exposes the element electrodes 11 and 12, so that a polishing step is not required. In other words, by supplying the second member 2A2 while sandwiched between the elastic sheet and the support substrate before performing the peeling step S16, the side of the light emitting element 1 can be covered without covering the back surface of the element electrodes 11 and 12 and the upper surface of the wavelength conversion member 3 with the second member 2A2. In addition, if the upper surface of the wavelength conversion member 3 is covered with the arrangement member 2A, the arrangement member 2A can be removed by polishing or the like to expose the upper surface of the wavelength conversion member 3. As a result, a light emitting device 100 including three light emitting elements 1 or four light emitting elements 1 is obtained.

<Application Example 3 of the embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Example 3 of the embodiment will be described.
The manufacturing method of the light emitting device according to the application example 3 of the embodiment includes, after performing the stretching process S11, the placing process S12, the supplying process S13, and the releasing process S14, a placement member molding process S17 in which the light emitting element 1 is covered with the placement member 2A (second member), and then, the singulation process S20 and the peeling process S16 in which the elastic sheet is peeled off are performed in this order.
In the manufacturing method of the light emitting device according to the application example 3 of the embodiment, a singulation step S20 of singulation is performed before the peeling step S16 of peeling off the stretchable sheet to expose the electrodes in the manufacturing method of the light emitting device according to the application example 2 of the embodiment. Note that in the singulation step S20, the stretchable sheet 20 may or may not be cut.

<Application Example 4 of the embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Example 4 of the embodiment will be described.
The manufacturing method of the light emitting device according to the application example 4 of the embodiment includes steps S11 to S14, a placement member forming step S17 for covering the light emitting element 1 with a placement member 2A (second member), and a peeling step S16 for peeling off the stretchable sheet 20 to expose the element electrodes 11 and 12, and is performed in this order. In other words, the light emitting device is made from a non-individualized product.

<Application Example 5 of the Embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Example 5 of the embodiment will be described.
The manufacturing method of the light emitting device according to the application example 5 of the embodiment includes a stretching process S11, a placing process S12 in which the light emitting element 1 is placed on the stretched elastic sheet 20 so that the wavelength conversion member 3, which is the side opposite to the side having the element electrodes 11, 12, faces the stretchable sheet 20, a supplying process S13, and a releasing process S14 in which the stretched state is released by the elastic force of the stretchable sheet 20, which are performed in this order.

The manufacturing method of the light emitting device includes a step S15 of placing the light emitting element 1 on the support substrate 21 so that the element electrodes 11, 12 face the support substrate 21, a peeling step S16 of peeling off the elastic sheet, a placement member forming step S17 of covering the light emitting element 1 with a placement member 2A (second member), a support substrate peeling step S19 of peeling off the support substrate 21, and a singulation step S20 of singulating the light emitting element 1, which are performed in this order. If the upper surface of the wavelength conversion member 3 is covered with the placement member 2A, the placement member 2A may be removed by polishing or the like to expose the upper surface of the wavelength conversion member 3. This results in a light emitting device 100 having three light emitting elements 1 or four light emitting elements 1.

<Application Example 6 of the embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Example 6 of the embodiment will be described.
The manufacturing method of a semiconductor device according to application example 6 of the embodiment includes a process S15 of placing the light-emitting element 1 on the support substrate 21 so that the element electrodes 11, 12 face the support substrate 21, a peeling process S16 of peeling off the elastic sheet, a placement member molding process S17 of covering the light-emitting element 1 with a placement member 2A, and a singulation process S20, which are performed in this order.
In the manufacturing method of the light emitting device according to the application example 6 of the embodiment, the support substrate peeling step S19 for peeling off the support substrate is not performed, and the light emitting elements 1 are singulated on the support substrate 21. In the singulation step S20, the support substrate 21 may or may not be cut. Also, the support substrate 21 may be peeled off after the singulation step S20.

<Application Example 7 of the embodiment>
Next, an example of a manufacturing method of a semiconductor device according to Application Example 7 of the embodiment will be described. The manufacturing method of the light emitting device includes, after performing the stretching step S11 to the releasing step S14, a mounting step S15 of mounting the light emitting element 1 on the support substrate 21 so that the element electrodes 11, 12 face the support substrate 21, a placement member forming step S17 of forming a placement member 2A covering the side surface of the light emitting element 1 between the support substrate 21 and the elastic sheet 20, a support substrate peeling step S19 of peeling off the support substrate 21, a peeling step S16 of peeling off the elastic sheet 20, and a singulation step S20 of singulating the light emitting element 1, which are performed in this order.

In the placement member molding step S17, a placement member 2A (second member) is filled between the support substrate 21 and the stretchable sheet 20 so as to cover the side surface of the light emitting element 1. The light emitting element 1 can be covered by supplying the placement member, which is the second member, from between the support substrate 21 and the stretchable sheet 20 using a nozzle to fill the second member between the support substrate 21 and the stretchable sheet 20. All other matters are similar to the manufacturing method of the light emitting device according to the application example 6 of the embodiment, except for the process order.
As a result, a light emitting device 100 having three light emitting elements 1 and four light emitting elements 1 is obtained.

<Application Example 8 of the embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Example 8 of the embodiment will be described.
The manufacturing method of the light-emitting device according to application example 8 of the embodiment includes a supporting substrate mounting step S15 in which the light-emitting element 1 is placed on the supporting substrate 21 so that the element electrodes 11, 12 face the supporting substrate 21, a placement member molding step S17 in which a placement member 2A covering the side surface of the light-emitting element 1 is placed between the supporting substrate 21 and the stretchable sheet 20, a peeling step S16 in which the stretchable sheet is peeled off, and a singulation step S20 in which the light-emitting element 1 is singulated, which are performed in this order.
In the manufacturing method of the light emitting device according to the application example 8 of the embodiment, the support substrate peeling step S19 for peeling off the support substrate 21 is not performed, and instead, a singulation step S20 for singulating the light emitting elements 1 on the support substrate 21 is performed. Note that in the singulation step S20, the support substrate 21 may or may not be cut. Also, the support substrate 21 may be peeled off after the singulation step S20.

<Manufacturing Method of Other Embodiments>
The stretchable sheet used in each embodiment may have wiring 40G formed on the lower surface of a stretchable sheet 20G as shown in Fig. 11. Fig. 11 is an explanatory diagram showing a schematic cross section of a configuration in which wiring is formed on the lower surface of a stretchable sheet in each embodiment.
For example, the elastic sheet 20G can be formed so that wiring 40G is formed on the lower surface and electrically connected to the element electrodes 11 and 12 of the light-emitting element 1 through via wiring 40g1 and 40g2 provided to penetrate the elastic sheet 20G. Here, the via wiring 40g1 and 40g2 are connected to the element electrodes 11 and 12 through wiring pads 41G formed on the upper surface of the elastic sheet. In addition, when the first member 2G1 is supplied, it may be supplied so as not to abut against the light-emitting element 1, and abut against the light-emitting element 1 after the stretching is released, or it may be supplied so as not to abut against the light-emitting element 1, and the first member (placement member) 2G1 may be placed close to the side of the light-emitting element 1.

As described above, in each embodiment, each application example, and each modified example, as described above, regardless of the number of sets of light-emitting elements 1, or even if there are no sets, a light-emitting device can be constructed in the same manner, or a light-emitting device can be manufactured by the manufacturing method thereof.
Furthermore, the light-emitting element 1 may have other shapes, such as a triangle, a trapezoid, a rhombus, or a circle.
Also, for example, in the placement process S11 in which the light-emitting element is placed, the elastic sheet 20 may be stretched in either of two directions, one along the X direction and the other, or in two directions, one along the Y direction perpendicular to the X direction.

In addition, in the placing step S11 of placing the light emitting element 1, the stretchable sheet 20 may be stretched in the radial direction from the center of the stretchable sheet 20.
Also, for example, in the element electrode exposing step S18 of polishing to expose the electrodes, the support substrate 21 may be peeled off, and the molded body covered with the arrangement member 2A may be placed on another support substrate and then polished.
Furthermore, the method for mounting a semiconductor element and the method for manufacturing a semiconductor device may include other steps between, before, or after each of the steps, as long as they do not adversely affect the steps. For example, a foreign matter removal step for removing foreign matter that has been mixed in during the manufacturing process may be included.

Furthermore, if the placement member is on the side of the side of the light-emitting element, it can be used as an underfill by stretching the stretchable sheet between the light-emitting elements. In other words, as long as the placement member is on the side of the side of the light-emitting element, there is no restriction on the height or amount of the placement member that is supplied. In addition, it is preferable that the first member is supplied when the stretchable sheet is stretched, but the second member may be formed after the stretched state of the stretchable sheet is released. In other words, when the second member is supplied, there is a sufficient area between the light-emitting element and the second member, so it is easy to place the second member in the desired position. However, when the second member is placed close to the side of the side of the light-emitting element, it is preferable that the second member is supplied when the stretchable sheet is stretched.

1 Light emitting element 2A, 2B Arrangement member 2A1, 2B1, 2C1, 2D1, 2E1, 2F1, 2G1 First member 2A2, 2B2, 2C2, 2E2 Second member 3 Wavelength conversion member 11, 12 Element electrode 15 Cutting line 20, 20B, 20F, 20G Elastic sheet 21 Support substrate 30, 31B Fixing device 40, 40F, 40G Wiring 41 Pair of wiring patterns 42, 43 Wiring section 100 Light emitting device S11 Stretching process S12 Placement process S13 Supply process S14 Release process S15 Placement on support substrate process S16 Peeling process S17 Arrangement member forming process S18 Element electrode exposure process S19 Support substrate peeling process S20 Singulation process

Claims (22)

Stretching the stretchable sheet against an elastic force;
placing at least one light emitting element in a predetermined area of the stretchable sheet in a stretched state;
supplying a first member to a side of a side surface of the light emitting element on the stretchable sheet;
and releasing the stretched state by the elastic force of the stretchable sheet. The method for manufacturing a light-emitting device according to claim 1, wherein the distance between the at least two light-emitting elements after the step of releasing the stretched state is narrower than the distance between the at least two light-emitting elements during the step of placing the light-emitting elements. The method for manufacturing a light-emitting device according to claim 1 or 2, wherein the step of supplying the first member includes supplying the first member so that the first member abuts against a side surface of the light-emitting element after the stretched state is released. The method for manufacturing a light-emitting device according to claim 1 or 2, wherein the step of supplying the first member is such that the first member is supplied so as not to come into contact with the side surface of the light-emitting element after the stretched state is released. The method for manufacturing a light-emitting device according to claim 1 or 2, wherein the step of supplying the first member includes supplying the first member to the side of the light-emitting element in contact with the side of the light-emitting element. The method for manufacturing a light-emitting device according to claim 1 or 2, wherein the step of supplying the first member includes supplying the first member to the side of the light-emitting element with a gap therebetween. In the step of placing the light-emitting element, the stretchable sheet is attached to a fixing tool and stretched by the fixing tool to stretch the stretchable sheet against an elastic force;
7. The method for manufacturing a light emitting device according to claim 1, wherein in the step of releasing the stretched state, the stretchable sheet is released from the tensioned state by the elastic force of the stretchable sheet by removing the stretchable sheet from the fixing device. In the step of placing the light emitting element, the stretchable sheet is stretched, and the stretchable sheet is fixed to a fixing tool in the stretched state;
7. The method for manufacturing a light emitting device according to claim 1, wherein in the step of releasing the stretched state, the stretchable sheet is released from the tensioned state by the elastic force of the stretchable sheet by removing the stretchable sheet from the fixing device. The method for manufacturing a light-emitting device according to any one of claims 1 to 8, wherein in the step of placing the light-emitting element, the stretchable sheet is stretched in either one of two directions along the X direction, or one of two directions along the Y direction perpendicular to the X direction. The method for manufacturing a light-emitting device according to any one of claims 1 to 8, wherein in the step of placing the light-emitting element, the stretchable sheet is stretched in four directions: two directions along the X direction, one along the Y direction, and two directions along the Y direction perpendicular to the X direction. The method for manufacturing a light-emitting device according to any one of claims 1 to 6, wherein the stretchable sheet is stretched in a radial direction from the center of the stretchable sheet in the process of placing the light-emitting element. The step of mounting the light-emitting elements includes mounting the light-emitting elements of each group in a row and column direction, with four of the light-emitting elements being one group;
12 . The method for manufacturing a light emitting device according to claim 1 , wherein the step of releasing the stretched state narrows the intervals between the four light emitting elements in each set to match the mounting intervals of the light emitting elements. The step of mounting the light-emitting elements includes mounting the light-emitting elements at positions where lines connecting the centers of the three light-emitting elements of each set of three light-emitting elements form a triangle,
12 . The method for manufacturing a light emitting device according to claim 1 , wherein the step of releasing the stretched state narrows a space between the three light emitting elements in each set to a mounting space between the light emitting elements. The method for manufacturing a light-emitting device according to claim 13, wherein each set of three light-emitting elements is a first light-emitting element that emits blue light, a second light-emitting element that emits green light, and a third light-emitting element that emits red light. The step of mounting the light-emitting elements includes mounting the light-emitting elements such that the distance between the light-emitting elements is 100 μm or more and 500 μm or less;
15. The method for manufacturing a light emitting device according to claim 1, wherein the step of releasing the stretched state comprises setting the mounting interval between the light emitting elements to be 20 [mu]m or more and 100 [mu]m or less. The step of supplying the first member includes supplying the first member such that a distance between the light emitting element and the first member is 200 μm or more and 500 μm or less;
15. The method for manufacturing a light emitting device according to claim 1, wherein the step of releasing the stretched state comprises setting a mounting distance between the light emitting element and the first member to 50 μm or more and 200 μm or less. The method includes forming wiring on the stretchable sheet before the step of placing the light-emitting element,
17. The method for manufacturing a light-emitting device according to claim 1, wherein the step of forming the wiring comprises forming a pair of wiring patterns having areas for mounting the light-emitting elements at equal intervals so that the areas for mounting the light-emitting elements are parallel to each other. The method for manufacturing a light-emitting device according to any one of claims 1 to 16, further comprising the step of peeling off the stretchable sheet to expose the electrodes of the light-emitting element after the step of releasing the stretched state. The method for manufacturing a light-emitting device according to claim 18, further comprising the step of placing the light-emitting element on the support substrate such that the surface opposite the electrode faces the support substrate before the step of exposing the electrode. The method for manufacturing a light-emitting device according to claim 18 or 19, further comprising a step of singulating the light-emitting elements before or after the step of exposing the electrodes. After the step of exposing the electrodes, a step of covering the light-emitting element with an arrangement member so as to cover the electrodes;
21. The method for manufacturing a light-emitting device according to claim 19, further comprising: polishing the placement member to expose the electrode from the placement member . After the step of exposing the electrodes, a step of covering the light-emitting element with an arrangement member so as to cover the electrodes;
abrading the placement member to expose the electrodes from the placement member ;
peeling off the support substrate;
The method for manufacturing a light emitting device according to claim 19 , further comprising:

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