JP2022012578A - Manufacturing method of light-emitting device - Google Patents

Abstract

To provide a manufacturing method of light-emitting devices that can increase the density of light-emitting devices.SOLUTION: A manufacturing method of a light-emitting device includes a step S11 of stretching an elastic sheet against an elastic force, a step S12 of placing at least one light-emitting element on a predetermined area of the stretched elastic sheet, and a step S13 of supplying a first member to a side of a side face of a light-emitting element on the elastic sheet, and a step S14 of releasing the stretched state by elasticity of the elastic sheet.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a method for manufacturing a light emitting device.

It is disclosed that when the light emitting device is manufactured, the stretched support sheet is peeled off from the stretched support sheet while being sucked by a suction member in a stretched state.

Japanese Unexamined Patent Publication No. 2014-16803

Therefore, it is an object of the present embodiment to provide a method of manufacturing a light emitting device capable of easily arranging the first member on the side surface of the light emitting element.

The method for manufacturing a light emitting device according to the embodiment of the present disclosure includes a step of stretching the stretchable sheet against elastic force and mounting at least one light emitting element in a preset region of the stretchable sheet in the stretched state. It includes a step of placing the first member on the stretchable sheet, a step of supplying the first member to the side of the side surface of the light emitting element, and a step of releasing the stretched state by the elastic force of the stretchable sheet.

According to the method for manufacturing a light emitting device according to the embodiment of the present disclosure, the first member can be easily arranged on the side surface of the light emitting element.

It is a perspective view which shows typically the light emitting device which concerns on 1st Embodiment. It is a top view which shows typically the light emitting device which concerns on 1st Embodiment. It is sectional drawing in the IC-IC line of FIG. 1B. It is a flowchart which shows the procedure of the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is a top view which shows typically the state which stretched the stretchable sheet in the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is a top view which shows typically the state which the light emitting element is placed in the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is a top view schematically showing the state which supplied the 1st member between light emitting elements in the manufacturing method of the light emitting device which concerns on 1st Embodiment. FIG. 3 is a cross-sectional view taken along the line IIICII-IIICII of FIG. 3C1. It is a top view schematically showing the state in which the stretchable sheet is released from the extension in the manufacturing method of the light emitting device which concerns on 1st Embodiment. FIG. 3 is a cross-sectional view taken along the line IIIDII-IIIDII of FIG. 3D1. It is a top view schematically showing the state which the elastic sheet was peeled off and the light emitting element was placed on the support substrate in the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is a top view which shows typically the state which the light emitting element on the support substrate is covered with the arrangement member in the manufacturing method of the light emitting device which concerns on 1st Embodiment. FIG. 3 is a cross-sectional view taken along the line IIIFII-IIIFII of FIG. 3F1. It is a top view schematically showing the state which exposed the element electrode by grinding the arrangement member in the manufacturing method of the light emitting device which concerns on 1st Embodiment. FIG. 3 is a cross-sectional view taken along the line IIIGII-IIIGII of FIG. 3G1. It is a top view schematically showing the state which the support substrate was peeled off in the manufacturing method of the light emitting device which concerns on 1st Embodiment. FIG. 3 is a cross-sectional view taken along the line IIIHII-IIIHII of FIG. 3H1. It is a perspective view which shows typically the light emitting device which concerns on 2nd Embodiment. It is a flowchart which shows the procedure of the manufacturing method of the light emitting device which concerns on 2nd Embodiment. It is a top view which shows typically the state which the wiring was formed on the stretchable sheet with the stretchable material in the manufacturing method of the light emitting device which concerns on 2nd Embodiment. It is a top view which shows typically the state which stretched the elastic sheet which formed the wiring in the manufacturing method of the light emitting device which concerns on 2nd Embodiment. It is a top view which shows typically the state which the light emitting element is placed on the wiring in the manufacturing method of the light emitting device which concerns on 2nd Embodiment. It is a top view schematically showing the state which supplied the arrangement member between the light emitting elements and around the light emitting element in the manufacturing method of the light emitting device which concerns on 2nd Embodiment. 6 is a cross-sectional view taken along the line VIDEO II-VIDEO of FIG. 6D1. FIG. 5 is a plan view schematically showing a state in which the stretchable sheet is released from stretching in the method for manufacturing a light emitting device according to a second embodiment. 6 is a cross-sectional view taken along the line VIEIII-VIEII of FIG. 6E1. It is a perspective view which shows the modification of the light emitting device schematically. It is sectional drawing which shows typically the supply state of the 1st member in the 1st modification of the manufacturing method of each embodiment. It is sectional drawing which shows typically the state of the 1st member in the release process in the 1st modification of the manufacturing method of each embodiment. It is sectional drawing which shows typically the state which the 1st member was polished and the wavelength conversion member was exposed in the 1st modification of the manufacturing method of each embodiment. It is sectional drawing which shows typically the supply state of the 1st member in the 2nd modification of the manufacturing method of each embodiment. It is sectional drawing which shows typically the state of the 1st member in the release process in the 2nd modification of the manufacturing method of each embodiment. It is a top view of the elastic sheet used in the manufacturing method of the light emitting device which concerns on another embodiment. FIG. 3 is a plan view schematically showing a state in which wiring is formed on the elastic sheet of FIG. 10A. 10B is a plan view schematically showing a state in which a light emitting element is placed on a wiring in FIG. 10B. FIG. 10C is a plan view schematically showing a state in which an elastic sheet in a state where a light emitting element is placed on a wiring is stretched. 10D is a plan view schematically showing a state in which the first member is supplied to the side of the side surface of the light emitting element of the stretchable elastic sheet in FIG. 10D. FIG. 10E is a plan view schematically showing a state in which the stretchable sheet is released from the stretched state and the first member is arranged facing the side of the light emitting element with a narrow space. In each embodiment, it is explanatory drawing which shows the structure which formed the wiring on the lower surface of the elastic sheet in a schematic cross section.

The embodiments will be described below with reference to the drawings. However, the embodiments shown below exemplify a method for manufacturing a light emitting device for embodying the technical idea of the present embodiment, and are not limited to the following. Further, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention to the specific description, but are merely examples. It's just that. In addition, the size and positional relationship of the members shown in each drawing may be exaggerated in order to clarify the explanation.
The first member refers to a member provided on the side of the light emitting element or a member covering the side surface of the light emitting element. The height of the first member is appropriately adjusted by the member to be supplied.

<First Embodiment>
[Light emitting device]
First, the light emitting device will be described.
FIG. 1A is a perspective view schematically showing a light emitting device according to the first embodiment. FIG. 1B is a plan view schematically showing a light emitting device according to the first embodiment. FIG. 1C is a cross-sectional view taken along the line IC-IC of FIG. 1A.
The light emitting device 100 includes a light emitting element 1 as a semiconductor element, an arrangement member 2A, and a wavelength conversion member 3. In the light emitting device 100, four light emitting elements 1 are arranged in a matrix direction of 2 rows and 2 columns. Further, the light emitting device 100 has, as the arrangement member 2A, a first member 2A1 formed between the light emitting elements 1 and a second member 2A2 that surrounds all the light emitting elements 1 in a frame shape.
Hereinafter, each configuration of the light emitting device will be described first, and then a method of manufacturing the light emitting device will be described.

(Light emitting element)
As the light emitting element 1, a semiconductor light emitting device is used as an example. The light emitting element 1 may be an element structure composed of various semiconductors provided with a pair of positive and negative element electrodes 11 and 12. In particular, the light emitting device 1 is preferably a nitride semiconductor (In _x Al _y Ga _1-x-y N, 0 ≦ x, 0 ≦ y, x + y ≦ 1) capable of efficiently exciting a phosphor. In addition, the light emitting element 1 may be a zinc sulfide-based semiconductor, a zinc selenide-based semiconductor, or a silicon carbide-based semiconductor.
Examples of the light emitting element 1 include a regular quadrangle having a side length of 100 μm or more and 2 mm or less in a plan view, but a polygon such as a triangle, a quadrangle, a pentagon, a hexagon, or an octagon may be used. It is possible, and various combinations of these polygons may be performed. Here, the light emitting element 1 uses four regular quadrangles to create an aggregate of quadrangles. The light emitting element 1 is arranged by using 6 squares in 2 rows and 3 columns to form an aggregate of rectangles, 2 in the 1st row, 4 in the 2nd row, 4 in the 3rd row, and 4th row. It is also possible to arrange two light emitting elements 1 together to form an aggregate that is close to an octagon or a circle. Further, the light emitting element 1 may be arranged so as to be a pentagon as a whole by arranging three quadrangles in an L shape and arranging a triangular light emitting element inside the L shape. It is preferable to determine the form of the light emitting element 1 in consideration of the state in which a plurality of light emitting elements 1 are combined.

The distance between the light emitting elements 1 in the light emitting device 100 is preferably 20 μm or more and 100 μm or less, and more preferably 20 μm or more and 50 μm or less. If the distance between the light emitting elements is 20 μm or more, it becomes easy to manufacture the light emitting device 100, and if the distance is 20 μm or more, the distance from the adjacent light emitting element 1 via the first member 2A1 is reduced to reduce the distance between the first member 2A1. Can be arranged in high density by facing each other in a state of being in contact with each other without a gap or by facing each other at a predetermined interval. On the other hand, if the distance between the light emitting elements 1 or the distance between the light emitting element 1 and the first member 2A1 is 100 μm or less, the light emitting element 1 can be further increased in density and the light emitting device 100 can be miniaturized. be able to.

(Arrangement member: 1st member)
The arranging member 2A is a member that mainly covers the side surface of the light emitting element 1 or a member that is arranged on the side of the side surface of the light emitting element 1. The arranging member 2A is a reflecting member that contains a reflective substance and reflects the light emitted by the light emitting element 1 in the lateral direction or the downward direction toward the wavelength conversion member 3 side, which is the light emitting region of the light emitting device 100. There may be.
The arrangement member 2A is provided on the side surface of the light emitting element 1, the side surface of the wavelength conversion member 3, and the lower surface of the light emitting element 1 excluding the lower surfaces of the element electrodes 11 and 12. Here, the arrangement member 2A is provided so as to face and abut the side surface of the light emitting element. By providing the light emitting element 1 so as to be in contact with the side surface thereof, it is possible to improve the parting. The arrangement member 2A may cover at least a part of the side surface of the light emitting element 1, but it is preferable that the height of the arrangement member 2A is at least higher than the light emitting layer of the light emitting element 1. Further, the height of the arrangement member 2A is preferably 5 μm or more and 150 μm or less, and particularly preferably 5 μm or more and 50 μm or less. The arrangement member 2A is provided between the light emitting elements 1 as a first member 2A1 and is provided with a second member 2A2 arranged in a frame shape as an outer surface surrounding the entire aligned light emitting elements 1. There is. The first member 2A1 and the second member 2A2 used here are formed of the same member as an example. The arrangement member 2A is also provided between the element electrodes 11 and 12 of the light emitting element 1, but the lower surface of the element electrodes 11 and 12 is exposed from the arrangement member 2A.
As the arranging member 2A, for example, resin, ceramics, glass, or the like can be used, and a reflective substance may be contained therein. The arranging member 2A may be configured by containing a filler in addition to a reflective substance in a base material, a resin serving as a binder, or the like.

The binder is a resin for binding a reflective substance or a filler to the light emitting element 1 or the like as the arranging member 2A. Examples of the resin serving as the binder include polycarbonate resin, epoxy resin, phenol resin, silicone resin, acrylic resin, TPX resin, polynorbornene resin, urethane resin and the like. Alternatively, examples of the resin serving as a binder include these modified resins and hybrid resins containing one or more of these resins. Of these, silicone resins or modified resins thereof are preferable because they are excellent in heat resistance and light resistance and have little volume shrinkage after curing.

The reflective substance is a substance that reflects the light emitted by the light emitting element 1. Examples of the reflective substance include silica, titanium oxide, silicon oxide, aluminum oxide, potassium titanate, zinc oxide, boron nitride and the like. Further, a resin powder such as silicone powder may be used.
The filler is added for reasons such as increasing the strength of the arranging member 2A, which is a resin layer, or increasing the thermal conductivity of the arranging member 2A. Examples of the filler include glass fiber, whiskers, aluminum oxide, silicon oxide, boron nitride, zinc oxide, aluminum nitride and the like.
The arrangement member 2A may be formed by using the first member 2A1 and the second member 2A2 as separate members. For example, in the first member 2A1, a member having a higher content of the reflective substance than the second member 2A2 may be used. Since the thickness of the first member 2A1 is thinner than that of the second member 2A2, the inclusion of more reflective members than the second member 2A2 makes it less likely to be affected by the light from the adjacent light emitting element 1.

(Wavelength conversion member)
The wavelength conversion member 3 is a member containing a wavelength conversion substance that absorbs a part of light having a wavelength emitted by the light emitting element 1 and converts it into light having a different wavelength to emit light. The wavelength conversion substance used in the wavelength conversion member 3 is, for example, a phosphor. The wavelength conversion member 3 is provided on the light emitting surface of the light emitting element 1.
The base material or binder of the wavelength conversion member 3 is preferably formed of a translucent resin. Examples of the resin here include a resin that serves as a base material or a binder for the above-mentioned arrangement member 2A. Of these, silicone resins or modified resins thereof are preferable because they are excellent in heat resistance and light resistance and have little volume shrinkage after curing. Further, the base material or the binder of the wavelength conversion member 3 may be formed of ceramics or glass in addition to the resin. The wavelength conversion member 3 may be one obtained by sintering only the wavelength conversion substance without using a binder, or may be a member to which the wavelength conversion substance is fixed by using a small amount of a binder such as alumina. Further, the wavelength conversion member 3 may be a phosphor sheet.

Examples of the phosphor contained in the wavelength conversion member 3 include yttrium aluminum garnet activated with cerium, lutetium aluminum garnet activated with cerium, terbium aluminum garnet activated with cerium, europium, and the like. Nitrogen-containing calcium aluminosilicate activated with either one or two of chromium, cerium activated with europium, silicate activated with europium, potassium fluoride silicate activated with manganese, activated with europium Examples include a nitride phosphor.

The light emitting device 100 may be configured to include a substrate having a base material on which wiring is formed. The base material used for the substrate may be a stretchable sheet or a rigid sheet having high hardness.

[Manufacturing method of light emitting device]
Next, an example of a method for manufacturing a light emitting device will be described.
FIG. 2 is a flowchart showing a procedure of a method for manufacturing a light emitting device according to the first embodiment. FIG. 3A is a plan view schematically showing a state in which the elastic sheet is stretched in the method for manufacturing the light emitting device according to the first embodiment. FIG. 3B is a plan view schematically showing a state in which a light emitting element is placed in the method for manufacturing a light emitting device according to the first embodiment. FIG. 3C1 is a plan view schematically showing a state in which the first member is supplied between the light emitting elements in the method for manufacturing the light emitting device according to the first embodiment. FIG. 3C2 is a cross-sectional view taken along the line IIICII-IIICII of FIG. 3C1. FIG. 3D1 is a plan view schematically showing a state in which the stretchable sheet is released from the stretch in the method for manufacturing the light emitting device according to the first embodiment. FIG. 3D2 is a cross-sectional view taken along the line IIIDII-IIIDII of FIG. 3D1. FIG. 3E is a plan view schematically showing a state in which the elastic sheet is peeled off and the light emitting element is placed on the support substrate in the method for manufacturing the light emitting device according to the first embodiment. FIG. 3F1 is a plan view schematically showing a state in which a light emitting element on a support substrate is covered with an arrangement member in the method for manufacturing a light emitting device according to the first embodiment. FIG. 3F2 is a cross-sectional view taken along the line IIIFII-IIIFII of FIG. 3F1. FIG. 3G1 is a plan view schematically showing a state in which the arrangement member is ground to expose the element electrodes in the method for manufacturing the light emitting device according to the first embodiment. FIG. 3G2 is a cross-sectional view taken along the line IIIGII-IIIGII of FIG. 3G1. FIG. 3H1 is a plan view schematically showing a state in which the support substrate is peeled off in the method for manufacturing the light emitting device according to the first embodiment. FIG. 3H2 is a cross-sectional view taken along the line IIIHII-IIIHII of FIG. 3H1.

The method for manufacturing the light emitting device is at least one (here, a plurality) in a step (stretching step) S11 in which the stretchable sheet 20 is stretched against an elastic force and a preset region of the stretchable sheet 20 in a stretched state. Step of mounting the light emitting element 1 (mounting step) S12, a step of supplying the first member 2A1 to the side of the side surface of the light emitting element 1 on the stretchable sheet 20 (supply step) S13, and the stretchable sheet. A step (release step) S14 of releasing the stretched state by the elastic force of 20 is included. Here, the method for manufacturing the light emitting device includes a step (step) S15 in which the element electrodes 11 and 12 of the light emitting element 1 are placed on the support substrate 21, and the elastic sheet 20 is peeled off. A step of exposing the element electrodes (peeling step) S16, a step of covering the light emitting device on the support substrate with an arrangement member (arrangement member molding step) S17, and a process of polishing the arrangement member 2A to expose the element electrodes 11 and 12. Includes a step (element electrode exposure step) S18, a step of peeling off the support substrate (support substrate peeling step) S19, and a step of separating the light emitting elements into individual groups (individualization step) S20. , Each process is performed in this order.

In this method of manufacturing a light emitting device, when a plurality of light emitting elements 1 are placed on the stretched elastic sheet 20, at least after the stretched state is released, the distance (d1) between at least two light emitting elements 1 is increased. The distance (d2) between the two light emitting elements 1 is set to be narrower.
Hereinafter, each step will be described. The materials and arrangement of each member are as described in the above description of the light emitting device 100, and thus description thereof will be omitted here as appropriate.

(Extending process)
The stretching step S11 is a step of stretching the elastic sheet 20 against the elastic force. In this stretching step S11, the elastic sheet 20 is attached to the fixing device 30, and the elastic sheet 20 is stretched by the fixing device 30. Alternatively, the stretchable sheet 20 is stretched, and the stretchable sheet 20 is fixed to the fixing device 30 in the stretched state. Here, it is assumed that the elastic sheet 20 is stretched by the fixing device 30.
Further, in the stretching step S11, the stretchable sheet 20 may be stretched in the radial direction from the center of the stretchable sheet 20.
Further, in the stretching step S11, the stretchable sheet 20 is either in two directions of one and the other along the X direction, or in two directions of one and the other along the Y direction orthogonal to the X direction. The elastic sheet 20 may be stretched.
Further, in the stretching step S11, one (X plus direction) and the other (X minus direction) along the X direction, and one (Y plus direction) and the other (Y plus direction) along the Y direction orthogonal to the X direction (Y plus direction). The elastic sheet 20 may be extended in two directions (Y minus direction) and four directions.

It is preferable that the stretchable sheet 20 is stretched so as to have the same stretch ratio in the radial direction or all four directions. By setting all the elongation rates to be the same, it becomes easy to adjust the mounting interval of the light emitting element 1 in the stretched state and the mounting interval of the light emitting element 1 after the stretched state is released, and it becomes easy to mount the light emitting element 1. The elongation rate may be appropriately set in consideration of the mounting interval of the light emitting element 1 in the stretched state, the mounting interval of the light emitting element 1 after the stretched state is released, and the like. Preferably, when the mounting interval of the light emitting element 1 in the light emitting device 100 after the extension is released is set to 100%, the mounting interval of the light emitting element 1 in the extended state is set to be 110% to 500%. You can also. More preferably, it can be set to 130% to 300%.
Further, the distance between the light emitting elements 1 in the light emitting device 100 is set to be, for example, a mounting distance of 20 μm or more and 100 μm or less. Then, in the stretching step, it is preferable that the stretching width in the two opposite directions when the stretchable sheet 20 is stretched is 100 μm or more and 500 μm or less so that the light emitting elements 1 are mounted at each other. When the stretch width is 100 μm or more, the light emitting element 1 and the first member 2A1 can be easily mounted on the stretchable sheet 20. On the other hand, when the expansion width is 500 μm or less, it is possible to suppress the occurrence of distortion in the mounting portion of the light emitting element 1. The stretch width is more preferably 100 μm or more and 300 μm or less.

The elastic sheet 20 may be any as long as it has an elongation rate sufficient to secure a desired clearance (distance between the light emitting elements 1) and can mount the light emitting element 1 without any problem. Examples of the material of the elastic sheet 20 include UV tape, various plastics, rubber and the like. The thickness of the elastic sheet 20 is preferably, for example, 10 μm or more and 500 μm or less, and more preferably 20 μm or more and 200 μm or less. The elongation rate of the elastic sheet 20 is preferably 700% or less, more preferably 500% or less, and particularly preferably 300% or less. By using an elastic sheet 20 having an elongation rate of more than 500%, the light emitting element 1 can be arranged at a high density. Further, by suppressing the elongation rate of the elastic sheet 20 to 300% or less, the elastic sheet 20 can be used for wiring and the like, and the breakage of the elastic sheet 20 can be suppressed. As the fixing device 30, a conventionally known fixing device 30 can be used. Further, the elastic sheet 20 can be used in the same manner as the above-mentioned numerical range of the elastic modulus as long as the elastic modulus is about 1-100 MPa and the Young's modulus is in the range of about 1 to 50 MPa. ..

(Placement process)
The mounting step S12 is a step of mounting at least one light emitting element 1 in a preset region of the stretchable sheet 20 in the stretched state. In this mounting step S12, as an example, four light emitting elements 1 are set as one set, and each set of light emitting elements 1 is placed so as to be arranged in the matrix direction. Then, each set including the four light emitting elements 1 is arranged in a matrix direction in 4 rows and 4 columns. Here, 16 sets are arranged in the matrix direction, and 64 light emitting elements 1 are mounted.
Further, in the mounting step S12, for example, the stretchable sheet 20 is mounted so that the distance between the light emitting elements 1 of each set when the stretchable sheet 20 is released is 20 μm or more and 100 μm or less via the first member 2A1. To. Here, in the mounting step S12, the light emitting elements 1 are placed so that the distance between the light emitting elements 1 of each set when the stretchable sheet 20 is stretched is 100 μm or more and 500 μm or less. The distance between the light emitting elements 1 when released is set to be 20 μm or more and 100 μm or less. Then, in the mounting step S12, the light emitting element 1 is mounted on the stretchable sheet 20 so that the element electrodes 11 and 12 face the stretchable sheet 20.

(Supply process)
The supply step S13 is a step of supplying the first member 2A1 to the side of the side surface of the light emitting element 1 on the elastic sheet 20. In this supply step S13, for example, the first member 2A1 to be the arrangement member 2A is supplied between the light emitting elements 1 via the supply nozzle. The supply amount of the first member 2A1 supplied in the supply step S13 is set to be the same height as the height of the light emitting element 1 when the stretchable sheet 20 is released from stretching. In the supply step S13, as shown in FIG. 3C2, the light emitting elements 1 are supplied in contact with the side surface of the light emitting element 1 at least on the side of the side surface, that is, at least a part of the positions facing the side surface. .. In the supply step S13, when the first member 2A1 supplied when the stretchable sheet 20 is in the predetermined stretched state is released from the stretched state and becomes the mounting interval between the light emitting elements 1 of the light emitting device 100. How the first member 2A1 is formed has been investigated in advance. Therefore, the supply amount of the first member 2A1 can be set in advance so as to be appropriate at the mounting interval.

Then, in the supply step S13, the first member 2A1 is supplied when the distance between the light emitting elements 1 is wider than the mounting distance, so that bubbles do not enter inside. That is, if the distance between the light emitting elements 1 is narrow, the first member 2A1 may not fit properly between the light emitting elements 1 and bubbles may remain, but in the present embodiment, the distance between the light emitting elements 1 can be widened. Therefore, the first member 2A1 can be filled between the light emitting elements 1 without leaving bubbles. In the supply step S13, the nozzle for supplying the first member 2A1 moves up, down, left, right, front and back, and the mounting table on which the elastic sheet 20 is placed moves up, down, left, right, front and back to supply the first member 2A1. can do. Further, even if the first member 2A1 overflows from the side surface of the light emitting element 1 to the outside, it is further covered by the arrangement member 2A in a later step, so that the first member 2A1 may overflow to the side of the light emitting element 1. There is no particular problem. It should be noted that the side of the side surface of the light emitting element 1 is a case where the first member 2A1 is supplied so as to be in contact with or in contact with the side surface of the light emitting element 1, or is not in contact with the side surface of the light emitting element 1 at intervals. Including any case where it is supplied. Further, facing at least a part of the side surface of the light emitting element 1 means that when the first member 2A1 is supplied, it faces the entire side surface of the light emitting element 1 or a part of the side surface of the light emitting element 1. Includes both face-to-face cases.

(Release process)
The releasing step S14 is a step of releasing the stretched state by the elastic force of the elastic sheet 20. In this release step S14, the stretchable sheet 20 is removed from the fixing device 30 in the stretched state, or the stretched state is released by the elastic force of the stretchable sheet 20 together with the fixing device 30. Then, in this release step S14, the distance between the light emitting elements 1 after releasing the stretched state of the elastic sheet 20 (d1) from the distance (d1) between the light emitting elements 1 on which the light emitting element 1 is placed in the mounting step S12 ( The d2) is narrowed, and the distance (d2) between the light emitting elements 1 of the light emitting device 100 is used as the mounting distance. Here, the distance between the four light emitting elements 1 of each set is narrowed to obtain the mounting distance of the light emitting element 1. Further, in the state where the stretched state is maintained, the four light emitting elements 1 are regarded as one set, and the light emitting elements 1 of the set are adjacent to each other from the distance between the adjacent light emitting elements 1 in the set. By widening the interval, it is possible to easily separate the four light emitting elements 1 into a set when the stretched state is released. In this release step S14, it is preferable to set the mounting interval of each set of light emitting elements 1 after releasing the stretched state of the stretchable sheet 20 in a range of 20 μm or more and 100 μm or less via the first member 2A1. It is preferable to perform a step of curing the supplied first member after the release step S14.

As described above, by forming the first member 2A1 between the light emitting elements 1 in the stretched state of the elastic sheet 20, the light emitting element 1 can be increased in density and mounted at a high density. Even if there is, since the stretchable film can be stretched, the thickness of the applied reflective resin can be suppressed, so that the first member 2A1 can be formed between the light emitting elements 1 without entering air bubbles. .. That is, when the light emitting element 1 is placed, it may collide with the adjacent light emitting elements. Therefore, the light emitting elements must be separated from each other by a predetermined distance or more, but the light emitting element is cut by using the elastic sheet. Since the distance between the light emitting elements can be made close to each other after the placement, the plurality of light emitting elements 1 can be arranged at a high density. Further, it is difficult to arrange the first member 2A1 between the adjacent light emitting elements 1 in a state where the elastic sheet 20 has returned to the original position, that is, in a state where the distance between the adjacent light emitting elements 1 is narrowed. This is because when the elastic sheet 20 is in the stretched state, the distance between the adjacent light emitting elements is wide, so that it is relatively easy to arrange the first member 2A between the adjacent light emitting elements 1. Therefore, it is possible to set a narrower mounting interval than in the past. Even if the stretchable sheet 20 is slightly twisted when the stretchable sheet 20 is released from the stretched state, the stretchable sheet 20 is peeled off in the process of manufacturing the light emitting device as described later, and the support substrate 21 is used. There is no problem because it is transferred to.

(Process of placing on the support substrate)
Next, in the method of manufacturing a light emitting device, after the light emitting element 1 in the light emitting device 100 is used as a mounting interval and the first member 2A1 is formed between the light emitting elements, the surface opposite to the element electrodes 11 and 12 faces the support substrate 21. As described above, the step S15 of mounting the light emitting element 1 on the support substrate 21 and mounting the light emitting element 1 on the support substrate 21 is performed. In this step S15, first, the light emitting element 1 is mounted on the support substrate 21 so that the wavelength conversion member 3 of the light emitting element 1 adheres to the support substrate 21 in a state where the light emitting element 1 is mounted on the elastic sheet 20. Place.
Examples of the support substrate 21 include a polyimide film and a PET film.
The thickness of the support substrate 21 is, for example, preferably 5 μm or more and 300 μm or less, and more preferably 10 μm or more and 150 μm or less.

(Peeling process)
The peeling step S16 is a step of peeling the elastic sheet 20 to expose the element electrodes 11 and 12. In the peeling step S16, the elastic sheet 20 in contact with the element electrodes 11 and 12 is peeled off with the wavelength conversion member 3 facing the support substrate 21, and the element electrodes are exposed upward. By performing this peeling step S16, the light emitting element 1 placed on the elastic sheet 20 is placed and transferred on the support substrate 21 in an inverted state. Therefore, the light emitting element 1 is placed on the support substrate 21 with the wavelength conversion member 3 of the light emitting element 1 facing each other and the element electrodes 11 and 12 facing upward.

(Arrangement member molding process)
The arrangement member forming step S17 is a step of covering the light emitting element 1 with the arrangement member 2A so as to cover the element electrodes 11 and 12. In this arrangement member forming step S17, the entire light emitting element 1 including the element electrodes 11 and 12 is covered with the arrangement member 2A. In this step S17, when the light emitting element 1 is coated, for example, on the upper side of the fixed support substrate 21, the discharge device (dispenser) that can be moved (movable) in the vertical direction, the horizontal direction, or the like with respect to the support substrate 21. ) Can be used. The coating of the light emitting element 1 can be performed by filling the support substrate 21 with a resin or the like which is the second member 2A2 constituting the arrangement member 2A by using a discharge device. It is also possible to cover by a compression molding method, a transfer molding method or the like. The second member (arrangement member) 2A2 used in the arrangement member forming step S17 may be the same member as the first member 2A1, and further, the amount of the reflective substance contained may be adjusted by the first member 2A1 and the second member 2A2. It may be used differently.

(Element electrode exposure process)
The element electrode exposure step S18 is a step of polishing or grinding the arrangement member 2A to expose the element electrodes 11 and 12. In the element electrode exposure step S18, when a part of the arrangement member 2A is scraped by polishing or the like to expose the bottom surfaces of the element electrodes 11 and 12, the work is performed by moving the support substrate 21, or the support substrate 21 is used. The work may be performed by fixing and moving the polishing mechanism side, or by moving both the support substrate and the polishing mechanism. When the element electrode exposure step S18 is completed, it is preferable to perform a step of washing away the polished arrangement member 2A with a shower or a step of blowing off the polished arrangement member 2A with a blower to remove the polishing powder.

(Support substrate peeling process)
The support substrate peeling step S19 is a step of polishing the arrangement member 2A to expose the element electrodes 11 and 12 and then peeling the support substrate 21. In the support substrate peeling step S19, the support substrate 21 is placed by pressing the arrangement member 2A and the support substrate 21 from the outside and peeling the support substrate 21 by a mechanical force, or by irradiating the support substrate 21 with ultraviolet rays having a predetermined wavelength. And may be peeled off from the wavelength conversion member 3 side of the light emitting element 1.

(Individualization process)
The individualization step S20 is a step of individualizing the light emitting element 1 into a preset number of groups. In this individualization step S20, the molded body in which the element electrodes 11 and 12 are exposed is cut in a predetermined region along the cutting line 15 so as to be an individual light emitting device 100. The cutting can be performed by a conventionally known method such as a dicing method for cutting with a blade. Here, a light emitting device 100 including four light emitting elements 1 is obtained by the individualization step S20.

<Second Embodiment>
[Light emitting device]
Next, the light emitting device of the second embodiment and the manufacturing method thereof will be described.
First, the light emitting device will be described mainly with reference to FIGS. 6A to 6E2 as appropriate.
FIG. 4 is a perspective view schematically showing the light emitting device according to the second embodiment.
The light emitting device 100B includes an elastic sheet 20B, a wiring 40, a light emitting element 1, an arrangement member 2B, and a wavelength conversion member 3. The light emitting device 100B is different from the first embodiment in that the wiring 40 is formed on the elastic sheet 20B and used as the substrate of the light emitting device 100B.

As the stretchable sheet 20B, the same stretchable sheet 20 as described in the first embodiment can be used. Further, although the arrangement of the light emitting element 1 is different, the light emitting element 1 and the wavelength conversion member 3 can be the same as those described in the light emitting device 100 of the first embodiment. Further, as the arrangement member 2B, the same one as that used in the first embodiment can be used although the arrangement of the first member 2B1 and the second member 2B2 is different.
The light emitting elements 1 are arranged in a straight line in a row, and the distance between the light emitting elements 1 is arranged via the first member 2B1 so that the distance between the light emitting elements 1 is 20 μm or more and 100 μm or less. When the distance between the light emitting elements 1 is 20 μm or more, the stretchable space of the elastic sheet 20B can be widened, so that the first member 2B1 can be easily formed and the light emitting device 100B can be easily manufactured. On the other hand, if the distance between the light emitting elements 1 is 100 μm or less, the light emitting element 1 can be increased in density and the light emitting device 100B can be miniaturized.

(wiring)
The wiring 40 is formed by forming a plurality of a pair of wiring patterns 41. In the pair of wiring patterns 41, the two linear wiring portions 42, 43 are arranged on the elastic sheet 20 at predetermined intervals so that the ends face each other. Wiring pads 42b and 43b having a wiring area wider than that of the straight portion are formed at the opposite ends of the wiring portions 42 and 43. Here, the wiring 40 is formed so that four pairs of wiring patterns 41 are provided in parallel, and the regions on which the light emitting elements 1 are placed are arranged in parallel at equal intervals. In the pair of wiring patterns 41, one element electrode 11 of the light emitting element 1 is bonded to one wiring pad 42b, and the other element electrode 12 of the light emitting element 1 is bonded to the other wiring pad 43b (see FIG. 6C). .. As a result, the light emitting element 1 is placed so as to straddle the pair of wiring patterns 41 and in parallel.
As the material of the wiring 40, a metallic material such as copper, a conductive paste, a stretchable paste, or the like can be used. As a result, even if the distance between the wiring pads 42b and 43b expands and contracts, the electrical connection between the electrodes 11 and 12 and the wiring pads 42b and 43b can be maintained. For the wiring 40, it is preferable to use a stretchable paste having elasticity.
In the light emitting device 100B having such a configuration, when the plurality of light emitting elements 1 are individually lit, the light emitting device 100B has a good close-out and can be miniaturized. Further, since the elastic sheet 20B is extended only in one direction, the difference in spacing between the light emitting elements 1 can be reduced.

[Manufacturing method of light emitting device]
Next, an example of a method for manufacturing a light emitting device will be described with reference to FIGS. 5, 6A to 6E2.
FIG. 5 is a flowchart showing a procedure of a method for manufacturing a light emitting device according to a second embodiment. FIG. 6A is a plan view schematically showing a state in which wiring is formed on an elastic sheet with an elastic material in the method for manufacturing a light emitting device according to a second embodiment. FIG. 6B is a plan view schematically showing a state in which the stretchable sheet on which the wiring is formed is stretched in the method for manufacturing the light emitting device according to the second embodiment. FIG. 6C is a plan view schematically showing a state in which a light emitting element is placed on wiring in the method for manufacturing a light emitting device according to a second embodiment. FIG. 6D1 is a plan view schematically showing a state in which an arrangement member is supplied between the light emitting elements and around the light emitting elements in the method for manufacturing the light emitting device according to the second embodiment. FIG. 6D2 is a cross-sectional view taken along the line VIDEO II-VIDEO of FIG. 6D1. FIG. 6E1 is a perspective view schematically showing a state in which the stretchable sheet is released from the stretch in the method for manufacturing the light emitting device according to the second embodiment. FIG. 6E2 is a cross-sectional view taken along the line VIEII-VIEII of FIG. 6E1.

In the second embodiment, the elastic sheet 20B used in the light emitting device becomes the substrate of the light emitting device 100B. The method for manufacturing the light emitting device is performed in this order so as to include the wiring forming step S2, the stretching step S21, the mounting step S22, the supply step S23, and the releasing step S24. Hereinafter, each step will be described. The same process as that of the first embodiment may be omitted as appropriate.

First, the wiring forming step S2 is a step of forming the wiring 40 on the elastic sheet 20B. Here, in the wiring forming step S2, a plurality of a pair of wiring patterns 41 having a region on which the light emitting element 1 is placed are formed at equal intervals so that the regions on which the light emitting element 1 is placed are arranged in parallel.
In this wiring forming step S2, a plurality of a pair of wiring patterns 41 having a region on which the light emitting element 1 is placed are formed at equal intervals so that the regions on which the light emitting element 1 is placed are arranged in parallel.
Specifically, the two linear wiring portions 42 and 43 are arranged on the elastic sheet 20B at predetermined intervals so that the ends face each other, and four pairs of wiring patterns 41 are formed. Wiring pads 42b and 43b having a wiring area wider than that of the straight portion are formed at the opposite ends of the wiring portions 42 and 43. Then, the element electrodes 11 and 12 of the light emitting element 1 are electrically connected to the wiring pads 42b and 43b.
The wiring 40 can be formed, for example, by joining a copper foil to the surface of the elastic sheet 20B and performing etching. Alternatively, it can be formed by applying a conductive paste or a stretchable paste to the surface of the elastic sheet 20B.

Further, in the wiring forming step S2, the wiring 40 may be formed on the lower surface of the elastic sheet 20B. The wiring 40 has a via penetrating the elastic sheet 20B in the area where the light emitting element 1 is placed, and the wiring pattern extending along the lower surface of the elastic sheet 20B through the penetrating via and the element electrode of the light emitting element 1. And are electrically connected. A wiring pad may be formed on the upper surface of the elastic sheet 20B, and the wiring pad and the element electrode of the light emitting element may be electrically connected to each other.

The width (line) of the pair of wiring patterns 41, that is, the width of one wiring portion 42, 43 is preferably 20 μm or more and 500 μm or less. When the width of the pair of wiring patterns 41 is 20 μm or more, it becomes easy to place the light emitting element 1 on the pair of wiring patterns 41. On the other hand, when the width of the pair of wiring patterns 41 is 500 μm or less, it becomes easy to adjust the mounting interval of the light emitting element 1 after the stretched state is released. The width of the pair of wiring patterns 41 is more preferably 50 μm or more and 200 μm or less.
The pattern width (space) between the pair of wiring patterns 41 is preferably 20 μm or more and 500 μm or less. When the pattern width is within this range, it becomes easy to adjust the mounting interval of the light emitting element 1 after the stretched state is released. The pattern width is more preferably 50 μm or more and 200 μm or less.
As shown in FIGS. 6D2 and 6E2, in the light emitting device 100B, the light emitting element after the stretchable sheet 20B is released from the stretched state from the distance (d1) between the light emitting elements immediately after the light emitting element 1 is placed. The distance between the light emitting elements (d2) is narrowed, and the distance between the light emitting elements of the light emitting device 100B (d2) is used as the mounting distance. Therefore, the width and the pattern width of the wiring pattern 41 are set so as to be within the range of the mounting interval between the light emitting elements 1.

(Extending process)
The stretching step S21 is a step of stretching the elastic sheet 20B against the elastic force. In this stretching step S21, the stretchable sheet 20B is attached to the fixing device 31B, and the stretchable sheet 20B is stretched by the fixing device 31B. In the stretching step S21, the stretchable sheet 20B is either in two directions of one and the other along the X direction, or in two directions of one and the other along the Y direction orthogonal to the X direction. The elastic sheet 20B may be stretched. By stretching in this way, the stretchable sheet 20B is stretched in only one direction, so that the difference in spacing between the light emitting elements 1 can be reduced.
Further, in this stretching step S21, the stretchable sheet 20B may be stretched in the radial direction from the center of the stretchable sheet 20B.
Further, in the stretching step S21, one (X plus direction) and the other (X minus direction) along the X direction, and one (Y plus direction) and the other (Y plus direction) along the Y direction orthogonal to the X direction (Y plus direction). The elastic sheet 20B may be extended in two directions (Y minus direction) and four directions.
Here, one (X plus direction) and the other (X minus direction) along the X direction, and one (Y plus direction) and the other (Y minus direction) along the Y direction orthogonal to the X direction. The elastic sheet 20B is stretched in two directions of and four directions. Then, in the stretching step S21, the wiring 40 is stretched along with the stretching of the stretchable sheet 20B, so that the wiring is not broken by the stretching of the stretchable sheet 20B.

In this stretching step S21, the fixing device 31B is attached to a predetermined area of the stretchable sheet 20B, the stretchable sheet 20B is stretched by the fixing device 31B against the elastic force, and the stretchable sheet 20B is stretched. It is fixed to the fixing device 31B. Alternatively, the elastic sheet 20B may be fixed to the fixing device in an extended state.
Specifically, the elastic sheet 20B is stretched in two opposite directions and fixed to the fixing device 31B so that the distance between the pair of adjacent wiring patterns 41 is widened.
To fix the elastic sheet 20B in the stretched state, the elastic sheet is pushed up from the back side of the elastic sheet 20B by the pushing member of the fixing device 31B, and then the pushed-up portion is moved from the front side of the elastic sheet 20B to the fixing device 31B. This can be done by fixing with a fixing member.
Here, the elastic sheet 20B is extended in two directions on the left and right by pushing up the portions on both the left and right sides of the wiring 40.

(Placement process)
The mounting step S22 is a step of mounting the light emitting element 1 on the wiring 40 formed on the stretchable sheet 20B in a state where the stretchable sheet 20B is stretched against the elastic force. Here, the element electrodes 11 and 12 of the light emitting element 1 are mounted so as to be electrically connected to the opposite wiring pads 42b and 43b of the wiring 40. Then, in the mounting step S22, the adjacent light emitting elements 1 are mounted so as to have the same mounting interval within a range of 100 μm or more and 500 μm or less.

The distance between the pair of adjacent wiring patterns 41 is adjusted so that the distance between the light emitting elements 1 becomes a desired range in the mounting step S22 in which the light emitting element is placed. The distance between the pair of adjacent wiring patterns 41 can be adjusted by the amount of extension of the elastic sheet 20B, and the amount of extension of the elastic sheet 20B can be adjusted by the height of the push-up member 31a. ..

When the distance between the light emitting elements 1 in the light emitting device 100B is 100 μm or less, the stretch width in the two opposite directions when the stretchable sheet 20B is stretched is preferably 100 μm or more and 500 μm or less. When the stretch width is 100 μm or more, the light emitting element 1 can be easily placed on the stretchable sheet 20B. On the other hand, when the expansion width is 500 μm or less, it is possible to suppress the occurrence of distortion in the mounting portion of the light emitting element 1. The stretch width is more preferably 100 μm or more and 300 μm or less.

In the mounting step S22, the element electrodes 11 and 12 of the light emitting element 1 are mounted and connected to the wiring pads 42b and 43b so as to straddle the pair of wiring patterns 41. The light emitting element 1 is arranged in parallel with the wiring pattern 41 by being connected to the wiring pads 42b and 43b. Here, as an example, four light emitting elements 1 are mounted in parallel. In this mounting step S22, for example, the light emitting element 1 is mounted so that the distance between the light emitting elements 1 is 100 μm or more and 500 μm or less.

(Supply process)
The supply step S23 is a step of supplying the first member 2B1 so as to face at least a part or all of the side surface of the light emitting element 1 on the elastic sheet 20B. In this supply step S23, for example, the first member 2B1 to be the arrangement member 2B is supplied between the light emitting elements 1 via the supply nozzle. Then, the supply amount of the first member 2B1 supplied in the supply step S23 is set here so as to be the same height as the height of the light emitting element 1 when the expansion of the elastic sheet 20B is released. ing. The arrangement member 2B may cover at least a part of the side surface of the light emitting element 1, but it is preferable that the height of the arrangement member 2B is at least higher than the light emitting layer of the light emitting element 1. In the supply step S23, as shown in FIGS. 6D1 and 6D2, at a position where the side surfaces of the light emitting elements 1 face each other, the first member abuts on the side surface so as to face at least a part of the side surface of the light emitting element 1. It is supplied in the state of contact).

Further, at the stage of the supply step S23, the second member 2B2 may be supplied in a frame shape around the light emitting elements 1 arranged in a row. The second member 2B2 used here is the same member as the first member 2B1. The second member 2B2 is supplied at intervals while facing the side surface of the light emitting element. In this supply step S23, when the stretchable sheet 20B is in the predetermined stretched state, the first member 2B1 and the second member 2B2 are separated from the light emitting element 1 when the stretched state is released. It is known in advance whether it is formed in this way. Therefore, the supply amount of the first member 2B1 and the distance between the second member 2B2 and the side surface of the light emitting element 1 are set in advance so as to be appropriate for the mounting interval. Then, in the supply step S23, the first member 2B1 is supplied when the distance between the light emitting elements 1 is wider than the mounting distance, so that bubbles do not enter inside.

(Release process)
The releasing step S24 is a step of releasing the stretched state by the elastic force of the elastic sheet 20B. In this release step S24, the stretchable sheet 20B is removed from the fixing device 31B in the stretched state, and the stretched state is released by the elastic force of the stretchable sheet 20B. Specifically, the stretched state of the stretchable sheet 20B is released by removing the fixing member of the fixing device 31B and returning the push-up member to its original position. By removing the fixing device 31B and releasing the stretched state, the light emitting elements 1 after releasing the stretched state of the elastic sheet 20B from the distance (d1) between the light emitting elements 1 immediately after the light emitting element 1 is placed. The interval (d2) is narrowed, and the interval (d2) between the light emitting elements 1 is set as the mounting interval with the first member 2B1 interposed therebetween. Further, the second member 2B2 is in contact with the side surface of the light emitting element 1, and the peripheral edges of the four light emitting elements 1 are surrounded in a frame shape. As a result, a light emitting device 100B including four light emitting elements 1 can be obtained. Further, it is preferable to perform a step of curing the first member 2B1 and the second member 2B2 after the release step S24.

After the formation of the first member 2B1 in the supply step S23, the second member 2B2 may be formed after the release step S24 without forming the second member 2B2. When the second member 2B2 is formed after the release step S24, the second member 2B2 may be supplied in a frame shape around the light emitting element 1 as in the supply step S23, or a frame-shaped tool having a desired shape may be supplied. It may be formed by pouring the second member 2B2 using. Further, in the supply step S23, the first member 2B1 is supplied not only between the light emitting elements 1 but also on the side surfaces of the light emitting element 1 corresponding to both ends of the light emitting device 100B, and after the release step S24, a frame shape is formed around the light emitting element 1. The second member 2B2 may be supplied to the vehicle. When the first member 2B1 is supplied to the side surface of the light emitting element 1 corresponding to both ends of the light emitting device 100B, the height is likely to be lower than that of the first member 2B1 between the light emitting elements 1. In that case, the shape of the light emitting device 100B can be adjusted by supplying the second member 2B2 after the release step S24.

<First modification of the first embodiment>
Next, a first modification of the light emitting device according to each embodiment will be described.
The light emitting device 100C may be configured to include three light emitting elements 1. In the light emitting device 100C, the light emitted from the light emitting element 1 may be arranged so as to be RGB. A first member 2C1 is formed between the light emitting elements 1 at positions facing each other, and a second member 2C2 is provided around the light emitting element 1. Here, the arrangement member 2C is formed by the first member 2C1 and the second member 2C2.
In the light emitting device 100C, the three light emitting elements 1 are arranged so that a straight line virtually connecting the centers of the three light emitting elements 1 forms a triangle. That is, in the light emitting device 100C, two of the three light emitting elements 1 are mounted in parallel, and the remaining one is mounted so as to be located on the lateral side of each of the two light emitting elements 1.

The three light emitting elements 1 are a first semiconductor element that emits red light, a second semiconductor element that emits blue light, and a third semiconductor element that emits green light, respectively. According to such a light emitting device 100C, full-color display by RBG becomes possible.
The blue (wavelength 430 to 490 nm light) and green (wavelength 495 to 565 nm light) light emitting elements 1 include nitride semiconductors (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y. , X + Y ≦ 1), GaP and the like can be used. As the red light emitting device 1 (light having a wavelength of 610 to 700 nm), GaAlAs, AlInGaP, or the like can be used in addition to the nitride semiconductor device.
Such a light emitting device 100C can be manufactured by the same process as the manufacturing method of the light emitting device already described (see, for example, FIGS. 2, 3A to 3H2).

<First modification of the supply process>
In each embodiment, the first modification of the supply process will be described with reference to FIGS. 8A to 8C, and the second modification of the supply process will be described with reference to FIGS. 9A and 9B.
In the first modification of the supply process, the first member 2D1 is supplied to fill the gap between the light emitting elements 1 placed on the stretchable elastic sheet 20. Then, in the releasing step, the expansion of the elastic sheet 20 is released, and the distance between the light emitting elements 1 is set as the mounting interval. When the stretchability of the elastic sheet 20 is released in the releasing step, the first member 2D1 is pushed between the light emitting elements 1 on the side surface of the light emitting element 1 and overflows between the light emitting elements 1 and the upper surface of the wavelength conversion member 3. Will cover. After that, by performing a new polishing step, the first member 2D1 covering the wavelength conversion member 3 is removed, and the first member 2D1 is in a state of being filled in the gaps that are the mounting intervals of the light emitting element 1. As described above, in the supply step, the stretchable sheet 20 is stretched to supply the first member 2D1 between the light emitting elements 1 and polish the material overflowing to the wavelength conversion member 3 side, thereby polishing the wavelength conversion member. 3 may be exposed so that the first member 2D1 can be formed between the light emitting elements 1. In the supply step, by performing the first member polishing step of polishing the first member after the release step, it is not necessary to strictly adjust the supply amount of the first member 2D1 in advance.

<Second modification of the supply process>
Next, in the method of manufacturing the light emitting device according to each embodiment, a case where the first member 2E1 is supplied close to the side surface of the light emitting element 1 will be described. When the first member (arrangement member) 2E1 is arranged close to the side surface of the light emitting element 1, the first member 2E1 having a high viscosity to some extent is in a state where the stretchable sheet 20 is stretched, and a distance d1 is opened. Place it in a preset position. Then, by releasing the extension of the elastic sheet 20, the distance between the first member 2E1 and the side surface of the light emitting element 1 can be shortened, and the first member 2E1 can be arranged close to the side surface of the light emitting element 1. The height of the first member 2E1 is preferably at least higher than that of the light emitting layer of the light emitting element 1. In this way, by forming the light emitting device while maintaining the state in which the first member 2E1 and the side surface of the light emitting element 1 are close to each other without abutting (contacting), the light from the light emitting device is emitted from the side surface side of the light emitting element. It can also be irradiated from, and light extraction can be improved. When an attempt is made to supply the first member in close proximity without covering the side surface of the light emitting element 1, if the first member is not supplied at a position some distance from the light emitting element 1, the wetting spread to the side surface of the light emitting element 1 is suppressed. It's difficult. However, by using the elastic sheet 20, it is possible to arrange the light emitting element 1 closer to the side surface.

In the light emitting device, regardless of whether the light emitting element 1 is one or a plurality of light emitting elements 1, when the stretchable sheet is released, the first member 2E1 or the second member 2E2 is the light emitting element 1. It can be provided with a configuration in which it does not abut on the side surface. Further, in the supply step of supplying the first member 2E1, as an example, the first member 2E1 is supplied so that the distance between the light emitting element 1 and the first member 2E1 is 200 μm or more and 500 μm or less, and the stretchable sheet 20 is stretched. In the release step S14 for releasing the state, the mounting interval between the light emitting element 1 and the first member 2E1 is set to 50 μm or more and 200 μm or less.

<Manufacturing method of light emitting device according to the second modification of the supply process>
Next, an example of a method for manufacturing a light emitting device according to a second modification of the supply process will be described with reference to FIGS. 10A to 10F.
FIG. 10A is a plan view of an elastic sheet used in the method for manufacturing a light emitting device according to another embodiment. FIG. 10B is a plan view schematically showing a state in which wiring is formed on the elastic sheet of FIG. 10A. FIG. 10C is a plan view schematically showing a state in which a light emitting element is placed on the wiring in FIG. 10B. FIG. 10D is a plan view schematically showing a stretched state of the stretchable sheet in a state where the light emitting element is placed on the wiring in FIG. 10C. FIG. 10E is a plan view schematically showing a state in which the first member is supplied to the side of the side surface of the light emitting element of the stretchable elastic sheet in FIG. 10D. FIG. 10F is a plan view schematically showing a state in which the stretchable sheet is released from the stretched state and the first member is arranged facing the side of the light emitting element with a narrow interval in FIG. 10E.

As shown in FIGS. 10A to 10F, the first member 2F1 may be arranged close to the four side surfaces of the light emitting element 1 at a predetermined interval. As an example of the manufacturing method of the light emitting device according to the second modification of the supply process, a step of drawing a wire on the elastic sheet and mounting the light emitting element and a method of mounting the elastic sheet on which the light emitting element is mounted using a fixing device are used. A step of fixing the stretched elastic sheet with a fixing device, a step of supplying the first member 2F1 on the stretched elastic sheet, and a step of releasing the stretchable sheet. including. In the step of releasing the stretch of the stretchable sheet, it is preferable to release the stretch after the shape of the first member 2F1 is stabilized.

In this embodiment, first, the elastic sheet 20F is prepared and the wiring 40F is formed on the upper surface of the elastic sheet 20F. The wiring 40F is preferably made of a stretchable material, as described above. After forming the wiring 40F, the light emitting element 1 is electrically connected to the wiring 40F. The elastic sheet 20F to which the light emitting device 1 is connected to the wiring is in an extended state as described above. Further, the first member 2F1 is supplied to the stretched elastic sheet 20F with a preset interval (d1). Here, the first member 2F1 is supplied with the same spacing (d1) on the four side surfaces of the light emitting element 1. After that, by releasing the stretched state of the stretchable sheet 20F, the light emitting element 1 and the first member 2F1 become the mounting interval (d2), and the first member 2F1 is formed facing the vicinity of the side surface of the light emitting element 1. This makes it possible to form a light emitting device 100F. As described above, the method for manufacturing a light emitting device is also effective when there is a wide space between the light emitting elements 1 and the first member 2F1 is to be arranged close to each other between the four side surfaces of the light emitting element 1.

<Application Example 1 of the Embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Examples 1 to 8 of the embodiment will be described. In the following application examples 1 to 8, the same effect can be obtained by changing the order of the steps already described or by putting the newly performed process in the order of the steps already described.
As the method for manufacturing the light emitting device according to the application example 1 of the embodiment, the stretching step S11, the mounting step S12, the supply step S13, and the releasing step S14 described in the method for manufacturing the light emitting device according to the first embodiment are performed. Further, a step S15 for placing the product on the support substrate and a peeling step S16 for peeling the elastic sheet 20 to expose the element electrodes are included, and the steps are performed in this order. That is, the light emitting device has a support substrate 21, does not have an arrangement member 2A, and is not individualized as a light emitting device.

<Application example 2 of the embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Example 2 of the embodiment will be described.
The method for manufacturing the light emitting device according to the application example 2 of the embodiment includes the stretching step S11, the mounting step S12, the supply step S13, and the releasing step S14 described in the method for manufacturing the light emitting device according to the first embodiment. , The arrangement member forming step S17, the peeling step S16 for peeling the elastic sheet, and the individualizing step S20 are performed in this order. Then, in the arrangement member forming step S17, the arrangement member 2A as the second member 2A2 provided on the peripheral edge of the light emitting element 1 is filled to the height at which the element electrodes 11 and 12 are exposed so as not to require a polishing step. Will be supplied. That is, by supplying the second member 2A2 while sandwiching the elastic sheet and the support substrate before performing the peeling step S16, the back surface of the element electrodes 11 and 12 and the upper surface of the wavelength conversion member 3 are the second member. The side surface of the light emitting element 1 can be covered without covering with 2A2. When the upper surface of the wavelength conversion member 3 is covered with the arrangement member 2A, the arrangement member 2A may be removed by polishing or the like to expose the upper surface of the wavelength conversion member 3. As a result, a light emitting device 100 including three light emitting elements 1 or four light emitting elements 1 can be obtained.

<Application Example 3 of the Embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Example 3 of the embodiment will be described.
In the method for manufacturing a light emitting device according to Application Example 3 of the embodiment, after performing the stretching step S11, the mounting step S12, the supply step S13, and the releasing step S14, the light emitting element 1 is covered with the arranging member 2A (second member). The arrangement member forming step S17 is performed, and then the individualization step S20 and the peeling step S16 for peeling the elastic sheet are performed in this order.
In the method for manufacturing a light emitting device according to the application example 3 of the embodiment, in the method for manufacturing the light emitting device according to the application example 2 of the embodiment, the elastic sheet is peeled off to expose the electrodes, and the pieces are separated before the peeling step S16. The individualization step S20 is performed. In the individualization step S20, the elastic sheet 20 may or may not be cut.

<Application Example 4 of the Embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Example 4 of the embodiment will be described.
In the method of manufacturing the light emitting device according to the application example 4 of the embodiment, the respective steps S11 to S14, the placement member molding step S17 in which the light emitting element 1 is covered with the placement member 2A (second member), and the elastic sheet 20 are peeled off. The peeling step S16 for exposing the element electrodes 11 and 12 is included, and the steps are performed in this order. That is, the light emitting device is a device that has not been individualized.

<Application Example 5 of the Embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Example 5 of the embodiment will be described.
In the method of manufacturing the light emitting device according to the application example 5 of the embodiment, the stretching step S11 and the wavelength conversion member 3 which is the surface opposite to the surface having the element electrodes 11 and 12 face the elastic sheet 20. A mounting step S12 for placing the light emitting element 1 on the stretchable sheet 20 in the stretched state, a supply step S13, and a releasing step S14 for releasing the stretched state by the elastic force of the stretchable sheet 20 are performed in this order. ..

The method for manufacturing the light emitting device includes a step S15 in which the light emitting element 1 is placed on the support substrate to be mounted on the support substrate 21 so that the element electrodes 11 and 12 face the support substrate 21, and a peeling step in which the elastic sheet is peeled off. S16, an arrangement member forming step S17 in which the light emitting element 1 is covered with the arrangement member 2A (second member), a support substrate peeling step S19 for peeling off the support substrate 21, and an individualization step S20 for individualizing the light emitting element 1. And, and are performed in this order. When the upper surface of the wavelength conversion member 3 is covered with the arrangement member 2A, the arrangement member 2A may be removed by polishing or the like to expose the upper surface of the wavelength conversion member 3. As a result, a light emitting device 100 including three light emitting elements 1 or four light emitting elements 1 can be obtained.

<Application Example 6 of the Embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Example 6 of the embodiment will be described.
In the method for manufacturing a semiconductor device according to the application example 6 of the embodiment, the light emitting element 1 is mounted on the support substrate 21 so that the element electrodes 11 and 12 face the support substrate 21, and the step S15 is mounted on the support substrate. A peeling step S16 for peeling the elastic sheet, an arrangement member forming step S17 for covering the light emitting element 1 with the arrangement member 2A, and an individualization step S20 are performed in this order.
In the method for manufacturing a light emitting device according to Application Example 6 of the embodiment, the light emitting element 1 is individualized on the support substrate 21 without performing the support substrate peeling step S19 for peeling the support substrate. In the individualization step S20, the support substrate 21 may or may not be cut. Further, the support substrate 21 may be peeled off after the individualization step S20.

<Application Example 7 of the Embodiment>
Next, an example of a method for manufacturing a semiconductor device according to Application Example 7 of the embodiment will be described. In the method of manufacturing the light emitting device, after performing the stretching step S11 to the releasing step S14, the light emitting element 1 is placed on the support substrate 21 so that the element electrodes 11 and 12 face the support substrate 21. The arrangement member forming step S17 for forming the arrangement member 2A covering the side surface of the light emitting element 1 between the support substrate 21 and the elastic sheet 20 and the support substrate peeling for peeling off the support substrate 21. A step S19, a peeling step S16 for peeling the elastic sheet 20, and an individualizing step S20 for separating the light emitting element 1 are performed in this order.

In the arrangement member forming step S17, the arrangement member 2A (second member) is filled between the support substrate 21 and the elastic sheet 20 so as to cover the side surface of the light emitting element 1. For the coating of the light emitting element 1, a nozzle is used to supply an arrangement member which is a second member from between the support substrate 21 and the elastic sheet 20, and the second member is placed between the support substrate 21 and the elastic sheet 20. It may be filled. The other matters are the same except that the manufacturing method and the process sequence of the light emitting device according to the application example 6 of the embodiment are different.
As a result, a light emitting device 100 including four light emitting elements 1 can be obtained.

<Application Example 8 of the Embodiment>
Next, an example of a method for manufacturing a light emitting device according to Application Example 8 of the embodiment will be described.
In the method of manufacturing the light emitting device according to the application example 8 of the embodiment, the light emitting element 1 is mounted on the support substrate 21 so that the element electrodes 11 and 12 face the support substrate 21, and the step S15 is mounted on the support substrate. The arrangement member forming step S17 for arranging the arrangement member 2A covering the side surface of the light emitting element 1 between the support substrate 21 and the elastic sheet 20, the peeling step S16 for peeling off the elastic sheet, and the light emitting element 1. It includes the individualization step S20 for individualization, and is performed in this order.
In the method for manufacturing a light emitting device according to Application Example 8 of the embodiment, the support substrate peeling step S19 for peeling the support substrate 21 is not performed, but the individualization step S20 for individualizing the light emitting element 1 is performed on the support substrate 21. There is. In the individualization step S20, the support substrate 21 may or may not be cut. Further, the support substrate 21 may be peeled off after the individualization step S20.

<Manufacturing method of other embodiments>
As shown in FIG. 11, the stretchable sheet used in each embodiment may have the wiring 40G formed on the lower surface of the stretchable sheet 20G. FIG. 11 is an explanatory view schematically showing a configuration in which wiring is formed on the lower surface of the elastic sheet in each embodiment as a cross section.
For example, the stretchable sheet 20G is electrically connected to the element electrodes 11 and 12 of the light emitting element 1 via via wirings 40g1 and 40g2 provided so as to form wiring 40G on the lower surface and penetrate the stretchable sheet 20G. Can also be formed to do. Here, the via wirings 40g1 and 40g2 are connected to the element electrodes 11 and 12 via the wiring pad 41G formed on the upper surface of the elastic sheet. Further, when the first member 2G1 is supplied, it may be supplied so as not to come into contact with the light emitting element 1 and may come into contact with the light emitting element 1 after the expansion is released, or may be supplied so as not to come into contact with the light emitting element 1. Then, the first member (arrangement member) 2G1 may be arranged close to the side surface of the light emitting element 1.

As described above, in each embodiment, each application example, and each modification, as described above, the light emitting device is configured in the same manner regardless of the number of each set of the light emitting element 1 or when the light emitting element 1 is not set. It can also be manufactured by the manufacturing method of the light emitting device.
Further, the light emitting element 1 may have other shapes such as a triangle, a trapezoid, a rhombus, and a circle.
Further, for example, in the mounting step S11 in which the light emitting element is mounted, two directions of one and the other along the X direction, or two directions of one and the other along the Y direction orthogonal to the X direction. The elastic sheet 20 may be stretched to either one.

Further, in the mounting step S11 in which the light emitting element 1 is mounted, the stretchable sheet 20 may be extended in the radial direction from the center of the stretchable sheet 20.
Further, for example, in the element electrode exposure step S18 in which the electrode is exposed by polishing, the support substrate 21 may be peeled off, and the molded product coated with the arrangement member 2A may be placed on another support substrate and then polished. ..
Further, the method for mounting the semiconductor element and the method for manufacturing the semiconductor device may include other steps during or before and after each of the steps as long as the steps are not adversely affected. For example, a foreign matter removing step of removing foreign matter mixed in during manufacturing may be included.

Further, the arrangement member can be used by extending the elastic sheet between the light emitting elements even when it is used as an underfill if it is on the side of the side surface of the light emitting element. That is, the height or supply amount of the arrangement member is not limited as long as it is on the side of the side surface of the light emitting element. Further, it is desirable that the first member is supplied when the stretchable sheet is stretched, but the second member may be formed after the stretched state of the stretchable sheet is released. That is, when the second member is supplied, since there is a sufficient region between the second member and the light emitting element, it is easy to arrange the second member at a desired position. However, in the case where the second member is arranged close to the side surface of the light emitting element, it is preferable that the second member is supplied when the elastic sheet is stretched.

1 Light emitting element 2A, 2B Arrangement member 2A1, 2B1, 2C1, 2D1, 2E1, 2F1, 2G1 First member 2A2, 2B2, 2C2, 2E2 Second member 3 Frequency conversion member 11, 12 Element electrode 15 Cutting wire 20, 20B, 20F, 20G Elastic sheet 21 Support board 30, 31B Fixing device 40, 40F, 40G Wiring 41 Pair of wiring patterns 42, 43 Wiring part 100 Light emitting device S11 Extension process S12 Mounting process S13 Supply process S14 Release process S15 On support board Placement step S16 Peeling step S17 Arrangement member molding step S18 Element electrode exposure step S19 Support substrate peeling step S20 Fragmenting step

Claims (22)

The process of stretching the elastic sheet against the elastic force,
A step of placing at least one light emitting element in a preset area of the stretchable sheet in a stretched state, and
A step of supplying the first member to the side of the side surface of the light emitting element on the elastic sheet, and
A method for manufacturing a light emitting device, comprising a step of releasing the stretched state by an elastic force of the stretchable sheet. The light emitting device according to claim 1, wherein the distance between at least two light emitting elements after the step of releasing the stretched state is narrower than the distance between at least two light emitting elements in the step of mounting the light emitting element. Production method. The manufacturing of the light emitting device according to claim 1 or 2, wherein in the step of supplying the first member, the first member is supplied so as to come into contact with the side surface of the light emitting element after releasing the stretched state. Method. The light emitting device according to claim 1 or 2, wherein the step of supplying the first member is such that the first member is supplied so as not to come into contact with the side surface of the light emitting element after the extended state is released. Production method. The light emitting device according to claim 1 or 2, wherein the step of supplying the first member is as a side of the side surface of the light emitting element and is brought into contact with the side surface of the light emitting element to supply the first member. Production method. The light emitting device according to claim 1 or 2, wherein the step of supplying the first member is a side of the side surface of the light emitting element and supplies the first member with a space between the side surfaces of the light emitting element. Production method. In the step of mounting the light emitting element, the elastic sheet is attached to a fixing device and stretched by the fixing device to stretch the stretchable sheet against elastic force.
The method according to any one of claims 1 to 6, wherein in the step of releasing the stretched state, the stretchable sheet is removed from the fixing device to release the stretched state by the elastic force of the stretchable sheet. Manufacturing method of light emitting device. In the step of placing the light emitting element, the stretchable sheet is stretched, and the stretchable sheet is fixed to the fixing device in the stretched state.
The method according to any one of claims 1 to 6, wherein in the step of releasing the stretched state, the stretchable sheet is removed from the fixing device to release the stretched state by the elastic force of the stretchable sheet. Manufacturing method of light emitting device. In the step of placing the light emitting element, the elastic sheet is provided in two directions of one and the other along the X direction, or two directions of one and the other along the Y direction orthogonal to the X direction. The method for manufacturing a light emitting device according to any one of claims 1 to 8, wherein the elastic sheet is stretched to any one of the above. In the step of mounting the light emitting element, the elastic sheet has two directions, one and the other along the X direction, and two directions, one and the other along the Y direction orthogonal to the X direction. The method for manufacturing a light emitting device according to any one of claims 1 to 8, wherein the elastic sheet is stretched in four directions. The method for manufacturing a light emitting device according to any one of claims 1 to 6, wherein in the step of placing the light emitting element, the stretchable sheet is stretched in a radial direction from the center of the stretchable sheet. In the step of mounting the light emitting element, four of the light emitting elements are set as one set, and each set of the light emitting elements is placed in the matrix direction.
The light emitting device according to any one of claims 1 to 11, wherein in the step of releasing the stretched state, the distance between the four light emitting elements of each set is narrowed to be the mounting interval of the light emitting elements. Manufacturing method. In the step of mounting the light emitting element, the three light emitting elements are set as one set, and the light emitting element is placed at a position where a straight line virtually connecting the centers of the three light emitting elements of each set becomes a triangle. death,
The light emitting device according to any one of claims 1 to 11, wherein in the step of releasing the stretched state, the distance between the three light emitting elements of each set is narrowed to be the mounting distance of the light emitting elements. Manufacturing method. The light emission according to claim 13, wherein the three light emitting elements of each set are a first light emitting element that emits blue light, a second light emitting element that emits green light, and a third light emitting element that emits red light, respectively. How to make the device. In the step of mounting the light emitting element, the light emitting element is placed so that the distance between the light emitting elements is 100 μm or more and 500 μm or less.
The method for manufacturing a light emitting device according to any one of claims 1 to 14, wherein the step of releasing the stretched state is a step of setting the mounting interval between the light emitting elements to 20 μm or more and 100 μm or less. In the step of supplying the first member, the first member is supplied so that the distance between the light emitting element and the first member is 200 μm or more and 500 μm or less.
The method for manufacturing a light emitting device according to claim 1 or 14, wherein the step of releasing the stretched state is a mounting interval between the light emitting element and the first member of 50 μm or more and 200 μm or less. Prior to the step of mounting the light emitting element, the step of forming wiring on the elastic sheet is included.
The steps of forming the wiring are claimed 1 to 16 in which a plurality of a pair of wiring patterns having a region on which the light emitting element is placed are formed at equal intervals so that the regions on which the light emitting element is placed are arranged in parallel. The method for manufacturing a light emitting device according to any one of the above items. The method for manufacturing a light emitting device according to claim 1, further comprising a step of peeling off the elastic sheet to expose the electrodes of the light emitting element after performing the step of releasing the stretched state. .. The light emitting device according to claim 18, further comprising a step of mounting the light emitting element on the support substrate so that the surface opposite to the electrode faces the support substrate before the step of exposing the electrode. Production method. The method for manufacturing a light emitting device according to claim 18 or 19, further comprising a step of disassembling the light emitting element before or after the step of exposing the electrodes. After the step of exposing the electrode, a step of covering the light emitting element with an arrangement member so as to cover the electrode, and a step of covering the light emitting element with an arrangement member.
The method for manufacturing a light emitting device according to claim 19, further comprising a step of polishing the arrangement member to expose the electrodes. After the step of polishing the placement member to expose the electrodes,
The process of peeling off the support substrate and
The method for manufacturing a light emitting device according to claim 19, further comprising a step of disassembling the light emitting element.

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