JP7464216B2 - Processing method using organic fine particles - Google Patents

Description

The present disclosure relates to a processing method using organic microparticles, and more specifically to a processing method using organic microparticles for producing optical elements used in optical systems with wavelength bands ranging from the vacuum ultraviolet region to the hard X-ray region, and glass substrates with high-precision surfaces.

Light in the wavelength range from the vacuum ultraviolet region to the soft X-ray region and hard X-ray region is absorbed by most materials and has a very small refractive index, so except in special cases, transmitting optical elements cannot be used in the optical system, and it is necessary to use reflective optical elements that utilize reflection on the surface of the material. For example, the optical systems for X-rays generated by large synchrotron radiation facilities (such as SPring-8) and X-ray free electron lasers (such as SACLA) use various reflective X-ray mirrors, such as high-precision flat mirrors, spherical mirrors, and aspherical mirrors.

Conventionally, high-precision X-ray mirrors have been manufactured by the EEM (Elastic Emission Machining) method. The EEM method is an ultra-precision machining method in which a machining fluid containing dispersed fine particles is made to flow along the surface of a workpiece, the fine particles are brought into contact with the surface under substantially no load, and the interaction (a type of chemical bond) between the fine particles and the surface interface at that time removes surface atoms on the order of nearly atomic units (Patent Documents 1 to 3).

However, the silica (SiO ₂ ) fine particles used in the EEM process have a high cohesiveness, and unexpectedly large aggregated particles may adhere to the workpiece surface or collide with the surface, causing recessed defects. In addition, when a silicon-based material (single crystal silicon or glass containing silicon oxide) is used as the workpiece, the same type of silica fine particles adhered to the workpiece surface cannot be removed by etching or the like without eroding the workpiece surface, and it is also difficult to completely remove them by cleaning.

On the other hand, in the finish polishing technique using abrasive grains, the abrasive grains are pressed against the work surface under load using a polishing pad, so it is inevitable that the abrasive grains will cause numerous scratches and processing-altered layers on the work surface. The surface roughness of the work surface can be improved to some extent by making the abrasive grains finer, but fine abrasive grains tend to aggregate and are difficult to handle. Therefore, it has been proposed to use organic fine particles that are less hard and more elastic than glass substrates as abrasive grains for precision polishing of glass substrates for magnetic disks used in magnetic recording devices and glass substrates for mask blanks, which are original plates for manufacturing photomasks used in semiconductor manufacturing devices by photolithography (Patent Documents 4 and 5).

However, even if organic fine particles with a lower hardness than the glass substrate are used, the surface of the glass substrate is pressed against the substrate for polishing, and therefore scratches are unavoidable. Also, if the particle size of the organic fine particles varies, the pressure with which organic fine particles with a larger particle size are pressed against the workpiece surface is greater than that with organic fine particles with a smaller particle size, resulting in variation in the amount of polishing. On the other hand, organic fine particles with a uniform particle size are generally expensive.

Japanese Patent Publication No. 2-25745 Japanese Patent No. 3860352 Japanese Patent No. 4770165 Patent No. 6078942 Patent No. 6446590

In view of the above-mentioned situation, the object of the present disclosure is to provide a processing method using organic microparticles that can be used to manufacture optical elements for use in optical systems in wavelength bands ranging from the vacuum ultraviolet region to the hard X-ray region, and glass substrates with high-precision surfaces, by using an EEM process with a proven track record, which solves the problem of aggregation of processed microparticles, and which enables the processed microparticles to be easily removed even if they adhere to the workpiece surface after processing.

In order to solve the above-mentioned problems, the present disclosure provides a processing method using organic fine particles having the following configuration.

(1)
A machining fluid is used in which machining particles that can adhere to the surface of the workpiece through physicochemical interactions are dispersed in a solvent.
In an EEM process, the machining liquid is caused to flow along the workpiece surface, and the machining particles adhering to the workpiece surface in a non-loaded state are removed together with the workpiece surface atoms bonded to the machining particles by a shear flow of the machining liquid, thereby machining the workpiece,
The processing method using organic fine particles, wherein organic fine particles are used as the only solid material as the processed fine particles.

(2)
A machining fluid is used in which machining particles that can adhere to the surface of the workpiece through physicochemical interactions are dispersed in a solvent.
In an EEM process, the machining liquid is caused to flow along the workpiece surface, and the machining particles adhering to the workpiece surface in a non-loaded state are removed together with the workpiece surface atoms bonded to the machining particles by a shear flow of the machining liquid to machine the workpiece,
After processing the workpiece surface by an inorganic fine particle EEM process using inorganic fine particles as the processing fine particles,
The processing method using organic fine particles includes a finishing process for a work surface by an organic fine particle EEM process using organic fine particles as the only solid matter as the processed fine particles, and removing the inorganic fine particles adhering to the work surface.

(3)
The method for processing with organic fine particles according to (1) or (2), wherein the organic fine particles are made of an acrylic resin, a urethane resin or a styrene resin.

(4)
The method for processing organic fine particles according to any one of (1) to (3), wherein the organic fine particles have an average particle size in the range of 0.08 to 10 μm.

(5)
As a means for flowing the machining fluid along the workpiece surface, a rotating ball type machining head is used which rotates an elastic rotating ball while pressing it against the workpiece with a constant load, and machining fluid is entrained between the elastic rotating ball and the workpiece surface to generate a high shear flow, and machining is performed while maintaining a predetermined distance between the workpiece surface and the elastic rotating ball by balancing the fluid dynamic pressure caused by the flow of the machining fluid and the load.

(6)
As a means for flowing the machining liquid along the workpiece surface, a nozzle-type machining head that ejects the machining liquid from the nozzle of a machining nozzle is used, a predetermined machining gap is provided between the tip of the machining nozzle and the workpiece surface, the machining liquid is ejected from the nozzle of the machining nozzle toward the workpiece surface, and a high-shear flow of the machining liquid is generated along the vicinity of the surface to perform machining.

(7)
The processing method using organic fine particles according to (6), wherein the workpiece and at least the tip of the processing nozzle are immersed in the processing fluid, and the processing fluid is sprayed from the nozzle outlet of the processing nozzle toward the workpiece surface in the processing fluid.

(8)
The processing method using organic fine particles according to (6), further comprising arranging the workpiece and the processing nozzle in the air, and ejecting the processing fluid from the nozzle opening of the processing nozzle toward the workpiece surface in the air.

(9)
The processing method using organic fine particles according to any one of (1) to (8), wherein the organic fine particles remaining on the surface of the workpiece are removed using an organic solvent or an organic cleaning agent that does not corrode the workpiece.

According to the processing method using organic microparticles disclosed herein, organic microparticles that have good dispersibility in solvents such as water are used, thereby eliminating the problem of defects occurring on the workpiece surface due to aggregation of the processed microparticles, and since a high concentration processing liquid can be used, processing speed can be ensured.

INDUSTRIAL APPLICABILITY The present disclosure can be used to manufacture optical elements for use in optical systems with wavelength bands ranging from the vacuum ultraviolet region to the hard X-ray region, and glass substrates with high-precision surfaces, and the surface of an optical element material can be processed with high precision so that it can be used in optical systems with wavelength bands ranging from the vacuum ultraviolet region to the hard X-ray region.

In addition, by removing any organic fine particles remaining on the surface of the workpiece using an organic solvent or organic cleaning agent that does not corrode the workpiece, it is possible to provide a high-quality optical element that has the desired shape accuracy and has few adhering fine particles.

FIG. 1 is a schematic explanatory diagram of a machining method using a rotating ball type machining head type EEM according to the present disclosure. FIG. 2 is a simplified explanatory diagram of a processing method using the nozzle-type processing head type EEM of the present disclosure. FIG. 3 shows phase-shifting interference microscope images of the surface of the glass substrate before and after processing by the EEM. FIG. 4 is a graph showing the shape of the glass substrate before and after processing by the EEM. FIG. 5 is a phase-shifting interference microscope image showing the surface roughness of a glass substrate before and after processing by EEM.

Next, the present disclosure will be described in more detail based on the embodiments shown in the accompanying drawings. Fig. 1 is a simplified explanatory diagram of a processing method using a rotating ball type processing head type EEM, and Fig. 2 is a simplified explanatory diagram of a processing method using a nozzle type processing head type EEM of the present disclosure, in which reference numerals 1, 2 indicate a workpiece, 3 indicate a surface of the workpiece 1, and 3 indicate processed particles.

The workpieces of the present disclosure include Si single crystals and various oxides, which are optical element materials used in X-ray optical systems and EUV optical systems. Si single crystals are available with very high purity and few lattice defects, making them suitable as materials for reflective optical systems in the X-ray region. The present disclosure can also be well applied to glass substrates made of single-component or multi-component oxides, such as quartz glass and extremely low expansion glass ceramics.

<EEM Process>
The processing principle disclosed herein employs an EEM process in which a processing fluid in which processing particles capable of adhering to the surface of a workpiece through physicochemical interactions are dispersed in a solvent is used, the processing fluid is caused to flow along the workpiece surface, and the processing particles adhering to the workpiece surface in an unloaded state are removed together with the workpiece surface atoms bound to the processing particles by the shear flow of the processing fluid, thereby processing the workpiece.

The machining liquid is a suspension in which processing particles are dispersed at a predetermined concentration in water with few impurities, such as pure water or ultrapure water, as a solvent. Here, the pure water is, for example, water with an electrical conductivity of 10 μS/cm or less (1 atom, 25°C conversion value, the same below), and the ultrapure water is, for example, water with an electrical conductivity of 0.1 μS/cm or less. In addition, surfactants and other auxiliary agents may be mixed into the machining liquid in addition to water. In addition, there are a rotating ball type machining head method and a nozzle type machining head method as a means for flowing the machining liquid along the work surface, and processing particles are used in a form suitable for each method.

<Rotating ball type machining head EEM>
FIG. 1 shows a simplified diagram of the rotating ball type machining head EEM. In the rotating ball type machining head EEM, an elastic rotating ball 11 and a workpiece 1 are placed in a machining tank containing a machining liquid in which machining particles 3 are uniformly dispersed in pure water or ultrapure water, and the elastic rotating ball 11 is rotated while being pressed against the surface 2 of the workpiece 1 with a constant load F, so that the machining liquid is drawn in and flows between the elastic rotating ball 11 and the surface 2, and machining is performed while maintaining a predetermined distance by the balance between the fluid dynamic pressure caused by the flow of the machining liquid and the load. Here, the symbol P in FIG. 1 indicates the flow of the machining liquid. A sphere made of polyurethane is used as the elastic rotating ball 11, and the elastic rotating ball 11 is provided at the tip of a rotating shaft driven by a motor. Here, it is also possible to use a disk-shaped or cylindrical one as the elastic rotating ball 11.

Normally, a gap of about 1 μm is maintained between the elastic rotating balls 11 and the surface 2 during machining, so that machining particles 3 having a particle size smaller than this gap are used in order to act on the surface 2 of the workpiece 1 under no load. The machining particles 3 in the machining liquid pass between the surface 2 and the elastic rotating balls 11 one after another while contacting the surface 2 along with the machining liquid flow, and the machining of the surface 2 proceeds due to chemical interaction at the interface between the surface 2 and the machining particles 3.

In addition, to continuously process a large surface 2, the unit processing mark by the rotating ball type processing head can be scanned relatively to the workpiece 1. Here, the rotating ball type processing head is a part including the elastic rotating ball 11, and the symbol X in FIG. 1 indicates the relative movement direction of the rotating ball type processing head. On the other hand, to perform local processing of the workpiece surface 2, the amount of processing can be controlled for each part of the surface 2 by numerically controlling the residence time of the rotating ball type processing head according to the amount of processing obtained by subtracting the target surface profile from the surface profile before processing measured in advance. The unit processing mark is a removal profile processed in a unit time with the rotating ball type processing head stationary relative to the surface 2 of the workpiece 1.

<Nozzle-type processing head EEM>
Fig. 2 shows a simplified nozzle-type machining head type EEM. In the nozzle-type machining head type EEM, the workpiece 1 and at least the tip of the machining nozzle 21 are immersed in the machining liquid in the machining tank, the tip surface of the machining nozzle 21 is arranged parallel to the surface 2 of the workpiece 1, and the ejection direction is arranged perpendicular to the surface 2, and the machining liquid in which the machining fine particles 3 that are chemically reactive with the surface atoms of the workpiece 1 are uniformly dispersed is ejected from the ejection port 22 of the machining nozzle 21 into the liquid, a high shear flow of the machining liquid is generated along the vicinity of the surface 2, the machining fine particles 3 chemically bonded to the surface atoms are removed by the high shear flow, and the surface atoms are removed, and the machining is progressed. In Fig. 2, the symbol P indicates the flow of the machining liquid.

To continuously machine a wide area of the work surface 2, the nozzle-type machining head scans the surface 2 with a unit machining mark. Here, the nozzle-type machining head is a portion including the machining nozzle 21, and the symbol X in FIG. 2 indicates the relative movement direction of the nozzle-type machining head. On the other hand, to perform local machining of the surface 2, the dwell time of the nozzle-type machining head is numerically controlled according to the machining amount obtained by subtracting the target surface profile from the surface profile before machining measured in advance. In addition, the nozzle 22 of the machining nozzle 21 can be a circular hole or a horizontally long slit hole. When the nozzle 22 is a circular hole, the unit machining mark is small, making it suitable for local machining, and when it is a slit hole, it is suitable for uniformly machining a wide area. The direction of the machining fluid ejected by the nozzle 22 of the machining nozzle 21 may be inclined with respect to the surface 2 of the work 1. In that case, the profile of the unit machining mark is not symmetrical.

The machining tank is filled in advance with machining fluid in which fine particles are dispersed in pure water or ultrapure water, and the machining fluid is sprayed into the machining fluid from the machining nozzle 21 at a predetermined pressure to create a predetermined shear flow along the surface 2 of the workpiece 1. In this case, the machining fluid can be circulated by a pump for use. At this time, it is preferable to pass the machining fluid through a filter to remove large aggregated particles and foreign matter. The workpiece 1 and the machining nozzle 21 may be placed in the air, and the machining fluid may be sprayed from the nozzle 22 of the machining nozzle 21 toward the workpiece surface 2 in the air. In this case, the machining fluid sprayed from the machining nozzle 21 is also collected, and the machining fluid is circulated by a pump for use.

<Processed particles used in EEM process>
The inorganic fine particle EEM process using inorganic fine particles as the processed fine particles is a conventionally known normal EEM process, and oxides such as silica (SiO ₂ ), zirconia (ZrO ₂ ), ceria (CeO ₂ ), etc. are mainly used as the inorganic fine particles. Colloidal silica is usually used.

In the rotating ball type machining head EEM, a gap of about 1 μm is formed between the elastic rotating ball 11 and the surface 2, and maintaining this gap is important for non-contact machining. Therefore, the particle size of the machining fine particles 3 that can be used here must be sufficiently smaller than the above-mentioned gap. Usually, machining is performed using machining fine particles 3 made of silica with a particle size of less than about 0.1 μm. The machining fine particles can be changed depending on the material of the workpiece.

In addition, in the nozzle-type machining head EEM, the machining gap between the tip of the machining nozzle 21 and the workpiece surface 2 can be set relatively wide at 10 μm or more, so that machining fine particles 3 with a wide range of average particle diameters of 10 nm to 10 μm can be used. However, if the particle diameter of the fine particles is too large, there is a risk of scratches being caused on the surface 2 due to contact with the machining fine particles 3, so in practice, the upper limit is set to about several μm, and if the particle diameter is too small, it is necessary to extremely increase the velocity gradient of the shear flow to remove the machining fine particles 3 attached to the surface 2, so in practice, it is preferable to set the lower limit to about 0.1 μm. In practice, the machining speed is increased by using agglomerated fine particles, which are an aggregate of multiple fine particles, as the machining fine particles 3. As the agglomerated fine particles, silica fine particles with a particle diameter of 1 to 100 nm are aggregated to form an aggregate with an average diameter of 0.5 to 5 μm. Here, the concentration of the processed fine particles 3 made of inorganic fine particles in the processing liquid is preferably 3 to 7 vol % (equivalent to 6.4 to 14.2 wt % when the specific gravity of silica is 2.2).

The organic fine particle EEM process using organic fine particles as the only solid material as the processed fine particles is the technology that forms the basis of this disclosure. Here, as the organic fine particles, acrylic resin, urethane resin, or styrene resin is used. The acrylic resin is a polymer obtained by polymerizing an acrylic monomer (e.g., polymethyl methacrylate (PMMA) or the like), or a copolymer containing an acrylic monomer as a main component. The urethane resin is a urethane resin obtained by polymerizing a urethane monomer, or a copolymer containing a urethane monomer as a main component. The styrene resin is a styrene resin obtained by polymerizing a styrene monomer, or a copolymer containing a styrene monomer as a main component. Among them, it is preferable to use an acrylic resin or a urethane resin in particular, because of its good dispersibility in water and its ease of forming a slurry.

The average particle diameter of the organic fine particles is preferably in the range of 0.08 to 10 μm. If the average particle diameter of the organic fine particles is smaller than 0.08 μm, it is difficult to obtain them, and the adhesion force to the work surface 2 increases, so that the velocity gradient of the shear flow in the EEM process needs to be extremely large, which is not practical. On the other hand, if the average particle diameter of the organic fine particles is larger than 10 μm, the adhesion force to the work surface 2 decreases, so that the processing speed is slow, which is not practical. In the present disclosure, since the processing fine particles are brought into contact with the work surface in a substantially unloaded state, the requirement for uniformity of the particle size is lower than in polishing, so that a relatively inexpensive material can be used. Of course, in order to use the rotating ball type processing head type EEM, there is a restriction that the maximum particle diameter of the organic fine particles is smaller than the processing gap. Here, the concentration of the processing fine particles 3 made of organic fine particles in the processing liquid is preferably in the range of 10 to 50 wt %. If the concentration of the organic fine particles is lower than 10 wt %, the processing speed is slow, which is not practical. On the other hand, if the concentration of the organic fine particles is higher than 50 wt %, the viscosity of the machining liquid becomes too high, causing problems such as clogging in the pump circulation system and the machining nozzle.

Compared to the normal EEM process using silica fine particles, the processing speed of the organic fine particle EEM process is slow, but it is possible to improve the processing speed by increasing the concentration of the processing liquid. Also, in the nozzle-type processing head type EEM using the organic fine particle EEM process, it has been confirmed that the processing speed is faster when the processing liquid is sprayed from the processing nozzle onto the workpiece surface in the air than when the processing liquid is sprayed from the processing nozzle onto the workpiece surface in the processing liquid.

<Removal of organic fine particles>
Here, inorganic particles used as processing particles are attached to the surface of the glass substrate pre-processed by the inorganic particle EEM, but the inorganic particles attached to the surface of the glass substrate are removed by the organic particle EEM for finishing. Finally, the organic particles attached to the surface of the glass substrate are removed using an organic solvent or organic cleaning agent that does not corrode the glass substrate (work), resulting in a high-quality optical element with the desired shape accuracy and fewer attached particles. Here, removing the organic particles refers to a state in which the organic particles are completely dissolved, or at least the molecular bonds between the work surface and the organic particles are broken, and no organic particle components remain on the work surface.

Organic solvents used to remove organic particles attached to the workpiece 1 include hydrocarbons, alcohols, ketones, esters, ethers, etc., and organic cleaning agents include amine compounds, etc. For example, the hydrocarbons include aromatic hydrocarbons such as toluene, xylene, and styrene, chlorinated aromatic hydrocarbons such as chlorobenzene and orthochlorobenzene, chlorinated aliphatic hydrocarbons such as dichloromethane, trichloromethane, tetrachloromethane, 1,2-dichloroethane, 1,1,1-trichloroethane, 1,1,2,2-tetrachloroethane, 1,2-dichloroethane, trichloroethylene, and tetrachloroethylene, alicyclic hydrocarbons such as cyclohexanone, methylcyclohexanone, cyclohexanol, and methylcyclohexanol, and aliphatic hydrocarbons such as normal hexane. The alcohols include methanol, ethanol, isopropyl alcohol, 1-butanol, 2-butanol, isobutyl alcohol, isopentyl alcohol, 3-methoxy-3-methylbutanol, and 2-isopropoxyethanol. Examples of the ketones include acetone, methyl ethyl ketone, methyl butyl ketone, and methyl isobutyl ketone. Examples of the esters include methyl acetate, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, pentyl acetate, isopentyl acetate, 1-methoxypropyl-2-acetate, and 3-methoxy-3-methyl-1-butyl acetate. Examples of the ethers include ethyl ether, 1,4-dioxane, tetrahydrofuran, ethylene glycol monomethyl ether, and dipropylene glycol monomethyl ether. In addition, organic solvents such as cresol, carbon disulfide, and N,N-dimethylformamide are also included.

Examples of the amine compound include ethylenediamine, diethylenetriamine, triethylenetetraamine, tetraethylenepentamine, pentaethylenehexamine, 2-[(2-aminoethyl)amino]ethanol, 2-[methyl[2-(dimethylamino)ethyl]amino]ethanol, 2,2'-(ethylenebisimino)bisethanol, N-(2-hydroxyethyl)-N'-(2-aminoethyl)ethylenediamine, 2,2'-(2-aminoethylimino)diethanol, N1, Examples of such compounds include N4-bis(hydroxyethyl)diethylenetriamine, N1,N7-bis(hydroxyethyl)diethylenetriamine, 1,3-diamino-2-propanol, piperazine, 1-methylpiperazine, 3-(1-piperazinyl)-1-amine, 1-(2-aminoethyl)piperazine, 4-methylpiperazine-1-amine, 1-piperazinemethaneamine, 4-ethyl-1-piperazineamine, 1-methyl-4-(2-aminoethyl)piperazine, and 1-(2-hydroxyethyl)piperazine.

In particular, when organic fine particles of acrylic resin are used, the organic solvent used to remove the organic fine particles attached to the work 1 is preferably ethanol, isopropyl alcohol, acetone, or a chlorine-based solvent, such as trichloroethylene, chloromethane, or chloroethane. When organic fine particles of urethane resin are used, the organic solvent used to remove the organic fine particles attached to the work 1 is preferably a chlorine-based solvent, such as trichloroethylene, chloromethane, or chloroethane. When organic fine particles of styrene resin are used, the organic solvent used to remove the organic fine particles attached to the work 1 is preferably acetone or a chlorine-based solvent, such as trichloroethylene, chloromethane, or chloroethane.

These organic solvents or organic cleaning agents are not corrosive to optical element materials such as silicon single crystals and glass, in other words, they are not etching agents, and can only remove organic fine particles adhering to the surface of the optical element material, so they do not affect the surface precision after finishing.

An extremely low expansion glass substrate was used as the workpiece. The surface of the glass substrate was pre-processed with high accuracy. In the pre-processing, the glass substrate was machined to the required accuracy using, for example, CMP or an inorganic particle EEM process after a conventionally known combination of cutting and polishing. Then, the glass substrate was NC processed for planarization using an organic particle EEM process with a nozzle-type processing head EEM. The organic particles used in this embodiment were acrylic resin particles with an average particle size of 8 μm, and the concentration of the processing liquid was 30 wt%. The processed glass substrate was washed with ethanol.

Figure 3 shows the results of observing the surface of the glass substrate before and after processing using a phase-shifting interference microscope (Zygo, NewView). The processing area of the glass substrate is an area of 20 mm x 20 mm (shown by the dotted line in Figure 3). Figure 4 shows the cross-sectional shapes of the surface of the glass substrate before and after processing obtained from the observation results of Figure 3. It can be seen that the surface of the glass substrate had a waviness of about 80 nm before processing, but this was reduced to about 15 nm after processing and was flattened. Furthermore, by repeating EEM processing and shape measurement, it is possible to flatten the P-V to less than 10 nm.

Figure 5 shows the results of narrowing the area of the surface of the glass substrate before and after processing, observed with a phase-shifting interference microscope. The surface roughness of the glass substrate was 0.411 nm RMS before processing, but was 0.365 nm RMS after processing, which was a slight improvement. Incidentally, there were scratches extending diagonally on the surface of the glass substrate before processing, but these were caused by polishing and could not be removed even after processing. However, the scratches on the glass substrate can be removed by processing in advance with a rotating ball type processing head type EEM using an inorganic fine particle EEM process, or by performing local polishing.

The first aspect of the present disclosure includes finishing processing by a rotating ball type processing head system EEM using organic fine particles as the processed fine particles, or finishing processing by a nozzle type processing head system EEM using organic fine particles as the processed fine particles, or finishing processing by a rotating ball type processing head system EEM using organic fine particles as the processed fine particles followed by processing by a nozzle type processing head system EEM using organic fine particles as the processed fine particles, or finishing processing by a rotating ball type processing head system EEM using organic fine particles as the processed fine particles followed by processing by a nozzle type processing head system EEM using organic fine particles as the processed fine particles.

The second aspect of the present disclosure includes the following pre-processing prior to the above-mentioned finishing process: the present disclosure includes pre-processing by a rotating ball type processing head system EEM using inorganic fine particles as processed fine particles, or pre-processing by a nozzle type processing head system EEM using inorganic fine particles as processed fine particles, or pre-processing by a rotating ball type processing head system EEM using inorganic fine particles as processed fine particles followed by processing by a nozzle type processing head system EEM using inorganic fine particles as processed fine particles, or pre-processing by a rotating ball type processing head system EEM using inorganic fine particles as processed fine particles followed by processing by a nozzle type processing head system EEM using inorganic fine particles as processed fine particles.

1 Workpiece 2 Surface 3 Processing fine particles 11 Elastic rotating ball 21 Processing nozzle 22 Spout

Claims (9)

A machining fluid is used in which machining particles that can adhere to the surface of the workpiece through physicochemical interactions are dispersed in a solvent.
In an EEM process, the machining liquid is caused to flow along the workpiece surface, and the machining particles adhering to the workpiece surface in a non-loaded state are removed together with the workpiece surface atoms bonded to the machining particles by a shear flow of the machining liquid, thereby machining the workpiece,
The processing method using organic fine particles, wherein organic fine particles are used as the only solid material as the processed fine particles. A machining fluid is used in which machining particles that can adhere to the surface of the workpiece through physicochemical interactions are dispersed in a solvent.
In an EEM process, the machining liquid is caused to flow along the workpiece surface, and the machining particles adhering to the workpiece surface in a non-loaded state are removed together with the workpiece surface atoms bonded to the machining particles by a shear flow of the machining liquid, thereby machining the workpiece,
After processing the workpiece surface by an inorganic fine particle EEM process using inorganic fine particles as the processing fine particles,
The processing method using organic fine particles includes finishing the surface of a workpiece by an organic fine particle EEM process using organic fine particles as the only solid matter as the processed fine particles, and removing the inorganic fine particles adhering to the surface of the workpiece. 3. The method for processing with organic fine particles according to claim 1, wherein the organic fine particles are made of an acrylic resin, a urethane resin or a styrene resin. 4. The method for processing organic fine particles according to claim 1, wherein the organic fine particles have an average particle size in the range of 0.08 to 10 μm. A processing method using organic microparticles as described in any one of claims 1 to 4, in which a rotating ball type processing head is used as a means for flowing the processing liquid along the workpiece surface, in which an elastic rotating ball is pressed against the workpiece with a constant load while rotating, and the processing liquid is entrained between the elastic rotating ball and the workpiece surface to generate a high shear flow, and processing is performed while maintaining a predetermined distance between the workpiece surface and the elastic rotating ball by balancing the fluid dynamic pressure due to the flow of the processing liquid and the load. A processing method using organic microparticles according to any one of claims 1 to 4, in which a nozzle-type processing head that sprays processing liquid from a processing nozzle outlet is used as a means for flowing the processing liquid along the work surface, a predetermined processing gap is provided between the tip of the processing nozzle and the work surface, the processing liquid is sprayed from the processing nozzle outlet toward the work surface, and a high shear flow of the processing liquid is generated along the vicinity of the surface to perform processing. 7. The machining method using organic fine particles according to claim 6, wherein the workpiece and at least the tip of the machining nozzle are immersed in the machining fluid, and the machining fluid is sprayed from the nozzle outlet of the machining nozzle toward the workpiece surface in the machining fluid. 7. The machining method using organic fine particles according to claim 6, wherein the workpiece and the machining nozzle are placed in the air, and the machining fluid is sprayed toward the workpiece surface from a nozzle of the machining nozzle in the air. 9. The processing method using organic fine particles according to claim 1, wherein the organic fine particles remaining on the surface of the workpiece are removed using an organic solvent or an organic cleaning agent that does not corrode the workpiece.

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