JP7420260B2 - Insulated wires and electrical equipment - Google Patents

Description

The present disclosure relates to an insulated wire, a method for manufacturing the same, and an electrical device using the insulated wire.

Patent Document 1 discloses that an insulating layer is laminated on the outer peripheral surface of a conductive wire, an expansion layer that expands when heated is laminated on the outer peripheral surface of this insulating layer, and a heat-sealing layer is laminated on the outer peripheral surface of this expansion layer. Insulated wires are described. By manufacturing a coil using this insulated wire, it is possible to manufacture a coil in which the windings are fixed together by heat fusion. Further, by expanding the expansion layer during heating for the thermal fusion, the reliability of fusion between adjacent windings can be improved.

JP2016-35836A

However, with such conventional insulated wires, misalignment of the windings and twisting of the windings after the coil is manufactured can be suppressed by fixation by heat fusion, but it is difficult to wind the insulated wire before heat fusion. It is not possible to suppress positional displacement of the winding wire or twisting of the winding wire during work.

The present disclosure has been made in order to solve such problems, and is aimed at suppressing positional shift of the winding wire and twisting of the winding wire during winding when manufacturing a coil by winding an insulated wire. The purpose of the present invention is to provide an insulated wire, a method for manufacturing the same, and electrical equipment that can be used.

An insulated wire according to the present disclosure includes a conductor wire and an outermost layer that is the outermost layer laminated on the outer circumference side of the conductor wire, and the outermost layer is made of a semi-cured adhesive having insulating properties. and has a step formed by molding the semi-cured adhesive on its outer peripheral surface, and the semi-cured adhesive is a photo-curable adhesive.
Further, the insulated wire according to the present disclosure includes a conductor wire and an outermost layer that is the outermost layer laminated on the outer circumference side of the conductor wire, and the outermost layer is made of a semi-cured adhesive having insulating properties. It has a step formed by molding the semi-cured adhesive on its outer circumferential surface, and the outermost layer is laminated directly on the outer circumferential surface of the conductive wire.

In the insulated wire according to the present disclosure, when the insulated wire is wound in multiple layers to manufacture a coil, the step comes into contact with another portion of the insulated wire, and the movement of the contacted portion is restricted. Therefore, when a coil is manufactured by winding this insulated wire, misalignment between adjacent windings and twisting of the windings can be suppressed.

1 is a cross-sectional view of an insulated wire according to Embodiment 1. FIG. FIG. 2 is a cross-sectional view when the insulated wire shown in FIG. 1 is wound in multiple layers. FIG. 3 is a cross-sectional view showing a modification of the insulated wire according to the first embodiment. FIG. 3 is a cross-sectional view showing a modification of the insulated wire according to the first embodiment. FIG. 5 is a cross-sectional view when the insulated wire shown in FIG. 4 is wound in multiple layers. FIG. 3 is a cross-sectional view showing a modification of the insulated wire according to the first embodiment. FIG. 7 is a cross-sectional view when the insulated wire shown in FIG. 6 is wound in multiple layers. FIG. 3 is a cross-sectional view showing a modification of the insulated wire according to the first embodiment. FIG. 9 is a cross-sectional view when the insulated wire shown in FIG. 8 is wound in multiple layers. 9 is a sectional view showing a modification of the insulated wire of FIG. 8. FIG. FIG. 3 is a cross-sectional view showing a modification of the insulated wire according to the first embodiment. FIG. 12 is a cross-sectional view when the insulated wire shown in FIG. 11 is wound in multiple layers. FIG. 5 is another cross-sectional view when the insulated wire shown in FIG. 4 is wound in multiple layers. FIG. 3 is a cross-sectional view showing a modification of the insulated wire according to the first embodiment. FIG. 3 is a cross-sectional view showing a modification of the insulated wire according to the first embodiment. FIG. 16 is a cross-sectional view of the insulated wire shown in FIG. 15 when wound in multiple layers. FIG. 3 is a cross-sectional view showing a modification of the insulated wire according to the first embodiment. FIG. 3 is a cross-sectional view of an insulated wire according to a second embodiment. FIG. 7 is a cross-sectional view showing a modification of the insulated wire according to the second embodiment. FIG. 7 is a cross-sectional view showing a modification of the insulated wire according to the second embodiment. FIG. 2 is a flow diagram showing an outline of the manufacturing process of the insulated wire according to the first embodiment. 22 is a schematic diagram of a manufacturing apparatus used in the manufacturing process of FIG. 21. FIG. 23 is a schematic diagram showing the configuration of an extrusion molding machine 105 in FIG. 22. FIG. 6 is a schematic diagram illustrating a coil formed by winding the insulated wire of FIG. 5. FIG. 6 is a schematic diagram showing another example of a coil formed by winding the insulated wire of FIG. 5. FIG.

Embodiment 1.
Hereinafter, the structure of the insulated wire of the present disclosure and the manufacturing method thereof will be described. The insulated wire of the present disclosure is used as a coil winding of a motor, a generator, a transformer, a solenoid, a reactor, etc. of various electrical devices.

FIG. 1 is a cross-sectional view of an insulated wire 10 according to Embodiment 1 of the present disclosure. FIG. 1 shows a cross section of the insulated wire 10 in a direction perpendicular to the stretching direction. The insulated wire 10 has the same cross section throughout its extending direction, that is, the cross section shown in FIG. 1. The insulated wire 10 includes a conductive wire 1 , an insulating layer 2 laminated on the outer circumferential surface of the conductive wire 1 , and a semi-cured adhesive layer 3 laminated on the outer circumferential surface of the insulating layer 2 . The semi-cured adhesive layer 3 is the outermost layer (outermost layer) of the insulated wire 10.

The semi-cured adhesive layer 3 is a layer made of a semi-cured adhesive in a semi-cured state. A semi-cured adhesive is an adhesive that can maintain a semi-cured state. For example, as a semi-cured adhesive, a B-stage adhesive that can be in a B-stage state is known. The B stage is an intermediate state of hardening of the thermosetting resin, and the resin in this state softens when heated and swells when it comes into contact with a certain type of solvent, but does not completely melt or dissolve. Such a semi-cured adhesive can be brought into a fully cured state by subjecting it to a predetermined treatment such as heating for a certain period of time or more from a semi-cured state. The semi-cured adhesive used here is not limited to thermosetting resins such as B-stage adhesives, as long as it can maintain a semi-cured state at room temperature for a certain period of time, as well as UV curable resins. It may also be a photocurable resin such as. The semi-hardened state here refers to an intermediate hardened state.

In the first embodiment, the semi-cured adhesive layer 3, which is the outermost layer, has the following characteristics. The semi-cured adhesive layer 3 has insulating properties and contributes to the insulation of the conductive wire 1. Further, the semi-cured adhesive layer 3 is in a semi-cured state, and by winding the insulated wire 10 in multiple layers and fully curing it, a coil in which the windings are fixed can be manufactured.

Furthermore, a step 4 is formed on the outer peripheral surface of the semi-cured adhesive layer 3. Therefore, when the insulated wire 10 is wound in multiple layers, the step 4 comes into contact with other parts of the insulated wire 10 and restricts the movement of that part. Therefore, if a coil is manufactured using this insulated wire 10, displacement of the winding wire and twisting of the winding wire during winding can be suppressed. In FIG. 1, the step 4 is formed as a part of the recess 5 by providing the recess 5 on the outer peripheral surface of the semi-cured adhesive layer 3. The steps 4 in FIG. 1 are the side surfaces 4a and 4b within the recess 5, respectively. When this insulated wire 10 is wound in multiple layers, the lower right corner portion 9 of the adjacent winding wire, which is a non-recessed portion, can be fitted into the recessed portion 5, as shown in FIG. 2, for example.

Further, the step 4 is formed by molding a semi-cured adhesive forming the semi-cured adhesive layer 3. Therefore, in the manufacturing process of the insulated wire 10, if extrusion molding or the like, which will be described later, is used, the semi-cured adhesive layer 3, including the steps 4 thereof, can be molded all at once.

Hereinafter, the structure of the insulated wire 10 shown in FIG. 1 will be explained in more detail. The conducting wire 1 is, for example, a copper wire, an aluminum wire, or an alloy wire thereof. As the material of the copper wire, for example, tough pitch copper, oxygen-free copper, etc. can be used. As the material of the aluminum wire, for example, hard aluminum can be used. Examples of materials for alloy wires include copper and tin alloys, copper and silver alloys, copper and zinc alloys, copper and chromium alloys, copper and zirconium alloys, aluminum and copper alloys, and aluminum and silver alloys. , an alloy of aluminum and zinc, an alloy of aluminum and iron, etc. can be used. The conducting wire 1 may be a single wire made of one conductor, or a twisted wire made of a plurality of conductors twisted together. Although FIG. 1 shows the case where the conductive wire 1 is a flat wire with a rectangular cross-sectional shape, it may be a round wire with a circular cross-sectional shape or a conductor with a polygonal cross-sectional shape.

The material of the insulating layer 2 is, for example, polyetheretherketone (PEEK), polyphenylene sulfide (PPS), polyetherimide (PEI), polyamideimide (PAI), polyimide (PI), polybenzimidazole (PBI), polyether. These include sulfone (PES) and polypropylene (PP).

The insulating layer 2 can be formed on the surface of the conductive wire 1 by, for example, an extrusion coating method. When the insulating layer 2 is formed by an extrusion coating method, the thickness of the insulating layer 2 is preferably 30 μm or more from the viewpoint of making the thickness of the insulating layer 2 uniform. Moreover, if the thickness of the insulating layer 2 is too thin, the insulation properties of the insulating layer 2 will be greatly reduced, and if it is too thick, it will be unsuitable for miniaturization and winding will be difficult. From such a viewpoint, the thickness of the insulating layer 2 is preferably 30 μm or more and 150 μm or less, and more preferably 50 μm or more and 70 μm or less.

The above-mentioned materials used for the insulating layer 2 have high volumetric efficiency and are stable and resistant to deterioration, but may have poor adhesion to the conductive wire 1. In that case, before applying the insulating layer 2 on the surface of the conducting wire 1, the surface of the conducting wire 1 may be subjected to physical or chemical treatment to improve the adhesion and adhesive strength between the conducting wire 1 and the insulating layer 2. You can improve. As such a physical treatment, atmospheric plasma treatment, deep ultraviolet light treatment, corona discharge treatment, thinning treatment (laser thinning, polishing, sandblasting), etc. can be used.

Alternatively, as a chemical treatment, a silane coupling agent may be applied onto the surface of the conductive wire 1, and the insulating layer 2 may be applied on the silane coupling agent. When applying an epoxy adhesive between the conductor 1 and the insulating layer 2, apply a silane coupling agent as a primer on the surface of the conductor 1, apply the epoxy adhesive on top of the primer, and then The insulating layer 2 may be applied to the surface to be adhered using an epoxy adhesive. Such primers include 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethylditoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxypropylmethylditoxysilane. Ethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, 3-aminopropyltrimethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, N-phenyl -3-aminopropyltrimethoxysilane, N-(benylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride, and the like can be used. An epoxy adhesive containing a silane coupling agent may be applied to the surface of the conductive wire 1, and the insulating layer 2 may be applied using the epoxy adhesive as the surface to be adhered. The surface of the conducting wire 1 may be subjected to both the above-mentioned physical treatment and chemical treatment.

The semi-cured adhesive layer 3 is a layer made of a semi-cured adhesive in a semi-cured state. As this semi-cured adhesive layer 3, for example, a B-stage adhesive or a UV-curable adhesive can be used. A suitable B-stage adhesive for the semi-cured adhesive layer 3 is, for example, a mixture of 60 to 75 wt% of bisphenol A epoxy resin and 25 to 35 wt% of cresol novolak epoxy resin, and an amine curing agent 1. It is possible to use a product that has been kneaded with ~5 wt% added. A suitable UV curable adhesive for the semi-cured adhesive layer 3 is, for example, a mixture of 30 to 40 wt% of bisphenol A epoxy resin and 20 to 30 wt% of bisphenol F epoxy resin, and a mixture of antimony sulfonium fluoride and the like. A material kneaded with 1 to 5 wt% of a photocuring agent can be used.

In the semi-cured adhesive layer 3, such a semi-cured adhesive has not been fully cured, and is in a semi-cured state. The B stage of the B stage adhesive is in a semi-cured state. A UV curable adhesive can be brought into a semi-cured state by irradiating the adhesive with ultraviolet rays. When a B-stage adhesive is used as the semi-cured adhesive layer 3, a B-stage adhesive that can be turned into a B-stage by ultraviolet rays may be used.

In order to improve the adhesion and adhesive strength between the insulating layer 2 and the semi-cured adhesive layer 3, physical treatment or chemical treatment may be performed before applying the semi-cured adhesive layer 3 on the surface of the insulating layer 2. good. As such a physical treatment, atmospheric plasma treatment, deep ultraviolet light treatment, corona discharge treatment, and thinning treatment (laser thinning, polishing, sandblasting), etc. can be used.

Alternatively, as a chemical treatment, a silane coupling agent may be applied as a primer on the surface of the insulating layer 2, and the semi-cured adhesive layer 3 may be applied using the primer as the surface to be adhered. When using an epoxy adhesive as the semi-cured adhesive forming the semi-cured adhesive layer 3, the primer may be 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyl. Dithoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, 3-aminopropyltrimethoxysilane, 3 -Triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-(benylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride Salt etc. can be used. The surface of the insulating layer 2 may be subjected to both the above-mentioned physical treatment and chemical treatment.

Hereinafter, for convenience of explanation, the expressions ``top'', ``bottom'', ``left'', and ``right'' will be used to correspond to the up, down, left, and right directions on the paper surface of each figure. In addition, when the insulated wire 10 is wound in multiple layers to generate a coil, a case will be described where the insulated wire 10 is wound with the lower side inside, but this is only an example, and the winding of the insulated wire 10 is The method is not limited to this.

In FIG. 1, a step 4 is formed by providing a recess 5 on the upper surface of the semi-cured adhesive layer 3, which is the outermost layer. In FIG. 1, the steps 4 are the side surfaces 4a and 4b of the recess 5, respectively. 4a is the left side surface within the recess 5, and 4b is the right side surface within the recess 5. Furthermore, a recess 6 is formed on the lower surface of the semi-cured adhesive layer 3. 7a is the left side surface within the recess 6, and 7b is the right side surface within the recess 6.

Reference numeral 8 in FIG. 1 is the upper left corner of the semi-cured adhesive layer 3, and specifically, the portion from the left end 81 of the semi-cured adhesive layer 3 to the left side surface 4a of the recess 5. 9 is the lower right corner of the semi-cured adhesive layer 3; specifically, it is a portion from the right end 91 of the semi-cured adhesive layer 3 to the right side surface 7b of the recess 6. The recess 5 is formed in a size that allows the lower right corner 9 to be inserted into the recess 5. The recess 6 is formed in a size such that the upper left corner 8 can be inserted into the recess 6.

In FIG. 1, the thickness of the semi-cured adhesive layer 3 is the same for the portions located in any of the upper, lower, left, and right directions of the insulating layer 2; The thickness of the portions located in the directions may be made different. Further, the thickness of the insulating layer 2 may be the same over the entire outer periphery of the conductive wire 1, or there may be portions with different thicknesses. For example, since the semi-cured adhesive layer 3 has reduced insulation properties due to the presence of the recesses 5 and 6 located in the vertical direction of the insulating layer 2, the thickness of the insulating layer 2 is may be made thicker than the thickness of the portions of the conducting wire 1 located in the left-right direction.

FIG. 2 is a cross-sectional view of the insulated wire 10 shown in FIG. 1, which is wound in multiple layers with its lower surface facing inside. FIG. 2 shows a cross section in a direction perpendicular to the winding direction. In this manner, the lower right corner portion 9 of the semi-cured adhesive layer 3, which is a non-recessed portion, can be fitted into the recessed portion 5 of the semi-cured adhesive layer 3. Furthermore, the upper left corner portion 8 of the semi-cured adhesive layer 3 can be fitted into the recess 6 of the semi-cured adhesive layer 3.

In this way, by fitting the lower right corner 9 of the semi-cured adhesive layer 3, which is a non-concave part, into the recess 5 of the semi-cured adhesive layer 3, when a coil is manufactured by winding the insulated wire 10, the adjacent It is possible to suppress misalignment between the windings and twisting of the windings. Furthermore, by allowing the upper left corner 8 of the semi-cured adhesive layer 3 to fit into the recess 6 of the semi-cured adhesive layer 3, the upper left corner 8 does not interfere between adjacent windings. , it becomes easier to fit the lower right corner 9 into the recess 5.

Note that it is not necessary to fit the non-recessed portion into the recess 5 over the entire insulated wire 10 to be wound, and when winding the insulated wire 10 in multiple layers, at least a portion of the insulated wire 10 In this case, if another portion of the insulated wire 10 comes into contact with the side surface 4a or the side surface 4b of the recessed portion, misalignment of the winding wire and twisting of the winding wire can be suppressed.

Furthermore, the insulated wire 10 may be wound in a regular manner sequentially from the inner winding layer to the outer winding layer using a winding machine or the like; however, it may be wound by hand or the like. , it may be irregularly wound in multiple layers.

1 and 2, by increasing the distance between the side surfaces 4a and 4b from the bottom of the recess 5 toward the opening of the recess 5, the lower right corner 9 can be easily fitted into the recess 5. It has a taper. Further, by increasing the distance between the side surfaces 7a and 7b from the bottom of the recess 6 toward the opening of the recess 6, a taper is provided so that the upper left corner 8 can be easily fitted into the recess 6. .

FIG. 3 is a sectional view showing a modification of the insulated wire 10 of FIG. 1. In FIG. 3, parts that are the same as or correspond to those in FIG. 1 are given the same reference numerals, and explanations thereof will be omitted. In FIGS. 1 and 2, the tapers of the side surfaces 4a, 4b, 7a, and 7b are formed in a flat shape, but as shown in FIG. may be formed. 3 is the same as FIG. 1 in other parts.

FIG. 4 is a sectional view showing a modification of the insulated wire 10 of the first embodiment. In FIG. 4, parts that are the same as or correspond to those in FIG. 1 are given the same reference numerals, and explanations thereof will be omitted. In FIGS. 1 to 3, the step 4 is formed by forming a recess 5 in the semi-cured adhesive layer 3 having side surfaces 4a and 4b facing each other. In FIG. 4, the step 4 is formed above the insulating layer 2 by not providing the semi-cured adhesive layer 3 in the portion from the step 4 to the right end portion 91. Moreover, the step 7 is formed by not providing the semi-cured adhesive layer 3 in the portion from the step 7 to the left end portion 81 below the insulating layer 2 . In FIG. 4, the upper left corner 8 is the portion of the semi-cured adhesive layer 3 from the step 4 to the left end 81. Further, the lower right corner portion 9 is the portion from the step 7 of the semi-cured adhesive layer 3 to the right end portion 91.

FIG. 5 is a cross-sectional view of the insulated wire 10 shown in FIG. 4, which is wound in multiple layers with its lower surface facing inside. FIG. 5 shows a cross section in a direction perpendicular to the winding direction. As described above, since the semi-cured adhesive layer 3 has the step 4, when manufacturing a coil by winding the insulated wire 10 in multiple layers, the lower right corner 9 of the insulated wire 10 comes into contact with the step 4, and the lower right corner The movement of section 9 is restricted. Therefore, positional displacement of the winding and twisting of the winding during winding of the insulated wire 10 are suppressed.

FIG. 6 is a sectional view showing another modification of the insulated wire 10 of the first embodiment. In FIG. 6, parts that are the same as or correspond to those in FIG. 1 are given the same reference numerals, and explanations thereof will be omitted. In FIGS. 1 to 5, the step 4 was formed by partially exposing the insulating layer 2 inside the semi-cured adhesive layer 3 without partially providing the outermost semi-cured adhesive layer 3. In FIG. 6, the step 4 is formed by partially reducing the thickness of the outermost circumferential semi-cured adhesive layer 3.

Similarly, regarding the recess 6, in FIGS. 1 to 5, the outermost semi-cured adhesive layer 3 is not partially provided, and the insulating layer 2 inside the semi-cured adhesive layer 3 is partially exposed. By doing so, a recess 6 was formed. In FIG. 6, the concave portion 6 is formed by partially reducing the thickness of the semi-cured adhesive layer 3 as the outermost layer.

In FIG. 6, the step 4 is formed by partially reducing the thickness of the outermost semi-cured adhesive layer 3, so that the insulating layer 2 is not exposed and is protected, and the semi-cured adhesive layer 3 is also Since it has insulating properties, the effect of insulating the conducting wire 1 is increased. Furthermore, it is also possible to make the insulating layer 2 thinner as the effect of the semi-cured adhesive layer 3 to insulate the conducting wire 1 increases.

The thicker the insulating layer 2 and semi-hardened adhesive layer 3, the greater the effect of insulating the conductor 1, but if they are too thick, they are unsuitable for miniaturizing the coil. From this, the thickness of the insulating layer 2 is 30 μm to 150 μm, and the thickness of the portion of the semi-cured adhesive layer 3 that covers the entire outer peripheral surface of the insulating layer 2 (that is, the thickness not including the thickness of the recess) is: The thickness is preferably 10 μm to 50 μm. Further, the total thickness of the insulating layer 2 and the semi-cured adhesive layer 3 is preferably 50 to 150 μm, more preferably 50 to 100 μm.

Furthermore, if the height of the step 4 of the recess 5 or the step 7 of the non-recessed portion that contacts the step 4 is too low, the contact area when the step 4 and the step 7 come into contact is small, resulting in positional deviation between adjacent windings. The effect of suppression becomes smaller. From this, the depth of the recess 5 provided in the semi-cured adhesive layer 3 and the height of the step 7 are preferably 5 μm or more, more preferably 10 μm or more.

FIG. 7 is a cross-sectional view of the insulated wire 10 shown in FIG. 6, which is wound in multiple layers with its lower surface facing inside. FIG. 7 shows a cross section in a direction perpendicular to the winding direction. In this manner, the lower right corner portion 9 of the semi-cured adhesive layer 3, which is a non-recessed portion, can be fitted into the recessed portion 5 of the semi-cured adhesive layer 3. Furthermore, the upper left corner portion 8 of the semi-cured adhesive layer 3 can be fitted into the recess 6 of the semi-cured adhesive layer 3.

In FIG. 2, the lower right corner 9 is fitted into the recess 5 with almost no gap, but as shown in FIG. It may be inserted with a gap. Even in that case, when winding the insulated wire 10 in multiple layers, the side surfaces 4a and 4b of the recess 5 are moved so that the lower right corner 9 does not shift significantly in the left-right direction. limit. Therefore, it is possible to suppress positional displacement of the winding wire and twisting of the winding wire when the insulated wire 10 is wound.

In addition, in FIG. 2, the upper left corner 8 was fitted into the recess 6 with almost no gap, but as shown in FIG. It may be inserted with a gap. Even in that case, when the insulated wire 10 is wound in multiple layers, the upper left corner 8 does not interfere between adjacent windings, and the lower right corner 9 can be easily fitted into the recess 5.

Note that the semi-cured adhesive layer 3 on which the recess 5 and the lower right corner 9 are formed is in a semi-cured state, so the lower right corner 9 is formed to be larger than the recess 5, and the semi-cured adhesive layer 3 is at room temperature or While heating the semi-cured adhesive layer 3 to give it viscosity, press the lower right corner 9 into the recess 5 so that the lower right corner 9 is in close contact with the recess 5. The portion 9 or the recess 5 may be modified.

FIG. 8 is a sectional view showing another modification of the insulated wire 10 of the first embodiment. FIG. 8 shows a cross section of the insulated wire 10 in a direction perpendicular to the stretching direction. In FIG. 8, parts that are the same as or correspond to those in FIG. In FIGS. 1 to 7, a step 4 is formed by providing a recess 5 in the outermost semi-cured adhesive layer 3. In FIG. 8, a step 12 is formed by providing a convex portion 11 on the semi-cured adhesive layer 3 as the outermost layer.

In FIG. 8, the steps 12 are on the side surfaces 12a and 12b of the convex portion 11, respectively. 12a is a left side surface of the convex portion 11, and 12b is a right side surface of the convex portion 11. Furthermore, a recess 6 is formed on the lower surface of the semi-cured adhesive layer 3. 7a is the left side surface within the recess 6, and 7b is the right side surface within the recess 6. The convex portion 11 is formed in a size that can be fitted into the concave portion 6.

FIG. 9 is a cross-sectional view of the insulated wire 10 shown in FIG. 8, which is wound in multiple layers with its lower surface facing inside. FIG. 9 shows a cross section of the insulated wire 10 in a direction perpendicular to the stretching direction. In this manner, when winding the insulated wire 10, by fitting the protrusion 11 of the semi-cured adhesive layer 3 into the recess 6 of the semi-cured adhesive layer 3, the insulated wire 10 can be wound to produce a coil. In some cases, misalignment between adjacent windings and twisting of the windings can be suppressed.

In FIGS. 8 and 9, the gap between the side surfaces 12a and 12b is tapered so that the protrusion 11 can be easily inserted into the recess 6 by decreasing the distance toward the tip of the protrusion 11. . Furthermore, by increasing the distance between the side surfaces 7a and 7b from the bottom of the recess 6 toward the opening of the recess 6, a taper is provided so that the protrusion 11 can be easily fitted into the recess 6.

FIG. 10 is a sectional view showing a modification of the insulated wire 10 of FIG. 8. In FIG. 8, the gap between the side surfaces 12a and 12b is tapered so as to decrease toward the tip of the convex portion 11, but in FIG. 10, the gap is increased toward the tip of the convex portion 11. It has a taper like this. Furthermore, in FIG. 8, the gap between the side surfaces 7a and 7b is tapered so as to increase from the bottom surface of the recess 6 toward the opening of the recess 6, but in FIG. A taper is provided so that it becomes smaller towards the end. Thereby, when the insulated wire 10 is wound and the protrusion 11 of the adjacent winding wire is fitted into the recess 6, the protrusion 11 becomes difficult to come out from the recess 6.

FIG. 11 is a sectional view showing another modification of the insulated wire 10 of the first embodiment. In FIG. 11, parts that are the same as or correspond to those in FIG. 1 are given the same reference numerals, and explanations thereof will be omitted. In FIG. 11, the semi-cured adhesive layer 3 is not provided on the right side of the insulating layer 2, and the semi-cured adhesive layer 3 is provided only on the upper, lower, and left sides of the insulating layer 2. Also, the thickness a of the semi-cured adhesive layer 3 above the insulating layer 2, the thickness c of the semi-cured adhesive layer 3 below the insulating layer 2, and the thickness c of the semi-cured adhesive layer 3 on the left side of the insulating layer 2. The thickness b is the same or substantially the same. Further, the thickness of the insulating layer 2 is the same or substantially the same over the entire circumference of the conductive wire 1.

FIG. 12 is a cross-sectional view of the insulated wire 10 shown in FIG. 11, which is wound in multiple layers with its lower surface facing inside. FIG. 12 shows a cross section of the insulated wire 10 in a direction perpendicular to the stretching direction. Here, not only the vertically adjacent windings of the insulated wire 10 but also the horizontally adjacent windings of the same layer are shown. Thus, in FIG. 12, the distances between the insulating layers 2 of the windings adjacent in the vertical direction are a and c, and the distance between the insulating layers 2 of the windings adjacent in the horizontal direction is b. Here, a=b=c (or they are substantially the same). Therefore, the thicknesses a and c of the semi-cured adhesive layer 3 that contribute to the insulation between the vertically adjacent insulating layers 2, and the thickness b of the semi-cured adhesive layer 3 that contributes to the insulation between the horizontally adjacent insulating layers 2. can be made the same.

When the thickness of the insulating layer 2 is the same over the entire circumference of the conductor 1, the thickness of the semi-cured adhesive layer 3, which is preferably provided between the insulating layers 2 adjacent in the left-right direction, and the insulating layer 2 adjacent in the vertical direction The thickness of the semi-cured adhesive layer 3, which is preferably provided between them, is usually the same in many cases, and if one of them is thicker, it is often the case that an excessive thickness is provided. On the other hand, as shown in FIGS. 11 and 12, if the semi-cured adhesive layer 3 is not provided on the right side of the insulating layer 2 and the semi-cured adhesive layer 3 is provided only on the left side, the insulating layer adjacent to the left and right The thickness of the semi-cured adhesive layer 3 existing between the two insulating layers 2 and the thickness of the semi-cured adhesive layer 3 existing between the vertically adjacent insulating layers 2 can be made the same or close to each other, which is advantageous for miniaturizing the coil. It is.

For example, when the insulated wire 10 shown in FIG. 4 is wound in multiple layers as in FIG. 12, its cross-sectional view is as shown in FIG. 13. In this case, the thickness e of the semi-cured adhesive layer 3 between the insulating layers 2 adjacent in the horizontal direction is larger than the thickness d of the semi-cured adhesive layer 3 between the insulating layers 2 adjacent in the vertical direction, and the coil It becomes larger in the left and right direction.

In addition, in FIG. 11, the semi-cured adhesive layer 3 is not provided on the right side of the insulating layer 2, and the semi-cured adhesive layer 3 is provided only on the left side, but as shown in FIG. The thickness of the semi-cured adhesive layer 3 located on the right side of the insulating layer 2 is h, and the thickness of the semi-cured adhesive layer 3 located on the upper side of the insulating layer 2 is h and i may be the same or different from each other so that f=g=h+i, where f is the thickness of the semi-cured adhesive layer 3 located below the insulating layer 2.

FIG. 15 is a sectional view showing a modification of the insulated wire 10 of FIG. 8. In FIG. 15, parts that are the same as or correspond to those in FIG. 8 are given the same reference numerals, and explanations thereof will be omitted. In FIG. 8, a step 12 is formed by providing a convex portion 11 on the semi-cured adhesive layer 3 above the insulating layer 2. In FIG. 15, a step 12 is formed by providing a convex portion 11 on the semi-cured adhesive layer 3 on the left side of the insulating layer 2. Further, in FIG. 8, side surfaces 7a and 7b are formed by providing a recess 6 in the semi-cured adhesive layer 3 below the insulating layer 2. In FIG. 15, side surfaces 7a and 7b are formed by forming a recess 6 in the semi-cured adhesive layer 3 on the right side of the insulating layer 2. The convex portion 11 is formed in a size that can be fitted into the concave portion 6.

FIG. 16 is a cross-sectional view when the insulated wire 10 shown in FIG. 15 is wound in multiple layers with its lower surface facing inside. In this manner, when winding the insulated wire 10, by fitting the protrusion 11 of the semi-cured adhesive layer 3 into the recess 6 of the semi-cured adhesive layer 3, the insulated wire 10 can be wound to produce a coil. In some cases, misalignment between adjacent windings and twisting of the windings can be suppressed. A coil is manufactured by winding such a winding wire in multiple layers.

As shown in FIG. 17, a convex portion 11 similar to that shown in FIG. 8 is provided on the semi-cured adhesive layer 3 above the insulating layer 2, and a recess 6 similar to that shown in FIG. At the same time, a protrusion 11 similar to that shown in FIG. 15 is provided on the semi-cured adhesive layer 3 on the left side of the insulating layer 2, and a recess 6 similar to that shown in FIG. 15 is provided on the semi-cured adhesive layer 3 on the right side of the insulating layer 2. You can do it like this.

As described above, in the insulated wire 10 of Embodiment 1, the semi-hardened adhesive layer 3, which is the outermost layer, has the steps 4 and 12, so when manufacturing a coil by winding the insulated wire 10 in multiple layers, In addition, the steps 4 and 12 come into contact with other parts of the insulated wire 10, and restrict the movement of the contacted parts. Therefore, when a coil is manufactured by winding the insulated wire 10, misalignment between adjacent windings and twisting of the windings can be suppressed.

Further, in the insulated wire 10 of the first embodiment, the outermost semi-cured adhesive layer 3 is formed of a semi-cured adhesive, and the steps 4 and 12 are also formed of this semi-cured adhesive. By extruding the curable adhesive or the like, the semi-cured adhesive layer 3 including the steps 4 and 12 can be formed all at once. Therefore, compared to the case where the steps 4 and 12 have to be formed in a separate process after applying the semi-cured adhesive layer 3, the insulated wire 10 can be manufactured with fewer steps.

Furthermore, in the insulated wire 10 of the first embodiment, since the semi-cured adhesive layer 3 as the outermost layer is in a semi-cured state including the steps 4 and 12, the steps 4 and 12 have viscosity at room temperature or under heating. However, when the steps 4, 12 are pressed into contact with other parts of the insulated wire 10 during winding of the insulated wire 10, the steps 4, 12 deform to match the shape of that part and fit/fit with that part. Easy to adhere. Therefore, the insulated wire 10 of Embodiment 1 can suppress displacement of the winding wire and twisting of the winding wire during winding. Note that the steps 4 and 12 of the semi-cured adhesive layer 3 may have a hardness that does not deform according to the shape of the part when the pressure bonding is performed at room temperature.

Further, in the insulated wire 10 of the first embodiment, since the semi-cured adhesive layer 3 of the outermost layer is formed of a semi-cured adhesive, the windings can be fixed by main curing by heating etc. .

Furthermore, since the insulated wire 10 of the first embodiment has the insulating layer 2 between the conductive wire 1 and the semi-cured adhesive layer 3 as the outermost layer, the material for the insulating layer 2 has a higher volume than the semi-cured adhesive layer 3. If a low-efficiency one is used, the cross-sectional area of the insulated wire 10 can be made smaller than when insulation is ensured only by the semi-cured adhesive layer 3. Furthermore, the material for the insulating layer 2 may be one that has higher adhesion to the conducting wire 1 than the semi-cured adhesive for the semi-cured adhesive layer 3.

Further, in the insulated wire 10 of the first embodiment, the step 4 is formed by providing the recess 5 in the semi-cured adhesive layer 3. Therefore, when manufacturing a coil by winding this insulated wire, the other portion of the insulated wire 10 is positioned within this recess 5, and its movement is restricted. Therefore, when a coil is manufactured by winding the insulated wire 10, misalignment between adjacent windings and twisting of the windings can be suppressed.

Further, in the insulated wire 10 of the first embodiment, the recess 5 forming the step 4 is formed by partially reducing the thickness of the semi-cured adhesive layer 3. Therefore, the insulating layer 2 inside the semi-cured adhesive layer 3 is not exposed, and the insulating layer 2 can be protected.

Further, in the insulated wire 10 of the first embodiment, the recess 5 forming the step 4 is formed by partially not providing the semi-cured adhesive layer 3 and exposing the insulating layer 2. Therefore, compared to the case where the recesses 5 are formed by making the semi-cured adhesive layer 3 thinner, the recesses 5 can be formed deeper without increasing the thickness of the semi-cured adhesive layer 3.

Further, in the insulated wire 10 of the first embodiment, since the recess 5 of the semi-cured adhesive layer 3 extends in the extending direction of the conductor 1, the insulated wire 10 is can be wound.

Furthermore, since the insulated wire 10 of the first embodiment has the same cross-sectional shape perpendicular to the stretching direction of the insulated wire 10 throughout the stretching direction, it is possible to When manufacturing a plurality of identical coils, the same insulated wire 10 can be cut out regardless of the cutting position.

Further, in the insulated wire 10 of the first embodiment, the cross-sectional shape of the outer circumferential surface of the outermost semi-cured adhesive layer 3 is rectangular, and each of the opposing outer circumferential surfaces of the semi-cured adhesive layer 3 has a recess. However, when this insulated wire 10 is wound, the corner on one outer circumferential surface side can be fitted into the recess 5 on the other outer circumferential surface, so that positional deviation and twisting of the winding wire during winding can be prevented. It can be suppressed.

Further, in the insulated wire 10 of the first embodiment, the opening of the recess 5 forming the step 4 is tapered to make the opening of the recess 5 larger than the bottom surface of the recess 5. When manufacturing a coil by winding it in multiple layers, it is easy to fit the adjacent portion of the winding wire into the recess 5.

Further, in the insulated wire 10 of the first embodiment, the opening of the recess 5 forming the step 4 is tapered to make the opening of the recess 5 smaller than the bottom surface of the recess 5. When manufacturing a coil by winding in multiple layers, adjacent winding portions fitted into the recesses 5 are difficult to come off.

In addition, the insulated wire 10 of the first embodiment has a recess 6 and a protrusion 11 on the outer peripheral surface of the semi-cured adhesive layer 3, which is the outermost layer, and when the insulated wire 10 is wound, the recess 6 Since the convex portion 11 can be fitted, when a coil is manufactured by winding the insulated wire 10 in multiple layers, it is possible to suppress positional displacement of the winding wire and twisting of the winding wire during winding.

Further, in the insulated wire 10 of the first embodiment, the convex portion 11 having a step 12 on the outer peripheral surface of the semi-cured adhesive layer 3, which is the outermost layer, is formed by partially thickening the semi-cured adhesive layer 3. Therefore, by extruding the semi-cured adhesive forming the semi-cured adhesive layer 3, the semi-cured adhesive layer 3 including the convex portions 11 can be formed all at once. Therefore, the insulated wire 10 can be manufactured with a reduced number of steps compared to the case where the convex portion 11 must be formed in a separate process after applying the semi-cured adhesive layer 3.

Although a single layer is shown here as the insulating layer 2 of the insulated wire 10 of Embodiment 1, the insulating layer 2 may be formed by laminating a plurality of insulating layers made of different materials. good. Further, an expansion layer (not shown) that expands upon heating may be provided between the semi-cured adhesive layer 3 and the insulating layer 2. Further, the insulated wire 10 of the first embodiment may be wound in multiple layers with the semi-cured adhesive layer 3 in a semi-cured state, and then fully cured to manufacture a coil. After the electric wire 10 is fully cured, it may be wound in multiple layers to manufacture a coil.

Embodiment 2.
FIG. 18 is a cross-sectional view of an insulated wire 10 according to Embodiment 2 of the present disclosure. FIG. 18 shows a cross section of the insulated wire 10 in a direction perpendicular to the stretching direction. The insulated wire 10 has the same cross section throughout its extending direction, that is, the cross section shown in FIG. 18. In FIG. 18, parts that are the same as or correspond to those in FIG. 1 are given the same reference numerals, and explanations thereof will be omitted.

In the first embodiment, the insulated wire 10 had the insulating layer 2 between the conductive wire 1 and the semi-cured adhesive layer 3; however, in the second embodiment, the insulated wire 10 had the insulating layer 2 between the conductive wire 1 and the semi-cured adhesive layer 13. A semi-cured adhesive layer 13 is formed directly on the conductive wire 1 without providing the conductive wire 2. This semi-cured adhesive layer 13 is formed to have a thickness that satisfies the insulation performance for the conductive wire 1 with only this semi-cured adhesive layer 13 . The semi-cured adhesive layer 13 is the outermost layer of the insulated wire 10.

The materials of the conductive wire 1 and the semi-cured adhesive layer 13 in FIG. 18 are the same as those of the conductive wire 1 and the semi-cured adhesive layer 3 of Embodiment 1, so the description thereof will be omitted. Similar to Embodiment 1, the semi-cured adhesive layer 13 is a layer made of a semi-cured adhesive in a semi-cured state.

Also in the second embodiment, the semi-cured adhesive layer 13, which is the outermost layer, has the following characteristics. The semi-cured adhesive layer 13 has insulating properties and contributes to the insulation of the conductive wire 1. Further, the semi-cured adhesive layer 13 is in a semi-cured state, and by winding the insulated wire 10 in multiple layers and fully curing it, a coil in which the windings are fixed can be manufactured.

Furthermore, a step 4 is formed on the outer peripheral surface of the semi-cured adhesive layer 13. Therefore, when the insulated wire 10 is wound in multiple layers, the step 4 comes into contact with other parts of the insulated wire 10 and restricts the movement of that part. Therefore, if a coil is manufactured using this insulated wire 10, displacement of the winding wire and twisting of the winding wire during winding can be suppressed.

Further, the step 4 is formed by molding a semi-cured adhesive forming the semi-cured adhesive layer 13. Therefore, in the manufacturing process of the insulated wire 10, if extrusion molding or the like, which will be described later, is used, the semi-cured adhesive layer 13, including the step 4, can be molded all at once.

The semi-cured adhesive layer 13 is formed to a thickness that satisfies the required insulation performance, but the thickness of the portion of the semi-cured adhesive layer 13 that covers the entire outer peripheral surface of the conductive wire 1 (i.e., including the thickness of the recess) The thickness (without thickness) is preferably 10 μm to 500 μm.

In order to improve the adhesion and adhesive strength between the conductive wire 1 and the semi-cured adhesive layer 13, the surface of the conductive wire 1 is subjected to physical treatment or chemical treatment before applying the semi-cured adhesive layer 13 on the surface of the conductive wire 1. You may go. As such a physical treatment, atmospheric plasma treatment, deep ultraviolet light treatment, corona discharge treatment, and thinning treatment (laser thinning, polishing, sandblasting), etc. can be used.

Alternatively, as a chemical treatment, a silane coupling agent may be applied as a primer on the surface of the conductive wire 1, and the semi-cured adhesive layer 13 may be applied using the primer as the surface to be adhered. When using an epoxy adhesive as the semi-cured adhesive forming the semi-cured adhesive layer 13, the primer may be 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyl. Dithoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, 3-aminopropyltrimethoxysilane, 3 -Triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-(benylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride Salt etc. can be used. The surface of the conducting wire 1 may be subjected to both the above-mentioned physical treatment and chemical treatment.

In FIG. 18, a step 4 is formed by providing a recess 5 on the upper surface of the semi-cured adhesive layer 13, which is the outermost layer. In FIG. 18, the steps 4 are the side surfaces 4a and 4b of the recess 5, respectively. 4a is the left side surface within the recess 5, and 4b is the right side surface within the recess 5. Furthermore, a recess 6 is formed on the lower surface of the semi-cured adhesive layer 13. 7a is the left side surface within the recess 6, and 7b is the right side surface within the recess 6.

18 is the upper left corner of the semi-cured adhesive layer 13, and 9 is the lower right corner of the semi-cured adhesive layer 13. The recess 5 is formed in a size that allows the lower right corner 9 to be inserted into the recess 5. The recess 6 is formed in a size such that the upper left corner 8 can be inserted into the recess 6. As in FIG. 2, the lower right corner portion 9 of the adjacent winding, which is a non-recessed portion, can be fitted into the recessed portion 5.

In FIG. 18, similarly to FIG. 1, by increasing the distance between the side surfaces 4a and 4b from the bottom of the recess 5 toward the opening of the recess 5, the lower right corner 9 can be easily fitted into the recess 5. A taper is provided. Further, by increasing the distance between the side surfaces 7a and 7b from the bottom of the recess 6 toward the opening of the recess 6, a taper is provided so that the upper left corner 8 can be easily fitted into the recess 6. .

FIG. 19 is a sectional view showing a modification of the insulated wire 10 of FIG. 18. In FIG. 18, a step 12 is formed by providing a protrusion 11 on the semi-cured adhesive layer 13 as the outermost layer. In FIG. 18, the steps 12 are on the side surfaces 12a and 12b of the convex portion 11, respectively. 12a is a left side surface of the convex portion 11, and 12b is a right side surface of the convex portion 11. Furthermore, a recess 6 is formed on the lower surface of the semi-cured adhesive layer 13. 12a is a left side surface inside the recess 6, and 12b is a right side surface inside the recess 6. The convex portion 11 is formed in a size that can be fitted into the concave portion 6.

When the insulated wire 10 of FIG. 19 is wound in multiple layers, the protrusion 11 of the semi-cured adhesive layer 13 of the adjacent winding can be fitted into the recess 6 as in FIG. In this way, when winding the insulated wire 10, by fitting the convex portion 11 of the semi-cured adhesive layer 13 into the recess 6 of the semi-cured adhesive layer 13, the insulated wire 10 is wound to produce a coil. In some cases, misalignment between adjacent windings and twisting of the windings can be suppressed.

FIG. 20 is a sectional view showing a modification of the insulated wire 10 of FIG. 19. In FIG. 20, parts that are the same as or correspond to those in FIG. 19 are designated by the same reference numerals, and description thereof will be omitted. In FIG. 20, a step 12 is formed by providing a convex portion 11 on the semi-cured adhesive layer 13 on the left side of the conductive wire 1. Further, by forming a recess 6 in the semi-cured adhesive layer 13 on the right side of the conductive wire 1, side surfaces 7a and 7b are formed. The convex portion 11 is formed in a size that can be fitted into the concave portion 6. Similarly to FIG. 16, when winding the insulated wire 10, if the convex portion 11 of the semi-cured adhesive layer 13 is fitted into the recess 6 of the semi-cured adhesive layer 13, the insulated wire 10 is wound and a coil is formed. When manufactured, it is possible to suppress misalignment between adjacent windings and twisting of the windings.

As described above, in the insulated wire 10 of the second embodiment, since the semi-cured adhesive layer 13, which is the outermost layer, is directly laminated on the outer circumferential surface of the conductive wire 1, there is a gap between the conductive wire 1 and the semi-cured adhesive layer 13. Compared to the case where a separate insulating layer is provided, manufacturing can be performed with fewer steps.

Embodiment 3.
As a third embodiment, a method for manufacturing the insulated wire 10 of the first embodiment will be described. FIG. 21 is a flow diagram schematically showing the manufacturing process of the insulated wire 10 according to the third embodiment. FIG. 22 is a schematic diagram of a manufacturing apparatus used in the manufacturing process of FIG. 21. Here, for example, a method for manufacturing the insulated wire 10 shown in FIG. 1 will be described, but the insulated wire 10 shown in FIGS. 2 to 17 can also be manufactured in the same manner.

First, the conducting wire 1 is sent to the surface treatment machine 101 shown in FIG. 22, and in this surface treatment machine 101, the surface treatment SC1 shown in FIG. 21 is performed. Specifically, the surface treatment machine 101 cleans the conductive wire 1 with a solvent such as acetone, or performs the above-mentioned physical treatment and/or chemical treatment on the outer peripheral surface of the conductive wire 1. For example, as a physical treatment, an atmospheric plasma treatment, a deep ultraviolet light treatment, a corona discharge treatment, or a thinning treatment (laser roughening, polishing, sandblasting) is performed on the outer peripheral surface of the conducting wire 1. Further, as a chemical treatment, a silane coupling agent is applied onto the outer circumferential surface of the conducting wire 1.

Next, the conducting wire 1 is sent to a heating furnace 102 shown in FIG. 22, and a heating process HC shown in FIG. 21 is performed in this heating furnace 102. In this heating step HC, the conducting wire 1 sent from the surface treatment machine 101 is preheated for extrusion molding, which will be described later. For example, the heating furnace 102 preheats the conducting wire 1 sent from the surface treatment machine 101 to about 300°C.

Next, the conducting wire 1 is sent to an extrusion molding machine 103 shown in FIG. 22, and a first molding process P1 shown in FIG. 21 is performed in this extrusion molding machine 103. In this first forming step P1, the insulating layer 2 is extruded onto the outer peripheral surface of the conducting wire 1 sent from the heating furnace 102. For example, the extrusion molding machine 103 extrudes a thermoplastic insulating resin such as polyetheretherketone (PEEK) or polyphenylene sulfide (PPS) onto the outer peripheral surface of the preheated conducting wire 1 sent from the heating furnace 102. By doing so, an insulating layer 2 is formed on the outer peripheral surface of the conducting wire 1. These insulating resins such as PEEK and PPS are put into an extrusion molding machine 103 in the form of pellets, and are extruded onto the outer circumferential surface of the conducting wire 1 at a temperature above the melting point of the insulating resin and below the decomposition temperature.

The conductive wire 1 on which the insulating layer 2 has been formed by the extrusion molding machine 103 is sent to the surface treatment machine 104, and the surface treatment SC2 shown in FIG. 21 is performed in this surface treatment machine 104. Specifically, the surface treatment machine 104 performs the above-mentioned physical treatment and/or chemical treatment on the outer peripheral surface of the insulating layer 2. For example, as a physical treatment, an atmospheric plasma treatment, a deep ultraviolet light treatment, a corona discharge treatment, or a densification treatment (laser densification, polishing, sandblasting) is performed on the outer peripheral surface of the insulating layer 2. Further, as a chemical treatment, a silane coupling agent is applied onto the outer peripheral surface of the insulating layer 2.

The conductive wire 1 with the insulating layer 2 subjected to the surface treatment by the surface treatment machine 104 is sent to the extrusion molding machine 105 shown in FIG. 22, and in this extrusion molding machine 105, the second molding step P2 shown in FIG. be exposed. In this second molding step P2, the semi-cured adhesive layer 3 is extruded onto the outer circumferential surface of the insulating layer 2 of the conductive wire 1 sent from the surface treatment machine 104, together with its steps 4 and 7.

For example, when a B-stage adhesive that is solid at room temperature and in the form of pellets is put into the extrusion molding machine 105, the B-stage adhesive is heated to a temperature higher than its melting point (for example, 60°C or higher and 140°C or lower), and the B-stage adhesive It is coated on the insulating layer 2 and extruded in this state. The B-stage adhesive used here is easy to store and handle if it is in the form of pellets at room temperature. The normal temperature is, for example, 5°C to 35°C. The viscosity of the B-stage adhesive when applying and extruding the B-stage adhesive onto the insulating layer 2 is preferably, for example, 3 Pa or more and 150 Pa or less.

FIG. 23 is a schematic diagram showing the configuration of the extrusion molding machine 105. 200 is a solid pellet-like B-stage adhesive, 201 is an inlet for the B-stage adhesive 200, 202 is a crushing section for crushing the pellet-like B-stage adhesive 200, and 203 is a crushed B-stage adhesive. A coating section melts the adhesive 200 and applies the melted B-stage adhesive 200 on the insulating layer 2 of the conductor 1 in a B-stage state; 204 is the B-stage adhesive melted and applied on the insulating layer 2; This is a drawing jig for extrusion-molding the semi-cured adhesive layer 3 together with the steps 4 and 7 in the B-stage state. Although a B-stage adhesive that is solid at room temperature is used here, a B-stage adhesive that is liquid at room temperature and can be turned into a B-stage by heating or UV irradiation may also be used.

Note that if the semi-cured adhesive layer 3 is not formed with a B-stage adhesive but with a photocurable adhesive, the extrusion molding machine is charged with a liquid photocurable adhesive at room temperature, and then the extrusion molding machine is heated. A light source with a curing wavelength may be provided at the extrusion port 105, and the photocurable adhesive may be extruded in a semi-cured state while being irradiated with the light.

Further, in order to easily control the thickness of the semi-cured adhesive layer 3, an insulating material such as glass or fused silica may be mixed with a semi-cured adhesive as a thickness adjusting material and then extruded.

Here, the surface treatment SC1 was performed by the surface treatment machine 101 in a step before the first molding step P1 by the extrusion molding machine 103, but this surface treatment SC1 may be omitted. Furthermore, although the surface treatment SC2 was performed by the surface treatment machine 104 in a step before the second molding step P2 by the extrusion molding machine 105, this surface treatment SC2 may be omitted.

Although the method for manufacturing the insulated wire 10 of the first embodiment has been described here, the insulated wire 10 of the second embodiment, that is, the insulated wire in which the semi-cured adhesive layer 3 is directly formed on the outer peripheral surface of the conductive wire 1. No. 10 can also be manufactured in the same manner by omitting the first molding step P1 and the surface treatment SC1.

Further, the insulated wire 10 shown in each of the first embodiment and the second embodiment may be manufactured by a manufacturing method other than the manufacturing method of the third embodiment.

Embodiment 4.
As Embodiment 4, an electric device using the insulated wire 10 of the present disclosure illustrated in Embodiment 1 and Embodiment 2 will be described. FIG. 24 is a schematic diagram of a coil formed by winding the insulated wire 10 of FIG. In FIG. 24, 30 is a coil insulator such as teeth, and 31 is an iron core of the coil. In this way, in the insulated wire 10, the semi-hardened adhesive layer 3, which is the outermost layer, has the step 4. Therefore, when manufacturing a coil by winding the insulated wire 10 in multiple layers, the step 4 is different from the insulated wire 10. and restricts the movement of the contacted part. Therefore, when a coil is manufactured by winding the insulated wire 10, misalignment of the winding wire and twisting of the winding wire can be suppressed. Therefore, the reliability of the coil is improved, the winding density of the coil is improved, and the size of the coil can be reduced.

In addition, since the semi-cured adhesive layer 3 of the outermost layer of the insulated wire 10 is formed of a semi-cured adhesive, after the insulated wire 10 is wound in multiple layers around the insulator 30, the coil is heated, etc. By fully curing it, the windings can be fixed together. Therefore, the durability and reliability of the coil are further improved.

Note that the surface of the insulator 30 around which the insulated wire 10 is wound may be a flat surface, but as shown in FIG. good.

In addition, in FIG. 24, when multiple layers of insulated wire 10 are wound around a coil, the number of turns in each layer is the same, but as shown in FIG. 25, the outer layer is wound with a smaller number of turns. You may also do so. Such a winding method is effective for improving the winding density that can be wound around each tooth. Normally, with this winding method, the winding tends to unravel in many cases, but if the insulated wire of Embodiments 1 and 2 is wound to form a coil, the winding will be difficult to unravel due to the step difference. can do.

In the coil of FIG. 25 as well, since the semi-cured adhesive layer 3 of the outermost peripheral layer of the insulated wire 10 is formed of a semi-cured adhesive, the coil is wound after winding the insulated wire 10 around the insulator 30 in multiple layers. By fully curing by heating etc., the windings can be fixed together. The circled numbers in FIGS. 24 and 25 illustrate the order in which the insulated wire 10 is wound.

By incorporating coils manufactured as shown in FIGS. 24 and 25 into electrical equipment such as motors, generators, transformers, solenoids, and reactors, small and highly reliable electrical equipment can be obtained.

1 conductive wire, 2 insulating layer, 3 semi-cured adhesive layer, 4 step, 5 recess, 6 recess, 7 step, 8 upper left corner, 9 lower right corner, 81 left end, 91 right end.

Claims (17)

conductor and
and an outermost layer that is the outermost layer laminated on the outer circumferential side of the conductive wire,
The outermost peripheral layer is made of an insulating semi-cured adhesive, and has a step formed by molding the semi-cured adhesive on its outer peripheral surface,
The insulated wire is characterized in that the semi-curable adhesive is a photocurable adhesive . conductor and
and an outermost layer that is the outermost layer laminated on the outer circumferential side of the conductive wire,
The outermost peripheral layer is made of an insulating semi-cured adhesive, and has a step formed by molding the semi-cured adhesive on its outer peripheral surface,
The insulated wire is characterized in that the outermost peripheral layer is directly laminated on the outer peripheral surface of the conductive wire . The insulated wire according to claim 1 or 2, wherein the outermost peripheral layer is in a semi-cured state. The insulated wire according to claim 2 , wherein the semi-cured adhesive is a B-stage adhesive. The insulated wire according to claim 4 , wherein the B-stage adhesive is solid at room temperature before main curing, and melts when heated. The insulated wire according to any one of claims 1 to 5, further comprising an insulating layer between the conductive wire and the outermost layer. The insulated wire according to any one of claims 1 to 6, wherein the step is formed by providing a recess on the outer peripheral surface of the outermost peripheral layer. The insulated wire according to claim 7 , wherein the outermost layer allows a non-recessed portion of the outermost layer other than the recessed portion to fit into the recessed portion when the insulated wire is wound. The insulated wire according to claim 8 , wherein the non-recessed portion is a corner of the outermost layer. The insulated wire according to claim 9 , wherein the corner that can be fitted into the recess has a side surface formed by a side surface of a recess different from the recess. The insulated wire according to any one of claims 1 to 6, wherein the step is formed by providing a convex portion on the outer peripheral surface of the outermost peripheral layer. 7. The stepped portion is formed by providing a convex portion and a concave portion on the outer peripheral surface of the outermost layer, and the convex portion can be fitted into the concave portion when the insulated wire is wound. The insulated wire according to any one of items 1 to 1 . The insulated wire according to any one of claims 1 to 12 , wherein the outermost peripheral layer has a cross-sectional shape perpendicular to the stretching direction of the conductor wire that is the same throughout the stretching direction. a conductive wire, and an outermost layer that is the outermost layer laminated on the outer peripheral side of the conductive wire,
The outermost layer is made of an insulating semi-cured adhesive, and has a coil formed by winding a plurality of layers of insulated wires having steps formed with the semi-cured adhesive on the outer circumferential surface thereof. death,
An electrical device characterized in that the semi-curable adhesive is a photocurable adhesive . a conductive wire, and an outermost layer that is the outermost layer laminated on the outer peripheral side of the conductive wire,
The outermost layer is made of an insulating semi-cured adhesive, and has a coil formed by winding a plurality of layers of insulated wires having steps formed with the semi-cured adhesive on the outer circumferential surface thereof. death,
The electrical equipment , wherein the outermost layer is directly laminated on the outer circumferential surface of the conductive wire . 16. The electrical equipment according to claim 14 , wherein the number of turns in at least one of the plurality of layers of the coil is smaller than the number of turns in a layer wound inside the coil. 17. The electrical equipment according to claim 14, wherein the coil has a groove formed in a surface around which the plurality of layers are wound, into which a corner of the outermost layer is fitted.

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