WO2022024207A1

WO2022024207A1 - Insulated wire, production method for same, and electrical equipment

Info

Publication number: WO2022024207A1
Application number: PCT/JP2020/028830
Authority: WO
Inventors: 芳幸加茂; 護寺井
Original assignee: 三菱電機株式会社
Priority date: 2020-07-28
Filing date: 2020-07-28
Publication date: 2022-02-03
Also published as: JPWO2022024207A1; JP7420260B2

Abstract

The present disclosure provides an insulated wire capable of inhibiting winding misalignments and winding kinks when a winding is wound.　An insulated wire according to the present disclosure comprises a conducting wire (1), and an outermost peripheral layer (3) that is the most outer peripheral layer laminated on the outer periphery of the conducting wire (1). The outermost peripheral layer (3) is composed of a semi-cured adhesive having insulating properties, and also has a step (4) which is formed by the semi-cured adhesive on the outer peripheral surface thereof. Furthermore, electrical equipment according to the present disclosure has a coil formed by winding the insulated wire in a plurality of layers.

Description

Insulated wires, their manufacturing methods, and electrical equipment

This disclosure relates to an insulated wire, a manufacturing method thereof, and an electric device using the insulated wire.

In Patent Document 1, an insulating layer is laminated on the outer peripheral surface of a conducting wire, an expansion layer that expands by heating is laminated on the outer peripheral surface of the insulating layer, and a heat fusion layer is laminated on the outer peripheral surface of the expansion layer. Insulated wires are listed. If a coil is manufactured using this insulated wire, it is possible to manufacture a coil in which the windings are fixed by heat fusion. Further, the expansion of the expansion layer during heating for the heat fusion can improve the reliability of fusion between adjacent windings.

Japanese Unexamined Patent Publication No. 2016-35836

However, in such a conventional insulated wire, misalignment of the winding and twisting of the winding after the coil is manufactured can be suppressed by fixing by heat fusion, but the insulated wire before heat fusion is wound. It is not possible to suppress the misalignment of the windings and the twisting of the windings during work.

The present disclosure has been made to solve such a problem, and suppresses the misalignment of the winding and the twisting of the winding at the time of winding when the insulated wire is wound to manufacture a coil. It is an object of the present invention to provide an insulated electric wire capable of being used, a method for manufacturing the same, and an electric device.

The insulated wire according to the present disclosure has a conducting wire and an outermost peripheral layer which is an outermost layer laminated on the outer peripheral side of the conducting wire, and the outermost peripheral layer is composed of an insulating semi-curing adhesive. At the same time, it has a step on the outer peripheral surface of which the semi-curable adhesive is formed.

In the insulated wire according to the present disclosure, when the insulated wire is wound in multiple layers to manufacture a coil, a step comes into contact with another part of the insulated wire, and the movement of the contacted portion is restricted. Therefore, when the coil is manufactured by winding this insulated wire, it is possible to suppress the positioning between adjacent windings and the twisting of the windings.

It is sectional drawing of the insulated wire which concerns on Embodiment 1. FIG. It is sectional drawing when the insulated wire shown in FIG. 1 is wound in a multi-layered structure. It is sectional drawing which shows the modification of the insulation electric wire which concerns on Embodiment 1. FIG. It is sectional drawing which shows the modification of the insulation electric wire which concerns on Embodiment 1. FIG. It is sectional drawing when the insulated wire shown in FIG. 4 is wound in a multi-layered structure. It is sectional drawing which shows the modification of the insulation electric wire which concerns on Embodiment 1. FIG. It is sectional drawing when the insulated wire shown in FIG. 6 is wound in a multi-layered structure. It is sectional drawing which shows the modification of the insulation electric wire which concerns on Embodiment 1. FIG. It is sectional drawing when the insulated wire shown in FIG. 8 is wound in a multi-layered structure. It is sectional drawing which shows the modification of the insulation wire of FIG. It is sectional drawing which shows the modification of the insulation electric wire which concerns on Embodiment 1. FIG. It is sectional drawing when the insulated wire shown in FIG. 11 is wound in a multi-layered structure. It is another cross-sectional view when the insulated wire shown in FIG. 4 is wound in multiple layers. It is sectional drawing which shows the modification of the insulation electric wire which concerns on Embodiment 1. FIG. It is sectional drawing which shows the modification of the insulation electric wire which concerns on Embodiment 1. FIG. It is sectional drawing when the insulated wire shown in FIG. 15 is wound in a multi-layered structure. It is sectional drawing which shows the modification of the insulation electric wire which concerns on Embodiment 1. FIG. It is sectional drawing of the insulated wire which concerns on Embodiment 2. FIG. It is sectional drawing which shows the modification of the insulation electric wire which concerns on Embodiment 2. FIG. It is sectional drawing which shows the modification of the insulation electric wire which concerns on Embodiment 2. FIG. It is a flow diagram which shows the outline of the manufacturing process of the insulated wire of Embodiment 1. FIG. It is the schematic of the manufacturing apparatus used in the manufacturing process of FIG. It is the schematic which shows the structure of the extruder 105 of FIG. 22. It is a schematic diagram which illustrates the coil formed by winding the insulated wire of FIG. It is a schematic diagram which shows another example of the coil formed by winding the insulated wire of FIG.

Embodiment 1.
Hereinafter, the structure of the insulated wire of the present disclosure and the manufacturing method thereof will be described. The insulated wire of the present disclosure is used as a winding of a coil of a motor, a generator, a transformer, a solenoid, a reactor, etc. of various electric devices.

FIG. 1 is a cross-sectional view of the insulated wire 10 according to the first embodiment of the present disclosure. FIG. 1 shows a cross section in a direction perpendicular to the extending direction of the insulated wire 10. The insulated wire 10 has the same cross section throughout the extending direction, that is, the cross section shown in FIG. 1. The insulated wire 10 has a conducting wire 1, an insulating layer 2 laminated on the outer peripheral surface of the conducting wire 1, and a semi-curing adhesive layer 3 laminated on the outer peripheral surface of the insulating layer 2. The semi-cured adhesive layer 3 is the outermost layer (outermost peripheral layer) of the insulated wire 10.

The semi-cured adhesive layer 3 is a layer made of a semi-cured adhesive in a semi-cured state. The semi-curing adhesive is an adhesive that can maintain a semi-curing state. For example, as a semi-curing adhesive, a B-stage adhesive that can be in a B-stage state is known. The B stage is an intermediate state in which the thermosetting resin is cured, and the resin in this state softens when heated and swells when it comes into contact with a certain solvent, but it does not completely melt or dissolve. Such a semi-curable adhesive can be brought into a completely cured main-cured state by subjecting it to a predetermined treatment such as heating from the semi-cured state for a certain period of time or longer. The semi-curing adhesive used here is not limited to a thermosetting resin such as a B-stage type adhesive as long as it can maintain a semi-curing state at room temperature for a certain period of time, but is also a UV curable resin (ultraviolet curable resin). It may be a photocurable resin such as. The semi-cured state here means an intermediate state of curing.

In the first embodiment, the semi-cured adhesive layer 3 which is the outermost layer has the following characteristics. The semi-curing adhesive layer 3 has an insulating property and contributes to the insulation of the conducting wire 1. Further, the semi-cured adhesive layer 3 is in a semi-cured state, and a coil in which the windings are fixed can be manufactured by winding the insulating electric wire 10 in multiple layers and main curing.

Further, a step 4 is formed on the outer peripheral surface of the semi-cured adhesive layer 3. Therefore, when the insulated wire 10 is wound in multiple layers, the step 4 comes into contact with another portion of the insulated wire 10 and restricts the movement of that portion. Therefore, if a coil is manufactured using the insulated wire 10, it is possible to suppress the misalignment of the winding and the twisting of the winding during winding. In FIG. 1, the step 4 is formed as a part of the recess 5 by providing the recess 5 on the outer peripheral surface of the semi-cured adhesive layer 3. The step 4 in FIG. 1 is each of the side surfaces 4a and 4b in the recess 5. When the insulated wire 10 is wound in multiple layers, for example, as shown in FIG. 2, the lower right corner portion 9 which is a non-recessed winding of the adjacent winding can be fitted into the recess 5.

Further, the step 4 is formed by molding a semi-curing adhesive that forms the semi-curing adhesive layer 3. Therefore, in the manufacturing process of the insulated wire 10, if extrusion molding or the like described later is used, the semi-cured adhesive layer 3 can be collectively molded including the step 4.

Hereinafter, the structure of the insulated wire 10 in FIG. 1 will be described in more detail. The conductor 1 is, for example, a copper wire, an aluminum wire, or an alloy wire thereof. As the material of the copper wire, for example, tough pitch copper, oxygen-free copper and the like can be used. As the material of the aluminum wire, for example, hard aluminum can be used. Alloy wire materials include, for example, copper and tin alloys, copper and silver alloys, copper and zinc alloys, copper and chromium alloys, copper and zirconium alloys, aluminum and copper alloys, and aluminum and silver alloys. , Alloys of aluminum and zinc, alloys of aluminum and iron, etc. can be used. The conductor 1 may be a single wire formed of one conductor or a stranded wire in which a plurality of conductors are twisted together. Although FIG. 1 shows a case where the conducting wire 1 is a rectangular wire having a rectangular cross-sectional shape, it may be a circular wire having a circular cross-sectional shape or a conductor having another polygonal cross-sectional shape.

The material of the insulating layer 2 is, for example, polyetheretherketone (PEEK), polyphenylene sulfide (PPS), polyetherimide (PEI), polyamideimide (PAI), polyimide (PI), polybenzoimidazole (PBI), polyether. Sulfon (PES), polypropylene (PP) and the like.

The insulating layer 2 can be formed on the surface of the conductor 1 by, for example, an extrusion coating method. When the insulating layer 2 is formed by the extrusion coating method, the thickness of the insulating layer 2 is preferably 30 μm or more from the viewpoint of making the thickness of the insulating layer 2 coated uniform. Further, if the thickness of the insulating layer 2 is too thin, the insulating property of the insulating layer 2 is greatly deteriorated, and if it is too thick, it is not suitable for miniaturization and winding becomes difficult. From such a viewpoint, the thickness of the insulating layer 2 is preferably 30 μm or more and 150 μm or less, and more preferably 50 μm or more and 70 μm or less.

The above-mentioned material used for the insulating layer 2 has high volume and low efficiency, and has the property of being stable and resistant to deterioration, but the adhesiveness with the conducting wire 1 may be inferior. In that case, before the insulating layer 2 is applied on the surface of the conducting wire 1, the surface of the conducting wire 1 is physically or chemically treated to improve the adhesion and the adhesive strength between the conducting wire 1 and the insulating layer 2. Can be improved. As such physical treatment, atmospheric plasma treatment, deep ultraviolet light treatment, corona discharge treatment, sparsening treatment (laser sparsening, polishing, sandblasting treatment) and the like can be used.

Further, as a chemical treatment, a silane coupling agent may be applied on the surface of the conducting wire 1, and the insulating layer 2 may be applied on the silane coupling agent. When applying an epoxy adhesive between the lead wire 1 and the insulating layer 2, a silane coupling agent is applied as a primer on the surface of the lead wire 1, and an epoxy adhesive is applied on the primer. The insulating layer 2 may be applied using an epoxy adhesive as the surface to be adhered. Such primers include 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethylditoxylsilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldi. Ethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, 3aminopropyltrimethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N-phenyl -3-Aminopropyltrimethoxysilane, N- (benylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride and the like can be used. An epoxy-based adhesive containing a silane coupling agent may be applied onto the surface of the lead wire 1, and the insulating layer 2 may be applied using the epoxy-based adhesive as the surface to be adhered. The surface of the conductor 1 may be subjected to both the above-mentioned physical treatment and chemical treatment.

The semi-cured adhesive layer 3 is a layer made of a semi-cured adhesive in a semi-cured state. As the semi-curable adhesive layer 3, for example, a B-stage type adhesive or a UV curable adhesive can be used. As a B-stage type adhesive suitable as the semi-curing adhesive layer 3, for example, a mixture of 60 to 75 wt% of bisphenol A type epoxy resin and 25 to 35 wt% of cresol novolac type epoxy resin is mixed with the amine-based curing agent 1. A mixture obtained by adding up to 5 wt% and kneading can be used. Suitable UV-curable adhesives for the semi-curable adhesive layer 3 include, for example, a mixture of 30 to 40 wt% of bisphenol A type epoxy resin and 20 to 30 wt% of bisphenol F type epoxy resin, and antimonth sulfonium fluoride. A photo-curing agent to which 1 to 5 wt% is added and kneaded can be used.

The semi-curing adhesive layer 3 is in a semi-curing state because such a semi-curing adhesive is not finally cured. The B stage of the B stage type adhesive is in the semi-cured state referred to here. The UV curable adhesive can be made into a semi-curable state by irradiating the adhesive with ultraviolet rays. When a B-stage adhesive is used as the semi-curing adhesive layer 3, a B-stage adhesive of a type that can be B-staged with ultraviolet rays may be used.

In order to improve the adhesion and adhesive strength between the insulating layer 2 and the semi-cured adhesive layer 3, physical treatment or chemical treatment may be performed before applying the semi-cured adhesive layer 3 on the surface of the insulating layer 2. good. As such physical treatment, atmospheric plasma treatment, deep ultraviolet light treatment, corona discharge treatment, sparsening treatment (laser sparsening, polishing, sandblasting treatment) and the like can be used.

Further, as a chemical treatment, a silane coupling agent may be applied on the surface of the insulating layer 2 as a primer, and the semi-cured adhesive layer 3 may be applied using the primer as a surface to be adhered. When an epoxy-based adhesive is used as the semi-curable adhesive that forms the semi-curing adhesive layer 3, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane and 3-glycidoxypropylmethyl are used as the primers. Ditoxylsilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, 3aminopropyltrimethoxysilane, 3 -Triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N- (benylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride Salt or the like can be used. The surface of the insulating layer 2 may be subjected to both the above-mentioned physical treatment and chemical treatment.

Hereinafter, for convenience of explanation, the expressions of up, down, left, and right will be used to correspond to the up, down, left, and right directions on the paper of each figure. Further, in the case where the insulated wire 10 is wound in multiple layers to generate a coil, the case where the coil is wound with the lower side of the insulated wire 10 inside is described, but this is merely an example, and the winding of the insulated wire 10 is described. The method is not limited to this.

In FIG. 1, a step 4 is formed by providing a recess 5 on the upper surface of the semi-cured adhesive layer 3, which is the outermost layer. In FIG. 1, the step 4 is each of the side surfaces 4a and 4b of the recess 5. 4a is the left side surface in the

recess

5, and 4b is the right side surface in the recess 5. Further, a recess 6 is formed on the lower surface of the semi-cured adhesive layer 3. 7a is the left side surface in the

recess

6, and 7b is the right side surface in the recess 6.

8 in FIG. 1 is the upper left corner portion of the semi-cured adhesive layer 3, and more specifically, the portion from the left end portion 81 of the semi-cured adhesive layer 3 to the left side surface 4a of the recess 5. Reference numeral 9 is a lower right corner portion of the semi-cured adhesive layer 3, specifically, a portion from the right end portion 91 of the semi-cured adhesive layer 3 to the right side surface 7b of the recess 6. The recess 5 is formed in such a size that the lower right corner portion 9 can be fitted into the recess 5. The recess 6 is formed in such a size that the upper left corner portion 8 can be fitted into the recess 6.

In FIG. 1, the thickness of the semi-cured adhesive layer 3 is the same for the portions located in any of the upper, lower, left, and right directions of the insulating layer 2, but as will be described later, any of the upper, lower, left, and right sides of the insulating layer 2. The thickness of the portion located in the direction may be different. Further, the thickness of the insulating layer 2 may be the same over the entire outer circumference of the conducting wire 1, or there may be portions having different thicknesses. For example, since the semi-curing adhesive layer 3 has reduced insulating properties due to the presence of the recesses 5 and the recesses 6 located in the vertical direction of the insulating layer 2, the insulating layer 2 has the thickness of the portion of the conducting wire 1 located in the vertical direction. May be thicker than the thickness of the portion of the conductor 1 located in the left-right direction.

FIG. 2 is a cross-sectional view of the insulated wire 10 shown in FIG. 1 when the insulated wire 10 is wound in multiple layers with the lower surface inside. FIG. 2 shows a cross section in a direction perpendicular to the winding direction. In this way, the lower right corner portion 9, which is a non-recessed portion of the semi-cured adhesive layer 3, can be fitted into the recess 5 of the semi-cured adhesive layer 3. Further, the upper left corner portion 8 of the semi-curable adhesive layer 3 can be fitted into the recess 6 of the semi-curable adhesive layer 3.

In this way, if the lower right corner portion 9, which is a non-recessed portion of the semi-cured adhesive layer 3, is fitted into the recess 5 of the semi-cured adhesive layer 3, the insulated wire 10 is wound around the insulating wire 10 to be adjacent to the coil. It is possible to suppress the misalignment between the windings and the twisting of the windings. Further, by making it possible to fit the upper left corner portion 8 of the semi-curing adhesive layer 3 into the recess 6 of the semi-curing adhesive layer 3 in this way, the upper left corner portion 8 does not interfere between the adjacent windings. , It becomes easy to fit the lower right corner portion 9 into the recess 5.

It is not always necessary to fit the non-recessed portion into the recessed portion 5 over the entire wound insulating wire 10, and when the insulated wire 10 is wound in multiple layers, at least a part of the insulated wire 10 is wound. In the case where the other portion of the insulated wire 10 comes into contact with the side surface 4a or the side surface 4b of the recess, the positioning of the winding and the twisting of the winding can be suppressed.

Further, as a method of winding the insulated wire 10, a winding machine or the like may be used to sequentially and regularly wind the insulated wire 10 from the inner winding layer to the outer winding layer, but by manual work or the like. , May be wound in multiple layers irregularly.

In FIGS. 1 and 2, the space between the side surface 4a and the side surface 4b is increased from the bottom surface of the recess 5 toward the opening of the recess 5, so that the lower right corner portion 9 can be easily fitted into the recess 5. A taper is provided. Further, by increasing the distance between the side surface 7a and the side surface 7b from the bottom surface of the recess 6 toward the opening of the recess 6, a taper is provided so that the upper left corner portion 8 can be easily fitted into the recess 6. ..

FIG. 3 is a cross-sectional view showing a modified example of the insulated wire 10 of FIG. In FIG. 3, the same or corresponding parts as those in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted. In FIGS. 1 and 2, the tapers of the side surfaces 4a, 4b, 7a, and 7b are formed in a planar shape, but as shown in FIG. 3, the tapers of the side surfaces 4a, 4b, 7a, and 7b are formed in a curved surface shape. It may be formed. FIG. 3 is the same as FIG. 1 except for the parts.

FIG. 4 is a cross-sectional view showing a modified example of the insulated wire 10 of the first embodiment. In FIG. 4, the same or corresponding parts as those in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted. In FIGS. 1 to 3, a step 4 is formed by forming a recess 5 having

side surfaces

4a and 4b facing each other in the semi-cured adhesive layer 3. In FIG. 4, the step 4 is formed by not providing the semi-curing adhesive layer 3 in the portion from the step 4 to the right end portion 91 above the insulating layer 2. Further, below the insulating layer 2, the step 7 is formed by not providing the semi-curing adhesive layer 3 in the portion from the step 7 to the left end portion 81. In FIG. 4, the upper left corner portion 8 is a portion from the step 4 of the semi-cured adhesive layer 3 to the left end portion 81. Further, the lower right corner portion 9 is a portion from the step 7 of the semi-cured adhesive layer 3 to the right end portion 91.

FIG. 5 is a cross-sectional view of the insulated wire 10 shown in FIG. 4 when the insulated wire 10 is wound in multiple layers with the lower surface inside. FIG. 5 shows a cross section in a direction perpendicular to the winding direction. As described above, since the semi-cured adhesive layer 3 has the step 4, when the insulated wire 10 is wound in multiple layers to manufacture a coil, the lower right corner portion 9 of the insulated wire 10 comes into contact with the step 4 and the lower right corner. Restrict the movement of part 9. Therefore, the misalignment of the winding and the twisting of the winding when the insulated wire 10 is wound are suppressed.

FIG. 6 is a cross-sectional view showing another modified example of the insulated wire 10 of the first embodiment. In FIG. 6, the same or corresponding parts as those in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted. In FIGS. 1 to 5, the step 4 is formed by partially exposing the insulating layer 2 inside the semi-curable adhesive layer 3 without partially providing the semi-curable adhesive layer 3 of the outermost peripheral layer. In FIG. 6, the step 4 is formed by partially reducing the thickness of the semi-cured adhesive layer 3 of the outermost peripheral layer.

Similarly, with respect to the recess 6, in FIGS. 1 to 5, the insulating layer 2 inside the semi-curable adhesive layer 3 is partially exposed without partially providing the semi-curable adhesive layer 3 of the outermost peripheral layer. The recess 6 was formed by allowing the mixture to form a recess 6. In FIG. 6, the recess 6 is formed by partially reducing the thickness of the semi-cured adhesive layer 3 of the outermost peripheral layer.

In FIG. 6, since the step 4 is formed by partially reducing the thickness of the semi-cured adhesive layer 3 of the outermost peripheral layer, the insulating layer 2 is not exposed and is protected, and the semi-cured adhesive layer 3 is also formed. Since it has an insulating property, the effect of insulating the conductor 1 is increased. Further, it is possible to make the insulating layer 2 thinner by the amount that the semi-curing adhesive layer 3 increases the effect of insulating the conducting wire 1.

The thicker the insulating layer 2 and the semi-cured adhesive layer 3, the greater the effect of insulating the conductor 1, but if it is too thick, it is not suitable for miniaturization of the coil. From this, the thickness of the insulating layer 2 is 30 μm to 150 μm, and the thickness of the portion of the semi-cured adhesive layer 3 that covers the entire outer peripheral surface of the insulating layer 2 (that is, the thickness excluding the thickness of the recess) is It is preferably 10 μm to 50 μm. The total thickness of the insulating layer 2 and the semi-cured adhesive layer 3 is preferably 50 to 150 μm, more preferably 50 to 100 μm.

Further, if the height of the step 4 of the recess 5 or the step 7 of the non-recess that contacts the step 4 is too low, the contact area when the step 4 and the step 7 come into contact is small, and the position shift between the adjacent windings. The effect of suppression is reduced. From this, the depth of the recess 5 provided in the semi-cured adhesive layer 3 and the height of the step 7 are preferably 5 μm or more, and more preferably 10 μm or more.

FIG. 7 is a cross-sectional view of the insulated wire 10 shown in FIG. 6 when the insulated wire 10 is wound in multiple layers with the lower surface inside. FIG. 7 shows a cross section in a direction perpendicular to the winding direction. In this way, the lower right corner portion 9, which is a non-recessed portion of the semi-cured adhesive layer 3, can be fitted into the recess 5 of the semi-cured adhesive layer 3. Further, the upper left corner portion 8 of the semi-curable adhesive layer 3 can be fitted into the recess 6 of the semi-curable adhesive layer 3.

In FIG. 2, the lower right corner portion 9 is fitted into the recess 5 with almost no gap, but as shown in FIG. 7, the lower right corner portion 9 is smaller than the recess 5, and is between the lower right corner portion 9 and the step 4. It may be fitted with a gap. Even in that case, when the insulated wire 10 is wound in multiple layers, the lower right corner portion 9 is moved so that the positions of the lower right corner portions 9 do not shift significantly in the left-right direction on the side surfaces 4a and 4b of the recess 5. To limit. Therefore, it is possible to suppress the misalignment of the winding and the twisting of the winding when the insulated wire 10 is wound.

Further, in FIG. 2, the upper left corner portion 8 is fitted into the concave portion 6 with almost no gap, but as shown in FIG. 7, the upper left corner portion 8 is smaller than the concave portion 6, and is between the upper left corner portion 8 and the step 7. It may be fitted with a gap. Even in that case, when the insulated wire 10 is wound in multiple layers, the upper left corner portion 8 does not interfere with the adjacent windings, and the lower right corner portion 9 can be easily fitted into the recess 5.

Since the semi-cured adhesive layer 3 in which the concave portion 5 and the lower right corner portion 9 are formed is in a semi-cured state, the lower right corner portion 9 is formed to be larger than the concave portion 5, and the semi-cured adhesive layer 3 is in a state of normal temperature or at room temperature. With the semi-cured adhesive layer 3 heated and the semi-cured adhesive layer 3 having viscosity, the lower right corner 9 is pressed into the recess 5 so that the recess 5 and the lower right corner 9 are in close contact with each other. The portion 9 or the recess 5 may be deformed.

FIG. 8 is a cross-sectional view showing another modified example of the insulated wire 10 of the first embodiment. FIG. 8 shows a cross section in a direction perpendicular to the extending direction of the insulated wire 10. In FIG. 8, the same or corresponding parts as those in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted. In FIGS. 1 to 7, a step 4 is formed by providing a recess 5 in the semi-cured adhesive layer 3 of the outermost peripheral layer. In FIG. 8, the step 12 is formed by providing the convex portion 11 on the semi-cured adhesive layer 3 of the outermost peripheral layer.

In FIG. 8, the step 12 is each of the side surfaces 12a and 12b of the convex portion 11. 12a is the left side surface of the

convex portion

11, and 12b is the right side surface of the convex portion 11. Further, a recess 6 is formed on the lower surface of the semi-cured adhesive layer 3. 7a is the left side surface in the

recess

6, and 7b is the right side surface in the recess 6. The convex portion 11 is formed in a size that can be fitted into the concave portion 6.

FIG. 9 is a cross-sectional view of the insulated wire 10 shown in FIG. 8 when the insulated wire 10 is wound in multiple layers with the lower surface inside. FIG. 9 shows a cross section in a direction perpendicular to the extending direction of the insulated wire 10. In this way, when the insulated wire 10 is wound, if the convex portion 11 of the semi-cured adhesive layer 3 is fitted into the concave portion 6 of the semi-cured adhesive layer 3, the insulated wire 10 is wound to manufacture a coil. Occasionally, it is possible to suppress misalignment between adjacent windings and twisting of windings.

In FIGS. 8 and 9, the distance between the side surface 12a and the side surface 12b is reduced toward the tip of the convex portion 11 so that the convex portion 11 can be easily fitted into the concave portion 6. .. Further, by increasing the distance between the side surface 7a and the side surface 7b from the bottom surface of the concave portion 6 toward the opening of the concave portion 6, a taper is provided so that the convex portion 11 can be easily fitted into the concave portion 6.

FIG. 10 is a cross-sectional view showing a modified example of the insulated wire 10 of FIG. In FIG. 8, the gap between the side surface 12a and the side surface 12b is tapered so as to decrease toward the tip of the convex portion 11, but in FIG. 10, the distance is increased toward the tip of the convex portion 11. The taper is provided so as to be. Further, in FIG. 8, a taper is provided so that the distance between the side surface 7a and the side surface 7b is increased from the bottom surface of the recess 6 toward the opening of the recess 6, but in FIG. 10, the gap is set to the opening of the recess 6. A taper is provided so as to make it smaller toward. As a result, when the insulated wire 10 is wound and the convex portion 11 of the adjacent winding is fitted in the concave portion 6, the convex portion 11 is less likely to come off from the concave portion 6.

FIG. 11 is a cross-sectional view showing another modified example of the insulated wire 10 of the first embodiment. In FIG. 11, the same or corresponding parts as those in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted. In FIG. 11, the semi-curing adhesive layer 3 is not provided on the right side of the insulating layer 2, and the semi-curing adhesive layer 3 is provided only on the upper and lower sides and the left side of the insulating layer 2. Further, the thickness a of the semi-cured adhesive layer 3 above the insulating layer 2, the thickness c of the semi-cured adhesive layer 3 below the insulating layer 2, and the semi-cured adhesive layer 3 on the left side of the insulating layer 2. The thickness b is the same or substantially the same. Further, the thickness of the insulating layer 2 is the same or substantially the same over the entire circumference of the conducting wire 1.

FIG. 12 is a cross-sectional view of the insulated wire 10 shown in FIG. 11 when the insulated wire 10 is wound in multiple layers with the lower surface inside. FIG. 12 shows a cross section in a direction perpendicular to the extending direction of the insulated wire 10. Here, not only the windings adjacent to each other in the vertical direction of the insulated wire 10 but also the windings adjacent to each other in the horizontal direction of the same layer are shown. As described above, in FIG. 12, the spacing between the insulating layers 2 of the windings adjacent in the vertical direction is a and c, and the spacing between the insulating layers 2 of the windings adjacent in the horizontal direction is b. Here, a = b = c (or they are substantially the same). Therefore, the thicknesses a and c of the semi-cured adhesive layer 3 that contribute to the insulation between the insulating layers 2 adjacent in the vertical direction and the thickness b of the semi-cured adhesive layer 3 that contributes to the insulation between the insulating layers 2 adjacent in the horizontal direction. Can be the same.

When the thickness of the insulating layer 2 is the same over the entire circumference of the conducting wire 1, the thickness of the semi-curing adhesive layer 3 preferably provided between the insulating layers 2 adjacent in the left-right direction and the insulating layer 2 adjacent in the vertical direction are preferable. The thickness of the semi-curing adhesive layer 3 preferably provided between them is usually the same, and the fact that one of them is large means that an excessive thickness is often provided. On the other hand, as shown in FIGS. 11 and 12, if the semi-curing adhesive layer 3 is not provided on the right side of the insulating layer 2 and the semi-curing adhesive layer 3 is provided only on the left side, the insulating layers adjacent to each other in the left-right direction are provided. The thickness of the semi-cured adhesive layer 3 existing between the two can be made the same as or close to the thickness of the semi-cured adhesive layer 3 existing between the insulating layers 2 adjacent in the vertical direction, which is advantageous for the miniaturization of the coil. Is.

For example, when the insulated wire 10 shown in FIG. 4 is wound in multiple layers in the same manner as in FIG. 12, the cross-sectional view thereof is as shown in FIG. In this case, the thickness e of the semi-curing adhesive layer 3 between the insulating layers 2 adjacent in the left-right direction is larger than the thickness d of the semi-curing adhesive layer 3 between the insulating layers 2 adjacent in the vertical direction, and the coil becomes larger. It increases in the left-right direction.

In FIG. 11, the semi-curing adhesive layer 3 is not provided on the right side of the insulating layer 2, but the semi-curing adhesive layer 3 is provided only on the left side. However, as shown in FIG. 14, the position is located in the left direction of the insulating layer 2. The thickness of the semi-cured adhesive layer 3 is i, the thickness of the semi-cured adhesive layer 3 located to the right of the insulating layer 2 is h, and the thickness of the semi-cured adhesive layer 3 located above the insulating layer 2 is h. f, the thickness of the semi-cured adhesive layer 3 located in the downward direction of the insulating layer 2 may be g, and h and i may be the same or different from each other so that f = g = h + i.

FIG. 15 is a cross-sectional view showing a modified example of the insulated wire 10 of FIG. In FIG. 15, the same or corresponding parts as those in FIG. 8 are designated by the same reference numerals, and the description thereof will be omitted. In FIG. 8, the step 12 is formed by providing the convex portion 11 on the semi-curing adhesive layer 3 above the insulating layer 2. In FIG. 15, a step 12 is formed by providing a convex portion 11 on the semi-curing adhesive layer 3 on the left side of the insulating layer 2. Further, in FIG. 8, the side surfaces 7a and 7b are formed by providing the recess 6 in the semi-curing adhesive layer 3 below the insulating layer 2. In FIG. 15, the side surfaces 7a and 7b are formed by forming the recess 6 in the semi-curing adhesive layer 3 on the right side of the insulating layer 2. The convex portion 11 is formed in a size that can be fitted into the concave portion 6.

FIG. 16 is a cross-sectional view of the insulated wire 10 shown in FIG. 15 when the insulated wire 10 is wound in multiple layers with the lower surface inside. In this way, when the insulated wire 10 is wound, if the convex portion 11 of the semi-cured adhesive layer 3 is fitted into the concave portion 6 of the semi-cured adhesive layer 3, the insulated wire 10 is wound to manufacture a coil. Occasionally, it is possible to suppress misalignment between adjacent windings and twisting of windings. A coil is manufactured by winding such a winding in multiple layers.

As shown in FIG. 17, the semi-cured adhesive layer 3 above the insulating layer 2 is provided with the same convex portion 11 as in FIG. 8, and the semi-cured adhesive layer 3 below the insulating layer 2 is provided with the same concave portion 6 as in FIG. The semi-cured adhesive layer 3 on the left side of the insulating layer 2 is provided with the same convex portion 11 as in FIG. 15, and the semi-cured adhesive layer 3 on the right side of the insulating layer 2 is provided with the same concave portion 6 as in FIG. You may do so.

As described above, in the insulated wire 10 of the first embodiment, since the semi-cured adhesive layer 3 which is the outermost peripheral layer has

steps

4 and 12, the case where the insulated wire 10 is wound in multiple layers to manufacture a coil. In addition, the

steps

4 and 12 come into contact with other parts of the insulated wire 10 and limit the movement of the contacted parts. Therefore, when the coil is manufactured by winding the insulated wire 10, it is possible to suppress the positioning between adjacent windings and the twisting of the windings.

Further, in the insulated wire 10 of the first embodiment, the semi-curing adhesive layer 3 of the outermost outermost layer is formed of the semi-curing adhesive, and the

steps

4 and 12 are also formed of the semi-curing adhesive. By extrusion-molding the curable adhesive, the semi-curable adhesive layer 3 can be collectively molded including the

steps

4 and 12. Therefore, the insulated wire 10 can be manufactured in a smaller number of steps as compared with the case where the

steps

4 and 12 of the semi-cured adhesive layer 3 must be formed in a separate process after being applied.

Further, in the insulated wire 10 of the first embodiment, since the semi-cured adhesive layer 3 of the outermost peripheral layer is in a semi-cured state including the

steps

4 and 12, the

steps

4 and 12 have a viscosity at room temperature or under heating. Then, when the

steps

4 and 12 are pressed against the other part of the insulated wire 10 when the insulated wire 10 is wound, the

steps

4 and 12 are deformed according to the shape of the portion and fitted with the portion. Easy to bond. Therefore, the insulated wire 10 of the first embodiment can suppress the misalignment of the winding and the twisting of the winding at the time of winding. The

steps

4 and 12 of the semi-cured adhesive layer 3 may have a hardness that does not deform according to the shape of the portion when the pressure welding is performed at room temperature.

Further, in the insulated wire 10 of the first embodiment, since the semi-curing adhesive layer 3 of the outermost peripheral layer is formed of the semi-curing adhesive, the windings can be fixed by the main curing by heating or the like. ..

Further, since the insulated wire 10 of the first embodiment has the insulating layer 2 between the conducting wire 1 and the semi-cured adhesive layer 3 of the outermost peripheral layer, the volume of the insulating wire 10 is higher than that of the semi-cured adhesive layer 3 as the material of the insulating layer 2. If a low-efficiency one is used, the cross-sectional area of the insulated wire 10 can be reduced as compared with the case where the insulating property is ensured only by the semi-curing adhesive layer 3. Further, as the material of the insulating layer 2, a material having higher adhesion to the conducting wire 1 than the semi-curing adhesive of the semi-curing adhesive layer 3 may be used.

Further, in the insulated wire 10 of the first embodiment, a step 4 is formed by providing a recess 5 in the semi-cured adhesive layer 3. Therefore, when the coil is manufactured by winding the insulated wire, the other portion of the insulated wire 10 is positioned in the recess 5 and its movement is restricted. Therefore, when the coil is manufactured by winding the insulated wire 10, it is possible to suppress the positioning between adjacent windings and the twisting of the windings.

Further, in the insulated wire 10 of the first embodiment, the recess 5 forming the step 4 is formed by partially reducing the thickness of the semi-curing adhesive layer 3. Therefore, the insulating layer 2 inside the semi-cured adhesive layer 3 is not exposed, and the insulating layer 2 can be protected.

Further, in the insulated wire 10 of the first embodiment, the recess 5 forming the step 4 is formed by exposing the insulating layer 2 without partially providing the semi-curing adhesive layer 3. Therefore, as compared with the case where the semi-cured adhesive layer 3 is thinned to form the recess 5, the recess 5 can be formed deeper without thickening the semi-cured adhesive layer 3.

Further, in the insulated wire 10 of the first embodiment, since the recess 5 of the semi-curing adhesive layer 3 extends in the extending direction of the conducting wire 1, the insulated wire 10 is fitted with the non-recessed winding in the recess 5. Can be wound.

Further, since the insulated wire 10 of the first embodiment has the same cross-sectional shape perpendicular to the extending direction of the insulating electric wire 10 over the entire extending direction, a part thereof is cut out from the insulated electric wire 10. When the same plurality of coils are manufactured, the same insulated wire 10 can be cut out regardless of the cutting position.

Further, the insulated wire 10 of the first embodiment has a rectangular cross-sectional shape on the outer peripheral surface of the semi-cured adhesive layer 3 of the outermost peripheral layer, and has recesses on each of the opposite outer peripheral surfaces of the semi-cured adhesive layer 3. Then, when the insulated wire 10 is wound, the corner portion on the outer peripheral surface side of one side can be fitted into the recess 5 on the other outer peripheral surface, so that the position of the winding and the twist of the winding during winding can be prevented. Can be suppressed.

Further, the insulated wire 10 of the first embodiment is provided with a taper at the opening of the recess 5 forming the step 4 so that the opening of the recess 5 is larger than that of the bottom surface of the recess 5. When the coil is manufactured by winding in multiple layers, it is easy to fit the portion of the winding adjacent to the recess 5.

Further, the insulated wire 10 of the first embodiment is provided with a taper at the opening of the recess 5 forming the step 4 so that the opening of the recess 5 is smaller than that of the bottom surface of the recess 5. When the coil is manufactured by winding in multiple layers, it is difficult for the adjacent winding portion fitted in the recess 5 to come off.

Further, the insulated wire 10 of the first embodiment is provided with a concave portion 6 and a convex portion 11 on the outer peripheral surface of the semi-cured adhesive layer 3 which is the outermost peripheral layer, and when the insulated wire 10 is wound, the concave portion 6 is formed. Since the convex portion 11 can be fitted, when the insulated wire 10 is wound in multiple layers to manufacture a coil, it is possible to suppress the misalignment of the winding and the twisting of the winding at the time of winding.

Further, the insulated wire 10 of the first embodiment is formed by forming a convex portion 11 having a step 12 on the outer peripheral surface of the semi-cured adhesive layer 3 which is the outermost layer by partially thickening the semi-cured adhesive layer 3. Therefore, the semi-curable adhesive layer 3 can be collectively formed including the convex portion 11 by extrusion-molding the semi-curable adhesive that forms the semi-curable adhesive layer 3. Therefore, the insulated wire 10 can be manufactured in a smaller number of steps than in the case where the convex portion 11 must be formed in a separate process after the semi-curing adhesive layer 3 is applied.

Here, the insulating layer 2 of the insulated wire 10 of the first embodiment is shown as a single layer, but the insulating layer 2 may be formed by laminating a plurality of insulating layers made of different materials. good. Further, an expansion layer (not shown) that expands by heating may be provided between the semi-curing adhesive layer 3 and the insulating layer 2. Further, the insulated wire 10 of the first embodiment may be wound in multiple layers with the semi-cured adhesive layer 3 in a semi-cured state and then main-cured to manufacture a coil. However, the insulation of the first embodiment may be produced. After the electric wire 10 is finally cured, it may be wound in multiple layers to manufacture a coil.

Embodiment 2.
FIG. 18 is a cross-sectional view of the insulated wire 10 according to the second embodiment of the present disclosure. FIG. 18 shows a cross section in a direction perpendicular to the extending direction of the insulated wire 10. The insulated wire 10 has the same cross section throughout the extending direction, that is, the cross section shown in FIG. In FIG. 18, the same or corresponding parts as those in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted.

In the first embodiment, the insulated wire 10 has an insulating layer 2 between the conducting wire 1 and the semi-curing adhesive layer 3, but in the second embodiment, the insulating layer is formed between the conducting wire 1 and the semi-curing adhesive layer 13. The semi-curing adhesive layer 13 is formed directly on the conductor 1 without providing 2. The semi-cured adhesive layer 13 is formed to a thickness that satisfies the insulating performance with respect to the conductor 1 only by the semi-cured adhesive layer 13. The semi-cured adhesive layer 13 is the outermost layer of the insulated wire 10.

Since the material of the conductor 1 and the semi-cured adhesive layer 13 in FIG. 18 is the same as that of the conductor 1 and the semi-cured adhesive layer 3 of the first embodiment, the description thereof will be omitted. Similar to the first embodiment, the semi-curing adhesive layer 13 is a layer made of a semi-curing adhesive in a semi-curing state.

Also in the second embodiment, the semi-cured adhesive layer 13 which is the outermost layer has the following characteristics. The semi-curing adhesive layer 13 has an insulating property and contributes to the insulation of the conducting wire 1. Further, the semi-cured adhesive layer 13 is in a semi-cured state, and a coil in which the windings are fixed can be manufactured by winding the insulating electric wire 10 in multiple layers and main curing.

Further, a step 4 is formed on the outer peripheral surface of the semi-cured adhesive layer 13. Therefore, when the insulated wire 10 is wound in multiple layers, the step 4 comes into contact with another portion of the insulated wire 10 and restricts the movement of that portion. Therefore, if a coil is manufactured using the insulated wire 10, it is possible to suppress the misalignment of the winding and the twisting of the winding during winding.

Further, the step 4 is formed by molding a semi-curing adhesive that forms the semi-curing adhesive layer 13. Therefore, in the manufacturing process of the insulated wire 10, if extrusion molding or the like described later is used, the semi-cured adhesive layer 13 can be collectively molded including the step 4.

The semi-cured adhesive layer 13 is formed to a thickness that satisfies the required insulating performance, but includes the thickness of the portion of the semi-cured adhesive layer 13 that covers the entire outer peripheral surface of the conductor 1 (that is, the thickness of the recess). The thickness) is preferably 10 μm to 500 μm.

In order to improve the adhesion and adhesive strength between the conductor 1 and the semi-cured adhesive layer 13, the surface of the conductor 1 is physically or chemically treated before the semi-cured adhesive layer 13 is applied on the surface of the conductor 1. You may go. As such physical treatment, atmospheric plasma treatment, deep ultraviolet light treatment, corona discharge treatment, sparsening treatment (laser sparsening, polishing, sandblasting treatment) and the like can be used.

Further, as a chemical treatment, a silane coupling agent may be applied on the surface of the conductor 1 as a primer, and the semi-cured adhesive layer 13 may be applied using the primer as a surface to be adhered. When an epoxy-based adhesive is used as the semi-curable adhesive that forms the semi-curable adhesive layer 13, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane and 3-glycidoxypropylmethyl are used as the primers. Ditoxylsilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, 3aminopropyltrimethoxysilane, 3 -Triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N- (benylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride Salt or the like can be used. The surface of the conductor 1 may be subjected to both the above-mentioned physical treatment and chemical treatment.

In FIG. 18, a step 4 is formed by providing a recess 5 on the upper surface of the semi-cured adhesive layer 13, which is the outermost layer. In FIG. 18, the step 4 is each of the side surfaces 4a and 4b of the recess 5. 4a is the left side surface in the

recess

5, and 4b is the right side surface in the recess 5. Further, a recess 6 is formed on the lower surface of the semi-cured adhesive layer 13. 7a is the left side surface in the

recess

6, and 7b is the right side surface in the recess 6.

8 in FIG. 18 is the upper left corner portion of the semi-cured

adhesive layer

13, and 9 is the lower right corner portion of the semi-cured adhesive layer 13. The recess 5 is formed in such a size that the lower right corner portion 9 can be fitted into the recess 5. The recess 6 is formed in such a size that the upper left corner portion 8 can be fitted into the recess 6. Similar to FIG. 2, the lower right corner portion 9 which is a non-recessed winding of the adjacent winding can be fitted in the recess 5.

In FIG. 18, as in FIG. 1, the space between the side surface 4a and the side surface 4b is increased from the bottom surface of the recess 5 toward the opening of the recess 5, so that the lower right corner portion 9 can be easily fitted into the recess 5. Is provided with a taper. Further, by increasing the distance between the side surface 7a and the side surface 7b from the bottom surface of the recess 6 toward the opening of the recess 6, a taper is provided so that the upper left corner portion 8 can be easily fitted into the recess 6. ..

FIG. 19 is a cross-sectional view showing a modified example of the insulated wire 10 of FIG. In FIG. 18, a step 12 is formed by providing a convex portion 11 on the semi-cured adhesive layer 13 of the outermost peripheral layer. In FIG. 18, the step 12 is each of the side surfaces 12a and 12b of the convex portion 11. 12a is the left side surface of the

convex portion

11, and 12b is the right side surface of the convex portion 11. Further, a recess 6 is formed on the lower surface of the semi-cured adhesive layer 13. 12a is the left side surface in the

recess

6, and 12b is the right side surface in the recess 6. The convex portion 11 is formed in a size that can be fitted into the concave portion 6.

When the insulated wire 10 of FIG. 19 is wound in multiple layers, the convex portion 11 of the semi-cured adhesive layer 13 of the adjacent winding can be fitted into the concave portion 6 as in FIG. In this way, when the insulated wire 10 is wound, if the convex portion 11 of the semi-cured adhesive layer 13 is fitted into the concave portion 6 of the semi-cured adhesive layer 13, the insulated wire 10 is wound to manufacture a coil. Occasionally, it is possible to suppress misalignment between adjacent windings and twisting of windings.

FIG. 20 is a cross-sectional view showing a modified example of the insulated wire 10 of FIG. In FIG. 20, the same or corresponding parts as those in FIG. 19 are designated by the same reference numerals, and the description thereof will be omitted. In FIG. 20, the step 12 is formed by providing the convex portion 11 on the semi-curing adhesive layer 13 on the left side of the conducting wire 1. Further, the side surfaces 7a and 7b are formed by forming the recess 6 in the semi-curing adhesive layer 13 on the right side of the conducting wire 1. The convex portion 11 is formed in a size that can be fitted into the concave portion 6. Similar to FIG. 16, when winding the insulated wire 10, if the convex portion 11 of the semi-cured adhesive layer 13 is fitted into the concave portion 6 of the semi-cured adhesive layer 13, the insulated wire 10 is wound to wind the coil. When manufactured, it is possible to suppress misalignment between adjacent windings and twisting of windings.

As described above, in the insulated wire 10 of the second embodiment, since the semi-cured adhesive layer 13 which is the outermost layer is directly laminated on the outer peripheral surface of the conductor 1, it is between the conductor 1 and the semi-cured adhesive layer 13. It can be manufactured with a smaller number of steps as compared with the case where a separate insulating layer is provided.

Embodiment 3.
As the third embodiment, the method of manufacturing the insulated wire 10 of the first embodiment will be described. FIG. 21 is a flow chart showing an outline of the manufacturing process of the insulated wire 10 according to the third embodiment. FIG. 22 is a schematic view of a manufacturing apparatus used in the manufacturing process of FIG. 21. Here, for example, the method for manufacturing the insulated wire 10 shown in FIG. 1 will be described, but the insulated wire 10 shown in FIGS. 2 to 17 can also be manufactured in the same manner.

First, the lead wire 1 is sent to the surface treatment machine 101 shown in FIG. 22, and the surface treatment SC1 shown in FIG. 21 is performed in this surface treatment machine 101. Specifically, the surface treatment machine 101 cleans the conductor 1 with a solvent such as acetone, or performs the above-mentioned physical treatment and / or chemical treatment on the outer peripheral surface of the conductor 1. For example, as a physical treatment, an atmospheric plasma treatment, a deep ultraviolet light treatment, a corona discharge treatment, or a sparsening treatment (laser sparsening, polishing, sandblasting treatment) is performed on the outer peripheral surface of the conducting wire 1. Further, as a chemical treatment, a silane coupling agent is applied on the outer peripheral surface of the conducting wire 1.

Next, the conductor 1 is sent to the heating furnace 102 shown in FIG. 22, and the heating step HC shown in FIG. 21 is performed in this heating furnace 102. In this heating step HC, the lead wire 1 sent from the surface treatment machine 101 is preheated for extrusion molding described later. For example, the heating furnace 102 preheats the lead wire 1 sent from the surface treatment machine 101 to about 300 ° C.

Next, the lead wire 1 is sent to the extruder 103 shown in FIG. 22, and the first molding step P1 shown in FIG. 21 is performed in the extruder 103. In this first molding step P1, the insulating layer 2 is extruded on the outer peripheral surface of the lead wire 1 sent from the heating furnace 102. For example, the extruder 103 extrudes a thermoplastic insulating resin such as polyetheretherketone (PEEK) or polyphenylene sulfide (PPS) on the outer peripheral surface of the preheated lead wire 1 sent from the heating furnace 102. By doing so, the insulating layer 2 is formed on the outer peripheral surface of the lead wire 1. These insulating resins such as PEEK and PPS are put into the extruder 103 in the form of pellets and extruded on the outer peripheral surface of the lead wire 1 at a temperature equal to or higher than the melting point of the insulating resin and lower than the decomposition temperature.

The conductor 1 on which the insulating layer 2 is formed by the extrusion molding machine 103 is sent to the surface treatment machine 104, and the surface treatment SC2 shown in FIG. 21 is performed in this surface treatment machine 104. Specifically, the surface treatment machine 104 performs the above-mentioned physical treatment and / or chemical treatment on the outer peripheral surface of the insulating layer 2. For example, as a physical treatment, an atmospheric plasma treatment, a deep ultraviolet light treatment, a corona discharge treatment, or a sparsening treatment (laser sparsening, polishing, sandblasting treatment) is performed on the outer peripheral surface of the insulating layer 2. Further, as a chemical treatment, a silane coupling agent is applied on the outer peripheral surface of the insulating layer 2.

The conductor 1 with the insulating layer 2 surface-treated by the surface treatment machine 104 is sent to the extrusion molding machine 105 shown in FIG. 22, and the second molding step P2 shown in FIG. 21 is performed in the extrusion molding machine 105. Will be. In this second molding step P2, the semi-curing adhesive layer 3 is extruded together with the step 4 and the step 7 on the outer peripheral surface of the insulating layer 2 of the conducting wire 1 sent from the surface treatment machine 104.

For example, when a solid and pellet-shaped B-stage adhesive is charged into the extruder 105 at room temperature, the B-stage adhesive is heated to a temperature above the melting point (for example, 60 ° C or higher and 140 ° C or lower), and the B stage is heated. It is applied and extruded on the insulating layer 2 in the above state. If the B-stage type adhesive used here is in the form of pellets at room temperature, it is easy to store and handle. The normal temperature is, for example, 5 ° C to 35 ° C. The viscosity of the B-stage adhesive when the B-stage adhesive is applied onto the insulating layer 2 and extruded is preferably, for example, 3 Pa or more and 150 Pa or less.

FIG. 23 is a schematic view showing the configuration of the extruder 105. 200 is a solid and pellet-shaped B-stage type adhesive, 201 is an input port for the B-stage type adhesive 200, 202 is a crushing portion for crushing the pellet-shaped B-stage type adhesive 200, and 203 is a crushed B-stage type. The coating portion where the adhesive 200 is melted and the melted B-stage type adhesive 200 is applied onto the insulating layer 2 of the lead wire 1 in the state of the B stage, and 204 is the B-stage type adhesive which is melt-coated on the insulating layer 2. Is a drawing jig that is extruded in the state of the B stage to form the semi-cured adhesive layer 3 together with the step 4 and the step 7. Here, a B-stage adhesive that is solid at room temperature is used, but a B-stage adhesive that is liquid at room temperature and can be B-staged by heating or UV irradiation may be used.

When the semi-curing adhesive layer 3 is not formed by the B-stage type adhesive but is formed by the photo-curing type adhesive, the photo-curing type adhesive which is liquid at room temperature is charged into the extrusion molding machine, and the extrusion molding machine is used. A light source having a curing wavelength may be provided at the extrusion port of 105, and the photocurable adhesive may be irradiated with the light to be extruded in a semi-cured state.

Further, in order to make it easier to control the thickness of the semi-curing adhesive layer 3, an insulating material such as glass or molten silica may be mixed with the semi-curing adhesive as a thickness adjusting material and extruded.

Here, the surface treatment SC1 by the surface treatment machine 101 was performed in the step before the first molding step P1 by the extrusion molding machine 103, but this surface treatment SC1 may be omitted. Further, although the surface treatment SC2 by the surface treatment machine 104 was performed in the step before the second molding step P2 by the extrusion molding machine 105, this surface treatment SC2 may be omitted.

Further, although the method of manufacturing the insulated wire 10 of the first embodiment has been described here, the insulated wire 10 of the second embodiment, that is, the insulated wire in which the semi-cured adhesive layer 3 is directly formed on the outer peripheral surface of the conducting wire 1. 10 can also be manufactured in the same manner without the first molding step P1 and the surface treatment SC1.

Further, the insulated wire 10 shown in each of the first embodiment and the second embodiment may be manufactured by a method other than the manufacturing method of the third embodiment.

Embodiment 4.
As the fourth embodiment, an electric device using the insulated wire 10 of the present disclosure exemplified in the first embodiment and the second embodiment will be described. FIG. 24 is a schematic view of a coil formed by winding the insulated wire 10 of FIG. In FIG. 24, 30 is an insulator of a coil such as a tooth, and 31 is an iron core of the coil. As described above, in the insulated wire 10, the semi-cured adhesive layer 3, which is the outermost layer, has a step 4, so that when the insulated wire 10 is wound in multiple layers to manufacture a coil, the step 4 is the other than the insulated wire 10. Contact with the part of, and restrict the movement of the contacted part. Therefore, when the coil is manufactured by winding the insulated wire 10, it is possible to suppress the position of the winding and the twist of the winding. Therefore, the reliability of the coil is improved, the winding density of the coil is improved, and the coil can be miniaturized.

Further, in the insulated wire 10, since the semi-cured adhesive layer 3 of the outermost peripheral layer is formed of the semi-cured adhesive, the coil is heated after winding the insulated wire 10 in multiple layers around the insulator 30 in this way. It is possible to fix the windings between the windings by the main curing. Therefore, the durability and reliability of the coil are further improved.

The surface around which the insulated wire 10 of the insulator 30 is wound may be a flat surface, but as shown in FIG. 24, it may have a groove portion 30a into which the lower right corner portion 9 of the insulated wire 10 is fitted. good.

Further, in FIG. 24, when a plurality of layers of the insulated wire 10 are wound around the coil, the number of windings of each layer is the same, but as shown in FIG. 25, the number of windings is smaller as the layer is wound outward. You may try to do it. Such a winding method is effective for improving the winding density that can be wound around each tooth. Normally, in such a winding method, the winding is easy to unwind, but if the insulated wires of the first and second embodiments are wound to form a coil, the winding is difficult to unwind due to the step. can do.

Also in the coil of FIG. 25, since the semi-curing adhesive layer 3 of the outermost peripheral layer of the insulated wire 10 is formed of the semi-curing adhesive, the coil is wound after winding the insulating wire 10 in multiple layers around the insulator 30. The windings can be fixed between the windings by the main curing by heating or the like. The circled numbers in FIGS. 24 and 25 exemplify the order in which the insulated wire 10 is wound.

By incorporating the coils manufactured as shown in FIGS. 24 and 25 to manufacture electric devices such as motors, generators, transformers, solenoids, and reactors, small and highly reliable electric devices can be obtained.

1 conductor, 2 insulating layer, 3 semi-curing adhesive layer, 4 step, 5 recess, 6 recess, 7 step, 8 upper left corner, 9 lower right corner, 81 left end, 91 right end.

Claims

It has a lead wire and an outermost layer, which is the outermost layer laminated on the outer peripheral side of the lead wire, and the outermost layer is composed of an insulating semi-curable adhesive and is formed on the outer peripheral surface thereof. An insulated wire having a step obtained by molding the semi-curing adhesive.
The insulated wire according to claim 1, wherein the outermost peripheral layer is in a semi-cured state.
The insulated wire according to claim 1 or 2, wherein the semi-curing type adhesive is a B-stage type adhesive.
The insulated wire according to claim 3, wherein the B-stage type adhesive is a solid at room temperature before the main curing and melts by heating.
The insulated wire according to claim 1 or 2, wherein the semi-curable adhesive is a photocurable adhesive.
The insulated wire according to any one of claims 1 to 5, which has an insulating layer between the conducting wire and the outermost peripheral layer.
The insulated wire according to any one of claims 1 to 5, wherein the outermost layer is directly laminated on the outer peripheral surface of the conducting wire.
The insulated wire according to any one of claims 1 to 7, wherein the step is formed by providing a recess on the outer peripheral surface of the outermost peripheral layer.
The insulated wire according to claim 8, wherein the outermost peripheral layer is a non-concave portion other than the concave portion of the outermost peripheral layer, which can be fitted into the concave portion when the insulated wire is wound.
The insulated wire according to claim 9, wherein the non-recessed portion is a corner portion of the outermost peripheral layer.
The insulated wire according to claim 10, wherein the corner portion that can be fitted into the recess is formed by a side surface of a recess whose side surface is different from that of the recess.
The insulated wire according to any one of claims 1 to 7, wherein the step is formed by providing a convex portion on the outer peripheral surface of the outermost peripheral layer.
The step is formed by providing a convex portion and a concave portion on the outer peripheral surface of the outermost peripheral layer, and the convex portion can be fitted into the concave portion when the insulated wire is wound. The insulated wire according to any one of the items.
The insulated wire according to any one of claims 1 to 13, wherein the outermost peripheral layer has the same cross-sectional shape perpendicular to the extending direction of the conducting wire over the entire extending direction.
The insulated wire according to any one of claims 1 to 14, wherein the semi-cured adhesive is heated and finally cured.
It has a conducting wire and an outermost outermost layer which is the outermost layer laminated on the outer peripheral surface of the conducting wire, and the outermost peripheral layer is composed of an insulating semi-curable adhesive and has the outer peripheral surface thereof. It is a method of manufacturing an insulated wire having a step obtained by molding a semi-curing adhesive.
The outermost layer is a method for manufacturing an insulated wire formed by extrusion-molding the semi-curable adhesive.
The method for manufacturing an insulated wire according to claim 16, wherein the viscosity of the semi-curable adhesive at the time of application is 3 Pa or more and 150 Pa or less, and the thickness of the outermost peripheral layer formed by the extrusion molding is 10 μm to 500 μm.
It has a conductor and an outermost layer that is the outermost layer laminated on the outer peripheral side of the conductor, and the outermost layer is composed of an insulating semi-curable adhesive and has the outer peripheral surface thereof. An electric device having a coil formed by winding a plurality of layers of an insulated wire having a step formed by forming a semi-curing adhesive.
The electric device according to claim 18, wherein the coil has at least one winding number of the plurality of layers smaller than the number of windings of the layer wound inside the coil.
The electric device according to claim 18 or 19, wherein the coil is formed with a groove in which a corner portion of the outermost peripheral layer is fitted on a surface around which the plurality of layers are wound.