JP7419092B2 - cutting blade - Google Patents

Description

The present disclosure relates to cutting blades.

2. Description of the Related Art Conventionally, when cutting, such as dicing, a semiconductor wafer on which semiconductor devices or electronic components are formed, a cutting blade such as a dicing blade is sometimes used. As the above-mentioned cutting blade, for example, one using diamond abrasive grains is known (see, for example, Patent Document 1).

JP2015-164228A

When attempting to cut an object to be cut, such as a semiconductor wafer, at high speed using a conventional cutting blade using diamond abrasive grains, it is conceivable to use large-sized diamond abrasive grains. However, when large-sized diamond abrasive grains are used, there is a problem in that chipping of the object to be cut becomes large.

Therefore, an object of the present disclosure is to provide a cutting blade that can suppress chipping that occurs during cutting.

As a result of intensive studies to achieve the above object, the inventors of the present disclosure discovered that chipping that occurs during cutting can be suppressed by incorporating nanodiamond particles into a cutting blade that uses metal as a bond. . The present disclosure relates to what has been completed based on these findings.

The present disclosure is a cutting blade for cutting a plate-like object,
A cutting blade is provided that includes an abrasive grain, a nanodiamond particle, and a metal that is a bond bonding the abrasive grain and the nanodiamond particle.

Preferably, the cutting blade has the nanodiamond particles dispersed in a metal matrix made of the metal.

Preferably, the abrasive grains include inorganic particles.

Preferably, the inorganic particles include diamond particles.

Preferably, the metal is a metal bond formed by a sintering method.

Preferably, the metal includes an alloy containing copper.

The cutting blade may include secondary particles of nanodiamond particles.

The average particle diameter (D50) of the primary particles of the nanodiamond particles in the cutting blade is preferably 1 to 240 nm.

The average particle diameter (D50) of the abrasive grains in the cutting blade is preferably 1 to 600 μm.

Preferably, the nanodiamond particles include detonation-produced nanodiamonds.

Preferably, the cutting blade is a dicing blade for dicing a semiconductor wafer.

According to the cutting blade described above, chipping that occurs during cutting can be suppressed. This improves the yield in the cutting process, resulting in an effect of improving process capability.

FIG. 2 is an enlarged schematic diagram of a cutting blade according to an embodiment of the present disclosure. It is a graph which shows the evaluation result of the chipping size of the back side of the glass cutting test in an Example and a comparative example. It is a graph showing the evaluation results of the chipping size on the surface of the glass cutting test in Examples and Comparative Examples.

A cutting blade according to an embodiment of the present disclosure is a cutting blade (blade) for cutting a plate-shaped object. It is particularly preferable that the cutting blade is a dicing blade for dicing the semiconductor wafer into individual pieces.

The cutting blade is, for example, disk-shaped and is attached to the outer circumference of a disk-shaped flange or hub mount that has a hole in the center for attachment to a spindle shaft of a dicing device. Further, the disc-shaped cutting blade has an annular shape having a flange for mounting on a dicing device and a hole for mounting on a hub mount in the center of the disc.

The cutting blade includes at least abrasive grains, nanodiamond particles, and a metal that is a bond bonding the abrasive grains and the nanodiamond particles.

FIG. 1 shows an enlarged schematic diagram of an embodiment of the cutting blade. Cutting blade 1 includes metal 2, nanodiamond particles 3, and abrasive grains 4. More specifically, the cutting blade 1 has nanodiamond particles 3 and abrasive grains 4 dispersed in a metal matrix made of metal 2.

In the cutting blade, the metal acts as a bond between the nanodiamond particles and the abrasive grains. In the cutting blade, the metal may be a metal bond formed by a sintering method, or an electroformed bond formed by plating growth using an electroforming method. Among these, the sintering method can be manufactured by mixing nanodiamond particles in a powder state with abrasive grains and a binder and baking them, making it possible to combine nanodiamond particles on the order of a few percent. , metal bond is preferable.

The above-mentioned metals include those used in known or conventional cutting blades, such as lithium, magnesium, aluminum, calcium, chromium, titanium, vanadium, iron, cobalt, nickel, copper, zinc, silver, tin, Examples include antimony, tellurium, tungsten, gold, bismuth, and alloys containing these metals. The above-mentioned alloy is preferably an alloy containing copper such as bronze or a copper-tin-zinc alloy. The above metal is preferably a soft metal. The above metals may be used alone or in combination of two or more.

Examples of the abrasive grains include those used in known or commonly used cutting blades, such as inorganic particles, organic particles, and organic-inorganic composite particles. Inorganic particles include oxide particles such as silica particles, alumina particles, cerium oxide particles, chromium oxide particles, titanium dioxide particles, zirconium oxide particles, magnesium oxide particles, manganese dioxide particles, zinc oxide particles, red iron particles; silicon nitride particles; , nitride particles such as boron nitride particles; carbide particles such as silicon carbide particles and boron carbide particles; diamond particles; carbonates such as calcium carbonate and barium carbonate. Examples of the organic particles include polymethyl methacrylate (PMMA) particles, poly(meth)acrylic acid particles, and polyacrylonitrile particles. Among the above abrasive grains, inorganic particles are preferable, and diamond particles are particularly preferable from the viewpoint of good cutting performance and easy chipping. The above abrasive grains may be used alone or in combination of two or more.

The diamond particles as the abrasive grains are preferably micron-sized diamond particles (microdiamond particles) from the viewpoint that they are larger than nanodiamond particles and function as abrasive grains.

As the microdiamond particles, known or commonly used microdiamond particles can be used. The above-mentioned microdiamond particles may be used alone or in combination of two or more.

In the cutting blade, it is presumed that the nanodiamond particles exhibit a friction/wear reducing effect. This is because when the abrasive grains grind a plate-like object, a transfer film (carbon transfer film) derived from nanodiamond particles is formed on the surface of the plate-like object, and this transfer film is caused by excessive wear or chipping caused by the abrasive grains. It is presumed that this is due to the suppression of In this way, the cutting blade described above suppresses chipping. This improves the yield in the cutting process, resulting in an effect of improving process capability.

The average particle diameter (D50, median diameter) of the abrasive grains (especially microdiamond particles) in the cutting blade is, for example, 1 to 600 μm, preferably 5 to 300 μm, more preferably 7 to 100 μm, and still more preferably 10 to 50 μm. It is. The above average particle diameter can be measured by a dynamic light scattering method.

The content of abrasive grains in the cutting blade is, for example, 1 to 30 parts by volume, preferably 5 to 20 parts by volume, and more preferably 8 to 15 parts by volume, based on 100 parts by volume of the metal. . Further, it is preferable that the content of micro-nano diamond particles is within the above range.

The nanodiamond particles are nano-sized diamond particles, and are not particularly limited, and any known or commonly used nanodiamond particles can be used. The nanodiamond particles may be surface-modified nanodiamond particles or non-surface-modified nanodiamond particles. Note that nanodiamond particles that are not surface-modified have hydroxyl groups (-OH) on the surface. The nanodiamond particles may be used alone or in combination of two or more.

In the above-mentioned surface-modified nanodiamond, examples of the compound or functional group that modifies the surface of the nanodiamond particle include a silane compound, a carboxyl group (-COOH), a phosphonate ion or a phosphonic acid residue, and a surface modification having a vinyl group at the end. Examples include a group containing a group, an amide group, a cation of a cationic surfactant, a group containing a polyglycerin chain, and a group containing a polyethylene glycol chain.

Preferably, the nanodiamond particles in the cutting blade include primary nanodiamond particles. In addition, it may contain secondary particles in which several to several dozen of the above-mentioned primary particles are aggregated (agglomerated). That is, the nanodiamond particles may be secondary particles (cluster nanodiamond particles) in the cutting blade.

The average particle diameter (D50, median diameter) of the primary particles of the nanodiamond particles in the cutting blade is, for example, 1 to 240 nm, preferably 2 to 100 nm, more preferably 3 to 50 nm, even more preferably 4 to 20 nm, especially Preferably it is 4 to 10 nm. The above average particle diameter can be measured by a dynamic light scattering method.

As the nanodiamond particles, for example, nanodiamonds produced by a detonation method (detonation nanodiamonds) or nanodiamonds produced by a high temperature and high pressure method (high temperature and high pressure nanodiamonds) can be used. Among these, the detonation method nanodiamond is preferred because nanodiamonds having a primary particle diameter of one digit nanometer can be easily obtained.

Examples of the detonation nanodiamonds include nanodiamonds produced by air-cooled detonation (air-cooled detonation nanodiamonds) and nanodiamonds produced by water-cooled detonation (water-cooled detonation nanodiamonds). It will be done. Among these, air-cooled detonation nanodiamonds are preferred because their primary particles are smaller than water-cooled detonation nanodiamonds.

The detonation may be performed in the air or in an inert gas atmosphere such as a nitrogen atmosphere, an argon atmosphere, or a carbon dioxide atmosphere.

The content of the nanodiamond particles in the cutting blade is, for example, 0.05 to 50 parts by volume, preferably 0.1 to 20 parts by volume, more preferably 1 part by volume, based on 100 parts by volume of the metal. ~10 parts by volume.

The cutting blade may contain other components than metal, nanodiamond particles, and abrasive grains. The above-mentioned other components may be used alone or in combination of two or more. The total content of metal, nanodiamond particles, and abrasive grains in the cutting blade is, for example, 90% by mass or more, 95% by mass or more, 98% by mass or more with respect to the total amount of 100% by mass of the cutting blade. , 99% by mass or more.

The above-mentioned cutting blade can be appropriately manufactured by referring to a known or commonly used cutting blade manufacturing method. For example, a disc-shaped cutting blade is made by forming a composition containing metal, nanodiamond particles, and abrasive grains by sintering or electroplating, and then punching it into the desired shape. It can be made.

Each aspect disclosed herein can be combined with any other feature disclosed herein. The configurations and combinations thereof in each embodiment are merely examples, and additions, omissions, substitutions, and other changes to the configurations can be made as appropriate without departing from the spirit of the present disclosure. Further, each invention according to the present disclosure is not limited by the embodiments or the following examples, but is limited only by the scope of the claims.

An embodiment of the present disclosure will be described in more detail below based on an example.

Example 1
Detonation nanodiamond particles and blades were manufactured through the following steps.

(Preparation of nanodiamonds by detonation method)
First, a nanodiamond generation process was performed using the detonation method. In this process, first, a shaped explosive with an electric detonator attached was placed inside a pressure-resistant container for detonation, and the container was sealed. The container is made of iron and has a volume of 15 m ³ . As the explosive, 0.50 kg of a mixture of TNT and RDX was used. The mass ratio of TNT to RDX (TNT/RDX) in this explosive is 50/50. Next, an electric detonator was detonated to detonate the explosive within the container (detonation nanodiamond production). Next, the temperature of the container and its interior was lowered by leaving it at room temperature for 24 hours. After this cooling, the nanodiamond crude products (including soot and aggregates of nanodiamond particles produced by the above detonation method) adhering to the inner wall of the container are scraped off with a spatula, and the nanodiamond The crude product was collected.

Next, an oxidation treatment step was performed. An oxidation treatment step was performed on the nanodiamond crude product obtained by performing the above-described generation step multiple times. Specifically, 6L of 98% by mass sulfuric acid and 1L of 69% by mass nitric acid were added to the obtained nanodiamond crude product to form a slurry, and then this slurry was refluxed at 48% by mass under normal pressure conditions. Heat treatment was performed for an hour. The heating temperature in this oxidation treatment is 140 to 160°C. Next, after cooling, the solid content (including nanodiamond aggregates) was washed with water by decantation. Although the supernatant liquid at the time of washing was colored, the solids were repeatedly washed with water by decantation until the supernatant liquid became visually transparent. Thereafter, it was dried to obtain nanodiamond particles containing primary particles and nanodiamond aggregates (secondary particles) as a powder. Further, the mixture was heated at 400° C. for 6 hours in a rotary kiln into which a gas containing about 8% by volume of oxygen and about 92% by volume of nitrogen was blown in at a flow rate of 20 L/min to obtain a dry powder of nanodiamonds.

Crystal structure analysis was performed on the obtained nanodiamond dry powder using an X-ray diffraction device (trade name "SmartLab", manufactured by Rigaku Co., Ltd.). As a result, a strong diffraction peak was observed at the diffraction peak position of diamond, that is, the diffraction peak position from the (111) plane of the diamond crystal, and the calculated crystallite size was 4.5 nm. In addition, the obtained dry powder was subjected to small-angle X-ray scattering measurement using an X-ray diffraction device (product name "SmartLab", manufactured by Rigaku Co., Ltd.), and particle size distribution analysis software (product name "NANO- Solver'' (manufactured by Rigaku Co., Ltd.) was used to estimate the primary particle size of nanodiamonds in the region of scattering angles of 1° to 3°. In this estimation, it was assumed that the nanodiamond primary particles were spherical and the particle density was 3.51 g/cm ³ . As a result, the average particle size of the nanodiamond primary particles obtained in this measurement was 5.5 nm, and the relative standard deviation (RSD) regarding the primary particle distribution was 30.2.

(Production of blade)
Bronze is used as a metal bond binder, and a composition in which 10 parts by volume of microdiamond powder (#800, abrasive grains for cutting, D50: 18 to 25 μm) is blended to 100 parts by volume of the binder, The nanodiamond dry powder was blended in an amount of 6.4 parts by volume with respect to 100 parts by volume of the binder, and sintered into a sheet shape at a temperature of 750° C. in a nitrogen atmosphere. Thereafter, a metal blade (outer diameter: 56 mm, inner diameter: 40 mm, blade thickness 0.13 mm) was produced by punching out an annular shape.

In addition, as a result of crystal structure analysis of the above-mentioned microdiamond powder using an X-ray diffraction device (product name "SmartLab", manufactured by Rigaku Co., Ltd.), the diamond diffraction peak position, that is, the diamond crystal A strong diffraction peak was observed at the diffraction peak position from the (111) plane, and the calculated crystallite size was 20 μm.

Comparative example 1
A metal blade was produced in the same manner as in Example 1 except that the nanodiamond dry powder was not blended.

(Glass cutting test)
A glass cutting test was conducted on the metal blades produced in Examples and Comparative Examples. The metal blades obtained in the examples and comparative examples were set in a dicing device, and a glass plate (length 7.5 cm x width 7.5 cm x thickness 0.4 mm) was cut using the metal blade. The chipping size on the front and back sides of the glass plate was confirmed. The glass plate was cut at a spindle rotation speed of 20 rpm, and a feed rate of 2 times at 1 mm/s, 2 times at 2 mm/s, 2 times at 3 mm/s, 2 times at 4 mm/s, and 2 times at 5 mm/s. , 25 times (35 times in total) at 6 mm/sec, respectively, so as to cut in the length direction. Further, cutting was performed in the width direction 72 times at a spindle rotation speed of 20 rpm and a feed rate of 6 mm/sec (107 times in total). After cutting, chippings on the cutting lines on the front and back surfaces of the glass plate were observed using an optical microscope, and nine large points were extracted on each of the front and back surfaces. For each of the nine points extracted on the front and back sides, the results of the chipping size evaluation on the back side are shown in FIG. 2 and Table 1, and the results of the chipping size evaluation on the front side are shown in FIG. 3 and Table 2, respectively. Note that the cutting was performed while supplying pure water at a rate of 1.0 L/min.

As shown in FIG. 2 and Table 1, when the metal blade obtained in Comparative Example 1 was used, the chipping size on the back surface of the glass plate was 13 to 30 μm, and the average value was 21 μm. On the other hand, when the metal blade obtained in Example 1 was used, the chipping size on the back surface of the glass plate was 11 to 20 μm, and the average value was 14 μm. In this way, in Example 1, the chipping size is generally smaller than in Comparative Example 1, the average value is also smaller, and the standard deviation is smaller and the variation is smaller. Furthermore, as shown in FIG. 3 and Table 2, it can be seen that the chipping size in Example 1 is generally smaller than that in Comparative Example 1 on the surface of the glass plate.

Variations of the invention according to the present disclosure will be described below.
[Appendix 1] A cutting blade for cutting a plate-shaped object, which includes abrasive grains, nanodiamond particles, and a metal that is a bond that bonds the abrasive grains and the nanodiamond particles.
[Appendix 2] The cutting blade according to Appendix 1, wherein the nanodiamond particles are dispersed in a metal matrix made of the metal.
[Appendix 3] The cutting blade according to Appendix 1 or 2, wherein the abrasive grains include inorganic particles.
[Appendix 4] The cutting blade according to Appendix 3, wherein the inorganic particles include diamond particles.
[Appendix 5] The cutting blade according to Appendix 4, wherein the diamond particles include microdiamond particles.
[Appendix 6] Appendices 1 to 5, wherein the average particle diameter of the abrasive grains (preferably the microdiamond particles) is 5 to 300 μm (preferably 5 to 300 μm, more preferably 7 to 100 μm, even more preferably 10 to 50 μm). The cutting blade according to any one of .
[Appendix 7] The cutting blade according to any one of Appendices 1 to 6, wherein the metal is a metal bond formed by a sintering method.
[Appendix 8] The cutting blade according to any one of Appendices 1 to 7, wherein the metal includes an alloy containing copper.
[Appendix 9] The cutting blade according to any one of Appendices 1 to 7, which includes secondary particles of the nanodiamond particles.
[Appendix 10] The cutting blade according to any one of Appendices 1 to 9, wherein the nanodiamond particles include detonation nanodiamonds.
[Appendix 11] The cutting blade according to any one of Appendices 1 to 9, wherein the nanodiamond particles include air-cooled detonation nanodiamonds.
[Additional Note 12] The content of abrasive grains in the cutting blade is 1 to 30 parts by volume (preferably 5 to 20 parts by volume, more preferably 8 to 15 parts by volume) based on 100 parts by volume of the metal in total. The cutting blade according to any one of supplementary notes 1 to 11.
[Additional note 13] Additional note that the average particle diameter of the primary particles of the nanodiamond particles is 1 to 240 nm (preferably 2 to 100 nm, more preferably 3 to 50 nm, still more preferably 4 to 20 nm, particularly preferably 4 to 10 nm). The cutting blade according to any one of 1 to 12.
[Appendix 14] The content of the nanodiamond particles in the cutting blade is 0.05 to 50 parts by volume (preferably 0.1 to 20 parts by volume, more preferably 1 part by volume) based on 100 parts by volume of the total amount of the metal. ~10 parts by volume), the cutting blade according to any one of appendices 1 to 13.
[Appendix 15] The total content of metal, nanodiamond particles, and abrasive grains in the cutting blade is 90% by mass or more (95% by mass or more, 98% by mass or more) based on the total amount of 100% by mass of the cutting blade. , or 99% by mass or more), the cutting blade according to any one of appendices 1 to 14.
[Appendix 16] The cutting blade according to any one of Appendices 1 to 15, which is a dicing blade for dicing a semiconductor wafer.
[Appendix 17] The cutting blade according to any one of Appendices 1 to 16, which has a disc shape.
[Appendix 18] The cutting blade according to any one of Appendices 1 to 17, which is annular.

1 Cutting blade 2 Metal (metal matrix)
3 Nanodiamond particles 4 Abrasive grains

Claims (10)

A cutting blade for cutting plate-shaped objects,
comprising an abrasive grain, a nanodiamond particle, and a metal that is a bond bonding the abrasive grain and the nanodiamond particle,
A cutting blade in which the metal is a metal bond formed by a sintering method . The cutting blade according to claim 1, wherein the nanodiamond particles are dispersed in a metal matrix made of the metal. The cutting blade according to claim 1 or 2, wherein the abrasive grains include inorganic particles. The cutting blade according to claim 3, wherein the inorganic particles include diamond particles. The cutting blade according to any one of claims 1 to 4 , wherein the metal includes an alloy containing copper. The cutting blade according to any one of claims 1 to 5 , comprising secondary particles of the nanodiamond particles. The cutting blade according to any one of claims 1 to 6 , wherein the average particle diameter (D50) of the primary particles of the nanodiamond particles in the cutting blade is 1 to 240 nm. The cutting blade according to any one of claims 1 to 7, wherein the abrasive grains in the cutting blade have an average particle diameter (D50) of 1 to 600 μm. The cutting blade according to any one of claims 1 to 8 , wherein the nanodiamond particles include detonation-produced nanodiamonds. The cutting blade according to any one of claims 1 to 9 , which is a dicing blade for dicing a semiconductor wafer.

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