JP7418174B2 - Products with parts - Google Patents

Description

The present invention relates to a component-equipped product to which an electronic component is attached, and particularly to a component-equipped product to which the electronic component is easily and reliably attached without damaging the electronic component.

Patent Document 1 below discloses an invention of an IC tag inlet for insert-in-mold molding that does not cause damage during molding, and an insert-in-mold molding method using this IC tag inlet. This IC tag inlet 1 for insert-in-mold molding is located approximately at the center of the IC tag inlet base material 1b, and at a position that does not damage the circumferential antenna coil 2 that the IC tag has. It has a larger opening 1h. By loading the IC tag inlet into the mold and injecting the resin so that this opening is located opposite the mold gate, the IC tag can be attached to the resin base material without damaging the IC tag. An embedded molded IC tag inlet can be manufactured.

Japanese Patent Application Publication No. 2002-355847

The IC tag inlet disclosed in Patent Document 1 can be used as a component of an article installed in a device equipped with a reading means for communicating with an IC tag. In such a case, the positional relationship between the IC tag and the reading means should be adjusted to the desired state so that the IC tag and the reading means can communicate normally according to the purpose of use of the device or article. Must be set. In order to correctly set the positional relationship between the IC tag and the reading means in the desired state, it is necessary to check the positional relationship between the reader and the IC tag when the article is mounted on the device, and the positional relationship between the IC tag and the IC tag in the IC tag inlet. Placement accuracy (position and posture accuracy) is considered to be important. However, Patent Document 1 does not specifically mention these points, and if the IC tag is tilted in the mold during the resin molding process of the IC tag inlet, there is a possibility that a problem will arise in the placement accuracy. be.

In addition, in order to fix the IC tag to the IC tag inlet, it is necessary to pour resin into the mold in which the IC tag is placed and mold it, and this molding process takes time and effort, which increases manufacturing costs. There was a problem with it being quite bulky. Furthermore, since the IC tag is exposed to high temperature and pressure during the molding process, there is a problem that there is a possibility of failure. Furthermore, if the IC tag breaks down for some reason and needs to be replaced, the IC tag cannot be removed without destroying the surrounding resin, as it is embedded inside the resin. There were also problems.

The present invention has been made in view of the above-mentioned conventional technology and its problems, and an object of the present invention is to provide a product with components that can be easily and reliably attached without damaging electronic components.

The product with parts described in claim 1 is:
A component-equipped product with electronic components,
It has a holding mechanism that is provided in a part of the periphery of a mounting plane provided on the product with parts and holds the electronic component arranged on the mounting plane,
The holding mechanism is characterized in that it has at least a pair of protrusions that hold the side surfaces of the electronic component, and a holding part that couples the pair of protrusions and faces the top surface of the electronic component.

According to the product with parts described in claim 1,
By simply inserting the electronic component inside the holding mechanism that surrounds the mounting plane of the product with the component, the electronic component can be placed on the mounting plane while being held by the holding mechanism. Therefore, the electronic component can be easily and reliably attached to a product with the component without damaging it, and can also be removed. In addition, the electronic component P can be easily and reliably attached to a product with the component without damaging it by simply inserting the electronic component P from between the protrusion and the holding part and fitting it between the protrusions. . Further, since the electronic component P is held by the holding portion not only on the protruding portion but also on the upper surface side, the electronic component P can be held even more reliably.

FIG. 2 is a plan view of a product with parts according to the first embodiment. Partial view (a) is a side view of the product with parts of the first embodiment seen from the direction of arrow A in FIG. 1, and part view (b) is a side view of the product with parts of the first embodiment seen from the direction of arrow B in FIG. FIG. 2 is a side view of a product with parts. FIG. 3 is a process diagram showing a procedure for mounting electronic components in a component-equipped product according to the first embodiment. It is a perspective view of a modification of the product with parts of the first embodiment. It is a top view of the product with parts of 2nd Embodiment. Partial view (a) is a side view of the product with parts of the second embodiment seen from the direction of arrow A in FIG. 5, and part view (b) is a side view of the product with parts of the second embodiment seen from the direction of arrow B in FIG. FIG. 2 is a side view of a product with parts. FIG. 7 is a process diagram showing a procedure for mounting electronic components in a component-equipped product according to a second embodiment. It is a perspective view which shows the 1st modification of the product with parts of 2nd Embodiment. It is a perspective view which shows the 2nd modification of the product with parts of 2nd Embodiment. It is a top view of the product with parts of 3rd Embodiment. Partial view (a) is a side view of a product with parts according to the third embodiment as seen from the direction of arrow A in FIG. 10, and part view (b) is a side view of the third embodiment as seen from the direction of arrow B in FIG. FIG. 2 is a side view of a product with parts. FIG. 7 is a process diagram showing a procedure for mounting electronic components in a component-equipped product according to a third embodiment. It is a perspective view which shows the modification of the product with parts of 3rd Embodiment. It is a top view of the product with parts of 4th Embodiment. Partial view (a) is a side view of a product with parts of the fourth embodiment as seen from the direction of arrow A in FIG. 14, and part view (b) is a side view of the fourth embodiment as seen from the direction of arrow B in FIG. FIG. 2 is a side view of a product with parts. FIG. 7 is a process diagram showing a procedure for mounting electronic components in a component-equipped product according to a fourth embodiment. It is a top view which shows the modification of the product with parts of 4th Embodiment. Partial view (a) is a side view showing a modification of the product with parts of the fourth embodiment as seen from the direction of arrow A in FIG. 17, and part view (b) is a side view as seen from the direction of arrow B in FIG. It is a side view which shows the modification of the product with parts of 4th Embodiment. FIG. 7 is a process diagram showing a procedure for mounting electronic components in a modification of the component-equipped product of the fourth embodiment.

Embodiments (first to fourth embodiments) of the present invention will be described with reference to FIGS. 1 to 19.
These embodiments relate to products with components, which are components used to efficiently manufacture final products equipped with electronic components. In other words, in cases where it is difficult to attach electronic components directly to the final product due to the process or handling of the electronic components, electronic components may be included in a form that makes it easy to incorporate them into the final product. If a product with components is manufactured in a separate process, the electronic components can be easily mounted by incorporating the product with components into the final product.

Here, an electronic component is an electronic component that is used for communication, etc. with an external device, etc. when a final product equipped with this electronic component is installed in the device, etc. There are no limitations on the content of such information or the purpose of communication, etc., and the technical significance of electronic components shall be interpreted in the broadest sense. In the embodiment, a rectangular plate-shaped electronic component having a predetermined thickness is shown, but of course this is only an example, and the external shape, dimensions, etc. of the electronic component are not limited to specific ones.

In addition, final products equipped with electronic components are used for various purposes and uses, and specific examples of final products will be explained later, but of course this is just one example, and the structure, shape, and size of the final product will be explained later. There is no reason why magnificence is limited to any particular thing. In addition, the equipment on which the final product is mounted is used for various purposes and uses, just like the final product, and there is no reason to limit the structure, shape, size, etc. to a specific one. It is.

A first embodiment of the present invention will be described with reference to FIGS. 1 to 4.
FIG. 1 is a plan view of a product with parts 1 according to the first embodiment, which is a part of a final product, and FIG. 2 is a side view of the product 1 as viewed from the direction of arrows A and B in FIG. In these figures, the main body of the final product is not shown, and the product with parts 1 shown in FIGS. 1 and 2 is attached to this main body (not shown) to complete the final product.

1 and 2 show a rectangular substrate 2 having a predetermined thickness as the main body of the product 1 with parts, but the shape and size of the substrate 2 are simplified and schematic. This is just an example, and is not intended to limit the shape and size, nor is there any particular limitation on the material. Furthermore, as will be explained below, the electronic component P is held on this board 2 by a holding mechanism, but when the product 1 with components is attached to the final product, the electronic component P is held so that the electronic component P can be seen from the outside of the final product. The attached product 1 may be attached to the final product, or the component attached product 1 may be attached to the final product so that the electronic component P is not visible from the outside of the final product. The same applies to other embodiments.

On the upper surface of the substrate 2 of the component-equipped product 1 shown in FIGS. 1 and 2, a rectangular mounting plane R is designated as a range in which a substantially rectangular plate-shaped electronic component P is to be installed. Although the outer edge of the rectangular mounting plane R is not shown, it corresponds to the plane on the upper surface side of the board 2 on which the electronic component P is placed after mounting. On a part of the periphery of this mounting plane R, 2 pairs of 4 protrusions 3 are provided as a holding mechanism for holding the electronic component P placed on the mounting plane R so as to touch the center of each side of the electronic component P. It is provided. The four protrusions 3 have the same shape, are in contact with the electronic component P at a long side shorter than one side of the electronic component P, and have a height slightly smaller than the height of the electronic component P.

Since the protrusion 3 is a member that holds the electronic component P, its material is preferably resin or the like rather than metal, which may affect wireless communication, which is a function of the electronic component P. Further, the distance between each pair of protrusions 3, 3 is set to be the same as or slightly smaller than the size of the electronic component P inserted therebetween. If the dimensional relationship between the two is expressed in terms of fit, it can be expressed as "tight fit", for example.

FIG. 3 is a process diagram showing a procedure for mounting the electronic component P in the component-equipped product 1 of the first embodiment. To hold the electronic component P between two pairs of four protrusions 3, as shown in FIG. 3(a), lower the electronic component P in a horizontal state from directly above the mounting plane R, As shown in (b), the electronic component P is pushed into the mounting plane R surrounded by the four protrusions 3. A slight pressing force is required when pushing the electronic component P, but once it is fitted, the electronic component P is held between the protrusions 3 and will not easily fall off. In addition, when it is necessary to remove the electronic component P from the product 1 with the component, insert a tool between the top surface of the board 2 and the electronic component P at the outer edge of the mounting plane R where the protrusion 3 does not exist, and adjust the distance between the two. By operating the tool to spread the electronic component P, the electronic component P can be lifted off the board 2 and removed from the protrusion 3.

FIG. 4 is a perspective view of a modification of the component-attached product 1a of the first embodiment. In this modification, the height of the protrusion 3a is set to be the same as that of the electronic component P, and the outer shape of the substrate 2a is circular. The other configurations are substantially the same as the first embodiment. In this modification, since the lower edge to the upper edge of the central part of each of the four side surfaces of the electronic component P is in contact with the inner surface of the protrusion 3a, the holding force of the electronic component P by the protrusion 3a is the same as that of the first embodiment. It is larger than the holding force by the projection 3 of the form, and the electronic component P is held securely and is unlikely to fall off.

A second embodiment of the present invention will be described with reference to FIGS. 5 to 9.
FIG. 5 is a plan view of a product with parts 5 of the second embodiment, which is a part of a final product, and FIG. 6 is a side view of the product 5 with parts as seen from the direction of arrows A and B in FIG. 5 and 6 show a board 2 similar to that of the first embodiment as the main body of the product 5 with components. Hereinafter, parts that are different from the first embodiment will be mainly described, and the description of the first embodiment will be used for other parts.

As shown in FIGS. 5 and 6, on the mounting plane R of the board 2 of the component-attached product 5, there are two holding mechanisms at the center of each of its four circumferences as a holding mechanism for holding the electronic component P placed on the mounting plane R. Four pairs of protrusions 3, 3b are provided. Unlike the first embodiment, one pair of protrusions 3b has a shorter width in contact with the side surface of the electronic component P and a larger height than the other pair of protrusions 3. The upper surfaces of the one pair of protrusions 3b, 3b are connected by a cover 6 serving as a holding portion that faces the upper surface of the electronic component P. Therefore, there is a gap between the top surface of the electronic component P located on the mounting plane R and the bottom surface of the cover 6.

FIG. 7 is a process diagram showing a procedure for mounting the electronic component P in the component-equipped product 5 of the second embodiment. In order to hold the electronic component P within the mounting plane R surrounded by the two pairs of four protrusions 3 and 3b and the cover 6, as shown in FIG. In other words, along the direction of arrow B in FIG. 5, the electronic component P is inserted between one pair of protrusions 3b, 3b and the cover 6 beyond the protrusion 3, as shown in FIG. 7(b). , the electronic component P is pushed into the mounting plane R surrounded by the four protrusions 3 and 3b. According to the second embodiment, even if the electronic component P comes off the four protrusions 3 and 3b, the cover 6 serves as a presser, so that it can be prevented from falling off the board 2.

FIG. 8 is a perspective view of a component-attached product 5a that is a first modification of the second embodiment. In this first modification, the substrate 2a is circular. Further, the height of one protrusion 3c to which the cover 6 is fixed is set to be the same as the height of the electronic component P, so that the cover 6 comes into contact with the top surface of the electronic component P at the mounting position. Further, the other protrusion 3d having a lower height is further lower than the lower protrusion 3 of the second embodiment, and has a wedge shape with an inclined upper surface so that the height is further reduced toward the mounting plane R. ing.

In order to mount the electronic component P in the component-attached product 5a of the first modified example shown in FIG. The electronic component P is inserted between one pair of protrusions 3c, 3c and the cover 6, and the electronic component P is pushed into the mounting plane R surrounded by the four protrusions 3, 3c. According to this first modification, the electronic component P is held down by the four protrusions 3, 3c on the four sides and by the cover 6 on the top surface, so the electronic component P is held more easily than in the second embodiment. More certain. In this way, the electronic component P contacts the holding mechanism on five sides, but when inserting the electronic component P, the inclined upper surface of the other protrusion 3d serves as a guide surface for the electronic component P, so that the mounting is smooth. It can be carried out. In addition, in order to perform such installation smoothly and to ensure retention after installation, the four protrusions 3 and 3d are made of a material that does not deform as much as possible, and the cover 6 is made of a material that does not deform slightly elastically. Preferably, it is made of a damp material.

FIG. 9 is a perspective view of a component-attached product 5b that is a second modification of the second embodiment. The lower projection 3e of this second modification has a smaller maximum thickness than the lower projection 3d of the first modification, and is plate-shaped, and unlike the first modification, the upper surface is It is not inclined and is a thin flat plate-like member as a whole.

In order to mount the electronic component P in the component-attached product 5b of the second modified example shown in FIG. , 3c and the cover 6, and push the electronic component P onto the mounting plane R surrounded by the four protrusions 3c and 3e. According to this second modification, the contact area between the lower protrusion 3e and the electronic component P is slightly larger than in the second modification, so a holding force equal to or greater than that of the first modification can be obtained. . Further, since the lower protrusion 3e is simply plate-shaped, there is no need to process the upper surface into a sloped shape as in the first modification, and the cost is lower than in the first modification.

A third embodiment of the present invention will be described with reference to FIGS. 10 to 13.
FIG. 10 is a plan view of a product with parts 7 according to the third embodiment, which is a part of a final product, and FIG. 11 is a side view of the product 7 as viewed from the direction of arrows A and B in FIG. 10 and 11 show a board 2 similar to that of the first embodiment as the main body of the product 1 with components. Hereinafter, parts that are different from the first embodiment will be mainly described, and the description of the first embodiment will be used for other parts.

As shown in FIGS. 10 and 11, on the mounting plane R of the board 2 of the component-attached product 1, two holding mechanisms are provided at the center of each of its four circumferences as a holding mechanism for holding the electronic component P placed on the mounting plane R. Four pairs of protrusions 3, 3f are provided. These protrusions 3, 3f have substantially the same shape as the first embodiment except for the height, but the height of the other protrusion 3f is higher than that of the other protrusion 3, as shown in FIG. 11(a). The height of the electronic component P is approximately the same as that of the electronic component P. Further, the distance between the other pair of protrusions 3f and 3f is longer than the width of the electronic component P, and a gap is created between the one protrusion 3f and the electronic component P as shown in FIG. 11(a). ing. Furthermore, a locking portion 8 serving as a holding mechanism for holding the electronic component P is attached to the upper surface of each of the pair of protrusions 3f, 3f. The locking portion 8 is a leaf spring-like member with elasticity that becomes thinner toward the tip, and the tip protrudes inside the projection 3f and contacts the top surface of the electronic component P above the mounting plane R. . Note that the locking portion 8 can be made of the same material as the cover 6 of the second embodiment.

FIG. 12 is a process diagram showing a procedure for mounting the electronic component P in the component-equipped product 7 of the third embodiment. In order to hold the electronic component P within the mounting plane R surrounded by the two pairs of four protrusions 3 and 3f and the locking parts 8, it is necessary to hold the electronic component P on the pair of locking parts 8 and 8 according to the arrangement of the projections 3. The electronic component P is placed, and as shown in FIG. Push it below. Continuously, as shown in FIG. 12(b), the other side portion of the electronic component P corresponding to the other locking portion 8 is pressed downward to push the other side portion below the locking portion 8. As a result, the electronic component P moves below the two locking portions 8, 8 and is held on the mounting plane R surrounded by the four protrusions 3, 3f. Of the four protrusions 3, 3f, only two protrusions 3, 3 are in contact with the electronic component P, but the electronic component P is held down by the locking parts 8, 8 at two places on the top surface. It is in a state where it does not fall off easily. Note that if it is necessary to take out the electronic component P held between the protrusions 3 and 3f, insert a tool between the top surface of the board 2 where the protrusions 3 and 3f are not present and the electronic component P, and adjust the distance between them. It is possible to remove the electronic component P from the protrusion 3 and the board 2 by enlarging it and lifting the tool so as to overcome the locking parts 8, 8 one by one.

FIG. 13 is a perspective view of a component-attached product 7a that is a modification of the third embodiment. In this modification, the height of the four protrusions 3 is set to be the same as that of the electronic component P, and the outer shape of the substrate 2a is circular. The other configurations are substantially the same as the third embodiment. In this modification, since the height of the protrusion 3 to which the locking part 8 is not attached is the same as that of the electronic component P, the holding force of the protrusion 3 for the electronic component P is greater than that of the third embodiment, and the electronic component P It holds securely and does not easily fall off.

A fourth embodiment of the present invention will be described with reference to FIGS. 14 to 16.
FIG. 14 is a plan view of a product with parts 9 of the fourth embodiment, which is a part of a final product, and FIG. 15 is a side view of the product 9 as viewed from the direction of arrows A and B in FIG. 14 and 15 show a board 2 similar to that of the first embodiment as the main body of the product 9 with components. Hereinafter, the holding mechanism of the fourth embodiment, which is different from the protrusions 3 and the like of the first to third embodiments, will be mainly explained, and the explanation of the first embodiment will be used for other parts.

As shown in FIGS. 14 and 15, the component-equipped product 1 of the fourth embodiment has two adjacent sides of the four peripheries of an electronic component P placed on the mounting plane R of the board 2, and A leaf spring 10 is provided as a holding mechanism that grips the electronic component P by contacting parts of two sides of the electronic component P. The leaf spring 10 has a fixing part 13 to the board 2 at a position corresponding to one corner of the electronic component P arranged on the mounting plane R, and is composed of two plate members 11, 11 connected to each other at the fixing part 13. has been done. When the two plate members 11, 11 do not sandwich the electronic component P, they are at an acute angle (approximately 30 degrees in the illustrated example), as shown in FIG. 16(a), and the electronic component P When it is held, it becomes a substantially right-angled state and holds the electronic component P with elastic force. Furthermore, a claw portion 12 that is perpendicular to the plate member 1 is provided at the tip of the plate member 11 . When the leaf spring 10 clamps the electronic component P, these claws 12 engage with the other two corners of the electronic component P, ensuring that the electronic component P is held securely.

FIG. 16 is a process diagram showing a procedure for mounting the electronic component P in the component-equipped product 9 of the fourth embodiment. In order to hold the electronic component P within the mounting plane R, as shown in FIG. An operation is performed in which the corners of the electronic component P are pressed against the two claws 12, 12 and pushed in. As shown in FIG. 16(b), as the electronic component P is pushed in, the claws 12, 12 of the leaf springs 10, 10 move along the sides of the electronic component P. The plate members 11, 11 are deformed in the direction in which the angle at which they intersect becomes larger. As shown in FIG. 16(c), when the electronic component P climbs over the claws 12 and enters the leaf spring 10, the claws 12 and 12 lock onto the two corners of the electronic component P. To securely hold an electronic component P. Note that when it is necessary to remove the electronic component P held between the leaf springs 10, the electronic component P is removed from the board 2 while applying a force to the leaf spring 10 in the direction in which the plate members 11, 11 of the leaf spring 10 open. By moving in the orthogonal direction, the electronic component P can be removed from the leaf spring 10 and the board 2.

A modification of the fourth embodiment of the present invention will be described with reference to FIGS. 17 to 19.
FIG. 17 is a plan view of a component-attached product 9a that is a modification of the fourth embodiment, and FIG. 18 is a side view of the product 9a viewed from the directions of arrows A and B in FIG. Hereinafter, a holding mechanism of a modification of the fourth embodiment that is different from the fourth embodiment will be mainly described, and the description of the fourth embodiment will be used for other parts.

As shown in FIGS. 17 and 18, a product with parts 9a that is a modification of the fourth embodiment has a leaf spring 10 similar to that of the fourth embodiment, but the plate member 11 of this leaf spring 10 is A cover 16 in the form of a rectangular plate parallel to the substrate 2 is attached to the top edge of the tip and the upper edge of the claw portion 12 . The operation of attaching the electronic component P to the leaf spring 10 of the modified example of the fourth embodiment is as shown in FIGS. 19(a) to (c). ). However, in a modification of the fourth embodiment, as shown in FIGS. 17 and 18, the electronic component P placed on the mounting plane R is affected by the elastic force of the leaf spring 10 acting in a plane parallel to the board 2 and the claws. Not only is it held by the locking portion 12, but also it is held down by a cover 16 provided at the tip of the leaf spring 10 so as not to move in a direction perpendicular to the substrate 2. Therefore, in the modified example, the electronic component P can be held more reliably than in the fourth embodiment, and the possibility that the electronic component P will come off the leaf spring 10 is even smaller than in the fourth embodiment. Note that if it is necessary to remove the electronic component P from the leaf spring 10, open the leaf spring 10 and move the electronic component P on the board 2 in the order of FIGS. 19(c), (b), and (a). However, since this operation causes the leaf spring 10 to deflect more than in the fourth embodiment, a larger force is required.

According to each of the embodiments and modifications described above, the holding mechanism (the protrusion 3, 3a, 3b, 3c, 3d, 3e, 3f, the cover 16, the leaf spring 10, the claw part 12 of the leaf spring 10, and the electronic component P inside the cover 6) of the leaf spring 10. The electronic component P can be stably placed on the mounting plane R while being held by the holding mechanism. Therefore, the electronic component P can be easily and reliably attached to the product with the component without being damaged.

Note that a specific example of the final product is a master roll installed in a plate-making device. A master roll is a product made by wrapping a continuous band of stencil paper around a paper tube. When the final product is a cap that is inserted and fixed to the end of the master roll or the paper tube of the master roll, the component-attached product 1 including the electronic component P is attached to the cap. When the master roll is mounted on or used in a plate-making device, communication regarding plate-making, stencil paper, etc. is performed between the electronic component P and the plate-making device as necessary.

Another specific example is an ink cartridge installed in an inkjet printing device. If the component-attached product 1 equipped with the electronic component P is attached to an ink cartridge as a final product, when the ink cartridge is installed or used in an inkjet printing device, printing or ink etc. Communication will be conducted as necessary.

Furthermore, another specific example is an ink bottle installed in a stencil printing device. If the component-attached product 1 equipped with the electronic component P is attached to an ink bottle as a final product, when the ink bottle is mounted on or used in a stencil printing device, there will be no printing or ink etc. between the electronic component P and the stencil printing device. Communication will be conducted as necessary.

《About the configuration of the product with parts of each aspect in the embodiment and its effects》
The first product with parts is
A component-equipped product provided with an electronic component P,
It is characterized by having a holding mechanism that is provided in a part of the periphery of the mounting plane R provided on the product with components and that holds the electronic component P placed on the mounting plane R.

According to the first product with parts,
By simply inserting the electronic component P inside the holding mechanism surrounding the mounting plane R of the product with the component, the electronic component P can be placed on the mounting plane R while being held by the holding mechanism. Therefore, the electronic component P can be easily and reliably attached to a product with the component without being damaged, and can also be removed.

The second product with parts is the first product with parts,
The holding mechanism is characterized by having at least a pair of protrusions 3, 3a, 3b, 3c, 3d, 3e, and 3f that hold the side surface of the electronic component P.

According to the second product with parts,
By simply fitting the electronic component P between the protrusions, the electronic component P can be easily and reliably attached to a product with the component without damaging it.

The third product with parts is the second product with parts,
The holding mechanism is characterized in that it has a holding part (cover 6) that couples the pair of projections and faces the top surface of the electronic component P.

According to the third product with parts,
By simply inserting the electronic component P from between the protrusion and the holding part and fitting it between the protrusions, the electronic component P can be easily and reliably attached to the product with the component without being damaged. Further, since the electronic component P is held by the holding portion not only on the protruding portion but also on the upper surface side, the electronic component P can be held even more reliably.

The fourth product with parts is the second product with parts,
The holding mechanism is characterized in that it has a locking portion (locking portion 8) that is provided on the pair of projections and comes into contact with the upper surface of the electronic component P arranged on the mounting plane R.

According to the fourth product with parts,
By simply pushing the electronic component P downward from above the locking part and fitting it between the projections, the electronic component P can be easily and reliably attached to the product with the component without being damaged. Furthermore, since the electronic component P is held down not only by the protrusion but also by the locking portion, the electronic component P can be held even more reliably.

The fifth product with parts is the first product with parts,
The holding mechanism is characterized by having a leaf spring 10 that sandwiches and holds the electronic component P placed on the mounting plane R.

According to the fifth product with parts,
By simply inserting the electronic component P between leaf springs, the electronic component P can be easily and reliably attached to a product with the component without damaging it. Since the electronic component P is sandwiched by the elastic force of the leaf spring, it can be held securely.

1, 1a, 5, 5a, 5b, 7, 7a, 9, 9a...Product with parts 3, 3a, 3b, 3c, 3d, 3e, 3f...Protrusion part as a holding mechanism 6... Holding part as a holding mechanism A certain cover 12...Claw portion as a holding mechanism P...Electronic component R...Mounting plane

Claims (2)

A component-equipped product with electronic components,
It has a holding mechanism that is provided in a part of the periphery of a mounting plane provided on the product with parts and holds the electronic component arranged on the mounting plane,
The holding mechanism includes at least a pair of protrusions that hold side surfaces of the electronic component, and a holding portion that couples the pair of protrusions and faces the top surface of the electronic component. product. A component-equipped product with electronic components,
The product includes a holding mechanism that is provided around a part of the mounting plane provided on the component-attached product and holds the electronic component placed on the mounting plane, and the holding mechanism holds the part of the electronic component. The positions corresponding to the above are the fixing parts with respect to the mounting plane, and they are connected to each other at the fixing parts, and when the electronic component is not clamped, it is in an acute angle state, and when the electronic component is clamped, it is in a substantially right-angled state, and the electronic component A product with parts, characterized in that it has a leaf spring made up of two plate members that sandwich and hold.

Images