JP2021057472A - Component-equipped product - Google Patents

Abstract

To provide a component-equipped product that is easily and securely installed without damaging an electronic component.SOLUTION: A component-equipped product 1 includes a protrusion 3 that is provided on a part around a mounting plane R provided on a substrate 2 of the component-equipped product, and serves as a holding mechanism that holds an electronic component arranged on the mounting plane. With a simple operation (FIG. 3) by simply inserting an electronic component inside the protrusion 3 surrounding the mounting plane, the electronic component can be placed on the mounting plane while being held by the protrusion 3. The electric component is easily and securely attached to the component-equipped products without being damaged, and also can be removed.SELECTED DRAWING: Figure 1

Description

The present invention relates to a product with a component to which an electronic component is attached, and more particularly to a product with a component to which the electronic component is easily and securely attached without damaging the electronic component.

Patent Document 1 below discloses an IC tag inlet for insert-in-mold molding that does not cause damage during molding, and an invention of an insert-in-mold molding method using this IC tag inlet. The insert-in-mold molding IC tag inlet 1 is located at a position substantially in the center of the IC tag inlet base material 1b so as not to damage the circumferential antenna coil 2 of the IC tag, and has a mold gate diameter. It has a larger opening 1h. By loading the IC tag inlet into the mold so that this opening faces the gate of the mold and injecting the resin, the IC tag can be attached to the resin base material without damaging the IC tag. An IC tag inlet, which is an embedded molded product, can be manufactured.

JP-A-2002-355847

The IC tag inlet disclosed in Patent Document 1 can be used as a part of an article mounted on a device provided with a reading means for communicating with the IC tag. In such a case, the positional relationship between the IC tag and the reading means is correctly set to the desired state so that the IC tag and the reading means can perform normal communication according to the purpose of use of the device and the article. Must be set. Then, in order to correctly set the positional relationship between the IC tag and the reading means to the desired state, the positional relationship between the reading device and the IC tag when the article is mounted on the device and the IC tag in the IC tag inlet Arrangement accuracy (accuracy of position and posture) is considered to be important. However, there is no particular description about these points in Patent Document 1, and if the IC tag is tilted in the mold in the resin molding process of the IC tag inlet, there is a possibility that a problem may occur in the arrangement accuracy. is there.

Further, in order to fix the IC tag to the IC tag inlet, it is necessary to pour the resin into the mold in which the IC tag is placed and mold it, and this molding process takes time and labor, which increases the manufacturing cost. There was a problem that it was correspondingly bulky. Further, since the IC tag is exposed to high temperature and high pressure in the molding process, there is a problem that it may break down. Furthermore, if the IC tag breaks down for some reason and needs to be replaced, the IC tag is embedded inside the resin, so the IC tag cannot be taken out unless the surrounding resin is destroyed. There was also a problem.

The present invention has been made in view of the above-mentioned prior art and its problems, and an object of the present invention is to provide a product with parts that are easily and surely attached without damaging electronic parts.

The product with parts according to claim 1 is
It is a product with parts provided with electronic parts,
It is characterized by having a holding mechanism provided on a part around a mounting plane provided on the product with parts and holding the electronic parts arranged on the mounting plane.

According to the product with parts according to claim 1,
By simply inserting the electronic component inside the holding mechanism that surrounds the mounting plane of the product with parts, the electronic component can be placed on the mounting plane while being held by the holding mechanism. Therefore, the electronic component can be easily and surely attached to the product with the component without damaging it, and the electronic component can be removed.

It is a top view of the product with parts of 1st Embodiment. FIG. 1A is a side view of the product with parts of the first embodiment as viewed from the direction of arrow A in FIG. 1, and FIG. 1B is a side view of the product with parts of the first embodiment as viewed from the direction of arrow B in FIG. It is a side view of the product with parts of. It is a process drawing which shows the mounting procedure of the electronic component in the product with component of 1st Embodiment. It is a perspective view of the modification of the product with parts of 1st Embodiment. It is a top view of the product with parts of 2nd Embodiment. FIG. 5A is a side view of the product with parts of the second embodiment as viewed from the direction of arrow A in FIG. 5, and FIG. 5B is a side view of the product with parts of the second embodiment as viewed from the direction of arrow B in FIG. It is a side view of the product with parts of. It is a process drawing which shows the mounting procedure of the electronic component in the product with component of 2nd Embodiment. It is a perspective view which shows the 1st modification of the product with parts of 2nd Embodiment. It is a perspective view which shows the 2nd modification of the product with parts of 2nd Embodiment. It is a top view of the product with parts of 3rd Embodiment. FIG. 10A is a side view of the product with parts of the third embodiment as viewed from the direction of arrow A in FIG. 10, and FIG. 10B is a side view of the product with parts of the third embodiment as viewed from the direction of arrow B in FIG. It is a side view of the product with parts of. It is a process drawing which shows the mounting procedure of the electronic component in the product with component of 3rd Embodiment. It is a perspective view which shows the modification of the product with parts of 3rd Embodiment. It is a top view of the product with parts of 4th Embodiment. FIG. 4A is a side view of the product with parts of the fourth embodiment as viewed from the direction of arrow A in FIG. 14, and FIG. 14B is a side view of the product with parts of the fourth embodiment as viewed from the direction of arrow B in FIG. It is a side view of the product with parts of. It is a process drawing which shows the mounting procedure of the electronic component in the product with component of 4th Embodiment. It is a top view which shows the modification of the product with parts of 4th Embodiment. FIG. 6A is a side view showing a modified example of the product with parts of the fourth embodiment as viewed from the direction of arrow A in FIG. 17, and FIG. 17B is a side view showing a modified example of the product with parts as viewed from the direction of arrow B in FIG. It is a side view which shows the modification of the product with parts of 4th Embodiment. It is a process drawing which shows the mounting procedure of the electronic component in the modification of the product with component of 4th Embodiment.

Embodiments of the present invention (first to fourth embodiments) will be described with reference to FIGS. 1 to 19.
These embodiments relate to products with components, which are components used to efficiently manufacture final products equipped with electronic components. That is, when it is difficult to directly attach the electronic component to the final product in terms of process or handling of the electronic component, the electronic component is included in a form that facilitates incorporation into the final product. If a product with parts is manufactured in a separate process, the mounting of electronic parts can be facilitated by incorporating the product with parts into the final product.

Here, the electronic component is an electronic component for communicating with an external device or the like when the final product on which the electronic component is mounted is mounted on an external device or the like, and is used for communication or the like. There are no restrictions on the content of such information, the purpose of communication, etc., and the technical significance of electronic components shall be interpreted in the broadest sense. In the embodiment, a rectangular plate-shaped electronic component having a predetermined thickness is shown, but of course, this is only an example, and the outer shape, dimensions, etc. of the electronic component are not limited to a specific one.

In addition, the final product equipped with electronic components is used for various purposes and applications, and a specific example of the final product will be described later, but of course this is only an example, and the structure, shape, and size of the final product. There is no reason to limit such things to specific ones. In addition, the equipment on which the final product is mounted is also used for various purposes and purposes like the final product, and there is no reason to limit the structure, shape, size, etc. to a specific one. Is.

The first embodiment of the present invention will be described with reference to FIGS. 1 to 4.
FIG. 1 is a plan view of a product 1 with parts according to the first embodiment, which is a part of a final product, and FIG. 2 is a side view seen from the directions of arrows A and B in FIG. In these figures, the main body of the final product is not shown, and the product 1 with parts shown in FIGS. 1 and 2 is attached to the main body (not shown) to complete the final product.

1 and 2 show a rectangular substrate 2 having a predetermined thickness as the main body of the product 1 with parts, but the shape and size of the substrate 2 simplify and model the form. It is an example of the above, and it is not intended to be limited to such a shape and size, and the material is not particularly limited. Further, as described below, the electronic component P is held on the substrate 2 by the holding mechanism, but when the product 1 with the component is attached to the final product, the component P is visible from the outside of the final product. The attached product 1 may be attached to the final product, or the attached product 1 may be attached to the final product so that the electronic component P cannot be seen from the outside of the final product. The same applies to other embodiments.

On the upper surface of the substrate 2 of the product 1 with parts shown in FIGS. 1 and 2, a rectangular mounting plane R is designated as a range in which a substantially rectangular plate-shaped electronic component P should be installed. Although the outer edge of the rectangular mounting plane R is not shown, the plane on the upper surface side of the substrate 2 on which the electronic component P is mounted after mounting corresponds to this. As a holding mechanism for holding the electronic component P arranged on the mounting plane R, two to four protrusions 3 are in contact with the center of each side of the electronic component P in a part around the mounting plane R. It is provided. The four protrusions 3 have the same shape and are in contact with the electronic component P on a long side shorter than one side of the electronic component P, and the height thereof is slightly smaller than the height of the electronic component P.

Since the protrusion 3 is a member that holds the electronic component P, the material thereof is preferably a resin or the like rather than a metal that may affect wireless communication, which is a function of the electronic component P. Further, the distance between the protrusions 3 and 3 of each pair is set to be the same as or slightly smaller than the size of the electronic component P inserted between them. If the dimensional relationship between the two is expressed in fitting terms, it can be, for example, "tightening".

FIG. 3 is a process diagram showing a mounting procedure of the electronic component P in the component-equipped product 1 of the first embodiment. In order to hold the electronic component P between the two to four protrusions 3, as shown in FIG. 3A, the electronic component P is lowered in a horizontal state from directly above the mounting plane R, and FIG. As shown in (b), the electronic component P is pushed into the mounting plane R surrounded by the four protrusions 3. A slight pressing force is required when pushing the electronic component P, but once the electronic component P is fitted, the electronic component P is held between the protrusions 3 and does not easily fall off. When it is necessary to remove the electronic component P from the product 1 with components, a tool is inserted between the upper surface of the substrate 2 and the electronic component P at the outer edge of the mounting plane R where the protrusion 3 does not exist, and the distance between the two is inserted. If the tool is operated so as to spread the electronic component P, the electronic component P can be lifted from the substrate 2 and removed from the protrusion 3.

FIG. 4 is a perspective view of a modified example of the product 1a with parts according to the first embodiment. In this modification, the height of the protrusion 3a is set to be the same as that of the electronic component P, and the outer shape of the substrate 2a is circular. Other configurations are substantially the same as those of the first embodiment. In this modification, in each central portion of the four side surfaces of the electronic component P, the lower end edge to the upper end edge are in contact with the inner side surface of the protrusion 3a, so that the holding force of the electronic component P by the protrusion 3a is the first implementation. It is larger than the holding force of the protrusion 3 of the form, and the electronic component P is surely held and is hard to fall off.

A second embodiment of the present invention will be described with reference to FIGS. 5-9.
FIG. 5 is a plan view of the product 5 with parts of the second embodiment, which is a part of the final product, and FIG. 6 is a side view seen from the directions of arrows A and B in FIG. 5 and 6 show a substrate 2 similar to that of the first embodiment as the main body of the product 5 with parts. Hereinafter, the parts different from the first embodiment will be mainly described, and the description of the first embodiment will be referred to for other parts.

As shown in FIGS. 5 and 6, the mounting plane R of the substrate 2 of the product 5 with parts has 2 as a holding mechanism for holding the electronic parts P arranged on the mounting plane R at the center of each of the four circumferences thereof. A pair of four protrusions 3, 3b are provided. Unlike the first embodiment, one pair of protrusions 3b has a shorter width in contact with the side surface of the electronic component P and a larger height than the other pair of protrusions 3. The upper surface and the upper surface of the pair of protrusions 3b, 3b are connected by a cover 6 as a holding portion facing the upper surface of the electronic component P. Therefore, there is a gap between the upper surface of the electronic component P on the mounting plane R and the lower surface of the cover 6.

FIG. 7 is a process diagram showing a mounting procedure of the electronic component P in the component-equipped product 5 of the second embodiment. In order to hold the electronic component P in the mounting plane R surrounded by the two to four protrusions 3, 3b and the cover 6, as shown in FIG. 7A, the side of the other lower protrusion 3 has a lower height. From, that is, along the direction of the arrow B in FIG. 5, the electronic component P is inserted between the pair of protrusions 3b, 3b and the cover 6 beyond the protrusion 3, and as shown in FIG. 7 (b). The electronic component P is pushed into the mounting plane R surrounded by the four protrusions 3 and 3b. According to the second embodiment, even if the electronic component P comes off from the four protrusions 3 and 3b, the cover 6 serves as a presser, so that the electronic component P can be prevented from falling off from the substrate 2.

FIG. 8 is a perspective view of a product with parts 5a, which is a first modification of the second embodiment. In this first modification, the substrate 2a is circular. Further, the height of the protrusion 3c on which the cover 6 is fixed is set to be the same as the height of the electronic component P, so that the cover 6 comes into contact with the upper surface of the electronic component P at the mounting position. Further, the other protrusion 3d having a lower height is further lower than the lower protrusion 3 of the second embodiment, and in addition, has a wedge shape whose upper surface is inclined so that the height is further lowered toward the mounting plane R. ing.

In order to mount the electronic component P in the component-equipped product 5a of the first modification shown in FIG. 8, one side of the other pair of low-height protrusions 3d and 3d is placed on the inclined upper surface of the protrusion 3d. Along the line, the electronic component P is inserted between one pair of protrusions 3c and 3c and the cover 6, and the electronic component P is pushed into the mounting plane R surrounded by the four protrusions 3 and 3c. According to this first modification, since the four side surfaces of the electronic component P are pressed by the four protrusions 3 and 3c and the upper surface is pressed by the cover 6, the electronic component P can be held more than in the second embodiment. More certain. In this way, the electronic component P comes into contact with the holding mechanism on five surfaces, but when the electronic component P is inserted, the inclined upper surface of the other protrusion 3d serves as a guide surface for the electronic component P, so that the electronic component P can be mounted smoothly. It can be carried out. In addition, in order to carry out such mounting smoothly and to ensure holding after mounting, the four protrusions 3 and 3d are made of a material that is not deformed as much as possible, and the cover 6 is slightly elastically deformed. It is preferable to use a material that can be used.

FIG. 9 is a perspective view of a product 5b with parts, which is a second modification of the second embodiment. The lower protrusion 3e of the second modification has a smaller maximum thickness than the lower protrusion 3d of the first modification, and is further plate-shaped. It is not inclined and is a thin flat plate as a whole.

In order to mount the electronic component P in the component-equipped product 5b of the second modification shown in FIG. 9, the electronic component P is mounted on the high protrusion 3c along the upper surface of the pair of low protrusions 3e from one side of the pair of low protrusions 3e. , 3c and the cover 6, and the electronic component P is pushed into the mounting plane R surrounded by the four protrusions 3c and 3e. According to this second modification, the contact area between the lower protrusion 3e and the electronic component P is slightly larger than that of the second modification, so that a holding force equal to or greater than that of the first modification can be obtained. .. Further, since the lower protrusion 3e is merely a plate shape, it is not necessary to process the upper surface into a slope shape as in the first modification, and the cost is lower than that in the first modification.

A third embodiment of the present invention will be described with reference to FIGS. 10 to 13.
FIG. 10 is a plan view of the product 7 with parts of the third embodiment, which is a part of the final product, and FIG. 11 is a side view seen from the directions of arrows A and B in FIG. 10 and 11 show a substrate 2 similar to that of the first embodiment as the main body of the product 1 with parts. Hereinafter, the parts different from the first embodiment will be mainly described, and the description of the first embodiment will be referred to for other parts.

As shown in FIGS. 10 and 11, the mounting plane R of the substrate 2 of the product 1 with parts has 2 as a holding mechanism for holding the electronic parts P arranged on the mounting plane R at the center of each of the four circumferences thereof. A pair of four protrusions 3, 3f are provided. The shapes of these protrusions 3 and 3f are substantially the same as those of the first embodiment except for the height, but the height of the other protrusions 3f is higher than that of the one protrusion 3 as shown in FIG. 11A. It is large and substantially the same as the height of the electronic component P. Further, the other pair of protrusions 3f and 3f have a longer arrangement interval than the width of the electronic component P, and as shown in FIG. 11A, a gap is formed between the other pair of protrusions 3f and the electronic component P. ing. Further, a locking portion 8 as a holding mechanism for holding the electronic component P is attached to each upper surface of the pair of protrusions 3f and 3f. The locking portion 8 is a leaf spring-like member having elasticity that becomes thinner as it approaches the tip, and the tip of the locking portion 8 projects inward of the protrusion 3f and is in contact with the upper surface of the electronic component P above the mounting plane R. .. The locking portion 8 can be made of the same material as the cover 6 of the second embodiment.

FIG. 12 is a process diagram showing a mounting procedure of the electronic component P in the product 7 with components according to the third embodiment. In order to hold the electronic component P in the mounting plane R surrounded by 2 to 4 protrusions 3, 3f and the locking portion 8, the electronic component P is placed on the pair of locking portions 8 and 8 according to the arrangement of the protrusions 3. The electronic component P is arranged, and as shown in FIG. 12A, one side portion of the electronic component P corresponding to one locking portion 8 is pressed downward, and the one side portion is pressed against the locking portion 8. Push it down. Subsequently, as shown in FIG. 12B, the other side portion of the electronic component P corresponding to the other locking portion 8 is pressed downward, and the other side portion is pushed below the locking portion 8. As a result, the electronic component P moves below the two locking portions 8 and 8 and is held on the mounting plane R surrounded by the four protrusions 3 and 3f. Of the four protrusions 3 and 3f, only the two protrusions 3 and 3 are in contact with the electronic component P, but the electronic component P is pressed by the locking portions 8 and 8 at two places on the upper surface. Therefore, it is in a state where it does not easily fall off. When it is necessary to take out the electronic component P held between the protrusions 3 and 3f, insert a tool between the upper surface of the substrate 2 in which the protrusions 3 and 3f do not exist and the electronic component P to reduce the distance between the two. It is possible to remove the electronic component P from the protrusion 3 and the substrate 2 by enlarging and lifting the tool so as to get over the locking portions 8 and 8 one by one.

FIG. 13 is a perspective view of a product 7a with parts, which is a modified example of the third embodiment. In this modification, the heights of the four protrusions 3 are set to be the same as those of the electronic component P, and the outer shape of the substrate 2a is circular. Other configurations are substantially the same as those of the third embodiment. In this modification, since the height of the protrusion 3 to which the locking portion 8 is not attached is the same as that of the electronic component P, the holding force of the electronic component P by the protrusion 3 is larger than that of the third embodiment, and the electronic component P It is sure to hold and is hard to fall off.

A fourth embodiment of the present invention will be described with reference to FIGS. 14 to 16.
FIG. 14 is a plan view of the product 9 with parts of the fourth embodiment, which is a part of the final product, and FIG. 15 is a side view seen from the directions of arrows A and B in FIG. 14 and 15 show a substrate 2 similar to that of the first embodiment as the main body of the product 9 with parts. Hereinafter, the holding mechanism of the fourth embodiment different from the protrusions 3 and the like of the first to third embodiments will be mainly described, and the description of the first embodiment will be referred to for other parts.

As shown in FIGS. 14 and 15, the product 1 with components of the fourth embodiment includes two adjacent sides of the four circumferences of the electronic component P arranged on the mounting plane R of the substrate 2, and other sides continuous thereto. A leaf spring 10 is provided as a holding mechanism for holding the electronic component P in contact with each part of the two sides of the above. The leaf spring 10 is composed of two plate members 11 and 11 connected to each other in the fixing portion 13 at a position corresponding to a corner portion of the electronic component P arranged on the mounting plane R as a fixing portion 13 with respect to the substrate 2. Has been done. As shown in FIG. 16A, the two plate members 11 and 11 have an acute angle (about 30 degrees in the illustrated example) when the electronic component P is not sandwiched. When the electronic component P is sandwiched, the electronic component P is held by an elastic force in a substantially right-angled state. Further, a claw portion 12 orthogonal to the plate portion agent 1 is provided at the tip of the plate member 11. When the leaf spring 10 sandwiches the electronic component P, these claws 12 are locked to the other two corners of the electronic component P to ensure the holding of the electronic component P.

FIG. 16 is a process diagram showing a mounting procedure of the electronic component P in the product 9 with components according to the fourth embodiment. In order to hold the electronic component P in the mounting plane R, as shown in FIG. 16A, the electronic component P is arranged on the upper surface of the substrate 2, and the two plate members 11 and 11 in an acute angle state are formed. The corners of the electronic component P are pressed against the two claws 12 and 12 to push them in. As shown in FIG. 16B, the claws 12 and 12 of the leaf springs 10 and 10 move along the side surface of the electronic component P by pushing in the electronic component P, and along with this, the two leaf springs 10 The plate members 11 and 11 of the above are deformed in a direction in which the angle of intersection increases. As shown in FIG. 16C, when the electronic component P gets over the claws 12 and 12 and enters the inside of the leaf spring 10, the claws 12 and 12 are locked to the two corners of the electronic component P. Securely holds the electronic component P. When it is necessary to remove the electronic component P sandwiched by the leaf spring 10, the electronic component P is attached to the substrate 2 while applying a force in the direction in which the leaf members 11 and 11 of the leaf spring 10 are opened to the leaf spring 10. The electronic component P can be removed from the leaf spring 10 and the substrate 2 by moving them in the directions orthogonal to each other.

A modified example of the fourth embodiment of the present invention will be described with reference to FIGS. 17 to 19.
FIG. 17 is a plan view of the product 9a with parts, which is a modified example of the fourth embodiment, and FIG. 18 is a side view seen from the directions of arrows A and B in FIG. Hereinafter, the holding mechanism of the modified example of the fourth embodiment different from the fourth embodiment will be mainly described, and the description of the fourth embodiment will be referred to for other parts.

As shown in FIGS. 17 and 18, the product 9a with parts, which is a modification of the fourth embodiment, has the same leaf spring 10 as that of the fourth embodiment, but the leaf member 11 of the leaf spring 10 A rectangular plate-shaped cover 16 parallel to the substrate 2 is attached to the tip end portion and the upper edge of the claw portion 12. As shown in FIGS. 19A to 19C, the operation of mounting the electronic component P on the leaf spring 10 of the modified example of the fourth embodiment is performed in the case of the fourth embodiment (FIGS. 16A to 16c). ) Is the same as). However, in the modified example of the fourth embodiment, as shown in FIGS. 17 and 18, the electronic component P arranged on the mounting plane R has the elastic force and the claw of the leaf spring 10 acting in the plane parallel to the substrate 2. Not only is it held by locking the portion 12, but it is also held by the cover 16 provided at the tip of the leaf spring 10 so as not to move in the direction orthogonal to the substrate 2. Therefore, in the modified example, the holding of the electronic component P is more reliable than in the fourth embodiment, and the possibility that the electronic component P will come off from the leaf spring 10 is even smaller than in the fourth embodiment. When it is necessary to remove the electronic component P from the leaf spring 10, open the leaf spring 10 and move the electronic component P on the substrate 2 in the order of FIGS. 19C, 19B, and 19A. However, this operation bends the leaf spring 10 more than in the case of the fourth embodiment, so that a larger force is required.

According to each of the above-described embodiments and modifications, a holding mechanism (protrusions 3,) that surrounds a part of the outer periphery of the mounting plane R of the parts-attached products 1, 1a, 5, 5a, 5b, 7, 7a, 9, 9a. 3a, 3b, 3c, 3d, 3e, 3f, cover 16, leaf spring 10, leaf spring 10 claw 12, leaf spring 10 cover 6) With a simple operation of inserting the electronic component P inside. The electronic component P can be stably arranged on the mounting plane R while being held by the holding mechanism. Therefore, the electronic component P can be easily and surely attached to the product with the component without being damaged.

A specific example of the final product is a master roll mounted on a plate making device. The master roll is a product in which continuous strip-shaped stencil base paper is wrapped around a paper tube. When the master roll or the cap inserted and fixed to the end of the paper tube of the master roll is the final product, the product 1 with parts including the electronic component P is attached to the cap. Then, when the master roll is mounted on or used in the plate making apparatus, communication regarding plate making or stencil base paper or the like is performed between the electronic component P and the plate making apparatus as necessary.

Further, as another specific example, an ink cartridge mounted on an inkjet printing apparatus can be mentioned. If the product 1 with a component equipped with the electronic component P is attached to the ink cartridge as the final product, when the ink cartridge is mounted or used in the inkjet printing device, printing or ink or the like is formed between the electronic component P and the inkjet printing device. Communication will be made as needed.

Further, as another specific example, there is an ink bottle mounted on a stencil printing apparatus. If the product 1 with a component equipped with the electronic component P is attached to the ink bottle as the final product, when the ink bottle is mounted on or used in the stencil printing device, printing or ink or the like is formed between the electronic component P and the stencil printing device. Communication will be made as needed.

<< About the configuration of the product with parts of each aspect in the embodiment and its effect >>
The first product with parts is
It is a product with parts provided with electronic parts P,
It is characterized by having a holding mechanism provided in a part around the mounting plane R provided on the product with parts and holding the electronic parts P arranged on the mounting plane R.

According to the product with the first part
The electronic component P can be arranged on the mounting plane R while being held by the holding mechanism by simply inserting the electronic component P inside the holding mechanism surrounding the mounting plane R of the product with the component. Therefore, the electronic component P can be easily and surely attached to the product with the component without damaging it, and can be removed.

The product with the second part is the product with the first part.
The holding mechanism is characterized by having at least a pair of protrusions 3, 3a, 3b, 3c, 3d, 3e, 3f that hold the side surface of the electronic component P.

According to the product with the second part
The electronic component P can be easily and surely attached to the product with the component without damaging the electronic component P by a simple operation of fitting the electronic component P between the protrusions.

The product with the third part is the product with the second part.
The holding mechanism is characterized by having a holding portion (cover 6) that connects the pair of the protrusions and faces the upper surface of the electronic component P.

According to the product with the third part
The electronic component P can be easily and surely attached to a product with a component without damaging the electronic component P by simply inserting the electronic component P from between the protrusion and the holding portion and fitting the electronic component P between the protrusions. Further, since the electronic component P is pressed not only by the protrusion but also by the holding portion on the upper surface side, the holding is more reliable.

The fourth product with parts is the product with second parts.
The holding mechanism is characterized by having a locking portion (locking portion 8) provided on the pair of the protrusions and in contact with the upper surface of the electronic component P arranged on the mounting plane R.

According to the product with the fourth part
The electronic component P can be easily and surely attached to the product with the component without damaging the electronic component P by a simple operation of pushing the electronic component P downward from above the locking portion and fitting it between the protrusions. Further, since the electronic component P is pressed not only by the protrusion but also by the locking portion on the upper surface side, the holding of the electronic component P is more reliable.

The fifth product with parts is the product with first parts.
The holding mechanism is characterized by having a leaf spring 10 that sandwiches and holds the electronic component P arranged on the mounting plane R.

According to the product with the fifth part
The electronic component P can be easily and surely attached to the product with the component without damaging the electronic component P by a simple operation of sandwiching the electronic component P between the leaf springs. Since the electronic component P is sandwiched by the elastic force of the leaf spring, the holding is reliable.

1,1a, 5,5a, 5b, 7,7a, 9, 9a ... Products with parts 3,3a, 3b, 3c, 3d, 3e, 3f ... Protrusions as a holding mechanism 6 ... Holding parts as a holding mechanism A certain cover 12 ... Claw part as a holding mechanism P ... Electronic component R ... Mounting plane

Claims (5)

It is a product with parts provided with electronic parts,
A product with parts, which is provided on a part around a mounting plane provided on the product with parts and has a holding mechanism for holding the electronic parts arranged on the mounting plane. The product with components according to claim 1, wherein the holding mechanism has at least a pair of protrusions that hold the side surfaces of the electronic component. The product with components according to claim 2, wherein the holding mechanism has a holding portion that connects a pair of the protrusions and faces the upper surface of the electronic component. The product with components according to claim 2, wherein the holding mechanism is provided on the pair of protrusions and has a locking portion that comes into contact with the upper surface of the electronic component arranged on the mounting plane. The product with components according to claim 1, wherein the holding mechanism has a leaf spring that sandwiches and holds the electronic component arranged on the mounting plane.

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