JP7417774B1 - Molding mold, resin molding equipment, and method for manufacturing resin molded products - Google Patents

Abstract

An object of the present invention is to provide a mold that can reduce costs. A molding mold comprising one mold and another mold having a cavity in which a release film is placed, the other mold comprising a main surface member and a side member, The side member is formed on a first opposing surface facing the one mold, and includes a first adsorbing portion that adsorbs the release film, and a first adsorbing portion that is closer to the cavity than the first adsorbing portion on the first opposing surface. a second adsorption section formed to adsorb the release film, and a suction path for sucking air from the first adsorption section and the second adsorption section, and the suction path is configured to absorb air. One end in the flow direction is connected to the suction device, and the other end is connected to the first suction section, and the second branch path is connected to the second suction section. The minimum cross-sectional area of the cross-section in the two-branch route is smaller than the minimum cross-sectional area of the cross-section in the first branch route. [Selection diagram] Figure 6

Description

The present invention relates to a mold, a resin molding device, and a method for manufacturing a resin molded product.

Patent Document 1 discloses a mold that is provided with a release film to make it easier to take out a resin molded product. The mold described in Patent Document 1 has an outer circumferential suction groove, a main suction groove, and a through hole for suctioning a release film. Specifically, in the mold described in Patent Document 1, an outer circumferential suction groove and a main suction groove that can suction and hold a release film are formed on the outside of the cavity. Further, in the mold described in Patent Document 1, a through hole capable of adsorbing and holding a release film is formed inside the cavity (between the peripheral surface member and the bottom surface member). Vacuum pumps are connected to the outer periphery suction groove, main suction groove, and through hole of the mold through on-off valves, respectively, so that suction can be performed independently.

In the mold configured in this manner, the release film is first attracted by the outer circumferential suction groove formed on the outermost side, and the release film is fixed to the surface of the mold. Next, the release film is adsorbed by the main adsorption groove formed inside the outer circumference adsorption groove, and tension is applied to the release film. Thereafter, the release film is attracted by the through hole formed inside the cavity, so that the release film is attracted along the shape of the cavity. By adsorbing the release film in stages in this way, it is possible to prevent wrinkles and sag from occurring in the release film.

JP 2017-35832 Publication

Here, in a mold that can suction a release film in stages with multiple suction grooves, etc. as described in Patent Document 1, many parts such as on-off valves are required to suction in stages. necessary and costly.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a mold, a resin molding device, and a method for manufacturing resin molded products that can reduce costs. It is to be.

The problems to be solved by the present invention are as described above, and in order to solve this problem, a mold according to the present invention includes one mold, a mold that is arranged opposite to the one mold, and a mold release film. Another mold having a cavity arranged therein, the other mold having a main surface member forming a main surface of the cavity, a side member forming a side surface of the cavity, The side member includes a first adsorption portion formed on a first opposing surface facing the one mold and adsorbing the release film, and a first adsorption portion on the first opposing surface that is also formed on the cavity side, and includes a second adsorption section for adsorbing the release film, and a suction path for sucking air from the first adsorption section and the second suction section, and the suction path a first branch path whose one end in the air flow direction is connected to the suction device and whose other end in the air flow direction is connected to the first suction section; and a second branch path connected to the second suction section. The minimum cross-sectional area of a cross section perpendicular to the air flow direction in the second branch path that is branched into a branch path is greater than the minimum cross-sectional area of a cross section perpendicular to the air flow direction in the first branch path. It's small.

Further, a resin molding apparatus according to the present invention includes the mold.

Further, the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, comprising: a film placement step of placing the release film on the other mold; The method includes a resin molding step of performing resin molding using the other mold in which the mold film is arranged.

According to the present invention, cost reduction can be achieved.

FIG. 1 is a schematic plan view showing the overall configuration of the resin molding apparatus according to the first embodiment. FIG. 2 is a schematic side view showing the configuration of a molding module. A plan view showing the lower mold. Front sectional view showing the lower mold. The bottom view which showed the upper side member. A partially enlarged view of a front sectional view showing the lower mold. FIG. 3 is a front sectional view showing an air suction path. (a) A cross-sectional view showing how the first suction part suctions the release film. (b) A cross-sectional view showing how the second suction part suctions the release film. (c) A cross-sectional view showing how the third suction part suctions the release film. FIG. 7 is a front sectional view showing a lower mold according to a second embodiment. FIG. 7 is a plan view showing a lower mold according to a third embodiment. (a) A front sectional view showing a lower mold according to a fourth embodiment. (b) A front sectional view showing a lower mold according to a fifth embodiment.

<Overall configuration of resin molding device 1>
First, a resin molding apparatus 1 according to a first embodiment of the present invention will be described using FIG. 1. Note that in the explanation using FIG. 1, directions are defined using arrows X and Y shown in the figure. The resin molding apparatus 1 seals a pre-sealed substrate W1 with resin to produce a resin molded product (sealed substrate W2). In this embodiment, the substrate before being sealed with resin is referred to as an unsealed substrate W1, and the substrate after being sealed with resin is referred to as a sealed substrate W2. Further, in this embodiment, a resin molding apparatus 1 that performs resin molding by a compression molding method is illustrated.

The resin molding apparatus 1 includes a substrate supply/storage module 10, a molding module 20, and a material supply module 30 as components. Each component is removable and replaceable with respect to other components.

The substrate supply/storage module 10 supplies the unsealed substrate W1 to the molding module 20 and stores the sealed substrate W2 received from the molding module 20. Note that as the pre-sealing substrate W1, it is possible to use a lead frame as well as various other substrates (glass epoxy substrate, ceramic substrate, resin substrate, metal substrate). The substrate supply/storage module 10 mainly includes an unsealed substrate supply section 11 , a sealed substrate storage section 12 , a substrate mounting section 13 , and a substrate transport mechanism 14 .

The substrate mounting section 13 is configured to appropriately transfer the unsealed substrate W1 and the sealed substrate W2 between the unsealed substrate supply section 11, the sealed substrate storage section 12, and the substrate transport mechanism 14. be. The substrate platform 13 can move in the Y direction within the substrate supply/storage module 10. The unsealed substrate supply section 11 can supply the unsealed substrate W1 to the substrate mounting section 13. The sealed substrate storage section 12 can store the sealed substrate W2 received from the substrate mounting section 13. The substrate transport mechanism 14 can move within the substrate supply/storage module 10 and the molding module 20 in the X direction and the Y direction. The substrate transport mechanism 14 can appropriately transport the unsealed substrate W1 and the sealed substrate W2 to the substrate supply/storage module 10 and the molding module 20.

The molding module 20 performs resin molding. Although this embodiment illustrates the resin molding apparatus 1 provided with three molding modules 20, the number of molding modules 20 is not limited to three. The molding module 20 mainly includes a mold clamping mechanism 100 and a mold 200.

The mold 200 includes an upper mold 200U (see FIG. 2, etc.) and a lower mold 200D that can be moved up and down with respect to the upper mold 200U. Note that the upper mold 200U and the lower mold 200D are embodiments of one mold and the other mold of the present application, respectively. A cavity C corresponding to the shape of the resin molded product is formed in the lower mold 200D. The mold clamping mechanism 100 can clamp and open the mold 200 by raising and lowering the lower mold 200D. Note that a more specific configuration of the molding module 20 will be described later.

The material supply module 30 supplies the release film F and the resin material to the molding module 20. The material supply module 30 mainly includes a material placement section 31, a release film supply mechanism 32, a resin material storage section 33, a resin material input mechanism 34, and a material transport mechanism 35.

The material placement section 31 is capable of placing the release film F and the resin material storage section 33. The material placement section 31 can move in the X direction and the Y direction within the material supply module 30. The release film supply mechanism 32 can supply the release film F to the material placement section 31.

The resin material storage section 33 has a substantially frame-like shape, and can accommodate the resin material supplied from the resin material input mechanism 34 together with the release film F supplied to the material placement section 31. can. The material transport mechanism 35 can move within the material supply module 30 and the molding module 20 in the X direction and the Y direction. The material transport mechanism 35 can transport the mold release film F and the resin material accommodating portion 33 that are integrated together to the molding module 20 together with the resin material.

<Resin molding method using resin molding device 1>
An example of a resin molding method using the resin molding apparatus 1 configured as described above will be described below.

The method for manufacturing a resin molded product according to this embodiment mainly includes a substrate loading process, a film placement process, a mold clamping process, a resin molding process, a mold opening process, and an unloading process. Below, they will be explained in order.

First, in the substrate loading step, a pre-sealing substrate W1 is loaded into the mold 200. Specifically, in the substrate loading process, the unsealed substrate W1 is supplied from the unsealed substrate supply section 11 to the substrate mounting section 13. The substrate transport mechanism 14 receives the unsealed substrate W1 placed on the substrate platform 13 and transports it to the mold 200 of the molding module 20.

Next, in a film placement step, a release film F and a resin material are placed on the mold 200 (lower mold 200D). Specifically, in the film placement process, the release film F is supplied from the release film supply mechanism 32 to the material placement section 31. At this time, it is also possible to appropriately cut the release film F into a predetermined size in the material placement section 31. The release film F placed on the material placement section 31 forms a box shape that can accommodate the resin material together with the resin material storage section 33 placed thereon. The resin material is fed from the resin material input mechanism 34 into the integrated release film F and resin material storage section 33, and the release film F and resin material storage section 33 containing the resin material are placed in the material placement section 31. It will be placed. The material conveyance mechanism 35 receives the release film F containing the resin material and the resin material storage section 33, moves to the molding module 20, and molds the release film F containing the resin material and the resin material storage section 33. It is placed in the mold 200 (lower mold 200D). Thereafter, as will be described later, the release film F is held by the lower mold 200D, and the resin material is supplied to the cavity C of the lower mold 200D. After the resin material is supplied to the cavity C, the resin material storage section 33 is carried out from the mold 200 by the material transport mechanism 35 and returned to the material supply module 30.

Next, in a mold clamping step, the mold 200 is clamped. Specifically, in the mold clamping step, the resin material accommodated in the cavity C is heated by a heating mechanism (not shown) provided in the lower mold 200D. Next, by driving the mold clamping mechanism 100, the lower mold 200D is raised toward the upper mold 200U. When the lower mold 200D rises to a predetermined position, the upper surface of the lower mold 200D and the lower surface of the upper mold 200U come into contact with each other directly or indirectly through the pre-sealing substrate W1, and the mold is formed in the lower mold 200D. The cavity C is closed from above by the upper mold 200U or the pre-sealing substrate W1. In this state, the lower mold 200D is further pushed up, thereby pressurizing the resin material accommodated in the lower mold 200D.

Next, in a resin molding step, the resin material is cured and resin molding is performed. Specifically, in the resin molding process, the resin material is kept under pressure for a predetermined period of time. Thereby, the resin material is cured, resin molding is performed on the pre-sealing substrate W1, and a resin molded product (sealed substrate W2) can be obtained.

Next, in a mold opening step, the mold 200 is opened. Specifically, in the mold opening process, the mold clamping mechanism 100 is driven to lower the lower mold 200D away from the upper mold 200U. As a result, the mold 200 is opened and the sealed substrate W2 can be taken out.

Next, in the unloading step, the resin molded product (sealed substrate W2) is unloaded from the mold 200. Specifically, in the unloading process, the substrate transport mechanism 14 receives the sealed substrate W2 of the mold 200, and delivers the received sealed substrate W2 to the substrate mounting section 13 of the substrate supply/storage module 10. . The sealed substrate storage section 12 receives the sealed substrate W2 from the substrate mounting section 13 and stores the received sealed substrate W2.

In this way, in the resin molding apparatus 1, the pre-sealing substrate W1, the release film F, the resin material, etc. are supplied to the molding module 20, and resin molding can be performed. Further, resin molding can be performed in parallel using a plurality of molding modules 20, and resin molded products can be efficiently manufactured. Note that the operations of each part of the resin molding apparatus 1 described above can be appropriately controlled by a control device (not shown).

<Configuration of molding module 20>
The specific configuration of the molding module 20 will be described below. As shown in FIG. 2, the molding module 20 mainly includes a mold clamping mechanism 100, a mold 200, and the like.

The mold clamping mechanism 100 moves the lower mold 200D up and down to perform mold clamping, mold opening, and the like. The mold clamping mechanism 100 mainly includes a base 101, a support 102, a lower mold base member 103, an upper mold base member 104, a drive mechanism 105, and the like.

The base 101 supports the mold 200 and the like. A plurality of pillars 102 are fixed to the base 101. The plurality of pillars 102 are provided to extend upward from the base 101. A lower die base member 103 is provided at a vertically intermediate portion of the support 102 so as to be movable up and down. An upper die base member 104 is fixed to the upper end of the support column 102. Note that, instead of the support column 102, two plate-like members disposed opposite to each other may be provided.

The drive mechanism 105 is for raising and lowering the lower die 200D. As the drive mechanism 105, a ball screw mechanism, a hydraulic cylinder, a toggle mechanism, etc. can be used. The drive mechanism 105 is arranged between the base 101 and the lower die base member 103. The drive mechanism 105 can move the lower mold base member 103 up and down by vertically expanding and contracting between the base 101 and the lower mold base member 103.

The mold 200 includes an upper mold 200U and a lower mold 200D.

The upper mold 200U has an appropriate thickness in the vertical direction. The lower surface of the upper mold 200U is formed into a planar shape with no irregularities. The upper mold 200U is fixed to the bottom surface of the upper mold base member 104. Suction holes (not shown) capable of sucking substrates (substrate before sealing W1 and sealed substrate W2) are appropriately formed on the lower surface of the upper mold 200U.

As shown in FIGS. 2 and 3, the lower mold 200D is arranged on the upper surface of the lower mold base member 103. The upper surface of the lower mold 200D is arranged to face the lower surface of the upper mold 200U in the vertical direction. The lower mold 200D mainly includes a main surface member 210, a side member 220, and the like.

The main surface member 210 forms the main surface of the cavity C. In this embodiment, since the main surface member 210 is the lower mold 200D, the main surface corresponds to the bottom surface. The main surface member 210 is formed into a rectangular shape in plan view. The main surface member 210 is formed to have an appropriate thickness in the vertical direction. The main surface member 210 is placed on the upper surface of the lower mold base member 103.

The side member 220 forms the side surface of the cavity C and surrounds the main surface member 210 from the side. The side member 220 is formed to have an appropriate thickness in the vertical direction. The side member 220 mainly includes a hollow portion 221 .

The hollow portion 221 is formed to vertically penetrate the center of the side member 220. The hollow portion 221 is formed into a rectangular shape in plan view. The hollow portion 221 is formed in a shape that generally matches the outer shape of the main surface member 210 when viewed from above.

In this way, the side member 220 is formed into a frame shape that is rectangular in plan view. The main surface member 210 is arranged in the hollow part 221 of the side member 220. The side member 220 is placed on the upper surface of the lower mold base member 103 via the elastic member 220a. The elastic member 220a is formed of, for example, a compression coil spring that can be expanded and contracted up and down. The upper surface of side member 220 is located above the upper surface of main surface member 210. A portion surrounded by the main surface member 210 and the side member 220 configured in this way (above the main surface member 210 and inside the side member 220) forms a cavity C for performing resin molding.

In addition, as shown in FIG. 4, in this embodiment, the side member 220 is formed by being divided into upper and lower parts. Specifically, the side member 220 includes an upper side member 222 in which a surface (upper surface) facing the lower surface of the upper die 200U is formed, and a lower side of the upper side member 222 (with respect to the upper side member 222). 222), and a lower side member 223 disposed on the opposite side from the upper surface of 222. The upper surface and lower surface of the upper side member 222 are formed to be parallel. Note that the upper side member 222 and the lower side member 223 are an embodiment of the first side member and the second side member of the present application, respectively. Further, the upper surface and the lower surface of the upper side member 222 are embodiments of the first opposing surface and the second opposing surface of the present application, respectively. Note that "parallel" includes not only a strict meaning but also a substantive meaning. Therefore, even if the angle between the upper and lower surfaces is not 0 degrees, if the angle between the upper and lower surfaces is within the error range, the upper and lower surfaces are parallel.

A release film F is disposed on the upper surface of the lower mold 200D configured in this way, and a resin material is supplied to a portion corresponding to the cavity C above the disposed release film F. Thereafter, the resin material is supplied into the cavity C by adsorbing the mold release film F to the lower mold 200D. Moreover, the substrate before sealing W1 is attracted and held by the upper mold 200U. In this state, the upper mold 200U and lower mold 200D are clamped by the mold clamping mechanism 100, and the resin is compression molded onto the unsealed substrate W1, thereby obtaining a sealed substrate W2.

<Configuration of lower mold 200D>
Here, suction holes and the like for sucking and holding the release film F are appropriately formed in the lower mold 200D. Below, the structure of the lower die 200D for adsorbing the release film F will be specifically explained.

As shown in FIGS. 3 to 6, the lower mold 200D includes a first suction part 232 for suctioning the release film F, an annular recess 234, a second suction part 236, a through hole 238, a communication part 240, and a suction part 232. A pipe portion 242, a third suction portion 244, and a suction hole portion 246 are provided.

The first suction portion 232 is for suctioning the release film F onto the upper surface of the side member 220. The first suction section 232 mainly includes a first suction hole section 232a.

The first suction hole portion 232a is a through hole formed along the vertical direction so as to connect the upper surface of the side member 220 (upper side member 222) and the annular recess 234. The first suction hole portion 232a is formed in a circular shape in plan view. A plurality of first suction holes 232a are formed in a row so as to surround the cavity C in a plan view. The plurality of first suction holes 232a are formed so as to be lined up in a rectangular shape along the shape of the cavity C when viewed from above. The first suction holes 232a are arranged at approximately equal intervals.

Note that the shape of the first suction hole portion 232a is not limited to a circular shape, and can be formed in any shape. Further, in this embodiment, the plurality of first suction holes 232a are formed such that the intervals between adjacent first suction holes 232a are approximately constant, but the arrangement of the plurality of first suction holes 232a is It is not limited to equally spaced arrangement. For example, it is also possible to form the plurality of first suction parts 232 at irregular intervals. For example, it is also possible to form a recess (groove) on the upper surface of the side member 220 (upper side member 222) to connect the plurality of first suction holes 232a.

The annular recess 234 shown in FIGS. 4 to 6 connects the first suction hole 232a and the suction pipe 242. The annular recess 234 is formed in the upper side member 222 below the first suction hole 232a. The annular recess 234 is formed to extend from the vertical midway point of the upper side member 222 to the bottom surface of the upper side member 222. The upper end of the annular recess 234 is connected to the first suction hole 232a. The lower end of the annular recess 234 is open at the bottom surface of the upper side member 222. In this way, the annular recess 234 is formed into a concave shape having a predetermined depth upward from the bottom surface of the upper side member 222. In a bottom view, the width of the annular recess 234 (the length in the direction perpendicular to the direction in which the annular recess 234 extends) is larger than the diameter of the first suction hole 232a.

The annular recess 234 is formed so as to surround the hollow portion 221 (cavity C) without interruption. That is, the annular recess 234 is formed in an annular shape with no end when viewed from the bottom. The annular recess 234 is formed to extend along the first suction hole 232a when viewed from the bottom. As a result, the annular recess 234 is formed into a substantially rectangular shape when viewed from the bottom. Note that the annular recess 234 is an embodiment of the annular portion of the present application.

The second suction section 236 shown in FIGS. 3, 4, and 6 is for suctioning the release film F onto the upper surface of the side member 220. The second suction portion 236 mainly includes a concave portion 236a.

The concave portion 236a is a concave portion formed on the upper surface of the side member 220 and closer to the cavity C than the first suction portion 232. A plurality of concave portions 236a are formed around the cavity C. In this embodiment, four concave portions 236a are formed along each side of the cavity C, which is formed in a rectangular shape when viewed from above. The recessed portion 236a is formed in a straight line parallel to each side of the cavity C. Note that, as mentioned above, "parallel" includes not only a strict meaning but also a substantive meaning. The four concave portions 236a are formed at appropriate intervals so as not to be connected to each other. The recessed portion 236a is formed in a V-shape that slopes downward toward the center in a longitudinal cross-sectional view.

Note that the shape of the concave portion 236a is not limited to a V-shape in cross-sectional view, and may be formed in any shape. Further, in this embodiment, an example is shown in which four concave portions 236a are formed along each side of the cavity C, but any number of concave portions 236a can be formed at any position.

The through hole 238 shown in FIGS. 3 to 6 connects the recessed portion 236a and the communication portion 240. The through hole 238 is formed along the vertical direction. The through hole 238 is formed in a circular shape in plan view. The through hole 238 is formed inside the concave portion 236a in plan view. A plurality of through holes 238 are formed in each concave portion 236a. The upper end of the through hole 238 is connected to the recessed portion 236a. The lower end of the through hole 238 is open at the bottom surface of the upper side member 222. Note that the through hole 238 is an embodiment of the second route of the present application.

The communication portion 240 shown in FIGS. 4 to 6 connects the annular recess 234 and the through hole 238. The communication portion 240 is formed in a concave shape on the bottom surface of the upper side member 222 . The communication portion 240 is formed to extend outward from each through hole 238 (to the side opposite to the cavity C). As a result, one end of the communication portion 240 is connected to the lower end of the through hole 238. Further, the other end of the communication portion 240 is connected to the lower end of the annular recess 234 . In other words, the communication portion 240 is formed to extend inward from the annular recess 234 (toward the main surface member 210 side). The communication portion 240 has a substantially rectangular shape when viewed in cross section along the longitudinal direction (the direction in which the communication portion 240 extends). The communication portion 240 is formed so as to have a relatively small cross-sectional area in a plane perpendicular to the air flow path so as to narrow the air flow path. Specifically, the cross-sectional area of the communication portion 240 is smaller than the cross-sectional area of the through hole 238. Further, the cross-sectional area of the communication portion 240 is smaller than the cross-sectional area of the first suction hole portion 232a. Note that the communication unit 240 is an embodiment of the first route of the present application.

The suction pipe section 242 is for sucking air from the first suction section 232 and the second suction section 236. The suction tube portion 242 is formed into a substantially circular tube shape. The suction tube portion 242 is arranged so as to vertically penetrate the lower surface member 223 with its longitudinal direction facing in the vertical direction. The upper end surface of the suction tube section 242 is arranged at the same position (flush) as the upper surface of the lower side member 223. A plurality of suction tube sections 242 are arranged below the annular recess 234. In this embodiment, as shown in FIG. 5, an example is shown in which four suction tube parts 242 are arranged so as to correspond to each side of an annular recess 234 formed in a substantially rectangular shape. By arranging the suction tube portion 242 in this manner, the upper end portion of the suction tube portion 242 is connected to the lower end portion of the annular recess 234.

Note that in this embodiment, the suction pipe section 242 is provided on the lower surface member 223 to form an air suction path. By doing so, it is also possible to form an air suction path.

The third adsorption section 244 shown in FIGS. 3, 4, and 6 is for adsorbing the release film F to the cavity C. The third suction portion 244 is formed by a gap between the outer surface of the main surface member 210 and the inner surface (hollow portion 221) of the side member 220. A gap is formed between the main surface member 210 and the side member 220 so as to extend around the entire circumference of the main surface member 210 in plan view. As a result, the third suction portion 244 is formed into an annular shape with no end so as to surround the cavity C in a plan view.

The suction hole section 246 shown in FIGS. 4 and 6 is for sucking air from the third suction section 244. The suction hole portion 246 is formed in the main surface member 210. One end of the suction hole portion 246 is open on the outer surface of the main surface member 210. The other end of the suction hole portion 246 is open at the bottom surface of the main surface member 210. A plurality of suction holes 246 are formed in the main surface member 210.

As shown in FIG. 6, a suction device 250 such as a vacuum pump is connected to the suction pipe section 242 and the suction hole section 246 via an appropriately formed air flow path. A first on-off valve 252 is provided between the suction device 250 and the suction pipe section 242, which can switch whether or not air can circulate. Further, a second on-off valve 254 is provided between the suction device 250 and the suction hole portion 246, which can switch whether or not air can circulate. By operating the suction device 250 and sucking air, by opening and closing the first on-off valve 252 and the second on-off valve 254, respectively, air is removed from the first suction section 232, the second suction section 236, and the third suction section 244. The release film F can be adsorbed by sucking air as desired.

<Suction route configuration>
As described above, in this embodiment, by suctioning air through the suction pipe section 242, air can be suctioned from the first suction section 232 and the second suction section 236, and the release film F can be suctioned. The air suction route through the suction pipe section 242 will be described below.

As shown in FIGS. 6 and 7, when the first on-off valve 252 is opened and air is sucked through the suction pipe section 242, the annular recess 234 and the first suction section 232 (first suction hole section 232a) Air is sucked through the side member 220, and the release film F can be adsorbed onto the upper surface of the side member 220. Furthermore, when air is sucked through the suction pipe section 242, the air is sucked through the communication section 240 and the through hole 238 connected to the lower end of the annular recess 234, and the air is sucked through the second suction section 236 (the concave section 236a). ) The release film F can be adsorbed onto the upper surface of the mold.

For the sake of explanation, as shown in FIG. 7, below, as shown in FIG. The part where the air suction path branches into the annular recess 234 and the communication part 240 is referred to as a branch point P. In this embodiment, since the communication part 240 is connected to the lower end of the annular recess 234, the lower end of the annular recess 234 (the upper end of the suction tube part 242) corresponds to the branch point P.

Further, the air suction path from the suction device 250 to the branch point P is referred to as a main path L. Further, the air suction path from the branch point P to the upper end of the first suction portion 232 (first suction hole portion 232a) is referred to as a first branch path L1. Further, the air suction path from the branch point P to the upper end of the through hole 238 is referred to as a second branch path L2.

Here, among the cross-sectional areas of the cross-sections perpendicular to the air flow direction in the first branch path L1, the minimum cross-sectional area is hereinafter referred to as the minimum cross-sectional area A1. In the present embodiment, the first branch path L1 includes an annular recess 234 and a plurality of first suction holes 232a (see FIG. 5, etc.) connected to the annular recess 234. That is, the first branch path L1 further branches from the annular recess 234 into a plurality of first suction holes 232a. When the first branch route L1 is branched in this way, the sum of the cross-sectional areas of each branched route is taken as the cross-sectional area of the first branch route L1. In this embodiment, among the cross-sectional areas of the first branch path L1, the cross-sectional area at the first suction hole portion 232a (the sum of the cross-sectional areas of the plurality of first suction hole portions 232a) is the minimum cross-sectional area A1. That is, in this embodiment, "minimum cross-sectional area A1 = cross-sectional area of first suction hole portion 232a x number of first suction hole portions 232a" holds true. Although FIG. 7 shows the minimum cross-sectional area A1 using one first suction hole portion 232a for convenience of explanation, in reality, the sum of the cross-sectional areas of all the first suction hole portions 232a is the minimum cross-sectional area A1. The area is A1.

In addition, in this embodiment, among the cross-sectional areas of the first branch path L1, the cross-sectional area at the first suction hole portion 232a is the minimum cross-sectional area A1, but the minimum cross-sectional area A1 of the present invention is the first It is not limited to the cross-sectional area of the suction hole portion 232a. For example, when the sum of the cross-sectional areas of the first suction holes 232a is larger than the cross-sectional area of the annular recess 234, the cross-sectional area of the annular recess 234 becomes the minimum cross-sectional area A1. That is, the portion having the smallest cross-sectional area is determined depending on the shape of the first branch path L1, and is not particularly limited.

Further, among the cross-sectional areas of the cross-sections perpendicular to the air flow direction in the second branch path L2, the minimum cross-sectional area is hereinafter referred to as the minimum cross-sectional area A2. In the present embodiment, the second branch path L2 includes a communication portion 240 and a through hole 238. Since the communication portion 240 and the through hole 238 are formed so as to branch out from the annular recess 234 in a plurality (see FIG. 5, etc.), a plurality of second branch paths L2 are formed. When a plurality of second branch routes L2 are formed in this manner, the sum of the cross-sectional areas of the plurality of second branch routes L2 is defined as the cross-sectional area of the second branch route L2. In the present embodiment, among the cross-sectional areas of the second branch route L2, the cross-sectional area of the communication portion 240 (the sum of the cross-sectional areas of the plurality of communication portions 240) is the minimum cross-sectional area A2. That is, in the present embodiment, "minimum cross-sectional area A2 = cross-sectional area of connecting portion 240 x number of connecting portions 240" holds true. Although FIG. 7 shows the minimum cross-sectional area A2 using one communication part 240 for convenience of explanation, in reality, the sum of the cross-sectional areas of all the communication parts 240 is the minimum cross-sectional area A2.

In addition, in this embodiment, among the cross-sectional areas of the second branch route L2, the cross-sectional area at the connecting portion 240 is assumed to be the minimum cross-sectional area A2, but the minimum cross-sectional area A2 of the present invention is the second branch route L2. It is not limited to the cross-sectional area of the communication portion 240 within the cross-sectional area of . That is, similarly to the minimum cross-sectional area A1 of the first branch route L1, the portion where the cross-sectional area is the minimum is determined according to the shape of the second branch route L2, and is not particularly limited.

In this embodiment, the minimum cross-sectional area A2 of the second branch route L2 is configured to be smaller than the minimum cross-sectional area A1 of the first branch route L1. That is, in this embodiment, the minimum cross-sectional area A1 and the like are set so as to satisfy "minimum cross-sectional area A2 < minimum cross-sectional area A1". With this configuration, the flow resistance of the air flowing through the second branch path L2 is greater than the flow resistance of the air flowing through the first branch path L1, and air is sucked through the suction pipe section 242. At this time, air is preferentially sucked from the first branch path L1 rather than the second branch path L2. Accordingly, in this embodiment, the release film F can be adsorbed to the side member 220 in stages.

<Adsorption of release film F>
Below, using FIG. 8 and the like, a description will be given of how the release film F is attracted to the lower mold 200D configured as described above in the film placement process. In this embodiment, the resin material is actually placed on the release film F as described above, but the resin material is omitted in the following figures and description.

First, as shown in FIG. 8(a), when the release film F is placed on the lower mold 200D, the suction device 250 (see FIG. 6) is activated, and the second on-off valve 254 remains closed. , only the first on-off valve 252 is opened. As a result, air is suctioned through the suction pipe section 242 (main path L).

When air is sucked through the suction pipe section 242, air is sucked preferentially from the first branch path L1, which has a larger minimum cross-sectional area, of the first branch path L1 and the second branch path L2. In particular, in this embodiment, since the first branch path L1 is formed on an extension of the suction path for air sucked through the suction pipe section 242 (main path L) (vertically above the suction pipe section 242), Air is more likely to be preferentially sucked from the first branch route L1 than from the second branch route L2. As a result, air is sucked through the first suction hole portion 232a, and the release film F is suctioned onto the upper surface of the side member 220.

In this state, if air suction is continued through the suction pipe section 242 (main path L), as shown in FIG. Air is also sucked through the second branch path L2, which has a small area. In particular, after the release film F is adsorbed by the first suction hole portion 232a, the first suction hole portion 232a is blocked by the release film F, thereby creating a suction force (negative pressure) applied to the second branch path L2. becomes higher. As a result, air is sucked through the through hole 238, and the release film F is attracted to the concave portion 236a. In this manner, in this embodiment, the timing of air suction through the first branch path L1 and air suction through the second branch path L2 can be shifted. By drawing the release film F into the recessed portion 236a, the release film F can be stretched and tension can be applied to the release film F.

Next, as shown in FIG. 8C, the second on-off valve 254 (see FIG. 6) is opened while the first suction section 232 and the second suction section 236 are sucking air. As a result, air is sucked through the suction hole portion 246. When air is suctioned through the suction hole portion 246, air is suctioned from the third suction portion 244. As a result, the release film F is attracted along the inner surface of the cavity C. By drawing the release film F in this way, the release film F can be further stretched and tension can be applied to the release film F. In fact, at this time, a resin material (not shown) is supplied into the cavity C together with the release film F.

As described above, in this embodiment, after the release film F is adsorbed by the first adsorption section 232, the second adsorption section 236 and the third adsorption section 244 perform adsorption to apply tension to the release film F. are doing. Here, in this embodiment, by suctioning air through the common main path L, air can be suctioned through the first branch path L1 and the second branch path L2. By sharing the air suction path in this way, the space of the suction path can be saved. By saving space in the suction path, it becomes easier to form the first suction part 232 and the second suction part 236 closer to the cavity C side, for example. Accordingly, by reducing the size of the release film F, the amount of the release film F to be used can be reduced, and the manufacturing cost of the resin molded product can be reduced. Further, by reducing the size of the release film F and saving space of the suction path, it is possible to reduce the outer size (size) of the mold 200 when viewed from above, and material costs can be reduced.

In addition, by sharing the air suction path and reducing the size of the mold, the volume of the space to be suctioned (vacuumed) becomes smaller, which shortens the time it takes to reach the preset degree of vacuum. Since the amount of air removed from the space until the mold clamping is completed increases, molding quality can be improved.

Furthermore, in this embodiment, by providing a difference in the minimum area of the first branching route L1 and the second branching route L2, the adsorption timing of the release film F via the first branching route L1 and the second branching route L2 can be made different. ing. This eliminates the need to provide a mechanism for controlling air suction (for example, suction pipe processing, suction piping, opening/closing valve, etc.) for each of the first branch route L1 and the second branch route L2. The cost of the molding device 1 can be reduced.

Although the first embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate changes can be made within the scope of the technical idea of the invention described in the claims. It is.

For example, the configuration (shape, arrangement, number, etc.) of each part of the resin molding apparatus 1 described in this embodiment is not particularly limited, and can be arbitrarily changed.

Further, in this embodiment, the substrate (substrate before sealing W1, etc.) is held by adsorption to the upper mold 200U, but the present invention is not limited to this. For example, it is also possible to adopt a configuration in which the substrate is held by the lower die 200D. In this case, the resin material can be supplied directly to the substrate.

Further, the cross-sectional shape of the suction holes (first suction hole portion 232a, etc.) for suctioning the release film F and the air suction path is not particularly limited, and may be any shape such as circular, rectangular, polygonal, etc. It is possible to form it into any shape. For example, it is also possible to connect the plurality of through holes 238 with a recess that surrounds the cavity C, similar to the annular recess 234. Further, instead of the plurality of through holes 238, an annular recess (groove) surrounding the cavity C may be used.

Further, in this embodiment, an example has been shown in which the first suction portion 232 and the second suction portion 236 are formed to be lined up in a rectangular shape following the shape of the cavity C in plan view, but the present invention is not limited to this. It is possible to arrange and form them in any shape.

Furthermore, in the present embodiment, an example is shown in which the suction tube portion 242 is arranged below the annular recess 234 so that the first branch path L1 and the main path L overlap vertically in plan view (see FIG. 7). ), but the present invention is not limited thereto. That is, if the minimum cross-sectional area A2 of the second branch route L2 is formed to be smaller than the minimum cross-sectional area A1 of the first branch route L1, the main route L, the first branch route L1, and the second branch route The shape and positional relationship of L2 are not particularly limited.

Further, in the present embodiment, an example is shown in which the first branch route L1 and the second branch route L2 are formed in the upper side member 222, but the present invention is not limited to this, and the first branch route L1 and the second branch route L2 are formed in the upper side member 222. It is also possible to form a part of the branch path L2 in the lower side member 223.

Further, in this embodiment, an example is shown in which the side surface member 220 is divided into two parts, upper and lower (into an upper side member 222 and a lower side member 223), but the present invention is not limited to this. For example, it is also possible to divide the side member 220 into three or more parts, or to form it as an integral member without dividing it.

Further, in the present embodiment, the mold 200 is described as having a rectangular shape in a plan view, but the shape of the mold 200 is not limited to this, and can have any shape, such as a circular shape in a plan view. 200 can be used.

Further, the shape of the release film F used in this embodiment is not particularly limited. As the release film F, it is possible to use a release film F having a rectangular shape, a circular shape, etc., for example. Further, the shape of the release film F can be appropriately selected depending on the shapes of the mold 200, the cavity C, and the like.

Moreover, the material of the release film F used in this embodiment is not particularly limited. As the release film F, it is possible to use, for example, a resin film, metal foil, rubber sheet, etc., or a composite of these.

Furthermore, in this embodiment, an example has been described in which the resin material is conveyed to the lower mold 200D together with the release film F, but the present invention is not limited to this, and the release film F and the resin material are separately conveyed to the lower mold 200D. 200D.

Further, in this embodiment, an example was explained in which the release film F is adsorbed and held on the lower mold 200D, but the present invention is not limited to this, and the release film F is adsorbed and held on the upper mold 200U. It is possible to do so.

<Second embodiment>
Below, a lower mold 200D according to the second embodiment will be described using FIG. 9.

The lower mold 200D according to the second embodiment differs from the first embodiment in that the connecting portion 240 is formed at a different position from the lower mold 200D according to the first embodiment (see FIG. 7). Therefore, this difference will be mainly explained below, and the same reference numerals will be given to the other configurations that are the same as those of the first embodiment, and the explanation will be omitted.

As shown in FIG. 9, the communication portion 240 according to the second embodiment is formed not on the bottom surface of the upper side member 222 but at a vertical midway portion of the upper side member 222. For example, by forming a hole from the outer surface of the upper side member 222 to pass through the annular recess 234 and reach the through hole 238, the communication portion 240 can be formed at such a position. In this case, airtightness can be ensured by closing the opening formed on the outer surface of the upper side member 222 with a suitable closing member 241. In addition, in the second embodiment, the lower end of the through hole 238 does not need to be formed all the way to the bottom of the upper side member 222, and extends from the concave portion 236a to the upper and lower middle part of the upper side member 222 (the position where it is connected to the communication portion 240). It is sufficient if it is formed.

In the second embodiment, the branching point P is the upper and lower middle part of the annular recess 234 (the part at the same height as the communication part 240). Therefore, in the second embodiment, the main path L is the air suction path from the suction device 250 to the vertical midway point (branch point P) of the annular recess 234. Further, the air suction path from the upper and lower midpoints (branch point P) of the annular recess 234 to the upper end of the first suction portion 232 (first suction hole portion 232a) is the first branch path L1. Further, the air suction path from the upper and lower midpoints (branch point P) of the annular recess 234 to the upper end of the through hole 238 becomes the second branch path L2.

Even in this case, the configuration is such that the minimum cross-sectional area A2 of the second branch route L2 is smaller than the minimum cross-sectional area A1 of the first branch route L1. That is, the minimum cross-sectional area A1 etc. are set so as to satisfy "minimum cross-sectional area A2 < minimum cross-sectional area A1". With this configuration, the flow resistance of the air flowing through the second branch path L2 is greater than the flow resistance of the air flowing through the first branch path L1, and air is sucked through the suction pipe section 242. At this time, air is preferentially sucked from the first branch path L1 rather than the second branch path L2. Accordingly, in this embodiment, the release film F can be adsorbed to the side member 220 in stages.

<Third embodiment>
Below, a lower mold 200D according to the third embodiment will be described using FIG. 10.

A lower mold 200D according to the third embodiment is different from the first embodiment (see FIG. 3) in the shape of the first suction portion 232. Therefore, this difference will be mainly explained below, and the same reference numerals will be given to the other configurations that are the same as those of the first embodiment, and the explanation will be omitted.

As shown in FIG. 10, the first suction section 232 according to the third embodiment includes a second suction hole section 232b in addition to the first suction hole section 232a. The second suction hole portion 232b, like the first suction portion 232, is a through hole formed along the vertical direction so as to connect the upper surface of the side member 220 and the annular recess 234. The second suction hole portion 232b is formed to extend from one first suction hole portion 232a to another first suction hole portion 232a adjacent to the first suction hole portion 232a in plan view. In this way, the second suction hole portions 232b are formed to connect adjacent first suction hole portions 232a. The width of the second suction hole portion 232b in plan view (the width that is the length in the direction perpendicular to the direction in which the second suction hole portion 232b extends to connect adjacent first suction hole portions 232a) is as follows: It is formed to be approximately constant. The width of the second suction hole portion 232b is formed to be, for example, four times or less the thickness of the release film F.

The width of the second suction hole portion 232b is the width of the first suction hole portion 232a (the width of the second suction hole portion 232b in the direction perpendicular to the direction in which the second suction hole portion 232b extends to connect adjacent first suction hole portions 232a). The maximum length of the first suction hole portion 232a (in this embodiment, the diameter of the first suction hole portion 232a) is smaller than the maximum length of the first suction hole portion 232a. As a result, the first suction hole portion 232a is formed to protrude from the second suction hole portion 232b on both sides in the width direction of the second suction hole portion 232b. That is, the first suction hole portion 232a is formed to protrude to the inside (cavity C side) and the outside (opposite side to cavity C) of the lower mold 200D with respect to the second suction hole portion 232b. .

The first suction hole portions 232a and the second suction hole portions 232b are formed so as to be alternately connected in a plan view. Further, the first suction hole portion 232a and the second suction hole portion 232b are formed to surround the cavity C. In this embodiment, the first suction hole portion 232a and the second suction hole portion 232b are formed so as to surround the cavity C without interruption. That is, the first suction hole portion 232a and the second suction hole portion 232b are formed in an endless ring shape in plan view, and the first suction hole portion 232a and the second suction hole portion 232b are continuously connected to form a cavity. It surrounds the entire area around C. In this way, a suction hole for suctioning the release film F is formed by the first suction hole portion 232a and the second suction hole portion 232b that are open on the upper surface of the side member 220.

Note that, as described above, the first suction hole portion 232a, the second suction hole portion 232b, and the annular recess 234 (see FIG. 5) are formed so as to continuously surround the cavity C without interruption. There is. Therefore, the upper side member 222 has a portion (outer member 222a) outside the first suction hole portion 232a, etc. and a portion (inner member 222b) inside the first suction hole portion 232a, etc. in plan view, with the first suction hole portion 232a etc. in between. , are separated into.

By connecting the first suction hole portion 232a with the second suction hole portion 232b as in the third embodiment, a large area of the suction hole for suctioning the release film F can be ensured. Thereby, the minimum cross-sectional area A1 (see FIG. 7) in the first branch route L1 can be increased. By widening the minimum cross-sectional area A1 in the first branch route L1, the difference from the minimum cross-sectional area A2 in the second branch route L2 can be increased. The timing of air suction via the two-branch route L2 can be shifted more clearly.

Further, by ensuring a large area of the suction holes for adsorbing the release film F as in the third embodiment, the release film F can be firmly held. As a result, when the release film F is adsorbed by the second adsorption section 236 or the third adsorption section 244, it is possible to prevent the adsorption failure (wrinkles, slippage, etc.) of the release film F from occurring. It is possible to prevent molding defects and release defects of the resin molded product due to poor suction of the film F. Furthermore, by connecting the first suction hole portion 232a with the second suction hole portion 232b having a relatively narrow width, even though the release film F is suctioned with a relatively large suction force, the release film F is attached to the first suction hole portion 232b. This can prevent it from being drawn into the hole 232a.

<Fourth and fifth embodiments>
Below, lower mold 200D according to the fourth embodiment and the fifth embodiment will be described using FIG. 11.

The lower mold 200D according to the fourth embodiment and the fifth embodiment differs from the first embodiment (see FIG. 7) in the shape and positional relationship of the main path L, the first branch path L1, and the second branch path L2. There is. Therefore, this difference will be mainly explained below, and the same reference numerals will be given to the other configurations that are the same as those of the first embodiment, and the explanation will be omitted.

FIG. 11A shows a lower mold 200D according to the fourth embodiment. As shown in FIG. 11(a), the suction tube part 242 according to the fourth embodiment is arranged not below the annular recess 234 but below the through hole 238. That is, the upper end of the suction tube section 242 is connected to the lower end of the through hole 238. Further, the lower end of the through hole 238 is connected to the lower end of the annular recess 234 via a communication portion 240. Accordingly, in the fourth embodiment, the lower end of the through hole 238 becomes the branch point P.

Note that in the fourth embodiment, the cross-sectional area of the communication portion 240 is formed larger than that in the first embodiment (see FIG. 7), and the minimum cross-sectional area A2 of the second branch route L2 is the minimum cross-sectional area A2 of the first branch route L1. It is formed to have a smaller cross-sectional area than A1. With this configuration, when air is sucked from the suction tube section 242, the release film F can be suctioned in stages by the first suction section 232 and the second suction section 236.

FIG. 11(b) shows a lower mold 200D according to the fifth embodiment. As shown in FIG. 11(b), the suction tube portion 242 according to the fifth embodiment is arranged at a position shifted from the annular recess 234 and the through hole 238. The upper end of the suction tube section 242 is connected to the lower end of the annular recess 234 via a recess 248 formed in the bottom surface of the upper side member 222. Further, the lower end of the annular recess 234 is connected to the lower end of the through hole 238 via a communication portion 240, similarly to the first embodiment. Accordingly, in the fifth embodiment, the lower end of the annular recess 234 becomes the branch point P.

In the fifth embodiment, similarly to the first embodiment (see FIG. 7), the second branch route L2 is formed so that the minimum cross-sectional area A2 is smaller than the minimum cross-sectional area A1 of the first branch route L1. . With this configuration, when air is sucked from the suction tube section 242, the release film F can be suctioned in stages by the first suction section 232 and the second suction section 236.

<Additional notes>
The mold 200 of the first aspect of the present disclosure includes:
A mold 200 comprising an upper mold 200U (one mold) and a lower mold 200D (the other mold) that is disposed opposite to the upper mold 200U and has a cavity C in which a release film F is disposed. There it is,
The lower mold 200D includes a main surface member 210 that forms the main surface of the cavity C, and a side surface member 220 that forms the side surface of the cavity C,
The side member 220 is
a first adsorption part 232 formed on a first opposing surface facing the upper mold 200U and adsorbing the release film F;
a second adsorption section 236 that is formed closer to the cavity C than the first adsorption section 232 on the first opposing surface and that adsorbs the release film F;
a suction path (main path L, first branch path L1, and second branch path L2) for sucking air from the first suction section 232 and the second suction section 236;
Equipped with
The suction path is
One end side in the air flow direction is connected to the suction device 250, and the other end side in the air flow direction is connected to the first branch path L1 connected to the first suction section 232 and the second suction section 236. branched to a second branch route L2,
The minimum cross-sectional area A2 of the cross section perpendicular to the air flow direction in the second branch path L2 is smaller than the minimum cross-sectional area A1 of the cross section perpendicular to the air flow direction in the first branch path L1.
According to the mold 200 of the first aspect of the present disclosure, cost reduction can be achieved. That is, by sharing the suction path for sucking air from the first suction section 232 and the second suction section 236, it is possible to save space in the suction path. By saving space in the suction path, the first suction section 232 and the second suction section 236 can be placed closer to the cavity C side, and the size of the release film F can be reduced accordingly. Therefore, it is possible to reduce the manufacturing cost of resin molded products. Furthermore, the timing of adsorption of the release film F by the first adsorption section 232 and the second adsorption section 236 can be made different depending on the difference in the minimum cross-sectional area between the first branch path L1 and the second branch path L2. Therefore, there is no need to provide a mechanism (for example, suction tube processing, suction piping, opening/closing valve, etc.) for varying the timing of suction, so that the cost of the resin molding apparatus 1 can be reduced.

In the mold 200 of the second side according to the first side,
The second branch route L2 is
a first path (communication portion 240) extending from a branch point P with the first branch path L1 toward the main surface member 210;
a second path (through hole 238) extending from the first path to the first opposing surface;
Equipped with.
According to the mold 200 of the second aspect of the present disclosure, the second branch path L2 can be formed to be curved, and the flow resistance of the air flowing through the second branch path L2 can be increased. Thereby, the timings at which the first suction section 232 and the second suction section 236 adsorb the release film F can be easily made different.

In the mold 200 of the third side according to the second side,
The side member 220 includes an upper side member 222 (first side member) on which the first opposing surface is formed, and a lower side disposed on the opposite side of the first opposing surface with respect to the upper side member 222. A member 223 (second side member),
The first path (communication portion 240) is formed on a second opposing surface of the upper surface member 222 that faces the lower surface member 223.
According to the mold 200 of the third aspect of the present disclosure, the first path (communication portion 240) can be easily formed, and the cost of the mold 200 can be reduced.

In the mold 200 of the fourth side according to the first to third sides,
The first branch path L1 includes an annular recess 234 (an annular portion) formed so as to continuously surround the cavity C when viewed from a direction perpendicular to the first opposing surface.
According to the mold 200 of the fourth aspect of the present disclosure, the flow resistance of air flowing through the first branch path L1 can be reduced. Thereby, the timings at which the first suction section 232 and the second suction section 236 adsorb the release film F can be easily made different.

In the mold 200 of the fifth side according to the fourth side,
A plurality of the second branch routes L2 are formed,
The plurality of second branch paths L2 are connected to the annular recess 234, respectively.
According to the mold 200 of the fifth aspect of the present disclosure, the release film F can be more reliably adsorbed. That is, since the minimum cross-sectional area A2 of the second branch route L2 is smaller than the minimum cross-sectional area A1 of the first branch route L1, there is a concern that the second branch route L2 will be clogged with dust. By forming a plurality of paths L2, even if any of the second branch paths L2 is clogged with dust or the like, the release film F can be adsorbed using the other second branch paths L2.

In the mold 200 of the sixth side according to the first to fifth sides,
The first suction part 232 includes a plurality of first suction holes 232a and a second suction hole 232b that connects the adjacent first suction holes 232a,
On the first opposing surface, the first suction hole portion 232a has a length in a direction perpendicular to the direction in which the second suction hole portion 232b extends to connect adjacent first suction hole portions 232a. It is larger than the second suction hole portion 232b.
According to the mold 200 of the sixth aspect of the present disclosure, since it is easy to ensure a wide cross-sectional area of the first suction part 232, the timing of suction of the release film F by the first suction part 232 and the second suction part 236 is can be easily made different. Further, the second suction hole portion 232b can prevent the release film F from being drawn into the first suction hole portion 232a.

In the mold 200 of the seventh side according to the sixth side,
The first suction portion 232 is formed so as to surround the cavity C continuously.
According to the mold 200 of the seventh aspect of the present disclosure, the release film F can be firmly held over the entire circumference of the cavity C. Thereby, poor adsorption of the release film F can be effectively prevented.

The resin molding device 1 according to the eighth aspect of the present disclosure includes:
Any one of the molds 200 from the first side to the seventh side is provided.
According to the resin molding apparatus 1 of the eighth aspect of the present disclosure, cost reduction can be achieved.

The method for manufacturing a resin molded product according to the ninth aspect of the present disclosure includes:
A method for manufacturing a resin molded product using the resin molding apparatus 1 of the eighth aspect,
a film placement step of placing the release film F on the lower mold 200D;
a resin molding step of performing resin molding using the lower mold 200D in which the release film F is disposed;
including.
According to the method for manufacturing a resin molded product according to the ninth aspect of the present disclosure, cost reduction can be achieved.

1 Resin molding apparatus 200 Molding mold 200D Lower mold 200U Upper mold 210 Main surface member 220 Side member 222 Upper surface member 223 Lower surface member 232 First suction part 232a First suction hole part 232b Second suction hole part 234 Annular recess 236 2 Adsorption part 238 Through hole 240 Communication part 250 Suction device

Claims (9)

A mold comprising one mold and another mold disposed opposite to the one mold and having a cavity in which a release film is disposed,
The other mold includes a main surface member forming a main surface of the cavity, and a side member forming a side surface of the cavity,
The side member is
a first suction part that is formed on a first opposing surface facing the one mold and that suctions the release film;
a second adsorption part that is formed closer to the cavity than the first adsorption part on the first opposing surface and adsorbs the release film;
a suction path for sucking air from the first suction part and the second suction part;
Equipped with
The suction path is
a first branch path in which one end in the air flow direction is connected to the suction device and the other end in the air flow direction to the first adsorption section; and a second branch path connected to the second adsorption section. It is branched into
The minimum cross-sectional area of a cross section perpendicular to the air flow direction in the second branch path is smaller than the minimum cross-sectional area of a cross section perpendicular to the air flow direction in the first branch path.
Molding mold. The second branch route is
a first path extending from a branch point with the first branch path toward the main surface member;
a second path extending from the first path to the first opposing surface;
Equipped with
The mold according to claim 1. The side member includes a first side member on which the first opposing surface is formed, and a second side member disposed on the opposite side of the first opposing surface with respect to the first side member,
The first path is formed on a second opposing surface of the first side member that faces the second side member.
The mold according to claim 2. The first branch path includes an annular portion formed to continuously surround the cavity when viewed from a direction perpendicular to the first opposing surface.
The mold according to claim 1 . A plurality of the second branch paths are formed,
The plurality of second branch paths are each connected to the annular portion,
The mold according to claim 4. The first suction part includes a plurality of first suction holes and a second suction hole that connects the adjacent first suction holes,
On the first opposing surface, the first suction hole portion has a length in the direction perpendicular to the direction in which the second suction hole portion extends to connect the adjacent first suction hole portions. larger than the suction hole,
The mold according to claim 1 . The first suction part is formed so as to continuously surround the periphery of the cavity.
The mold according to claim 6. A resin molding apparatus comprising the mold according to any one of claims 1 to 7. A method for manufacturing a resin molded product using the resin molding apparatus according to claim 8,
a film placement step of placing the release film on the other mold;
a resin molding step of performing resin molding using the other mold in which the release film is disposed;
A method for manufacturing a resin molded product, including:

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