JP7417018B2 - Processing equipment and method - Google Patents

Description

The present invention relates to a processing apparatus and method, and more particularly, to a processing apparatus and method for dicing a workpiece such as a wafer on which a semiconductor device, an electronic component, or the like is formed.

Laser processing equipment (laser processing equipment) that aligns the condensing point inside a silicon wafer and irradiates laser light along the planned dividing line to form a laser processing area that will be the starting point for cutting inside the wafer along the planned dividing line. dicing apparatus) is known (for example, Patent Document 1). The wafer on which the laser processing region has been formed is then cut into individual chips by a cutting process such as expanding or breaking along the planned dividing line.

Japanese Patent Application Publication No. 2016-195265 Japanese Patent Application Publication No. 2019-149541

Generally, in a laser processing apparatus, processing is performed for each wafer in the order of processing preparation (wafer loading and alignment) -> processing operation -> post-processing (inspection and unloading). However, if the series of processes described above are repeated for each wafer, there is a problem that the process takes time and production efficiency decreases.

In order to improve the production efficiency of laser processing equipment, it is preferable to shorten the execution time of the entire process. To shorten the execution time of the entire process, specifically, "reducing machining operation time" and "reducing processing time other than machining" are performed.

First, in order to "reduce machining operation time", it is necessary to increase machining speed and acceleration. However, there are the following issues in increasing the machining speed and acceleration.
(1) Larger motors used for relative movement of wafers, etc. (2) Higher autofocus response (3) Higher laser output and higher repetition frequency (4) Increased equipment vibration due to increased acceleration Among the above (1) to (4), the autofocus response in (2) may be reduced due to the influence of vibration of the laser processing device (4). Therefore, it is difficult to significantly improve autofocus response.

Next, in order to achieve ``shortening of processing time other than processing'', examples include increasing the speed of the wafer transport system, increasing the stage feed speed, and optimizing the alignment operation. However, with these methods, it is difficult to dramatically shorten processing time.

By the way, while processing other than processing (for example, inspection) is being performed, the laser processing optical unit (processing device) is stopped. If the downtime of the processing equipment, which accounts for most of the cost of the laser processing equipment, becomes longer, the cost effectiveness of the laser processing equipment will decrease.

As production efficiency improves and it becomes possible to process a large amount of products in a short period of time, inspection for defects in processing becomes important. If a large number of products are to be rigorously inspected for defects in processing, etc., it is expected that the time required to inspect the processing conditions (measuring internal cracks, etc.) will be longer.

In order to improve the production efficiency of a laser processing apparatus, an apparatus has been proposed in which processing and inspection can be performed respectively on a plurality of stages (wafer tables) (see Patent Document 2).

In the laser processing apparatus (laser dicing apparatus) described in Patent Document 2, the weight of the stage and its driving device has a high proportion to the weight of the laser processing apparatus. Therefore, vibration occurs when the stage is moved, which affects the accuracy of laser processing and inspection.

The present invention has been made in view of the above circumstances, and provides a processing device and method capable of shortening the downtime of the processing device and suppressing vibration when processing and inspecting a workpiece. The purpose is to

In order to solve the above problems, a processing device according to a first aspect of the present invention includes a plurality of stages configured to be movable independently of each other in a first direction, and a plurality of stages configured to be movable independently of each other in a first direction, and in a second direction perpendicular to the first direction. A processing means is configured to be movable and processes a first workpiece held on one of the plurality of stages; an inspection means for inspecting a second workpiece held on another stage; at least one counterweight configured to be movable in a first direction; and an inspection means for inspecting a second workpiece held on another stage; counterweight control means for moving the at least one counterweight in a restraining manner.

In the processing apparatus according to the second aspect of the present invention, in the first aspect, the counterweight control means moves at least one counterweight in a direction opposite to the moving direction of one stage or the other stage.

In the processing apparatus according to a third aspect of the present invention, in the first aspect, the counterweight control means moves at least one of the one stage or the other stage in a direction opposite to the moving direction of the stage facing the processing means. Move the counterweight.

In the processing apparatus according to a fourth aspect of the present invention, in any one of the first to third aspects, the plurality of stages include a first stage and a second stage arranged in parallel in the second direction, and at least One counterweight is a first counterweight placed on the opposite side of the first stage to the side where the second stage is placed, and one counterweight placed on the side of the second stage opposite to the side where the first stage is placed. and a second counterweight.

In the processing apparatus according to a fifth aspect of the present invention, in any one of the first to fourth aspects, the plurality of stages include a first stage and a second stage arranged in parallel in the second direction, and at least One counterweight includes a third counterweight disposed between the first stage and the second stage.

In the processing apparatus according to a sixth aspect of the present invention, in any one of the first to third aspects, the plurality of stages include a first stage and a second stage arranged in parallel in the second direction, and at least One counterweight includes a pair of first stage side counterweights arranged on both sides of the first stage and a pair of second stage side counterweights arranged on both sides of the second stage.

In the processing apparatus according to the seventh aspect of the present invention, in any one of the first to sixth aspects, the processing means processes the workpiece with a laser beam.

A processing method according to an eighth aspect of the present invention includes the steps of moving a processing means to a position facing one of the plurality of stages, and moving an inspection means to a position facing another stage among the plurality of stages. a step of moving one stage relative to the processing means, processing a first workpiece held on the one stage by the processing means; and a step of moving the other stage relative to the inspection means. , a step of inspecting a second workpiece held on another stage by an inspection means, and a step of moving at least one counterweight so as to suppress vibrations generated by movement of one stage or the other stage. include.

According to the present invention, it is possible to shorten the downtime of a processing device when processing and inspecting a workpiece, and it is also possible to suppress vibration.

FIG. 1 is a plan view showing a laser processing apparatus according to a first embodiment of the present invention. FIG. 2 is a front view showing the laser processing apparatus according to the first embodiment of the present invention. FIG. 3 is a side view showing the laser processing apparatus according to the first embodiment of the present invention. FIG. 4 is a block diagram showing a laser processing apparatus according to the first embodiment of the present invention. FIG. 5 is a plan view when wafers are processed and inspected in the first and second stages, respectively. FIG. 6 is a plan view when wafers are inspected and processed in the first and second stages, respectively. FIG. 7 is a timing chart showing the procedure of laser processing according to the first embodiment of the present invention. FIG. 8 is a plan view showing a laser processing apparatus according to a second embodiment of the present invention. FIG. 9 is a plan view showing a laser processing apparatus according to a third embodiment of the present invention. FIG. 10 is a plan view showing a laser processing apparatus according to a fourth embodiment of the present invention. FIG. 11 is a graph showing the relationship between the number of counterweights and the displacement of the laser processing device.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a processing apparatus and method according to the present invention will be described below with reference to the accompanying drawings.

[First embodiment]
(Processing equipment)
1 to 3 are a plan view, a front view, and a side view, respectively, showing a processing device (laser processing device) according to a first embodiment of the present invention. In the following description, a three-dimensional orthogonal coordinate system will be used.

As shown in FIGS. 1 to 3, the laser processing apparatus 10 according to the present embodiment includes a first stage 14-1, a second stage 14-2, a processing section 28, and an inspection section 30. The laser processing apparatus 10 is capable of processing and inspecting a workpiece (wafer) in parallel (for example, simultaneously) on the first stage 14-1 and the second stage 14-2.

The laser processing device 10 is provided on a base 12 parallel to a horizontal plane (XY plane). The base 12 forms a reference plane of the laser processing device 10.

The first stage 14-1 and the second stage 14-2 (hereinafter also referred to as X stage) are arranged (parallel) in the Y direction (second direction), and each is arranged in the X direction (first direction). It is attached so that it can move along the X1 axis and the X2 axis that extend to . Here, the mechanism for moving the first stage 14-1 and the second stage 14-2 includes, for example, a nut provided on the first stage 14-1 and the second stage 14-2, and a mechanism for moving the first stage 14-1 and the second stage 14-2. A mechanism capable of linearly reciprocating the first stage 14-1 and second stage 14-2 in the X direction, such as a ball screw mechanism including a screwed ball screw, a linear motor, or a rack and pinion mechanism, is used. Is possible.

θ stages 16-1 and 16-2 are attached to the first stage 14-1 and the second stage 14-2, respectively. Wafer chucks C1 and C2 are attached to the θ stages 16-1 and 16-2, respectively. The θ stages 16-1 and 16-2 rotate the wafer chucks C1 and C2 around their respective rotation axes (eg, central axes) (in the θ direction).

Suction holes for sucking air are formed on the surfaces of the wafer chucks C1 and C2. The wafer chucks C1 and C2 suck and hold the wafers W1 and W2, respectively, which have been carried into the laser processing apparatus 10 as targets for laser processing.

As described above, the first stage 14-1 and the second stage 14-2 have similar configurations. Therefore, in the following description, configurations and operations that are common to both the first stage 14-1 side and the second stage 14-2 side may be explained together with branch numbers omitted.

A Y base 18 is provided above the base 12. The Y base 18 forms a reference plane along the Y direction. The Y base 18 is supported by a column extending from the base 12 in the Z direction. A Y1 axis and a Y2 axis extending in the Y direction are attached to the Y base 18, respectively. As shown in FIGS. 2 and 3, the Y1 axis is shifted from the Y2 axis in the +Z direction and the +X direction.

A processing Y-axis moving stage 20 and an inspection Y-axis moving stage 24 (hereinafter referred to as Y stages 20 and 24) are attached to the Y1 axis and the Y2 axis, respectively.

A processing section 28 is attached to the Y stage 20 via a processing Z-axis moving stage (hereinafter referred to as "Z stage") 22. The processing section (processing means) 28 is movable in the YZ direction by a Y stage 20 and a Z stage 22, respectively. As the Y stage 20 and the Z stage 22, it is possible to use a mechanism (for example, a ball screw mechanism, a linear motor, a rack and pinion mechanism, etc.) that allows the processing section 28 to reciprocate and linearly move in the YZ direction, respectively. .

An inspection section 30 is attached to the Y stage 24 via an inspection Z-axis moving stage (hereinafter referred to as Z stage) 26 . The inspection section (inspection means) 30 is movable in the YZ direction by a Y stage 24 and a Z stage 26, respectively. As the Y stage 24 and the Z stage 26, it is possible to use a mechanism (for example, a ball screw mechanism, a linear motor, a rack and pinion mechanism, etc.) that allows the inspection section 30 to reciprocate linearly in the YZ direction. .

The processing section 28 includes an optical unit for laser processing (hereinafter referred to as a processing unit) 28A and an optical unit for alignment (hereinafter referred to as an optical unit) 28B. The processing unit 28A and the optical unit 28B are movable as a unit in the YZ direction.

The processing unit 28A includes a laser oscillator and a condensing lens (see Japanese Unexamined Patent Publication No. 2004-111946), and directs the laser beam output from the laser oscillator into the inside of the wafer W (W1 or W2) using the condensing lens. Focus the light. As a result, a laser processing region is formed inside the wafer W, which serves as a starting point for cutting the wafer W.

The optical unit 28B includes an image sensor (for example, an indium gallium arsenide (InGaAs) photodiode or a CCD (Charge-Coupled Device) image sensor) that captures an image of the wafer W. The control device 50 (see FIG. 4) detects the position of the alignment pattern from the image of the wafer W taken by the optical unit 28B, and controls the X drive unit 54, the θ drive unit 56, the Y drive unit 60, and the Z drive unit 62. Then, the processing unit 28A and the wafer W are aligned.

The inspection section 30 includes an inspection optical unit (hereinafter referred to as an inspection unit) 30A and an alignment optical unit (hereinafter referred to as an optical unit) 30B. The inspection unit 30A and the optical unit 30B are movable as a unit in the YZ direction.

The inspection unit 30A measures the length of the crack extending from the laser processing area. As the inspection unit 30A, for example, it is possible to apply a crack detection device described in Japanese Patent Application Publication No. 2017-133997.

The optical unit 30B includes an image sensor (for example, an indium gallium arsenide (InGaAs) photodiode or a CCD (Charge-Coupled Device) image sensor) that captures an image of the wafer W. The control device 50 detects the position of the alignment pattern from the image of the wafer W captured by the optical unit 30B, controls the X drive unit 54, the θ drive unit 56, the Y drive unit 64, and the Z drive unit 66, and controls the inspection unit. 30A and the wafer W are aligned.

Note that in the laser processing apparatus 10 according to the present embodiment, the processing section 28 is disposed on the +X side relative to the inspection section 30 due to the positional relationship between the Y stages 20 and 24, but the present invention is not limited thereto. For example, the inspection section 30 may be arranged on the +X side with respect to the processing section 28.

On the base 12, counterweights CW1 to CW3 are arranged. The counterweights CW1 to CW3 are movable along guide rails G1 to G3 extending in the X direction, respectively.

As shown in FIG. 1, the counterweight CW1, first stage 14-1, counterweight CW3, second stage 14-2, and counterweight CW2 are arranged in this order from the +Y side on the base 12. The counterweights CW1 to CW3 and the guide rails G1 to G3 suppress vibrations of the laser processing device 10 that occur when moving the first stage 14-1 and the second stage 14-2 along the X1 axis and the X2 axis. It functions as a vibration damping mechanism 58 (see FIGS. 4 to 7).

Here, the weights of the counterweights CW1 to CW3 are set such that they can cancel out the rotational moment that occurs when moving the first stage 14-1 and the second stage 14-2 along the X1 axis and the X2 axis, respectively. It has been adjusted. Counter weights CW1 and CW2 placed outside of the first stage 14-1 and second stage 14-2, and counters placed inside of the first stage 14-1 and second stage 14-2. The weight of weight CW3 may be different.

In addition, counterweights CW1 to CW3 and the first stage 14-1 and the second stage 14 are used to cancel the rotational moment that occurs when moving the first stage 14-1 and the second stage 14-2. -2 (for example, the distance in the Y direction or the height in the Z direction) may be adjusted.

(Control system of laser processing equipment)
FIG. 4 is a block diagram showing a laser processing apparatus according to the first embodiment of the present invention.

As shown in FIG. 4, the laser processing apparatus 10 according to the present embodiment includes a control device 50, an input/output section 52, X drive sections 54-1, 54-2, θ drive sections 56-1, 56-2, It includes a vibration mechanism 58, a Y drive section 60, a Z drive section 62, a Y drive section 64, and a Z drive section 66.

The control device 50 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a storage device (for example, a hard disk, etc.), and the like. In the control device 50, various programs such as a control program stored in the ROM are expanded to the RAM, and the programs expanded to the RAM are executed by the CPU, thereby realizing the functions of each part of the laser processing device 10. .

The input/output unit 52 includes an operating member (for example, a keyboard, a pointing device, etc.) for receiving operation input from a user, and a device (for example, a graphical user interface) for displaying a GUI (Graphical User Interface) for operating the laser processing apparatus 10. , liquid crystal display), etc.

The X drive units 54-1 and 54-2 are power sources (for example, motors) for moving the first stage 14-1 and the second stage 14-2 attached to the X1 axis and the X2 axis, respectively, in the X direction. ). The X drive units 54-1 and 54-2 are an example of a first drive device.

The θ drive units 56-1 and 56-2 include power sources (for example, motors) for rotating the wafer chucks C1 and C2 attached to the θ stages 16-1 and 16-2, respectively, in the θ direction. There is.

The Y drive section 60 includes a power source (for example, a motor) for moving the processing section 28 attached to the Y stage 20 via the Z stage 22 in the Y direction.

The Z drive section 62 includes a power source (for example, a motor) for moving the processing section 28 attached to the Z stage 22 in the Z direction.

The Y drive section 64 includes a power source (for example, a motor) for moving the inspection section 30 attached to the Y stage 24 via the Z stage 26 in the Y direction.

The Z drive section 66 includes a power source (for example, a motor) for moving the inspection section 30 attached to the Z stage 26 in the Y direction.

The Y drive units 60 and 64 and the Z drive units 62 and 66 described above are examples of the second drive device.

The damping mechanism 58 includes a power source (eg, a motor) for moving the counterweights CW1 to CW3 along the guide rails G1 to G3, respectively. The vibration damping mechanism 58 controls the movement direction, movement amount, and movement acceleration of the counterweights CW1 to CW3 according to the movement direction, movement amount, movement speed, and movement acceleration of the first stage 14-1 and the second stage 14-2. Control speed and movement acceleration. Thereby, vibrations of the laser processing apparatus 10 that occur when moving the first stage 14-1 and the second stage 14-2 can be suppressed. Here, the counterweights CW1 to CW3 are examples of first to third counterweights, respectively, and the control device 50 and the vibration damping mechanism 58 are examples of counterweight control means.

(Processing method)
Next, control of the vibration damping mechanism 58 during laser processing will be explained with reference to FIGS. 5 to 7.

In the following description, an example will be described in which laser processing and inspection are sequentially performed on wafers W0, W1, W2, W3, . . . , W(2i-1), W(2i), . Note that i=1, 2, 3, . . . Wafers W1, W3,..., W(2i-1),... are processed at the first stage 14-1, and wafers W0, W2,..., W(2i),... are processed at the second stage 14-2. . That is, first, wafers W0 and W1 are loaded onto the second stage 14-2 and first stage 14-1, respectively, and laser processing of the wafer W0 is performed. Next, inspection of the wafer W0 at the second stage 14-2 and laser processing of the wafer W1 at the first stage 14-1 are performed in parallel.

FIG. 5 is a plan view when wafers are processed and inspected in the first and second stages, respectively, and FIG. 6 is a plan view when wafers are inspected and processed in the first and second stages, respectively. be.

In the example shown in FIG. 5, the first stage 14-1 performs laser processing on the wafer W1, and the second stage 14-2 performs inspection on the wafer W0 after the laser processing. In this case, first, the control device 50 moves the positions of the processing section 28 and the inspection section 30 in the Y direction according to the positions of the first stage 14-1 and the second stage 14-2 in the Y direction, respectively. That is, the control device 50 moves the processing section 28 and the inspection section 30 so as to face the first stage 14-1 and the second stage 14-2, respectively.

Further, the control device 50 moves the first stage 14-1 to the +X side and the second stage 14-2 to the -X side, depending on the positions of the processing section 28 and the inspection section 30 in the X direction. The control device 50 controls the vibration damping mechanism 58 to move the counterweights CW1 to CW3 so as to cancel the rotational moment generated when moving the first stage 14-1 and the second stage 14-2 in the X direction. let

In the example shown in FIG. 5, while the first stage 14-1 moves to the +X side, the counterweights CW1 and CW3 placed across the first stage 14-1 move in the opposite direction (-X side). move it. The rotational moment of the laser processing device 10 can be canceled by operating the counterweights CW1 to CW3 in accordance with the operations of the first stage 14-1 and the second stage 14-2 during processing and inspection.

Next, the control device 50 performs laser processing on the wafer W1 and inspection on the wafer W0 after the laser processing in parallel. Specifically, the control device 50 controls the X drive section 54-1, the θ drive section 56-1, the Y drive section 60, and the Z drive section 62 to move the first stage 14-1 and the processing section 28. While relatively moving, laser processing is performed along the planned dividing line of the wafer W1 to form a laser processing area. Further, the control device 50 controls the X drive section 54-2, the θ drive section 56-2, the Y drive section 64, and the Z drive section 66 to relatively move the second stage 14-2 and the inspection section 30. Meanwhile, the laser processing area formed on the wafer W0 is inspected (the length of the crack is measured).

Next, when the inspection is completed, the wafer W0 is carried out (unloaded) from the laser processing apparatus 10 by a handler arm (not shown). Then, the next wafer W2 is carried (loaded) into the laser processing apparatus 10 by a handler arm (not shown), placed on the wafer chuck C2, and held by suction.

Next, as shown in FIG. 6, the wafer W1 after laser processing is inspected at the first stage 14-1, and the wafer W2 is subjected to laser processing at the second stage 14-2. In this case, the control device 50 moves the positions of the processing section 28 and the inspection section 30 in the Y direction according to the positions of the second stage 14-2 and the first stage 14-1 in the Y direction, respectively.

Further, the control device 50 moves the first stage 14-1 to the -X side and the second stage 14-2 to the +X side, depending on the positions of the processing section 28 and the inspection section 30 in the X direction. The control device 50 controls the vibration damping mechanism 58 to move the counterweights CW1 to CW3 so as to cancel the rotational moment generated when moving the first stage 14-1 and the second stage 14-2 in the X direction. let

In the example shown in FIG. 6, while the second stage 14-2 moves to the +X side, the counterweights CW2 and CW3 placed across the second stage 14-2 move in the opposite direction (-X side). move it. The counterweights CW1 to CW3 are operated in accordance with the operations of the first stage 14-1 and the second stage 14-2 during processing and inspection, thereby canceling out the rotational moment of the laser processing device 10. Thereby, the rotational moment of the laser processing device 10 can be canceled out.

Next, the control device 50 controls the X drive section 54-1, the θ drive section 56-1, the Y drive section 64, and the Z drive section 66 to relatively move the first stage 14-1 and the inspection section 30. While doing so, the laser processing area formed on the wafer W1 is inspected. Further, the control device 50 controls the X drive section 54-2, the θ drive section 56-2, the Y drive section 60, and the Z drive section 62 to relatively move the second stage 14-2 and the processing section 28. At the same time, laser processing is performed along the planned dividing line of the wafer W2 to form a laser processing area.

Note that in this embodiment, when the X stage 14 moves in the -X direction, the counterweights (CW1 to CW3) arranged to sandwich the X stage 14 are moved. but not limited to. One counterweight closest to the moving X stage 14 may be moved.

Further, the moving speed or moving acceleration of the counterweights (CW1 to CW3) may be adjusted according to the weight, moving speed or moving acceleration of the moving X stage 14 and the weight of the counterweights (CW1 to CW3). good. For example, the amount of movement of the counterweights (CW1 to CW3) may be adjusted according to the amount of movement of the X stage 14 during movement.

In addition, counterweights (CW1 to CW3) located on the opposite side (for example, point symmetrical) of the moving X stage 14 with respect to the center or center of gravity of the laser processing device 10 in the XY plane are set in the moving direction of the X stage 14. It may be configured to be movable in the opposite direction (for example, in a point-symmetrical direction). At this time, the momentum of the counterweights (CW1 to CW3) is adjusted according to the momentum of the X stage 14 during movement and the distance from the center or center of gravity of the X stage 14 and the counterweights (CW1 to CW3). Good too.

Further, the X stage 14 and the counterweights (CW1 to CW3) may be moved synchronously. That is, the start and stop timings of the movement of the X stage 14 and the counterweights (CW1 to CW3) may be made to coincide with each other.

FIG. 7 is a timing chart showing the procedure of laser processing according to the first embodiment of the present invention. In FIG. 7, a portion surrounded by a dotted line indicates a step using the processing section 28 (processing unit 28A), and a portion surrounded by a broken line indicates a step using the inspection section 30 (inspection unit 30A). Moreover, the positional relationship of the configuration of the laser processing apparatus 10 in the section P(i-1) shown in FIG. 7 corresponds to FIG. 5 in which processing and inspection are performed in the first stage 14-1 and the second stage 14-2, respectively. , the positional relationship in section P(i) corresponds to FIG. 6 where inspection and processing are performed at the first stage 14-1 and the second stage 14-2, respectively.

(Processing in second stage 14-2: steps S5 to S3)
In step S5 (2(i-1)), the control device 50 uses the inspection unit 30 to inspect the laser processing area formed on the wafer W (2(i-1)) (inspection step). At this time, the control device 50 moves the counterweights CW2 and CW3 placed across the second stage 14-2 according to the operation during the inspection (the operation of the second stage 14-2), and performs the laser processing. The vibrations of the device 10 are suppressed. When the inspection of the wafer W (2(i-1)) is completed, the control device 50 records the inspection results and outputs them via the input/output unit 52.

Next, the control device 50 releases the adsorption state of the wafer W (2(i-1)) to the wafer chuck C2, and uses the handler arm (not shown) to laser process the wafer W (2(i-1)). It is carried out (unloaded) from the apparatus 10 (step S6 (2(i-1))).

Next, the control device 50 prepares for processing the wafer W (2i) (steps S1 (2i) to S3 (2i)). First, the control device 50 carries (loads) the wafer W (2i) into the laser processing apparatus 10 using a handler arm (not shown) (step S1 (2i)).

Next, the control device 50 controls the Z drive section 66 to set the height of the inspection section 30 in the Z direction (step S2 (2i)). Then, the control device 50 acquires an image of the wafer W (2i) using the optical unit 30B, detects the position of the alignment pattern, detects the position of the wafer W (2i), and performs alignment (for example, in the θ and Y directions). alignment) is performed (step S3 (2i)).

(Processing in the first stage 14-1: Step S4)
On the other hand, the control device 50 executes step S4 (2i-1) in parallel with steps S5 (2 (i-1)) to S3 (2i) (processing step). That is, the control device 50 uses the processing unit 28 to perform laser processing on the wafer W (2i-1) held by suction on the first stage 14-1, and determines the scheduled division of the wafer W (2i-1). A laser processing area is formed along the line. At this time, the control device 50 moves the counterweights CW1 and CW3 placed across the first stage 14-1 according to the operation during processing (the operation of the first stage 14-1), and performs the laser processing. The vibrations of the device 10 are suppressed.

(Preparation for processing and inspection: Step S10)
When the processing on the wafer W (2i-1) in the first stage 14-1 and the preparation for processing on the wafer W (2i) in the second stage 14-2 (steps S1 (2i) to S3 (2i)) are completed, the control The apparatus 50 inspects the wafer W (2i-1) and prepares for processing the wafer W (2i) (step S10(i)). That is, the control device 50 controls the Y drive section 60 to move the processing section 28 to the second stage 14-2 side, and controls the Y drive section 64 to move the inspection section 30 to the first stage 14-1 side. move it. Further, the control device 50 controls the X drive units 54-1 and 54-2 to move the first stage 14-1 and the second stage 14-2 in the -X direction and the +X direction, respectively.

(Preparation in second stage 14-2: Step S10)
Next, the control device 50 controls the Z drive section 62 to set the height of the processing section 28 in the Z direction. Then, the control device 50 acquires an image of the wafer W (2i) using the optical unit 28B, detects the position of the alignment pattern, detects the position of the wafer W (2i), and connects the processing unit 28A and the wafer W (2i). ) (for example, alignment in the X, θ, Y, and Z directions).

(Preparation in the first stage 14-1: Step S10)
On the other hand, the control device 50 controls the Z drive section 66 to set the height of the inspection section 30 in the Z direction. Then, the control device 50 acquires an image of the wafer W (2i-1) using the optical unit 30B, detects the position of the alignment pattern, detects the position of the wafer W (2i-1), and connects the inspection unit 30A with the image of the wafer W (2i-1). Alignment (for example, positioning in the X, θ, Y, and Z directions) with the wafer W (2i-1) is performed.

(Processing in second stage 14-2: Step S4)
Next, the control device 50 uses the processing unit 28 to perform laser processing on the wafer W (2i) held by suction on the second stage 14-2, and processes the wafer W (2i) along the dividing line of the wafer W (2i). A laser processing area is formed (step S4 (2i)).

(Processing in the first stage 14-1: steps S5 to S3)
On the other hand, the control device 50 uses the inspection unit 30 to inspect the laser processing area formed on the wafer W (2i-1) (step S5 (2i-1)). When the inspection of the wafer W (2i-1) is completed, the control device 50 records the inspection results and outputs them via the input/output unit 52.

Next, the control device 50 unloads the wafer W (2i-1) to the wafer chuck C2 (step S6 (2i-1)), loads the wafer W (2i+1), and prepares for processing (step S1 (2i+1)). )~S3(2i+1)).

As described above, in this embodiment, steps S1 to S6 and S10 are alternately repeated in the first stage 14-1 and the second stage 14-2. Thereby, the occurrence of downtime of the processing section 28 and the inspection section 30 can be suppressed. By moving the counterweights CW1 to CW3 in accordance with the movement of the first stage 14-1 and the second stage 14-2, it becomes possible to suppress vibrations of the laser processing apparatus 10.

[Second embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG. 8. FIG. 8 is a plan view and a front view showing a laser processing apparatus according to a second embodiment of the present invention. In the following description, the same components as in the first embodiment are given the same reference numerals and the description thereof will be omitted.

As shown in FIG. 8, in the laser processing apparatus 10A according to the present embodiment, only one counterweight CW3 is disposed between the first stage 14-1 and the second stage 14-2. That is, in the laser processing apparatus 10A according to the present embodiment, the first stage 14-1, counterweight CW3 (guide rail G3), and second stage 14-2 are arranged in this order from the +Y side.

The control device 50 operates the counterweight CW3 so as to suppress vibrations of the laser processing device 10 (X stage 14) caused by operations during processing or inspection (operations of the X stage 14). Specifically, the counterweight CW3 is moved in the opposite direction to the moving direction of the X stage 14. For example, when performing the processing step and the inspection step in parallel, if the movement timing of the first stage 14-1 and the second stage 14-2 is shifted, even one counterweight CW3 can be used for the first stage 14-1 and the second stage 14-2. It becomes possible to suppress vibrations generated by the second stage 14-2.

According to this embodiment, since the number of counterweights is one, the size and weight of the laser processing apparatus 10A can be reduced compared to the first embodiment. Furthermore, according to this embodiment, the stroke in the Y direction can be shortened.

[Third embodiment]
Next, a third embodiment of the present invention will be described with reference to FIG. 9. FIG. 9 is a plan view and a front view showing a laser processing apparatus according to a third embodiment of the present invention. In the following description, the same components as those in each of the above embodiments are given the same reference numerals and the description thereof will be omitted.

As shown in FIG. 9, in the laser processing apparatus 10B according to the present embodiment, two counterweights CW1 and CW2 are arranged outside the first stage 14-1 and the second stage 14-2, respectively. That is, in the laser processing apparatus 10B according to the present embodiment, the order of counterweight CW1 (guide rail G1), first stage 14-1, second stage 14-2, and counterweight CW2 (guide rail G2) from the +Y side is The layout is as follows.

The control device 50 operates the counterweights CW1 and CW2 so as to suppress vibrations of the laser processing device 10 (X stage 14) caused by operations during processing or inspection (operations of the X stage 14). For example, the counterweight CW1 closest to the first stage 14-1 is moved in the opposite direction to the moving direction of the first stage 14-1, and the counterweight CW2 closest to the second stage 14-2 is moved to the second stage 14-1. -Move in the opposite direction to the moving direction of 2. Alternatively, with respect to the center or center of gravity of the laser processing device 10, the counterweight CW2 on the opposite side of the first stage 14-1 is moved in the opposite direction to the moving direction of the first stage 14-1, and the second stage 14- The counterweight CW1 on the opposite side of stage 2 may be moved in the opposite direction to the moving direction of second stage 14-2.

According to this embodiment, since the number of counterweights is two, the size and weight of the laser processing apparatus 10B can be reduced compared to the first embodiment. Furthermore, according to this embodiment, the stroke in the Y direction can be shortened.

[Fourth embodiment]
Next, a fourth embodiment of the present invention will be described with reference to FIG. 10. FIG. 10 is a plan view and a front view showing a laser processing apparatus according to a fourth embodiment of the present invention. In the following description, the same components as those in each of the above embodiments are given the same reference numerals and the description thereof will be omitted.

As shown in FIG. 10, in the laser processing apparatus 10C according to the present embodiment, two counterweights CW1 and CW2 are arranged outside the first stage 14-1 and the second stage 14-2, respectively. Two counterweights CW3 and CW4 are arranged inside the first stage 14-1 and the second stage 14-2, respectively. That is, in the laser processing apparatus 10C according to the present embodiment, from the +Y side, the counterweight CW1 (guide rail G1), the first stage 14-1, the counterweights CW3 and CW4 (guide rails G3 and G4), and the second stage 14. -2 and counterweight CW2 (guide rail G2) are arranged in this order. Here, the counterweights CW1 and CW3 are an example of a pair of first stage side counterweights arranged on both sides of the first stage 14-1, and the counterweights CW2 and CW4 are an example of a pair of first stage side counterweights arranged on both sides of the second stage 14-2. This is an example of a pair of second stage side counterweights arranged in FIG.

The control device 50 operates the counterweights CW1 to CW4 so as to suppress vibrations of the laser processing device 10 (X stage 14) caused by operations during processing or inspection (operation of the X stage 14). Specifically, counterweights CW1 and CW3 arranged to sandwich the first stage 14-1 are moved in the opposite direction to the moving direction of the first stage 14-1, and are moved so as to sandwich the second stage 14-2. The counterweights CW2 and CW4 disposed at are moved in the opposite direction to the moving direction of the second stage 14-2.

According to the present embodiment, since two counterweights are arranged to sandwich the first stage 14-1 and the second stage 14-2, the laser processing device The rotational moment of 10C can be canceled out more effectively. This makes it possible to enhance the vibration damping effect.

[Example]
Next, the vibration damping effect of the laser processing apparatus according to the above embodiment will be explained with reference to FIG. 11. FIG. 11 is a graph showing the relationship between the number of counterweights and the displacement of the laser processing device.

FIG. 11(a) shows the displacement during operation of the laser processing apparatus (comparative example) when no counterweight is provided. FIG. 11(b) corresponds to the case where one counterweight is provided (second embodiment), and FIG. 11(c) corresponds to the case where two counterweights are provided (third embodiment). .

Although the numerical values of elapsed time and displacement are omitted in FIG. 11, the scales of elapsed time and displacement in FIGS. 11(a) to (c) have the same size.

As shown in FIG. 11(a), if a counterweight is not provided, vibrations are generated in the laser processing apparatus due to the movement of the X stage, which affects the accuracy of laser processing and inspection for processing defects.

On the other hand, as shown in FIGS. 11(b) and (c), when a counterweight is provided, the laser processing device generated by the movement of the first stage 14-1 and the second stage 14-2 The vibrations of 10A and 10B are suppressed. Furthermore, the greater the number of counterweights, the more the vibration damping effect can be enhanced.

Note that in this embodiment, the moving directions of the first stage 14-1 and the second stage 14-2 are parallel to each other, but the present invention is not limited thereto. Even if the moving directions of the first stage 14-1 and the second stage 14-2 are non-parallel, it is possible to move parallel to the moving direction of the first stage 14-1 and the second stage 14-2. Vibration can be suppressed by providing a counterweight and a guide rail.

Further, in this embodiment, a case has been described in which the laser processing apparatus includes two X stages, but the present invention is not limited to this. Even when three or more X stages are provided, vibration can be suppressed by providing a counterweight and guide rail that can be moved parallel to the moving direction of each X stage. be.

In addition, although this embodiment has described the case where crack detection is performed as an inspection performed in parallel with processing in a laser processing apparatus equipped with a plurality of X stages, the present invention is not limited to this. It can also be applied to cases where other inspections are performed. Furthermore, although the inspection in this embodiment was performed on the workpiece W after laser processing, this embodiment is also applied to the inspection on the workpiece W before laser processing and is performed in parallel with the processing. Is possible. Moreover, although the processing in this embodiment is laser processing, it is possible to apply this embodiment to the case where processing other than laser processing (for example, blade dicing) is performed.

10, 10A, 10B, 10C...Laser processing device, 12...Base, 14-1...First stage, 14-2...Second stage, 16-1, 16-2...θ stage, 18...Y base, 20, 24...Y stage, 22, 26...Z stage, 28...processing section, 28A...processing unit, 28B...optical unit, 30...inspection section, 30A...inspection unit, 30B...optical unit, 50...control device, 52...input Output unit, 54-1, 54-2...X drive unit, 56-1, 56-2...θ drive unit, 58...vibration damping mechanism, 60, 64...Y drive unit, 62, 66...Z drive unit, C1 , C2...Wafer chuck, CW1-CW4...Counter weight, G1-G4...Guide rail

Claims (9)

a plurality of stages configured to be movable independently of each other in a first direction;
processing means configured to be movable in a second direction orthogonal to the first direction and processing a first workpiece held on one of the plurality of stages;
Inspection means configured to be movable in the second direction independently of the processing means and inspecting a second workpiece held on another stage of the plurality of stages;
at least one counterweight configured to be movable in the first direction;
counterweight control means for moving the at least one counterweight so as to suppress vibrations generated by movement of the one stage or the other stage;
The plurality of stages include a first stage and a second stage arranged in parallel in the second direction,
The at least one counterweight includes a first counterweight disposed on a side of the first stage opposite to a side on which the second stage is disposed, and a side of the second stage on which the first stage is disposed. and a second counterweight disposed on the opposite side . a plurality of stages configured to be movable independently of each other in a first direction;
processing means configured to be movable in a second direction orthogonal to the first direction and processing a first workpiece held on one of the plurality of stages;
Inspection means configured to be movable in the second direction independently of the processing means and inspecting a second workpiece held on another stage of the plurality of stages;
at least one counterweight configured to be movable in the first direction;
counterweight control means for moving the at least one counterweight so as to suppress vibrations generated by movement of the one stage or the other stage;
The plurality of stages include a first stage and a second stage arranged in parallel in the second direction,
The processing apparatus, wherein the at least one counterweight includes a third counterweight disposed between the first stage and the second stage. a plurality of stages configured to be movable independently of each other in a first direction;
processing means configured to be movable in a second direction orthogonal to the first direction and processing a first workpiece held on one of the plurality of stages;
Inspection means configured to be movable in the second direction independently of the processing means and inspecting a second workpiece held on another stage of the plurality of stages;
at least one counterweight configured to be movable in the first direction;
counterweight control means for moving the at least one counterweight so as to suppress vibrations generated by movement of the one stage or the other stage;
The plurality of stages include a first stage and a second stage arranged in parallel in the second direction,
The at least one counterweight includes a pair of first stage side counterweights arranged on both sides of the first stage and a pair of second stage side counterweights arranged on both sides of the second stage . Processing equipment. The counterweight control means moves the at least one counterweight in a direction opposite to the moving direction of the one stage or the other stage.
The processing device according to any one of claims 1 to 3 . The counterweight control means moves the at least one counterweight in a direction opposite to a moving direction of a stage facing the processing means among the one stage or the other stage.
The processing device according to any one of claims 1 to 3 . The processing apparatus according to any one of claims 1 to 5 , wherein the processing means processes the workpiece with a laser beam. a plurality of stages movable independently of each other in a first direction; a processing means movable in a second direction perpendicular to the first direction; and a plurality of stages movable in the second direction independently of the processing means. A processing method using an inspection means,
moving the processing means to a position facing one of the plurality of stages;
moving the inspection means to a position facing another stage among the plurality of stages;
processing a first workpiece held on the one stage by the processing means while moving the one stage with respect to the processing means;
inspecting a second workpiece held on the other stage by the inspection means while moving the other stage with respect to the inspection means;
moving at least one counterweight so as to suppress vibrations generated by movement of the one stage or the other stage ,
The plurality of stages include a first stage and a second stage arranged in parallel in the second direction,
The at least one counterweight includes a first counterweight disposed on a side of the first stage opposite to a side on which the second stage is disposed, and a side of the second stage on which the first stage is disposed. and a second counterweight disposed on the opposite side . a plurality of stages movable independently of each other in a first direction; a processing means movable in a second direction perpendicular to the first direction; and a plurality of stages movable in the second direction independently of the processing means. A processing method using an inspection means,
moving the processing means to a position facing one of the plurality of stages;
moving the inspection means to a position facing another stage among the plurality of stages;
processing a first workpiece held on the one stage by the processing means while moving the one stage with respect to the processing means;
inspecting a second workpiece held on the other stage by the inspection means while moving the other stage with respect to the inspection means;
moving at least one counterweight so as to suppress vibrations generated by movement of the one stage or the other stage,
The plurality of stages include a first stage and a second stage arranged in parallel in the second direction,
The processing method, wherein the at least one counterweight includes a third counterweight disposed between the first stage and the second stage. a plurality of stages movable independently of each other in a first direction; processing means movable in a second direction perpendicular to the first direction; and a plurality of stages movable in the second direction independently of the processing means. A processing method using an inspection means,
moving the processing means to a position facing one of the plurality of stages;
moving the inspection means to a position facing another stage among the plurality of stages;
processing a first workpiece held on the one stage by the processing means while moving the one stage with respect to the processing means;
inspecting a second workpiece held on the other stage by the inspection means while moving the other stage with respect to the inspection means;
moving at least one counterweight so as to suppress vibrations generated by movement of the one stage or the other stage,
The plurality of stages include a first stage and a second stage arranged in parallel in the second direction,
The at least one counterweight includes a pair of first stage side counterweights arranged on both sides of the first stage and a pair of second stage side counterweights arranged on both sides of the second stage. Method.

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