JP2021061280A - Processing device and method - Google Patents

Abstract

To provide a processing device and method capable of reducing a downtime of the processing device and suppressing vibration when processing and inspecting a workpiece.SOLUTION: A processing method includes the steps of moving processing means (28) to a position facing one of a plurality of stages (ST), moving inspection means (30) to a position facing the other stage from among the plurality of stages, processing a first workpiece (W) held in one stage by the processing means while moving one stage with respect to the processing means, inspecting a second workpiece (W) held in the other stage by the inspection means while moving the other stage to the inspection means, and moving at least one counterweight (CW1 to CW4) so as to suppress the vibration generated by the movement of one stage or the other stage.SELECTED DRAWING: Figure 1

Description

The present invention relates to a processing apparatus and method, and relates to a processing apparatus and method for dicing a workpiece such as a wafer on which a semiconductor device or an electronic component is formed.

A laser processing device (laser) that aligns a condensing point inside a wafer such as silicon and irradiates laser light along the planned division line to form a laser processing region inside the wafer that is the starting point of cutting along the planned division line. A dicing device) is known (for example, Patent Document 1). The wafer on which the laser processing region is formed is then divided along the planned division line by a division process such as expanding or braking, and is divided into individual chips.

Japanese Unexamined Patent Publication No. 2016-195265 JP-A-2019-149541

Generally, in a laser processing apparatus, processing is performed for each wafer in the order of processing preparation (wafer loading and alignment) → processing operation → post-processing (inspection and unloading). However, if the above series of processing is repeated for each wafer, there is a problem that the processing takes time and the production efficiency is lowered.

In order to improve the production efficiency of the laser processing apparatus, it is preferable to shorten the execution time of the entire processing. When shortening the execution time of the entire processing, specifically, "reducing the machining operation time" and "reducing the processing time other than machining" are performed.

First, in order to realize "reduction of machining operation time", it is necessary to increase the machining speed and acceleration. However, there are the following problems in order to increase the machining speed and acceleration.
(1) Larger motor used for relative movement of wafers, etc. (2) Higher autofocus response (3) Higher laser output and higher repetition frequency (4) Increased vibration of equipment due to improved acceleration Of the above (1) to (4), the autofocus response of (2) may be reduced by the influence of the vibration of the laser processing apparatus of (4). Therefore, it is difficult to significantly improve the autofocus response.

Next, in order to realize "shortening of processing time other than processing", speeding up of the wafer transfer system, improvement of stage feed speed, optimization of alignment operation, and the like can be mentioned. However, it is difficult to dramatically reduce the processing time with these methods.

By the way, the laser processing optical unit (processing apparatus) is stopped while processing other than processing (for example, inspection) is being performed. If the downtime of the processing device, which accounts for the majority of the price of the laser processing device, becomes long, the cost-effectiveness of the laser processing device becomes reduced.

When production efficiency is improved and a large amount of processing can be performed in a short time, inspection of processing defects and the like becomes important. When a large number of products are rigorously inspected for processing defects, it is expected that the time required for inspection of the processing state (measurement of internal cracks, etc.) will be long.

In order to improve the production efficiency of a laser processing apparatus, an apparatus capable of performing machining and inspection at a plurality of stages (wafer tables) has been proposed (see Patent Document 2).

In the laser processing apparatus (laser dicing apparatus) described in Patent Document 2, the ratio of the weight of the stage and its driving device tightening to the weight of the laser processing apparatus is high. Therefore, vibration occurs when the stage is transferred, which affects the accuracy of laser machining and inspection.

The present invention has been made in view of such circumstances, and provides a processing apparatus and method capable of reducing downtime of the processing apparatus and suppressing vibration when machining and inspecting a workpiece. The purpose is.

In order to solve the above problems, the processing apparatus according to the first aspect of the present invention has a plurality of stages configured to be movable independently of each other in the first direction, and a second direction orthogonal to the first direction. A processing means for processing a first work that is movable and held in one of a plurality of stages, and a processing means that is movable in a second direction independently of the processing means, and is configured to be movable in a plurality of stages. Of these, an inspection means for inspecting a second work held on another stage, at least one counter weight configured to be movable in the first direction, and vibration generated by the movement of one stage or another stage. It is provided with a counterweight control means for moving at least one counterweight so as to suppress it.

In the processing apparatus according to the second aspect of the present invention, in the first aspect, the counterweight control means moves at least one counterweight in the direction opposite to the moving direction of one stage or another stage.

In the processing apparatus according to the third aspect of the present invention, in the first aspect, the counterweight control means is at least one of one stage or another stage in the direction opposite to the moving direction of the stage facing the processing means. Move the counterweight.

In the processing apparatus according to the fourth aspect of the present invention, in any one of the first to third aspects, the plurality of stages include a first stage and a second stage arranged side by side in the second direction, and at least. One counterweight is arranged on the side opposite to the side where the second stage of the first stage is arranged and the side opposite to the side where the first stage of the second stage is arranged. Includes the second counterweight.

In the processing apparatus according to the fifth aspect of the present invention, in any one of the first to fourth aspects, the plurality of stages include a first stage and a second stage arranged side by side in the second direction, and at least. One counterweight includes a third counterweight placed between the first and second stages.

In the processing apparatus according to the sixth aspect of the present invention, in any one of the first to third aspects, the plurality of stages include a first stage and a second stage arranged side by side in the second direction, and at least. One counterweight includes a pair of first stage side counterweights arranged on both sides of the first stage and a pair of second stage side counterweights arranged on both sides of the second stage.

In the processing apparatus according to the seventh aspect of the present invention, in any one of the first to sixth aspects, the processing means laser-machines the work.

The machining method according to the eighth aspect of the present invention includes a step of moving the machining means to a position facing one of the plurality of stages and an inspection means at a position of the plurality of stages facing the other stage. While moving one stage with respect to the processing means, the step of moving the first work held by the one stage by the processing means, and moving the other stage with respect to the inspection means. , The step of inspecting the second work held in the other stage by the inspection means, and the step of moving at least one counter weight so as to suppress the vibration generated by the movement of one stage or the other stage. Including.

According to the present invention, it is possible to shorten the downtime of the processing apparatus when processing and inspecting the work, and it is possible to suppress vibration.

FIG. 1 is a plan view showing a laser processing apparatus according to the first embodiment of the present invention. FIG. 2 is a front view showing a laser processing apparatus according to the first embodiment of the present invention. FIG. 3 is a side view showing a laser processing apparatus according to the first embodiment of the present invention. FIG. 4 is a block diagram showing a laser processing apparatus according to the first embodiment of the present invention. FIG. 5 is a plan view when processing and inspecting wafers in the first and second stages, respectively. FIG. 6 is a plan view when inspecting and processing wafers in the first and second stages, respectively. FIG. 7 is a timing chart showing a laser machining procedure according to the first embodiment of the present invention. FIG. 8 is a plan view showing a laser processing apparatus according to a second embodiment of the present invention. FIG. 9 is a plan view showing a laser processing apparatus according to a third embodiment of the present invention. FIG. 10 is a plan view showing a laser processing apparatus according to a fourth embodiment of the present invention. FIG. 11 is a graph showing the relationship between the number of counterweights and the displacement of the laser processing apparatus.

Hereinafter, embodiments of the processing apparatus and method according to the present invention will be described with reference to the accompanying drawings.

[First Embodiment]
(Processing equipment)
1 to 3 are a plan view, a front view, and a side view showing a processing apparatus (laser processing apparatus) according to the first embodiment of the present invention, respectively. In the following description, a three-dimensional Cartesian coordinate system will be used.

As shown in FIGS. 1 to 3, the laser machining apparatus 10 according to the present embodiment includes a first stage 14-1, a second stage 14-2, a machining section 28, and an inspection section 30. The laser machining apparatus 10 can perform machining and inspection of workpieces (wafers) in parallel (for example, simultaneously) in the first stage 14-1 and the second stage 14-2.

The laser processing device 10 is provided on a base 12 parallel to a horizontal plane (XY plane). The base 12 forms a reference plane for the laser machining apparatus 10.

The first stage 14-1 and the second stage 14-2 (hereinafter, also referred to as the X stage) are arranged (parallel) side by side in the Y direction (second direction), and are respectively arranged in the X direction (first direction). It is attached so as to be movable along the X1 axis and the X2 axis extending in. Here, as a mechanism for moving the first stage 14-1 and the second stage 14-2, for example, the nuts provided in the first stage 14-1 and the second stage 14-2 and their nuts are used. A mechanism capable of reciprocating and linearly moving the first stage 14-1 and the second stage 14-2 in the X direction, such as a ball screw mechanism including a ball screw to be screwed, a linear motor or a rack and pinion mechanism, is used. It is possible.

Θ stages 16-1 and 16-2 are attached to the first stage 14-1 and the second stage 14-2, respectively. Wafer chucks C1 and C2 are attached to the θ stages 16-1 and 16-2, respectively. The θ stages 16-1 and 16-2 rotate the wafer chucks C1 and C2 around their respective rotation axes (for example, the central axis) (in the θ direction).

A suction hole for sucking air is formed on the surfaces of the wafer chucks C1 and C2. The wafer chucks C1 and C2 adsorb and hold the wafers W1 and W2 carried into the laser processing apparatus 10 as targets for laser processing, respectively.

As described above, the first stage 14-1 and the second stage 14-2 have similar configurations to each other. Therefore, in the following description, the configurations and operations common to both the first stage 14-1 side and the second stage 14-2 side may be collectively described by omitting the branch numbers.

A Y base 18 is provided above the base 12. The Y base 18 forms a reference plane along the Y direction. The Y base 18 is supported by a support column extending in the Z direction from the base 12. A Y1 axis and a Y2 axis extending in the Y direction are attached to the Y base 18, respectively. As shown in FIGS. 2 and 3, the Y1 axis is arranged so as to be offset in the + Z direction and the + X direction with respect to the Y2 axis.

A Y-axis moving stage 20 for processing and a Y-axis moving stage 24 for inspection (hereinafter referred to as Y stages 20 and 24) are attached to the Y1 axis and the Y2 axis, respectively.

A machining portion 28 is attached to the Y stage 20 via a Z-axis moving stage for machining (hereinafter, referred to as a Z stage) 22. The processing unit (processing means) 28 can be moved in the YZ direction by the Y stage 20 and the Z stage 22, respectively. As the Y stage 20 and the Z stage 22, it is possible to use a mechanism (for example, a ball screw mechanism, a linear motor, a rack and pinion mechanism, etc.) capable of reciprocating and linearly moving the machined portion 28 in the YZ direction, respectively. ..

An inspection unit 30 is attached to the Y stage 24 via an inspection Z-axis moving stage (hereinafter, referred to as a Z stage) 26. The inspection unit (inspection means) 30 can be moved in the YZ direction by the Y stage 24 and the Z stage 26, respectively. As the Y stage 24 and the Z stage 26, it is possible to use a mechanism (for example, a ball screw mechanism, a linear motor, a rack and pinion mechanism, etc.) capable of reciprocating and linearly moving the inspection unit 30 in the YZ direction, respectively. ..

The processing unit 28 includes a laser processing optical unit (hereinafter referred to as a processing unit) 28A and an alignment optical unit (hereinafter referred to as an optical unit) 28B. The processing unit 28A and the optical unit 28B can be integrally moved in the YZ direction.

The processing unit 28A includes a laser oscillator and a condenser lens (see Japanese Patent Application Laid-Open No. 2004-111946), and the laser light output from the laser oscillator is brought into the inside of the wafer W (W1 or W2) by the condenser lens. Condensing. As a result, a laser processing region serving as a starting point for cutting the wafer W is formed inside the wafer W.

The optical unit 28B includes an image pickup element (for example, an indium gallium arsenide (InGaAs) photodiode or a CCD (Charge-Coupled Device) image sensor) that captures an image of the wafer W. The control device 50 (see FIG. 4) detects the position of the alignment pattern from the image of the wafer W captured by the optical unit 28B, and controls the X drive unit 54, the θ drive unit 56, the Y drive unit 60, and the Z drive unit 62. Then, the processing unit 28A and the wafer W are aligned.

The inspection unit 30 includes an inspection optical unit (hereinafter referred to as an inspection unit) 30A and an alignment optical unit (hereinafter referred to as an optical unit) 30B. The inspection unit 30A and the optical unit 30B can be integrally moved in the YZ direction.

The inspection unit 30A measures the length of the crack extending from the laser processing region. As the inspection unit 30A, for example, the crack detection device described in JP-A-2017-133997 can be applied.

The optical unit 30B includes an image pickup element (for example, an indium gallium arsenide (InGaAs) photodiode or a CCD (Charge-Coupled Device) image sensor) that captures an image of the wafer W. The control device 50 detects the position of the alignment pattern from the image of the wafer W captured by the optical unit 30B, controls the X drive unit 54, the θ drive unit 56, the Y drive unit 64, and the Z drive unit 66, and controls the inspection unit. Align 30A with wafer W.

In the laser machining apparatus 10 according to the present embodiment, the machining section 28 is arranged on the + X side of the inspection section 30 due to the positional relationship between the Y stages 20 and 24, but the present invention is not limited to this. For example, the inspection unit 30 may be arranged on the + X side of the processing unit 28.

Counterweights CW1 to CW3 are arranged on the base 12. The counterweights CW1 to CW3 can move along the guide rails G1 to G3 extending in the X direction, respectively.

As shown in FIG. 1, on the base 12, the counterweight CW1, the first stage 14-1, the counterweight CW3, the second stage 14-2, and the counterweight CW2 are arranged in this order from the + Y side. The counterweights CW1 to CW3 and the guide rails G1 to G3 suppress the vibration of the laser processing apparatus 10 generated when the first stage 14-1 and the second stage 14-2 are moved along the X1 axis and the X2 axis. It functions as a vibration damping mechanism 58 (see FIGS. 4 to 7).

Here, the weights of the counterweights CW1 to CW3 can cancel the rotational moment generated when the first stage 14-1 and the second stage 14-2 are moved along the X1 axis and the X2 axis, respectively. It has been adjusted. Counterweights CW1 and CW2 arranged outside the first stage 14-1 and the second stage 14-2, and counters arranged inside the first stage 14-1 and the second stage 14-2. The weights of the weights CW3 may be different.

The counterweights CW1 to CW3 and the first stage 14-1 and the second stage 14 can cancel the rotational moment generated when the first stage 14-1 and the second stage 14-2 are moved. The positional relationship with -2 (for example, the distance in the Y direction or the height in the Z direction) may be adjusted.

(Control system for laser machining equipment)
FIG. 4 is a block diagram showing a laser processing apparatus according to the first embodiment of the present invention.

As shown in FIG. 4, the laser machining apparatus 10 according to the present embodiment includes a control device 50, an input / output unit 52, an X drive unit 54-1 and 54-2, a θ drive unit 56-1 and 56-2, and a control unit. It includes a vibration mechanism 58, a Y drive unit 60, a Z drive unit 62, a Y drive unit 64, and a Z drive unit 66.

The control device 50 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a storage device (for example, a hard disk, etc.) and the like. In the control device 50, various programs such as a control program stored in the ROM are expanded in the RAM, and the programs expanded in the RAM are executed by the CPU to realize the functions of each part of the laser processing apparatus 10. ..

The input / output unit 52 displays an operation member (for example, a keyboard, a pointing device, etc.) for receiving an operation input from a user, a GUI (Graphical User Interface) for operating the laser processing apparatus 10, and the like (for example). , Liquid crystal display) and the like.

The X drive units 54-1 and 54-2 are power sources (for example, motors) for moving the first stage 14-1 and the second stage 14-2 attached to the X1 axis and the X2 axis in the X direction, respectively. ) Is included. The X drive units 54-1 and 54-2 are examples of the first drive device.

The θ drive units 56-1 and 56-2 include a power source (for example, a motor) for rotating the wafer chucks C1 and C2 attached to the θ stages 16-1 and 16-2 in the θ direction, respectively. There is.

The Y drive unit 60 includes a power source (for example, a motor) for moving the processing unit 28 attached to the Y stage 20 via the Z stage 22 in the Y direction.

The Z drive unit 62 includes a power source (for example, a motor) for moving the processed unit 28 attached to the Z stage 22 in the Z direction.

The Y drive unit 64 includes a power source (for example, a motor) for moving the inspection unit 30 attached to the Y stage 24 via the Z stage 26 in the Y direction.

The Z drive unit 66 includes a power source (for example, a motor) for moving the inspection unit 30 attached to the Z stage 26 in the Y direction.

The Y drive units 60 and 64 and the Z drive units 62 and 66 are examples of the second drive device.

The vibration damping mechanism 58 includes a power source (for example, a motor) for moving the counterweights CW1 to CW3 along the guide rails G1 to G3, respectively. The vibration damping mechanism 58 moves the counterweights CW1 to CW3 in the direction, movement amount, and movement according to the movement direction, movement amount, movement speed, and movement acceleration of the first stage 14-1 and the second stage 14-2. Control speed and movement acceleration. Thereby, the vibration of the laser processing apparatus 10 generated when the first stage 14-1 and the second stage 14-2 are moved can be suppressed. Here, the counterweights CW1 to CW3 are examples of the first to third counterweights, respectively, and the control device 50 and the vibration damping mechanism 58 are examples of the counterweight control means.

(Processing method)
Next, the control of the vibration damping mechanism 58 during laser machining will be described with reference to FIGS. 5 to 7.

In the following description, an example in which laser machining and inspection are sequentially performed on the wafers W0, W1, W2, W3, ..., W (2i-1), W (2i), ... Will be described. It should be noted that i = 1, 2, 3, ... Wafers W1, W3, ..., W (2i-1), ... Are processed in the first stage 14-1, and wafers W0, W2, ..., W (2i), ... Are processed in the second stage 14-2. .. That is, first, the wafers W0 and W1 are loaded into the second stage 14-2 and the first stage 14-1, respectively, and the wafer W0 is laser-machined. Next, the inspection of the wafer W0 in the second stage 14-2 and the laser machining of the wafer W1 in the first stage 14-1 are performed in parallel.

FIG. 5 is a plan view when the wafers are processed and inspected in the first and second stages, respectively, and FIG. 6 is a plan view when the wafers are inspected and processed in the first and second stages, respectively. is there.

In the example shown in FIG. 5, the first stage 14-1 performs laser processing on the wafer W1, and the second stage 14-2 inspects the wafer W0 after laser processing. In this case, first, the control device 50 moves the positions of the processing unit 28 and the inspection unit 30 in the Y direction according to the positions of the first stage 14-1 and the second stage 14-2 in the Y direction, respectively. That is, the control device 50 moves the processing unit 28 and the inspection unit 30 so as to face the first stage 14-1 and the second stage 14-2, respectively.

Further, the control device 50 moves the first stage 14-1 to the + X side and the second stage 14-2 to the −X side according to the positions of the processing unit 28 and the inspection unit 30 in the X direction. The control device 50 controls the vibration damping mechanism 58 to move the counterweights CW1 to CW3 so as to cancel the rotational moment generated when the first stage 14-1 and the second stage 14-2 are moved in the X direction. Let me.

In the example shown in FIG. 5, the first stage 14-1 moves to the + X side, while the counterweights CW1 and CW3 arranged across the first stage 14-1 move in the opposite direction (-X side). Move. Then, the counterweights CW1 to CW3 can be operated according to the operations of the first stage 14-1 and the second stage 14-2 at the time of processing and inspection to cancel the rotational moment of the laser processing apparatus 10.

Next, the control device 50 performs laser processing on the wafer W1 and inspection on the wafer W0 after the laser processing in parallel. Specifically, the control device 50 controls the X drive unit 54-1, the θ drive unit 56-1, the Y drive unit 60, and the Z drive unit 62 to control the first stage 14-1 and the machining unit 28. While moving relative to each other, laser machining is performed along the planned division line of the wafer W1 to form a laser machining region. Further, the control device 50 controls the X drive unit 54-2, the θ drive unit 56-2, the Y drive unit 64, and the Z drive unit 66 to relatively move the second stage 14-2 and the inspection unit 30. At the same time, the laser processing region formed on the wafer W0 is inspected (measurement of crack length).

Next, when the inspection is completed, the wafer W0 is unloaded from the laser processing apparatus 10 by a handler arm (not shown). Then, the next wafer W2 is carried (loaded) into the laser processing apparatus 10 by a handler arm (not shown), placed on the wafer chuck C2, and attracted and held.

Next, as shown in FIG. 6, in the first stage 14-1, the wafer W1 after laser machining is inspected, and in the second stage 14-2, the wafer W2 is laser machined. In this case, the control device 50 moves the positions of the processing unit 28 and the inspection unit 30 in the Y direction according to the positions of the second stage 14-2 and the first stage 14-1 in the Y direction, respectively.

Further, the control device 50 moves the first stage 14-1 to the −X side and the second stage 14-2 to the + X side according to the positions of the processing unit 28 and the inspection unit 30 in the X direction. The control device 50 controls the vibration damping mechanism 58 to move the counterweights CW1 to CW3 so as to cancel the rotational moment generated when the first stage 14-1 and the second stage 14-2 are moved in the X direction. Let me.

In the example shown in FIG. 6, the second stage 14-2 moves to the + X side, while the counterweights CW2 and CW3 arranged across the second stage 14-2 move in the opposite direction (-X side). Move. Then, the counterweights CW1 to CW3 are operated according to the operations of the first stage 14-1 and the second stage 14-2 at the time of processing and inspection to cancel the rotational moment of the laser processing apparatus 10. Thereby, the rotational moment of the laser processing apparatus 10 can be canceled.

Next, the control device 50 controls the X drive unit 54-1, the θ drive unit 56-1, the Y drive unit 64, and the Z drive unit 66 to move the first stage 14-1 and the inspection unit 30 relative to each other. While doing so, the laser processing region formed on the wafer W1 is inspected. Further, the control device 50 controls the X drive unit 54-2, the θ drive unit 56-2, the Y drive unit 60, and the Z drive unit 62 to relatively move the second stage 14-2 and the machining unit 28. At the same time, laser machining is performed along the planned division line of the wafer W2 to form a laser machining region.

In the present embodiment, when the X stage 14 moves in the −X direction, the counter weights (CW1 to CW3) arranged so as to sandwich the X stage 14 are moved. Not limited to. The one counterweight closest to the moving X stage 14 may be moved.

Further, the moving speed or moving acceleration of the counter weights (CW1 to CW3) may be adjusted according to the weight, moving speed or moving acceleration of the moving X stage 14 and the weight of the counter weights (CW1 to CW3). Good. For example, the momentum of the counterweights (CW1 to CW3) may be adjusted according to the momentum of the movement of the X stage 14.

Further, the counter weights (CW1 to CW3) located on the opposite side (for example, point symmetry) of the moving X stage 14 with respect to the center or the center of gravity of the laser processing apparatus 10 in the XY plane are set as the moving direction of the X stage 14. The configuration may be such that it can be moved in the opposite direction (for example, the direction in which it becomes point-symmetrical). At this time, the momentum of the counterweights (CW1 to CW3) is adjusted according to the momentum of the movement of the X stage 14 and the distance from the center or the center of gravity of the X stage 14 and the counterweights (CW1 to CW3). May be good.

Further, the X stage 14 and the counter weights (CW1 to CW3) may be moved in synchronization with each other. That is, the start and stop timings of the movements of the X stage 14 and the counterweights (CW1 to CW3) may be matched.

FIG. 7 is a timing chart showing a laser machining procedure according to the first embodiment of the present invention. In FIG. 7, the portion surrounded by the dotted line indicates the step of using the processing unit 28 (processing unit 28A), and the portion surrounded by the broken line indicates the step of using the inspection unit 30 (inspection unit 30A). Further, the positional relationship of the configuration of the laser machining apparatus 10 in the section P (i-1) shown in FIG. 7 corresponds to FIG. 5 in which machining and inspection are performed in the first stage 14-1 and the second stage 14-2, respectively. The positional relationship in the section P (i) corresponds to FIG. 6 in which inspection and processing are performed in the first stage 14-1 and the second stage 14-2, respectively.

(Processing in the second stage 14-2: steps S5 to S3)
In step S5 (2 (i-1)), the control device 50 inspects the laser processing region formed on the wafer W (2 (i-1)) by using the inspection unit 30 (inspection step). At this time, the control device 50 moves the counterweights CW2 and CW3 arranged across the second stage 14-2 according to the operation at the time of inspection (the operation of the second stage 14-2) to perform laser machining. The vibration of the device 10 is suppressed. Then, when the inspection of the wafer W (2 (i-1)) is completed, the control device 50 records the inspection result and outputs it via the input / output unit 52.

Next, the control device 50 releases the adsorption state of the wafer W (2 (i-1)) on the wafer chuck C2, and laser-machines the wafer W (2 (i-1)) by a handler arm (not shown). Unloading from the device 10 (step S6 (2 (i-1))).

Next, the control device 50 prepares for processing the wafer W (2i) (steps S1 (2i) to S3 (2i)). First, the control device 50 carries (loads) the wafer W (2i) into the laser processing device 10 by a handler arm (not shown) (step S1 (2i)).

Next, the control device 50 controls the Z drive unit 66 to set the height of the inspection unit 30 in the Z direction (step S2 (2i)). Then, the control device 50 acquires an image of the wafer W (2i) by the optical unit 30B, detects the position of the alignment pattern, detects the position of the wafer W (2i), and aligns (for example, the θ and Y directions). Alignment) (step S3 (2i)).

(Processing in the first stage 14-1: step S4)
On the other hand, the control device 50 executes step S4 (2i-1) in parallel with steps S5 (2 (i-1)) to S3 (2i) (machining step). That is, the control device 50 performs laser machining on the wafer W (2i-1) attracted and held by the first stage 14-1 by using the machining section 28, and plans to divide the wafer W (2i-1). A laser machining area is formed along the line. At this time, the control device 50 moves the counter weights CW1 and CW3 arranged so as to sandwich the first stage 14-1 according to the operation at the time of processing (the operation of the first stage 14-1), and performs laser processing. The vibration of the device 10 is suppressed.

(Preparation for processing and inspection: step S10)
Control when the machining of the wafer W (2i-1) in the first stage 14-1 and the machining preparation for the wafer W (2i) in the second stage 14-2 (steps S1 (2i) to S3 (2i)) are completed. The apparatus 50 inspects the wafer W (2i-1) and prepares for processing the wafer W (2i) (step S10 (i)). That is, the control device 50 controls the Y drive unit 60 to move the processing unit 28 to the second stage 14-2 side, and controls the Y drive unit 64 to move the inspection unit 30 to the first stage 14-1 side. Move. Further, the control device 50 controls the X drive units 54-1 and 54-2 to move the first stage 14-1 and the second stage 14-2 in the −X direction and the + X direction, respectively.

(Preparation in the second stage 14-2: step S10)
Next, the control device 50 controls the Z drive unit 62 to set the height of the processing unit 28 in the Z direction. Then, the control device 50 acquires an image of the wafer W (2i) by the optical unit 28B, detects the position of the alignment pattern, detects the position of the wafer W (2i), and processes the processing unit 28A and the wafer W (2i). ) (For example, alignment in the X, θ, Y and Z directions).

(Preparation in the first stage 14-1: step S10)
On the other hand, the control device 50 controls the Z drive unit 66 to set the height of the inspection unit 30 in the Z direction. Then, the control device 50 acquires an image of the wafer W (2i-1) by the optical unit 30B, detects the position of the alignment pattern, detects the position of the wafer W (2i-1), and sets the inspection unit 30A. Alignment with the wafer W (2i-1) (for example, alignment in the X, θ, Y and Z directions) is performed.

(Processing in the second stage 14-2: step S4)
Next, the control device 50 laser-machines the wafer W (2i) attracted and held by the second stage 14-2 by using the processing unit 28, and follows the scheduled division line of the wafer W (2i). To form a laser machining region (step S4 (2i)).

(Processing in the first stage 14-1: Steps S5 to S3)
On the other hand, the control device 50 inspects the laser processing region formed on the wafer W (2i-1) by using the inspection unit 30 (step S5 (2i-1)). Then, when the inspection of the wafer W (2i-1) is completed, the control device 50 records the inspection result and outputs it via the input / output unit 52.

Next, the control device 50 unloads the wafer W (2i-1) onto the wafer chuck C2 (step S6 (2i-1)), loads the wafer W (2i + 1), and prepares for processing (step S1 (2i + 1)). ) ~ S3 (2i + 1)).

As described above, in the present embodiment, steps S1 to S6 and S10 are alternately repeated in the first stage 14-1 and the second stage 14-2. As a result, it is possible to suppress the occurrence of downtime in the processing unit 28 and the inspection unit 30. Then, by moving the counterweights CW1 to CW3 in accordance with the movement of the first stage 14-1 and the second stage 14-2, it becomes possible to suppress the vibration of the laser processing apparatus 10.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 8 is a plan view and a front view showing the laser processing apparatus according to the second embodiment of the present invention. In the following description, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 8, in the laser processing apparatus 10A according to the present embodiment, only one counterweight CW3 is arranged between the first stage 14-1 and the second stage 14-2. That is, in the laser processing apparatus 10A according to the present embodiment, the first stage 14-1, the counterweight CW3 (guide rail G3), and the second stage 14-2 are arranged in this order from the + Y side.

The control device 50 operates the counterweight CW3 so as to suppress the vibration of the laser processing device 10 (X stage 14) generated by the operation during processing or inspection (operation of the X stage 14). Specifically, the counterweight CW3 is moved in the direction opposite to the moving direction of the X stage 14. For example, when the machining step and the inspection step are performed in parallel, if the movement timings of the first stage 14-1 and the second stage 14-2 are shifted, even one counterweight CW3 can be used for the first stage 14-1 and the first stage 14-1. It becomes possible to suppress the vibration generated by the second stage 14-2.

According to the present embodiment, since the number of counterweights is one, the size of the laser processing apparatus 10A can be reduced and the weight can be reduced as compared with the first embodiment. Further, according to the present embodiment, the stroke in the Y direction can be shortened.

[Third Embodiment]
Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 9 is a plan view and a front view showing the laser processing apparatus according to the third embodiment of the present invention. In the following description, the same components as those of the above-described embodiments will be designated by the same reference numerals and description thereof will be omitted.

As shown in FIG. 9, in the laser processing apparatus 10B according to the present embodiment, two counterweights CW1 and CW2 are arranged outside the first stage 14-1 and the second stage 14-2, respectively. That is, in the laser processing apparatus 10B according to the present embodiment, the counterweight CW1 (guide rail G1), the first stage 14-1, the second stage 14-2, and the counterweight CW2 (guide rail G2) are in this order from the + Y side. It is the arrangement of.

The control device 50 operates the counterweights CW1 and CW2 so as to suppress the vibration of the laser processing device 10 (X stage 14) generated by the operation during processing or inspection (operation of the X stage 14). For example, the counterweight CW1 closest to the first stage 14-1 is moved in the direction opposite to the moving direction of the first stage 14-1, and the counterweight CW2 closest to the second stage 14-2 is moved to the second stage 14. -Move in the direction opposite to the moving direction of -2. Alternatively, the counterweight CW2 on the opposite side of the first stage 14-1 is moved in the direction opposite to the moving direction of the first stage 14-1 with respect to the center or the center of gravity of the laser processing apparatus 10, and the second stage 14- The counterweight CW1 on the opposite side of 2 may be moved in the direction opposite to the moving direction of the second stage 14-2.

According to the present embodiment, since the number of counterweights is two, the size of the laser processing apparatus 10B can be reduced and the weight can be reduced as compared with the first embodiment. Further, according to the present embodiment, the stroke in the Y direction can be shortened.

[Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a plan view and a front view showing a laser processing apparatus according to a fourth embodiment of the present invention. In the following description, the same components as those of the above-described embodiments will be designated by the same reference numerals and description thereof will be omitted.

As shown in FIG. 10, in the laser processing apparatus 10C according to the present embodiment, two counterweights CW1 and CW2 are arranged outside the first stage 14-1 and the second stage 14-2, respectively. Two counterweights CW3 and CW4 are arranged inside the first stage 14-1 and the second stage 14-2, respectively. That is, in the laser processing apparatus 10C according to the present embodiment, from the + Y side, the counterweight CW1 (guide rail G1), the first stage 14-1, the counterweights CW3 and CW4 (guide rails G3 and G4), and the second stage 14 -2 and counterweight CW2 (guide rail G2) are arranged in this order. Here, the counterweights CW1 and CW3 are examples of a pair of counterweights on the first stage side arranged on both sides of the first stage 14-1, and the counterweights CW2 and CW4 are on both sides of the second stage 14-2. This is an example of a pair of counterweights on the second stage side arranged in.

The control device 50 operates the counterweights CW1 to CW4 so as to suppress the vibration of the laser processing device 10 (X stage 14) generated by the operation during processing or inspection (operation of the X stage 14). Specifically, the counterweights CW1 and CW3 arranged so as to sandwich the first stage 14-1 are moved in the direction opposite to the moving direction of the first stage 14-1 so as to sandwich the second stage 14-2. The counterweights CW2 and CW4 arranged in the second stage 14-2 are moved in the direction opposite to the moving direction of the second stage 14-2.

According to the present embodiment, since two counterweights are arranged so as to sandwich the first stage 14-1 and the second stage 14-2, the laser processing apparatus generated by the operation of the processing unit 28, the inspection unit 30, and the like. The rotational moment of 10C can be canceled more effectively. This makes it possible to enhance the damping effect.

[Example]
Next, the vibration damping effect of the laser processing apparatus according to the above embodiment will be described with reference to FIG. FIG. 11 is a graph showing the relationship between the number of counterweights and the displacement of the laser processing apparatus.

FIG. 11A shows the displacement of the laser processing apparatus (comparative example) during operation when the counterweight is not provided. FIG. 11B corresponds to the case where one counterweight is provided (second embodiment), and (c) corresponds to the case where two counterweights are provided (third embodiment). ..

Although the numerical values of the elapsed time and the displacement are omitted in FIG. 11, the scales of the elapsed time and the displacement in FIGS. 11 (a) to 11 (c) are the same.

As shown in FIG. 11A, when the counterweight is not provided, vibration is generated in the laser processing apparatus due to the movement of the X stage, which affects the accuracy of laser processing and inspection of processing defects.

On the other hand, as shown in FIGS. 11B and 11C, when the counterweight is provided, the laser processing apparatus generated by the movement of the first stage 14-1 and the second stage 14-2. Vibrations of 10A and 10B are suppressed. And, as the number of counterweights increases, the damping effect can be further enhanced.

In the present embodiment, the moving directions of the first stage 14-1 and the second stage 14-2 are parallel, but the present invention is not limited to this. Even if the moving directions of the first stage 14-1 and the second stage 14-2 are not parallel, they can be moved in parallel with the moving directions of the first stage 14-1 and the second stage 14-2. By providing a counterweight and a guide rail, it is possible to suppress vibration.

Further, in the present embodiment, the case where the laser processing apparatus includes two X stages has been described, but the present invention is not limited to this. Even when a plurality of X stages of three or more are provided, it is possible to suppress vibration by providing counterweights and guide rails that can move in parallel with the moving direction of each X stage. is there.

Further, the present embodiment has described a case where crack detection is performed as an inspection performed in parallel with processing in a laser processing apparatus provided with a plurality of X stages, but the present invention is not limited to this, and for example, crack detection is performed in parallel with processing. It can also be applied when performing inspections other than. Further, the inspection in the present embodiment was performed on the work W after laser machining, but the inspection on the work W before laser machining is also performed in parallel with the machining by applying this embodiment. It is possible. Further, although the processing in the present embodiment is laser processing, the present embodiment can also be applied when processing other than laser processing (for example, blade dicing) is performed.

10, 10A, 10B, 10C ... Laser Machining Equipment, 12 ... Base, 14-1 ... 1st Stage, 14-2 ... 2nd Stage, 16-1, 16-2 ... θ Stage, 18 ... Y Base, 20, 24 ... Y stage, 22, 26 ... Z stage, 28 ... Machining unit, 28A ... Machining unit, 28B ... Optical unit, 30 ... Inspection unit, 30A ... Inspection unit, 30B ... Optical unit, 50 ... Control device, 52 ... On Output unit, 54-1, 54-2 ... X drive unit, 56-1, 56-2 ... θ drive unit, 58 ... Vibration damping mechanism, 60, 64 ... Y drive unit, 62, 66 ... Z drive unit, C1 , C2 ... Wafer chuck, CW1-CW4 ... Counterweight, G1-G4 ... Guide rail

Claims (8)

Multiple stages configured to move independently of each other in the first direction,
A processing means for processing a first work that is movable in a second direction orthogonal to the first direction and is held in one of the plurality of stages.
An inspection means that is configured to be movable in the second direction independently of the processing means and inspects a second work held in another stage among the plurality of stages.
With at least one counterweight configured to be movable in the first direction,
A counterweight control means for moving at least one counterweight so as to suppress vibration generated by the movement of the one stage or the other stage.
A processing device equipped with. The counterweight control means moves the at least one counterweight in the direction opposite to the moving direction of the one stage or the other stage.
The processing apparatus according to claim 1. The counterweight control means moves the at least one counterweight in the direction opposite to the moving direction of the stage of the one stage or the other stage facing the processing means.
The processing apparatus according to claim 1. The plurality of stages include a first stage and a second stage arranged side by side in the second direction.
The at least one counterweight includes a first counterweight arranged on the side of the first stage opposite to the side on which the second stage is arranged, and a side on which the first stage of the second stage is arranged. Includes a second counterweight located on the opposite side of the
The processing apparatus according to any one of claims 1 to 3. The plurality of stages include a first stage and a second stage arranged side by side in the second direction.
The at least one counterweight includes a third counterweight disposed between the first stage and the second stage.
The processing apparatus according to any one of claims 1 to 4. The plurality of stages include a first stage and a second stage arranged side by side in the second direction.
The at least one counterweight includes a pair of first stage side counterweights arranged on both sides of the first stage and a pair of second stage side counterweights arranged on both sides of the second stage.
The processing apparatus according to any one of claims 1 to 3. The processing apparatus according to any one of claims 1 to 6, wherein the processing means laser-processes the work. A step of moving the processing means to a position facing one of the multiple stages,
A step of moving the inspection means to a position facing the other stage among the plurality of stages,
A step of processing the first work held by the one stage by the processing means while moving the one stage with respect to the processing means.
A step of inspecting the second work held by the other stage by the inspection means while moving the other stage with respect to the inspection means.
A step of moving at least one counterweight so as to suppress vibration generated by the movement of the one stage or the other stage.
Processing method including.

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