JP7412999B2 - Organic EL display panel and method for manufacturing organic EL display panel - Google Patents

Description

The present disclosure relates to an organic EL (Electro Luminescence) display panel that utilizes the electroluminescence phenomenon of organic materials and a method for manufacturing the same.

Conventionally, organic EL display panels including a plurality of organic EL elements are known. An organic EL element has a multilayer structure in which thin films of various materials are laminated, and is provided with at least a pixel electrode, a common electrode, and a TFT (Thin Film Transistor) substrate covered with a flattened insulating layer. and sandwiched organic light emitting layers.

An organic EL element emits light by applying a voltage between a pixel electrode and a common electrode and recombining holes and electrons injected into a light emitting layer. In a top-emission type organic EL element, light from a light-emitting layer is reflected by a pixel electrode made of a light-reflecting material and is emitted upward from a common electrode made of a light-transmitting material. The common electrode is often formed as a film over the entire surface of the substrate, and is electrically connected to a power supply unit for supplying current to the organic EL element via an electrode plate provided in the peripheral area other than the image display area. .

At this time, if the electrical resistance of the common electrode is large, in order to prevent the brightness from decreasing due to the voltage drop in the central part of the display panel, for example, an auxiliary power supply wiring that crosses the inside of the display panel on the same level as the pixel electrode may be installed. Techniques for reducing the resistance of electrodes have been proposed (for example, Patent Documents 1 and 2).

JP2006-278212A Japanese Patent Application Publication No. 2007-227129

However, in the conventional display panels described in Patent Documents 1 and 2, as the display panel becomes larger, in-plane brightness variations may occur due to voltage drop in the central portion, and the light emitting elements may be affected. It was necessary to further reduce the resistance of the power supply path.

The present disclosure has been made in view of the above problems, and provides an organic EL display panel and an organic EL display panel that reduce the resistance of the power supply path to the light emitting elements in the organic EL panel and improve in-plane brightness variations caused by voltage drop. The purpose of this invention is to provide a manufacturing method thereof.

To achieve the above object, an organic EL display panel according to one aspect of the present disclosure includes a substrate, a planarization layer containing a resin material disposed on the upper surface of the substrate, and a planarization layer arranged in a matrix on the planarization layer. a plurality of pixel electrodes, a light-emitting layer containing an organic light-emitting material disposed on the pixel electrode, and a common electrode covering at least above the light-emitting layer and disposed continuously in a plane direction, An elongated recess extending in the column direction is provided in at least one gap among the gaps between the pixel electrodes adjacent in the row direction on the planarizing layer, and the common electrode is connected to the pixel electrodes on the planarizing layer. A power feeding auxiliary wiring made of a coating film extending in the column direction is arranged continuously in the recess, and on the upper surface of the common electrode located in the recess of the flattening layer. do.

According to a display panel and a method for manufacturing a display panel according to one embodiment of the present disclosure, it is possible to reduce the resistance of a power supply path to a light emitting element in an organic EL panel and improve in-plane brightness variations caused by voltage drop. can.

1 is a plan view of an organic EL display panel 10 according to Embodiment 1. FIG. FIG. 2 is a schematic plan view of section A in FIG. 1. FIG. 3 is a schematic cross-sectional view taken along the line X1-X1 in FIG. 2. FIG. (a) is a schematic plan view of section B in FIG. 1, and (b) is a schematic plan view of another aspect of section B in FIG. 1. (a) is a schematic cross-sectional view taken along the line X2-X2 in FIG. 4(a). (b) is a schematic cross-sectional view taken along the line X3-X3 in FIG. 4(a). It is a flowchart of the manufacturing process of the organic EL display panel 10. (a) to (e) are schematic cross-sectional views taken along the line X1-X1 in FIG. 2, showing the state at each step in manufacturing the organic EL display panel 10. (a) to (d) are schematic cross-sectional views taken along the line X1-X1 in FIG. 2, showing states at each step in manufacturing the organic EL display panel 10. (a) to (d) are schematic cross-sectional views taken along the line X1-X1 in FIG. 2, showing states at each step in manufacturing the organic EL display panel 10. (a) to (c) are schematic cross-sectional views taken along the line X1-X1 in FIG. 2, showing the state at each step in manufacturing the organic EL display panel 10. 3 is a schematic cross-sectional view of a display panel 10A according to Modification Example 1 taken along the line X1-X1 in FIG. 2. FIG. (a) is a schematic plan view of the display panel 10B according to modification 2 in the same area as section B in FIG. 1; (b) is a schematic plan view of the display panel 10C according to modification 3 in the same area as section B in FIG. FIG. FIG. 3 is a schematic plan view of a part of a pixel region 10a of the display panel 10B. FIG. 2 is a schematic plan view of a part of a pixel region 10a of a display panel 10C. FIG. 1 is a schematic block diagram showing a circuit configuration of an organic EL display device according to an embodiment. FIG. 2 is a schematic circuit diagram showing a circuit configuration of each subpixel 100se of an organic EL display panel 10 used in an organic EL display device.

≪Overview of the mode for carrying out the present invention≫
A display panel according to an embodiment of the present disclosure includes a substrate, a planarization layer containing a resin material disposed on an upper surface of the substrate, and a plurality of pixel electrodes arranged in a matrix on the planarization layer. A light-emitting layer containing an organic light-emitting material disposed on the pixel electrode, and a common electrode covering at least above the light-emitting layer and disposed continuously in a plane direction, and extending in a row direction on the flattening layer. An elongated recess extending in the column direction is provided in at least one of the gaps between the adjacent pixel electrodes, and the common electrode is continuously disposed within the recess of the planarizing layer. The power supply auxiliary wiring made of a coating film extending in the column direction is arranged on the upper surface of the common electrode located in the recess of the planarizing layer.

With such a configuration, the auxiliary wiring formed in the recess can secure a cross-sectional area equivalent to the cross-sectional shape of the recess cut in the row direction, and it is possible to reduce the resistance of the power supply path to the light emitting elements in the organic EL panel. , it is possible to improve in-plane brightness variations caused by voltage drops. Further, it is possible to improve display quality by improving crosstalk caused by decreased responsiveness in the central portion of the display panel.

In another aspect, in any of the above aspects, further, two wires extending in the column direction are provided between the concave portion on the planarization layer and the pixel electrodes adjacent to each other on both sides in the row direction. An elongated column bank may be formed, and the depth of the recessed portion of the planarization layer may be greater than the height of the column bank.

With such a configuration, the auxiliary wiring has a predetermined thickness, so that the electrical resistance of the auxiliary wiring can be reduced.

In another embodiment, in any of the above embodiments, a lower power supply auxiliary wiring made of a vapor deposited film extending in the column direction is further provided in the recess of the planarization layer and below the common electrode. It is also possible to have a configuration in which the

With such a configuration, the cross sections of the column banks adjacent to the recesses in the row direction can have equivalent shapes in the row direction.

In another aspect, in any of the above aspects, further, on the planarization layer, a layer extending along the periphery of the substrate outside a region where the pixel electrode exists in plan view. An electrode plate is provided, the recess of the planarization layer is opened to near the periphery of the substrate in a plan view, and the electrode plate is continuously arranged within the recess of the planarization layer, The power feeding auxiliary wiring may be configured to extend to the upper surface of the electrode plate in plan view.

With this configuration, the power feeding auxiliary wiring formed in the recess is extended to the periphery of the substrate while ensuring a cross-sectional area corresponding to the cross-sectional area of the recess by having a predetermined thickness.

In another aspect, in any of the above aspects, the common electrode may be configured to extend to the upper surface of the electrode plate in plan view.

With such a configuration, the power feeding auxiliary wiring formed in the recess is connected to the electrode plate existing at the periphery of the substrate to make an external connection while ensuring a cross-sectional area equivalent to the cross-sectional area of the recess by having a predetermined thickness. Connected to the terminal. Therefore, it is possible to reduce the resistance of the power supply path from the electrode plate to the organic EL element array.

In another aspect, in any of the above aspects, the recessed portion of the planarizing layer is located outside the region where the pixel electrode exists and inward from the electrode plate substrate in plan view. The power feeding auxiliary wiring may extend to the end point in plan view, and the common electrode may extend to the upper surface of the electrode plate in plan view.

With such a configuration, the power supply auxiliary wiring is electrically connected to the electrode plate via the common electrode in the peripheral region, and the resistance of the power supply path from the electrode plate to the organic EL element array can be reduced.

In another aspect, in any of the above aspects, the depth of the recessed portion of the planarization layer is 2 μm or more and 5 μm or less, and the power feeding auxiliary wiring contains silver and has a thickness of 0.5 μm or more and 2 μm or less. The following configuration may also be used.

With such a configuration, the electrical resistance of the auxiliary wiring can be reduced by setting the auxiliary wiring to the above-mentioned thickness.

In another aspect, in any of the above aspects, when the recess is a first recess and the auxiliary power supply wiring is a first auxiliary power supply wiring, furthermore, when the recess is a first recess and the auxiliary power supply wiring is a first auxiliary power supply wiring, a A second elongated recess extending in the row direction is provided in at least one of the gaps between the matching pixel electrodes, and the common electrode is disposed within the second recess of the flattening layer. A second power feeding auxiliary wiring made of a coating film extending in the row direction is arranged on the upper surface of the common electrode that is arranged continuously and located in the second recess of the planarization layer. You can also use it as

With such a configuration, it is possible to reduce the electrical resistance of the auxiliary wiring not only in the column direction but also in the row direction, thereby reducing in-plane brightness variations caused by voltage drops.

In another aspect, in any of the above aspects, the column direction positions of the second recess and the second power feeding auxiliary wiring are located at the positions of the second recess and the second power feeding auxiliary wiring that sandwich the gap in the column direction. The configuration may be different depending on the position of the pixel electrode in the row direction.

With this configuration, a so-called houndstooth check pattern is formed, so that variations in brightness (horizontal streaks) in the column direction due to the presence of the power feeding auxiliary wiring can be made less noticeable.

In another aspect, in any of the above aspects, the second recess and the second power supply auxiliary wiring may be arranged for each of the plurality of pixel electrodes in the column direction.

With such a configuration, it is possible to suppress the occurrence of brightness variations due to variations in ink application for each sub-pixel in the column direction.

In another aspect, in any of the above aspects, there are two grooves extending in the row direction between the second recess on the planarizing layer and the pixel electrodes adjacent to each other on both sides in the column direction. A long row bank of books may be formed, and the height of the row bank may be smaller than the depth of the second recess.

With such a configuration, when ink containing an organic light emitting material is applied in the gap between the column banks in the step of forming the light emitting layer, the applied ink can be dammed up by the row banks. Therefore, it is possible to prevent ink from flowing from within the gap into the recessed portion where the auxiliary wiring is laid.

In another embodiment, in any of the above embodiments, the pixel electrode and the lower power supply auxiliary wiring may be made of a vapor deposited film, and the pixel electrode and the lower power supply auxiliary wiring may be made of the same material. .

With this configuration, the pixel electrode and the lower layer power supply auxiliary wiring can be formed and patterned simultaneously during manufacturing.

In another aspect, in any of the above aspects, the common electrode may be made of a vapor-deposited film and may be formed continuously above the column bank.

With such a configuration, it is possible to realize a structure in which the common electrode is continuously arranged within the recess of the planarization layer.

In another aspect, in any of the above aspects, when the column bank is a first column bank, the pixel electrode and the pixel electrode that are adjacent to each other in the row direction on the planarization layer are further A long second column bank is formed between the first column bank and the second column bank, and the organic light emitting layer is made of a coating film. The second column banks may be arranged continuously in the column direction within a gap between the second column banks adjacent in the row direction.

With such a configuration, even when a power feeding auxiliary electrode extending inside the substrate in the column direction is provided, it is possible to suppress the occurrence of brightness variations due to variations in ink application for each subpixel in the column direction.

A method for manufacturing a display panel according to an embodiment of the present disclosure includes a step of preparing a substrate, a step of forming a planarization layer containing a resin material disposed on an upper surface of the substrate, and a process of forming a matrix on the planarization layer. a step of forming a plurality of pixel electrodes in a shape, a step of forming a light emitting layer containing an organic light emitting material disposed on the pixel electrode, and a step of forming a plurality of pixel electrodes continuously in a plane direction so as to cover at least an upper part of the light emitting layer. arranging an electrode, and in the step of forming the planarization layer, at least one gap among the gaps in the regions where the pixel electrodes are to be formed adjacent in the row direction on the planarization layer is provided. In the step of forming the common electrode by opening an elongated recess extending in the column direction, the common electrode is continuously formed in the recess of the planarization layer, and further, the common electrode is disposed. After the step, the method may include a step of forming an auxiliary power supply wiring made of a coating film extending in the column direction on the upper surface of the common electrode located in the recess of the planarization layer.

With such a configuration, it is possible to manufacture an organic EL panel in which the resistance of the power supply path to the light emitting elements is reduced and in-plane luminance variations caused by voltage drop are improved.

In another aspect, in any of the above aspects, after the step of forming the pixel electrode and before the step of forming the light emitting layer, the recess on the planarization layer is further formed. The step of forming two elongated column banks extending in the column direction between the pixel electrodes adjacent to each other on both sides in the row direction; The power supply auxiliary wiring may be formed by applying ink containing a metal material to the gaps between the banks and drying it.

With such a configuration, since the recess exists in the gap, even if a large amount of ink is applied in the gap, the ink can be prevented from overflowing into the adjacent gap and blocking the light emitting layer 123 in the adjacent gap. . This makes it possible to increase the thickness of the auxiliary wiring while preventing ink from leaking to the sub-pixels.

In another aspect, in any of the above aspects, in the step of forming the pixel electrode, further, in the recessed portion of the planarization layer, below the common electrode, a A configuration may be adopted in which a lower layer power supply auxiliary wiring is formed of a vapor-deposited film.

With such a configuration, it is possible to prevent the light-emitting layer from being blocked due to ink overflowing into the gap adjacent to the recess in the row direction.

≪Embodiment≫
An organic EL display panel 10 (hereinafter referred to as "display panel 10") according to the present embodiment will be described using the drawings. Note that the drawings are schematic diagrams, and the scale may differ from the actual scale.

<Overall configuration of display panel 10>
FIG. 1 is a plan view of a display panel 10 according to the first embodiment. FIG. 2 is an enlarged view of section A in FIG. The display panel 10 is an organic EL (Electro Luminescence) panel that utilizes the electroluminescence phenomenon of organic materials, and is configured with a plurality of organic EL elements arranged in, for example, a matrix. As shown in the figure, the display panel 10 has an image display area 10a and a peripheral area 10b located outside the substrate of the image display area 10a when viewed from above.

<Configuration of image display area 10a of display panel 10>
In the image display area 10a, a plurality of unit pixels 100e are arranged in a matrix. Each unit pixel 100e includes a plurality of subpixels 100se that emit light of different colors, and one subpixel 100se is composed of one organic EL element 100. These plurality of organic EL elements 100 are arranged in a matrix in the image display area 10a of the display panel 10 to constitute an organic EL element array 100ar. As shown in FIG. 2, in the image display area 10a of the display panel 10, unit pixels 100e each having a pixel electrode 119 and having R, G, and B sub-pixels 100se are arranged in a matrix, and organic EL An element array 100ar is configured.

FIG. 2 is a schematic plan view showing a part of the image display area 10a of the display panel 10, with a light emitting layer 123, an electron transport layer 124, a common electrode 125, a sealing layer 126, and a front plate 131, which will be described later, removed. FIG. Here, in this specification, the X direction, Y direction, and Z direction in FIG. 2 are the row direction, column direction, and thickness direction of the display panel 10, respectively.

The display panel 10 has a top panel in which a plurality of organic EL elements 100 each forming a pixel are arranged in a matrix on a substrate 100x (TFT substrate) on which a thin film transistor (TFT) is formed, and which emits light from the upper surface. It has an emission type configuration.

The display panel 10 has an image display area 10a in which a column bank 522Y and a row bank 122X (collectively referred to as "banks 122") are arranged, dividing the substrate 100x into a matrix to regulate the light emission units of each RGB color. It consists of In the image display area 10a of the display panel 10, subpixels 100se corresponding to the organic EL elements 100 are arranged in a matrix, and each subpixel 100se includes 100aR that emits red light, 100aG that emits green light, and 100aG that emits blue light. Any of the three types of self-emitting regions 100a of 100aB (if not distinguished, it will be referred to as "100a") is formed, and the unit is formed from three sub-pixels 100se corresponding to the self-emitting regions 100aR, 100aG, and 100aB arranged in the row direction. A pixel 100e is configured.

Further, in the display panel 10, a plurality of pixel electrodes 119 are arranged in a matrix on the substrate 100x with predetermined distances apart from each other in the row and column directions. The pixel electrode 119 has a rectangular shape in plan view, is made of a light-reflecting material, and corresponds to the self-luminous region 100a.

In the display panel 10, the shape of the bank 122 adopts a so-called line-shaped bank format, and each strip extends in the column direction (Y direction in FIG. 2) between two pixel electrodes 119 adjacent in the row direction. A plurality of column banks 522Y are arranged in parallel in the row direction.

On the other hand, between two pixel electrodes 119 adjacent in the column direction, a plurality of row banks 122X each of which extends in the row direction (X direction in FIG. 2) are arranged in parallel in the column direction. The formed region becomes a non-self-luminous region 100b because organic electroluminescence does not occur in the light-emitting layer 123. A connection recess (contact hole, not shown) for connecting the pixel electrode 119 and the source S ₁ of the TFT is provided in the non-self-luminous region 100b.

The space between adjacent column banks 522Y is defined as a gap 522z, and the gaps corresponding to the self-luminous regions 100aR, 100aG, and 100aB are defined as gaps 522zR, 522zG, and 522zB. The gap in which the auxiliary wiring 128Y (hereinafter referred to as "lower auxiliary wiring 129Y" or "auxiliary wiring 128Y") is laid is defined as an auxiliary gap 522zA (or "gap 522z" if not distinguished).

<Configuration of each part in the image display area 10a>
The configuration of the organic EL element 100 in the display panel 10 will be explained using FIG. 3. FIG. 3 is a schematic cross-sectional view taken along the line X1-X1 in FIG.

As shown in FIG. 3, the display panel 10 includes a substrate 100x (TFT substrate) in which a thin film transistor is formed below in the Z-axis direction, and a flattening layer 118, an organic EL element portion, and a front plate 131 are formed on the substrate 100x (TFT substrate). are layered. The organic EL element section mainly includes a flattening layer 118, a pixel electrode 119, a hole injection layer 120, a hole transport layer 121, an organic light emitting layer 123, an electron transport layer 124, a common electrode 125, and a sealing layer 126. It consists of each layer. Furthermore, banks 122 are formed on the planarization layer 118 to partition the organic EL element portions.

(Substrate)
[Substrate 100x]
The substrate 100x is a support member of the display panel 10, and includes a base material (not shown) and a TFT layer (not shown) formed on the base material.

The base material is a supporting member of the display panel 10 and has a flat plate shape. The base material may be made of any electrically insulating material, such as alkali-free glass, soda glass, polycarbonate resin, polyester resin, polyimide material, alumina, or the like.

The TFT layer is provided on the surface of the base material for each subpixel, and a subpixel circuit including a thin film transistor element is formed in each subpixel. The TFT layer has a multilayer structure including an electrode, a semiconductor layer, an insulating layer, etc. formed on the top surface of a base material.

[Planarization layer 118]
A planarization layer 118 is provided on the base material and the top surface of the TFT layer. The planarization layer 118 located on the top surface of the substrate 100x ensures electrical insulation between the TFT layer and the pixel electrode 119, and even if there is a step on the top surface of the TFT layer, it flattens it and makes the pixel It has a function of suppressing the influence on the underlying surface on which the electrode 119 is formed. Examples of the material for the planarization layer 118 include organic insulating materials such as polyimide resin, acrylic resin, siloxane resin, and novolac type phenolic resin, and inorganic insulating materials such as SiO (silicon oxide) and SiN (silicon nitride). can be used. A contact hole (not shown) is formed in the planarization layer 118 to connect the pixel electrode 119 to the source S ₁ of the corresponding TFT subpixel circuit.

(Organic EL element 100)
[Pixel electrode 119]
A pixel electrode 119 is provided on the flattening layer 118 located on the upper surface of the image display area 10a on the substrate 100x, corresponding to the subpixel 100se.

The pixel electrode 119 is for supplying carriers to the light emitting layer 123, and for example, when functioning as an anode, it supplies holes to the light emitting layer 123. For the metal layer, examples of materials having low sheet resistance and high light reflectivity include Ag (silver), Al (aluminum), aluminum alloy, Mo (molybdenum), and APC (alloy of silver, palladium, and copper). Consisting of The thickness of the pixel electrode 119 may be, for example, 200 nm or more and 400 nm or less.

The shape of the pixel electrode 119 is, for example, a generally rectangular flat plate. A connection electrode (not shown) of the pixel electrode 119 is formed by recessing a part of the pixel electrode 119 in the direction of the substrate 100x on the contact hole of the planarization layer 118, and the pixel electrode 119 is formed at the bottom of the connection recess. and a wiring connected to the source S ₁ of the corresponding pixel.

Note that a known transparent conductive film may be further provided on the surface of the pixel electrode 119. As a material for the transparent conductive film, for example, indium tin oxide (ITO) or indium zinc oxide (IZO) can be used.

[Hole injection layer 120]
A hole injection layer 120 is laminated on the pixel electrode 119. The hole injection layer 120 has a function of transporting holes injected from the pixel electrode 119 to the hole transport layer 121.

The hole injection layer 120 is made of, for example, an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), or PEDOT. (a mixture of polythiophene and polystyrene sulfonic acid). The thickness of the hole injection layer 120 may be, for example, several nm to several tens of nm.

[Bank 122]
A bank made of an insulator is formed to cover the edges of the pixel electrode 119 and the hole injection layer 120. In the banks, column banks 522Y and row banks 122X are formed in a grid pattern. Gaps 522z partitioned by the column banks 522Y are formed between the column banks 522Y, and at the bottom of each gap 522z, a plurality of pixel electrodes 119 are arranged in a row in the Y direction, and a functional layer is formed on the pixel electrodes 119. A hole injection layer 120, a hole transport layer 121, an organic light emitting layer 123, and an electron transport layer 124 are formed. The column bank 522Y has a linear shape extending in the column direction, and a cross section cut parallel to the row direction has a forward tapered trapezoid shape tapering upward. The column banks 522Y block the flow of ink containing an organic compound, which is a material of the light emitting layer 123, in the row direction when forming the light emitting layer 123 by a wet method, so that the applied ink does not overflow. It also functions as a structure. Further, the column bank 522Y defines the outer edge of the light emitting region 100a of each subpixel 100se in the row direction by the base in the row direction.

The row bank 122X is formed between the pixel electrodes 119 adjacent to each other in the Y direction in each gap 522z, and partitions the subpixels 100se adjacent to each other in the Y direction. Therefore, an opening corresponding to the self-luminous region 100a is formed by the row bank 122X and the column bank 522Y. The row bank 122X has a linear shape extending in the row direction, and a cross section cut parallel to the column direction has a forward tapered trapezoid shape tapering upward. Each of the row banks 122X has an upper surface located lower than the upper surface 522Yb of the column bank 522Y.

The bank 122 is made of an insulating organic material (for example, acrylic resin, polyimide resin, novolac type phenol resin, etc.) or an inorganic material such as silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), etc. Consisting of

[Hole transport layer 121]
A hole transport layer 121 is stacked on the hole injection layer 120 in the gaps 522zR, 522zG, and 522zB. The hole transport layer 121 has a function of transporting holes injected from the hole injection layer 120 to the light emitting layer 123. The hole transport layer 121 is made of, for example, a polymer compound such as polyfluorene or a derivative thereof, an amine-based organic polymer such as polyarylamine or a derivative thereof, or TFB (poly(9,9-di-n-octylfluorene- alt-(1,4-phenylene-((4-sec-butylphenyl)imino)-1,4-phenylene)) and the like can be used.

[Light-emitting layer 123]
A light emitting layer 123 is laminated on the hole transport layer 121. The light-emitting layer 123 is a layer made of an organic compound, and has a function of generating an excited state by injecting and recombining holes and electrons inside and emitting light. Within the gap 522zR, gap 522zG, and gap 522zB defined by the column bank 522Y, the light emitting layer 123 is linearly provided so as to extend in the column direction. Light-emitting layers 123R, 123G, and 123B that emit light in each color are formed in the red gap 522zR, the green gap 522zG, and the blue gap 522zB, respectively.

In the display panel 10, the light-emitting layer 123 is made of a light-emitting organic material that can be formed using a wet printing method. Specifically, for example, oxinoid compounds, perylene compounds, coumarin compounds, azacoumarin compounds, oxazole compounds, oxadiazole compounds, perinone compounds, and pyrrolopyrrole described in Patent Publication (Japanese Patent Publication No. 5-163488) Compounds, naphthalene compounds, anthracene compounds, fluorene compounds, fluoranthene compounds, tetracene compounds, pyrene compounds, coronene compounds, quinolone compounds and azaquinolone compounds, pyrazoline derivatives and pyrazolone derivatives, rhodamine compounds, chrysene compounds, phenanthrene compounds, cyclopentadiene compounds, stilbene compounds , diphenylquinone compounds, styryl compounds, butadiene compounds, dicyanomethylenepyran compounds, dicyanomethylenethiopyran compounds, fluorescein compounds, pyrylium compounds, thiapyrylium compounds, selenapyrylium compounds, telluropyrylium compounds, aromatic aldadiene compounds, oligophenylene compounds, thioxanthenes Compounds, anthracene compounds, cyanine compounds, acridine compounds, metal complexes of 8-hydroxyquinoline compounds, metal complexes of 2-bipyridine compounds, complexes of Schiff salts with Group III metals, oxine metal complexes, rare earth complexes, and other fluorescent substances. It is preferable that

[Electron transport layer 124]
The electron transport layer 124 is stacked to cover the column bank 522Y and the light emitting layer 123 within the gap 522z defined by the column bank 522Y. The electron transport layer 124 has a function of transporting electrons from the common electrode 125 to the light emitting layer 123 and restricting injection of electrons into the light emitting layer 123. In the display panel 10, it is formed continuously over at least the entire display area.

Examples of organic materials with high electron transport properties used for the electron transport layer 124 include π-electron based low-molecular organic materials such as oxadiazole derivatives (OXD), triazole derivatives (TAZ), and phenanthroline derivatives (BCP, Bphen). Can be mentioned. It may also include a layer formed of sodium fluoride. The layer may also include a layer doped with a doped metal selected from alkali metals and alkaline earth metals.

[Common electrode 125]
A common electrode 125 is formed on the electron transport layer 124. The common electrode 125 forms a pair with the pixel electrode 119 and creates a current-carrying path by sandwiching the light emitting layer 123 therebetween. The common electrode 125 supplies carriers to the light emitting layer 123, and supplies electrons to the light emitting layer 123 when functioning as a cathode, for example. In the display panel 10, the common electrode 125 is an electrode common to each light emitting layer 123. The common electrode 125 is formed using a thin electrode made of silver (Ag), aluminum (Al), or the like. Further, in addition to the metal layer, or alone, a conductive material having light transmittance such as indium tin oxide (ITO) or indium zinc oxide (IZO) may be used.

(Sealing layer 126)
A sealing layer 126 is laminated to cover the common electrode 125 . The sealing layer 126 includes the pixel electrode 119, the lower auxiliary wiring 129Y, the hole injection layer 120, the hole transport layer 121, the light emitting layer 123, the electron transport layer 124, the common electrode 125, the auxiliary wiring 128Y, and the metal oxide layer 1201. This is to prevent deterioration due to exposure to air. The sealing layer 126 is provided to cover the upper surface of the common electrode 125. In addition, in the case of a top emission type, in order to ensure good light extraction performance as a display, transparent inorganic materials such as silicon nitride (SiN) and silicon oxynitride (SiON), which have high transparency, are used. It is formed using Furthermore, a sealing resin layer made of a resin material such as acrylic resin or silicone resin may be provided on the layer of transparent inorganic material.

(Formation part of auxiliary wiring 128Y)
The formation portion of the auxiliary wiring 128Y shown in section C in FIG. 3 will be described below.

[Concavity 118a of planarization layer 118]
An elongated recess 118a extending in the column direction is provided in at least one of the gaps between pixel electrodes adjacent in the row direction on the planarizing layer 118. In this example, for a unit pixel 100e composed of three sub-pixels 100se corresponding to self-emitting regions 100aR, 100aG, and 100aB arranged in the row direction, the gap between the unit pixels 100e and the unit pixels 100e in the row direction is A recess 118a is formed inside. In this example, the thickness of the flattening layer is, for example, about 4 μm, and the recess 118a has a width of, for example, about 15 μm, a depth of, for example, about 3 μm, and has a remaining portion of about 1 μm at the bottom. However, the depth and width of the recessed portion 118a are not limited to those described above, and may be adjusted as appropriate depending on the film thickness required for the auxiliary wiring 128Y formed inside. For example, the depth of the recess 118a may be greater than or equal to 2 μm and less than or equal to 5 μm.

Further, two elongated column banks 522Y extending in the column direction are formed between the recess 118a of the planarizing layer 118 and the pixel electrodes 119 adjacent to each other on both sides in the row direction, and the recess 118a The depth of the column bank 522 is larger than the height of the column bank 522. Here, the space between the two elongated column banks 522Y sandwiching the recess 118a of the planarization layer 118 is defined as an auxiliary gap 522zA.

A lower auxiliary wiring 129Y made of a vapor deposited film extending in the column direction is arranged on the planarization layer 118 located in the recess 118a of the planarization layer 118. Furthermore, a structure may be adopted in which a metal oxide layer 1201 patterned in the same shape is laminated on the lower auxiliary wiring 129Y. Here, the lower layer auxiliary wiring 129Y is made of a vapor-deposited film, which means that the lower layer auxiliary wiring 129Y is made of a dry method such as a vacuum evaporation method, an electron beam evaporation method, a sputtering method, a reactive sputtering method, an ion plating method, a vapor phase growth method, etc. This means that the film is formed using a film forming process.

The lower layer auxiliary wiring 129Y is arranged extending in the column direction on the planarization layer 118 within the auxiliary gap 522zA of the column bank 522Y. The lower layer auxiliary wiring 129Y is an auxiliary wire for reducing the electrical resistance of the common electrode 125 by electrically connecting with the common electrode 125 laminated on the upper surface of the metal oxide layer 1201 laminated on the upper surface. This is a wiring layer. The lower auxiliary wiring 129Y is preferably made of a material having low sheet resistance, such as a metal layer or an alloy layer containing aluminum (Al) as a main component. The thickness may be, for example, 200 nm or more and 400 nm or less. The lower auxiliary wiring 129Y may be formed of the same material and in the same layer as the pixel electrode 119. Furthermore, the metal oxide layer 1201 and the hole injection layer 120 may be formed of the same material and in the same layer.

In this way, by providing the lower auxiliary wiring 129Y and the metal oxide layer 1201 (hereinafter referred to as "lower auxiliary wiring 129Y, etc.") in the recess 118a, the cross section of the column bank 522Y adjacent to the recess 118a in the row direction is has an equivalent shape in the row direction. If the lower layer auxiliary wiring 129Y, etc. is not provided, the cross-sectional shape of the column bank 522Y adjacent to the recess 118a in the row direction is such that the height on the side closer to the recess 118a is equal to the thickness of the lower layer auxiliary wiring 129Y, etc. becomes smaller. In that case, when applying ink containing a large amount of wiring material into the gap 522zA in the formation process of the auxiliary wiring 128Y, which will be described later, the ink may overflow into the adjacent gap 522z and block the light emitting layer 123 in the gap 522z. sex increases.

Therefore, by providing the lower auxiliary wiring 129Y and the like in the recess 118a, it is possible to prevent the light emitting layer 123 from being blocked due to ink overflowing into the adjacent gap 522z.

The common electrode 125 is made of a deposited film, and is disposed continuously above the lower auxiliary wiring 129Y in the recess 118a of the planarization layer 118. The common electrode 125 is electrically connected to the lower auxiliary wiring 129Y via the metal oxide layer 1201. Here, the common electrode 125 is made of a vapor deposited film, which means that the common electrode 125 is made of a dry film formed by a vacuum vapor deposition method, an electron beam vapor deposition method, a sputtering method, a reactive sputtering method, an ion plating method, a vapor phase growth method, etc. This means that the film is formed using a process.

Note that the electron transport layer 124 may be disposed continuously between the lower auxiliary wiring 129Y and the common electrode 125 within the recess 118a of the planarization layer 118. In this case, the common electrode 125 is electrically connected to the lower auxiliary wiring 129Y via the metal oxide layer 1201 and the electron transport layer 124.

[Auxiliary wiring 128Y]
An auxiliary wiring 128Y made of a coating film extending in the column direction is arranged on the upper surface of the common electrode 125 located in the recess 118a of the planarization layer 118. The auxiliary wiring 128Y is a so-called bus bar, which is an auxiliary wiring layer for reducing the electrical resistance of the common electrode 125 by electrically connecting it to the underlying common electrode 125. The auxiliary wiring 128Y is preferably composed of a metal layer or an alloy layer containing silver (Ag) or aluminum (Al) as a main component, for example, as a material with low sheet resistance. Here, the auxiliary wiring 128Y being made of a coating film means that the auxiliary wiring 128Y is formed by applying ink containing a solute using a wet film forming process such as a printing method, a spin coating method, or an inkjet method. It means there is.

In this embodiment, the auxiliary wiring 128Y formed in the recess 118a is extended to the periphery of the substrate 100x to become an external connection terminal while ensuring a cross-sectional area corresponding to the cross-sectional area of the recess 118a by having a predetermined thickness. Connected. For example, the thickness of the auxiliary wiring 128Y may be greater than or equal to 0.5 μm and less than or equal to 2 μm. Therefore, it is possible to reduce the resistance of the power supply path from the external connection terminal to the organic EL element array 100ar.

(Joining layer 127)
A front plate 131 having a color filter layer 132 formed on the lower main surface of an upper substrate 130 is disposed above the sealing layer 126 and is bonded by a bonding layer 127 . The bonding layer 127 has the function of bonding the substrate 100x and the front plate 131 together and also of preventing each layer from being exposed to moisture or air. The material of the bonding layer 127 is, for example, a resin adhesive or the like, and a translucent resin material such as acrylic resin, silicone resin, or epoxy resin can be used.

(Constitution of each part of front plate 131)
[Upper substrate 130]
A front plate 131 having a color filter layer 132 formed on an upper substrate 130 is installed and bonded on the bonding layer 127 . For the upper substrate 130, for example, a light-transmitting material such as a cover glass or a transparent resin film is used in the top emission type. Furthermore, the upper substrate 130 can improve the rigidity of the display panel 10 and prevent moisture, air, and the like from entering.

[Color filter layer 132]
A color filter layer 132 is formed on the upper substrate 130 at a position corresponding to each color self-emitting region 100a of the pixel. The color filter layer 132 is a transparent layer provided to transmit visible light of wavelengths corresponding to R, G, and B, and has a function of transmitting light emitted from each color pixel and correcting its chromaticity. have For example, in this example, red, green, and blue color filter layers 132R, 132G, and 132B are provided above the light emitting region 100aR in the red gap 522zR, the light emitting region 100aG in the green gap 522zG, and the light emitting region 100aB in the blue gap 522zB. are formed respectively. As the color filter layer 132, a known resin material (for example, a commercially available color resist manufactured by JSR Corporation) can be used.

[Light blocking layer 133]
A light shielding layer 133 is formed on the upper substrate 130 at a position corresponding to the boundary between the light emitting regions 100a of each pixel. The light shielding layer 133 is a black resin layer provided to prevent visible light of wavelengths corresponding to R, G, and B from passing through, and is made of, for example, a resin material containing a black pigment that has excellent light absorption and light shielding properties. For example, a resin whose main component is an ultraviolet curable resin (for example, an ultraviolet curable acrylic resin), to which a black pigment such as a light-shielding material such as a carbon black pigment, a titanium black pigment, a metal oxide pigment, or an organic pigment is added. Consists of materials.

<Configuration of peripheral area 10b of display panel 10>
FIG. 4(a) is a schematic plan view of section B in FIG. 1 in one aspect of the embodiment. This figure is a schematic plan view showing a part of the image display area 10a and the peripheral area 10b, and shows a bank 122, a light emitting layer 123, an electron transport layer 124, a common electrode 125, a sealing layer 126, and a front plate 131. It is a diagram showing a removed state. FIG. 5(a) is a schematic cross-sectional view taken along the line X2-X2 in FIG. 4(a). (b) is a schematic cross-sectional view taken along the line X3-X3 in FIG. 4(a).

As shown in FIG. 4A, a lower auxiliary wiring 129Y and an auxiliary wiring 128Y extend in the column direction adjacent to the unit pixel 100e in the row direction.

In the peripheral region 10b of the display panel 10, an electrode plate 129PL is arranged on the flattening layer 118 and extends outward from the image display region 10a where the organic EL element array 100ar is present in plan view. Furthermore, a structure may be adopted in which a metal oxide layer 1201 patterned in the same shape is laminated on the electrode plate 129PL. The electrode plate 129PL is arranged continuously up to the vicinity of the outer edge of the peripheral region 10b of the substrate 100x and is connected to an external connection terminal. By disposing the electrode plate 129PL in a band shape with a predetermined width along the periphery of the substrate 100x, the electrical resistance of the common electrode 125 within the display panel 10 can be reduced.

The electrode plate 129PL is preferably made of a material having low sheet resistance, such as a metal layer or an alloy layer containing aluminum (Al) as a main component. Further, the electrode plate 129PL may be formed of the same material and in the same layer as the lower auxiliary wiring 129Y and the pixel electrode 119. Furthermore, the metal oxide layer 1201 and the hole injection layer 120 may be formed of the same material and in the same layer.

The common electrode 125 extends continuously to near the periphery of the substrate 100x in plan view.

The electron transport layer 124 may be configured to extend to the outside of the image display area 10a where the organic EL element array 100ar is present in plan view.

As shown in FIG. 4A, in one aspect of the embodiment, the recess 118a of the planarization layer 118 extends to the vicinity of the periphery of the substrate 100x in plan view.

As shown in FIG. 5A, the electrode plate 129PL is continuously arranged within the recess 118a of the planarization layer 118 at the periphery of the substrate 100x.

The auxiliary wiring 128Y extends within the recess 118a of the planarization layer 118 to near the periphery of the substrate 100x in plan view. The auxiliary wiring 128Y extends to the upper surface of the electrode plate 129PL in plan view, and the auxiliary wiring 128Y is electrically connected to the electrode plate 129PL.

Further, as shown in FIG. 5(b), the lower auxiliary wiring 129Y is also formed in the recess 118a of the planarization layer 118 to extend to the vicinity of the periphery of the substrate 100x in plan view, and is connected to the electrode plate 129PL. You can also use it as

In such an aspect, the auxiliary wiring 128Y formed in the recess 118a is connected to the electrode plate 129PL present at the periphery of the substrate 100x while ensuring a cross-sectional area corresponding to the cross-sectional area of the recess 118a by having a predetermined thickness. connected to the external connection terminal. Therefore, it is possible to reduce the resistance of the power supply path from the electrode plate 129PL to the organic EL element array 100ar.

FIG. 4(b) is a schematic plan view of another aspect of section B in FIG. 1 in another aspect of the embodiment. In the embodiment shown in FIG. 4B, the recess 118a of the planarization layer 118 is opened to a position a predetermined distance 10b' outward from the inner edge of the peripheral region 10b of the substrate 100x in plan view. Further, the auxiliary wiring 128Y and the lower auxiliary wiring 129Y also extend to the same position as the recess 118a in the recess 118a of the planarization layer 118, and in the peripheral region 10b of the substrate 100x, only the common electrode 125 continues to the vicinity of the periphery of the substrate 100x. and extend.

In this embodiment, the auxiliary wiring 128Y is electrically connected to the electrode plate 129PL via the common electrode 125 in the peripheral region 10b, and it is possible to reduce the resistance of the power supply path from the electrode plate 129PL to the organic EL element array 100ar. .

<Method for manufacturing display panel 10>
A method for manufacturing the display panel 10 will be explained using FIGS. 6 to 10. FIG. 6 is a flowchart of the manufacturing process of the organic EL display panel 10. Each figure in FIGS. 7-10 is a schematic cross-sectional view taken along the line X1-X1 in FIG. 2 (image display area 10a) showing the state at each step in manufacturing the display panel 10.

[Creation of board 100x]
A plurality of TFTs and wiring (TFT layer) are formed on the substrate 100x (step S1 in FIG. 6, FIG. 7(a)).

[Formation of planarization layer 118]
A planarization layer 118 is formed to cover the substrate 100x.

At this time, elongated recesses 118a extending in the column direction are formed in the planarization layer 118 by photolithography. In the row direction, in this example, the recessed portion 118a is formed between adjacent unit pixel 100e forming regions in the row direction. Here, as described above, the depth of the recess 118a of the planarization layer 118 may be set to 2 μm or more and 5 μm or less. In this example, the thickness of the flattening layer is, for example, approximately 4 μm, the width of the recess 118a is, for example, approximately 15 μm, the depth is, for example, approximately 3 μm, and the remaining portion at the bottom is approximately 1 μm.

Further, a contact hole (not shown) is formed in the planarization layer 118 at a location above, for example, the source electrode of the TFT element at the same time as the recess 118a. The contact hole is formed by patterning or the like so that the surface of the source electrode is exposed at the bottom of the contact hole.

In forming the planarizing layer 118, first, the constituent material (photosensitive resin material) of the planarizing layer 118 is applied as a photoresist, and the surface is planarized to form the planarizing layer 118 (FIG. 6: Step S2, Figure 7(b)). Specifically, a resin material having a certain fluidity is applied, for example, by a die coating method along the upper surface of the substrate 100x so as to fill the irregularities on the substrate 100x1 caused by the TFT layer, and baked to form a resin film. Form. For example, a solution of acrylic resin, polyimide resin, siloxane resin, or phenol resin, which are positive photosensitive materials, dissolved in a solvent is uniformly applied to the resin material using a spin coating method or the like. It is formed by

Next, the resin film is patterned to simultaneously form a flattening layer 118 having recesses 118a and contact holes by photolithography using a photomask including a halftone portion (FIG. 6: Step S3, FIG. 7(c)). . In the photomask used, the portion corresponding to the contact hole may be a light-transmitting portion, the portion corresponding to the recess 118a may be a halftone portion, and the other regions may be a light-shielding portion. The recessed portion 118a is formed by exposing the recessed portion using a halftone mask portion of a mask, removing the exposed portion by development, and patterning the recessed portion by baking, leaving the bottom portion. Further, the contact hole is formed by exposing the light-transmitting part of the mask, and then removing the exposed part by development and baking, thereby patterning the contact hole so that the surface of the source electrode is exposed at the bottom. As shown in FIG. 7C, the cross section of the formed recess 118a is an inverted trapezoidal shape that tapers downward when cut parallel to the row direction.

After that, a connection electrode (not shown) is formed in the contact hole.

[Formation of pixel electrode 119, lower auxiliary wiring 129Y, electrode plate 129PL, hole injection layer 120, and metal oxide layer 1201]
Next, a pixel electrode 119 and a hole injection layer 120 are formed.

First, after forming the planarizing layer 118, dry etching treatment is performed on the surface of the planarizing layer 118, and cleaning before film formation is performed.

Next, after cleaning the surface of the planarization layer 118 before film formation, the pixel electrode 119 is formed in the image display area 10a, the pixel electrode metal film 119x for forming the lower layer auxiliary wiring 129Y, and the pixel electrode metal film 119x is formed in the peripheral area 10b. A metal film for forming the plate 129PL is formed on the surface of the planarization layer 118 by a vapor phase growth method such as a sputtering method or a vacuum evaporation method (FIG. 6: Step S4, FIG. 7(d)). In this example, a film made of aluminum or an alloy containing aluminum as a main component is formed by a sputtering method. Baking may be performed after the film is formed.

Furthermore, after pre-film-forming cleaning is performed on the surface of the metal film 119x, a metal layer for the hole injection layer 120 for forming the hole injection layer 120 and the metal oxide layer 1201 in the image display area 10a is subsequently cleaned in a vacuum atmosphere. In the peripheral region 10b, a film 120' is formed on the surface of the metal film 119x to form a metal oxide layer 1201 by vapor phase growth (FIG. 6: Step S5, FIG. 7D). In this example, a tungsten film is formed by a sputtering method. Baking may be performed after the film is formed.

After that, a photoresist layer FR made of a photosensitive resin or the like is applied, a photomask PM with a predetermined opening is placed thereon, the photoresist is exposed to ultraviolet rays from above, and the photoresist is exposed to light. The pattern of the photomask is transferred (FIG. 8(a)). Next, the photoresist layer FR is patterned by development.

Thereafter, in the image display region 10a, the metal film 120' is patterned by dry etching through the patterned photoresist layer FR, thereby forming a hole injection layer 120 and a metal oxide layer 1201. In the peripheral region 10b, the metal film is patterned by dry etching to form a metal oxide layer 1201.

Subsequently, in the image display area 10a, the metal film 119x is patterned by wet etching through the patterned photoresist layer FR and the hole injection layer 120, thereby forming the pixel electrode 119 and the lower auxiliary wiring 129Y. . In the peripheral region 10b, the metal film is patterned by wet etching to form an electrode plate 129PL.

Finally, the photoresist layer FR is peeled off, and in the image display area 10a, a stack of the pixel electrode 119 and the hole injection layer 120 patterned in the same shape, a stack of the lower auxiliary wiring 129Y and the metal oxide layer 1201 are formed. form. Furthermore, in the peripheral region 10b, a laminate of the electrode plate 129PL and the metal oxide layer 1201 patterned in the same shape is formed (FIG. 6: Step S6, FIG. 8(b)).

[Formation of bank 122]
In the image display area 10a, after forming the hole injection layer 120, a bank 122 is formed to cover the hole injection layer 120. In forming the bank 122, first, a film made of the constituent material of the bank 122X (for example, a photosensitive resin material) is laminated on the hole injection layer 120 using a spin coating method or the like. Then, the resin film is patterned to form row banks 122X (FIG. 6: Step S7, FIG. 8(c)).

Next, in the step of forming the column banks 522Y, a film made of the constituent material of the column banks 522Y (for example, a photosensitive resin material) is laminated on the hole injection layer 120 and the row banks 122X using a spin coating method or the like. do. Then, by placing a mask above the resin film and exposing it to light, and then developing it, the resin film is patterned to open gaps 522z and form column banks 522Y (FIG. 6: Step S8, FIG. 8 ( c)). At this time, in the firing process for the row bank 122X and the column bank 522Y, the metal is oxidized and the hole injection layer 120 is completed.

[Formation of organic functional layer]
A hole transport layer 121 and a light emitting layer 123 are sequentially stacked on the hole injection layer 120 formed in the gap 522z defined by the column bank 522Y including the row bank 122X.

The hole transport layer 121 is formed by applying ink containing a constituent material into the gaps 522z defined by the column banks 522Y using a wet process such as an inkjet method or a gravure printing method, and then removing the solvent by volatilization or baking it. (FIG. 6: Step S9, FIG. 8(d)). The hole transport layer 121 formed in each RGB subpixel may be formed to have a different thickness depending on each RGB subpixel.

The light-emitting layer 123 is formed by applying ink containing a constituent material into the gap 522z defined by the column bank 522Y using an inkjet method, and then firing it (FIG. 6: Step S10, FIG. 9(a) )).

Specifically, the substrate 100x is placed on the operation table of the droplet ejection device with the column banks 522Y along the Y direction, and is an inkjet in which a plurality of nozzle holes are arranged in a line along the Y direction. This is performed by causing droplets of ink 18 to land from each nozzle hole at a landing target set within the gap 522z between the row banks 522Y while moving the head 301 in the X direction relative to the substrate 100x. In this step, the ink 18 containing the material for the organic light emitting layer of R, G, or B is filled into the gap 522z serving as the sub-pixel forming area by an inkjet method, the filled ink is dried under reduced pressure, and then baked. Through the treatment, light emitting layers 123R, 123G, and 123B are formed.

When the application of ink to form any of the red, green, and blue light-emitting layers to the substrate 100x is completed, another color ink is applied to that substrate, and then a third color ink is applied to that substrate. This process is repeated to sequentially apply three colors of ink. As a result, a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer are repeatedly formed side by side in the lateral direction of the drawing paper on the substrate 100x.

Note that the method for forming the hole transport layer 121 and the light emitting layer 123 of the hole injection layer 120 is not limited to the above-mentioned method, but may be a known method such as a dispenser method, a nozzle coating method, a spin coating method, intaglio printing, letterpress printing, etc. The ink may be dropped and applied using the method.

Note that before forming the hole transport layer 121, an ink containing a conductive polymer material such as PEDOT (a mixture of polythiophene and polystyrene sulfonic acid) is applied into the gap 522z using an inkjet method, and then the solvent is removed by volatilization. Alternatively, it may be baked.

[Baking before electron transport layer deposition]
Baking is performed in a vacuum environment before forming the electron transport layer (FIG. 6: Step S11). This makes it possible to prevent the planarization layer from absorbing moisture again after the residual moisture in the planarization layer is removed.

[Formation of electron transport layer 124]
After forming the light emitting layer 123, an electron transport layer 124 is formed over the entire light emitting area of the display panel 10 (image display area 10a and part of the peripheral area 10b) by vacuum evaporation or the like (FIG. 6: Step S12, FIG. 9(b)).

The reason for using the vacuum evaporation method is to avoid damaging the light emitting layer 123, which is an organic film. The electron transport layer 124 is formed by forming a film of metal oxide or fluoride on the light emitting layer 123 by vacuum evaporation or the like. Alternatively, the film is formed by co-evaporation of an organic material and a metal material. Note that the thickness of the electron transport layer 124 is set to an appropriate thickness that is most advantageous for optical light extraction.

[Formation of common electrode 125]
After forming the electron transport layer 124, the common electrode 125 is formed so as to cover the electron transport layer 124 in the image display area 10a, and simultaneously to cover the electrode plate 129PL in the peripheral area 10b (FIG. 6: Step S13, FIG. 9(c)). The common electrode 125 is formed by a sputtering method or a vacuum evaporation method to cover the base layer with a film mainly composed of metal or metal oxide.

At this time, in the recess 118a of the planarizing layer 118, the upper surface of the lower layer auxiliary wiring 129Y is formed into a forward tapered shape, so that the common electrode 125 is formed inside the recess 118a of the planarizing layer 118 as a lower layer auxiliary wire. It is continuously arranged on the upper surface of the wiring 129Y or the metal oxide layer 1201.

[Formation of auxiliary wiring 128Y]
An auxiliary wiring 128Y made of a coating film is formed on the upper surface of the common electrode 125 located in the recess 118a of the planarization layer 118, extending in the column direction. The auxiliary wiring 128Y is formed by applying ink containing a constituent material mainly composed of silver (Ag) or aluminum (Al) into the gaps 522zA defined by the column banks 522Y using a wet process using an inkjet method or a gravure printing method. After coating to fill the area, the solvent is removed by evaporation. Alternatively, by firing, the surface of the ink is lowered to form a wiring layer with a predetermined thickness (FIG. 6: Step S14, FIG. 9(d)).

At this time, since the recess 118a exists in the gap 522zA, even if a large amount of ink is applied in the gap 522zA, the ink overflows into the adjacent gap 522z and the light emitting layer 123 in the gap 522z can be prevented from being blocked. Thus, by providing the recess 118a in the gap 522zA, it is possible to increase the thickness of the auxiliary wiring 128Y while preventing ink from leaking to the subpixel 100se.

The formed auxiliary wiring 128Y is in contact with the column bank 522Y and the upper surface of the common electrode 125 laid in the recess 118a of the planarization layer 118.

In addition, the auxiliary wiring 128Y is designed so that the volume of the recess 118a below the pinning position determined by the depth of the recess 118a, the liquid repellency of the common electrode 125, and the surface tension of the ink, the amount of ink dropped, the type of solvent, etc. By adjusting it, a desired cross-sectional shape can be obtained, and the film thickness of the auxiliary wiring 128Y can be adjusted to a desired value. For example, in a cross-sectional shape cut parallel to the row direction of the auxiliary wiring 128Y, the pinning position is at least the height of the upper edge of the recess 118a, and the proportion of the upper flat part is at least a predetermined value, and the lower part is tapered. It may also have a tapered trapezoidal shape. Therefore, by providing the auxiliary wiring 128Y with a predetermined thickness, it is possible to secure a cross-sectional area equivalent to the cross-sectional shape cut in the row direction of the recess 118a of the flattening layer 118, and reduce the electrical resistance of the auxiliary wiring 128Y. can be done.

[Formation of sealing layer 126]
A sealing layer 126 is formed to cover from the common electrode 125 to the periphery of the substrate 100 on the flattening layer 118 of the substrate 100x (FIG. 6: Step S15, FIG. 10(a)). The sealing layer 126 can be formed using a CVD method, a sputtering method, or the like.

[Attachment of front plate 131 and back panel]
Next, a material for the bonding layer 127 whose main component is an ultraviolet curable resin such as acrylic resin, silicone resin, or epoxy resin is applied to the back panel consisting of each layer from the substrate 100x to the sealing layer 126 (see FIG. 10). b)).

Subsequently, the applied material is irradiated with ultraviolet rays, and the back panel and front plate 131 are bonded together with their relative positions aligned. Thereafter, when both substrates are fired and the sealing process is completed, the display panel 10 is completed (FIG. 6: Step S16, FIG. 10(c)).

<Effect>
The effects of the display panel 10 will be explained below.

As described above, the organic EL display panel according to the embodiment includes a substrate 100x, a planarization layer 118 containing a resin material disposed on the upper surface of the substrate 100x, and a plurality of planarization layers arranged in a matrix on the planarization layer 118. a pixel electrode 119, a light-emitting layer 123 containing an organic light-emitting material disposed on the pixel electrode, and a common electrode 125 covering at least the upper part of the light-emitting layer 123 and disposed continuously in the plane direction. An elongated recess 118a extending in the column direction is provided in at least one of the gaps between pixel electrodes 119 adjacent in the row direction on the layer 118, and the common electrode 125 is formed in the recess of the flattening layer 118. 118a, and on the upper surface of the common electrode 125 located in the recess 118a of the flattening layer 118, an auxiliary power supply wiring 128Y made of a coating film extending in the column direction is arranged. Take.

With such a configuration, the auxiliary wiring 128Y formed in the recess 118a can secure a cross-sectional area equivalent to the cross-sectional shape cut in the row direction of the recess 118a of the planarization layer 118, and with this cross-sectional area secured, It extends to the periphery of the substrate 100x and is connected to an external connection terminal.

As a result, it is possible to reduce the resistance of the power supply path to the light emitting elements in the organic EL panel, and improve in-plane brightness variations caused by voltage drop.

Further, it is possible to improve display quality by improving crosstalk caused by decreased responsiveness in the central portion of the display panel.

In another aspect, two elongated column banks 522Y extending in the column direction are further provided between the recess 118a on the planarization layer 118 and the pixel electrodes 119 adjacent to each other on both sides in the row direction. The depth of the recess 118a of the planarization layer 118 may be greater than the height of the column bank 522Y.

With this configuration, the auxiliary wiring 128Y has a predetermined thickness, so that the electrical resistance of the auxiliary wiring 128Y can be reduced.

Further, the method for manufacturing an organic EL display panel according to the embodiment includes a step of preparing a substrate 100x, a step of forming a planarization layer 118 containing a resin material disposed on the upper surface of the substrate 100x, and a step of forming the planarization layer 118 on the upper surface of the substrate 100x. A step of forming a plurality of pixel electrodes 119 in a matrix on the pixel electrode 119, a step of forming a light emitting layer 123 containing an organic light emitting material arranged on the pixel electrode 119, and a step of forming a plurality of pixel electrodes 119 in a row and column on the pixel electrode 119. In the step of forming the planarizing layer 118, at least one of the gaps between the areas where pixel electrodes 119 adjacent in the row direction on the planarizing layer 118 are to be formed In the step of forming a common electrode 125 by forming an elongated recess 118a extending in the column direction in the two gaps, the common electrode 125 is continuously formed in the recess 118a of the planarization layer 118, and the common electrode 125 is After the step of arranging the electrodes 125, there is a step of forming an auxiliary power supply wiring 128Y made of a coating film extending in the column direction on the upper surface of the common electrode 125 located in the recess 118a of the flattening layer 118. .

With such a configuration, it is possible to manufacture an organic EL panel in which the resistance of the power supply path to the light emitting elements is reduced and in-plane luminance variations caused by voltage drop are improved.

In another aspect, after the step of forming the pixel electrode 119 and before the step of forming the light-emitting layer 123, furthermore, after the step of forming the pixel electrode 119, and before the step of forming the light emitting layer 123, a There is a step of forming two elongated column banks 522Y extending in the column direction between the pixel electrode 119, and in the step of forming the power supply auxiliary wiring 128Y, metal is inserted into the gap between the column banks 522Y. The power supply auxiliary wiring 128Y may be formed by applying ink containing the material and drying it.

With this configuration, the presence of the recess 118a in the gap 522zA prevents the ink from overflowing into the adjacent gap 522z and blocking the light emitting layer 123 in the gap 522z even if a large amount of ink is applied in the gap 522zA. It can be prevented. This allows the thickness of the auxiliary wiring 128Y to be increased while preventing ink from leaking to the subpixel 100se.

In another aspect, in the step of forming the pixel electrode 119, a lower auxiliary wiring 129Y made of a vapor deposited film extending in the column direction is further provided in the recess 118a of the planarization layer 118 and below the common electrode 125. It is also possible to have a configuration that forms a.

With this configuration, the cross section of the column bank 522Y adjacent to the recess 118a in the row direction can have an equivalent shape in the row direction, and the light emitting layer 123 due to ink overflow into the gap 522z adjacent to the recess 118a in the row direction. blockage can be prevented.

<Modified example>
Although the display panel 10 according to the embodiment has been described, the present disclosure is not limited to the above embodiment except for its essential characteristic components. For example, there may be a form obtained by making various modifications to the embodiments by those skilled in the art, or a form realized by arbitrarily combining the constituent elements and functions of each embodiment without departing from the spirit of the present invention. Included in this disclosure.

Below, a modified example of the display panel 10 will be described as an example of such a form.

(Modification 1)
FIG. 11 is a schematic cross-sectional view of the display panel 10A according to Modification Example 1 taken along the line X1-X1 in FIG.

In the display panel 10 according to the embodiment, as shown in section C in FIG. 3, in the portion where the auxiliary wiring 128Y is formed, the auxiliary wiring 128Y is connected to the lower auxiliary wiring 129Y, the metal oxide layer 1201, and the electron transport layer in the recess 118a. It is configured to extend in the column direction above the laminate consisting of the layer 124.

On the other hand, in the display panel 10A according to Modification Example 1, as shown in section D in FIG. This is different from the display panel 10 in that there is no wiring 129Y and metal oxide layer 1201, and the auxiliary wiring 128YA is arranged above the common electrode 125 laid in the recess 118a.

In the display panel 10 according to the embodiment, the electrical connection between the common electrode 125 and the lower auxiliary wiring 129Y has a certain electrical resistance due to the presence of the electron transport layer 124 in the conductive path.

On the other hand, in the display panel 10A, the cross-sectional area of the auxiliary wiring 128YA can be increased by an amount corresponding to the cross-sectional area of the lower auxiliary wiring 129Y and the metal oxide layer 1201 in the recess 118a in the display panel 10. Since the auxiliary wiring 128YA is in direct contact with the common electrode 125, an increase in the cross-sectional area of the auxiliary wiring 128YA directly contributes to reducing the electrical resistance of the auxiliary wiring 128YA. Therefore, in the display panel 10A, the electrical resistance can be reduced compared to the display panel 10 by increasing the cross-sectional area of the auxiliary wiring 128YA instead of the lower auxiliary wiring 12 laid in the recess 118a and the metal oxide layer 1201. can.

That is, in the display panel 10A, the space for power supply secured by providing the recess 118a of the planarization layer 118 can be used more efficiently for reducing electrical resistance than in the display panel 10.

(Modifications 2 and 3)
FIG. 12A is a schematic plan view of the display panel 10B according to Modification 2 in the same area as the section B in FIG. 1 .

In the display panel 10 according to the embodiment, as shown in FIG. 1, a plurality of lower auxiliary wirings 129Y are continuously arranged in the auxiliary gap 522zA in the column direction between the unit pixels 100e on the substrate 100x. did.

In the display panel 10B according to Modification Example 2, as shown in FIG. A recess 118aB extending in the row direction is formed on the upper surface of the planarizing layer 118, and a lower power supply auxiliary wiring 129XB and a power supply auxiliary wiring 128XB (hereinafter referred to as "lower layer auxiliary wiring 129XB", "auxiliary wiring") are provided in the recess 118aB. The display panel 10 is different from the display panel 10 according to the embodiment in that the lower layer auxiliary wiring 129Y and the auxiliary wiring 128Y extending in the column direction form a lattice shape. Hereinafter, the auxiliary wiring 128XB and the auxiliary wiring 128Y will be referred to as "auxiliary wiring 128" when the row and column directions are not distinguished.

FIG. 12(b) is a schematic plan view of the display panel 10C according to modification 3 in the same area as section B in FIG.

In the display panel 10C according to modification example 3, as shown in FIG. 12(b), a row is formed on the upper surface of the flattening layer 118 for each plurality of pixels between adjacent unit pixels 100e in the column direction. Similar to the display panel 10B, a recess 118aB extending in the direction is formed, and a lower auxiliary wiring 129XB and a power feeding auxiliary wiring 128XB are formed extending within the recess 118aB.

The display panel 10C differs from the display panel 10B in that the positions in the column direction where the recess 118aB, the lower auxiliary wiring 129XB, and the auxiliary wiring 128XB are formed differ for each unit pixel 100e in the row direction. Therefore, in the display panel 10C, the lower layer auxiliary wiring 129XB and the auxiliary wiring 128XB, and the lower layer auxiliary wiring 129Y and the auxiliary wiring 128Y extending in the column direction form a so-called houndstooth pattern.

With this configuration, in the display panels 10B and 10C, the electrical resistance of the auxiliary wiring 128 can be reduced not only in the column direction but also in the row direction, thereby reducing in-plane luminance variations caused by voltage drops.

FIG. 13 is a schematic plan view of a part of the pixel region 10a of the display panel 10B according to the second modification. Further, FIG. 14 is a schematic plan view of a part of the pixel region 10a of the display panel 10C according to the third modification.

In the display panels 10B and 10C, as shown in FIGS. 13 and 14, respectively, on the row bank 122X where the lower auxiliary wiring 129XB and the auxiliary wiring 128XB extend, the row corresponding to the recess 118aB where both wirings are laid is Bank 122X does not exist. Further, on the row bank 122X where the auxiliary wiring 128XB extends, a pair of row banks 522XB are formed so as to sandwich the recess 118aB from the column direction. Row bank 522XB is taller than row bank 122X and the same height as column bank 522Y.

With this configuration, when ink containing an organic light emitting material is applied in the gap 522z between the column banks 522Y in the formation process of the light emitting layer 123 in the manufacturing process of the display panels 10B and 10C, the applied ink is transferred to the row banks 522XB. It can be stopped by. Therefore, it is possible to prevent ink from flowing from within the gap 522z into the recess 118aB where the auxiliary wiring 128XB is laid.

In addition, as described above, in the display panels 10B and 10C, the row banks 522XB are provided for each of a plurality of pixels, for example, from several tens to several hundreds of pixels, so that variations in ink application for each subpixel in the column direction may occur. The occurrence of brightness variations can be suppressed.

Furthermore, in the display panel 10C, the lower layer auxiliary wiring 129XB and the auxiliary wiring 128XB, and the lower layer auxiliary wiring 129Y and the auxiliary wiring 128Y extending in the column direction form a so-called houndstooth pattern. The presence of the auxiliary wiring 128XB makes it possible to make luminance variations (horizontal streaks) in the column direction less noticeable.

(Other variations)
In the display panel 10 according to the first embodiment, the light emitting layer 123 is configured to extend continuously in the column direction on the row bank. However, in the above structure, the light emitting layer 123 may be arranged intermittently for each pixel on the row bank.

In the display panel 10, the colors of the light emitted by the light emitting layers 123 of the sub-pixels 100se arranged in the gaps 522z between the column banks 522Y adjacent to each other in the row direction are different from each other. The light emitting layer 123 of the sub-pixel 100se arranged in the sub-pixel 100se has the same color of light. However, in the above configuration, the colors of the light emitted by the light emitting layers 123 of the subpixels 100se adjacent to each other in the row direction are the same, and the colors of the light emitted by the light emitting layers 123 of the subpixels 100se adjacent to each other in the column direction are different from each other. Good too. Alternatively, the light emitting layers 123 of adjacent sub-pixels 100se may have different colors in both rows and columns.

In the display panel 10 according to the embodiment, there are three types of pixels 100e: a red pixel, a green pixel, and a blue pixel, but the present invention is not limited to this. For example, there may be one type of light-emitting layer, or there may be four types of light-emitting layers that emit light in red, green, blue, and yellow.

Further, in the above embodiment, the pixels 100e are arranged in a matrix, but the present invention is not limited to this. For example, when the interval between pixel regions is one pitch, the present invention is effective even in a configuration in which the pixel regions are shifted by half a pitch in the column direction between adjacent gaps. In display panels that are becoming increasingly high-definition, it is difficult to visually discern slight deviations in the column direction, and even if the film thickness unevenness is arranged in a straight line (or staggered pattern) with a certain width, it visually appears as a strip. Therefore, even in such a case, the display quality of the display panel can be improved by suppressing the luminance unevenness from being arranged in the linear shape.

Further, in the above embodiment, the hole injection layer 120, the hole transport layer 121, the light emitting layer 123, and the electron transport layer 124 are present between the pixel electrode 119 and the common electrode 125, but the present invention does not have this structure. Not limited to. For example, a structure may be adopted in which only the light emitting layer 123 exists between the pixel electrode 119 and the common electrode 125 without using the hole injection layer 120, the hole transport layer 121, and the electron transport layer 124. Further, for example, a structure including a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, etc., or a structure including a plurality or all of these at the same time may be used. Further, all of these layers do not need to be made of organic compounds, and may be made of inorganic substances.

Further, in the above embodiment, the light emitting layer 123 is formed using a wet film forming process such as a printing method, a spin coating method, or an inkjet method, but the present invention is not limited thereto. For example, a dry film forming process such as a vacuum evaporation method, an electron beam evaporation method, a sputtering method, a reactive sputtering method, an ion plating method, and a vapor phase growth method can also be used. Furthermore, known materials can be used as appropriate for the materials of each component.

Further, in the above embodiment, a top emission type EL display panel is used as an example, but the present invention is not limited to this. For example, it can also be applied to a bottom emission type display panel. In that case, appropriate changes can be made to each configuration. Further, the present invention can also be applied to a quantum dot display device using colloidal quantum dots.

<Circuit configuration>
Below, the circuit configuration of the organic EL display device 1 according to the embodiment will be explained. As shown in FIG. 15, the organic EL display device 1 includes a display panel 10 and a drive control circuit section 20 connected thereto. The drive control circuit section 20 includes four drive circuits 21 to 24 and a control circuit 25.

In the display panel 10, a plurality of pixels 100e are arranged in a matrix to form a display area. Each pixel 100e is composed of three organic EL elements 100R, 100B, and 100G for each color, that is, three subpixels 100se that emit light for three colors: R (red), G (green), and B (blue). . The circuit configuration of each subpixel 100se will be explained. FIG. 16 is a circuit diagram showing the circuit configuration of each color organic EL element 100R, 100B, and 100G corresponding to each subpixel 100se of the display panel 10. In the display panel 10 according to the present embodiment, each subpixel 100se includes two transistors Tr ₁ and Tr ₂ , one capacitor C, and an organic EL element portion EL as a light emitting portion. Transistor Tr ₁ is a drive transistor, and transistor Tr ₂ is a switching transistor.

The gate G ₂ of the switching transistor Tr ₂ is connected to the scanning line Vscn, and the source S2 is connected to the data line Vdat. The drain D2 of the switching transistor Tr2 is connected to the gate _G1 of the drive transistor _Tr1 .

The drain D ₁ of the drive transistor Tr ₁ is connected to the power supply line Va, and the source S ₁ is connected to the pixel electrode (anode) of the organic EL element portion EL. Organic EL element part E
The common electrode (cathode) at L is connected to the ground line Vcat.

Note that the first end of the capacitor C is connected to the drain _D2 of the switching transistor _Tr2 and the gate _G1 of the drive transistor _Tr1 , and the second end of the capacitor C is connected to the power supply line Va.

In the display panel 10, gate lines are drawn out from the gate _G2 of each sub-pixel 100se and connected to a scanning line Vscn connected from outside the display panel 10. Similarly, source lines are drawn out from the source S ₂ of each subpixel 100se and connected to a data line Vdat connected from outside the display panel 10.

Further, the power line Va of each sub-pixel 100se and the ground line Vcat of each sub-pixel 100se are combined and connected to the power line and ground line of the organic EL display device 1.

Note that the pixel electrode 119, which is an anode, is arranged at the bottom of the EL element part, and the pixel electrode 119 is connected to the wiring connected to the source electrode of the TFT. It is also possible to adopt a configuration in which the anode is arranged at the top. In this case, the cathode located below is connected to the drain of the TFT.

Further, in the above embodiment, a configuration in which two transistors Tr ₁ and Tr ₂ are provided for one subpixel 100se is adopted, but the present invention is not limited to this. For example, one subpixel may have one transistor, or three or more transistors.

≪Supplement≫
All of the embodiments described above are preferred specific examples of the present invention. The numerical values, shapes, materials, components, arrangement positions and connection forms of the components, steps, order of steps, etc. shown in the embodiments are merely examples, and do not limit the present invention. Furthermore, among the constituent elements in the embodiments, steps that are not described in the independent claims representing the most important concept of the present invention will be described as arbitrary constituent elements constituting a more preferable embodiment.

Further, the order in which the above steps are performed is merely an example for specifically explaining the present invention, and an order other than the above may be used. Further, some of the above steps may be executed simultaneously (in parallel) with other steps.

Further, in order to facilitate understanding of the invention, the scales of the constituent elements in each of the figures mentioned in each of the above embodiments may differ from the actual scale. Further, the present invention is not limited to the description of each embodiment described above, and can be modified as appropriate without departing from the gist of the present invention.

Furthermore, at least some of the functions of the embodiments and their modifications may be combined.

Furthermore, the present invention also includes various modifications of the present embodiment that are within the scope of those skilled in the art.

The organic EL display panel and organic EL display device according to one aspect of the present disclosure can be widely used in devices such as television sets, personal computers, mobile phones, and various other electronic devices having display panels.

1 Organic EL display device 10, 10A, 10B, 10C Organic EL display panel 10a Image display area 10b Peripheral area 100 Organic EL element 100ar Organic EL element array 100e Unit pixel 100R, 100B, 100G Organic EL element for each color 100se Sub-pixel 100a Self-emission Area 100b Non-self-luminous area 100x Substrate (TFT substrate)
100p Base material 118 Flattening layer 118a, 118aB Recessed portion 119 Pixel electrode (reflecting electrode)
120 Hole injection layer 121 Hole transport layer 122 Bank 122X, 522XB Row bank 522Y Column bank 522z (522zR, 522zG, 522zB, 522zA) Gap 123 (123R, 123G, 123B) Light emitting layer 124 Electron transport layer 125 Common electrode 126 Sealing layer 127 Bonding layer 128Y, 128XB Power feeding auxiliary wiring 129Y, 129XB Lower layer power feeding auxiliary wiring 130 Upper substrate 131 Front plate 132 Color filter layer 133 Light shielding layer 1201 Metal oxide layer

Claims (15)

A substrate and
a flattening layer containing a resin material disposed on the upper surface of the substrate;
a plurality of pixel electrodes arranged in a matrix on the planarization layer;
a light-emitting layer containing an organic light-emitting material disposed on the pixel electrode;
a common electrode that covers at least above the light emitting layer and is continuously arranged in a plane direction;
a recess extending in the column direction is provided in at least one of the gaps between the pixel electrodes adjacent in the row direction on the planarization layer;
The common electrode is continuously arranged within the recess of the planarization layer,
A power supply auxiliary wiring made of a coating film extending in the column direction is disposed on the upper surface of the common electrode located in the recess of the planarization layer,
Furthermore, two column banks extending in the column direction are formed between the concave portion on the planarizing layer and the pixel electrodes adjacent to each other on both sides in the row direction,
The depth of the recess in the planarization layer is greater than the height of the column bank.
Organic EL display panel. A substrate and
a flattening layer containing a resin material disposed on the upper surface of the substrate;
a plurality of pixel electrodes arranged in a matrix on the planarization layer;
a light-emitting layer containing an organic light-emitting material disposed on the pixel electrode;
a common electrode that covers at least above the light emitting layer and is continuously arranged in a plane direction;
a recess extending in the column direction is provided in at least one of the gaps between the pixel electrodes adjacent in the row direction on the planarization layer;
The common electrode is continuously arranged within the recess of the planarization layer,
A power supply auxiliary wiring made of a coating film extending in the column direction is disposed on the upper surface of the common electrode located in the recess of the planarization layer,
Furthermore, a lower power supply auxiliary wiring made of a vapor-deposited film extending in the column direction is disposed within the recess of the planarizing layer and below the common electrode.
Organic EL display panel. A substrate and
a flattening layer containing a resin material disposed on the upper surface of the substrate;
a plurality of pixel electrodes arranged in a matrix on the planarization layer;
a light-emitting layer containing an organic light-emitting material disposed on the pixel electrode;
a common electrode that covers at least above the light emitting layer and is continuously arranged in a plane direction;
a recess extending in the column direction is provided in at least one of the gaps between the pixel electrodes adjacent in the row direction on the planarization layer;
The common electrode is continuously arranged within the recess of the planarization layer,
A power supply auxiliary wiring made of a coating film extending in the column direction is disposed on the upper surface of the common electrode located in the recess of the planarization layer,
Furthermore, an electrode plate is provided on the planarization layer and extends along the periphery of the substrate outside the region where the pixel electrode is present in a plan view,
The recessed portion of the planarization layer is opened to near the periphery of the substrate in plan view,
The electrode plate is continuously arranged within the recess of the planarization layer,
The power supply auxiliary wiring extends to the upper surface of the electrode plate in plan view.
Organic EL display panel. A substrate and
a flattening layer containing a resin material disposed on the upper surface of the substrate;
a plurality of pixel electrodes arranged in a matrix on the planarization layer;
a light-emitting layer containing an organic light-emitting material disposed on the pixel electrode;
a common electrode that covers at least above the light emitting layer and is continuously arranged in a plane direction;
a recess extending in the column direction is provided in at least one of the gaps between the pixel electrodes adjacent in the row direction on the planarization layer;
The common electrode is continuously arranged within the recess of the planarization layer,
A power supply auxiliary wiring made of a coating film extending in the column direction is disposed on the upper surface of the common electrode located in the recess of the planarization layer,
Furthermore, an electrode plate is provided on the planarization layer and extends along the periphery of the substrate outside the region where the pixel electrode is present in a plan view,
The common electrode extends to the upper surface of the electrode plate in plan view.
Organic EL display panel. A substrate and
a flattening layer containing a resin material disposed on the upper surface of the substrate;
a plurality of pixel electrodes arranged in a matrix on the planarization layer;
a light-emitting layer containing an organic light-emitting material disposed on the pixel electrode;
a common electrode that covers at least above the light emitting layer and is continuously arranged in a plane direction;
a recess extending in the column direction is provided in at least one of the gaps between the pixel electrodes adjacent in the row direction on the planarization layer;
The common electrode is continuously arranged within the recess of the planarization layer,
A power supply auxiliary wiring made of a coating film extending in the column direction is disposed on the upper surface of the common electrode located in the recess of the planarization layer,
Furthermore, an electrode plate is provided on the planarization layer and extends along the periphery of the substrate outside the region where the pixel electrode is present in a plan view,
The recessed portion of the planarization layer is opened to an end point located outside the region where the pixel electrode exists and inward from the electrode plate in plan view,
The power supply auxiliary wiring extends to the end point in plan view,
The common electrode extends to the upper surface of the electrode plate in plan view.
Organic EL display panel. The pixel electrode and the lower layer power supply auxiliary wiring are made of a vapor deposited film,
The organic EL display panel according to claim 2 , wherein the pixel electrode and the lower layer power supply auxiliary wiring are made of the same material. The organic EL display panel according to claim 1 , wherein the common electrode is made of a deposited film and is continuously formed above the column bank. The depth of the recess of the planarization layer is 2 μm or more and 5 μm or less,
The organic EL display panel according to any one of claims 1 to 7 , wherein the power feeding auxiliary wiring contains silver and has a thickness of 0.5 μm or more and 2 μm or less. When the recess is a first recess and the auxiliary power supply wiring is a first auxiliary power supply wiring,
Further, a second recess extending in the row direction is provided in at least one of the gaps between the pixel electrodes adjacent in the column direction on the planarizing layer,
The common electrode is continuously arranged within the second recess of the planarization layer,
Any one of claims 1 to 8 , wherein a second power supply auxiliary wiring made of a coating film extending in the row direction is disposed on the upper surface of the common electrode located in the second recess of the planarizing layer. The organic EL display panel described in . A substrate and
a flattening layer containing a resin material disposed on the upper surface of the substrate;
a plurality of pixel electrodes arranged in a matrix on the planarization layer;
a light-emitting layer containing an organic light-emitting material disposed on the pixel electrode;
a common electrode that covers at least above the light emitting layer and is continuously arranged in a plane direction;
a recess extending in the column direction is provided in at least one of the gaps between the pixel electrodes adjacent in the row direction on the planarization layer;
The common electrode is continuously arranged within the recess of the planarization layer,
A power supply auxiliary wiring made of a coating film extending in the column direction is disposed on the upper surface of the common electrode located in the recess of the planarization layer,
When the recess is a first recess and the auxiliary power supply wiring is a first auxiliary power supply wiring,
Further, a second recess extending in the row direction is provided in at least one of the gaps between the pixel electrodes adjacent in the column direction on the planarizing layer,
The common electrode is continuously arranged within the second recess of the planarization layer,
A second power supply auxiliary wiring made of a coating film extending in the row direction is disposed on the upper surface of the common electrode located in the second recess of the planarization layer,
The column direction positions of the second recess and the second power feeding auxiliary wiring vary depending on the row direction positions of the pixel electrodes that sandwich the gap in the column direction in which the second recess is formed.
Organic EL display panel. A substrate and
a flattening layer containing a resin material disposed on the upper surface of the substrate;
a plurality of pixel electrodes arranged in a matrix on the planarization layer;
a light-emitting layer containing an organic light-emitting material disposed on the pixel electrode;
a common electrode that covers at least above the light emitting layer and is continuously arranged in a plane direction;
a recess extending in the column direction is provided in at least one of the gaps between the pixel electrodes adjacent in the row direction on the planarization layer;
The common electrode is continuously arranged within the recess of the planarization layer,
A power supply auxiliary wiring made of a coating film extending in the column direction is disposed on the upper surface of the common electrode located in the recess of the planarization layer,
When the recess is a first recess and the auxiliary power supply wiring is a first auxiliary power supply wiring,
Further, a second recess extending in the row direction is provided in at least one of the gaps between the pixel electrodes adjacent in the column direction on the planarization layer,
The common electrode is continuously arranged within the second recess of the planarization layer,
A second power supply auxiliary wiring made of a coating film extending in the row direction is disposed on the upper surface of the common electrode located in the second recess of the planarization layer,
The second recess and the second power supply auxiliary wiring are arranged for each of the plurality of pixel electrodes in the column direction.
Organic EL display panel. A substrate and
a flattening layer containing a resin material disposed on the upper surface of the substrate;
a plurality of pixel electrodes arranged in a matrix on the planarization layer;
a light-emitting layer containing an organic light-emitting material disposed on the pixel electrode;
a common electrode that covers at least above the light emitting layer and is continuously arranged in a plane direction;
a recess extending in the column direction is provided in at least one of the gaps between the pixel electrodes adjacent in the row direction on the planarization layer;
The common electrode is continuously arranged within the recess of the planarization layer,
A power supply auxiliary wiring made of a coating film extending in the column direction is disposed on the upper surface of the common electrode located in the recess of the planarization layer,
When the recess is a first recess and the auxiliary power supply wiring is a first auxiliary power supply wiring,
Further, a second recess extending in the row direction is provided in at least one of the gaps between the pixel electrodes adjacent in the column direction on the planarizing layer,
The common electrode is continuously arranged within the second recess of the planarization layer,
A second power supply auxiliary wiring made of a coating film extending in the row direction is disposed on the upper surface of the common electrode located in the second recess of the planarization layer,
Two row banks extending in the row direction are formed between the second recess on the planarization layer and the pixel electrodes adjacent to each other on both sides in the column direction,
The height of the row bank is smaller than the depth of the second recess.
Organic EL display panel. When the column bank is a first column bank,
Furthermore, a second column bank is formed extending in the column direction between the pixel electrodes and the pixel electrodes adjacent in the row direction on the planarization layer,
The organic light-emitting layer is made of a coating film, and is disposed continuously in the column direction in the gap between the first column bank and the second column bank and in the gap between the second column banks adjacent in the row direction. The organic EL display panel according to claim 1 . a step of preparing a substrate;
forming a flattening layer containing a resin material disposed on the upper surface of the substrate;
forming a plurality of pixel electrodes in a matrix on the planarization layer;
forming a light emitting layer containing an organic light emitting material disposed on the pixel electrode;
arranging a common electrode continuously in a planar direction so as to cover at least an upper part of the light emitting layer,
In the step of forming the planarizing layer, a recess is formed extending in the column direction in at least one gap among gaps in regions where the pixel electrodes are to be formed adjacent in the row direction on the planarizing layer. ,
In the step of forming the common electrode, the common electrode is continuously formed within the recess of the planarization layer,
Furthermore, after the step of arranging the common electrode, a step of forming an auxiliary power supply wiring made of a coating film extending in the column direction on the upper surface of the common electrode located in the recess of the planarization layer,
After the step of forming the pixel electrode and before the step of forming the light emitting layer,
Further, the step of forming two column banks extending in the column direction between the concave portion on the planarization layer and the pixel electrodes adjacent to each other on both sides in the row direction,
In the step of forming the power supply auxiliary wiring, the power supply auxiliary wiring is formed by applying ink containing a metal material to the gap between the column banks and drying it.
A method for manufacturing an organic EL display panel. a step of preparing a substrate;
forming a flattening layer containing a resin material disposed on the upper surface of the substrate;
forming a plurality of pixel electrodes in a matrix on the planarization layer;
forming a light emitting layer containing an organic light emitting material disposed on the pixel electrode;
arranging a common electrode continuously in a planar direction so as to cover at least an upper part of the light emitting layer,
In the step of forming the planarizing layer, a recess is formed extending in the column direction in at least one gap among gaps in regions where the pixel electrodes are to be formed adjacent in the row direction on the planarizing layer. ,
In the step of forming the common electrode, the common electrode is continuously formed within the recess of the planarization layer,
Furthermore, after the step of arranging the common electrode, a step of forming an auxiliary power supply wiring made of a coating film extending in the column direction on the upper surface of the common electrode located in the recess of the planarization layer,
In the step of forming the pixel electrode, further, a lower power supply auxiliary wiring made of a vapor deposited film extending in the column direction is formed in the recess of the planarizing layer and below the common electrode.
A method for manufacturing an organic EL display panel.

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