JP7410752B2 - パッケージ構造とその電子装置 - Google Patents
パッケージ構造とその電子装置 Download PDFInfo
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- 230000000007 visual effect Effects 0.000 claims description 88
- 239000000758 substrate Substances 0.000 claims description 65
- 239000004020 conductor Substances 0.000 claims description 36
- 230000031700 light absorption Effects 0.000 claims description 27
- 230000005693 optoelectronics Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 description 33
- 239000000463 material Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 238000005520 cutting process Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000006096 absorbing agent Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
10 硬質キャリア板
11 マザーボード
111、111’、111’’ 基板
112 パターン化配線
12 光反射層
13 視覚的ユニット
131 光電素子
14 パッケージ
15、34 光吸収層
16 第1の電気的接続パッド
17 第2の電気的接続パッド
18 導電体
2 駆動回路板
21 導電層
3 電子装置
31 導電性材料
32 光吸収体
33 バインダ
3B-3B、4B-4B、5B-5B、6B-6B 切断線
DA 第2領域
H スルーホール
LA 第1領域
S01~S04 ステップ
Claims (10)
- パッケージ構造であって、
基板と、
前記基板上に設けられ、複数のパターン化配線を含む導線層と、
前記基板上に設けられており、これら前記パターン化配線の少なくとも一つに対応して設けられ且つ電気的に接続されている光電素子が設けられている第1領域と、前記第1領域の周囲に沿って画成されている第2領域とを有する、視覚的ユニットと、
前記基板上に設けられており、前記視覚的ユニットの前記第1領域を完全に覆うとともに、対応する前記パターン化配線を部分的に覆っており、且つその内部の平均反射率がその外部の平均反射率よりも大きい、パッケージと、
前記基板に設けられ、且つ前記導線層のこれら前記パターン化配線に対応している複数のスルーホールと、
各前記スルーホールに設けられ、且つ対応する前記パターン化配線に電気的に接続されており、対応する前記パターン化配線を介して前記視覚的ユニットの前記光電素子に電気的に接続されている、導電体と、を備える、ことを特徴とするパッケージ構造。 - 前記基板がソフトプレートである、請求項1に記載のパッケージ構造。
- 前記基板が光吸収板又は光反射板である、請求項1に記載のパッケージ構造。
- 更に、前記基板上に設けられており、前記導線層の上又は下に位置し、少なくとも一部分が前記視覚的ユニットの前記第1領域を画成している、光反射層を備える、請求項1に記載のパッケージ構造。
- 更に、前記基板上に設けられており、前記視覚的ユニットの前記第1領域の周囲に沿って設けられており、且つ前記視覚的ユニットの前記第2領域を画成している、光吸収層を備える、請求項1に記載のパッケージ構造。
- 更に、前記基板又は前記光反射層上に設けられており、前記視覚的ユニットの前記第1領域の周囲に沿って設けられており、且つ前記視覚的ユニットの前記第2領域を画成している、光吸収層を備える、請求項4に記載のパッケージ構造。
- 前記導線層が前記光反射層と前記基板との間に位置している、請求項4に記載のパッケージ構造。
- 前記導線層が前記光反射層と前記基板との間に位置している、又は前記光反射層が前記導線層と前記基板との間に位置している、請求項6に記載のパッケージ構造。
- 更に、前記基板上に設けられており、各々が前記視覚的ユニットの周囲に設けられており、且つ前記導線層のこれら前記パターン化配線に対応している、複数の第1の電気的接続パッドと、
前記基板上に設けられており、各々が前記導線層上に設けられており、且つ各々を介して前記視覚的ユニットの前記光電素子が前記導線層に電気的に接続されている、複数の第2の電気的接続パッドと、を更に備える、請求項1に記載のパッケージ構造。 - 導電層を含む駆動回路板と、
前記駆動回路板上に設けられており、請求項1ないし9のいずれか一項に記載の複数のパッケージ構造と、
前記導電層上に設けられている複数の導電性材料と、を備える電子装置であって、
各前記パッケージ構造の前記光電素子がこれら前記パターン化配線、これら前記導電性材料を介して前記駆動回路板の前記導電層に電気的に接続されている、ことを特徴とする電子装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108107173 | 2019-03-05 | ||
TW108107173A TWI838359B (zh) | 2019-03-05 | 封裝結構及其製造方法、與電子裝置 |
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JP2020144366A JP2020144366A (ja) | 2020-09-10 |
JP7410752B2 true JP7410752B2 (ja) | 2024-01-10 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US11315909B2 (en) * | 2019-12-20 | 2022-04-26 | X Display Company Technology Limited | Displays with embedded light emitters |
TWI751554B (zh) * | 2020-05-12 | 2022-01-01 | 台灣愛司帝科技股份有限公司 | 影像顯示器及其拼接式電路承載與控制模組 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120178194A1 (en) | 2007-05-31 | 2012-07-12 | National Aeronautics And Space Administration (Nasa) | Method of Manufacturing a Light Emitting, Photovoltaic or Other Electronic Apparatus and System |
JP2012156442A (ja) | 2011-01-28 | 2012-08-16 | Nichia Chem Ind Ltd | 発光装置 |
US20170294424A1 (en) | 2016-04-08 | 2017-10-12 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the same |
-
2020
- 2020-03-02 US US16/806,296 patent/US11075330B2/en active Active
- 2020-03-03 JP JP2020036236A patent/JP7410752B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120178194A1 (en) | 2007-05-31 | 2012-07-12 | National Aeronautics And Space Administration (Nasa) | Method of Manufacturing a Light Emitting, Photovoltaic or Other Electronic Apparatus and System |
JP2012156442A (ja) | 2011-01-28 | 2012-08-16 | Nichia Chem Ind Ltd | 発光装置 |
US20170294424A1 (en) | 2016-04-08 | 2017-10-12 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the same |
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Publication number | Publication date |
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US11075330B2 (en) | 2021-07-27 |
JP2020144366A (ja) | 2020-09-10 |
US20200287112A1 (en) | 2020-09-10 |
TW202034410A (zh) | 2020-09-16 |
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