JP7407518B2 - ネガ型感光性樹脂組成物及びその製造方法 - Google Patents

ネガ型感光性樹脂組成物及びその製造方法 Download PDF

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Publication number
JP7407518B2
JP7407518B2 JP2019079223A JP2019079223A JP7407518B2 JP 7407518 B2 JP7407518 B2 JP 7407518B2 JP 2019079223 A JP2019079223 A JP 2019079223A JP 2019079223 A JP2019079223 A JP 2019079223A JP 7407518 B2 JP7407518 B2 JP 7407518B2
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photosensitive resin
resin composition
polyimide precursor
negative photosensitive
general formula
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Japanese (ja)
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JP2020091464A (ja
JP2020091464A5 (fr
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秀二郎 塩崎
知士 小倉
竜也 平田
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Asahi Kasei Corp
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Asahi Kasei Corp
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Priority to JP2023146953A priority Critical patent/JP2023171788A/ja
Priority to JP2023206198A priority patent/JP2024019341A/ja
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  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2019079223A 2018-04-27 2019-04-18 ネガ型感光性樹脂組成物及びその製造方法 Active JP7407518B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023146953A JP2023171788A (ja) 2018-04-27 2023-09-11 ネガ型感光性樹脂組成物及びその製造方法
JP2023206198A JP2024019341A (ja) 2018-04-27 2023-12-06 ネガ型感光性樹脂組成物及びその製造方法

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2018087319 2018-04-27
JP2018087350 2018-04-27
JP2018087319 2018-04-27
JP2018087350 2018-04-27
JP2018092007 2018-05-11
JP2018092007 2018-05-11
JP2018203990 2018-10-30
JP2018203990 2018-10-30
JP2018221555 2018-11-27
JP2018221555 2018-11-27

Related Child Applications (1)

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JP2023146953A Division JP2023171788A (ja) 2018-04-27 2023-09-11 ネガ型感光性樹脂組成物及びその製造方法

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JP2020091464A JP2020091464A (ja) 2020-06-11
JP2020091464A5 JP2020091464A5 (fr) 2022-03-04
JP7407518B2 true JP7407518B2 (ja) 2024-01-04

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JP2019079223A Active JP7407518B2 (ja) 2018-04-27 2019-04-18 ネガ型感光性樹脂組成物及びその製造方法
JP2023146953A Pending JP2023171788A (ja) 2018-04-27 2023-09-11 ネガ型感光性樹脂組成物及びその製造方法
JP2023206198A Pending JP2024019341A (ja) 2018-04-27 2023-12-06 ネガ型感光性樹脂組成物及びその製造方法

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JP2023146953A Pending JP2023171788A (ja) 2018-04-27 2023-09-11 ネガ型感光性樹脂組成物及びその製造方法
JP2023206198A Pending JP2024019341A (ja) 2018-04-27 2023-12-06 ネガ型感光性樹脂組成物及びその製造方法

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JP (3) JP7407518B2 (fr)
TW (2) TWI803627B (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230110416A1 (en) * 2020-01-30 2023-04-13 Asahi Kasei Kabushiki Kaisha Negative photosensitive resin composition and method for manufacturing cured relief pattern
WO2022202907A1 (fr) * 2021-03-26 2022-09-29 住友ベークライト株式会社 Composition de résine photosensible, film de résine et dispositif électronique
CN115701440B (zh) * 2021-08-02 2024-07-30 华为技术有限公司 聚酰亚胺复合物薄膜及其制备方法、电子设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001302746A (ja) 2000-04-21 2001-10-31 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
WO2017110982A1 (fr) 2015-12-25 2017-06-29 富士フイルム株式会社 Résine, composition, film durci, procédé de production d'un film durci et dispositif semi-conducteur

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11282155A (ja) * 1998-03-27 1999-10-15 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いたソルダーレジストの製造法
JP6923334B2 (ja) * 2016-04-14 2021-08-18 旭化成株式会社 感光性樹脂組成物及び硬化レリーフパターンの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001302746A (ja) 2000-04-21 2001-10-31 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
WO2017110982A1 (fr) 2015-12-25 2017-06-29 富士フイルム株式会社 Résine, composition, film durci, procédé de production d'un film durci et dispositif semi-conducteur

Also Published As

Publication number Publication date
JP2020091464A (ja) 2020-06-11
TW202334283A (zh) 2023-09-01
TW201945439A (zh) 2019-12-01
JP2024019341A (ja) 2024-02-08
TWI803627B (zh) 2023-06-01
JP2023171788A (ja) 2023-12-05

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