JP7405088B2 - Photosensitive resin composition, method for producing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic components - Google Patents
Photosensitive resin composition, method for producing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic components Download PDFInfo
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- JP7405088B2 JP7405088B2 JP2020550511A JP2020550511A JP7405088B2 JP 7405088 B2 JP7405088 B2 JP 7405088B2 JP 2020550511 A JP2020550511 A JP 2020550511A JP 2020550511 A JP2020550511 A JP 2020550511A JP 7405088 B2 JP7405088 B2 JP 7405088B2
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- photosensitive resin
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- 239000011342 resin composition Substances 0.000 title claims description 66
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 239000010410 layer Substances 0.000 title claims description 23
- 239000011229 interlayer Substances 0.000 title claims description 19
- 230000001681 protective effect Effects 0.000 title claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 63
- 229920005989 resin Polymers 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 55
- 125000001931 aliphatic group Chemical group 0.000 claims description 38
- 150000001875 compounds Chemical class 0.000 claims description 35
- 239000000178 monomer Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 27
- 125000000217 alkyl group Chemical group 0.000 claims description 26
- 125000003118 aryl group Chemical group 0.000 claims description 25
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 24
- -1 phenylimino Chemical group 0.000 claims description 21
- 239000004642 Polyimide Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 13
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 11
- 239000002243 precursor Substances 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 10
- 238000007363 ring formation reaction Methods 0.000 claims description 10
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 claims description 8
- OJGMBLNIHDZDGS-UHFFFAOYSA-N N-Ethylaniline Chemical compound CCNC1=CC=CC=C1 OJGMBLNIHDZDGS-UHFFFAOYSA-N 0.000 claims description 8
- AFBPFSWMIHJQDM-UHFFFAOYSA-N N-methylaniline Chemical compound CNC1=CC=CC=C1 AFBPFSWMIHJQDM-UHFFFAOYSA-N 0.000 claims description 8
- 239000003963 antioxidant agent Substances 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 6
- 125000003944 tolyl group Chemical group 0.000 claims description 6
- OJPDDQSCZGTACX-UHFFFAOYSA-N 2-[n-(2-hydroxyethyl)anilino]ethanol Chemical compound OCCN(CCO)C1=CC=CC=C1 OJPDDQSCZGTACX-UHFFFAOYSA-N 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- MWGATWIBSKHFMR-UHFFFAOYSA-N 2-anilinoethanol Chemical compound OCCNC1=CC=CC=C1 MWGATWIBSKHFMR-UHFFFAOYSA-N 0.000 claims description 4
- FHQRDEDZJIFJAL-UHFFFAOYSA-N 4-phenylmorpholine Chemical compound C1COCCN1C1=CC=CC=C1 FHQRDEDZJIFJAL-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000003505 polymerization initiator Substances 0.000 claims description 4
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- 125000000753 cycloalkyl group Chemical group 0.000 claims description 3
- 239000000047 product Substances 0.000 description 65
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 18
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- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 10
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 10
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- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 9
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- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 8
- 238000011161 development Methods 0.000 description 8
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 7
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- 238000011156 evaluation Methods 0.000 description 7
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- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XYXJKPCGSGVSBO-UHFFFAOYSA-N 1,3,5-tris[(4-tert-butyl-3-hydroxy-2,6-dimethylphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C)=C1CN1C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C1=O XYXJKPCGSGVSBO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 238000002329 infrared spectrum Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 230000036211 photosensitivity Effects 0.000 description 3
- 229920005575 poly(amic acid) Polymers 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- JUVSRZCUMWZBFK-UHFFFAOYSA-N 2-[n-(2-hydroxyethyl)-4-methylanilino]ethanol Chemical compound CC1=CC=C(N(CCO)CCO)C=C1 JUVSRZCUMWZBFK-UHFFFAOYSA-N 0.000 description 2
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
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- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 2
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical class C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 2
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- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 description 1
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- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
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Images
Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/145—Polyamides; Polyesteramides; Polyimides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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Description
本発明は、感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品に関する。 The present invention relates to a photosensitive resin composition, a method for producing a patterned cured product, a cured product, an interlayer insulating film, a cover coat layer, a surface protective film, and an electronic component.
従来、半導体素子の表面保護膜及び層間絶縁膜には、優れた耐熱性と電気特性、機械特性等を併せ持つポリイミドやポリベンゾオキサゾールが用いられている。近年、これらの樹脂自身に感光特性を付与した感光性樹脂組成物が用いられており、これを用いるとパターン硬化物の製造工程が簡略化でき、煩雑な製造工程を短縮できる(例えば、特許文献1参照)。 Conventionally, polyimide and polybenzoxazole, which have excellent heat resistance, electrical properties, mechanical properties, etc., have been used for surface protection films and interlayer insulating films of semiconductor devices. In recent years, photosensitive resin compositions in which these resins themselves have been given photosensitivity properties have been used, and by using these, the manufacturing process of patterned cured products can be simplified and the complicated manufacturing process can be shortened (for example, as disclosed in Patent Document (see 1).
ところで、近年、コンピュータの高性能化を支えてきたトランジスタの微細化は、スケーリング則の限界に来ており、さらなる高性能化や高速化のために半導体素子を3次元的に積層する積層デバイス構造が注目を集めている。 By the way, in recent years, the miniaturization of transistors, which has supported the high performance of computers, has reached the limit of the scaling law, and in order to further improve performance and speed, a stacked device structure in which semiconductor elements are stacked three-dimensionally is being developed. is attracting attention.
積層デバイス構造の中でも、マルチダイファンアウトウエハレベルパッケージ(Multi-die Fanout Wafer Level Packaging)は、一つのパッケージの中に複数のダイを一括封止して製造するパッケージであり、従来から提案されているファンアウトウエハレベルパッケージ(一つのパッケージの中に一つのダイを封止して製造する)よりも低コスト化、高性能化が期待できるので、非常に注目を集めている。 Among stacked device structures, multi-die fanout wafer level packaging (Multi-die Fanout Wafer Level Packaging) is a package manufactured by sealing multiple dies in one package, and has not been proposed in the past. It is attracting a lot of attention because it is expected to be lower cost and have higher performance than conventional fan-out wafer-level packages (manufactured by sealing one die in one package).
マルチダイファンアウトウエハレベルパッケージの作製においては、高性能なダイの保護や耐熱性の低い封止材を保護し、歩留まりを向上させる観点から、低温硬化性が強く求められている(例えば、特許文献2参照)。 In the fabrication of multi-die fan-out wafer-level packages, low-temperature curing properties are strongly required from the viewpoint of protecting high-performance die, protecting encapsulants with low heat resistance, and improving yield (for example, patented (See Reference 2).
また、樹脂組成物として、ポリイミド前駆体を含む樹脂組成物が開示されている(例えば、特許文献3参照)。 Further, as a resin composition, a resin composition containing a polyimide precursor is disclosed (for example, see Patent Document 3).
本発明の目的は、230℃以下の低温硬化であっても、機械特性に優れた硬化物を形成できる、保存安定性に優れる感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品を提供することである。 The purpose of the present invention is to provide a photosensitive resin composition with excellent storage stability, which can form a cured product with excellent mechanical properties even when cured at a low temperature of 230°C or lower, a method for producing a patterned cured product, a cured product, and an interlayer The purpose of the present invention is to provide insulating films, cover coat layers, surface protective films, and electronic components.
本発明によれば、以下の感光性樹脂組成物等が提供される。
1.(A)重合性の不飽和結合を有するポリイミド前駆体、
(B)重合性モノマー、
(C)光重合開始剤、
(D)環化触媒、及び
(E)溶剤を含有する感光性樹脂組成物。
2.前記(A)成分が、下記式(1)で表される構造単位を有するポリイミド前駆体である1に記載の感光性樹脂組成物。
3.前記(D)成分が、N-フェニルジエタノールアミン、N-メチルアニリン、N-エチルアニリン、N,N-ジメチルアニリン、N-フェニルエタノールアミン、4-フェニルモルフォリン及び2,2′-(4-メチルフェニルイミノ)ジエタノールからなる群から選択される1以上である1又は2に記載の感光性樹脂組成物。
4.前記(D)成分が、下記式(17)で表される化合物を含む1又は2に記載の感光性樹脂組成物。
5.前記(C)成分が(C1)下記式(15)で表される化合物及び(C2)下記式(16)で表される化合物を含む1~4のいずれかに記載の感光性樹脂組成物。
6.前記(B)成分が、脂肪族環状骨格を有する重合性モノマーを含む1~5のいずれかに記載の感光性樹脂組成物。
7.前記(B)成分が、重合性の不飽和二重結合を含む基を有する1~6のいずれかに記載の感光性樹脂組成物。
8.前記(B)成分が、2以上の重合性の不飽和二重結合を含む基を有する重合性モノマーである7に記載の感光性樹脂組成物。
9.前記(B)成分が、下記式(3)で表される重合性モノマーを含む1~7のいずれかに記載の感光性樹脂組成物。
10.n1+n2が、2又は3である9に記載の感光性樹脂組成物。
11.前記(B)成分が、下記式(5)で表される重合性モノマーを含む1~10のいずれかに記載の感光性樹脂組成物。
13.さらに、酸化防止剤を含む1~12のいずれかに記載の感光性樹脂組成物。
14.1~13のいずれかに記載の感光性樹脂組成物を基板上に塗布、乾燥して感光性樹脂膜を形成する工程と、
前記感光性樹脂膜をパターン露光して、樹脂膜を得る工程と、
前記パターン露光後の樹脂膜を、有機溶剤を用いて、現像し、パターン樹脂膜を得る工程と、
前記パターン樹脂膜を加熱処理する工程と、を含むパターン硬化物の製造方法。
15.前記加熱処理の温度が230℃以下である14に記載のパターン硬化物の製造方法。
16.1~13のいずれかに記載の感光性樹脂組成物を硬化した硬化物。
17.パターン硬化物である16に記載の硬化物。
18.16又は17に記載の硬化物を用いて作製された層間絶縁膜、カバーコート層又は表面保護膜。
19.18に記載の層間絶縁膜、カバーコート層又は表面保護膜を含む電子部品。According to the present invention, the following photosensitive resin compositions and the like are provided.
1. (A) a polyimide precursor having a polymerizable unsaturated bond,
(B) a polymerizable monomer,
(C) photopolymerization initiator,
(D) A cyclization catalyst, and (E) a photosensitive resin composition containing a solvent.
2. 2. The photosensitive resin composition according to 1, wherein the component (A) is a polyimide precursor having a structural unit represented by the following formula (1).
3. The component (D) is N-phenyldiethanolamine, N-methylaniline, N-ethylaniline, N,N-dimethylaniline, N-phenylethanolamine, 4-phenylmorpholine, and 2,2'-(4-
4. 3. The photosensitive resin composition according to 1 or 2, wherein the component (D) contains a compound represented by the following formula (17).
5. 5. The photosensitive resin composition according to any one of 1 to 4, wherein the component (C) comprises (C1) a compound represented by the following formula (15) and (C2) a compound represented by the following formula (16).
6. 6. The photosensitive resin composition according to any one of 1 to 5, wherein the component (B) contains a polymerizable monomer having an aliphatic cyclic skeleton.
7. 7. The photosensitive resin composition according to any one of 1 to 6, wherein the component (B) has a group containing a polymerizable unsaturated double bond.
8. 8. The photosensitive resin composition according to 7, wherein the component (B) is a polymerizable monomer having a group containing two or more polymerizable unsaturated double bonds.
9. 8. The photosensitive resin composition according to any one of 1 to 7, wherein the component (B) contains a polymerizable monomer represented by the following formula (3).
10. 10. The photosensitive resin composition according to 9, wherein n1+n2 is 2 or 3.
11. The photosensitive resin composition according to any one of 1 to 10, wherein the component (B) contains a polymerizable monomer represented by the following formula (5).
13. 13. The photosensitive resin composition according to any one of 1 to 12, further comprising an antioxidant.
14. Applying the photosensitive resin composition according to any one of 1 to 13 on a substrate and drying it to form a photosensitive resin film;
pattern-exposing the photosensitive resin film to obtain a resin film;
Developing the resin film after the pattern exposure using an organic solvent to obtain a pattern resin film;
A method for producing a patterned cured product, comprising the step of heat-treating the patterned resin film.
15. 15. The method for producing a patterned cured product according to 14, wherein the temperature of the heat treatment is 230° C. or lower.
16. A cured product obtained by curing the photosensitive resin composition according to any one of 1 to 13.
17. 17. The cured product according to 16, which is a pattern cured product.
18. An interlayer insulating film, a cover coat layer, or a surface protective film produced using the cured product according to 16 or 17.
19. An electronic component comprising an interlayer insulating film, a cover coat layer, or a surface protective film according to 18.
本発明によれば、230℃以下の低温硬化であっても、機械特性に優れた硬化物を形成できる、保存安定性に優れる感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品が提供できる。 According to the present invention, a photosensitive resin composition with excellent storage stability that can form a cured product with excellent mechanical properties even when cured at a low temperature of 230°C or lower, a method for producing a patterned cured product, a cured product, and an interlayer Insulating films, cover coat layers, surface protection films, and electronic components can be provided.
以下に、本発明の感光性樹脂組成物、それを用いたパターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品の実施の形態を詳細に説明する。尚、以下の実施の形態により本発明が限定されるものではない。 Below, embodiments of the photosensitive resin composition of the present invention, a method for producing a patterned cured product using the same, a cured product, an interlayer insulating film, a cover coat layer, a surface protective film, and an electronic component will be described in detail. Note that the present invention is not limited to the following embodiments.
本明細書において「A又はB」とは、AとBのどちらか一方を含んでいればよく、両方とも含んでいてもよい。また、本明細書において「工程」との語は、独立した工程だけではなく、他の工程と明確に区別できない場合であってもその工程の所期の作用が達成されれば、本用語に含まれる。
「~」を用いて示された数値範囲は、「~」の前後に記載される数値をそれぞれ最小値及び最大値として含む範囲を示す。また、本明細書において組成物中の各成分の含有量は、組成物中に各成分に該当する物質が複数存在する場合、特に断らない限り、組成物中に存在する当該複数の物質の合計量を意味する。さらに、例示材料は特に断らない限り単独で用いてもよいし、2種以上を組み合わせて用いてもよい。
本明細書における「(メタ)アクリル基」とは、「アクリル基」及び「メタクリル基」を意味する。In this specification, "A or B" may include either A or B, or may include both. In addition, in this specification, the term "process" does not only refer to an independent process, but also refers to a process that cannot be clearly distinguished from other processes, as long as the intended effect of the process is achieved. included.
A numerical range indicated using "~" indicates a range that includes the numerical values written before and after "~" as the minimum and maximum values, respectively. In addition, in this specification, if there are multiple substances corresponding to each component in the composition, unless otherwise specified, the content of each component in the composition refers to the total content of the multiple substances present in the composition. means quantity. Furthermore, unless otherwise specified, the exemplified materials may be used alone or in combination of two or more.
The "(meth)acrylic group" in this specification means an "acrylic group" and a "methacrylic group."
本発明の感光性樹脂組成物は、(A)重合性の不飽和結合を有するポリイミド前駆体(以下、「(A)成分」ともいう。)、(B)重合性モノマー(「架橋剤」ともいう。)(以下、「(B)成分」ともいう。)、(C)光重合開始剤(以下、「(C)成分」ともいう。)、(D)環化触媒(以下、「(D)成分」ともいう。)、及び
(E)溶剤(以下、「(E)成分」ともいう。)を含有する。The photosensitive resin composition of the present invention comprises (A) a polyimide precursor having a polymerizable unsaturated bond (hereinafter also referred to as "component (A)"), (B) a polymerizable monomer (also referred to as a "crosslinking agent"). ) (hereinafter also referred to as "component (B)"), (C) photopolymerization initiator (hereinafter also referred to as "component (C)"), (D) cyclization catalyst (hereinafter also referred to as "(D ), and (E) a solvent (hereinafter also referred to as "component (E)").
これにより、230℃以下の低温硬化であっても、機械特性に優れた硬化物を形成できる。
また、保存安定性を向上させることができる。
また、任意の効果として、230℃以下の低温硬化であっても、環化率に優れた硬化物を形成できる。
任意の効果として、感度を向上させることができる。Thereby, a cured product with excellent mechanical properties can be formed even when cured at a low temperature of 230° C. or lower.
Moreover, storage stability can be improved.
Further, as an optional effect, a cured product with an excellent cyclization rate can be formed even when curing at a low temperature of 230° C. or lower.
As an optional effect, sensitivity can be improved.
本発明の感光性樹脂組成物は、ネガ型感光性樹脂組成物であることが好ましい。本発明の感光性樹脂組成物は、電子部品用材料であることが好ましい。 The photosensitive resin composition of the present invention is preferably a negative photosensitive resin composition. The photosensitive resin composition of the present invention is preferably a material for electronic parts.
(A)成分としては、特に制限はされないが、パターニング時の光源にi線を用いた場合の透過率が高く、230℃以下の低温硬化時にも高い硬化物特性を示すポリイミド前駆体が好ましい。 Component (A) is not particularly limited, but is preferably a polyimide precursor that has high transmittance when i-line is used as a light source during patterning and exhibits high cured product properties even when cured at a low temperature of 230° C. or lower.
重合性の不飽和結合としては、炭素炭素の二重結合等が挙げられる。 Examples of the polymerizable unsaturated bond include a carbon-carbon double bond.
(A)成分は、下記式(1)で表される構造単位を有するポリイミド前駆体であることが好ましい。これにより、i線の透過率が高く、230℃以下の低温硬化時にも良好な硬化物を形成できる。
式(1)で表される構造単位の含有量は、(A)成分の全構成単位に対して、50モル%以上であることが好ましく、80モル%以上がより好ましく、90モル%以上がさらに好ましい。上限は特に限定されず、100モル%でもよい。Component (A) is preferably a polyimide precursor having a structural unit represented by the following formula (1). As a result, the i-line transmittance is high, and a good cured product can be formed even when cured at a low temperature of 230° C. or lower.
The content of the structural unit represented by formula (1) is preferably 50 mol% or more, more preferably 80 mol% or more, and 90 mol% or more of the total structural units of component (A). More preferred. The upper limit is not particularly limited and may be 100 mol%.
式(1)のX1の1以上(好ましくは1~3、より好ましくは1又は2)の芳香族基を有する4価の基において、芳香族基は、芳香族炭化水素基でもよく、芳香族複素環式基でもよい。芳香族炭化水素基が好ましい。In the tetravalent group having one or more (preferably 1 to 3, more preferably 1 or 2) aromatic groups in X 1 of formula (1), the aromatic group may be an aromatic hydrocarbon group, and the aromatic group may be an aromatic hydrocarbon group. It may also be a group heterocyclic group. Aromatic hydrocarbon groups are preferred.
式(1)のX1の芳香族炭化水素基としては、ベンゼン環から形成される2~4価(2価、3価又は4価)の基、ナフタレンから形成される2~4価の基、ペリレンから形成される2~4価の基等が挙げられる。The aromatic hydrocarbon group represented by X 1 in formula (1) includes a divalent to tetravalent (divalent, trivalent or tetravalent) group formed from a benzene ring, a divalent to tetravalent group formed from naphthalene. , divalent to tetravalent groups formed from perylene, and the like.
式(1)のX1の1以上の芳香族基を有する4価の基としては、例えば以下の式(6)の4価の基が挙げられるが、これらに限定されるものではない。
式(6)において、X及びYの、各々が結合するベンゼン環と共役しない2価の基は、-O-、-S-、メチレン基、ビス(トリフルオロメチル)メチレン基、又はジフルオロメチレン基であることが好ましく、-O-であることがより好ましい。 In formula (6), the divalent groups of X and Y that are not conjugated with the benzene ring to which they are bonded are -O-, -S-, a methylene group, a bis(trifluoromethyl)methylene group, or a difluoromethylene group. is preferable, and -O- is more preferable.
式(1)のY1の2価の芳香族基は、2価の芳香族炭化水素基でもよく、2価の芳香族複素環式基でもよい。2価の芳香族炭化水素基が好ましい。The divalent aromatic group of Y 1 in formula (1) may be a divalent aromatic hydrocarbon group or a divalent aromatic heterocyclic group. A divalent aromatic hydrocarbon group is preferred.
式(1)のY1の2価の芳香族炭化水素基としては、例えば以下の式(7)の基が挙げられるが、これに限定されるものではない。
式(7)のR12~R19の1価の脂肪族炭化水素基(好ましくは炭素数1~10、より好ましくは炭素数1~6)としては、メチル基等が挙げられる。例えば、R12及びR15~R19が水素原子であり、R13及びR14が1価の脂肪族炭化水素基であってもよい。Examples of the monovalent aliphatic hydrocarbon group (preferably having 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms) for R 12 to R 19 in formula (7) include a methyl group and the like. For example, R 12 and R 15 to R 19 may be hydrogen atoms, and R 13 and R 14 may be monovalent aliphatic hydrocarbon groups.
式(7)のR12~R19のハロゲン原子(好ましくはフッ素原子)を有する1価の有機基は、ハロゲン原子を有する1価の脂肪族炭化水素基(好ましくは炭素数1~10、より好ましくは炭素数1~6)が好ましく、トリフルオロメチル基等が挙げられる。The monovalent organic group having a halogen atom (preferably a fluorine atom) represented by R 12 to R 19 in formula (7) is a monovalent aliphatic hydrocarbon group having a halogen atom (preferably having 1 to 10 carbon atoms, or more). Preferably, the carbon number is 1 to 6), such as a trifluoromethyl group.
式(1)のR1及びR2の炭素数1~4(好ましくは1又は2)の脂肪族炭化水素基としては、メチル基、エチル基、n-プロピル基、2-プロピル基、n-ブチル基等が挙げられる。Examples of the aliphatic hydrocarbon group having 1 to 4 carbon atoms (preferably 1 or 2) for R 1 and R 2 in formula (1) include methyl group, ethyl group, n-propyl group, 2-propyl group, n- Examples include butyl group.
式(1)のR1及びR2の少なくとも一方が、式(2)で表される基であり、ともに式(2)で表される基であることが好ましい。At least one of R 1 and R 2 in formula (1) is a group represented by formula (2), and preferably both are groups represented by formula (2).
式(2)のR3~R5の炭素数1~3(好ましくは1又は2)の脂肪族炭化水素基としては、メチル基、エチル基、n-プロピル基、2-プロピル基等が挙げられる。メチル基が好ましい。Examples of the aliphatic hydrocarbon group having 1 to 3 carbon atoms (preferably 1 or 2) for R 3 to R 5 in formula (2) include methyl group, ethyl group, n-propyl group, 2-propyl group, etc. It will be done. Methyl group is preferred.
式(1)で表される構造単位を有するポリイミド前駆体は、例えば下記式(8)で表されるテトラカルボン酸二無水物と、下記式(9)で表されるジアミノ化合物とを、N-メチル-2-ピロリドン等の有機溶剤中にて反応させポリアミド酸を得て、下記式(10)で表される化合物を加え、有機溶剤中で反応させ部分的にエステル基を導入することで得ることができる。
式(8)で表されるテトラカルボン酸二無水物及び式(9)で表されるジアミノ化合物は、1種単独で用いてもよく、2種以上を組み合わせてもよい。A polyimide precursor having a structural unit represented by the formula (1) can be obtained by combining, for example, a tetracarboxylic dianhydride represented by the following formula (8) and a diamino compound represented by the following formula (9) with N - By reacting in an organic solvent such as methyl-2-pyrrolidone to obtain a polyamic acid, adding a compound represented by the following formula (10), and reacting in an organic solvent to partially introduce an ester group. Obtainable.
The tetracarboxylic dianhydride represented by formula (8) and the diamino compound represented by formula (9) may be used alone or in combination of two or more.
(A)成分は、式(1)で表される構造単位以外の構造単位を有してもよい。
式(1)で表される構造単位以外の構造単位としては、式(11)で表される構造単位等が挙げられる。
Examples of structural units other than the structural unit represented by formula (1) include the structural unit represented by formula (11).
式(11)のX2の1以上の芳香族基を有する4価の基は、式(1)のX1の1以上の芳香族基を有する4価の基と同様のものが挙げられる。
式(11)のY2の2価の芳香族基は、式(1)のY1の2価の芳香族基と同様のものが挙げられる。
式(11)のR51及びR52の炭素数1~4の脂肪族炭化水素基は、R1及びR2の炭素数1~4の脂肪族炭化水素基と同様のものが挙げられる。Examples of the tetravalent group having one or more aromatic groups represented by X 2 in formula (11) include those similar to the tetravalent group having one or more aromatic groups represented by X 1 in formula (1).
Examples of the divalent aromatic group of Y 2 in formula (11) include the same divalent aromatic group as Y 1 of formula (1).
Examples of the aliphatic hydrocarbon groups having 1 to 4 carbon atoms for R 51 and R 52 in formula (11) include the same aliphatic hydrocarbon groups having 1 to 4 carbon atoms as R 1 and R 2 .
式(1)で表される構造単位以外の構造単位は、1種単独で用いてもよく、2種以上を組み合わせてもよい。 Structural units other than the structural unit represented by formula (1) may be used alone or in combination of two or more.
式(1)で表される構造単位以外の構造単位の含有量は、(A)成分の全構成単位に対して、50モル%未満であることが好ましい。 The content of structural units other than the structural unit represented by formula (1) is preferably less than 50 mol % based on all the structural units of component (A).
(A)成分において、全カルボキシ基及び全カルボキシエステルに対して、式(2)で表される基でエステル化されたカルボキシ基の割合が、50モル%以上であることが好ましく、60~100モル%がより好ましく、70~90モル%がさらに好ましい。 In component (A), the proportion of carboxyl groups esterified with the group represented by formula (2) is preferably 50 mol% or more, and 60 to 100 mol%, based on all the carboxy groups and all the carboxy esters. More preferably mol%, and even more preferably 70 to 90 mol%.
(A)成分の分子量に特に制限はないが、数平均分子量で10,000~200,000であることが好ましい。
数平均分子量は、例えばゲルパーミエーションクロマトグラフィー法によって測定することができ、標準ポリスチレン検量線を用いて換算することによって求めることができる。There is no particular restriction on the molecular weight of component (A), but it is preferably a number average molecular weight of 10,000 to 200,000.
The number average molecular weight can be measured, for example, by gel permeation chromatography, and can be determined by conversion using a standard polystyrene calibration curve.
(B)成分は、(好ましくは2以上の)重合性の不飽和二重結合を含む基(好ましくは、光重合開始剤により重合可能であることから、(メタ)アクリル基)を有することが好ましい。(B)成分は、2以上の重合性の不飽和二重結合を含む基を有する重合性モノマーであることが好ましい。架橋密度及び光感度の向上、現像後のパターンの膨潤の抑制のため、2~3の、重合性の不飽和二重結合を含む基を、有することが好ましい。 Component (B) may have a group containing (preferably two or more) polymerizable unsaturated double bonds (preferably a (meth)acrylic group since it is polymerizable with a photopolymerization initiator). preferable. Component (B) is preferably a polymerizable monomer having a group containing two or more polymerizable unsaturated double bonds. In order to improve the crosslinking density and photosensitivity and to suppress swelling of the pattern after development, it is preferable to have a group containing 2 to 3 polymerizable unsaturated double bonds.
また、(B)成分は、重合性の不飽和二重結合を含む基以外の官能基を有する重合性モノマーを含んでもよい。官能基としては、エポキシ基、オキセタン基等の環状エーテル基などが挙げられる。 Moreover, the component (B) may contain a polymerizable monomer having a functional group other than the group containing a polymerizable unsaturated double bond. Examples of the functional group include cyclic ether groups such as epoxy groups and oxetane groups.
(B)成分は、脂肪族環状骨格(好ましくは炭素数4~15、より好ましくは5~12)を有する重合性モノマーを含むことが好ましい。これにより、形成できる硬化物に疎水性を付与でき、高温多湿条件下での硬化物と基板間の接着性低下を抑制できる。 Component (B) preferably contains a polymerizable monomer having an aliphatic cyclic skeleton (preferably having 4 to 15 carbon atoms, more preferably 5 to 12 carbon atoms). Thereby, hydrophobicity can be imparted to the cured product that can be formed, and deterioration in adhesiveness between the cured product and the substrate under high temperature and high humidity conditions can be suppressed.
(B)成分は、下記式(3)で表される重合性モノマーを含むことが好ましい。
R7が2つの場合、2つのR7は同一でもよく、異なっていてもよい。When there are two R 7s , the two R 7s may be the same or different.
(B)成分は、下記式(5)で表される重合性モノマーを含むことがより好ましい。
また、(B)成分として、例えば以下の重合性モノマーを用いてもよい。 Further, as component (B), for example, the following polymerizable monomers may be used.
R21が2以上存在する場合、2以上のR21は同一でもよく、異なっていてもよい。
R22が2以上存在する場合、2以上のR22は同一でもよく、異なっていてもよい。When two or more R 21s exist, the two or more R 21s may be the same or different.
When two or more R 22s exist, the two or more R 22s may be the same or different.
n3個のR21の少なくとも1つ(好ましくは2又は3)は、上記式(4)で表される基である。
n4個のR22の少なくとも1つ(好ましくは2又は3)は、上記式(4)で表される基である。
n5個のR23及びn6個のR24の少なくとも1つ(好ましくは2)は、上記式(4)で表される基である。At least one (preferably 2 or 3) of n3 R 21 is a group represented by the above formula (4).
At least one (preferably 2 or 3) of n4 R 22 is a group represented by the above formula (4).
At least one (preferably 2) of n5 R23s and n6 R24s is a group represented by the above formula (4).
式(3)のR6及びR7及び式(12)のR21~R24の炭素数1~4の脂肪族炭化水素基としては、式(1)のR1及びR2の炭素数1~4の脂肪族炭化水素基と同様のものが挙げられる。The aliphatic hydrocarbon groups having 1 to 4 carbon atoms in R 6 and R 7 in formula (3) and R 21 to R 24 in formula (12) include 1 to 4 carbon atoms in R 1 and R 2 in formula (1); Examples include those similar to the aliphatic hydrocarbon groups in ~4.
式(4)のR9~R11の炭素数1~3の脂肪族炭化水素基としては、式(2)のR3~R5の炭素数1~3の脂肪族炭化水素基と同様のものが挙げられる。The aliphatic hydrocarbon groups having 1 to 3 carbon atoms represented by R 9 to R 11 in formula (4) are the same as the aliphatic hydrocarbon groups having 1 to 3 carbon atoms represented by R 3 to R 5 in formula (2). Things can be mentioned.
(B)成分は、脂肪族環状骨格を有する重合性モノマー以外の重合性モノマーを含んでもよい。これにより、良好な機械特性を持つ硬化物を得ることができる。 Component (B) may contain a polymerizable monomer other than the polymerizable monomer having an aliphatic cyclic skeleton. Thereby, a cured product with good mechanical properties can be obtained.
脂肪族環状骨格を有する重合性モノマー以外の重合性モノマーとしては、例えば、ジエチレングリコールジアクリレート、トリエチレングリコールジアクリレート、テトラエチレングリコールジアクリレート、ジエチレングリコールジメタクリレート、トリエチレングリコールジメタクリレート、テトラエチレングリコールジメタクリレート、1,4-ブタンジオールジアクリレート、1,6-ヘキサンジオールジアクリレート、1,4-ブタンジオールジメタクリレート、1,6-ヘキサンジオールジメタクリレート、トリメチロールプロパンジアクリレート、トリメチロールプロパントリアクリレート、トリメチロールプロパンジメタクリレート、トリメチロールプロパントリメタクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、ペンタエリスリトールトリメタクリレート、ペンタエリスリトールテトラメタクリレート、テトラメチロールメタンテトラアクリレート、テトラメチロールメタンテトラメタクリレート、ジペンタエリスリトールヘキサアクリレート、ジペンタエリスリトールヘキサメタクリレート、エトキシ化ペンタエリスリトールテトラアクリレート、エトキシ化イソシアヌル酸トリアクリレート、エトキシ化イソシアヌル酸トリメタクリレート、アクリロイルオキシエチルイソシアヌレート、メタクリロイルオキシエチルイソシアヌレート、エチレンオキシド(EO)変性ビスフェノールAジアクリレート(例えば、市販品として、FA324A(日立化成株式会社製))等が挙げられる。 Examples of polymerizable monomers other than polymerizable monomers having an aliphatic cyclic skeleton include diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, and tetraethylene glycol dimethacrylate. , 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, trimethylolpropane diacrylate, trimethylolpropane triacrylate, Methylolpropane dimethacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, tetramethylolmethane tetraacrylate, tetramethylolmethane tetramethacrylate, dipentaerythritol hexaacrylate, di Pentaerythritol hexamethacrylate, ethoxylated pentaerythritol tetraacrylate, ethoxylated isocyanuric acid triacrylate, ethoxylated isocyanuric acid trimethacrylate, acryloyloxyethyl isocyanurate, methacryloyloxyethyl isocyanurate, ethylene oxide (EO) modified bisphenol A diacrylate (e.g. Examples of commercially available products include FA324A (manufactured by Hitachi Chemical Co., Ltd.).
(B)成分は、1種単独で用いてもよく、2種以上を組み合わせてもよい。 Component (B) may be used alone or in combination of two or more.
(B)成分は、良好な機械特性及び感光特性を得るという観点から、脂肪族環状骨格を有する重合性モノマー及び脂肪族環状骨格を有する重合性モノマー以外の重合性モノマーを含むことが好ましい。
脂肪族環状骨格を有する重合性モノマー及び脂肪族環状骨格を有する重合性モノマー以外の重合性モノマーを含む場合、脂肪族環状骨格を有する重合性モノマーの含有量は、(A)成分100質量部に対して、1~40質量部が好ましい。硬化物の疎水性向上の観点から、より好ましくは5~35質量部である。脂肪族環状骨格を有する重合性モノマー以外の重合性モノマーの含有量は、(A)成分100質量部に対して、1~20質量部が好ましい。硬化物の疎水性向上の観点から、より好ましくは5~15質量部である。From the viewpoint of obtaining good mechanical properties and photosensitive properties, component (B) preferably contains a polymerizable monomer having an aliphatic cyclic skeleton and a polymerizable monomer other than the polymerizable monomer having an aliphatic cyclic skeleton.
When containing a polymerizable monomer other than the polymerizable monomer having an aliphatic cyclic skeleton and the polymerizable monomer having an aliphatic cyclic skeleton, the content of the polymerizable monomer having an aliphatic cyclic skeleton is 100 parts by mass of component (A). On the other hand, 1 to 40 parts by mass is preferable. From the viewpoint of improving the hydrophobicity of the cured product, the amount is more preferably 5 to 35 parts by mass. The content of polymerizable monomers other than the polymerizable monomer having an aliphatic cyclic skeleton is preferably 1 to 20 parts by weight based on 100 parts by weight of component (A). From the viewpoint of improving the hydrophobicity of the cured product, the amount is more preferably 5 to 15 parts by mass.
(B)成分の含有量は、(A)成分100質量部に対して、1~50質量部が好ましい。硬化物の疎水性向上の観点から、より好ましくは3~50質量部、さらに好ましくは5~40質量部である。
上記範囲内である場合、実用的なレリ-フパターンが得られやすく、未露光部の現像後残滓を抑制しやすい。The content of component (B) is preferably 1 to 50 parts by mass per 100 parts by mass of component (A). From the viewpoint of improving the hydrophobicity of the cured product, the amount is more preferably 3 to 50 parts by weight, and even more preferably 5 to 40 parts by weight.
When it is within the above range, it is easy to obtain a practical relief pattern, and it is easy to suppress residues after development in unexposed areas.
(C)成分としては、例えば、ベンゾフェノン、o-ベンゾイル安息香酸メチル、4-ベンゾイル-4’-メチルジフェニルケトン、ジベンジルケトン、フルオレノン等のベンゾフェノン誘導体、
2,2’-ジエトキシアセトフェノン、2-ヒドロキシ-2-メチルプロピオフェノン、1-ヒドロキシシクロヘキシルフェニルケトン等のアセトフェノン誘導体、
チオキサントン、2-メチルチオキサントン、2-イソプロピルチオキサントン、ジエチルチオキサントン等のチオキサントン誘導体、
ベンジル、ベンジルジメチルケタール、ベンジル-β-メトキシエチルアセタール等のベンジル誘導体、
ベンゾイン、ベンゾインメチルエーテル等のベンゾイン誘導体、及び
1-フェニル-1,2-ブタンジオン-2-(O-メトキシカルボニル)オキシム、1-フェニル-1,2-プロパンジオン-2-(O-メトキシカルボニル)オキシム、1-フェニル-1,2-プロパンジオン-2-(O-エトキシカルボニル)オキシム、1-フェニル-1,2-プロパンジオン-2-(O-ベンゾイル)オキシム、1,3-ジフェニルプロパントリオン-2-(O-エトキシカルボニル)オキシム、1-フェニル-3-エトキシプロパントリオン-2-(O-ベンゾイル)オキシム、エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)、下記式で表される化合物等のオキシムエステル類などが好ましく挙げられるが、これらに限定されるものではない。
Acetophenone derivatives such as 2,2'-diethoxyacetophenone, 2-hydroxy-2-methylpropiophenone, 1-hydroxycyclohexylphenyl ketone,
Thioxanthone derivatives such as thioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, diethylthioxanthone,
Benzyl, benzyl dimethyl ketal, benzyl derivatives such as benzyl-β-methoxyethyl acetal,
Benzoin, benzoin derivatives such as benzoin methyl ether, 1-phenyl-1,2-butanedione-2-(O-methoxycarbonyl) oxime, 1-phenyl-1,2-propanedione-2-(O-methoxycarbonyl) Oxime, 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2-(O-benzoyl)oxime, 1,3-diphenylpropanetrione -2-(O-ethoxycarbonyl)oxime, 1-phenyl-3-ethoxypropanetrione-2-(O-benzoyl)oxime, ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H- Preferred examples include oxime esters such as carbazol-3-yl]-,1-(O-acetyloxime) and compounds represented by the following formula, but are not limited thereto.
特に光感度の点で、オキシムエステル類が好ましい。 Oxime esters are particularly preferred from the viewpoint of photosensitivity.
(C)成分は、(C1)下記式(15)で表される化合物(以下、「(C1)成分」ともいう。)を含有することが好ましい。
(C1)成分は、活性光線に対する感度が後述する(C2)成分より高いことが好ましく、高感度な感光剤であることが好ましい。Component (C) preferably contains (C1) a compound represented by the following formula (15) (hereinafter also referred to as "component (C1)").
The component (C1) preferably has higher sensitivity to actinic rays than the component (C2) described later, and is preferably a highly sensitive photosensitizer.
R11Aは、好ましくは炭素数1~4のアルキル基であり、より好ましくはメチル基である。a1は好ましくは1である。R12Aは、好ましくは炭素数1~4のアルキル基であり、より好ましくはエチル基である。R13A及びR14Aは、好ましくはそれぞれ独立に炭素数1~4のアルキル基であり、より好ましくはメチル基である。R 11A is preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group. a1 is preferably 1. R 12A is preferably an alkyl group having 1 to 4 carbon atoms, more preferably an ethyl group. R 13A and R 14A are preferably each independently an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group.
式(15)で表される化合物としては、例えば、下記式(15A)で表される化合物が挙げられ、BASFジャパン株式会社製「IRGACURE OXE 02」として入手可能である。
また、(C)成分は、(C2)下記式(16)で表される化合物(以下、「(C2)成分」ともいう。)を含有することが好ましい。
(C2)成分は、活性光線に対する感度が(C1)成分より低いことが好ましく、標準的な感度の感光剤であることが好ましい。Further, the component (C) preferably contains (C2) a compound represented by the following formula (16) (hereinafter also referred to as "component (C2)").
Component (C2) preferably has lower sensitivity to actinic rays than component (C1), and is preferably a photosensitizer with standard sensitivity.
c1は好ましくは0である。R22Aは、好ましくは炭素数1~4のアルキル基であり、より好ましくはメチル基である。R23Aは、好ましくは炭素数1~12のアルコキシ基であり、より好ましくは炭素数1~4のアルコキシ基であり、さらに好ましくはメトキシ基又はエトキシ基である。c1 is preferably 0. R 22A is preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group. R 23A is preferably an alkoxy group having 1 to 12 carbon atoms, more preferably an alkoxy group having 1 to 4 carbon atoms, and even more preferably a methoxy group or an ethoxy group.
式(16)で表される化合物としては、例えば下記式(16A)で表される化合物が挙げられ、Lambson社製「G-1820(PDO)」として入手可能である。
(C)成分は、1種単独で用いてもよく、2種以上を組み合わせてもよい。 Component (C) may be used alone or in combination of two or more.
(C)成分は、(C1)成分及び(C2)成分からなる群から選択される1以上を含むことが好ましい。
また、(C)成分は、(C1)成分及び(C2)成分を含むことが好ましい。Component (C) preferably includes one or more selected from the group consisting of component (C1) and component (C2).
Moreover, it is preferable that the (C) component includes a (C1) component and a (C2) component.
(C)成分の含有量は、(A)成分100質量部に対して、0.1~20質量部が好ましく、より好ましくは0.1~10質量部であり、さらに好ましくは0.1~5質量部である。
上記範囲内の場合、光架橋が膜厚方向で均一となりやすく、実用的なレリ-フパターンを得やすくなる。The content of component (C) is preferably 0.1 to 20 parts by mass, more preferably 0.1 to 10 parts by mass, and even more preferably 0.1 to 10 parts by mass, per 100 parts by mass of component (A). 5 parts by mass.
Within the above range, photocrosslinking tends to be uniform in the film thickness direction, making it easier to obtain a practical relief pattern.
(C1)成分を含有する場合、(C1)成分の含有量は、通常、(A)成分100質量部に対して0.05~5.0質量部であり、好ましくは0.07~2.5質量部であり、より好ましくは0.09~1.0質量部である。 When containing component (C1), the content of component (C1) is usually 0.05 to 5.0 parts by mass, preferably 0.07 to 2.0 parts by mass, per 100 parts by mass of component (A). The amount is 5 parts by weight, more preferably 0.09 to 1.0 parts by weight.
(C2)成分を含有する場合、(C2)成分の含有量は、通常、(A)成分100質量部に対して0.5~15.0質量部であり、好ましくは1.0~15.0質量部である。 When component (C2) is contained, the content of component (C2) is usually 0.5 to 15.0 parts by mass, preferably 1.0 to 15.0 parts by mass, per 100 parts by mass of component (A). It is 0 parts by mass.
(C1)成分及び(C2)成分を含有する場合、(C1)成分の含有量が(A)成分100質量部に対して0.05~5.0質量部であり、かつ、(C2)成分の含有量が(A)成分100質量部に対して0.5~15.0質量部であると好ましい。 When containing component (C1) and component (C2), the content of component (C1) is 0.05 to 5.0 parts by mass per 100 parts by mass of component (A), and the component (C2) The content is preferably 0.5 to 15.0 parts by weight per 100 parts by weight of component (A).
(C1)成分及び(C2)成分を含有する場合、(C1)成分と(C2)成分の含有量の質量比は、好ましくは1:2~1:15であり、より好ましくは1:3~1:10である。 When containing component (C1) and component (C2), the mass ratio of the content of component (C1) and component (C2) is preferably 1:2 to 1:15, more preferably 1:3 to It is 1:10.
本発明の感光性樹脂組成物は、(D)環化触媒を含む。
(D)成分は、2-(メチルフェニルアミノ)エタノール、2-(エチルアニリノ)エタノール、N-フェニルジエタノールアミン、N-メチルアニリン、N-エチルアニリン、N,N-ジメチルアニリン、N-フェニルエタノールアミン、4-フェニルモルフォリン及び2,2′-(4-メチルフェニルイミノ)ジエタノールからなる群から選択される1以上であることが好ましく、N-フェニルジエタノールアミン、N-メチルアニリン、N-エチルアニリン、N,N-ジメチルアニリン、N-フェニルエタノールアミン、4-フェニルモルフォリン及び2,2′-(4-メチルフェニルイミノ)ジエタノールからなる群から選択される1以上であることがより好ましい。The photosensitive resin composition of the present invention contains (D) a cyclization catalyst.
Component (D) is 2-(methylphenylamino)ethanol, 2-(ethylanilino)ethanol, N-phenyldiethanolamine, N-methylaniline, N-ethylaniline, N,N-dimethylaniline, N-phenylethanolamine, It is preferably one or more selected from the group consisting of 4-phenylmorpholine and 2,2'-(4-methylphenylimino)diethanol, N-phenyldiethanolamine, N-methylaniline, N-ethylaniline, N- , N-dimethylaniline, N-phenylethanolamine, 4-phenylmorpholine, and 2,2'-(4-methylphenylimino)diethanol.
(D)成分は、下記式(17)で表される化合物を含むことが好ましい。
好ましくは、さらに、R31A~R33Aの少なくとも一つは、1価の脂肪族炭化水素基、ヒドロキシ基を有する1価の脂肪族炭化水素基、又は1価の芳香族基である。Preferably, at least one of R 31A to R 33A is a monovalent aliphatic hydrocarbon group, a monovalent aliphatic hydrocarbon group having a hydroxy group, or a monovalent aromatic group.
式(17)のR31A~R33Aの1価の脂肪族炭化水素基(好ましくは炭素数1~10、より好ましくは炭素数1~6)としては、メチル基、エチル基等が挙げられる。
式(17)のR31A~R33Aのヒドロキシ基を有する1価の脂肪族炭化水素基としては、R31A~R33Aの1価の脂肪族炭化水素基に、1以上(好ましくは1~3)のヒドロキシ基が結合した基等が挙げられる。具体的には、メチロール基、ヒドロキシエチル基等が挙げられる。ヒドロキシエチル基が好ましい。Examples of the monovalent aliphatic hydrocarbon group (preferably having 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms) represented by R 31A to R 33A in formula (17) include a methyl group and an ethyl group.
As the monovalent aliphatic hydrocarbon group having a hydroxy group of R 31A to R 33A in formula (17), one or more (preferably 1 to 3 ) to which a hydroxy group is bonded. Specific examples include methylol group and hydroxyethyl group. Hydroxyethyl group is preferred.
式(17)のR31A~R33Aの1価の芳香族基としては、1価の芳香族炭化水素基(好ましくは炭素数6~12、より好ましくは炭素数6~10)でもよく、1価の芳香族複素環式基でもよい。1価の芳香族炭化水素基が好ましい。
1価の芳香族炭化水素基としては、フェニル基、ナフチル基等が挙げられる。
式(17)のR31A~R33Aの1価の芳香族基は、置換基を有してもよい。置換基としては、上述の式(17)のR31A~R33Aの1価の脂肪族炭化水素基、及び上述の式(17)のR31A~R33Aのヒドロキシ基を有する1価の脂肪族炭化水素基と同様のものが挙げられる。The monovalent aromatic group R 31A to R 33A in formula (17) may be a monovalent aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms, more preferably 6 to 10 carbon atoms); It may also be a valent aromatic heterocyclic group. Monovalent aromatic hydrocarbon groups are preferred.
Examples of the monovalent aromatic hydrocarbon group include a phenyl group and a naphthyl group.
The monovalent aromatic groups R 31A to R 33A in formula (17) may have a substituent. Examples of substituents include monovalent aliphatic hydrocarbon groups represented by R 31A to R 33A of the above formula (17), and monovalent aliphatic groups having a hydroxy group represented by R 31A to R 33A of the above formula (17). Examples include those similar to hydrocarbon groups.
(D)成分は、1種単独で用いてもよく、2種以上を組み合わせてもよい。
(D)成分の含有量は、イミド化率や感度向上の観点から、(A)成分100質量部に対して、0.1~20質量部が好ましい。保存安定性の観点から、より好ましくは0.3~15質量部、さらに好ましくは0.5~10質量部である。Component (D) may be used alone or in combination of two or more.
The content of component (D) is preferably 0.1 to 20 parts by mass based on 100 parts by mass of component (A) from the viewpoint of imidization rate and sensitivity improvement. From the viewpoint of storage stability, the amount is more preferably 0.3 to 15 parts by weight, and even more preferably 0.5 to 10 parts by weight.
本発明の感光性樹脂組成物は、(E)溶剤を含む。
(E)成分としては、N-メチル-2-ピロリドン、γ-ブチロラクトン、乳酸エチル、プロピレングリコールモノメチルエーテルアセテート、酢酸ベンジル、n-ブチルアセテート、エトキシエチルプロピオネート、3-メチルメトキシプロピオネート、N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド、ジメチルスルホキシド、ヘキサメチルホスホリルアミド、テトラメチレンスルホン、シクロヘキサノン、シクロペンタノン、ジエチルケトン、ジイソブチルケトン、メチルアミルケトン、N-ジメチルモルホリン等が挙げられ、通常、他の成分を充分に溶解できるものであれば特に制限はない。
この中でも、各成分の溶解性と感光性樹脂膜形成時の塗布性に優れる観点から、N-メチル-2-ピロリドン、γ-ブチロラクトン、乳酸エチル、プロピレングリコールモノメチルエーテルアセテート、N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミドを用いることが好ましい。The photosensitive resin composition of the present invention contains (E) a solvent.
Component (E) includes N-methyl-2-pyrrolidone, γ-butyrolactone, ethyl lactate, propylene glycol monomethyl ether acetate, benzyl acetate, n-butyl acetate, ethoxyethylpropionate, 3-methylmethoxypropionate, N,N-dimethylformamide, N,N-dimethylacetamide, dimethyl sulfoxide, hexamethylphosphorylamide, tetramethylene sulfone, cyclohexanone, cyclopentanone, diethyl ketone, diisobutyl ketone, methyl amyl ketone, N-dimethylmorpholine, etc. Generally, there are no particular limitations as long as the other components can be sufficiently dissolved.
Among these, N-methyl-2-pyrrolidone, γ-butyrolactone, ethyl lactate, propylene glycol monomethyl ether acetate, and N,N-dimethylformamide are selected from the viewpoints of excellent solubility of each component and coating properties when forming a photosensitive resin film. , N,N-dimethylacetamide is preferably used.
また、(E)成分としては、下記式(21)で表される化合物を用いてもよい。
式(21)中におけるR41~R43の炭素数1~10(好ましくは1~3、より好ましくは1又は3)のアルキル基としては、メチル基、エチル基、n-プロピル基、イソプロピル基、n-ブチル基、t-ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基等を挙げることができる。
式(21)で表される化合物は、3-メトキシ-N,N-ジメチルプロパンアミド(例えば、商品名「KJCMPA-100」(KJケミカルズ株式会社製))であることが好ましい。In formula (21), the alkyl group having 1 to 10 carbon atoms (preferably 1 to 3, more preferably 1 or 3) in R 41 to R 43 includes a methyl group, an ethyl group, an n-propyl group, an isopropyl group. , n-butyl group, t-butyl group, pentyl group, hexyl group, heptyl group, octyl group, etc.
The compound represented by formula (21) is preferably 3-methoxy-N,N-dimethylpropanamide (eg, trade name "KJCMPA-100" (manufactured by KJ Chemicals Co., Ltd.)).
(E)成分は、1種単独で用いてもよく、2種以上を組み合わせてもよい。
(E)成分の含有量は、特に限定されないが、一般的に、(A)成分100質量部に対して、50~1000質量部である。Component (E) may be used alone or in combination of two or more.
The content of component (E) is not particularly limited, but is generally 50 to 1,000 parts by mass per 100 parts by mass of component (A).
本発明の感光性樹脂組成物は、重合反応の促進の観点から、さらに、(F)熱重合開始剤(以下、「(F)成分」ともいう。)を含んでもよい。
(F)成分としては、成膜時に溶剤を除去するための加熱(乾燥)では分解せず、硬化時の加熱により分解してラジカルを発生し、(B)成分同士、又は(A)成分及び(B)成分の重合反応を促進する化合物が好ましい。
(F)成分は分解点が、110℃以上200℃以下の化合物が好ましく、より低温で重合反応を促進する観点から、110℃以上175℃以下の化合物がより好ましい。The photosensitive resin composition of the present invention may further contain (F) a thermal polymerization initiator (hereinafter also referred to as "component (F)") from the viewpoint of promoting the polymerization reaction.
Component (F) does not decompose by heating (drying) to remove the solvent during film formation, but decomposes by heating during curing to generate radicals, and component (B) or component (A) Compounds that promote the polymerization reaction of component (B) are preferred.
Component (F) is preferably a compound with a decomposition point of 110°C or more and 200°C or less, and more preferably a compound with a decomposition point of 110°C or more and 175°C or less from the viewpoint of promoting the polymerization reaction at a lower temperature.
具体例としては、メチルエチルケトンペルオキシド等のケトンペルオキシド、1,1-ジ(t-ヘキシルパーオキシ)-3,3,5-トリメチルシクロヘキサン、1,1-ジ(t-ヘキシルパーオキシ)シクロヘキサン、1,1-ジ(t-ブチルパーオキシ)シクロヘキサン等のパーオキシケタール、1,1,3,3-テトラメチルブチルハイドロペルオキシド、クメンハイドロペルオキシド、p-メンタンハイドロペルオキシド等のハイドロペルオキシド、ジクミルペルオキシド、ジ-t-ブチルペルオキシド等のジアルキルペルオキシド、ジラウロイルペルオキシド、ジベンゾイルペルオキシド等のジアシルペルオキシド、ジ(4-t-ブチルシクロヘキシル)パーオキシジカーボネート、ジ(2-エチルヘキシル)パーオキシジカーボネート等のパーオキシジカーボネート、t-ブチルパーオキシ-2-エチルヘキサノエート、t-ヘキシルパーオキシイソプロピルモノカーボネート、t-ブチルパーオキシベンゾエート、1,1,3,3-テトラメチルブチルパーオキシ-2-エチルヘキサノエート等のパーオキシエステル、ビス(1-フェニル-1-メチルエチル)ペルオキシドなどが挙げられる。市販品としては、商品名「パークミルD」、「パークミルP」、「パークミルH」(以上、日油株式会社製)等が挙げられる。 Specific examples include ketone peroxides such as methyl ethyl ketone peroxide, 1,1-di(t-hexylperoxy)-3,3,5-trimethylcyclohexane, 1,1-di(t-hexylperoxy)cyclohexane, 1, Peroxyketals such as 1-di(t-butylperoxy)cyclohexane, hydroperoxides such as 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, p-menthane hydroperoxide, dicumyl peroxide, dicumyl peroxide, -Dialkyl peroxides such as t-butyl peroxide, diacyl peroxides such as dilauroyl peroxide and dibenzoyl peroxide, peroxides such as di(4-t-butylcyclohexyl) peroxydicarbonate and di(2-ethylhexyl) peroxydicarbonate Dicarbonate, t-butylperoxy-2-ethylhexanoate, t-hexylperoxyisopropyl monocarbonate, t-butylperoxybenzoate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate Examples include peroxy esters such as noate, bis(1-phenyl-1-methylethyl) peroxide, and the like. Examples of commercially available products include the trade names "Percmil D", "Percmil P", and "Percmil H" (all manufactured by NOF Corporation).
(F)成分を含有する場合、(F)成分の含有量は、(A)成分100質量部に対して、0.1~20質量部が好ましく、良好な耐フラックス性の確保のために0.2~20質量部がより好ましく、乾燥時の分解による溶解性低下抑制の観点から、0.3~10質量部がさらに好ましい。 When containing component (F), the content of component (F) is preferably 0.1 to 20 parts by mass per 100 parts by mass of component (A), and in order to ensure good flux resistance, the content of component (F) is preferably 0.1 to 20 parts by mass. The amount is more preferably 0.2 to 20 parts by weight, and even more preferably 0.3 to 10 parts by weight from the viewpoint of suppressing a decrease in solubility due to decomposition during drying.
本発明の感光性樹脂組成物は、さらに、酸化防止剤を含んでもよい。酸化防止剤を含有することで、高温保存又はリフロー処理で発生する酸素ラジカル及び過酸化物ラジカルを補足し、接着性(密着性)の低下をより抑制できる。また、絶縁信頼性試験時の電極の酸化を抑制することができ、電極から樹脂膜又はパターン樹脂膜への拡散を抑制することができる。 The photosensitive resin composition of the present invention may further contain an antioxidant. By containing an antioxidant, oxygen radicals and peroxide radicals generated during high-temperature storage or reflow treatment can be captured, and a decrease in adhesiveness (adhesion) can be further suppressed. Further, oxidation of the electrode during an insulation reliability test can be suppressed, and diffusion from the electrode to the resin film or patterned resin film can be suppressed.
酸化防止剤としては、N,N’-ビス[2-[2-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)エチルカルボニルオキシ]エチル]オキサミド、N,N’-ビス-3-(3,5-ジ-tert-ブチル-4’-ヒドロキシフェニル)プロピオニルヘキサメチレンジアミン、1、3、5-トリス(3-ヒドロキシ-4-tert-ブチル-2,6-ジメチルベンジル)-1、3、5-トリアジン-2、4、6(1H、3H、5H)-トリオン、
2,6-ジ-t-ブチル-4-メチルフェノール、2,5-ジ-t-ブチル-ハイドロキノン、オクタデシル-3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネ-ト、4、4’-メチレンビス(2、6-ジ-t-ブチルフェノール)、4,4’-チオ-ビス(3-メチル-6-t-ブチルフェノール)、4,4’-ブチリデン-ビス(3-メチル-6-t-ブチルフェノール)、トリエチレングリコール-ビス[3-(3-t-ブチル-5-メチル-4-ヒドロキシフェニル)プロピオネート]、2,2-チオ-ジエチレンビス[3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート]、N,N’-ヘキサメチレンビス(3,5-ジ-t-ブチル-4-ヒドロキシ-ヒドロシンナマミド)、イソオクチル-3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート、1,3,5-トリス[4-トリエチルメチル-3-ヒドロキシ-2,6-ジメチルベンジル]-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、2,2’-メチレン-ビス(4-メチル-6-t-ブチルフェノール)、2,2’-メチレン-ビス(4-エチル-6-t-ブチルフェノール)、
トリス-(3,5-ジ-t-ブチル-4-ヒドロキシベンジル)-イソシアヌレイト、1,3,5-トリメチル-2,4,6-トリス(3,5-ジ-t-ブチル-4-ヒドロキシベンジル)ベンゼン、1,3,5-トリス(3-ヒドロキシ-2,6-ジメチル-4-イソプロピルベンジル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、1,3,5-トリス(4-t-ブチル-3-ヒドロキシ-2,6-ジメチルベンジル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、1,3,5-トリス(4-s-ブチル-3-ヒドロキシ-2,6-ジメチルベンジル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、1,3,5-トリス[4-(1-エチルプロピル)-3-ヒドロキシ-2,6-ジメチルベンジル]-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、1,3,5-トリス(4-t-ブチル-3-ヒドロキシ-2-メチルベンジル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、1,3,5-トリス(4-t-ブチル-3-ヒドロキシ-2,5-ジメチルベンジル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、
ペンタエリスリチル-テトラキス[3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート]、1,6-ヘキサンジオール-ビス[3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート]、1,3,5-トリス(4-t-ブチル-3-ヒドロキシ-2,5,6-トリメチルベンジル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、1,3,5-トリス(4-t-ブチル-5-エチル-3-ヒドロキシ-2,6-ジメチルベンジル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、1,3,5-トリス(4-t-ブチル-6-エチル-3-ヒドロキシ-2,5-ジメチルベンジル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、1,3,5-トリス(4-t-ブチル-5,6-ジエチル-3-ヒドロキシ-2-メチルベンジル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、1,3,5-トリス(4-t-ブチル-6-エチル-3-ヒドロキシ-2-メチルベンジル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、
1,3,5-トリス(4-t-ブチル-5‐エチル-3-ヒドロキシ-2-メチルベンジル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、1,3,5-トリス(3-ヒドロキシ-2,6-ジメチル-4-フェニルベンジル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン、及び
1,3,5-トリス(4-t-ブチル-3-ヒドロキシ-2,6-ジメチルベンジル)イソシアヌル酸等が挙げられる。As antioxidants, N,N'-bis[2-[2-(3,5-di-tert-butyl-4-hydroxyphenyl)ethylcarbonyloxy]ethyl]oxamide, N,N'-bis-3 -(3,5-di-tert-butyl-4'-hydroxyphenyl)propionylhexamethylenediamine, 1,3,5-tris(3-hydroxy-4-tert-butyl-2,6-dimethylbenzyl)-1 , 3,5-triazine-2,4,6(1H,3H,5H)-trione,
2,6-di-t-butyl-4-methylphenol, 2,5-di-t-butyl-hydroquinone, octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate , 4,4'-methylenebis(2,6-di-t-butylphenol), 4,4'-thio-bis(3-methyl-6-t-butylphenol), 4,4'-butylidene-bis(3- methyl-6-t-butylphenol), triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], 2,2-thio-diethylenebis[3-(3, 5-di-t-butyl-4-hydroxyphenyl)propionate], N,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamamide), isooctyl-3-( 3,5-di-t-butyl-4-hydroxyphenyl)propionate, 1,3,5-tris[4-triethylmethyl-3-hydroxy-2,6-dimethylbenzyl]-1,3,5-triazine- 2,4,6-(1H,3H,5H)-trione, 2,2'-methylene-bis(4-methyl-6-t-butylphenol), 2,2'-methylene-bis(4-ethyl-6 -t-butylphenol),
Tris-(3,5-di-t-butyl-4-hydroxybenzyl)-isocyanurate, 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4 -hydroxybenzyl)benzene, 1,3,5-tris(3-hydroxy-2,6-dimethyl-4-isopropylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H )-trione, 1,3,5-tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H )-trione, 1,3,5-tris(4-s-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H )-trione, 1,3,5-tris[4-(1-ethylpropyl)-3-hydroxy-2,6-dimethylbenzyl]-1,3,5-triazine-2,4,6-(1H, 3H,5H)-trione, 1,3,5-tris(4-t-butyl-3-hydroxy-2-methylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H, 5H)-trione, 1,3,5-tris(4-t-butyl-3-hydroxy-2,5-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H, 5H)-trion,
Pentaerythrityl-tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4) -hydroxyphenyl)propionate], 1,3,5-tris(4-t-butyl-3-hydroxy-2,5,6-trimethylbenzyl)-1,3,5-triazine-2,4,6-( 1H,3H,5H)-trione, 1,3,5-tris(4-t-butyl-5-ethyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4 ,6-(1H,3H,5H)-trione, 1,3,5-tris(4-t-butyl-6-ethyl-3-hydroxy-2,5-dimethylbenzyl)-1,3,5-triazine -2,4,6-(1H,3H,5H)-trione, 1,3,5-tris(4-t-butyl-5,6-diethyl-3-hydroxy-2-methylbenzyl)-1,3 ,5-triazine-2,4,6-(1H,3H,5H)-trione, 1,3,5-tris(4-t-butyl-6-ethyl-3-hydroxy-2-methylbenzyl)-1 , 3,5-triazine-2,4,6-(1H,3H,5H)-trione,
1,3,5-tris(4-t-butyl-5-ethyl-3-hydroxy-2-methylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)- trione, 1,3,5-tris(3-hydroxy-2,6-dimethyl-4-phenylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione, and 1,3,5-tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl)isocyanuric acid.
酸化防止剤は、1種単独で用いてもよく、2種以上を組み合わせてもよい。 The antioxidants may be used alone or in combination of two or more.
酸化防止剤を含む場合、酸化防止剤の含有量は、(A)成分100質量部に対して、0.1~20質量部が好ましく、より好ましくは0.1~10質量部であり、さらに好ましくは0.1~5質量部である。 When containing an antioxidant, the content of the antioxidant is preferably 0.1 to 20 parts by mass, more preferably 0.1 to 10 parts by mass, and more preferably 0.1 to 10 parts by mass, based on 100 parts by mass of component (A). Preferably it is 0.1 to 5 parts by mass.
本発明の感光性樹脂組成物は、さらに、カップリング剤(接着助剤)、界面活性剤又はレベリング剤、防錆剤及び重合禁止剤等を含有してもよい。 The photosensitive resin composition of the present invention may further contain a coupling agent (adhesive aid), a surfactant or a leveling agent, a rust preventive agent, a polymerization inhibitor, and the like.
通常、カップリング剤は、現像後の加熱処理において、(A)成分と反応して架橋する、又は加熱処理する工程においてカップリング剤自身が重合する。これにより、得られる硬化物と基板との接着性をより向上させることができる。 Usually, the coupling agent reacts with component (A) to crosslink in the heat treatment after development, or the coupling agent itself polymerizes in the heat treatment step. Thereby, the adhesiveness between the obtained cured product and the substrate can be further improved.
好ましいシランカップリング剤としては、ウレア結合(-NH-CO-NH-)を有する化合物が挙げられる。これにより、230℃以下の低温下で硬化を行った場合も基板との接着性をさらに高めることができる。
低温での硬化を行った際の接着性の発現に優れるため、下記式(13)で表される化合物がより好ましい。
A compound represented by the following formula (13) is more preferred because it exhibits excellent adhesive properties when cured at low temperatures.
式(13)で表される化合物の具体例としては、ウレイドメチルトリメトキシシラン、ウレイドメチルトリエトキシシラン、2-ウレイドエチルトリメトキシシラン、2-ウレイドエチルトリエトキシシラン、3-ウレイドプロピルトリメトキシシラン、3-ウレイドプロピルトリエトキシシラン、4-ウレイドブチルトリメトキシシラン、4-ウレイドブチルトリエトキシシラン等が挙げられ、好ましくは3-ウレイドプロピルトリエトキシシランである。 Specific examples of the compound represented by formula (13) include ureidomethyltrimethoxysilane, ureidomethyltriethoxysilane, 2-ureidoethyltrimethoxysilane, 2-ureidoethyltriethoxysilane, and 3-ureidopropyltrimethoxysilane. , 3-ureidopropyltriethoxysilane, 4-ureidobutyltrimethoxysilane, 4-ureidobutyltriethoxysilane, etc., with 3-ureidopropyltriethoxysilane being preferred.
シランカップリング剤として、ヒドロキシ基又はグリシジル基を有するシランカップリング剤を用いてもよい。ヒドロキシ基又はグリシジル基を有するシランカップリング剤、及び分子内にウレア結合を有するシランカップリング剤を併用すると、さらに低温硬化時の硬化物の基板への接着性を向上することができる。
ヒドロキシ基又はグリシジル基を有するシランカップリング剤としては、メチルフェニルシランジオール、エチルフェニルシランジオール、n-プロピルフェニルシランジオール、イソプロピルフェニルシランジオール、n-ブチルフェニルシランジオール、イソブチルフェニルシランジオール、tert-ブチルフェニルシランジオール、ジフェニルシランジオール、エチルメチルフェニルシラノール、n-プロピルメチルフェニルシラノール、イソプロピルメチルフェニルシラノール、n-ブチルメチルフェニルシラノール、イソブチルメチルフェニルシラノール、tert-ブチルメチルフェニルシラノール、エチルn-プロピルフェニルシラノール、エチルイソプロピルフェニルシラノール、n-ブチルエチルフェニルシラノール、イソブチルエチルフェニルシラノール、tert-ブチルエチルフェニルシラノール、メチルジフェニルシラノール、エチルジフェニルシラノール、n-プロピルジフェニルシラノール、イソプロピルジフェニルシラノール、n-ブチルジフェニルシラノール、イソブチルジフェニルシラノール、tert-ブチルジフェニルシラノール、フェニルシラントリオール、1,4-ビス(トリヒドロキシシリル)ベンゼン、1,4-ビス(メチルジヒドロキシシリル)ベンゼン、1,4-ビス(エチルジヒドロキシシリル)ベンゼン、1,4-ビス(プロピルジヒドロキシシリル)ベンゼン、1,4-ビス(ブチルジヒドロキシシリル)ベンゼン、1,4-ビス(ジメチルヒドロキシシリル)ベンゼン、1,4-ビス(ジエチルヒドロキシシリル)ベンゼン、1,4-ビス(ジプロピルヒドロキシシリル)ベンゼン、1,4-ビス(ジブチルヒドロキシシリル)ベンゼン、及び下記式(14)で表わされる化合物等が挙げられる。中でも、特に、基板との接着性をより向上させるため、式(14)で表される化合物が好ましい。As the silane coupling agent, a silane coupling agent having a hydroxy group or a glycidyl group may be used. When a silane coupling agent having a hydroxy group or a glycidyl group and a silane coupling agent having a urea bond in the molecule are used together, the adhesion of the cured product to the substrate during low temperature curing can be further improved.
Examples of the silane coupling agent having a hydroxy group or a glycidyl group include methylphenylsilanediol, ethylphenylsilanediol, n-propylphenylsilanediol, isopropylphenylsilanediol, n-butylphenylsilanediol, isobutylphenylsilanediol, tert- Butylphenylsilanediol, diphenylsilanediol, ethylmethylphenylsilanol, n-propylmethylphenylsilanol, isopropylmethylphenylsilanol, n-butylmethylphenylsilanol, isobutylmethylphenylsilanol, tert-butylmethylphenylsilanol, ethyl n-propylphenyl Silanol, ethylisopropylphenylsilanol, n-butylethylphenylsilanol, isobutylethylphenylsilanol, tert-butylethylphenylsilanol, methyldiphenylsilanol, ethyldiphenylsilanol, n-propyldiphenylsilanol, isopropyldiphenylsilanol, n-butyldiphenylsilanol, Isobutyldiphenylsilanol, tert-butyldiphenylsilanol, phenylsilane triol, 1,4-bis(trihydroxysilyl)benzene, 1,4-bis(methyldihydroxysilyl)benzene, 1,4-bis(ethyldihydroxysilyl)benzene, 1,4-bis(propyldihydroxysilyl)benzene, 1,4-bis(butyldihydroxysilyl)benzene, 1,4-bis(dimethylhydroxysilyl)benzene, 1,4-bis(diethylhydroxysilyl)benzene, 1, Examples include 4-bis(dipropylhydroxysilyl)benzene, 1,4-bis(dibutylhydroxysilyl)benzene, and a compound represented by the following formula (14). Among these, the compound represented by formula (14) is particularly preferred in order to further improve adhesiveness with the substrate.
式(14)で表される化合物としては、ヒドロキシメチルトリメトキシシラン、ヒドロキシメチルトリエトキシシラン、2-ヒドロキシエチルトリメトキシシラン、2-ヒドロキシエチルトリエトキシシラン、3-ヒドロキシプロピルトリメトキシシラン、3-ヒドロキシプロピルトリエトキシシラン、4-ヒドロキシブチルトリメトキシシラン、4-ヒドロキシブチルトリエトキシシラン、グリシドキシメチルトリメトキシシラン、グリシドキシメチルトリエトキシシラン、2-グリシドキシエチルトリメトキシシラン、2-グリシドキシエチルトリエトキシシラン、3-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルトリエトキシシラン、4-グリシドキシブチルトリメトキシシラン、4-グリシドキシブチルトリエトキシシラン等が挙げられる。 Examples of the compound represented by formula (14) include hydroxymethyltrimethoxysilane, hydroxymethyltriethoxysilane, 2-hydroxyethyltrimethoxysilane, 2-hydroxyethyltriethoxysilane, 3-hydroxypropyltrimethoxysilane, 3- Hydroxypropyltriethoxysilane, 4-hydroxybutyltrimethoxysilane, 4-hydroxybutyltriethoxysilane, glycidoxymethyltrimethoxysilane, glycidoxymethyltriethoxysilane, 2-glycidoxyethyltrimethoxysilane, 2- Examples include glycidoxyethyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 4-glycidoxybutyltrimethoxysilane, 4-glycidoxybutyltriethoxysilane, etc. It will be done.
ヒドロキシ基又はグリシジル基を有するシランカップリング剤は、さらに、窒素原子を有する基を含むことが好ましく、さらにアミノ基又はアミド結合を有するシランカップリング剤が好ましい。
さらにアミノ基を有するシランカップリング剤としては、ビス(2-ヒドロキシメチル)-3-アミノプロピルトリエトキシシラン、ビス(2-ヒドロキシメチル)-3-アミノプロピルトリメトキシシラン、ビス(2-グリシドキシメチル)-3-アミノプロピルトリエトキシシラン、ビス(2-ヒドロキシメチル)-3-アミノプロピルトリメトキシシラン等が挙げられる。The silane coupling agent having a hydroxy group or a glycidyl group preferably further contains a group having a nitrogen atom, and further preferably has an amino group or an amide bond.
Furthermore, examples of silane coupling agents having an amino group include bis(2-hydroxymethyl)-3-aminopropyltriethoxysilane, bis(2-hydroxymethyl)-3-aminopropyltrimethoxysilane, and bis(2-glycid). Examples include oxymethyl)-3-aminopropyltriethoxysilane, bis(2-hydroxymethyl)-3-aminopropyltrimethoxysilane, and the like.
さらにアミド結合を有するシランカップリング剤としては、R36-(CH2)e-CO-NH-(CH2)f-Si(OR37)3(R36はヒドロキシ基又はグリシジル基であり、e及びfは、それぞれ独立に、1~3の整数であり、R37はメチル基、エチル基又はプロピル基である)で表される化合物等が挙げられる。Furthermore, as a silane coupling agent having an amide bond, R 36 -(CH 2 ) e -CO-NH-(CH 2 ) f -Si(OR 37 ) 3 (R 36 is a hydroxy group or a glycidyl group, e and f are each independently an integer of 1 to 3, and R 37 is a methyl group, an ethyl group, or a propyl group.
シランカップリング剤は、1種単独で用いてもよく、2種以上を組み合わせてもよい。 The silane coupling agents may be used alone or in combination of two or more.
シランカップリング剤を用いる場合、シランカップリング剤の含有量は、(A)成分100質量部に対して、0.1~20質量部が好ましく、0.3~10質量部がより好ましく、1~10質量部がさらに好ましい。 When using a silane coupling agent, the content of the silane coupling agent is preferably 0.1 to 20 parts by mass, more preferably 0.3 to 10 parts by mass, and 1 to 10 parts by mass, based on 100 parts by mass of component (A). ˜10 parts by mass is more preferable.
界面活性剤又はレベリング剤を含むことで、塗布性(例えばストリエーション(膜厚のムラ)の抑制)及び現像性を向上させることができる。 By including a surfactant or a leveling agent, coating properties (for example, suppression of striations (unevenness in film thickness)) and developability can be improved.
界面活性剤又はレベリング剤としては、例えば、ポリオキシエチレンラウリルエーテル、ポリオキシエチレンステアリルエーテル、ポリオキシエチレンオレイルエーテル、ポリオキシエチレンオクチルフェノールエーテル等が挙げられ、市販品としては、商品名「メガファックF171」、「F173」、「R-08」(以上、DIC株式会社製)、商品名「フロラードFC430」、「FC431」(以上、住友スリーエム株式会社製)、商品名「オルガノシロキサンポリマーKP341」、「KBM303」、「KBM403」、「KBM803」(以上、信越化学工業株式会社製)等が挙げられる。 Examples of the surfactant or leveling agent include polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenol ether, etc. Commercially available products include the product name "Megafac F171". ", "F173", "R-08" (manufactured by DIC Corporation), product name "Florado FC430", "FC431" (manufactured by Sumitomo 3M Corporation), product name "Organosiloxane Polymer KP341", " KBM303," "KBM403," and "KBM803" (all manufactured by Shin-Etsu Chemical Co., Ltd.).
界面活性剤及びレベリング剤は、1種単独で用いてもよく、2種以上を組み合わせてもよい。 The surfactant and the leveling agent may be used alone or in combination of two or more.
界面活性剤又はレベリング剤を含む場合、界面活性剤又はレベリング剤の含有量は、(A)成分100質量部に対して0.01~10質量部が好ましく、0.05~5質量部がより好ましく、0.05~3質量部がさらに好ましい。 When a surfactant or leveling agent is included, the content of the surfactant or leveling agent is preferably 0.01 to 10 parts by weight, more preferably 0.05 to 5 parts by weight, based on 100 parts by weight of component (A). It is preferably 0.05 to 3 parts by mass, and more preferably 0.05 to 3 parts by mass.
防錆剤を含むことで、銅及び銅合金の腐食の抑制や変色の防止ができる。
防錆剤としては、例えば、トリアゾール誘導体及びテトラゾール誘導体等が挙げられる。
防錆剤は、1種単独で用いてもよく、2種以上を組み合わせてもよい。By containing a rust preventive agent, corrosion of copper and copper alloys can be suppressed and discoloration can be prevented.
Examples of the rust preventive include triazole derivatives and tetrazole derivatives.
The rust inhibitors may be used alone or in combination of two or more.
防錆剤を用いる場合、防錆剤の含有量は、(A)成分100質量部に対して0.01~10質量部が好ましく、0.1~5質量部がより好ましく、0.5~3質量部がさらに好ましい。 When using a rust preventive agent, the content of the rust preventive agent is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, and 0.5 to 5 parts by mass, based on 100 parts by mass of component (A). 3 parts by mass is more preferred.
重合禁止剤を含有することで、良好な保存安定性を確保することができる。
重合禁止剤としては、ラジカル重合禁止剤、ラジカル重合抑制剤等が挙げられる。By containing a polymerization inhibitor, good storage stability can be ensured.
Examples of the polymerization inhibitor include radical polymerization inhibitors and radical polymerization inhibitors.
重合禁止剤としては、例えば、p-メトキシフェノール、ジフェニル-p-ベンゾキノン、ベンゾキノン、ハイドロキノン、ピロガロール、フェノチアジン、レゾルシノール、オルトジニトロベンゼン、パラジニトロベンゼン、メタジニトロベンゼン、フェナントラキノン、N-フェニル-2-ナフチルアミン、クペロン、2,5-トルキノン、タンニン酸、パラベンジルアミノフェノール、ニトロソアミン類等が挙げられる。 Examples of the polymerization inhibitor include p-methoxyphenol, diphenyl-p-benzoquinone, benzoquinone, hydroquinone, pyrogallol, phenothiazine, resorcinol, orthodinitrobenzene, paradinitrobenzene, metadinitrobenzene, phenanthraquinone, N-phenyl-2- Examples include naphthylamine, cuperone, 2,5-torquinone, tannic acid, parabenzylaminophenol, and nitrosamines.
重合禁止剤は、1種単独で用いてもよく、2種以上を組み合わせてもよい。 The polymerization inhibitors may be used alone or in combination of two or more.
重合禁止剤を含有する場合、重合禁止剤の含有量としては、感光性樹脂組成物の保存安定性及び得られる硬化物の耐熱性の観点から、(A)成分100質量部に対して、0.01~30質量部が好ましく、0.01~10質量部がより好ましく、0.05~5質量部がさらに好ましい。 When containing a polymerization inhibitor, the content of the polymerization inhibitor is 0 to 100 parts by mass of component (A) from the viewpoint of storage stability of the photosensitive resin composition and heat resistance of the obtained cured product. The amount is preferably from 0.01 to 30 parts by weight, more preferably from 0.01 to 10 parts by weight, and even more preferably from 0.05 to 5 parts by weight.
本発明の感光性樹脂組成物は、本質的に、(A)~(E)成分、並びに任意に(F)成分、カップリング剤、界面活性剤、レベリング剤、防錆剤及び重合禁止剤からなっており、本発明の効果を損なわない範囲で他に不可避不純物を含んでもよい。
本発明の感光性樹脂組成物の、例えば、80質量%以上、90質量%以上、95質量%以上、98質量%以上又は100質量%が、
(A)~(E)成分、
(A)~(F)成分、又は
(A)~(E)成分、並びに任意に(F)成分、カップリング剤、界面活性剤、レベリング剤、防錆剤及び重合禁止剤からなっていてもよい。The photosensitive resin composition of the present invention essentially consists of components (A) to (E), and optionally component (F), a coupling agent, a surfactant, a leveling agent, a rust preventive, and a polymerization inhibitor. Other unavoidable impurities may be included within a range that does not impair the effects of the present invention.
For example, 80% by mass or more, 90% by mass or more, 95% by mass or more, 98% by mass or more, or 100% by mass of the photosensitive resin composition of the present invention,
(A) to (E) components,
Even if it consists of components (A) to (F), or components (A) to (E), and optionally component (F), a coupling agent, a surfactant, a leveling agent, a rust preventive agent, and a polymerization inhibitor. good.
本発明の硬化物は、上述の感光性樹脂組成物を硬化することで得ることができる。
本発明の硬化物は、パターン硬化物として用いてもよく、パターンがない硬化物として用いてもよい。
本発明の硬化物の膜厚は、5~20μmが好ましい。The cured product of the present invention can be obtained by curing the above-mentioned photosensitive resin composition.
The cured product of the present invention may be used as a patterned cured product or as a cured product without a pattern.
The film thickness of the cured product of the present invention is preferably 5 to 20 μm.
本発明のパターン硬化物の製造方法では、上述の感光性樹脂組成物を基板上に塗布、乾燥して感光性樹脂膜を形成する工程と、感光性樹脂膜をパターン露光して、樹脂膜を得る工程と、パターン露光後の樹脂膜を、有機溶剤を用いて、現像し、パターン樹脂膜を得る工程と、パターン樹脂膜を加熱処理する工程と、を含む。
これにより、パターン硬化物を得ることができる。The method for producing a patterned cured product of the present invention includes a step of coating the above-described photosensitive resin composition on a substrate and drying it to form a photosensitive resin film, and exposing the photosensitive resin film in a pattern to form a resin film. The patterned resin film is developed using an organic solvent to obtain a patterned resin film, and the patterned resin film is heat-treated.
Thereby, a patterned cured product can be obtained.
パターンがない硬化物を製造する方法は、例えば、上述の感光性樹脂膜を形成する工程と加熱処理する工程とを備える。さらに、露光する工程を備えてもよい。 A method for manufacturing a cured product without a pattern includes, for example, the step of forming the above-mentioned photosensitive resin film and the step of heat treatment. Furthermore, a step of exposing may be included.
基板としては、ガラス基板、Si基板(シリコンウエハ)等の半導体基板、TiO2基板、SiO2基板等の金属酸化物絶縁体基板、窒化ケイ素基板、銅基板、銅合金基板などが挙げられる。Examples of the substrate include semiconductor substrates such as glass substrates and Si substrates (silicon wafers), metal oxide insulator substrates such as TiO 2 substrates and SiO 2 substrates, silicon nitride substrates, copper substrates, and copper alloy substrates.
塗布方法に特に制限はないが、スピナー等を用いて行うことができる。 There are no particular restrictions on the coating method, but a spinner or the like can be used.
乾燥は、ホットプレート、オーブン等を用いて行うことができる。
乾燥温度は90~150℃が好ましく、溶解コントラスト確保の観点から、90~120℃がより好ましい。
乾燥時間は、30秒間~5分間が好ましい。
乾燥は、2回以上行ってもよい。
これにより、上述の感光性樹脂組成物を膜状に形成した感光性樹脂膜を得ることができる。Drying can be performed using a hot plate, oven, or the like.
The drying temperature is preferably 90 to 150°C, more preferably 90 to 120°C from the viewpoint of ensuring dissolution contrast.
The drying time is preferably 30 seconds to 5 minutes.
Drying may be performed two or more times.
Thereby, a photosensitive resin film formed from the above-described photosensitive resin composition can be obtained.
感光性樹脂膜の膜厚は、5~100μmが好ましく、6~50μmがより好ましく、7~30μmがさらに好ましい。 The thickness of the photosensitive resin film is preferably 5 to 100 μm, more preferably 6 to 50 μm, and even more preferably 7 to 30 μm.
パターン露光は、例えばフォトマスクを介して所定のパターンに露光する。
照射する活性光線は、i線、広帯域(BB)等の紫外線、可視光線、放射線などが挙げられるが、i線であることが好ましい。
露光装置としては、平行露光機、投影露光機、ステッパ、スキャナ露光機等を用いることができる。In the pattern exposure, for example, a predetermined pattern is exposed through a photomask.
The active light to be irradiated includes i-line, ultraviolet rays such as broadband (BB), visible light, radiation, etc., but i-line is preferable.
As the exposure device, a parallel exposure device, a projection exposure device, a stepper, a scanner exposure device, etc. can be used.
現像することで、パターン形成された樹脂膜(パターン樹脂膜)を得ることができる。一般的に、ネガ型感光性樹脂組成物を用いた場合には、未露光部を現像液で除去する。
現像液として用いる有機溶剤は、現像液としては、感光性樹脂膜の良溶媒を単独で、又は良溶媒と貧溶媒を適宜混合して用いることができる。
良溶媒としては、N-メチル-2-ピロリドン、N-アセチル-2-ピロリドン、N,N-ジメチルアセトアミド、N,N-ジメチルホルムアミド、ジメチルスルホキシド、γ-ブチロラクトン、α-アセチル-γ-ブチロラクトン、シクロペンタノン、シクロヘキサノン等が挙げられる。
貧溶媒としては、トルエン、キシレン、メタノール、エタノール、イソプロパノール、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノメチルエーテル及び水等が挙げられる。By developing, a patterned resin film (patterned resin film) can be obtained. Generally, when a negative photosensitive resin composition is used, unexposed areas are removed with a developer.
The organic solvent used as the developer may be a good solvent for the photosensitive resin film alone, or a suitable mixture of a good solvent and a poor solvent.
Good solvents include N-methyl-2-pyrrolidone, N-acetyl-2-pyrrolidone, N,N-dimethylacetamide, N,N-dimethylformamide, dimethylsulfoxide, γ-butyrolactone, α-acetyl-γ-butyrolactone, Examples include cyclopentanone and cyclohexanone.
Examples of the poor solvent include toluene, xylene, methanol, ethanol, isopropanol, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, and water.
現像液に界面活性剤を添加してもよい。添加量としては、現像液100質量部に対して、0.01~10質量部が好ましく、0.1~5質量部がより好ましい。 A surfactant may be added to the developer. The amount added is preferably 0.01 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, per 100 parts by weight of the developer.
現像時間は、例えば感光性樹脂膜を浸漬して完全に溶解するまでの時間の2倍とすることができる。
現像時間は、用いる(A)成分によっても異なるが、10秒間~15分間が好ましく、10秒間~5分間より好ましく、生産性の観点からは、20秒間~5分間がさらに好ましい。The development time can be, for example, twice the time required for the photosensitive resin film to be completely dissolved after being immersed.
The development time varies depending on the component (A) used, but is preferably 10 seconds to 15 minutes, more preferably 10 seconds to 5 minutes, and even more preferably 20 seconds to 5 minutes from the viewpoint of productivity.
現像後、リンス液により洗浄を行ってもよい。
リンス液としては、蒸留水、メタノール、エタノール、イソプロパノール、トルエン、キシレン、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノメチルエーテル等を単独又は適宜混合して用いてもよく、また段階的に組み合わせて用いてもよい。After development, cleaning may be performed with a rinse solution.
As the rinsing liquid, distilled water, methanol, ethanol, isopropanol, toluene, xylene, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, etc. may be used alone or in appropriate mixtures, or may be used in stepwise combinations. good.
パターン樹脂膜を加熱処理することにより、パターン硬化物を得ることができる。
(A)成分のポリイミド前駆体が、加熱処理工程によって、脱水閉環反応を起こし、通常対応するポリイミドとなる。A patterned cured product can be obtained by heat-treating the patterned resin film.
The polyimide precursor of component (A) undergoes a dehydration ring-closing reaction through a heat treatment step, and usually becomes a corresponding polyimide.
加熱処理の温度は、250℃以下が好ましく、120~250℃がより好ましく、230℃以下又は180~230℃がさらに好ましい。
上記範囲内であることにより、基板やデバイスへのダメージを小さく抑えることができ、デバイスを歩留り良く生産することが可能となり、プロセスの省エネルギー化を実現することができる。The temperature of the heat treatment is preferably 250°C or lower, more preferably 120 to 250°C, and even more preferably 230°C or lower or 180 to 230°C.
By being within the above range, damage to the substrate and devices can be suppressed to a minimum, making it possible to produce devices with a high yield, and realizing energy saving in the process.
加熱処理の時間は、5時間以下が好ましく、30分間~3時間がより好ましい。
上記範囲内であることにより、架橋反応又は脱水閉環反応を充分に進行することができる。
加熱処理の雰囲気は大気中であっても、窒素等の不活性雰囲気中であってもよいが、パターン樹脂膜の酸化を防ぐことができる観点から、窒素雰囲気下が好ましい。The heat treatment time is preferably 5 hours or less, more preferably 30 minutes to 3 hours.
By being within the above range, the crosslinking reaction or dehydration ring closure reaction can proceed sufficiently.
The atmosphere for the heat treatment may be air or an inert atmosphere such as nitrogen, but a nitrogen atmosphere is preferable from the viewpoint of preventing oxidation of the patterned resin film.
加熱処理に用いられる装置としては、石英チューブ炉、ホットプレート、ラピッドサーマルアニール、縦型拡散炉、赤外線硬化炉、電子線硬化炉、マイクロ波硬化炉等が挙げられる。 Examples of the apparatus used for the heat treatment include a quartz tube furnace, a hot plate, a rapid thermal annealing, a vertical diffusion furnace, an infrared curing furnace, an electron beam curing furnace, a microwave curing furnace, and the like.
本発明の硬化物は、パッシベーション膜、バッファーコート膜、層間絶縁膜、カバーコート層又は表面保護膜等として用いることができる。
上記パッシベーション膜、バッファーコート膜、層間絶縁膜、カバーコート層及び表面保護膜等からなる群から選択される1以上を用いて、信頼性の高い、半導体装置、多層配線板、各種電子デバイス、積層デバイス(マルチダイファンアウトウエハレベルパッケージ等)等の電子部品などを製造することができる。The cured product of the present invention can be used as a passivation film, a buffer coat film, an interlayer insulating film, a cover coat layer, a surface protection film, etc.
By using one or more selected from the group consisting of the above-mentioned passivation film, buffer coat film, interlayer insulating film, cover coat layer, surface protection film, etc., highly reliable semiconductor devices, multilayer wiring boards, various electronic devices, and laminated It is possible to manufacture electronic components such as devices (multi-die fan-out wafer level packages, etc.).
本発明の電子部品である半導体装置の製造工程の一例を、図面を参照して説明する。
図1は、本発明の一実施形態に係る電子部品である多層配線構造の半導体装置の製造工程図である。
図1において、回路素子を有するSi基板等の半導体基板1は、回路素子の所定部分を除いてシリコン酸化膜等の保護膜2などで被覆され、露出した回路素子上に第1導体層3が形成される。その後、前記半導体基板1上に層間絶縁膜4が形成される。An example of the manufacturing process of a semiconductor device, which is an electronic component of the present invention, will be described with reference to the drawings.
FIG. 1 is a manufacturing process diagram of a semiconductor device with a multilayer wiring structure, which is an electronic component according to an embodiment of the present invention.
In FIG. 1, a
次に、塩化ゴム系、フェノールノボラック系等の感光性樹脂層5が、層間絶縁膜4上に形成され、公知の写真食刻技術によって所定部分の層間絶縁膜4が露出するように窓6Aが設けられる。
Next, a
窓6Aが露出した層間絶縁膜4は、選択的にエッチングされ、窓6Bが設けられる。
次いで、窓6Bから露出した第1導体層3を腐食することなく、感光性樹脂層5のみを腐食するようなエッチング溶液を用いて感光性樹脂層5が完全に除去される。The
Next, the
さらに公知の写真食刻技術を用いて、第2導体層7を形成し、第1導体層3との電気的接続を行う。
3層以上の多層配線構造を形成する場合には、上述の工程を繰り返して行い、各層を形成することができる。Further, a
When forming a multilayer wiring structure of three or more layers, each layer can be formed by repeating the above steps.
次に、上述の感光性樹脂組成物を用いて、パターン露光により窓6Cを開口し、表面保護膜8を形成する。表面保護膜8は、第2導体層7を外部からの応力、α線等から保護するものであり、得られる半導体装置は信頼性に優れる。
尚、前記例において、層間絶縁膜を本発明の感光性樹脂組成物を用いて形成することも可能である。Next, using the photosensitive resin composition described above, the
In addition, in the above example, it is also possible to form the interlayer insulating film using the photosensitive resin composition of the present invention.
以下、実施例及び比較例に基づき、本発明についてさらに具体的に説明する。尚、本発明は下記実施例に限定されるものではない。 The present invention will be described in more detail below based on Examples and Comparative Examples. Note that the present invention is not limited to the following examples.
合成例1(A1の合成)
3,3’,4,4’‐ジフェニルエーテルテトラカルボン酸二無水物(ODPA)7.07gと2,2’-ジメチルビフェニル-4,4’-ジアミン(DMAP)4.12gとをN-メチル-2-ピロリドン(NMP)30gに溶解し、30℃で4時間、その後室温下で一晩撹拌し、ポリアミド酸を得た。そこに水冷下で無水トリフルオロ酢酸を9.45g加え、45℃で3時間撹拌し、メタクリル酸2-ヒドロキシエチル(HEMA)7.08gを加えた。この反応液を蒸留水に滴下し、沈殿物をろ別して集め、減圧乾燥することによってポリイミド前駆体A1を得た。
ゲルパーミエーションクロマトグラフ(GPC)法を用いて、標準ポリスチレン換算により、以下の条件で、数平均分子量を求めた。A1の数平均分子量は40,000であった。Synthesis example 1 (synthesis of A1)
N-methyl- It was dissolved in 30 g of 2-pyrrolidone (NMP) and stirred at 30° C. for 4 hours and then at room temperature overnight to obtain polyamic acid. 9.45 g of trifluoroacetic anhydride was added thereto under water cooling, stirred at 45° C. for 3 hours, and 7.08 g of 2-hydroxyethyl methacrylate (HEMA) was added. This reaction solution was added dropwise to distilled water, and the precipitate was collected by filtration and dried under reduced pressure to obtain polyimide precursor A1.
Using gel permeation chromatography (GPC), the number average molecular weight was determined in terms of standard polystyrene under the following conditions. The number average molecular weight of A1 was 40,000.
0.5mgのA1に対して溶剤[テトラヒドロフラン(THF)/ジメチルホルムアミド(DMF)=1/1(容積比)]1mLの溶液を用いて測定した。 The measurement was performed using a solution of 1 mL of solvent [tetrahydrofuran (THF)/dimethylformamide (DMF) = 1/1 (volume ratio)] for 0.5 mg of A1.
測定装置:検出器 株式会社日立製作所製L4000UV
ポンプ:株式会社日立製作所製L6000
株式会社島津製作所製C-R4A Chromatopac
測定条件:カラムGelpack GL-S300MDT-5×2本
溶離液:THF/DMF=1/1(容積比)
LiBr(0.03mol/L)、H3PO4(0.06mol/L)
流速:1.0mL/min、検出器:UV270nmMeasuring device: Detector L4000UV manufactured by Hitachi, Ltd.
Pump: L6000 manufactured by Hitachi, Ltd.
C-R4A Chromatopac manufactured by Shimadzu Corporation
Measurement conditions: Column Gelpack GL-S300MDT-5
LiBr (0.03mol/L), H3PO4 ( 0.06mol /L)
Flow rate: 1.0mL/min, detector: UV270nm
また、A1のエステル化率(ODPAのカルボキシ基のHEMAとの反応率)を、以下の条件でNMR測定を行い、算出した。エステル化率は、ポリアミド酸の全カルボキシ基に対し80モル%であった(残り20モル%はカルボキシ基)。 Further, the esterification rate of A1 (the reaction rate of the carboxy group of ODPA with HEMA) was calculated by performing NMR measurement under the following conditions. The esterification rate was 80 mol% based on the total carboxyl groups of the polyamic acid (the remaining 20 mol% was carboxyl groups).
測定機器:ブルカー・バイオスピン社製 AV400M
磁場強度:400MHz
基準物質:テトラメチルシラン(TMS)
溶媒:ジメチルスルホキシド(DMSO)Measuring equipment: Bruker Biospin AV400M
Magnetic field strength: 400MHz
Reference material: Tetramethylsilane (TMS)
Solvent: dimethyl sulfoxide (DMSO)
実施例1~3及び比較例1~5
(感光性樹脂組成物の調製)
表1に示した成分及び配合量にて、実施例1~3及び比較例1~5の感光性樹脂組成物を調製した。表1の配合量は、100質量部のA1に対する、各成分の質量部である。Examples 1 to 3 and Comparative Examples 1 to 5
(Preparation of photosensitive resin composition)
Photosensitive resin compositions of Examples 1 to 3 and Comparative Examples 1 to 5 were prepared using the components and blending amounts shown in Table 1. The blending amounts in Table 1 are parts by mass of each component relative to 100 parts by mass of A1.
用いた各成分は以下の通りである。(A)成分として、合成例1で得られたA1を用いた。 The components used are as follows. As component (A), A1 obtained in Synthesis Example 1 was used.
(B)成分:重合性モノマー
B1:A-DCP(新中村化学工業株式会社製、トリシクロデカンジメタノールジアクリレート、下記式B1で表される化合物)
(C)成分:光重合開始剤
C1:IRUGCURE OXE 02(BASFジャパン株式会社製、エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム))
C2:G-1820(PDO)(Lambson株式会社製、1-フェニル-1,2-プロパンジオン-2-(O-エトキシカルボニル)オキシム)Component (C): Photoinitiator C1: IRUGCURE OXE 02 (manufactured by BASF Japan Co., Ltd., ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1 -(O-acetyloxime))
C2: G-1820 (PDO) (manufactured by Lambson Co., Ltd., 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime)
(D)成分:環化触媒
D1:2HE(モーリン化学工業株式会社製、N-フェニルジエタノールアミン)(D) Component: Cyclization catalyst D1:2HE (manufactured by Morin Chemical Industry Co., Ltd., N-phenyldiethanolamine)
(D’)成分
D2:U-CAT SA810(サンアプロ株式会社製、下記式D2で表される化合物)
(E)成分:溶剤
E1:KJCMPA-100(KJケミカルズ株式会社製、下記式E1で表される化合物)
(F)成分:熱重合開始剤
F1:パークミルD(日油株式会社製、ビス(1-フェニル-1-メチルエチル)ペルオキシド、下記式F1で表される化合物)
(感度の評価)
得られた感光性樹脂組成物を、塗布装置Act8(東京エレクトロン株式会社製)を用いて、シリコンウエハ上にスピンコートし、105℃で120秒間乾燥後、115℃で120秒間乾燥して乾燥膜厚が13μmの感光性樹脂膜を形成した。
得られた感光性樹脂膜をシクロペンタノンに浸漬して完全に溶解するまでの時間の2倍を現像時間として設定した。
また、上記と同様に感光性樹脂膜を作製し、得られた感光性樹脂膜に、i線ステッパFPA-3000iW(キヤノン株式会社製)を用いて、100~1100mJ/cm2のi線を、100mJ/cm2刻みの照射量で、所定のパターンに照射して、露光を行った。
露光後の樹脂膜を、Act8を用いて、シクロペンタノンに、上記の現像時間で現像した後、プロピレングリコールモノメチルエーテルアセテート(PGMEA)でリンス洗浄を行い、パターン樹脂膜を得た。(Evaluation of sensitivity)
The obtained photosensitive resin composition was spin-coated onto a silicon wafer using a coating device Act8 (manufactured by Tokyo Electron Ltd.), dried at 105°C for 120 seconds, and then dried at 115°C for 120 seconds to form a dry film. A photosensitive resin film having a thickness of 13 μm was formed.
The development time was set to be twice the time required for the obtained photosensitive resin film to be completely dissolved by immersing it in cyclopentanone.
In addition, a photosensitive resin film was prepared in the same manner as above, and an i-line of 100 to 1100 mJ/cm 2 was applied to the obtained photosensitive resin film using an i-line stepper FPA-3000iW (manufactured by Canon Inc.). Exposure was performed by irradiating a predetermined pattern with an irradiation dose of 100 mJ/cm2 in steps of 2 .
The exposed resin film was developed with
得られたパターン樹脂膜の膜厚が、露光前の感光性樹脂膜の膜厚の80%以上となる露光量の下限を感度とした。結果を表1に示す。 The lower limit of the exposure amount at which the thickness of the patterned resin film obtained was 80% or more of the thickness of the photosensitive resin film before exposure was defined as the sensitivity. The results are shown in Table 1.
(パターン硬化物の製造1)
感度の評価で得られたパターン樹脂膜を、縦型拡散炉μ-TF(光洋サーモシステム株式会社製)を用いて、窒素雰囲気下、200℃で2時間加熱し、パターン硬化物(硬化後膜厚10μm)が得られた。(Manufacture of patterned cured product 1)
The patterned resin film obtained in the sensitivity evaluation was heated at 200°C for 2 hours in a nitrogen atmosphere using a vertical diffusion furnace μ-TF (manufactured by Koyo Thermo Systems Co., Ltd.) to form a patterned cured product (cured film). A thickness of 10 μm) was obtained.
(パターン硬化物の製造2)
感度の評価で得られたパターン樹脂膜を、縦型拡散炉μ-TFを用いて、窒素雰囲気下、400℃で1時間加熱し、パターン硬化物が得られた。(Manufacture of patterned cured product 2)
The patterned resin film obtained in the sensitivity evaluation was heated at 400° C. for 1 hour in a nitrogen atmosphere using a vertical diffusion furnace μ-TF to obtain a patterned cured product.
(環化率の評価)
感度の評価で得られたパターン樹脂膜について、FT-IR IRAffinity-1S(株式会社島津製作所製)を用いて、以下の条件でIR(赤外分光分析)スペクトルを測定した。この値をIR1とする。
IRスペクトルの測定条件は、透過法で、測定範囲400~4000cm-1、積算回数16回で行った。
IRスペクトルの測定は、基板としてシリコンウエハを用いた。まず、感光性樹脂組成物を塗布していない基板について、測定し、バックグラウンドとした。次に、パターン樹脂膜の樹脂膜部分について、上記バックグラウンドを用いて、測定を行い、IRスペクトルを得た。(Evaluation of cyclization rate)
The IR (infrared spectroscopy) spectrum of the patterned resin film obtained in the sensitivity evaluation was measured using FT-IR IRAffinity-1S (manufactured by Shimadzu Corporation) under the following conditions. Let this value be IR1.
The measurement conditions for the IR spectrum were a transmission method, a measurement range of 400 to 4000 cm −1 , and 16 integrations.
A silicon wafer was used as the substrate for the measurement of the IR spectrum. First, a substrate to which no photosensitive resin composition was applied was measured and used as a background. Next, the resin film portion of the patterned resin film was measured using the above background to obtain an IR spectrum.
また、パターン硬化物の製造1で得られたパターン硬化物について、上記と同様にIRを測定した。この値をIR2とする。
パターン硬化物の製造2で得られたパターン硬化物について、上記と同様にIRを測定した。この値をIR3とする。Further, the IR was measured in the same manner as above for the patterned cured product obtained in
Regarding the patterned cured product obtained in Production of Patterned Cured
IR2からIR1を引いた値を、IR3からIR1を引いた値で除して、百分率にすることで、環化率を求めた。65%以上をAとし、65%未満をBとした。結果を表1に示す。 The cyclization rate was determined by dividing the value obtained by subtracting IR1 from IR2 by the value obtained by subtracting IR1 from IR3 and converting the result into a percentage. 65% or more was rated A, and less than 65% was rated B. The results are shown in Table 1.
(保存安定性の評価)
上述の感光性樹脂組成物について、調整後24時間以内で、Si基板上に、乾燥後の膜厚が13μmになる回転数でスピンコートし、ホットプレート上で、105℃で120秒間、115℃で120秒間加熱乾燥し、感光性樹脂膜を形成した。膜の一部分をけがくことでシリコンウエハを露出させ、露出したシリコンウエハ表面から膜表面までの高さを、接針式プロファイラーDektak150(ブルカー社製)を用いて、測定した(膜厚の測定は、上記において同様であり、以下においても同様である)。これを膜厚1とする。
上述の感光性樹脂組成物を、調整後、室温(25℃)で、14日間静置した。静置の後、Si基板上に、膜厚1測定用の感光性樹脂膜を形成したときと同じ回転数でスピンコートし、ホットプレート上で、105℃で120秒間、115℃で120秒間加熱乾燥し、感光性樹脂膜を形成した。上記と同様に、膜厚を測定した。これを膜厚2とする。
膜厚2から膜厚1を引いた絶対値を、膜厚1で除して、百分率にした値が、5%以下の場合をAとした。5%を超える場合をBとした。結果を表1に示す。(Evaluation of storage stability)
Within 24 hours after preparation, the photosensitive resin composition described above was spin-coated onto a Si substrate at a rotation speed that gave a film thickness of 13 μm after drying, and then coated on a hot plate at 105°C for 120 seconds at 115°C. The film was dried by heating for 120 seconds to form a photosensitive resin film. The silicon wafer was exposed by scratching a part of the film, and the height from the exposed silicon wafer surface to the film surface was measured using a contact profiler Dektak150 (manufactured by Bruker). , the same applies above and the same applies below). This is defined as a film thickness of 1.
After the above photosensitive resin composition was adjusted, it was allowed to stand at room temperature (25° C.) for 14 days. After standing still, spin coating was performed on the Si substrate at the same rotation speed as when forming the photosensitive resin film for
The absolute value obtained by subtracting the
(パターン硬化物の製造3)
上述の感光性樹脂組成物を、Si基板上にスピンコートし、ホットプレート上で、105℃で120秒間、115℃で120秒間加熱乾燥し、12.0~13.0μmの感光性樹脂膜を形成した。
得られた感光性樹脂膜を、マスクアライナーMA-8(ズース・マイクロテック社製)を用いて、広帯域(BB)露光し、露光後の樹脂膜を、シクロペンタノンにて現像し、10mm幅の短冊状のパターン樹脂膜を得た。
得られたパターン樹脂膜を、縦型拡散炉μ-TFを用いて、窒素雰囲気下、200℃で2時間、硬化し、膜厚10μmのパターン硬化物を得た。(Manufacture of patterned cured product 3)
The above-described photosensitive resin composition was spin-coated onto a Si substrate, and heated and dried on a hot plate at 105°C for 120 seconds and at 115°C for 120 seconds to form a photosensitive resin film with a thickness of 12.0 to 13.0 μm. Formed.
The obtained photosensitive resin film was exposed to broadband (BB) light using Mask Aligner MA-8 (manufactured by SUSS Microtech), and the exposed resin film was developed with cyclopentanone to form a 10 mm wide film. A strip-shaped patterned resin film was obtained.
The resulting patterned resin film was cured for 2 hours at 200° C. in a nitrogen atmosphere using a vertical diffusion furnace μ-TF to obtain a patterned cured product with a thickness of 10 μm.
(伸び率の評価)
パターン硬化物の製造3で得られたパターン硬化物を、4.9質量%フッ酸水溶液に浸漬して、10mm幅の硬化物をウエハから剥離した。
剥離した10mm幅の硬化物について、オートグラフAGS-X 100 N(株式会社島津製作所製)を用いて、引っ張り試験を行った。チャック間距離20mm、引張速度5mm/分、測定温度を18~25℃とし、各実施例及び比較例の硬化物ごとに、3回測定し、伸び率の平均値を求めた。
伸び率の平均値が、50%超の場合Aとし、45%超50%以下の場合Bとし、45%以下の場合Cとした。PCT(プレッシャークッカー試験)前の結果として、表1に示す。(Evaluation of growth rate)
The patterned cured product obtained in Production of Patterned Cured
A tensile test was performed on the peeled cured product with a width of 10 mm using Autograph AGS-X 100N (manufactured by Shimadzu Corporation). The distance between the chucks was 20 mm, the tensile speed was 5 mm/min, and the measurement temperature was 18 to 25° C., and each cured product of each example and comparative example was measured three times, and the average elongation rate was determined.
When the average elongation rate was over 50%, it was designated as A, when it was over 45% and not more than 50%, it was designated as B, and when it was 45% or less, it was designated as C. Table 1 shows the results before PCT (pressure cooker test).
また、上述のパターン硬化物の製造3で得られたパターン硬化物を、PCT試験装置HASTEST(株式会社平山製作所製、PC-R8D)を用いて、121℃、100RH(Relative Humidity)%、2atmで100時間処理した。
PCT試験装置からパターン硬化物を取り出し、パターン硬化物を、上記と同様に剥離し、引っ張り試験を行い、伸び率の平均値を求めた。
伸び率の平均値が、50%超の場合Aとし、45%超50%以下の場合Bとし、45%以下の場合Cとした。PCT後の結果として、表1に示す。「-」は測定しなかったこと示す。Further, the patterned cured product obtained in the above-mentioned pattern cured
The pattern cured product was taken out from the PCT testing apparatus, and the pattern cured product was peeled off in the same manner as above, a tensile test was performed, and the average elongation rate was determined.
When the average elongation rate was over 50%, it was designated as A, when it was over 45% and not more than 50%, it was designated as B, and when it was 45% or less, it was designated as C. Table 1 shows the results after PCT. "-" indicates that no measurement was performed.
本発明の感光性樹脂組成物は、層間絶縁膜、カバーコート層又は表面保護膜等に用いることができ、本発明の層間絶縁膜、カバーコート層又は表面保護膜は、電子部品等に用いることができる。 The photosensitive resin composition of the present invention can be used for an interlayer insulating film, a cover coat layer, a surface protective film, etc., and the interlayer insulating film, cover coat layer, or surface protective film of the present invention can be used for electronic components, etc. I can do it.
上記に本発明の実施形態及び/又は実施例を幾つか詳細に説明したが、当業者は、本発明の新規な教示及び効果から実質的に離れることなく、これら例示である実施形態及び/又は実施例に多くの変更を加えることが容易である。従って、これらの多くの変更は本発明の範囲に含まれる。
この明細書に記載の文献、及び本願のパリ条約による優先権の基礎となる出願の内容を全て援用する。
Although some embodiments and/or examples of the present invention have been described in detail above, those skilled in the art will appreciate that these exemplary embodiments and/or It is easy to make many changes to the embodiment. Accordingly, many of these modifications are within the scope of this invention.
The documents mentioned in this specification and the content of the application that is the basis of the priority right under the Paris Convention of this application are all incorporated by reference.
Claims (19)
(B)重合性モノマー、
(C1)下記式(15)で表される化合物、
(C2)下記式(16)で表される化合物、
(D)環化触媒、及び
(E)溶剤を含有する感光性樹脂組成物。
(B) a polymerizable monomer,
(C1) A compound represented by the following formula (15) ,
(C2) a compound represented by the following formula (16),
(D) A cyclization catalyst, and (E) a photosensitive resin composition containing a solvent.
前記感光性樹脂膜をパターン露光して、樹脂膜を得る工程と、
前記パターン露光後の樹脂膜を、有機溶剤を用いて、現像し、パターン樹脂膜を得る工程と、
前記パターン樹脂膜を加熱処理する工程と、を含むパターン硬化物の製造方法。 Coating the photosensitive resin composition according to any one of claims 1 to 13 on a substrate and drying it to form a photosensitive resin film;
pattern-exposing the photosensitive resin film to obtain a resin film;
Developing the resin film after the pattern exposure using an organic solvent to obtain a pattern resin film;
A method for producing a patterned cured product, comprising the step of heat-treating the patterned resin film.
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