JP7405056B2 - power converter - Google Patents

Description

The present invention relates to a power conversion device.

For example, Patent Document 1 describes a driver circuit that drives an IGBT as a switching element. The driver circuit described in Patent Document 1 feeds back the induced voltage induced from the inductance of the emitter wiring through which the collector current flows as the applied current, in order to achieve both reduction of switching loss and reduction of surge voltage or surge current. Active gate control is used to The induced voltage is induced by a change in collector current.

Japanese Patent Application Publication No. 2004-48843

Here, for example, if the inductance that generates the induced voltage is small, the desired induced voltage may not be obtained and the desired feedback effect may not be obtained. However, since the applied current flows, for example, if the inductance is increased, losses and surges tend to increase. From the above, there is still room for improvement in order to obtain the desired feedback effect.

A power conversion device that achieves the above object is provided with a switching element having a control terminal and an application terminal through which an applied current flows, a first inductance component through which the applied current flows, and a position where a magnetic flux generated from the first inductance component passes through. and a second inductance component that induces a feedback voltage by a change in the magnetic flux accompanying a change in the applied current, and a driver circuit that drives the switching element, the driver circuit receiving the feedback voltage. a feedback input terminal, an external input terminal into which an external command voltage is input, the external command voltage or a conversion command voltage obtained by converting the external command voltage, and the feedback voltage or a conversion command voltage obtained by converting the feedback voltage. It is characterized by comprising an addition circuit that adds the obtained conversion feedback voltage and outputs the added voltage to the control terminal.

According to this configuration, a feedback voltage is induced by the second inductance component as the magnetic flux changes with a change in the applied current flowing through the first inductance component. Then, the feedback voltage or the converted feedback voltage obtained by converting the feedback voltage is fed back to the adding circuit, and the added voltage is input to the control terminal. This makes it possible to suppress surges when the switching element is turned on or turned off.

In particular, according to this configuration, the desired feedback effect is obtained by using the feedback voltage induced by the second inductance component as the voltage fed back to the driver circuit, instead of the back electromotive force generated by the first inductance component. be able to.

The power conversion device includes a drive substrate on which the switching element is mounted, the first inductance component includes a parasitic inductance within the switching element, and the second inductance component is formed on the drive substrate and includes a parasitic inductance within the switching element. It is preferable that at least a part of the feedback pattern is formed by a feedback pattern arranged next to the switching element.

According to this configuration, since at least a part of the feedback pattern that constitutes the second inductance component is arranged next to the switching element, the distance between them tends to be shortened. This tends to cause interaction between the feedback pattern and the parasitic inductance within the switching element. Therefore, the feedback voltage can be increased.

Regarding the power conversion device, if the direction in which the applied current flows in the switching element is a first direction, and the direction perpendicular to both the first direction and the thickness direction of the drive board is a second direction, the feedback The pattern and the switching element may be arranged side by side in the second direction, and the feedback pattern may have a portion extending in the first direction.

According to this configuration, the magnetic flux generated by the parasitic inductance within the switching element penetrates the portion of the feedback pattern extending in the first direction, thereby increasing the area through which the magnetic flux penetrates in the feedback pattern. Therefore, the feedback voltage can be increased.

In the power conversion device, the switching elements include a first switching element and a second switching element arranged apart from each other in the first direction, and the feedback pattern includes a first switching element and a second switching element arranged adjacent to the first switching element in the second direction. a first feedback pattern disposed next to the second switching element in the second direction, and a second feedback pattern disposed adjacent to the second switching element in the second direction; The second feedback pattern is arranged within a range of the second switching element in the first direction, and the distance between the two feedback patterns is the distance between the two switching elements. It is better if it is larger than .

According to this configuration, it is possible to suppress generation of a feedback voltage in the other feedback pattern due to a change in magnetic flux in one of the two feedback patterns, and it is possible to suppress malfunction of a switching element corresponding to the other feedback pattern. .

The power conversion device includes a drive board and a control board stacked to face each other, the switching element is mounted on the drive board, the driver circuit is mounted on the control board, and the first inductance The second inductance component includes a parasitic inductance within the switching element, and the second inductance component is configured by a feedback pattern formed on the control board and electrically connected to the driver circuit, and the second inductance component is configured by a feedback pattern formed on the control board and electrically connected to the driver circuit. At least a portion of the switching element may be disposed at a position overlapping the switching element when viewed from the stacking direction of the drive board and the control board.

According to this configuration, since at least a portion of the feedback pattern is arranged at a position overlapping the switching element when viewed from the stacking direction of both substrates, the magnetic flux generated from the parasitic inductance within the switching element penetrates the feedback pattern. As a result, a feedback voltage is induced from the second inductance component. Therefore, the above-mentioned effects can be obtained. Further, according to this configuration, there is no need to transmit feedback voltage between different boards, so the configuration can be simplified.

According to this invention, a desired feedback effect can be obtained.

1 is a circuit diagram showing an overview of the electrical configuration of a power conversion device. FIG. 3 is a front view schematically showing a switching element, a driver circuit, and a feedback pattern mounted on a drive board in the first embodiment. FIG. 3 is a circuit diagram schematically showing a switching element and a driver circuit. FIG. 7 is a front view schematically showing a driver circuit and a feedback pattern in a second embodiment. A sectional view taken along the line 5-5 in FIG. 4. FIG. 7 is a circuit diagram schematically showing another example of a switching element and a driver circuit.

(First embodiment)
A first embodiment of the power conversion device will be described below.
The power conversion device 10 of this embodiment is mounted, for example, on a vehicle 200, and is used to drive an electric motor 201 provided in the vehicle 200.

The electric motor 201 of this embodiment is a traveling motor for rotating the wheels of the vehicle 200. The electric motor 201 of this embodiment has three-phase coils 202u, 202v, and 202w. The three-phase coils 202u, 202v, and 202w are, for example, Y-connected. The electric motor 201 rotates by energizing the three-phase coils 202u, 202v, and 202w in a predetermined pattern. Note that the connection mode of the three-phase coils 202u, 202v, and 202w is not limited to Y-connection, but is arbitrary, and may be, for example, delta connection.

As shown in FIG. 1, vehicle 200 includes a power storage device 203. The power conversion device 10 of this embodiment is an inverter device that converts DC power of a power storage device 203 into AC power that can be driven by an electric motor 201. In other words, the power conversion device 10 can also be said to be a drive device that drives the electric motor 201 using the power storage device 203. Note that the voltage of power storage device 203 is assumed to be power supply voltage Vdc.

Power conversion device 10 has switching element 11 . The power converter 10 of this embodiment has a plurality of switching elements 11, and in detail, u-phase switching elements 11u1 and 11u2 corresponding to the u-phase coil 202u, and v-phase switching elements 11u1 and 11u2 corresponding to the v-phase coil 202v. It includes elements 11v1 and 11v2, and w-phase switching elements 11w1 and 11w2 corresponding to the w-phase coil 202w.

Each switching element 11u1, 11u2, 11v1, 11v2, 11w1, 11w2 (hereinafter referred to as "each switching element 11u1 to 11w2") is, for example, a power switching element, and an example is a MOSFET. Each of the switching elements 11u1 to 11w2 corresponds to a "switching element". The switching elements 11u1 to 11w2 have free wheel diodes (body diodes) Du1 to Dw2.

The u-phase switching elements 11u1 and 11u2 are connected in series to each other via connection lines. Specifically, the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2 are connected via a connection line, and the connection line is connected to the u-phase coil 202u. The u-phase upper arm switching element 11u1 is connected to a positive terminal (+ terminal) on the high voltage side of the power storage device 203. The u-phase lower arm switching element 11u2 is connected to a negative terminal (− terminal) on the low voltage side of the power storage device 203.

Note that the connection manner of the other switching elements 11v1, 11v2, 11w1, 11w2 is the same as that of the u-phase switching elements 11u1, 11u2, except that the corresponding coils are different.

As shown in FIGS. 1 and 2, the power conversion device 10 includes a driver circuit 12 that drives the switching element 11, and a drive board 13 on which the switching element 11 is mounted. In this embodiment, the driver circuit 12 is mounted on the drive board 13.

The driver circuit 12 of this embodiment is a so-called gate driver circuit. The power conversion device 10 of this embodiment includes a plurality of driver circuits 12 corresponding to a plurality of switching elements 11. Specifically, the power conversion device 10 includes a plurality of driver circuits 12u1 to 12w2 corresponding to a plurality of switching elements 11u1 to 11w2. The driver circuits 12u1 to 12w2 are connected to the gates of the switching elements 11u1 to 11w2, and turn the switching elements 11u1 to 11w2 ON/OFF by controlling gate voltages.

As shown in FIG. 1 , vehicle 200 includes a conversion control device 14 that controls power conversion device 10 . The conversion control device 14 of this embodiment is an inverter control device. Conversion control device 14 determines a target current flowing through electric motor 201 based on an external command (eg, required rotational speed), and derives external command voltage Vp at which the target current flows. Then, the conversion control device 14 outputs the external command voltage Vp to the driver circuit 12.

In this embodiment, the conversion control device 14 derives the external command voltage Vp for each of the switching elements 11u1 to 11w2, and outputs the external command voltage Vp to each of the driver circuits 12u1 to 12w2. As a result, each of the switching elements 11u1 to 11w2 is individually controlled.

The external command voltage Vp is a pulse voltage having a predetermined pulse width. For example, the external command voltage Vp switches from LOW to HI, maintains the HI state for a certain period of time, and then switches from HI to LOW. In the following description, the switching from LOW to HI will be referred to as "rising", and the switching from HI to LOW will be referred to as "falling".

Note that the conversion control device 14 of this embodiment is mounted on the drive board 13. However, the present invention is not limited to this, and the conversion control device 14 may be mounted on a board different from the drive board 13.

Driver circuits 12u1 to 12w2 apply gate voltages to switching elements 11u1 to 11w2 based on external command voltages Vp that are individually input. As a result, each of the switching elements 11u1 to 11w2 is periodically turned ON/OFF, and the DC power of the power storage device 203 is converted into three-phase AC power and supplied to the electric motor 201. That is, the conversion control device 14 performs PWM control on the power conversion device 10.

Next, the switching elements 11u1 to 11w2 and the driver circuits 12u1 to 12w2 will be explained in detail.
Here, each of the switching elements 11u1 to 11w2 has basically the same configuration, and each of the driver circuits 12u1 to 12w2 has basically the same configuration. Therefore, in the following, one switching element 11 (u-phase upper arm switching element 11u1) among each of the switching elements 11u1 to 11w2 and the corresponding driver circuit 12 (upper arm u-phase driver circuit 12u1) will be described in detail. do.

As shown in FIG. 2, the switching element 11 includes an element body 20, a gate terminal 21, a drain terminal 22, and a source terminal 23 attached to the element body 20.
The element main body 20 has a rectangular parallelepiped shape, for example. The element body 20 has a first side surface 20a and a second side surface 20b, which are both end surfaces in the X direction orthogonal to the thickness direction of the drive board 13. The second side surface 20b is a side surface opposite to the first side surface 20a. The X direction can also be said to be a direction that intersects (perpendicularly intersects in this embodiment) both side surfaces 20a and 20b.

The drain terminal 22 is provided on the first side surface 20a. In this embodiment, there is only one drain terminal 22, and it is formed in a tab shape extending in one direction of the first side surface 20a, specifically, in the Y direction. The Y direction is a direction perpendicular to both the thickness direction of the drive substrate 13 and the X direction.

In this embodiment, a plurality of source terminals 23 are provided. The gate terminal 21 and the plurality of source terminals 23 are provided in a portion of the switching element 11 opposite to the drain terminal 22. Specifically, the gate terminal 21 and the plurality of source terminals 23 are provided on the second side surface 20b. In this case, it can be said that the gate terminal 21 and the plurality of source terminals 23 face the drain terminal 22 in the X direction with the element body 20 interposed therebetween. That is, the X direction can also be said to be the direction in which the drain terminal 22 and the source terminal 23 face each other.

The gate terminal 21 and the plurality of source terminals 23 are arranged in the Y direction at a predetermined pitch on the second side surface 20b. In other words, the Y direction can also be said to be the direction in which the plurality of source terminals 23 are arranged.

When a gate voltage equal to or higher than a predetermined threshold is applied to the gate terminal 21, a drain current Id as an applied current flows through the drain terminal 22 and the plurality of source terminals 23. The drain current Id is a current flowing between the source and drain of the switching element 11.

In this embodiment, the drain current Id flows from the drain terminal 22 through the element body 20 toward the plurality of source terminals 23 . Therefore, the drain current Id flows in the switching element 11 in the X direction. That is, the X direction can also be said to be the direction of the current flowing within the switching element 11. Note that the number of source terminals 23 is arbitrary. In this embodiment, the gate terminal 21 corresponds to a "control terminal", and the source terminal 23 and drain terminal 22 correspond to "application terminals". In particular, the drain terminal 22 corresponds to the "first application terminal" and the source terminal 23 corresponds to the "second application terminal".

Here, a source-drain voltage Vds, which is a voltage for causing a drain current Id to flow through the switching element 11, is applied between the source and drain of the switching element 11. The source-drain voltage Vds of this embodiment becomes the power supply voltage Vdc when the switching element 11 is in the OFF state, and becomes 0V when the switching element 11 is in the ON state.

The power conversion device 10 has a first inductance component L1 through which a drain current Id flows. The first inductance component L1 is provided on the current path through which the drain current Id flows.

In this embodiment, as shown in FIG. 3, the first inductance component L1 includes the parasitic inductance Ls within the element body 20 of the switching element 11. The parasitic inductance Ls is configured by, for example, a wiring pattern within the element body 20, a wire, a source terminal 23, and the like.

According to this configuration, when the switching element 11 is turned on and the drain current Id flows, magnetic flux is generated from the first inductance component L1. In this embodiment, since the first inductance component L1 includes the parasitic inductance Ls, the magnetic flux is generated around the switching element 11. The magnetic flux changes as the drain current Id changes.

The power conversion device 10 in this embodiment has a second inductance component L2 provided at a position where the magnetic flux generated from the first inductance component L1 passes through. The second inductance component L2 induces a feedback voltage Vf due to a change in magnetic flux accompanying a change in drain current Id. In this case, the second inductance component L2 can be said to be magnetically coupled to the first inductance component L1, or can be said to cooperate with the first inductance component L1 to form a transformer.

The second inductance component L2 of this embodiment is configured by a wiring pattern mounted on the drive board 13. Specifically, as shown in FIG. 2, the power conversion device 10 includes a feedback pattern 31 formed on the drive board 13 and forming the second inductance component L2. The feedback pattern 31 is one of the wiring patterns formed on the drive board 13.

The feedback pattern 31 is provided at a position where the magnetic flux passes through the drive board 13, and in this embodiment, it is arranged next to the switching element 11. Specifically, the feedback pattern 31 is arranged adjacent to the switching element 11 in the Y direction. Therefore, the feedback pattern 31 and the switching element 11 are arranged side by side in the Y direction.

Here, as already explained, the drain current Id flows in the X direction inside the switching element 11 (specifically, the element main body 20), and the Y direction is a direction perpendicular to the X direction. Therefore, it can be said that the feedback pattern 31 and the switching element 11 are arranged side by side in a direction perpendicular to the direction in which the drain current Id flows. In this embodiment, the X direction corresponds to the "first direction" and the Y direction corresponds to the "second direction."

The feedback pattern 31 of this embodiment is a single line drawn around, and has a first end 31a and a second end 31b. The feedback pattern 31 is formed, for example, in a spiral shape. Specifically, the feedback pattern 31 extends in a spiral shape from the first end 31a to the second end 31b. In this case, the first end 31a can be said to be an outer peripheral end, and the second end 31b can also be said to be an inner peripheral end.

The feedback pattern 31 has a first part portion 31c and a second part portion 31d extending in the X direction. Here, if the direction from the first end 31a to the second end 31b of the feedback pattern 31 is defined as the extending direction of the feedback pattern 31, the first part portion 31c is connected to the extending direction of the feedback pattern 31 and the drain current Id. The flow direction matches the flow direction. On the other hand, in the second part portion 31d, the direction in which the feedback pattern 31 extends is opposite to the direction in which the drain current Id flows. In this embodiment, the second part part 31d is arranged closer to the switching element 11 than the first part part 31c. A plurality of second parts portions 31d are arranged side by side in the Y direction. The first part part 31c is arranged in line in the Y direction at a position farther away from the switching element 11 than the second part part 31d.

Incidentally, in this embodiment, the feedback pattern 31 partially protrudes from the element body 20 in the X direction. However, when viewed in relation to the entire switching element 11 including the drain terminal 22 and source terminal 23, the feedback pattern 31 is within the range of the switching element 11 in the X direction, and is larger than the switching element 11. It does not protrude in the X direction. That is, it can be said that the feedback pattern 31 of this embodiment is entirely arranged next to the switching element 11.

As shown in FIG. 2, the power conversion device 10 includes a connection section 32 that connects the feedback pattern 31 and the driver circuit 12. The connecting portion 32 has a first connecting portion 33 that connects the first end 31a and the driver circuit 12, and a second connecting portion 34 that connects the second end 31b and the driver circuit 12. .

The first connection portion 33 is configured by a wiring pattern formed on the drive board 13. In this embodiment, the first connecting portion 33 and the first end portion 31a are continuously connected, and there is no boundary between them. The first connection section 33 is connected to one terminal (in this embodiment, the first feedback input terminal 53) of the driver circuit 12.

The second connecting portion 34 connects the second end portion 31b and the driver circuit 12 so as not to interfere with the feedback pattern 31. Specifically, the second connection section 34 connects an arch section 34a formed in an arch shape so as to straddle the feedback pattern 31 (specifically, the first part section 31c), and the arch section 34a and the driver circuit 12. It has a connection pattern 34b.

The arch portion 34a is made of, for example, wire. The arch portion 34a is formed in an inverted U shape when viewed from the X direction, and straddles the first part portion 31c. The arch portion 34a has a first arch end 34aa joined to the second end 31b, and a second arch end 34ab disposed outside the feedback pattern 31.

The connection pattern 34b is configured by a wiring pattern formed on the drive board 13, for example. The connection pattern 34b is connected to the second arch end 34ab and also to one terminal (specifically, the second feedback input terminal 54) of the driver circuit 12.

According to this configuration, when the drain current Id flowing through the switching element 11 changes, the magnetic flux generated from the first inductance component L1 changes. Then, a feedback voltage Vf is induced in the second inductance component L2 provided at a position where the magnetic flux passes through. Feedback voltage Vf is applied to driver circuit 12 via connection 32 . Note that the change in drain current Id includes a case where the drain current Id starts flowing and a case where the drain current Id stops.

In this embodiment, the feedback voltage Vf is larger than the back electromotive force generated in the first inductance component L1. Specifically, the second inductance component L2 is configured such that the feedback voltage Vf is greater than the back electromotive force. That is, the second inductance component L2 of this embodiment generates a feedback voltage Vf that is larger than the back electromotive force generated in the first inductance component L1.

In other words, the second inductance component L2 of this embodiment is magnetically coupled to the first inductance component L1, and amplifies the back electromotive force generated in the first inductance component L1 to generate the feedback voltage Vf. It can also be said that

As shown in FIG. 2, in this embodiment, the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2 are arranged apart from each other in the X direction. The X direction can be said to be the arrangement direction of the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2, and the Y direction is the arrangement direction of both the u-phase switching elements 11u1 and 11u2 and the thickness direction of the drive board 13. It can also be said to be a direction perpendicular to both.

The second inductance component L2 (feedback pattern 31 in this embodiment) is provided corresponding to each of the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2. Specifically, the power conversion device 10 includes, as the feedback pattern 31, a u-phase upper arm feedback pattern 31u1 arranged next to the u-phase upper arm switching element 11u1 in the Y direction, and a u-phase lower arm switching element 11u2 in the Y direction. The U-phase lower arm feedback pattern 31u2 is arranged next to the U-phase lower arm feedback pattern 31u2. Both feedback patterns 31u1 and 31u2 are arranged apart from each other in the X direction, and in this embodiment, the distance between both feedback patterns 31u1 and 31u2 is larger than the distance between both U-phase switching elements 11u1 and 11u2.

In this embodiment, the u-phase upper arm switching element 11u1 and the u-phase upper arm feedback pattern 31u1 correspond to a "first switching element" and a "first feedback pattern." The u-phase lower arm switching element 11u2 and the u-phase lower arm feedback pattern 31u2 correspond to a "second switching element" and a "second feedback pattern."

The same applies to the v-phase upper arm switching element 11v1 and the v-phase lower arm switching element 11v2, and the w-phase upper arm switching element 11w1 and the w-phase lower arm switching element 11w2.

The power conversion device 10 includes a plurality of drive patterns 41 to 43 formed on a drive substrate 13. Each drive pattern 41 to 43 is used to electrically connect the switching element 11 and the power storage device 203, and is also used to electrically connect the switching element 11 and the electric motor 201 as a load. It is being Drive patterns 41 to 43 include parasitic inductance.

The first drive pattern 41 is used to connect the u-phase upper arm switching element 11u1 to a positive terminal (+ terminal) on the high voltage side of the power storage device 203. The first drive pattern 41 is disposed on the side of the u-phase upper arm switching element 11u1 in the X direction on the side where the drain terminal 22 is located. ing. The drain terminal 22 of the u-phase upper arm switching element 11u1 is connected to the first drive pattern 41.

The second drive pattern 42 connects the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2. The second drive pattern 42 is arranged on the side of the u-phase upper arm switching element 11u1 in the X direction on which the plurality of source terminals 23 are located, and more specifically on the side of the second side surface 20b of the drive board 13. It is formed. The second drive pattern 42 is arranged between the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2. The plurality of source terminals 23 of the u-phase upper arm switching element 11u1 are connected to the second drive pattern 42, and the drain terminal 22 of the u-phase lower arm switching element 11u2 is connected to the second drive pattern 42. Further, the second drive pattern 42 is connected to the electric motor 201 (specifically, the u-phase coil 202u).

The third drive pattern 43 is used to connect the u-phase lower arm switching element 11u2 and the negative terminal (-terminal), which is the low voltage side of the power storage device 203. The third drive pattern 43 is arranged on the side where the plurality of source terminals 23 are located among both sides of the u-phase lower arm switching element 11u2 in the X direction, and specifically on the side of the second side surface 20b of the drive board 13. It is formed. The plurality of source terminals 23 of the u-phase lower arm switching element 11u2 are connected to the third drive pattern 43.

According to this configuration, when the u-phase upper arm switching element 11u1 is in the ON state, the drain current Id flows from the first drive pattern 41 to the second drive pattern 42 via the u-phase upper arm switching element 11u1. Further, when the u-phase lower arm switching element 11u2 is in the ON state, the drain current Id flows from the second drive pattern 42 to the third drive pattern 43 via the u-phase lower arm switching element 11u2.

In this embodiment, a first drive pattern 41 and a second drive pattern 42 are arranged on both sides of the u-phase upper arm switching element 11u1 in the X direction, and a second drive pattern 42 is arranged on both sides of the u-phase lower arm switching element 11u2 in the X direction. It can also be said that the drive pattern 42 and the third drive pattern 43 are arranged. That is, the power conversion device 10 of this embodiment has drive patterns on both sides of the switching element 11 in the X direction.

Next, the driver circuit 12 will be explained.
As shown in FIG. 3, the driver circuit 12 includes an external input terminal 51, an output terminal 52, and feedback input terminals 53 and 54.

External input terminal 51 is electrically connected to conversion control device 14 . The external command voltage Vp from the conversion control device 14 is input to the external input terminal 51 .
The output terminal 52 is a terminal for outputting a gate voltage (in other words, gate current) from the driver circuit 12. As shown in FIG. 2, a gate pattern that electrically connects the output terminal 52 and the gate terminal 21 is formed on the drive board 13, and the gate voltage output from the output terminal 52 is transmitted through the gate pattern. and is input to the gate terminal 21.

The feedback input terminals 53 and 54 are terminals into which the feedback voltage Vf is input. In this embodiment, two feedback input terminals 53 and 54 are provided, and both feedback input terminals 53 and 54 are connected to the second inductance component L2. Specifically, as shown in FIG. 2, both feedback input terminals 53 and 54 are connected to the feedback pattern 31 via the connection part 32. As a result, the feedback voltage Vf generated in the second inductance component L2 is applied between both the feedback input terminals 53 and 54.

The driver circuit 12 generates an added voltage Vad based on an external command voltage Vp input from an external input terminal 51 and a feedback voltage Vf inputted to feedback input terminals 53 and 54, and gates the added voltage Vad. The voltage is configured to be output from the output terminal 52 as a voltage.

An example of the driver circuit 12 that outputs the added voltage Vad will be described below.
The driver circuit 12 of this embodiment includes a command conversion circuit 55 that converts an external command voltage Vp into a conversion command voltage Vpt, a feedback conversion circuit 56 that converts a feedback voltage Vf into a conversion feedback voltage Vft, and a conversion command voltage Vpt and a conversion command voltage Vpt. An addition circuit 57 that adds the feedback voltage Vft is provided.

The command conversion circuit 55 converts the external command voltage Vp into a command voltage Vpt by amplifying the external command voltage Vp at a predetermined amplification factor while reducing noise included in the external command voltage Vp input from the external input terminal 51. Convert to Then, the command conversion circuit 55 outputs the conversion command voltage Vpt to the addition circuit 57. Note that the amplification factor includes "1". The specific configuration of the command conversion circuit 55 is arbitrary, and may be, for example, a non-inverting amplifier circuit having an operational amplifier.

The feedback conversion circuit 56 converts the feedback voltage Vf into a converted feedback voltage Vft by amplifying the feedback voltage Vf by a predetermined amplification factor, for example, and outputs the converted feedback voltage Vft to the addition circuit 57 .

In this embodiment, the conversion feedback voltage Vft is higher than the feedback voltage Vf. That is, the amplification factor of the feedback conversion circuit 56 in this embodiment is greater than "1". However, the present invention is not limited to this, and the amplification factor of the feedback conversion circuit 56 may be "1" or may be smaller than "1".

Here, the polarity of the conversion feedback voltage Vft differs depending on the change mode of the drain current Id. Specifically, when the drain current Id increases, the conversion feedback voltage Vft becomes a negative voltage, while when the drain current Id decreases, the conversion feedback voltage Vft becomes a positive voltage.

If the feedback voltage Vf is input to the driver circuit 12 as a negative voltage when the drain current Id increases, the feedback conversion circuit 56 converts the feedback voltage Vf into a converted feedback voltage Vft without inverting the feedback voltage Vf. On the other hand, if the feedback voltage Vf is input to the driver circuit 12 as a positive voltage when the drain current Id increases, the feedback conversion circuit 56 inverts the feedback voltage Vf and converts it into a converted feedback voltage Vft. Note that the polarity of the feedback voltage Vf input to the driver circuit 12 can be changed depending on, for example, the connection state between the feedback pattern 31 and the feedback input terminals 53 and 54.

The specific configuration of the feedback conversion circuit 56 is arbitrary. For example, the feedback conversion circuit 56 may include a voltage dividing circuit that divides the feedback voltage Vf and a voltage amplifying circuit that amplifies the divided voltage.

The addition circuit 57 is connected to the command conversion circuit 55 and the feedback conversion circuit 56, and is also connected to the output terminal 52. The conversion command voltage Vpt and the conversion feedback voltage Vft are input to the addition circuit 57. Addition circuit 57 adds conversion command voltage Vpt and conversion feedback voltage Vft, and outputs the added addition voltage Vad toward output terminal 52. As a result, the additional voltage Vad as a gate voltage is input to the gate terminal 21.

The specific configuration of the adder circuit 57 is arbitrary. For example, the adder circuit 57 may be configured such that a line through which the conversion command voltage Vpt is transmitted and a line through which the conversion feedback voltage Vft is transmitted are connected. Further, the addition circuit 57 preferably includes a voltage amplification circuit that generates the addition voltage Vad by amplifying a voltage that is a combination of the conversion command voltage Vpt and the conversion feedback voltage Vft.

Note that the addition circuit 57 may include a current amplification circuit in order to supply the necessary current to the gate terminal 21 while maintaining the addition voltage Vad. Further, the adder circuit 57 may have a gate resistor.

Next, the operation of this embodiment will be explained.
First, a description will be given of when the switching element 11 is turned on.
As the external command voltage Vp rises, the source-drain voltage Vds starts to fall, and the drain current Id starts to flow. As a result, magnetic flux is generated in the first inductance component L1. A feedback voltage Vf is generated from the second inductance component L2 due to a change in magnetic flux due to a change (more specifically, an increase) in the drain current Id. In this embodiment, the feedback voltage Vf is input to the driver circuit 12 and converted to the converted feedback voltage Vft.

Then, the conversion command voltage Vpt and the conversion feedback voltage Vft are added, and the added voltage Vad is input to the gate terminal 21 of the switching element 11. In this case, since the conversion feedback voltage Vft is added, the rising angle from LOW to HI in the addition voltage Vad (in other words, the slope of the addition voltage Vad) becomes gentler than the conversion command voltage Vpt. This suppresses a surge when the drain current Id rises.

Next, a description will be given of the time when the switching element 11 is turned off.
As the external command voltage Vp falls, the source-drain voltage Vds starts to rise, while the drain current Id starts to decrease. As a result, the magnetic flux generated in the first inductance component L1 changes. As a result, a feedback voltage Vf is generated from the second inductance component L2. In this embodiment, the feedback voltage Vf is input to the driver circuit 12 and converted to the converted feedback voltage Vft. Then, an added voltage Vad obtained by adding the conversion command voltage Vpt and the conversion feedback voltage Vft is input to the gate terminal 21 of the switching element 11.

In this case, since the conversion feedback voltage Vft is added, the falling angle from HI to LOW in the addition voltage Vad (in other words, the slope of the addition voltage Vad) becomes gentler than the conversion command voltage Vpt. . This suppresses a surge when the source-drain voltage Vds rises.

According to this embodiment described in detail above, the following effects are achieved.
(1-1) The power conversion device 10 includes a switching element 11, a first inductance component L1, a second inductance component L2, and a driver circuit 12 that drives the switching element 11.

The switching element 11 has a gate terminal 21 as a control terminal, and a drain terminal 22 and a source terminal 23 through which a drain current Id as an applied current flows. Since the drain current Id flows through the first inductance component L1, magnetic flux is generated from the first inductance component L1. The second inductance component L2 is provided at a position where the magnetic flux generated from the first inductance component L1 passes through, and induces a feedback voltage Vf by a change in the magnetic flux accompanying a change in the drain current Id.

The driver circuit 12 includes an external input terminal 51 to which an external command voltage Vp is input, and feedback input terminals 53 and 54 to which a feedback voltage Vf is input. The driver circuit 12 adds a conversion command voltage Vpt obtained by converting the external command voltage Vp and a conversion feedback voltage Vft obtained by converting the feedback voltage Vf, and gates the added voltage Vad. It includes an adder circuit 57 that outputs an output toward the terminal 21.

According to this configuration, the feedback voltage Vf is induced from the second inductance component L2 as the magnetic flux changes with the change in the drain current Id flowing through the first inductance component L1. Then, a conversion feedback voltage Vft corresponding to the feedback voltage Vf is added to the conversion command voltage Vpt, and the added voltage Vad is input to the gate terminal 21. This makes it possible to suppress surges when the switching element 11 is turned on or turned off.

In particular, according to this configuration, the feedback voltage Vf induced by the second inductance component L2 is used as the voltage fed back to the driver circuit 12, instead of the back electromotive force generated by the first inductance component L1. Thereby, the voltage generated due to the change in the drain current Id can be suitably fed back, and a desired feedback effect can be obtained.

Regarding the above effects, a configuration in which the back electromotive force generated in the first inductance component L1 is fed back will be described in detail as a comparative example. The effect (specifically, the surge suppression effect) may be reduced and the desired feedback effect may not be obtained. However, since the drain current Id flows through the first inductance component L1, if the first inductance component L1 is increased in an attempt to increase the back electromotive force, losses and surges will increase.

In this regard, according to the present configuration, since the feedback voltage Vf depends on the second inductance component L2, a desired feedback voltage Vf can be obtained by adjusting the second inductance component L2. Further, since the drain current Id does not flow through the second inductance component L2, the loss occurring in the second inductance component L2 can be small. Thereby, a desired feedback effect can be obtained while suppressing loss.

(1-2) Here, in order to obtain a desired feedback effect in the comparative example, a configuration may be considered in which, for example, the driver circuit 12 includes an amplifier circuit that amplifies the back electromotive force. However, in the amplification by the amplifier circuit, noise included in the back electromotive force is also amplified. Therefore, excessive amplification by the amplifier circuit can cause malfunction.

In this regard, according to the present configuration, by providing the second inductance component L2, it is possible to obtain the feedback voltage Vf of a desired magnitude, so there is no need to perform excessive amplification. Therefore, malfunctions caused by noise can be suppressed.

(1-3) The power conversion device 10 includes a drive board 13 on which the switching element 11 is mounted. The first inductance component L1 includes a parasitic inductance Ls within the switching element 11. The second inductance component L2 is configured by a feedback pattern 31 mounted on the drive board 13. At least a portion (all in this embodiment) of the feedback pattern 31 is arranged next to the switching element 11.

According to this configuration, since the feedback pattern 31 constituting the second inductance component L2 is arranged next to the switching element 11, the distance between them tends to become short. As a result, interaction is likely to occur between the feedback pattern 31 and the parasitic inductance Ls within the switching element 11. Therefore, the feedback voltage Vf can be increased.

(1-4) The feedback pattern 31 and the switching element 11 are arranged in a direction perpendicular to both the direction in which the drain current Id flows in the switching element 11 (specifically, the are arranged side by side in the Y direction). The feedback pattern 31 has both parts 31c and 31d extending in the X direction.

According to this configuration, the magnetic flux generated by the parasitic inductance Ls in the switching element 11 penetrates both parts 31c and 31d, thereby increasing the area in the feedback pattern 31 that the magnetic flux penetrates. Therefore, the feedback voltage Vf can be increased.

(1-5) The feedback pattern 31 is formed in a spiral shape. Thereby, the length of the feedback pattern 31 can be increased, and the second inductance component L2 can be increased. Therefore, the feedback voltage Vf can be increased.

(1-6) The driver circuit 12 includes a command conversion circuit 55 that converts an external command voltage Vp into a conversion command voltage Vpt, and a feedback conversion circuit 56 that converts a feedback voltage Vf into a conversion feedback voltage Vft. The adding circuit 57 adds the conversion command voltage Vpt and the conversion feedback voltage Vft. The feedback voltage Vf is larger than the back electromotive force generated in the first inductance component L1, and the converted feedback voltage Vft is larger than the feedback voltage Vf.

According to this configuration, even if the external command voltage Vp and the feedback voltage Vf are significantly different in voltage, an appropriate additional voltage Vad can be generated. Thereby, an appropriate feedback effect can be obtained.

In particular, according to this configuration, the feedback voltage Vf induced by the second inductance component L2 is converted, and the feedback voltage Vf is larger than the back electromotive force generated in the first inductance component L1. This allows the conversion ratio by the feedback conversion circuit 56 to be reduced, thereby reducing the influence of noise.

(1-7) The power conversion device 10 includes, as the switching elements 11, a u-phase upper arm switching element 11u1 and a u-phase lower arm switching element 11u2 arranged apart from each other in the X direction. The power conversion device 10 includes, as feedback patterns 31, a u-phase upper arm feedback pattern 31u1 arranged next to the u-phase upper arm switching element 11u1 in the Y direction, and a u-phase lower arm switching element 11u2 arranged next to the U-phase lower arm switching element 11u2 in the Y direction. The U-phase lower arm feedback pattern 31u2 is provided.

In this configuration, the feedback patterns 31u1, 31u2 are within the range of the u-phase switching elements 11u1, 11u2 in the X direction, and the distance between the feedback patterns 31u1, 31u2 is equal to the distance between the u-phase switching elements 11u1, 11u2. greater than distance. According to this configuration, malfunctions caused by the feedback patterns 31u1 and 31u2 can be suppressed.

Specifically, when both u-phase switching elements 11u1 and 11u2 are arranged side by side in the X direction, the u-phase upper arm feedback pattern 31u1 corresponding to the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2 U-phase lower arm feedback patterns 31u2 corresponding to are arranged side by side in the X direction. In this case, the magnetic flux generated from the u-phase upper arm feedback pattern 31u1 may generate an unintended voltage in the u-phase lower arm feedback pattern 31u2, and this voltage may cause the u-phase lower arm switching element 11u2 to malfunction. In particular, since the magnetic flux tends to increase as the position nearer to the feedback pattern 31 approaches, malfunctions are more likely to occur as the feedback patterns 31u1 and 31u2 get closer together.

In this regard, according to the present configuration, the feedback patterns 31u1 and 31u2 are within the range of the u-phase switching elements 11u1 and 11u2 in the X direction, and do not protrude from the u-phase switching elements 11u1 and 11u2 in the X direction. Thereby, the distance between both feedback patterns 31u1 and 31u2 can be ensured to be larger than the distance between both U-phase switching elements 11u1 and 11u2. Therefore, it is possible to suppress the voltage from being generated in the other feedback pattern due to a change in the magnetic flux of one of the feedback patterns 31u1 and 31u2, and it is possible to suppress the switching element corresponding to the other feedback pattern from malfunctioning.

(Second embodiment)
This embodiment differs from the first embodiment in the arrangement of the driver circuit 12 and feedback pattern 31. The different points will be explained using FIGS. 4 and 5. 4 and 5, the switching element 11, the driver circuit 12, and the connector 101 are schematically shown.

As shown in FIGS. 4 and 5, the power conversion device 10 of this embodiment includes a control board 100 on which a driver circuit 12 is mounted, in addition to a drive board 13 on which the switching element 11 is mounted. The drive board 13 and the control board 100 are stacked in the thickness direction of both boards 13 and 100 so as to face each other. The lamination direction of both substrates 13 and 100 can also be said to be the thickness direction of drive substrate 13 or control substrate 100. The conversion control device 14 is mounted on the control board 100.

The feedback pattern 31 of this embodiment is formed on the control board 100. Specifically, the feedback pattern 31 is arranged so that at least a portion thereof overlaps the switching element 11 when viewed from the stacking direction of both the substrates 13 and 100.

For example, as shown in FIG. 4, the feedback pattern 31 is arranged so as to partially overlap the element body 20. Specifically, the second part portion 31d of the feedback pattern 31 is arranged at a position overlapping with the element main body 20, while the first part part 31c is arranged at a position shifted from the element main body 20.

However, the present invention is not limited to this, and the first part part 31c may be arranged at a position overlapping with the element main body 20, while the second part part 31d may be arranged at a position shifted from the element main body 20. That is, one of the first part part 31c and the second part part 31d may be arranged at a position overlapping with the element main body 20, while the other may be arranged at a position shifted from the element main body 20. Further, the entire feedback pattern 31 may be placed at a position overlapping the element body 20.

Similar to the first embodiment, the feedback pattern 31 and the driver circuit 12 are connected by a connecting portion 32. Thereby, the feedback voltage Vf induced by the feedback pattern 31 is input to the driver circuit 12.

The power conversion device 10 includes a connector 101 that electrically connects the drive board 13 and the control board 100. In this embodiment, the switching element 11 and the driver circuit 12, specifically the gate terminal 21 and the output terminal 52, are electrically connected via the connector 101 and gate patterns 102a and 102b formed on the substrates 13 and 100. ing.

On the other hand, in this embodiment, since the feedback pattern 31 is formed on the same control board 100 as the driver circuit 12, the configuration related to transmission of the feedback voltage Vf is simplified. Specifically, in the connector 101 and the drive board 13, the configuration (specifically, pins and wiring patterns) for transmitting the feedback voltage Vf is omitted.

According to this embodiment described in detail above, the following effects are achieved.
(2-1) The power conversion device 10 includes a drive board 13 and a control board 100 stacked so as to face each other. The switching element 11 is mounted on the drive board 13, and the driver circuit 12 is mounted on the control board 100. The second inductance component L2 is constituted by a feedback pattern 31 formed on the control board 100, and at least a part of the feedback pattern 31 is located at a position overlapping the switching element 11 when viewed from the stacking direction of both the boards 13 and 100. It is located.

According to this configuration, since at least a part of the feedback pattern 31 is arranged at a position overlapping the switching element 11 when viewed from the stacking direction of both the substrates 13 and 100, the magnetic flux generated from the parasitic inductance Ls within the switching element 11 runs through the feedback pattern 31. As a result, a feedback voltage Vf is induced from the second inductance component L2. Therefore, the effect (1-1) is achieved.

Further, according to this configuration, since the feedback pattern 31 is formed on the control board 100 on which the driver circuit 12 is mounted, there is no need to transmit the feedback voltage Vf between different boards 13 and 100. Thereby, the configuration for electrically connecting the feedback pattern 31 and the driver circuit 12 can be simplified.

Note that each of the above embodiments may be modified as follows. Furthermore, the above embodiments and the following different examples may be combined as appropriate within a range that does not technically cause contradiction.
The first inductance component L1 may include a parasitic inductance included in at least one of each drive pattern 41 to 43. In this case, the feedback pattern 31 may extend further in the X direction than the switching element 11. For example, the feedback pattern 31 may extend across the switching element 11 and at least one of the drive patterns on both sides of the switching element 11 in the X direction. In this case, a part of the feedback pattern 31 will be placed next to the switching element 11, and another part will be placed next to the drive pattern. In short, it is sufficient that at least a portion of the feedback pattern 31 is placed next to the switching element 11. Note that in this other example, the distance between both feedback patterns 31u1 and 31u2 is smaller than the distance between both U-phase switching elements 11u1 and 11u2.

○ The inductance component L1 does not need to include the parasitic inductance Ls. In this case, the feedback pattern 31 is selectively placed next to one of the drive patterns 41 to 43, but may not be placed next to the switching element 11.

The first inductance component L1 may or may not include inductance other than the inductance of the switching element 11 or each drive pattern 41 to 43.

○ The first inductance component L1 may be constituted by a dedicated coil.
○ The feedback voltage Vf may be smaller than the back electromotive force generated in the first inductance component L1. That is, the second inductance component L2 may generate a feedback voltage Vf that is smaller than the back electromotive force generated in the first inductance component L1. This makes it possible to cope with the case where the back electromotive force generated in the first inductance component L1 is larger than a desired value.

The specific position of the second inductance component L2 is arbitrary as long as it is provided at a position through which the magnetic flux generated from the first inductance component L1 passes. For example, in the first embodiment, the feedback pattern 31 forming the second inductance component L2 may be placed next to the first drive pattern 41 in the X direction. Furthermore, in the second embodiment, the control board 100 may be arranged below the drive board 13 and the feedback pattern 31 may be arranged below the switching element 11.

The specific shape of the feedback pattern 31 is not limited to a spiral shape, but may be arbitrary, and may be, for example, a zigzag shape. Further, the feedback pattern 31 may have a single line shape extending in the X direction.

○ What constitutes the second inductance component L2 is not limited to the wiring pattern formed on the drive board 13, but may be any material as long as it has inductance. For example, the second inductance component L2 may be configured by a dedicated coil mounted on the drive board 13 or the control board 100.

- At least one of the command conversion circuit 55 and the feedback conversion circuit 56 may be omitted.
For example, the command conversion circuit 55 may be omitted. In this case, the external command voltage Vp is input to the addition circuit 57. Addition circuit 57 adds external command voltage Vp and feedback voltage Vf or a converted feedback voltage Vft obtained by converting feedback voltage Vf.

For example, the feedback conversion circuit 56 may be omitted. In this case, the adder circuit 57 receives the feedback voltage Vf. Addition circuit 57 adds external command voltage Vp or conversion command voltage Vpt obtained by converting external command voltage Vp and feedback voltage Vf.

That is, the addition circuit 57 only needs to be input with either the external command voltage Vp or the conversion command voltage Vpt, and either the feedback voltage Vf or the conversion feedback voltage Vft. In other words, the addition circuit 57 may be one that adds the external command voltage Vp or conversion command voltage Vpt and the feedback voltage Vf or conversion feedback voltage Vft.

○ As shown in FIG. 6, the driver circuit 12 may have a reference potential terminal 111. The reference potential terminal 111 is connected to the reference potential V0 within the driver circuit 12.

Corresponding to this, the power conversion device 10 may include a signal wiring 112 that connects one of the plurality of source terminals 23 and the reference potential terminal 111. The signal wiring 112 is preferably configured by a wiring pattern formed on the drive board 13, for example. For convenience of explanation, the one connected to the second drive pattern 42 among the plurality of source terminals 23 will be referred to as the main source terminal 23a, and the one connected to the signal wiring 112 will be referred to as the signal source terminal 23b.

According to this configuration, the drain current Id hardly flows through the signal wiring 112 and the signal source terminal 23b connected to the signal wiring 112. Therefore, the signal wiring 112 and the signal source terminal 23b are not easily affected by the parasitic inductance Ls. Therefore, the signal source terminal 23b can be equivalently considered to be connected to a portion of the switching element 11 upstream of the parasitic inductance Ls.

The switching element 11 is not limited to a MOSFET, but may be any arbitrary one, for example, an IGBT. In this case, the gate terminal of the switching element 11 corresponds to the "control terminal", the collector current flowing between the collector and emitter of the switching element 11 corresponds to the "applied current", and the collector terminal and the emitter terminal correspond to the "applying terminal". handle.

○ Although each of the switching elements 11u1 to 11w2 constitutes an inverter, it is not limited to this, and may optionally constitute, for example, a DC/DC converter that converts DC power of the power storage device 203 to DC power of a different voltage. good. That is, the power conversion device 10 is not limited to an inverter, but may be any other suitable device such as a DC/DC converter, an AC/AC converter, or an AC/DC inverter. In other words, the power converter 10 may convert DC power or AC power into DC power or AC power.

○ The load is not limited to the electric motor 201 but is arbitrary.
○ The power conversion device 10 may be mounted on a vehicle other than the vehicle 200. That is, power converter 10 may drive a load other than the load provided in vehicle 200.

Next, a preferred example that can be understood from the above embodiment and other examples will be described below.
(a) The switching element includes an element main body, the element main body has a first side surface and a second side surface that are both end surfaces in the first direction, and the application terminal is provided on the first side surface. a first application terminal provided on the first side surface, and a second application terminal provided on the first side surface, and the applied current flows within the switching element from the first application terminal to the second application terminal. It would be good if it were.

DESCRIPTION OF SYMBOLS 10... Power conversion device, 11 (11u1-11w2)... Switching element, 12 (12u1-12w2)... Driver circuit, 13... Drive board, 21... Gate terminal (control terminal), 22... Drain terminal (applying terminal), 23 ...Source terminal (applying terminal), 31...Feedback pattern, 31u1...U-phase upper arm feedback pattern (first feedback pattern), 31u2...U-phase lower arm feedback pattern (second feedback pattern), 41-43... Drive pattern, 51... External input terminal, 52... Output terminal, 53, 54... Feedback input terminal, 55... Command conversion circuit, 56... Feedback conversion circuit, 57... Addition circuit, 100... Control board, 200... Vehicle, 201... Electric motor ( load), 203...Power storage device, Vp...External command voltage, Vpt...Conversion command voltage, Vf...Feedback voltage, Vft...Conversion feedback voltage, Vad...Additional voltage, L1...First inductance component, Ls...Parasitic inductance, L2... Second inductance component, Id...Drain current (applied current).

Claims (3)

a switching element having a control terminal and an application terminal through which an applied current flows;
a first inductance component through which the applied current flows;
a second inductance component that is provided at a position where the magnetic flux generated from the first inductance component passes through, and that induces a feedback voltage due to a change in the magnetic flux that accompanies a change in the applied current;
a driver circuit that drives the switching element;
a drive board on which the switching element is mounted;
Equipped with
The driver circuit is
a feedback input terminal into which the feedback voltage is input;
an external input terminal into which external command voltage is input;
Adding the external command voltage or a conversion command voltage obtained by converting the external command voltage and the feedback voltage or a conversion feedback voltage obtained by converting the feedback voltage, and calculating the added voltage. an adder circuit that outputs toward the control terminal;
Equipped with
The first inductance component includes a parasitic inductance within the switching element,
The second inductance component is configured by a feedback pattern formed on the drive board and at least a part of which is disposed next to the switching element,
When the direction in which the applied current flows in the switching element is a first direction, and the direction perpendicular to both the first direction and the thickness direction of the drive substrate is a second direction,
The feedback pattern and the switching element are arranged side by side in the second direction,
The power conversion device , wherein the feedback pattern has a portion extending in the first direction . As the switching element, a first switching element and a second switching element arranged in a spaced manner in the first direction;
As the feedback pattern, a first feedback pattern arranged next to the first switching element in the second direction, and a second feedback pattern arranged next to the second switching element in the second direction;
Equipped with
The first feedback pattern is arranged within a range of the first switching element in the first direction, and the second feedback pattern is arranged within a range of the second switching element in the first direction,
The power conversion device according to claim 1 , wherein a distance between the two feedback patterns is larger than a distance between the two switching elements. a switching element having a control terminal and an application terminal through which an applied current flows;
a first inductance component through which the applied current flows;
a second inductance component that is provided at a position where the magnetic flux generated from the first inductance component passes through, and that induces a feedback voltage due to a change in the magnetic flux that accompanies a change in the applied current;
a driver circuit that drives the switching element;
a drive board and a control board stacked to face each other;
Equipped with
The driver circuit is
a feedback input terminal into which the feedback voltage is input;
an external input terminal into which external command voltage is input;
Adding the external command voltage or a conversion command voltage obtained by converting the external command voltage and the feedback voltage or a conversion feedback voltage obtained by converting the feedback voltage, and calculating the added voltage. an adder circuit that outputs toward the control terminal;
Equipped with
The switching element is mounted on the drive board,
The driver circuit is mounted on the control board,
The first inductance component includes a parasitic inductance within the switching element,
The second inductance component is configured by a feedback pattern formed on the control board and electrically connected to the driver circuit,
A power converter device , wherein at least a portion of the feedback pattern is disposed at a position overlapping the switching element when viewed from a stacking direction of the drive board and the control board .