JP2022061798A - Power converter - Google Patents

Abstract

To provide a power converter capable of obtaining desired feedback effect.SOLUTION: A power converter 10 includes: a switching element 11; a first inductance component L1 through which a drain current Id flows; a second inductance component L2; and a driver circuit 12 for driving the switching element 11. The second inductance component L2 is provided at a position where magnetic flux generated from the first inductance component L1 penetrates, and induces a feedback voltage Vf due to change in the magnetic flux accompanied by change in a drain current Id. The driver circuit 12 includes an adder circuit 57 for adding a conversion command voltage Vpt obtained by converting an external command voltage Vp and a conversion feedback voltage Vft obtained by converting the feedback voltage Vf.SELECTED DRAWING: Figure 3

Description

The present invention relates to a power conversion device.

For example, Patent Document 1 describes a driver circuit that drives an IGBT as a switching element. The driver circuit described in Patent Document 1 feeds back the induced voltage induced from the inductance of the emitter wiring through which the collector current as the applied current flows in order to achieve both the reduction of switching loss and the reduction of surge voltage or surge current. Active gate control is performed. The induced voltage is induced by changing the collector current.

Japanese Unexamined Patent Publication No. 2004-48843

Here, for example, when the inductance for generating the induced voltage is small, the desired induced voltage may not be obtained and the desired feedback effect may not be obtained. However, due to the flow of applied current, for example, if the inductance is increased, the loss and surge tend to increase. From the above, there is still room for improvement in order to obtain the desired feedback effect.

The power conversion device that achieves the above object is provided at a position where a switching element having a control terminal and an application terminal through which the applied current flows, a first inductance component through which the applied current flows, and a magnetic voltage generated from the first inductance component penetrate. A second inductance component that induces a feedback voltage by a change in the magnetic flux accompanying a change in the applied current, and a driver circuit that drives the switching element are provided, and the feedback voltage is input to the driver circuit. By converting the feedback input terminal, the external input terminal to which the external command voltage is input, the conversion command voltage obtained by converting the external command voltage or the external command voltage, and the feedback voltage or the feedback voltage. It is characterized by including an adder circuit that adds the obtained conversion feedback voltage and outputs the added added voltage toward the control terminal.

According to this configuration, the magnetic flux changes with the change of the applied current flowing through the first inductance component, so that the feedback voltage is induced by the second inductance component. Then, the feedback voltage or the conversion feedback voltage obtained by converting the feedback voltage is fed back to the adder circuit, and the added voltage is input to the control terminal. As a result, it is possible to suppress a surge at the time of turn-on or turn-off of the switching element.

In particular, according to this configuration, a desired feedback effect is obtained by using the feedback voltage induced by the second inductance component instead of the counter electromotive force generated by the first inductance component as the voltage to be fed back to the driver circuit. be able to.

The power conversion device includes a drive board on which the switching element is mounted, the first inductance component includes a parasitic inductance in the switching element, and the second inductance component is formed on the drive board. It is preferable that at least a part thereof is composed of a feedback pattern arranged next to the switching element.

According to such a configuration, since at least a part of the feedback pattern constituting the second inductance component is arranged next to the switching element, the separation distance between the two tends to be short. As a result, an interaction is likely to occur between the feedback pattern and the parasitic inductance in the switching element. Therefore, the feedback voltage can be increased.

Regarding the power conversion device, the feedback is defined as the direction in which the applied current flows in the switching element as the first direction and the direction orthogonal to both the first direction and the thickness direction of the drive substrate as the second direction. It is preferable that the pattern and the switching element are arranged side by side in the second direction, and the feedback pattern has a portion extending in the first direction.

According to such a configuration, the area through which the magnetic flux penetrates in the feedback pattern can be improved by penetrating the portion of the feedback pattern in which the magnetic flux generated by the parasitic inductance in the switching element extends in the first direction. Therefore, the feedback voltage can be increased.

Regarding the power conversion device, the first switching element and the second switching element arranged apart from each other in the first direction as the switching element, and the feedback pattern next to the first switching element in the second direction. The first feedback pattern is provided with a first feedback pattern arranged in the second feedback pattern and a second feedback pattern arranged next to the second switching element in the second direction, and the first feedback pattern is the said of the first switching element. The second feedback pattern is arranged within the range of the first direction, the second feedback pattern is arranged within the range of the first direction of the second switching element, and the separation distance between the two feedback patterns is the separation distance between the two switching elements. Should be larger than.

According to such a configuration, it is possible to suppress the generation of a feedback voltage in the other due to the change in the magnetic flux of one of the two feedback patterns, and it is possible to suppress the malfunction of the switching element corresponding to the other feedback pattern. ..

The power conversion device includes a drive board and a control board laminated so as to face each other, the switching element is mounted on the drive board, the driver circuit is mounted on the control board, and the first inductance is used. The component includes a parasitic inductance in the switching element, and the second inductance component is composed of a feedback pattern formed on the control board and electrically connected to the driver circuit, and is composed of a feedback pattern of the feedback pattern. At least a part of the drive board and the control board may be arranged at a position where they overlap with the switching element when viewed from the stacking direction.

According to this configuration, since at least a part of the feedback pattern is arranged at a position overlapping the switching element when viewed from the stacking direction of both substrates, the magnetic flux generated from the parasitic inductance in the switching element penetrates the feedback pattern. As a result, a feedback voltage is induced from the second inductance component. Therefore, the above-mentioned effect can be obtained. Further, according to this configuration, it is not necessary to transmit the feedback voltage between different substrates, so that the configuration can be simplified.

According to the present invention, a desired feedback effect can be obtained.

A circuit diagram showing an outline of the electrical configuration of a power converter. The front view which shows typically the switching element, the driver circuit and the feedback pattern mounted on the drive board in 1st Embodiment. A circuit diagram schematically showing a switching element and a driver circuit. The front view which shows typically the driver circuit and the feedback pattern in 2nd Embodiment. FIG. 4 is a sectional view taken along line 5-5 of FIG. The circuit diagram which shows the switching element and the driver circuit of another example schematically.

(First Embodiment)
Hereinafter, the first embodiment of the power conversion device will be described.
The power conversion device 10 of the present embodiment is mounted on the vehicle 200, for example, and is used to drive the electric motor 201 provided on the vehicle 200.

The electric motor 201 of the present embodiment is a traveling motor for rotating the wheels of the vehicle 200. The electric motor 201 of this embodiment has three-phase coils 202u, 202v, 202w. The three-phase coils 202u, 202v, 202w are, for example, Y-connected. The electric motor 201 rotates when the three-phase coils 202u, 202v, 202w are energized in a predetermined pattern. The connection mode of the three-phase coils 202u, 202v, 202w is not limited to Y connection, and may be arbitrary, for example, delta connection.

As shown in FIG. 1, the vehicle 200 has a power storage device 203. The power conversion device 10 of the present embodiment is an inverter device that converts the DC power of the power storage device 203 into AC power that can be driven by the electric motor 201. In other words, the power conversion device 10 can be said to be a drive device for driving the electric motor 201 by using the power storage device 203. The voltage of the power storage device 203 is defined as the power supply voltage Vdc.

The power conversion device 10 has a switching element 11. The power conversion device 10 of the present embodiment has a plurality of switching elements 11, and more specifically, u-phase switching elements 11u1 and 11u2 corresponding to the u-phase coil 202u and v-phase switching corresponding to the v-phase coil 202v. The elements 11v1, 11v2 and the w-phase switching elements 11w1, 11w2 corresponding to the w-phase coil 202w are provided.

Each switching element 11u1, 11u2, 11v1, 11v2, 11w1, 11w2 (hereinafter referred to as "each switching element 11u1 to 11w2") is, for example, a power switching element, and an example is a MOSFET. Each switching element 11u1 to 11w2 corresponds to a "switching element". The switching elements 11u1 to 11w2 have return diodes (body diodes) Du1 to Dw2.

The u-phase switching elements 11u1 and 11u2 are connected in series to each other via a connecting line. Specifically, the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2 are connected via a connecting line, and the connecting line is connected to the u-phase coil 202u. The u-phase upper arm switching element 11u1 is connected to a positive electrode terminal (+ terminal) on the high voltage side of the power storage device 203. The u-phase lower arm switching element 11u2 is connected to a negative electrode terminal (− terminal) on the low voltage side of the power storage device 203.

The connection mode of the other switching elements 11v1, 11v2, 11w1, 11w2 is the same as that of the u-phase switching elements 11u1, 11u2, except that the corresponding coils are different.

As shown in FIGS. 1 and 2, the power conversion device 10 includes a driver circuit 12 for driving the switching element 11 and a drive board 13 on which the switching element 11 is mounted. In this embodiment, the driver circuit 12 is mounted on the drive board 13.

The driver circuit 12 of this embodiment is a so-called gate driver circuit. The power conversion device 10 of the present embodiment has a plurality of driver circuits 12 corresponding to a plurality of switching elements 11. Specifically, the power conversion device 10 has a plurality of driver circuits 12u1 to 12w2 corresponding to the plurality of switching elements 11u1 to 11w2. The driver circuits 12u1 to 12w2 are connected to the gates of the switching elements 11u1 to 11w2, and the switching elements 11u1 to 11w2 are turned ON / OFF by controlling the gate voltage.

As shown in FIG. 1, the vehicle 200 includes a conversion control device 14 that controls a power conversion device 10. The conversion control device 14 of the present embodiment is an inverter control device. The conversion control device 14 determines a target current flowing through the electric motor 201 based on an external command (for example, a required rotation speed), and derives an external command voltage Vp for the target current to flow. Then, the conversion control device 14 outputs the external command voltage Vp toward the driver circuit 12.

In the present embodiment, the conversion control device 14 derives the external command voltage Vp for each of the switching elements 11u1 to 11w2, and outputs the external command voltage Vp to each driver circuit 12u1 to 12w2. As a result, each switching element 11u1 to 11w2 is individually controlled.

The external command voltage Vp is a pulse voltage having a predetermined pulse width. For example, the external command voltage Vp switches from LOW to HI, maintains the HI state for a certain period of time, and then switches from HI to LOW. In the following description, the switching from LOW to HI is referred to as "rising", and the switching from HI to LOW is referred to as "falling".

The conversion control device 14 of the present embodiment is mounted on the drive board 13. However, the present invention is not limited to this, and the conversion control device 14 may be mounted on a board different from the drive board 13.

The driver circuits 12u1 to 12w2 apply a gate voltage to the switching elements 11u1 to 11w2 based on the external command voltage Vp individually input. As a result, the switching elements 11u1 to 11w2 are periodically turned ON / OFF, and the DC power of the power storage device 203 is converted into three-phase AC power and supplied to the electric motor 201. That is, the conversion control device 14 PWM controls the power conversion device 10.

Next, the switching elements 11u1 to 11w2 and the driver circuits 12u1 to 12w2 will be described in detail.
Here, the switching elements 11u1 to 11w2 have basically the same configuration, and the driver circuits 12u1 to 12w2 have basically the same configuration. Therefore, in the following, one of the switching elements 11u1 to 11w2, the switching element 11 (u-phase upper arm switching element 11u1) and the corresponding driver circuit 12 (upper arm u-phase driver circuit 12u1) will be described in detail. do.

As shown in FIG. 2, the switching element 11 includes an element main body 20, a gate terminal 21, a drain terminal 22, and a source terminal 23 attached to the element main body 20.
The element body 20 has, for example, a rectangular parallelepiped shape. The element main body 20 has a first side surface 20a and a second side surface 20b which are both end faces in the X direction orthogonal to the thickness direction of the drive substrate 13. The second side surface 20b is a side surface opposite to the first side surface 20a. It can be said that the X direction intersects the both side surfaces 20a and 20b (orthogonally in the present embodiment).

The drain terminal 22 is provided on the first side surface 20a. In the present embodiment, the drain terminal 22 is one, and is formed in a tab shape in one direction of the first side surface 20a, specifically in the Y direction. The Y direction is a direction orthogonal to both the thickness direction and the X direction of the drive substrate 13.

In this embodiment, a plurality of source terminals 23 are provided. The gate terminal 21 and the plurality of source terminals 23 are provided on a portion of the switching element 11 opposite to the drain terminal 22. Specifically, the gate terminal 21 and the plurality of source terminals 23 are provided on the second side surface 20b. In this case, it can be said that the gate terminal 21 and the plurality of source terminals 23 face the drain terminal 22 in the X direction via the element main body 20. That is, it can be said that the X direction is the opposite direction between the drain terminal 22 and the source terminal 23.

The gate terminal 21 and the plurality of source terminals 23 are arranged in the Y direction at a predetermined pitch on the second side surface 20b. In other words, the Y direction can be said to be the arrangement direction of the plurality of source terminals 23.

When a gate voltage equal to or higher than a predetermined threshold value is applied to the gate terminal 21, a drain current Id as an applied current flows through the drain terminal 22 and the plurality of source terminals 23. The drain current Id is a current flowing between the source and the drain of the switching element 11.

In the present embodiment, the drain current Id flows from the drain terminal 22 through the element main body 20 toward the plurality of source terminals 23. Therefore, the drain current Id flows in the switching element 11 in the X direction. That is, the X direction can be said to be the direction of the current flowing in the switching element 11. The number of source terminals 23 is arbitrary. In this embodiment, the gate terminal 21 corresponds to the "control terminal", and the source terminal 23 and the drain terminal 22 correspond to the "applied terminal". In particular, the drain terminal 22 corresponds to the "first application terminal", and the source terminal 23 corresponds to the "second application terminal".

Here, a source-drain voltage Vds, which is a voltage for passing a drain current Id through the switching element 11, is applied between the source and drain of the switching element 11. The source-drain voltage Vds of the present embodiment is the power supply voltage Vdc when the switching element 11 is in the OFF state, and 0V when the switching element 11 is in the ON state.

The power conversion device 10 has a first inductance component L1 through which the drain current Id flows. The first inductance component L1 is provided on the current path through which the drain current Id flows.

In the present embodiment, as shown in FIG. 3, the first inductance component L1 includes the parasitic inductance Ls in the element body 20 of the switching element 11. The parasitic inductance Ls is composed of, for example, a wiring pattern in the element main body 20, a wire, a source terminal 23, and the like.

According to this configuration, when the switching element 11 is turned on and the drain current Id flows, a magnetic flux is generated from the first inductance component L1. In the present embodiment, since the first inductance component L1 contains the parasitic inductance Ls, the magnetic flux is generated around the switching element 11. The magnetic flux changes as the drain current Id changes.

The power conversion device 10 in the present embodiment has a second inductance component L2 provided at a position where the magnetic flux generated from the first inductance component L1 penetrates. The second inductance component L2 induces a feedback voltage Vf by a change in the magnetic flux accompanying a change in the drain current Id. In this case, it can be said that the second inductance component L2 is magnetically coupled to the first inductance component L1 and can be said to form a transformer in cooperation with the first inductance component L1.

The second inductance component L2 of the present embodiment is configured by a wiring pattern mounted on the drive board 13. Specifically, as shown in FIG. 2, the power conversion device 10 includes a feedback pattern 31 formed on the drive board 13 and constituting the second inductance component L2. The feedback pattern 31 is one of the wiring patterns formed on the drive board 13.

The feedback pattern 31 is provided at a position on the drive substrate 13 through which the magnetic flux penetrates, and is arranged next to the switching element 11 in the present embodiment. Specifically, the feedback pattern 31 is arranged next to the switching element 11 in the Y direction. Therefore, the feedback pattern 31 and the switching element 11 are arranged side by side in the Y direction.

Here, as already described, the drain current Id flows in the switching element 11 (specifically, the element main body 20) in the X direction, and the Y direction is a direction orthogonal to the X direction. Therefore, it can be said that the feedback pattern 31 and the switching element 11 are arranged side by side in a direction orthogonal to the direction in which the drain current Id flows. In this embodiment, the X direction corresponds to the "first direction" and the Y direction corresponds to the "second direction".

The feedback pattern 31 of the present embodiment is obtained by routing one line, and has a first end portion 31a and a second end portion 31b. The feedback pattern 31 is formed, for example, in a spiral shape. Specifically, the feedback pattern 31 extends spirally from the first end 31a toward the second end 31b. In this case, the first end portion 31a can be said to be the outer peripheral end portion, and the second end portion 31b can be said to be the inner peripheral end portion.

The feedback pattern 31 has a first part portion 31c and a second part portion 31d extending in the X direction. Here, assuming that the direction from the first end portion 31a to the second end portion 31b in the feedback pattern 31 is the extension direction of the feedback pattern 31, the first part portion 31c has the extension direction of the feedback pattern 31 and the drain current Id. Is in line with the direction of flow. On the other hand, in the second part portion 31d, the extending direction of the feedback pattern 31 and the direction in which the drain current Id flows are opposite to each other. In the present embodiment, the second part portion 31d is arranged closer to the switching element 11 than the first part portion 31c. A plurality of second part portions 31d are arranged side by side in the Y direction. The first part portion 31c is arranged side by side in the Y direction at a position farther from the switching element 11 than the second part portion 31d.

Incidentally, in the present embodiment, the feedback pattern 31 partially protrudes from the element body 20 in the X direction. However, when viewed in relation to the entire switching element 11 including the drain terminal 22 and the source terminal 23, the feedback pattern 31 is within the range of the switching element 11 in the X direction, and is larger than the switching element 11. It does not protrude in the X direction. That is, it can be said that the feedback pattern 31 of the present embodiment is entirely arranged next to the switching element 11.

As shown in FIG. 2, the power conversion device 10 includes a connection portion 32 for connecting the feedback pattern 31 and the driver circuit 12. The connection portion 32 has a first connection portion 33 that connects the first end portion 31a and the driver circuit 12, and a second connection portion 34 that connects the second end portion 31b and the driver circuit 12. ..

The first connection portion 33 is configured by a wiring pattern formed on the drive board 13. In the present embodiment, the first connection portion 33 and the first end portion 31a are continuously connected, and there is no boundary between them. The first connection unit 33 is connected to one terminal of the driver circuit 12 (first feedback input terminal 53 in this embodiment).

The second connection portion 34 connects the second end portion 31b and the driver circuit 12 so as not to interfere with the feedback pattern 31. Specifically, the second connection portion 34 connects the arch portion 34a formed in an arch shape so as to straddle the feedback pattern 31 (specifically, the first part portion 31c), the arch portion 34a, and the driver circuit 12. It has a connection pattern 34b and.

The arch portion 34a is made of, for example, a wire or the like. The arch portion 34a is formed in an inverted U shape when viewed from the X direction, and straddles the first part portion 31c. The arch portion 34a has a first arch end portion 34aa joined to the second end portion 31b and a second arch end portion 34ab arranged outside the feedback pattern 31.

The connection pattern 34b is composed of, for example, a wiring pattern formed on the drive board 13. The connection pattern 34b is connected to the second arch end portion 34ab and is also connected to one terminal (specifically, the second feedback input terminal 54) of the driver circuit 12.

According to this configuration, when the drain current Id flowing through the switching element 11 changes, the magnetic flux generated from the first inductance component L1 changes. Then, the feedback voltage Vf is induced by the second inductance component L2 provided at the position where the magnetic flux penetrates. The feedback voltage Vf is applied to the driver circuit 12 via the connection portion 32. The change in the drain current Id includes a case where the drain current Id starts to flow and a case where the drain current Id stops.

In the present embodiment, the feedback voltage Vf is larger than the counter electromotive force generated by the first inductance component L1. Specifically, the second inductance component L2 is configured such that the feedback voltage Vf is larger than the counter electromotive force. That is, the second inductance component L2 of the present embodiment generates a feedback voltage Vf larger than the counter electromotive force generated by the first inductance component L1.

In other words, the second inductance component L2 of the present embodiment is magnetically coupled to the first inductance component L1 and amplifies the back electromotive force generated by the first inductance component L1 to generate a feedback voltage Vf. It can be said that it is.

As shown in FIG. 2, in the present embodiment, the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2 are arranged apart from each other in the X direction. The X direction can be said to be the arrangement direction of the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2, and the Y direction is the arrangement direction of both u-phase switching elements 11u1 and 11u2 and the thickness direction of the drive substrate 13. It can be said that the directions are orthogonal to both.

The second inductance component L2 (feedback pattern 31 in this embodiment) is provided corresponding to each of the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2. Specifically, the power conversion device 10 uses the u-phase upper arm feedback pattern 31u1 arranged next to the u-phase upper arm switching element 11u1 in the Y direction as the feedback pattern 31 and the u-phase lower arm switching element 11u2 in the Y direction. The u-phase lower arm feedback pattern 31u2, which is arranged next to the u-phase lower arm feedback pattern 31u2, is provided. Both feedback patterns 31u1 and 31u2 are arranged apart from each other in the X direction, and in the present embodiment, the separation distance between the two feedback patterns 31u1 and 31u2 is larger than the separation distance between the two u-phase switching elements 11u1 and 11u2.

In the present embodiment, the u-phase upper arm switching element 11u1 and the u-phase upper arm feedback pattern 31u1 correspond to the "first switching element" and the "first feedback pattern". The u-phase lower arm switching element 11u2 and the u-phase lower arm feedback pattern 31u2 correspond to the "second switching element" and the "second feedback pattern".

The same applies to the v-phase upper arm switching element 11v1 and the v-phase lower arm switching element 11v2, and the w-phase upper arm switching element 11w1 and the w-phase lower arm switching element 11w2.

The power conversion device 10 includes a plurality of drive patterns 41 to 43 formed on the drive board 13. Each drive pattern 41 to 43 is used to electrically connect the switching element 11 and the power storage device 203, and is also used to electrically connect the switching element 11 and the electric motor 201 as a load. Has been done. The drive patterns 41 to 43 include a parasitic inductance.

The first drive pattern 41 is used to connect the u-phase upper arm switching element 11u1 and the positive electrode terminal (+ terminal) on the high voltage side of the power storage device 203. The first drive pattern 41 is arranged on both sides of the u-phase upper arm switching element 11u1 in the X direction where the drain terminal 22 is located, and is specifically formed on the side of the first side surface 20a of the drive substrate 13. ing. The drain terminal 22 of the u-phase upper arm switching element 11u1 is connected to the first drive pattern 41.

The second drive pattern 42 connects the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2. The second drive pattern 42 is arranged on both sides of the u-phase upper arm switching element 11u1 in the X direction where the plurality of source terminals 23 are located, and more specifically, on the side of the second side surface 20b of the drive board 13. It is formed. The second drive pattern 42 is arranged between the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2. A plurality of source terminals 23 of the u-phase upper arm switching element 11u1 are connected to the second drive pattern 42, and a drain terminal 22 of the u-phase lower arm switching element 11u2 is connected to the second drive pattern 42. Further, the second drive pattern 42 is connected to the electric motor 201 (specifically, the u-phase coil 202u).

The third drive pattern 43 is used to connect the u-phase lower arm switching element 11u2 and the negative electrode terminal (− terminal) on the low voltage side of the power storage device 203. The third drive pattern 43 is arranged on both sides of the u-phase lower arm switching element 11u2 in the X direction where the plurality of source terminals 23 are located, and more specifically, on the side of the second side surface 20b of the drive board 13. It is formed. The plurality of source terminals 23 of the u-phase lower arm switching element 11u2 are connected to the third drive pattern 43.

According to this configuration, when the u-phase upper arm switching element 11u1 is in the ON state, a drain current Id flows from the first drive pattern 41 to the second drive pattern 42 via the u-phase upper arm switching element 11u1. Further, when the u-phase lower arm switching element 11u2 is in the ON state, a drain current Id flows from the second drive pattern 42 to the third drive pattern 43 via the u-phase lower arm switching element 11u2.

In the present embodiment, the first drive pattern 41 and the second drive pattern 42 are arranged on both sides of the u-phase upper arm switching element 11u1 in the X direction, and the second drive pattern 41 and the second drive pattern 42 are arranged on both sides of the u-phase lower arm switching element 11u2 in the X direction. It can be said that the drive pattern 42 and the third drive pattern 43 are arranged. That is, the power conversion device 10 of the present embodiment has drive patterns on both sides of the switching element 11 in the X direction.

Next, the driver circuit 12 will be described.
As shown in FIG. 3, the driver circuit 12 includes an external input terminal 51, an output terminal 52, and feedback input terminals 53 and 54.

The external input terminal 51 is electrically connected to the conversion control device 14. The external command voltage Vp from the conversion control device 14 is input to the external input terminal 51.
The output terminal 52 is a terminal for outputting a gate voltage (in other words, a gate current) from the driver circuit 12. As shown in FIG. 2, a gate pattern for electrically connecting the output terminal 52 and the gate terminal 21 is formed on the drive board 13, and the gate voltage output from the output terminal 52 passes through the gate pattern. Is input to the gate terminal 21.

The feedback input terminals 53 and 54 are terminals to which the feedback voltage Vf is input. In this embodiment, two feedback input terminals 53 and 54 are provided, and both feedback input terminals 53 and 54 are connected to the second inductance component L2. Specifically, as shown in FIG. 2, both feedback input terminals 53 and 54 are connected to the feedback pattern 31 via the connection portion 32. As a result, the feedback voltage Vf generated by the second inductance component L2 is applied between the feedback input terminals 53 and 54.

The driver circuit 12 generates an additional voltage Vad based on the external command voltage Vp input from the external input terminal 51 and the feedback voltage Vf input to the feedback input terminals 53 and 54, and gates the added voltage Vad. It is configured to output as a voltage from the output terminal 52.

An example of the driver circuit 12 that outputs the added voltage Vad will be described below.
The driver circuit 12 of the present embodiment includes a command conversion circuit 55 that converts an external command voltage Vp into a conversion command voltage Vpt, a feedback conversion circuit 56 that converts a feedback voltage Vf into a conversion feedback voltage Vft, a conversion command voltage Vpt, and conversion. An adder circuit 57 for adding a feedback voltage Vft is provided.

The command conversion circuit 55 converts the external command voltage Vp into a conversion command voltage Vpt by amplifying the external command voltage Vp at a predetermined amplification factor while reducing the noise contained in the external command voltage Vp input from the external input terminal 51. Convert to. Then, the command conversion circuit 55 outputs the conversion command voltage Vpt toward the addition circuit 57. The amplification factor includes "1". The specific configuration of the command conversion circuit 55 is arbitrary, and may be, for example, a non-inverting amplifier circuit having an operational amplifier.

The feedback conversion circuit 56 converts the feedback voltage Vf into a conversion feedback voltage Vft by amplifying the feedback voltage Vf at a predetermined amplification factor, and outputs the converted feedback voltage Vft toward the addition circuit 57.

In this embodiment, the conversion feedback voltage Vft is higher than the feedback voltage Vf. That is, the amplification factor of the feedback conversion circuit 56 in this embodiment is larger than "1". However, the present invention is not limited to this, and the amplification factor of the feedback conversion circuit 56 may be "1" or may be smaller than "1".

Here, the polarity of the conversion feedback voltage Vft differs depending on the mode of change of the drain current Id. Specifically, when the drain current Id increases, the conversion feedback voltage Vft becomes a negative voltage, while when the drain current Id decreases, the conversion feedback voltage Vft becomes a positive voltage.

If the feedback voltage Vf is input to the driver circuit 12 as a negative voltage when the drain current Id increases, the feedback conversion circuit 56 converts the feedback voltage Vf into a conversion feedback voltage Vft without inverting it. On the other hand, if the feedback voltage Vf is input to the driver circuit 12 as a positive voltage when the drain current Id increases, the feedback conversion circuit 56 inverts the feedback voltage Vf and converts it into a conversion feedback voltage Vft. The polarity of the feedback voltage Vf input to the driver circuit 12 can be changed, for example, according to the connection mode between the feedback pattern 31 and the feedback input terminals 53 and 54.

The specific configuration of the feedback conversion circuit 56 is arbitrary. For example, the feedback conversion circuit 56 may be configured to include a voltage dividing circuit that divides the feedback voltage Vf and a voltage amplification circuit that amplifies the divided voltage.

The adder circuit 57 is connected to the command conversion circuit 55 and the feedback conversion circuit 56, and is also connected to the output terminal 52. A conversion command voltage Vpt and a conversion feedback voltage Vft are input to the adder circuit 57. The adder circuit 57 adds the conversion command voltage Vpt and the conversion feedback voltage Vft, and outputs the added added voltage Vad toward the output terminal 52. As a result, the added voltage Vad as the gate voltage is input to the gate terminal 21.

The specific configuration of the adder circuit 57 is arbitrary. For example, the adder circuit 57 may be configured to connect a line through which the conversion command voltage Vpt is transmitted and a line through which the conversion feedback voltage Vft is transmitted. Further, the addition circuit 57 may have a voltage amplification circuit that generates an addition voltage Vad by amplifying a voltage obtained by combining the conversion command voltage Vpt and the conversion feedback voltage Vft.

The adder circuit 57 may have a current amplifier circuit for supplying the required current to the gate terminal 21 while maintaining the adder voltage Vad. Further, the adder circuit 57 may have a gate resistance.

Next, the operation of this embodiment will be described.
First, the turn-on time of the switching element 11 will be described.
As the external command voltage Vp rises, the source-drain voltage Vds begins to fall, while the drain current Id begins to flow. As a result, a magnetic flux is generated in the first inductance component L1. Then, the feedback voltage Vf is generated from the second inductance component L2 due to the change in the magnetic flux due to the change (specifically, increase) in the drain current Id. In the present embodiment, the feedback voltage Vf is input to the driver circuit 12 and converted into a conversion feedback voltage Vft.

Then, the conversion command voltage Vpt and the conversion feedback voltage Vft are added, and the added voltage Vad is input to the gate terminal 21 of the switching element 11. In this case, since the conversion feedback voltage Vft is added, the rising angle from LOW to HI (in other words, the slope of the added voltage Vad) in the added voltage Vad becomes gentler than the conversion command voltage Vpt. As a result, the surge when the drain current Id rises is suppressed.

Next, the turn-off time of the switching element 11 will be described.
As the external command voltage Vp falls, the source-drain voltage Vds begins to rise, while the drain current Id begins to decrease. As a result, the magnetic flux generated by the first inductance component L1 changes. As a result, the feedback voltage Vf is generated from the second inductance component L2. In the present embodiment, the feedback voltage Vf is input to the driver circuit 12 and converted into a conversion feedback voltage Vft. Then, the added voltage Vad to which the conversion command voltage Vpt and the conversion feedback voltage Vft are added is input to the gate terminal 21 of the switching element 11.

In this case, since the conversion feedback voltage Vft is added, the falling angle from HI to LOW (in other words, the slope of the added voltage Vad) in the added voltage Vad becomes gentler than the conversion command voltage Vpt. .. As a result, the surge when the source-drain voltage Vds rises is suppressed.

According to the present embodiment described in detail above, the following effects are obtained.
(1-1) The power conversion device 10 includes a switching element 11, a first inductance component L1, a second inductance component L2, and a driver circuit 12 for driving the switching element 11.

The switching element 11 has a gate terminal 21 as a control terminal, a drain terminal 22 through which a drain current Id as an applied current flows, and a source terminal 23. Since the drain current Id flows through the first inductance component L1, a magnetic flux is generated from the first inductance component L1. The second inductance component L2 is provided at a position where the magnetic flux generated from the first inductance component L1 penetrates, and induces a feedback voltage Vf by a change in the magnetic flux accompanying a change in the drain current Id.

The driver circuit 12 includes an external input terminal 51 to which an external command voltage Vp is input, and feedback input terminals 53 and 54 to which a feedback voltage Vf is input. The driver circuit 12 adds the conversion command voltage Vpt obtained by converting the external command voltage Vp and the conversion feedback voltage Vft obtained by converting the feedback voltage Vf, and gates the added added voltage Vad. The addition circuit 57 that outputs to the terminal 21 is provided.

According to this configuration, the feedback voltage Vf is induced from the second inductance component L2 by changing the magnetic flux with the change of the drain current Id flowing through the first inductance component L1. Then, the conversion feedback voltage Vft corresponding to the feedback voltage Vf is added to the conversion command voltage Vpt, and the added added voltage Vad is input to the gate terminal 21. As a result, it is possible to suppress a surge at the time of turn-on or turn-off of the switching element 11.

In particular, according to this configuration, as the voltage to be fed back to the driver circuit 12, the feedback voltage Vf induced by the second inductance component L2 is used instead of the counter electromotive force generated by the first inductance component L1. As a result, the voltage generated by the change in the drain current Id can be suitably fed back, and a desired feedback effect can be obtained.

Regarding the above effect, the configuration for feeding back the counter electromotive force generated by the first inductance component L1 will be described in detail as a comparative example. In the comparative example, for example, when the first inductance component L1 is small, the counter electromotive force is also small, so that feedback The effect (specifically, the surge suppressing effect) may be small, and the desired feedback effect may not be obtained. However, since the drain current Id flows through the first inductance component L1, if the first inductance component L1 is increased in an attempt to increase the counter electromotive force, the loss and surge increase.

In this respect, according to this configuration, since the feedback voltage Vf depends on the second inductance component L2, a desired feedback voltage Vf can be obtained by adjusting the second inductance component L2. Further, since the drain current Id does not flow through the second inductance component L2, the loss caused by the second inductance component L2 can be small. This makes it possible to obtain a desired feedback effect while suppressing loss.

(1-2) Here, in order to obtain a desired feedback effect in the comparative example, for example, a configuration in which the driver circuit 12 has an amplifier circuit for amplifying the back electromotive force can be considered. However, in the amplification by the amplifier circuit, the noise included in the counter electromotive force is also amplified. Therefore, excessive amplification by the amplifier circuit may cause a malfunction.

In this respect, according to this configuration, by providing the second inductance component L2, a feedback voltage Vf having a desired magnitude can be obtained, so that it is not necessary to perform excessive amplification. Therefore, it is possible to suppress a malfunction caused by noise.

(1-3) The power conversion device 10 includes a drive board 13 on which the switching element 11 is mounted. The first inductance component L1 includes the parasitic inductance Ls in the switching element 11. The second inductance component L2 is composed of a feedback pattern 31 mounted on the drive board 13. At least a part (all in this embodiment) of the feedback pattern 31 is arranged next to the switching element 11.

According to this configuration, since the feedback pattern 31 constituting the second inductance component L2 is arranged next to the switching element 11, the separation distance between the two tends to be short. As a result, an interaction is likely to occur between the feedback pattern 31 and the parasitic inductance Ls in the switching element 11. Therefore, the feedback voltage Vf can be increased.

(1-4) The feedback pattern 31 and the switching element 11 are in a direction orthogonal to both the direction in which the drain current Id flows in the switching element 11 (specifically, the X direction) and the thickness direction of the drive substrate 13 (details). Are arranged side by side in the Y direction). The feedback pattern 31 has both parts 31c and 31d extending in the X direction.

According to such a configuration, the magnetic flux generated by the parasitic inductance Ls in the switching element 11 penetrates both the parts 31c and 31d, so that the area through which the magnetic flux in the feedback pattern 31 penetrates can be improved. Therefore, the feedback voltage Vf can be increased.

(1-5) The feedback pattern 31 is formed in a spiral shape. As a result, the length of the feedback pattern 31 can be increased, and the second inductance component L2 can be increased. Therefore, the feedback voltage Vf can be increased.

(1-6) The driver circuit 12 includes a command conversion circuit 55 that converts an external command voltage Vp into a conversion command voltage Vpt, and a feedback conversion circuit 56 that converts the feedback voltage Vf into a conversion feedback voltage Vft. The adder circuit 57 adds the conversion command voltage Vpt and the conversion feedback voltage Vft. The feedback voltage Vf is larger than the counter electromotive force generated by the first inductance component L1, and the conversion feedback voltage Vft is larger than the feedback voltage Vf.

According to such a configuration, an appropriate additional voltage Vad can be generated even when the voltage is significantly different between the external command voltage Vp and the feedback voltage Vf. As a result, an appropriate feedback effect can be obtained.

In particular, according to this configuration, the feedback voltage Vf induced by the second inductance component L2 is converted, and the feedback voltage Vf is larger than the counter electromotive force generated by the first inductance component L1. As a result, the conversion ratio by the feedback conversion circuit 56 can be reduced, so that the influence of noise can be reduced.

(1-7) The power conversion device 10 includes u-phase upper arm switching elements 11u1 and u-phase lower arm switching elements 11u2 arranged apart from each other in the X direction as switching elements 11. As the feedback pattern 31, the power conversion device 10 is arranged next to the u-phase upper arm feedback pattern 31u1 arranged next to the u-phase upper arm switching element 11u1 in the Y direction and next to the u-phase lower arm switching element 11u2 in the Y direction. It is provided with the u-phase lower arm feedback pattern 31u2.

In such a configuration, the feedback patterns 31u1 and 31u2 are within the range of the u-phase switching elements 11u1 and 11u2 in the X direction, and the separation distance between the two feedback patterns 31u1 and 31u2 is the separation between the two u-phase switching elements 11u1 and 11u2. Greater than the distance. According to such a configuration, it is possible to suppress a malfunction caused by the feedback patterns 31u1 and 31u2.

More specifically, when both u-phase switching elements 11u1 and 11u2 are arranged side by side in the X direction, the u-phase upper arm feedback pattern 31u1 corresponding to the u-phase upper arm switching element 11u1 and the u-phase lower arm switching element 11u2 The u-phase lower arm feedback pattern 31u2 corresponding to the above is arranged side by side in the X direction. In this case, the magnetic flux generated from the u-phase upper arm feedback pattern 31u1 may generate an unintended voltage in the u-phase lower arm feedback pattern 31u2, and the u-phase lower arm switching element 11u2 may malfunction due to the voltage. In particular, the magnetic flux tends to increase as the position is closer to the feedback pattern 31, so that the closer the feedback patterns 31u1 and 31u2 are, the more likely it is that a malfunction will occur.

In this respect, according to this configuration, the feedback patterns 31u1 and 31u2 are within the range of the u-phase switching elements 11u1 and 11u2 in the X direction, and do not protrude from the u-phase switching elements 11u1 and 11u2 in the X direction. As a result, the separation distance between the two feedback patterns 31u1 and 31u2 can be secured larger than the separation distance between the two u-phase switching elements 11u1 and 11u2. Therefore, it is possible to suppress the generation of voltage on the other side due to the change in the magnetic flux of one of the two feedback patterns 31u1 and 31u2, and it is possible to suppress the malfunction of the switching element corresponding to the other feedback pattern.

(Second Embodiment)
In the present embodiment, the arrangement mode of the driver circuit 12 and the feedback pattern 31 is different from that of the first embodiment. The differences will be described with reference to FIGS. 4 and 5. Note that FIGS. 4 and 5 schematically show the switching element 11, the driver circuit 12, and the connector 101.

As shown in FIGS. 4 and 5, the power conversion device 10 of the present embodiment includes a control board 100 on which the driver circuit 12 is mounted, in addition to the drive board 13 on which the switching element 11 is mounted. The drive board 13 and the control board 100 are laminated in the thickness direction of both boards 13 and 100 so as to face each other. It can be said that the stacking direction of both the substrates 13 and 100 is the thickness direction of the drive substrate 13 or the control substrate 100. The conversion control device 14 is mounted on the control board 100.

The feedback pattern 31 of this embodiment is formed on the control board 100. Specifically, the feedback pattern 31 is arranged so that at least a part thereof overlaps with the switching element 11 when viewed from the stacking direction of both the substrates 13 and 100.

For example, as shown in FIG. 4, a part of the feedback pattern 31 is arranged so as to overlap the element main body 20. Specifically, the second part portion 31d of the feedback pattern 31 is arranged at a position overlapping the element main body 20, while the first part portion 31c is arranged at a position displaced from the element main body 20.

However, the present invention is not limited to this, and the first part portion 31c may be arranged at a position overlapping the element main body 20, while the second part portion 31d may be arranged at a position displaced from the element main body 20. That is, either one of the first part portion 31c or the second part portion 31d may be arranged at a position where it overlaps with the element main body 20, while the other may be arranged at a position deviated from the element main body 20. Further, the entire feedback pattern 31 may be arranged at a position where it overlaps with the element main body 20.

Similar to the first embodiment, the feedback pattern 31 and the driver circuit 12 are connected by a connecting portion 32. As a result, the feedback voltage Vf induced by the feedback pattern 31 is input to the driver circuit 12.

The power conversion device 10 includes a connector 101 that electrically connects the drive board 13 and the control board 100. In the present embodiment, the switching element 11 and the driver circuit 12, specifically the gate terminal 21 and the output terminal 52, are electrically connected to each other via the gate patterns 102a and 102b formed on the connector 101 and the boards 13 and 100. ing.

On the other hand, in the present embodiment, since the feedback pattern 31 is formed on the same control board 100 as the driver circuit 12, the configuration related to the transmission of the feedback voltage Vf is simplified. Specifically, in the connector 101 and the drive board 13, the configuration for transmitting the feedback voltage Vf (specifically, pins and wiring patterns) is omitted.

According to the present embodiment described in detail above, the following effects are obtained.
(2-1) The power conversion device 10 includes a drive board 13 and a control board 100 stacked so as to face each other. The switching element 11 is mounted on the drive board 13, and the driver circuit 12 is mounted on the control board 100. The second inductance component L2 is composed of a feedback pattern 31 formed on the control board 100, and at least a part of the feedback pattern 31 is located at a position where it overlaps with the switching element 11 when viewed from the stacking direction of both boards 13 and 100. Have been placed.

According to this configuration, since at least a part of the feedback pattern 31 is arranged at a position where it overlaps with the switching element 11 when viewed from the stacking direction of both substrates 13 and 100, the magnetic flux generated from the parasitic inductance Ls in the switching element 11 Penetrates the feedback pattern 31. As a result, the feedback voltage Vf is induced from the second inductance component L2. Therefore, the effect of (1-1) is achieved.

Further, according to this configuration, since the feedback pattern 31 is formed on the control board 100 on which the driver circuit 12 is mounted, it is not necessary to transmit the feedback voltage Vf between the different boards 13 and 100. This makes it possible to simplify the configuration for electrically connecting the feedback pattern 31 and the driver circuit 12.

In addition, each of the above-mentioned embodiments may be changed as follows. Further, as long as there is no technical contradiction, each of the above embodiments and the following alternative examples may be appropriately combined.
○ The first inductance component L1 may include a parasitic inductance contained in at least one of each drive pattern 41 to 43. In this case, the feedback pattern 31 may extend in the X direction from the switching element 11. For example, the feedback pattern 31 may extend so as to straddle the switching element 11 and at least one of the drive patterns on both sides of the switching element 11 in the X direction. In this case, a part of the feedback pattern 31 is arranged next to the switching element 11, and another part is arranged next to the drive pattern. In short, at least a part of the feedback pattern 31 may be arranged next to the switching element 11. In this alternative example, the separation distance between the two feedback patterns 31u1 and 31u2 is smaller than the separation distance between the two u-phase switching elements 11u1 and 11u2.

○ The inductance component L1 does not have to include the parasitic inductance Ls. In this case, the feedback pattern 31 may be selectively arranged next to one of the drive patterns 41 to 43, but may not be arranged next to the switching element 11.

○ The first inductance component L1 may or may not include an inductance other than the inductance of the switching element 11 or each drive pattern 41 to 43.

○ The first inductance component L1 may be configured by a dedicated coil.
○ The feedback voltage Vf may be smaller than the counter electromotive force generated by the first inductance component L1. That is, the second inductance component L2 may generate a feedback voltage Vf smaller than the counter electromotive force generated by the first inductance component L1. This makes it possible to cope with the case where the counter electromotive force generated by the first inductance component L1 is larger than a desired value.

○ The specific position of the second inductance component L2 is arbitrary as long as it is provided at a position where the magnetic flux generated from the first inductance component L1 penetrates. For example, in the first embodiment, the feedback pattern 31 constituting the second inductance component L2 may be arranged next to the first drive pattern 41 in the X direction. Further, in the second embodiment, the control board 100 may be arranged below the drive board 13, and the feedback pattern 31 may be arranged below the switching element 11.

○ The specific shape of the feedback pattern 31 is not limited to the spiral shape, but may be arbitrary, for example, a zigzag shape. Further, the feedback pattern 31 may be in the form of a single line extending in the X direction.

○ What constitutes the second inductance component L2 is not limited to the wiring pattern formed on the drive board 13, and is arbitrary as long as it has an inductance. For example, the second inductance component L2 may be composed of a dedicated coil mounted on the drive board 13 or the control board 100.

○ At least one of the command conversion circuit 55 and the feedback conversion circuit 56 may be omitted.
For example, the command conversion circuit 55 may be omitted. In this case, the external command voltage Vp is input to the adder circuit 57. The addition circuit 57 adds the external command voltage Vp and the feedback voltage Vf or the conversion feedback voltage Vft obtained by converting the feedback voltage Vf.

For example, the feedback conversion circuit 56 may be omitted. In this case, the feedback voltage Vf is input to the adder circuit 57. The addition circuit 57 adds the conversion command voltage Vpt obtained by converting the external command voltage Vp or the external command voltage Vp and the feedback voltage Vf.

That is, in the adder circuit 57, either one of the external command voltage Vp or the conversion command voltage Vpt and either the feedback voltage Vf or the conversion feedback voltage Vft may be input. That is, the adder circuit 57 may add the external command voltage Vp or the conversion command voltage Vpt and the feedback voltage Vf or the conversion feedback voltage Vft.

○ As shown in FIG. 6, the driver circuit 12 may have a reference potential terminal 111. The reference potential terminal 111 is connected to the reference potential V0 in the driver circuit 12.

Correspondingly, the power conversion device 10 may have a signal wiring 112 that connects one of the plurality of source terminals 23 to the reference potential terminal 111. The signal wiring 112 may be configured by, for example, a wiring pattern formed on the drive board 13. For convenience of explanation, among the plurality of source terminals 23, the one connected to the second drive pattern 42 is referred to as the main source terminal 23a, and the one connected to the signal wiring 112 is referred to as the signal source terminal 23b.

According to this configuration, the drain current Id is unlikely to flow through the signal wiring 112 and the signal source terminal 23b connected to the signal wiring 112. Therefore, the signal wiring 112 and the signal source terminal 23b are not easily affected by the parasitic inductance Ls. Therefore, it can be considered that the signal source terminal 23b is equivalently connected to the portion upstream of the parasitic inductance Ls in the switching element 11.

○ The switching element 11 is not limited to the MOSFET but may be arbitrary, and may be, for example, an IGBT. In this case, the gate terminal of the switching element 11 corresponds to the "control terminal", the collector current flowing between the collector and the emitter of the switching element 11 corresponds to the "applied current", and the collector terminal and the emitter terminal correspond to the "applied terminal". handle.

○ Each switching element 11u1 to 11w2 has configured an inverter, but is not limited to this, and may be arbitrary, for example, a DC / DC converter that converts the DC power of the power storage device 203 into DC power of a different voltage may be configured. good. That is, the power conversion device 10 is not limited to the inverter, but may be a DC / DC converter, an AC / AC converter, an AC / DC inverter, or the like. In other words, the power conversion device 10 may convert DC power or AC power into DC power or AC power.

○ The load is not limited to the electric motor 201 and is arbitrary.
○ The power conversion device 10 may be mounted on a vehicle other than the vehicle 200. That is, the power conversion device 10 may drive a load other than the load provided on the vehicle 200.

Next, a suitable example that can be grasped from the above embodiment and another example will be described below.
(A) The switching element includes an element body, the element body has first side surfaces and second side surfaces which are both end faces in the first direction, and the application terminal is provided on the first side surface. A first application terminal and a second application terminal provided on the first side surface thereof are included, and the applied current flows in the switching element from the first application terminal toward the second application terminal. It should be.

10 ... Power converter, 11 (11u1 to 11w2) ... Switching element, 12 (12u1 to 12w2) ... Driver circuit, 13 ... Drive board, 21 ... Gate terminal (control terminal), 22 ... Drain terminal (application terminal), 23 ... Source terminal (applied terminal), 31 ... Feedback pattern, 31u1 ... u phase upper arm feedback pattern (first feedback pattern), 31u2 ... u phase lower arm feedback pattern (second feedback pattern), 41 to 43 ... Drive pattern, 51 ... External input terminal, 52 ... Output terminal, 53, 54 ... Feedback input terminal, 55 ... Command conversion circuit, 56 ... Feedback conversion circuit, 57 ... Addition circuit, 100 ... Control board, 200 ... Vehicle, 201 ... Electric motor ( Load), 203 ... Power storage device, Vp ... External command voltage, Vpt ... Conversion command voltage, Vf ... Feedback voltage, Vft ... Conversion feedback voltage, Vad ... Additional voltage, L1 ... First inductance component, Ls ... Parasitic inductance, L2 ... Second inductance component, Id ... Drain current (applied current).

Claims (5)

A switching element having a control terminal and an application terminal through which an applied current flows,
The first inductance component through which the applied current flows and
A second inductance component that is provided at a position where the magnetic flux generated from the first inductance component penetrates and induces a feedback voltage by the change of the magnetic flux accompanying the change of the applied current.
The driver circuit that drives the switching element and
Equipped with
The driver circuit is
The feedback input terminal to which the feedback voltage is input and
An external input terminal to which an external command voltage is input, and
The conversion command voltage obtained by converting the external command voltage or the external command voltage is added to the feedback voltage or the conversion feedback voltage obtained by converting the feedback voltage, and the added added voltage is added. An adder circuit that outputs to the control terminal and
A power conversion device characterized by being equipped with. A drive board on which the switching element is mounted is provided.
The first inductance component includes a parasitic inductance in the switching element.
The power conversion device according to claim 1, wherein the second inductance component is formed on the drive board and at least a part of the second inductance component is composed of a feedback pattern arranged next to the switching element. It is assumed that the direction in which the applied current flows in the switching element is the first direction, and the direction orthogonal to both the first direction and the thickness direction of the drive board is the second direction.
The feedback pattern and the switching element are arranged side by side in the second direction.
The power conversion device according to claim 2, wherein the feedback pattern has a portion extending in the first direction. As the switching element, the first switching element and the second switching element arranged apart from each other in the first direction,
As the feedback pattern, a first feedback pattern arranged next to the second direction with respect to the first switching element, and a second feedback pattern arranged next to the second direction with respect to the second switching element.
Equipped with
The first feedback pattern is arranged within the range of the first direction of the first switching element, and the second feedback pattern is arranged within the range of the first direction of the second switching element.
The power conversion device according to claim 3, wherein the separation distance between the two feedback patterns is larger than the separation distance between the two switching elements. It is provided with a drive board and a control board laminated so as to face each other.
The switching element is mounted on the drive board and is mounted on the drive board.
The driver circuit is mounted on the control board and is mounted on the control board.
The first inductance component includes a parasitic inductance in the switching element.
The second inductance component is composed of a feedback pattern formed on the control board and electrically connected to the driver circuit.
The power conversion device according to claim 1, wherein at least a part of the feedback pattern is arranged at a position overlapping the switching element when viewed from the stacking direction of the drive board and the control board.

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