JP7404634B2 - Wiring board and wiring board with element - Google Patents

Description

The present disclosure relates to a wiring board and a wiring board with an element.

2. Description of the Related Art Wiring boards for mounting elements such as semiconductor elements are known. An identification information section in which manufacturing information is written is sometimes formed on a wiring board, and the identification information section is used, for example, to investigate the cause of a defect in the wiring board.

Patent Document 1 discloses a wiring board that configures an electronic component module by mounting electronic components on one side of the board, in which a removal portion is provided in a conductive pattern arranged on the other side of the board, and the conductive pattern is removed. A wiring board is disclosed in which a removal section is used as a formation site for a two-dimensional code that displays identification information.

Japanese Patent Application Publication No. 2005-294635

In a wiring board, if the identification information part is arranged so as to be exposed to the outside, the identification information part may be damaged by chemical action such as a chemical solution or physical action such as rubbing. The present disclosure has been made in view of the above circumstances, and its main purpose is to provide a wiring board in which the identification information section is prevented from being damaged.

In the present disclosure, a support substrate, a wiring layer formed on at least one of a first surface side and a second surface side of the support substrate, and an identification information section formed on the first surface side of the support substrate; , the above-mentioned identification information section is present inside the above-mentioned wiring board, the above-mentioned wiring board has a transparent member at a position overlapping with the above-mentioned identification information section in plan view, and the above-mentioned wiring board has a A wiring board is provided in which the identification information section can be confirmed from the outside of the board through the transparent member.

According to the present disclosure, since the identification information section is present inside the wiring board, damage to the identification information section can be prevented. Furthermore, since the identification information section present inside can be confirmed through the transparent member, information at the time of manufacture can be confirmed from the wiring board, which is the final product. Therefore, a wiring board with good traceability can be obtained.

In the above disclosure, the wiring board may have a transparent insulating layer containing an insulating resin as the transparent member.

In the above disclosure, the wiring board has a first transparent insulating layer formed on the first surface side of the supporting substrate as the transparent insulating layer, and the wiring board includes the supporting substrate, the identification information section, and the first transparent insulating layer. The transparent insulating layers may be formed in this order.

In the above disclosure, the wiring board may include the support substrate having transparency as the transparent member.

In the above disclosure, the support substrate, the identification information section, and the wiring layer may be formed in this order.

In the above disclosure, the wiring layer may include the entire identification information section in plan view.

In the above disclosure, the wiring board may include, as the transparent member, the supporting substrate having transparency and a transparent insulating layer containing an insulating resin.

In the above disclosure, the wiring board has a second transparent insulating layer formed on the second surface side of the supporting substrate as the transparent insulating layer, and the second transparent insulating layer, the supporting substrate, and the The identification information section and the wiring layer may be formed in this order.

In the above disclosure, the wiring board includes, as the transparent insulating layer, a first transparent insulating layer formed on the first surface side of the support substrate, and a second transparent insulating layer formed on the second surface side of the support substrate. The second transparent insulating layer, the supporting substrate, the identification information section, and the first transparent insulating layer may be formed in this order.

In the above disclosure, the identification information section may be in direct contact with the support substrate.

In the above disclosure, a non-transparent insulating layer may be formed between the support substrate and the identification information section.

Further, the present disclosure provides a wiring board with an element, which includes the wiring board described above and an element mounted on the wiring board.

According to the present disclosure, by using the wiring board described above, it is possible to provide a wiring board with an element that prevents damage to the identification information section.

The wiring board according to the present disclosure is effective in preventing damage to the identification information section.

FIG. 2 is a schematic plan view illustrating a multi-sided wiring board according to the present disclosure. 1 is a schematic cross-sectional view illustrating a wiring board according to the present disclosure. 1 is a schematic cross-sectional view illustrating a wiring board according to the present disclosure. 1 is a schematic cross-sectional view illustrating a wiring board according to the present disclosure. 1 is a schematic cross-sectional view illustrating a wiring board according to the present disclosure. 1 is a schematic cross-sectional view illustrating a wiring board according to the present disclosure. 1 is a schematic cross-sectional view illustrating a wiring board according to the present disclosure. 1 is a schematic cross-sectional view illustrating a wiring board according to the present disclosure. 1 is a schematic cross-sectional view illustrating a wiring board according to the present disclosure. FIG. 2 is a schematic diagram illustrating a wiring board according to the present disclosure. 1 is a schematic cross-sectional view illustrating a wiring board with an element according to the present disclosure.

Embodiments of the present disclosure will be described below with reference to the drawings and the like. However, the present disclosure can be implemented in many different ways, and should not be construed as being limited to the description of the embodiments exemplified below. In addition, in order to make the explanation clearer, the drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual form, but this is just an example, and the interpretation in this disclosure is limited. It's not something you do. In addition, in this specification and each figure, the same elements as those described above with respect to the previously shown figures are denoted by the same reference numerals, and detailed explanations may be omitted as appropriate.

In this specification, when expressing a mode in which another member is placed on top of a certain member, when it is simply expressed as “above” or “below”, unless otherwise specified, the term This includes both cases in which another member is placed directly above or below a certain member, and cases in which another member is placed above or below a certain member via another member. Similarly, in this specification, when the phrase "on the side of a certain member" is used, unless otherwise specified, there are cases in which another member is placed directly in contact with the surface of a certain member, and cases in which another member is placed directly in contact with the surface of a certain member. This includes both the case where another member is placed on the surface of the object via another member.

A. Wiring Board FIG. 1 is a schematic plan view illustrating a multi-sided wiring board according to the present disclosure. In FIG. 1, four wiring boards 10 are mounted, and an identification information section 16 of the entire mounted wiring board and an identification information section 6 of each wiring board 10 are formed. By cutting along the cut line C, each wiring board 10 is obtained.

FIG. 2 is a cross-sectional view taken along line AA in FIG. _The wiring board 10 shown in _FIG . and an identification information section 6 formed on the _S1 side. Further, the wiring board 10 has an interlayer insulation layer 2 between the wiring layer 3 located on the outside and the wiring layer 3 located on the inside, and has a cover insulation layer 4 that covers the wiring layer 3 located on the outside. A connecting portion 5 for connecting to an element is formed in the wiring layer 3 located on the outside.

Further, as shown in FIG. 2, the identification information section 6 exists inside the wiring board 10. Further, the wiring board 10 has a transparent member at a position overlapping the identification information section 6 in a plan view. In FIG. 2, the first transparent insulating layer _T1 formed on the first surface _S1 side of the support substrate 1 corresponds to the transparent member. In FIG. 2, both the interlayer insulation layer 2 and the cover insulation layer 4 are the first transparent insulation layer _T1 . In the present disclosure, the identification information section 6 can be confirmed from the outside of the wiring board 10 through the transparent member. In FIG. 2, by observing from the direction _D12 from the first surface _S1 of the support substrate 1 to the second surface _S2 of the support substrate 1, the identification information section ₆ can be seen through the first transparent insulating layer T1. It is possible to confirm. In FIG. 2, the interlayer insulating layer 2 and the cover insulating layer 4 formed on the second surface _S2 side of the support substrate 1 are non-transparent insulating layers N.

According to the present disclosure, since the identification information section is present inside the wiring board, damage to the identification information section can be prevented. Furthermore, since the identification information section present inside can be confirmed through the transparent member, information at the time of manufacture can be confirmed from the wiring board, which is the final product. Therefore, a wiring board with good traceability can be obtained.

Furthermore, conventionally, due to product design, it has sometimes been difficult to leave information at the time of manufacture on the wiring board. Furthermore, when forming an identification information section on the outermost surface of a wiring board, information at the time of manufacturing must be recorded after the fact, and there is a possibility that a recording error may occur due to a time lag. In contrast, in the present disclosure, for example, by forming the identification information section at the initial stage of manufacturing, information at the time of manufacturing can be recorded with a relatively high degree of freedom and without time lag.

1. Configuration of Wiring Board The wiring board in the present disclosure includes at least a support substrate, a wiring layer, and an identification information section. Further, the identification information section exists inside the wiring board. Inside refers to a location that is not exposed to the outside. Further, the wiring board has a transparent member at a position overlapping the identification information section in plan view. The "transparent member" is a member that is transparent enough to allow the identification information section to be confirmed from the outside of the wiring board through the transparent member. The total light transmittance of the transparent member is preferably high, for example, 15% or more, may be 20% or more, or may be 30% or more. The total light transmittance is measured based on JIS K 7361-1 (Test method for total light transmittance of plastic transparent materials). For the measurement, for example, an ultraviolet/visible/near-infrared spectrophotometer (Shimadzu UV-3600) and an integrating sphere attachment device (ISR-3100) can be used. Further, as the standard plate, for example, Spectralon (manufactured by Teflon (registered trademark)) manufactured by Labsphere, Inc., USA can be used.

Note that, as described later, the supporting substrate, the cover insulating layer, and the interlayer insulating layer do not need to have transparency. These members can be referred to as non-transparent members. The total light transmittance of the non-transparent member is, for example, 1% or less, may be 0.5% or less, or may be 0.1% or less.

The wiring board may have, as a transparent member, (i) a transparent insulating layer containing an insulating resin (first embodiment), or (ii) a support substrate having transparency. (Second embodiment), (iii) may have a transparent insulating layer containing an insulating resin and a support substrate having transparency (Third embodiment). Moreover, the transparent insulating layer may be one layer, or may be two or more layers.

(1) First Embodiment The wiring board may have a transparent insulating layer containing an insulating resin as a transparent member. For example, the wiring board 10 shown in FIG. 3 has a first transparent insulating layer _T1 formed on the first surface _S1 side of the support substrate 1 as a transparent member. Although the first transparent insulating layer _T1 in FIG. 3 is the cover insulating layer 4, the first transparent insulating layer _T1 may be an interlayer insulating layer.

Further, as shown in FIG. 3, the support substrate 1, the identification information section 6, and the first transparent insulating layer _T1 may be formed in this order. In this case, the identification information portion ₆ can be confirmed through the first transparent insulating layer T1 by observing from the direction _D12 from the first surface S1 of the support substrate ₁ to the _second surface S2 of the support substrate 1. It is possible. Note that in FIG. 3, other layers are not formed on the second surface _S2 side of the support substrate 1, but any other layer may also be provided. This point also applies to FIGS. 4 to 6, FIG. 9, etc., which will be described later.

Further, as shown in FIG. 4, a non-transparent insulating layer N may be formed between the support substrate 1 and the identification information section 6. Specifically, the support substrate 1, the non-transparent insulating layer N, the identification information section 6, and the first transparent insulating layer _T1 may be formed in this order. Even in such a case, the identification information section ₆ can be confirmed through the first transparent insulating layer T1 by observing from the direction _D12 . Further, there are usually more types of materials used for the non-transparent insulating layer than for the transparent insulating layer. Therefore, as compared to, for example, the case where two transparent insulating layers are formed as shown in FIG. 2, the range of material selection is wider in FIG.

(2) Second Embodiment The wiring board may have a transparent support substrate as a transparent member. That is, the support substrate may be used as a transparent member. For example, the wiring board 10 shown in FIG. 5 has a transparent support substrate 1 as a transparent member. In this case, the identification information portion 6 can be confirmed through the support substrate 1 by observing from the direction D ₂₁ from the second surface S ₂ side of the support substrate 1 toward the first surface S ₁ of the support substrate 1 .

Further, as shown in FIG. 5, the support substrate 1, the identification information section 6, and the wiring layer 3 may be formed in this order. The presence of the wiring layer 3 makes the contrast of the identification information section 6 clear and improves the identifiability of the identification information section 6. Moreover, it is preferable that the wiring layer 3 includes the entire identification information section 6 in a plan view. That is, it is preferable that the wiring layer 3 located on the identification information section 6 has a solid pattern. This is because the contrast can be prevented from becoming non-uniform, and the identifiability of the identification information section 6 can be improved.

Further, as shown in FIG. 6, the support substrate 1, the identification information section 6, and the non-transparent insulating layer N may be formed in this order. Due to the presence of the non-transparent insulating layer N, the contrast of the identification information section 6 can be made clear, and the identifiability of the identification information section 6 can be improved. Note that although the non-transparent insulating layer N in FIG. 6 is the cover insulating layer 4, the non-transparent insulating layer N may be an interlayer insulating layer.

(3) Third Embodiment The wiring board may have a transparent insulating layer containing an insulating resin and a support substrate having transparency as transparent members. Further, the transparent insulating layer may be a first transparent insulating layer formed on the first surface side of the support substrate, or may be a second transparent insulating layer formed on the second surface side of the support substrate. , may be both the first transparent insulating layer and the second transparent insulating layer.

For example, the wiring board 10 shown in FIG. 7 includes a second transparent insulating layer T ₂ and a transparent support substrate 1 as transparent members. In this case, by observing from the direction D ₂₁ from the second surface S ₂ side of the support substrate 1 toward the first surface S ₁ of the support substrate 1, the identification information can be seen through the second transparent insulating layer T ₂ and the support substrate 1. Part 6 can be confirmed.

Further, as shown in FIG. 7, the second transparent insulating layer _T2 , the support substrate 1, the identification information section 6, and the wiring layer 3 may be formed in this order. The presence of the wiring layer 3 makes the contrast of the identification information section 6 clear and improves the identifiability of the identification information section 6. Moreover, it is preferable that the wiring layer 3 includes the entire identification information section 6 in a plan view. That is, it is preferable that the wiring layer 3 located on the identification information section 6 has a solid pattern. This is because the contrast can be prevented from becoming non-uniform, and the identifiability of the identification information section 6 can be improved. Although the second transparent insulating layer _T2 in FIG. 7 is the cover insulating layer 4, the second transparent insulating layer _T2 may be an interlayer insulating layer.

For example, the wiring board 10 shown in FIG. 8 includes a second transparent insulating layer T ₂ , a support substrate 1 having transparency, and a first transparent insulating layer T ₁ as transparent members. In FIG. 8, the second transparent insulating layer _T2 , the support substrate 1, the identification information section 6, and the first transparent insulating layer _T1 are formed in this order. In this case, the identification information section 6 can be confirmed from both the direction _D12 and the direction _D21 through the second transparent insulating layer _T2 and the support substrate 1. Furthermore, as shown in FIG. 8, when the transmitted light from the light source 50 is used, the identifiability of the identification information section 6 is improved. Note that although the first transparent insulating layer T ₁ and the second transparent insulating layer T ₂ in FIG. 8 are the cover insulating layer 4, they may each be an interlayer insulating layer. Note that in the wiring board according to the present disclosure, the identification information section may be able to be confirmed by transmitted light, or the identification information section may be confirmed by reflected light.

2. Components of Wiring Board The wiring board according to the present disclosure includes at least a support substrate, a wiring layer, and an identification information section. Furthermore, it may have other layers such as an interlayer insulating layer, a cover insulating layer, and a terminal portion.

(1) Identification Information Section The identification information section in the present disclosure exists inside the wiring board. The identification information section records information at the time of manufacture. Information at the time of manufacturing includes, for example, management information in the manufacturing process (for example, production information at the time of wiring formation). As shown in FIG. 3, the identification information section 6 may be in direct contact with the support substrate 1. On the other hand, as shown in FIG. 4, the identification information section 6 does not need to be in direct contact with the support substrate 1. Further, the wiring board may have one identification information section, or may have two or more identification information sections.

In the present disclosure, the transparent insulating layer is present at a position overlapping with the identification information section in a plan view, and the non-transparent resin layer is located adjacent to the transparent insulating layer in a direction orthogonal to the thickness direction in a cross-sectional view. may exist. For example, as shown in FIG. 9, the transparent insulating layer T exists at a position overlapping the identification information section 6 in a plan view, and in the direction D _B perpendicular to the thickness direction D _A in a cross-sectional view, the transparent insulating layer T A non-transparent resin layer N may be present adjacent to the non-transparent resin layer N. Typically, there are more types of materials used for non-transparent insulating layers than for transparent insulating layers. Therefore, by using a transparent insulating layer in the vicinity of the identification information section and using a non-transparent insulating layer in the surrounding area, there is an advantage that the range of material selection can be expanded. Note that although the transparent insulating layer T and the non-transparent insulating layer N in FIG. 9 are the cover insulating layer 4, they may each be an interlayer insulating layer.

In the present disclosure, it is preferable that a wiring layer is formed between the identification information section and the end of the support substrate. FIG. 10(a) is a schematic plan view showing an example of a wiring board according to the present disclosure, and FIG. 10(b) is a cross-sectional view taken along the line AA in FIG. 10(a). As shown in FIGS. 10A and 10B, it is preferable that a wiring layer 3 is formed between the identification information section 6 and the end X of the support substrate 1. This is because the presence of the wiring layer 3 can suppress, for example, a chemical liquid from entering between the transparent insulating layer T and the support substrate 1.

In the present disclosure, the identification information section can be confirmed from outside the wiring board through the transparent member. It is preferable that the identification information part can be confirmed visually or with an inspection machine. An example of the identification information section is an ink pattern. Ink patterns are particularly susceptible to damage due to chemical effects such as chemicals and physical effects such as rubbing. On the other hand, by forming the ink pattern inside the wiring board, damage to the ink pattern can be effectively prevented.

Further, a part of the support substrate may be used as the identification information section. The identification information portion can be formed by, for example, irradiating the support substrate with a laser. Further, a part of the wiring layer may be used as the identification information section. The identification information section can be formed by performing desired patterning when forming the wiring layer.

Examples of the types of identification information portions include primary codes such as bar codes, secondary codes such as matrix codes, and stack codes. Specific examples of the matrix code include QR code (registered trademark) and Vericode. Further, numerical information or character information may be used as the identification information section.

(2) Support substrate The support substrate is a layer that supports a wiring layer, etc., which will be described later. The supporting substrate may be a transparent supporting substrate or a non-transparent supporting substrate. Furthermore, the support substrate may or may not have flexibility. Examples of the support substrate include inorganic substrates such as glass substrates, silicon substrates, and ceramic substrates, resin substrates, paper substrates, and metal substrates. Examples of the glass substrate include soda lime glass, alkali-free glass, and quartz glass. Examples of resin substrates include polyimide, polyamide, polyamideimide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyetheretherketone, polyethersulfone, polycarbonate, polyetherimide, epoxy resin, phenol resin, polyphenylene ether, and acrylic resin. , polyolefins (eg, polyethylene, polypropylene), polycycloolefins (eg, polynorbornene), and liquid crystalline polymer compounds. Furthermore, a composite material such as glass-epoxy resin, paper epoxy, paper phenol, etc. may be used as the supporting substrate. Furthermore, a TFT (Thin Film Transistor) substrate can also be used as the support substrate.

The shape of the support substrate in plan view is not particularly limited, and examples thereof include rectangles such as rectangles and squares. When the support substrate is rectangular, the length of one side is, for example, 10 mm or more, and may be 100 mm or more. On the other hand, the length of one side is, for example, 2000 mm or less. The length of one side is, for example, 10 mm or more and 2000 mm or less, and may be 100 mm or more and 2000 mm or less. Further, the thickness of the support substrate is, for example, 10 μm or more, may be 100 μm or more, or may be 300 μm or more. On the other hand, the thickness of the support substrate is, for example, 1000 μm or less. The thickness of the support substrate may be, for example, 10 μm or more and 1000 μm or less, 100 μm or more and 1000 μm or less, or 300 μm or more and 1000 μm or less.

(3) Wiring layer The wiring layer is formed on at least one of the first surface side and the second surface side of the support substrate. The wiring layer may be formed only on the first surface side of the support substrate, may be formed only on the second surface side of the support substrate, or may be formed on both sides of the support substrate. Moreover, it is preferable that the wiring layer has a pad part for forming a connection part. Further, as described above, the wiring layer may include the entire identification information section in plan view.

Further, the wiring board may have only one wiring layer, or may have two or more wiring layers. In the latter case, it is preferable that two wiring layers are laminated in the thickness direction via at least one of the support substrate and the interlayer insulating layer. The wiring layers stacked in the thickness direction may be electrically connected via vias.

Examples of the material for the wiring layer include metal materials such as simple metals, alloys, and metal compounds. Examples of metallic elements contained in metallic materials include chromium, manganese, iron, cobalt, nickel, copper, zinc, gallium, germanium, arsenic, ruthenium, rhodium, palladium, silver, cadmium, indium, tin, antimony, and osmium. , iridium, platinum, gold, mercury, thallium, lead, bismuth, molybdenum, titanium, tungsten, tantalum, and aluminum. Among these, the material for the wiring layer is preferably an elemental metal such as copper, gold, silver, platinum, rhodium, tin, aluminum, nickel, or chromium, or an alloy containing at least one of these metal elements. Furthermore, metal oxides such as indium tin oxide (ITO) and indium zinc oxide (IZO) can also be used as the wiring layer.

Examples of uses of the wiring layer include ground wiring, power supply wiring, common wiring, signal wiring, gate wiring, drain wiring, source wiring, and scanning wiring.

The method for forming the wiring layer may be an additive method or a subtractive method. In the additive method, a patterned wiring layer is obtained by producing a resist pattern by, for example, photolithography, and performing plating on the portions exposed from the resist pattern. When using an electrolytic plating method, a conductive layer may be formed on a base material (for example, a supporting substrate, an interlayer insulating layer) on which a wiring layer is to be formed, before producing a resist pattern. In the subtractive method, for example, a patterned wiring layer is obtained by forming a resist pattern on a wiring layer formed on the entire surface and etching the portion exposed from the resist pattern.

The thickness of the wiring layer may be, for example, 0.1 μm or more, 0.5 μm or more, 1 μm or more, 3 μm or more, or 5 μm or more. On the other hand, the thickness of the wiring layer is, for example, 20 μm or less, and may be 15 μm or less. The thickness of the wiring layer may be, for example, 0.1 μm or more and 20 μm or less, 0.5 μm or more and 15 μm or less, 1 μm or more and 15 μm or less, 3 μm or more and 15 μm or less, and 5 μm or more. The thickness may be greater than or equal to 15 μm. For example, when forming a wiring layer by sputtering, a relatively thin wiring layer can be obtained. Further, when forming the wiring layer by, for example, a plating method, a relatively thick wiring layer can be obtained.

(4) Cover insulating layer It is preferable that the cover insulating layer covers the wiring layer and has an opening at a position corresponding to the pad portion. The cover insulating layer has a function of preventing deterioration and short circuit of the wiring layer. The cover insulating layer may be formed only on the first surface side of the support substrate, may be formed only on the second surface side of the support substrate, or may be formed on both sides of the support substrate. Further, the cover insulating layer may be an insulating layer that has transparency (transparent insulating layer) or may be an insulating layer that does not have transparency (non-transparent insulating layer).

The material of the cover insulating layer may be a photosensitive material or a non-photosensitive material. Further, the material of the cover insulating layer is preferably an insulating resin. Examples of insulating resins include polyimide, polyamide, polyamideimide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyetheretherketone, polyethersulfone, polycarbonate, polyetherimide, epoxy resin, phenol resin, polyphenylene ether, and acrylic. Examples include resins, polyolefins (eg, polyethylene, polypropylene), polycycloolefins (eg, polynorbornene), and liquid crystalline polymer compounds. In particular, examples of the insulating resin used for the transparent insulating layer include acrylic resin, methacrylic resin, epoxy resin, polyimide resin, and imide resin. The thickness of the cover insulating layer is, for example, 1 μm or more and 8 μm or less.

The method for forming the insulating cover layer is preferably selected as appropriate depending on the material of the insulating cover layer. For example, when the material of the insulating cover layer is a photosensitive material, a patterned insulating cover layer can be obtained by exposing and developing the insulating cover layer formed on the entire surface. On the other hand, when the material of the cover insulating layer is a non-photosensitive material, a patterned cover insulating layer can be obtained by creating a resist pattern on the cover insulating layer formed on the entire surface and etching the exposed part from the resist pattern. It will be done. Further, for example, a patterned cover insulating layer may be formed by performing laser processing on the cover insulating layer.

(5) Interlayer insulation layer The wiring board may or may not have an interlayer insulation layer. The interlayer insulating layer may be formed only on the first surface side of the support substrate, may be formed only on the second surface side of the support substrate, or may be formed on both surfaces of the support substrate. Further, the interlayer insulating layer may be an insulating layer having transparency (transparent insulating layer) or may be an insulating layer not having transparency (non-transparent insulating layer).

Further, the wiring board may have only one interlayer insulating layer, or may have two or more interlayer insulating layers. The interlayer insulating layer may be formed between the support substrate and the wiring layer, or may be formed between two wiring layers.

The material of the interlayer insulating layer is preferably an insulating resin. The insulating resin is the same as the insulating resin used for the cover insulating layer described above. The thickness of the interlayer insulating layer is, for example, 1.5 μm or more, and may be 2.5 μm or more. On the other hand, the thickness of the interlayer insulating layer is, for example, 6 μm or less. The thickness of the interlayer insulating layer is, for example, 1.5 μm or more and 6 μm or less, and may be 2.5 μm or more and 6 μm or less. The method for forming the interlayer insulating layer is the same as the method for forming the cover insulating layer described above.

(6) Connection portion The wiring board may have a connection portion on the pad portion of the wiring layer. It is preferable that the connecting portion protrudes from the cover insulating layer at a position overlapping the pad portion exposed through the opening of the cover insulating layer in plan view. Further, it is preferable that the connecting portion has a convex shape.

Preferably, the connecting portion is an electroless plated portion. Furthermore, it is preferable that the electroless plated portion protrudes from the cover insulating layer. The electroless plated portion preferably contains, for example, Pd and Ni. Specifically, it is preferable that a Pd part and a Ni part are formed in order from the pad part. In the electroless plating method, Pd is first adsorbed on the surface of the pad portion, and then Pd functions as a catalyst and Ni is deposited. Therefore, a Pd part and a Ni part are formed in order from the pad part. Furthermore, since a reducing agent such as hypophosphorous acid is usually used in the electroless plating method, the electroless plating portion may further contain P.

Further, a protective plating portion may be formed on the connection portion. Examples of the protective plating portion include a gold plating portion. Providing a gold-plated part improves connection reliability. The gold-plated portion can be formed, for example, by electroless gold plating.

Further, a solder portion may be formed on the connection portion. It is preferable that the solder part contains at least one of Sn, Cu, and Pb, for example. The solder portion can be formed by, for example, a printing method or an electroless plating method.

B. Wiring Board with Elements FIG. 11 is a schematic cross-sectional view showing an example of the wiring board with elements according to the present disclosure. A wiring board 30 with an element shown in FIG. 11 includes a wiring board 10 and an element 20 mounted on the wiring board 10. In FIG. 11 , the wiring board 10 and the element 20 are electrically connected by the connecting portion 5 .

According to the present disclosure, by using the wiring board described above, it is possible to provide a wiring board with an element that prevents damage to the identification information section.

1. Wiring Board The wiring board in the present disclosure is the same as that described in "A. Wiring Board" above, so a description thereof will be omitted here.

2. Element The element in the present disclosure is a member mounted in an element mounting area of a wiring board. The element may be an active element, a passive element, or a mechanical element. Moreover, it is preferable that the element is a semiconductor element. Examples of elements include transistors, integrated circuits (for example, LSI), MEMS (Micro Electro Mechanical Systems), relays, light emitting elements (for example, LEDs, OLEDs), sensors, resistors, capacitors, inductors, piezoelectric elements, and batteries. .

3. Wiring board with elements Applications of the wiring board with elements in the present disclosure are not particularly limited, but include, for example, display devices, information processing terminals (e.g. personal computers, tablets, smartphones), car accessories (e.g. car interior parts, car exterior parts) ), printed wiring boards, electromagnetic shielding materials, antennas, power semiconductors, and noise filters.

The wiring board with an element in the present disclosure can be obtained, for example, by mounting an element on a wiring board. The method for mounting the element is not particularly limited, and a general method can be used. Examples of methods for mounting elements include a method of mounting a plurality of elements at once using a transfer method. An example of a transfer method includes a method in which a transfer laminate in which a plurality of elements are temporarily fixed to a transfer substrate is prepared, and the plurality of elements in the transfer laminate are transferred to a wiring board.

Note that the present disclosure is not limited to the above embodiments. The above-mentioned embodiments are illustrative, and any configuration that has substantially the same technical idea as the claims of the present disclosure and provides similar effects is the present invention. within the technical scope of the disclosure.

[Example 1]
A wiring board shown in FIG. 5 was manufactured. First, a glass substrate (manufactured by AGC, A100, 370 mm x 470 mm) was irradiated with ultraviolet rays and cleaned. After washing, a two-dimensional code (DataMatrix), which is an identification information section, was formed on the first surface of the substrate using an inkjet printer (manufactured by Keyence Corporation, MK-U6000). Next, the first surface was subjected to chromium sputtering treatment and copper sputtering treatment, and a resist pattern was formed thereon using a dry film resist (Sunfort AQ4038, manufactured by Asahi Kasei Electronics Co., Ltd.). At this time, a resist pattern was formed such that the location where the two-dimensional code was formed was included in the opening of the resist pattern.

Thereafter, copper sulfate electrolytic plating (Top Lucina SF, manufactured by Okuno Pharmaceutical Co., Ltd.) was performed on the openings of the resist pattern to form a wiring layer (thickness: 3 μm). Next, the dry film resist was peeled off with an aqueous sodium hydroxide solution at 50°C, and the exposed chromium layer and copper layer were removed using an etching solution for chromium (S-clean S-24, manufactured by Sasaki Chemical Industry Co., Ltd.), respectively. It was removed using a copper etching solution (AD-331, manufactured by Meltech). Thereafter, a cover insulating layer (thickness: 3 μm) was formed using a photosensitive resist (Photonice PW-1000, manufactured by Toray Industries, Inc.) to cover the wiring layer. In this way, the wiring board shown in FIG. 5 was manufactured. As shown in FIG. 5, the two-dimensional code (identification information section 6) could be confirmed from the direction _D21 through the glass substrate.

DESCRIPTION OF SYMBOLS 1...Support board 2...Interlayer insulating layer 3...Wiring layer 4...Cover insulating layer 5...Connection part 10...Wiring board 20...Element 30...Wiring board with element

Claims (4)

a support substrate;
a wiring layer formed on at least one of the first surface side and the second surface side of the support substrate;
an identification information section formed on the first surface side of the support substrate;
A wiring board having
The identification information section exists inside the wiring board,
The wiring board has a transparent member at a position overlapping with the identification information section in plan view,
The identification information section can be confirmed from outside the wiring board through the transparent member ,
The wiring board has the support substrate having transparency as the transparent member ,
The support substrate, the identification information section, and the wiring layer are formed in this order,
A wiring board , wherein the wiring layer overlaps to include the entire identification information section in a plan view . a support substrate;
a wiring layer formed on at least one of the first surface side and the second surface side of the support substrate;
an identification information section formed on the first surface side of the support substrate;
A wiring board having
The identification information section exists inside the wiring board,
The wiring board has a transparent member at a position overlapping with the identification information section in plan view,
The identification information section can be confirmed from outside the wiring board through the transparent member,
The wiring board has a transparent insulating layer containing an insulating resin as the transparent member,
The wiring board has a first transparent insulating layer formed on the first surface side of the support substrate as the transparent insulating layer,
The support substrate, the identification information section, and the first transparent insulating layer are formed in this order.
A wiring board , wherein a non-transparent insulating layer is formed between the support substrate and the identification information section . The wiring board according to claim 1 or 2 , wherein the identification information section is in direct contact with the support substrate. A wiring board according to any one of claims 1 to 3 ;
an element mounted on the wiring board;
A wiring board with an element.

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