JP7399678B2 - Resin molding for optical semiconductor devices and optical semiconductor devices - Google Patents

Description

The present invention relates to a resin molded body used in an optical semiconductor device including an optical semiconductor element such as a light emitting diode, and an optical semiconductor device equipped with the resin molded body.

Optical semiconductor devices that include optical semiconductor elements such as light-emitting diodes have a longer lifespan, stable operation, and faster response speed than other light sources such as light bulbs, fluorescent lamps, neon tubes, and halogen lamps. It has the following characteristics. Such optical semiconductor devices are being put into practical use in a variety of applications. For example, they are used in lighting applications (general indoor lighting in homes and offices, street lights, etc.), display applications (traffic lights, etc.), light source applications (backlights for LCD televisions, etc.), and communication applications (infrared remote controllers, etc.). Such an optical semiconductor device is described, for example, in Patent Document 1 below.

Japanese Patent Application Publication No. 2019-012854

Optical semiconductor devices come in a variety of designs, and there is a demand for a design that provides higher luminous intensity even for optical semiconductor devices of the same external size. However, in the conventional optical semiconductor device, there is a lot of loss in light extraction, and the current state is that the inherent luminous intensity of the optical semiconductor element cannot be fully utilized.

Furthermore, in conventional optical semiconductor devices, there is a so-called dead space where a part of the light emitting surface becomes dark, and the brightness is not uniform.This tendency has become more noticeable as optical semiconductor devices have become larger. It's coming. In recent years, there has been a demand for more uniform brightness by reducing dead space even on larger optical semiconductor device surfaces.

The present invention was conceived under the above circumstances, and its purpose is to reduce light loss and emit brighter and more uniform light for use in optical semiconductor devices. An object of the present invention is to provide a resin molded article for an optical semiconductor device, and an optical semiconductor device including the resin molded article for an optical semiconductor device.

As a result of intensive studies to solve the above problems, the present inventors found that the main cause of light loss and dead space in optical semiconductor devices is that the path of reflected light within the optical semiconductor device is restricted. They discovered that this is due to an increase in the number of collisions between reflected lights, causing the light to attenuate (extinguish). We also considered the design of the resin moldings used in optical semiconductor devices to ensure that light is uniformly reflected throughout the optical semiconductor device, resulting in fewer collisions of reflected light with each other, making it brighter and minimizing dead space. We have discovered a design that provides more uniform light. The present invention was completed based on these findings.

That is, one embodiment of the present invention is a resin molded article for an optical semiconductor device, comprising:
having a front surface and a back surface facing opposite to each other in the thickness direction,
The surface has a concave portion recessed from the opening toward the back surface,
The recess has n reflective surfaces (n is an integer of 5 or more) on an inner wall and a bottom surface,
The shape of the opening of the recess is approximately an n-gon (n is the same integer as n) that satisfies the following conditions (1) and (2),
(1) All interior angles of the substantially n-gon are obtuse angles.
(2) All sides of the substantially n-gon are not parallel to each other.
The present invention provides a resin molded article for an optical semiconductor device, in which a shape formed by an arbitrary plane parallel to the opening and an inner wall of the recess is a substantially n-gon shape that is substantially similar to the opening of the recess.

In the resin molded article for an optical semiconductor device, the bottom surface of the recess may have a substantially n-gon shape that is substantially similar to the opening of the recess.

In the resin molded article for an optical semiconductor device, it is preferable that the area of the opening of the recess is larger than the area of the bottom surface of the recess.

In the resin molded article for an optical semiconductor device, it is preferable that the area of the shape formed by any plane parallel to the opening and the side surface of the recess gradually decreases from the opening to the bottom of the recess.

The resin molded body for an optical semiconductor device may be integrated with a first lead and a second lead that are separated from each other.

In the resin molded article for an optical semiconductor device, the first lead has a first exposed surface forming a part of the bottom surface of the recess, and is exposed on a side opposite to the first exposed surface. having a second exposed surface that is
The second lead forms a part of the bottom surface of the recess, has a third exposed surface separated from the first exposed surface, and is exposed on a side opposite to the third exposed surface. It may have a fourth exposed surface.

In the resin molded article for an optical semiconductor device, each of the first lead and the second lead may have an electrode portion extending outside from the resin molded article for an optical semiconductor device.

Further, other embodiments of the present invention include an optical semiconductor element,
Comprising a resin molded body,
The resin molded body is the resin molded body for an optical semiconductor device,
The present invention provides an optical semiconductor device in which the optical semiconductor element is mounted on the first exposed surface of the first lead and connected to the third exposed surface of the second lead via a bonding wire.

In the optical semiconductor device, the optical semiconductor element may be connected to a substantially central portion of the bottom surface of the recess.

Since the resin molded body for an optical semiconductor device of the present invention has the above-described configuration, an optical semiconductor device equipped with the resin molded body reflects light uniformly throughout the optical semiconductor device, and collisions between reflected lights occur. It's brighter, with less dead space, and provides more uniform light by minimizing dead space.

FIG. 1 is a perspective view (schematic diagram) of a resin molded article for an optical semiconductor device according to one embodiment of the present invention. FIG. 2 is a plan view (schematic diagram) of the resin molded body for an optical semiconductor device shown in FIG. 1. FIG. 3 is a cross-sectional view (schematic diagram) taken along line X-X' of the resin molded article for an optical semiconductor device shown in FIG. 2. FIG. FIG. 3 is a plan view (schematic diagram) of a resin molded article for an optical semiconductor device according to another embodiment of the present invention. 5 is a cross-sectional view (schematic diagram) taken along line YY' of the resin molded article for an optical semiconductor device shown in FIG. 4. FIG. FIG. 5 is a back view (schematic diagram) of the resin molded article for an optical semiconductor device shown in FIG. 4. FIG. 1 is a plan view (schematic diagram) of an optical semiconductor device according to one embodiment of the present invention. 8 is a cross-sectional view (schematic diagram) taken along line Z-Z' in the optical semiconductor device shown in FIG. 7. FIG. FIG. 1 is a plan view (schematic diagram) of a conventional optical semiconductor device. 10 is a cross-sectional view (schematic diagram) taken along line VV' of the optical semiconductor device shown in FIG. 9. FIG. FIG. 2 is an explanatory diagram of reflected light in a conventional optical semiconductor device.

First, the causes of large optical loss and dead pace in conventional optical semiconductor devices will be explained with reference to FIGS. 9 to 11.
9 and 10 show schematic diagrams of an optical semiconductor device 100 which is an example of a conventional optical semiconductor device, FIG. 9 is a plan view from above, and FIG. 10 is a line V in the optical semiconductor device shown in FIG. -V' is a cross-sectional view. The optical semiconductor device 100 is formed in the form of a so-called molded array package (MAP), and includes a resin molded body 110, a set of leads 120 and 130, an LED element 140 that is a light emitting diode, and a transparent resin. 150.

The resin molded body 110 is a resin body molded to hold the leads 120 and 130 by so-called insert molding with the leads 120 and 130, and has a concave portion 112 whose concave shape is defined by an inclined surface 111. At least the inclined surface 111 of the resin molded body 110 is provided with light reflectivity in a predetermined manner. The LED element 140 is electrically and mechanically connected to the lead 120 within the recess 112. Along with this, the LED element 140 is electrically connected to the lead 130 via a bonding wire 160. The transparent resin part 150 is a transparent resin body that is filled into the recess 112 of the resin molded body 110 and hardened, and seals the LED element 140 and the like in the recess 112. When the leads 120, 130 are energized from the external electrodes 120a, 130a, the LED element 140 emits light. The light passes through the transparent resin portion 150 and is emitted from the recess 112 of the optical semiconductor device 100 to the outside.

In the optical semiconductor device 100 having such a configuration, light is three-dimensionally emitted from the LED element 140 in all directions. Although some light exits directly from the upper opening of the recess 112 to the outside of the recess 112, most of the light exits the recess 112 while repeatedly being reflected on reflective surfaces such as the inclined surface 111 within the recess 112. At this time, when the reflected lights collide with each other inside the recess 112, the light is attenuated (extinguished), and less light is emitted from the opening, resulting in a decrease in illuminance.

In the recess 112, if the angle between adjacent reflecting surfaces (slanted surfaces 111) is a right angle (90°) or if the opposing reflecting surfaces are parallel, the path of the reflected light is limited, resulting in collision of reflections. More light. This will be explained with reference to FIG. Light incident at 45° on one reflective surface where the angles formed by the adjacent reflective surfaces are right angles will be reflected by the two adjacent reflective surfaces, becoming reflected light parallel to the incident light, and colliding with the incident light. (See L1 in Figure 11). Furthermore, in the case of two parallel reflecting surfaces facing each other, the lights incident perpendicularly (90 degrees) collide with each other and cancel each other out, resulting in a significant attenuation of illuminance (see L2 and L3 in FIG. 11).

In particular, when the shape of the recess 112 is rectangular (including rectangles and squares) as in the optical semiconductor device 100, the reflected light collides over the shortest distance, that is, the reflected light with high optical energy collides, resulting in attenuation ( loss) increases. In addition, it is difficult for light to reach the four corners, resulting in dark dead spaces, and the brightness of the light emitting surface tends to be uneven.

Next, typical embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited thereto and is merely an example.
1 to 3 are schematic diagrams showing a resin molded article 1 for an optical semiconductor device according to one embodiment of the present invention. FIG. 1 is a perspective view of a resin molded body 1 for an optical semiconductor device according to the embodiment, and FIG. 2 is a plan view of the resin molded body 1 for an optical semiconductor device. FIG. 3 is a cross-sectional view of the resin molded article 1 for an optical semiconductor device taken along the dotted line XX' in FIG.

The resin molded body 1 for an optical semiconductor device is not particularly limited as long as it is used for manufacturing an optical semiconductor device, but it is preferably a resin molded body that constitutes a substrate of an optical semiconductor device, and the resin molded bodies face oppositely to each other in the thickness direction. It has a front surface 10 and a back surface 11. The substrate of an optical semiconductor device refers to a plate-like object on which constituent members such as an optical semiconductor element, which will be described later, are mounted. Note that the front surface 10 and the back surface 11 are, in principle, flat surfaces except for cases specified in the present invention (for example, recesses 13 described below), but other uneven shapes may be formed within the range that does not impair the effects of the present invention. may have.

The resin molded body 1 for an optical semiconductor device is molded by, for example, an insert molding method. Such a resin molded body 1 for a semiconductor device is made of, for example, a thermosetting resin composition containing a white pigment. Examples of the thermosetting resin include epoxy resin. Examples of the white pigment blended into the thermosetting resin include titanium oxide, alumina, zinc oxide, magnesium oxide, antimony oxide, and zirconium oxide. A commercially available resin material for forming the resin molded body 1 for semiconductor devices includes, for example, "AEW-700" manufactured by Daicel Corporation.

The resin molded body 1 for an optical semiconductor device has a recess 13 on the front surface 10 that is depressed from the opening 12 toward the back surface 11 . The recess 13 constitutes a reflector opening of the optical semiconductor device, and has n reflective surfaces 14 (n is an integer of 5 or more) and a bottom surface 15 on its inner wall. The reflective surface 14 and the bottom surface 15 of the recess 13 define the concave shape of the recess 13. In this embodiment, n reflective surfaces are used so that the concave shape spreads from the bottom surface 15 of the recess 13 to the opening 12. 14 is inclined.

The reflective surface 14 is made of, for example, a resin body containing the above-mentioned white pigment to provide light reflectivity. Although such a reflective surface is preferably a flat surface, it may have fine irregularities within a range that does not impair light reflectivity. The bottom surface 15 of the recess 13 on which the resin body is exposed may similarly have light reflective properties.

The number of reflective surfaces 14 present on the inner wall of the recess 13 is not particularly limited as long as it is 5 or more, but from the viewpoint of reducing collisions between reflected lights and improving brightness and uniformity of light, it is preferable. 6 or more sheets, more preferably 7 or more sheets, more preferably 8 or more sheets, more preferably 9 sheets or more, more preferably 10 sheets or more, more preferably 11 sheets or more, more preferably 12 sheets or more, even more preferably is 13 or more, particularly preferably 14 or more. The number of reflective surfaces 14 is not particularly limited, but from the viewpoint of the design of the optical semiconductor device, ease of manufacture, etc., it is preferably 30 or less, more preferably 25 or less, and even more preferably 20 or less.

The n reflective surfaces 14 may have the same (congruent) shape, or may all have different shapes. From the viewpoint of reducing collisions between reflected lights and improving brightness and uniformity of light, it is preferable that all the shapes are different.

The shape of the opening 12 of the recess 13 (that is, the shape of the opening end of the recess 13) is approximately an n-gon that satisfies the following conditions (1) and (2).
(1) All internal angles of the substantially n-gon are obtuse angles (hereinafter referred to as condition (1)).
(2) All sides of the substantially n-gon are not parallel to each other (hereinafter referred to as condition (2)).

Here, "n" of the approximately n-gon is the same integer as the number of reflective surfaces 14 (n) described above. For example, when the inner wall of the recess 13 has six reflective surfaces 14, the shape of the opening 12 is approximately hexagonal. Furthermore, the term "approximately n-gon" refers to an n-gon or a shape close to the n-gon, such as a shape in which all or some of the corners of an n-gon are rounded.

In the resin molded body 1 for a semiconductor device, the shape 16 formed by an arbitrary surface parallel to the opening 12 and the inner wall of the recess 13 is a substantially n-gon shape that is substantially similar to the opening 12 of the recess 13 . An arbitrary plane parallel to the opening 12 is an imaginary plane that cuts the resin molded body 1 for a semiconductor device in a direction horizontal to the opening 12, and the shape 16 is a line where the plane intersects with the inner wall of the recess 13. It is a shape that is composed of The shape 16 having a substantially n-gon shape that is substantially similar to the opening 12 includes cases where the shape 16 is similar to the opening 12 and cases where the shape 16 is close to the similar shape to the opening 12. When the shape 16 is close to a similar shape to the opening 12, for example, the opening 12 is an n-gon, and the shape 16 is similar to the n-gon, with all or part of the corners rounded. When referring to a shape, it is meant to include a case where the shape 16 is an n-gon, the opening 12 is a similar shape to the n-gon, and all or some of the corners are rounded.

Since the opening 12 and the shape 16 are in a substantially n-gonal relationship with substantially similar shapes, it is specified that the conditions (1) and (2) are satisfied on the entire surface of the n reflective surfaces 14. It is something.

The condition (1) stipulates that all internal angles of the substantially n-gon shape that defines the opening 12 and the shape 16 are obtuse angles, that is, angles that are greater than 90° and less than 180°. According to condition (1), even if the light reflected by one of the two adjacent reflecting surfaces 14 is further reflected by the other reflecting surface, the reflected light will not be parallel to the incident light. Therefore, as long as condition (1) is satisfied, collisions between reflected lights are reduced, and brightness and uniformity of light can be improved.
When the approximately n-gon has a shape similar to an n-gon (a shape in which all or some of the corners of the n-gon are rounded), an interior angle is an angle formed by extension lines of adjacent sides of the approximately n-gon.

All internal angles of the approximately n-gon are not particularly limited as long as they are greater than 90° and less than 180°, but from the viewpoint of reducing collisions between reflected lights and improving brightness and uniformity of light, preferably 95° degree or more, more preferably 100 degrees or more, more preferably 110 degrees or more, more preferably 120 degrees or more, more preferably 120 degrees or more, more preferably 130 degrees or more, more preferably 140 degrees or more, more preferably 150 degrees. The angle is more preferably 160° or more.

The condition (2) stipulates that all sides of the substantially n-gon shape that defines the opening 12 and the shape 16 are not parallel to each other. Condition (2) makes it possible to minimize collisions between the lights reflected by the two reflective surfaces 14 located in opposing positions within the recess 13. Therefore, as long as condition (2) is satisfied, collisions between reflected lights are reduced, and brightness and light uniformity can be improved.

The approximately n-gon shape that defines the opening 12 and the shape 16 may have a symmetrical shape or an asymmetrical shape as long as the above conditions (1) and (2) are satisfied. Asymmetrical is preferred from the point of view of reducing collisions and improving brightness and light uniformity.

In the resin molded body 1 for a semiconductor device, it is preferable that the bottom surface 15 of the recess 13 has a substantially n-gon shape that is substantially similar to the opening 12 of the recess 13 . The meaning of "substantially similar n-gon shape" is the same as above.
Further, the area of the opening 12 of the recess 13 is preferably larger than the area of the bottom surface 15 of the recess 13. Further, it is preferable that the area of the shape 16 gradually decreases from the opening 12 of the recess 13 to the bottom surface 15.
The preferred embodiment defines a mode in which the n reflective surfaces 14 are inclined so that the concave shape spreads from the bottom surface 15 of the concave portion 13 to the opening 12. According to the preferred embodiment, light is easily reflected upward, and collisions between reflected lights can be reduced, and brightness and light uniformity can be improved.

4 to 6 are schematic views showing a resin molded body 2 for an optical semiconductor device according to another embodiment of the present invention. FIG. 4 is a plan view of the resin molded body 2 for an optical semiconductor device according to the embodiment, and FIG. 5 is a sectional view of the resin molded body 2 for an optical semiconductor device along the dotted line YY' in FIG. , FIG. 6 is a back view of the resin molded body 2 for an optical semiconductor device.

The resin molded body 2 for an optical semiconductor device according to the present embodiment is integrated (integrated molding) with the resin molded body 1 for a semiconductor device and a first lead 21 and a second lead 22 which are spaced apart from each other. That is, the resin molded body 2 for an optical semiconductor device is a resin body molded, for example, by insert molding, with the first lead 21 and the second lead 22 partially incorporated therein.
In the resin molded body 2 for an optical semiconductor device, the first lead 21 and the second lead 22 form a pair of terminals for external connection in the optical semiconductor device.

As shown in FIGS. 4 to 6, the lead 21 (first lead) has an exposed surface 21a (first exposed surface) that faces the recess 13 of the resin molded body 2 for an optical semiconductor device and forms a part of the bottom surface 15 of the recess 13. ), and has an exposed surface 21b (second exposed surface) exposed on the side opposite to the recess 13. Further, the lead 21 has an electrode portion 21c extending outside from the resin molded body 2 for an optical semiconductor device. The extension length of the electrode portion 21c from the resin molded body 2 for optical semiconductor device is, for example, 0.1 to 2 mm. In this manner, the lead 21 is held while being partially covered by the resin molded body 2 for an optical semiconductor device.

As shown in FIGS. 4 to 6, the lead 22 (second lead) has an exposed surface 22a (facing the recess 13) at a position separated from the exposed surface 21a on the bottom surface 15 of the recess 13 of the resin molded body 2 for an optical semiconductor device. and an exposed surface 22b (fourth exposed surface) exposed on the side opposite to the recess 13. Further, the lead 22 has an electrode portion 22c extending outside from the resin molded body 2 for an optical semiconductor device. The extending length of the electrode portion 22c from the resin molded body 2 for optical semiconductor device is, for example, 0.1 to 2 mm. In this manner, the lead 22 is held while being partially covered by the resin molded body 2 for an optical semiconductor device.

The above structure of the lead 21 and the lead 22 of this embodiment allows the area of the electrodes (exposed surface 21a, exposed surface 21b, exposed surface 22a, exposed surface 22b, etc.) to be increased, so that heat can be easily dissipated and thermal resistance can be reduced. This is preferable because it can be made smaller.

The leads 21 and 22 are each made of a conductive metal material. Examples of the metal material for the lead include Cu, Cu alloy, and 42% Ni--Fe alloy. Further, the thickness of each of the leads 21 and 22 is, for example, 0.1 to 0.3 mm. Such leads 21 and leads 22 can be formed, for example, by etching or punching a metal plate. The surfaces of the leads 21 and 22 may be subjected to a predetermined plating process such as Ag plating process.

In the resin molded article 2 for optical semiconductor devices, the areas of the exposed surfaces 21a and 22a of the leads 21 and 22 within the recess 13 are preferably 50% or more of the area of the bottom surface 15 within the recess 13, and more preferably is 60% or more, more preferably 70% or more, even more preferably 80% or more, particularly preferably 85% or more. Such a configuration is preferable because the area of the electrode is increased, heat can be easily dissipated, and thermal resistance can be reduced. The area of the exposed surface 21a and the exposed surface 22a is preferably 95% or less, more preferably 90% or less of the area of the bottom surface 15 within the recess 13. Such a configuration is suitable for sufficiently separating the exposed surface 21a and the exposed surface 22a and for securing the area of a region having light reflectivity in a part of the bottom surface 15 of the recess 13. This is suitable for achieving high light utilization efficiency in the device.

Such a resin molded body 2 for an optical semiconductor device is manufactured, for example, by the following so-called line molding method. First, a predetermined lead frame is prepared. This lead frame has a frame body that is rectangular in plan view, and a pattern portion having a predetermined pattern shape for each optical semiconductor device formation area that is lined up in the frame body. The pattern portion includes a lead portion that forms the leads 21 and 22 described above, a connecting portion that connects the lead portion and the frame, and a connecting portion that connects the lead portions. Such a lead frame can be produced, for example, by etching. Next, the above-mentioned resin molded body 2 for an optical semiconductor device is formed in each optical semiconductor device forming area of the lead frame. Specifically, the lead frame is interposed between a set of molds having a molding surface for collectively molding a plurality of resin molded bodies 2 for optical semiconductor devices over a plurality of optical semiconductor device forming areas in the lead frame. After the mold is clamped, the above-mentioned thermosetting resin composition containing a white pigment for forming the resin molded article 2 for an optical semiconductor device is supplied into the mold and molded under predetermined temperature and pressure conditions. (Insert molding). As a result, the resin molded body 2 for an optical semiconductor device with the above-described recess 13 is formed in each optical semiconductor device forming area. As the molding method, for example, transfer molding or injection molding is adopted.

7 and 8 are schematic diagrams showing an optical semiconductor device 3 according to one embodiment of the present invention. FIG. 7 is a plan view of the optical semiconductor device 3 according to this embodiment, and FIG. 8 is a cross-sectional view of the optical semiconductor device 3 taken along the dotted line ZZ' in FIG.

The optical semiconductor device 3 according to the present embodiment includes an optical semiconductor element 31 and a resin molded body 2 for an optical semiconductor device, in which the optical semiconductor element 31 is mounted on the exposed surface 21a of the lead 21 and 22a via a bonding wire 32. The recess 13 of the optical semiconductor element 31 may be sealed with a transparent resin part 33. In this embodiment, the optical semiconductor device 3 is formed in the form of a so-called molded array package (MAP).

The optical semiconductor element 31 is an element having a light emitting function, and in this embodiment, is specifically a light emitting diode (LED) element. Examples of semiconductor materials for forming the LED element include GaAlAs, AlInGaP, InGaN, GaP, GaAs, and GaAsP. Further, in this embodiment, the optical semiconductor element 31 has electrode portions (not shown) on the upper surface side and the lower surface side in FIG. 8, respectively.

The optical semiconductor element 31 is a transparent resin body filled in the recess 13 of the optical semiconductor device 3 and cured, and is made of a transparent semiconductor sealing material. Such sealing materials include, for example, epoxy sealants and silicone sealants. Examples of commercially available epoxy sealants include "CELVENUS W0973" and "CELVENUS W0925" manufactured by Daicel Corporation. Commercially available silicone sealing materials include, for example, "CELVENUS A2045" and "CELVENUS A0246" manufactured by Daicel Corporation.

Such an optical semiconductor device 3 is manufactured by the above-mentioned line molding method. First, a resin molded body 2 for an optical semiconductor device is manufactured by the method described above. Thereafter, in the recess 13 of each optical semiconductor device formation area, the optical semiconductor element 31 is mounted on the above-mentioned exposed surface 21a of the lead 21 via the conductive bonding material, and the optical semiconductor element 31 and the above-mentioned exposed surface of the lead 22 are mounted. 22a, and the above-described transparent resin portion 33 is formed by, for example, potting. Next, for each optical semiconductor device forming area, the above-mentioned connection portion of the pattern portion of the lead frame is cut to separate the leads 21 and 22, and the optical semiconductor device 3 is isolated. For example, the optical semiconductor device 3 can be manufactured as described above.

When the optical semiconductor device 3 is driven, a predetermined electric power is supplied to the optical semiconductor element 31 via the leads 21 and 22, thereby causing the optical semiconductor element 31 to emit light. A part of the light emitted from the optical semiconductor element 31 is reflected within the recess 13 of the resin molded body 2 for an optical semiconductor device, and another part of the light emitted from the optical semiconductor element 31 is reflected within the recess 13. The light passes through the transparent resin portion 33 and is emitted to the outside of the recess 13 without passing through the transparent resin portion 33 .

As described above, most of the light emitted from the optical semiconductor element 31 is repeatedly reflected on the reflective surface 14 of the recess 13 and is emitted to the outside of the recess 13 . The optical semiconductor device 3 of this embodiment is suitable in that it can reduce collisions between reflected lights and improve brightness and uniformity of light.

In the optical semiconductor device 3 , the optical semiconductor element 31 is preferably connected to a substantially central portion of the bottom surface 15 of the recess 13 . This configuration is preferable from the viewpoint that the light emitted from the optical semiconductor element 31 is uniformly reflected by the n reflective surfaces 14, reducing collisions between the reflected lights and improving brightness and uniformity of light.

When the optical semiconductor element 31 is connected to the substantially central portion of the bottom surface 15, it is intended that the optical semiconductor element 31 be arranged so that the center (center of gravity) of the bottom surface 15 and at least a portion of the entire surface of the optical semiconductor element 31 overlap. It is more preferable to arrange the optical semiconductor element 31 so that the center (center of gravity) of the optical semiconductor element 31 and the center (center of gravity) of the bottom surface 15 coincide with each other.

In the n reflective surfaces 14 forming the inner wall of the recess 13 of the optical semiconductor element 31, the substantially n-gon shape defining the opening 12 and the shape 16 satisfies the conditions (1) and (2), so that the optical semiconductor The light emitted from the element 31 is repeatedly reflected in a very complicated manner by the n reflecting surfaces 14 and then emitted to the outside of the recess 13 . Therefore, attenuation (loss) due to collision between reflected lights is minimized, and brighter light is emitted. Further, the reflected light reaches every corner inside the recess 13 and is emitted as uniform light without dead space.

1, 2 Resin molded body for optical semiconductor device 10 Front surface 11 Back surface 12 Opening of the recess 13 Recess 14 Reflective surface of the inner wall of the recess 15 Bottom surface of the recess 16 Shape 21 formed by a surface parallel to the opening and the inner wall of the recess Lead ( 1st lead)
22 Lead (2nd lead)
21a Exposed surface (first exposed surface)
21b Exposed surface (second exposed surface)
22a Exposed surface (third exposed surface)
22b Exposed surface (4th exposed surface)
21c, 22c Electrode part 3 Optical semiconductor device 31 Optical semiconductor element 32 Bonding wire 33 Transparent resin part

Claims (9)

A resin molded body for an optical semiconductor device,
having a front surface and a back surface facing opposite to each other in the thickness direction,
The surface has a concave portion recessed from the opening toward the back surface,
The recess has n reflective surfaces (n is an integer of 5 or more) on an inner wall and a bottom surface,
The shape of the opening of the recess is approximately an n-gon (n is the same integer as n) that satisfies the following conditions (1) and (2),
(1) All interior angles of the substantially n-gon are obtuse angles.
(2) All sides of the substantially n-gon are not parallel to each other.
The substantially n-gon has an asymmetric shape,
A resin molded body for an optical semiconductor device, wherein a shape formed by an arbitrary plane parallel to the opening and an inner wall of the recess is a substantially n-gon shape that is substantially similar to the opening of the recess. 2. The resin molded article for an optical semiconductor device according to claim 1, wherein the bottom surface of the recess has a substantially n-gon shape that is substantially similar to the opening of the recess. The resin molded article for an optical semiconductor device according to claim 1 or 2, wherein the area of the opening of the recess is larger than the area of the bottom surface of the recess. 4. The optical semiconductor according to claim 1, wherein an area of a shape formed by an arbitrary plane parallel to the opening and a side surface of the recess gradually decreases from the opening to the bottom of the recess. Resin molded body for equipment. The resin molded article for an optical semiconductor device according to any one of claims 1 to 4, which is integrated with a first lead and a second lead that are spaced apart from each other. The first lead has a first exposed surface forming a part of the bottom surface of the recess of the resin molded article for an optical semiconductor device, and is exposed on a side opposite to the first exposed surface. having a second exposed surface;
The second lead forms a part of the bottom surface of the recess of the resin molded article for an optical semiconductor device, and has a third exposed surface separated from the first exposed surface, and the third exposed surface 6. The resin molded article for an optical semiconductor device according to claim 5, having a fourth exposed surface exposed on the opposite side. 7. The resin molded article for an optical semiconductor device according to claim 6 , wherein the first lead and the second lead each have an electrode portion extending outward from the resin molded article for an optical semiconductor device. an optical semiconductor element;
Comprising a resin molded body,
The resin molded body is a resin molded body for an optical semiconductor device according to claim 6 or 7,
An optical semiconductor device, wherein the optical semiconductor element is mounted on the first exposed surface of the first lead and connected to the third exposed surface of the second lead via a bonding wire. 9. The optical semiconductor device according to claim 8, wherein the optical semiconductor element is connected to a substantially central portion of the bottom surface of the recess.

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