JP7396849B2 - tape pasting device - Google Patents

Description

The present invention relates to a tape adhering device for adhering tape to a ring frame and a wafer.

For example, as disclosed in Patent Document 1, a circular tape (for example, dicing tape) is attached to a ring frame provided with a circular opening to close the opening, and a wafer is attached to the tape exposed from the opening, There is a tape pasting device that integrates a ring frame and a wafer with tape.

In the above-mentioned tape adhering device, a tape unit is used in which circular tapes are arranged and adhered at equal intervals in the longitudinal direction of a strip-shaped protective sheet and are integrated. This tape unit is wound around a tube in the form of a roll with the circular tape inside. Then, with the roll-shaped tape unit having a winding tube inserted through the shaft of the tape applicator, the sheet is grasped and pulled out from the outer edge of the roll tape, and the sheet is turned inward against the peel plate. Peel the edge of the tape from the sheet while pressing the peel plate and bending it.

Next, position the end of the circular tape peeled off from the sheet on top of the ring frame, press the tape against the ring frame with a rolling roller, stick the end of the tape to the ring frame, and then peel off the sheet while applying the tape. It is pressed with a roller and adhered to the surfaces to be adhered, which are the upper surface of the wafer and the upper surface of the ring frame.

Japanese Patent Application Publication No. 2011-086687

At this point, the tape is peeled off from the sheet at the height of the tip of the peel plate that is pressed against the sheet, so in order to prevent air bubbles from entering between the tape and the surface of the ring frame or wafer to which it is attached, It is better to place the peel plate close to the surface to be adhered.

However, when the peel plate is brought close to the surface to be adhered, a gap is created between the tip of the peel plate and the side surface of the roller, and this gap causes the tape to loosen, causing the tape attached to the ring frame and wafer to become loose. There is a problem that the tension is not uniform. That is, the tension at the beginning of applying the tape is weak and then becomes uniform, resulting in uneven tension overall. Furthermore, depending on the type of tape, wrinkles may occur between the ring frame and the wafer. If the tension of the attached tape is not uniform, there will be problems such as when the tape is expanded and the wafer is divided, the chips will come into contact with each other and chips will be chipped. There is a problem with the tape peeling off the frame.

Therefore, in the tape adhering apparatus, there is a problem of adhering a circular tape to a ring frame and a wafer so as not to introduce air bubbles, and also to make the tension of the applied tape uniform.

In order to solve the above problems, the present invention is a band-shaped tape unit in which circular tapes are lined up and stuck in the longitudinal direction of a band-shaped sheet, and the tape is peeled off from the sheet and placed in a ring frame and an opening of the ring frame. A tape adhering device that integrates the ring frame and the wafer with the tape, the tape adhering device comprising: a ring frame holding portion that holds the ring frame; a holding means consisting of a wafer holding part that holds a wafer; a feeding unit that rotates and feeds out the tape unit; a winding unit that rotates and winds up the sheet from which the tape has been peeled; the feeding unit and the tape unit; a peel plate that contacts the sheet and bends the tape unit with the sheet inside to peel the tape from the sheet; and a peel plate that peels the tape peeled from the sheet between the ring frame and the wafer. an adhesion roller that adheres while pressing against the adhesion roller; a roller core that penetrates from the center of one end surface of the adhesion roller to the center of the other end surface; a DC power supply that supplies DC power to the roller core; Further, by forming the adhering roller with an insulator and supplying DC power to the roller core material, the surface portion of the adhering roller is charged with the electrically charged tape that has been peeled off from the sheet. The tape is equipped with a charging means that charges an opposite charge, and the tape, which is charged by being peeled off from the sheet at the tip of the peel plate, is stuck to the surface of the sticking roller using static electricity, and the tape is rolled. This is a tape sticking device that sticks the tape to the ring frame and the wafer using the sticking roller.

The tape sticking device according to the present invention includes a sticking roller made of an insulator, and a charging means for charging the surface portion of the sticking roller with an electric charge opposite to the electric charge of the tape that is charged when the tape is peeled off from a sheet. The tape, which is electrically charged after being peeled off from the sheet at the tip of the peel plate, is stuck to the outer surface of the sticking roller using static electricity, and the rolling sticking roller attaches the tape to the ring frame and the wafer. By attaching the tape to the ring frame, the tape (for example, dicing tape) that has been peeled off from the sheet is attached along the surface of the adhesion roller, preventing air bubbles from entering and applying uniform tension to the ring frame. Tape can be attached to the wafer and the wafer. Therefore, when the wafer is divided and the tape is expanded, it is possible to prevent adjacent divided chips from coming into contact with each other and chip chipping.

FIG. 2 is a perspective view showing an example of a tape unit wound into a roll. It is a perspective view showing an example of a tape pasting device. FIG. 2 is a side view illustrating a state in which a tape, which is electrically charged by being peeled off from a sheet at the tip of a peel plate, is stuck to a surface portion of a sticking roller using static electricity in the tape sticking device. FIG. 3 is a side view illustrating a state in which the tape is started to be attached to a ring frame and a wafer in a state in which the tape is attached to the surface of the attachment roller using static electricity in the tape attachment apparatus. FIG. 3 is a side view illustrating a state in which the tape is stuck to the surface of the sticking roller using static electricity and the tape is finished being stuck to the ring frame and the wafer in the tape sticking device. FIG. 3 is a side view illustrating a state in which static electricity is removed from the tape after the tape has been pasted onto the ring frame and the wafer in the tape pasting apparatus.

The tape unit TU shown in FIG. 1 includes a strip-shaped tape T5 composed of a base material T51 made of, for example, polyolefin resin, an adhesive layer T52 formed on one surface of the base material T51, and an adhesive layer T52. It has a structure in which a band-shaped protective sheet T1 (hereinafter referred to as sheet T1) that protects the is pasted together.
The strip tape T5 shown in this embodiment is pre-cut in a plurality of circular shapes according to the diameter of the opening of the annular plate-shaped ring frame F (see FIG. 2) to be pasted, and is attached to the wafer W on the sheet T1. A plurality of circular tapes T2 corresponding to the circular shape are adhered to the sheet T1 at equal intervals in the longitudinal direction (X-axis direction in FIG. 1). As shown in FIG. 1, the tape unit TU is in the form of a roll tape wound around a cylinder T3 with the tape T2 inside. Note that the tape T2 has a diameter larger than the inner diameter of the circular opening of the ring frame F (see FIG. 2) and smaller than the outer diameter of the ring frame F.

The tape adhering device 1 according to the present invention shown in FIG. An integrated work set can be formed using the tape T2.

As shown in FIG. 2, the ring frame F is made of a predetermined metal (for example, SUS, etc.), has an annular flat plate shape, and has a circular opening with an inner diameter larger than the outer diameter of the wafer W. There is. Further, the ring frame F is provided with a pair of first flat surfaces and a pair of second flat surfaces that face each other in parallel by, for example, cutting out a part of its outer circumference flatly. The flat surface and the pair of second flat surfaces are used for positioning the ring frame F.

The wafer W is, for example, a circular semiconductor wafer made of a silicon base material or the like, and the surface Wa (lower surface Wa) of the wafer W facing downward in FIG. It is protected by a protective tape (not shown) attached thereto. The back surface Wb (upper surface Wb) of the wafer W is the surface to which the tape T2 is attached. Note that the wafer W may be made of gallium arsenide, sapphire, gallium nitride, ceramics, resin, silicon carbide, or the like other than silicon, or may be a rectangular package substrate or the like.

The upper surface of the base 10 of the tape applicator 1 is a horizontal plane, and above the rear side (+X direction side) of the base 10, a feeding unit 80 that rotates and feeds out the tape unit TU is arranged. There is. The feeding unit 80 rotatably supports the tape unit TU in a state where a rotary shaft whose axial direction is the Y-axis direction is inserted into the cylinder T3 of the tape unit TU in a roll shape as shown in FIG. . As the rotary shaft rotates, the roll-shaped tape unit TU rotates, and the tape unit TU is fed out toward the peel plate 15 in the form of a band. Note that a nipping roller (not shown) or the like is provided between the peel plate 15 and the feeding unit 80 to prevent the tape unit TU from becoming loose.

A winding unit 82 that rotates and winds up the sheet T1 from which the tape T2 has been peeled off is disposed at a position below and rearward of the feeding unit 80, and a winding unit 82 is disposed at a position diagonally below the front of the feeding unit 80. A peel plate 15 is provided between the feeding unit 80 and the winding unit 82, which contacts the sheet T1, bends the tape unit TU with the sheet T1 inside, and peels the tape T2 from the sheet T1.

The peel plate 15 is, for example, a swash plate that has a triangular shape in side view when viewed from the Y-axis direction, and extends in the Y-axis direction with a length equal to or greater than the width (Y-axis direction length) of the sheet T1. There is. The tip end side of the peel plate 15 may be rounded in an R shape so as not to damage the tape unit TU. As shown in FIGS. 3 and 4, the tape T2 can be peeled off from the sheet T1 by the peel plate 15 pressing the sheet T1 at its leading end and bending it at an acute angle.

For example, as shown in FIG. 3, the peel plate 15 extends obliquely upward in opposition to a sticking roller 30 that presses and sticks the tape T2 peeled from the sheet T1 onto the ring frame F and the wafer W. It is arranged on a plate base 160 via a plate movable member 161. The plate movable member 161 can reciprocate diagonally up and down on the plate base 160 by a ball screw mechanism (not shown) or the like, thereby making it possible to appropriately position the peel plate 15 with respect to the tape unit TU. In addition, in FIG. 2, the plate base 160 and the plate movable member 161 that move the peel plate 15 are omitted.

As shown in FIG. 2, the sheet T1 from which the tape T2 has been peeled off by the peel plate 15 is sent to the rear of the peel plate 15 (in the +X direction). The sheet T1 is then wound into a roll by a winding unit 82 that rotates around a rotation axis in the Y-axis direction by a rotational drive source such as a motor. The rotational drive source of the winding unit 82 controls the speed at which the sheet T1 is pulled out from the roll-shaped tape unit TU, for example, by torque control. Note that a sheet support roller 820 is disposed between the winding unit 82 and the peel plate 15, and the sheet support roller 820 prevents the sheet T1 from which the tape T2 has been peeled off from loosening.

As shown in FIG. 2, the tape sticking device 1 includes a holding means 2 consisting of a ring frame holding section 20 that holds a ring frame F and a wafer holding section 21 that holds a wafer W within an opening of the ring frame F; It includes a sticking roller 30 that presses and sticks the tape T2 peeled from the sheet T1 onto the ring frame F and the wafer W.

The ring frame holder 20 shown in FIGS. 2 and 3 is, for example, formed in a square shape in plan view, and accommodates the wafer holder 21 in a recess 200 formed at the center thereof. The upper surface 20a of the ring frame holding part 20 is a flat ring frame holding surface. The upper surface 20a of the ring frame holding part 20 is provided with, for example, four (not shown) suction cup accommodating parts each having an opening and a concave shape. A suction cup 25 (only shown in FIG. 2) capable of suctioning the ring frame F is disposed in each of these four suction cup accommodating portions (not shown). The suction cup 25 is, for example, made of a deformable elastic material such as rubber and formed into a circular shape in plan view. Each suction cup 25 communicates with a suction source (not shown) such as a vacuum generator.
Note that the outer shape, structure, etc. of the ring frame holding portion 20 are not limited to those of this embodiment.

On the upper surface 20a of the ring frame holding section 20, there is a first fixed positioning section 23 made of a fixed pin or the like for positioning (centering) the ring frame F on the upper surface 20a; A first movable positioning section 24 consisting of opposing movable pins or the like is arranged. Further, a second fixed positioning part 26 and a second movable positioning part 27 facing the second fixed positioning part 26 are arranged on the upper surface 20a.
For example, the direction in which the first fixed positioning part 23 and the first movable positioning part 24 face each other and the direction in which the second fixed positioning part 26 and the second movable positioning part 27 face each other are substantially orthogonal to each other. There is.

In this embodiment, at least one of the first fixed positioning part 23 and the first movable positioning part 24, and the second fixed positioning part 26 and the second movable positioning part 27 is attached to the ring frame F. The ring frame F is positioned (centered) at a target position on the upper surface 20a of the ring frame holding part 20, sandwiching at least one of the pair of first flat surfaces and the pair of second flat surfaces on the outer periphery. Thereafter, the ring frame F is sucked and held by each suction cup 25.

The wafer holding part 21 shown in detail in FIG. 3 has, for example, a circular outer shape and a suction part 210 that is made of a porous material or the like and attracts the wafer W, and a concave longitudinal section that supports the suction part 210. A frame body 211 is provided. The suction portion 210 fitted into the recess of the frame 211 communicates with a suction source (not shown). The suction force generated by the suction source is transmitted to the flat holding surface 210a, which is the upper surface of the suction section 210, so that the wafer holding section 21 suction-holds the wafer W on the holding surface 210a.

For example, when the wafer W is held by the holding surface 210a of the wafer holding part 21 and the ring frame F is held by the top surface 20a of the ring frame holding part 20, the height of the top surface 20a of the ring frame holding part 20 is as follows. The upper surface of F and the upper surface Wb of wafer W are set to be approximately at the same height.

As shown in FIG. 2, a holding means moving means 13 for reciprocating the wafer holding section 21 and the ring frame holding section 20 in the X-axis direction is disposed on the base 10. The holding means moving means 13 includes a ball screw 130 having an axis in the X-axis direction, a guide rail 131 arranged parallel to the ball screw 130, and a motor 132 connected to the ball screw 130 and rotating the ball screw 130. , a nut (not shown) provided on the lower surface of the ring frame holding portion 20 is screwed onto the ball screw 130. Then, when the motor 132 rotates the ball screw 130, the wafer holding section 21 and the ring frame holding section 20 are guided by the guide rail 131 and reciprocate in the X-axis direction.

As shown in FIG. 2, a sticking roller 30 is disposed above the movement path of the ring frame holding part 20 and near the tip of the peel plate 15 that has been lowered to the sticking position. There is. The sticking roller 30 has, for example, a length equal to or longer than the width of the ring frame holding part 20 in the Y-axis direction, and is rotatably supported by a roller frame and a roller core material 32 (not shown). The sticking roller 30 crosses the ring frame holding section 20 in the Y-axis direction, and is movable in the vertical direction by a roller vertical movement means 31 (see FIG. 3).

The sticking roller 30 is made of an insulator such as PVC or silicone rubber and is formed into a cylindrical shape. The roller core material 32 inserted through the pasting roller 30 is made of metal such as aluminum or steel and has electrical conductivity.

When the circular tape T2 attached to the sheet T1 shown in FIG. 2 is peeled off, charging may occur. This is a phenomenon called peel-off charging, and if this occurs, the tape T2 after being peeled off will be charged with, for example, a positive (+) charge, and the sheet T1 will be charged with a negative (-) charge. Note that the reason why the tape T2 is charged to, for example, (+) is a conventionally known charging sequence, and the tape T2 is often made of a material that has a stronger tendency to be charged to (+) than the sheet T1. It's for a reason.

Therefore, the tape adhering device 1 applies an electric charge (( -) is provided with a charging means for charging the electric charge.

In this embodiment, the charging means is, for example, the DC power supply 39 shown in FIG. 2. The DC power source 39 is connected to a roller core material 32 inserted through the pasting roller 30 .

The charging means may be, for example, the ionizer 6 shown in FIG. 2. The ionizer 6 is, for example, a nozzle type pulse AC type one, but is not limited thereto. As shown in FIGS. 2 and 3, the ionizer 6 communicates with the ionization nozzle 60, which is disposed so that the air injection port 60a faces the outer peripheral surface of the sticking roller 30, for example. An air source 61 is provided.
In the example shown in FIG. 2, the ionization nozzle 60 of the ionizer 6 extends in the Y-axis direction with approximately the same length as the adhesive roller 30, and ionizes the surface of the adhesive roller 30 from end to end. Although air can be blown, the invention is not limited to this.

Generally, an ionizer is used to eliminate static electricity from a predetermined object, and is used to generate approximately the same amount of (+) charged ionized air and (-) charged ionized air. On the other hand, in the ionizer 6 of this embodiment, air is supplied from the air source 61 to the ionization nozzle 60, and the ionization nozzle 60 generates (-) charged ionized air and sprays it onto the sticking roller 30. The sticking roller 30 is charged with a (-) charge opposite to the (+) charge of the tape T2.
Note that the tape sticking device 1 may be provided with at least one of the DC power source 39 and the ionizer 6 as a charging means.

An example of the operation of the tape sticking device 1 shown in FIG. 2 will be described below.
First, the wafer W is placed on the wafer holding part 21 of the holding means 2 with their centers substantially aligned with each other, and the ring frame F is placed on the ring frame holding part 20. Subsequently, a suction source (not shown) is activated, and the wafer W is suction-held on the holding surface 210a of the wafer holding section 21, and the ring frame F is suction-held on the upper surface 20a, which is the holding surface of the ring frame holding section 20.

Further, the feeding unit 80 feeds out the tape unit TU toward the peel plate 15 while rotating.

For example, a DC power supply 39 shown in FIG. 3, which is a charging means, charges the sticking roller 30 to (-). That is, power is supplied from the DC power supply 39 to the roller core material 32 via wiring, and the roller core material 32, which is a charged body, is charged (-). As a result, an electric field is applied to the adhesive roller 30, and the electrons in the molecules and atoms within the adhesive roller 30 formed of an insulator receive an electrostatic force, and unlike conductors, these electrons are free electrons that can move freely. Therefore, a bias in charge occurs in each molecule or atom, and a bias in charge occurs in the sticking roller 30 as a whole. As a result, a (+) charge opposite to that of the charged body is generated on the side of the adhesive roller 30, which is an insulator, near the roller core material 32, and a (-) charge is generated on the side of the surface part away from the roller core material 32. occurs. That is, due to the dielectric polarization, the surface portion of the sticking roller 30 becomes negatively charged (-) as shown in FIG.

Instead of the DC power supply 39 shown in FIG. 3, for example, the ionizer 6, which is a charging means, may charge the surface portion of the sticking roller 30 to (-). That is, in the ionizer 6, air is supplied from the air source 61 to the ionization nozzle 60, and the ionization nozzle 60 generates (-) charged ionized air, which is sprayed onto the sticking roller 30, and the surface portion of the sticking roller 30 is is charged with a (-) charge.

In this state, the holding means moving means 13 moves the holding means 2 in, for example, the -X direction, so that the ring frame holding section 20 holding the ring frame F is positioned directly below the sticking roller 30. After that, the sticking roller 30 is lowered by the roller vertical movement means 31, and the sticking roller 30 is moved from the stop height position when sticking the tape T2 to the ring frame F held by the ring frame holding part 20. Position it slightly upward.

Further, as shown in FIG. 3, the plate movable member 161 on which the peel plate 15 is disposed moves to the lower end side of the plate base 160, so that, for example, the tip of the peel plate 15 and the outer periphery of the sticking roller 30 The tape unit TU is now passing through the gap with the side surface. Note that the gap is small enough to allow the tape unit TU to pass through. Further, the tip of the peel plate 15 contacts and presses the sheet T1 of the tape unit TU, thereby bending the tape unit TU with the sheet T1 inside to form an acute angle. Then, the tape T2 is peeled off from the tape unit TU, and the tape T2 is fed below the sticking roller 30.

The DC power supply 39 or the ionizer 6, which is a charging means, applies a (-) charge opposite to the (+) charge of the tape T2 that was charged when it was peeled off from the sheet T1 onto the surface of the adhesive roller 30 made of an insulator. Since the tape T2 is electrically charged, the tape T2, which has been peeled off from the sheet T1 at the tip of the peel plate 15 and has been electrically charged (+), sticks to the surface of the sticking roller 30 due to static electricity.

As shown in FIG. 3, the sticking roller 30 rotates at a predetermined rotational speed with the tape T2 stuck to the surface of the sticking roller 30 using static electricity. Further, as the pasting roller 30 is lowered to the pasting height position when pasting the tape by the roller vertical movement means 31, the ring frame F held by the ring frame holding part 20 is moved as shown in FIG. Tape T2 is pressed from one side.

As shown in FIG. 4, the ring frame holding section 20 and the wafer holding section 21 are sent out in the -X direction by the holding means moving means 13, and the rotating sticking roller 30 moves the ring frame holding section 20 and the wafer holding section 21 toward the wafer W and ring frame F. The tape T2 sent by the sending unit 80 is pressed.
Further, the winding unit 82 winds up the sheet T1 from which the tape T2 has been peeled off.

Then, while pressing the tape T2 with the sticking roller 30, as shown in FIGS. A piece of tape T2 can be attached to the ring frame F, and a work set can be created in which the wafer W and the ring frame F are integrated with the tape T2. Furthermore, even when the tape T2 has been pasted, as shown in FIG. Since the tape T2 is charged with the opposite (-) charge, the tape T2, which has been peeled off from the sheet T1 at the tip of the peel plate 15 and has a positive charge, is stuck to the surface of the sticking roller 30 by static electricity. The tape T2 can be attached to the wafer W and the ring frame F in the attached state, and the tape T2 is not loosened and air bubbles etc. are not mixed into the attached portion.

For example, the second ionization nozzle 72 is disposed above the holding means 2 that has been moved in the -X direction to a position past the sticking roller 30 shown in FIG. The second ionization nozzle 72 is arranged such that the air injection port 72a faces the tape T2 of the work set held by the holding means 2 in the Z-axis direction. The second ionization nozzle 72 is used to remove static electricity from the tape T2, and communicates with the air source 61, for example.

Air is supplied from the air source 61 to the second ionization nozzle 72, and from the second ionization nozzle 72 approximately the same amount of (+) charged ionized air and (−) charged ionized air are produced. It is sprayed onto the tape T2 of the work set passing below the second ionization nozzle 62, and the tape T2 is neutralized. Thereafter, the wafer W, which can be handled as a work set via the ring frame F, is transferred to, for example, a dicing apparatus by a transport means (not shown), and is subjected to dicing or the like.

As described above, the tape sticking device 1 according to the present invention has the sticking roller 30 made of an insulator, and the surface portion, which is the outer peripheral portion of the sticking roller 30, is peeled from the sheet T1 so that (+) The tape T2 is peeled off from the sheet T1 at the tip of the peel plate 15 by a charging means (for example, a DC power supply 39 or an ionizer 6) that charges the tape T2 with a (-) charge opposite to the (+) charge on the tape T2. The tape T2, which has been charged with electricity, is stuck to the surface of the sticking roller 30 using static electricity, and the rolling sticking roller 30 sticks the tape T2 to the ring frame F and the wafer W, so that it can be peeled off from the sheet T1. Since the tape T2 is applied along the surface of the adhesion roller 30, the tape is applied to the ring frame F and the wafer W with uniform tension at the beginning and end of adhesion to prevent air bubbles from entering. T2 can be pasted. Therefore, when the wafer W is divided and the tape T2 is expanded, it is possible to prevent adjacent divided chips from coming into contact with each other and chip chipping.

The tape application device 1 according to the present invention is not limited to this embodiment, and the shape of the configuration of the tape application device 1 illustrated in the attached drawings is not limited to this. It can be changed as appropriate within the range that can bring out the effects of the invention.

TU: Tape unit T1: Sheet T2: Circular tape T3: Cylinder W: Wafer F: Ring frame
1: Tape pasting device 10: Base
80: Feeding unit 82: Winding unit 820: Sheet support roller 15: Peel plate 160: Plate base 161: Plate movable member 2: Holding means 20: Ring frame holding section 21: Wafer holding section 210a: Holding surface 25: Suction cup 23: First fixed positioning part 24: First movable positioning part 26: Second fixed positioning part 27: Second movable positioning part 13: Holding means moving means 130: Ball screw 132: Motor 30: Sticking roller 31 :Roller vertical movement means 32:Roller core material
39: DC power supply as charging means 6: Ionizer as charging means 60: Ionization nozzle 61: Air source 60a: Air injection port 72: Second ionization nozzle 72a: Air injection port

Claims (1)

Peel off the tape from the sheet of a band-shaped tape unit in which circular tapes are lined up and stuck in the longitudinal direction of a band-shaped sheet, and stick it to a ring frame and a wafer placed in the opening of the ring frame, and the wafer using the tape, the tape adhering device comprising:
holding means comprising a ring frame holding part that holds the ring frame and a wafer holding part that holds the wafer within the opening of the ring frame;
a feeding unit that feeds out the tape unit while rotating;
a winding unit that rotates and winds up the sheet from which the tape has been peeled;
a peel plate that contacts the sheet between the feeding unit and the winding unit, bends the tape unit with the sheet inside, and peels the tape from the sheet;
an adhesion roller that presses and adheres the tape peeled from the sheet to the ring frame and the wafer; a roller core that penetrates from the center of one end surface of the adhesion roller to the center of the other end surface; A DC power source that supplies DC power to the roller core material ,
Furthermore, by forming the adhering roller with an insulator and supplying DC power to the roller core material, the surface portion of the adhering roller is charged with an electric charge opposite to that of the tape that is charged when it is peeled off from the sheet. It is equipped with a charging means for charging the electric charge of
The tape, which is electrically charged by being peeled off from the sheet at the tip of the peel plate, is stuck to the surface of the sticking roller using static electricity, and the rolling sticking roller attaches the tape to the ring frame. A tape sticking device that sticks the tape to the wafer.

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