JP7394150B2 - 光学モジュール及び移動端末 - Google Patents
光学モジュール及び移動端末 Download PDFInfo
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- JP7394150B2 JP7394150B2 JP2021570473A JP2021570473A JP7394150B2 JP 7394150 B2 JP7394150 B2 JP 7394150B2 JP 2021570473 A JP2021570473 A JP 2021570473A JP 2021570473 A JP2021570473 A JP 2021570473A JP 7394150 B2 JP7394150 B2 JP 7394150B2
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- 230000003287 optical effect Effects 0.000 title claims description 59
- 238000001914 filtration Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/147—Details of sensors, e.g. sensor lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14678—Contact-type imagers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Vascular Medicine (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Optical Filters (AREA)
- Image Input (AREA)
Description
本出願は、2019年6月28日に中国で提出された中国特許出願番号No.201910579374.6の優先権を主張しており、同出願の内容の全ては、ここに参照として取り込まれる。
本開示は、通信技術分野に関し、特に光学モジュール及び移動端末に関する。
コリメータ100を製造することと、
コリメータ100の一方側の表面に感光ユニット200と引き回し構造300を製造し、引き回し構造300を感光ユニット200のコリメータ100との反対側に位置させることとを含む。
110 光通過孔
200 感光ユニット
300 引き回し構造
400 回路基板
500 回線保護層
600 表示画面
700 密着剤
Claims (8)
- 光学モジュールであって、コリメータ(100)、感光ユニット(200)及び引き回し構造(300)を含み、前記感光ユニット(200)は、前記コリメータ(100)の一方側の表面に直接形成され、前記引き回し構造(300)は、前記感光ユニット(200)の前記コリメータ(100)とは反対側の表面に設けられ、
前記光学モジュールは、回線保護層(500)をさらに含み、前記回線保護層(500)は、前記引き回し構造(300)の前記感光ユニット(200)とは反対側の表面に設けられ、
前記光学モジュールは、回路基板(400)をさらに含み、前記回路基板(400)は、前記引き回し構造(300)に接続され、前記回路基板(400)と前記回線保護層(500)は、前記引き回し構造(300)の同一側に位置し、
前記引き回し構造(300)の一部は、前記回路基板(400)に密着され、前記引き回し構造(300)の別部分は、回線保護層(500)に密着される、光学モジュール。 - 前記引き回し構造(300)は、前記感光ユニット(200)に密着される、請求項1に記載の光学モジュール。
- 光フィルタリング層をさらに含み、前記光フィルタリング層は、前記コリメータ(100)の前記感光ユニット(200)とは反対側の表面に設けられる、請求項1に記載の光学モジュール。
- 光フィルタリング層をさらに含み、前記光フィルタリング層は、前記コリメータ(100)と前記感光ユニット(200)との間に設けられる、請求項1に記載の光学モジュール。
- 前記感光ユニット(200)と前記引き回し構造(300)のうちの少なくとも一つは、めっき層構造である、請求項1に記載の光学モジュール。
- 前記光学モジュールは指紋モジュールである、請求項1に記載の光学モジュール。
- 移動端末であって、表示画面(600)と、前記表示画面(600)の下に設けられた光学モジュールとを含み、前記光学モジュールは、請求項1~6のいずれか1項に記載の光学モジュールである、移動端末。
- 前記光学モジュールは、密着剤(700)によって前記表示画面(600)に密着される、請求項7に記載の移動端末。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910579374.6 | 2019-06-28 | ||
CN201910579374.6A CN110321832B (zh) | 2019-06-28 | 2019-06-28 | 光学模组及移动终端 |
PCT/CN2020/085675 WO2020259032A1 (zh) | 2019-06-28 | 2020-04-20 | 光学模组及移动终端 |
Publications (2)
Publication Number | Publication Date |
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JP2022534582A JP2022534582A (ja) | 2022-08-02 |
JP7394150B2 true JP7394150B2 (ja) | 2023-12-07 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2021570473A Active JP7394150B2 (ja) | 2019-06-28 | 2020-04-20 | 光学モジュール及び移動端末 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11881046B2 (ja) |
EP (1) | EP3992843B1 (ja) |
JP (1) | JP7394150B2 (ja) |
KR (1) | KR20220004700A (ja) |
CN (1) | CN110321832B (ja) |
WO (1) | WO2020259032A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110321832B (zh) | 2019-06-28 | 2021-05-18 | 维沃移动通信有限公司 | 光学模组及移动终端 |
CN110796097B (zh) * | 2019-10-30 | 2022-08-30 | Oppo广东移动通信有限公司 | 屏下光学指纹模组、显示屏组件和电子设备 |
Citations (2)
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CN108537171A (zh) | 2018-04-09 | 2018-09-14 | 武汉天马微电子有限公司 | 一种显示装置及其制作方法 |
CN109416737A (zh) | 2018-09-21 | 2019-03-01 | 深圳市汇顶科技股份有限公司 | 指纹识别装置和电子设备 |
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JPH0536872A (ja) * | 1991-08-02 | 1993-02-12 | Nec Corp | 混成集積回路 |
JPH05250618A (ja) * | 1992-03-05 | 1993-09-28 | Sony Chem Corp | 回転ヘッド用金属端子板の製造方法 |
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-
2019
- 2019-06-28 CN CN201910579374.6A patent/CN110321832B/zh active Active
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2020
- 2020-04-20 JP JP2021570473A patent/JP7394150B2/ja active Active
- 2020-04-20 EP EP20832796.5A patent/EP3992843B1/en active Active
- 2020-04-20 WO PCT/CN2020/085675 patent/WO2020259032A1/zh unknown
- 2020-04-20 KR KR1020217038593A patent/KR20220004700A/ko unknown
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2021
- 2021-12-14 US US17/550,757 patent/US11881046B2/en active Active
Patent Citations (2)
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CN108537171A (zh) | 2018-04-09 | 2018-09-14 | 武汉天马微电子有限公司 | 一种显示装置及其制作方法 |
CN109416737A (zh) | 2018-09-21 | 2019-03-01 | 深圳市汇顶科技股份有限公司 | 指纹识别装置和电子设备 |
Also Published As
Publication number | Publication date |
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US11881046B2 (en) | 2024-01-23 |
EP3992843A4 (en) | 2022-08-17 |
WO2020259032A1 (zh) | 2020-12-30 |
KR20220004700A (ko) | 2022-01-11 |
EP3992843B1 (en) | 2024-05-29 |
CN110321832A (zh) | 2019-10-11 |
EP3992843A1 (en) | 2022-05-04 |
JP2022534582A (ja) | 2022-08-02 |
CN110321832B (zh) | 2021-05-18 |
US20220101647A1 (en) | 2022-03-31 |
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