JP7380944B2 - 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 - Google Patents

樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 Download PDF

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JP7380944B2
JP7380944B2 JP2023501347A JP2023501347A JP7380944B2 JP 7380944 B2 JP7380944 B2 JP 7380944B2 JP 2023501347 A JP2023501347 A JP 2023501347A JP 2023501347 A JP2023501347 A JP 2023501347A JP 7380944 B2 JP7380944 B2 JP 7380944B2
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JPWO2023047783A1 (https=
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祐司 中島
和弘 橋口
俊介 平野
恵一 長谷部
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Mitsubishi Gas Chemical Co Inc
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • C08G65/485—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
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    • C—CHEMISTRY; METALLURGY
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

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  • Chemical & Material Sciences (AREA)
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  • Health & Medical Sciences (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
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JP2023501347A 2021-09-27 2022-07-22 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 Active JP7380944B2 (ja)

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JP2023179633A JP2024020213A (ja) 2021-09-27 2023-10-18 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置

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JP2021157024 2021-09-27
JP2021157024 2021-09-27
PCT/JP2022/028444 WO2023047783A1 (ja) 2021-09-27 2022-07-22 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置

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JP2023179633A Division JP2024020213A (ja) 2021-09-27 2023-10-18 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置

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JPWO2023047783A1 JPWO2023047783A1 (https=) 2023-03-30
JPWO2023047783A5 JPWO2023047783A5 (https=) 2023-08-29
JP7380944B2 true JP7380944B2 (ja) 2023-11-15

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JP2023179633A Pending JP2024020213A (ja) 2021-09-27 2023-10-18 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置

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KR (1) KR20240065286A (https=)
CN (1) CN118019800A (https=)
TW (1) TW202323326A (https=)
WO (1) WO2023047783A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010111758A (ja) 2008-11-06 2010-05-20 Hitachi Chem Co Ltd 樹脂組成物、プリプレグ、積層板及びプリント基板
JP2016210856A (ja) 2015-05-01 2016-12-15 味の素株式会社 硬化性組成物
JP2018504511A (ja) 2014-12-22 2018-02-15 ドゥーサン コーポレイション 高周波用熱硬化性樹脂組成物及びこれを用いたプリプレグ、積層シート、並びに印刷回路基板
WO2019026927A1 (ja) 2017-08-02 2019-02-07 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板
JP2020002217A (ja) 2018-06-26 2020-01-09 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板
WO2020175538A1 (ja) 2019-02-28 2020-09-03 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板
WO2020175537A1 (ja) 2019-02-28 2020-09-03 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6833723B2 (ja) 2015-12-28 2021-02-24 日鉄ケミカル＆マテリアル株式会社 可溶性多官能ビニル芳香族共重合体、その製造方法及び硬化性組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010111758A (ja) 2008-11-06 2010-05-20 Hitachi Chem Co Ltd 樹脂組成物、プリプレグ、積層板及びプリント基板
JP2018504511A (ja) 2014-12-22 2018-02-15 ドゥーサン コーポレイション 高周波用熱硬化性樹脂組成物及びこれを用いたプリプレグ、積層シート、並びに印刷回路基板
JP2016210856A (ja) 2015-05-01 2016-12-15 味の素株式会社 硬化性組成物
WO2019026927A1 (ja) 2017-08-02 2019-02-07 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板
JP2020002217A (ja) 2018-06-26 2020-01-09 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板
WO2020175538A1 (ja) 2019-02-28 2020-09-03 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板
WO2020175537A1 (ja) 2019-02-28 2020-09-03 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板

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JP2024020213A (ja) 2024-02-14
WO2023047783A1 (ja) 2023-03-30
KR20240065286A (ko) 2024-05-14
TW202323326A (zh) 2023-06-16
CN118019800A (zh) 2024-05-10

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