JP7380143B2 - Heat storage member and its manufacturing method - Google Patents

Description

The present invention relates to a heat storage member and a method of manufacturing the same. The present invention also relates to a curable heat storage composition suitably used for manufacturing this heat storage member.

Patent Document 1 describes a wooden board using a heat storage material used for residential building materials, which describes a latent heat storage material such as an aliphatic hydrocarbon such as n-hexadecane, n-heptadecane, or n-octadecane in the voids of a wooden molded body. It is described that it is impregnated with.
The wood board of Patent Document 1 has a problem of a bleed phenomenon in which the heat storage material oozes out from the wood molded body when the temperature exceeds the melting point of the latent heat storage material.

Patent Document 2 describes a heat storage body that prevents leakage of a heat storage material, in which a heat storage material is supported on a three-dimensional crosslinked structure obtained by reacting a polyol with a compound having a functional group that can react with the hydroxyl group of the polyol. A heat storage body is described. When the temperature of such a heat storage body exceeds the melting point of the heat storage material, the strength of the heat storage body decreases, and there is a risk that durability may become insufficient. Paragraph 0070 of Patent Document 2 describes that a heat storage body is applied onto various base materials to form a layer, but Patent Document 2 describes that a surface layer made of a heat storage body is formed on the surface of the base material. However, only a heat storage body/base material laminate with a heat storage body/substrate structure is obtained, and there is a risk that the heat storage body may peel off from the surface of the base material, resulting in poor durability. Moreover, the surface of the base material is coated with the surface layer of the heat storage body, and the original design and texture of the base material are impaired.

JP 2017-81178 Publication Japanese Patent Application Publication No. 2005-98677

The present invention provides a heat storage member that prevents leakage of a heat storage material, has excellent durability, and has a good design, a method for manufacturing the same, and a curable heat storage composition suitable for manufacturing the same. The purpose is to provide

The present inventor has repeatedly studied to solve the above problems, and by impregnating and curing a porous base material with a curable heat storage composition that can form a three-dimensional crosslinked structure that can support a heat storage material, It has been found that the above problems can be solved.
That is, the gist of the present invention is as follows.

[1] A heat storage member, characterized in that a curable heat storage composition containing a polyol (a), a compound having an isocyanate group (b), and a heat storage material (c) is impregnated into a porous base material and cured.

[2] The heat storage member according to [1], wherein the porous base material is a wooden board, an inorganic porous board, a resin foam, a nonwoven fabric, a woven fabric, or paper.

[3] The heat storage member according to [1] or [2], wherein the heat storage material (c) is a long chain fatty acid ester having 15 to 22 carbon atoms.

[4] The heat storage member according to any one of [1] to [3], wherein the porous base material has a porosity of 10 to 98%.

[5] A porous base material is impregnated with a curable heat storage composition containing a polyol (a), a compound having an isocyanate group (b), and a heat storage material (c) at a temperature equal to or higher than the melting point of the heat storage material (c). A method for producing a heat storage member, which comprises curing the heat storage member.

[6] The method for producing a heat storage member according to [5], wherein the curable heat storage composition has a viscosity of 10 to 500 mPa·s during the impregnation.

[7] The method for producing a heat storage member according to [5] or [6], wherein the heat storage material (c) is a long chain fatty acid ester having 15 to 22 carbon atoms.

[8] A curable heat storage composition comprising a polyol (a), a compound having an isocyanate group (b), and a heat storage material (c), wherein the heat storage material (c) has a viscosity of 10 to 500 mPa at the melting temperature. A curable heat storage composition characterized in that: s.

[9] The curable heat storage composition according to [8], wherein the heat storage material (c) is a long chain fatty acid ester having 15 to 22 carbon atoms.

In the heat storage member of the present invention, the heat storage material is supported on a three-dimensional crosslinked body formed of a curable heat storage composition containing a polyol (a), a compound having an isocyanate group (b), and a heat storage material (c). The heat storage material is filled in the voids of the porous base material in a state where the heat storage material is melted, so that it is retained within the voids of the porous base material, so leakage of the heat storage material can be prevented or suppressed. can. Therefore, the cutting process etc. are easy, and even if the cutting process etc. are performed, there is no problem of leakage of the heat storage material, and the handleability and workability are excellent.
Furthermore, since the three-dimensional crosslinked body supporting the heat storage material is present in the voids of the porous base material, durability is also improved.
In addition, by having a configuration in which the three-dimensional crosslinked body supporting the heat storage material is filled into the voids of the porous base material without covering the surface of the porous base material, the surface of the porous base material is exposed, and the porous base material It is also possible to maintain the original texture and enhance the design.

According to the method for manufacturing a heat storage member of the present invention, such a heat storage member of the present invention can be manufactured with high productivity using the curable heat storage composition of the present invention.

Embodiments of the present invention will be described in detail below.

The heat storage member of the present invention is characterized in that a curable heat storage composition containing a polyol (a), a compound having an isocyanate group (b), and a heat storage material (c) is impregnated into a porous base material and cured. do.

Such a heat storage member of the present invention is characterized in that a curable heat storage composition containing a polyol (a), a compound having an isocyanate group (b), and a heat storage material (c) is porously heated at a temperature equal to or higher than the melting point of the heat storage material (c). The heat storage member can be manufactured with high productivity by the method for manufacturing a heat storage member of the present invention in which the heat storage member is impregnated into a solid base material and then cured.

Further, the curable heat storage composition of the present invention is a curable heat storage composition suitably used for manufacturing the heat storage member of the present invention, and comprises a polyol (a), a compound (b) having an isocyanate group, and It is characterized in that it contains a heat storage material (c), and the viscosity of the heat storage material (c) at the melting temperature is 10 to 500 mPa·s.

[Curable heat storage composition]
First, polyol (a) (hereinafter sometimes referred to as "component (a)"), compound (b) having an isocyanate group (hereinafter sometimes referred to as "component (b)"), and a heat storage material The curable heat storage composition of the present invention containing (c) (hereinafter sometimes referred to as "component (c)") will be described.

<Polyol (a)>
The polyol as the component (a) is a component that reacts with the component (b) described later to form a three-dimensional crosslinked structure for supporting the heat storage material (c), and can form a dense crosslinked structure. .

Examples of the polyol (a) include polyester polyol, polyether polyol, polyolefin polyol, polycarbonate polyol, polycaprolactone polyol, acrylic polyol, epoxy polyol, alkyd polyol, fluorine-containing polyol, silicon-containing polyol, cellulose and/or its derivatives. , polysaccharides such as amylose, and the like. As component (a), only one type of these may be used or a mixture of two or more types may be used.

In the present invention, it is particularly preferable that the polyol (a) contains one or more selected from polyester polyols, polyether polyols, and polyolefin polyols, and by using such polyols (a), a dense crosslinked structure can be formed. In addition, it has the advantage that it has good compatibility with the heat storage material (c) described later, and that leakage of the heat storage material (c) from the three-dimensional crosslinked structure can be easily suppressed. Among these, it is preferable to include polyester polyol from the viewpoint of compatibility with the heat storage material (c).

Polyester polyols include, for example, condensation products of polyhydric alcohols and polycarboxylic acids; ring-opening polymers of cyclic esters (lactones); reactions with three types of components: polyhydric alcohols, polycarboxylic acids, and cyclic esters. Examples include castor oil, castor oil, and modified products thereof. These may be used alone or in combination of two or more.

Examples of polyhydric alcohols include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, trimethylene glycol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 1,3-tetra Methylene diol, 1,4-tetramethylene diol, 1,6-hexane diol, 1,3-tetramethylene diol, 2-methyl-1,3-trimethylene diol, 1,5-pentamethylene diol, trimethylpentanediol, 2,2,4-trimethyl-1,3-pentanediol, neopentyl glycol, cyclohexanediol, 2-butyl-2-ethyl-1,3-propanediol, 1,6-hexamethylenediol, 3-methyl-1 , 5-pentamethylene diol, 2,4-diethyl-1,5-pentamethylene diol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, metaxylene glycol, paraxylene glycol, Bishydroxyethoxybenzene, bishydroxyethyl terephthalate, glycerin, diglycerin, trimethylolpropane, ditrimethylolpropane, trimethylolethane, cyclohexanediols (1,4-cyclohexanediol, cyclohexanedimethanol, etc.), bisphenols (bisphenol A, etc.) ), sugar alcohols (such as xylitol and sorbitol), pentaerythritol, dipentaerythritol, 2-methylolpropanediol, and ethoxylated trimethylolpropane. These may be used alone or in combination of two or more.

Examples of polyvalent carboxylic acids include aliphatic dicarboxylic acids such as malonic acid, maleic acid, maleic anhydride, succinic acid, glutaric acid, adipic acid, suberic acid, azelaic acid, sebacic acid, and dodecanedioic acid; - Alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, orthophthalic acid, phthalic anhydride, terephthalic acid, 2,6-naphthalenedicarboxylic acid, paraphenylenedicarboxylic acid, trimellitic acid, etc. ; or acid anhydrides thereof. These may be used alone or in combination of two or more.

Examples of the cyclic ester in the ring-opening polymer of the cyclic ester include propiolactone, β-methyl-δ-valerolactone, and ε-caprolactone. These may be used alone or in combination of two or more.

As the polyhydric alcohol, polyhydric carboxylic acid, and cyclic ester in the reaction product containing the three components of polyhydric alcohol, polyhydric carboxylic acid, and cyclic ester, those exemplified above can be used.

Examples of the polyether polyols include aromatic polyether polyols, glycerin-based polyether polyols, and amino group-containing polyether polyols. Specifically, as the aromatic polyether polyol, for example, bisphenol A obtained by using bisphenol A as an initiator and adding alkylene oxide (for example, at least one or more kinds of ethylene oxide, propylene oxide, etc., the same applies hereinafter) type polyether polyols, aromatic amines (e.g. toluenediamine, diethyltoluenediamine, 4,4'-diaminodiphenylmethane, p-phenylenediamine, o-phenylenediamine, naphthalene diamine, triethanolamine, Mannich condensation products, etc.) Examples of the agent include aromatic amine-based polyether polyols obtained by adding alkylene oxide. Examples of glycerin-based polyether polyols include polyether polyols obtained by adding alkylene oxide to glycerin as an initiator. Examples of amino group-containing polyether polyols include those obtained by adding alkylene oxide using a low molecular weight amine (eg, ethylene diamine, propylene diamine, butylene diamine, hexamethylene diamine, neopentyl diamine, etc.) as an initiator. In the present invention, it is particularly preferable to use a polyether polyol using glycerin as an initiator (glycerin-based polyether polyol).

The polyolefin polyol is a polyol that contains an olefin as a component of the skeleton (or main chain) of a polymer or copolymer and has at least two hydroxyl groups in the molecule (especially at the terminal), and has a number average molecular weight of 500 or more. can be used. The olefin may be an olefin having a carbon-carbon double bond at the end (for example, an α-olefin such as ethylene or propylene), or an olefin having a carbon-carbon double bond at a site other than the end. (for example, isobutene, etc.) or dienes (for example, butadiene, isoprene, etc.).

Polyol (a) can be produced by a conventional method, and if necessary, known curing agents, curing catalysts, etc. may be used.

The hydroxyl value of polyol (a) is not particularly limited, but is preferably about 10 to 500 KOHmg/g, more preferably about 15 to 400 KOHmg/g.

The molecular weight of polyol (a) is not particularly limited, but is preferably from 100 to 20,000, more preferably from 300 to 10,000, and even more preferably from 1,000 to 8,000. With such a molecular weight, a good three-dimensional crosslinked structure that can sufficiently suppress leakage of the heat storage material (c) can be formed. If the molecular weight of the polyol (a) is too small, the heat storage material (c) may easily leak. On the other hand, if the molecular weight is too large, there is a possibility that the heat storage material (c) cannot be retained sufficiently. The molecular weight referred to herein is the weight average molecular weight in terms of polystyrene determined by GPC method.

In addition, it is preferable to select and use polyol (a) such that the viscosity at the melting temperature of the heat storage material (c) used in the curable heat storage composition is a suitable viscosity described below.

<Compound (b) having an isocyanate group>
Component (b) reacts with the hydroxyl group of polyol (a) to form a three-dimensional crosslinked structure, and the isocyanate group in component (b) has excellent reactivity with the hydroxyl group, and the reaction proceeds quickly. and can form a dense crosslinked structure.

As the compound (b) containing an isocyanate group, for example,
1,3-trimethylene diisocyanate, 1,4-tetramethylene diisocyanate, 1,3-pentamethylene diisocyanate, 1,5-pentamethylene diisocyanate, 1,6-hexamethylene diisocyanate (HMDI) , 1,2-propylene diisocyanate, 1,2-butylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, 2-methyl-1,5-pentamethylene diisocyanate, 3-methyl-1,5-penta Methylene diisocyanate, 2,4,4-trimethyl-1,6-hexamethylene diisocyanate, 2,2,4-trimethyl-1,6-hexamethylene diisocyanate, 2,6-diisocyanate methyl caproate, lysine diisocyanate aliphatic diisocyanates such as dimer acid diisocyanate, norbornene diisocyanate;
1,3-Cyclopentane diisocyanate, 1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate, 3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate, 4,4'-methylenebis(cyclohexyl isocyanate), methyl- 2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 1,3-bis(isocyanatomethyl)cyclohexane, 1,4-bis(isocyanatemethyl)cyclohexane, isophorone diisocyanate (IPDI), norbornane diisocyanate, dicyclohexylmethane diisocyanate , alicyclic diisocyanates such as hydrogenated diphenylmethane diisocyanate and hydrogenated xylylene diisocyanate;
m-phenylene diisocyanate, p-phenylene diisocyanate, 2,4-tolylene diisocyanate (TDI), 2,6-tolylene diisocyanate (TDI), naphthylene-1, 4-diisocyanate, naphthylene-1,5-diisocyanate, 4,4'-diphenyl diisocyanate, 4,4'-diphenylmethane diisocyanate (MDI), 2,4'-diphenylmethane diisocyanate Isocyanate, 4,4'-diphenyl ether diisocyanate, 2-nitrodiphenyl-4,4'-diisocyanate, 2,2'-diphenylpropane-4,4'-diisocyanate, 3, 3'-dimethyldiphenylmethane-4,4'-diisocyanate, 4,4'-diphenylpropane diisocyanate, 3,3'-dimethoxydiphenyl-4,4'-diisocyanate, dianisidine diisocyanate - aromatic diisocyanates such as tetramethylene xylylene diisocyanate;
1,3-xylylene diisocyanate (XDI), 1,4-xylylene diisocyanate (XDI), ω,ω'-diisocyanate-1,4-diethylbenzene, 1,3-bis(1-isocyanate) -Aroaliphatic diisocyanates such as -1-methylethyl)benzene, 1,4-bis(1-isocyanate-1-methylethyl)benzene, and 1,3-bis(α,α-dimethylisocyanatemethyl)benzene;
and other isocyanate group-containing compounds, derivatives of these isocyanate group-containing compounds by allophanation, biuretation, dimerization (uretidione), trimerization (isocyanurate), adductization, carbodiimide reaction, etc., and mixtures thereof. etc.

As the compound (b) having an isocyanate group, it is particularly preferable to use an aliphatic diisocyanate, and HMDI and derivatives thereof are particularly preferable.

In addition, it is preferable to select and use the compound (b) having an isocyanate group such that the viscosity at the melting temperature of the heat storage material (c) used in the curable heat storage composition is a suitable viscosity described below.

<Content ratio of polyol (a) and compound (b) having an isocyanate group>
The content ratio of component (a) and component (b) contained in the curable heat storage composition of the present invention is preferably 0.5 to 5.0, more preferably 0.7 in NCO/OH ratio (equivalent ratio). It may be set within the range of ~4.0, more preferably 0.8~3.0.
By keeping the NCO/OH ratio within this range, the supporting strength of the heat storage material (c) can be increased, and a uniform and dense three-dimensional crosslinked structure supporting the heat storage material without leakage of the heat storage material (c) can be achieved. can be formed.
If the NCO/OH ratio is less than 0.5, the crosslinking rate will be low, and sufficient physical properties such as curability, durability, and strength may not be ensured, and the heat storage material (c) may leak easily. Become. If the NCO/OH ratio is larger than 5.0, unreacted isocyanate groups remain, which adversely affects various physical properties of the three-dimensional crosslinked body supporting a heat storage material, and the three-dimensional crosslinked body supporting a heat storage material is likely to deteriorate. .

<Heat storage material (c)>
Examples of the heat storage material (c) include inorganic latent heat storage materials, organic latent heat storage materials, and the like.
Examples of inorganic latent heat storage materials include hydrated sodium sulfate decahydrate, sodium carbonate decahydrate, sodium hydrogen phosphate decahydrate, sodium thiosulfate pentahydrate, calcium chloride hexahydrate, etc. Examples include salt.
Examples of the organic latent heat storage material include aliphatic hydrocarbons, long-chain alcohols, long-chain fatty acids, long-chain fatty acid esters, polyether compounds, fatty acid triglycerides, and the like.
As the heat storage material (c), one or more of these heat storage materials can be used.

In the present invention, when impregnating a porous base material with a curable heat storage composition, it is necessary to adjust the viscosity to an appropriate level so that the curable heat storage composition can smoothly penetrate into the voids of the porous base material. For this purpose, it is preferable to use an organic latent heat storage material whose viscosity can be easily melted and whose viscosity can be lowered as the heat storage material (c). The organic latent heat storage material is preferable because it has a high boiling point and is difficult to volatilize, so there is almost no thinning during the formation of the three-dimensional crosslinked structure supporting the heat storage material, and the heat storage performance is maintained over a long period of time. Furthermore, when using an organic latent heat storage material, it is easy to set the phase change temperature according to the application. For example, by mixing two or more types of organic latent heat storage materials with different phase change temperatures, the phase change temperature can be easily set. settings can be made.

Among the organic latent heat storage materials, as the aliphatic hydrocarbon, for example, aliphatic hydrocarbons having 8 to 30 carbon atoms can be used, and specifically, pentadecane (melting point 6°C), tetradecane (melting point 8°C) , hexadecane (melting point: 18°C), heptadecane (melting point: 22°C), octadecane (melting point: 28°C), nonadecane (melting point: 32°C), icosane (melting point: 36°C), docosane (melting point: 44°C), and paraffin wax.

As the long-chain alcohol, for example, a long-chain alcohol having 8 to 30 carbon atoms can be used. Specifically, caprylic alcohol (melting point: 7°C), lauryl alcohol (melting point: 24°C), myristyl alcohol (melting point: 38°C) ), stearyl alcohol (melting point: 58°C), and the like.

As the long chain fatty acid, for example, a long chain fatty acid having 8 to 30 carbon atoms can be used, and specifically, octanoic acid (melting point 17°C), decanoic acid (melting point 32°C), dodecanoic acid (melting point 44°C) ), fatty acids such as tetradecanoic acid (melting point 50°C), hexadecanoic acid (melting point 63°C), and octadecanoic acid (melting point 70°C).

As the long chain fatty acid ester, for example, a long chain fatty acid ester having 8 to 30 carbon atoms can be used, and specifically, methyl laurate (melting point 5°C), methyl myristate (melting point 19°C), palmitic acid Methyl (melting point 30°C), butyl palmitate (melting point 15°C), methyl stearate (melting point 38°C), butyl stearate (melting point 25°C), methyl arachidate (melting point 45°C), stearyl stearate (melting point 60°C) ), distearyl phthalate, etc.

Examples of the polyether compound include diethylene glycol, triethylene glycol, tetraethylene glycol, triethylene glycol monomethyl ether, polypropylene glycol, polyethylene glycol, polypropylene glycol diacrylate, and ethyl ethylene glycol.

Examples of fatty acid triglycerides include vegetable oils such as coconut oil and palm kernel oil, medium-chain fatty acid triglycerides that are refined processed products thereof, and long-chain fatty acid triglycerides.

In the present invention, it is particularly preferable to use an aliphatic hydrocarbon or a long-chain fatty acid ester, and it is more preferable to use a long-chain fatty acid ester as the heat storage material (c). Among long-chain fatty acid esters, it is particularly preferable to use long-chain fatty acid esters having 15 to 22 carbon atoms.Such long-chain fatty acid esters have a high latent heat amount and have a phase change temperature (melting point) in the practical temperature range. Because of this, it is easy to use for various purposes. Among these, it is preferable to use one or a mixture of two or more of methyl palmitate, butyl palmitate, methyl stearate, and butyl stearate.

Note that it is preferable to use a heat storage material (c) such as an organic latent heat storage material that has a viscosity at a melting temperature of a suitable viscosity described below.

There is no particular restriction on the content of the heat storage material (c) in the curable heat storage composition of the present invention, but according to the curable heat storage composition of the present invention, a large amount of Since the heat storage material (c) can be supported, the heat storage material (c) content in the curable heat storage composition (the heat storage material (c) content in this curable heat storage composition is determined by the amount of heat storage material supported on the formed heat storage material). ) is preferably 40% by weight or more, more preferably 50% by weight or more, still more preferably 60% by weight or more, particularly preferably 65% by weight or more. can. In this way, by containing a large amount of the heat storage material (c), the content of the heat storage material in the obtained heat storage member can be increased, and the heat storage performance of the heat storage member can be improved. However, if the content of the heat storage material (c) in the curable heat storage composition is excessively high, the content of three-dimensional crosslinked structure forming components such as component (a) and component (b) will be relatively reduced, resulting in stability. In addition, since a strong three-dimensional crosslinked structure cannot be formed, the content of the heat storage material (c) in the curable heat storage composition should be 95% by weight or less, especially 90% by weight or less, especially 85% by weight or less, especially 80% by weight. The following is preferable.

<Other ingredients>
The curable heat storage composition of the present invention may contain other components other than the above-mentioned components (a), (b) and (c), if necessary.

For example, when using a mixture of two or more types of organic latent heat storage materials as component (c), it is preferable to contain a compatibilizer. By containing the compatibilizer, the compatibility between the organic latent heat storage materials can be further improved. The compatibilizer functions not only to improve the compatibility between organic latent heat storage materials, but also to improve the compatibility between the heat storage material (c) and components (a) and (b), thereby creating a more dense three-dimensional crosslinked structure. This is effective in forming the heat storage material (c) and thereby improving the supporting performance of the heat storage material (c).

Examples of the compatibilizing agent include fatty acid triglycerides and nonionic surfactants having a hydrophilic-lipophilic balance (HLB) of 1 to 10, and one or more of these may be used in combination.

As mentioned above, fatty acid triglyceride is a substance that is also used as an organic latent heat storage material. Such fatty acid triglycerides are particularly preferable because they can further improve the compatibility between organic latent heat storage materials and have excellent heat storage properties. Examples of fatty acid triglycerides include vegetable oils such as coconut oil and palm kernel oil, medium-chain fatty acid triglycerides that are refined processed products thereof, and long-chain fatty acid triglycerides.

Examples of nonionic surfactants having a hydrophilic-lipophilic balance (HLB) of 1 to 10 include polyoxyethylene lauryl ether, polyoxyethylene oleyl ether, polyoxyethylene stearyl ether, sorbitan sesquioleate, sorbitan triolate, Sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan tristearate, glycerol monostearate, glycerol monostearate, glycerol monooleate, glyceryl stearate, glyceryl caprylate, sorbitan stearate, sorbitan oleate , sorbitan sesquioleate, sorbitan coconut fatty acid, and the like.

When the curable heat storage composition of the present invention contains a compatibilizer, the compatibilizer is contained in an amount of 0.1 to 30 parts by weight, particularly 0.5 to 20 parts by weight, based on 100 parts by weight of component (a). It is preferable that

Further, the curable heat storage composition of the present invention preferably contains a catalyst (reaction accelerator) in order to rapidly advance the curing reaction of components (a) and (b).

Examples of catalysts include amines such as triethylamine, triethylenediamine, triethylamine, tetramethylbutanediamine, dimethylaminoethanol, dimer diamine, and dimer acid polyamide amine; tin carboxylic acids such as dibutyltin dilaurate, dibutyltin diacetate, and tin octate; Salts: Metal carboxylates such as iron naphthenate, cobalt naphthenate, manganese naphthenate, zinc naphthenate, iron octylate, cobalt octylate, manganese octylate, zinc octylate; dibutyltinthiocarboxylate, dioctyltinthiocarboxylate and carboxylates such as tributylmethylammonium acetate, tributylmethylammonium acetate, and trioctylmethylammonium acetate; aluminum compounds such as aluminum trisacetylacetate; and the like, and one or more of these can be used.

As for this catalyst, it is also preferable to select and use a catalyst that has a viscosity at the melting temperature of the heat storage material (c) used in the curable heat storage composition to a suitable viscosity described below.

The catalyst is used in a ratio of usually 0.01 to 10 parts by weight, preferably 0.05 to 5 parts by weight, based on 100 parts by weight of component (a). If the catalyst content is less than 0.01 parts by weight, the curability and the strength of the three-dimensional crosslinked structure formed may be insufficient. On the other hand, if the amount is more than 10 parts by weight, the durability, discoloration resistance, etc. of the three-dimensional crosslinked structure tend to decrease.

In addition to the above-mentioned components, the curable heat storage composition of the present invention may contain various additives within a range that does not impede the effects of the present invention. Such additives include, for example, plasticizers, preservatives, antifungal agents, algaecides, antifoaming agents, leveling agents, pigment dispersants, antisettling agents, antisagging agents, hardening accelerators, dehydrating agents, Examples include matting agents, flame retardants, ultraviolet absorbers, and light stabilizers.

Furthermore, the curable heat storage composition of the present invention contains a functional group that can react with a hydroxyl group-containing compound other than the above-mentioned polyol (a) or a hydroxyl group of component (a) other than the isocyanate group-containing compound (b), such as It may contain a compound having a carboxyl group, an imide group, an aldehyde group, etc.

The curable heat storage composition of the present invention may also include a thermally conductive substance in order to improve the thermal efficiency of the heat storage material (c) and obtain better heat storage performance. Examples of thermally conductive substances include metals such as copper, iron, zinc, beryllium, magnesium, cobalt, nickel, titanium, zirconium, mobridene, tungsten, boron, aluminum, gallium, silicon, germanium, and tin, and alloys thereof; Alternatively, metal compounds containing these metals such as metal oxides, metal nitrides, metal carbides, and metal phosphides, and graphites such as scaly graphite, lumpy graphite, earthy graphite, and fibrous graphite may be mentioned. One type or a mixture of two or more types can be used.

However, from the viewpoint of impregnation into a porous substrate, it is preferable that the curable heat storage composition of the present invention does not contain a thermally conductive substance.

Furthermore, the curable heat storage composition of the present invention may contain a viscosity modifier.
Examples of the viscosity modifier include layered clay minerals such as smectite and vermiculite, amide wax, hydrophobic cellulose such as ethyl cellulose and cellulose nitrate, and polyolefins such as polyethylene and polypropylene. Can be used. In particular, in the present invention, it is preferable to use layered clay minerals, and it is particularly preferable to use layered clay minerals (organic smectite (organic montmorillonite, organic bentonite, etc.), organic vermiculite, etc.) that have been organically treated with long-chain alkyl ammonium ions, etc. . The viscosity of the curable heat storage composition can be adjusted by including the viscosity modifier, but the ratio of the viscosity modifier is 100 parts by weight of component (c) from the viewpoint of impregnation into the porous base material. It is preferably 10 parts by weight or less, more preferably 8 parts by weight or less. It is also preferable that the curable heat storage composition of the present invention does not contain such a viscosity modifier.

Furthermore, the curable heat storage composition of the present invention may contain a nonionic surfactant having a hydrophilic-lipophilic balance (HLB value) of 10 or more (preferably 12 or more and 18 or less).
By including such a nonionic surfactant, the heat storage material (c) is supported on the three-dimensional crosslinked body in a finely and uniformly dispersed state, and it is possible to obtain better heat storage performance.

Examples of nonionic surfactants with a hydrophilic-lipophilic balance (HLB value) of 10 or more include:
Polyoxyethylene sorbitan fatty acid esters such as polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan monooleate,
polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octyl dodecyl ether,
Polyoxyethylene sorbitol fatty acid esters such as polyoxyethylene sorbitol tetraoleate,
polyoxyethylene fatty acid esters such as polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, polyethylene glycol monooleate,
Examples include polyoxyethylene hydrogenated castor oil, polyoxyethylene coconut oil fatty acid sorbitan, and the like.

<Viscosity>
The curable heat storage composition of the present invention preferably has a viscosity of 10 to 500 mPa·s at the temperature at which it is impregnated into a porous base material in order to improve its impregnability into a porous base material. If the viscosity of the curable heat storage composition during impregnation is higher than 500 mPa·s, it may not be possible to smoothly impregnate the porous base material with the curable heat storage composition. On the other hand, in order to lower the viscosity of the curable heat storage composition to less than 10 mPa·s, it is necessary to reduce the contents of component (a) and component (b), which may cause the heat storage material to leak from the heat storage member.
Here, the temperature at the time of impregnation is a temperature higher than the melting point of the heat storage material (c), that is, the temperature at which the heat storage material (c) melts (melting temperature), and is usually the melting point of the heat storage material (c). The temperature range is approximately 40°C to melting point +40°C, preferably 40 to 80°C.
The viscosity of the curable heat storage composition during impregnation is more preferably 12 to 400 mPa·s, even more preferably 15 to 300 mPa·s, particularly preferably 15 to 100 mPa·s.
The viscosity in the present invention is a value determined by measuring the viscosity at 20 rpm (pointer value at the 4th rotation) using a BH-type viscometer.

The viscosity of the curable heat storage composition is controlled to the above-mentioned suitable viscosity by adjusting the types and content ratios of the (a) component, (b) component, and (c) component used, and the types and content ratios of other components. be able to.

In addition, in order to obtain the above-mentioned suitable viscosity, the curable heat storage composition of the present invention has a heat storage material (c) at a temperature at the time of impregnation into a porous base material, that is, the melting temperature of the heat storage material (c). In the temperature range from the melting point of The viscosity of the compound (b) is preferably 10 to 2000 mPa·s, particularly 50 to 1000 mPa·s.
Even if the viscosity of components (a) and (b) in the curable heat storage composition exceeds the above upper limit or is less than the above lower limit, it becomes difficult to adjust the viscosity to the suitable viscosity of the curable heat storage composition. It may happen.

From the same viewpoint as above, the viscosity of the heat storage material (c) contained in the curable heat storage composition of the present invention when melted is 0.1 to 200 mPa·s, more preferably 0.5 to 100 mPa·s, particularly 1 to 50 mPa. -s, the viscosity of the catalyst at the melting temperature of the heat storage material (c) is preferably 1 to 500 mPa·s, particularly 3 to 300 mPa·s.

In the present invention, the viscosity of the heat storage material (c) is often lower than the viscosity of the components (a) and (b) in the curable heat storage composition. Therefore, by including the heat storage material (c) in a high proportion, it becomes easier to adjust the curable heat storage composition to a predetermined viscosity. However, in order to further improve the impregnating property of the porous substrate, it is important to keep the viscosity of the curable heat storage composition of the present invention within the desired range as described above. ) component, the type and content ratio of component (c), and the type and content ratio of other components need to be adjusted.

Examples of the heat storage material (c) whose viscosity at the melting temperature is the above-mentioned suitable viscosity include methyl myristate, methyl palmitate, butyl palmitate, methyl stearate, and butyl stearate.

In addition, the component (a), component (b), and catalyst that satisfy the above-mentioned preferred viscosity may be appropriately selected and used depending on the melting point and impregnation temperature of the heat storage material (c) used.
For example, as the heat storage material (c), butyl palmitate (melting point 15°C) with a melting point of 15 to 40°C, methyl myristate (melting point 19°C), methyl palmitate (melting point 30°C), methyl stearate (melting point 38°C), When using butyl stearate (melting point 25°C), etc., the impregnation temperature is usually about 45 to 80°C, so polyester polyol, polyether polyol, polyolefin polyol, etc. are used as component (a) that satisfies the above-mentioned preferred viscosity at this temperature. In addition, an aliphatic diisocyanate or the like can be used as the component (b), and amines, tin carboxylates, metal carboxylates, etc. can be used as the catalyst.
In addition, when using pentadecane (melting point 6°C), tetradecane (melting point 8°C), methyl laurate (melting point 5°C), etc. with a melting point of 0 to 15°C as the heat storage material (c), the impregnation temperature is usually about 40 to 70°C. Therefore, polyester polyols, polyether polyols, polyolefin polyols, etc. are used as the (a) component that satisfies the above-mentioned preferred viscosity at this temperature, aliphatic diisocyanates, etc. are used as the (b) component, and amines, tin carbonate, etc. are used as the catalyst. Acid salts, metal carboxylic acid salts, etc. can be used.

<Method for producing curable heat storage composition>
The curable heat storage composition of the present invention is produced by mixing components (a), (b), and (c) with predetermined amounts of other components such as a catalyst that are blended as necessary. .
In the curable heat storage composition of the present invention, in order to prevent the reaction between the (a) component and the (b) component before impregnation into the porous substrate, the (a) component and the (b) component are separated into separate agents. In some cases, these two-component curing agents are mixed and used immediately before impregnation into a porous substrate.
In this case, it is usually manufactured as a main agent containing components (a), (c) and other components, and a curing agent containing component (b), and these are mixed before impregnating into the porous base material. A curable heat storage composition of the invention is prepared.

In addition, the temperature at the time of mixing each component during the production of the curable heat storage composition of the present invention is the melting temperature of the heat storage material (c), that is, a temperature equal to or higher than the melting point, preferably in the temperature range of the melting point to the melting point + 40 ° C. It is preferable.

[Porous base material]
Next, a porous substrate impregnated with the curable heat storage composition of the present invention will be explained.

The porous base material used in the present invention is not particularly limited as long as it has continuous pores that can be impregnated with the curable heat storage composition, but examples include a wooden board, an inorganic porous board, and a resin foam. , nonwoven fabric, woven fabric, paper, etc.

Wooden boards are made by heating and press-molding a mixture of lignocellulosic materials such as wood chips and fiber materials and thermosetting adhesives such as phenolic resin, melamine resin, urea resin, urea-melamine cocondensation resin, and isocyanate resin. It is manufactured by bonding lignocellulosic materials with a thermosetting adhesive, and is used for hardboard (hard fiberboard JIS A5905), MDF (medium density fiberboard JIS A5905), insulation board (soft fiberboard JIS A5905), Although fiberboard (JIS A5905), particle board (JIS A5908), insulation fiber heat insulation material (JIS A9521), etc. are provided, any of these may be used.

Further, examples of the material for the inorganic porous plate include diatomaceous earth, diatomaceous shale, calcium silicate, zeolite, bamboo charcoal, and charcoal. Foamed glass can also be used.

The resin foam may be one that has a heat resistance higher than the impregnation and curing temperature of the curable heat storage composition, such as polyethylene (high-density polyethylene, linear low-density polyethylene, low-density polyethylene), polypropylene ( Isotactic polypropylene, syndiotactic polypropylene), polyethylene terephthalate, polybutylene terephthalate, polyamide (nylon 6, nylon 66, nylon 12), polystyrene, polycarbonate, polyvinyl alcohol, ABS resin, polymethyl methacrylate, polymethyl acrylate, polychloride Vinyl, polyvinylidene chloride, polyvinyl butyral, polyacrylonitrile, polyetheretherketone, poly-4-methylpentene-1, polybutene-1, silicone resin, fluororesin (polytetrafluoroethylene, polyvinylidene fluoride), polyphenylene oxide, polyphenylene Thermoplastic resins such as sulfide, polyimide resin (polyetherimide, polyamideimide), polyarylate, polyvinyl acetate, polyacrylamide, cellulose acetate, polysulfone, polyethersulfone, polyparaxylene, polymethylene oxide, polyethylene oxide, polyvinyl carbazole, etc. Examples include resin foams obtained from one or two of the following.

As the nonwoven fabric or woven fabric, a nonwoven fabric or woven fabric made of inorganic fibers such as glass fiber, ceramic fiber, and rock wool, or organic fiber such as polyester fiber can be used.

The porous base material preferably has a high porosity from the viewpoint of impregnability and amount of curable heat storage composition, while from the viewpoint of strength and weight reduction, the porosity should be low. is preferred. The porosity of the porous base material used in the present invention is preferably 10 to 98%, more preferably 30 to 90%.
Here, "porosity" is a value determined by "1-(bulk specific gravity of porous base material/specific gravity of constituent material of porous base material)".

Note that the entire porous base material may be impregnated and cured with the curable heat storage composition, or only a portion, for example, the surface layer of the porous base material, may be impregnated and cured with the curable heat storage composition. It's okay. When only a portion of the porous substrate is impregnated and cured with the curable heat storage composition, it is sufficient that only the impregnated portion has the above-mentioned preferred porosity, and the porosity of other portions is There are no particular restrictions.

The size and shape of the porous base material used in the present invention are not particularly limited, and are appropriately designed depending on the use of the heat storage member. For example, it may have a plate shape with a length of 100 to 3000 mm, a width of 100 to 3000 mm, and a thickness of 1 to 20 mm, or a block shape of 100 to 1000 mm x 100 to 1000 mm x 100 to 1000 mm. Further, the porous base material is not limited to a flat plate shape, but may be a curved plate shape, or may be processed into various shapes suitable for the application site.

[Method for manufacturing heat storage member]
The heat storage member of the present invention is produced by impregnating a porous base material with the curable heat storage composition of the present invention at a temperature equal to or higher than the melting point of the heat storage material (c) in the curable heat storage composition. It can be manufactured by curing the curable heat storage composition.

The temperature during this impregnation is preferably higher than the melting point of the heat storage material (c), for example, from the melting point of the heat storage material (c) to the melting point +40°C.
If the temperature at the time of impregnation is lower than the melting point of the heat storage material (c), the viscosity of the curable heat storage composition will increase, making it difficult to mix and be compatible with components (a) and (b), making it difficult to impregnate the porous substrate smoothly. I can't do it. If the impregnation temperature is too high, the reaction will proceed excessively, and efficient impregnation and curing may not be possible. Therefore, it is preferable that the impregnation temperature is in the range of the melting point of the heat storage material (c) to the melting point +40°C. The specific impregnation temperature varies depending on the type of heat storage material (c) used, but is usually about 40 to 80°C.

Note that it is preferable to impregnate the porous base material with the curable heat storage composition quickly so that the curing reaction does not proceed during the impregnation. Suction impregnation may be performed by suctioning from the opposite side of the surface.
Alternatively, the impregnation rate can be increased by forming a curable heat storage composition layer on the surface of the porous substrate and applying pressure from the surface of the curable heat storage composition layer.

However, by adjusting the viscosity of the curable heat storage composition to the above-mentioned suitable viscosity, it is usually possible to impregnate the curable heat storage composition without performing suction impregnation or pressure impregnation as described above.
That is, for example, the curable heat storage composition can be easily impregnated by applying the curable heat storage composition to the surface of the porous base material and allowing the curable heat storage composition to penetrate into the continuous pores of the porous base material.

Further, the porous base material can be impregnated with the curable heat storage composition in a single infiltration process, or can be impregnated in a plurality of infiltration processes. Moreover, only one type of curable heat storage composition may be impregnated, or two or more types may be used.

For example, in a method of impregnating a curable heat storage composition in multiple infiltration steps, after impregnating a curable heat storage composition with a heat storage material (c) content of 50% by weight or more, the heat storage material (c) content is Impregnation can be accomplished through a two-step process in which less than 50% by weight of the curable heat storage composition is impregnated. With this method, the inside of the porous base material contains a large amount of heat storage material (c), and the surface of the porous base material contains a small amount of heat storage material (c), and while maintaining excellent heat storage performance, it has better radiation prevention properties. , a heat storage member that can also prevent leakage of the heat storage material (c) is obtained.

For example, in a method of impregnating the heat storage material (c) using two or more types of curable heat storage compositions having different melting points, after impregnating the porous base material with the curable heat storage composition, By impregnating a porous substrate with a curable heat storage composition containing a heat storage material (c) having a melting point different from that of the heat storage material (c) in the curable heat storage composition, heat storage performance is ensured over a wider temperature range. For example, it is also possible to obtain a heat storage member with different heat storage temperatures on the front and back surfaces, which can be used for various purposes.

In addition, in order to improve the impregnation property of the curable heat storage composition, it is preferable that the porous substrate is sufficiently dried before the impregnation treatment to remove moisture and the like in the pores.

The reaction conditions for the curing reaction after impregnation vary depending on the type and composition of the curable heat storage composition, but are usually at about 40 to 70°C for about 30 minutes to 5 hours.

After impregnating with the curable heat storage composition, a protective layer can be provided as necessary. The protective layer can be provided by applying various coatings to the outermost surface of the heat storage member or by pasting a sheet/film or the like.

The content of the heat storage material (c) in the heat storage member of the present invention manufactured in this way can be adjusted by the concentration of the heat storage material (c) and the amount of impregnation in the curable heat storage composition. According to the present invention, for example, when a wooden board is used as the porous base material, the heat storage material (c) is contained in the heat storage member in an amount of about 100 to 300% by weight based on the porous base material to achieve high heat storage performance. can be granted.

[Application]
The heat storage member of the present invention is mainly used as a plate-shaped heat storage member, and is suitably used as an inner wall material, an outer wall material, a ceiling material, a floor material, or a laminated material thereof for buildings such as a house, an interior material for a vehicle, etc. I can do it. Furthermore, the heat storage member of the present invention can be applied to thermoelectric conversion systems, refrigerators/freezers, cooler boxes, heat insulation sheets, etc., and even if cutting is performed during construction, the heat storage material (c) will not leak out from the cut surface. Furthermore, leakage of the heat storage material (c) is also prevented during nailing, riveting, drilling, etc.

EXAMPLES The present invention will be explained in more detail with reference to Examples below.

[raw materials]
The raw materials used for manufacturing the heat storage members in the following Examples and Comparative Examples are as follows.

[Porous base material: rock wool board]
Dimensions: length 100mm, width 100mm, thickness 9mm
Specific gravity: 0.34g/ ^cm3
Porosity: 87%

[Raw material for curable heat storage composition]
<Polyol (a)>
Polyester polyol (a)-1: Castor oil-based polyester polyol Hydroxyl value: 140 KOHmg/g
Molecular weight: 800
Viscosity at 50°C: 140mPa・s
Polyester polyol (a)-2: Castor oil-based polyester polyol Hydroxyl value: 40KOHmg/g
Molecular weight: 2800
Viscosity at 50°C: 450mPa・s
Polyester polyol (a)-3: Castor oil-based polyester polyol Hydroxyl value: 100KOHmg/g
Molecular weight: 1700
Viscosity at 50°C: 150mPa・s
Polyether polyol (a)-4: Glycerin-based polyether polyol Hydroxyl value: 33KOHmg/g
Molecular weight: 4600
Viscosity at 50℃: 500mPa・s

<Compound (b) having an isocyanate group>
Compound (b)-1 having an isocyanate group: Solvent-free MDI polyisocyanate NCO%: 16%
Viscosity at 50℃: 500mPa・s
Compound (b)-2 having an isocyanate group: Solvent-free HMDI polyisocyanate NCO%: 12%
Viscosity at 50°C: 150mPa・s
Compound (b)-3 having an isocyanate group: Solvent-free HMDI polyisocyanate NCO%: 20%
Viscosity at 50°C: 120mPa・s

<Heat storage material (c)>
Heat storage material (c)-1: Methyl palmitate Melting point: 30.0°C
Latent heat amount: 210kJ/kg
Viscosity at 50℃: 5mPa・s
Heat storage material (c)-2: Butyl stearate Melting point: 25°C
Latent heat amount: 140kJ/kg
Viscosity at 50℃: 5mPa・s

<Others>
Catalyst: dibutyltin dilaurate Viscosity at 50°C: 30 mPa・s
Viscosity modifier: Organically modified bentonite (BENTONE 34 (manufactured by Elementis Japan))

[Evaluation of heat storage members]
The heat storage members manufactured in Examples and Comparative Examples were evaluated as follows.

<Impregnability evaluation>
The heat storage member was cut in the thickness direction, the cross section was observed, and the state of impregnation with the curable heat storage composition was confirmed by the change in color (the region impregnated with the curable heat storage composition changed to a dark color).

<Leakage evaluation of heat storage material>
The heat storage member was left in an atmosphere of 50° C. for 72 hours, and then transferred to an environment with a temperature of 23° C. and a humidity of 50%, the heat storage member was cut, and the presence or absence of leakage of the heat storage material was confirmed.

<Heat storage evaluation I>
The heat storage amount (J/g) of the heat storage member was evaluated by electrical method latent heat measurement. Specifically, the heat storage member is sandwiched between two heat flow plates, and the instantaneous value data of the heat flow is integrated when the temperature is changed at a temperature change rate of 5.0°C/h in the range of 5.0 to 42.5°C. The amount of heat (J/g) accumulated in the test specimen was determined.
Create a graph with the horizontal axis as the heat storage amount and the vertical axis as the temperature for the data of the 5th cycle, where one cycle is the heating process, high temperature stability process (3 hours), cooling process, and low temperature stability process (7 hours). Then, the amount of heat storage per unit weight of the heat storage material during the cooling process in the temperature range for calculating the amount of heat storage (15°C to 35°C) was determined.

<Heat storage evaluation II>
In accordance with JSTM O 6101 (2018), a heat storage property test was conducted using the heat flow meter method. The amount of heat stored per unit weight of the heat storage material (J/g) and the amount of latent heat per unit area of the heat storage material (kJ/m ² ) in the cooling process in the heat storage amount calculation temperature range (15° C. to 35° C.) were determined.

[Example 1]
A polyol (a), a compound having an isocyanate group (b), a heat storage material (c), and a catalyst were mixed at 60° C. in the formulation shown in Table 1 below to produce a curable heat storage composition. This curable heat storage composition had a viscosity of 30 mPa·s and a specific gravity of 0.90 at an impregnation temperature of 50°C.
After drying the rock wool board at 40°C for 48 hours, the rockwool board was impregnated with a curable heat storage composition maintained at 50°C and then cured in an oven at 50°C for 180 minutes. The impregnation with the curable heat storage composition was carried out by placing a rock wool board in a frame having the same area as the rock wool board, and applying the stock solution of the curable heat storage composition onto the rock wool board.

The specific gravity of the obtained heat storage member is 0.71, and from the specific gravity after impregnation and curing and the specific gravity of the rock wool board, which is the porous substrate before impregnation, the residual porosity of the porous substrate is 45.1. It was calculated as %.
In the impregnation evaluation of the obtained heat storage member, it was confirmed that the entire thickness thereof was impregnated with the curable heat storage composition.
There was no leakage of the heat storage material in this heat storage member. Further, the heat storage amount in heat storage evaluation I was 83.8 J/g, the heat storage amount in heat storage evaluation II was 94.8 J/g, and the latent heat amount was 390 KJ/m ² .

[Example 2]
A heat storage member was manufactured in the same manner as in Example 1 except that the curable heat storage composition was formulated as shown in Table 1. The viscosity of this curable heat storage composition at an impregnation temperature of 50° C. was 25 mPa·s.
The specific gravity of the obtained heat storage member is 0.64, and from the specific gravity after impregnation and curing and the specific gravity of the rock wool board, which is the porous substrate before impregnation, the residual porosity of the porous substrate is 50.3. It was calculated as %.
In the impregnation evaluation of the obtained heat storage member, it was confirmed that the entire thickness thereof was impregnated with the curable heat storage composition.
There was no leakage of the heat storage material in this heat storage member. Further, the amount of heat storage in heat storage evaluation I was 56.0 J/g, the amount of heat storage in heat storage evaluation II was 66.4 J/g, and the amount of latent heat was 359 KJ/m ² .

[Comparative example 1]
A heat storage member was manufactured in the same manner as in Example 1 except that the curable heat storage composition was formulated as shown in Table 1. The viscosity of this curable heat storage composition at an impregnation temperature of 50° C. was 700 mPa·s.
When the impregnability of the obtained heat storage member was evaluated, it was found that the curable heat storage composition was not impregnated into the inside of the rock wool board and remained on the surface of the rock wool board. Leakage of heat storage material, heat storage evaluation I, and heat storage evaluation II were not conducted.

From the above results, the heat storage member of the present invention stably retains the heat storage material within the voids of the porous base material, has excellent heat storage properties, and has no problems with leakage or peeling of the heat storage material during processing. , it can be seen that it has excellent handling properties.

Claims (8)

A heat storage member comprising a porous base material and a curable heat storage composition impregnated into the porous base material and cured,
The curable heat storage composition contains a polyol (a), a compound having an isocyanate group (b), and a heat storage material (c),
The polyol (a) is a castor oil -based polyester polyol with a molecular weight of 800 to 2,800 ,
The compound (b) having the isocyanate group is a solvent-free MDI or HMDI polyisocyanate,
A heat storage member characterized in that the heat storage material (c) is an organic latent heat storage material . The heat storage member according to claim 1, wherein the porous base material is a wooden board, an inorganic porous board, a resin foam, a nonwoven fabric, a woven fabric, or paper. The heat storage member according to claim 1 or 2, wherein the heat storage material (c) is a long chain fatty acid ester having 15 to 22 carbon atoms. The heat storage member according to any one of claims 1 to 3, wherein the porous base material has a porosity of 10 to 98%. After impregnating a porous base material with a curable heat storage composition containing a polyol (a), a compound having an isocyanate group (b), and a heat storage material (c) at a temperature equal to or higher than the melting point of the heat storage material (c), A method for manufacturing a heat storage member to be cured, the method comprising:
The polyol (a) is a castor oil -based polyester polyol ,
The compound (b) having the isocyanate group is a solvent-free MDI or HMDI polyisocyanate,
A method for manufacturing a heat storage member, characterized in that the heat storage material (c) is an organic latent heat storage material . The method for producing a heat storage member according to claim 5, wherein the viscosity of the curable heat storage composition at the time of impregnation is 10 to 500 mPa·s. The method for producing a heat storage member according to claim 5 or 6, wherein the heat storage material (c) is a long chain fatty acid ester having 15 to 22 carbon atoms. The heat storage member according to any one of claims 1 to 4, wherein the curable heat storage composition has a viscosity of 10 to 500 mPa·s at the melting temperature of the heat storage material (c).