JP2020094202A - Heat storage member and method for producing the same - Google Patents

Abstract

To provide: a heat storage member which can prevent leakage of a heat storage material, has excellent durability and can improve designability; a method for producing the same; and a curable heat storage composition suitable for the production.SOLUTION: There is provided a heat storage member obtained by impregnating a curable heat storage composition comprising a polyol (a), a compound having an isocyanate group (b) and a heat storage material (c) in a porous base material, followed by curing. There is provided a method for producing the heat storage member by impregnating the curable heat storage composition comprising the polyol (a), the compound having the isocyanate group (b) and the heat storage material (c) in the porous base material at a temperature higher than a melting point of the heat storage material (c), followed by curing. There is provided the curable heat storage composition which comprises the polyol (a), the compound having the isocyanate group (b) and the heat storage material (c), wherein viscosity at the melting temperature of the heat storage material (c) is 10 to 500 mPa s.SELECTED DRAWING: None

Description

The present invention relates to a heat storage member and a manufacturing method thereof. The present invention also relates to a curable heat storage composition that is preferably used in the production of this heat storage member.

As a wood board using a heat storage material used as a building material for a house, Patent Document 1 discloses a latent heat storage material such as an aliphatic hydrocarbon such as n-hexadecane, n-heptadecane, and n-octadecane in a void of a wood molded body. What is impregnated with is described.
The wood board of Patent Document 1 has a problem of a bleed phenomenon in which the heat storage material oozes out from the wood molded body when the temperature exceeds the melting point of the latent heat storage material.

In Patent Document 2, as a heat storage material that prevents leakage of the heat storage material, the heat storage material is supported in a three-dimensional crosslinked structure obtained by reacting a polyol and a compound having a functional group capable of reacting with a hydroxyl group of the polyol. Is described. When the heat storage material has a melting point of the heat storage material or higher, the strength of the heat storage material may be reduced and the durability may be insufficient. Paragraph 0070 of Patent Document 2 describes applying a heat storage material to various base materials to form a laminate, but in Patent Document 2, a surface layer made of the heat storage material is formed on the surface of the base material. The obtained heat storage material/base material laminate is only obtained, and the heat storage material may peel off from the surface of the base material, resulting in poor durability. In addition, the surface of the base material is covered with the surface layer of the heat storage material, which impairs the original design and texture of the base material.

JP, 2017-81178, A JP 2005-98677 A

INDUSTRIAL APPLICABILITY The present invention is a heat storage member which prevents leakage of a heat storage material, has excellent durability, and also has good designability, a method for producing the same, and a curable heat storage composition suitable for the production thereof. The purpose is to provide.

MEANS TO SOLVE THE PROBLEM This inventor impregnates a porous base material with the curable heat storage composition which can form the three-dimensional bridge|crosslinking structure which can carry|support a heat storage material, and hardens| It has been found that the above problems can be solved.
That is, the gist of the present invention is as follows.

[1] A heat storage member obtained by impregnating and curing a porous base material with a curable heat storage composition containing a polyol (a), a compound (b) having an isocyanate group, and a heat storage material (c).

[2] The heat storage member according to [1], wherein the porous substrate is a wood board, an inorganic porous board, a resin foam, a nonwoven fabric, a woven cloth, or paper.

[3] The heat storage member according to [1] or [2], wherein the heat storage material (c) is a long-chain fatty acid ester having 15 to 22 carbon atoms.

[4] The heat storage member according to any one of [1] to [3], wherein the porosity of the porous substrate is 10 to 98%.

[5] A porous base material is impregnated with a curable heat storage composition containing a polyol (a), a compound (b) having an isocyanate group, and a heat storage material (c) at a temperature equal to or higher than the melting point of the heat storage material (c). A method for manufacturing a heat storage member, which comprises curing after heating.

[6] The method for producing a heat storage member according to [5], wherein the curable heat storage composition has a viscosity of 10 to 500 mPa·s during the impregnation.

[7] The method for producing a heat storage member according to [5] or [6], wherein the heat storage material (c) is a long-chain fatty acid ester having 15 to 22 carbon atoms.

[8] A curable heat storage composition comprising a polyol (a), a compound having an isocyanate group (b), and a heat storage material (c), the viscosity of the heat storage material (c) at the melting temperature being 10 to 500 mPa. and a curable heat storage composition.

[9] The curable heat storage composition according to [8], wherein the heat storage material (c) is a long-chain fatty acid ester having 15 to 22 carbon atoms.

In the heat storage member of the present invention, the heat storage material is carried on the three-dimensional crosslinked body formed of the curable heat storage composition containing the polyol (a), the compound (b) having an isocyanate group and the heat storage material (c). It is filled in the voids of the porous base material in such a state that it will be retained in the voids of the porous base material even if the heat storage material melts, so it is possible to prevent or suppress leakage of the heat storage material. it can. For this reason, the cutting process is facilitated, the problem of leakage of the heat storage material does not occur even if the cutting process is performed, and the handleability and workability are excellent.
Further, since the heat storage material-carrying three-dimensional crosslinked body is present in the voids of the porous substrate, the durability is also improved.
In addition, the three-dimensional crosslinked material carrying the heat storage material is filled in the voids of the porous base material without covering the surface of the porous base material, thereby exposing the surface of the porous base material to form a porous base material. The original texture can be maintained and the design can be improved.

According to the method for producing a heat storage member of the present invention, such a heat storage member of the present invention can be produced with high productivity by using the curable heat storage composition of the present invention.

Embodiments of the present invention will be described in detail below.

The heat storage member of the present invention is characterized in that a curable heat storage composition containing a polyol (a), a compound (b) having an isocyanate group and a heat storage material (c) is impregnated into a porous substrate and cured. To do.

Such a heat storage member of the present invention has a curable heat storage composition containing a polyol (a), a compound (b) having an isocyanate group and a heat storage material (c), and is porous at a temperature equal to or higher than the melting point of the heat storage material (c). It can be manufactured with high productivity by the method for manufacturing a heat storage member of the present invention in which a quality base material is impregnated and then cured.

Moreover, the curable heat storage composition of the present invention is a curable heat storage composition that is preferably used for the production of such a heat storage member of the present invention, and comprises a polyol (a), a compound (b) having an isocyanate group, and The heat storage material (c) is included, and the viscosity at the melting temperature of the heat storage material (c) is 10 to 500 mPa·s.

[Curable heat storage composition]
First, a polyol (a) (hereinafter sometimes referred to as “(a) component”), a compound having an isocyanate group (b) (hereinafter sometimes referred to as “(b) component”), and a heat storage material. The curable heat storage composition of the present invention containing (c) (hereinafter sometimes referred to as “component (c)”) will be described.

<Polyol (a)>
The polyol as the component (a) is a component that reacts with the component (b) described below to form a three-dimensional crosslinked structure for supporting the heat storage material (c), and can form a dense crosslinked structure. ..

Examples of the polyol (a) include polyester polyol, polyether polyol, polyolefin polyol, polycarbonate polyol, polycaprolactone polyol, acrylic polyol, epoxy polyol, alkyd polyol, fluorine-containing polyol, silicon-containing polyol, cellulose and/or its derivative. , And polysaccharides such as amylose. As the component (a), only one kind thereof may be used, or two or more kinds may be mixed and used.

In the present invention, in particular, the polyol (a) preferably contains at least one selected from polyester polyols, polyether polyols, and polyolefin polyols. By using such a polyol (a), a dense crosslinked structure can be obtained. In addition to being able to be formed, it has good compatibility with the heat storage material (c) described later, and has an advantage that leakage of the heat storage material (c) from the three-dimensional crosslinked structure can be easily suppressed. Above all, from the viewpoint of compatibility with the heat storage material (c), it is preferable to include a polyester polyol.

As the polyester polyol, for example, a polycondensation product of a polyhydric alcohol and a polycarboxylic acid; a ring-opening polymerization product of a cyclic ester (lactone); a reaction by three kinds of components of a polyhydric alcohol, a polycarboxylic acid and a cyclic ester And castor oil or a modified product thereof. These may be used alone or in combination of two or more.

Examples of the polyhydric alcohol include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, trimethylene glycol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, and 1,3-tetraglycol. Methylene diol, 1,4-tetramethylene diol, 1,6-hexane diol, 1,3-tetramethylene diol, 2-methyl-1,3-trimethylene diol, 1,5-pentamethylene diol, trimethyl pentane diol, 2,2,4-trimethyl-1,3-pentanediol, neopentyl glycol, cyclohexanediol, 2-butyl-2-ethyl-1,3-propanediol, 1,6-hexamethylenediol, 3-methyl-1 ,5-pentamethylenediol, 2,4-diethyl-1,5-pentamethylenediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, metaxylene glycol, paraxylene glycol, Bishydroxyethoxybenzene, bishydroxyethyl terephthalate, glycerin, diglycerin, trimethylolpropane, ditrimethylolpropane, trimethylolethane, cyclohexanediols (1,4-cyclohexanediol, cyclohexanedimethanol, etc.), bisphenols (bisphenol A, etc.) ), sugar alcohols (such as xylitol and sorbitol), pentaerythritol, dipentaerythritol, 2-methylolpropanediol, and ethoxylated trimethylolpropane. These may be used alone or in combination of two or more.

Examples of the polycarboxylic acid include aliphatic dicarboxylic acids such as malonic acid, maleic acid, maleic anhydride, succinic acid, glutaric acid, adipic acid, suberic acid, azelaic acid, sebacic acid and dodecanedioic acid; 1,4 Alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, orthophthalic acid, phthalic anhydride, terephthalic acid, 2,6-naphthalenedicarboxylic acid, paraphenylenedicarboxylic acid and trimellitic acid Or an acid anhydride thereof or the like. These may be used alone or in combination of two or more.

Examples of the cyclic ester in the ring-opening polymer of the cyclic ester include propiolactone, β-methyl-δ-valerolactone, ε-caprolactone and the like. These may be used alone or in combination of two or more.

As the polyhydric alcohol, polyvalent carboxylic acid, and cyclic ester in the reaction product of three kinds of components of polyhydric alcohol, polycarboxylic acid, and cyclic ester, those exemplified above can be used.

Examples of the polyether polyols include aromatic polyether polyols, glycerin-based polyether polyols, amino group-containing polyether polyols, and the like. Specifically, as the aromatic polyether polyol, for example, bisphenol A obtained by adding alkylene oxide (for example, at least one or more of ethylene oxide, propylene oxide and the like; the same applies hereinafter) using bisphenol A as an initiator. Type polyether polyol, aromatic amine (eg, toluenediamine, diethyltoluenediamine, 4,4'-diaminodiphenylmethane, p-phenylenediamine, o-phenylenediamine, naphthalenediamine, triethanolamine, Mannich condensation product, etc.) Examples of the agent include aromatic amine polyether polyols obtained by adding alkylene oxide. Examples of the glycerin-based polyether polyol include polyether polyols obtained by adding alkylene oxide using glycerin as an initiator. Examples of the amino group-containing polyether polyol include those obtained by adding an alkylene oxide using a low molecular weight amine (for example, ethylenediamine, propylenediamine, butylenediamine, hexamethylenediamine, neopentyldiamine) as an initiator. In the present invention, it is particularly preferable to use a polyether polyol having glycerin as an initiator (glycerin-based polyether polyol).

The polyolefin polyol is a polyol having an olefin as a component of the skeleton (or main chain) of a polymer or copolymer and having at least two hydroxyl groups in the molecule (particularly at the terminal) and having a number average molecular weight of 500 or more. Can be used. The olefin may be an olefin having a carbon-carbon double bond at the terminal (for example, an α-olefin such as ethylene or propylene), or an olefin having a carbon-carbon double bond at a site other than the terminal. It may be (for example, isobutene, etc.), and may be a diene (for example, butadiene, isoprene, etc.).

The polyol (a) can be produced by a conventional method, and a known curing agent, curing catalyst or the like may be used if necessary.

The hydroxyl value of the polyol (a) is not particularly limited, but is preferably 10 to 500 KOHmg/g, more preferably 15 to 400 KOHmg/g.

The molecular weight of the polyol (a) is not particularly limited, but is preferably 100 to 20,000, more preferably 300 to 10,000, and further preferably 1,000 or more and 8,000 or less. With such a molecular weight, it is possible to form a good three-dimensional crosslinked structure capable of sufficiently suppressing the leakage of the heat storage material (c). If the molecular weight of the polyol (a) is too small, the heat storage material (c) may easily leak. On the other hand, if the molecular weight is too large, the heat storage material (c) may not be sufficiently retained. The molecular weight referred to here is a polystyrene-equivalent weight average molecular weight determined by the GPC method.

The polyol (a) is preferably selected and used so that the viscosity of the heat storage material (c) used in the curable heat storage composition at the melting temperature becomes a suitable viscosity described later.

<Compound having isocyanate group (b)>
The component (b) reacts with the hydroxyl group of the polyol (a) to form a three-dimensional crosslinked structure, and the isocyanate group in the component (b) has excellent reactivity with the hydroxyl group and the reaction proceeds rapidly. And a dense crosslinked structure can be formed.

Examples of the compound (b) containing an isocyanate group include:
1,3-trimethylene diisocyanate, 1,4-tetramethylene diisocyanate, 1,3-pentamethylene diisocyanate, 1,5-pentamethylene diisocyanate, 1,6-hexamethylene diisocyanate (HMDI) 1,2-propylene diisocyanate, 1,2-butylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, 2-methyl-1,5-pentamethylene diisocyanate, 3-methyl-1,5-penta Methylene diisocyanate, 2,4,4-trimethyl-1,6-hexamethylene diisocyanate, 2,2,4-trimethyl-1,6-hexamethylene diisocyanate, 2,6-diisocyanate methyl caproate, lysine diisocyanate , Dimer acid diisocyanate, norbornene diisocyanate and other aliphatic diisocyanates;
1,3-cyclopentane diisocyanate, 1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 4,4′-methylenebis(cyclohexyl isocyanate), methyl- 2,4-Cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 1,3-bis(isocyanatomethyl)cyclohexane, 1,4-bis(isocyanatomethyl)cyclohexane, isophorone diisocyanate (IPDI), norbornane diisocyanate, dicyclohexylmethane diisocyanate Alicyclic diisocyanates such as hydrogenated diphenylmethane diisocyanate and hydrogenated xylylene diisocyanate;
m-phenylene diisocyanate, p-phenylene diisocyanate, 2,4-tolylene diisocyanate (TDI), 2,6-tolylene diisocyanate (TDI), naphthylene-1, 4-diisocyanate, naphthylene-1,5-diisocyanate, 4,4'-diphenyldiisocyanate, 4,4'-diphenylmethane diisocyanate (MDI), 2,4'-diphenylmethane di Isocyanate, 4,4'-diphenyl ether diisocyanate, 2-nitrodiphenyl-4,4'-diisocyanate, 2,2'-diphenylpropane-4,4'-diisocyanate, 3, 3'-Dimethyldiphenylmethane-4,4'-diisocyanate, 4,4'-diphenylpropane diisocyanate, 3,3'-dimethoxydiphenyl-4,4'-diisocyanate, dianisidine diisocyanate Aromatic diisocyanates such as tetra- and tetramethylene xylylene diisocyanate;
1,3-xylylene diisocyanate (XDI), 1,4-xylylene diisocyanate (XDI), ω,ω'-diisocyanate-1,4-diethylbenzene, 1,3-bis(1-isocyanate) Aroaliphatic diisocyanates such as -1-methylethyl)benzene, 1,4-bis(1-isocyanate-1-methylethyl)benzene, and 1,3-bis(α,α-dimethylisocyanatomethyl)benzene;
Isocyanate group-containing compounds such as, and those isocyanate group-containing compounds are derivatized by alohanation, biuretization, dimerization (uretdione), trimerization (isocyanurate), adduct formation, carbodiimide reaction, etc., and mixtures thereof. Etc.

As the compound (b) having an isocyanate group, it is particularly preferable to use an aliphatic diisocyanate, and particularly preferable is HMDI or a derivative thereof.

The compound (b) having an isocyanate group is preferably selected and used so that the heat storage material (c) used in the curable heat storage composition has a viscosity at the melting temperature that will be described later.

<Content ratio of polyol (a) and compound (b) having isocyanate group>
The content ratio of the component (a) and the component (b) contained in the curable heat storage composition of the present invention is preferably 0.5 to 5.0, more preferably 0.7 in terms of NCO/OH ratio (equivalent ratio). Up to 4.0, more preferably 0.8 to 3.0.
Within such a range of NCO/OH ratio, the carrying strength of the heat storage material (c) can be enhanced, and a uniform and dense three-dimensional crosslinked structure carrying the heat storage material (c) without leakage of the heat storage material (c) can be obtained. Can be formed.
If the NCO/OH ratio is less than 0.5, the cross-linking ratio will be low, and it may not be possible to secure sufficient physical properties in terms of curability, durability, strength, etc., and the heat storage material (c) will easily leak. Become. When the NCO/OH ratio is greater than 5.0, unreacted isocyanate groups remain, adversely affecting various physical properties of the heat storage material-supporting three-dimensional crosslinked body, and the heat storage material-supporting three-dimensional crosslinked body is likely to deteriorate. ..

<Heat storage material (c)>
Examples of the heat storage material (c) include an inorganic latent heat storage material and an organic latent heat storage material.
Examples of the inorganic latent heat storage material include hydrates of sodium sulfate decahydrate, sodium carbonate decahydrate, sodium hydrogen phosphate dodecahydrate, sodium thiosulfate pentahydrate, calcium chloride hexahydrate, and the like. Salt etc. are mentioned.
Examples of the organic latent heat storage material include aliphatic hydrocarbons, long chain alcohols, long chain fatty acids, long chain fatty acid esters, polyether compounds, and fatty acid triglycerides.
As the heat storage material (c), one kind or two or more kinds of these heat storage materials can be used.

In the present invention, when impregnating the curable heat storage composition into the porous base material, the curable heat storage composition needs to be adjusted to an appropriate viscosity that can be smoothly penetrated into the voids of the porous base material, For that purpose, it is preferable to use an organic latent heat storage material that can be easily melted to reduce the viscosity as the heat storage material (c). The organic latent heat storage material is preferable because it has a high boiling point and is hard to volatilize, so that there is almost no thinning in the formation of the heat storage material-supporting three-dimensional crosslinked structure, and the heat storage performance is maintained for a long time. Furthermore, when an organic latent heat storage material is used, it is easy to set the phase change temperature according to the application. For example, by mixing two or more kinds of organic latent heat storage materials having different phase change temperatures, the phase change temperature can be easily set. Can be set.

Among the organic latent heat storage materials, as the aliphatic hydrocarbon, for example, an aliphatic hydrocarbon having 8 to 30 carbon atoms can be used, and specifically, pentadecane (melting point 6°C), tetradecane (melting point 8°C). , Hexadecane (melting point 18° C.), heptadecane (melting point 22° C.), octadecane (melting point 28° C.), nonadecane (melting point 32° C.), icosane (melting point 36° C.), docosane (melting point 44° C.), paraffin wax and the like.

As the long chain alcohol, for example, a long chain alcohol having 8 to 30 carbon atoms can be used, and specifically, capryl alcohol (melting point 7° C.), lauryl alcohol (melting point 24° C.), myristyl alcohol (melting point 38° C. ), stearyl alcohol (melting point 58° C.) and the like.

As the long-chain fatty acid, for example, a long-chain fatty acid having 8 to 30 carbon atoms can be used. Specifically, octanoic acid (melting point 17° C.), decanoic acid (melting point 32° C.), dodecanoic acid (melting point 44° C.) ), tetradecanoic acid (melting point 50° C.), hexadecanoic acid (melting point 63° C.), octadecanoic acid (melting point 70° C.) and the like.

As the long-chain fatty acid ester, for example, a long-chain fatty acid ester having 8 to 30 carbon atoms can be used. Specifically, methyl laurate (melting point 5° C.), methyl myristate (melting point 19° C.), palmitic acid can be used. Methyl (melting point 30°C), butyl palmitate (melting point 15°C), methyl stearate (melting point 38°C), butyl stearate (melting point 25°C), methyl arachidate (melting point 45°C), stearyl stearate (melting point 60°C) ), and distearyl phthalate.

Examples of the polyether compound include diethylene glycol, triethylene glycol, tetraethylene glycol, triethylene glycol monomethyl ether, polypropylene glycol, polyethylene glycol, polypropylene glycol diacrylate, ethyl ethylene glycol and the like.

Examples of the fatty acid triglycerides include vegetable oils such as coconut oil and palm kernel oil, and medium-chain fatty acid triglycerides and long-chain fatty acid triglycerides which are purified products thereof.

In the present invention, as the heat storage material (c), it is particularly preferable to use an aliphatic hydrocarbon or a long chain fatty acid ester, and it is more preferable to use a long chain fatty acid ester. Among the long-chain fatty acid esters, it is particularly preferable to use a long-chain fatty acid ester having 15 to 22 carbon atoms. Such a long-chain fatty acid ester has a high latent heat amount and a phase change temperature (melting point) in a practical temperature range. Therefore, it is easy to use for various purposes. Among them, it is preferable to use one of methyl palmitate, butyl palmitate, methyl stearate, and butyl stearate, or a mixture of two or more thereof.

As the heat storage material (c) such as the organic latent heat storage material, it is preferable to use a material whose viscosity at the melting temperature becomes a suitable viscosity described later.

The content of the heat storage material (c) in the curable heat storage composition of the present invention is not particularly limited, but according to the curable heat storage composition of the present invention, a large amount is contained in the dense three-dimensional crosslinked structure. Since the heat storage material (c) can be supported, the content of the heat storage material (c) in the curable heat storage composition (the content of the heat storage material (c) in this curable heat storage composition is the heat storage material supported). Corresponding to the amount of heat storage material carried in the three-dimensional crosslinked structure) is preferably 40% by weight or more, more preferably 50% by weight or more, further preferably 60% by weight or more, and particularly preferably 65% by weight or more. it can. In this way, by containing a large amount of the heat storage material (c), the heat storage material content rate of the obtained heat storage member can be increased and the heat storage performance of the heat storage member can be improved. However, when the content of the heat storage material (c) in the curable heat storage composition is excessively large, the content of the three-dimensional crosslinked structure-forming component such as the component (a) and the component (b) is relatively reduced, and thus stable. And since it becomes impossible to form a strong three-dimensional crosslinked structure, the content of the heat storage material (c) in the curable heat storage composition is 95% by weight or less, particularly 90% by weight or less, especially 85% by weight or less, especially 80% by weight. The following is preferable.

<Other ingredients>
The curable heat storage composition of the present invention may contain other components other than the above-mentioned components (a), (b) and (c), if necessary.

For example, when two or more kinds of organic latent heat storage materials are mixed and used as the component (c), it is preferable to contain a compatibilizer. By containing the compatibilizing agent, the compatibility between the organic latent heat storage materials can be further improved. The compatibilizer functions not only to improve the compatibility between the organic latent heat storage materials but also to improve the compatibility between the heat storage materials (c) and the components (a) and (b), and has a more precise three-dimensional crosslinked structure. Is effective in improving the carrying performance of the heat storage material (c).

Examples of the compatibilizing agent include fatty acid triglycerides, nonionic surfactants having a hydrophilic-lipophilic balance (HLB) of 1 to 10, and the like, and one type or a mixture of two or more types can be used.

As described above, the fatty acid triglyceride is a substance also used as an organic latent heat storage material. Such a fatty acid triglyceride is particularly preferable because it can further improve the compatibility between the organic latent heat storage materials and has an excellent heat storage property. Examples of the fatty acid triglycerides include vegetable oils such as coconut oil and palm kernel oil, and medium-chain fatty acid triglycerides and long-chain fatty acid triglycerides which are purified products thereof.

Examples of the nonionic surfactant having a hydrophilic-lipophilic balance (HLB) of 1 to 10 include polyoxyethylene lauryl ether, polyoxyethylene oleyl ether, polyoxyethylene stearyl ether, sorbitan sesquioleate, sorbitan trioleate, Sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan tristearate, glycerol monostearate, glycerol monostearate, glycerol monooleate, glyceryl stearate, glyceryl caprylate, sorbitan stearate, sorbitan oleate , Sorbitan sesquioleate, sorbitan coconut fatty acid and the like.

When the curable heat storage composition of the present invention contains a compatibilizing agent, the compatibilizing agent is contained in an amount of 0.1 to 30 parts by weight, particularly 0.5 to 20 parts by weight, based on 100 parts by weight of the component (a). Preferably.

Further, the curable heat storage composition of the present invention preferably contains a catalyst (reaction accelerator) in order to accelerate the curing reaction of the components (a) and (b).

As the catalyst, for example, amines such as triethylamine, triethylenediamine, triethylamine, tetramethylbutanediamine, dimethylaminoethanol, dimerdiamine, dimer acid polyamidoamine; tin carboxylic acid such as dibutyltin dilaurate, dibutyltin diacetate, tin octate. Salts; metal carboxylic acid salts such as iron naphthenate, cobalt naphthenate, manganese naphthenate, zinc naphthenate, iron octylate, cobalt octylate, manganese octylate, zinc octylate; dibutyltin thiocarboxylate, dioctyltin thiocarboxyl And carboxylates such as tributylmethylammonium acetate and trioctylmethylammonium acetate; aluminum compounds such as aluminum trisacetylacetate; and the like, and one or more of these may be used.

Also for this catalyst, it is preferable to select and use a catalyst such that the viscosity of the heat storage material (c) used in the curable heat storage composition at the melting temperature becomes a suitable viscosity described later.

The catalyst is used in a proportion of usually 0.01 to 10 parts by weight, preferably 0.05 to 5 parts by weight, relative to 100 parts by weight of the component (a). If the catalyst content is less than 0.01 part by weight, the curability and the strength of the three-dimensional crosslinked structure formed may be insufficient. On the other hand, when the amount is more than 10 parts by weight, the durability and discoloration resistance of the three-dimensional crosslinked structure tend to be deteriorated.

Further, the curable heat storage composition of the present invention may contain various additives in addition to the components described above within a range that does not impair the effects of the present invention. Examples of such additives include plasticizers, preservatives, antifungal agents, antialgal agents, antifoaming agents, leveling agents, pigment dispersants, anti-settling agents, anti-sagging agents, curing accelerators, dehydrating agents, Matting agents, flame retardants, UV absorbers, light stabilizers and the like can be mentioned.

Furthermore, the curable heat storage composition of the present invention is a functional group capable of reacting with a hydroxyl group-containing compound other than the above-mentioned polyol (a) and a hydroxyl group of the component (a) other than the compound (b) having an isocyanate group, for example, It may contain a compound having a carboxyl group, an imide group, an aldehyde group, or the like.

In order to improve the thermal efficiency of the heat storage material (c) and obtain more excellent heat storage performance, the curable heat storage composition of the present invention may be blended with a heat conductive substance. Examples of the heat-conductive substance include, for example, metals such as copper, iron, zinc, beryllium, magnesium, cobalt, nickel, titanium, zirconium, mobridene, tungsten, boron, aluminum, gallium, silicon, germanium and tin, and alloys thereof. Alternatively, metal oxides containing these metals, metal nitrides, metal carbides, metal compounds such as metal phosphide, and graphite such as scaly graphite, agglomerated graphite, earthy graphite, and fibrous graphite can be given. One kind or a mixture of two or more kinds can be used.

However, it is preferable that the curable heat storage composition of the present invention does not contain a heat conductive substance from the viewpoint of the impregnation property into the porous substrate.

Furthermore, the curable heat storage composition of the present invention may contain a viscosity modifier.
Examples of the viscosity modifier include layered clay minerals such as smectite and vermiculite, amide wax, hydrophobic cellulose such as ethyl cellulose and cellulose nitrate, polyolefins such as polyethylene and polypropylene, and one or more of them may be used. Can be used. In particular, in the present invention, it is preferable to use a layered clay mineral, and it is particularly preferable to use a layered clay mineral organically treated with a long-chain alkylammonium ion or the like (organic smectite (organic montmorillonite, organic bentonite, etc.), organic vermiculite, etc.). .. The viscosity of the curable heat storage composition can be adjusted by including the viscosity adjusting agent, but the ratio of the viscosity adjusting agent is 100 parts by weight of the component (c) from the viewpoint of impregnation into the porous substrate. On the other hand, it is preferably 10 parts by weight or less, and more preferably 8 parts by weight or less. It is also preferable that the curable heat storage composition of the present invention does not contain such a viscosity modifier.

Furthermore, the curable heat storage composition of the present invention may contain a nonionic surfactant having a hydrophilic-lipophilic balance (HLB value) of 10 or more (preferably 12 or more and 18 or less).
By including such a nonionic surfactant, the heat storage material (c) is supported on the three-dimensional crosslinked body in a finely and uniformly dispersed state, and it is possible to obtain more excellent heat storage performance.

Examples of the nonionic surfactant having a hydrophilic-lipophilic balance (HLB value) of 10 or more include:
Polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan monooleate and other polyoxyethylene sorbitan fatty acid esters,
Polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octyldodecyl ether,
Polyoxyethylene sorbitol fatty acid ester such as tetraoleic acid polyoxyethylene sorbitol,
Polyoxyethylene fatty acid esters such as polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, polyethylene glycol monooleate,
Examples thereof include polyoxyethylene hydrogenated castor oil, polyoxyethylene coconut oil fatty acid sorbitan, and the like.

<Viscosity>
The curable heat storage composition of the present invention preferably has a viscosity of 10 to 500 mPa·s at the temperature of impregnation into the porous base material in order to enhance the impregnation property into the porous base material. When the viscosity of the curable heat storage composition at the time of impregnation is higher than 500 mPa·s, the curable heat storage composition may not be smoothly impregnated into the porous substrate. On the other hand, in order to reduce the viscosity of the curable heat storage composition to less than 10 mPa·s, it is necessary to reduce the contents of the components (a) and (b), and the heat storage material may leak from the heat storage member.
Here, the temperature at the time of impregnation is a temperature equal to or higher than the melting point of the heat storage material (c), that is, a temperature (melting temperature) at which the heat storage material (c) melts, as will be described later, and is usually the melting point of the heat storage material (c). To the melting point + 40°C, preferably 40 to 80°C.
The viscosity of the curable heat storage composition at the time of impregnation is more preferably 12 to 400 mPa·s, further preferably 15 to 300 mPa·s, and particularly preferably 15 to 100 mPa·s.
The viscosity in the present invention is a value obtained by measuring the viscosity at 20 rpm (guide value at the fourth rotation) with a BH type viscometer.

The viscosity of the curable heat storage composition is controlled to the above-mentioned suitable viscosity by adjusting the types and content ratios of the (a) component, (b) component, (c) component, and other components used. be able to.

In addition, the curable heat storage composition of the present invention has a temperature at the time of impregnation into the porous base material, that is, a heat storage material (c) which is the melting temperature of the heat storage material (c), so as to have the above-mentioned suitable viscosity. Of the polyol (a) contained in the curable heat storage composition in the temperature range of melting point to melting point +40° C. of 10 to 1000 mPa·s, particularly 30 to 500 mPa·s, and particularly 50 to 450 mPa·s, with an isocyanate group. It is preferable that the compound (b) has a viscosity of 10 to 2000 mPa·s, particularly 50 to 1000 mPa·s.
Even if the viscosity of the component (a) and the component (b) in the curable heat storage composition exceeds the above upper limit or is less than the above lower limit, it becomes difficult to adjust the viscosity of the above curable heat storage composition to a suitable value. May be.

From the same viewpoint as described above, the viscosity of the heat storage material (c) contained in the curable heat storage composition of the present invention during melting is 0.1 to 200 mPa·s, further 0.5 to 100 mPa·s, and particularly 1 to 50 mPas. .S, the viscosity of the catalyst at the melting temperature of the heat storage material (c) is preferably 1 to 500 mPa.s, and particularly preferably 3 to 300 mPa.s.

In the present invention, the viscosity of the heat storage material (c) is often lower than the viscosities of the components (a) and (b) in the curable heat storage composition. Therefore, by containing the heat storage material (c) in a high ratio, the curable heat storage composition can be easily adjusted to a predetermined viscosity. However, in order to further enhance the impregnation property into the porous base material, it is important to set the viscosity of the curable heat storage composition of the present invention within a desired range as described above, and the components (a) and (b) ) Component, (c) component type and content ratio, and other component types and content ratios need to be adjusted.

Examples of the heat storage material (c) having the above-mentioned suitable viscosity at the melting temperature include methyl myristate, methyl palmitate, butyl palmitate, methyl stearate, butyl stearate and the like.

Further, the component (a), the component (b), and the catalyst satisfying the above-mentioned preferable viscosity may be appropriately selected and used according to the melting point and the impregnation temperature of the heat storage material (c) to be used.
For example, as the heat storage material (c), butyl palmitate (melting point 15°C) having a melting point of 15 to 40°C, methyl myristate (melting point 19°C), methyl palmitate (melting point 30°C), methyl stearate (melting point 38°C), When butyl stearate (melting point 25° C.) or the like is used, the impregnation temperature is usually about 45 to 80° C., and therefore polyester polyol, polyether polyol, polyolefin polyol, etc. as component (a) satisfying the above-mentioned suitable viscosity at this temperature In addition, aliphatic diisocyanate or the like can be used as the component (b), and amines, tin carboxylates, metal carboxylates or the like can be used as the catalyst.
When pentadecane (melting point 6°C), tetradecane (melting point 8°C), methyl laurate (melting point 5°C) or the like having a melting point of 0 to 15°C is used as the heat storage material (c), the impregnation temperature is usually about 40 to 70°C. Therefore, polyester polyols, polyether polyols, polyolefin polyols and the like as the component (a) satisfying the above-mentioned preferable viscosity at this temperature, aliphatic diisocyanate and the like as the component (b), and amines and tin carboxyl as the catalyst. Acid salts, metal carboxylates and the like can be used.

<Method for producing curable heat storage composition>
The curable heat storage composition of the present invention is produced by mixing the components (a), (b) and (c) with predetermined amounts of other components such as a catalyst to be blended as necessary. ..
In the curable heat storage composition of the present invention, in order to prevent the reaction between the component (a) and the component (b) before impregnation into the porous substrate, the component (a) and the component (b) are separate agents. In some cases, it is produced as a two-component curing agent, and these are mixed and provided for impregnation immediately before impregnation into the porous substrate.
In this case, it is usually produced as a main agent containing the component (a), the component (c) and other components, and a curing agent containing the component (b), and these are mixed before impregnation into the porous substrate to form the main component. The curable heat storage composition of the invention is prepared.

In addition, the temperature at the time of mixing each component at the time of manufacturing the curable heat storage composition of the present invention is set to a melting temperature of the heat storage material (c), that is, a temperature equal to or higher than the melting point, preferably a temperature range from the melting point to the melting point +40°C. Preferably.

[Porous substrate]
Next, the porous base material impregnated with the curable heat storage composition of the present invention will be described.

The porous substrate used in the present invention is not particularly limited as long as it has continuous pores that can be impregnated with the curable heat storage composition, and is not particularly limited, and examples thereof include a wood board, an inorganic porous board, and a resin foam. , Non-woven fabric, woven fabric, paper and the like.

Wood board is made by heating and pressing a mixture of lignocellulosic materials such as wood chips and fiber materials and thermosetting adhesives such as phenol resin, melamine resin, urea resin, urea melamine co-condensation resin and isocyanate resin. It is manufactured by binding a lignocellulosic material with a thermosetting adhesive, and includes hardboard (hard fiber board JIS A5905), MDF (medium density fiber board JIS A5905), and insulation board (soft). A fiber board (JIS A5905), a particle board (JIS A5908), an insulation fiber heat insulating material (JIS A9521) and the like are provided, but any of these may be used.

Examples of the material of the inorganic porous plate include diatomaceous earth, diatom shale, calcium silicate, zeolite, bamboo charcoal, and charcoal. Further, foam glass can also be used.

Any resin foam may be used as long as it has a heat resistance higher than the temperature at which it is impregnated with the curable heat storage composition and the curing temperature. For example, polyethylene (high density polyethylene, linear low density polyethylene, low density polyethylene), polypropylene ( Isotactic polypropylene, syndiotactic polypropylene), polyethylene terephthalate, polybutylene terephthalate, polyamide (nylon 6, nylon 66, nylon 12), polystyrene, polycarbonate, polyvinyl alcohol, ABS resin, polymethyl methacrylate, polymethyl acrylate, polychlorination Vinyl, polyvinylidene chloride, polyvinyl butyral, polyacrylonitrile, polyether ether ketone, poly-4-methylpentene-1, polybutene-1, silicone resin, fluororesin (polytetrafluoroethylene, polyvinylidene fluoride), polyphenylene oxide, polyphenylene Thermoplastic resins such as sulfide, polyimide resin (polyether imide, polyamide imide), polyarylate, polyvinyl acetate, polyacrylamide, cellulose acetate, polysulfone, polyether sulfone, polyparaxylene, polymethylene oxide, polyethylene oxide, polyvinylcarbazole The resin foam obtained from 1 type or 2 types of is mentioned.

As the non-woven fabric and the woven fabric, non-woven fabrics and woven fabrics made of inorganic fibers such as glass fibers, ceramic fibers and rock wool, and organic fibers such as polyester fibers can be used.

The porous substrate preferably has a high porosity (porosity) from the viewpoint of the impregnability and impregnation amount of the curable heat storage composition, while the porosity is low from the viewpoint of strength and weight reduction. Is preferred. The porosity of the porous substrate used in the present invention is preferably 10 to 98%, more preferably 30 to 90%.
Here, the "porosity" is a value obtained by "1-(bulk specific gravity of porous substrate/specific gravity of constituent materials of porous substrate)".

The curable heat storage composition may be impregnated and cured throughout the porous substrate, and only a part, for example, the surface layer of the porous substrate is impregnated with the curable heat storage composition and cured. May be. When the curable heat storage composition is only partially impregnated and cured, the porous base material only needs to have the above-mentioned suitable porosity in the impregnated portion, and the porosity in other locations is There is no particular limitation.

The size and shape of the porous base material used in the present invention is not particularly limited and is appropriately designed according to the application of the heat storage member. For example, it may have a plate shape with a length of 100 to 3000 mm, a width of 100 to 3000 mm, and a thickness of 1 to 20 mm, or a block shape of 100 to 1000 mm x 100 to 1000 mm x 100 to 1000 mm. Further, the porous base material is not limited to the flat plate shape, and may be a curved plate shape or may be processed into various shapes suitable for the application site.

[Method of manufacturing heat storage member]
In the heat storage member of the present invention, the porous base material is impregnated with the curable heat storage composition of the present invention at a temperature equal to or higher than the melting point of the heat storage material (c) in the curable heat storage composition to impregnate the porous base material. It can be manufactured by curing the curable heat storage composition.

The temperature at the time of this impregnation is equal to or higher than the melting point of the heat storage material (c), and is preferably, for example, the melting point to the melting point +40° C.
If the temperature at the time of impregnation is lower than the melting point of the heat storage material (c), the viscosity of the curable heat storage composition increases, and it becomes difficult to mix and mix with the components (a) and (b), and the porous base material is smoothly impregnated. I can't let you do it. If the impregnation temperature is excessively high, the reaction may proceed excessively, and impregnation and curing may not be efficiently performed. Therefore, the impregnation temperature is preferably in the range of the melting point of the heat storage material (c) to the melting point +40°C. The specific impregnation temperature varies depending on the type of the heat storage material (c) used, but is usually about 40 to 80°C.

The impregnation of the curable heat storage composition into the porous substrate is preferably carried out promptly so that the curing reaction does not proceed during the impregnation, and in some cases, the curable heat storage composition impregnated side of the porous substrate. You may perform the suction impregnation which sucks from the surface on the opposite side to the surface.
Alternatively, it is also possible to form a curable heat storage composition layer on the surface of the porous substrate and pressurize from the surface of the curable heat storage composition layer to increase the impregnation rate.

However, by adjusting the viscosity of the curable heat storage composition to the above-mentioned preferable viscosity, the curable heat storage composition can be usually impregnated without performing the above-mentioned suction impregnation or pressure impregnation.
That is, for example, the curable heat storage composition can be easily impregnated by applying the curable heat storage composition to the surface of the porous base material and allowing the curable heat storage composition to soak into the continuous pores of the porous base material.

Moreover, the curable heat storage composition can be impregnated into the porous base material in a single permeation step, or can be impregnated in a plurality of permeation steps. Further, the curable heat storage composition to be impregnated may be only one kind or two or more kinds.

For example, in the method of impregnating the curable heat storage composition in a plurality of infiltration steps, after the curable heat storage composition having a heat storage material (c) content of 50 wt% or more is impregnated, the heat storage material (c) content is It can be impregnated through a two-step process in which a curable heat storage composition of less than 50% by weight is impregnated. According to this method, the inside of the porous base material contains a large amount of the heat storage material (c), and the surface of the porous base material has a small amount of the heat storage material (c). A heat storage member that can prevent leakage of the heat storage material (c) is obtained.

Further, for example, in the method of impregnating the curable heat storage composition with two or more curable heat storage compositions having different melting points of the contained heat storage material (c), after impregnating the curable heat storage composition into the porous substrate, Ensuring the heat storage property in a wider temperature range by impregnating the porous base material with the curable heat storage composition containing the heat storage material (c) having a melting point different from that of the heat storage material (c) in the curable heat storage composition It is also possible to obtain a heat storage member having different heat storage temperatures on the front surface and the back surface, and can be used in various applications.

In order to enhance the impregnating property of the curable heat storage composition, it is preferable that the porous substrate is sufficiently dried before the impregnation treatment to remove water and the like in the pores.

The reaction condition of the curing reaction after impregnation varies depending on the type and composition of the curable heat storage composition, but is usually about 40 to 70° C. and about 30 minutes to 5 hours.

After impregnating the curable heat storage composition, a protective layer can be provided if necessary. The protective layer can be provided by applying various coatings on the outermost surface of the heat storage member or by sticking a sheet/film or the like.

The content of the heat storage material (c) in the heat storage member of the present invention produced in this way can be adjusted by the concentration or impregnation amount of the heat storage material (c) of the curable heat storage composition. According to the present invention, for example, when a wood board is used as the porous base material, the heat storage member contains about 100 to 300% by weight of the heat storage material (c) with respect to the porous base material to achieve high heat storage properties. Can be granted.

[Use]
The heat storage member of the present invention is suitably used mainly as a plate-shaped heat storage member as an inner wall material, an outer wall material, a ceiling material, a floor material of a building such as a house, or a laminated material thereof, an interior material of a vehicle or the like. You can Furthermore, the heat storage member of the present invention can be applied to a thermoelectric conversion system, a refrigerator/freezer, a cooler box, a heat insulating sheet, etc., and even if cutting is performed during construction, leakage of the heat storage material (c) from the cut surface is prevented. It is possible to prevent the heat storage material (c) from leaking out even in nailing, tacking, drilling, or the like.

Hereinafter, the present invention will be described more specifically with reference to examples.

[raw materials]
The raw materials used for manufacturing the heat storage member in the following Examples and Comparative Examples are as follows.

[Porous substrate: Rock wool board]
Dimensions: length 100 mm, width 100 mm, thickness 9 mm
Specific gravity: 0.34 g/cm ³
Porosity: 87%

[Raw material for curable heat storage composition]
<Polyol (a)>
Polyester polyol (a)-1: Castor oil-based polyester polyol Hydroxyl value: 140 KOHmg/g
Molecular weight: 800
Viscosity at 50°C: 140 mPa·s
Polyester polyol (a)-2: Castor oil-based polyester polyol Hydroxyl value: 40 KOHmg/g
Molecular weight: 2800
Viscosity at 50°C: 450 mPa·s
Polyester polyol (a)-3: Castor oil-based polyester polyol Hydroxyl value: 100 KOHmg/g
Molecular weight: 1700
Viscosity at 50°C: 150 mPa·s
Polyether polyol (a)-4: Glycerin-based polyether polyol Hydroxyl value: 33 KOHmg/g
Molecular weight: 4600
Viscosity at 50°C: 500 mPa·s

<Compound having isocyanate group (b)>
Compound (b)-1 having isocyanate group: Solventless MDI polyisocyanate NCO%: 16%
Viscosity at 50°C: 500 mPa·s
Compound (b)-2 having isocyanate group: Solventless HMDI polyisocyanate NCO%: 12%
Viscosity at 50°C: 150 mPa·s
Compound (b)-3 having isocyanate group: Solventless HMDI polyisocyanate NCO%: 20%
Viscosity at 50°C: 120 mPa·s

<Heat storage material (c)>
Heat storage material (c)-1: Methyl palmitate Melting point: 30.0°C
Latent heat amount: 210 kJ/kg
Viscosity at 50°C: 5 mPa·s
Heat storage material (c)-2: Butyl stearate Melting point: 25°C
Latent heat amount: 140 kJ/kg
Viscosity at 50°C: 5 mPa·s

<Other>
Catalyst: dibutyltin dilaurate Viscosity at 50°C: 30 mPa·s
Viscosity modifier: Organic modified bentonite (BENTONE 34 (manufactured by Elementis Japan))

[Evaluation of heat storage member]
The heat storage members manufactured in the examples and comparative examples were evaluated as follows.

<Evaluation of impregnability>
The heat storage member was cut in the thickness direction, its cross section was observed, and the impregnation state of the curable heat storage composition was confirmed by its color change (the impregnation region of the curable heat storage composition changes to a dark color).

<Leakage evaluation of heat storage material>
After allowing the heat storage member to stand in an atmosphere of 50° C. for 72 hours, the heat storage member was transferred to an environment of a temperature of 23° C. and a humidity of 50% to cut the heat storage member, and the presence or absence of leakage of the heat storage material was confirmed.

<Heat storage evaluation I>
The heat storage amount (J/g) of the heat storage member was evaluated by the electric method latent heat amount measurement. Specifically, the heat storage member is sandwiched between two heat flow plates, and the instantaneous value data of the heat flow when the temperature is changed at a temperature change rate of 5.0°C/h in the range of 5.0 to 42.5°C is integrated. Then, the amount of heat (J/g) accumulated in the test body was obtained.
Regarding the data of the 5th cycle when the heating process, high temperature stable process (3 hours), cooling process, low temperature stable process (7 hours) are 1 cycle, create a graph with the horizontal axis as heat storage amount and the vertical axis as temperature. Then, the heat storage amount per unit weight of the heat storage material in the cooling process in the heat storage amount calculation temperature range (15°C to 35°C) was obtained.

<Heat storage evaluation II>
A heat storage characteristic test by a heat flow meter method was performed according to JST M 6101 (2018). The heat storage amount per unit weight of the heat storage material (J/g) and the latent heat amount per unit area of the heat storage material (kJ/m ² ) were calculated in the cooling process in the temperature range for calculating the heat storage amount (15°C to 35°C).

[Example 1]
The curable heat storage composition was produced by mixing the polyol (a), the compound having an isocyanate group (b), the heat storage material (c) and the catalyst at 60° C. in the formulation shown in Table 1 below. The viscosity of this curable heat storage composition at an impregnation temperature of 50° C. was 30 mPa·s, and the specific gravity was 0.90.
After the rock wool board was dried at 40° C. for 48 hours, the rock wool board was impregnated with the curable heat storage composition kept at 50° C., and then cured in an oven at 50° C. for 180 minutes. The curable heat storage composition was impregnated by placing the rock wool board in a frame having the same area as the rock wool board and applying the stock solution of the curable heat storage composition onto the rock wool board.

The specific gravity of the obtained heat storage member was 0.71, and the residual porosity of the porous substrate was 45. 1 based on the specific gravity after impregnation and curing and the specific gravity of the rock wool board which was the porous substrate before impregnation. % Was calculated.
In the evaluation of impregnating property, it was confirmed that the obtained heat storage member was impregnated with the curable heat storage composition over the entire thickness thereof.
There was no leakage of heat storage material in this heat storage member. The heat storage amount in the heat storage property evaluation I was 83.8 J/g, the heat storage amount in the heat storage property evaluation II was 94.8 J/g, and the latent heat amount was 390 KJ/m ² .

[Example 2]
A heat storage member was produced in the same manner as in Example 1 except that the curable heat storage composition was used as shown in Table 1. The viscosity of this curable heat storage composition at an impregnation temperature of 50° C. was 25 mPa·s.
The specific gravity of the obtained heat storage member was 0.64. From the specific gravity after impregnation and curing and the specific gravity of the rock wool board which was the porous base material before impregnation, the residual porosity of the porous base material was 50.3. % Was calculated.
In the evaluation of impregnating property, it was confirmed that the obtained heat storage member was impregnated with the curable heat storage composition over the entire thickness thereof.
There was no leakage of heat storage material in this heat storage member. The heat storage amount in the heat storage property evaluation I was 56.0 J/g, the heat storage amount in the heat storage property evaluation II was 66.4 J/g, and the latent heat amount was 359 KJ/m ² .

[Comparative Example 1]
A heat storage member was produced in the same manner as in Example 1 except that the curable heat storage composition was used as shown in Table 1. The viscosity of this curable heat storage composition at an impregnation temperature of 50° C. was 700 mPa·s.
When the impregnability of the obtained heat storage member was evaluated, the curable heat storage composition was not impregnated inside the rockwool board, but remained on the surface of the rockwool board. Leakage of heat storage material, heat storage property evaluation I, and heat storage property evaluation II were not performed.

From the above results, the heat storage member of the present invention, which stably holds the heat storage material in the voids of the porous substrate, has excellent heat storage properties, and there is no problem of leakage or separation of the heat storage material during processing. It turns out that it is easy to handle.

Claims (9)

A heat storage member comprising a porous base material impregnated and cured with a curable heat storage composition containing a polyol (a), a compound (b) having an isocyanate group, and a heat storage material (c). The heat storage member according to claim 1, wherein the porous substrate is a wood board, an inorganic porous board, a resin foam, a nonwoven fabric, a woven cloth, or paper. The heat storage member according to claim 1 or 2, wherein the heat storage material (c) is a long-chain fatty acid ester having 15 to 22 carbon atoms. The heat storage member according to claim 1, wherein the porous substrate has a porosity of 10 to 98%. After impregnating the curable heat storage composition containing the polyol (a), the compound (b) having an isocyanate group and the heat storage material (c) into the porous substrate at a temperature equal to or higher than the melting point of the heat storage material (c), A method for manufacturing a heat storage member, which comprises curing. The method for producing a heat storage member according to claim 5, wherein the viscosity of the curable heat storage composition at the time of the impregnation is 10 to 500 mPa·s. The method for producing a heat storage member according to claim 5 or 6, wherein the heat storage material (c) is a long-chain fatty acid ester having 15 to 22 carbon atoms. A curable heat storage composition comprising a polyol (a), a compound having an isocyanate group (b) and a heat storage material (c), wherein the heat storage material (c) has a viscosity of 10 to 500 mPa·s at a melting temperature. Curable heat storage composition characterized by the above. The curable heat storage composition according to claim 8, wherein the heat storage material (c) is a long-chain fatty acid ester having 15 to 22 carbon atoms.