JP2008249308A - Floor heating structure and construction method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide floor heating structure capable of thinning, capable of restraining an escape of heat to an underfloor part in floor heating operation, and capable of preventing a sudden temperature drop in the indoor temperature and the floor temperature after stopping floor heating. <P>SOLUTION: The floor heating structure is laminated a sheet-like heating element and a floor material on a heat storage layer. The heat storage layer is formed by laying a heat storage sheet including a latent heat storage material all over, and a storage space is arranged in a part of the heat storage layer. A wiring cord of the sheet-like heating element is stored in the storage space, and a heat storage body including the latent heat storage material is also filled. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a floor heating structure used for floor heating in a house or the like and a construction method thereof.

Houses equipped with a floor heating system are increasing against the background of the recent rise in the residential environment.
In the floor heating system, for example, in order to prevent heat generated by a heating wire or the like from escaping under the floor, a heat insulating material or the like is installed to improve heat efficiency without escaping heat under the floor. In this case, the thermal efficiency can be further improved by adding a certain thickness to the heat insulating material.

In such a floor heating system, in recent years, thinning of the floor heating structure has been studied.
Especially in the installation of floor heating systems in renovation, it is a great advantage that it is thin, even if it is installed on the existing floor as it is, the living space is not compressed, and the existing floor structure, wiring, Since it is not necessary to repair or reconstruct pipes, it is possible to shorten the construction period and reduce costs.
In thinning the floor heating structure, for example, a sheet heating sheet in which heating wires are arranged is used, or a heat storage body (heat storage sheet) containing a heat storage material is introduced (for example, Patent Document 1, Patent Document 2, (Patent Document 3 etc.).
When a heat storage material containing a heat storage material is introduced, the generated heat can be stored in the heat storage material, so that it is possible to improve the thermal efficiency without using a normally used heat insulating material. Therefore, the floor heating structure can be reduced in thickness, and heat escape to the underfloor can be suppressed and the thermal efficiency can be improved.

JP 2003-343864 A JP 2003-294323 A JP 2003-021349 A

Furthermore, in such floor heating systems that use sheet heating sheets and heat storage sheets, there are wiring cords that connect the power source and heating wires, and how to install the wiring cords when making the floor heating structure thinner. It becomes important to do.
Usually, a method for providing a gap for wiring cords between the heat storage sheets and storing the wiring cords in the gap has been introduced. However, in such a method, heat escapes from the gaps and thermal efficiency is reduced. There was a risk of it.

  In order to solve the above problems, the present inventors have intensively studied, and as a result, a floor heating structure in which a sheet heating element and a flooring material are laminated on the heat storage layer, wherein the heat storage layer is a latent heat storage material. A storage space is provided in a part of the heat storage layer, and a wiring cord of a planar heating element is stored in the storage space, and a latent heat storage material is provided. The floor heating structure filled with the heat storage material it contains can be thinned, suppresses the escape of heat to the bottom of the floor during floor heating operation, and reduces the room temperature and floor temperature after the floor heating is stopped. The present inventors have found that a rapid decrease in temperature can be prevented and completed the present invention.

That is, the present invention includes the following features.
1. A floor heating structure in which a planar heating element and a flooring layer are laminated on a heat storage layer,
The heat storage layer is formed by laying a heat storage sheet containing a latent heat storage material, and a storage space is provided in a part of the heat storage layer, and a wiring code of a planar heating element is stored in the storage space. Furthermore, the floor heating structure characterized by being filled with the thermal storage body containing a latent-heat thermal storage material.
2. A floor heating structure in which a heat-resistant layer, a planar heating element, and a flooring layer are laminated on the heat storage layer,
The heat storage layer is formed by laying a heat storage sheet containing a latent heat storage material, and a storage space is provided in a part of the heat storage layer, and a wiring code of a planar heating element is stored in the storage space. Furthermore, the floor heating structure characterized by being filled with the thermal storage body containing a latent-heat thermal storage material.
3. On the base material, a storage space for storing the wiring cord of the planar heating element is provided, and a heat storage layer containing a latent heat storage material is spread and a heat storage layer is laminated,
The wiring code of the sheet heating element is stored in the storage space, the sheet heating element is laminated on the heat storage layer, and the storage space is further filled with a heat storage element containing a latent heat storage material,
A floor heating structure construction method characterized by laminating a flooring layer thereon.
4). Laminating a heat storage sheet containing a latent heat storage material on the base material, laminating the heat storage layer,
In a part of the heat storage layer, a storage space for storing the wiring cord of the planar heating element is provided,
The wiring code of the sheet heating element is stored in the storage space, the sheet heating element is laminated on the heat storage layer, and the storage space is further filled with a heat storage element containing a latent heat storage material,
Furthermore, a floor heating layer is laminated thereon, and a floor heating structure construction method is provided.
5. 2. A heat-resistant layer is laminated between the heat storage layer and the planar heating element. Or 4. Construction method of the floor heating structure described in 2.

The floor heating structure of the present invention can be reduced in thickness, suppresses escape of heat under the floor during floor heating operation, and rapidly decreases the room temperature and floor temperature after the floor heating is stopped. Can be prevented.
Furthermore, the construction method of the floor heating structure of the present invention can shorten the construction period and reduce the cost. It is applicable as a corresponding floor heating, and is particularly suitable as a simple thin floor heating structure for renovation.

  Hereinafter, the best mode for carrying out the present invention will be described in detail.

  The floor heating structure of the present invention is obtained by laminating a sheet heating element and a floor material on a heat storage layer.

<Heat storage layer>
The heat storage layer of the present invention is composed of a heat storage sheet containing a latent heat storage material. As a latent heat storage material, an inorganic latent heat storage material, an organic latent heat storage material, etc. are mentioned, for example.

  Examples of the inorganic latent heat storage material include hydrates such as sodium sulfate decahydrate, sodium carbonate decahydrate, sodium hydrogen phosphate dodecahydrate, sodium thiosulfate pentahydrate, calcium chloride hexahydrate, etc. Examples include salts.

  Examples of the organic latent heat storage material include aliphatic hydrocarbons, long chain alcohols, long chain fatty acids, long chain fatty acid esters, fatty acid triglycerides, polyether compounds, and the like, and one or two of these latent heat storage materials are used. The above can be used.

  In the present invention, an organic latent heat storage material can be particularly preferably used. Organic latent heat storage materials are preferred because they have a high boiling point and are less likely to volatilize, so there is almost no volume change (thinning) when forming a heat storage sheet and the heat storage performance lasts for a long time. Furthermore, when an organic latent heat storage material is used, it is easy to set the phase change temperature according to the application. For example, by mixing two or more organic latent heat storage materials having different phase change temperatures, the phase change temperature can be easily set. Can be set.

  As the aliphatic hydrocarbon, for example, an aliphatic hydrocarbon having 8 to 36 carbon atoms can be used. Specifically, n-tetradecane (melting point: 8 ° C.), pentadecane (melting point: 10 ° C.), n-hexadecane ( Melting point 17 ° C), n-heptadecane (melting point 22 ° C), n-octadecane (melting point 28 ° C), n-nonadecane (melting point 32 ° C), icosane (melting point 36 ° C), docosan (melting point 44 ° C), and mixtures thereof N-paraffin, paraffin wax, etc. comprised by these.

  As the long chain alcohol, for example, a long chain alcohol having 8 to 36 carbon atoms can be used. Specifically, capryl alcohol (melting point: 7 ° C.), lauryl alcohol (melting point: 24 ° C.), myristyl alcohol (melting point: 38 ° C.) ), Stearyl alcohol (melting point: 58 ° C.), and the like.

  As the long chain fatty acid, for example, a long chain fatty acid having 8 to 36 carbon atoms can be used. Specifically, octanoic acid (melting point: 17 ° C.), decanoic acid (melting point: 32 ° C.), dodecanoic acid (melting point: 44 ° C.). ), Fatty acids such as tetradecanoic acid (melting point 50 ° C.), octadecanoic acid (melting point 70 ° C.), hexadecanoic acid (melting point 63 ° C.), and the like.

  As the long-chain fatty acid ester, for example, a long-chain fatty acid ester having 8 to 36 carbon atoms can be used. Specifically, methyl laurate (melting point 5 ° C.), methyl myristate (melting point 19 ° C.), palmitic acid Examples include methyl (melting point: 30 ° C.), methyl stearate (melting point: 38 ° C.), butyl stearate (melting point: 25 ° C.), and methyl arachidate (melting point: 45 ° C.).

  Examples of the fatty acid triglyceride include vegetable oils such as coconut oil and palm kernel oil, and medium-chain fatty acid triglycerides and long-chain fatty acid triglycerides that are refined processed products thereof.

  Examples of the polyether compound include diethylene glycol, triethylene glycol, tetraethylene glycol, triethylene glycol monomethyl ether, tetraethylene glycol dimethyl ether, polypropylene glycol, polyethylene glycol, polypropylene glycol diacrylate, and ethyl ethylene glycol.

  In the present invention, as the latent heat storage material, in particular, aliphatic hydrocarbons, long chain fatty acids, and long chain fatty acid esters having a phase change temperature (melting point) in a practical temperature range of 25 ° C. to 40 ° C. have high latent heat, Excellent in stability and preferable.

  Further, as the latent heat storage material, aliphatic hydrocarbons having 8 to 36 carbon atoms, long chain alcohols having 8 to 36 carbon atoms, long chain fatty acids having 8 to 36 carbon atoms, and long chain fatty acid esters having 8 to 36 carbon atoms are used. It is preferable to use aliphatic hydrocarbons having 8 to 36 carbon atoms and long chain fatty acid esters having 8 to 36 carbon atoms. Among them, it is preferable to use a long-chain fatty acid ester having 15 to 22 carbon atoms and an aliphatic hydrocarbon having 15 to 22 carbon atoms. Such a latent heat storage material has a high latent heat amount and has a phase change temperature in a practical temperature range. Since it has a (melting point), it is easy to use for various purposes.

  In the present invention, a heat storage sheet having a wide application temperature range can be obtained by using two or more latent heat storage materials having different melting points.

Moreover, when mixing and using 2 or more types of organic latent heat storage materials, it is preferable to use a compatibilizing agent. By using a compatibilizing agent, the compatibility between the organic latent heat storage materials can be improved.
Examples of the compatibilizing agent include fatty acid triglycerides, nonionic surfactants having a hydrophilic / lipophilic balance (HLB) of 1 or more and less than 10 (preferably 1 or more and 5 or less), and one or two of these. The above can be mixed and used.

  The mixing ratio of the compatibilizer and the latent heat storage material is usually about 0.1 to 20 parts by weight (preferably 0.5 to 10 parts by weight) with respect to 100 parts by weight of the latent heat storage material. That's fine.

  Furthermore, a viscosity regulator, a heat conductive substance, etc. can be mixed and used for a thermal storage sheet.

Examples of the viscosity modifier include clay minerals, and it is particularly preferable to use a layered clay mineral that has been organically treated.
By mixing the latent heat storage material and the organically treated layered clay mineral, the latent heat storage material enters between the layers of the organically processed layered clay mineral, and the latent heat storage material is interposed between the layered clay mineral layers that have been organically processed. The structure is easy to hold.

  By mixing such an organically treated layered clay mineral and latent heat storage material, as a result, the viscosity of the latent heat storage material is increased, and the latent heat storage material is supported in the heat storage sheet, and more stably supported. Can continue to hold.

The viscosity at the time of mixing the latent heat storage material and the organically treated layered clay mineral may be about 0.5 to 20.0 Pa · s. The viscosity is a value measured using a B-type rotational viscometer at a temperature of 23 ° C. and a relative humidity of 50% RH.
The TI value when mixing the latent heat storage material and the organically treated layered clay mineral may be about 4.0 to 9.0. In addition, TI value is a value calculated | required by following formula 1 using a B-type rotational viscometer.
TI value = η1 / η2 (Formula 1)
(However, η1: Viscosity at 2 rpm (Pa · s: guide value for the second rotation), η2: Viscosity at 20 rpm (Pa · s: Guide value for the fourth rotation))

  Examples of the organically treated layered clay mineral include smectite, vermiculite, kaolinite, allophane, mica, talc, halloysite, and sepiolite. In addition, swellable fluorine mica, swellable synthetic mica, and the like can be used.

Examples of the organic treatment include ion exchange (intercalation) of a cation existing between layers of a layered clay mineral with a long-chain alkylammonium ion or the like.
In the present invention, smectite and vermiculite are particularly preferably used because they are easily organically treated. Furthermore, among the smectites, montmorillonite is particularly preferably used, and in the present invention, organically treated montmorillonite can be particularly preferably used.

Specifically, as an organically treated montmorillonite,
Hojun Co., Ltd., Esben C, Esben E, Esben W, Esben P, Esven WX, Esven NX, Esven NZ, Esven N-400, Organite, Organite D, Organite T (trade name)
TIXOGEL MP, TIXOGEL VP, TIXOGEL VP, TIXOGEL MP, TIXOGEL EZ 100, MP 100, TIXOGEL UN, TIXOGEL DS, TIXOGEL VP-A, TIXOGEL VP-A, TIXOGEL VP-A, TIXOGEL VP-A )
BENTONE 34, 38, 52, 500, 1000, 128, 27, SD-1, SD-3 (trade names) manufactured by Elementis Japan
Etc.

  The mixing ratio of the organically treated layered clay mineral and the latent heat storage material is usually 0.5 to 50 parts by weight (preferably 1 to 30 parts by weight, more preferably 3 parts by weight based on 100 parts by weight of the latent heat storage material. The weight may be about 15 parts by weight.

  In the present invention, the encapsulated latent heat storage material can be fixed by any method, or the latent heat storage material can be filled into a porous body to form a heat storage sheet, or the latent heat storage material can be used as it is. It can also be enclosed in a film to form a heat storage sheet.

  Examples of the method for encapsulating the latent heat storage material include the methods described in Japanese Patent Application Nos. 2005-134852 and 2006-95924.

  When the encapsulated heat storage capsule is used as a heat storage sheet, it may be fixed by some method. For example, the heat storage capsule can be encapsulated in the film as it is, or a molded product of slurry in which the heat storage capsule and the binder are kneaded may be used as the heat storage sheet. May be impregnated with a heat storage capsule to form a heat storage sheet, or these methods may be combined to produce a heat storage sheet.

For example, as a method of encapsulating the heat storage capsule as it is in the film, a film in which the heat storage capsule is dispersed in a solvent such as water or a solid fine powder of the heat storage capsule may be enclosed in the film.
Here, the film is not particularly limited, but for example, one or more selected from organic materials such as polyethylene, polypropylene, nylon, polyester, polyethylene terephthalate, vinylidene chloride, ethylene / vinyl acetate copolymer,
One or more metals selected from aluminum, gold, silver, copper, iron, chromium, zinc, magnesium, titanium, nickel, bismuth, tin, cobalt, or oxides, chlorides, sulfides, carbonates of these metals, A film mainly composed of one or more selected from silicates, phosphates, nitrates, sulfates, and composites thereof can be used.

Moreover, what is necessary is just to use a well-known thing as a method of forming the slurry which knead | mixed the heat storage capsule and binder.
Examples of such binders include acrylic resin, silicon resin, polyester resin, alkyd resin, epoxy resin, urethane resin, phenol resin, melamine resin, amino resin, polycarbonate resin, fluororesin, vinyl acetate resin, acrylic / acetic acid Solvent soluble types such as vinyl resin, acrylic / urethane resin, acrylic / silicone resin, silicon-modified acrylic resin, ethylene / vinyl acetate / versaic acid vinyl ester resin, ethylene / vinyl acetate resin, vinyl chloride resin, ABS resin, AS resin Synthetic rubber such as resin, NAD type resin, water soluble resin, water dispersion type resin, solventless type resin, chloroprene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, methyl methacrylate-butadiene rubber, butadiene rubber Organic binder such as
Examples include inorganic binders such as Portland cement, blast furnace cement, silica cement, fly ash cement, white cement, calcined gypsum, colloidal silica, and water-soluble alkali metal silicates. Use one or more of these. Can do.

  In the present invention, it is particularly preferable to use an organic binder. Among the organic binders, either a one-component type or a two-component type can be used, but a two-component type is more preferable. The use of the two-component type is preferable because the reaction proceeds quickly, a high-strength molded product is formed, and a molded product in which the heat storage capsules are uniformly dispersed is easily obtained.

  As the two-component type, for example, hydroxyl group and isocyanate group, hydroxyl group and carboxyl group, hydroxyl group and imide group, hydroxyl group and aldehyde group, epoxy group and amino group, epoxy group and carboxyl group, carboxyl group and carbodiimide group, Examples include those utilizing a crosslinking reaction such as a carboxyl group and an oxazoline group, a carbonyl group and a hydrazide group, and a carboxyl group and an aziridine group. In particular, it is preferable to use a crosslinking reaction between a hydroxyl group and an isocyanate group because the reaction proceeds quickly and a molded product in which the heat storage capsules are more uniformly dispersed is easily obtained.

  In addition to the binder, the slurry includes a solvent, a pigment, an aggregate, a viscosity modifier, a buffer, a dispersant, an antifoaming agent, a plasticizer, an antiseptic, an antifungal agent, an antialgae, a flame retardant, Various additives such as a leveling agent, an anti-settling agent, an anti-sagging agent, and a dehydrating agent can be kneaded.

  In the formation of such a molded product, such a slurry may be formed into a sheet by a known method, or may be formed by enclosing the slurry in the aforementioned film.

Further, in the method of impregnation by the dipping method, the reduced pressure / pressure injection method or the like, the material shown below may be impregnated with the heat storage capsule.
Examples of materials include inorganic materials such as concrete, gypsum board, mortar, and slate board,
Synthetic fibers such as glass fiber, pulp fiber, polyethylene fiber, polypropylene fiber, vinylon fiber, tetron fiber, polyester fiber, cellulose fiber, nylon fiber, natural fiber such as cotton, cotton, asbestos, hemp, palm, cork, kenaf, etc. Fiber material,
Acrylic resin, silicone resin, polyester resin, alkyd resin, epoxy resin, urethane resin, phenol resin, melamine resin, amino resin, polycarbonate resin, fluororesin, vinyl acetate resin, acrylic / vinyl acetate resin, acrylic / urethane resin, acrylic / urethane resin Silicone resin, silicon-modified acrylic resin, ethylene / vinyl acetate / versaic acid vinyl ester resin, ethylene / vinyl acetate resin, vinyl chloride resin, ABS resin, AS resin, chloroprene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, methacryl Organic materials such as acid-methyl-butadiene rubber, synthetic rubber such as butadiene rubber,
Wood materials such as pine, lawan, beech, hinoki and plywood, and other papers, synthetic papers, ceramic papers and the like can be mentioned, and one or more of these can be used.

  The content of the heat storage capsule in the heat storage sheet is preferably 10% by weight or more, more preferably 20% by weight or more and 70% by weight or less, with respect to the total amount of the heat storage sheet. By being in such a range, it can have the outstanding heat storage property.

  The material in which the latent heat storage material is filled in the porous body is not particularly limited as long as the latent heat storage material is supported and held in the porous body.

  The shape of the porous body is not particularly limited as long as the latent heat storage material can be supported and held, and examples thereof include those having a shape such as a particle aggregation type porous material, a sponge type porous material, and a three-dimensional stitch structure type porous material. . In the present invention, in particular, a three-dimensional stitch structure type porous body is preferable because the latent heat storage material is more easily supported and held.

  The porous body can be used without any particular limitation, such as an inorganic porous body or an organic porous body, but an organic porous body is preferably used from the viewpoint of more easily carrying and holding the latent heat storage material. Furthermore, the organic porous body can also prevent cracking and shape change of the heat storage sheet due to volume shrinkage due to phase change (particularly, change from liquid to solid) of the latent heat storage material.

  Examples of the resin component that forms such an organic porous material include acrylic resin, silicon resin, polyester resin, alkyd resin, epoxy resin, urethane resin, phenol resin, melamine resin, amino resin, polycarbonate resin, fluororesin, and acetic acid. Solvents such as vinyl resin, acrylic / vinyl acetate resin, acrylic / urethane resin, acrylic / silicone resin, silicon-modified acrylic resin, ethylene / vinyl acetate / veova resin, ethylene / vinyl acetate resin, vinyl chloride resin, ABS resin, AS resin, etc. Soluble type, NAD type, water soluble type, water dispersion type, solventless type, etc., or synthetic rubber such as chloroprene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, methyl methacrylate-butadiene rubber, butadiene rubber Of these, among these Or more can be used species or two or.

  Further, in the present invention, among the resin components, either one liquid type or two liquid type can be used, but the two liquid type is more preferable. For example, a two-component type composed of a compound containing a reactive functional group and a compound containing a reactive functional group capable of reacting with the reactive functional group is preferably used.

  Such reactive functional group combinations include hydroxyl group and isocyanate group, hydroxyl group and carboxyl group, hydroxyl group and imide group, hydroxyl group and aldehyde group, epoxy group and amino group, epoxy group and carboxyl group, carboxyl group. Group and carbodiimide group, carboxyl group and oxazoline group, carbonyl group and hydrazide group, carboxyl group and aziridine group, and the like.

  Further, as the combination of reactive functional groups, a combination of a compound containing a hydroxyl group and a compound containing an isocyanate group, a compound containing an epoxy group and a compound containing an amino group, etc. are particularly preferable. A combination of a compound containing and a compound containing an isocyanate group is preferred. Such a combination is preferable because the crosslinking reaction is likely to proceed under mild conditions and the adjustment of the crosslinking density and the like is easy.

For example, when using a compound containing a hydroxyl group and a compound containing an isocyanate group, the NCO / OH ratio is usually 0.1 to 1.8, preferably 0.2 to 1.5, more preferably 0.3. What is necessary is just to set in the range used as -1.3.
By being within such a range of the NCO / OH ratio, the strength of the porous body can be made strong, and a uniform and dense cross-linked structure with no leakage of the latent heat storage material can be obtained.
When the NCO / OH ratio is less than 0.1, the crosslinking rate is low, and sufficient physical properties such as curability, durability, and strength may not be ensured, and the latent heat storage material is likely to leak. When the NCO / OH ratio is larger than 1.8, unreacted isocyanate remains, adversely affects various physical properties of the porous body, the porous body is easily deformed, and the latent heat storage material is liable to leak.

  What is necessary is just to manufacture a porous body by a well-known method using the said component. Examples thereof include the methods described in Japanese Patent Application Nos. 2005-322930 and 2006-280575.

  The content ratio (filling rate) of the latent heat storage material in the porous body of the present invention is preferably 40% by weight or more, more preferably 50% by weight or more, more preferably 60% by weight or more, and most preferably 65% by weight or more.

  In the method of enclosing the latent heat storage material as it is in the film, for example, the latent heat storage material may be encapsulated using the above-described film.

The heat storage sheet of the present invention is the above-described latent heat storage material, or one encapsulating the latent heat storage material, one in which the latent heat storage material is filled in a porous body, and one in which the latent heat storage material is enclosed in a film. Although the thickness of a thermal storage sheet | seat is not specifically limited, Usually, about 1 mm-20 mm, Furthermore, about 2 mm-15 mm are preferable.
<Surface heating element>

The planar heating element of the present invention is not particularly limited, and a known planar heating element can be used.
As the planar heating element, for example, a nichrome wire meandering and disposed on the surface of the insulator, an electric resistance heating element and an electrode laminated, a PTC planar heating element, and the like can be cited.

The electric resistance heating element is not particularly limited as long as the electric resistance value is 1 × 10 ³ Ω · cm or less (preferably 1 × 10 ² Ω · cm or less). Those consisting of are preferred. When the electric resistance value of the electric resistance heating element is larger than 1 × 10 ³ Ω · cm, the power consumption is increased, which is not preferable.

Resin components include acrylic resin, polyester resin, acrylic silicon resin, silicon resin, urethane resin, epoxy resin, polyvinyl alcohol resin, butyral resin, amino resin, phenol resin, fluororesin, synthetic rubber, etc., or a composite resin of these Etc.
In the present invention, for example, urethane resin, epoxy resin, acrylic resin, silicon resin, phenol resin, synthetic rubber and the like are preferably used as the flexible resin.

  Examples of conductive powder include graphite powder, scaly graphite, flake graphite, carbon powder such as carbon nanotube, graphitized fiber, carbon fiber such as fiber carrying graphite, silver, gold, copper, nickel, aluminum Metal fine particles such as zinc, platinum, palladium, iron, etc., conductive fibers in which conductive components such as these metal fine particles are supported on the fiber surface, and metal fine particles on the surface of powder such as mica, mica, talc, titanium oxide In addition, a conductive powder supported on a conductive oxide, or a conductive oxide such as fluorine-doped tin oxide, tin-doped indium oxide, antimony-doped tin oxide, or conductive zinc oxide can be used.

The electric resistance heating element can be manufactured by mixing the conductive powder so as to be uniformly dispersed in the resin and forming the conductive powder into a film or a sheet by a known method.
The mixing amount of the conductive powder is not particularly limited, but it may be mixed so that the electric resistance value of the electric resistance heating element can be adjusted to 1 × 10 ³ Ω · cm or less, and the solid content of the resin component is 100 parts by weight. And 10 parts by weight or more and 300 parts by weight or less (preferably 30 parts by weight or more and 100 parts by weight or less).

Moreover, as long as the electrical resistance value is within a range of 1 × 10 ³ Ω · cm or less, in addition to the resin component, an antifoaming agent, a thickener, an antiseptic agent, an antibacterial agent, a denaturing agent, an ultraviolet ray absorbing agent, if necessary. Additives such as an agent, a curing agent, a curing catalyst, a film increasing aid, and a solvent can also be added.

  The thickness of the electric resistance heating element is preferably 3 mm or less. If it is thicker than 3 mm, the flexibility is lowered, and temperature unevenness is likely to occur in the electric resistance heating element, which may make it difficult to achieve a uniform temperature.

  The electrode is not particularly limited as long as the electric resistance value is lower than that of the electric resistance heating element. Preferably, an electrode made of metal fine particles and / or a paste in which these metal fine particles are mixed can be used. Although it does not specifically limit as metal microparticles, Silver, copper, gold | metal | money, platinum, etc. can be used.

  The electrode can be laminated on the electric resistance heating element by a known method. For example, it can be laminated by spraying, roller, brush coating, dip coating, sputtering, vapor deposition, screen printing method, doctor blade method and the like.

The PTC sheet heating element utilizes PTC (Positive Temperature Coefficient) characteristics, and is formed by printing a special heating ink exhibiting PTC characteristics on a resin film such as a polyester film or a PET film. can do. As a material for the special heat-generating ink, barium titanate-based ceramics that are made into a semiconductor by doping a small amount of rare earth elements such as yttrium, antimony, and lanthanum are used.
Such a PTC planar heating element quickly rises in temperature when energized due to the PTC characteristics, reaches a predetermined temperature, and can control and maintain the temperature itself, so there is no need to use a sensor controller.

Further, since the PTC sheet heating element is a printing method using the special heating ink, the PTC sheet heating element can be formed thin, and thus can be reduced in weight and thickness. Furthermore, this PTC planar heating element has a low resistance value from when the power is turned on until it reaches a predetermined temperature, so that power consumption required for temperature rise can be suppressed. Therefore, it can be heated efficiently.
<Floor material layer>

As the flooring layer of the present invention, resin tiles and resin sheets such as vinyl chloride and polyolefin, monolithic boards, flooring materials, plywood, particle boards, cork tiles and other wood materials, fiber materials, ceramic tiles and other ceramic materials Stone materials such as marble, granite, and terrazzo, concrete materials such as mortar, natural resin tiles such as rubber and linoleum, natural resin sheets, and the like can be used. Tatami mats, carpets, carpets, etc. can also be used as the flooring layer. In the present invention, those having heat resistance are more preferable.
The thickness of the flooring layer is usually 1 to 20 mm, preferably about 2 to 15 mm.
<Construction method>

  The floor heating structure of the present invention can be used in any case such as new construction or renovation, and can be laminated on a base material. In the present invention, a thin film can be formed, and it can be suitably used particularly in the case of reforming.

  It does not specifically limit as a base material, Concrete, mortar, a plywood, the existing flooring etc. are mentioned.

As a construction method, first, a heat storage sheet is spread on a base material to laminate a heat storage layer.
At this time, a storage space for storing the wiring cord of the planar heating element is provided in the heat storage layer. The method for providing the storage space is not particularly limited, but a method of providing a part of the storage space between the heat storage sheets when the heat storage sheets are laid, or a part of the heat storage sheet is cut out and stored after the heat storage sheets are laid down. And the like.
When a heat storage sheet filled with a latent heat storage material is used as the heat storage layer of the present invention, the latent heat storage material does not leak even if the heat storage sheet is cut off with a cutter, knife, etc. Can be provided.
Such a storage space may be provided as appropriate so that the wiring cord and the power source can be easily connected. The width of the storage space may be appropriately set depending on the type of the wiring cord, the laminated area of the planar heating element, etc., but is usually about 1 cm to 10 cm. The length of the storage space may be appropriately set depending on the planar heating element to be laminated.

Next, a wiring cord is stored in the storage space, and a sheet heating element is laminated.
The lamination area of the planar heating element may be set as appropriate, but the planar heating element may be laminated on the entire surface of the heat storage layer, or may be laminated only on a part of the heat storage layer.
Further, the storage space is filled with a heat storage body containing a latent heat storage material.
There is a gap in the storage space in which the wiring code is stored. In the present invention, a decrease in thermal efficiency can be suppressed by filling a heat storage material containing a latent heat storage material so that heat does not escape from such a gap. As a method of filling the heat storage body, for example, the above-mentioned heat storage body forming component may be applied to the storage space in a liquid state and solidified, or the heat storage sheet made of the above heat storage body forming component may have a predetermined size in advance. And may be molded into a storage space. In the present invention, it is advantageous and preferable in terms of construction to use a heat storage sheet left over when the heat storage layer is laminated, a heat storage sheet cut out when forming the storage space, or the like. Moreover, you may laminate | stack the heat-resistant layer mentioned later between a wiring cord and a thermal storage body and between a wiring cord and a thermal storage sheet | seat as needed.

  Furthermore, a flooring layer is laminated thereon. Since the planar heating element and the heat storage layer surface on which the flooring layers are laminated are substantially flat, they can be easily laminated.

  For laminating the heat storage layer, the planar heating element, and the flooring layer, a known adhesive or adhesive tape can be used as necessary.

In the present invention, the thickness of the floor heating structure is preferably 25 mm or less, preferably 20 mm or less, and more preferably 15 mm or less. By reducing the film thickness to 25 mm or less and reducing the weight, it can be easily constructed. In particular, in renovation, the comfortable living space can be maintained without being compressed after the construction.
In addition, the floor heating structure of the present invention has excellent heat storage performance, and even if the thickness is as thin as 25 mm, it suppresses the escape of heat under the floor during floor heating operation, and after the floor heating is stopped, It is possible to prevent a sudden decrease in the room temperature and the floor temperature. Therefore, the amount of power consumption can be suppressed and a comfortable living environment can be maintained.

<Heat resistant layer>
In the floor heating structure of the present invention, a heat-resistant layer can be laminated between the heat storage layer and the planar heating element.
By laminating the heat-resistant layer, deformation of the heat storage layer can be suppressed against an excessive temperature rise such as a heating wire.
Examples of the heat resistant layer include a glass layer having a heat resistant temperature of 100 ° C. or higher, a metal layer, a heat resistant resin layer, and the like. In consideration of the thinness in the present invention, the thickness of the heat-resistant layer is preferably 5 mm or less.
In addition, the heat-resistant temperature as used in the field of this invention means the upper limit temperature which a heat-resistant layer does not deform | transform. That is, when the temperature is higher than the heat resistant temperature, the heat resistant layer may be deformed.

  Examples of the glass layer include a glass plate or a glass fiber layer in which glass fibers are arranged in a mesh, spots or randomly.

  Examples of the metal layer include one or more metals selected from aluminum, gold, silver, copper, iron, chromium, zinc, magnesium, titanium, nickel, bismuth, tin, and cobalt, or oxides and chlorides of these metals. , Sulfides, carbonates, silicates, phosphates, nitrates, sulfates, and composites containing one or more selected from these.

  Examples of the heat-resistant resin layer include those in which one or more of synthetic resins such as polyethylene terephthalate and polypropylene are formed in a plate shape or a film shape.

By laminating such a heat-resistant layer, it is possible to suppress deformation and combustion of the heat storage layer accompanying an excessive increase in temperature. Furthermore, leakage of the latent heat storage material associated with deformation of the heat storage layer can be prevented.
In addition, such a heat-resistant layer also has a soaking effect that makes the entire floor surface a uniform temperature. For example, when a planar heating element is laminated on a part of the floor surface, Can be spread over the entire surface. In particular, by laminating a layer having a high thermal conductivity such as a metal layer, a more excellent soaking effect can be exhibited.
In addition, a rapid increase in temperature can be prevented by laminating a glass layer having a low thermal conductivity and a heat-resistant resin layer.
In the present invention, in addition to heat resistance, considering a soaking effect and an effect of preventing a rapid temperature rise, a heat resistant layer obtained by laminating a metal layer, a glass layer and / or a heat resistant resin layer, and further, a metal layer and a glass layer A heat-resistant layer in which is laminated can be suitably applied. Moreover, you may laminate | stack a metal layer, a glass layer, and / or a heat-resistant resin layer by two layers or 3 layers or more.

  In the present invention, when the heat-resistant layer is formed by laminating a metal layer and a glass layer and / or a heat-resistant resin layer, the heat-resistant layer is laminated so that the glass layer or the heat-resistant resin layer is laminated at least on the heat storage layer side. Are preferably laminated.

The method of laminating the heat-resistant layer is not particularly limited, but the method of laminating the heat storage sheet and the heat-resistant layer in advance by the above-described method, the method of laminating the heat-storage sheet and then laminating the heat-resistant layer, and the sheet heat generation in advance. And a method of laminating a body and a heat-resistant layer by the above-described method.
The heat-resistant layer only needs to be laminated at least where the planar heating element is laminated, and may be laminated on the entire surface of the heat storage layer. In the storage space, the heat-resistant layer may be laminated after filling the heat storage body.

<Insulation layer>
In the present invention, a heat insulating layer can be further laminated.
By laminating the heat insulating layer, it is possible to moderate the external temperature change and to efficiently heat the heat generated by the planar heating element to the outside and to warm the floor surface efficiently.

  Although it does not specifically limit as a location which laminates | stacks a heat insulation layer, Between a base material or the existing flooring and a thermal storage layer is preferable. Moreover, although a heat insulation layer can be newly laminated | stacked, you may use the heat insulation layer which already exists.

  Although it does not specifically limit as a heat insulation layer, Thermal conductivity is less than 0.1 W / (m * K) (More preferably, 0.08 W / (m * K) or less, More preferably, 0.05 W / (m * K) It is preferable that it has the heat insulation property of the following). When the thermal conductivity is less than 0.1 W / (m · K), it has excellent heat insulating properties.

  Examples of such a heat insulating layer include polystyrene foam, polyurethane foam, acrylic resin foam, phenol resin foam, polyethylene resin foam, foam rubber, glass wool, rock wool, foam ceramic, and the like, or a composite thereof. Etc. Moreover, you may use a commercially available heat insulation layer.

  The thickness of the heat insulating layer is usually preferably 1 mm or more and 30 mm or less.

Example 1
As shown in FIG. 1, the heat storage sheet 1 was spread on a base material (plywood: 620 × 360 mm, thickness 5 mm), and a heat storage layer was laminated. At this time, a storage space for storing the wiring cord of the planar heating element was provided (the width of the storage space: 3 cm).
Next, as shown in FIG. 2, the wiring cord was stored in the storage space, and the planar heating elements were stacked.
Next, as shown in FIG. 3, the heat storage sheet 1 was cut into a predetermined size so that the storage space could be filled, and the heat storage sheet 1 was filled into the storage space. At this time, no leakage of the latent heat storage material from the heat storage sheet 1 was observed.
Next, as shown in FIG. 4, a flooring layer was laminated on the planar heating element to obtain a floor heating structure.
Thermal storage sheet 1: 80 parts by weight of methyl palmitate (phase change temperature 30.0 ° C., latent heat 200 kJ / kg), solventless polyester polyol (polycondensation of 2,4-diethyl-1,5-pentamethylenediol and adipic acid 15.8 parts by weight, hydroxyl value 58 mg KOH / g, molecular weight 2000), 4.2 parts by weight of HMDI polyisocyanate (isocyanurate type, NCO% 17.4% (solid content 100%)) at 35 ° C. Then, 0.1 part by weight of dibutyltin dilaurate was added and sufficiently stirred. After stirring, it was poured into a 300 × 180 × 5 mm mold, cured at 50 ° C. for 180 minutes, and demolded to obtain a heat storage sheet 1 filled with a latent heat storage material. The NCO / OH ratio was 1.0.
Planar heating element: Silicon rubber heater (300 x 180 mm, thickness 2 mm) with nichrome wire meandering in silicon rubber
Floor material layer: heat-resistant flooring (300 x 180 mm, thickness 12 mm)

(Example 2)
As shown in FIG. 5, the heat storage sheet 1 / heat-resistant layer 1 laminate is placed on a base material (plywood: 620 × 360 mm, thickness 5 mm) so that the planar heating element and the heat-resistant layer 1 side described later are in contact with each other. The heat storage layer was laminated and spread. At this time, no leakage of the latent heat storage material from the heat storage sheet 1 was observed. In addition, a storage space for storing the wiring cord of the planar heating element was provided (storage space width: 3 cm).
Next, as shown in FIG. 6, the wiring cord was stored in the storage space, and the planar heating elements were stacked.
Next, as shown in FIG. 7, the heat storage sheet was cut into a predetermined size so that the storage space could be filled, and the storage space was filled with the heat storage sheet.
Next, as shown in FIG. 8, a flooring layer was laminated on the planar heating element to obtain a floor heating structure.
Heat storage sheet 1 / heat-resistant layer 1 laminate: 80 parts by weight of methyl palmitate (phase change temperature 30.0 ° C., latent heat 200 kJ / kg), solvent-free polyester polyol (2,4-diethyl-1,5-pentamethylenediol) And adipic acid polycondensate, hydroxyl value 58 mg KOH / g, molecular weight 2000) 15.8 parts by weight, HMDI polyisocyanate (isocyanurate type, NCO% 17.4% (solid content 100%)) 4.2 parts by weight Were uniformly mixed at a temperature of 35 ° C., 0.1 part by weight of dibutyltin dilaurate was added, and the mixture was sufficiently stirred. After stirring, it is poured into a 300 x 180 x 5 mm mold with a heat-resistant layer 1 (100 µm polyethylene terephthalate film (PET film)), cured at 50 ° C for 180 minutes, demolded, and filled with a latent heat storage material A laminate of the heat storage sheet 1 and the PET film (heat-resistant layer 1) was obtained. The NCO / OH ratio was 1.0.

(Example 3)
A floor heating structure was obtained in the same manner as in Example 2 except that the heat storage sheet 1 / heat resistant layer 1 laminate was replaced with the heat storage sheet 1 / heat resistant layer 2 laminate. At this time, no leakage of the latent heat storage material from the heat storage sheet 1 was observed.
Thermal storage sheet 1 / heat-resistant layer 2 laminate: 80 parts by weight of methyl palmitate (phase change temperature 30.0 ° C., latent heat 200 kJ / kg), solvent-free polyester polyol (2,4-diethyl-1,5-pentamethylenediol) And adipic acid polycondensate, hydroxyl value 58 mg KOH / g, molecular weight 2000) 15.8 parts by weight, HMDI polyisocyanate (isocyanurate type, NCO% 17.4% (solid content 100%)) 4.2 parts by weight Were uniformly mixed at a temperature of 35 ° C., 0.1 part by weight of dibutyltin dilaurate was added, and the mixture was sufficiently stirred. After stirring, it is poured into a 300 × 180 × 5 mm formwork laid with a heat-resistant layer 2 (100 μm aluminum-coated cloth (aluminum / glass fiber layer)) so that the glass fiber layer side contacts the heat storage sheet 1 side. The laminate was cured at 50 ° C. for 180 minutes and demolded to obtain a laminate of the heat storage sheet 1 and the PET film (heat-resistant layer 1) filled with the latent heat storage material. The NCO / OH ratio was 1.0.

Example 4
As shown in FIG. 9, the heat storage sheet 1 was spread on a base material (plywood: 620 × 360 mm, thickness 5 mm) to stack a heat storage layer. Furthermore, as shown in FIG. 10, a part of the heat storage sheet 1 was cut out with a cutter to provide a storage space for storing the wiring cord of the planar heating element (the width of the storage space: 3 cm). At this time, no leakage of the latent heat storage material from the heat storage sheet 1 was observed.
Next, as shown in FIG. 11, the wiring cord was stored in the storage space, and the planar heating elements were stacked.
Next, as shown in FIG. 12, a part of the heat storage sheet 1 cut by the cutter was filled in the storage space.
Next, as shown in FIG. 13, a flooring layer was laminated on the planar heating element to obtain a floor heating structure.

(Comparative Example 1)
As shown in FIG. 1, the heat storage sheet 1 was spread on a base material (plywood: 620 × 360 mm, thickness 5 mm), and a heat storage layer was laminated. At this time, a storage space for storing the wiring cord of the planar heating element was provided (the width of the storage space: 3 cm).
Next, as shown in FIG. 2, the wiring cord was stored in the storage space, and the planar heating elements were stacked.
Next, as shown in FIG. 14, a flooring layer was laminated on the planar heating element to obtain a floor heating structure.

(Floor heating performance evaluation)
A test specimen box with polystyrene foam with a thickness of 25 mm on the side and top surface, and with the floor material layer side of the floor heating structure on the bottom so that the inner dimension is 620 x 360 x 200 mm Was made.
Further, thermocouples were respectively installed at the surface of the floor heating structure (above the wiring cord) and at a height of 100 mm from the surface of the floor heating structure.
Moreover, in order to make surface temperature constant on the floor heating structure surface, the temperature control apparatus (a temperature controller, a transformer) was attached to the floor surface.
This test body box was installed in a thermostat and the following experiment was conducted.
The temperature in the thermostat was set to 10 ° C. and left for 15 hours. Thereafter, the sheet heating element was heated for 180 minutes while the temperature in the thermostat was set to 10 ° C. The floor surface was set to be constant at 30 ° C. by a temperature control device (temperature controller, transformer).
As the floor heating performance evaluation, the following temperatures (1) and (2) were measured.
(1) The floor heating structure surface temperature (surface temperature) 60 minutes after the heating of the planar heating element and the temperature (space temperature) at a position 100 mm in height from the floor heating structure surface were measured.
(2) Moreover, after heating for 180 minutes, heating was stopped and the surface temperature and space temperature 60 minutes after the stop were measured.
As a result, (1) the temperature of 60 minutes after the heating, the surface temperature of Examples 1 to 4 and Comparative Example 1 was 30.0 ° C., and the space temperature of Examples 1 to 4 and Comparative Example 1 was 19 It was 0 ° C to 20.0 ° C.
(2) The temperature of 60 minutes after stopping the heating is that the surface temperature of Examples 1 to 4 is 20.0 ° C. to 21.0 ° C., whereas the surface temperature of Comparative Example 1 is 18.8 ° C. there were. The space temperature of Examples 1 to 4 was 16.0 ° C to 17.0 ° C, while the space temperature of Comparative Example 1 was 13.5 ° C.

It is a model figure of the construction process of the floor heating structure in Example 1. FIG. It is a model figure of the construction process of the floor heating structure in Example 1. FIG. It is a model figure of the construction process of the floor heating structure in Example 1. FIG. It is a model figure of the floor heating structure obtained in Example 1. FIG. It is a model figure of the construction process of the floor heating structure in Example 2, 3. FIG. It is a model figure of the construction process of the floor heating structure in Example 2, 3. FIG. It is a model figure of the construction process of the floor heating structure in Example 2, 3. FIG. It is a model figure of the floor heating structure obtained in Examples 2 and 3. It is a model figure of the construction process of the floor heating structure in Example 4. It is a model figure of the construction process of the floor heating structure in Example 4. It is a model figure of the construction process of the floor heating structure in Example 4. It is a model figure of the construction process of the floor heating structure in Example 4. It is a model figure of the floor heating structure obtained in Example 4. It is a model figure of the floor heating structure obtained in the comparative example 1.

Claims (5)

A floor heating structure in which a planar heating element and a flooring layer are laminated on a heat storage layer,
The heat storage layer is formed by laying a heat storage sheet containing a latent heat storage material, and a storage space is provided in a part of the heat storage layer, and a wiring code of a planar heating element is stored in the storage space. Furthermore, the floor heating structure characterized by being filled with the thermal storage body containing a latent-heat thermal storage material. A floor heating structure in which a heat-resistant layer, a planar heating element, and a flooring layer are laminated on the heat storage layer,
The heat storage layer is formed by laying a heat storage sheet containing a latent heat storage material, and a storage space is provided in a part of the heat storage layer, and a wiring code of a planar heating element is stored in the storage space. Furthermore, the floor heating structure characterized by being filled with the thermal storage body containing a latent-heat thermal storage material. On the base material, a storage space for storing the wiring cord of the planar heating element is provided, and a heat storage layer containing a latent heat storage material is spread and a heat storage layer is laminated,
The wiring code of the sheet heating element is stored in the storage space, the sheet heating element is laminated on the heat storage layer, and the storage space is further filled with a heat storage element containing a latent heat storage material,
A floor heating structure construction method characterized by laminating a flooring layer thereon. Laminating a heat storage sheet containing a latent heat storage material on the base material, laminating the heat storage layer,
In a part of the heat storage layer, a storage space for storing the wiring cord of the planar heating element is provided,
The wiring code of the sheet heating element is stored in the storage space, the sheet heating element is laminated on the heat storage layer, and the storage space is further filled with a heat storage element containing a latent heat storage material,
Furthermore, a floor heating layer is laminated thereon, and a floor heating structure construction method is provided. The construction method of the floor heating structure according to claim 3 or 4, wherein a heat-resistant layer is laminated between the heat storage layer and the planar heating element.

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