JP7371473B2 - Coil parts and their manufacturing method - Google Patents

Description

The present invention relates to a coil component and a method for manufacturing the same, and more particularly to a coil component having a structure in which a plurality of spirally wound coil patterns are stacked, and a method for manufacturing the same.

As a coil component having a structure in which a plurality of spirally wound coil patterns are stacked, a coil component described in Patent Document 1 is known. The coil component described in Patent Document 1 forms a first coil pattern and a first sacrificial pattern located in the first layer, and further includes a second coil pattern located in the second layer via an insulating layer. and a second sacrificial pattern are formed, and then the first and second sacrificial patterns are removed. Here, when each conductor pattern is formed by electrolytic plating, a plating film is grown by applying a predetermined potential to the underlying power supply pattern.

Japanese Patent Application Publication No. 2018-160610

However, when the number of turns in the coil pattern increases, even if power is supplied from the outer edge, the potential of the power supply pattern decreases as it approaches the inner edge, and as a result, the film thickness of the coil pattern decreases as it approaches the inner edge. A phenomenon of thinning occurs. This causes a problem in that the flatness of the coil pattern decreases and the cross-sectional area of the coil pattern decreases as it approaches the inner peripheral end, resulting in an increase in resistance value.

Therefore, the present invention suppresses the phenomenon that the film thickness of the coil pattern becomes thinner as it approaches the inner peripheral end in a coil component having a structure in which a plurality of spirally wound coil patterns are stacked and a method for manufacturing the same. The purpose is to

A coil component according to the present invention includes a first insulating layer, a power feeding pattern provided on the first insulating layer, a first coil pattern provided on the first insulating layer, and a first coil. A first conductor layer including a first electrode pattern connected to the outer peripheral edge of the pattern and overlapping a part of the power supply pattern, and provided on the first insulating layer so as to cover the first conductor layer. comprising a second insulating layer and a second conductor layer provided on the second insulating layer and including a second coil pattern whose inner peripheral end is connected to the inner peripheral end of the first coil pattern, The first power supply pattern is characterized by having a thinner film thickness than the first conductor layer.

According to the present invention, since the first power feeding pattern is provided at the outer peripheral end of the first coil pattern, when forming the second coil pattern by electrolytic plating, not only the outer peripheral end side but also the first power feeding pattern is provided. It is also possible to supply power from the inner peripheral end side through the coil pattern. This improves the flatness of the second coil pattern and makes it possible to obtain a designed resistance value. Moreover, since the first power supply pattern is thinner than the first conductor layer, when etching the sacrificial pattern using an etching solution such as acid, the etching solution can easily reach the first electrode pattern. do not. In other words, the etching can be completed with a portion of the first power supply pattern remaining unetched.

In the present invention, the width of the portion of the first power supply pattern exposed from the first electrode pattern may be narrower than the width of the first coil pattern. According to this, it becomes even more difficult for an etching solution such as an acid to reach the first electrode pattern. In this case, the width of the portion of the first power feeding pattern covered by the first electrode pattern may be wider than the width of the portion of the first power feeding pattern exposed from the first electrode pattern. According to this, it becomes possible to make the electrical connection between the first electrode pattern and the first power supply pattern more reliable.

In the present invention, the second conductor layer further includes a second electrode pattern overlapping with and connected to the first electrode pattern, and the first electrode pattern is connected to the second electrode pattern. It does not matter if the plane size is smaller than that. According to this, it becomes possible to secure a sufficient area for arranging the first power feeding pattern.

In this case, the exposed area of the first electrode pattern may be smaller than the exposed area of the second electrode pattern. According to this, since the exposed area of the first electrode pattern is small, when it is mounted on a motherboard using solder, it is possible to prevent the solder fillet from spreading excessively. Further, in this case, the first conductor layer further includes a third electrode pattern disposed on the opposite side of the first electrode pattern when viewed from the first coil pattern, and the second conductor layer further includes a third electrode pattern disposed on the opposite side of the first electrode pattern when viewed from the first coil pattern. The third electrode pattern further includes a fourth electrode pattern overlapping with and connected to the third electrode pattern, the third electrode pattern having a smaller planar size than the fourth electrode pattern, and the third electrode pattern having a smaller planar size than the fourth electrode pattern. The exposed area of may be smaller than the exposed area of the fourth electrode pattern. According to this, since the exposed area of the third electrode pattern is small, it is possible to prevent the solder fillet from spreading excessively when it is mounted on a motherboard using solder. Furthermore, in this case, the second power feeding pattern may be provided on the first insulating layer, partially overlapping the third electrode pattern, and having a thinner film thickness than the third electrode pattern. I do not care. According to this, since the symmetry of the pattern is improved, it becomes possible to suppress warping of the substrate during the manufacturing process.

A coil component according to the present invention includes a magnetic element in which first and second insulating layers and first and second conductor layers are embedded, and a magnetic element embedded in the magnetic element and connected to the first and second conductor patterns. The magnetic element has a bottom surface perpendicular to the axial direction of the first and second coil patterns and a side surface parallel to the axial direction. The first and second electrode patterns are exposed from the bottom and side surfaces, and the first and second electrode patterns are exposed from the side surfaces of the magnetic element, and the exposed width on the side surfaces of the first electrode pattern may be narrower than the exposed width on the side surfaces of the conductor post. do not have. According to this, by mounting the magnetic element on the motherboard using solder so that the bottom surface of the magnetic element faces the motherboard, fillets can be formed on the bottom and side surfaces of the magnetic element, and excessive fillets on the side surfaces can be formed. It becomes possible to prevent the spread.

The method for manufacturing a coil component according to the present invention includes a first step of forming a power feeding pattern on a first insulating layer, a first coil pattern, and an outer peripheral end of the first coil pattern on the first insulating layer. and a first electrode pattern that is connected to and overlaps the first section of the power supply pattern, and a second electrode pattern of the power supply pattern that is connected to the first section of the power supply pattern and overlaps with the first section of the power supply pattern, and a second step of forming by electrolytic plating a first conductor layer that includes a first sacrificial pattern that overlaps with the section; a third step of forming a second insulating layer on the first insulating layer; and a second step of forming a second insulating layer on the second insulating layer, the inner circumferential end of which is connected to the inner circumferential end of the first coil pattern. a fourth step of forming, by electrolytic plating, a second conductor layer including a coil pattern and a second sacrificial pattern that contacts the first sacrificial pattern without in-plane contact with the second coil pattern; a fifth step of removing the first and second sacrificial patterns, the power supply pattern is thinner than the first conductor layer, and the power supply pattern is It is characterized in that power is supplied to the first and second coil patterns, respectively, through the coil patterns.

According to the present invention, when the second coil pattern is formed by electrolytic plating, power is supplied not only from the outer peripheral end side but also from the inner peripheral end side via the first coil pattern. The flatness of the pattern is improved, and it becomes possible to obtain the designed resistance value. Moreover, since the first power supply pattern is thinner than the first conductor layer, when etching the first and second sacrificial patterns using an etching solution such as acid, the etching solution is The electrode pattern cannot be easily reached.

In the present invention, the length between the first section and the second section of the power feeding pattern is determined by the length of the first electrode pattern that is in contact with the first section of the power feeding pattern, and the portion of the first sacrificial pattern that is in contact with the first section of the power feeding pattern. The distance may be longer than the straight line distance between the portion of the pattern that is in contact with the second section. According to this, when etching the first and second sacrificial patterns using an etching solution such as an acid, it becomes more difficult for the etching solution to reach the first electrode pattern.

As described above, according to the present invention, in a coil component having a structure in which a plurality of spirally wound coil patterns are stacked, and a method for manufacturing the same, the film thickness of the coil pattern becomes thinner as it approaches the inner peripheral end. It becomes possible to suppress this phenomenon.

FIG. 1 is a schematic perspective view showing the appearance of a coil component 1 according to a preferred embodiment of the present invention. FIG. 2 is an xy plan view of the coil component 1. FIG. 3 is a schematic cross-sectional view taken along line AA shown in FIG. FIG. 4 is a yz side view for explaining the shape of the terminal electrode E1. FIG. 5 is an xy plan view for explaining the pattern shape of the conductor layer 10. FIG. 6 is a schematic perspective view taken along line BB shown in FIG. FIG. 7 is a process diagram for explaining the method for manufacturing the coil component 1. FIG. 8 is a process diagram for explaining the method for manufacturing the coil component 1. FIG. 9 is a process diagram for explaining the method for manufacturing the coil component 1. FIG. 10 is a process diagram for explaining the method for manufacturing the coil component 1. FIG. 11 is a process diagram for explaining the method for manufacturing the coil component 1. FIG. 12 is a process diagram for explaining the method for manufacturing the coil component 1. FIG. 13 is a process diagram for explaining the method for manufacturing the coil component 1. FIG. 14 is a process diagram for explaining the method for manufacturing the coil component 1. FIG. 15 is a process diagram for explaining the method for manufacturing the coil component 1. FIG. 16 is a process diagram for explaining the method for manufacturing the coil component 1. FIG. 17 is a process diagram for explaining the method for manufacturing the coil component 1. FIG. 18 is an enlarged view for explaining the planar shape of the power feeding pattern FP. FIG. 19 is an enlarged view for explaining the planar shape of the power feeding pattern FP according to the first modification. FIG. 20 is an enlarged view for explaining the planar shape of the power feeding pattern FP according to the second modification.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic perspective view showing the appearance of a coil component 1 according to a preferred embodiment of the present invention. 2 is an xy plan view of the coil component 1, and FIG. 3 is a schematic cross-sectional view taken along the line AA shown in FIG.

The coil component 1 according to the present embodiment is a surface-mounted chip component suitable for use as an inductor for a power supply circuit, and as shown in FIGS. It includes an embedded coil portion C and a pair of conductor posts BP1 and BP2. Although the structure of the coil portion C will be described later, in this embodiment, four conductor layers each having a spiral coil pattern are laminated, thereby forming one coil conductor. One end of the coil conductor is connected to the conductor post BP1, and the other end of the coil conductor is connected to the conductor post BP2.

The magnetic element M is a composite member made of resin containing magnetic powder, and constitutes a magnetic path for magnetic flux generated by passing a current through the coil conductor. As the magnetic powder, magnetic metals such as iron (Fe) and permalloy materials, and magnetic oxides such as ferrite can be used. As the resin, a liquid or powdered epoxy resin can be used.

As shown in FIG. 3, the coil portion C included in the coil component 1 has a structure in which insulating layers 51 to 55 and conductor layers 10, 20, 30, and 40 are alternately laminated. Each of the conductor layers 10, 20, 30, and 40 has spiral coil patterns CP1 to CP4, and the top, bottom, and side surfaces of the coil patterns CP1 to CP4 are covered with insulating layers 51 to 55.

Coil patterns CP1 to CP4 constitute coil conductors by being connected to each other via through holes formed in insulating layers 52 to 54. It is preferable to use copper (Cu) as the material for the conductor layers 10, 20, 30, 40 and the conductor posts BP1, BP2. The magnetic element M is also embedded in the inner diameter region and outer diameter region of the coil patterns CP1 to CP4. Among the insulating layers 51 to 55, at least the insulating layers 52 to 54 are made of nonmagnetic material. A magnetic material may be used for the insulating layers 51 and 55.

The conductor layer 10 is a conductor layer located at the bottom layer, but as shown in FIG. 3, during actual use, it is mounted upside down on a motherboard, etc., so it is located at the top layer during actual use. . The conductor layer 10 is provided with a coil pattern CP1 spirally wound with approximately four turns and two electrode patterns 11 and 12. The lower and side surfaces of the coil pattern CP1 and the electrode patterns 11 and 21 are covered with an insulating layer 51, and the upper surfaces are covered with an insulating layer 52. In a predetermined cross section, the outer peripheral end of the coil pattern CP1 and the electrode pattern 11 are connected. In contrast, the electrode pattern 12 is provided independently of the coil pattern CP1.

The conductor layer 20 is a second conductor layer formed on the upper surface of the conductor layer 10 with the insulating layer 52 interposed therebetween. The conductor layer 20 is provided with a coil pattern CP2 spirally wound with approximately 3.9 turns and two electrode patterns 21 and 22. The lower and side surfaces of the coil pattern CP2 and the electrode patterns 21 and 22 are covered with an insulating layer 52, and the upper surfaces are covered with an insulating layer 53. The inner peripheral end of the coil pattern CP2 is connected to the inner peripheral end of the coil pattern CP1 via a through hole formed in the insulating layer 52. The electrode patterns 21 and 22 are both provided independently of the coil pattern CP2, and are connected to the electrode patterns 11 and 12, respectively, through through holes formed in the insulating layer 52.

The conductor layer 30 is a third conductor layer formed on the upper surface of the conductor layer 20 with an insulating layer 53 interposed therebetween. The conductor layer 30 is provided with a coil pattern CP3 spirally wound with approximately 3.6 turns and two electrode patterns 31 and 32. The lower and side surfaces of the coil pattern CP3 and the electrode patterns 31, 31 are covered with an insulating layer 53, and the upper surfaces are covered with an insulating layer 54. The outer peripheral end of the coil pattern CP3 is connected to the outer peripheral end of the coil pattern CP2 via a through hole formed in the insulating layer 53. The electrode patterns 31 and 32 are both provided independently of the coil pattern CP3, and are connected to the electrode patterns 21 and 22, respectively, through through holes formed in the insulating layer 53.

The conductor layer 40 is a fourth conductor layer formed on the upper surface of the conductor layer 30 with the insulating layer 54 interposed therebetween. The conductor layer 40 is provided with a coil pattern CP4 spirally wound with approximately four turns and two electrode patterns 41 and 42. The lower and side surfaces of the coil pattern CP4 and the electrode patterns 41 and 42 are covered with an insulating layer 54, and the upper surfaces are covered with an insulating layer 55. The inner peripheral end of the coil pattern CP4 is connected to the inner peripheral end of the coil pattern CP3 via a through hole formed in the insulating layer 54. In a predetermined cross section, the outer peripheral end of the coil pattern CP4 and the electrode pattern 42 are connected. In contrast, the electrode pattern 41 is provided independently of the coil pattern CP4. The electrode patterns 41 and 42 are connected to the electrode patterns 31 and 32, respectively, through through holes formed in the insulating layer 54.

The conductor post BP1 is connected to the electrode pattern 41 through a through hole formed in the insulating layer 55, and the conductor post BP2 is connected to the electrode pattern 42 through a through hole formed in the insulating layer 55. . As a result, a coil conductor of 15.5 turns is formed by the coil patterns CP1 to CP4, one end of which is connected to the conductor post BP1, and the other end is connected to the conductor post BP2. As shown in FIG. 3, the height of the conductor posts BP1 and BP2 in the stacking direction is higher than the height of each of the coil patterns CP1 to CP4.

In this embodiment, the side surfaces of the electrode patterns 11, 21, 31, and 41 and the conductor post BP1 are exposed on one yz side surface of the magnetic element M, and constitute the terminal electrode E1. Further, the side surfaces of the electrode patterns 12, 22, 32, and 42 and the conductor post BP2 are exposed on the other yz side surface of the magnetic element M, and constitute a terminal electrode E2. The yz side surface is a surface parallel to the axial direction of the coil patterns CP1 to CP4. Further, the conductor posts BP1 and BP2 are also exposed on the xy bottom surface of the magnetic element M. The xy bottom surface is a surface perpendicular to the axial direction of the coil patterns CP1 to CP4. As a result, when the coil component 1 is mounted on the motherboard using solder so that the xy bottom surface of the magnetic element M faces the motherboard, fillets are formed on the bottom and side surfaces of the magnetic element M. In the example shown in FIG. 3, the side surfaces of the electrode patterns 11, 12, 21, 22, 31, 32, 41, and 42 are completely exposed, and the bottom and side surfaces of the conductor posts BP1 and BP2 are completely exposed. However, this point is not essential in the present invention, and a conductive paste or the like may be formed on the exposed surfaces of the electrode patterns 11, 12, 21, 22, 31, 32, 41, 42 and the conductor posts BP1, BP2. .

FIG. 4 is a yz side view for explaining the shape of the terminal electrode E1.

As shown in FIG. 4, the exposed widths W2 in the y direction of the electrode patterns 21, 31, and 41 constituting the terminal electrode E1 are substantially the same. Further, the exposed width W3 of the conductor post BP1 in the y direction is slightly wider than W2, but the two may be the same. On the other hand, the exposed width W1 of the electrode pattern 11 in the y direction is narrower than the exposed width W2. Thereby, when the coil component 1 according to this embodiment is mounted on a motherboard, excessive spread of the solder fillet above the terminal electrode E1 can be suppressed. Further, on the yz side surface of the magnetic element M, a via conductor 61 connects the electrode pattern 11 and the electrode pattern 21, a via conductor 62 connects the electrode pattern 21 and the electrode pattern 31, and a via conductor 62 connects the electrode pattern 31 and the electrode pattern 41. The via conductor 63 and the via conductor 64 connecting the electrode pattern 41 and the conductor post BP1 are also exposed. Among these, the via conductor 61 is arranged approximately at the center of the terminal electrode E1 in the y direction, whereas the via conductors 62 to 64 are all arranged offset to one side or the other side in the y direction. has been done. Specifically, the via conductors 62 and 64 are arranged offset in the +y direction (left side in FIG. 4), and the via conductor 63 is arranged offset in the -y direction (right side in FIG. 4). There is. In this way, by alternating the offset directions of the via conductors 62 to 64, the level difference in the formation position of the via conductors is alleviated, and the solder fillet becomes difficult to rise in the height direction (-z direction). , excessive spread of the solder fillet is suppressed.

FIG. 5 is an xy plan view for explaining the pattern shape of the conductor layer 10.

As shown in FIG. 5, the conductor layer 10 includes a spiral coil pattern CP1 wound approximately four turns, an electrode pattern 11 connected to the outer peripheral end of the coil pattern CP1, and an electrode pattern seen from the coil pattern CP1. It has an electrode pattern 12 provided on the opposite side to 11. Power feeding patterns FP1 and FP2 are connected to the electrode patterns 11 and 12, respectively. The power supply patterns FP1 and FP2 are made of thin conductors located between the insulating layer 51 and the conductor layer 10. In the example shown in FIG. 5, the power supply pattern FP1 has a shape that extends from the electrode pattern 11 in the +y direction and is further bent in the -x direction. Further, the power supply pattern FP2 has a shape that extends from the electrode pattern 12 in the −y direction and is further bent in the +x direction. Although it is not essential that the power supply patterns FP1 and FP2 have such a bent shape, it is preferable that at least a portion extending in the +y direction or the −y direction remains.

The power feeding pattern FP1 overlaps the electrode patterns 21, 31, 41 and the conductor post BP1 in a plan view, and is determined by the difference between the width W1 of the electrode pattern 11 and the widths W2, W3 of the electrode patterns 21, 31, 41 and the conductor post BP1. Power feeding pattern FP1 is arranged in the corresponding area. Similarly, the power feeding pattern FP2 overlaps the electrode patterns 22, 32, 42 and the conductor post BP2 in a plan view, and the width W1 of the electrode pattern 12 and the width W2, W3 of the electrode patterns 22, 32, 42 and the conductor post BP2. Power feeding pattern FP2 is arranged in an area corresponding to the difference between .

FIG. 6 is a schematic perspective view taken along line BB shown in FIG.

As shown in FIG. 6, the power supply pattern FP1 and the conductor layer 10 are both formed on the surface of the insulating layer 51, but the power supply pattern FP1 is located in the lower layer, and its film thickness is considerably greater than that of the conductor layer 10. thin. This is because the conductor layer 10 is a thick film formed by electrolytic plating, whereas the power supply pattern FP1 is made of, for example, metal foil. As shown in FIG. 6, a part of the power supply pattern FP1 overlaps with the electrode pattern 11, and the remaining part does not overlap with the electrode pattern 11. The power supply pattern FP1 is a conductor pattern used to supply power to the coil patterns CP1 to CP4 in the electrolytic plating process, and although it hardly contributes to the characteristics of the coil component 1 after manufacturing, it is a part where the power supply pattern FP1 does not overlap with the electrode pattern 11. The fact that this remains means that the etching solution used in the sacrificial pattern removal process described later has not corroded the electrode pattern 11. On the other hand, if the power supply pattern FP1 does not remain, there is a possibility that the electrode pattern 11 has been eroded by the etching solution, so such a product may be sorted out as a defective product, for example.

Next, a method for manufacturing the coil component 1 according to this embodiment will be described.

7 to 17 are process diagrams for explaining the method for manufacturing the coil component 1 according to this embodiment. The process drawings shown in FIGS. 7 to 9 show planes corresponding to two coil parts 1 adjacent in the x direction, and the process drawings shown in FIGS. 10 to 17 show planes or cross sections corresponding to one coil part 1. However, in reality, a large number of coil parts 1 can be manufactured by simultaneously manufacturing a large number of coil parts 1 using a collective substrate.

First, an insulating layer 51 is formed on the surface of a support substrate (not shown), and then the insulating layer 51 is patterned to form openings 51a and 51b (FIG. 7). The insulating layer 51 can be formed by a lamination method, and the openings 51a and 51b can be formed by patterning the insulating layer 51 by a photolithography method. The method for forming insulating layers 52 to 55 to be formed later is also similar. The opening 51a is provided at a position that overlaps with the outer area of the coil patterns CP1 to CP4, and the opening 51b is provided at a position that overlaps with the inner diameter area of the coil patterns CP1 to CP4. Furthermore, the insulating layer 51 is provided not only at positions overlapping with the coil patterns CP1 to CP4, but also at positions connecting two adjacent coil components in the x direction.

A meandering power supply pattern FP is formed on the surface of the insulating layer 51 at a position connecting two coil components adjacent in the x direction (FIG. 8). In other words, the meandering power feeding pattern FP is arranged so as to straddle the boundary between the two coil components. The method for forming the power supply pattern FP is not particularly limited, but when the insulating layer 51 is formed by laminating a laminate of a resin layer and a copper foil, it may be formed by patterning the copper foil included in the laminate. can. In this case, after laminating the laminate of the resin layer and the copper foil, first pattern the copper foil to form the power supply pattern FP, and then pattern the insulating layer 51 to form the openings 51a and 51b. good.

Next, a conductor layer 10 is formed on the support substrate and the surfaces of the insulating layer 51 (FIG. 9). The conductor layer 10 is formed by forming a base metal film using a thin film process such as a sputtering method, patterning this using a photolithography method, etc., and then growing the metal film to a desired thickness using an electrolytic plating method. Form. The method for forming the conductor layers 20, 30, and 40 to be formed later is also the same. The conductor layer 10 includes a coil pattern CP1, electrode patterns 11 and 12, and sacrificial patterns VP11 and V12. The sacrificial patterns VP11 and V12 do not touch either the coil pattern CP1 or the electrode patterns 11 and 12 in the plane. The coil pattern CP1 is wound clockwise from the outer circumferential end toward the inner circumferential end, and the outer circumferential end is connected to the electrode pattern 11. The electrode pattern 12 is not connected to the coil pattern CP1 within the plane. Here, the electrode patterns 11 and 12 and the sacrificial pattern VP11 are provided at positions overlapping with the power supply pattern FP. Thereby, power can be supplied to the coil pattern CP1 in the electrolytic plating process via the sacrificial pattern VP11, the power supply pattern FP, and the electrode pattern 11.

The planar shape of the power feeding pattern FP is as shown in FIG. 18, and includes sections 71 and 79 that overlap with the sacrificial pattern VP1, sections 72, 74, 76, and 78 that extend in the y direction, and a section 73 that extends in the x direction. , 75, and 77, and has a meander shape that can be written in one stroke from section 71 to section 79. The electrode pattern 11 is provided at a position overlapping a portion of the sections 74 and 75, and the electrode pattern 12 is provided at a position overlapping a portion of the sections 75 and 76. The width of section 75 is designed to be wider than the widths of sections 72 to 74 and 76 to 78, thereby ensuring reliable electrical connection with electrode patterns 11 and 12. On the other hand, the widths of the sections 72 to 74 and 76 to 78 are designed to be narrow in order to prevent the etching solution from reaching the electrode patterns 11 and 12 in the sacrificial pattern removal process described later. The widths of sections 72 to 74 and 76 to 78 are preferably designed to be narrower than the width of coil pattern CP1.

Next, an insulating layer 52 is formed on the surface of the insulating layer 51 so as to cover the conductor layer 10, and then the insulating layer 52 is patterned to form openings 52a to 52e (FIG. 10). The opening 52a is provided at a position overlapping with the outer region of the coil pattern CP1, and the opening 52b is provided at a position overlapping with the inner diameter region of the coil pattern CP1. Further, the opening 52c is provided at a position overlapping with the electrode pattern 11, and the opening 52d is provided at a position overlapping with the electrode pattern 12. Furthermore, the opening 52e is provided at a position overlapping the inner peripheral end of the coil pattern CP1.

Next, a conductor layer 20 is formed on the surface of the insulating layer 52 (FIG. 11). The conductor layer 20 includes a coil pattern CP2, electrode patterns 21 and 22, and sacrificial patterns VP21 and V22. The sacrificial patterns VP21 and V22 do not touch either the coil pattern CP2 or the electrode patterns 21 and 22 in the plane. The coil pattern CP2 is wound clockwise from the inner peripheral end toward the outer peripheral end, and the inner peripheral end is connected to the coil pattern CP1 through an opening 52e provided in the insulating layer 52. Connected to the inner edge. Therefore, power can be supplied to the coil pattern CP2 in the electrolytic plating process not only from the outer peripheral end side but also from the inner peripheral end side via the power feeding pattern FP, the electrode pattern 11, and the coil pattern CP1. Further, the sacrificial patterns VP21 and V22 are connected to the sacrificial patterns VP11 and VP12 through the openings 52a and 52b, respectively, and the electrode patterns 21 and 22 are connected to the electrode patterns 11 and 12 through the openings 52c and 52d, respectively. be done.

Next, an insulating layer 53 is formed on the surface of the insulating layer 52 so as to cover the conductor layer 20, and then the insulating layer 53 is patterned to form openings 53a to 53e (FIG. 12). The opening 53a is provided at a position overlapping with the outer region of the coil pattern CP2, and the opening 53b is provided at a position overlapping with the inner diameter region of the coil pattern CP2. Further, the opening 53c is provided at a position overlapping with the electrode pattern 21, and the opening 53d is provided at a position overlapping with the electrode pattern 22. Furthermore, the opening 53e is provided at a position overlapping the outer peripheral end of the coil pattern CP2.

Next, a conductor layer 30 is formed on the surface of the insulating layer 53 (FIG. 13). The conductor layer 30 includes a coil pattern CP3, electrode patterns 31 and 32, and sacrificial patterns VP31 and V32. The sacrificial patterns VP31 and V32 do not touch either the coil pattern CP3 or the electrode patterns 31 and 32 in the plane. The coil pattern CP3 is wound clockwise from the outer circumference end toward the inner circumference end, and the outer circumference end is connected to the outer circumference of the coil pattern CP2 through an opening 53e provided in the insulating layer 53. connected to the end. Further, the sacrificial patterns VP31 and V32 are connected to the sacrificial patterns VP21 and VP22 through openings 53a and 32b, respectively, and the electrode patterns 31 and 32 are connected to the electrode patterns 21 and 22 through openings 53c and 53d, respectively. be done.

Next, an insulating layer 54 is formed on the surface of the insulating layer 53 so as to cover the conductor layer 30, and then the insulating layer 54 is patterned to form openings 54a to 54e (FIG. 14). The opening 54a is provided at a position overlapping with the outer region of the coil pattern CP3, and the opening 54b is provided at a position overlapping with the inner diameter region of the coil pattern CP3. Further, the opening 54c is provided at a position overlapping with the electrode pattern 31, and the opening 54d is provided at a position overlapping with the electrode pattern 32. Furthermore, the opening 54e is provided at a position overlapping the inner peripheral end of the coil pattern CP3.

Next, a conductor layer 40 is formed on the surface of the insulating layer 54 (FIG. 15). The conductor layer 40 includes a coil pattern CP4, electrode patterns 41 and 42, and sacrificial patterns VP41 and V42. The sacrificial patterns VP41 and V42 do not touch either the coil pattern CP4 or the electrode patterns 41 and 42 in the plane. The coil pattern CP4 is wound clockwise from the inner peripheral end toward the outer peripheral end, the outer peripheral end is connected to the electrode pattern 42, and the inner peripheral end is provided on the insulating layer 54. It is connected to the inner peripheral end of the coil pattern CP3 via the opening 54e. Therefore, power can be supplied to the coil pattern CP4 in the electrolytic plating process not only from the outer peripheral end side but also from the inner peripheral end side via the power feeding pattern FP, the electrode pattern 11, and the coil patterns CP1 to CP3. . Further, the sacrificial patterns VP41 and V42 are connected to the sacrificial patterns VP31 and VP32 through the openings 54a and 54b, respectively, and the electrode patterns 41 and 42 are connected to the electrode patterns 31 and 32 through the openings 54c and 54d, respectively. be done.

Next, an insulating layer 55 is formed on the surface of the insulating layer 54 so as to cover the conductor layer 40, and then the insulating layer 55 is patterned to form openings 55a to 55d (FIG. 16). The opening 55a is provided at a position overlapping with the outer region of the coil pattern CP4, and the opening 55b is provided at a position overlapping with the inner diameter region of the coil pattern CP4. Further, the opening 55c is provided at a position overlapping with the electrode pattern 41, and the opening 55d is provided at a position overlapping with the electrode pattern 42.

In this state, wet etching is performed using an etchant such as acid to remove the sacrificial patterns VP11, VP12, VP21, VP22, VP31, VP32, VP41, and VP42 (FIG. 17). The coil patterns CP1 to CP4 and the electrode patterns 11, 12, 21, 22, 31, 32, 41, and 42 are not etched because they are covered with the insulating layers 51 to 55. As a result, a space SP is formed in the inner diameter region and outer region of the coil patterns CP1 to CP4. Here, since the power supply pattern FP is in contact with the sacrificial pattern VP11, a part of the power supply pattern FP is also eroded by the etching solution during etching of the sacrificial patterns VP11, VP12, VP21, VP22, VP31, VP32, VP41, and VP42. Ru. However, as explained using FIGS. 6 and 18, the feed pattern FP is thin and has a meandering planar shape, and the sacrificial pattern VP11 and the electrode patterns 11, 12 along the feed pattern FP are thin. Since the distance is longer than the straight-line distance between the sacrificial pattern VP11 and the electrode patterns 11 and 12, a sufficient amount of time is ensured for the etching solution to reach the electrode patterns 11 and 12. Therefore, even if etching is performed for a sufficient amount of time to completely remove the sacrificial patterns VP11, VP12, VP21, VP22, VP31, VP32, VP41, and VP42, as long as an excessive amount of time is not taken, the etching solution will It never reaches the electrode patterns 11 and 12. Since the etching liquid erodes a part of the power supply pattern FP, the power supply pattern FP remains as power supply patterns FP1 and FP2 shown in FIG. 5. In the example shown in FIG. 5, the entire sections 71 and 72 shown in FIG. A state in which a part of the power supply pattern 77 is removed and the power supply pattern FP2 remains is shown.

After forming conductor posts BP1 and BP2 to be connected to the electrode patterns 41 and 42 through the openings 55c and 55d, respectively, a magnetic element M is formed to fill the space SP, and the individual coil parts 1 are separated into individual pieces. Once this is completed, the coil component 1 according to the present embodiment is completed. The magnetic element M can be formed by forming an uncured or semi-effective composite member and then performing heat treatment to harden the resin contained in the composite material.

In this way, in the manufacturing process of the coil component 1 according to the present embodiment, since the power feeding pattern FP is connected to the electrode pattern 11 located at the bottom layer, the coil patterns CP2 to CP4 located at the upper layer are electrolytically plated. When forming, power can also be supplied from the coil pattern CP1. This improves the flatness of the coil patterns CP1 to CP4 and makes it possible to obtain the designed resistance value. Moreover, since the power supply pattern FP is thinner than the conductor layer 10 and has a meandering shape, the sacrificial patterns VP11, VP12, VP21, VP22, VP31, VP32 are etched using an etching solution such as acid. , VP41, VP42, it is also possible to prevent the etching solution from reaching the electrode patterns 11, 12.

Furthermore, in this embodiment, since the planar shape of the power feeding pattern FP is rotationally symmetrical, warping of the substrate during the manufacturing process is also suppressed. Moreover, since power is supplied to the electrode pattern 11 not only from the section 71 side but also from the section 79 side, it becomes possible to perform more sufficient power supply. However, since the electrode pattern 12 is not connected to the coil patterns CP1 to CP4, the portion of the power supply pattern FP connected to the electrode pattern 12 may be omitted as in the first modification shown in FIG. I do not care.

Furthermore, as in a second modification shown in FIG. 20, the power supply pattern FP may be connected only to the electrode pattern 11, and the electrode patterns 11 and 12 may be offset in the -y direction (or +y direction). I do not care. According to this, since the space between the sacrificial pattern VP11 and the electrode pattern 11 is expanded, the distance from the sacrificial pattern VP11 to the electrode pattern 11 along the power feeding pattern FP can be made longer. Moreover, when mounting the coil component 1 on the motherboard, if the coil component 1 is rotated 180 degrees around the z-axis, the offset direction of the electrode pattern 11 will be reversed, so this can also be used as a directional mark. Become.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the gist of the present invention. Needless to say, it is included within the scope.

For example, the coil component 1 according to the embodiment described above includes four stacked coil patterns CP1 to CP4, but in the present invention, the number of stacked coil patterns is not limited to this. Furthermore, the number of turns in each coil pattern is not particularly limited.

1 Coil parts 10, 20, 30, 40 Conductor layers 11, 12, 21, 22, 31, 32, 41, 42 Electrode patterns 51 to 55 Insulating layers 51a, 51b, 52a to 52e, 53a to 53e, 54a to 54e, 55a to 55d Openings 61 to 64 Via conductors 71 to 79 Sections BP1, BP2 Conductor post C Coil parts CP1 to CP4 Coil patterns E1, E2 Terminal electrodes FP, FP1, FP2 Power supply pattern M Magnetic element SP Spaces VP11, VP12, VP21 , VP22, VP31, VP32, VP41, VP42 Sacrificial patterns W1 to W3 Exposure width

Claims (9)

a plurality of insulating layers including first and second insulating layers, a first conductor layer located at the lowest layer provided on the first insulating layer, and the first conductor layer covering the first conductor layer. a coil portion having a configuration in which a plurality of conductor layers including a second conductor layer provided on the second insulating layer are alternately stacked;
The coil portion includes a first power feeding pattern provided on the first insulating layer,
The first conductor layer includes a first coil pattern and a first electrode pattern that is connected to an outer peripheral end of the first coil pattern and overlaps a part of the first power supply pattern. ,
The second conductor layer includes a second coil pattern whose inner peripheral end is connected to the inner peripheral end of the first coil pattern,
The first power supply pattern is thinner than the first conductor layer,
A width of a portion of the first power feeding pattern covered by the first electrode pattern is wider than a width of a portion of the first power feeding pattern exposed from the first electrode pattern. coil parts. The coil component according to claim 1, wherein a width of a portion of the first power supply pattern exposed from the first electrode pattern is narrower than a width of the first coil pattern. The second conductor layer further includes a second electrode pattern overlapping with and connected to the first electrode pattern,
3. The coil component according to claim 1, wherein the first electrode pattern has a smaller planar size than the second electrode pattern. The coil component according to claim 3 , wherein an exposed area of the first electrode pattern is smaller than an exposed area of the second electrode pattern. The first conductor layer further includes a third electrode pattern disposed on the opposite side of the first electrode pattern when viewed from the first coil pattern,
The second conductor layer further includes a fourth electrode pattern overlapping with the third electrode pattern and connected to the third electrode pattern,
The third electrode pattern has a smaller planar size than the fourth electrode pattern,
The coil component according to claim 4 , wherein an exposed area of the third electrode pattern is smaller than an exposed area of the fourth electrode pattern. The device further includes a second power feeding pattern provided on the first insulating layer, partially overlapping the third electrode pattern, and having a thinner film thickness than the third electrode pattern. The coil component according to claim 5 . a magnetic element in which the coil portion is embedded;
further comprising a conductor post embedded in the magnetic element and connected to the first and second electrode patterns,
The magnetic element has a bottom surface perpendicular to the axial direction of the first and second coil patterns, and a side surface parallel to the axial direction,
The conductor post is exposed from the bottom and side surfaces of the magnetic element,
the first and second electrode patterns are exposed from the side surface of the magnetic element;
7. The coil component according to claim 4 , wherein an exposed width of the first electrode pattern on the side surface is narrower than an exposed width of the conductor post on the side surface. a first step of forming a first insulating layer on the surface of the support substrate;
A power feeding pattern including a first section, a second section, and a third section located between the first section and the second section is formed on the first insulating layer . a second step;
A first conductor layer located at the lowest layer among the plurality of conductor layers on the first insulating layer, connected to a first coil pattern, and an outer peripheral end of the first coil pattern, and A first electrode pattern that overlaps with the first section of the power feeding pattern, and a first electrode pattern of the power feeding pattern that overlaps with the first section of the power feeding pattern, and a a third step of forming the first conductor layer including a first sacrificial pattern overlapping the second section by electrolytic plating;
a fourth step of forming a second insulating layer on the first insulating layer so as to cover the first conductor layer and expose at least a portion of the first sacrificial pattern;
On the second insulating layer, there is a second coil pattern whose inner peripheral end is connected to the inner peripheral end of the first coil pattern, and the a fifth step of forming a second conductor layer including a second sacrificial pattern in contact with the first sacrificial pattern by electrolytic plating;
a sixth step of removing the first and second sacrificial patterns,
The power supply pattern is thinner than the first conductor layer,
The width of the first section of the power supply pattern is wider than the width of the third section of the power supply pattern,
In the electrolytic plating in the third and fifth steps, power is supplied to the first and second coil patterns, respectively, via the power supply pattern. The length between the third section of the power feeding pattern is the length between the portion of the first electrode pattern that is in contact with the first section of the power feeding pattern, and the portion of the first sacrificial pattern that is in contact with the first section of the power feeding pattern. 9. The method for manufacturing a coil component according to claim 8 , wherein the straight line distance is longer than the straight line distance between the portions in contact with the second section.

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