JP7367494B2 - Fixtures and vibration devices - Google Patents

Description

FIELD OF THE INVENTION The present invention relates to fixtures and vibration devices.

2. Description of the Related Art A vibration device including a piezoelectric element having a piezoelectric body and a pair of external electrodes is known (for example, see Patent Document 1). In such a vibration device, a configuration can be considered in which a pair of external electrodes are arranged on one main surface of the piezoelectric element body, and the pair of external electrodes and a wiring section are connected on one main surface.

Japanese Patent Application Publication No. 2006-33774

In the vibrating device having the above configuration, the wiring section may be fixed to the case. The wiring part and the case are fixed by a fixing part (fixing tool) provided on the case. The fixing part has a shaft part protruding from the case, and a head part connected to the shaft part and latched to the wiring part. The fixing part has a shaft inserted through the through hole of the wiring part, and fixes the wiring part to the case with a head having a larger external shape than the through hole. In a vibrating device, the wiring section may push up the head due to the vibration of the piezoelectric element. As a result, cracks may occur starting from the connection portion between the shaft and the head (the corner formed by the shaft and the head). If the head is damaged due to cracks, it may become impossible to fix the wiring part. This may reduce the reliability of the vibration device.

One aspect of the present invention provides a fixture and a vibration device with improved reliability.

A fixture according to one aspect of the present invention includes a shaft extending in one direction and a head provided at one end in one direction of the shaft, and when viewed from one direction, The outer shape of the head is larger than the outer shape of the shaft, and the head includes a first head connected to one end of the shaft, and a first head connected to the first head and one part from the first head. The second head extends toward the other end of the shaft in the direction of the shaft, and is disposed to face the outer peripheral surface of the shaft at a predetermined distance.

In the fixture according to one aspect of the present invention, the head includes a first head and a second head. The second head is connected to the first head and extends from the first head toward the other end in one direction of the shaft, and is spaced apart from the outer peripheral surface of the shaft by a predetermined distance. are placed facing each other. That is, the second head is provided apart from the shaft. Thereby, in the fixture, even if the second head is pushed up by the wiring section or the like, stress from the outside can be dispersed in the second head. Therefore, in the fixture, it is possible to suppress the occurrence of cracks starting from the connecting portion between the shaft portion and the head. Therefore, with the fixture, damage to the head can be suppressed. As a result, the reliability of the fixture can be improved.

In one embodiment, the second head may be arranged to surround the entire outer peripheral surface of the shaft. With this configuration, external stress can be more effectively dispersed in the second head.

In one embodiment, the tip of the second head may have a curved portion. In this configuration, since the tip of the second head that contacts (abuts) the wiring portion, etc. does not have a corner, it is possible to suppress damage to the wiring portion, etc. that the second head may come into contact with.

A vibration device according to one aspect of the present invention includes a piezoelectric element having a piezoelectric element body having a first main surface, a pair of external electrodes disposed on the first main surface, and a piezoelectric element having a piezoelectric element body having a first main surface; a strip-shaped first wiring member connected to the external electrode of the first wiring member; a plate-shaped second wiring member having second and third main surfaces facing each other and connected to the first wiring member; a case in which a second wiring member is disposed, and the second wiring member is provided with a plurality of through holes passing through the second wiring member in opposing directions of the second main surface and the third main surface. The case has a fourth main surface facing the third main surface, and is configured integrally with the arrangement section, in which the second wiring member is arranged, and the arrangement section, in which the second wiring member is arranged. a plurality of fixing parts fixed to the part, each of the plurality of fixing parts protruding along one direction from the fourth principal surface, a shaft part inserted into the through hole, and one part of the shaft part. a head provided at one end in the direction and locked to the third main surface, the head includes a first head connected to the one end of the shaft; a second head that is connected and extends from the first head in one direction toward the other end of the shaft, and is disposed facing the outer circumferential surface of the shaft at a predetermined distance; and has.

In the vibrating device according to one aspect of the present invention, the case has a plurality of fixing parts. The fixing part has a shaft part and a head part. The head has a first head and a second head. The second head is connected to the first head and extends from the first head toward the other end in one direction of the shaft, and is spaced apart from the outer peripheral surface of the shaft by a predetermined distance. are placed facing each other. That is, the second head is provided apart from the shaft. Thereby, in the vibrating device, even if the second head is pushed up by the second wiring member, external stress can be dispersed in the second head. Therefore, in the vibrating device, it is possible to suppress the occurrence of cracks starting from the connecting portion between the shaft portion and the head portion. Therefore, in the vibration device, damage to the head can be suppressed. As a result, the reliability of the vibration device can be improved.

In one embodiment, the second head portion of each of the plurality of fixing portions may have a different shape. With this configuration, the frequency of contact between the second head of each fixing part and the second wiring member may be different. As a result, in the vibrating device, the durability (life span) of each fixed part may differ. Therefore, it is possible to prevent all the fixing parts from being damaged at the same time.

According to one aspect of the present invention, reliability can be improved.

FIG. 1 is a cross-sectional view of a vibrating device according to one embodiment. FIG. 2 is a partially enlarged view of FIG. 1. FIG. 3 is a perspective view of the vibrating section. FIG. 4 is an exploded perspective view of the vibrating section. FIG. 5 is a top view of the vibrating section. FIG. 6 is an exploded perspective view of the piezoelectric element. FIG. 7 is a bottom view of the wiring member. FIG. 8 is a sectional view taken along line VIII-VIII in FIG. 5. 9 is a sectional view taken along line IX-IX in FIG. 5. FIG. FIG. 10 is a partially enlarged view of FIG. 11(a), FIG. 11(b), FIG. 11(c), and FIG. 11(d) are cross-sectional views of the fixing portion. FIGS. 12(a) and 12(b) are cross-sectional views for explaining a method of fixing the second wiring member to the bottom plate. FIG. 13 is a sectional view of a conventional fixing part. FIGS. 14(a) and 14(b) are cross-sectional views of a fixing part according to a modified example. FIG. 15 is a sectional view of a fixing part according to a modification.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements are given the same reference numerals, and redundant description will be omitted.

The vibration device 100 shown in FIGS. 1 to 5 is, for example, an acoustic device used as a speaker or a buzzer. The vibrating device 100 includes a vibrating part 1, a wiring part 2 connected to the vibrating part 1, a case 3 forming an acoustic space in which the vibrating part 1 is arranged, a joining member 70, and a joining member 71. There is. The vibration device 100 is attached to an attached surface 200a of an attached member 200, as shown in FIG. The attached member 200 is, for example, an electronic device such as a television or a smartphone.

The vibrating section 1 includes a piezoelectric element 10 and a vibrating member 12. The vibrating member 12 is made of metal such as Ni--Fe alloy, Ni, brass, or stainless steel, for example. The vibrating member 12 is a plate-like member. The vibrating member 12 has a main surface 12a on which the piezoelectric element 10 is provided, and a main surface 12b facing the main surface 12a in the thickness direction. The main surfaces 12a and 12b have a rectangular shape. That is, the vibrating member 12 has a rectangular shape when viewed from the thickness direction. Here, the rectangular shape includes, for example, a shape in which each corner is chamfered and a shape in which each corner is rounded. The rectangular shape also includes a square shape. In this embodiment, the main surfaces 12a and 12b have, for example, a square shape with a side length of 21 mm or more and 29 mm or less. The thickness of the vibrating member 12 is, for example, 0.06 mm or more and 0.15 mm or less.

FIG. 6 is an exploded perspective view of the piezoelectric element. As shown in FIG. 6, the piezoelectric element 10 includes a piezoelectric element body 11 and a pair of external electrodes 13 and 15 having mutually different polarities. The piezoelectric element body 11 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes, for example, a rectangular parallelepiped shape with chamfered corners and edge lines, and a rectangular parallelepiped shape with rounded corners and edge lines. The piezoelectric element 11 has a main surface (first main surface) 11a and a main surface 11b facing each other. A pair of external electrodes 13 and 15 are provided on the main surface 11a. The main surface 11b faces the main surface 12a (see FIG. 2) and is joined (adhered) to the center of the main surface 12a by a joining member 71.

The main surfaces 11a and 11b have a rectangular shape. Hereinafter, the long side direction of the main surfaces 11a, 11b will be referred to as the X direction, the short side direction of the main surfaces 11a, 11b will be referred to as the Y direction, and the opposing direction of the main surfaces 11a, 11b will be referred to as the Z direction. The long side direction, short side direction, and opposing direction of the main surfaces 11a and 11b correspond to the long side direction, short side direction, and opposing direction of the main surfaces 12a and 12b, respectively. The length of the piezoelectric element 10 in the X direction is, for example, 20 mm. The length of the piezoelectric element 10 in the Y direction is, for example, 10 mm. The length of the piezoelectric element 10 in the Z direction is, for example, 0.45 mm.

The piezoelectric element body 11 is configured by laminating a plurality of piezoelectric layers 17a, 17b, 17c, and 17d. That is, the piezoelectric element body 11 has a plurality of stacked piezoelectric layers 17a, 17b, 17c, and 17d. In this embodiment, the piezoelectric element body 11 has four piezoelectric layers 17a, 17b, 17c, and 17d. In the piezoelectric element body 11, the direction in which the plurality of piezoelectric layers 17a, 17b, 17c, and 17d are stacked coincides with the Z direction. The piezoelectric layer 17a has a main surface 11a. The piezoelectric layer 17d has a main surface 11b. The piezoelectric layers 17b and 17c are located between the piezoelectric layer 17a and the piezoelectric layer 17d.

Each piezoelectric layer 17a, 17b, 17c, 17d is made of piezoelectric material. In this embodiment, each piezoelectric layer 17a, 17b, 17c, and 17d is made of a piezoelectric ceramic material. Piezoelectric ceramic materials include, for example, PZT[Pb(Zr,Ti)O ₃ ], PT(PbTiO ₃ ), PLZT[(Pb,La)(Zr,Ti)O ₃ ], or barium titanate (BaTiO ₃ ). is used. Each piezoelectric layer 17a, 17b, 17c, and 17d is composed of, for example, a sintered body of a ceramic green sheet containing the piezoelectric ceramic material described above. In the actual piezoelectric element 11, the piezoelectric layers 17a, 17b, 17c, and 17d are integrated to such an extent that the boundaries between the piezoelectric layers 17a, 17b, 17c, and 17d are unrecognizable.

The piezoelectric element 10 includes a plurality of internal electrodes 19 , 21 , 23 arranged within the piezoelectric element body 11 . In this embodiment, the piezoelectric element 10 includes three internal electrodes 19, 21, and 23. Each internal electrode 19, 21, 23 is made of a conductive material. For example, Ag, Pd, or Ag-Pd alloy is used as the conductive material. Each of the internal electrodes 19, 21, and 23 is configured, for example, as a sintered body of conductive paste containing the above-mentioned conductive material. In this embodiment, the outer shape of each internal electrode 19, 21, 23 is rectangular.

Each internal electrode 19, 21, 23 is arranged at a different position (layer) in the Z direction. Internal electrode 19 and internal electrode 21 face each other with a gap in the Z direction. Internal electrode 21 and internal electrode 23 face each other with a gap in the Z direction. Internal electrode 19 is located between piezoelectric layer 17a and piezoelectric layer 17b. Internal electrode 21 is located between piezoelectric layer 17b and piezoelectric layer 17c. The internal electrode 23 is located between the piezoelectric layer 17c and the piezoelectric layer 17d. Each internal electrode 19 , 21 , 23 is not exposed on the surface of the piezoelectric element body 11 . That is, each internal electrode 19, 21, 23 is not exposed on each side surface. Each internal electrode 19, 21, 23 is spaced apart from all edges (four sides) of main surfaces 11a, 11b when viewed from the Z direction.

A pair of external electrodes 13 and 15 are arranged on the main surface 11a. The external electrodes 13 and 15 are arranged in the X direction. External electrode 13 and external electrode 15 are adjacent to each other in the X direction. A pair of external electrodes 13 and 15 are arranged at the center of the main surface 11a. The pair of external electrodes 13 and 15 are spaced apart from all edges (four sides) of the main surface 11a when viewed from the Z direction. Each external electrode 13, 15 has a rectangular shape when viewed from the Z direction. Each external electrode 13, 15 is made of a conductive material. For example, Ag, Pd, or Ag-Pd alloy is used as the conductive material. Each of the external electrodes 13 and 15 is configured, for example, as a sintered body of conductive paste containing the above-mentioned conductive material.

External electrode 13 is electrically connected to connection conductor 25 through via conductor 31 . The connection conductor 25 is located on the same layer as the internal electrode 19. The connection conductor 25 is located inside the internal electrode 19. An opening is formed in the internal electrode 19 at a position corresponding to the external electrode 13 when viewed from the Z direction. The connection conductor 25 is located within an opening formed in the internal electrode 19. The entire edge of the connection conductor 25 is surrounded by the internal electrode 19 when viewed from the Z direction.

The connection conductor 25 is located between the piezoelectric layer 17a and the piezoelectric layer 17b. Internal electrode 19 and connection conductor 25 are spaced apart. The connection conductor 25 faces the external electrode 13 in the Z direction. The via conductor 31 is connected to the external electrode 13 and also to the connection conductor 25 . The connection conductor 25 is electrically connected to the internal electrode 21 through the via conductor 33. The connection conductor 25 faces the internal electrode 21 in the Z direction. The via conductor 33 is connected to the connection conductor 25 and also to the internal electrode 21 .

Internal electrode 21 is electrically connected to connection conductor 27 through via conductor 35 . The connection conductor 27 is located on the same layer as the internal electrode 23. The connecting conductor 27 is located inside the internal electrode 23. An opening is formed in the internal electrode 23 at a position corresponding to the external electrode 13 (connection conductor 25) when viewed from the Z direction. The connection conductor 27 is located within an opening formed in the internal electrode 23. The entire edge of the connection conductor 27 is surrounded by the internal electrode 23 when viewed from the Z direction.

External electrode 15 is electrically connected to internal electrode 19 through via conductor 37 . The internal electrode 19 faces the external electrode 15 in the Z direction. The via conductor 37 is connected to the external electrode 15 and also to the internal electrode 19 .

Internal electrode 19 is electrically connected to connection conductor 29 through via conductor 39 . The connection conductor 29 is located on the same layer as the internal electrode 21. The connecting conductor 29 is located inside the internal electrode 21 . An opening is formed in the internal electrode 21 at a position corresponding to the external electrode 15 when viewed from the Z direction. The connecting conductor 29 is located within an opening formed in the internal electrode 21. The entire edge of the connecting conductor 29 is surrounded by the internal electrode 21 when viewed from the Z direction.

The connection conductor 29 is located between the piezoelectric layer 17b and the piezoelectric layer 17c. Internal electrode 21 and connection conductor 29 are spaced apart. The connection conductor 29 faces the internal electrode 19 in the Z direction. The via conductor 39 is connected to the internal electrode 19 and also to the connection conductor 29 . The connection conductor 29 is electrically connected to the internal electrode 23 through the via conductor 41. The connection conductor 29 faces the internal electrode 23 in the Z direction. The via conductor 41 is connected to the connection conductor 29 and also to the internal electrode 23 .

The external electrode 13 is electrically connected to the internal electrode 21 through the via conductor 31 , the connecting conductor 25 , and the via conductor 33 . External electrode 15 is electrically connected to internal electrode 19 through via conductor 37 . The external electrode 15 is electrically connected to the internal electrode 23 through the via conductor 37 , internal electrode 19 , via conductor 39 , connection conductor 29 , and via conductor 41 .

The connection conductors 25, 27, 29 and the via conductors 31, 33, 35, 37, 39, 41 are made of conductive material. Each of the via conductors 31, 33, 35, 37, 39, and 41 is a via conductor group consisting of a plurality of via conductors, but may be a single via conductor. Via conductors 31 and 33 arranged in piezoelectric layers 17a and 17b adjacent to each other in the Z direction are spaced apart from each other when viewed from the Z direction, and are arranged so as not to overlap. The via conductors 37 and 39 arranged in the piezoelectric layers 17a and 17b are spaced apart from each other when viewed from the Z direction, and are arranged so as not to overlap. Via conductors 33 and 35 arranged in piezoelectric layers 17b and 17c adjacent to each other in the Z direction are spaced apart from each other when viewed from the Z direction, and are arranged so as not to overlap. The via conductors 39 and 41 arranged in the piezoelectric layers 17b and 17c are spaced apart from each other when viewed from the Z direction, and are arranged so as not to overlap.

For example, Ag, Pd, or Ag-Pd alloy is used as the conductive material. The connection conductors 25, 27, 29 and the via conductors 31, 33, 35, 37, 39, 41 are configured, for example, as sintered bodies of conductive paste containing the above-mentioned conductive material. The connection conductors 25, 27, 29 have a rectangular shape. Via conductors 31, 33, 35, 37, 39, and 41 are formed by sintering conductive paste filled in through holes formed in ceramic green sheets for forming corresponding piezoelectric layers 17a, 17b, and 17c. It is formed by

A conductor electrically connected to the internal electrodes 19 and 23 and a conductor electrically connected to the internal electrode 21 are not arranged on the main surface 11b of the piezoelectric element 11. In this embodiment, when main surface 11b is viewed from the Z direction, the entire main surface 11b is exposed. The main surfaces 11a and 11b are natural surfaces. The natural surface is a surface formed by the surface of crystal grains grown by firing.

Conductors electrically connected to the internal electrodes 19 and 23 and conductors electrically connected to the internal electrode 21 are not arranged on each side surface of the piezoelectric element 11 either. In this embodiment, when each side surface of the piezoelectric element body 11 is viewed from the X direction and the Y direction, each side surface is entirely exposed. In this embodiment, each of these sides is also a natural surface.

The region sandwiched between the internal electrodes 19 and 21 in the piezoelectric layer 17b and the region sandwiched between the internal electrodes 21 and 23 in the piezoelectric layer 17c constitute piezoelectrically active regions. . In this embodiment, the piezoelectrically active region is located so as to surround the pair of external electrodes 13 and 15 when viewed from the Z direction. When viewed from the Z direction, the piezoelectric element body 11 includes a piezoelectrically active region in a region located between the external electrodes 13 and 15. When viewed from the Z direction, the piezoelectric element body 11 also includes a piezoelectrically active region outside the region where the external electrodes 13 and 15 are located.

As shown in FIGS. 1 to 5, the wiring section 2 includes a strip-shaped first wiring member 50 connected to the pair of external electrodes 13 and 15 on the main surface 11a, and a first wiring member 50 connected to the first wiring member 50. It has a plate-shaped second wiring member 60 and a joining member 72.

The first wiring member 50 extends along the long side of the main surface 11a and is orthogonal to the short side of the main surface 11a when viewed from the orthogonal direction (Z direction) perpendicular to the main surface 11a. The first wiring member 50 extends in the X direction and is perpendicular to the Y direction. The first wiring member 50 has one end 50a that is electrically and physically connected to the second wiring member 60, and the other end 50b that is electrically and physically connected to the piezoelectric element 10. ing. The first wiring member 50 has a narrow portion 50c having a narrow width (length in the Y direction) between one end portion 50a and the other end portion 50b. The narrow portion 50c is provided adjacent to the one end portion 50a. The first wiring member 50 has a constant width in a portion other than the narrow portion 50c. The width of the narrow portion 50c is, for example, 56% or more and 83% or less of the width of the portion other than the narrow portion 50c.

The other end 50b of the first wiring member 50 is joined to the pair of external electrodes 13 and 15 by a joining member 70. The joining member 70 is disposed between the pair of external electrodes 13, 15 and the other end 50b, and joins the pair of external electrodes 13, 15 and the other end 50b. The joining member 70 is a resin layer containing a plurality of conductive particles (not shown). The conductive particles are, for example, metal particles or gold-plated particles. The joining member 70 includes, for example, a thermosetting elastomer. The joining member 70 is formed, for example, by curing an anisotropic conductive paste or an anisotropic conductive film. The joining member 70 electrically connects the pair of external electrodes 13 and 15 to the other end portion 50b. When viewed from the Z direction, the joining member 70 integrally covers the pair of external electrodes 13 and 15. When viewed from the Z direction, the joining member 70 integrally covers a pair of end portions 53b and 55b (see FIG. 7), which will be described later, provided at the other end portion 50b.

The first wiring member 50 is joined to the main surface 11a and the main surface 12a by a joining member 71. The joining member 71 is a resin layer that does not contain conductive particles and has electrical insulation properties. The joining member 71 is, for example, a hot melt resin whose main components are a reactive phenol resin and nitrile rubber. Bonding member 71 may include the same resin material as that contained in bonding member 70 . The joining member 71 is arranged along one short side of the main surface 11a. The joining member 71 joins the entire first wiring member 50 in the width direction (Y direction) to the main surface 11a and the main surface 12a. The joining member 71 is spaced apart from the joining member 70 in the X direction.

One end 50a of the first wiring member 50 is joined to the second wiring member 60 by a joining member 72. The joining member 72 is disposed between a pair of conductor layers 63, 65 (see FIG. 4) to be described later and one end portion 50a, and joins the pair of conductor layers 63, 65 and one end portion 50a. The joining member 72 is a resin layer containing a plurality of conductive particles (not shown). The conductive particles are, for example, metal particles or gold-plated particles. The joining member 72 includes, for example, a thermosetting elastomer. The joining member 72 is formed, for example, by curing an anisotropic conductive paste or an anisotropic conductive film. The joining member 72 is made of the same material as the joining member 70, for example. The joining member 72 electrically connects the pair of conductor layers 63, 65 and one end portion 50a. When viewed from the Z direction, the joining member 70 integrally covers the pair of conductor layers 63 and 65. When viewed from the Z direction, the joining member 70 integrally covers a pair of end portions 53a and 55a, which will be described later, provided at the other end portion 50b.

The joining members 70, 71, and 72 all have a rectangular shape when viewed from the thickness direction (Z direction). The longitudinal direction of the joining member 70 coincides with the direction (X direction) in which a pair of end portions 53b and 55b (see FIG. 7), which will be described later, are lined up. The longitudinal direction of the joining member 71 coincides with the short side direction (Y direction) of the main surface 11a. The longitudinal direction of the bonding member 72 coincides with the direction (Y direction) in which a pair of conductor layers 63 and 65 (see FIG. 4), which will be described later, are lined up. The longitudinal direction of the joining member 70 and the longitudinal directions of the joining members 71 and 72 intersect with each other (orthogonal to each other).

As shown in FIGS. 1 and 7, the first wiring member 50 includes a base 51, a pair of conductor layers 53 and 55, a cover 57, and a reinforcing portion 59. The first wiring member 50 has flexibility, and is, for example, a flexible printed circuit board (FPC) or a flexible flat cable (FFC).

The base 51 is strip-shaped and has a pair of principal surfaces 51a and 51b facing each other. The base 51 has electrical insulation properties. The base 51 is, for example, a resin layer made of resin such as polyimide resin. The thickness of the base 51 is, for example, 100 μm.

Each conductor layer 53, 55 is arranged on the main surface 51a of the base 51. Each conductor layer 53, 55 is joined (adhered) to the main surface 51a by an adhesive layer (not shown). Each conductor layer 53, 55 is made of, for example, Cu. Each conductor layer 53, 55 may have a structure in which, for example, a Ni plating layer and an Au plating layer are provided in this order on a Cu layer. The conductor layer 53 and the conductor layer 55 are spaced apart from each other. The thickness of each conductor layer 53, 55 is, for example, 20 μm.

The conductor layer 53 has an end 53a connected to the second wiring member 60, an end 53b connected to the external electrode 13, and a connecting part 53c connecting the end 53a and the end 53b. Contains. The connecting portion 53c extends in the direction in which the first wiring member 50 extends (X direction). The end portion 53a is adjacent to one end portion of the connecting portion 53c in the direction in which the first wiring member 50 extends. The end portion 53b is adjacent to the other end portion of the connecting portion 53c in the width direction (Y direction) of the first wiring member 50.

The conductor layer 55 has an end 55a connected to the second wiring member 60, an end 55b connected to the external electrode 15, and a connecting part 55c connecting the end 55a and the end 55b. Contains. The connecting portion 55c extends in the direction in which the first wiring member 50 extends (X direction). The end portion 55a is adjacent to one end portion of the connecting portion 55c in the direction in which the first wiring member 50 extends. The end portion 55b is adjacent to the other end portion of the connecting portion 55c in the width direction (Y direction) of the first wiring member 50.

The end portion 53a and the end portion 55a are spaced apart from each other in the width direction of the first wiring member 50. The end portion 53b and the end portion 55b are spaced apart from each other in the direction in which the first wiring member 50 extends. The connecting portion 53c and the connecting portion 55c are arranged parallel to each other and spaced apart from each other in the width direction of the first wiring member 50.

A joining member 70 is present between the end portion 53b and the external electrode 13. The end portion 53b and the external electrode 13 are electrically connected through conductive particles included in the joining member 70. A joining member 70 is present between the end portion 55b and the external electrode 15. The end portion 55b and the external electrode 15 are electrically connected through conductive particles included in the joining member 70.

The cover 57 is arranged on the main surface 51a. The cover 57 covers each conductor layer 53, 55 and the main surface 51a. The cover 57 is joined (adhered) to each conductor layer 53, 55 and a region of the main surface 51a exposed from each conductor layer 53, 55 by an adhesive layer (not shown). The cover 57 is, for example, a resin layer made of resin such as polyimide resin. The thickness of the cover 57 is, for example, 25 μm. Ends 53a and 53b of the conductor layer 53, ends 55a and 55b of the conductor layer 55, and areas near the ends 53a, 53b, 55a, and 55b on the main surface 51a are exposed from the cover 57.

The reinforcing portion 59 is arranged on the main surface 51b of the base 51. The reinforcing portion 59 is joined (adhered) to the main surface 51b by an adhesive layer (not shown). The reinforcing portion 59 is provided at least in the narrow portion 50c. The reinforcing portion 59 is provided across both a portion of the first wiring member 50 that overlaps with the second wiring member 60 and a portion that does not overlap with the second wiring member 60 when viewed from the Z direction. The reinforcing portion 59 is, for example, a resin layer made of polyimide. The thickness of the reinforcing portion 59 is, for example, 200 μm.

As shown in FIGS. 4 and 8, the second wiring member 60 includes a substrate 61, a pair of conductor layers 63 and 65, and a pair of resist layers 67 and 69. The second wiring member 60 has a rectangular plate shape and has a main surface 60a (second main surface) and a main surface 60b (third main surface) facing each other in the thickness direction (Z direction). . The main surface 60a includes a main surface 61a, which will be described later, the surfaces of a pair of conductor layers 63 and 65, and the surface of a resist layer 67. Main surface 60b includes the surface of resist layer 69.

The second wiring member 60 is provided with a plurality of through holes 60c that penetrate the second wiring member 60 in the direction in which the main surfaces 60a and 60b face each other (Z direction). The through hole 60c has a circular cross section. The second wiring member 60 is harder than the first wiring member 50 and has no flexibility. The second wiring member 60 is, for example, a printed circuit board (PCB). The second wiring member 60 is harder than the case 3.

The substrate 61 has a rectangular plate shape. The substrate 61 is made of glass, for example, and has electrical insulation properties. The substrate 61 has a pair of rectangular main surfaces 61a and 61b facing each other. The length of the pair of main surfaces 61a, 61b in the long side direction (X direction) is, for example, 17 mm. The length of the pair of main surfaces 61a and 61b in the short side direction (Y direction) is, for example, 10.9 mm. The thickness of the substrate 61 (the length of the substrate 61 in the Z direction) is, for example, 0.8 mm.

Each conductor layer 63, 65 is provided on the main surface 61a. Each conductor layer 63, 65 is made of, for example, Cu. Each conductor layer 63, 65 may have a structure in which, for example, a Ni plating layer and an Au plating layer are provided in this order on a Cu layer. The conductor layer 63 and the conductor layer 65 are spaced apart from each other. The thickness of each conductor layer 63, 65 is, for example, 20 μm. The resist layer 67 covers the main surface 61a of the substrate 61 and each conductor layer 63, 65. The thickness of the resist layer 67 is, for example, 1 μm. The resist layer 69 covers the main surface 61b of the substrate 61. The thickness of the resist layer 69 is, for example, 1 μm.

The conductor layer 63 has an end portion 63a exposed from the resist layer 67. A joining member 72 exists between the end portion 63a and the end portion 53a. The end portion 63a is joined to the end portion 53a by a joining member 72. The conductor layer 63 is electrically connected to the end portion 53a through conductive particles included in the bonding member 72. The conductor layer 65 has an end portion 65a exposed from the resist layer 67. A joining member 72 exists between the end portion 65a and the end portion 55a. The end portion 65a is joined to the end portion 55a by a joining member 72. The conductor layer 65 is electrically connected to the end portion 55a through conductive particles included in the bonding member 72. Although not shown, the second wiring member 60 further includes a pair of conductor layers provided on the lower surface of the substrate 61 and connected to the conductor layers 63 and 65 through through-hole conductors.

The case 3 shown in FIGS. 1 to 5 is made of a resin material such as acrylic resin, vinyl chloride resin, molded resin, or the like. The case 3 has a first housing part 3a in which the vibrating part 1 is housed, and a second housing part 3b in which the wiring part 2 is housed. In the case 3, the vibrating section 1 and the wiring section 2 are arranged.

The first accommodating portion 3a is, for example, a rectangular parallelepiped-shaped box member with an open top surface (surface on the side of the attached member 200). The first accommodating part 3a has a bottom plate 4, a pair of side plates 5, a pair of side plates 6, and a support part 7.

The bottom plate 4 has a main surface 4a (third main surface) facing the main surface 12b of the vibrating member 12. The main surface 4a has, for example, a rectangular shape having a pair of long sides and a pair of short sides. Here, the rectangular shape includes, for example, a shape in which each corner is chamfered and a shape in which each corner is rounded. The rectangular shape also includes a square shape. The long side direction of the main surface 4a corresponds to the X direction, the short side direction of the main surface 4a corresponds to the Y direction, and the thickness direction of the bottom plate 4 corresponds to the Z direction. The main surface 4a is larger than the main surfaces 12a, 12b, and when viewed from the Z direction, the outer edge of the main surface 4a is spaced apart from the main surfaces 12a, 12b and located on the outside of the main surfaces 12a, 12b. The thickness (length in the Z direction) of the bottom plate 4 is, for example, 1.2 mm or more and 1.4 mm or less.

In this embodiment, the main surface 4a has a similar shape to the main surfaces 12a and 12b, for example, and has a square shape with a side length of 30 mm or more and 33 mm or less. Note that the main surface 4a differs from the main surfaces 12a and 12b in that each corner is chamfered or each corner is rounded. This also includes cases. In other words, the outline of the principal surface 4a and the outline of the principal surfaces 12a and 12b are similar shapes, regardless of whether each corner is chamfered or rounded. If so, it is assumed that the main surface 4a has a shape similar to that of the main surfaces 12a and 12b.

The pair of side plates 5 are arranged at both ends of the bottom plate 4 in the X direction, and face each other in the X direction. The side plate 5 has a rectangular shape when viewed from the thickness direction (X direction). One side plate 5 is provided with a pair of through holes 5a aligned in the Y direction. The through hole 5a has a rectangular shape and passes through one side plate 5 in the X direction. The pair of through holes 5a have the same shape. The sound generated by the vibration device 100 is mainly transmitted to the outside of the case 3 through the through hole 5a. The other side plate 5 is connected to the second accommodating portion 3b. A cut-out recess 5b is formed at the upper end of the other side plate 5 (the end opposite to the bottom plate 4).

The pair of side plates 6 are arranged at both ends of the bottom plate 4 in the Y direction, and face each other in the Y direction. The side plates 6 connect the pair of side plates 5 to each other. The side plate 6 has a rectangular shape when viewed from the thickness direction (Y direction). The pair of side plates 6 have the same shape.

The support portion 7 protrudes from the main surface 4a of the bottom plate 4 and supports the peripheral edge 12c of the main surface 12b of the vibrating member 12. The upper surface of the support portion 7 is joined to the peripheral edge portion 12c of the main surface 12b. The support portion 7 is a convex portion (projection portion) having a rectangular frame shape. The width of the support portion 7 is, for example, 3 mm. The support portion 7 has four sides 7a and supports the four sides of the main surface 12b. Among the four side portions 7a, a communicating portion 7b is provided at the center in the length direction (X direction) on the upper surfaces of a pair of side portions 7a that face each other in the Y direction. The communication portion 7b is a notch-shaped recess that crosses the side portion 7a in the width direction (Y direction). The communication portion 7b is provided across the entire width of the side portion 7a. The length of the communication portion 7b in the longitudinal direction of the side portion 7a is, for example, shorter than the length of the side portion 7a, and is 2.5 mm or more and 3.5 mm or less.

The support portion 7 is spaced apart from the piezoelectric element 10 when viewed from the opposing direction (Z direction) of the main surface 12b and the main surface 4a. When viewed from the Z direction, the piezoelectric element 10 is disposed at the center of the inner region of the support portion 7 in the X and Y directions. That is, the distance between one end of the piezoelectric element 10 and one end of the support section 7 in the X direction is equal to the distance between the other end of the piezoelectric element 10 and the other end of the support section 7 in the X direction. The distance between one end of the piezoelectric element 10 and one end of the support section 7 in the Y direction is equal to the distance between the other end of the piezoelectric element 10 and the other end of the support section 7 in the Y direction. According to such an arrangement of the piezoelectric element 10, the piezoelectric element 10 can be vibrated in a well-balanced manner.

The second accommodating portion 3b is attached to the other side plate 5. The second accommodating portion 3b has a groove shape with a U-shaped cross section. The internal space of the second accommodating part 3b communicates with the internal space of the first accommodating part 3a via the recess 5b. The second accommodating part 3b has a bottom plate 8 (arranging part) in which the wiring part 2 is arranged, and a pair of side plates 9.

As shown in FIGS. 4, 5, and 9, the bottom plate 8 has a main surface 8a (fourth main surface) facing the main surface 60b of the second wiring member 60 in the Z direction. A gap G is formed between the main surface 60b and the main surface 8a. A step corresponding to the thickness of the second wiring member 60 is provided on the main surface 8a. Thereby, there is no difference in level between the portion of the first wiring member 50 disposed on the second wiring member 60 and the other portions. Therefore, the first wiring member 50 is arranged in a straight line without being curved. The bottom plate 8 has a rectangular shape when viewed from the thickness direction (Z direction). The pair of side plates 9 are arranged at both ends of the bottom plate 8 in the Y direction, and face each other in the Y direction. The pair of side plates 9 have a rectangular shape when viewed from the thickness direction (Y direction).

The second accommodating part 3b is configured integrally with the bottom plate 8, and has a plurality of (four in this case) fixing parts (fixing tools) 8b, 8c, 8d, 8e that fix the second wiring member 60 to the bottom plate 8. have. Each of the fixing parts 8b, 8c, 8d, and 8e has a shaft part 80 and a head part 81. The shaft portion 80 and the head portion 81 are integrally formed.

As shown in FIG. 10, the shaft portion 80 extends in one direction. The shaft portion 80 protrudes from the main surface 8a (is erected on the main surface 8a). The other end of the shaft portion 80 in the extending direction is connected to the main surface 8a. The shaft portion 80 is columnar and has a circular cross section. The shaft portion 80 is inserted into the corresponding through hole 60c. The inner diameter d1 of the through hole 60c is equivalent to the outer diameter d2 of the shaft portion 80, and is, for example, 1.55 mm or more and 1.65 mm or less. The outer peripheral surface 80a of the shaft portion 80 and the inner peripheral surface of the through hole 10c are in surface contact with each other. Here, the entire outer peripheral surface 80a of the shaft portion 80 and the entire inner peripheral surface of the through hole 10c are in surface contact with each other.

The head 81 is connected to the shaft portion 80 and is locked to the main surface 60a of the second wiring member 60. The head 81 has a disk shape. The outer diameter d3 of the head 81 is larger than the inner diameter d1 of the through hole 60c. The head 81 includes a first head 81a and a second head 81b. The first head 81a and the second head 81b are integrally formed. The first head 81a is connected to one end of the shaft portion 80. The first head 81a has a disk shape. The upper surface of the first head 81a is, for example, a flat surface.

The second head 81b is connected to the first head 81a. The second head 81b is connected to the lower surface of a portion of the first head 81a that extends radially beyond the shaft portion 80. The second head 81b extends from the first head 81a toward the other end of the shaft portion 80 in one direction. That is, the second head 81b extends from the first head 81a toward the second wiring member 60 (main surface 8a). The second head 81b is disposed to face the outer circumferential surface 80a of the shaft portion 80 with a predetermined distance therebetween. That is, the inner surface 81bs of the second head 81b is arranged to face the outer circumferential surface 80a of the shaft portion 80. A void (gap) is formed between the second head 81b and the shaft portion 80.

The second head 81b is arranged to surround the entire circumference of the outer peripheral surface 80a of the shaft portion 80. That is, the second head 81b has an annular shape. The tip of the second head 81b (the end opposite to the end connected to the first head 81a) has a curved portion. That is, in the second head 81b, no corner is formed at the end that can come into contact with the main surface 60b of the second wiring member 60.

In this embodiment, the shapes of the second heads 81b of the heads 81 of the plurality of fixing parts 8b, 8c, 8d, and 8e are different from each other. As shown in FIG. 11(a), in the fixed portion 8c, the second head 81b of the head 81 is not in contact with the main surface 60a of the second wiring member 60. As shown in FIG. 11(b), in the fixed portion 8b, the second head 81b of the head 81 is in contact with the main surface 60a of the second wiring member 60. As shown in FIG. 11(c), in the fixed part 8e, a part of the second head 81b of the head 81 is in contact with the main surface 60a of the second wiring member 60, and a part of the second head 81b is in contact with the main surface 60a of the second wiring member 60. The portion is not in contact with the main surface 60a of the second wiring member 60. As shown in FIG. 11(d), in the fixed part 8d, a part of the second head 81b of the head 81 is in contact with the main surface 60a of the second wiring member 60, and a part of the second head 81b is in contact with the main surface 60a of the second wiring member 60. The portion is not in contact with the main surface 60a of the second wiring member 60.

Next, a method for fixing the wiring section 2 to the bottom plate 8 will be explained. As shown in FIG. 12(a), the fixed part 8b0 before the wiring part 2 is fixed has a different shape from the fixed part 8b after the wiring part 2 is fixed. The shaft portion 800 before the wiring portion 2 is fixed is, for example, larger than the inner diameter d1 of the through hole 60c. The head 810 before the wiring section 2 is fixed is formed in a tapered shape that becomes narrower as it moves away from the shaft section 800. The outer diameter of the tip of the head 810 is smaller than the inner diameter d1 of the through hole 60c.

When fixing the wiring part 2 to the bottom plate 8, first align the wiring part 2 with the bottom plate 8 so that the through hole 60c of the second wiring member 60 is placed on the corresponding fixing part 8b0, and then The through hole 60c is inserted into the portion 800. Subsequently, as shown in FIG. 12(b), the fixing portion 8b0 is pressed by the press plate P toward the main surface 8a. The press plate P is heated. As a result, the head 810 made of resin is melted and crushed by the press plate P to become the head 81.

As shown in FIG. 2, the case 3 is attached to the mounting surface 200a of the mounting member 200, and forms an acoustic space S in which the vibrating section 1 is disposed between the mounting surface 200a and the mounting surface 200a. The acoustic space S has a first space S1 and a second space S2 that communicate with each other through the communication portion 7b. The first space S1 is formed between the attached surface 200a and the main surface 12a. The second space S2 is formed between the case 3 and the main surface 12b. The first space S1 is, for example, wider than the second space S2.

The piezoelectric element 10, the vibration member 12, and the acoustic space S are configured to have mutually different resonance frequencies (resonance points) in the audible range (for example, a range of 2 kHz or more and 20 kHz or less). For example, the resonant frequency of the piezoelectric element 10 and the vibrating member 12 becomes higher when the outer dimensions of the piezoelectric element 10 and the vibrating member 12 are made smaller, and becomes lower when the outer dimensions of the piezoelectric element 10 and the vibrating member 12 are made larger. The resonance frequencies of the piezoelectric element 10 and the vibrating member 12 are also adjusted, for example, by the materials that constitute the piezoelectric element 10 and the vibrating member 12, or the shapes of the piezoelectric element 10 and the vibrating member 12. The resonant frequency of the acoustic space S is adjusted, for example, by adjusting the size, shape, etc. of the acoustic space S. The resonant frequency of the acoustic space S is also adjusted by the materials constituting members such as the case 3 and the attached member 200 that define the acoustic space S. Note that the resonant frequency is the frequency at which the sound pressure becomes maximum due to resonance.

The piezoelectric element 10 is configured to have a resonant frequency in a range of, for example, 2000 Hz or more and 3000 Hz or less. The acoustic space S is configured to have a resonant frequency in a range of, for example, 3000 Hz or more and 6000 Hz or less. The vibrating member 12 is configured to have a resonant frequency in a range of, for example, 13,000 Hz or more and 17,000 Hz or less. The piezoelectric element 10, the vibration member 12, and the acoustic space S have resonance frequencies in different ranges (ranges that do not overlap with each other) in the audible range. The resonant frequencies of the piezoelectric element 10, the vibrating member 12, and the acoustic space S are adjusted to be dispersed with at least a difference of 500 Hz or more from each other. The difference between the resonant frequency of the piezoelectric element 10 and the resonant frequency of the vibrating member 12 is, for example, 10,000 Hz or more. The difference between the resonant frequency of the vibrating member 12 and the resonant frequency of the acoustic space S is, for example, 7000 Hz or more.

As shown in FIG. 13, the conventional fixing portion 8P includes a shaft portion 80P and a head portion 81P. The head 81P has a flat plate shape. In the fixed part 8P, the second wiring member 60 may push up the head 81P due to the vibration of the piezoelectric element. As a result, there is a possibility that cracks may occur starting from the connection portion between the shaft portion 80P and the head portion 81P (the corner formed by the outer circumferential surface 80Pa of the shaft portion 80 and the lower surface of the head portion 81P). If the head 81P is damaged due to the occurrence of cracks, it may become impossible to fix the second wiring member 60. This may reduce the reliability of the vibration device.

In the vibration device 100 according to this embodiment, the case 3 has a plurality of fixing parts 8b, 8c, 8d, and 8e. Each of the fixing parts 8b, 8c, 8d, and 8e has a shaft part 80 and a head part 81. The head 81 has a first head 81a and a second head 81b. The second head 81b is connected to the first head 81a and extends from the first head 81a toward the other end in one direction of the shaft 80, and is connected to the outer peripheral surface 80a of the shaft 80. They are arranged facing each other at a predetermined interval. That is, the second head 81b is provided apart from the shaft portion 80. Thereby, in the vibrating device 100, even if the second head 81b is pushed up by the second wiring member 60, external stress can be dispersed in the second head 81b. Therefore, in the vibrating device 100, it is possible to suppress the occurrence of cracks starting from the connecting portion between the shaft portion 80 and the head portion 81. Therefore, in the vibration device 100, damage to the head 81 can be suppressed. As a result, the reliability of the vibration device 100 can be improved.

In this embodiment, the fixing parts 8b, 8c, 8d, and 8e are made of a resin material such as acrylic resin, vinyl chloride resin, or molded resin. Therefore, since the second head 81b has flexibility, it bends when external force is applied. Thereby, in the vibrating device 100, when the second head 81b is pushed up by the second wiring member 60, external stress can be effectively dispersed in the second head 81b.

In the vibration device 100 according to the present embodiment, the second head 81b is arranged to surround the entire circumference of the outer peripheral surface 80a of the shaft portion 80. With this configuration, external stress can be more effectively dispersed in the second head 81b.

In the vibration device 100 according to this embodiment, the tip of the second head 81b has a curved portion. In this configuration, since the tip of the second head 81b that contacts (butts) the second wiring member 60 does not have a corner, the second wiring member 60 (the main Damage to the surface 60a) can be suppressed.

In the vibration device 100 according to the present embodiment, the second head 81b of the head 81 of each of the plurality of fixing parts 8b, 8c, 8d, and 8e has a different shape. In this configuration, the frequency of contact between the second head 81b of each of the fixing parts 8b, 8c, 8d, and 8e and the second wiring member 60 may be different. As a result, in the vibrating device 100, the durability (life span) of the fixed parts 8b, 8c, 8d, and 8e may differ. Therefore, it is possible to avoid damaging all the fixing parts 8b, 8c, 8d, and 8e at the same time.

Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the embodiments described above, and various changes can be made without departing from the gist thereof.

In the above embodiment, the upper surface of the second head 81b of the head 81 of the fixing parts 8b, 8c, 8d, and 8e is a flat surface. The shape of the head 81 is not limited to this. As shown in FIG. 14(a), the fixing portion 8Ab has a shaft portion 80 and a head portion 81A. The head 81A includes a first head 81Aa and a second head 81Ab. The upper surface of the first head 81Aa is, for example, a curved surface. The first head 81Aa has a hemispherical shape. The first head 81Aa has a so-called single mount shape. The second head 81Ab is arranged to face the outer circumferential surface 80a of the shaft portion 80 with a predetermined distance therebetween. That is, the inner surface 81Abs of the second head 81Ab is arranged to face the outer circumferential surface 80a of the shaft portion 80.

As shown in FIG. 14(b), the fixing portion 8Bb includes a shaft portion 80 and a head portion 81BC. The head 81B includes a first head 81Ba and a second head 81Bb. The upper surface of the first head 81Ba is, for example, a curved surface. The first head 81Ba has a hemispherical shape with a depressed center. The first head 81Ba has a so-called double mount shape. The second head 81Bb is disposed to face the outer circumferential surface 80a of the shaft portion 80 with a predetermined distance therebetween. That is, the inner surface 81Bbs of the second head 81Bb is arranged to face the outer circumferential surface 80a of the shaft portion 80.

In the embodiment described above, an example has been described in which the shaft portions 80 and heads 81 of the fixing portions 8b, 8c, 8d, and 8e are integrally formed. However, as shown in FIG. 15, in the fixing part 8Cb, the shaft part 80 and the head part 81C may be provided separately. The head 81C includes a first head 81Aa and a second head 81Ab. The head 81C is fixed to the shaft portion 80 with a bolt 82. Thereby, the second head 81Cb is disposed to face the outer circumferential surface 80a of the shaft portion 80 with a predetermined distance therebetween. That is, the inner surface 81Cbs of the second head 81Cb is arranged to face the outer circumferential surface 80a of the shaft portion 80.

In the above embodiment, the second head 81b of the head 81 is arranged to surround the entire circumference of the outer peripheral surface 80a of the shaft portion 80, as an example. However, the second head 81b may be arranged so as to surround a part of the outer circumferential surface 80a of the shaft portion 80.

In the above embodiment, as shown in FIG. 10, the outer circumferential surface 80a of the shaft portion 80 and the second head portion 81b are arranged to face each other with a predetermined interval. That is, the embodiment in which a space is formed between the shaft portion 80 and the second head 81b has been described as an example. However, being disposed facing each other with a predetermined interval may mean that at least a gap exists between the shaft portion and the head (second head). The gap referred to here may be any gap that exists between the shaft portion and the second head portion and partitions the shaft portion and the second head portion. Therefore, the gap may be linear like a weld line, for example. By providing such a gap in the fixture (fixing part), even if a crack should occur starting from the connecting portion between the shaft part and the head part, extension of the crack can be suppressed. Further, in the fixture, by providing the above-mentioned gap, the structure becomes noticeable before the head is completely damaged, and it is possible to prevent the head from being completely damaged.

In the embodiment described above, the second head 81b of the head 81 of each of the plurality of fixing parts 8b, 8c, 8d, and 8e has been explained as an example. However, the shapes of the second heads 81b of the respective heads 81 of the plurality of fixing parts 8b, 8c, 8d, and 8e may be the same. Moreover, the shape of the second head 81b of the head 81 may be different in two of the plurality of fixing parts 8b, 8c, 8d, and 8e.

In the above embodiment, the shaft portion 80 has a cylindrical shape and the head portion 81 has a disk shape. However, the shaft portion may also be prismatic. Further, the head may have a rectangular plate shape.

In the embodiment described above, an example in which the fixtures (fixing parts 8b, 8c, 8d, and 8e) are applied to the vibration device 100 has been described. However, the fixture may also be applied to other devices (structures). Further, the fixture may be used alone.

In the embodiment described above, the thickness of the second head 81b of the head 81 is shown to be uniform in FIG. However, the second head 81b does not need to have an even thickness. That is, the second head 81b may have a thick portion and a thin portion.

3... Case, 8... Bottom plate (arrangement part), 8a... Main surface (fourth main surface), 8b... Fixing part (fixing tool), 10... Piezoelectric element, 11... Piezoelectric element body, 11a... Main surface, 13, DESCRIPTION OF SYMBOLS 15... External electrode, 50... First wiring member, 50c... Narrow part, 59... Reinforcement part, 60... Second wiring member, 60a... Principal surface (second principal surface), 60b... Principal surface (third principal surface) ), 60c...through hole, 80...shaft portion, 80a...outer peripheral surface, 81...head, 81a...first head, 81b...second head, 100...vibration device.

Claims (2)

a piezoelectric element having a piezoelectric element body having a first main surface, and a pair of external electrodes disposed on the first main surface;
a strip-shaped first wiring member connected to the pair of external electrodes on the first main surface;
a plate-shaped second wiring member having a second main surface and a third main surface facing each other and connected to the first wiring member;
a case in which the second wiring member is arranged,
The second wiring member is provided with a plurality of through holes penetrating the second wiring member in a direction opposite to the second main surface and the third main surface,
The said case is
an arrangement portion having a fourth main surface facing the third main surface and in which the second wiring member is arranged;
a plurality of fixing parts configured integrally with the arrangement part and fixing the second wiring member to the arrangement part,
Each of the plurality of fixing parts is
a shaft protruding from the fourth principal surface in one direction and inserted into the through hole;
a head provided at one end of the shaft in the one direction and locked to the second main surface;
The head is
a first head connected to the one end of the shaft;
connected to the first head, extending from the first head in the one direction toward the other end of the shaft, and facing the outer circumferential surface of the shaft at a predetermined distance; a second head disposed as a vibration device; The vibration device according to claim 1 , wherein the second head of the head of each of the plurality of fixing parts has a different shape.

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