JP7358009B2 - Processing condition change method and processing equipment - Google Patents

Description

The present invention relates to a processing apparatus for processing a workpiece, and a processing condition changing method for changing the processing conditions of the processing apparatus.

By dividing a semiconductor wafer on which devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed, a plurality of semiconductor device chips each having a device are manufactured. Moreover, a package device is manufactured by dividing a package substrate formed by covering a plurality of semiconductor device chips mounted on a substrate with a sealing material (mold resin) made of resin. This package device is built into various electronic devices such as mobile phones and personal computers.

In recent years, as electronic devices have become smaller and thinner, semiconductor device chips and package devices have also been required to be thinner. Therefore, a method is used in which semiconductor wafers and package substrates are ground and thinned before being divided.

For example, a cutting device that cuts the workpiece with an annular cutting blade attached to a spindle is used to divide the workpiece, such as the semiconductor wafer or package substrate described above. Further, for thinning the workpiece, for example, a grinding device is used that grinds the workpiece with a grinding wheel provided with a grinding wheel mounted on a spindle.

Processing devices such as cutting devices and grinding devices may process multiple types of workpieces that differ in size, material, structure, etc. In this case, the processing device stores in advance a plurality of processing conditions (recipes) suitable for processing each workpiece. Appropriate processing conditions are then selected depending on the type of workpiece to be processed by the processing device, and the workpiece is processed under these processing conditions. The processing conditions are set manually, for example, by an operator operating a touch panel or the like provided in the processing device.

Furthermore, in a large-scale factory that processes a large number of workpieces, the same type of workpieces are simultaneously processed using a plurality of processing apparatuses that are set to the same processing conditions. Here, when it becomes necessary to change the machining conditions, it is necessary to reset the machining conditions of all the machining devices that process the same type of workpiece. In this case, the operator must operate each processing device individually to change the processing conditions, which requires a great deal of effort.

Therefore, a processing device management method is sometimes used in which a plurality of processing devices are configured to be able to communicate with each other, and by operating one processing device, the processing conditions of the other processing devices can also be changed. For example, Patent Document 1 discloses a configuration in which a plurality of processing devices are connected through a communication circuit and processing conditions can be transmitted and received between the processing devices. This eliminates the need to individually change the machining conditions for each machining device, thereby simplifying the management of the machining conditions.

Japanese Patent Application Publication No. 2014-235443

Each of the plurality of processing conditions (recipes) stored in the processing device includes a plurality of condition items (condition elements). For example, the machining conditions stored in a cutting device that cuts a workpiece with an annular cutting blade include condition items such as machining feed rate, rotation speed of the cutting blade, and depth of cut of the cutting blade. Values for each condition item are set in advance depending on the content of processing. When using a machining device in which a plurality of machining conditions are stored, only the set values of some condition items may be uniformly changed for all machining conditions.

For example, when changing the machining feed rate to a predetermined value regardless of the type of workpiece to be machined, the set value of the machining feed rate is changed to the predetermined value under all machining conditions, and the other The setting values of the condition items are maintained unchanged. In this case, the operator selects one machining condition by operating the touch panel etc. equipped on the machining device, and changes only the set value of a predetermined condition item (machining feed rate) included in the selected machining condition. The work must be repeated for all processing conditions. Therefore, it takes time and effort to set the processing conditions, and input errors are more likely to occur.

The present invention has been made in view of this problem, and aims to provide a processing condition changing method and processing apparatus that allow processing conditions to be set easily and reliably.

According to one aspect of the present invention, a holding table that holds a workpiece, a processing unit that processes the workpiece held by the holding table, and a plurality of processing conditions each including a plurality of condition items. A method for changing machining conditions of a machining device comprising: a control section having a storage section for storing a plurality of conditions; and an input section connected to the control section. an input step of inputting a predetermined condition item whose setting value is to be changed among the items and a setting value after the change of the predetermined condition item into the input section; and a plurality of conditions stored in the storage section. Processing comprising a setting value changing step of collectively changing the setting values of the predetermined condition items included in all of the processing conditions that are subject to change to the changed setting values. A method of changing conditions is provided.

Preferably, in the machining condition changing method, before the setting value changing step, the setting values of the predetermined condition items included in each of the plurality of machining conditions stored in the storage unit are changed to old settings. The method further includes a step of storing an old setting value in the storage unit as a value. Preferably, in the input step, machining condition designation information specifying a predetermined machining condition among the plurality of machining conditions is further input into the input section, and in the setting value changing step, machining condition designation information is used to specify a predetermined machining condition among the plurality of machining conditions. The setting value of the predetermined condition item included in the specified predetermined processing condition is changed.

According to another aspect of the present invention, each includes a holding table that holds a workpiece, a processing unit that processes the workpiece held by the holding table, and a plurality of condition items. A control unit having a storage unit that stores a plurality of machining conditions; and an input unit connected to the control unit, the input unit inputting the plurality of condition items included in the machining conditions to the control unit. Among them, a predetermined condition item whose setting value is to be changed and a setting value after the change of the predetermined condition item are input, and the control unit inputs a plurality of processing conditions stored in the storage unit . A machining device is provided that collectively changes the setting values of the predetermined condition items included in all of the machining conditions that are subject to change to the changed setting values.

In the machining condition changing method and machining apparatus according to one aspect of the present invention, setting values of predetermined condition items included in each of a plurality of machining conditions stored in a storage section are changed all at once. This simplifies the process of changing the machining conditions, makes it difficult to input errors in the machining conditions, and makes it possible to easily and reliably set the machining conditions of the machining device.

It is a perspective view showing a processing device. FIG. 3 is a block diagram showing a control section. FIG. 3 is a block diagram showing a control unit when setting values of condition items are changed. FIG. 3 is a block diagram showing a storage unit in an old setting value storage step. It is a block diagram which shows the control part when some processing conditions are changed.

Hereinafter, embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. First, a configuration example of a processing apparatus according to this embodiment will be described. FIG. 1 is a perspective view showing the processing device 2. As shown in FIG. The processing device 2 is a grinding device that performs a grinding process on the workpiece 11.

The processing device 2 includes a base 4 on which each component constituting the processing device 2 is mounted. A rectangular parallelepiped-shaped support structure 6 is provided at the rear end of the base 4 along the Z-axis direction (vertical direction, up-down direction). Further, a rectangular opening 4a whose longitudinal direction is along the X-axis direction (front-back direction, first horizontal direction) is formed on the upper surface side of the base 4.

A ball screw type X-axis moving mechanism 8 and a dust-proof and drip-proof cover 10 that partially covers the X-axis moving mechanism 8 are arranged inside the opening 4a. The X-axis moving mechanism 8 includes an X-axis moving table 8a whose upper surface is exposed from the dust-proof and drip-proof cover 10, and moves this X-axis moving table 8a along the X-axis direction.

A holding table 12 that holds a workpiece 11 is provided on the X-axis moving table 8a. The upper surface of the holding table 12 is formed approximately parallel to the X-axis direction and the Y-axis direction (left-right direction, second horizontal direction), and constitutes a holding surface 12a that holds the workpiece 11. The holding surface 12a is formed into a porous shape by, for example, porous ceramics, and is connected to a suction source (not shown) such as an ejector via a flow path (not shown) formed inside the holding table 12.

A workpiece 11 to be processed by the processing device 2 is placed on the holding surface 12a of the holding table 12. For example, the workpiece 11 is a disk-shaped wafer made of silicon or the like, and has a front surface 11a and a back surface 11b. The workpiece 11 is divided into a plurality of regions by a plurality of dividing lines (streets) arranged in a grid so as to intersect with each other, and an IC (Integrated Circuit) is installed on the surface 11a side of each region. , LSI (Large Scale Integration), LED (Light Emitting Diode), and other devices are formed.

A tape 13 made of resin or the like and having approximately the same diameter as the workpiece 11 is attached to the surface 11a side of the workpiece 11. This tape 13 functions as a protective tape that protects a plurality of devices formed on the front surface 11a side of the workpiece 11 when the back surface 11b side of the workpiece 11 is ground by the processing device 2.

Note that there are no restrictions on the material, shape, structure, size, etc. of the workpiece 11. For example, the workpiece 11 may be a wafer of any shape and size made of a material other than silicon (GaAs, InP, GaN, SiC, etc.), sapphire, glass, ceramics, resin, metal, or the like. Furthermore, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of devices formed on the workpiece 11. Furthermore, the workpiece 11 does not need to have a device formed thereon, and the tape 13 does not need to be attached thereto.

For example, the workpiece 11 is placed on the holding table 12 so that the front surface 11a side (tape 13 side) faces the holding surface 12a, and the back surface 11b side is exposed upward. When negative pressure from the suction source is applied to the holding surface 12a in this state, the workpiece 11 is suction-held by the holding table 12 via the tape 13. Note that although FIG. 1 shows an example in which the holding surface 12a is formed in a circular shape in a plan view, assuming that a disk-shaped workpiece 11 is held, the shape of the holding surface 12a may vary depending on the shape of the workpiece 11, etc. Changes will be made as appropriate.

The holding table 12 is moved along the X-axis direction by the X-axis moving mechanism 8 together with the X-axis moving table 8a. Further, the holding table 12 is connected to a rotational drive source (not shown) such as a motor, and this rotational drive source rotates the holding table 12 around a rotation axis that is generally parallel to the Z-axis direction.

A Z-axis moving mechanism 14 is provided on the front side of the support structure 6. The Z-axis moving mechanism 14 includes a pair of guide rails 16 arranged along the Z-axis direction, and a moving plate 18 is disposed on the pair of guide rails 16 along the Z-axis direction. It is attached so that it can slide in any direction. A nut portion (not shown) is provided on the rear side (back side) of the movable plate 18, and a ball screw 20 disposed approximately parallel to the pair of guide rails 16 is screwed into this nut portion.

A pulse motor 22 is connected to one end of the ball screw 20. When the ball screw 20 is rotated by the pulse motor 22, the moving plate 18 moves along the guide rail 16 in the Z-axis direction.

A support 24 that protrudes forward from the front surface of the movable plate 18 is fixed to the front side (surface side) of the movable plate 18 . The support 24 supports a processing unit (processing means) 26 that processes the workpiece 11. This processing unit 26 is a grinding unit (grinding means) that performs a grinding process on the workpiece 11. The processing unit 26 includes a cylindrical housing 28 fixed to the support 24, and the housing 28 accommodates a cylindrical spindle 30 serving as a rotation axis.

The spindle 30 is arranged along the Z-axis direction. The tip (lower end) of the spindle 30 is exposed outside the housing 28, and a disc-shaped wheel mount 32 is fixed to this tip. Further, a rotational drive source (not shown) such as a motor is connected to the base end (upper end) side of the spindle 30, and the spindle 30 and wheel mount 32 are rotated by the force transmitted from this rotational drive source. It rotates around a rotation axis that is generally parallel to the axial direction.

A disc-shaped grinding wheel 34 having approximately the same diameter as the wheel mount 32 is mounted on the lower surface side of the wheel mount 32 . The grinding wheel 34 includes an annular base made of metal or the like and attached to the lower surface of the wheel mount 32, and a plurality of grinding wheels fixed to the lower surface of the base. The plurality of grinding wheels are formed, for example, in the shape of a rectangular parallelepiped, and are arranged at approximately equal intervals along the outer periphery of the base. The lower surfaces of the plurality of grinding wheels correspond to grinding surfaces for grinding the workpiece 11.

A grinding wheel is formed by fixing abrasive grains made of diamond, cBN (Cubic Boron Nitride), etc. with a binding material such as metal bond, resin bond, or vitrified bond. However, there are no restrictions on the material, shape, structure, size, etc. of the grinding wheels, and the number of grinding wheels included in the grinding wheel 34 can also be set arbitrarily.

When grinding the workpiece 11 , the holding table 12 holding the workpiece 11 is moved by the X-axis moving mechanism 8 and positioned below the grinding wheel 34 . Then, while rotating the holding table 12 and the spindle 30 (grinding wheel 34) in a predetermined direction at a predetermined number of rotations, the spindle 30 (grinding wheel 34) is lowered at a predetermined speed by the Z-axis moving mechanism 14, A plurality of grinding wheels included in the grinding wheel 34 are brought into contact with the back surface 11b side of the workpiece 11. As a result, the back surface 11b side of the workpiece 11 is ground, and the workpiece 11 is thinned to a predetermined thickness.

Note that a machining fluid supply path (not shown) for supplying machining fluid (grinding fluid) such as pure water is formed inside the machining unit 26 . When machining the workpiece 11, the machining fluid is supplied from this machining fluid supply path toward the grinding stone of the grinding wheel 34 and the workpiece 11. As a result, the grinding wheel and the workpiece 11 are cooled, and the debris (machining debris) generated by machining is washed away.

The processing device 2 also includes a control section (control unit, control means) 40 connected to each component of the processing device 2 (X-axis moving mechanism 8, holding table 12, Z-axis moving mechanism 14, processing unit 26, etc.). Equipped with. The control unit 40 is configured by a computer or the like, and controls each component of the processing device 2.

The control unit 40 includes a processing unit (processing means) 42 that performs processing such as calculations necessary for controlling the processing device 2, and a storage unit (memory unit) that stores various data, programs, etc. used in processing by the processing unit 42. means) 44. The processing unit 42 is configured by a processor such as a CPU (Central Processing Unit), and the storage unit 44 is configured by a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory). Note that, as described later, the storage unit 44 stores conditions (processing conditions) when the processing device 2 processes the workpiece 11.

The control section 40 includes an input section (input means) 60 for inputting various information to the control section 40, and a display section (display means) 70 for displaying various information regarding processing (processing conditions, processing results, etc.). It is connected. The input unit 60 includes an operation panel (operation keys), a mouse, and the like, and the display unit 70 includes a display and the like. Further, the display unit 70 may be configured with a touch panel or the like that allows information to be input. In this case, since the display section 70 also functions as the input section 60, there is no need to separately provide the input section 60.

The processing device 2 described above processes a plurality of types of workpieces 11 having different sizes, materials, structures, and the like. Therefore, the storage unit 44 stores a plurality of processing conditions (recipes) suitable for processing each workpiece 11. Then, the control unit 40 controls each of the processing devices 2 so that appropriate processing conditions are selected according to the type of the workpiece 11 to be processed by the processing device 2, and the workpiece 11 is processed under these processing conditions. Control the behavior of components.

FIG. 2 is a block diagram showing the control section 40. As shown in FIG. The storage unit 44 includes a processing condition storage unit 46 that stores processing conditions of the processing device 2. The processing condition storage unit 46 stores a plurality of processing conditions (recipes) 48 having different contents. Further, each machining condition 48 includes a machining condition name 48a indicating the name of the machining condition 48, and a plurality of condition items (condition elements) 48b. FIG. 2 shows an example in which six types of machining conditions 48 (machining conditions A to F) are stored in the storage unit 44, and each machining condition 48 includes three condition items 48b (condition items a, b, c). It shows. However, there is no limit to the number of processing conditions 48 and condition items 48b.

The machining condition name 48a is a character string that serves as an index of the machining condition 48, and includes, for example, letters and numbers indicating the size of the workpiece 11, the material of the workpiece 11, the details of machining, and the like. Further, the condition item 48b is an item (element) that constitutes the machining condition 48, and is various parameters that determine the contents of the machining condition 48. Examples of the condition items 48b include the target value of the thickness of the workpiece 11 (finished thickness), the rotation speed of the grinding wheel 34 (spindle 30), the rotation speed of the holding table 12, and the descending speed of the grinding wheel 34 (grinding The speed at which the wheel 34 is pressed against the workpiece 11), the supply amount and temperature of the machining fluid, etc.

Each of the condition items 48b is set to a predetermined value depending on the processing content. For example, the setting values of condition items a, b, and c included in machining condition A (machining condition name "XXXX") are x ₁ , y ₁ , and z _1, respectively. By changing the setting value of the condition item 48b, the contents of the processing condition 48 are changed.

When processing the workpiece 11 with the processing device 2, processing conditions are first set according to the type of the workpiece 11. Specifically, the operator selects one machining condition 48 suitable for machining the workpiece 11 and inputs the machining condition name 48a of the machining condition 48 into the input section 60. The processing condition name 48a input to the input section 60 is input from the input section 60 to the processing section 42 of the control section 40.

The processing unit 42 reads the machining condition 48 corresponding to the machining condition name 48a input to the input unit 60 from the machining condition storage unit 46 in the storage unit 44, and sets each condition item 48b included in the machining condition 48. Set the value as a parameter for processing. Then, the processing unit 42 controls the operation of each component of the processing device 2 according to the set value of the condition item 48b.

As a result, the workpiece 11 is machined under the machining conditions 48 specified by the operator. Further, the processing section 42 outputs information such as the set machining conditions 48 and the machining progress status to the display section 70, and causes the display section 70 to display this information.

When adding a new machining condition 48 or condition item 48b to the storage section 44, or when changing or deleting the machining condition 48 or condition item 48b stored in the storage section 44, the operator inputs necessary information into the input section 60. Enter. The processing unit 42 then accesses the storage unit 44 and adds, changes (overwrites), or deletes the processing conditions 48 or condition items 48b based on the information input to the input unit 60.

For example, when changing the setting value x ₁ of condition item a included in processing condition A shown in FIG. 2 and the setting value y ₂ of condition item b included in processing condition B, the operator first inputs and select processing condition A. Then, the changed setting value of condition item a is input into the input section 60, and the setting value of condition item a is changed. After that, the selection of machining condition A is canceled and machining condition B is selected. Then, the changed setting value of condition item b is input into the input section 60, and the setting value of condition item b is changed.

Note that among the plurality of condition items 48b included in the processing conditions 48, only the setting values of some of the condition items 48b may be uniformly changed in the plurality of processing conditions 48. For example, when changing the finished thickness of all types of workpieces 11 processed by the processing device 2 to a predetermined value uniformly, the finished thickness of the workpieces 11 is changed under all processing conditions 48. It is necessary to change only the setting value of the condition item 48b shown.

Here, in the processing device 2, when the predetermined condition item 48b whose set value is changed and the changed setting value of the condition item 48b are input to the input unit 60, the set value is stored in the storage unit 44. The setting values of the predetermined condition items 48b included in each of the plurality of processing conditions 48 are collectively changed to the changed setting values. Therefore, the operator does not have to repeat the process of selecting the processing conditions 48 one by one and changing the set value of the condition item 48b. This simplifies the task of changing the machining conditions of the machining device 2, and makes input errors less likely to occur.

A specific example of a method for setting machining conditions for the machining device 2 will be described below. As an example, a case will be described below in which the setting value of condition item c is changed to z ₇ for all machining conditions 48 (machining conditions A to F). FIG. 3 is a block diagram showing the control unit 40 when the setting value of the condition item 48b is changed.

First, among the plurality of condition items 48b included in the processing conditions 48, a predetermined condition item 48b whose setting value is to be changed and the changed setting value of the predetermined condition item 48b are input into the input section 60 (input step). The predetermined condition item 48b whose setting value is to be changed and the changed setting value of the condition item 48b are selected by, for example, an operator of the processing device 2 and input into the input unit 60. FIG. 3 shows an example in which the predetermined condition item 48b whose setting value is changed is condition item c, and the changed setting value of condition item c is _z7 .

Next, the setting values of the predetermined condition items 48b included in each of the plurality of processing conditions 48 stored in the storage unit 44 are changed all at once to the changed setting values (setting value changing step). Specifically, the condition item c and setting value _z7 input to the input unit 60 are input to the processing unit 42 included in the control unit 40. Then, the processing section 42 accesses the machining condition storage section 46 in the storage section 44 and rewrites the setting value of the condition item c of all the machining conditions 48 (machining conditions A to F) to _z7 . As a result, the setting value of condition item c is changed to _z7 in all machining conditions 48 at once.

The batch modification of the condition items 48b is performed, for example, by the processing unit 42 executing a predetermined program stored in the storage unit 44. Specifically, the processing condition storage unit 44 stores a process of changing the setting value of the predetermined condition item 48b input into the input unit 60 to the predetermined setting value input into the input unit 60. A program to be executed for all machining conditions 48 stored in is stored. Then, when the condition item 48b and the set value are input to the input unit 60, the processing unit 42 executes this program.

Note that after changing the setting values of a predetermined condition item 48b for all processing conditions 48 at once, the setting value of the condition item 48b may be returned to the setting value before the change (old setting value). For example, if the setting value of condition item 48b is temporarily changed, or if the setting value of condition item 48b after the change is not appropriate, it is necessary to return the setting value of condition item 48b to the old setting value. becomes. In addition, past setting values of the condition items 48b may be saved and referred to later when selecting appropriate processing conditions.

Therefore, before the setting value changing step, the setting values of the predetermined condition items 48b included in each of the plurality of processing conditions 48 stored in the storage section 44 may be stored in the storage section 44 as old setting values. (old setting value storage step). FIG. 4 is a block diagram showing the storage unit 44 in the old setting value storage step.

In addition to the machining condition storage section 46, the storage section 44 further includes an old setting value storage section 50. This old setting value storage section 50 stores the setting value of the predetermined condition item 48b before the change. For example, when condition item c and setting value _z7 are input to the input section 60, and the setting value of condition item c of all machining conditions 48 (machining conditions A to F) is changed by _z7 (see FIG. 3), ), before the change, the setting values (z ₁ to z ₆ ) of condition item c of machining conditions A to F are each copied and stored in the old setting value storage section 50. Note that the processing unit 42 copies the setting value of the condition item c. As a result, the pre-change setting value of the predetermined condition item 48b is stored in the storage unit 44.

For example, the setting values (z ₁ to z ₆ ) of condition item c of machining conditions A to F are associated with the machining condition names 48a of machining conditions A to F, as shown in FIG. 4, and are stored in the old setting value memory. The information is stored in the section 50. Then, after the setting values of condition item c of machining conditions A to F are changed all at once to z ₇ (setting value change step), the old setting values of condition item c (z ₁ to z ₆ ) and overwrites it as the setting value of condition item c of machining conditions A to F stored in machining condition storage unit 46, the setting value of condition item c of machining condition storage unit 46 is changed. can be returned to its previous value.

Furthermore, in FIG. 3, a case has been described in which the setting values of the condition items 48b of all the processing conditions 48 (processing conditions A to F) are changed, but only the setting values of the condition items 48b of some of the processing conditions 48 are changed. You can also. For example, the setting value of the condition item 48b may be changed only for the processing conditions 48 for processing the workpiece 11 of a specific size or material. FIG. 5 is a block diagram showing the control unit 40 when some of the processing conditions 48 are changed.

In the input step, in addition to the condition item 48b whose setting value is to be changed (condition item c in FIG. 5) and the changed setting value of the condition item 48b (z ₇ in FIG. 5), the setting of the condition item 48b is Information specifying some of the processing conditions 48 whose values are to be changed (processing condition designation information) is input to the input unit 60. For example, as information specifying the processing condition 48, a condition with a processing condition name 48a is input. FIG. 5 shows an example in which information specifying machining conditions 48 (machining conditions A to C) whose machining condition name 48a includes the character string "XXX" is input.

When the condition item 48b (condition item c), setting value (z ₇ ), and machining condition designation information (condition with machining condition name 48a) are input to the input unit 60, the processing unit 42 inputs the machining condition in the storage unit 44. The storage unit 46 is accessed and the set value of the condition item 48b included in the machining condition 48 specified by the machining condition designation information is rewritten. Specifically, the processing unit 42 selects the processing conditions 48 (processing conditions A to C) whose processing condition name 48a includes the character string “XXX” among the plurality of processing conditions 48 stored in the processing condition storage unit 46. Rewrite the setting value of condition item c to _z7 . As a result, in some machining conditions 48, the set value of condition item c is changed to _z7 all at once.

Note that the machining conditions 48 may further include information indicating the size and material of the workpiece 11 to be machined under the machining conditions 48. In this case, by inputting information specifying the size or material of the workpiece 11 into the input section 60, the condition item is set only for the processing conditions 48 for processing the workpiece 11 of a specific size or material. 48b can be changed. In addition, if the processing condition name 48a includes a character string indicating the size or material of the workpiece 11, by inputting the character string as processing condition specification information, it is possible to specify the workpiece of a specific size or material. Only the machining conditions 48 for machining 11 can be selected.

As described above, in the machining condition changing method according to the present embodiment, the setting values of the predetermined condition items 48b included in each of the plurality of machining conditions 48 stored in the storage unit 44 are changed at once. This simplifies the process of changing the machining conditions, makes it difficult to input errors in the machining conditions, and allows the machining conditions of the machining device 2 to be set easily and reliably.

In addition, in this embodiment, the case where the processing apparatus 2 is a grinding apparatus equipped with the processing unit 26 (grinding unit) which grinds the workpiece 11 was demonstrated, but there is no restriction|limiting in the type of processing apparatus 2. For example, the processing device 2 includes a cutting device including a processing unit (cutting unit) that cuts the workpiece 11 with an annular cutting blade, a polishing device including a processing unit (polishing unit) that polishes the workpiece 11 with a polishing pad, It may be a laser processing device or the like that includes a processing unit (laser irradiation unit) that processes the workpiece 11 by irradiating the workpiece 11 with a laser beam.

When the processing device 2 is a cutting device, the condition items 48b included in the processing conditions 48 include the rotation speed of the cutting blade, the speed and direction of processing feed, the depth of cut of the cutting blade, and the area to be cut by the cutting blade. The interval, the supply amount and temperature of machining fluid (pure water, etc.), and the like are stored in the storage unit 44.

In addition, when the processing device 2 is a polishing device, the condition items 48b included in the processing conditions 48 include the target value of the thickness of the workpiece 11 (finishing thickness), the number of rotations of the polishing pad, and the rotation of the holding table. The number, the descending speed of the polishing pad (the speed at which the polishing pad is pressed against the workpiece 11), the supply amount and temperature of the machining liquid (pure water, etc.), and the like are stored in the storage unit 44.

In addition, if the processing device 2 is a laser processing device, the condition items 48b included in the processing conditions 48 include laser beam irradiation conditions (wavelength, power, spot diameter, repetition frequency, position of focal point, etc.), processing The feeding speed, direction, etc. are stored in the storage unit 44.

In addition, the structure, method, etc. according to the above embodiments can be modified and implemented as appropriate without departing from the scope of the objective of the present invention.

11 Workpiece 11a Front surface 11b Back surface 13 Tape 2 Processing device 4 Base 4a Opening 6 Support structure 8 X-axis moving mechanism 8a X-axis moving table 10 Dust-proof and drip-proof cover 12 Holding table 12a Holding surface 14 Z-axis moving mechanism 16 Guide rail 18 Moving plate 20 Ball screw 22 Pulse motor 24 Support 26 Processing unit (processing means)
28 Housing 30 Spindle 32 Wheel mount 34 Grinding wheel 40 Control section (control unit, control means)
42 Processing unit (processing means)
44 Storage unit (storage means)
46 Processing condition storage section 48 Processing conditions (recipe)
48a Processing condition name 48b Condition item (condition element)
50 Old setting value storage section 60 Input section (input means)
70 Display section (display means)

Claims (4)

a holding table that holds the workpiece;
a processing unit that processes the workpiece held by the holding table;
a control unit having a storage unit that stores a plurality of processing conditions each including a plurality of condition items;
An input section connected to the control section, a processing condition changing method for changing processing conditions of a processing device, the method comprising:
an input step of inputting into the input section a predetermined condition item whose setting value is to be changed among the plurality of condition items included in the processing condition, and a changed setting value of the predetermined condition item;
The setting values of the predetermined condition items included in all of the processing conditions that are subject to change among the plurality of processing conditions stored in the storage unit are collectively added to the changed setting values. A method for changing machining conditions, comprising: a setting value changing step. Before the setting value changing step, storing the setting values of the predetermined condition items included in each of the plurality of processing conditions stored in the storage unit as old setting values in the storage unit. 2. The method of changing processing conditions according to claim 1, further comprising the step of: In the input step, machining condition designation information specifying a predetermined machining condition among the plurality of machining conditions is further input into the input section,
Changing processing conditions according to claim 1 or 2, characterized in that in the setting value changing step, setting values of the predetermined condition items included in the predetermined processing conditions specified by the processing condition specification information are changed. Method. a holding table that holds the workpiece;
a processing unit that processes the workpiece held by the holding table;
a control unit having a storage unit that stores a plurality of processing conditions each including a plurality of condition items;
an input section connected to the control section;
The input unit inputs into the control unit a predetermined condition item whose setting value is to be changed among the plurality of condition items included in the processing condition, and a changed setting value of the predetermined condition item. death,
The control unit converts the setting values of the predetermined condition items included in all of the processing conditions that are subject to change among the plurality of processing conditions stored in the storage unit into the changed settings. A processing device that is characterized by changing values all at once.

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