JP7354709B2 - Heat exchanger - Google Patents

Description

The present invention relates to a heat exchanger for controlling the temperature of a temperature-controlled object.

A conventional heat exchanger generally has a basic configuration as shown in FIG. Here, FIG. 15 is a diagram showing an example of a conventional heat exchanger, in which (a) is a schematic plan view and (b) is a schematic cross-sectional view taken along the line CC in (a).

That is, as shown in FIG. 15, the conventional heat exchanger 101 includes a flow path structure 102 through which a fluid as a heat medium flows from an inlet to an outlet, and has a flow path structure 102 in which a fluid as a heat medium flows in contact with the surface of a temperature-controlled object 104. will be placed in Channel structure 102 generally has a tubular configuration.

For example, in the example shown in FIG. 15, when cooling the temperature-controlled object 104, the fluid flowing through the channel structure 102 that constitutes the heat exchanger 101 becomes a refrigerant. Conversely, when heating the temperature-controlled object 104, the fluid flowing through the channel structure 102 that constitutes the heat exchanger 101 becomes a heat medium.

On the other hand, a structure whose thermal conductivity changes depending on the load has been proposed (Non-Patent Document 1). This structure is a structure in which multiple metal plates are laminated with an air layer in between.In order to maintain the distance between the metal plates, the sides of the opposing metal plates are shaped like a U-shape in cross section. It is held in place by resin parts.

This structure has low thermal conductivity when no load is applied because the metal plates are separated by air spaces, but when a load is applied, the metal plates come into contact and conduct heat. rate increases. For example, the thermal conductivity of a configuration in which eight copper plates with a thickness of 1 mm are separated by an air layer of 0.25 mm ranges from 0.001 W/(m・K) to 100 W/(m・K) depending on the presence or absence of a load. It changes by about 100,000 times.

However, although the thermal conductivity of the above structure changes depending on the load, it does not change depending on the temperature.

Phoenix et al. "Adaptive Thermal Conductivity Metamaterials: Enabling Active and Passive Thermal Control" Journal of Thermal Science and Engineering Applications, October 2018, Vol.10, 051020-1

In the conventional heat exchanger shown in FIG. 15, the temperature of the temperature-controlled object 104 is difficult to become uniform. The reason for this will be explained using FIG. 16.

Here, FIG. 16 is a diagram showing the function and effect of the conventional heat exchanger 101, in which (a) is a diagram illustrating the case where the temperature-controlled object 104 is cooled, and (b) is a diagram illustrating the case where the temperature-controlled object 104 is heated. It is a figure explaining the case where it does.

Note that FIG. 16 is a diagram for conceptually explaining the relationship between temperatures in a conventional heat exchanger, and the temperature gradients of the temperature-controlled object, refrigerant, and heat medium are not strict.

For example, to explain the case of cooling the temperature-controlled object 104, as shown in FIG. The heat transfer from 104 to the refrigerant in the flow path structure 102 also becomes large, and as a result, the temperature (T103) of the temperature-adjusted object 104 on the inlet side becomes low.

However, as it progresses from the inlet side to the outlet side, heat due to heat transfer from the temperature-controlled object 104 accumulates in the refrigerant in the flow path structure 102, so that the refrigerant in the flow path structure 102 on the outlet side The temperature (T102) is higher than the temperature on the inlet side (T101).

When the temperature of the refrigerant is thus high, the temperature-adjusted object 104 is not cooled much either, and as a result, the temperature (T104) of the temperature-adjusted object 104 on the outlet side becomes high.

Therefore, the temperature of the temperature-controlled object 104 is low on the inlet side and high on the outlet side, and is not uniform. That is, there is a temperature difference (ΔT=T104-T103) between the inlet side and the outlet side.

Similarly, to explain the case of heating the temperature controlled object 104, as shown in FIG. The heat transfer from the heating medium in the structure 102 to the temperature-adjusted object 104 also becomes large, and as a result, the temperature (T113) of the temperature-adjusted object 104 on the inlet side becomes high.

However, as the process progresses from the inlet side to the outlet side, heat due to heat transfer to the temperature-controlled object 104 is cumulatively released from the heat medium in the channel structure 102, so that the heat in the channel structure 102 on the outlet side The temperature of the medium (T112) is lower than the temperature on the inlet side (T111).

When the temperature of the heating medium is low as described above, the temperature-adjusted object 104 is not heated much, and as a result, the temperature (T114) of the temperature-adjusted object 104 on the outlet side becomes low.

Therefore, the temperature of the temperature-controlled object 104 is high on the inlet side and low on the outlet side, and is not uniform. That is, there is a temperature difference (ΔT=T113-T114) between the inlet side and the outlet side.

The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide a heat exchanger that can uniformize the temperature of a temperature-controlled object.

A first aspect of the present invention is a heat exchanger for adjusting the temperature of a temperature-controlled object, which has an inlet and an outlet, and has a flow path structure in which a fluid flows from the inlet toward the outlet; a thermal conductivity control body disposed between the temperature control target and controlling heat transfer between the flow path structure and the temperature control target, the thermal conductivity control body comprising at least two Two thermally conductive material plates are stacked with a spacing layer in between, and the two thermally conductive material plates are held so as to be able to change from a separated state to a contact state and from a contact state to a separated state. , a heat exchanger having a configuration in which a bimetal plate is disposed above the top or below the bottom of the thermally conductive material plates in the stacking direction so as to face the thermally conductive material plates. .

A second invention is the heat exchanger according to the first invention, in which the bimetal plate of the thermal conductivity control body is the topmost thermally conductive material plate in the stacking direction, or the bimetal plate in the stacking direction. The heat exchanger is held so as to be able to change from a separated state to a contact state and from a contact state to a separated state with respect to the lowermost thermally conductive material plate.

A third invention is the heat exchanger according to the first or second invention, wherein the thermally conductive material plate of the thermal conductivity control body has a lower thermal conductivity than the thermally conductive material plate. This is a heat exchanger that is held by a holding part made of a material so that it can change from a separated state to a contact state and from a contact state to a separated state.

A fourth invention is the heat exchanger according to any one of the first to third inventions, in which the bimetal plate of the thermal conductivity control body is located on the side of the opposing thermally conductive material plate, The heat exchanger has a metal material layer with a large coefficient of thermal expansion, and a metal material layer with a small coefficient of thermal expansion on the opposite side to the side of the thermally conductive material plate.

A fifth invention is the heat exchanger according to the fourth invention, wherein the bimetal plate is disposed above the top of the thermally conductive material plates in the stacking direction, and the bimetal plate The heat exchanger is spaced apart from the topmost thermally conductive material plate in the stacking direction, and comes into contact with the topmost thermally conductive material plate in the stacking direction when the temperature of the bimetal plate increases.

A sixth invention is the heat exchanger according to the fourth invention, wherein the bimetal plate is disposed above the top of the thermally conductive material plates in the stacking direction, and the bimetal plate The heat exchanger is in contact with the topmost thermally conductive material plate in the stacking direction, and is separated from the topmost thermally conductive material plate in the stacking direction as the temperature of the bimetallic plate decreases.

A seventh invention is the heat exchanger according to any one of the first to third inventions, wherein the bimetal plate of the thermal conductivity control body is on the side of the opposing thermally conductive material plate, The heat exchanger has a metal material layer with a small coefficient of thermal expansion, and a metal material layer with a large coefficient of thermal expansion on the side opposite to the side of the thermally conductive material plate.

An eighth invention is the heat exchanger according to the seventh invention, wherein the bimetal plate is disposed above the top of the thermally conductive material plates in the stacking direction, and the bimetal plate The heat exchanger is spaced apart from the topmost thermally conductive material plate in the stacking direction, and comes into contact with the topmost thermally conductive material plate in the stacking direction as the temperature of the bimetallic plate decreases.

A ninth invention is the heat exchanger according to the seventh invention, wherein the bimetal plate is disposed above the top of the thermally conductive material plates in the stacking direction, and the bimetal plate The heat exchanger is in contact with the topmost thermally conductive material plate in the stacking direction, and is separated from the topmost thermally conductive material plate in the stacking direction as the temperature of the bimetallic plate increases.

A tenth invention is the heat exchanger according to any one of the first to ninth inventions, wherein a plurality of the thermal conductivity control bodies are arranged with respect to the flow path structure. It is.

According to the present invention, the temperature of the temperature-controlled object can be made uniform.

A diagram showing an example of a first embodiment of a heat exchanger according to the present invention A diagram showing an example of another planar form of the first embodiment of the heat exchanger according to the present invention A diagram showing an example of another cross-sectional form of the first embodiment of the heat exchanger according to the present invention A perspective view showing an example of a thermal conductivity control body included in the heat exchanger shown in FIG. 1 Front view of the thermal conductivity control body shown in Figure 4 A front view showing another example of the thermal conductivity control body included in the heat exchanger shown in FIG. 1 Diagram showing the action of the thermal conductivity control body shown in FIG. Diagram showing the relationship between temperature and thermal conductivity in the thermal conductivity control body shown in Figure 5 Diagram showing the effects of the heat exchanger shown in Figure 1 A diagram showing an example of a second embodiment of the heat exchanger according to the present invention A diagram showing an example of a thermal conductivity control body included in the heat exchanger shown in FIG. 10 Diagram showing the action of the thermal conductivity control body shown in FIG. 11 Diagram showing the relationship between temperature and thermal conductivity in the thermal conductivity control body shown in FIG. 11 Diagram showing the effects of the heat exchanger shown in FIG. Diagram showing an example of a conventional heat exchanger Diagram showing the effects of conventional heat exchangers

Embodiments of the present invention will be described below with reference to the drawings. In addition, in the drawings, for convenience of illustration and ease of understanding, the scale, vertical and horizontal dimension ratios, etc. are appropriately changed and exaggerated from those of the actual objects.

In addition, terms used in this specification to specify shapes, geometrical conditions, physical properties, and their degrees, such as terms such as "flat" and "same", lengths, angles, and values of physical properties, etc. shall be interpreted to include the extent to which similar functions can be expected, without being bound by a strict meaning. Furthermore, in the drawings, for clarity, the shapes of multiple parts that can be expected to have similar functions are shown in a regular manner, but without being bound by a strict meaning, it is possible to expect the functions The shapes of the portions may be different from each other as long as the shapes can be different from each other. In addition, in the drawings, boundaries indicating bonding surfaces between members are shown as simple straight lines for convenience, but they are not restricted to exact straight lines and can be used to achieve the desired bonding performance. The shape of the boundary line is arbitrary within the range possible.

In this specification, the term "separated state" refers to a state in which two plates facing each other in the stacking direction are not in contact with each other and are physically separated.

Moreover, "separating" refers to changing two plates facing each other in the stacking direction from a state in which they were in contact with each other to a state in which they are physically separated.
<First embodiment>
First, a first embodiment of a heat exchanger according to the present invention will be described using FIGS. 1 to 9.

The heat exchanger of the first embodiment is a type of heat exchanger that functions to cool the temperature-controlled object.
(Heat exchanger 1)
FIG. 1 is a diagram showing an example of a heat exchanger according to the present embodiment, in which (a) is a schematic plan view, and (b) is a schematic cross-sectional view taken along line AA in (a).

As shown in FIG. 1, the heat exchanger 1 includes a flow path structure 2 and a thermal conductivity control body 3.

The flow path structure 2 has an inlet and an outlet, and has a structure in which fluid as a heat medium flows from the inlet to the outlet. In this embodiment, the fluid flowing through the channel structure 2 is a refrigerant.

The flow path structure 2 is made of a thermally conductive material (metal, etc.) and usually has a tubular shape, but its cross section is not limited to a circle, but may be oval, rectangular, various polygons, or their corners. can be in a rounded form.

The thermal conductivity control body 3 is disposed between the channel structure 2 and the temperature-controlled object 4A, and controls heat transfer between the channel structure 2 and the temperature-controlled object 4A.

The thermal conductivity control body 3 may have the same length as the channel structure 2, but in reality, the channel structure 2 extends along the direction in which the channel structure 2 extends, as shown in FIG. A plurality of thermal conductivity control bodies 3 are arranged with respect to the structure 2 .

The plurality of thermal conductivity control bodies 3 may be arranged with gaps as shown in FIG. 1, or may be arranged without gaps. The configuration and effects of the thermal conductivity control body 3 will be explained in detail later using FIGS. 4 to 8.

The temperature-adjusted object 4A is an object whose temperature is adjusted to a desired temperature by the heat exchanger 1. In this embodiment, the temperature-controlled object 4A is an object that is cooled by the heat exchanger 1. Its shape is not limited to the long plate shape illustrated in FIG. 1, but may be various shapes such as a flat plate shape, a cylindrical shape, and a rectangular parallelepiped shape.

In addition, in FIG. 1, for ease of understanding, the temperature control object 4A has a long plate shape, and the flow path structure 2 has a simple configuration extending in one direction (X direction in the figure) in plan view. Although the heat exchanger 1 of this embodiment is illustrated, the heat exchanger of this embodiment is not limited to this.

For example, as shown in FIG. 2, the surface area of the temperature-controlled object 4A is larger, and the flow path structure 2 is arranged in a meandering manner on the surface of the temperature-controlled object 4A when viewed from above. Good too.

Although not shown, the temperature control object 4A may have a substantially cylindrical shape, and the flow path structure 2 may be arranged in a spiral shape along the surface of the temperature control object 4A.

Further, FIG. 1 illustrates a heat exchanger 1 having a thermal conductivity control body 3 only on one side (lower side in FIG. 1) of a channel structure 2 having a rectangular cross section when viewed in cross section. However, the heat exchanger of this embodiment is not limited to this.

For example, as shown in FIG. 3(a), the heat exchanger 1 has a flow path structure 2 having a rectangular cross section. The conductivity controller 3 may be provided to cool the two temperature-adjusted objects 4A on the two sides of the channel structure 2.

Further, as shown in FIG. 3(b), the heat exchanger 1 includes a thermal conductivity control body 3 around the flow path structure 2 in a cross-sectional view. The heat exchanger 1 provided with the heat exchanger 3 may be arranged so as to penetrate through the temperature-adjusted object 4A.
(Thermal conductivity control body 3)
4 is a perspective view showing an example of the thermal conductivity control body 3 included in the heat exchanger 1 shown in FIG. 1, and FIG. 5 is a front view of the thermal conductivity control body 3 shown in FIG. 4. Further, FIG. 6 is a front view showing another example of the thermal conductivity control body 3 included in the heat exchanger 1 shown in FIG. 1.

As shown in FIGS. 4 and 5, in the thermal conductivity control body 3 included in the heat exchanger 1 according to the present embodiment, three thermally conductive material plates 11 are arranged in a stacked manner with a spacing layer 12 in between. A bimetallic plate 14 is arranged above the top of the thermally conductive material plate 11 in the stacking direction (Z direction in FIGS. 4 and 5) so as to face the thermally conductive material plate 11.

The bimetal plate 14 is made by pasting together two metal material layers with different coefficients of thermal expansion, but in the thermal conductivity control body 3 shown in FIGS. It has a metal material layer 14H with a large coefficient of thermal expansion on the side thereof, and has a metal material layer 14L with a small coefficient of thermal expansion on the side opposite to the side of the thermally conductive material plate 11.

Further, in the thermal conductivity control body 3 shown in FIGS. 4 and 5, the three thermally conductive material plates 11 and the bimetal plate 14 are held by the holding part 13.

The holding portion 13 is made of a material having a lower thermal conductivity than the thermally conductive material plate 11, and the three thermally conductive material plates 11 and the bimetallic plate 14 are each kept from the separated state by the holding portion 13. The contact state and the separation state from the contact state are maintained.

Here, in the thermal conductivity control body 3 shown in FIGS. 4 and 5, three thermally conductive material plates 11 are arranged in a laminated manner with a spacing layer 12 in between, mainly to avoid complexity. However, in the present invention, the number of thermally conductive material plates 11 may be at least two, and may be four or more. In either case, the plurality of thermally conductive material plates 11 are arranged in a stacked manner with spaced layers 12 interposed therebetween.

Note that normally, the larger the number of thermally conductive material plates 11 stacked with the spacer layer 12 in between, the greater the amount of change in thermal conductivity of the thermal conductivity control body 3 (i.e., the maximum value of the thermal conductivity that changes). and the minimum value) can be increased. However, if the number of thermally conductive material plates 11 is large, and the thickness of the thermally conductive material plates 11 is the same, the thickness of the thermal conductivity control body 3 will also be large. Moreover, the structure may also become complicated.

Therefore, the number of thermally conductive material plates 11 arranged in a stacked manner with the spacing layer 12 in between is appropriately selected depending on the application and the like. Although it depends on the application, a preferable number of thermally conductive material plates 11 is 6 to 10.

For example, if eight copper plates with a thickness of 1 mm are used as the thermally conductive material plates 11 and an air layer with a thickness of 0.25 mm is used as the separation layer 12, the thermal conductivity of the thermal conductivity control body 3 is increased by 100,000 times. It is possible to vary the degree.

Further, in the thermal conductivity control body 3 shown in FIGS. 4 and 5, the holding portion 13 has a U-shaped cross section that holds the thermally conductive material plate 11 and the bimetal plate 14 on their respective sides. Although the holding part is illustrated, the present invention is not limited to this.

For example, like the holding part 13a of the thermal conductivity control body 3a shown in FIG. It may also be held in the form of a spacer (a so-called spacer form).

In such a form, the thickness of the spacing layer 12 (that is, the spacing distance) is the same as the thickness of the holding part 13a, so the spacing distance between the bimetal plate 14 and the thermally conductive material plate 11, and the thickness of the stacked layer There is an advantage that the distance between the thermally conductive material plates 11 can be easily controlled.

Further, like the holding part 13b of the thermal conductivity control body 3b shown in FIG. 6(b), it has a wall-like form, and the thermally conductive material plate 11 and The respective ends of the thermally conductive material plate 11 and the bimetal plate 14 may be held by fitting the corresponding outer edges of the bimetal plate 14 into each other.

In the case of this form as well, since the holding part 13b has a so-called spacer-shaped part, it has the advantage that the thickness (separation distance) of the spacing layer 12 can be easily controlled, similar to the above-mentioned holding part 13a. There is.

Furthermore, since the holding portion 13b holds the thermally conductive material plate 11 and the bimetallic plate 14 from the top to the bottom in the stacking direction in one wall-like form, the thermal conductivity control body 3b as a whole is , a more robust configuration can be achieved.

In addition, in the thermal conductivity control body 3 shown in FIGS. 4 and 5, the bimetal plate 14 is arranged on the upper side (Z direction in FIGS. 4 and 5), but in the present invention, the bimetal plate 14 may be arranged on the lower side (in the direction opposite to the Z direction in FIGS. 4 and 5).

In this case, the bimetal plate 14 is arranged below the lowest part of the thermally conductive material plate 11 in the stacking direction.

In this case as well, the bimetal plate 14 has a metal material layer 14H with a large coefficient of thermal expansion on the side of the thermally conductive material plate 11, and a layer 14H of a metal material with a large coefficient of thermal expansion on the side opposite to the side of the thermally conductive material plate 11. It has a metal material layer 14L with a small coefficient.

That is, in the form in which the bimetal plate 14 is disposed on the lower side (in the direction opposite to the Z direction in FIGS. 4 and 5), the thermal conductivity control body 3 shown in FIGS. 4 and 5 maintains its configuration, It is inverted vertically.

Each component of the thermal conductivity control body 3 will be explained below.
(Thermal conductive material plate 11)
The thermally conductive material plate 11 is a plate-shaped substance made of a thermally conductive material. In the present invention, it is usually preferable that the thermal conductivity of the thermally conductive material plate 11 is high.

Although it depends on the application, the thermal conductivity of the thermally conductive material plate 11 is preferably 80 W/(m・K) or more, and 200 W/(m・K) or more at around 20° C., for example. More preferably, it is 400 W/(m·K) or more.

Further, in the present invention, the thermally conductive material plate 11 is elastically deformable, and is deformed by the pressure from the bimetal plate 14 and comes into contact with the opposing thermally conductive material plate 11. When released from the pressure, it restores to its original shape and becomes separated from the opposing thermally conductive material plate 11.

The stacked thermally conductive material plates 11 can exhibit a heat insulating effect when they are separated, and can exhibit a heat transfer effect when they are in contact.

In the present invention, a metal plate can be suitably used as the thermally conductive material plate 11.
Examples of metal plates include those made of copper (Cu), aluminum (Al), gold (Au), silver (Ag), nickel (Ni), iron (Fe), and alloys containing these. be able to.

For example, at around 20° C., the thermal conductivity of copper (Cu) is 403 W/(m·K).
Further, the thermal conductivity of aluminum (Al) is 236 W/(m·K).

Similarly, the thermal conductivity of gold (Au) is 319 W/(m・K), the thermal conductivity of silver (Ag) is 428 W/(m・K), and the thermal conductivity of nickel (Ni) is 94 W/(m・K).・K), the thermal conductivity of iron (Fe) is 84 W/(m・K).

Further, as for the thickness of the metal plate, the smaller the thickness, the higher the heat transfer effect in the contact state. Note that the larger the thickness of the metal plate, the stronger the force required to transform it into a contact state. Further, as the thickness increases, the overall thickness of the thermal conductivity control body 3 may also increase. In the present invention, the preferred thickness is, for example, 0.5 mm or more and 2 mm or less, and more preferably 0.8 mm or more and 1.2 mm or less, although it depends on the application.
(Separation layer 12)
The spacing layer 12 is a layer interposed between the thermally conductive material plates 11 facing each other in the separated state. Furthermore, in the thermal conductivity control body 3, the spacing layer 12 is also interposed between the bimetal plate 14 and the opposing thermally conductive material plate 11.

The spacing layer 12 does not inhibit the deformation of the bimetal plate 14 or the thermally conductive material plate 11 when the bimetal plate 14 deforms, and as the bimetal plate 14 deforms, the bimetal plate 14 and the thermally conductive material plate 11, The opposing thermally conductive material plates 11 can change from a separated state to a contact state, and from a contact state to a separated state.

A substance may be present in the spacing layer 12, or a vacuum state in which no substance is present may be provided. If a substance is present, the substance is made of a material having a lower thermal conductivity than the thermally conductive material plate 11. Although it depends on the application, it is preferable that the thermal conductivity of the spacing layer 12 is, for example, 1/1000 or less of that of the thermally conductive material plate 11.

In the present invention, the substance normally present in the spacing layer 12 is air. For example, at around 20° C., the thermal conductivity of air is 0.024 W/(m·K).

The spacing layer 12 separates the thermally conductive material plates 11 and the bimetallic plate 14 and the thermally conductive material plates 11 facing each other in the separated state, but the distance (separation distance) may be the same. , may be different. Further, for example, in the thermally conductive material plates 11 facing each other, the distance (separation distance) may be different between the inner side and the outer edge side of the facing surfaces.

The thickness of the spacing layer 12 (i.e., the spacing distance) changes depending on the deformation of the bimetal plate 14, such that the bimetal plate 14 and the thermally conductive material plate 11, or the thermally conductive material plates 11 facing each other, change from a separated state to a contact state, and The size is such that it can be changed from a contact state to a separated state, and is determined so that the heat insulation properties of the thermal conductivity control body 3 in the separated state and the heat conductivity of the heat conductivity control body 3 in the contact state satisfy the purpose.

The thickness of the spacing layer 12 (that is, the spacing distance) depends on the material and thickness of the thermally conductive material plates 11 to be stacked, but for example, it can be in the range of 0.1 mm or more and 0.5 mm or less. .
(Holding part 13)
The holding part 13 (the above-mentioned holding parts 13a and 13b are the same) holds the thermally conductive material plates 11 facing each other so that they can be changed from a separated state to a contact state and from a contact state to a separated state. .

In the thermal conductivity control body 3, the holding part 13 also holds the bimetal plate 14, and changes the bimetal plate 14 and the opposing thermally conductive material plate 11 from a separated state to a contact state and from a contact state to a separated state. Keep it possible.

The holding portion 13 is made of a material having a lower thermal conductivity than the thermally conductive material plate 11, and is elastically deformable. Although it depends on the application, it is preferable that the thermal conductivity of the holding part 13 is, for example, 1/100 or less of that of the thermally conductive material plate 11.

Various resins and rubbers can be used as the material constituting the holding part 13. For example, at around 20° C., the thermal conductivity of epoxy resin is 0.21 W/(m·K).

The holding portion 13 may include a sintered body such as ceramics. For example, by including a sintered body such as ceramics, the thermal conductivity can be reduced.
(Bimetal plate 14)
The bimetal plate 14 is made by bonding two types of metal material layers with different coefficients of thermal expansion. Therefore, like the thermally conductive material plate 11, the bimetal plate 14 also has thermal conductivity.

In the thermal conductivity control body 3, the bimetal plate 14 deforms and presses the stacked thermally conductive material plates 11, thereby changing the mutually opposing thermally conductive material plates 11 from a separated state to a contact state.

In the present invention, as the bimetal plate 14, any commercially available plate can be used without particular limitation as long as it has the above-mentioned effects. You can select the board as appropriate.

As the bimetal plate 14, for example, two types of metal plates with different coefficients of thermal expansion are made by adding manganese (Mn), chromium (Cr), copper (Cu), etc. to an alloy of iron (Fe) and nickel (Ni). An example is one made by manufacturing and pasting them together by rolling. An alloy (referred to as Invar) of 36 wt% nickel (Ni) and 64 wt% iron (Fe) may be used as the metal material layer having a small coefficient of thermal expansion.
<Operations and effects of the first embodiment>
Next, the effects of the thermal conductivity control body 3 will be explained using FIGS. 7 and 8, and the effects of the heat exchanger 1 will be explained using FIG.

Here, the thermal conductivity control body 3 shown in FIG. 7(a) is the same as the thermal conductivity control body 3 shown in FIG. 5. The three thermally conductive material plates 11 and the bimetallic plates 14 are each in a separated state.

In addition, in the thermal conductivity control body 3 shown in FIG. 7(a), in order to facilitate the subsequent explanation, the symbols indicating the three thermally conductive material plates 11 are indicated from the top to the bottom. , numerals 11A to 11C are also given. Strictly speaking, the holding part 13 also deforms as the thermal conductivity control body 3 deforms from FIG. 7(a) to FIG. 7(b), but in order to avoid complication, the holding part 1 Description and illustration of the modification are omitted.

The bimetal plate 14 included in the thermal conductivity control body 3 shown in FIG. A metal material layer 14L having a small coefficient of thermal expansion is provided on the opposite side to the conductive material plate 11 (11A).

Therefore, when the temperature of the bimetal plate 14 rises, the metal material layer 14H having a large coefficient of thermal expansion expands more than the metal material layer 14L having a small coefficient of thermal expansion, and the bimetal plate 14 expands as shown in FIG. 7(b). It is deformed into a convex shape downwardly (on the opposite side in the Z direction in the figure) and comes into contact with the uppermost thermally conductive material plate 11 (11A).

The uppermost thermally conductive material plate 11 (11A) is also pressed by the deformation of the bimetallic plate 14 and deforms into a downwardly convex shape, and the thermally conductive material plate 11 (11A) located second from the uppermost It comes into contact with the plate 11 (11B).

Furthermore, the thermally conductive material plate 11 (11B) located second from the top is also pressed and deformed into a convex shape downward, and the thermally conductive material plate 11 (11C) located at the bottom Contact.

In this way, the bimetal plate 14 of the thermal conductivity control body 3 and all the thermally conductive material plates 11 come into contact as shown in FIG. 7(b). Therefore, the thermal conductivity control body 3 shown in FIG. 7(b) has a higher thermal conductivity than the thermal conductivity control body 3 shown in FIG. 7(a).

On the other hand, when the temperature of the bimetal plate 14 decreases from the temperature in the state shown in FIG. 7(b) to the temperature in the state shown in FIG. The bimetal plate 14 contracts more than the metal material layer 14L, returns to its original flat state as shown in FIG. 7(a), and is separated from the uppermost thermally conductive material plate 11 (11A).

Then, the uppermost thermally conductive material plate 11 (11A) is no longer pressed due to the separation of the bimetal plate 14, and restores to its original flat state, and the thermally conductive material plate 11 located second from the uppermost Separate from (11B).

Similarly, the second thermally conductive material plate 11 (11B) from the top is also restored to its original flat state and separated from the thermally conductive material plate 11 (11C) at the bottom.

In this way, the bimetal plate 14 of the thermal conductivity control body 3 and all the thermally conductive material plates 11 are separated from each other as shown in FIG. 7(a). Therefore, the thermal conductivity control body 3 shown in FIG. 7(a) has a smaller thermal conductivity than the thermal conductivity control body 3 shown in FIG. 7(b).

In the above description, three thermally conductive material plates 11 are laminated as the thermal conductivity control body 3 with the spacing layer 12 in between, but in the present invention, the thermal conductivity control body 3 The number of material plates 11 may be at least two, and may be four or more.

Even when the number of thermally conductive material plates 11 is other than three, by bringing the respective thermally conductive material plates 11 into contact with each other, the thermal conductivity of the thermal conductivity control body 3 including the plurality of thermally conductive material plates 11 can be improved. rate can be increased.

Conversely, by separating the thermally conductive material plates 11 that are in contact, the thermal conductivity of the thermal conductivity control body 3 including the plurality of thermally conductive material plates 11 can be reduced.

In this way, in the thermal conductivity control body 3, the thermal conductivity can be changed depending on the temperature. That is, the thermal conductivity control body 3 can change from an adiabatic state to a heat transfer state, or from a heat transfer state to an adiabatic state, depending on the temperature.

FIG. 8 is a diagram showing the relationship between temperature and thermal conductivity in the thermal conductivity control body 3.

For example, as shown in FIG. 8, in the thermal conductivity control body 3, at a temperature lower than the target temperature (Ta), the plurality of thermally conductive material plates 11 of the thermal conductivity control body 3 are in a separated state. The thermal conductivity of the thermal conductivity control body 3 is the minimum value Ka, but at a temperature higher than the target temperature (Ta), the plurality of thermally conductive material plates 11 of the thermal conductivity control body 3 are A contact state is established, and the thermal conductivity of the thermal conductivity control body 3 becomes a large value depending on the degree of the contact state.

For ease of explanation, FIG. 8 shows an ideal state where the temperature at which the thermal conductivity control body 3 changes from the adiabatic state to the heat transfer state or from the heat transfer state to the adiabatic state is one point (Ta). This is what is shown. In reality, the temperature at which the thermal conductivity control body 3 changes from an adiabatic state to a heat transfer state or from a heat transfer state to an adiabatic state has a range.

As described above, in the thermal conductivity control body 3, the thermal conductivity can be changed depending on the temperature.

Therefore, according to the heat exchanger 1 equipped with the thermal conductivity control body 3, heat transfer between substances separated by the thermal conductivity control body 3 is controlled according to the temperature without requiring electrical control. can do. Furthermore, by controlling heat transfer between the substances separated by the thermal conductivity control body 3, the temperature of one substance can be maintained at a constant temperature without requiring a separate energy supply.

Next, the effects of the heat exchanger 1 will be explained using FIG. 9. Here, FIG. 9(a) is the same diagram as FIG. 16(a) described above, and is a diagram showing the effects of the conventional heat exchanger 101. FIG. 9(b) is a diagram showing the effects of the heat exchanger 1 shown in FIG. 1.

Note that FIG. 9 is a diagram for conceptually explaining the difference in function and effect between the conventional heat exchanger 101 and the heat exchanger 1 of this embodiment, particularly the difference in temperature difference between the inlet side and the outlet side. The temperature gradients of the temperature-controlled object and the refrigerant are not exact.

As shown in FIG. 9(a), in the conventional heat exchanger 101 (see FIG. 15), the temperature (T101) of the refrigerant in the flow path structure 102 is low on the inlet side, and therefore the temperature of the temperature controlled object 104 is low. The heat transfer from the refrigerant to the refrigerant in the flow path structure 102 also becomes large, and as a result, the temperature (T103) of the temperature-adjusted object 104 on the inlet side becomes low.

However, as it progresses from the inlet side to the outlet side, heat due to heat transfer from the temperature-controlled object 104 accumulates in the refrigerant in the flow path structure 102, so that the refrigerant in the flow path structure 102 on the outlet side The temperature (T102) is higher than the temperature on the inlet side (T101).

When the temperature of the refrigerant is thus high, the temperature-adjusted object 104 is not cooled much either, and as a result, the temperature (T104) of the temperature-adjusted object 104 on the outlet side becomes high.

Therefore, the temperature of the temperature-controlled object 104 is low on the inlet side and high on the outlet side, and is not uniform. That is, there is a temperature difference (ΔT=T104-T103) between the inlet side and the outlet side.

On the other hand, as shown in FIG. 9(b), in the heat exchanger 1 of this embodiment (see FIG. 1), first, on the inlet side, the refrigerant (temperature T1) in the flow path structure 2 is used to control the temperature of the object 4A. is cooled and its temperature becomes low, but when it reaches the target temperature (temperature Ta shown in FIG. 8), the thermal conductivity control body 3 changes from the heat transfer state to the adiabatic state, and from then on, the temperature controlled object 4A Heat transfer from the coolant to the refrigerant in the flow path structure 2 also stops. Therefore, the temperature rise of the refrigerant within the flow path structure 2 is also suppressed.

For the above reason, the temperature (T3) of the temperature-adjusted object 4A on the inlet side can theoretically be the same as the target temperature (temperature Ta shown in FIG. 8).

In the heat exchanger 1, as shown in FIG. 1, a thermal conductivity control body 3 is arranged between the flow path structure 2 and the temperature-controlled object 4A from the inlet side to the outlet side. Therefore, the effect of the thermal conductivity control body 3 as described above is exerted from the inlet side to the outlet side.

Therefore, even if it advances from the inlet side to the outlet side, the temperature of the refrigerant in the flow path structure 2 does not rise like in the conventional heat exchanger 101, and the temperature (T2) on the outlet side is suppressed to a low temperature. .

When the temperature of the refrigerant is low in this way, that is, when the temperature difference between the refrigerant temperature on the outlet side (T2) and the refrigerant temperature on the inlet side (T1) is small, the temperature-adjusted object 4A is is cooled to the same extent as the inlet side, and the temperature (T4) of the temperature-controlled object 4A on the outlet side also becomes low.

In other words, the temperature difference (ΔT=T4-T3) between the inlet and outlet sides of the temperature-controlled object 4A is small, and therefore the temperature of the temperature-controlled object 4A remains the same from the inlet side to the outlet side. It will be like that.

Here, similarly to the inlet side, when the target temperature (temperature Ta shown in FIG. 8) is reached on the outlet side, the thermal conductivity control body 3 changes from the heat transfer state to the adiabatic state. Heat transfer from 4A to the refrigerant in the channel structure 2 also stops.

Therefore, in the heat exchanger 1 of this embodiment, the temperature (T4) of the temperature-controlled object 4A on the outlet side can also be set to the target temperature (temperature Ta shown in FIG. 8) in theory.

That is, in the heat exchanger 1 of this embodiment, the temperature of the temperature-controlled object 4A is not only made uniform from the inlet side to the outlet side, but also the temperature is adjusted to the target temperature (as shown in FIG. 8). temperature Ta).

However, in reality, the temperature at which the thermal conductivity control body 3 changes from an adiabatic state to a heat transfer state or from a heat transfer state to an adiabatic state has a range, and therefore, the temperature control object 4A is also on the inlet side. There will be a temperature difference (ΔT=T4-T3) on the exit side.

However, as described above, the temperature difference (ΔT=T4-T3) can be much smaller than the temperature difference (ΔT=T104-T103) in the conventional heat exchanger 101.
<Modification of the first embodiment>
In the heat exchanger 1 described above, an example was shown in which a plurality of thermal conductivity control bodies 3 having the same configuration are arranged from the inlet side to the outlet side of the flow path structure 2, but the present invention is limited to this. It may be any material that can make the temperature of the temperature-adjusted object 4A uniform. For example, the plurality of thermal conductivity control bodies 3 may be different from each other.

For example, each bimetal plate 14 of the plurality of thermal conductivity control bodies 3 may be made of different materials. Further, the sizes (areas) may be different.

Further, each of the thermally conductive material plates 11 of the plurality of thermal conductivity control bodies 3 may be made of different materials. The number of sheets may also be different. The thickness may also be different.

Moreover, the thickness (that is, the separation distance) of each spacing layer 12 of the plurality of thermal conductivity control bodies 3 may also be different.
<Second embodiment>
Next, a second embodiment of the heat exchanger according to the present invention will be described using FIGS. 10 to 14. Note that descriptions of contents that overlap with those of the first embodiment described above will be omitted as appropriate.

The heat exchanger of this second embodiment is a type of heat exchanger that functions to heat the temperature-controlled object.
(Heat exchanger 21)
FIG. 10 is a diagram showing an example of the heat exchanger of this embodiment, in which (a) is a schematic plan view, and (b) is a schematic cross-sectional view taken along the line BB in (a). As shown in FIG. 10, the heat exchanger 21 includes a flow path structure 22 and a thermal conductivity control body 23.

The flow path structure 22 has an inlet and an outlet, and a fluid serving as a heat medium flows from the inlet to the outlet. This flow path structure 22 can have a similar form to the flow path structure 2 of the heat exchanger 1 of the first embodiment described above. However, in this embodiment, the fluid flowing through the flow path structure 22 becomes a heat medium.

The thermal conductivity control body 23 is arranged between the flow path structure 22 and the temperature control object 4B, and controls heat transfer between the flow path structure 22 and the temperature control object 4B.

Similar to the thermal conductivity control body 3 of the heat exchanger 1 of the first embodiment described above, the thermal conductivity control body 23 may have the same length as the flow path structure 22; As shown in FIG. 10, a plurality of thermal conductivity control bodies 23 are arranged with respect to the flow path structure 22 along the direction in which the flow path structure 22 extends.

The plurality of thermal conductivity control bodies 23 may be arranged with gaps as shown in FIG. 10, or may be arranged without gaps. The configuration and effects of the thermal conductivity control body 23 will be explained in detail later using FIGS. 11 to 13.

The temperature-adjusted object 4B is an object whose temperature is adjusted to a desired temperature by the heat exchanger 21.
In this embodiment, the temperature-controlled object 4B is an object heated by the heat exchanger 21.
The shape thereof is not limited to the long plate shape illustrated in FIG. 10, but may be various shapes such as a flat plate shape, a cylindrical shape, and a rectangular parallelepiped shape.

In addition, in FIG. 10, for ease of understanding, the temperature control object 4B has a long plate shape, and the flow path structure 22 has a simple configuration extending in one direction (X direction in the figure) in a plan view. Although the heat exchanger 21 of this embodiment is illustrated, the heat exchanger of this embodiment is not limited to this.

For example, similar to the form shown in FIG. 2 in the heat exchanger 1 of the first embodiment described above, the surface area of the temperature control object 4B is larger, and the flow path structure 22 is They may be arranged in a meandering manner on the surface of the adjustment target 4B.

Although not shown, the temperature control object 4B may have a substantially cylindrical shape, and the flow path structure 22 may be arranged in a spiral shape along the surface of the temperature control object 4B.

In addition, FIG. 10 illustrates a heat exchanger 21 having a thermal conductivity control body 23 only on one side (lower side in FIG. 10) of a flow path structure 22 having a rectangular cross section when viewed in cross section. However, the heat exchanger of this embodiment is not limited to this.

For example, similar to the form shown in FIG. 3(a) in the heat exchanger 1 of the first embodiment described above, the heat exchanger 21 has two flow path structures 22 having a rectangular cross section in cross-sectional view. The heat conductivity control body 23 may be provided on the side, and the two temperature-adjusted objects 4B may be cooled on the two sides of the flow path structure 22.

Further, similar to the form shown in FIG. 3(b) in the heat exchanger 1 of the first embodiment described above, the heat exchanger 21 has a thermal conductivity control body 23 around the flow path structure 22 in a cross-sectional view. The heat exchanger 21 provided with the thermal conductivity control body 23 having such a configuration may be arranged so as to penetrate through the temperature-adjusted object 4B.
(Thermal conductivity control body 23)
FIG. 11 is a diagram (front view) showing an example of the thermal conductivity control body 23 included in the heat exchanger 21 shown in FIG. 10. As shown in FIG. 11, in the thermal conductivity control body 23 according to the present embodiment, similarly to the above-described thermal conductivity control body 3, three thermally conductive material plates 11 are connected to each other via the spacing layer 12. A bimetal plate 24 is arranged above the top of the thermally conductive material plate 11 in the stacking direction (Z direction in the figure).

Here, the bimetal plate 24 is also made by laminating two types of metal material layers with different coefficients of thermal expansion, but the bimetal plate 14 of the thermal conductivity control body 3 described above is on the side of the thermal conductive material plate 11. In contrast, in FIG. The bimetal plate 24 of the thermal conductivity control body 23 shown has a metal material layer 24L with a small coefficient of thermal expansion on the side of the thermally conductive material plate 11, and on the side opposite to the side of the thermally conductive material plate 11, The difference is that the metal material layer 24H has a large coefficient of thermal expansion.

The other configurations, ie, the thermally conductive material plate 11, the spacing layer 12, and the holding part 13, can be the same as those of the thermal conductivity control body 3 described above.
<Actions and effects of the second embodiment>
Next, the effects of the thermal conductivity control body 23 will be explained using FIGS. 12 and 13, and the effects of the heat exchanger 21 will be explained using FIG.

Here, the thermal conductivity control body 23 shown in FIG. 12(a) is the same as the thermal conductivity control body 23 shown in FIG. 11. The three thermally conductive material plates 11 and the bimetallic plates 24 are each in a separated state.

In addition, also in the thermal conductivity control body 23 shown in FIG. 12(a), in order to facilitate the subsequent explanation, the symbols indicating the three thermally conductive material plates 11 are indicated from the top to the bottom. , numerals 11A to 11C are also given. Strictly speaking, the holding part 13 also deforms as the thermal conductivity control body 23 deforms from FIG. 12(a) to FIG. Description and illustration of the modification are omitted.

The bimetal plate 24 included in the thermal conductivity control body 23 shown in FIG. A metal material layer 24H having a large coefficient of thermal expansion is provided on the side opposite to the side of the conductive material plate 11 (11A).

Therefore, when the temperature of the bimetal plate 24 decreases, the metal material layer 24H with a large coefficient of thermal expansion contracts more than the metal material layer 24L with a small coefficient of thermal expansion, and the bimetal plate 24 becomes as shown in FIG. 12(b). It is deformed into a convex shape downwardly (on the opposite side in the Z direction in the figure) and comes into contact with the uppermost thermally conductive material plate 11 (11A).

Then, the uppermost thermally conductive material plate 11 (11A) is also pressed by the deformation of the bimetal plate 24 and deforms into a downwardly convex shape, and the thermally conductive material plate 11 (11A) located second from the uppermost It comes into contact with the plate 11 (11B).

Furthermore, the thermally conductive material plate 11 (11B) located second from the top is also pressed and deformed into a convex shape downward, and the thermally conductive material plate 11 (11C) located at the bottom Contact.

In this way, the bimetal plate 24 of the thermal conductivity control body 23 and all the thermally conductive material plates 11 come into contact as shown in FIG. 12(b). Therefore, the thermal conductivity control body 23 shown in FIG. 12(b) has a higher thermal conductivity than the thermal conductivity control body 23 shown in FIG. 12(a).

On the other hand, when the temperature of the bimetal plate 24 rises from the temperature in the state shown in FIG. 12(b) to the temperature in the state shown in FIG. The bimetal plate 24 expands more than the metal material layer 24L, returns to its original flat state as shown in FIG. 12(a), and is separated from the uppermost thermally conductive material plate 11 (11A).

The uppermost thermally conductive material plate 11 (11A) is also no longer pressed due to the separation of the bimetal plate 24, and restores to its original flat state, and the thermally conductive material plate 11 located second from the uppermost Separate from (11B).

Similarly, the second thermally conductive material plate 11 (11B) from the top is also restored to its original flat state and separated from the thermally conductive material plate 11 (11C) at the bottom.

In this way, the bimetal plate 24 of the thermal conductivity control body 23 and all the thermally conductive material plates 11 are separated from each other as shown in FIG. 12(a). Therefore, the thermal conductivity control body 23 shown in FIG. 12(a) has a smaller thermal conductivity than the thermal conductivity control body 23 shown in FIG. 12(b).

In this way, in the thermal conductivity control body 23, the thermal conductivity can be changed depending on the temperature. That is, the thermal conductivity control body 23 can change from an adiabatic state to a heat transfer state, or from a heat transfer state to an adiabatic state, depending on the temperature.

FIG. 13 is a diagram showing the relationship between temperature and thermal conductivity in the thermal conductivity control body 23.

For example, as shown in FIG. 13, in the thermal conductivity control body 23, at a temperature higher than the target temperature (Tb), the plurality of thermally conductive material plates 11 included in the thermal conductivity control body 23 are in a separated state. The thermal conductivity of the thermal conductivity control body 23 is the minimum value Kb, but at a temperature below the target temperature (Tb), the plurality of thermally conductive material plates 11 of the thermal conductivity control body 23 are A contact state is established, and the thermal conductivity of the thermal conductivity control body 23 becomes a large value depending on the degree of the contact state.

For ease of explanation, FIG. 13 shows an ideal state in which the temperature at which the thermal conductivity control body 23 changes from a heat transfer state to an adiabatic state or from an adiabatic state to a heat transfer state is one point (Tb). This is what is shown. In reality, the temperature at which the thermal conductivity control body 23 changes from a heat transfer state to an adiabatic state or from an adiabatic state to a heat transfer state has a range.

As described above, in the thermal conductivity control body 23, the thermal conductivity can be changed depending on the temperature.

Therefore, according to the heat exchanger 21 equipped with the thermal conductivity control body 23, heat transfer between substances separated by the thermal conductivity control body 23 is controlled according to the temperature without requiring electrical control. can do. Furthermore, by controlling heat transfer between the substances separated by the thermal conductivity control body 23, the temperature of one substance can be maintained at a constant temperature without requiring a separate energy supply.

Next, the effects of the heat exchanger 21 will be explained using FIG. 14. Here, FIG. 14(a) is the same diagram as FIG. 16(b) described above, and is a diagram showing the effects of the conventional heat exchanger 101. FIG. 14(b) is a diagram showing the effects of the heat exchanger 21 shown in FIG. 10.

Note that FIG. 14 is a diagram for conceptually explaining the difference in function and effect between the conventional heat exchanger 101 and the heat exchanger 21 of this embodiment, especially the difference in temperature difference between the inlet side and the outlet side. The temperature gradients of the temperature-controlled object and the heating medium are not exact.

As shown in FIG. 14(a), in the conventional heat exchanger 101 (see FIG. 15), the temperature (T111) of the heat medium in the channel structure 102 is high on the inlet side, and therefore the temperature (T111) of the heat medium in the channel structure 102 is high. The heat transfer from the heating medium inside to the temperature-adjusted object 104 also becomes large, and as a result, the temperature (T113) of the temperature-adjusted object 104 on the inlet side becomes high.

However, as the process progresses from the inlet side to the outlet side, heat due to heat transfer to the temperature-controlled object 104 is cumulatively released from the heat medium in the channel structure 102, so that the heat in the channel structure 102 on the outlet side The temperature of the medium (T112) is lower than the temperature on the inlet side (T111).

When the temperature of the heating medium is low as described above, the temperature-adjusted object 104 is not heated much, and as a result, the temperature (T114) of the temperature-adjusted object 104 on the outlet side becomes low.

Therefore, the temperature of the temperature-controlled object 104 is high on the inlet side and low on the outlet side, and is not uniform. That is, there is a temperature difference (ΔT=T113-T114) between the inlet side and the outlet side.

On the other hand, as shown in FIG. 14(b), in the heat exchanger 21 of this embodiment (see FIG. 10), first, on the inlet side, the heat medium (temperature T11) in the flow path structure 22 4B is heated and its temperature becomes high, but when it reaches the target temperature (temperature Tb shown in FIG. 13), the thermal conductivity control body 23 changes from the heat transfer state to the adiabatic state, and from then on, the flow path structure 22 Heat transfer from the heating medium inside to the temperature-controlled object 4B also stops. Therefore, the temperature drop of the heat medium within the flow path structure 22 is also suppressed.

For the above reason, the temperature (T13) of the temperature-adjusted object 4B on the inlet side can theoretically be the same as the target temperature (temperature Tb shown in FIG. 13).

In the heat exchanger 21, as shown in FIG. 10, a thermal conductivity control body 23 is arranged between the flow path structure 22 and the temperature controlled object 4B from the inlet side to the outlet side. Therefore, the effect of the thermal conductivity control body 23 as described above is exerted from the inlet side to the outlet side.

Therefore, even when proceeding from the inlet side to the outlet side, the temperature of the heat medium in the flow path structure 22 does not fall like in the conventional heat exchanger 101, and the temperature (T12) on the outlet side is maintained at a high temperature. be done.

Then, when the temperature of the heating medium is high as described above, that is, when the temperature difference between the temperature of the heating medium on the inlet side (T11) and the temperature of the heating medium on the exit side (T12) is small, the temperature controlled object 4B is The outlet side is heated to the same extent as the inlet side, and the temperature (T14) of the temperature-controlled object 4B on the outlet side also becomes high.

In other words, the temperature difference (ΔT=T13-T14) between the inlet side and the outlet side of the temperature-controlled object 4B is small, and therefore the temperature of the temperature-controlled object 4B remains the same from the inlet side to the outlet side. It will be like that.

Here, similarly to the inlet side, when the target temperature (temperature Tb shown in FIG. 13) is reached on the outlet side, the thermal conductivity control body 23 changes from the heat transfer state to the adiabatic state, and from then on, the flow path structure 22 Heat transfer from the heating medium inside to the temperature-controlled object 4B also stops.

Therefore, in the heat exchanger 21 of this embodiment, the temperature (T14) of the temperature-controlled object 4B on the outlet side can also be set to the target temperature (temperature Tb shown in FIG. 13) in theory.

That is, in the heat exchanger 21 of this embodiment, the temperature of the temperature-controlled object 4B is not only made uniform from the inlet side to the outlet side, but also the temperature is adjusted to the target temperature (as shown in FIG. 13). temperature Tb).

However, in reality, the temperature at which the thermal conductivity control body 23 changes from a heat transfer state to an adiabatic state or from an adiabatic state to a heat transfer state has a range, and therefore, the temperature control object 4B is also on the inlet side. There will be a temperature difference (ΔT=T13-T14) on the exit side.

However, as described above, the temperature difference (ΔT=T13-T14) can be much smaller than the temperature difference (ΔT=T113-T114) in the conventional heat exchanger 101.
<Modification of the second embodiment>
In the heat exchanger 21 described above, an example has been shown in which a plurality of thermal conductivity control bodies 23 having the same configuration are arranged from the inlet side to the outlet side of the flow path structure 22, but the present invention is limited to this. It may be any other material as long as it can make the temperature of the temperature-adjusted object 4B uniform. For example, the plurality of thermal conductivity control bodies 23 may be different from each other.

For example, the bimetal plates 24 of the plurality of thermal conductivity control bodies 23 may be made of different materials. Further, the sizes (areas) may be different.

Further, each of the thermally conductive material plates 11 of the plurality of thermal conductivity control bodies 23 may be made of different materials. The number of sheets may also be different. The thickness may also be different.

Moreover, the thickness (that is, the separation distance) of each spacing layer 12 of the plurality of thermal conductivity control bodies 23 may also be different.

Although each embodiment of the heat exchanger according to the present invention has been described above, the present invention is not limited to the above embodiments. The above-mentioned embodiments are illustrative, and any embodiment that has substantially the same configuration as the technical idea stated in the claims of the present invention and has similar effects will be covered by the present invention in any case. covered within the technical scope of

1, 21 Heat exchanger 2, 22 Flow path structure 3, 23 Thermal conductivity control body 4A, 4B Temperature control object 11 Thermal conductive material plate 12 Spacing layer 13, 13a, 13b Holding part 14, 24 Bimetal plate 14L, 24L Metal material layer with a small coefficient of thermal expansion 14H, 24H Metal material layer with a large coefficient of thermal expansion 101 Heat exchanger 102 Channel structure 104 Temperature control object

Claims (9)

A heat exchanger that adjusts the temperature of a temperature-controlled object,
A channel structure having an inlet and an outlet, through which a fluid flows from the inlet to the outlet;
a thermal conductivity control body that is disposed between the flow path structure and the temperature control object and controls heat transfer between the flow path structure and the temperature control object;
Equipped with
In the thermal conductivity control body, at least three thermally conductive material plates are stacked with spaced layers in between , and the thermally conductive material plates facing each other change from a separated state to a contact state and a contact state. A bimetal plate is disposed above the top or below the bottom of the thermally conductive material plate in the stacking direction so as to face the thermally conductive material plate. and
The bimetal plate changes from a separated state to a contact state and from a contact state to a separated state with respect to the thermally conductive material plate at the top in the stacking direction or the bottom thermally conductive material plate in the stacking direction. It is maintained that it is possible to become
the thermally conductive material plate is a metal plate,
The thermal conductivity of the thermally conductive material plate is 400 W/(m K) or more at 20° C.,
The thickness of the thermally conductive material plate is 0.5 mm or more and 2 mm or less,
The thermal conductivity of the spacing layer is 1/1000 or less of that of the thermally conductive material plate,
The thickness of the spacing layer is 0.1 mm or more and 0.5 mm or less,
The thermally conductive material plate is elastically deformable, and is deformed by pressure from the bimetallic plate to come into contact with the opposing thermally conductive material plate, and returns to its original state by releasing the pressure from the bimetallic plate. The heat exchanger is restored to its shape and separated from the opposing thermally conductive material plate . The thermally conductive material plate of the thermal conductivity control body is
According to claim 1 , the holding portion is made of a material having a lower thermal conductivity than the thermally conductive material plate, and is held so as to be able to change from a separated state to a contact state and from a contact state to a separated state. Heat exchanger as described. The bimetal plate of the thermal conductivity control body is
A metal material layer having a large coefficient of thermal expansion is provided on the opposing side of the thermally conductive material plate,
having a metal material layer with a small coefficient of thermal expansion on the side opposite to the side of the thermally conductive material plate;
The heat exchanger according to claim 1 or claim 2 . The bimetal plate is arranged above the top of the thermally conductive material plate in the stacking direction,
The bimetal plate is spaced apart from the uppermost thermally conductive material plate in the stacking direction,
The heat exchanger according to claim 3 , wherein the bimetallic plate comes into contact with the uppermost thermally conductive material plate in the stacking direction as the temperature of the bimetallic plate increases. The bimetal plate is arranged above the top of the thermally conductive material plate in the stacking direction,
The bimetal plate is in contact with the uppermost thermally conductive material plate in the stacking direction,
The heat exchanger according to claim 3 , wherein as the temperature of the bimetallic plate decreases, the bimetallic plate separates from the topmost thermally conductive material plate in the stacking direction. The bimetal plate of the thermal conductivity control body is
A metal material layer having a small coefficient of thermal expansion is provided on the opposing side of the thermally conductive material plate,
having a metal material layer with a large coefficient of thermal expansion on the side opposite to the side of the thermally conductive material plate;
The heat exchanger according to claim 1 or claim 2 . The bimetal plate is arranged above the top of the thermally conductive material plate in the stacking direction,
The bimetal plate is spaced apart from the uppermost thermally conductive material plate in the stacking direction,
7. The heat exchanger according to claim 6 , wherein the bimetallic plate comes into contact with the uppermost thermally conductive material plate in the stacking direction as the temperature of the bimetallic plate decreases. The bimetal plate is arranged above the top of the thermally conductive material plate in the stacking direction,
The bimetal plate is in contact with the uppermost thermally conductive material plate in the stacking direction,
The heat exchanger according to claim 6 , wherein as the temperature of the bimetallic plate increases, the bimetallic plate separates from the uppermost thermally conductive material plate in the stacking direction. The heat exchanger according to any one of claims 1 to 8 , wherein a plurality of the thermal conductivity control bodies are arranged with respect to the flow path structure.