JP7345769B2 - Direct writing exposure system and direct writing exposure method - Google Patents

Description

The present invention relates to the field of micro-nano processing technology, and particularly to a direct writing exposure system and a direct writing exposure method.

Optoelectronics is a high-tech technology that has developed rapidly following microelectronics. Current laser devices, photodetectors, diffraction gratings, etc. are the early development products of optoelectronic technology. Optoelectronic technology will be used in displays, imaging, Significant developments are expected in areas such as detection.

Analyzing the microstructure of the device, microelectronic devices have a 2D pattern in their internal circuitry, and the duty ratio of this pattern is not high.Optoelectronic devices are attracting attention due to the surface 3D topography of the microstructure, and are multistage. Continuous topography is the main feature. Therefore, the processing requirements for 3D microstructures for new optoelectronic applications are different from current microelectronics, and the surface topography requirements are shifting from 2D to 3D. Current products generally include microprisms and microlenses with 3D structures, but they all belong to regular structures. With the development of technology, the microstructural requirements of optoelectronic applications are moving from regular 3D to complex 3D. Processing methods for complex 3D structures have great scientific significance for supporting many researches in the optoelectronic field, and have strategic significance for the development of new industries and new applications.

Currently, the main microfabrication technology means to realize 3D micro-nanotopography include precision diamond turning, 3D printing, lithography (light exposure), and other technologies. Diamond turning is a suitable method for fabricating 3D topographical microstructures of tens of microns in size, regular arrays, and its typical application is microprism films. Although 3D printing technology can create complex 3D structures, the resolution of conventional galvano scanner 3D printing technology is several tens of microns, the resolution of DLP projection type 3D printing is 10 to 20 um, and two-photon polymerization Although 3D printing technology can reach submicron resolution, its efficiency is extremely low because it is a sequential processing method. Microlithography technology using the photoresist exposure method is still the mainstream technological means for modern microfabrication.The photoresist material is mature, the process is controllable, and it is the highest precision processing method achievable to date. be.

2D projection lithography technology has already been widely applied in the microelectronic field, and 3D topography lithography technology is currently in the elementary stage and has not formed a mature technology system, and the current progress is as follows. be.
1. Traditional mask alignment methods are applied to create multi-level structures, control the depth of the structure in cooperation with ion etching, and require multiple alignment steps, making the process demanding and continuous. 3D topography is difficult to process.
2. In the gray scale mask exposure method, a half-tone mask is manufactured and irradiated with a mercury lamp light source to generate a light transmission area with a gray scale distribution, and the photoresist is exposed to form a 3D surface structure. It's technology. However, such masks are difficult to manufacture, have low structural resolution, require complicated processes, and are very expensive.
3. Moving mask exposure methods are compatible with the fabrication of structures such as regular microlens arrays.
4. The acousto-optic scanning direct writing method scans with a single beam, which not only has low efficiency but also has pattern splicing problems.
5. Typical manufacturers and product models of the electron beam grayscale direct writing method include Japan's Joel JBX9300, Germany's Vistec, and Leica VB6.This method has extremely low manufacturing efficiency for large-sized products, and Due to the limited energy, the depth control ability of 3D topography is not sufficient, and it is only applicable to the fabrication of small size 3D topography microstructures.
6. Digital grayscale lithography is a micro-nano processing technology that has been developed by combining a grayscale mask and digital light processing technology. A continuous three-dimensional surface-shaped relief microstructure is processed, and a step splicing method is adopted for patterns larger than one exposure field. The main shortcomings are that the grayscale modulation capability is limited by the grayscale level of the DMD, there are significant step problems and splice problems between fields of view, and the uniformity of the light intensity inside the spot is limited by the surface shape of the 3D topography. This is a point that affects the quality of the product.

Therefore, a high-quality lithography method that can realize arbitrary 3D topography is of great importance to microlithography technology in related fields, as there exists a significant difference between the research status of 3D topography lithography and future requirements. And it is in dire demand.

An object of the present invention is to provide a direct-write exposure system and a direct-write exposure method to realize maskless grayscale lithography of complex surface three-dimensional topography structures and improve lithography accuracy and lithography efficiency. .

A direct writing exposure system according to the object of the present invention includes a direct writing light source, a moving mechanism, a central control device, a spot pattern input device, a projection optical device,
the direct write light source provides a starting beam;
The movement mechanism controls the projection optical device to scan a lithography target to be exposed along a preset path, and transmits position data of a reference point;
The central controller reads corresponding spot image data in a spot pattern file sequence based on the position data and uploads this spot image data to the spot pattern input device;
The spot pattern input device modulates the starting beam supplied from the direct light light source based on the spot image data to generate pattern light, and inputs the pattern light to a projection optical device;
The projection optical device is controlled to project the patterned light onto the surface of the lithography object to form a variable spot, and scans along the preset path under the control of a movement mechanism, and during scanning, By changing the spot image data according to the position data, a preset controllable variable spot is formed.

Further, the moving mechanism transmits the position data of the reference point again after the scanning position of the projection optical device changes,
the central controller reads the corresponding spot image data in the spot pattern file sequence again based on the position data and uploads the spot image data to the spot pattern input device again;
The spot pattern input device modulates the starting beam supplied from the direct light light source again based on the spot image data to generate pattern light, and inputs the pattern light into the projection optical device again;
The projection optical device is controlled to project the pattern light onto the surface of the lithography object again to form a variable spot, and scans the pattern light along the preset path under control of the movement mechanism.

Further, the direct writing exposure system includes:
a three-dimensional topography generation device for generating three-dimensional topography data;
a three-dimensional topography analysis to generate a spot pattern file sequence comprising a coordinate sequence and a spot image data sequence corresponding to the coordinate sequence, based on the three-dimensional topography data and preset parameters of the direct-write exposure system; The apparatus further includes: an apparatus;

Further, the inside of the variable spot has a fixed light intensity, the spot image data includes a spot shape, and the preset parameters of the direct write exposure system include the preset path, scanning speed and the Contains fixed light intensity.

Further, the inside of the variable spot has a grayscale distributed light intensity, the spot image data includes a spot shape and an in-spot light intensity distribution, and the preset parameters of the direct writing exposure system are the preset including the path taken and the scanning speed.

The central controller is further configured to move the projection optical device in a three-dimensional direction with respect to the lithography object by transmitting a displacement command to the movement mechanism, thereby changing the displacement and focus of the projection optical device. Achieve alignment.

The direct writing exposure system according to the present invention includes:
including a direct writing light source, a movement mechanism, a central controller, a spot pattern input device, and a projection optical device;
the direct write light source provides a starting beam;
The movement mechanism controls the projection optical device to scan a lithography target to be exposed along a preset path, and sequentially transmits position data of at least two groups of reference points;
The central controller reads corresponding spot image data in a spot pattern file sequence based on the position data, and sequentially uploads the spot image data corresponding to the position data of each group to the spot pattern input device; changing this spot image data according to position data transmitted from the moving mechanism,
The spot pattern input device modulates the starting beam supplied from the direct writing light source to sequentially generate corresponding pattern light based on the spot image data corresponding to the position data of each group, and generates corresponding pattern light in order, and Input pattern light corresponding to each data into the projection optical device in order,
The projection optical device is controlled to project the pattern light onto the surface of the lithography target to form a variable spot, and scans the pattern light along the preset path under the control of the movement mechanism to generate a variable spot. Forms a set controllable variable spot.

The direct writing exposure method according to the present invention includes:
Step S1 of generating three-dimensional topography data;
step S2 of generating a spot pattern file sequence comprising a coordinate sequence and a spot image data sequence corresponding to the coordinate sequence, based on the three-dimensional topography data and preset parameters of the direct writing exposure system;
A pattern of light is generated based on the spot image data sequence, and the pattern of light is projected onto the surface of the lithographic object to be exposed to form a variable spot, which is scanned along a predetermined path and scanned. The method includes a step S3 of changing the shape of the variable spot according to position data to form a preset controllable variable spot.

Further, in step S3, the light intensity distribution of the variable spot also changes according to the position data during scanning.

Further, the step S3 specifically includes:
Step S31 of acquiring position data of the reference point;
step S32 of reading corresponding spot image data in the spot pattern file sequence based on the position data;
step S33 of generating the pattern light based on the spot image data;
Step S34 of projecting the patterned light onto the surface of the lithography object to form the variable spot;
a step S35 of controlling the variable spot to be displaced by a predetermined amount;
Steps S31 to S35 are repeatedly executed until the direct drawing exposure is completed.

Further, in step S3, the step of scanning along a preset route specifically includes:
controlling the variable spot to scan along a plurality of preset paths in forward and backward order;
The plurality of preset routes are head-to-tail discontinuous or head-to-tail continuous, and the plurality of routes are parallel or intersect with each other.

Further, the projection optical device employs a parallel imaging method for projecting the variable spot.

Furthermore, before step S3,
providing a substrate;
further comprising applying a corresponding thickness of photoresist on the surface of the substrate according to three-dimensional topography requirements;
In step S2, the preset parameters of the direct write exposure system include an exposure sensitivity curve of the photoresist.

The direct writing exposure system and the direct writing exposure method according to the present invention provide a variable spot whose shape and/or light intensity distribution changes during drag scanning so that the exposure amount at each evaluation point on the lithography object changes. can be used to expose the surface of a lithography object to realize maskless grayscale lithography of complex surface three-dimensional topography structures and improve lithography accuracy and lithography efficiency.

FIG. 3 is a schematic diagram of the shape change during drag scanning of a variable spot in the direct write exposure optical system of the present invention and the lithography bath shape of a lithography object. 1 is a schematic diagram of the shape of a variable spot at a certain point in time in a direct write exposure system of the present invention; FIG. 1 is a schematic diagram of a cross-section of a variable spot scanned over the surface of a lithographic object at a certain point in time in the direct write exposure method of the present invention; FIG. 1 is a schematic diagram of the configuration of a direct writing exposure system according to a first embodiment of the present invention. 1 is a flowchart of a direct writing exposure method according to Example 1 of the present invention. 5 is a specific flowchart of step S3 in the direct writing exposure method shown in FIG. 4. FIG. FIG. 3 is a schematic diagram of a plurality of preset paths in the direct writing exposure method of Example 1 of the present invention. FIG. 3 is a schematic diagram of a plurality of preset paths in the direct writing exposure method of Example 1 of the present invention. FIG. 3 is a schematic diagram of a plurality of preset paths in the direct writing exposure method of Example 1 of the present invention.

Hereinafter, specific embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention and are not intended to limit the scope of the invention.

In the direct writing exposure (maskless exposure) system and direct writing exposure method according to the present invention, the shape and/or light intensity distribution changes during drag scanning so that the exposure amount at each evaluation point on the lithography object 20 changes. A changing variable spot 10 is used to expose the surface of a lithographic object 20 to achieve maskless gray scale lithography of complex surface three-dimensional topography structures.

Referring to FIGS. 1 and 3, FIG. 1 illustrates the shape change during drag scanning of the variable spot 10 and the lithography bath shape of the lithography object 20 of the present invention. The variable spot 10 performs interval updates along the scan path, which updates are controlled by a central controller 35, e.g. with frame rate updates at predetermined time intervals, or as required by the three-dimensional topography. Updates are performed at non-uniform time intervals. Each time the update is performed, the shape of the variable spot 10 changes, and the inside of the variable spot 10 has a gray scale distributed light intensity, and the shape and/or light intensity distribution of the variable spot 10 changes each time the update is performed.

Referring to FIGS. 2a and 2b, FIG. 2a shows the shape of the variable spot 10 at a certain point in time, and within the projected area produced by the direct writing optical head of the projection optics 37 there are bright regions 101 and A light-blocking area 102 is included, and a bright area 101 is called the inside of the variable spot 10. FIG. 2b shows a cross-section through which the variable spot 10 is scanned over the surface of the lithographic object 20 at a certain point in time. Regarding any evaluation point Q on the surface of the lithography object 20, the variable spot 10 scans the evaluation point Q along a predetermined scanning path at a predetermined scanning speed, The exposure time and/or light intensity distribution when the front end 11 and rear end 12 of 10 scan the evaluation point Q are adjusted, and the exposure time and light intensity distribution affect the exposure amount at the evaluation point Q, and The etch depth of the plurality of evaluation points defines the lithography bath shape of the lithography object 20 at that location. For example, when the variable spot 10 scans along a certain path, each point on the internal line AA' sequentially scans the evaluation point Q, and the exposure amount at the evaluation point Q is different from each point on the internal line AA'. When the variable spot 10 scans along another path depending on the light intensity and scanning speed of the point, each point on the internal line BB' sequentially scans the evaluation point Q, and the exposure at the evaluation point Q The amount is influenced by the light intensity and scanning speed at each point on the line BB'.

Therefore, depending on the three-dimensional topography formed by the desired lithography, factors such as the scanning path in the direct writing optical system, preset parameters such as the scanning speed, and the sensitivity of the lithography object 20 to the exposure dose are considered. Accordingly, a series of specific two-dimensional spots can be estimated and designed, and there is a correspondence between the shape and/or light intensity of the spots and the (x,y) coordinates in the scanning path. The correspondence between the shape and/or light intensity of this series of specific two-dimensional spots and the position data constitutes a spot pattern file sequence. The direct write exposure system of the present invention generates a variable spot 10 whose shape and/or light intensity distribution changes during a drag scan based on a spot pattern file sequence.

(Example 1)
Referring to FIG. 3, the direct writing exposure system of this embodiment includes a three-dimensional topography generation device 31, a three-dimensional topography analysis device 32, a direct writing light source 33, a moving mechanism 34, a central control device 35, and a spot It includes a pattern input device 36 and a projection optical device 37. The three-dimensional topography generation device 31, three-dimensional topography analysis device 32, and central control device 35 may be provided in one or more computers or servers.

The three-dimensional topography generation device 31 generates three-dimensional topography data. The three-dimensional topography data includes, but is not limited to, coordinates in the x and y directions of each point position of the three-dimensional topography and corresponding height data in the z-direction. The 3D modeling software generated by the modeling software is a vector file that can derive generic 3D data formats (e.g. STL, 3DS, STP, IGS, OBJ, etc.) that are analyzed by the computer. is preferred.

The three-dimensional topography analysis device 32 generates a spot pattern file sequence based on the three-dimensional topography data and preset parameters of the direct write exposure system. The spot pattern file sequence includes a coordinate sequence and a spot image data sequence corresponding to the coordinate sequence. In this embodiment, the inside of the variable spot 10 adopts a fixed light intensity, and each spot image data in the spot image data sequence includes a spot shape, and the spot shape in the spot image data has a plurality of shapes that describe the spot contour. defined by the coordinates or binarized light intensity data of each point within the projected area produced by the direct-write optical head. Preset parameters of the direct write exposure system include, but are not limited to, a preset path P, a scanning speed, and a fixed light intensity. After the spot pattern file sequences are generated, they are stored in memory in order, and the central controller 35 can read, match, etc. the spot pattern file sequences in the memory.

Direct write light source 33 provides a starting beam to spot pattern input device 36 . The direct writing light source 33 can be an LED, a semiconductor laser, a solid state laser, a gas laser, etc. that exposes the photoresist material on the lithography object 20, and is preferably an incoherent continuous light source.

The moving mechanism 34 controls the projection optical device 37 to scan the lithography target 20 to be exposed along a preset path P, and transmits position data. Note that scanning, movement, and displacement in the present invention refer to relative displacement between the projection optical device 37 and the lithography target object 20. Specifically, the moving mechanism 34 includes a first step shaft and a first drive motor for interlocking and moving the projection optical device 37 in the horizontal direction, and a first step shaft and a first drive motor for interlocking and moving the projection optical device 37 up and down. Alternatively, the moving mechanism 34 includes a first step shaft and a first drive motor for interlocking and horizontally moving the stage on which the lithography object 20 is mounted. The stage may include a drive motor, a second step shaft and a second drive motor for moving the stage up and down in conjunction with each other, or a combination of the two movement methods may be employed. A rectangular coordinate system or a polar coordinate system is used to move the projection optical device 37 or the stage in the horizontal direction. The moving mechanism 34 acquires position data using a laser, ultrasonic wave, etc., and this position data is determined by the coordinates of the reference point within the variable spot 10, the coordinates of the reference point in the projection optical device 37, and the moving mechanism 34. This includes, but is not limited to, the coordinates of a reference point.

Based on the position data, the central controller 35 reads the corresponding spot image data in the spot pattern file sequence and uploads this spot image data to the spot pattern input device 36 . Specifically, the central controller 35 matches the stored spot pattern file sequence with the position data, reads the spot shape corresponding to the position data, and causes the spot pattern input device 36 to generate a corresponding pattern of light. control to update. Furthermore, the central controller 35 moves the projection optical device 37 in a three-dimensional direction relative to the lithography object 20 by transmitting a displacement command to the movement mechanism 34, thereby controlling the displacement and focusing of the projection optical device 37. Realize.

The spot pattern input device 36 modulates the starting beam supplied from the direct writing light source 33 based on the spot image data to generate pattern light, and causes the pattern light to be input to the projection optical device 37 . The spot pattern input device 36 uses, for example, a spatial light modulator with a two-dimensional array structure such as a digital micromirror array (DMD) or a silicon-based liquid crystal (LCOS).

The projection optical device 37 projects a dynamically deformed structure spot onto the surface of the lithography target object 20 with pattern light to form a dynamically deformed structure spot, and scans the dynamically deformed structure spot along a preset path P in conjunction with the moving mechanism 34 . do. The projection optical device 37 performs focus adjustment with the assistance of the central control device 35 and the moving mechanism 34, and controls the projected area of the variable spot 10 having a predetermined shape onto the surface of the lithography object 20 by the focus adjustment. During scanning, the positional data of the reference point is continuously uploaded to the central controller 35 and the shape of the pattern light is updated, so the shape of the variable spot 10 changes according to the positional data, and the shape of the variable spot 10 changes according to the positional data. A controllable variable spot is formed. During the period between the nth (n is a positive integer) update and the (n+1)th update, the variable spot 10 maintains the shape after the nth update, so the scanning method of the projection optical device 37 is as follows. This is a drag step scan. The projection of the variable spot 10 by the projection optical device 37 employs a parallel imaging method such as a flat field reduction imaging projection optical method instead of a serial imaging method such as an acousto-optic modulation optical method or a galvano mirror optical method.

Furthermore, the direct write exposure system may further include a beam shaper located between the direct write light source 33 and the spot pattern input device 36 to shape the starting beam from the direct write light source 33.

Referring to FIG. 4, the direct drawing exposure method according to this embodiment is as follows:
Step S1 of generating three-dimensional topography data;
step S2 of generating a spot pattern file sequence comprising a coordinate sequence and a spot image data sequence corresponding to the coordinate sequence based on the three-dimensional topography data and preset parameters of the direct-write exposure system;
Based on the spot image data sequence, a pattern of light is generated, which is projected onto the surface of the lithographic object 20 to be exposed to form a variable spot 10, which is scanned along a preset path P. , a step S3 of changing the shape of the variable spot 10 during scanning according to position data to form a preset controllable variable spot.

Specifically, referring to FIG. 5, step S3 includes:
Step S31 of acquiring position data;
step S32 of reading corresponding spot image data in the spot pattern file sequence based on the position data;
Step S33 of generating pattern light based on the spot image data;
a step S34 of projecting the patterned light onto the surface of the lithography object 20 to form a variable spot 10;
Step S35 of controlling the variable spot 10 to be displaced by a predetermined value,
Steps S31 to S35 are repeatedly executed until the direct drawing exposure is completed.

In step S3, the step of scanning along a preset route P specifically includes the step of controlling the variable spot 10 to scan along a plurality of preset routes P in forward and backward order, The plurality of preset routes P can be discontinuous or continuous, and the plurality of routes can be parallel or intersect with each other. 6a to 6c, three embodiments of scanning paths are shown, in which the variable spot 10 scans along a continuous preset path P and directs the projection optics 37. The scanning area of the optical head forms a continuous strip pattern 13 spliced so as not to overlap to form a width pattern, and in FIG. The scanning area of the direct writing optical head forms a width pattern by forming a plurality of strip patterns 13 that are parallel and have overlapping regions 14, and in FIG. 6c, the variable spot 10 is Scanning is performed along an existing preset path P, and the scanning area of the direct writing optical head forms a plurality of stripe patterns 13 spliced so as to overlap to form a width pattern.

Before step S3,
providing a substrate 21;
The method may further include applying a photoresist 22 with a corresponding thickness on the surface of the substrate 21 according to the requirements of three-dimensional topography.

In the above step S2, the preset parameters of the direct writing exposure system include an exposure sensitivity curve of the photoresist 22, which is a correspondence relationship between the exposure amount and the exposure sensitivity of the photoresist, and the exposure sensitivity curve of the photoresist 22. Sensitivity means the minimum energy value of light of a predetermined wavelength necessary to generate a good pattern on the photoresist 22. Furthermore, the preset parameters of the direct write exposure system also include the thickness of the photoresist 22, the contrast of the photoresist 22, etc., where the contrast of the photoresist 22 is transient from exposed areas to unexposed areas of the photoresist 22. Refers to slope.

After step S3, the method may further include a step of performing a chemical treatment such as development on the lithography object 20 to remove a portion of the photoresist 22 in a gradation manner. The removal depth of the photoresist 22 is related to the amount of exposure obtained at each point on the surface, thereby obtaining a three-dimensional micro-nanostructure pattern master with the desired three-dimensional topography. Thereafter, the method may further include performing ion etching, replication, electroplating, etc. based on the three-dimensional micro-nano structure pattern master.

(Example 2)
This embodiment provides a direct-write exposure system and a direct-write exposure method. The direct drawing exposure method of this embodiment differs from the first embodiment described above in the following points.
The interior of the variable spot 10 has a grayscale distributed light intensity, and the spot image data includes the spot shape and the intra-spot light intensity distribution. The preset parameters of the direct write exposure system include a preset path P and scanning speed, and the preset parameters may further include an exposure sensitivity curve, thickness, contrast, etc. of the photoresist 22. .

The direct drawing exposure method of this embodiment differs from the first embodiment described above in the following points.
In step S2, a spot pattern file sequence is generated based on the three-dimensional topography data, a preset path P, and a scanning speed, and the spot pattern file sequence includes a coordinate sequence and a spot image data sequence corresponding to the coordinate sequence. and a light intensity distribution sequence corresponding to this coordinate sequence.

In step S3, the light intensity distribution of the variable spot 10 also changes according to the position data during scanning. Further, in step S32, the step of reading the corresponding spot image data in the spot pattern file sequence based on the position data specifically includes the step of reading the corresponding spot image data in the spot pattern file sequence based on the position data. It is about reading the distribution.

In this example, the variable spot 10 updated the nth time (n is a positive integer) and the variable spot 10 updated the n+1th time may have the same shape and a different light intensity distribution, or may have a different shape. There are cases where the light intensity distribution is different.

According to the above, in the direct writing exposure system and direct writing exposure method according to the present invention, the shape and/or light intensity distribution is changed during drag scanning so that the exposure amount at each evaluation point on the lithography object 20 changes. A changing variable spot 10 is used to expose the surface of a lithographic object 20 to achieve maskless grayscale lithography, and the spot pattern file sequence has a high degree of flexibility, allowing complex surface three-dimensional topography structures to be created. There is no need to fabricate a high-precision halftone mask, which can save cost and improve lithography accuracy and lithography efficiency.

The technical configurations of the above embodiments can be combined arbitrarily, and to simplify the explanation, all possible combinations of the technical features of the above embodiments are not described. Combinations of technical configurations should be considered within the scope of this specification unless inconsistent.

The above are merely specific embodiments of the present invention, and the protection scope of the present invention is not limited thereto.Changes and changes that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention are not limited thereto. Substitutions shall be included within the protection scope of the present invention. Therefore, the protection scope of the present invention is based on the protection scope described in the claims.

Claims (8)

A direct write exposure system,
It includes a direct writing light source (33), a movement mechanism (34), a central control device (35), a spot pattern input device (36), and a projection optical device (37),
the direct write light source (33) provides a starting beam;
The movement mechanism (34) controls the projection optical device (37) to scan the lithography target (20) to be exposed along a preset path (P), and Every time the variable spot (10) projected by the device (37) is updated, the position data of the reference point of the next variable spot (10) is transmitted;
The central controller (35) reads corresponding spot image data in a spot pattern file sequence based on the position data , and sends the spot image data corresponding to each of the position data to the spot pattern input device (36). Upload in order to
The spot pattern input device (36) modulates the starting beam supplied from the direct writing light source (33) based on the spot image data corresponding to each of the position data to generate a corresponding pattern light. sequentially generate pattern light corresponding to each of the spot image data, and sequentially input pattern light to the projection optical device (37);
The projection optical device (37) projects the pattern light onto the surface of the lithography object (20) to form a variable spot (10), and controls the variable spot (10) by controlling the movement mechanism ( 34 ). a spot (10) scanned along the predetermined path (P) to etch the lithography object (20) ;
The central controller (35) changes the shape and light intensity distribution of the variable spot (10) during scanning according to the position data.
A direct drawing exposure system characterized by: The direct writing exposure system includes:
a three-dimensional topography generation device (31) for generating three-dimensional topography data;
a three-dimensional topography analysis to generate a spot pattern file sequence comprising a coordinate sequence and a spot image data sequence corresponding to the coordinate sequence, based on the three-dimensional topography data and preset parameters of the direct-write exposure system; further comprising an apparatus (32);
2. A direct writing exposure system according to claim 1. The inside of the variable spot (10) has a grayscale distributed light intensity,
The spot image data includes a spot shape and an in-spot light intensity distribution,
The preset parameters of the direct write exposure system include the preset path (P) and scanning speed;
2. A direct writing exposure system according to claim 1. The central controller (35) further moves the projection optical device (37) in three dimensions with respect to the lithography object (20) by transmitting a displacement command to the moving mechanism (34). realizing displacement and focusing of the projection optical device (37);
2. A direct writing exposure system according to claim 1. A direct writing exposure method,
Step S1 of generating three-dimensional topography data;
step S2 of generating a spot pattern file sequence comprising a coordinate sequence and a spot image data sequence corresponding to the coordinate sequence, based on the three-dimensional topography data and preset parameters of the direct writing exposure system;
generating a pattern of light based on the spot image data sequence and projecting the pattern of light onto a surface of a lithographic object (20) to be exposed to form a variable spot (10); etching the lithography object (20) by scanning along a preset path (P);
changing the shape and light intensity distribution of the variable spot (10) during scanning according to position data of a reference point of the variable spot (10);
A direct drawing exposure method characterized by: The step S3 is
Step S31 of acquiring position data of the reference point;
step S32 of reading corresponding spot image data in the spot pattern file sequence based on the position data;
step S33 of generating the pattern light based on the spot image data;
a step S34 of projecting the patterned light onto the surface of the lithography object (20) to form the variable spot (10);
a step S35 of controlling the variable spot (10) to be displaced by a predetermined amount;
Repeating steps S31 to S35 until the direct drawing exposure is completed,
6. The direct writing exposure method according to claim 5 . In the step S3, the step of scanning along a preset path (P) is controlled such that the variable spot (10) scans along a plurality of preset paths (P) in forward and backward order. contains steps
6. The direct writing exposure method according to claim 5 . Before step S3,
providing a substrate (21);
further comprising applying a photoresist (22) of a corresponding thickness on the surface of the substrate (21) according to the requirements of three-dimensional topography;
In step S2, the preset parameters of the direct write exposure system include an exposure sensitivity curve of a photoresist;
6. The direct writing exposure method according to claim 5 .

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