JP7343624B2 - レーザー切削縁部を評価するための方法、移動端末機器およびシステム - Google Patents
レーザー切削縁部を評価するための方法、移動端末機器およびシステム Download PDFInfo
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Description
A)レーザー切削縁部およびその周囲の画像データを取得するステップと、
B)画像データをセグメント化し、画像データの関心セグメントを識別するステップであって、ここで、関心セグメントは、レーザー切削縁部の画像データを含むステップと、
C)関心セグメントについて画質認識を実施するステップと、
D)画質認識に基づいて、ユーザーのための出力を生成するステップとを含む。
3次元の鮮明度、静止した最良のコントラスト比、モーション鮮明度、
照度:露出過多および露出不足の回避ならびに最大動特性を拡大するためのHDR(High Dynamic Range)法の使用、
ノイズ:ISOパラメータ化の最適化、
ガンマ補正:周囲光、例えば、よりリアルな色再現のための昼光、ネオンランプなどへの自動的なパラメータ適合化、
絞り:可及的に深い被写界深度への適合化、
の最適化に関するフィードバックを受け取る。
Claims (15)
- ワークピース(12)のレーザー切削縁部(16)を評価するための方法であって、
A)前記レーザー切削縁部(16)およびその周囲の画像データを取得するステップと、
B)前記画像データをセグメント化し、前記画像データの関心セグメントを識別するステップであって、前記関心セグメントは、前記レーザー切削縁部(16)の画像データを含むステップと、
C)前記関心セグメントについて画質認識を実施するステップと、
D)前記画質認識に基づいて、ユーザーのための出力を生成するステップとを含み、
前記ステップB)において、前記画像データの各ピクセルについて、それが前記レーザー切削縁部(16)の一部を表しているかどうかが求められ、記憶される、方法。 - ワークピース(12)のレーザー切削縁部(16)を評価するための方法であって、
A)前記レーザー切削縁部(16)およびその周囲の画像データを取得するステップと、
B)前記画像データをセグメント化し、前記画像データの関心セグメントを識別するステップであって、前記関心セグメントは、前記レーザー切削縁部(16)の画像データを含むステップと、
C)前記関心セグメントについて画質認識を実施するステップと、
D)前記画質認識に基づいて、ユーザーのための出力を生成するステップとを含み、
前記ステップA)の前に、前記レーザー切削縁部(16)に関するパラメータが受信される、方法。 - 前記ステップB)は、ニューラルネットワークを用いて実行される、請求項1または2に記載の方法。
- 前記画質認識は、鮮明度認識を含む、請求項1から3までのいずれか一項に記載の方法。
- 前記鮮明度認識は、前記関心セグメントの画像データの周波数領域への変換を含み、前記鮮明度認識は、前記周波数領域において実施される、請求項4に記載の方法。
- 前記ステップA)の前に、前記レーザー切削縁部(16)は、レーザービームを用いて、特に付加的に圧縮空気ブラストを用いて切削される、請求項1から5までのいずれか一項に記載の方法。
- 移動端末機器(10)であって、
・レーザー切削縁部(16)の画像データを周囲とともに取得するように構成されたカメラ(18)を備え、
前記移動端末機器(10)は、
・前記画像データを計算ユニットに伝送し、前記計算ユニットから前記画像データを受信するように構成され、
前記受信された画像データは、セグメント化され、前記受信された画像データ内で関心セグメントが識別され、
前記関心セグメントは、前記レーザー切削縁部(16)の画像データを含み、
前記受信された画像データは、前記関心セグメントについての画質認識の結果を含み、
前記画像データの各ピクセルについて、それが前記レーザー切削縁部(16)の一部を表しているかどうかが求められ、記憶される、移動端末機器(10)。 - 移動端末機器(10)であって、
・レーザー切削縁部(16)の画像データを周囲とともに取得するように構成されたカメラ(18)を備え、
前記移動端末機器(10)は、
・前記画像データを計算ユニットに伝送し、前記計算ユニットから前記画像データを受信するように構成され、
前記受信された画像データは、セグメント化され、前記受信された画像データ内で関心セグメントが識別され、
前記関心セグメントは、前記レーザー切削縁部(16)の画像データを含み、
前記受信された画像データは、前記関心セグメントについての画質認識の結果を含み、
前記カメラ(18)による前記レーザー切削縁部(16)の画像データの取得前に、前記レーザー切削縁部(16)に関するパラメータが受信される、移動端末機器(10)。 - ユーザーのための出力を生成するように構成された出力インターフェース(24)を備え、前記出力は、前記画質認識の結果に基づいている、請求項7または8に記載の移動端末機器。
- 前記移動端末機器(10)は、携帯電話、タブレットコンピュータ、またはウェブカメラとして構成可能である、請求項7から9までのいずれか一項に記載の移動端末機器。
- 前記計算ユニットは、前記画像データをセグメント化し、前記画像データの関心セグメントを識別するように構成されており、前記関心セグメントは、前記レーザー切削縁部(16)の画像データを含み、前記計算ユニットは、前記関心セグメントについて画質認識を実施するように構成されている、請求項7から10までのいずれか一項に記載の移動端末機器。
- 前記レーザー切削縁部(16)に関するパラメータを受信するための少なくとも1つのインターフェース(20,22,24)を備える、請求項7から11までのいずれか一項に記載の移動端末機器。
- 前記少なくとも1つのインターフェースは、ユーザーのための入力インターフェース(20,22)として、かつ/またはレーザー切削機械(14)と通信するための通信インターフェース(24)として構成されている、請求項12に記載の移動端末機器。
- 前記移動端末機器は、計算ユニットを備えている、請求項7から13までのいずれか一項に記載の移動端末機器。
- システムであって、
・レーザービームを用いて、レーザー切削縁部(16)が、ワークピース(12)内へ切削するように構成されたレーザー切削機械(14)と、
請求項7から14までのいずれか一項に記載の移動端末機器(10)とを含んでいる、システム。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030120714A1 (en) | 2001-12-26 | 2003-06-26 | Wolff Robert A. | Human/machine interface for a machine vision sensor and method for installing and operating the same |
US20060049158A1 (en) | 2004-08-13 | 2006-03-09 | Precitec Kg. | Method and apparatus for regulating an automatic treatment process |
JP2012533434A (ja) | 2009-07-20 | 2012-12-27 | プレシテック カーゲー | レーザ加工ヘッドおよびレーザ加工ヘッドの焦点位置の変化を補償するための方法 |
CN204997230U (zh) | 2015-06-24 | 2016-01-27 | 苏州汇能激光科技有限公司 | 一种用于龙门式激光切割机上的跨平台实时监控系统 |
JP2019012426A (ja) | 2017-06-30 | 2019-01-24 | キヤノン株式会社 | 画像認識装置、学習装置、画像認識方法、学習方法及びプログラム |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11129083A (ja) * | 1997-10-30 | 1999-05-18 | Koike Sanso Kogyo Co Ltd | 切断装置 |
GB2432726B (en) * | 2005-11-25 | 2008-06-18 | Coated Conductors Consultancy | Template for a superconducting coil |
JP4997175B2 (ja) * | 2008-05-23 | 2012-08-08 | 株式会社Pfu | オブジェクト管理装置、携帯端末、および、オブジェクト操作方法 |
WO2014009942A1 (en) * | 2012-07-10 | 2014-01-16 | Matitiahu Tiano | A modular system for real-time evaluation and monitoring of a machining production-line overall performances calculated from each given workpiece, tool and machine |
WO2014167463A2 (en) * | 2013-04-10 | 2014-10-16 | Koninklijke Philips N.V. | Image quality index and/or imaging parameter recommendation based thereon |
WO2017117051A1 (en) * | 2015-12-30 | 2017-07-06 | Rudolph Technologies, Inc. | Wafer singulation process control |
CN105787930B (zh) * | 2016-02-17 | 2019-01-18 | 上海文广科技(集团)有限公司 | 基于锐利度的针对虚化图像的显著性检测方法及系统 |
CN105809704B (zh) * | 2016-03-30 | 2019-03-15 | 北京小米移动软件有限公司 | 识别图像清晰度的方法及装置 |
US20180082416A1 (en) * | 2016-09-16 | 2018-03-22 | Qualcomm Incorporated | Systems and methods for analyzing image quality |
DE102016226230B4 (de) * | 2016-12-27 | 2018-07-12 | Siemens Healthcare Gmbh | Automatisierte Bildprüfung in der Röntgenbildgebung |
WO2018237138A1 (en) * | 2017-06-23 | 2018-12-27 | Flow International Corporation | AUTONOMOUS MODIFICATION OF WATERJET CUTTING SYSTEMS |
CN108628061B (zh) * | 2018-05-07 | 2020-09-29 | 凌云光技术集团有限责任公司 | 一种工业相机自适应自动对焦方法及装置 |
JP2021166229A (ja) * | 2020-04-06 | 2021-10-14 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030120714A1 (en) | 2001-12-26 | 2003-06-26 | Wolff Robert A. | Human/machine interface for a machine vision sensor and method for installing and operating the same |
US20060049158A1 (en) | 2004-08-13 | 2006-03-09 | Precitec Kg. | Method and apparatus for regulating an automatic treatment process |
JP2012533434A (ja) | 2009-07-20 | 2012-12-27 | プレシテック カーゲー | レーザ加工ヘッドおよびレーザ加工ヘッドの焦点位置の変化を補償するための方法 |
CN204997230U (zh) | 2015-06-24 | 2016-01-27 | 苏州汇能激光科技有限公司 | 一种用于龙门式激光切割机上的跨平台实时监控系统 |
JP2019012426A (ja) | 2017-06-30 | 2019-01-24 | キヤノン株式会社 | 画像認識装置、学習装置、画像認識方法、学習方法及びプログラム |
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