JP7334053B2 - Electronic component manufacturing apparatus and electronic component manufacturing method - Google Patents

Description

The present invention relates to an electronic component manufacturing apparatus and an electronic component manufacturing method.

2. Description of the Related Art Conventionally, there has been known an electronic component manufacturing apparatus that carries out a process of bonding a lid to a package substrate on which a semiconductor element or the like is mounted. In the electronic component, the lid is connected to the package substrate in order to block interference of electromagnetic waves with a semiconductor element or the like mounted on the package substrate or leakage of electromagnetic waves from the package substrate. For example, Japanese Patent Laying-Open No. 2002-343896 discloses an electronic component manufacturing apparatus in which a lid is connected to a member corresponding to a package substrate. In Japanese Unexamined Patent Application Publication No. 2002-343896, pre-coated solder is formed on a lid, and the lid is attached to a member corresponding to a package substrate. At this time, the precor and the solder are kept in contact with the member. By heating and melting the pre-coating solder in this state, the lid is soldered to the member.

JP-A-2002-343896

In the above-described electronic component manufacturing apparatus, when the process of bonding the lid to the member corresponding to the package substrate is repeatedly performed, foreign matter such as dirt adheres to the stage that holds the lid or the member in the manufacturing apparatus, and the lid and the stage are separated. or between the member and the stage. As a result, soldering is performed while the parallelism between the lid and the member is not maintained. As a result, relatively wide or relatively narrow solder joint gaps occur. The amount of solder filling is insufficient in the portion where the gap is wide. An excessive amount of solder is filled in a portion where the gap is narrow. As a result, the amount of solder is not uniform at the joint between the lid and the member, resulting in mounting defects (soldering defects) of the lid, such as partially unjoined portions.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic component manufacturing apparatus capable of suppressing the occurrence of defective mounting of a lid that constitutes an electronic component; An object of the present invention is to provide a method for manufacturing an electronic component.

An electronic component manufacturing apparatus according to the present disclosure includes a first holding section, a second holding section, a moving section, and an attitude adjusting section. An electronic component is formed by bonding a package substrate and a lid. The first holding part holds the package substrate. The second holding part holds the lid. The moving part moves either the first holding part or the second holding part so that the package substrate held by the first holding part and the lid held by the second holding part are in contact with each other. The attitude adjusting section changes the relative attitude of the lid held by the second holding section with respect to the package substrate held by the first holding section.

A method of manufacturing an electronic component according to the present disclosure includes the steps of holding a package substrate on a first holding portion, holding a lid on a second holding portion, moving, and bonding. In the moving step, either one of the first holding portion and the second holding portion is moved so that the package substrate held by the first holding portion and the lid held by the second holding portion are in contact via solder. move. In the joining step, the solder in contact with the package substrate and the lid is heated and melted, thereby joining the package substrate and the lid with the solder. In the moving step, the relative posture of the lid held by the second holding portion with respect to the package substrate held by the first holding portion can be changed.

According to the above, it is possible to suppress the occurrence of defective mounting of the lid that constitutes the electronic component.

1 is a schematic plan view showing an electronic component manufacturing apparatus according to Embodiment 1. FIG. 2 is a schematic partial cross-sectional view of the electronic component manufacturing apparatus shown in FIG. 1. FIG. FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG. 2; 4 is a flowchart for explaining a method for manufacturing an electronic component according to Embodiment 1; 5 is a schematic partial cross-sectional view for explaining a method of manufacturing the electronic component shown in FIG. 4; FIG. 5 is a schematic partial cross-sectional view for explaining a method of manufacturing the electronic component shown in FIG. 4; FIG. 5 is a schematic partial cross-sectional view for explaining a method of manufacturing the electronic component shown in FIG. 4; FIG. 5 is a schematic diagram of an electronic component manufactured by the method for manufacturing an electronic component shown in FIG. 4; FIG. FIG. 9 is a schematic cross-sectional view along the line segment IX-IX in FIG. 8; It is a cross-sectional schematic diagram for demonstrating operation|movement of the comparative example of the manufacturing apparatus of an electronic component. It is a cross-sectional schematic diagram for demonstrating operation|movement of the comparative example of the manufacturing apparatus of an electronic component. It is a cross-sectional schematic diagram for demonstrating the problem in the comparative example of the manufacturing apparatus of electronic components. It is a cross-sectional schematic diagram for demonstrating the problem in the comparative example of the manufacturing apparatus of electronic components. It is a cross-sectional schematic diagram for demonstrating the problem in the comparative example of the manufacturing apparatus of electronic components. FIG. 7 is a schematic partial cross-sectional view of an electronic component manufacturing apparatus according to Embodiment 2; 8 is a flowchart for explaining a method for manufacturing an electronic component according to Embodiment 2; FIG. 11 is a schematic partial cross-sectional view of an electronic component manufacturing apparatus according to Embodiment 3; 18 is a schematic diagram for explaining the operation of the electronic component manufacturing apparatus shown in FIG. 17; FIG. FIG. 11 is a schematic partial cross-sectional view showing a first modification of the electronic component manufacturing apparatus according to Embodiment 3; FIG. 11 is a schematic partial cross-sectional view showing a second modification of the electronic component manufacturing apparatus according to Embodiment 3; 21 is a schematic diagram for explaining the operation of the electronic component manufacturing apparatus shown in FIG. 20; FIG. FIG. 11 is a schematic partial cross-sectional view of an electronic component manufacturing apparatus according to Embodiment 4; 23 is a schematic diagram for explaining the operation of the electronic component manufacturing apparatus shown in FIG. 22; FIG. FIG. 11 is a schematic partial cross-sectional view showing a modification of the electronic component manufacturing apparatus according to Embodiment 4; 25 is a schematic diagram for explaining the operation of the electronic component manufacturing apparatus shown in FIG. 24; FIG.

Embodiments of the present invention will be described below with reference to the accompanying drawings. In the drawings below, the same reference numerals are given to the corresponding parts, and the description thereof will not be repeated.

Embodiment 1.
<Configuration of electronic component manufacturing equipment>
FIG. 1 is a schematic plan view showing an electronic component manufacturing apparatus according to Embodiment 1. FIG. FIG. 2 is a schematic partial cross-sectional view of the electronic component manufacturing apparatus shown in FIG. FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG. An electronic component manufacturing apparatus according to the present embodiment will be described with reference to FIGS. 1 to 3. FIG.

1 to 3 includes a base member, a lid supply unit 14, a lid supply unit 22, a lid soldering unit 10, a package board soldering unit 19, a lid positioning unit 17, and a lid supply unit 14. , the package substrate supply unit 15 , the package substrate supply unit 13 , the mounted product recovery unit 16 , the package substrate position correction camera 18 , the movable robot that moves the lid supply unit 22 , and the lid soldering unit 10 . and a movable robot for moving the package substrate supply unit 13 are mainly provided.

The movable robot that moves the lid supply unit 22 includes an X-axis direction transport section 20 and a Y-axis direction transport section 21 . The X-axis direction transport section 20 moves the lid supply unit 22 in the X-axis direction (horizontal direction in FIG. 1). The Y-axis direction conveying unit 21 moves the X-axis direction conveying unit 20 in the Y-axis direction (vertical direction in FIG. 1). The lid supply unit 22 is connected to the transport section 20 via an elevation mechanism (not shown). Any configuration such as a fluid cylinder or a motor can be adopted as the lifting mechanism. The movable robot allows the lid supply unit 22 to move from above the lid supply section 14 to above the lid positioning unit 17 .

The movable robot for moving the lid soldering unit 10 includes an X-axis direction transfer section 8 and a Y-axis direction transfer section 9 . The X-axis direction conveying unit 8 moves the lid soldering unit 10 in the X-axis direction (horizontal direction in FIG. 1). The Y-axis direction transporter 9 moves the X-axis direction transporter 8 in the Y-axis direction. The lid soldering unit 10 is connected to the transport section 8 via an elevation mechanism (not shown). Any configuration such as a fluid cylinder or a motor can be adopted as the lifting mechanism. The movable robot allows the lid soldering unit 10 to move from above the lid positioning unit 17 to above the package substrate soldering unit 19 .

The movable robot that moves the package substrate supply unit 13 includes an X-axis direction transfer section 11 and a Y-axis direction transfer section 12 . The X-axis direction transfer unit 11 moves the package substrate supply unit 13 in the X-axis direction. The Y-axis direction transport unit 12 moves the X-axis direction transport unit 11 in the Y-axis direction. The package substrate supply unit 13 is connected to the transport section 11 via an elevation mechanism (not shown). Any configuration such as a fluid cylinder or a motor can be adopted as the lifting mechanism. The movable robot allows the package substrate supply unit 13 to move from the package substrate supply unit 15 onto the package substrate position correction camera 18 and onto the package substrate soldering unit 19 . Conventionally well-known arbitrary members such as linear guides can be used as the above-described transport units 8, 9, 11, 12, 20, and 21. FIG.

A lid supply section 14 receives a tray containing a plurality of lids 3 on which pre-coated solder is formed. The lid positioning unit 17 positions the lid 3 received from the lid supply section 14 . A package substrate supply unit 15 receives a tray containing a plurality of package substrates 2 .

Any configuration can be adopted as the lid supply unit 22 as long as the lid 3 can be transported from the lid supply unit 14 to the lid positioning unit 17 . For example, a vacuum suction device can be used as the lid supply unit 22 .

As the package substrate supply unit 13 , any configuration can be adopted as long as the package substrate 2 can be transferred from the package substrate supply unit 15 to the package substrate soldering unit 19 . For example, a vacuum suction device can be used as the package substrate supply unit 13 .

The lid soldering unit 10 transfers the lid 3 from the lid positioning unit 17 onto the package substrate soldering unit 19 . The configurations of the lid soldering unit 10 and the package substrate soldering unit 19 will be described with reference to FIGS. 2 and 3. FIG.

As shown in FIGS. 2 and 3, the lid soldering unit 10 includes a housing 34 having an opening 34a, a second holding portion 39 arranged inside the opening 34a, and an attitude adjusting portion 35. Mainly contains The posture adjusting portion 35 connects the second holding portion 39 and the housing 34 and is made of a flexible elastic body such as rubber. Since the posture adjusting portion 35 is an elastic body that can expand and contract, the posture of the second holding portion 39 with respect to the package substrate soldering unit 19 can be changed as described later.

A suction hole 26 for vacuum suction is formed in the lower surface of the second holding portion 39 . The suction hole 26 extends to the upper surface of the second holding portion 39 . A hose 37 is connected to the suction hole 26 via a joint 36 on the upper surface of the second holding portion 39 . The hose 37 extends from the inside of the housing 34 to the outside of the housing 34 through a hole formed in the upper surface of the housing 34 . Hose 37 is connected to a suction device such as a vacuum pump. In order to avoid applying a load to the second holding portion 39, the hose 37 is preferably made of a flexible material, and a flexible hose may be used as the hose 37, for example.

A heater 24 and a thermocouple 25 are arranged inside the second holding portion 39 . The heater 24 and the thermocouple 25 are arranged in a region relatively close to the lower surface of the second holding portion 39 between the upper surface and the lower surface, which are the surfaces on which the lid 3 is attracted. A plurality of suction holes 26 may be formed on the lower surface of the second holding portion 39 .

A posture adjusting portion 35 is arranged so as to connect the outer peripheral portion of the upper surface of the second holding portion 39 and a portion of the wall adjacent to the opening 34 a in the housing 34 . The posture adjusting portion 35 has an annular planar shape to connect, for example, the second holding portion 39 and the wall adjacent to the opening 34a. In FIG. 3, the outer diameter of the posture adjusting portion 35 in plan view is square. An opening for exposing the upper surface of the second holding portion 39 is formed in the posture adjusting portion 35 . The posture adjusting portion 35 is fixed to the housing 34 and the second holding portion 39 with mounting screws 38 . In the second holding portion 39 , the plurality of mounting screws 38 are arranged in a region overlapping the attitude adjusting portion 35 on the outer peripheral portion of the upper surface. In the housing 34 , the plurality of mounting screws 38 are arranged in a portion of the wall portion adjacent to the opening 34 a and in a region overlapping with a portion of the posture adjusting portion 35 . As for the material of the posture adjusting portion 35, it is desirable to use a heat-resistant silicone rubber or the like that can withstand temperatures above the melting point (220° C.) of solder.

The package substrate soldering unit 19 mainly includes a case 28 and a first holding portion 27 that is a package substrate suction stage arranged inside the case 28 . An opening into which the second holding portion 39 can be inserted is formed in the upper surface of the case 28 . A gas introduction hole 29 and a gas exhaust hole 30 are formed in the side surface of the case 28 . A pipe (not shown) may be connected to the gas introduction hole 29 . The piping may be connected to a gas supply source. An inert gas can be used as the gas. Nitrogen gas, for example, can be used as the gas. A pipe (not shown) may be connected to the gas exhaust hole 30 . The pipe may be connected to an exhaust device such as an exhaust pump. A gas such as nitrogen can be supplied to the inside of the case 28 from the gas introduction hole 29 . The supplied gas is discharged outside the case 28 through the gas exhaust hole 30 .

A suction hole 26 for vacuum suction is formed in the upper surface of the first holding portion 27 . The suction hole 26 extends to the side surface of the first holding portion 27 . A pipe (not shown) may be connected to the suction hole 26 on the side surface of the first holding portion 27 . The pipe may extend from the inside of the case 28 to the outside. The tubing may be connected to a suction device such as a vacuum pump.

A heater 24 and a thermocouple 25 are arranged inside the first holding portion 27 . The heater 24 and the thermocouple 25 are arranged in a region relatively close to the upper surface of the first holding portion 27 between the upper surface and the lower surface of the package substrate 2 . A plurality of suction holes 26 may be formed on the upper surface of the first holding portion 27 . Thermocouple 25 is used for temperature control and temperature monitoring of heater 24 . A sensor (not shown) for detecting a load applied to the package substrate 2 mounted on the upper surface is installed in the first holding portion 27 . A piezoelectric element, for example, can be used as the sensor.

<Method for manufacturing electronic components>
FIG. 4 is a flow chart for explaining the method for manufacturing an electronic component according to the first embodiment. FIG. 5 is a schematic partial cross-sectional view for explaining the method of manufacturing the electronic component shown in FIG. FIG. 6 is a schematic partial cross-sectional view for explaining the method of manufacturing the electronic component shown in FIG. FIG. 7 is a schematic partial cross-sectional view for explaining the method of manufacturing the electronic component shown in FIG. A method for manufacturing an electronic component according to the present embodiment will be described with reference to FIGS. 1 to 7. FIG.

First, a tray containing a plurality of lids 3 precoated with solder 4 (see FIG. 2) is put into the lid supply section 14 . Also, a tray containing a plurality of package substrates 2 is put into the package substrate supply section 15 .

Next, the lid supply unit 22 conveys the lid 3 arranged in the tray of the lid supply section 14 to the lid positioning unit 17 . Although details of the lid positioning unit 17 are not shown, for example, the lid positioning unit 17 has a reference plate having a first reference surface to be in contact with one side of the lid 3 and a second reference surface perpendicular to the first reference surface. can be used as The lid 3 can be mechanically positioned by pressing the lid 3 against the reference plate so that the two sides of the lid 3 are in contact with the first reference surface and the second reference surface of the reference plate. .

Next, the package board supply unit 13 conveys the package board 2 arranged in the tray of the package board supply unit 15 onto the package board position correction camera 18 . The package substrate position correcting camera 18 measures the absolute position of the package substrate 2 held by the package substrate supply unit 13 . As the information indicating the absolute position of the package substrate 2, for example, information such as the X and Y coordinates of the corners on the outer periphery of the package substrate 2 can be used.

Thereafter, the package substrate supply unit 13 conveys the package substrate 2 from the package substrate position correcting camera 18 onto the first holding portion 27 of the package substrate soldering unit 19 . The information indicating the absolute position of the package substrate 2 described above is used for correcting the position of the package substrate 2 mounted on the upper surface of the first holding portion 27 and for mounting the lid 3 at an accurate position on the surface of the package substrate 2. used for

Next, as shown in FIG. 4, a package substrate suction step (S11) is performed. In this step ( S<b>11 ), the first holding portion 27 vacuum-sucks the package substrate 2 . Specifically, by sucking the gas from between the package substrate 2 and the upper surface of the first holding portion 27 through the suction holes 26 of the first holding portion 27 , the package substrate 2 is attached to the upper surface of the first holding portion 27 . to be adsorbed.

Next, a step (S12) of preheating the package substrate 2 with a heater is performed. In this step ( S<b>12 ), the package substrate 2 is preheated by operating the heater 24 of the first holding portion 27 . The heating temperature of the package substrate 2 at this time is set to a temperature equal to or lower than the melting temperature (for example, 210° C.) of the solder 4 .

Next, the step of sucking the lid (S21) is performed. In this step ( S<b>21 ), the lid soldering unit 10 vacuum-sucks the lid 3 placed on the lid positioning unit 17 . Specifically, gas is sucked from between the lid 3 and the lower surface of the second holding portion 39 through the suction holes 26 of the second holding portion 39 , whereby the lid 3 is attracted to the lower surface of the second holding portion 39 . do.

Next, a step of preheating the lid 3 with a heater (S22) is performed. In this step ( S<b>22 ), the lid 3 is preheated by operating the heater 24 of the second holding portion 39 . The heating temperature of the lid 3 at this time is set to a temperature equal to or lower than the melting temperature of the solder 4, similarly to the heating temperature of the package substrate 2 in step (S12).

Next, by moving the lid soldering unit 10, the step (S23) of moving the lid 3 to the upper part of the package substrate soldering unit 19 is performed.

Next, the step of lowering the lid soldering unit 10 toward the package substrate soldering unit 19 (S24) is performed. In this step ( S<b>24 ), the lid soldering unit 10 is lowered until the solder 4 placed on the surface of the lid 3 held by the lid soldering unit 10 contacts the surface of the package substrate 2 .

Next, a step (S31) of detecting an increase in the load on the package substrate 2 by a sensor such as a piezoelectric element is performed. In this step ( S<b>31 ), it is detected that the load on the package substrate 2 has increased due to the lid 3 coming into contact with the package substrate 2 via the solder 4 . As a result, it can be confirmed that the lid 3 is in contact with the package substrate 2 via the solder 4 . When the load increase is detected as described above, the lowering of the lid soldering unit 10 is stopped.

Here, in the step (S21) described above, the lid 3 is attracted to the second holding portion 39 while the foreign object 31 is sandwiched between the lower surface of the second holding portion 39 and the lid 3 as shown in FIG. Consider the case of In this case, the surface (bonding surface) of the lid 3 on which the solder 4 is arranged is inclined with respect to the lower surface of the second holding portion 39 as shown in FIG. In this state, when the lid 3 contacts the package substrate 2 through the solder 4 as in step (S31), as shown in FIG. Transform into As a result, the posture of the second holding portion 39 is changed such that the bonding surface of the lid 3 is substantially parallel to the surface of the package substrate 2 . In this way, even if the foreign matter 31 exists, the state in which the entire solder 4 of the lid 3 is in contact with the surface of the package substrate 2 can be achieved.

Moreover, as shown in FIG. 7, even if the thickness of the package substrate 2 is not uniform and the surface of the package substrate 2 to which the lid 3 is to be soldered is inclined with respect to the surface of the first holding portion 27. By partially deforming the posture adjusting portion 35 , a state in which the entire solder 4 of the lid 3 is in contact with the surface of the package substrate 2 can be realized.

Next, the step of heating the heater (S32) is performed. In this step ( S<b>32 ), the heaters 24 of the second holding portion 39 as the lid suction stage and the first holding portion 27 as the package substrate suction stage are operated to heat the lid 3 and the package substrate 2 above the melting point of the solder 4 . to a temperature of The heating temperature is, for example, 220° C. or higher. At this time, nitrogen gas, which is an example of an inert gas, is introduced into the case 28 through the gas introduction hole 29 . The interior of the case 28 is preferably filled with nitrogen gas. In this state, heating is continued for a preset retention time required for the solder to wet and spread. Thus, the soldering step (S33) is performed in the nitrogen gas atmosphere.

Next, a cooling step (S34) is performed. In this step (S34), the amount of heat generated by the heater 24 is reduced or the operation of the heater 24 is stopped to lower the temperature of the lid 3 and the package substrate 2 to the melting point of the solder 4 or less. This state is maintained until the temperature of the solder 4 that was melted in the steps (S33, S34) drops and the solder 4 solidifies. Thus, the soldering of the lid 3 and the package substrate 2 is completed.

Next, the step of releasing the adsorption of the lid 3 (S41) is performed. In this step ( S<b>41 ), the vacuum suction of the lid 3 to the second holding portion 39 is stopped so that the second holding portion 39 can be removed from the lid 3 .

Next, the step (S42) of raising the lid soldering unit 10 is performed. In this step ( S<b>42 ), the lid soldering unit 10 is raised in a direction away from the package substrate soldering unit 19 .

Next, the step of releasing the adsorption of the package substrate (S51) is performed. In this step ( S<b>51 ), vacuum suction of the package substrate 2 to the first holding portion 27 is stopped, and the package substrate 2 to which the lid 3 is connected from the first holding portion 27 is put into a detachable state.

Next, a step (S52) of moving the package substrate 2, to which the lid 3, which is a mounted product, is connected to the mounted product collection unit 16, is carried out. In this step ( S<b>52 ), the package board supply unit 13 conveys the package board 2 to which the lid 3 as an electronic component is connected from the first holding section 27 to the mounted product collecting section 16 . Thus, the electronic component 1 can be obtained.

<Structure of Electronic Components>
FIG. 8 is a schematic diagram of an electronic component manufactured by the electronic component manufacturing method shown in FIG. The upper diagram in FIG. 8 shows a schematic plan view of the electronic component 1 . The lower diagram in FIG. 8 shows a schematic side view of the electronic component 1 . FIG. 9 is a schematic cross-sectional view along line segment IX-IX in FIG. The electronic component 1 obtained by the above-described electronic component manufacturing method may be a high-frequency electronic component used in, for example, communication equipment, radar, and the like.

As shown in FIGS. 8 and 9, electronic component 1 mainly includes package substrate 2 and lid 3 . A semiconductor element 5 is mounted on the surface of the package substrate 2 . The semiconductor element 5 is connected by bonding wires 6 to a wiring layer made of a conductor formed on the surface of the package substrate 2 .

Semiconductor device 5 is a high-frequency device used in, for example, communication equipment, radar, and the like. In this case, the semiconductor element 5 of the electronic component 1 is required to block leakage and interference of electromagnetic waves. Therefore, it is necessary to protect the semiconductor element 5 with the lid 3 . The lid 3 is made of metal such as Kovar, for example. As means for joining the package substrate 2 and the lid 3, for example, solder mounting can be used as described above. In this case, as described in the electronic component manufacturing method shown in FIG. Also, on the package substrate 2, a metal that is easily wetted by the solder 4 is formed in a region to which the solder 4 is to be connected. 4, the solder 4 is melted and the lid 3 and the package substrate 2 are soldered together. As a result, the entire outer peripheral portion of the lid 3 is joined to the package substrate 2 by the solder 4 .

<Effect>
A manufacturing apparatus 7 for an electronic component 1 according to the present disclosure includes a first holding section 27 , a second holding section 39 , a moving section 71 and an attitude adjusting section 35 . The electronic component 1 is obtained by joining a package substrate 2 and a lid 3 . The first holding portion 27 holds the package substrate 2 . The second holding portion 39 holds the lid 3 . The moving portion 71 moves either the first holding portion 27 or the second holding portion 39 so that the package substrate 2 held by the first holding portion 27 and the lid 3 held by the second holding portion 39 are in contact with each other. move one. The attitude adjusting section 35 changes the relative attitude of the lid 3 held by the second holding section 39 with respect to the package substrate 2 held by the first holding section 27 .

Here, as described in the steps (S31) to (S33) shown in FIG. think. At this time, the posture in which the package substrate 2 is held by the first holding portion 27 as shown in FIGS. Even if the posture is deviated from the assumed posture, the relative posture of the lid 3 with respect to the package substrate 2 can be changed by the posture adjusting section 35 . As a result, the posture of the package substrate 2 or the lid 3 can be changed by the posture adjustment unit 35 so as to cancel the deviation of the posture described above. can be brought into contact with the package substrate 2. Therefore, when the lid 3 is soldered to the package substrate 2 , the entire bonding surface can be bonded to the package substrate 2 via the solder 4 .

In the electronic component manufacturing apparatus 7 , the attitude adjustment section 35 changes the attitude of the second holding section 39 with respect to the first holding section 27 . In this case, the posture of the lid 3 with respect to the package substrate 2 can be changed by changing the posture of the second holding portion 39 by the posture adjusting portion 35 .

In the electronic component manufacturing apparatus 7 described above, the attitude adjusting section 35 includes an elastic body. In this case, if an elastic body serving as the posture adjustment part 35 is arranged at the connecting part that connects the first holding part 27 or the second holding part 39 to another member such as the housing 34 or the case 28, the elastic force of the elastic body can be used to easily change the posture of the first holding portion 27 or the second holding portion 39 . Therefore, the configuration of the manufacturing apparatus 7 can be simplified as compared with the case where an electric actuator or the like is used as the posture adjusting section 35 .

In the electronic component manufacturing apparatus 7, the elastic body is made of resin. In this case, the characteristics of the posture adjusting section 35 can be changed by changing the type and size of the resin.

In the method of manufacturing an electronic component according to the present disclosure, the step of holding the package substrate 2 on the first holding portion 27 (S11), the step of holding the lid 3 on the second holding portion 39 (S21), and the step of moving (S23, S24) and a joining step (S32, S33, S34). In the step of moving (S23, S24, S31), the first holding portion 27 is moved so that the package substrate 2 held by the first holding portion 27 and the lid 3 held by the second holding portion 39 are in contact via the solder 4. Either one of the holding portion 27 and the second holding portion 39 is moved. In the joining step (S32, S33, S34), the package substrate 2 and the lid 3 are joined by the solder 4 by heating and melting the solder 4 in contact with the package substrate 2 and the lid 3 . In the moving steps (S23, S24, S31), the relative posture of the lid 3 held by the second holding portion 39 with respect to the package substrate 2 held by the first holding portion 27 can be changed.

Here, in the moving step (S23, S24, S31), the package substrate 2 is moved to the first position while the lid 3 is in contact with the package substrate 2 in order to bond the lid 3 to the package substrate 2. Consider a case where the posture held by the holding portion 27 or the posture held by the second holding portion 39 of the lid 3 deviates from the posture assumed at the time of designing the manufacturing apparatus 7 . At this time, when the package substrate 2 and the lid 3 are in contact with each other through the solder 4, the relative posture of the lid 3 with respect to the package substrate 2 can be changed. As a result, by changing the posture of the package substrate 2 or the lid 3 so as to cancel out the above-described deviation of the posture, the entire bonding surface of the lid 3 to be connected to the package substrate 2 can be transferred to the package substrate 2 via the solder 4 . can be contacted. Therefore, when the lid 3 is solder-bonded to the package substrate 2 in the bonding step (S32, S33, S34), the entire bonding surface of the lid 3 is bonded to the package substrate 2 via the solder 4. can be

Here, the effect of the electronic component manufacturing apparatus and manufacturing method according to the present embodiment described above will be described in detail by comparing with a comparative example. 10 and 11 are schematic cross-sectional views for explaining the operation of the comparative example of the electronic component manufacturing apparatus. 12 to 14 are schematic cross-sectional views for explaining problems in the comparative example of the electronic component manufacturing apparatus. 10 shows a process corresponding to the process (S24) in FIG. 4, and FIG. 11 shows a process corresponding to the process (S31) in FIG. In the comparative example of the electronic component manufacturing apparatus shown in FIGS. 10 to 14, since the posture adjusting portion 35 is not provided, the posture of the second holding portion 123 with respect to the first holding portion 27 is fixed. As shown in FIGS. 10 and 11, if the lid 3 is vacuum-sucked in the correct posture on the second holding portion 123 without any foreign matter intervening, the lid 3 can be held even in the comparative example of the electronic component manufacturing apparatus. The entire solder 4 can be brought into contact with the surface of the package substrate 2 .

However, as shown in FIG. 12, when a foreign object 31 is caught between the lid 3 and the second holding portion 123, the lid 3 is placed against the package substrate 2 in the comparative example of the electronic component manufacturing apparatus. The lid 3 is tilted, and only a part of the solder 4 of the lid 3 is in contact with the surface of the package substrate 2 . In other words, a gap 33 is formed between the solder 4 of the lid 3 and the surface of the package substrate 2 . As a result, a part of the joint between the lid 3 and the package substrate 2 is not soldered.

In addition, as shown in FIG. 13, when a foreign object 31 is caught between the package substrate 2 and the first holding portion 27, the package substrate 2 is placed against the lid 3 in the comparative example of the electronic component manufacturing apparatus. As in the case of FIG. 12, only a part of the solder 4 of the lid 3 is in contact with the surface of the package substrate 2 . As a result, a part of the joint between the lid 3 and the package substrate 2 is not soldered.

Also, as shown in FIG. 14, when the thickness of the package substrate 2 is uneven and the upper surface of the package substrate 2 is tilted with respect to the lid 3, the lid 3 and the lid 3 can be arranged in the same manner as in FIG. At the junction with the package substrate 2, there is a part that is not soldered.

In the comparative example, solder joint failure between the lid 3 and the package substrate 2 occurs due to the presence of the foreign matter 31 and the shape defect of the package substrate 2 as described above. However, in the electronic component manufacturing apparatus and manufacturing method according to the present embodiment, since the manufacturing apparatus includes the attitude adjusting unit 35, the relative attitude of the lid 3 with respect to the package substrate 2 can be changed as described above. , the entire solder 4 of the lid 3 can be brought into contact with the surface of the package substrate 2 . As a result, it is possible to suppress the occurrence of solder joint defects as described above in the electronic component.

Embodiment 2.
<Configuration of electronic component manufacturing equipment>
FIG. 15 is a schematic partial cross-sectional view of the electronic component manufacturing apparatus according to the second embodiment. 15 shows only the lid soldering unit 10 in the electronic component manufacturing apparatus. The electronic component manufacturing apparatus shown in FIG. 15 basically has the same configuration as the electronic component manufacturing apparatus shown in FIGS. It is different from the electronic component manufacturing equipment shown. Specifically, in the electronic component manufacturing apparatus shown in FIG. 15, the internal space 42 in the housing 34 of the lid soldering unit 10 is a closed space isolated from the outside. Instead of the hose 37 shown in FIG. 2, an inner hose 54, joints 56, 57 and an outer hose 44 are used in FIG. The joint 57 is arranged so as to block the opening for the hose formed in the portion of the outer wall facing the opening 34a of the housing 34 from the inner space 42 side. The internal hose 54 is arranged to connect the joint 36 of the second holding portion 39 and the joint 57 . The inner hose 54 has a length sufficiently longer than the distance between the joints 36 and 57 . Therefore, the internal hose 54 has a bent shape inside the internal space 42 . As a result, even when the posture of the second holding portion 43 changes, the inner hose 54 does not hinder the movement of the second holding portion 43 due to insufficient length of the inner hose 54 . A joint 56 is connected to the tip of the external hose 44 . Joint 56 is connected to joint 57 . The end of the external hose 44 opposite to the end to which the joint 56 is connected is connected to a suction device such as a vacuum pump.

Further, in the lid soldering unit 10 shown in FIG. 15, a pressure hose 41 is connected to the internal space 42 of the housing 34 for supplying pressure gas. The distal end of the pressure hose 41 is connected to a joint 58 arranged to close the pressure hose opening formed in the outer wall of the housing 34 . The end of the pressurization hose 41 opposite to the tip connected to the joint 58 is connected to a supply section 72 for supplying pressurization gas to the internal space 42 . For example, a pump or the like can be used as supply unit 72 . The pressurizing hose 41 has a state in which gas is supplied to the internal space 42 and a pressurized state is maintained, and a state in which the gas is discharged from the internal space 42 and the pressure inside the internal space 42 is lowered to atmospheric pressure. A switching valve (not shown) is connected in order to switch between . The switching valve can switch between the two states described above in response to a control signal from a control unit (not shown). Any conventionally known configuration can be adopted as the configuration of the switching valve.

In the lid soldering unit 10 shown in FIG. 15, a measuring section 73 for measuring the pressure in the internal space 42 of the housing 34 is arranged. Any conventionally known device can be employed as the measurement unit 73 .

<Method for manufacturing electronic components>
FIG. 16 is a flow chart for explaining the method for manufacturing an electronic component according to the second embodiment. The electronic component manufacturing method shown in FIG. 16 is basically the same as the electronic component manufacturing method shown in FIG. In addition, the step of detecting the pressure in the internal space 42 (S25), the step of detecting the pressure in the internal space 42 after soldering (S43), and the step of opening the internal space 42 to the atmosphere (S44) are the points shown in FIG. It is different from the manufacturing method of the electronic parts shown in . This will be explained below.

As shown in FIG. 16, step (S11), step (S12), step (S21) to step (S23) are performed, and then step (S25) is performed. In this step ( S<b>25 ), pressurizing gas is introduced into the internal space 42 of the housing 34 through the pressurizing hose 41 . Air can be used as the gas for pressurization. Then, the pressure in the internal space 42 is detected by the measurement unit 73, and the supply of the gas is stopped when the pressure reaches a predetermined reference value. After that, the switching valve connected to the pressure hose 41 is operated to maintain the state in which the internal space 42 is pressurized. In this state, the measurement unit 73 monitors pressure fluctuations in the internal space 42 .

By monitoring the pressure, the amount of gas leaking from the internal space 42 can be estimated. If the leak amount is large (that is, if the rate of pressure decrease in the internal space 42 is greater than a predetermined reference value), it is conceivable that a defect such as a crack has occurred in the attitude adjustment section 35 . In such a case, it is difficult to uniformly press the lid 3 against the package substrate 2 in the soldering steps of steps (S31) to (S34), and the possibility of soldering failures increases. Therefore, when the amount of leakage is large as described above, the process is interrupted to inspect the attitude adjustment unit 35 and the like, and repair the attitude adjustment unit 35 and the like if necessary.

On the other hand, if the amount of leakage from the internal space 42 is sufficiently small as a result of the above monitoring, the next steps, step (S24), step (S31) to step (S34), step (S41), and step (S42) are carried out. do.

After that, the step of detecting the pressure in the internal space 42 of the housing 34 (S43) is performed. In this step ( S<b>43 ), the pressure in the internal space 42 is measured by the measuring section 73 . The measured result is compared with the pressure data measured in the step (S25). For example, the difference between the pressure data measured in step (S25) and the pressure data measured in step (S43) is calculated, and it is confirmed whether or not the difference is smaller than a preset reference value. If the difference is smaller than the reference value, it can be seen that the lid soldering unit 10 has no equipment defects and the pressure in the internal space 42 hardly fluctuates. As a result, it can be seen that there was no problem-causing variation in the force pressing the lid 3 against the package substrate 2 during soldering. Note that this step (S43) may be performed each time one electronic component is manufactured, or may be performed each time the manufacture of a plurality of electronic components is completed. For example, step (S25) and step (S43) may be performed at the start and end of production of electronic components in one day.

Thereafter, steps (S51) and (S52) are performed in the same manner as in the manufacturing method shown in FIG. In this manner, an electronic component can be manufactured using the electronic component manufacturing apparatus shown in FIG.

<Effect>
In the electronic component manufacturing apparatus 7 , the attitude adjustment section 35 changes the attitude of the second holding section 43 with respect to the first holding section 27 . The electronic component manufacturing apparatus 7 further includes a housing 34 for supporting the second holding portion 43 . Housing 34 includes an outer wall surrounding an interior space 42 . An opening 34a is formed in the outer wall. The second holding portion 43 is arranged in the opening portion 34a. Posture adjustment section 35 includes an elastic body. The elastic body connects the second holding portion 43 and the outer wall so as to close the opening 34a. The electronic component manufacturing apparatus 7 further includes a supply section 72 and a measurement section 73 . The supply unit 72 supplies gas to the internal space 42 . The measuring section 73 measures the pressure in the internal space 42 .

In this case, the posture of the lid 3 held by the second holding portion 43 with respect to the package substrate 2 can be changed by changing the posture of the second holding portion 43 by the posture adjusting portion 35 . Further, gas is supplied to the inner space 42 of the housing 34 by the supply part 72 to make the pressure in the inner space 42 higher than the atmospheric pressure, thereby bringing the lid 3 held by the second holding part 43 into contact with the package substrate 2. Sometimes the lid 3 can be pressed against the package substrate 2 . As a result, the posture of the second holding portion 43 can be changed by deforming the elastic body so that the posture of the lid 3 follows the posture of the package substrate 2 .

In the method of manufacturing the electronic component described above, in the moving steps (S23, S24, S31), the pressure for pressing the lid 3 toward the package substrate 2 via the solder 4 is generated by the gas pressing the second holding portion 43. I am letting The electronic component manufacturing method further includes the steps of measuring the pressure of the gas (S25, S43).

In this case, the lid 3 can be reliably pressed against the package substrate 2 by making the pressure of the gas that presses the second holding portion 43 higher than the atmospheric pressure. As a result, the posture of the second holding portion 43 can be changed so that the posture of the lid 3 follows the posture of the package substrate 2 . In addition, for example, before and after the bonding steps (S32, S33, S34), by measuring the pressure of the gas, it is confirmed that the pressure of the gas has not decreased unexpectedly, that is, that no abnormality has occurred. can. Therefore, it can be determined whether or not the lid 3 is pressed against the package substrate 2 with a sufficient pressure in the bonding steps (S32, S33, S34).

Embodiment 3.
<Structure and Operation of Electronic Component Manufacturing Equipment>
17 is a schematic partial cross-sectional view of an electronic component manufacturing apparatus according to Embodiment 3. FIG. FIG. 18 is a schematic diagram for explaining the operation of the electronic component manufacturing apparatus shown in FIG. 17 and 18 show only the lid soldering unit 10 in the electronic component manufacturing apparatus.

The electronic component manufacturing apparatus shown in FIGS. 17 and 18 basically has the same configuration as the electronic component manufacturing apparatus shown in FIGS. 1 is different from the electronic component manufacturing apparatus shown in FIGS. Specifically, a posture adjusting portion 45 made of an elastic body is arranged on the upper surface of the second holding portion 39 of the lid soldering unit 10 . A housing 34 is arranged on the attitude adjusting portion 45 . The attitude adjusting portion 45 connects the second holding portion 39 and the housing 34 . Although the shape of the housing 34 can be any shape, it is plate-like, for example. The posture adjusting portion 45 is configured to change the posture of the second holding portion 39 with respect to the housing 34 . Posture adjusting portion 45 may be made of resin such as flexible rubber, for example. In this case, as shown in FIG. 18 , the second holding portion 39 can be tilted with respect to the housing 34 by locally contracting the posture adjusting portion 45 . 6 and 7, the posture of the second holding portion 39 can be changed so that the lid 3 sucked by the second holding portion 39 follows the surface of the package substrate 2. .

<Effect>
In the above-described electronic component manufacturing apparatus, by using an elastic body such as flexible rubber as the posture adjusting portion 45, the same effect as in the first embodiment can be obtained.

<Structure and effect of modification>
FIG. 19 is a schematic partial cross-sectional view showing a first modification of the electronic component manufacturing apparatus according to the third embodiment. FIG. 20 is a schematic partial cross-sectional view showing a second modification of the electronic component manufacturing apparatus according to the third embodiment. FIG. 21 is a schematic diagram for explaining the operation of the electronic component manufacturing apparatus shown in FIG. 19 and 20 correspond to FIG. 17, and FIG. 21 corresponds to FIG.

The electronic component manufacturing apparatus shown in FIG. 19 basically has the same configuration as the electronic component manufacturing apparatus shown in FIGS. It is different from the electronic component manufacturing equipment shown in . Specifically, an attitude adjusting portion 45 partially made of an elastic body is arranged on the upper surface of the second holding portion 39 of the lid soldering unit 10 . A plurality of posture adjusting portions 45 may be discretely arranged on the upper surface of the second holding portion 39 . Alternatively, the posture adjusting portion 45 may be arranged in an annular shape on the upper surface of the second holding portion 39 in a region along the outer peripheral portion. Moreover, the planar shape of the posture adjusting portion 45 may be an annular shape along the outer circumference of the second holding portion 39 . With such a configuration, the same effects as those of the electronic component manufacturing apparatus shown in FIGS. 17 and 18 can be obtained.

The electronic component manufacturing apparatus shown in FIGS. 20 and 21 basically has the same configuration as the electronic component manufacturing apparatus shown in FIGS. 1 is different from the electronic component manufacturing apparatus shown in FIGS. Specifically, an attitude adjusting portion 46 made of a compression coil spring as an elastic body is partially arranged on the upper surface of the second holding portion 39 of the lid soldering unit 10 . In this manner, a plurality of posture adjusting portions 46 made of springs may be discretely arranged on the upper surface of the second holding portion 39 . Alternatively, the posture adjusting portion 46 may be arranged on the upper surface of the second holding portion 39 along a region along the outer peripheral portion.

To summarize the characteristic configuration of the electronic component manufacturing apparatus described above, in the electronic component manufacturing apparatus 7, the elastic body constituting the posture adjusting section 46 is a spring. Also in this case, the same effects as those of the electronic component manufacturing apparatus shown in FIGS. 17 and 18 can be obtained. Furthermore, by appropriately selecting springs having different characteristics such as spring constants and using them as elastic bodies, the characteristics of the posture adjusting section 46 can be changed.

Embodiment 4.
<Structure and Operation of Electronic Component Manufacturing Equipment>
22 is a schematic partial cross-sectional view of an electronic component manufacturing apparatus according to Embodiment 4. FIG. FIG. 23 is a schematic diagram for explaining the operation of the electronic component manufacturing apparatus shown in FIG. 22 and 23 show only the lid soldering unit 10 and the package substrate soldering unit 19. FIG. 22 corresponds to FIG. 5 and FIG. 23 corresponds to FIG.

The electronic component manufacturing apparatus shown in FIGS. 22 and 23 basically has the same configuration as the electronic component manufacturing apparatus shown in FIGS. The configuration of the unit 19 is different from that of the electronic component manufacturing apparatus shown in FIGS. Specifically, the lid soldering unit 10 does not have the housing 34 as shown in FIGS. 2 and 5, and the second holding portion 123 is directly connected to the moving portion (see FIG. 5). Also, in the package substrate soldering unit 19 , the posture adjusting portion 65 made of an elastic body is arranged on the lower surface of the first holding portion 67 . The posture adjusting portion 65 connects the inner surface of the case 28 and the first holding portion 67 . The posture adjusting portion 65 is arranged to cover most of the lower surface of the first holding portion 67, but is arranged to partially cover the lower surface of the first holding portion 67 as shown in FIG. good too.

In this case, as shown in FIG. 23 , the first holding portion 67 can be tilted with respect to the case 28 by locally contracting the posture adjusting portion 65 . In this way, the posture of the first holding portion 67 can be changed so that the package substrate 2 sucked by the first holding portion 67 is aligned with the bonding surface of the lid 3 on which the solder 4 is arranged.

<Effect>
In the electronic component manufacturing apparatus 7 , the attitude adjustment section 65 changes the attitude of the first holding section 67 with respect to the second holding section 123 . In this case, the posture of the package substrate 2 with respect to the lid 3 can be changed by changing the posture of the first holding portion 67 using the posture adjusting portion 65 . As a result, effects similar to those of the first embodiment can be obtained.

<Structure and effect of modification>
FIG. 24 is a schematic partial cross-sectional view showing a modification of the electronic component manufacturing apparatus according to the fourth embodiment. FIG. 25 is a schematic diagram for explaining the operation of the electronic component manufacturing apparatus shown in FIG.

The electronic component manufacturing apparatus shown in FIGS. 24 and 25 basically has the same configuration as the electronic component manufacturing apparatus shown in FIGS. 22 and 23 are different from the electronic component manufacturing apparatus shown in FIG. Specifically, an attitude adjusting portion 66 made of a compression coil spring as an elastic body is partially arranged on the lower surface of the first holding portion 67 of the package board soldering unit 19 . In this manner, a plurality of posture adjusting portions 66 made of springs may be discretely arranged on the lower surface of the first holding portion 67 . Alternatively, the posture adjusting portion 66 may be arranged on the lower surface of the first holding portion 67 along a region along the outer peripheral portion.

To summarize the characteristic configuration of the electronic component manufacturing apparatus described above, in the electronic component manufacturing apparatus 7, the elastic body constituting the posture adjusting section 66 is a spring. Also in this case, the same effects as those of the electronic component manufacturing apparatus shown in FIGS. 22 and 23 can be obtained. Furthermore, by appropriately selecting springs having different characteristics such as spring constants and using them as elastic bodies constituting the attitude adjustment section 66, the characteristics of the attitude adjustment section 66 can be changed.

In addition, in each embodiment described above, an elastic body is used as the posture adjusting portion, but any other configuration can be adopted as the posture adjusting portion as long as the posture of the first holding portion 27 or the second holding portion 39 can be changed. For example, a mechanical joint such as a universal joint may be used as the posture adjusting section in each of the above-described embodiments.

Although the embodiment of the present invention has been described as above, it should be considered that the embodiment disclosed this time is illustrative in all respects and is not restrictive. The scope of the present invention is indicated by the claims, and is intended to include all changes within the meaning and range of equivalents to the claims.

1 Electronic component 2 Package substrate 3 Lid 4 Solder 5 Semiconductor element 6 Bonding wire 7 Manufacturing device 8, 9, 11, 12, 20, 21 Transfer unit 10 Lid soldering unit 13 Package substrate supply unit, 14 lid supply unit, 15 package substrate supply unit, 16 mounted product recovery unit, 17 lid positioning unit, 18 package substrate position correction camera, 19 package substrate soldering unit, 22 lid supply unit, 24 heater, 25 thermocouple , 26 suction hole, 27, 67 first holding portion, 28 case, 29 gas introduction hole, 30 gas exhaust hole, 31 foreign matter, 33 gap, 34 housing, 34a opening, 35, 45, 46, 65, 66 attitude adjustment Parts 36, 56, 57, 58 Coupling 37 Hose 38 Mounting screw 39, 43, 123 Second holding part 41 Pressure hose 42 Internal space 44 External hose 54 Internal hose 71 Moving part 72 feeding section, 73 measuring section;

Claims (8)

An electronic component manufacturing apparatus in which a package substrate and a lid are joined,
a first holding portion that holds the package substrate;
a second holding portion that holds the lid;
moving one of the first holding portion and the second holding portion such that the package substrate held by the first holding portion and the lid held by the second holding portion are in contact with each other; Department and
an attitude adjustment unit that changes a relative attitude of the lid held by the second holding unit with respect to the package substrate held by the first holding unit ;
The electronic component manufacturing apparatus, wherein the posture adjusting unit includes an elastic body . 2. The electronic component manufacturing apparatus according to claim 1, wherein said posture adjusting section changes the posture of said second holding portion with respect to said first holding portion. 2. The electronic component manufacturing apparatus according to claim 1, wherein said attitude adjusting section changes the attitude of said first holding section with respect to said second holding section. 2. The electronic component manufacturing apparatus according to claim 1 , wherein said elastic body is made of resin. 2. The electronic component manufacturing apparatus according to claim 1 , wherein said elastic body is a spring. The attitude adjusting section changes the attitude of the second holding section with respect to the first holding section, and
A housing for supporting the second holding part,
the housing includes an outer wall surrounding an interior space;
An opening is formed in the outer wall,
The second holding part is arranged in the opening,
The posture adjustment section includes an elastic body that connects the second holding section and the outer wall so as to close the opening, and
a supply unit that supplies gas to the internal space;
2. The electronic component manufacturing apparatus according to claim 1, further comprising a measuring unit that measures the pressure in said internal space. holding the package substrate on the first holding part;
holding the lid on the second holding portion;
Either one of the first holding portion and the second holding portion is held so that the package substrate held by the first holding portion and the lid held by the second holding portion are in contact via solder. a step of moving the
a step of heating and melting the solder in contact with the package substrate and the lid to join the package substrate and the lid with the solder;
In the moving step, an attitude adjusting portion including an elastic body can change the relative attitude of the lid held by the second holding portion with respect to the package substrate held by the first holding portion. A method of manufacturing an electronic component. In the moving step, a pressure for pressing the lid toward the package substrate through the solder is generated by a gas pressing the second holding portion,
8. The method of manufacturing an electronic component according to claim 7 , further comprising the step of measuring the pressure of said gas.

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