JP7326788B2 - Coil component and its manufacturing method - Google Patents

Description

The present invention relates to a coil component and its manufacturing method, and more particularly to a coil component having a structure in which a planar spiral coil pattern is covered with a magnetic element and its manufacturing method.

A chip-type coil component having a spiral coil pattern is sometimes covered with a magnetic element to increase inductance. For example, Patent Literatures 1 and 2 disclose a coil component having a structure in which a spiral coil pattern is covered with a magnetic element.

However, the material forming the magnetic body has insufficient insulating properties compared to resin materials and the like. For this reason, instead of directly covering the coil pattern with a magnetic element, a structure is adopted in which the coil pattern is covered with an interlayer insulating film made of a resin material, and the surface is further covered with a magnetic element.

JP 2017-183529 A JP 2017-11185 A

However, since the resin material generally has a larger coefficient of thermal expansion than the magnetic element, there is a problem that peeling is likely to occur at the interface between the interlayer insulating film and the magnetic element.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to prevent peeling at the interface between an interlayer insulating film and a magnetic element in a coil component having a structure in which a spiral coil pattern is covered with a magnetic element. Another object of the present invention is to provide a method for manufacturing such a coil component.

A coil component according to the present invention comprises a spirally wound coil pattern, a first interlayer insulating film covering the lower surface of the coil pattern, a second interlayer insulating film covering the upper surface of the coil pattern, and a first interlayer insulating film covering the upper surface of the coil pattern. A first magnetic body embedded with an insulating film and a second magnetic body embedded with a coil pattern and a second interlayer insulating film, wherein the first magnetic body is an interface with the second magnetic body The interface with the first interlayer insulating film has a recessed shape.

According to the present invention, since the first interlayer insulating film has a structure embedded in the first magnetic element, the contact area between the first interlayer insulating film and the first magnetic element increases. do. As a result, peeling is less likely to occur at the interface between the first interlayer insulating film and the first magnetic element.

In the present invention, the first magnetic element and the second magnetic element may be in contact at least in the outer region of the coil pattern. According to this, the magnetic resistance in the outer region of the coil pattern can be reduced. Furthermore, the first magnetic element and the second magnetic element may be in contact with each other in the inner diameter region of the coil pattern. According to this, a closed magnetic circuit can be formed by the first and second magnetic bodies. In this case, the interface between the first and second magnetic bodies in the inner diameter region of the coil pattern may be curved.

In the present invention, the first and second magnetic bodies may be made of the same magnetic resin material. Even in this case, if the first magnetic body and the second magnetic body are formed in different steps and hardened in different steps, the interface between the two can be confirmed.

A method of manufacturing a coil component according to the present invention forms a spirally wound coil pattern, forms a first sacrificial pattern in an inner diameter region of the coil pattern, and forms a second sacrificial pattern in an outer region of the coil pattern. a first step of forming, a second step of forming a first interlayer insulating film covering the coil pattern, the first sacrificial pattern and the second sacrificial pattern, and a first interlayer insulating film along the coil pattern. and a first magnetic element covering the coil pattern through the first interlayer insulating film and covering the first and second sacrificial patterns without the first interlayer insulating film. a fourth step of forming; a fifth step of forming a space in the inner diameter region and the outer region of the coil pattern by removing the first and second sacrificial patterns; and forming a second magnetic element in the space. and a sixth step of forming.

According to the present invention, after patterning the first interlayer insulating film, the first magnetic element covering the first interlayer insulating film is formed. It is possible to obtain a structure embedded in the body. As a result, since the contact area between the first interlayer insulating film and the first magnetic element is increased, peeling at the interface between the two is less likely to occur.

As described above, according to the present invention, in a coil component having a structure in which a spiral coil pattern is covered with a magnetic element, it is possible to prevent peeling at the interface between the interlayer insulating film and the magnetic element. Moreover, according to the present invention, it is possible to provide a method for manufacturing such a coil component.

FIG. 1 is a schematic perspective view showing the appearance of a coil component 1 according to a first embodiment of the invention. FIG. 2 is a side view showing a state in which the coil component 1 is mounted on the circuit board 80, viewed from the stacking direction. FIG. 3 is a cross-sectional view of the coil component 1, showing a cross section where the external terminals E1 and E2 appear. FIG. 4 is a cross-sectional view of the coil component 1, showing a cross section in which the external terminals E1 and E2 do not appear. FIG. 5 is a process diagram for explaining the method of manufacturing the coil component 1. FIG. FIG. 6 is a process chart for explaining the method of manufacturing the coil component 1. FIG. 7A to 7D are process diagrams for explaining the method of manufacturing the coil component 1. FIG. FIG. 8 is a process diagram for explaining the method of manufacturing the coil component 1. FIG. 9A to 9D are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 10A to 10D are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 11A and 11B are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 12A and 12B are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 13A and 13B are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 14A to 14D are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 15A and 15B are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 16A and 16B are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 17A to 17D are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 18A to 18D are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 19A to 19D are process diagrams for explaining the method of manufacturing the coil component 1. FIG. FIG. 20 is a process diagram for explaining the method of manufacturing the coil component 1. FIG. 21A to 21D are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 22A to 22C are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 23A to 23D are process diagrams for explaining the method of manufacturing the coil component 1. FIG. 24 is a plan view showing the pattern shape of the interlayer insulating film 55. FIG. FIG. 25 is a plan view showing the pattern shape of the conductor layer 40. FIG. FIG. 26 is a plan view showing the pattern shape of the interlayer insulating film 54. As shown in FIG. 27 is a plan view showing the pattern shape of the conductor layer 30. FIG. FIG. 28 is a plan view showing the pattern shape of the interlayer insulating film 53. FIG. FIG. 29 is a plan view showing the pattern shape of the conductor layer 20. FIG. FIG. 30 is a plan view showing the pattern shape of the interlayer insulating film 52. FIG. FIG. 31 is a plan view showing the pattern shape of the conductor layer 10. FIG. FIG. 32 is a plan view showing the pattern shape of the interlayer insulating film 51. FIG. 33A to 33D are process diagrams for explaining another method of manufacturing the coil component 1. FIG. 34A and 34B are process diagrams for explaining another method of manufacturing the coil component 1. FIG. 35A and 35B are process diagrams for explaining another method of manufacturing the coil component 1. FIG. 36A to 36D are process diagrams for explaining another method of manufacturing the coil component 1. FIG. 37A and 37B are process diagrams for explaining another method of manufacturing the coil component 1. FIG. 38A to 38D are process diagrams for explaining another method of manufacturing the coil component 1. FIG. 39A to 39D are process diagrams for explaining another method of manufacturing the coil component 1. FIG. 40A to 40D are process diagrams for explaining another method of manufacturing the coil component 1. FIG. FIG. 41 is a cross-sectional view of a coil component 1A according to a second embodiment of the invention. FIG. 42 is a cross-sectional view of a coil component 1B according to the third embodiment of the invention. FIG. 43 is a cross-sectional view of a coil component 1C according to a fourth embodiment of the invention. FIG. 44 is a cross-sectional view of a coil component 1D according to the fifth embodiment of the invention.

Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic perspective view showing the appearance of a coil component 1 according to a first embodiment of the invention.

A coil component 1 according to the first embodiment of the present invention is a surface-mounted chip component suitable for use as an inductor for a power supply circuit. , M2, and a coil portion C embedded in the first and second magnetic bodies M1 and M2. Although the configuration of the coil portion C will be described later, in this embodiment, four conductor layers having spiral coil patterns are laminated to form one coil conductor. One end of the coil conductor is connected to the first external terminal E1, and the other end of the coil conductor is connected to the second external terminal E2.

The magnetic bodies M1 and M2 are composite members made of resin containing metal magnetic powder made of iron (Fe), permalloy-based material, or the like, and constitute magnetic paths for magnetic flux generated by applying current to the coils. As the resin, it is preferable to use liquid or powder epoxy resin. The material forming the magnetic element M1 and the material forming the magnetic element M2 may be the same or different.

Unlike a general laminated coil component, the coil component 1 according to the present embodiment is mounted upright so that the z direction, which is the lamination direction, is parallel to the circuit board. Specifically, the surfaces 2 of the magnetic bodies M1 and M2 forming the xz plane are used as mounting surfaces. The surface 2 is provided with a first external terminal E1 and a second external terminal E2. The first external terminal E1 is a terminal to which one end of the coil conductor formed in the coil portion C is connected, and the second external terminal E2 is connected to the other end of the coil conductor formed in the coil portion C. terminal.

As shown in FIG. 1, the first external terminal E1 is formed continuously from the surface 2 to the surface 3 constituting the yz plane, and the second external terminal E2 is formed continuously from the surface 2 to the yz plane. It is formed continuously over the surface 4 . The external terminals E1 and E2 are composed of laminated films of nickel (Ni) and tin (Sn) formed on the exposed surfaces of the electrode patterns included in the coil portion C. As shown in FIG.

FIG. 2 is a side view showing a state in which the coil component 1 according to the present embodiment is mounted on the circuit board 80, viewed from the stacking direction.

As shown in FIG. 2, the coil component 1 according to the present embodiment is mounted upright on a circuit board 80 . Specifically, the surfaces 2 of the magnetic bodies M1 and M2 face the mounting surface of the circuit board 80, that is, the z direction, which is the stacking direction of the coil component 1, is parallel to the mounting surface of the circuit board 80. , to be implemented.

Land patterns 81 and 82 are provided on the circuit board 80, and the external terminals E1 and E2 of the coil component 1 are connected to these land patterns 81 and 82, respectively. Electrical and mechanical connections between the land patterns 81 and 82 and the external terminals E1 and E2 are made by solder 83. FIG. Fillets of solder 83 are formed on the portions of the external terminals E1 and E2 formed on the surfaces 3 and 4 of the coil component 1 . The external terminals E1 and E2 are made of a laminated film of nickel (Ni) and tin (Sn), which enhances solder wettability.

3 and 4 are cross-sectional views of the coil component 1 according to this embodiment. FIG. 3 shows a cross section where the external terminals E1 and E2 appear, and FIG. 4 shows a cross section where the external terminals E1 and E2 do not appear.

As shown in FIGS. 3 and 4, the coil portion C included in the coil component 1 is embedded in two magnetic bodies M1 and M2, and includes interlayer insulating films 51 to 55 and conductor layers 10, 20, 30, . 40 are alternately stacked. The conductor layers 10, 20, 30, and 40 have spiral coil patterns CP1-CP4, respectively, and the upper or lower surfaces of the coil patterns CP1-CP4 are covered with interlayer insulating films 51-55. Side surfaces of the coil patterns CP1 to CP4 are covered with portions of the interlayer insulating films 51 to 54, respectively. Here, the upper and lower surfaces of the coil patterns CP1 to CP4 refer to surfaces perpendicular to the coil axis, and the side surfaces of the coil patterns CP1 to CP4 refer to surfaces horizontal to the coil axis.

The coil patterns CP1-CP4 are connected to each other through through holes formed in the interlayer insulating films 52-54 to form coil conductors. Copper (Cu) is preferably used as the material for the conductor layers 10 , 20 , 30 , 40 . Magnetic bodies M2 are also embedded in the inner and outer regions of the coil patterns CP1 to CP4. A nonmagnetic material is used for at least the interlayer insulating films 52 to 54 among the interlayer insulating films 51 to 55 . A magnetic material may be used for the interlayer insulating film 51 positioned at the bottom layer and the interlayer insulating film 55 positioned at the top layer.

The conductor layer 10 is a first conductor layer formed on the upper surface of the magnetic element M1 with an interlayer insulating film 51 interposed therebetween. The conductor layer 10 is provided with a coil pattern CP1 spirally wound for one turn and two electrode patterns 11 and 12 . The lower surface and side surfaces of the coil pattern CP1 are covered with an interlayer insulating film 51, and the upper surface of the coil pattern CP1 is covered with an interlayer insulating film 52. As shown in FIG. As shown in FIG. 3, the coil pattern CP1 and the electrode pattern 11 are connected in a predetermined cross section. On the other hand, the electrode pattern 12 is provided independently of the coil pattern CP1. The electrode pattern 11 is exposed from the coil portion C, and an external terminal E1 is formed on the surface thereof. Moreover, the electrode pattern 12 is exposed from the coil portion C, and an external terminal E2 is formed on the surface thereof.

The conductor layer 20 is a second conductor layer formed on the upper surface of the conductor layer 10 with an interlayer insulating film 52 interposed therebetween. The conductor layer 20 is provided with a coil pattern CP2 spirally wound for one turn and two electrode patterns 21 and 22 . The lower surface and side surfaces of the coil pattern CP2 are covered with an interlayer insulating film 52, and the upper surface of the coil pattern CP2 is covered with an interlayer insulating film 53. Both the electrode patterns 21 and 22 are provided independently of the coil pattern CP2. The electrode pattern 21 is exposed from the coil portion C, and the external terminal E1 is formed on the surface thereof. Moreover, the electrode pattern 22 is exposed from the coil portion C, and an external terminal E2 is formed on the surface thereof.

The conductor layer 30 is a third conductor layer formed on the upper surface of the conductor layer 20 with an interlayer insulating film 53 interposed therebetween. The conductor layer 30 is provided with a coil pattern CP3 spirally wound for one turn and two electrode patterns 31 and 32 . The lower surface and side surfaces of the coil pattern CP3 are covered with an interlayer insulating film 53, and the upper surface of the coil pattern CP3 is covered with an interlayer insulating film . Both the electrode patterns 31 and 32 are provided independently of the coil pattern CP3. The electrode pattern 31 is exposed from the coil portion C, and the external terminal E1 is formed on the surface thereof. Moreover, the electrode pattern 32 is exposed from the coil portion C, and an external terminal E2 is formed on the surface thereof.

The conductor layer 40 is a fourth conductor layer formed on the upper surface of the conductor layer 30 with an interlayer insulating film 54 interposed therebetween. The conductor layer 40 is provided with a coil pattern CP4 spirally wound for one turn and two electrode patterns 41 and 42 . The lower surface and side surfaces of the coil pattern CP4 are covered with an interlayer insulating film 54, and the upper surface of the coil pattern CP4 is covered with an interlayer insulating film 55. As shown in FIG. As shown in FIG. 3, the coil pattern CP4 and the electrode pattern 42 are connected in a predetermined cross section. On the other hand, the electrode pattern 41 is provided independently of the coil pattern CP4. The electrode pattern 41 is exposed from the coil portion C, and the external terminal E1 is formed on the surface thereof. Moreover, the electrode pattern 42 is exposed from the coil portion C, and the external terminal E2 is formed on the surface thereof.

The coil patterns CP1-CP4 are connected through via conductors (not shown) provided through the interlayer insulating films 52-54. As a result, the coil patterns CP1 to CP4 form a four-turn coil conductor, one end of which is connected to the external terminal E1 and the other end of which is connected to the external terminal E2.

A coil component 1 according to this embodiment has a structure in which an interlayer insulating film 51 is embedded in a magnetic body M1. Other internal elements, that is, the conductor layers 10, 20, 30 and 40 and the interlayer insulating films 52 to 55 are embedded in the magnetic body M2. That is, the lowermost interlayer insulating film 51 is in contact with the magnetic body M1 at the lower surface 51B and the side surfaces 51S. An upper surface 51u of the interlayer insulating film 51 is in contact with the magnetic body M2. A portion of the upper surface of the magnetic element M1, which is not in contact with the interlayer insulating film 51, is in contact with the magnetic element M2. That is, in plan view, the magnetic element M1 and the magnetic element M2 are in contact with each other in the inner and outer regions of the coil patterns CP1 to CP4. As a result, the magnetic bodies M1 and M2 form a closed magnetic circuit.

As described above, in the present embodiment, since the interlayer insulating film 51 is embedded in the magnetic element M1, the magnetic element M1 is closer to the interlayer insulating film 51 than the magnetic element M2. It has a concave shape. As a result, since the contact area between the magnetic element M1 and the interlayer insulating film 51 increases, even if there is a difference in thermal expansion coefficient between the magnetic element M1 and the interlayer insulating film 51, separation at the interface between the two can be prevented. becomes less likely to occur. On the other hand, since the magnetic element M2 and the interlayer insulating films 52 to 55 have a large contact area and are complicatedly intricate, separation at the interface between the two hardly occurs in the first place. As a result, the coil component 1 according to this embodiment can ensure high reliability.

Next, a method for manufacturing the coil component 1 according to this embodiment will be described.

5 to 23 are process diagrams for explaining the method of manufacturing the coil component 1 according to this embodiment. The process diagrams shown in FIGS. 5 to 23 show a cross section corresponding to one coil component 1, but in reality, a large number of coil components 1 are produced simultaneously using an aggregate substrate, thereby obtaining a large number of coil components. can do.

First, a support 70 having a metal foil 72 such as copper (Cu) provided on the surface of a base material 71 is prepared (FIG. 5), and an interlayer insulating film 55 and a metal foil 43 are formed on the surface of the metal foil 72 (see FIG. 5). Figure 6). The interlayer insulating film 55 and the metal foil 43 can be formed by a lamination method. Next, by patterning the metal foil 43, the metal foil 43 is processed into a spiral shape (FIG. 7). Next, the interlayer insulating film 55 is patterned using the metal foil 43 as a mask (FIG. 8). The patterning of the interlayer insulating film 55 can be performed by, for example, blasting. The pattern shape of the interlayer insulating film 55 is as shown in FIG. 24. An opening 55a is provided at a position corresponding to the inner diameter region of the coil pattern CP4, and an opening 55b is provided at a position corresponding to the outer region of the coil pattern CP4. be provided.

Next, after removing the metal foil 43, a seed layer 44 is formed on the front surface by electroless plating (FIG. 9). Next, a resist pattern R is formed on the interlayer insulating film 55 (FIG. 10). The resist pattern R is a negative pattern of the coil pattern CP4, and therefore the regions defined by the resist pattern R have a spiral shape.

Next, a conductor layer 40 is formed by growing a seed layer 44 by electroplating (FIG. 11). As a result, a spiral coil pattern CP4 is formed in the region partitioned by the resist pattern R. As shown in FIG. At this time, sacrificial patterns VP4 are formed in the inner and outer regions of the coil pattern CP4. The planar shape of the conductor layer 40 is as shown in FIG. 25, and includes a spirally wound coil pattern CP4, two electrode patterns 41 and 42 positioned outside the coil pattern CP4, and an inner diameter of the coil pattern CP4. It consists of a sacrificial pattern VP4 located in a region and an outer region. As shown in FIG. 25, one end of the coil pattern CP4 is connected to the electrode pattern 42. As shown in FIG.

Next, after removing the resist pattern R (FIG. 12), the seed layer 44 exposed in the removed portion of the resist pattern R is removed by etching (FIG. 13). As a result, the coil pattern CP4 and the sacrificial pattern VP4 are electrically separated by the spiral slit SL4. Next, an interlayer insulating film 54 is formed on the surface of the conductor layer 40 so as to fill the slit SL4, and a metal foil 33 is formed on the surface of the interlayer insulating film 54 (FIG. 14). The interlayer insulating film 54 and the metal foil 33 can be formed by a lamination method. Next, by patterning the metal foil 33, after processing the metal foil 33 into a spiral shape, the interlayer insulating film 54 is patterned using the metal foil 33 as a mask (FIG. 15). Then, as described with reference to FIGS. 9 to 13, a conductor is formed by forming a seed layer 34, forming a resist pattern, electroplating, stripping the resist pattern, and removing the seed layer 34 exposed to the slit SL3. Formation of layer 30 is carried out (FIG. 16). As a result, the spiral coil pattern CP3 is formed in the region partitioned by the spiral slit SL3, and the sacrificial pattern VP3 is formed in the inner and outer regions of the coil pattern CP3. The pattern shape of the interlayer insulating film 54 is as shown in FIG. 26. An opening 54a is provided at a position corresponding to the inner diameter region of the coil pattern CP4, and an opening 54b is provided at a position corresponding to the outer region of the coil pattern CP4. be provided. In the interlayer insulating film 54, an opening 54c is formed at a position overlapping with the other end of the coil pattern CP4, and an opening 54d is formed at a position overlapping with the electrode patterns 41 and . The planar shape of the conductor layer 30 is as shown in FIG. 27, and includes a spirally wound coil pattern CP3, two electrode patterns 31 and 32 positioned outside the coil pattern CP3, and an inner diameter of the coil pattern CP3. It consists of a sacrificial pattern VP3 located in a region and an outer region.

Similarly, patterning of the interlayer insulating film 53, formation of the seed layer 24, formation of a resist pattern, electroplating, stripping of the resist pattern, and removal of the seed layer 24 exposed in the slit SL2 are performed to form the upper surface of the conductor layer 30. Then, a conductor layer 20 is formed (FIG. 17). As a result, the spiral coil pattern CP2 is formed in the region partitioned by the spiral slit SL2, and the sacrificial pattern VP2 is formed in the inner diameter region and the outer region of the coil pattern CP2. The pattern shape of the interlayer insulating film 53 is as shown in FIG. 28. An opening 53a is provided at a position corresponding to the inner diameter region of the coil pattern CP3, and an opening 53b is provided at a position corresponding to the outer region of the coil pattern CP3. be provided. In the interlayer insulating film 53, an opening 53c is formed at a position overlapping with one end of the coil pattern CP3, and an opening 53d is formed at a position overlapping with the electrode patterns 31 and 32. As shown in FIG. The planar shape of the conductor layer 20 is as shown in FIG. 29, and includes a spirally wound coil pattern CP2, two electrode patterns 21 and 22 positioned outside the coil pattern CP2, and an inner diameter of the coil pattern CP2. It consists of a sacrificial pattern VP2 located in an area and an outer area.

In the same manner, patterning of the interlayer insulating film 52, formation of the seed layer 14, formation of a resist pattern, electroplating, stripping of the resist pattern, and removal of the seed layer 14 exposed in the slit SL1 are performed to form the upper surface of the conductor layer 20. Then, a conductor layer 10 is formed (FIG. 18). As a result, the spiral coil pattern CP1 is formed in the region partitioned by the spiral slit SL1, and the sacrificial pattern VP1 is formed in the inner diameter region and the outer region of the coil pattern CP1. The pattern shape of the interlayer insulating film 52 is as shown in FIG. 30. An opening 52a is provided at a position corresponding to the inner diameter region of the coil pattern CP2, and an opening 52b is provided at a position corresponding to the outer region of the coil pattern CP2. be provided. In the interlayer insulating film 52, an opening 52c is formed at a position overlapping with one end of the coil pattern CP2, and an opening 52d is formed at a position overlapping with the electrode patterns 31 and 32. As shown in FIG. The planar shape of the conductor layer 10 is as shown in FIG. 31, and includes a spirally wound coil pattern CP1, two electrode patterns 11 and 12 positioned outside the coil pattern CP1, and an inner diameter of the coil pattern CP1. It consists of a sacrificial pattern VP1 located in a region and an outer region. One end of the coil pattern CP1 is connected to the electrode pattern 11 .

Next, after forming an interlayer insulating film 51 on the surface of the conductor layer 10 so as to fill the slit SL1, the interlayer insulating film 51 is patterned (FIG. 19). The pattern shape of the interlayer insulating film 51 is as shown in FIG. 32. An opening 51a is provided at a position corresponding to the inner diameter region of the coil pattern CP1, and an opening 51b is provided at a position corresponding to the outer region of the coil pattern CP1. be provided. Next, a magnetic body M1 is formed to cover the conductor layer 10 (FIG. 20). The magnetic body M1 can be formed by forming a composite member in an uncured or semi-effective state and then performing a heat treatment to cure the resin contained in the composite material. As a result, the magnetic element M1 covers the coil pattern CP1 with the interlayer insulating film 51 interposed therebetween, and covers the sacrificial pattern VP1 without the interlayer insulating film 51 interposed therebetween.

Next, after peeling off the base material 71 (FIG. 21), the upper limit is reversed, and another base material 74 is attached to the magnetic element M1 (FIG. 22). In this state, wet etching is performed to remove the sacrificial patterns VP1 to VP4 (FIG. 23). Since the coil patterns CP1 to CP4 are covered with the interlayer insulating films 51 to 55, they are not etched. As a result, spaces S are formed in the inner and outer regions of the coil patterns CP1 to CP4.

After forming the magnetic element M2 filling the space S, the base material 74 is peeled off to complete the coil component 1 according to the present embodiment. The formation of the magnetic body M2 can be performed by forming an uncured or semi-effective composite member and then performing a heat treatment to cure the resin contained in the composite material. As described above, the same material may be used for the magnetic bodies M1 and M2, but the hardening timing is different, so the interface between the two can be clearly confirmed.

As described above, in this embodiment, after the conductor layers 40, 30, 20 and 10 are formed in this order with the interlayer insulating films 55 to 51 interposed therebetween, the magnetic element M1 is formed so as to fill the interlayer insulating film 51. Therefore, the interlayer insulating film 51 and the magnetic element M1 do not come into planar contact with each other, but three-dimensionally contact with the lower surface 51B and the side surface 51S of the interlayer insulating film 51. FIG. As a result, even when there is a difference in the coefficient of thermal expansion between the magnetic element M1 and the interlayer insulating film 51, it is possible to obtain a structure in which separation is unlikely to occur at the interface between the two.

Next, another method for manufacturing the coil component 1 according to this embodiment will be described.

33 to 40 are process diagrams for explaining another method of manufacturing the coil component 1 according to this embodiment. The process diagrams shown in FIGS. 33 to 40 show a cross section corresponding to one coil component 1, but in reality, a large number of coil components 1 are produced simultaneously using an assembly board. can do.

First, after forming the interlayer insulating film 51 and the seed layer 14 on the surface of the support 70 composed of the base material 71 and the metal foil 72, the seed layer 14 is partially removed, and the interlayer insulating pattern 61 is formed on the removed portion. form (Fig. 33). The in-layer insulating pattern 61 is a negative pattern of the coil pattern CP1 made of a photosensitive permanent resist, and therefore the region defined by the in-layer insulating pattern 61 has a spiral shape. Next, the conductor layer 10 is formed by growing the seed layer 14 by electroplating (FIG. 34). As a result, the spiral coil pattern CP1 is formed in the region partitioned by the in-layer insulating pattern 61, and the sacrificial pattern VP1 is formed in the inner and outer regions of the coil pattern CP1.

Thereafter, an interlayer insulating film 52 is formed to cover the conductor layer 10, and the interlayer insulating film 52 is patterned to expose the sacrificial pattern VP1. 20, 30 and 40 are stacked in this order (FIG. 35). Next, wet etching is performed to remove the sacrificial patterns VP1 to VP4 (FIG. 36). Since the coil patterns CP1 to CP4 are covered with the interlayer insulating films 51 to 55 and the intralayer insulating patterns 61 to 64, they are not etched. As a result, spaces S are formed in the inner and outer regions of the coil patterns CP1 to CP4.

Next, after forming the magnetic element M2 filling the space S (FIG. 37), the support 70 is peeled off and the upper limit is reversed (FIG. 38). Then, after patterning the interlayer insulating film 51 (FIG. 39), the magnetic body M1 is formed so as to embed the patterned interlayer insulating film 51, thereby completing the coil component 1 according to the present embodiment. 33 to 40, the conductor layers 10, 20, 30 and 40 are formed in this order via the interlayer insulating films 51 to 55, and then the interlayer insulating film 51 is patterned. , a magnetic element M1 is formed. Even when such a method is used, the interlayer insulating film 51 and the magnetic element M1 are not in planar contact with each other, but the magnetic element M1 is arranged such that the lower surface 51B and the side surface 51S of the interlayer insulating film 51 are in contact with each other. can be brought into steric contact with each other. Further, in the processes shown in FIGS. 33 to 40, intra-layer insulating patterns 61 to 64 made of photosensitive permanent resist are used. In this way, it is possible to use a permanent resist for the insulating pattern separating the layers.

FIG. 41 is a cross-sectional view of a coil component 1A according to a second embodiment of the invention.

As shown in FIG. 41, in the coil component 1A according to the second embodiment of the present invention, the interface between the magnetic element M1 and the magnetic element M2 located in the inner diameter regions of the coil patterns CP1 to CP4 in plan view curves inward. is different from the coil component 1 according to the first embodiment. Since other basic configurations are the same as those of the coil component 1 according to the first embodiment, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted. As exemplified in this embodiment, the interface between the magnetic element M1 and the magnetic element M2 is not necessarily straight, and may be curved.

FIG. 42 is a cross-sectional view of a coil component 1B according to the third embodiment of the invention.

As shown in FIG. 42, in the coil component 1B according to the third embodiment of the present invention, the interlayer insulating film 51 located in the inner diameter regions of the coil patterns CP1 to CP4 in plan view is not removed. It is different from the coil component 1 according to the embodiment. Since other basic configurations are the same as those of the coil component 1 according to the first embodiment, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted. In the present embodiment, the magnetic element M1 and the magnetic element M2 are in contact in the outer regions of the coil patterns CP1 to CP4 without being in contact in the inner diameter regions of the coil patterns CP1 to CP4 in plan view. As illustrated in this embodiment, it is not essential that the magnetic element M1 and the magnetic element M2 are in contact with each other in the inner diameter regions of the coil patterns CP1 to CP4.

FIG. 43 is a cross-sectional view of a coil component 1C according to a fourth embodiment of the invention.

As shown in FIG. 43, the coil component 1C according to the fourth embodiment of the present invention has a configuration in which all of the coil patterns CP1 to CP4 are spirally wound for three turns. It is different from the coil component 1 according to the embodiment. Since other basic configurations are the same as those of the coil component 1 according to the first embodiment, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted. As illustrated in this embodiment, the number of turns of each coil pattern is not particularly limited.

FIG. 44 is a cross-sectional view of a coil component 1D according to the fifth embodiment of the invention.

As shown in FIG. 44, the coil component 1D according to the fifth embodiment of the present invention is different from the coil component 1 according to the first embodiment in that the external terminals E1 and E2 are arranged on the upper surface of the magnetic element M2. is different from Since other basic configurations are the same as those of the coil component 1 according to the first embodiment, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted. In this embodiment, bump conductors 91 and 92 are provided to pass through the magnetic element M2, and the external terminal E1 and the coil pattern CP1 are connected via the bump conductor 91 and the electrode patterns 41, 31, 21, and 11, and the bumps The external terminal E2 and the coil pattern CP4 are connected via a conductor 92. FIG. As illustrated in this embodiment, the positions where the external terminals E1 and E2 are formed are not particularly limited in the present invention.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention. Needless to say, it is included within the scope.

1, 1A to 1D coil parts 2 to 4 surfaces 10, 20, 30, 40 of coil parts conductor layers 11, 12, 21, 22, 31, 32, 41, 42 electrode patterns 14, 24, 34, 44 seed layer 33 , 43 metal foils 51 to 55 interlayer insulating film 51B lower surface 51S side surface 51U upper surface 51a to 55a, 51b to 55b, 52c to 54c, 52d to 54d openings 61 to 64 intralayer insulating pattern 70 supports 71, 74 base material 72, 73 metal foil 80 circuit board 81, 82 land pattern 83 solder 91, 92 bump conductor C coil part CP1-CP4 coil pattern E1, E2 external terminal M1, M2 magnetic element R resist pattern S space SL1-SL4 slit VP1-VP4 sacrifice pattern

Claims (4)

a spirally wound coil pattern;
a first interlayer insulating film covering the lower surface of the coil pattern;
a second interlayer insulating film covering the upper surface of the coil pattern;
a first magnetic element embedding the first interlayer insulating film;
a second magnetic element embedding the coil pattern and the second interlayer insulating film,
the first interlayer insulating film is made of a magnetic material,
the second interlayer insulating film is made of a non-magnetic material,
A coil component according to claim 1, wherein the first magnetic element has a shape in which the interface with the first interlayer insulating film is recessed from the interface with the second magnetic element. 2. The coil component according to claim 1, wherein said first magnetic element and said second magnetic element are in contact with each other at least in an outer region of said coil pattern. 3. The coil component according to claim 2, wherein said first magnetic element and said second magnetic element are further in contact with each other in an inner diameter region of said coil pattern. a first step of forming a spirally wound coil pattern, forming a first sacrificial pattern in an inner diameter region of the coil pattern, and forming a second sacrificial pattern in an outer region of the coil pattern;
a second step of forming a first interlayer insulating film covering the coil pattern, the first sacrificial pattern and the second sacrificial pattern;
a third step of patterning the first interlayer insulating film along the coil pattern;
A fourth method for forming a first magnetic element covering the coil pattern with the first interlayer insulating film interposed therebetween and covering the first and second sacrificial patterns without the first interlayer insulating film interposed therebetween. process and
a fifth step of forming a space in the inner diameter region and the outer region of the coil pattern by removing the first and second sacrificial patterns;
and a sixth step of forming a second magnetic element in the space.

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