JP7124333B2 - Coil component and its manufacturing method - Google Patents

Description

The present invention relates to a coil component and its manufacturing method, and more particularly to a coil component having a structure in which a laminated coil formed by electrolytic plating or the like is embedded inside a sealing member such as a magnetic resin layer, and its manufacturing method.

As a coil component having a structure in which a coil conductor is embedded in a magnetic resin layer, Patent Documents 1 and 2 disclose a method in which a coil portion is formed on a magnetic substrate such as sintered ferrite, and then the coil portion is covered with a magnetic resin layer. A coil component having a structure is disclosed. According to this coil component, a high inductance value can be obtained by improving the magnetic permeability of the magnetic path of the coil portion.

JP 2015-76606 A Japanese Unexamined Patent Application Publication No. 2017-199800

As one method for increasing the inductance of the coil component described in Patent Documents 1 and 2, etc., the thickness of the insulating resin layer for insulating and separating the coil pattern of the coil portion from the magnetic resin layer is reduced to reduce the thickness of the coil pattern periphery. There is a method of increasing the volume of the magnetic resin.

However, in order to maintain the insulation and weather resistance of the coil while the size of the coil component is limited, there is a limit to how thin the insulating resin layer of the coil can be made.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a coil component capable of increasing inductance while maintaining insulation and weather resistance, and a method of manufacturing the same.

In order to solve the above problems, a coil component according to the present invention includes: a coil portion including a laminate of a plurality of coil patterns embedded in a coil insulating layer; and a magnetic resin layer covering the coil portion with the coil insulating layer interposed therebetween. and wherein the coil insulation layer is composed of a combination of an insulation resin layer and an inorganic insulation layer.

According to the present invention, the inductance of the coil can be increased while maintaining insulation and weather resistance without changing the size and shape of the element and without changing the type of magnetic resin. With this configuration, the coil portion can be covered with a thin inorganic insulating layer, and the volume of the insulating layer covering the coil portion can be reduced. Therefore, the volume of the magnetic resin layer can be increased, thereby improving the inductance of the coil.

In the present invention, the inorganic insulating layer may be provided at a boundary portion between the coil portion and the magnetic resin layer, and the magnetic resin layer may cover the coil portion via the inorganic insulating layer. preferable. With this configuration, the coil portion can be covered with a thin inorganic insulating layer, and the volume of the insulating layer covering the coil portion can be reduced. Therefore, the volume of the magnetic resin layer can be increased, thereby improving the inductance of the coil.

In the present invention, it is preferable that the insulating resin layer is not provided at the boundary between the coil portion and the magnetic resin layer. According to this, the insulating layer covering the coil portion can be composed only of a thin inorganic insulating layer, and the volume of the insulating layer can be reduced. Therefore, the volume of the magnetic resin layer can be increased, thereby improving the inductance of the coil.

In the present invention, part of the insulating resin layer may be provided at the boundary between the coil portion and the magnetic resin layer. In this case, a portion of the insulating resin layer provided at the boundary between the coil portion and the magnetic resin layer entirely covers the outer surface of the coil portion, and the inorganic insulating layer is the insulating resin layer. A layer may cover the coil portion. A portion of the insulating resin layer provided at the boundary between the coil portion and the magnetic resin layer partially covers the outer surface of the coil portion, and a portion of the inorganic insulating layer is the magnetic resin layer. It may be in contact with the coil portion. In the former case, a two-layer film of an insulating resin layer and an inorganic insulating layer can be formed, and the insulating properties and weather resistance can be sufficiently improved. In addition, by thinning the insulating resin layer covering the coil portion, the protection of the coil can be enhanced without significantly lowering the inductance of the coil. In the latter case, a thinner insulating layer can be formed than in the former case.

In the present invention, the coil portion has a structure in which the coil patterns and the insulating resin layers covering the coil patterns are alternately laminated, and the insulating resin layer is provided between two coil patterns adjacent in the lamination direction. It is preferably provided in the inter-layer region of each coil pattern and in the line-to-line region between adjacent turns of each coil pattern. Thus, by providing the insulating resin layer in the interlayer region and the line-to-line region of the coil pattern, the insulation of the coil pattern can be ensured, and a thick coil pattern can be easily formed.

In the present invention, the inorganic insulating layer preferably covers the upper surface of the uppermost coil pattern, the inner side surface of the innermost turn of each coil pattern, and the outer side surface of the outermost turn of each coil pattern. According to this, it is possible not only to insulate between lines and between layers of coil patterns, but also to easily form a laminate of a plurality of coil patterns.

Further, a method for manufacturing a coil component according to the present invention includes a step of alternately laminating conductive layers including a coil pattern and an insulating resin layer covering the coil pattern to form a coil portion, and an inorganic insulating layer covering the coil portion. and forming a magnetic resin layer covering the coil portion via the inorganic insulating layer.

According to the present invention, a thin film inductor having a large inductance can be manufactured without changing the size and shape of the element and without changing the type of magnetic resin while maintaining the insulation and environmental resistance of the coil. can.

The method for manufacturing a coil component according to the present invention may further include the step of removing at least part of a surface layer portion of the insulating resin layer covering the outside of the coil pattern laminate before forming the inorganic insulating layer. preferable. According to this, the insulating layer covering the coil portion can be made thin, and the volume of the insulating layer can be reduced. Therefore, the volume of the magnetic resin layer can be increased, thereby improving the inductance of the coil.

In the present invention, the step of removing the surface layer portion of the insulating resin layer preferably exposes the entire outer surface of the coil pattern laminate. Exposure is also preferred. According to this, a thin insulating layer covering the coil portion can be formed, and the volume of the insulating layer can be reduced while maintaining insulation and weather resistance. Therefore, the volume of the magnetic resin layer can be increased, thereby improving the inductance of the coil.

It is also preferable that the step of removing the surface layer portion of the insulating resin layer reduces the thickness of the surface layer portion of the insulating resin layer without exposing the outer surface of the laminate of the coil patterns. According to this, a two-layer film of an insulating resin layer and an inorganic insulating layer can be formed as an insulating layer covering the coil portion, and the insulating properties and weather resistance can be sufficiently improved. In addition, by thinning the insulating resin layer covering the coil portion, the protection of the coil can be enhanced without significantly lowering the inductance of the coil.

According to the present invention, it is possible to provide a coil component capable of increasing inductance while maintaining insulation and weather resistance, and a method of manufacturing the same.

FIG. 1 is a schematic perspective view of a coil component according to a first embodiment of the invention. 2 is a cross-sectional view of the coil component taken along line AA of FIG. 1. FIG. FIG. 3 is a developed view showing a planar layout of the coil pattern. 4A to 4E are process diagrams for explaining the method of manufacturing the coil component of FIG. 5A to 5D are process diagrams for explaining the method of manufacturing the coil component of FIG. 6A to 6D are process diagrams for explaining the method of manufacturing the coil component shown in FIG. FIG. 7 is a schematic cross-sectional view showing the configuration of a coil component according to a second embodiment of the invention. FIG. 8 is a schematic cross-sectional view showing the configuration of a coil component according to a third embodiment of the invention. FIG. 9 is a schematic cross-sectional view showing the configuration of a coil component according to a fourth embodiment of the invention. 10A to 10D are process diagrams showing a method of manufacturing the coil component of FIG.

Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic perspective view of a coil component according to a first embodiment of the invention. 2 is a cross-sectional view of the coil component taken along line AA of FIG. 1. FIG. FIG. 3 is a developed view showing a planar layout of the coil pattern.

As shown in FIGS. 1 to 3, this coil component 1 includes a magnetic substrate 11 and a magnetic resin layer 12 covering the main surface of the magnetic substrate 11 so as to embed a coil portion 20, which will be described later. A pair of external terminals E1 and E2 are provided on the main surface 12a of the magnetic resin layer 12 via an insulating film 15. One end of the coil element is connected to the first external terminal E1, and the other end of the coil element is connected to the first external terminal E1. It is connected to the second external terminal E2. In the present invention, the configuration of the external terminals E1 and E2 is not particularly limited, and various configurations are possible.

The magnetic substrate 11 is, for example, a ferrite substrate, and the magnetic resin layer 12 is a composite member made of resin containing metal magnetic particles (magnetic filler). The magnetic substrate 11 and the magnetic resin layer 12 form a magnetic path for magnetic flux generated by applying current to the coil element. As metal magnetic particles, it is preferable to use iron coated with an inorganic insulating material such as SiO ₂ or a soft magnetic material such as a permalloy-based material. As the resin, it is preferable to use a semi-cured epoxy resin that is liquid or powder.

As shown in FIG. 2, the coil part 20 includes first and second coil patterns C1 and C2 that are laminated in order, and an insulating resin layer 51 that is provided in the insulation separation regions of the first and second coil patterns C1 and C2. and an inorganic insulating layer 56 covering the exposed surfaces of the laminate of the first and second coil patterns C1 and C2. A combination of the insulating resin layer 51 and the inorganic insulating layer 56 constitutes the coil insulating layer 50 in which the laminate of the coil patterns C1 and C2 is embedded.

The magnetic substrate 11 covers the coil portion 20 from one side in the coil axis direction of the coil portion 20 and is provided in a lower region 24 of the coil portion 20 . In addition, the magnetic resin layer 12 covers the coil portion 20 from the other side of the coil portion 20 in the coil axis direction, and includes an upper region 21 of the coil portion 20, an inner diameter region 22 surrounded by the coil portion 20, and a coil portion It is provided in an outer peripheral region 23 surrounding 20 .

The coil section 20 has a multilayer structure in which a plurality of coil patterns are laminated. The coil part 20 according to the present embodiment has a two-layer structure in which the first and second coil patterns C1 and C2 are laminated in order, but the number of coil patterns to be laminated is not limited to two, and is three or more. may be The first coil pattern C1 is formed on the upper surface of the underlying insulating layer 30, and the second coil pattern C2 is formed on the upper surface of the first interlayer insulating layer 53a covering the first coil pattern C1. The first and second coil patterns C1, C2 are arranged in a direction orthogonal to the main surface of the coil component 1, and the first and second coil patterns C1, C2 have substantially symmetrical shapes in plan view. and have approximately the same dimensions. The shape of the first and second coil patterns C1 and C2 can be appropriately selected from, for example, a rectangular shape, a rectangular shape with rounded corners, a circular shape, an elliptical shape, and the like.

As shown in FIG. 3, the first and second coil patterns C1 and C2 have a spiral shape that overlaps each other in a plan view, and the outer peripheral end of the first coil pattern C1 is connected to the first external terminal E1 via a lead conductor 81. , and the outer peripheral end of the second coil pattern C2 is connected to the second external terminal E2 via the lead conductor 82. As shown in FIG. In addition, the inner peripheral end of the first coil pattern C1 is connected to the inner peripheral end of the second coil pattern C2 via a through-hole conductor 45. As shown in FIG. Thereby, the first and second coil patterns C1 and C2 form a single coil element. When the first and second coil patterns C1 and C2 are viewed from one side in the coil axial direction, the winding direction from the outer peripheral end to the inner peripheral end of the first coil pattern C1 and the inner peripheral end of the second coil pattern C1 The winding direction from the edge to the outer peripheral edge is the same.

As shown in FIG. 2, the insulating resin layer 51 includes the underlying insulating layer 30, the first embedded insulating layer 52a formed in the interline region between adjacent turns of the first coil pattern C1, and the first coil pattern C1. and the second coil pattern C2, and a second buried insulating layer 52b formed in the line-to-line region between adjacent turns of the second coil pattern C2. I have. The upper surface of the uppermost second coil pattern C2, the inner side surfaces of the innermost turns of the first and second coil patterns C1 and C2, and the outer side surfaces of the outermost turns of the first and second coil patterns C1 and C2 are insulated. It is exposed without being covered with the resin layer 51 .

The inorganic insulating layer 56 is made of an inorganic insulating material such as SiO ₂ or Al ₂ O ₃ and is provided so as to cover the entire main surface of the magnetic substrate 11 including the laminate of the first and second coil patterns C1 and C2. there is Therefore, the inorganic insulating layer 56 includes the upper surface of the uppermost second coil pattern C2, the inner side surfaces of the innermost turns of the first and second coil patterns C1 and C2, and the first and second coil patterns C1 and C2. and a region of the main surface of the magnetic substrate 11 that does not overlap the coil portion 20 in plan view. Note that the inorganic insulating layer 56 may be omitted in a region of the main surface of the magnetic substrate 11 that does not overlap the coil portion 20 in plan view.

In the present embodiment, only the inorganic insulating layer 56 is provided on the upper surface, the outer side surface, and the inner side surface of the laminate of the first and second coil patterns C1 and C2, which are the boundary portions with the magnetic resin layer 12, and provide insulation. Resin layer 51 is not provided. The insulating resin layer 51 provides insulation between the line-to-line region for insulating and separating adjacent turns of the first and second coil patterns C1 and C2, and the first coil pattern C1 and the second coil pattern C2 that are adjacent in the stacking direction. It is only provided in the interlayer region for separation. Therefore, the inorganic insulating layer 56 is the upper surface of the second coil pattern C2, which is the uppermost layer, and the inorganic insulating layer 56 is the inner side surfaces of the innermost turns of the first and second coil patterns C1 and C2, and the first and second coil patterns C1 and C2. It is in contact with the outer side surfaces of the outermost turns of the two coil patterns C1 and C2. The inorganic insulating layer 56 intervenes at the boundary between the exposed surfaces of the first and second coil patterns C1 and C2 not covered with the insulating resin layer 51 and the magnetic resin layer 12, and serves to insulate and separate the two. play.

Thus, in the present embodiment, the first and second coil patterns C1 and C2 are stacked in the stacking direction and in the direction perpendicular to the stacking direction as insulating layers for insulating and separating the first and second coil patterns C1 and C2. Since two types of insulation resin layer 51 for insulation separation and a thin inorganic insulating layer 56 covering the outer surface of the laminate of the first and second coil patterns C1 and C2 are used, the coil pattern laminate is The volume of the insulating layer covering the outside can be reduced, thereby increasing the volume of the magnetic resin layer 12 . Therefore, the inductance of the coil can be improved. Inorganic materials are superior to resins in insulating properties and weather resistance, and can improve the reliability of coil components.

4 to 6 are process diagrams for explaining the method of manufacturing the coil component 1. FIG.

As shown in FIG. 4( a ), in manufacturing the coil component 1 , a base insulating layer 30 is formed on the upper surface of the magnetic substrate 11 . The method for forming the base insulating layer 30 is not particularly limited, and it may be formed by coating a resin material on the surface of the magnetic substrate 11 by a spin coating method or a printing method, or the base insulating layer 30 may be formed into a film in advance. may be attached to the magnetic substrate 11 .

Subsequently, as shown in FIG. 4B, a seed pattern 41a (seed layer) is formed on the upper surface 30a of the underlying insulating layer 30 in order to form the first coil pattern C1 on the underlying insulating layer 30. Next, as shown in FIG. The seed pattern 41a can be formed using a thin film process such as sputtering or using a thin copper foil. The seed pattern 41a includes a coil pattern 42a, an inner dummy pattern 43a formed in the inner diameter area of the coil pattern 42a, and an outer dummy pattern 44a formed in the outer circumference area of the coil pattern 42a. The seed pattern 41a preferably has a thickness of 0.1 to 5 μm.

Subsequently, as shown in FIG. 4C, a first embedded insulating layer 52a is formed as a negative pattern of the seed pattern 41a. The first buried insulating layer 52a can be formed by applying an insulating resin to the entire surface of the magnetic substrate 11 and then patterning it by a technique such as photolithography so that the seed pattern 41a is exposed. The first embedded insulating layer 52a is a wall-like portion erected on the upper surface 30a of the base insulating layer 30, and defines the forming region of the first coil pattern C1.

Subsequently, as shown in FIG. 4D, the seed pattern 41a is grown by electroplating to form the first conductor layer 40a including the first coil pattern C1. At this time, the seed pattern 41a is grown by plating so as to fill the region sandwiched between the first buried insulating layers 52a to form the first coil pattern C1, whereby the first buried insulating layer 52a becomes the first coil pattern. It is in a state of being embedded between adjacent turns of C1. In addition, the first embedded insulating layer 52a has a boundary portion between the innermost peripheral turn of the first coil pattern C1 and the inner dummy pattern 43a, and a boundary portion between the outermost peripheral turn of the first coil pattern C1 and the outer dummy pattern 44a. placed in

Subsequently, as shown in FIG. 4E, a first interlayer insulating layer 53a is formed on the upper surfaces of the first conductor layer 40a and the first buried insulating layer 52a. In the formation of the first interlayer insulating layer 53a, the upper end portion of the first embedded insulating layer 52a is removed by ashing or the like to expose the first conductor layer 40a, and then the first conductor layer 40a and the first embedded layer are formed. It can be formed by applying an insulating resin to the entire upper surface of the insulating layer 52a and patterning it by a technique such as photolithography.

4(b) to (e) are repeated to form a second coil pattern C2, an inner dummy pattern 43b, an outer dummy pattern 44b and a through-hole conductor 45 as shown in FIG. 5(a). A second conductor layer 40b, a second buried insulating layer 52b and a second interlayer insulating layer 53b are formed.

Subsequently, as shown in FIG. 5B, the inner dummy patterns 43a, 43b and the outer dummy patterns 44a, 44b of the first and second conductor layers 40a, 40b are selectively removed. A method for removing the unnecessary portion is not particularly limited, and the unnecessary portion can be removed by wet etching, for example. By removing unnecessary portions of the first and second conductor layers 40a and 40b other than the coil patterns in this way, spaces are formed in the inner diameter region 22 and the outer peripheral region 23 of the first and second coil patterns C1 and C2, The inner side surface _Sa2 and the outer side surface _Sa3 of the insulating resin layer 51 composed of the first buried insulating layer 52a, the first interlayer insulating layer 53a, the second buried insulating layer 52b and the second interlayer insulating layer 53b are exposed. The upper surface _Sa1 of the insulating resin layer 51 is also exposed.

Subsequently, as shown in FIG. 5C, the surface layer portion of the insulating resin layer 51 covering the first and second coil patterns C1 and C2 is removed by ashing or the like. As a result, the upper surface _Sb1 of the second coil pattern C2 of the uppermost layer, the inner side surfaces _{Sb2 of the first and second coil patterns C1 and C2, and the outer side surfaces Sb3 of} the first and second coil patterns are exposed. becomes. Furthermore, the base insulating layer 30 formed on the main surface of the magnetic substrate 11 is also selectively removed, and the main surface 11a of the magnetic substrate 11 is exposed in a region that does not overlap with the coil portion 20 . In the removal of the insulating resin layer 51, as long as the shapes of the first and second coil patterns C1 and C2 can be maintained, the insulating resin existing inside the outer surface of the laminate of the first and second coil patterns C1 and C2 is removed. The layer 51 may be removed, and it is also possible to ash a region deeper than the surface layer of the insulating resin layer 51 .

Subsequently, as shown in FIG. 5D, after forming an inorganic insulating layer 56 on the entire surface of the magnetic substrate 11 including the exposed surfaces of the laminate of the first and second coil patterns C1 and C2, lead conductors 81, Unnecessary portions of the inorganic insulating layer 56 such as the forming region of 82 are selectively removed by photolithography and dry etching. By removing the surface layer portion of the insulating resin layer 51 and reattaching the inorganic insulating layer 56 in this manner, the volume of the insulating layer covering the first and second coil patterns C1 and C2 can be reduced.

Subsequently, as shown in FIG. 6(a), a first lead conductor 81 connected to the outer peripheral end of the first coil pattern C1 and a second lead conductor connected to the outer peripheral end of the second coil pattern C2. form 82; After that, as shown in FIG. 6B, the magnetic resin layer 12 is formed to cover the inorganic insulating layer 56, the magnetic resin is embedded in the inner diameter region 22 and the outer peripheral region 23 of the coil portion 20, and the upper region of the coil portion 20 is filled with magnetic resin. is covered with magnetic resin. Subsequently, as shown in FIG. 6C, the upper surface of the magnetic resin layer 12 is polished until the upper ends of the first and second lead conductors 81 and 82 are exposed. After that, the insulating film 15 is formed as shown in FIG. 6(d), and the external terminals E1 and E2 shown in FIG. 1 are formed to complete the coil component 1 according to the present embodiment.

As described above, in the coil component 1 according to the present embodiment, the outer periphery of the coil portion 20 is not covered with the insulating resin layer 51 but is covered with the thin inorganic insulating layer 56, so that the insulating property of the coil portion 20 is And the volume of the insulating layer can be reduced while maintaining the weather resistance. Therefore, the inductance of the coil can be improved by increasing the volume of the magnetic resin layer 12 .

FIG. 7 is a schematic cross-sectional view showing the configuration of a coil component according to a second embodiment of the invention.

As shown in FIG. 7, the feature of this coil component 2 is that a thin surface layer portion of the insulating resin layer 51 exists at the boundary portion between the coil portion 20 and the insulating resin layer 12, and a part of the insulating resin layer 51 is The point is that the outer surface of the coil portion 20 is entirely covered. In the first embodiment, as shown in FIGS. 5B and 5C, the insulating resin layer 51 covering the upper surface _Sb1 , the inner side surface _Sb2 , and the outer side surface _Sb3 of the laminate of the coil patterns C1 and C2 is The surface layer is completely removed and the coil patterns C1 and C2 are completely exposed. not exposed. Therefore, the surface layer portion of the insulating resin layer 51 is interposed between the laminate of the first and second coil patterns C1 and C2 and the inorganic insulating layer 56, and the coil patterns C1 and C2 are in contact with the inorganic insulating layer 56. not. Other configurations are the same as those of the first embodiment.

In manufacturing the coil component 2 according to the present embodiment, when removing the exposed portions of the insulating resin layer 51 covering the first and second coil patterns C1 and C2 shown in FIG. The insulating resin layer 51 is not completely removed, but processed to such an extent that the surface layer portion of the insulating resin layer 51 is slimmed. That is, weaken the ashing power or shorten the processing time. By doing so, the volume of the insulating resin layer 51 can be reduced without exposing the coil patterns C<b>1 and C<b>2 from the insulating resin layer 51 .

As described above, in the coil component 2 according to the present embodiment, the outer periphery of the coil portion 20 is covered with the thin surface layer portion of the insulating resin layer 51, and the outer side is further covered with the thin inorganic insulating layer 56. , the inductance of the coil can be improved by increasing the volume of the magnetic resin layer 12 while maintaining the insulation and weather resistance of the coil portion 20 .

FIG. 8 is a schematic cross-sectional view showing the configuration of a coil component according to a third embodiment of the invention.

As shown in FIG. 8, the feature of this coil component 3 is that the surface layer portion of the insulating resin layer 51 remains locally between the laminate of the coil patterns C1 and C2 and the inorganic insulating layer 56, and the insulating resin The point is that the mottled surface layer portion of the layer 51 partially covers the outer surface of the coil portion. Therefore, the coil patterns C<b>1 and C<b>2 are only partially covered with the insulating resin layer 51 and are not completely covered, and are therefore in contact with the inorganic insulating layer 56 . Other configurations are the same as those of the second embodiment. This is a state in which the insulating resin layer 51 is incompletely removed, and is an intermediate state between the first embodiment and the second embodiment. This is achieved by slightly increasing the machining amount of 51 .

As described above, in the coil component 3 according to the present embodiment, the outer periphery of the coil portion 20 is fragmentarily covered with the thin surface layer portion of the insulating resin layer 51, and the outer side is further covered with the thin inorganic insulating layer 56. Therefore, not only can the weather resistance and moisture resistance of the coil portion 20 be improved, but also the inductance of the coil can be improved by increasing the volume of the magnetic resin layer.

FIG. 9 is a schematic cross-sectional view showing the configuration of a coil component according to a fourth embodiment of the invention. 10A and 10B are process diagrams showing a method of manufacturing the coil component shown in FIG.

As shown in FIG. 9, the feature of this coil component 4 is that the coil portion 20 is not sandwiched between the magnetic substrate 11 and the magnetic resin layer 12, but is sandwiched between two magnetic resin layers 12 and 13 on both sides of the coil portion 20. at the point where Other configurations are the same as those of the first embodiment.

In manufacturing the coil component 4 , as shown in FIG. 10A , a carrier substrate 90 such as a glass substrate is prepared instead of a magnetic substrate, and the base resin layer 30 is formed on the carrier substrate 90 . Next, as shown in FIG. 10B, the coil portion 20 and the magnetic resin layer 12 are formed on the carrier substrate 90 in the same manner as in the first embodiment. Next, the base resin layer 30 is carbonized with a laser beam, and the carrier substrate 90 is separated from the coil section 20 as shown in FIG. 10(c). Thereafter, as shown in FIG. 10(d), the semi-cured magnetic resin layer 13 supported by the film 91 is adhered to the back side of the coil portion 20 and cured. The inorganic insulating layer 56 may be formed on the bottom surface of the coil portion 20 by completely removing the base resin layer 30 before forming the magnetic resin layer 13 . The above completes the coil component 4 according to the present embodiment.

The coil component 4 according to this embodiment can also produce the same effects as those of the first embodiment. That is, not only can the weather resistance and moisture resistance of the coil portion 20 be improved, but also the inductance of the coil can be improved by increasing the volume of the magnetic resin layer. Further, by using the magnetic resin layer 13 instead of the magnetic substrate 11, it is possible to reduce the thickness of the coil component and improve the magnetic saturation characteristics.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention. Needless to say, it is included within the scope.

For example, in the above embodiment, the case where the insulating resin layer is completely removed, slimmed down, or the insulating resin is left fragmentarily has been explained, but the insulating resin layer 51 shown in FIG. It is also possible to completely omit the step of removing the surface layer of . In this case, since the insulating layer covering the outside of the coil portion 20 becomes thicker, the effect of increasing the volume of the magnetic resin layer 12 and improving the inductance of the coil cannot be expected, but the insulation and weather resistance can be sufficiently improved. .

1 to 4 coil component 11 magnetic substrate 11a main surfaces 12 and 13 of the magnetic substrate magnetic resin layer 12a main surface 15 of the magnetic resin layer insulating coating 20 coil portion 21 upper region 22 of the coil portion inner diameter region 23 of the coil portion outer periphery Region 24 Lower region of coil portion 30 Underlying insulating layer (insulating resin layer)
30a Upper surface 40a of base insulating layer 1st conductor layer 40b 2nd conductor layer 41a Seed pattern 42a Coil pattern 43a Inside dummy pattern 44a Outside dummy pattern 45 Through-hole conductor 51 Insulating resin layers 52a, 52b Embedded insulating layers 53a, 53b Interlayer insulation Layer 56 Inorganic insulating layer 81 Lead conductor 82 Lead conductor 90 Carrier substrate 91 Film C1 First coil pattern C2 Second coil pattern E1, E2 External terminal S _a1 Upper surface of insulating resin layer S _a2 Inner side surface of insulating resin layer S _a3 Insulating resin Layer Outer Side S _b1 Coil Pattern Laminate Top Side S _b2 Coil Pattern Laminate Inner Side S _b3 Coil Pattern Laminate Outer Side

Claims (11)

a coil portion including a laminate of a plurality of coil patterns embedded in a coil insulating layer;
and a magnetic resin layer covering the coil portion via the coil insulating layer,
The coil portion has a structure in which the coil patterns and insulating resin layers covering the coil patterns are alternately laminated,
The insulating resin layer is provided in an interlayer region between two coil patterns adjacent in the stacking direction and in a line region between adjacent turns of each coil pattern,
The coil insulation layer is composed of a combination of an insulation resin layer and an inorganic insulation layer,
A coil component, wherein the inorganic insulating layer covers the upper surface of the uppermost coil pattern, the inner side surface of the innermost turn of each coil pattern, and the outer side surface of the outermost turn of each coil pattern. The inorganic insulating layer is provided at a boundary portion between the coil portion and the magnetic resin layer,
2. The coil component according to claim 1, wherein said magnetic resin layer covers said coil portion via said inorganic insulating layer. 3. The coil component according to claim 2, wherein said insulating resin layer is not provided at a boundary portion between said coil portion and said magnetic resin layer. 3. The coil component according to claim 2, wherein a portion of said insulating resin layer is provided at a boundary portion between said coil portion and said magnetic resin layer. A portion of the insulating resin layer provided at the boundary between the coil portion and the magnetic resin layer entirely covers the outer surface of the coil portion, and the inorganic insulating layer is formed via the insulating resin layer. 5. The coil component according to claim 4, wherein the coil part is covered with a support. A portion of the insulating resin layer provided at a boundary portion between the coil portion and the magnetic resin layer partially covers the outer surface of the coil portion, and a portion of the inorganic insulating layer is a portion of the coil portion. 5. The coil component of claim 4, wherein the coil component is in contact with the a step of alternately laminating conductor layers including coil patterns and insulating resin layers covering the coil patterns to form a coil portion;
a step of removing at least a portion of a surface layer portion of the insulating resin layer covering the outside of the coil pattern laminate;
forming an inorganic insulating layer covering the coil portion;
Forming a magnetic resin layer covering the coil part via the inorganic insulating layer,
The step of removing at least a portion of the surface layer of the insulating resin layer includes a top surface portion of the insulating resin layer covering the top surface of the coil pattern laminate, and an innermost circumferential turn of the coil pattern laminate. A method of manufacturing a coil component, comprising removing an inner peripheral side portion covering an inner side surface and an outer peripheral side portion covering an outer side surface of an outermost turn of the laminate of coil patterns. The step of removing at least part of the surface layer of the insulating resin layer includes leaving the insulating resin layer in an interlayer region between two coil patterns adjacent in the stacking direction and a line region between adjacent turns of each coil pattern. The method for manufacturing the coil component according to claim 7. The step of removing the surface layer portion of the insulating resin layer exposes the uppermost surface of the coil pattern laminate, the inner side surface of the innermost turn, and the outer side surface of the outermost turn. 8. The method for manufacturing the coil component according to 7. The step of removing the surface layer portion of the insulating resin layer partially exposes the uppermost surface of the coil pattern laminate, the inner side surface of the innermost turn, and the outer side surface of the outermost turn. 8. The method for manufacturing the coil component according to 7. The step of removing the surface layer of the insulating resin layer includes removing the insulating resin layer without exposing the uppermost surface of the coil pattern laminate, the inner side surface of the innermost turn, and the outer side surface of the outermost turn. 8. The method of manufacturing a coil component according to claim 7, wherein the thickness of the surface layer portion of is reduced.

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