JP7326012B2 - processing equipment - Google Patents

Description

The present invention relates to a processing apparatus for processing a workpiece.

Generally, there is known a processing apparatus that cuts a wafer (work piece) held on a chuck table along streets and divides it into individual device chips. This type of processing apparatus has a touch panel type operation panel that displays an image of the wafer surface captured by the imaging unit and a plurality of operation keys, and various operations of the processing apparatus are performed through this operation panel. (See Patent Document 1, for example).

Here, as an example of the operation in the processing apparatus, an operation for setting alignment data, which is a data setting operation when performing full automation processing of the processing apparatus, for example, will be described. In full-automation processing with processing equipment, alignment targets set for each wafer are used to perform pattern matching with captured images, and by recognizing the desired processing position, positioning with respect to the streets is automatically executed with high accuracy. .

Such pattern matching enables accurate image processing by selecting the optimum target, setting the optimum focus and light intensity, and clarifying the contrast of the target imaged by the imaging unit. Alignment teach, which is performed prior to full-automation processing, allows the operator to perform various operations such as moving the chuck table, adjusting the focus of the imaging unit, and adjusting the amount of light when setting alignment data. This is done by manually operating various operation keys on the panel.

Japanese Patent Application Laid-Open No. 2008-4885

By the way, the processing apparatus described above is operated by a plurality of operators in shifts. When operating processing equipment, the time required for an operator to operate varies greatly from operator to operator, and skill in various operations is greatly related to processability (production volume and yield per unit time), so skill improvement is desired. there is

However, there is currently no record of how each operator operates a plurality of operation keys to drive each component of the processing apparatus. For example, in the alignment data setting mode operation described above, although the number of times the operation keys are pressed and the procedure to be performed differ depending on the operator, the operator's operation procedure is unknown and it is impossible to look back later. , it is difficult to share the skills of setting operation.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a processing apparatus in which the operator's operational skills are shared and the operator's skill is improved.

In order to solve the above-described problems and achieve the object, the present invention provides a machining unit for machining a workpiece held on a chuck table, an imaging unit for imaging the workpiece, and an imaging unit for imaging the workpiece. Machining comprising: an operation panel for displaying an image of the surface of the processed workpiece and displaying a plurality of operation keys for executing various control functions of the processing apparatus; and a control unit for controlling the various control functions. The apparatus, wherein the control unit controls the operation keys operated by the operator and the timing of the operation in a series of arbitrary operations for operating the operation panel by the operator, and during the course of the arbitrary series of operations. An operation screen image storage unit that stores operation screen images displayed on the operation panel at arbitrary intervals as operation data in chronological order; and an operation screen image reproduction control unit for outputting and reproducing on the operation panel .

Also, the arbitrary interval may be the timing at which the operator operates the operation key and the operation screen displayed on the operation panel is changed. Further, the control unit may include an operator information registration section for registering information of an operator who performs an operation, and the operation data may be stored in association with the operator information.

Further, the operation screen image reproduction control unit reads out the operation data corresponding to the operator selected from among the plurality of operators from the operation screen image storage unit, and reproduces the plurality of operations performed by the operator on the operation panel. The screen images may be reproduced in chronological order according to the order of operations.

Since the processing apparatus according to the present invention stores the operation keys operated by the operator and the operation timing as operation data in chronological order, by reproducing the operation data, a plurality of operators can share the operation data. It is possible to improve the operation skill of the operator.

FIG. 1 is a partial external perspective view showing an example of a processing apparatus according to this embodiment. FIG. 2 is a plan view showing a configuration example of a wafer processed by the processing apparatus according to this embodiment. FIG. 3 is a schematic front view showing a configuration example of the light source of the imaging unit. FIG. 4 is a functional block diagram showing a configuration example of a control unit. FIG. 5 is a diagram showing an example of an operation screen image displayed during wafer θ adjustment and target setting. FIG. 6 is a diagram showing an example of an operation screen image displayed when registering a cutting position. FIG. 7 is a diagram showing an example of an operation screen image displayed when adjusting the focus of a captured image. FIG. 8 is a diagram showing an example of an operation screen image displayed when adjusting the focus of a captured image. FIG. 9 is a diagram showing an example of an operation screen image displayed when adjusting the light amount of a captured image. FIG. 10 is a diagram showing an example of an operation screen image displayed when adjusting the light amount of a captured image. FIG. 11 is a diagram showing an example of a screen configuration for selecting operator operation data in the alignment data education mode.

Hereinafter, a processing apparatus according to this embodiment will be described with reference to the drawings. FIG. 1 is a partial external perspective view showing an example of a processing apparatus according to this embodiment, and FIG. 2 is a plan view showing a configuration example of a wafer processed by the processing apparatus according to this embodiment. FIG. 3 is a schematic front view showing a configuration example of the light source of the imaging unit.

A processing apparatus 10 according to the present embodiment is a cutting apparatus that cuts a wafer (workpiece) 100 along streets (dividing lines) 103 . As shown in FIG. 1, the processing apparatus 10 has, as a basic configuration, a chuck table 11 that holds the wafer 100, an imaging unit 12, a processing unit 13, a driving means 14, a Z-axis moving means 15, a control unit (control section ) 16 and an operation panel 17 .

The wafer 100 is adhered to the surface of an adhesive tape 107 attached to an annular frame 108, as shown in FIG. The wafer 100 is partitioned into a plurality of regions by a plurality of streets 103 formed in a grid pattern on the front surface 101, and devices 104 such as ICs, LSIs, etc., which are semiconductor chips, are formed in the partitioned regions. The wafer 100 configured in this way has its back surface 102 adhered to an adhesive tape 107 attached to an annular frame 108 with its front surface 101 facing upward.

The chuck table 11 has a holding surface 11a that holds the wafer 100 by suction, and is connected to a motor 19 so as to be rotatable. The chuck table 11 is provided so as to be movable in the X-axis direction, which is horizontal with respect to the holding surface 11a, by means of a well-known X-axis moving means 22 including a ball screw 20, a nut, a pulse motor 21, and the like. Thereby, the chuck table 11 can move the wafer 100 held on the chuck table 11 relative to the imaging unit 12 and the processing unit 13 in the X-axis direction.

The imaging unit 12 is an electron microscope equipped with a CCD camera or the like for imaging the surface 101 of the wafer 100 held on the holding surface 11 a of the chuck table 11 . The imaging unit 12 can switch between low-magnification (Lo) macro-imaging and high-magnification (Hi) micro-imaging to image the surface 101 of the wafer 100 . A region portion to be cut is detected based on the image information acquired by the imaging unit 12 and used for positioning of the machining operation by the machining unit 13 . The imaging unit 12 includes a light source 23 for illuminating the surface of the wafer 100 held on the holding surface 11a of the chuck table 11, as shown in FIG. The light source 23 is composed of a vertical light source 23a that illuminates the wafer 100 from directly above and an oblique light source 23b that illuminates the wafer 100 from an oblique direction.

The processing unit 13 forms cutting grooves by cutting the wafer 100 held on the holding surface 11a of the chuck table 11 along the streets 103 with a rotating ring-shaped ultra-thin cutting blade 24 . The imaging unit 12 is integrated by being attached and supported by a part of the housing 25 for the processing unit 13, and can be moved in the Z-axis direction by the Z-axis moving means 15 such as a ball screw, a nut, and a pulse motor 26. is provided in Y-axis moving means 27 for moving the imaging unit 12 and the processing unit 13 relative to the holding surface 11a of the chuck table 11 in the Y-axis direction comprises a ball screw 28, a nut, a pulse motor 29, and the like. The driving means 14 is configured together with the axial moving means 22 .

The operation panel 17 is disposed at a location on the housing of the processing apparatus 10 that is easy to see and easy to operate. Under the control of the control unit 16, the operation panel 17 is a display panel for displaying an image of the surface 101 of the wafer 100 captured by the imaging unit 12 and various information necessary for processing, and for performing input operations necessary for processing. and a touch panel functioning as an operation key for.

The processing apparatus 10 having the above configuration moves the chuck table 11 with respect to the processing unit 13 in the X-axis direction by the X-axis moving means 22 while cutting the cutting blade 24 rotated at high speed into the wafer 100 to a predetermined cutting depth. relative processing feed. Thus, the streets 103 on the wafer 100 can be cut to form cut grooves. After forming cutting grooves for all the streets 103 in the same direction, the wafer 100 is rotated by 90° by rotating the chuck table 11, and all the streets 103 newly arranged in the X-axis direction are similarly processed by the processing unit 13. can be divided into individual devices 104 by repeating the cutting process.

Next, the configuration of the control system provided in the processing apparatus 10 of this embodiment will be described. FIG. 4 is a functional block diagram showing a configuration example of a control unit. The control unit 16 includes a control section 30 and a registration section 40 . The control unit 30 can be composed of a microprocessor or a microcomputer having an arithmetic processing unit composed of, for example, a CPU, a ROM, a RAM, etc., and controlling the processing apparatus 10 as a whole. The control unit 30 has a central control unit 31, a display control unit 32, an operation screen image reproduction control unit 33, and an image processing unit 34 as functional internal configurations. The central control unit 31, the display control unit 32, the operation screen image reproduction control unit 33, and the image processing unit 34 may be composed of software (computer programs) or hardware. Furthermore, it may be configured by combining software and hardware.

The central control unit 31 controls overall operations of the processing apparatus 10 according to operation information operated on the operation panel 17 . The central control unit 31 also controls the imaging operation of the imaging unit 12 having the light source 23 during alignment and kerf check, and also controls processing of image information captured by the imaging unit 12 . As the processing control of the image information, the image information captured by the image pickup unit 12 is stored in the registration unit 40 as it is, or the image information is processed in the image processing unit 34 and then stored in the registration unit 40. The display control unit 32 controls display contents such as images captured by the imaging unit 12 displayed on the operation panel 17 and various operation keys necessary for processing, and also controls display according to input information operated on the operation panel 17. I do.

The operation screen image reproduction control unit 33 reproduces a plurality of operation screen images (operation data) including operation keys operated on the operation panel 17 in accordance with the order of operations in a series of arbitrary operations for the operator to operate the operation panel 17. Play processing. In the present embodiment, the operation screen image reproduction control unit 33 sequentially switches operation screen images (transition screen images) including various operation keys as an arbitrary series of operations, for example, during an alignment teach operation, in accordance with the order of operations. displayed. At this time, in the alignment teaching operation, the operation screen image reproduction control unit 33 sequentially switches and displays the operation screen image corresponding to each operation at the timing (time interval) when the operator actually operates from the start of the teaching operation. Further, the operation screen image reproduction control unit 33 displays the operation keys or operation areas actually touched (operated) by the operator in a different color from the surroundings. Such an operation screen image is stored according to the order of operations together with the timings of operations performed by the operator from the start of the teaching operation, for example, when the above-described alignment data setting mode is executed. The image processing unit 34 performs image processing on image information captured by the imaging unit 12 .

The registration unit 40 has a storage unit 41 , a panel display screen storage unit 42 , an operation screen image storage unit 43 and an operator information storage unit (operator information registration unit) 44 . The storage unit 41, the panel display screen storage unit 42, the operation screen image storage unit 43, and the operator information storage unit 44 may use, for example, a semiconductor memory device such as a flash memory, or a HDD (Hard Disk). A storage device such as a drive) may be used.

The storage unit 41 stores various data and control programs. The panel display screen storage unit 42 stores display screen information in which display patterns such as operation keys corresponding to various modes are set. The operation screen image storage unit 43 stores the operation keys of the operation panel 17 and the operation timings (operation data) in an arbitrary series of operations for the operator to operate the operation panel 17 along the operation order (time series). In the present embodiment, the operation screen image storage unit 43 stores, for example, the operation timing (the time from the start) each time an operation is performed on the operation panel 17 when executing the alignment data setting mode in the alignment teaching operation. ) and a plurality of operation screen images (operation data) according to the order of operations. Here, the operation screen image storage unit 43 also stores the coordinate information of the position (area) touched (operated) by the operator on the operation panel 17 in association with the operation screen image and the operation order.

The operator information storage unit 44 stores operator information (for example, a unique number of each operator) who operates the processing apparatus 10 . The operation screen image storage unit 43 stores the information of the series of operation screen images and the operator information in association with each other.

Next, operation of the control unit 16 of the processing apparatus 10 will be described. In the present embodiment, as an example of a series of arbitrary operations for operating the operation panel 17, the operations in the alignment data setting mode in the alignment teaching operation will be described. FIG. 5 is a diagram showing an example of an operation screen image displayed during wafer θ adjustment and target setting. FIG. 6 is a diagram showing an example of an operation screen image displayed when registering a cutting position. 7 and 8 are diagrams showing examples of operation screen images displayed when adjusting the focus of a captured image. 9 and 10 are diagrams showing examples of operation screen images displayed when adjusting the light amount of a captured image. The operation screen image described above is an example showing a part of the operation screen when executing the alignment data setting mode.

The operator of the processing device 10 reads the operator information of himself (for example, operator A) stored in advance in the operator information storage unit 44 and sets him as an operator who will be in charge of operating the processing device 10 from now on. As a result, when executing the alignment data setting mode, operation data including various operation screen images for the operation panel 17, operation timing, and operation coordinate positions are associated with the responsible (self) operator information. It is stored in the screen image storage unit 43 .

When an operator starts an operation by touching, for example, a "teach button" from a top menu screen (not shown), an operation screen image ("teach" screen) is displayed on the operation panel 17 (FIG. 1). Operation timing (time from the start of the setting mode) is stored in the operation screen image storage unit 43 . As shown in FIG. 5, the operation screen image includes an image display area 50 provided in the left half of the central portion to display an image captured by the imaging unit 12, and an image display area 50 on the side (right side) of the image display area 50. A first operation key area 60 provided and a second operation key area 70 provided below the image display area 50 are provided.

The image display area 50 includes a captured image 51 of the wafer surface, a target window 52 located in the center of the captured image 51 for selecting a target provided on the wafer surface, and a control function of an alignment data setting mode. A plurality of operation keys 53 for performing are displayed in an overlapping manner. The captured image 51 can be displayed by switching between a low-magnification (Lo) macro-captured image and a high-magnification (Hi) micro-captured image depending on the microscope magnification of the imaging unit 12 . The target window 52 can be freely resized. The operation keys 53 have a Y-axis operation key 54 displayed on the right side of the image display area 50 and an X-axis operation key 55 displayed on the bottom side. The Y-axis operation key 54 is composed of operation keys 54a and 54b for moving the captured image 51 up and down within the image display area 50, respectively. The X-axis operation key 55 includes operation keys 55a and 55b for moving the captured image 51 left and right within the image display area 50, respectively.

A first operation key area 60 is an area in which operation keys for advancing operations in the alignment data setting mode are arranged. An EXIT key 62 is provided for exiting to the screen of the hierarchy.

The second operation key area 70 is an area in which function keys (operation keys) for performing control functions of the alignment data setting mode are arranged. These function keys are switched by software according to the displayed screen. In the "Teach" screen, for example, a window adjustment key 71 for transitioning to a screen for adjusting the target window 52, a θ adjustment key 72 for performing θ adjustment of the wafer 100, and a light intensity key 73 for transitioning to a light intensity adjustment screen for the light source 23. , a focus key 74 for transitioning to the focus adjustment screen of the imaging unit 12, and a magnification change key 75 for switching the magnification of the imaging unit 12 between low magnification (Lo) and high magnification (Hi).

[θ alignment]
When the operation screen image described above is displayed on the operation panel 17, the operator performs θ alignment to match (align) the direction of the wafer 100 on the chuck table 11 and the X-axis direction (processing feed direction). . This θ matching is performed in two stages: low magnification θ matching performed using a low magnification macro image and high magnification θ matching performed using a high magnification micro image. Low-magnification θ alignment is rough alignment between the orientation of the wafer 100 and the X-axis direction (processing feed direction), and high-magnification θ alignment is precise alignment between the orientation of the wafer 100 and the X-axis direction (processing feed direction). .

In this embodiment, each time the display screen displayed on the operation panel 17 is changed or at predetermined intervals, the operation screen image is stored in the operation screen image storage unit 43 . At this time, the timing at which each operation key is operated (the time from the start of the setting mode) and the coordinate information of the operated position on the operation panel 17 are also stored in association with the operation screen image. The same applies to the following operations.

When performing low-magnification θ alignment, the operator positions the vicinity of one end (for example, the left end) of the wafer 100 below the imaging unit 12 and operates the Y-axis operation key 54 and the X-axis operation key 55, respectively. After aligning the center of the target window 52 with the edge line of the device 104 in 51, the θ alignment key 72 is touched. Next, the operator positions the vicinity of the other end (for example, the right end) of the wafer 100 under the imaging unit 12, aligns the center of the target window 52 with the edge line of the device 104 in the captured image 51, and then adjusts θ again. Touch key 72 . Accordingly, the central control unit 31 performs rough correction of the θ angle from the distance in the X-axis direction and the distance in the Y-axis direction. A series of operation screen images related to the low magnification θ adjustment operation are stored in the operation screen image storage unit 43 .

When performing high-magnification θ adjustment, the operator touches the magnification change key 75 to set the magnification of the imaging unit 12 to high magnification (Hi). In this high-magnification state, the operator performs the high-magnification θ-matching by the same operation as the low-magnification θ-matching described above. Accordingly, the central control unit 31 executes precise correction of the θ angle from the distance in the X-axis direction and the distance in the Y-axis direction. Also, a series of operation screen images relating to the operation of high-magnification θ adjustment are stored in the operation screen image storage unit 43 .

[Target setting]
Next, the operator sets targets provided on the wafer surface. This target setting is an operation for setting a target that serves as a reference for wafer alignment, and is performed in two steps: macro target setting using a low-magnification macro image and micro target setting using a high-magnification micro image. will be

When performing macro target setting, the operator touches the magnification change key 75 to set the magnification of the imaging unit 12 to low magnification (Lo). In this low-magnification state, the operator operates the Y-axis operation key 54 and the X-axis operation key 55 to move a predetermined target in the captured image 51 into the target window 52 . Next, the operator positions the target within the target window 52 and touches the ENTER key 61, for example. Thereby, the central control unit 31 executes the target check. This target check determines whether the target selected by the target window 52 is appropriate.

If the target check for determining whether the target is appropriate is unsatisfactory, the operator starts over from setting the target. Also, if the target check is good, a message to that effect is displayed on the operation panel 17, so the operator touches the ENTER key 61 to end the macro target setting. A series of operation screen images related to these macro target settings are stored in the operation screen image storage unit 43 .

When setting the micro target, the operator touches the magnification change key 75 to set the magnification of the imaging unit 12 to high magnification (Hi). In this high-magnification state, the operator operates the Y-axis operation key 54 and the X-axis operation key 55 to display a predetermined target (a target other than the macro target setting) in the captured image 51. . Next, after touching the window adjustment key 71, the operator adjusts the size of the target window 52 according to the target 57, and displays the target window 52 of this adjusted size overlapping the target 57. . Since the adjustment of the size of the target window 52 differs depending on the operator, storing the operation screen image including the target window 52 of the adjusted size is very important, for example, for operators who are unfamiliar with operations. A learning material. Next, the operator touches the ENTER key 61, for example, while the target window 52 is superimposed on the target 57 and displayed. Thereby, the central control unit 31 executes the target check. If the target check fails, the operator starts over from target setting. Also, if the target check is good, a message to that effect is displayed on the operation panel 17, so the operator touches the ENTER key 61 to end micro target setting. A series of operation screen images related to these micro target setting operations are stored in the operation screen image storage unit 43 .

[Street Adjust]
The street adjustment is an operation for setting (storing) in the processing apparatus 10 the distance from the target 57 to the street 103 to be processed, for example, which is set in the micro target setting described above. In the “street adjust” screen, a hairline narrow key 77A and a hairline wide key 77B are set in the second operation key area 70 . In addition, in the image display area 50, a hairline 58 is displayed superimposed on the high-magnification captured image 51. As shown in FIG.

The operator operates the Y-axis operation key 54 and the X-axis operation key 55 to move the street 103 to be displayed in the captured image 51 as shown in FIG. Next, the operator operates the hairline narrow key 77A or the hairline wide key 77B to align the street 103 of the captured image 51 with the hairline 58, and touches the ENTER key 61. FIG. As a result, the distance (adjustment amount) from the target 57 to the processed street 103 is set in the storage unit 41, and the street adjustment is completed. A series of operation screen images related to these street adjustment operations are stored in the operation screen image storage unit 43 .

In the alignment data setting mode described above, for example, it is effective to set a high-contrast target in the target setting operation. For this reason, in order to perform the target check well and complete the alignment data setting operation in a short time, it is necessary to set the focus of the imaging unit 12 and adjust the light amount of the light source 23 .

Next, the focus setting of the imaging unit 12 and the operation of adjusting the light amount of the light source 23, which are appropriately performed by the operator in the alignment data setting mode, will be described.

[Focus Setting]
Focus setting is an operation for focusing a captured image. As shown in FIG. 7, when the captured image 51 out of focus is displayed in the image display area 50, when the operator touches the focus key 74, the operation screen image shown in FIG. Adjustment” screen) is displayed. Adjustment keys 78 (for example, autofocus) relating to focus adjustment are set as function keys (operation keys) arranged in the second operation key area 70 on the "focus adjustment" screen. The focus is adjusted when the operator touches the adjustment key 78 . A series of operation screen images related to these focus setting operations are stored in the operation screen image storage unit 43 .

[Light intensity adjustment]
The light amount adjustment is for adjusting the contrast of the captured image by changing the balance between the incident light source 23a and the oblique light source 23b of the light source 23. FIG. As shown in FIG. 9, when a high-magnification captured image 51 including a low-contrast target 57 is displayed in the image display area 50, when the operator touches the light amount key 73, the operation shown in FIG. A screen image (“light intensity adjustment” screen) is displayed. A light amount change key 79 for changing the light amount of the light source 23 is set as a function key (operation key) arranged in the second operation key area 70 on the "light amount adjustment" screen. By operating the light amount change keys 79 respectively, the operator can obtain a captured image 51 in which the contrast of the target 57 is increased, as shown in FIG. A series of operation screen images related to these light amount adjustment operations are stored in the operation screen image storage unit 43 .

Next, the operation of the alignment data training mode will be described. FIG. 11 is a diagram showing an example of a screen configuration for selecting operator operation data in the alignment data education mode. When the operator touches, for example, an "educational mode button" on the top menu screen (not shown), an operator's operation data selection screen 80 is displayed on the operation panel 17 as shown in FIG.

Icons 81A, 81B, and 81C for selecting operation data of operators A, B, and C are displayed on this operation data selection screen 80 . A series of operation data when setting alignment data is stored in the operation screen image storage unit 43 in association with a plurality of operation screen images, operation timings, and coordinate information of operation positions. Each icon 81A to 81C displays the operator name and the time required for the setting operation. When the operator to be trained touches the icon 81A to 81C of the operator whose operation data is to be confirmed, the operation screen image reproduction control unit 33 reads out the operation data corresponding to the selected operator from the operation screen image storage unit 43, and performs alignment. When data is set, a plurality of operation screen images operated by the operator on the operation panel 17 are reproduced in chronological order according to the operation order.

In addition, the operation screen image reproduction control unit 33 switches the operation screen image according to the timing (interval) at which the corresponding operation is performed from the start of the operation, and also determines the color of the actually operated operation key or operation area from the coordinate information. Display by changing with the surroundings. This allows the operator to visually learn how many times (how many times) which operation keys are actually operated to process a series of setting operations, so that operation skills can be shared among operators. can. In particular, the tips for adjusting the light intensity of the light source 23 and adjusting the size of the target window 52 are difficult to convey in sentences.

In addition, in this embodiment, a series of operation data at the time of setting alignment data is stored for each operator, and this operation data can be reproduced. For this reason, for example, by comparing the actual operation of an operator who takes a long time to perform setting operations and an operator who takes a long time, it is possible to determine which operations the operator takes time to perform and to It is possible to easily determine how the operator is devising and operating. Therefore, by sharing operation skills among operators, it is possible to improve the operation skills of each operator.

As described above, according to the present embodiment, the processing unit 13 for processing the wafer 100 held on the chuck table 11, the imaging unit 12 for imaging the wafer 100, and the image of the wafer surface captured by the imaging unit 12 are displayed. and an operation panel 17 that displays a plurality of operation keys for executing various control functions of the processing apparatus 10, and a control unit 16 that controls the various control functions. In a series of arbitrary operations to be operated, since operation screen images including operation keys operated by the operator and operation timings are stored in chronological order as operation data, for example, the stored operation screen images can be reproduced in chronological order. This enables multiple operators to share operation data and improve their operation skills.

Further, according to the present embodiment, the control unit 16 includes the operation screen image storage unit 43 that stores operation screen images displayed on the operation panel 17 during an arbitrary series of operations at arbitrary intervals as the operation data. and an operation screen image reproduction control unit 33 for continuously outputting a plurality of operation screen images according to intervals of actual operation by the operator and reproducing them on the operation panel 17, so that the operator can actually select which operation key. You can visually learn how much you operate to process a series of actions. Therefore, operation skills can be shared among operators.

Moreover, since the arbitrary interval is the timing at which the operator operates the operation key and the display screen displayed on the operation panel 17 changes, all the operations performed by the operator can be stored as the operation screen image. .

In addition, the control unit 16 includes an operator information storage unit 44 for registering operator information that performs operations, and since operation data including a series of operation screen images is stored in association with operator information, differences in operation by each operator can be minimized. can be visually compared. Therefore, by learning the strengths and weaknesses of each operator, it is possible to share the operation skills among the operators and improve the operation skills.

In addition, this invention is not limited to the said embodiment. That is, various modifications can be made without departing from the gist of the present invention. For example, in the above embodiment, the arbitrary interval for storing the operation screen image is the timing when the operator operates the operation key and the display screen displayed on the operation panel 17 is changed, but it is not limited to this. Instead, for example, a predetermined number of frames (eg, 5 to 20 frames) per unit time (eg, 1 second) may be stored continuously. Further, in the present embodiment, operation data including a series of operation screen images are stored, and these operation screen images are reproduced in chronological order. may be reproducible in the processing apparatus by means of operation data storing a series of operations for aligning the . In this case, the central control unit 31 functions as a reproduction unit that reproduces a series of operations during alignment.

REFERENCE SIGNS LIST 10 processing device 11 chuck table 12 imaging unit 13 processing unit 16 control unit 17 operation panel 23 light source 23a incident light source 23b oblique light source 30 control section 31 central control section 33 operation screen image reproduction control section 40 registration section 43 operation screen image storage section 44 Operator information storage unit (operator information registration unit)
50 image display area 51 captured image 52 target window 58 hairline 100 wafer (workpiece)
103 Street 104 Device

Claims (4)

a machining unit for machining the workpiece held on the chuck table;
an imaging unit for imaging the workpiece;
an operation panel for displaying an image of the surface of the workpiece imaged by the imaging unit and displaying a plurality of operation keys for executing various control functions of the processing apparatus;
A processing apparatus comprising a control unit that controls the various control functions,
The control unit is
In an arbitrary series of operations in which the operator operates the operation panel, the operation keys operated by the operator, the operation timing , and an arbitrary interval displayed on the operation panel during the progress of the arbitrary series of operations. an operation screen image storage unit that stores operation screen images in chronological order as operation data;
an operation screen image reproduction control unit for continuously outputting the plurality of operation screen images according to the intervals at which the operator actually operates them and reproducing them on the operation panel;
A processing device comprising : 2. The processing apparatus according to claim 1 , wherein the arbitrary interval is timing when an operator operates the operation key and an operation screen displayed on the operation panel is changed. The control unit is
Equipped with an operator information registration unit for registering operator information that performs operations,
3. The processing apparatus according to claim 1 , wherein said operation data is stored in association with said operator information. The operation screen image reproduction control unit reads the operation data corresponding to the operator selected from the plurality of operators from the operation screen image storage unit, and reproduces a plurality of operation screen images operated by the operator on the operation panel. 4. The processing apparatus according to claim 3, wherein the are reproduced in chronological order according to the order of operations.

Images