JP7311253B2 - 半導体製造装置のためのユーザ相互作用を自動化するシステムおよび方法 - Google Patents

半導体製造装置のためのユーザ相互作用を自動化するシステムおよび方法 Download PDF

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JP7311253B2
JP7311253B2 JP2018168409A JP2018168409A JP7311253B2 JP 7311253 B2 JP7311253 B2 JP 7311253B2 JP 2018168409 A JP2018168409 A JP 2018168409A JP 2018168409 A JP2018168409 A JP 2018168409A JP 7311253 B2 JP7311253 B2 JP 7311253B2
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substrate processing
processing tool
tool
operator
database
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JP2019083309A (ja
JP2019083309A5 (enExample
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レイナー・ウンターグッゲンベルガー
ヘンリー・チャン
チュン－ホ・フアン
ビンセント・ウォン
デビッド・ヘンカー
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Lam Research Corp
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Lam Research Corp
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/0265—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/25—Pc structure of the system
    • G05B2219/25236—Detail, detect presence of operator to wake up system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/26—Pc applications
    • G05B2219/2602—Wafer processing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32128—Gui graphical user interface
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36039—Learning task dynamics, process
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36297—Machining plan, indicate order of machining as function of presence of operator
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0267—Fault communication, e.g. human machine interface [HMI]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0283—Predictive maintenance, e.g. involving the monitoring of a system and, based on the monitoring results, taking decisions on the maintenance schedule of the monitored system; Estimating remaining useful life [RUL]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • User Interface Of Digital Computer (AREA)
  • General Factory Administration (AREA)
JP2018168409A 2017-09-11 2018-09-10 半導体製造装置のためのユーザ相互作用を自動化するシステムおよび方法 Active JP7311253B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762556733P 2017-09-11 2017-09-11
US62/556,733 2017-09-11
US16/119,202 US10747210B2 (en) 2017-09-11 2018-08-31 System and method for automating user interaction for semiconductor manufacturing equipment
US16/119,202 2018-08-31

Publications (3)

Publication Number Publication Date
JP2019083309A JP2019083309A (ja) 2019-05-30
JP2019083309A5 JP2019083309A5 (enExample) 2021-10-21
JP7311253B2 true JP7311253B2 (ja) 2023-07-19

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JP2018168409A Active JP7311253B2 (ja) 2017-09-11 2018-09-10 半導体製造装置のためのユーザ相互作用を自動化するシステムおよび方法

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US (1) US10747210B2 (enExample)
EP (1) EP3454141B1 (enExample)
JP (1) JP7311253B2 (enExample)
KR (1) KR102637272B1 (enExample)
CN (1) CN109637947B (enExample)
SG (1) SG10201807788QA (enExample)
TW (1) TWI782085B (enExample)

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JP7244367B2 (ja) * 2019-06-20 2023-03-22 ファナック株式会社 加工指令改良システム及び加工指令改良方法
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US11782397B2 (en) * 2019-11-27 2023-10-10 Johnson Controls Tyco IP Holdings LLP Operator automation system
CN113642819B (zh) * 2020-05-11 2024-12-20 上海华力集成电路制造有限公司 连环许容时间区段站点异常时产品自动调度装置和方法
US11901204B2 (en) * 2020-05-22 2024-02-13 Applied Materials, Inc. Predictive wafer scheduling for multi-chamber semiconductor equipment
US12020961B2 (en) * 2020-06-22 2024-06-25 Lavorro, Inc. Automated assistance in a semiconductor manufacturing environment
US11545379B2 (en) * 2020-07-31 2023-01-03 Nanya Technology Corporation System and method for controlling semiconductor manufacturing equipment
US12593646B2 (en) * 2021-04-28 2026-03-31 Tel Manufacturing And Engineering Of America, Inc. Automated fault detection in microfabrication
JP7858400B2 (ja) * 2021-05-27 2026-05-14 東京エレクトロン株式会社 基板処理装置及びリカバリ処理方法
US12652993B2 (en) 2021-05-27 2026-06-09 Tokyo Electron Limited Board processing equipment and recovery processing method
US20230113095A1 (en) * 2021-10-13 2023-04-13 Applied Materials, Inc. Verification for improving quality of maintenance of manufacturing equipment
KR102587791B1 (ko) * 2021-12-30 2023-10-12 한국세라믹기술원 미세채널을 갖거나 다공성재질을 갖는 피증착물에 대한 원자층증착 시뮬레이션 방법
KR102737299B1 (ko) * 2022-03-10 2024-12-02 한국수력원자력 주식회사 인공지능을 이용하여 플랜트의 이상상태에 대한 조치사항을 제공하는 방법
JP7575432B2 (ja) * 2022-08-26 2024-10-29 株式会社アルバック 情報処理装置、情報処理方法およびプログラム
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JP2013518449A (ja) 2010-01-29 2013-05-20 東京エレクトロン株式会社 半導体製造ツールを自己学習及び自己改善するための方法及びシステム
JP2014519182A (ja) 2011-03-21 2014-08-07 東京エレクトロン株式会社 生物学に基づくチャンバマッチング
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Publication number Publication date
JP2019083309A (ja) 2019-05-30
US20190079503A1 (en) 2019-03-14
TWI782085B (zh) 2022-11-01
KR102637272B1 (ko) 2024-02-15
US10747210B2 (en) 2020-08-18
EP3454141B1 (en) 2023-11-15
SG10201807788QA (en) 2019-04-29
CN109637947B (zh) 2023-06-20
CN109637947A (zh) 2019-04-16
TW201921241A (zh) 2019-06-01
EP3454141A1 (en) 2019-03-13
KR20190029465A (ko) 2019-03-20

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