JP7295355B1 - Machining information display device, laser processing control device, and processing information display program - Google Patents

Abstract

The present disclosure includes a display unit that displays processing information including a processing path and a beam profile when performing laser processing, an input unit that selects and inputs a specific processing position on the displayed processing route, and an input A processing information display device comprising: a control unit having a function of determining a beam profile at the processing position based on the processing position. The control unit includes a processing condition acquisition unit that acquires laser processing conditions for processing a processing path, a selection processing condition extraction unit that extracts a selection processing condition at the processing position from the laser processing conditions, and the selection processing. a profile determination unit that determines a beam profile at a position corresponding to the processing position based on conditions.

Description

The present disclosure relates to a processing information display device, a laser processing control device, and a processing information display program.

A laser processing device such as a laser cutting machine or a laser welding machine transmits a laser beam output from a laser oscillator to irradiate a work, and performs a predetermined processing by relatively moving the laser beam and the work. can be done. In particular, in order to obtain a good cut cross section in laser cutting or to obtain a stable weld bead in laser welding, irradiation conditions (for example, It is desirable to appropriately adjust the laser output and energy density for each processing position.

In such laser processing, if the processing path for the workpiece consists of a simple straight line, it is necessary to change the irradiation conditions per unit processing length if processing is performed at a constant processing speed and a constant laser output. do not have. However, if laser beam cutting, marking, etc. are mixed in a series of processing programs, the melting depth and width of the laser beam will differ depending on the required processing, so Therefore, it is necessary to adjust and control the irradiation conditions of .

Thus, in adjusting or controlling the irradiation conditions of the laser beam on the machining path, if there is a display device that displays various machining conditions on the machining path on a single screen, the various machining conditions on the machining path can be displayed. This is preferable because it can be grasped at a glance. As an example of such a display device, for example, Patent Document 1 discloses a processing path display device that displays a processing path in a laser processing machine. an acquisition unit, a laser processing head coordinate calculation unit that calculates the coordinate values of the laser processing head from the position information and information on the mechanical configuration of the laser processing machine, a first data acquisition unit that acquires processing data related to laser processing, and a second a two-data acquisition unit, a display format setting unit that sets a display format according to the acquired processing data, and a display unit that displays a processing path based on the coordinate values of the laser processing head and the set display format; , is disclosed.

Japanese Patent Application Laid-Open No. 2018-180780

Conventionally known machining path display devices display the positional information on the machining path in association with the machining data acquired during machining. There is an advantage that it is easy to grasp the relationship between the point of whether it is or not, or the relationship between the quality of processing and the correspondence. However, since such a machining path display device creates image data to be displayed based on the results of actual machining according to a machining program, it is necessary to perform so-called "trial machining", and the "trial machining" is required for the operator. There was a problem that the load of preparation and construction for doing " was large.

Further, in the conventional machining path display device, it is possible to express the magnitude of the machining conditions by displaying the predetermined machining conditions on the machining path with different colors or their shades. However, this technique only displays the distribution of machining conditions for the entire machining path, and cannot obtain the laser beam irradiation state (for example, beam profile) at a predetermined machining position.

Under these circumstances, there is a demand for a technology that can predict and display the beam profile at a predetermined processing position on the processing path in laser processing based on a predetermined processing program without performing actual processing such as trial processing. ing.

A processing information display device according to a representative aspect of the present disclosure includes a display unit that displays processing information including a processing route when laser processing is performed, and a specific processing position on the displayed processing route that is selected and input. and a control unit having a function of determining a beam profile at the processing position based on the input processing position, the control unit acquiring laser processing conditions for processing the processing path. A condition acquisition unit, a selected processing condition extraction unit that extracts selected processing conditions at the processing position from the acquired laser processing conditions, and a profile determination unit that determines a beam profile at a position corresponding to the processing position based on the selected processing conditions. including the part and

1 is a schematic diagram showing the configuration of a processing information display device according to a first embodiment; FIG. 2 is a block diagram showing a specific configuration of a control unit shown in FIG. 1 and a relationship with peripheral devices; FIG. It is a schematic diagram which shows an example which displayed the processing path|route of the laser processing by 1st Embodiment on the display part. FIG. 10 is a schematic diagram showing an example of a display screen when cutting is performed; FIG. 10 is a schematic diagram showing an example of a display screen when cutting is performed; FIG. 5 is a schematic diagram showing an example of a display screen when marking processing is performed; FIG. 5 is a schematic diagram showing an example of a display screen when marking processing is performed; It is the schematic which shows the structure of the processing information display apparatus by 2nd Embodiment. 7 is a block diagram showing a specific configuration of a control unit shown in FIG. 6 and a relationship with peripheral devices; FIG. FIG. 5 is a schematic diagram showing an example of a display screen displaying an operation of changing a beam profile; FIG. 5 is a schematic diagram showing an example of a display screen displaying an operation of changing a beam profile; It is a block diagram which shows the specific structure of the control part in the modification of the processing information display apparatus by 2nd Embodiment, and the relationship with a peripheral device. It is a schematic diagram showing the configuration of a processing information display device according to a third embodiment. FIG. 11 is a schematic diagram showing an example when the processing information display device shown in FIG. 10 is specifically operated; FIG. 11 is a schematic diagram showing an example when the processing information display device shown in FIG. 10 is specifically operated; It is a schematic diagram showing an example of a laser processing apparatus provided with a laser processing control device including a processing information display device according to a fourth embodiment. 13 is a block diagram showing an example of the configuration of the laser processing control device shown in FIG. 12; FIG.

Hereinafter, embodiments of a display device having a function of displaying a laser processing state and a processing control device including the display device according to a typical example of the present disclosure will be described with reference to the drawings.

In addition, "based on XX" in the present disclosure means "based on at least XX", and includes cases based on other elements in addition to XX. Moreover, "based on XX" is not limited to the case of using XX directly, but also includes the case of being based on what has been calculated or processed with respect to XX. Here, "XX" means any element (for example, any information).

<First embodiment>
FIG. 1 is a schematic diagram showing the configuration of a processing information display device according to a first embodiment, which is a representative example of the present disclosure. FIG. 2 is a block diagram showing the specific configuration of the control unit shown in FIG. 1 and the relationship with peripheral devices.

As shown in FIG. 1, the processing information display device 100 includes, as an example, a display unit 110 that displays processing information including a processing route for laser processing, and a specific processing position on the displayed processing route. An input unit 120 for selecting and inputting, and a control unit 130 having a function of determining a beam profile at the processing position based on the input processing position are provided.

The display unit 110 receives a command signal from a display command unit 132 of the control unit 130, which will be described later, and is configured as means for displaying a machining path on a workpiece to be laser-machined, various machining conditions (machining parameters), and the like. . Various display means such as a liquid crystal display, an organic EL display, or a plasma display can be applied to the display unit 110 as described above.

For example, as shown in FIG. 1, the input unit 120 determines or cancels the position of the cross key 122 that moves the selection pointer (see symbol PT in FIG. 4A) within the screen of the display unit 110 and the selection pointer PT. and a button portion 124 including an enter button 124a and a cancel button 124b. As such an input unit 120, a controller-type unit including the cross key 122 illustrated in FIG. 1, a keyboard including a numeric keypad, a joystick-type unit, or the like can be applied. Note that the connection between the input unit 120 and the control unit 130 may be made by either a wired or wireless method as long as signals can be exchanged between them.

As an example, as shown in FIG. 2, the control unit 130 includes a display command unit 132 that outputs a display command to the display unit 110, and a processing condition acquisition unit 133 that acquires laser processing conditions for processing the processing path. Then, a selected processing condition extraction unit 134 that extracts the selected processing conditions at the processing position selected by the input unit 120 from the acquired laser processing conditions, and a beam profile at the position corresponding to the processing position based on the selected processing conditions. and a profile determination unit 135 that determines.

As an example, the display command unit 132 reads information on the machining path and machining conditions included in the machining program from the external storage device 140 such as a database, and receives the beam profile determined by the profile determination unit 135 . Then, the display command unit 132 creates a display command for displaying the determined beam profile together with the machining path and the machining conditions, and outputs it to the display unit 110 .

The machining condition acquisition unit 133 reads machining path data and machining condition data from the external storage device 140, associates the two data, and creates correspondence information indicating machining conditions for each position or section on the machining path. . The processing condition acquisition unit then sends the created correspondence information to the selected processing condition extraction unit 134 . "Processing conditions" include information such as the processing speed on the processing path, the power of the laser beam, the focal position, the distance from the workpiece, the wavelength of the laser beam, and the settings of the optical system such as lenses. shall include

The selected machining condition extraction unit 134 receives the above correspondence information from the machining condition acquisition unit 133 and also receives position information of a specific machining position on the machining path selected and input by the operator from the input unit 120 . Then, based on the position information of the selected machining position, the selected machining condition extraction unit 134 extracts the machining condition corresponding to the machining position from the correspondence information, determines the selected machining condition, and determines the selected machining condition. It is sent to profile determination section 135 .

The profile determination unit 135 determines the beam profile of the laser beam at the selected processing position based on the selected processing conditions received from the selected processing condition extraction unit 134 . At this time, the beam profile is obtained, for example, by a method using a predetermined arithmetic expression using parameters included in the selected processing conditions, or by using a condition table that associates laser beam processing conditions with representative beam profiles in advance. The condition table is stored in the external storage device 140 or the like, and is determined by a method of reading out and selecting the condition table. Then, the profile determination unit 135 sends the determined beam profile to the display command unit 132 together with the position information of the processing position.

Next, specific examples of operation of the processing information display device according to the first embodiment will be described with reference to FIGS. 3 to 5B.

FIG. 3 is a schematic diagram showing an example of displaying a processing path of laser processing according to the first embodiment on a display unit. 4A and 4B are schematic diagrams showing an example of the display screen when cutting is performed. Furthermore, FIGS. 5A and 5B are schematic diagrams showing an example of a display screen when performing marking processing.

As shown in FIG. 3, the machining path according to the first embodiment, as an example, cuts the workpiece W from the machining start point P1 via bending points P2 to P4 on the way back to the machining start point P1. It includes a first machining path R1 for performing machining CP, and a second machining path R2 for performing marking machining MP along a trajectory that draws predetermined characters and symbols on the surface of workpiece W.

First, when the operator wants to check the beam profile when performing the cutting CP along the first machining path R1, the operator selects and displays the machining path R1 of the cutting CP on the display unit 110 as shown in FIG. 4A. . Next, the operator operates the cross key 122 of the input unit 120 to move the selection pointer PT displayed on the display screen of the display unit 110 to a specific machining position SP1 on the machining path R1.

At this position, the operator presses the enter button 124a of the input unit 120 to set the processing position SP1 at which the operator wishes to obtain beam profile information. Then, the position information of the processing position SP1 from the input unit 120 is sent to the selected processing condition extraction unit 134 of the control unit 130, and based on the position information of the processing position SP1, the beam profile at the processing position SP1 is determined by the profile determination unit. 135.

Then, as shown in FIG. 4B, on the display screen of the display unit 110, a pop-up screen PW1 starting from the processing position SP1 is additionally displayed together with the beam profile image BP1. Here, FIG. 4B exemplifies a two-dimensional laser power distribution as the beam profile image BP1, but it may be configured to display a three-dimensional stereoscopic laser power distribution.

With such an operation, it is possible to predict the machining state by displaying the beam profile at the specific machining position SP1 when performing the cutting process CP without performing actual machining such as trial machining. If you want to see the beam profile information at another machining position on the machining path R1, press the cancel button 124b of the input unit 120 to cancel the selection of the selection pointer PT, and operate the cross key 122 again. Another machining position SP1 may be selected.

On the other hand, if the operator wants to check the beam profile when performing the marking process MP along the second machining path R2, the operator selects and displays the machining path R2 of the marking process MP on the display unit 110 as shown in FIG. 5A. Let Next, the operator operates the cross key 122 of the input unit 120 to move the selection pointer PT displayed on the display screen of the display unit 110 to a specific machining position SP2 on the machining path R2.

At this position, the operator presses the enter button 124a of the input unit 120 to set the processing position SP2 from which the operator wishes to obtain beam profile information. Then, the position information of the processing position SP1 from the input unit 120 is sent to the selected processing condition extraction unit 134 of the control unit 130, and based on the position information of the processing position SP2, the beam profile at the processing position SP2 is determined by the profile determination unit. 135.

Then, as shown in FIG. 5B, on the display screen of the display unit 110, a pop-up screen PW2 whose starting point is the processing position SP2 is additionally displayed together with the beam profile image BP2. Here, in marking processing, unlike cutting processing, it is sufficient to perform thin groove processing in the vicinity of the surface of the work W, so the beam profile in the marking processing shown in FIG. 5B is different from the beam profile in the cutting processing shown in FIG. 5A. The distribution is such that the peak power of the laser beam is smaller and the width of the high output region is narrower than that.

With such an operation, the beam profile at the specific processing position SP2 when performing the marking processing MP can also be displayed without performing actual processing such as trial processing, making it possible to predict the processing state. . In addition, in the display examples shown in FIGS. 5A and 5B, the case where either display of the cutting process CP or the marking process MP is selected and only the prediction result of one beam profile is presented was illustrated, but the cutting process CP and It may be configured to simultaneously present beam profiles at a plurality of processing positions corresponding to both of the marking processing MP. It is also possible to simultaneously present beam profiles at a plurality of processing positions in one processing.

With the above configuration, the machining information display device according to the first embodiment extracts the selected machining conditions at a specific machining position on the machining path input from the input unit, and based on the selected machining conditions By having the function of determining and displaying the beam profile at the position corresponding to the above-mentioned processing position, it is possible to perform laser processing based on a predetermined processing program without performing actual processing such as trial processing. The beam profile at a given processing position can be predicted and displayed.

<Second embodiment>
FIG. 6 is a schematic diagram showing the configuration of the processing information display device according to the second embodiment. FIG. 7 is a block diagram showing the specific configuration of the control unit shown in FIG. 6 and the relationship with peripheral devices. In addition, in the second embodiment, in the schematic diagrams and the like shown in FIGS. 1 to 5B, the same reference numerals are attached to those that can adopt the same or common configuration as the first embodiment. The repeated description of is omitted.

In the processing information display device 200 according to the second embodiment, the input unit 220 includes a keypad 224 including the functions of the enter button 124a and the cancel button 124b shown in the first embodiment instead of the button unit 124. However, the configuration is different from that of the processing information display device 100 according to the first embodiment. That is, the processing information display device 200 according to the second embodiment includes a function of inputting change information for changing the beam profile displayed on the display section 110 .

As shown in FIG. 6 as an example, the machining information display device 200 according to the second embodiment includes a display unit 110 and a display unit 110 for selecting a specific machining position on the displayed machining path and allowing the operator to input change information. An input unit 220 having a function, and a control unit 230 having a function of determining a beam profile at the input processing position based on the processing position and changing the beam profile based on the change information.

The input unit 220 includes, for example, as shown in FIG. 6, a cross key 222 and a keypad 224 for inputting change information for changing the beam profile, such as letters and numbers. 7, for example, the control unit 230 includes a display command unit 232, a processing condition acquisition unit 233, a selected processing condition extraction unit 234, a profile determination unit 235, and a change input by the input unit 220. It includes a profile changing section 236 that changes the beam profile based on the information, and a laser processing condition correcting section 237 that corrects the laser processing conditions by reflecting the changed beam profile. Note that the connection between the input unit 220 and the control unit 230 may be performed by either a wired or wireless method as long as signals can be exchanged with each other, as in the first embodiment.

The profile determination unit 235 determines the beam profile of the laser beam at the selected processing position based on the selected processing conditions received from the selected processing condition extraction unit 234, as in the first embodiment. Then, the profile determination unit 235 sends the determined beam profile to the display command unit 232 and the profile change unit 236 together with the position information of the processing position.

The profile changer 236 changes and updates the power distribution of the laser beam based on the beam profile change information sent from the input unit 220 . At this time, the beam profile can be changed by directly inputting the power distribution numerically or manually, or by inputting a parameter as a change condition and obtaining the power distribution corresponding to the parameter from a condition table stored in the external storage device 140. It is executed by a method such as reading. Then, the profile changing section 236 sends the changed beam profile to the display commanding section 232 and the laser processing condition correcting section 237 together with the position information of the processing position.

The laser processing condition correction unit 237 changes the laser processing conditions acquired by the processing condition acquisition unit 233 based on the changed beam profile sent from the profile change unit 236 to create corrected processing conditions. At this time, to change the laser processing conditions, either change only the beam profile at the position corresponding to the processing position selected for the change, or further select an arbitrary processing section including the selected processing position. to change the beam profile of the entire machining section.

Also, the laser processing condition correction unit 237 sends the changed corrected processing conditions to the display command unit 232 . Then, the display command unit 232 outputs a display command for displaying the processing information reflecting the corrected processing conditions and the beam profile sent to the display unit 110 .

Next, a specific operation example of the processing information display device according to the second embodiment will be described with reference to FIGS. 8A and 8B.

8A and 8B are schematic diagrams showing an example of a display screen displaying an operation for changing the beam profile.

As an operation to change the beam profile, when changing the beam profile when performing the cutting CP along the first machining path R1, as shown in FIG. After selecting and displaying R1, the user selects and inputs the processing position SP1 from which beam profile information is to be obtained. Then, the position information of the processing position SP1 from the input unit 220 is sent to the selected processing condition extraction unit 234 of the control unit 230, and the beam profile at the processing position SP1 is determined as in the first embodiment. determined by unit 235 .

Then, in response to the display command from the display command unit 232, a pop-up screen PW1 starting from the processing position SP1 is additionally displayed on the display screen of the display unit 110 together with the beam profile image BP1. At this time, the position information, the peak power value of the laser beam, etc. can be displayed in addition to the image BP1 of the beam profile on the pop-up screen PW1.

Subsequently, the operator who viewed the display screen of FIG. 8A uses the input unit 220 to input change information for changing the beam profile. Here, the input change information is executed by directly moving the power distribution by manual input using the cross key 222 or by directly inputting numerical values etc. to the parameters using the keypad 224 .

When the change information is input, the beam profile is changed by the profile changing section 236 as described above, and the laser processing conditions are changed by the laser processing condition correcting section 237 accordingly. Then, in response to a display command from display command unit 232 that has received information about these changes, pop-up screen PW1 including image BP1a of the beam profile after change is newly displayed on display unit 110 as shown in FIG. 8B. to be displayed.

With such an operation, the beam profile at a specific processing position SP1 on the processing path R1 is displayed without performing actual processing such as trial processing, and the beam profile and the laser beam are displayed based on the change information input by the operator. It becomes possible to arbitrarily change the processing conditions.

Next, a modification of the processing information display device according to the second embodiment will be described with reference to FIG.

FIG. 9 is a block diagram showing a specific configuration of a control unit and a relationship with peripheral devices in a modified example of the processing information display device according to the second embodiment.

In a modification of the second embodiment, the control unit 230 includes, for example, a display command unit 232, a processing condition acquisition unit 233, a selected processing condition extraction unit 234, a profile determination unit 235, and a It includes a profile changer 236, a laser processing condition correction unit 237, and a corrected processing condition output unit 238 that outputs the corrected processing conditions corrected by the laser processing condition correction unit 237 to the outside.

In this modification, the laser processing condition correction unit 237 changes the laser processing conditions acquired by the processing condition acquisition unit 233 based on the changed beam profile sent from the profile change unit 236 to generate the corrected processing conditions. create. Then, the laser processing condition correction unit 237 sends the data of the beam profile and the position information together with the corrected processing conditions to the display command unit 232 and the corrected processing condition output unit 238 .

8A and 8B, the display command unit 232 issues a display command to display on the display unit 110 the processing information reflecting the changed laser processing conditions and beam profile that have been sent. to output On the other hand, the corrected processing condition output unit 238 outputs the corrected processing conditions, information on the changed beam profile, and the like to a portable storage device such as a USB memory, or an external storage device 140 such as the database shown in FIG. Memorize.

By providing the above-described configuration, the processing information display device according to the second embodiment has the effect described in the first embodiment, as well as the prediction result of the beam profile displayed on the display unit. The operator can arbitrarily change the beam profile by inputting change information. Further, by changing the beam profile at the selected processing position, it is possible to reflect this in the laser processing conditions and create modified processing conditions.

Furthermore, by adding a function to output the corrected machining conditions to the outside, the corrected machining conditions can be overwritten and saved in the database, and by transferring the corrected machining conditions to the processing control device of the laser processing device, the processing of the laser processing device It is also possible to modify the program.

<Third Embodiment>
FIG. 10 is a schematic diagram showing the configuration of the processing information display device according to the third embodiment. 11A and 11B are schematic diagrams showing an example when the processing information display device shown in FIG. 10 is specifically operated. In the third embodiment, in the schematic diagrams and the like shown in FIGS. 1 to 9, the same or common configurations as those in the first and second embodiments can be used. Reference numerals are attached and description of these repetitions is omitted.

The processing information display device 300 according to the third embodiment is configured as a mobile terminal 350 having a touch panel type display unit 310 that serves as both a display unit and an input unit. The configuration is different from that of the device 100 . In other words, the processing information display device 300 according to the third embodiment is a device that does not include an input section configured separately.

A mobile terminal 350 that constitutes the processing information display device 300 according to the third embodiment includes a display unit 310 and a control section (not shown), as shown in FIG. 10 as an example. Note that the control unit (not shown) can have the same configuration as that of the control unit described in the first embodiment or the second embodiment, so description thereof will be omitted here.

As a specific example of the operation of the processing information display device 300 according to the third embodiment, a case of executing the cutting CP is illustrated. First, the operator displays the cutting CP on the display unit 310 as shown in FIGS. is selected and displayed. Next, the operator recognizes the start of selection from the display unit 310 by touching the display screen of the display unit 310, which also serves as an input unit, with the hand HD (or finger).

Subsequently, when the operator performs a tap operation (operation of lightly tapping the screen) at a specific processing position on the processing path R1, the processing position SP1 where the operator wishes to obtain beam profile information is set. Then, the position information of the processing position SP1 from the display unit 310 is sent to the control unit, and based on the position information of the processing position SP1, the processing position is displayed as in the case of the first embodiment or the second embodiment. A beam profile at SP1 is determined.

Then, as shown in FIG. 11B, on the display screen of the display unit 310, a pop-up screen PW1 starting from the processing position SP1 is additionally displayed together with the beam profile image BP1. Note that the pop-up screen PW1 may be configured to display the position information, the peak power value of the laser beam, etc. in addition to the beam profile image BP1, as in the case shown in FIGS. 8A and 8B. good.

If you want to see the information of the beam profile at another machining position on the machining path R1, you can tap another position on the machining path R1 on the display screen of the display unit 310 to display another machining position SP1. can be selected. Further, as in the first embodiment, the display screen of the display unit 310 simultaneously presents beam profiles at a plurality of processing positions corresponding to both cutting processing CP and marking processing MP, or in one processing It is also possible to present beam profiles at multiple processing positions simultaneously.

With the configuration as described above, the processing information display device according to the third embodiment has the effects of the display section and the input section in addition to the effects described in the first embodiment and the second embodiment. Since it is configured as a mobile terminal with an integrated display unit, it is possible to simplify the overall configuration and facilitate handling by the operator.

<Fourth Embodiment>
FIG. 12 is a schematic diagram showing an example of a laser processing apparatus provided with a laser processing control device including a processing information display device according to the fourth embodiment. 13 is a block diagram showing an example of the configuration of the laser processing control device shown in FIG. 12. As shown in FIG. In addition, in the fourth embodiment, in the schematic diagrams and the like shown in FIGS. Reference numerals are attached and description of these repetitions is omitted.

A laser processing apparatus 1 to which the laser processing control apparatus 50 according to the fourth embodiment is applied has, as an example, shown in FIG. 20, a processing head 30 that irradiates a processing laser beam LB to the work W, a transport mechanism 40 that relatively moves the processing head 30 with respect to the processing table 20, and a laser processing that controls a predetermined laser processing operation for the work W. and a controller 50 . Moreover, the laser processing control device 50 further includes a processing information display device 400 .

The laser oscillator 10 employs a laser source with a wavelength having a high absorption efficiency depending on the material of the workpiece W to be processed, and the output processing laser beam LB is transmitted to the processing head 30 via a transmission line 12 such as an optical fiber. is transmitted to As an example, the processing table 20 includes a chuck mechanism (not shown) for attaching the work W, and is configured to grip and fix the work W. As shown in FIG.

As an example, the processing head 30 receives a processing laser beam LB from one end (upper end) side, is condensed by a condensing lens (not shown) disposed inside, and then is condensed at the other end (lower end) side. The light is emitted from the nozzle 32 toward the condensing point FP of the work W. As shown in FIG. As the configuration of the processing head 30 for irradiating the processing laser beam LB to the condensing point FP of the work W, instead of the above-described configuration, a scanning optical unit (not shown) such as a galvanomirror is incorporated inside, The scanning optical unit may scan the workpiece W with the optical axis of the processing laser beam LB.

As an example, the transport mechanism 40 is configured as a linear driving body that relatively moves in three axial directions of XYZ orthogonal to each other, and the processing head 30 is attached to one end thereof. The transport mechanism 40 may be configured as a 6-axis or 7-axis type industrial robot having a robot arm with the processing head 30 attached to one end.

As shown in FIG. 13 as an example, the laser processing control device 50 includes a main control device 52 that controls the overall operation of the laser processing control device 50, and an operator that controls various parameter items and numerical values for laser processing. a user interface 54 for manual input, an external storage device 140 in which a processing program for performing laser processing, a condition table corresponding to laser processing conditions, and the like are recorded, and a processing information display device 400.

The main controller 52 of the laser processing control device 50 is connected to various sensors and the like provided in each component of the laser processing device 1 to receive a detection signal, and also sends a control command signal based on the processing program to each component. Output. The user interface 54 is configured as a keyboard for inputting, for example, character strings, numbers, etc. In the fourth embodiment, the user interface 54 is also configured to function as an input section of the processing information display device 400 .

As an example, the processing information display device 400 includes a display section 410 , a user interface 54 functioning as an input section, and a control section 430 . As in the first embodiment, the control unit 430 includes a display command unit 432, a processing condition acquisition unit 433, a selected processing condition extraction unit 434, and a profile determination unit 435.

With the configuration as described above, the laser processing control apparatus according to the fourth embodiment extracts the selected processing conditions at a specific processing position on the processing path input from the user interface, and based on the selected processing conditions Since the machining state display device has a function of determining and displaying the beam profile at the position corresponding to the machining position, it is possible to perform the actual machining such as trial machining at the predetermined machining position on the machining path. beam profile can be predicted and displayed.

In FIG. 13, as the processing information display device 400, the processing information display device 400 is provided with the same control unit 430 as in the first embodiment. Alternatively, a configuration of a control unit having a function of modifying the beam profile and laser processing conditions based on additional change information input from the operator may be applied. Further, the processing information display device 400 may be detachably attached to the laser processing control device 50 as a portable terminal as shown in FIG. 10 of the third embodiment.

<Fifth Embodiment>
In the first to fourth embodiments, the processing information display device and the laser processing control device to which this is applied have been described as representative configurations of the present disclosure, but as another specific example of the present disclosure, A processing information display program that causes a laser processing control device having a general-purpose display device or a display unit to execute a control operation based on the technical idea of the present disclosure can be exemplified.

That is, the processing information display program according to the fifth embodiment displays processing information including a processing path for laser processing on a general-purpose display device having a display unit, an input unit, and a control unit. a step of selecting and inputting a specific machining position on the displayed machining path; a step of acquiring laser machining conditions for machining the machining path; and the acquired laser machining conditions extracting selected machining conditions at the machining position from , is stored in, for example, the control unit of the display device to display the beam profile together with the processing information on the display unit.

The processing information display program according to the fifth embodiment is recorded in various recording media such as USB memories and magnetic disks, or in large-scale recording devices such as databases and cloud servers, etc., and used as necessary. It can also be used as a mode in which it is installed as software in a display device or a laser processing control device.

In addition to the series of steps described above, the processing information display program according to the fifth embodiment includes a step of inputting change information for the displayed beam profile, and a step of changing the beam profile based on the change information. and modifying the laser processing conditions to reflect the changed beam profile.

Furthermore, the processing information display program according to the fifth embodiment includes, in addition to the series of steps described above, a step of outputting a modified modified processing condition, and a processing program for executing laser processing based on the modified modified processing condition. and modifying the .

With the above configuration, the processing information display program according to the fifth embodiment can be stored as a control program in a general-purpose display device or laser processing control device having a display unit, an input unit, and a control unit, so that trial processing can be performed. It is possible to add a function capable of predicting and displaying the beam profile at a predetermined machining position on the machining path without performing actual machining.

Although the present disclosure has been described in detail above, the present disclosure is not limited to the individual embodiments described above. These embodiments include various additions, replacements, modifications, Partial deletion etc. are possible. Also, these embodiments can be implemented in combination. For example, in the above-described embodiments, the order of each operation and the order of each process are shown as an example, and are not limited to these. The same applies when numerical values or formulas are used in the description of the above-described embodiments.

The following notes are further disclosed with respect to the above embodiments and modifications.

(Appendix 1)
a display unit that displays processing information including a processing path and a beam profile when performing laser processing;
an input unit for selecting and inputting a specific machining position on the machining path displayed on the display unit;
a control unit having a function of determining the beam profile at the processing position based on the processing position input from the input unit;
with
The control unit
a processing condition acquisition unit that acquires laser processing conditions for processing the processing path;
a selective processing condition extraction unit that extracts a selective processing condition at the processing position from the laser processing conditions;
a profile determination unit that determines the beam profile at a position corresponding to the processing position based on the selected processing condition;
Machining information display device including.
(Appendix 2)
The input unit further has a function of inputting change information for the beam profile displayed on the display unit,
The control unit
a profile changing unit that changes the beam profile based on the change information;
a laser processing condition correction unit that corrects the laser processing conditions reflecting the changed beam profile;
The processing information display device according to the above supplementary note 1, further comprising:
(Appendix 3)
2. The processing information display device according to claim 2, wherein the control unit further includes a corrected processing condition output unit that outputs the corrected processing conditions corrected by the laser processing condition correction unit.
(Appendix 4)
4. The processing information display device according to any one of Appendices 1 to 3, wherein the display unit is configured as a touch panel that also functions as the input unit.
(Appendix 5)
A processing information display device including a main control unit for controlling laser processing operation of a laser processing apparatus based on a laser processing program, and a display unit for displaying processing information including a processing path and a beam profile when performing the laser processing. and a laser processing control device comprising
The machining information display device includes an input unit for selecting and inputting a specific machining position on the machining path displayed on the display unit, and based on the machining position input from the input unit, the machining position a control unit having a function of determining the beam profile in
The control unit includes a processing condition acquisition unit that acquires laser processing conditions for processing the processing path, a selection processing condition extraction unit that extracts a selection processing condition at the processing position from the laser processing conditions, and the selection processing. a profile determination unit that determines the beam profile at a position corresponding to the processing position based on conditions.
(Appendix 6)
The input unit further has a function of inputting change information for the beam profile displayed on the display unit,
The control unit
a profile changing unit that changes the beam profile based on the change information;
a laser processing condition correction unit that corrects the laser processing conditions reflecting the changed beam profile;
6. The laser processing control device according to appendix 5 above, further comprising:
(Appendix 7)
The control unit further includes a corrected processing condition output unit that outputs the corrected processing conditions corrected by the laser processing condition correction unit,
7. The laser processing control device according to claim 6, wherein the main controller further has a function of modifying the laser processing program based on the modified processing conditions from the modified processing condition output unit.
(Appendix 8)
8. The laser processing control device according to any one of Appendices 5 to 7, wherein the display unit is configured as a touch panel that also functions as the input unit.
(Appendix 9)
a step of displaying processing information including a processing path for laser processing on a processing information display device;
a step of selecting and inputting a specific machining position on the machining path displayed on the machining information display device;
obtaining laser processing conditions for processing the processing path;
a step of extracting selected processing conditions at the processing position from the laser processing conditions;
determining a beam profile at a position corresponding to the machining position based on the selected machining condition;
A processing information display program for displaying the beam profile together with the processing information on the processing information display device by executing a series of steps including:
(Appendix 10)
inputting change information for the beam profile displayed on the processing information display device;
modifying the beam profile based on the modification information;
a step of correcting the laser processing conditions reflecting the changed beam profile;
The machining information display program according to Supplementary Note 9 above, further comprising:
(Appendix 11)
a step of outputting the corrected modified machining conditions;
11. The processing information display program according to supplementary note 10, further comprising a step of modifying a processing program for executing the laser processing based on the modified processing conditions.

1 laser processing device 10 laser oscillator 12 transmission path 20 processing table 30 processing head 32 nozzle 40 transport mechanism 50 laser processing control device 52 main control device 54 user interface 100 processing information display device 110 display unit 120 input unit 122 cross key 124 button unit 124a Enter button 124b Cancel button 130 Control unit 132 Display command unit 133 Processing condition acquisition unit 134 Selected processing condition extraction unit 135 Profile determination unit 140 External storage device 200 Processing information display device 220 Input unit 222 Cross key 224 Keypad 230 Control unit 232 Display command unit 233 Machining condition acquisition unit 234 Selected machining condition extraction unit 235 Profile determination unit 236 Profile change unit 237 Laser machining condition correction unit 238 Correction machining condition output unit 300 Machining information display device 310 Display unit 350 Portable terminal 400 Machining information display device 410 display unit 430 control unit 432 display command unit 433 machining condition acquisition unit 434 selected machining condition extraction unit 435 profile determination unit

Claims (11)

a display unit that displays processing information including a processing path and a beam profile when performing laser processing;
an input unit for selecting and inputting a specific machining position on the machining path displayed on the display unit;
a control unit having a function of determining the beam profile at the processing position based on the processing position input from the input unit;
with
The control unit
a processing condition acquisition unit that acquires laser processing conditions for processing the processing path;
a selective processing condition extraction unit that extracts a selective processing condition at the processing position from the laser processing conditions;
a profile determination unit that determines the beam profile at a position corresponding to the processing position based on the selected processing condition;
Machining information display device including. The input unit further has a function of inputting change information for the beam profile displayed on the display unit,
The control unit
a profile changing unit that changes the beam profile based on the change information;
a laser processing condition correction unit that corrects the laser processing conditions reflecting the changed beam profile;
The processing information display device according to claim 1, further comprising: 3. The processing information display device according to claim 2, wherein said control unit further includes a corrected processing condition output unit that outputs the corrected processing conditions corrected by said laser processing condition correction unit. The processing information display device according to any one of claims 1 to 3, wherein the display section is configured as a touch panel that also functions as the input section. A processing information display device including a main control unit for controlling laser processing operation of a laser processing apparatus based on a laser processing program, and a display unit for displaying processing information including a processing path and a beam profile when performing the laser processing. and a laser processing control device comprising
The machining information display device includes an input unit for selecting and inputting a specific machining position on the machining path displayed on the display unit, and based on the machining position input from the input unit, the machining position a control unit having a function of determining the beam profile in
The control unit includes a processing condition acquisition unit that acquires laser processing conditions for processing the processing path, a selection processing condition extraction unit that extracts a selection processing condition at the processing position from the laser processing conditions, and the selection processing. a profile determination unit that determines the beam profile at a position corresponding to the processing position based on conditions. The input unit further has a function of inputting change information for the beam profile displayed on the display unit,
The control unit
a profile changing unit that changes the beam profile based on the change information;
a laser processing condition correction unit that corrects the laser processing conditions reflecting the changed beam profile;
6. The laser processing control device of claim 5, further comprising: The control unit further includes a corrected processing condition output unit that outputs the corrected processing conditions corrected by the laser processing condition correction unit,
7. The laser processing control device according to claim 6, wherein said main controller further has a function of modifying said laser processing program based on said modified processing conditions from said modified processing condition output unit. The laser processing control device according to any one of claims 5 to 7, wherein the display unit is configured as a touch panel that also functions as the input unit. a step of displaying processing information including a processing path for laser processing on a processing information display device;
a step of selecting and inputting a specific machining position on the machining path displayed on the machining information display device;
obtaining laser processing conditions for processing the processing path;
a step of extracting selected processing conditions at the processing position from the laser processing conditions;
determining a beam profile at a position corresponding to the machining position based on the selected machining condition;
A processing information display program for displaying the beam profile together with the processing information on the processing information display device by executing a series of steps including: inputting change information for the beam profile displayed on the processing information display device;
modifying the beam profile based on the modification information;
a step of correcting the laser processing conditions reflecting the changed beam profile;
The machining information display program according to claim 9, further comprising: a step of outputting the corrected modified machining conditions;
11. The processing information display program according to claim 10, further comprising a step of modifying a processing program for executing said laser processing based on said modified processing conditions.

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