JP7294762B2 - Electronics - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a flow path structure, and more particularly to an electronic device having a flow path structure composed of flow path components coated with an insulating material.

Electronic devices equipped with various electronic components include a large number of heat generating elements that generate heat during operation. ing. However, as the mounting density of electronic components increases, the miniaturization of equipment progresses, and the heat generation density inside the electronic equipment continues to increase. For this reason, in order to sufficiently cool the heat generating elements mounted at high density, there is a demand for a more efficient cooling structure.

As an efficient cooling structure of this type, there is a technique of arranging heat radiating components and heat generating elements along the flow of cooling air generated by a forced exhaust system (Reference 1).

JP-A-11-354955

In the above cooling technology, it is required to align the heat generating elements and heat dissipating parts along the air flow of the exhaust system, which places restrictions on the positions where the electronic parts and modules housed in the housing are installed. , is unsuitable for further miniaturization of electronic equipment.

The present invention has been made in view of such circumstances, and its object is to provide sufficient mechanical strength even with a thin wall thickness in an electronic device in which electronic components are densely mounted and heat generation density is high. Providing a flow path structure for controlling the flow of cooling air for realizing more efficient cooling of electronic equipment using parts that have high electrical insulation from adjacent electronic parts It is to be.

An electronic device according to a first aspect of the present invention comprises a housing, a module housed in the housing and having electronic components mounted on a circuit board, a heat dissipation component attached to the module and having a plurality of fin structures, a flow path component attached to each of the circuit board and the heat radiation component and covering the module, wherein the flow path component is made of metal, and the metal is in close proximity to at least the electronic component mounted on the circuit board. part, the surface of which is coated with an insulating material.

According to a second aspect of the present invention, in the first aspect, the insulating material is made of a resin material.

According to a third aspect of the present invention, in the second aspect, the resin material includes at least one of fluororesin, polyimide resin, silicon resin, and PEEK resin.

According to a fourth aspect of the present invention, in the first aspect, the insulating material is made of a ceramic material.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the insulating material has higher insulating properties than air.

According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the flow path component is mechanically attached to the heat radiation component.

According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the housing is provided on the opposite side of the exhaust port covered by the exhaust device and the exhaust port. and an intake port, wherein outside air is introduced from the intake port, the outside air is warmed inside the housing, and the exhaust device exhausts the warmed outside air from the exhaust port to the outside of the housing.

According to an eighth aspect of the present invention, in the seventh aspect, the portion surrounded by the housing, the circuit board, and the flow path component constitutes a flow path for the gas flowing from the intake port to the exhaust port. , the heat radiating component is arranged so as to protrude into the flow path.

According to a ninth aspect of the present invention, in the eighth aspect, the flow path component increases the flow velocity of the gas passing between the fin structures of the heat radiating component.

According to a tenth aspect of the present invention, in any one of the first to ninth aspects, the metal constituting the flow channel component is a portion attached to each of the circuit board and the heat dissipation component. Its surface is covered with an insulating material, except for

According to the electronic device of the present invention, in an electronic device in which electronic components are densely mounted and heat generation density is high, it has sufficient mechanical strength even with a thin wall thickness and high electrical insulation from adjacent electronic components. To provide a flow path structure for controlling the flow of cooling air for realizing more efficient cooling of the electronic device by using a component that realizes

1 is a perspective view of one embodiment of an electronic device of the present invention; FIG. 1 is a perspective view of one embodiment of an electronic device of the present invention; FIG. 1 is a side view of an electronic device according to an embodiment of the present invention, in which an exhaust device is installed; FIG. 1 is a side view of an electronic device according to an embodiment of the present invention, in which air inlets are arranged; FIG. 1 is a perspective view of the interior of an electronic device according to an embodiment of the present invention; FIG. 1 is a perspective view of the interior of an electronic device according to an embodiment of the present invention; FIG. It is a figure which shows the internal structure seen from the side of one Embodiment of the electronic device of this invention. 1 is an enlarged view of a module included in one embodiment of an electronic device of the present invention; FIG. FIG. 2 is a conceptual diagram showing a flow path of cooling air in one embodiment of the electronic device of the present invention;

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below based on the drawings.

1 and 2 are perspective views of one embodiment of the electronic device of the present invention. An electronic device 1 has a rectangular parallelepiped housing 2, two exhaust ports are installed on one side thereof, and two exhaust devices 3 are installed to cover the respective exhaust ports (Fig. 1 ). An intake port 5 is provided on another side surface opposite to the one side surface (FIG. 2).

FIG. 3 shows a side view in which the exhaust device 3 is installed. Two exhaust devices 3 are arranged vertically on the left side of this side. These exhaust devices 3 are electric fans, for example, and can exhaust the air inside the housing 2 through two exhaust ports opened in the housing 2 .

An intake port 5 is provided at a position facing an exhaust port 4 covered with an exhaust device 3 (FIG. 4). When the exhaust device 3 operates to exhaust the air inside the housing 2 through the exhaust port 4 , the outside air is introduced into the housing 2 through the intake port 5 on the opposite side due to the pressure gradient generated in the housing 2 . The outside air passes through the entire interior of the housing 2 and is exhausted to the outside of the housing 2 from the exhaust port 4 . By operating the exhaust device 3 in this manner, an air flow from the intake port 5 to the exhaust port 4 can be generated.

5 to 7 show the internal structure of the housing 2. FIG. 5 and 6 are perspective views seen from the same direction as FIGS. 1 and 2, respectively, and FIG. 7 is a view of the internal structure seen from the side.

Inside the housing 2, a first circuit board 11 arranged along the bottom surface of the housing 2 and a second circuit board 12 arranged along the top surface of the housing 2 are arranged. Electronic components and modules installed on each of the first circuit board 11 and the second circuit board 12 are accommodated. An internal case 10 is further installed on the bottom surface of the housing 2 .

A first module 21 is installed on the first circuit board 11 on the exhaust port 4 side, and a second module 22 is installed adjacent to the inner case 10 . An electronic component 14 is installed between the first module 21 and the second module 22 .

The first module 21 and the second module 22 include heating elements, the first module 21 is attached with a first heat dissipation component 26, the second module 22 is attached with a second heat dissipation component 27, and each Heat generated from the module is conducted to and radiated by each heat radiating component. The first heat-radiating component 26 and the second heat-radiating component 27, for example, have a large number of fin structures and can be made of a metal material with good thermal conductivity.

A third module 23 is installed on the second circuit board 12 on the air inlet 5 side, and a fourth module 24 and electronic components 25 are arranged on the air outlet 4 side. Three electronic components 15 , 16 and 17 are installed between the third module 23 and the fourth module 24 . These two modules and three electronic components are installed so as to protrude toward the center inside the housing 2 from the second circuit board 12 installed along the upper surface of the housing 2. .

The third module 23 and the fourth module 24 include heating elements, the third module 23 is attached with the third heat dissipation component 28, the fourth module 24 is attached with the fourth heat dissipation component 29, and each module Heat generated from is conducted to and radiated by each heat radiation component. The third heat dissipating component 28 and the fourth heat dissipating component 29, for example, have a large number of fin structures and can be made of a metal material with good thermal conductivity.

The side surface of the first module 21 facing the exhaust port 4 side is provided by the first flow path component 31 attached so as to extend from the first heat radiation component 26 to the first circuit board 11 . cover. Both ends of the second flow path component 32 are attached to the first heat dissipation component 26 and the first circuit board 11 so as to cover the other side surface of the first module 21 . The side surface of the first module 21 is entirely covered with the first flow path component 31 and the second flow path component 32, and only the first heat radiation component 26 is exposed inside the housing 2. It has a structure.

Further, the space between the second module 22 and the inner case 10 is covered with a third flow passage component 33 attached so as to extend from the second heat radiating component 27 to the inner case 10 . The other side surface of the second module 22 is covered with the second heat dissipation component 27 and the fourth flow path component 34 attached at both ends to the first circuit board 11 . As a result, the second module 22 has its entire side surface covered with the third flow path component 33 and the fourth flow path component 34, and only the second heat radiating component 27 is attached to the housing 2. The structure is exposed inside.

Furthermore, the side surface of the third module 23 facing the air inlet 5 is covered with the third heat dissipation component 28 and the second circuit board 12 with the fifth flow path component 35 attached at both ends thereof. Both ends of the sixth flow path component 36 are attached to the third heat dissipation component 28 and the second circuit board 12 respectively so as to cover the other side surface of the third module 23 . The side surface of the third module 23 is entirely covered with the fifth flow path component 35 and the sixth flow path component 36, and only the third heat radiation component 28 is exposed inside the housing 2. It has a structure.

Further, the side surface of the fourth module 24 facing the exhaust port 4 side is covered with the seventh flow path component 37 attached at both ends to the fourth heat radiation component 29 and the second circuit board 12 . Both ends of the eighth flow path component 38 are attached to the fourth heat radiation component 29 and the second circuit board 12 so as to cover the other side surface of the fourth module 24 . The side surface of the fourth module 24 is entirely covered with the seventh flow path component 37 and the eighth flow path component 38, and only the fourth heat radiation component 29 is exposed inside the housing 2. It has a structure.

On the other hand, the electronic component 14 installed on the first circuit board 11 and the three electronic components 15, 16, and 17 installed on the second circuit board 12 are entirely exposed inside the housing 2. are doing. These are parts that generate a small amount of heat and do not heat up even if no heat dissipating parts are attached.

FIG. 8 is an enlarged view of the fourth module 24. As shown in FIG. A fourth module 24 is installed on the second circuit board 12 , and a fourth heat dissipation component 29 is attached to the fourth module 24 . The eighth channel component 38, which covers the sides of the fourth module 24, is omitted in this view.

The seventh flow path component 37 has, at both ends thereof, an attachment portion 321 for attachment to the fourth heat radiation component 29 and an attachment portion 322 for attachment to the second circuit board 12. and the second circuit board 12 are fixed by fixing parts 40 such as screws. The seventh flow path component 37 may have a lateral straightening section 323 in order to apply cooling air efficiently to the fourth heat radiating component 29 .

In an electronic device with high density mounting, flow path components for rectifying cooling air must be able to be installed in a narrow space. Therefore, it has excellent shape workability, has high mechanical strength even though it is thin, can be easily attached and detached using general-purpose fixing parts such as screws and bolts, and is in contact with heat dissipating parts, so it can be heated. High conductivity is required. These requirements can be met, for example, by making the flow path components out of metal.

However, when installing a flow path component made of a conductive material such as a metal, between electronic components (seventh flow path component 37 and electronic component 25 in FIG. 8) arranged close to each other, for example, discharge may cause dielectric breakdown. In order to prevent this, an insulating distance corresponding to the potential difference between the flow path component and the electronic component is required. This is not preferable because it conflicts with the desire to mount electronic components at a higher density to reduce the size of electronic equipment.

Therefore, when using a flow path component made of metal, it is preferable to cover the surface with an insulating material except for the mounting portion. As a result, the insulation distance between the flow channel component and the electronic component can be made very small, and the potential difference between the flow channel component and the electronic component can be reduced with respect to the insulating properties of the insulating material that covers it. is small enough, they may be placed in contact.

Resin materials such as fluorine resin, polyimide resin, silicon resin, and PEEK resin can be used as such an insulating material. Alternatively, a ceramic material may be used. In any case, any material can be used as long as it has a dielectric breakdown voltage higher than that of air and can coat metal.

FIG. 9 shows the flow path of the cooling air, which is drawn in through the intake port 5 by the operation of the exhaust device 3 , flows inside the housing 2 , and is exhausted to the outside through the exhaust port 4 . By operating the exhaust device 3 , warm air inside the housing 2 is exhausted as indicated by an arrow 50 , and external air 51 is introduced into the housing 2 through the intake port 5 due to the pressure gradient generated at that time.

The introduced outside air 51 becomes cooling air 71 that flows through the third heat radiating component 28 . Outside air 51 is rectified (arrow 61 ) by the fifth flow path component 35 so as to flow into the third heat radiation component 28 without going around the third module 23 . Also, part of the outside air 51 becomes cooling air 52 that passes between the inner case 10 and the third heat radiating component 28 .

As shown in FIGS. 5 and 6, the third heat dissipation component 28 has a plurality of fin structures parallel to the flow of cooling air flowing from the air inlet 5 toward the air outlet 4 . The cooling air 71 flows between these fin structures to efficiently cool the third heat dissipating component 28 . Similarly, each of the first heat dissipation component 26 , the second heat dissipation component 27 , and the fourth heat dissipation component 29 also has a plurality of heat dissipation components parallel to the flow of cooling air flowing from the air inlet 5 toward the air outlet 4 . It has a fin structure.

Most of the cooling air 52 becomes cooling air 72 flowing through the second heat radiating component 27 . Since the space between the second module 22 and the inner case 10 is closed by the third flow path component 33, the cooling air does not flow in between (arrow 62), and all of it is the second heat dissipation. It flows into part 27 . Then, the cooling air 72 passes through the inside of the second heat radiating component 27 to cool it, and then goes to the first heat radiating component 26 .

Part of the cooling air 72 winds in the direction of the first circuit board 11 as indicated by the arrow 64 to cool the electronic component 14 . However, the first module 21 is wrapped around its sides with a second flow path component 32, and the second module 22 is wrapped around its sides with a fourth flow path component 34. Therefore, the flow (arrow 64 ) that reaches the vicinity of the surface of the first circuit board 11 without flowing around those modules is also directed to the first heat radiation component 26 .

On the other hand, part of the cooling air 52 and the cooling air 71 become the cooling air 53 flowing through the center of the housing 2 and cool the three electronic components 15 , 16 and 17 . Part of it wraps around the second circuit board 12 (arrow 63), while the circumferences of the third module 23 and the fourth module 24 respectively surround the sixth flow path component 36 and the eighth flow path. Since it is covered with the path component 38, the cooling air does not flow around the module.

On the exhaust port 4 side, the cooling air is exhausted to the outside of the housing 2 by the operation of the exhaust device 3 . Here, the side surface of the first module 21 on the side of the exhaust port 4 is covered with the first channel component 31 , and the side surface of the fourth module 24 on the side of the exhaust port 4 is covered with the seventh channel component 37 . covered. Therefore, the air inside the housing 2 consists of cooling air 74 flowing through the first heat radiating component 26 , cooling air 73 flowing through the fourth heat radiating component 29 , and cooling air flowing through the first heat radiating component 26 and the fourth heat radiating component 29 . It is exhausted from the exhaust port 4 as one of the cooling air 54 flowing between them.

In this way, the outside air introduced from the intake port 5 is warmed by cooling each heat radiating component and each electronic component in the housing 2, and the warm air passes through the exhaust port 4 and is discharged to the exhaust device. 3 exhausts the air to the outside of the housing 2 .

Further, the path (flow path) through which the gas (cooling air) flowing from the intake port 5 to the exhaust port 4 flows is the side wall of the housing 2, the first circuit board 11 and the second circuit board 12, and the first flow path. It is an area surrounded by each of the channel component 31 to the eighth channel component 38 . Each heat radiating component is protrudingly arranged in the flow path, and each heat radiating component has a plurality of fin structures parallel to the flow of the cooling air.

Further, the exhaust port 4 is sized to exhaust air from the first circuit board 11 near the bottom surface of the housing 2 to the second circuit board 12 near the top surface. is rectified by the first flow path component 31 and the seventh flow path component 37, and is regulated in a narrow flow path composed of the first heat radiation component 26, the fourth heat radiation component 29, and between them. be. As a result, the flow velocity of the cooling air passing through the first heat radiation component 26 and the fourth heat radiation component 29 increases, thereby improving the cooling capacity. Similarly, the fifth flow passage component 35 on the side of the air inlet 5 rectifies the outside air introduced from the air inlet 5 to increase the flow velocity of the cooling air passing through the third heat radiating component 28. .

As described above, according to the electronic device of the present invention, in an electronic device in which electronic components are mounted at a high density and heat generation is high, the electronic device has sufficient mechanical strength even with a small wall thickness, and the adjacent electronic components By using parts that achieve high electrical insulation, it is possible to provide a flow path structure that controls the flow of cooling air to achieve more efficient cooling of the electronic device.

Reference Signs List 1 electronic device 2 housing 3 exhaust device 4 exhaust port 5 intake port 8 connector 10 inner case 11 first circuit board 12 second circuit board 14, 15, 16, 17, 25 electronic components 21, 22, 23, 24 Modules 26, 27, 28, 29 Heat dissipation parts 31, 32, 33, 34, 35, 36, 37, 38 Flow path component parts 321, 322 Mounting part 323 Side straightening part 40 Fixing parts 50-53, 61-66, 71-74 Cooling Gas Flow

Claims (10)

a housing;
An electronic device comprising a circuit board,
A module having electronic components is mounted on one surface of the circuit board ,
A heat dissipation component having a plurality of fin structures is attached to the module,
It further includes a flow channel component having mounting portions at both ends, wherein one end of the mounting portion of the flow channel component is mounted on the one surface of the circuit board and the other end of the mounting portion is mounted on the heat dissipation component. is covered around the module by being
The flow path component is made of metal, and the surface of the metal is coated with an insulating material at least at a portion adjacent to the electronic component mounted on the circuit board,
An electronic device, wherein the circuit board on which the module, the heat dissipation component, and the flow path component are mounted is arranged along one surface of the housing and accommodated in the housing. 2. The electronic device according to claim 1, wherein said insulating material is made of a resin material. 3. The electronic device according to claim 2, wherein said resin material includes at least one of fluororesin, polyimide resin, silicon resin, and PEEK resin. 2. The electronic device according to claim 1, wherein said insulating material comprises a ceramic material. 5. The electronic device according to claim 1, wherein said insulating material has higher insulating properties than air. The electronic device according to any one of claims 1 to 5, wherein the metal portion of the attachment portion of the flow path component is mechanically attached by a fixing component so as to be in contact with the heat dissipation component. The housing includes an exhaust port covered with an exhaust device and an intake port provided on the opposite side of the exhaust port. 7. The electronic device according to any one of claims 1 to 6, wherein said exhaust device exhausts said warmed outside air out of said housing through said exhaust port. A portion surrounded by the housing, the circuit board, and the flow path component constitutes a flow path for the gas flowing from the intake port to the exhaust port, and the heat dissipation component is arranged so as to protrude into the flow channel. 8. The electronic device of claim 7, comprising: 9. The electronic device according to claim 8, wherein said flow path component increases the flow velocity of said gas passing between said fin structures of said heat radiating component. 10. The surface of the metal forming the flow path component is covered with the insulating material except for the mounting portions of the circuit board and the heat radiation component. The electronic equipment described in the paragraph.

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