JP7283045B2 - Multilayer Capacitor and Mounting Structure of Multilayer Capacitor - Google Patents

Description

The present invention relates to a multilayer capacitor and a mounting structure for the multilayer capacitor.

As a conventional multilayer capacitor, one described in Patent Document 1 is known. This multilayer capacitor includes an element body, a pair of terminal electrodes formed at both ends of the element body, and a capacitor section in which internal electrodes are arranged so as to face each other in the element body.

JP-A-2002-237429

Here, there is a case where a pair of capacitor portions are provided in one element body and connected in series with each other. Such multilayer capacitors are required to reduce defects due to short circuits. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a multilayer capacitor in which a pair of capacitor portions are connected in series while reducing defects due to short circuits, and a mounting structure for the multilayer capacitor.

A multilayer capacitor according to the present invention includes: an element body having a first main surface serving as a mounting surface for a circuit board; and a second main surface facing the first main surface in the first direction; A first terminal electrode and a second terminal electrode formed on one main surface, a connection conductor formed on the second main surface of the element body, and a second terminal electrode intersecting the first direction in the element body. a first capacitor section formed of first internal electrodes and second internal electrodes facing each other in the direction; and third internal electrodes and fourth internal electrodes facing each other in the second direction in the element body. a second capacitor portion formed, wherein the first internal electrode is connected to the first terminal electrode; the second internal electrode and the third internal electrode are connected to the connection conductor; and the fourth internal electrode is connected to the connection conductor. The electrode is connected to the second terminal electrode, and the first capacitor section and the second capacitor section are connected in series by a connecting conductor.

In this multilayer capacitor, the first internal electrode of the first capacitor section is connected to the first terminal electrode, and the fourth internal electrode of the second capacitor section is connected to the second terminal electrode. Also, the second internal electrode of the first capacitor section and the third internal electrode of the second capacitor section are connected to the connection conductor. Thereby, the first capacitor section and the second capacitor section in the element body are connected in series by the connection conductor. In this way, the first capacitor section formed by the first internal electrode and the second internal electrode and the second capacitor section formed by the third internal electrode and the fourth internal electrode are connected in series. Therefore, even if one capacitor section is short-circuited, the other capacitor section functions to reduce defects due to the short-circuit. Also, the first terminal electrode and the second terminal electrode are formed on the first main surface that serves as the mounting surface for the circuit board. In this case, even if a crack occurs in the element body on the mounting surface side when the multilayer capacitor is mounted on the circuit board, it is possible to reduce defects due to short-circuiting between opposing internal electrodes. Also, the connection conductor is formed on the second main surface facing the first main surface, which is the mounting surface. By arranging the connection conductor at a position away from the circuit board in this way, it is possible to reduce short-circuiting between the circuit board and the connection conductor. As described above, it is possible to provide a multilayer capacitor in which a pair of capacitor portions are connected in series while reducing defects due to short circuits.

The element has a pair of side surfaces facing in a second direction and a pair of end surfaces facing in a third direction intersecting the first direction and the second direction. The second internal electrodes each have a first facing region and a second facing region that face each other in the second direction, and the third internal electrode and the fourth internal electrode each have a first facing region and a second facing region that face each other in the second direction. At least one of the first terminal electrode and the second terminal electrode has a wraparound portion that wraps around at least one of the side surface and the end surface, and the first is arranged closer to the first main surface than the first facing region and the second facing region, and the wrapping portion of the second terminal electrode is disposed between the third facing region and the fourth facing region It may be arranged closer to the first main surface than the opposing region. With such a configuration, even if a crack occurs starting from the tip of the winding portion of the terminal electrode, the crack is formed at a position closer to the first main surface than each opposing region. Become. That is, by suppressing cracks from reaching the opposing regions, short-circuiting between the opposing regions can be avoided.

The element body has a pair of side surfaces facing in a second direction and a pair of end surfaces facing in a third direction intersecting the first direction and the second direction, and the first terminal electrode and At least one of the second terminal electrodes may have a wrapping portion that wraps around the side surface. Of the dielectric layers forming the element body, the dielectric layer formed between the capacitor section and the side surface is thicker than the dielectric layer between the internal electrodes. That is, it is possible to increase the distance between the wrap portion on the side surface and the capacitor portion. Therefore, even if a crack originates from the leading end of the winding portion, it is possible to prevent the crack from reaching the capacitor portion.

The first internal electrode and the second internal electrode may be arranged so as not to overlap the third internal electrode and the fourth internal electrode when viewed from the second direction. In this case, since the first capacitor section and the second capacitor section are configured independently, even if a short circuit occurs in one capacitor section, it is possible to avoid the influence of the short circuit in the other capacitor section. .

The first internal electrode and the second internal electrode each have a first facing region and a second facing region facing each other in the second direction, and the third internal electrode and the fourth internal electrode are: Each of a third facing region and a fourth facing region facing each other in the second direction is provided, and the first internal electrode is a first lead portion led out from the first facing region to the first terminal electrode. , the second internal electrode has a second lead portion led out to the connection conductor from the second opposing region, and the third internal electrode has a third lead portion led out to the connection conductor from the third opposing region The fourth internal electrode has a fourth lead portion led out from the fourth opposing region to the second terminal electrode, and intersects the first direction and the second direction. In the third direction, the separation distance between the first drawer and the fourth drawer may be greater than the separation between the second drawer and the third drawer. Thus, by increasing the separation distance between the first lead-out portion and the fourth lead-out portion in the third direction, the separation distance between the first terminal electrode and the second terminal electrode can be increased to reduce defects due to short circuits. On the other hand, by reducing the separation distance between the second lead-out portion and the third lead-out portion, it is possible to improve the reliability of the connection of the connection conductors of the respective lead-out portions.

A multilayer capacitor mounting structure according to the present invention includes the multilayer capacitor described above and a circuit board, and the first terminal electrode and the second terminal electrode are mounted on the circuit board.

According to this multilayer capacitor mounting structure, it is possible to obtain the same functions and effects as those of the multilayer capacitor described above.

According to the present invention, it is possible to provide a multilayer capacitor in which a pair of capacitor portions are connected in series while reducing defects due to short circuits, and a mounting structure for the multilayer capacitor.

1 is a schematic perspective view showing a multilayer capacitor and a mounting structure according to this embodiment; FIG. FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. 1; FIG. 2 is a cross-sectional view taken along line III-III shown in FIG. 1; FIG. 3 is a diagram showing internal electrodes on dielectric layers per layer constituting a multilayer capacitor;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and overlapping descriptions are omitted.

First, configurations of a multilayer capacitor 1 according to the present embodiment and a mounting structure 100 for the multilayer capacitor 1 will be described with reference to FIGS. 1 to 4. FIG. FIG. 1 is a schematic perspective view showing a multilayer capacitor and a mounting structure according to this embodiment. FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. FIG. 3 is a cross-sectional view taken along line III-III shown in FIG. FIG. 4 is a diagram showing internal electrodes on dielectric layers for each layer constituting a multilayer capacitor. As shown in FIG. 1 , the mounting structure 100 includes a circuit board 101 and a multilayer capacitor 1 mounted on the circuit board 101 . The circuit board 101 has a planar surface 101a. Electrodes 102A and 102B for mounting the multilayer capacitor 1 are formed on the surface 101a. The multilayer capacitor 1 includes an element body 2 , terminal electrodes 3 A (first terminal electrodes), terminal electrodes 3 B (second terminal electrodes), and connection conductors 4 .

In the following description, an XYZ coordinate system is set for the mounting structure 100 for description. The X-axis direction is a direction parallel to the surface 101 a of the circuit board 101 . The Y-axis direction is parallel to the surface 101a and perpendicular to the X-axis direction. The Z-axis direction is a direction perpendicular to the surface 101a. In FIG. 1, the upper side of the surface 101a is the positive side in the Z-axis direction, and the lower side is the negative side in the Z-axis direction. The Z-axis direction corresponds to the "first direction" in the claims, the Y-axis direction corresponds to the "second direction" in the claims, and the X-axis direction corresponds to the "third direction" in the claims. .

The element body 2 has a pair of main surfaces 2a and 2b facing each other in the Z-axis direction, a pair of side surfaces 2c and 2d facing each other in the Y-axis direction, and a pair of end surfaces 2e and 2f facing each other in the X-axis direction. , has The main surface 2 a is arranged on the negative side in the Z-axis direction and faces the surface 101 a of the circuit board 101 . The main surface 2 a is a mounting surface for the circuit board 101 . The principal surface 2 b is a surface located on the positive side in the Z-axis direction and on the opposite side of the circuit board 101 . The side surface 2c is a surface arranged on the negative side in the Y-axis direction. The side surface 2d is a surface arranged on the positive side in the Y-axis direction. The end surface 2e is a surface arranged on the negative side in the X-axis direction. The end surface 2f is a surface arranged on the positive side in the X-axis direction.

The element body 2 has a rectangular parallelepiped shape having a longitudinal direction in the X-axis direction. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, and a rectangular parallelepiped shape with rounded corners and edges. For example, the length of the element body 2 in the X-axis direction is 3.2 to 1.6 mm, the length in the Y-axis direction is 1.6 to 0.8 mm, and the length in the Z-axis direction is 1.6 mm. It may be ~0.8 mm.

The element body 2 is configured by laminating a plurality of dielectric layers (dielectric layers 20 and 21 shown in FIG. 3) in the Y-axis direction. In the element body 2, the stacking direction of the plurality of dielectric layers coincides with the Y-axis direction. Each dielectric layer is formed from a sintered ceramic green sheet containing, for example, a dielectric material (dielectric ceramic such as _BaTiO3 series, Ba(Ti,Zr) _O3 series, or (Ba,Ca) _TiO3 series). Configured. In the actual element body 2, the dielectric layers are integrated to such an extent that the boundaries between the dielectric layers are invisible.

The terminal electrode 3A and the terminal electrode 3B are formed on the main surface 2a that serves as the mounting surface for the circuit board 101. As shown in FIG. 3 A of terminal electrodes are arrange|positioned in the position spaced apart from the end surface 2e to the positive side of the X-axis direction. The terminal electrode 3B is arranged at a position spaced apart from the end surface 2f toward the negative side in the X-axis direction. The terminal electrode 3A and the terminal electrode 3B are arranged so as to be separated from each other with the center of the element body 2 in the X-axis direction interposed therebetween. The terminal electrodes 3A and 3B are formed over the entire length of the main surface 2a in the Y-axis direction. Moreover, the terminal electrodes 3A and 3B have wrapping portions 3Aa and 3Ba that wrap around the side surfaces 2c and 2d. The size of wraparound portions 3Aa and 3Ba will be described later.

The connection conductors 4 are formed on the main surface 2 b opposite to the circuit board 101 . The connection conductor 4 is separated from the end face 2e toward the positive side in the X-axis direction, separated from the end face 2f toward the negative side in the X-axis direction, and arranged at the center position of the element body 2 in the X-axis direction. The connection conductor 4 is formed over the entire length of the main surface 2b in the Y-axis direction. In addition, the connection conductor 4 has wraparound portions 4a that wrap around the side surfaces 2c and 2d. The size of the wrapping portion 4a will be described later.

Next, the internal structure of the multilayer capacitor 1 will be described with reference to FIGS. 2 to 4. FIG. As shown in FIGS. 2 to 4, the multilayer capacitor 1 includes a capacitor section 6A (first capacitor section) and a capacitor section 6B (second capacitor section). The capacitor portion 6A is formed of an internal electrode 7A (first internal electrode) and an internal electrode 8A (second internal electrode) facing each other in the Y-axis direction within the element body 2 . The capacitor section 6A is constructed by alternately laminating a plurality of internal electrodes 7A and internal electrodes 8A with dielectric layers 20 (see FIG. 3) interposed therebetween. The capacitor portion 6B is formed of an internal electrode 7B (fourth internal electrode) and an internal electrode 8B (third internal electrode) facing each other in the Y-axis direction within the element body 2 . The capacitor section 6B is constructed by alternately laminating a plurality of internal electrodes 7B and internal electrodes 8B with dielectric layers 20 (see FIG. 3) interposed therebetween. The internal electrodes 7A, 7B, 8A, 8B are made of a conductive material such as Ni or Cu.

The capacitor portion 6A is arranged on the negative side in the X-axis direction with respect to the center of the element body 2 in the X-axis direction. The capacitor portion 6B is arranged on the positive side in the X-axis direction with respect to the center of the element body 2 in the X-axis direction. The capacitor section 6A and the capacitor section 6B are arranged so as to be separated from each other with the center of the element body 2 in the X-axis direction interposed therebetween. Therefore, the internal electrodes 7A and 8A forming the capacitor section 6A are arranged so as not to overlap the internal electrodes 7B and 8B forming the capacitor section 6B when viewed in the Y-axis direction.

The internal electrodes 7A and 8A respectively have a facing region 11A (first facing region) and a facing region 13A (second facing region) facing each other in the Y-axis direction. The internal electrode 8B and the internal electrode 7B respectively have a facing region 13B (third facing region) and a facing region 11B (fourth facing region) facing each other in the Y-axis direction. In addition, the internal electrode 7A has a lead portion 12A (first lead portion) that leads from the facing region 11A to the terminal electrode 3A. The internal electrode 8A has a lead portion 14A (second lead portion) that leads to the connecting conductor 4 from the opposing region 13A. The internal electrode 8B has a lead portion 14B (third lead portion) that leads to the connection conductor 4 from the opposing region 13B. The internal electrode 7B has a lead portion 12B (fourth lead portion) that leads from the opposing region 11B to the terminal electrode 3B.

FIG. 4 shows a plan view of each dielectric layer 20 assuming that the dielectric layers 20 are developed one by one. As shown in FIG. 4A, internal electrodes 7A and 7B are formed on the same dielectric layer 20. As shown in FIG. As shown in FIG. 4B, the internal electrodes 8A and 8B are formed on the same dielectric layer 20. As shown in FIG. As shown in FIGS. 4A and 4B, the dielectric layer 20 is a rectangular plate having ends 20a and 20b facing in the Z-axis direction and ends 20c and 20d facing in the X-axis direction. formed in the shape of The end portions 20a and 20b constitute the main surfaces 2a and 2b of the element body 2, and the end portions 20c and 20d constitute the end surfaces 2e and 2f of the element body 2, respectively. In the stage prior to sintering the element body 2, the shapes of the internal electrodes 7A, 7B, 8A, and 8B are shaped by applying conductive paste onto the ceramic green sheets that form the dielectric layer 20 after sintering. A conductor pattern is formed.

As shown in FIG. 4A, the internal electrodes 7A and 7B are formed so as to be symmetrical with respect to the center line CL. The internal electrode 7A is formed on the negative side of the X-axis direction from the center line CL, and the internal electrode 7B is formed on the positive side of the X-axis direction from the center line CL.

A facing region 11A of the internal electrode 7A and a facing region 11B of the internal electrode 7B are rectangular patterns. The opposing regions 11A and 11B include ends 11Aa and 11Ba on the negative side in the Z-axis direction, ends 11Ab and 11Bb on the positive side in the Z-axis direction, ends 11Ac and 11Bc on the side opposite to the center line CL, and the center line CL. It has ends 11Ad and 11Bd on the line CL side. The ends 11Aa and 11Ba extend parallel to the end 20a of the dielectric layer 20 at positions spaced apart from the end 20a toward the positive side in the Z-axis direction. The end portions 11Ab and 11Bb extend parallel to the end portion 20b of the dielectric layer 20 at positions spaced apart from the end portion 20b toward the negative side in the Z-axis direction. The end portion 11Ac extends parallel to the end portion 20c at a position spaced apart from the end portion 20c toward the positive side in the X-axis direction. The end portion 11Bc extends parallel to the end portion 20d at a position spaced apart from the end portion 20d. The end portion 11Ad extends parallel to the center line CL at a position spaced apart from the center line CL toward the negative side in the X-axis direction. The end portion 11Bd extends parallel to the centerline CL at a position spaced apart from the centerline CL.

The lead portion 12A of the internal electrode 7A extends from the end portion 11Aa of the opposing region 11A toward the end portion 20a of the dielectric layer 20 toward the negative side in the Z-axis direction. The lead portion 12A is connected to a position closer to the negative end portion 11Ac in the X-axis direction of the end portion 11Aa. A negative end portion 12Aa and a positive end portion 12Ab in the X-axis direction of the lead-out portion 12A extend straight in parallel with the Z-axis direction. The lead portion 12B of the internal electrode 7B extends from the end portion 11Ba of the opposing region 11B toward the end portion 20a of the dielectric layer 20 toward the negative side in the Z-axis direction. The lead-out portion 12B is connected to a position closer to the end portion 11Bc on the positive side in the X-axis direction in the end portion 11Ba. A positive end portion 12Ba and a negative end portion 12Bb in the X-axis direction of the lead-out portion 12B extend straight in parallel with the Z-axis direction.

As shown in FIG. 4B, the internal electrodes 8A and 8B are formed so as to be symmetrical with respect to the center line CL. The internal electrode 8A is formed on the negative side of the X-axis direction from the center line CL, and the internal electrode 8B is formed on the positive side of the X-axis direction from the center line CL.

A facing region 13A of the internal electrode 8A and a facing region 13B of the internal electrode 8B are rectangular patterns. The opposing regions 13A and 13B have the same shape as the opposing regions 11A and 11B of the internal electrodes 7A and 7B when viewed from the Y-axis direction, and are formed at the same positions. That is, the facing region 13A has ends 13Aa, 13Ab, 13Ac, and 13Ad configured similarly to the ends 11Aa, 11Ab, 11Ac, and 11Ad of the facing region 11A. The facing region 13B has end portions 13Ba, 13Bb, 13Bc, and 13Bd configured similarly to the end portions 11Ba, 11Bb, 11Bc, and 11Bd of the facing region 11B.

The lead portion 14A of the internal electrode 8A extends from the end portion 13Ab of the opposing region 13A toward the end portion 20b of the dielectric layer 20 toward the positive side in the Z-axis direction. The lead-out portion 14A is connected to a position closer to the positive end portion 13Ad in the X-axis direction in the end portion 13Ab. A negative end portion 14Aa and a positive end portion 14Ab in the X-axis direction of the drawn-out portion 14A extend straight in parallel with the Z-axis direction. The lead portion 14B of the internal electrode 8B extends from the end portion 13Bb of the opposing region 13B toward the end portion 20b of the dielectric layer 20 toward the positive side in the Z-axis direction. The lead portion 14B is connected to a position closer to the negative end 13Bd in the X-axis direction of the end 13Bb. A positive end portion 14Ba and a negative end portion 14Bb in the X-axis direction of the lead-out portion 14B extend straight in parallel with the Z-axis direction.

Returning to FIGS. 2 and 3, the connection relationship and positional relationship of each component of the multilayer capacitor 1 will be described. As shown in FIG. 2, the internal electrode 7A of the capacitor portion 6A is connected to the terminal electrode 3A via the lead portion 12A. Terminal electrode 3A is connected to electrode 102A of circuit board 101 via solder 103 . Thereby, the capacitor section 6A is electrically connected to the electrode 102A of the circuit board 101 through the terminal electrode 3A. The internal electrode 8A of the capacitor portion 6A is connected to the connection conductor 4 via the lead portion 14A. The internal electrode 8B of the capacitor portion 6B is connected to the connecting conductor 4 via the lead portion 14B. As a result, the capacitor section 6A and the capacitor section 6B are electrically connected to each other via the connection conductor 4. As shown in FIG. The internal electrode 7B of the capacitor section 6B is connected to the terminal electrode 3B via the lead section 12B. Terminal electrode 3B is connected to electrode 102B of circuit board 101 via solder 103 . Thereby, the capacitor section 6B is electrically connected to the electrode 102B of the circuit board 101 through the terminal electrode 3B. As described above, the capacitor section 6A and the capacitor section 6B are connected in series by the connection conductor 4 between the electrodes 102A and 102B of the circuit board 101 .

In the X-axis direction, the distance L1 between the lead portions 12A and 12B is greater than the distance L2 between the lead portions 14A and 14B. The separation distance L1 is the distance in the X-axis direction between the positive end 12Ab of the lead portion 12A in the X-axis direction and the negative end 12Bb of the lead portion 12B in the X-axis direction. The separation distance L2 is the distance in the X-axis direction between the positive end 14Ab of the lead portion 14A in the X-axis direction and the negative end 14Bb of the lead portion 14B in the X-axis direction.

As shown in FIG. 3, the capacitor sections 6A and 6B are covered with a dielectric layer 21 having a greater thickness than the dielectric layer 20 on both sides in the Y-axis direction. That is, the distance between the outermost internal electrodes 7A, 7B of the capacitor portions 6A, 6B and the side surface 2c and the distance between the outermost internal electrodes 8A, 8B and the side surface 2d are It is larger than the distance between the internal electrodes 8A, 8B. As described above, the terminal electrodes 3A and 3B have wraparound portions 3Aa and 3Ba that wrap around the side surfaces 2c and 2d. Since the thick dielectric layer 21 is interposed between the wraparound portions 3Aa, 3Ba and the capacitor portions 6A, 6B, the wraparound portions 3Aa, 3Ab are largely separated from the capacitor portions 6A, 6B. In addition, the connection conductor 4 has wraparound portions 4a that wrap around the side surfaces 2c and 2d. Since the thick dielectric layer 21 is interposed between the wraparound portion 4a and the capacitor portions 6A and 6B, the wraparound portion 4a is largely separated from the capacitor portions 6A and 6B.

Wrap-around portions 3Aa and 3Ba are portions of terminal electrode 3A that extend to the positive side in the Z-axis direction from main surface 2a at corners between main surface 2a and side surfaces 2c and 2d. The corners between the main surface 2a and the side surfaces 2c and 2d have a large radius of curvature, and the wraparound portions 3Aa and 3Ba remain within the range of the curved surfaces and do not reach the flat portions of the side surfaces 2c and 2d. may be reached or may have been reached. Wrap-around portion 3Aa of terminal electrode 3A is arranged closer to main surface 2a than opposing regions 11A and 13A. Wrap-around portion 3Ba of terminal electrode 3B is arranged closer to main surface 2a than opposing regions 11B and 13B. That is, the leading ends of the winding portions 3Aa and 3Ba on the positive side in the Z-axis direction correspond to the ends 11Aa, 13Aa, 11Ba and 13Ba of the facing regions 11A, 13A, 11B and 13B on the negative side in the Z-axis direction (see FIG. 4). is arranged on the negative side in the Z-axis direction. The wraparound amount of the wraparound portions 3Aa and 3Ba, that is, the height in the Z-axis direction is not particularly limited, and may be half or less of the gap between the opposing regions 11A, 13A, 11B, and 13B and the main surface 2a. , may be greater than or equal to the distance.

Wrap-around portion 4a is a portion of connecting conductor 4 that extends to the negative side in the Z-axis direction from main surface 2b at corners between main surface 2b and side surfaces 2c and 2d. The radius of curvature of the rounded corners between the main surface 2b and the side surfaces 2c and 2d may be large, and the wraparound portion 4a may remain within the range of the curved surface and may not reach the flat portions of the side surfaces 2c and 2d. and may have been reached. The winding portion 4a of the connection conductor 4 is arranged at a position higher than the opposing regions 11A and 13A with respect to the main surface 2b. That is, the leading end portion on the negative side in the Z-axis direction of wraparound portion 4a is located further than the positive end portions 11Ab, 13Ab, 11Bb, and 13Bb (see FIG. 4) on the positive side in Z-axis direction of opposing regions 11A, 13A, 11B, and 13B. , on the positive side in the Z-axis direction. The wraparound amount of the wraparound portion 4a, that is, the height in the Z-axis direction is not particularly limited, and may be half the distance or less of the gap between the opposing regions 11A, 13A, 11B, and 13B and the main surface 2b. It may be longer than the distance.

Next, functions and effects of the multilayer capacitor 1 according to this embodiment will be described.

In the multilayer capacitor 1, the internal electrode 7A of the capacitor portion 6A is connected to the terminal electrode 3A, and the internal electrode 7B of the capacitor portion 6B is connected to the terminal electrode 3B. Further, the internal electrode 8A of the capacitor section 6A and the internal electrode 8B of the capacitor section 6B are connected to the connecting conductor 4. As shown in FIG. As a result, the capacitor portion 6A and the capacitor portion 6B in the element body 2 are connected in series by the connection conductor 4. As shown in FIG. Since the capacitor section 6A formed by the internal electrodes 7A and 8A and the capacitor section 6B formed by the internal electrodes 8B and 7B are connected in series in this manner, one capacitor section is short-circuited. Even if this is the case, defects due to short circuits can be reduced by the functioning of the other capacitor portion.

The terminal electrodes 3A and 3B are formed on the main surface 2a that serves as the mounting surface for the circuit board 101. As shown in FIG. In this case, even if a crack occurs in the element body 2 on the mounting surface side when the multilayer capacitor 1 is mounted on the circuit board 101, defects due to short-circuiting between the opposing internal electrodes 7A, 8A, 7B, and 8B are reduced. be able to. For example, if the surface on which the terminal electrodes are formed is different from the mounting surface, the electrodes must be made to extend from the terminal electrodes to the mounting surface. In this way, in the structure in which the terminal electrodes largely wrap around other surfaces, if cracks occur in the element body 2 during mounting, the cracks may reach the internal electrodes 7A, 8A, 7B, and 8B, resulting in defects due to short circuits. have a nature. In this embodiment, since the terminal electrodes 3A and 3B are formed on the main surface 2a, which is the mounting surface, defects caused by such shorts can be reduced.

Moreover, the connection conductor 4 is formed on the main surface 2b facing the main surface 2a, which is the mounting surface. By arranging the connection conductor 4 at a position away from the circuit board 101 in this manner, short-circuiting between the circuit board 101 and the connection conductor 4 can be reduced. As described above, it is possible to provide the multilayer capacitor 1 in which the pair of capacitor portions 6A and 6B are connected in series while reducing defects due to short circuits.

The element body 2 has a pair of side surfaces 2c and 2d facing each other in the Y-axis direction and a pair of end faces 2e and 2f facing each other in the X-axis direction. The internal electrodes 7A and 7B respectively have opposing regions 11A and 13A that face each other in the Y-axis direction, and the internal electrodes 8B and 7B have opposing regions 13B and 13B that face each other in the Y-axis direction. 11B respectively. The terminal electrode 3A and the terminal electrode 3B have wraparound portions 3Aa and 3Ba that wrap around the side surfaces 2c and 2d, and the wraparound portion 3Aa of the terminal electrode 3A is arranged closer to the main surface 2a than the facing region 11A and the facing region 13A, The winding portion 3Ba of the terminal electrode 3B is arranged closer to the main surface 2a than the opposing regions 13B and 11B. With such a configuration, even if a crack CK (see FIGS. 2 and 3) occurs starting from the tips of the wrap-around portions 3Aa and 3Ba of the terminal electrodes 3A and 3B, the crack CK is generated in each opposing region. They are formed at positions closer to the main surface 2a than 11A, 13A, 11B, and 13B. That is, by suppressing the cracks CK from reaching the opposing regions 11A, 13A, 11B, and 13B, short-circuiting between the opposing regions 11A, 13A, 11B, and 13B can be avoided.

The element body 2 has a pair of side surfaces 2c and 2d facing each other in the Y-axis direction and a pair of end faces 2e and 2f facing each other in the X-axis direction. The terminal electrode 3A and the terminal electrode 3B have wrapping portions 3Aa and 3Ba that wrap around the side surfaces 2c and 2d. Among the dielectric layers forming the element body 2, the dielectric layer 21 formed between the capacitor portions 6A, 6B and the side surfaces 2c, 2d is thicker than the dielectric layer 20 between the internal electrodes. That is, the distance between the wraparound portions 3Aa, 3Ba of the side surfaces 2c, 2d and the capacitor portions 6A, 6B can be increased. Therefore, even if a crack CK occurs starting from the tip end portions of the winding portions 3Aa and 3Ba, it is possible to suppress the crack CK from reaching the capacitor portions 6A and 6B.

The internal electrodes 7A and 8A are arranged so as not to overlap the internal electrodes 8B and 7B when viewed in the Y-axis direction. In this case, since the capacitor section 6A and the capacitor section 6B are configured independently, even if a short circuit occurs in one capacitor section, it is possible to avoid the influence of the short circuit in the other capacitor section.

The internal electrodes 7A and 7B respectively have opposing regions 11A and 13A that face each other in the Y-axis direction, and the internal electrodes 8B and 7B have opposing regions 13B and 13B that face each other in the Y-axis direction. 11B respectively. The internal electrode 7A has a lead portion 12A that leads to the terminal electrode 3A from the facing region 11A, the internal electrode 8A has a lead portion 14A that leads to the connecting conductor 4 from the facing region 13A, and the internal electrode 8B has a facing region 13A. The internal electrode 7B has a lead portion 14B that leads to the connection conductor 4 from the region 13B, and the internal electrode 7B has a lead portion 12B that leads to the terminal electrode 3B from the opposing region 11B. In the X-axis direction, the distance L1 between the lead portions 12A and 12B is greater than the distance L2 between the lead portions 14A and 14B. In this way, by increasing the separation distance L1 between the lead portions 12A and 12B in the X-axis direction, the separation distance between the terminal electrodes 3A and 3B is increased to prevent defects due to short circuits. can be reduced. On the other hand, by reducing the separation distance L2 between the lead portions 14A and 14B, it is possible to improve the reliability of the connection of the lead portions 14A and 14B with the connection conductors 4. FIG.

A mounting structure 100 for a multilayer capacitor 1 according to this embodiment includes a multilayer capacitor 1 and a circuit board 101, and terminal electrodes 3A and 3B are mounted on the circuit board 101. FIG.

According to the mounting structure 100 of this multilayer capacitor 1, it is possible to obtain the same functions and effects as those of the multilayer capacitor 1 described above.

Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

For example, the terminal electrodes 3A and 3B may be formed only on the main surface 2a without forming wraparound portions of the terminal electrodes 3A and 3B. Moreover, the terminal electrodes 3A and 3B may have wraparound portions that wrap around the end faces 2e and 2f. The same applies to connecting conductors.

In the above-described embodiment, the capacitor sections 6A and 6B are configured independently so that they do not overlap when viewed in the stacking direction. Alternatively, the capacitor section 6A and the capacitor section 6B may partially or wholly overlap. For example, the stacking direction of the capacitor portions 6A and 6B is rotated 90° on the spot from the one of the embodiment, the capacitor portions 6A and 6B are arranged in the X-axis direction, and the respective internal electrodes are stacked in the X-axis direction. may be

The shape of the base body 2 is not limited to a rectangular parallelepiped shape as long as it has a pair of main surfaces facing each other.

DESCRIPTION OF SYMBOLS 1... Multilayer capacitor, 2... Element body, 2a... Main surface (first main surface), 2b... Main surface (second main surface), 2c, 2d... Side surface, 2e, 2f... End surface, 3A... Terminal electrode (first terminal electrode), 3B... terminal electrode (second terminal electrode), 3Aa, 3Ba... wrapping portion, 4... connection conductor, 6A... capacitor portion (first capacitor portion), 6B... capacitor portion (second terminal electrode) 2 capacitor portion), 7A... inner conductor (first inner conductor), 7B... inner conductor (fourth inner conductor), 8A... inner conductor (second inner conductor), 8B... inner conductor (third inner conductor) internal conductor), 11A... facing area (first facing area), 11B... facing area (fourth facing area), 12A... lead portion (first lead portion), 12B... lead portion (fourth lead portion) ), 14A... Drawer portion (second drawer portion), 14B... Drawer portion (third drawer portion), 13A... Opposing area (second opposing area), 13B... Opposing area (third opposing area), 100... Mounting structure, 101... Circuit board.

Claims (3)

a base body having a first principal surface serving as a mounting surface for a circuit board and a second principal surface facing the first principal surface in a first direction;
a first terminal electrode and a second terminal electrode formed on the first main surface of the base body;
a connection conductor formed on the second main surface of the base body;
a first capacitor section formed of a first internal electrode and a second internal electrode facing each other in a second direction intersecting the first direction in the element body;
a second capacitor section formed of a third internal electrode and a fourth internal electrode facing each other in the second direction in the element body;
the first internal electrode is connected to the first terminal electrode;
the second internal electrode and the third internal electrode are connected to the connection conductor;
the fourth internal electrode is connected to the second terminal electrode;
the first capacitor section and the second capacitor section are connected in series by the connection conductor;
the base body has a pair of side surfaces facing in the second direction and a pair of end faces facing in a third direction that intersects the first direction and the second direction;
the first internal electrode and the second internal electrode respectively have a first facing region and a second facing region facing each other in the second direction;
the third internal electrode and the fourth internal electrode respectively have a third facing region and a fourth facing region facing each other in the second direction;
at least one of the first terminal electrode and the second terminal electrode has a wrapping portion that wraps around at least one of the side surface and the end surface;
the winding portion of the first terminal electrode is arranged closer to the first main surface than the first opposing region and the second opposing region;
the winding portion of the second terminal electrode is arranged closer to the first main surface than the third opposing region and the fourth opposing region ;
When viewed from the second direction, the first internal electrode and the second internal electrode are aligned with the third internal electrode and the fourth internal electrode in the third direction and do not overlap each other. is placed,
The first internal electrode has a width dimension in the third direction smaller than that of the first opposing region, and is located at a position opposite to the fourth opposing region in the third direction, a first lead-out portion led out from the first opposing region to the first terminal electrode;
The second internal electrode has a width dimension in the third direction smaller than that of the second opposing region, and is positioned closer to the third opposing region in the third direction than the second internal electrode. having a second lead-out portion led out to the connection conductor from the opposing region of
The third internal electrode has a width dimension in the third direction smaller than that of the third opposing region, and is positioned closer to the second opposing region in the third direction than the third internal electrode. has a third lead-out portion that is led out to the connection conductor from the opposing region of
The fourth internal electrode has a width dimension in the third direction smaller than that of the fourth opposing region, and is located at a position opposite to the first opposing region in the third direction, a fourth lead portion led out from the fourth opposing region to the second terminal electrode;
In the third direction, the separation distance between the first drawer section and the fourth drawer section is greater than the separation distance between the second drawer section and the third drawer section. , multilayer capacitors. 2. The multilayer capacitor according to claim 1, wherein at least one of said first terminal electrode and said second terminal electrode has a wrapping portion that wraps around said side surface. A multilayer capacitor according to claim 1 or 2 ;
and the circuit board,
A mounting structure for a multilayer capacitor, wherein the first terminal electrode and the second terminal electrode are mounted on the circuit board.

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