JP7206768B2 - electronic components - Google Patents

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JP7206768B2
JP7206768B2 JP2018189436A JP2018189436A JP7206768B2 JP 7206768 B2 JP7206768 B2 JP 7206768B2 JP 2018189436 A JP2018189436 A JP 2018189436A JP 2018189436 A JP2018189436 A JP 2018189436A JP 7206768 B2 JP7206768 B2 JP 7206768B2
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terminal
chip component
terminal member
terminal electrode
component
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JP2020061392A (en
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真也 齋藤
崇 青木
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TDK Corp
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TDK Corp
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Description

本発明は、電子部品に関する。 The present invention relates to electronic components.

従来の電子部品として、特許文献１に記載されたものが知られている。この電子部品は、素体及び端子電極を有する複数のチップ部品と、複数のチップ部品の端子電極に接続される端子部材と、を備えている。端子部材は、断面Ｌ字状に構成されている。また、端子部材は、チップ部品の延在方向における端面に対応する箇所にて、端子電極と接続されている。電子部品は、端子部材を介して、回路基板に実装される。 2. Description of the Related Art As a conventional electronic component, one described in Patent Document 1 is known. This electronic component includes a plurality of chip components having an element body and terminal electrodes, and a terminal member connected to the terminal electrodes of the plurality of chip components. The terminal member is configured to have an L-shaped cross section. Also, the terminal member is connected to the terminal electrode at a location corresponding to the end face in the extending direction of the chip component. The electronic component is mounted on the circuit board through the terminal member.

特開２０００－２３５９３２号公報JP-A-2000-235932

ここで、回路基板にたわみが発生する場合がある。このとき、当該回路基板のたわみの影響により、端子部材と端子電極との間に応力が加わる。これにより、端子部材と端子電極との間の接続の安定性に影響が及ぼされるという問題がある。 Here, bending may occur in the circuit board. At this time, stress is applied between the terminal member and the terminal electrode due to the bending of the circuit board. As a result, there is a problem that the stability of the connection between the terminal member and the terminal electrode is affected.

本願発明は、このような課題を解決するためになされたものであり、端子部材と端子電極との間の接続の安定性を向上することができる電子部品を提供することを目的とする。 SUMMARY OF THE INVENTION The present invention has been made to solve such problems, and an object of the present invention is to provide an electronic component capable of improving the stability of connection between a terminal member and a terminal electrode.

本発明に係る電子部品は、素体及び端子電極を備える第１のチップ部品及び第２のチップ部品と、第１のチップ部品及び第２のチップ部品のそれぞれの端子電極に接続される複数の端子部材と、を備える電子部品であって、素体は、当該素体が延びる延在方向の両端側に形成された一対の端面と、一対の端面の間に形成された側面と、を有し、端子電極は、素体の端面に形成された本体部、及び本体部から側面へ回り込む回り込み部を有し、複数の端子部材のうちの一の端子部材は、第１のチップ部品の端子電極の回り込み部と、第２のチップ部品の端子電極の回り込み部との間に配置され、それぞれの回り込み部と接続されている。 An electronic component according to the present invention includes a first chip component and a second chip component each having an element body and terminal electrodes, and a plurality of electronic components connected to the terminal electrodes of the first chip component and the second chip component, respectively. a terminal member, wherein the element body has a pair of end faces formed on both end sides in an extension direction of the element body, and a side face formed between the pair of end faces. The terminal electrode has a main body formed on the end surface of the base body and a wrap-around part extending from the main body to the side surface, and one of the plurality of terminal members is a terminal of the first chip component. It is arranged between the wraparound portion of the electrode and the wraparound portion of the terminal electrode of the second chip component, and is connected to each wraparound portion.

この電子部品では、第１のチップ部品及び第２のチップ部品の素体は、当該素体が延びる延在方向の両端側に形成された一対の端面と、一対の端面の間に形成された側面と、を有する。端子電極は、素体の端面に形成された本体部、及び本体部から側面へ回り込む回り込み部を有する。これらの端子電極には、複数の端子部材がそれぞれ接続される。ここで、複数の端子部材のうちの一の端子部材は、第１のチップ部品の端子電極の回り込み部と、第２のチップ部品の端子電極の回り込み部との間に配置されている。更に、一の端子部材は、第１のチップ部品の端子電極、及び第２のチップ部品の端子電極のそれぞれの回り込み部と接続されている。この場合、端子部材は、端子電極のうちの素体の側面に対応する箇所に接続されるため、端面に対応する箇所に接続される場合に比して、回路基板のたわみによって受ける影響を低減することができる。また、端子部材は、第１のチップ部品の端子電極及び第２のチップ部品の端子電極に挟まれるように保持された状態で接続される。この場合、端子電極と端子部材との間の接続性は、端子電極のうちの素体の端面に対応する箇所に端子部材が接続される構成に比して、高くなる。従って、端子部材と端子電極との間の接続の安定性を向上することができる。 In this electronic component, the base bodies of the first chip component and the second chip component are formed between a pair of end faces formed on both end sides in the extension direction of the base body and between the pair of end faces. a side surface; The terminal electrode has a main body portion formed on the end surface of the element body and a wrap-around portion extending from the main body portion to the side surface. A plurality of terminal members are connected to these terminal electrodes, respectively. Here, one terminal member among the plurality of terminal members is arranged between the wrap-around portion of the terminal electrode of the first chip component and the wrap-around portion of the terminal electrode of the second chip component. Furthermore, the one terminal member is connected to the winding portions of the terminal electrode of the first chip component and the terminal electrode of the second chip component. In this case, since the terminal member is connected to a portion of the terminal electrode corresponding to the side surface of the element body, the effect of bending of the circuit board is reduced compared to the case where the terminal member is connected to a portion corresponding to the end face. can do. Further, the terminal member is connected while being sandwiched between the terminal electrode of the first chip component and the terminal electrode of the second chip component. In this case, the connectivity between the terminal electrode and the terminal member is higher than in a configuration in which the terminal member is connected to a portion of the terminal electrode corresponding to the end surface of the element body. Therefore, it is possible to improve the stability of the connection between the terminal member and the terminal electrode.

端子部材は、端子電極のうち、複数の側面に対応する回り込み部に接続されていてよい。この場合、端子部材が複数の側面に対して接続されることで、端子部材と端子電極との間の接続の安定性を向上できる。 The terminal member may be connected to wraparound portions corresponding to a plurality of side surfaces of the terminal electrode. In this case, since the terminal member is connected to the plurality of side surfaces, the stability of the connection between the terminal member and the terminal electrode can be improved.

第１のチップ部品の端子電極に接続される端子部材、及び第１のチップ部品の位置関係と、第２のチップ部品の端子電極に接続される端子部材、及び第２のチップ部品の位置関係は、点対称の関係にあってよい。この場合、第１のチップ部品の端子電極と第２のチップ部品の端子電極を一の端子部材に接続することが可能となるため、製造が容易となる。また、電子部品がこのような点対称の関係を有している場合、第１のチップ部品と端子部材による構造体、及び第２のチップ部品と端子部材による構造体は、部品としては同じ形状を有することとなる。従って、一のチップ部品に対して一の端子部材を接続した構造体を複数作っておけば、いずれの構造体も、第１のチップ部品と端子部材による構造体、及び第２のチップ部品と端子部材による構造体として用いることができる。このように、第１のチップ部品と端子部材による構造体、及び第２のチップ部品と端子部材による構造体を区別する必要がなくなるため、電子部品の製造が容易となる。 Positional relationship between the terminal member connected to the terminal electrode of the first chip component and the first chip component, and positional relationship between the terminal member connected to the terminal electrode of the second chip component and the second chip component may have a point-symmetrical relationship. In this case, the terminal electrode of the first chip component and the terminal electrode of the second chip component can be connected to one terminal member, which facilitates manufacturing. Further, when the electronic component has such a point-symmetrical relationship, the structure composed of the first chip component and the terminal member and the structure composed of the second chip component and the terminal member have the same shape as components. will have Therefore, if a plurality of structures in which one terminal member is connected to one chip component are prepared, any structure can be composed of the first chip component and the terminal member, and the second chip component. It can be used as a structure with terminal members. In this way, there is no need to distinguish between the structure composed of the first chip component and the terminal member and the structure composed of the second chip component and the terminal member, which facilitates the manufacture of electronic components.

端子部材は、側面のうち、回路基板に対する実装面に対応する側面の回り込み部と接続されてよい。この場合、端子部材は、実装面側でチップ部品を保持することができる。従って、端子部材は、チップ部品が回路基板に脱落することを抑制できる。 The terminal member may be connected to the winding portion of the side surface corresponding to the mounting surface for the circuit board, among the side surfaces. In this case, the terminal member can hold the chip component on the mounting surface side. Therefore, the terminal member can prevent the chip component from dropping onto the circuit board.

第１のチップ部品と第２のチップ部品とは、直列に接続されていてよい。このように、端子部材を用いて複数のチップ部品を直列に接続することができる。 The first chip component and the second chip component may be connected in series. In this way, a plurality of chip components can be connected in series using the terminal member.

端子部材は、回路基板に実装される実装部を有し、実装部は、延在方向に対する垂直方向に延びていてよい。例えば、実装部が延在方向に延びる場合、当該実装部は、回路基板のたわみに伴って変形し易くなる。この場合、実装部は、回路基板のたわみに起因する応力を回避することができるが、その分、応力の影響が端子部材と端子電極との接続部分に及ぼされてしまう可能性がある。これに対し、実装部が延在方向に対する垂直方向に延びている場合、実装部自体が回路基板のたわみに起因する応力を受け持つ分、端子部材と端子電極との接続部分に対する応力を低減できる。 The terminal member may have a mounting portion mounted on the circuit board, and the mounting portion may extend in a direction perpendicular to the extending direction. For example, when the mounting portion extends in the extending direction, the mounting portion is likely to deform as the circuit board bends. In this case, the mounting portion can avoid the stress caused by the bending of the circuit board, but there is a possibility that the connection portion between the terminal member and the terminal electrode will be affected by the stress. On the other hand, when the mounting portion extends in the direction perpendicular to the extending direction, the mounting portion itself bears the stress caused by the bending of the circuit board, so the stress applied to the connecting portion between the terminal member and the terminal electrode can be reduced.

本発明によれば、端子部材と端子電極との間の接続の安定性を向上することができる電子部品を提供できる。 ADVANTAGE OF THE INVENTION According to this invention, the electronic component which can improve the stability of the connection between a terminal member and a terminal electrode can be provided.

本発明の実施形態に係る電子部品を示す斜視図である。1 is a perspective view showing an electronic component according to an embodiment of the invention; FIG. 図１に示すＩＩ－ＩＩ線に沿った断面図である。FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. 1; 変形例に係る電子部品を示す斜視図である。It is a perspective view which shows the electronic component which concerns on a modification. 変形例に係る電子部品を示す斜視図である。It is a perspective view which shows the electronic component which concerns on a modification. 変形例に係る電子部品を示す斜視図である。It is a perspective view which shows the electronic component which concerns on a modification. 変形例に係る電子部品を示す斜視図である。It is a perspective view which shows the electronic component which concerns on a modification. 変形例に係る電子部品を示す斜視図である。It is a perspective view which shows the electronic component which concerns on a modification.

以下、添付図面を参照して、本発明の実施形態について詳細に説明する。なお、説明において、同一要素又は同一機能を有する要素には、同一符号を用いることとし、重複する説明は省略する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and overlapping descriptions are omitted.

まず、図１及び図２を参照して、本実施形態に係る電子部品１００構成について説明する。図１は、本実施形態に係る電子部品を示す斜視図である。図２は、図１に示すＩＩ－ＩＩ線に沿った断面図である。図１に示すように、電子部品１００は、チップ部品１０Ａ（第１のチップ部品）と、チップ部品１０Ｂ（第２のチップ部品）と、端子部材２０Ａ，２０Ｂ，２０Ｃと、を備える。チップ部品１０Ａ，１０Ｂは、素体２と、端子電極３と、端子電極４と、を備える積層コンデンサである。なお、電子部品１００は、回路基板５０に実装される（図３（ｂ）参照）。 First, the configuration of an electronic component 100 according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. FIG. 1 is a perspective view showing an electronic component according to this embodiment. FIG. 2 is a cross-sectional view along line II-II shown in FIG. As shown in FIG. 1, the electronic component 100 includes a chip component 10A (first chip component), a chip component 10B (second chip component), and terminal members 20A, 20B, and 20C. The chip components 10A and 10B are multilayer capacitors each including an element body 2, terminal electrodes 3, and terminal electrodes 4. As shown in FIG. Electronic component 100 is mounted on circuit board 50 (see FIG. 3B).

なお、以降の説明においては、電子部品１００に対してＸＹＺ座標系を設定して説明を行う場合がある。Ｘ軸方向は、実装対象である回路基板５０（図３（ｂ）参照）の表面と平行な方向である。また、Ｘ軸方向は、素体２が延びる延在方向に対応する。Ｙ軸方向は、回路基板５０の表面と平行でありＸ軸方向と直交する方向である。Ｚ軸方向は、回路基板５０の表面と直交する方向である。図１では、上側がＺ軸方向の正側であり、下側がＺ軸方向の負側である。 In the following description, the XYZ coordinate system may be set for the electronic component 100 in some cases. The X-axis direction is a direction parallel to the surface of the circuit board 50 (see FIG. 3B) to be mounted. Also, the X-axis direction corresponds to the extension direction in which the element body 2 extends. The Y-axis direction is parallel to the surface of the circuit board 50 and orthogonal to the X-axis direction. The Z-axis direction is a direction perpendicular to the surface of the circuit board 50 . In FIG. 1, the upper side is the positive side in the Z-axis direction, and the lower side is the negative side in the Z-axis direction.

図１に示すように、素体２は、延在方向であるＸ軸方向に沿って延びる直方体の部品である。素体２は、Ｘ軸方向に互いに対向する一対の端面２ａ，２ｂ（図２参照）と、Ｚ軸方向に互いに対向する一対の側面２ｃ，２ｄと、Ｙ軸方向に互いに対向する一対の側面２ｅ，２ｆと、を有する。端面２ａはＸ軸方向の正側に配置され、端面２ｂはＸ軸方向の負側に配置される。側面２ｃはＺ軸方向の正側に配置され、側面２ｄはＺ軸方向の負側に配置される。側面２ｄは、回路基板５０（図３（ｂ）参照）に対する実装面となる。側面２ｅはＹ軸方向の正側に配置され、側面２ｆはＹ軸方向の負側に配置される。 As shown in FIG. 1, the base body 2 is a rectangular parallelepiped part extending along the X-axis direction, which is the extending direction. The element body 2 has a pair of end faces 2a and 2b (see FIG. 2) facing each other in the X-axis direction, a pair of side faces 2c and 2d facing each other in the Z-axis direction, and a pair of side faces facing each other in the Y-axis direction. 2e and 2f. The end face 2a is arranged on the positive side in the X-axis direction, and the end face 2b is arranged on the negative side in the X-axis direction. The side surface 2c is arranged on the positive side in the Z-axis direction, and the side surface 2d is arranged on the negative side in the Z-axis direction. The side surface 2d serves as a mounting surface for the circuit board 50 (see FIG. 3B). The side surface 2e is arranged on the positive side in the Y-axis direction, and the side surface 2f is arranged on the negative side in the Y-axis direction.

素体２の形状は特に限定されないが、ここではＸ軸方向及びＺ軸方向の寸法がＹ軸方向の寸法より大きい直方体形状を有している。直方体形状には、角部及び稜線部が面取りされている直方体の形状、及び、角部及び稜線部が丸められている直方体の形状が含まれる。例えば、素体２のＸ軸方向の長さは５．７～２．０ｍｍであり、Ｙ軸方向の長さは５．０～１．２ｍｍであり、Ｚ軸方向の長さは５．０～１．２ｍｍであってよい。 Although the shape of the element body 2 is not particularly limited, it has a rectangular parallelepiped shape in which the dimensions in the X-axis direction and the Z-axis direction are larger than the dimension in the Y-axis direction. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, and a rectangular parallelepiped shape with rounded corners and edges. For example, the length of the element body 2 in the X-axis direction is 5.7 to 2.0 mm, the length in the Y-axis direction is 5.0 to 1.2 mm, and the length in the Z-axis direction is 5.0 mm. It may be ˜1.2 mm.

素体２では、Ｙ軸方向に複数の誘電体層（図３に示す誘電体層５）が積層されて構成されている。素体２では、複数の誘電体層の積層方向が、Ｙ軸方向と一致する。各誘電体層は、たとえば誘電体材料（ＢａＴｉＯ３系、Ｂａ(Ｔｉ，Ｚｒ)Ｏ３系、又は（Ｂａ，Ｃａ）ＴｉＯ３系などの誘電体セラミック）を含むセラミックグリーンシートの焼結体から構成される。実際の素体２では、各誘電体層は、各誘電体層の間の境界が視認できない程度に一体化されている。 The element body 2 is configured by laminating a plurality of dielectric layers (dielectric layers 5 shown in FIG. 3) in the Y-axis direction. In the element body 2, the stacking direction of the plurality of dielectric layers coincides with the Y-axis direction. Each dielectric layer is formed from a sintered ceramic green sheet containing, for example, a dielectric material (dielectric ceramic such as BaTiO3 series, Ba(Ti,Zr)O3 series , or (Ba , Ca) TiO3 series). Configured. In the actual element body 2, the dielectric layers are integrated to such an extent that the boundaries between the dielectric layers are invisible.

端子電極３，４は、素体２の端面２ａ，２ｂを覆うように設けられる。端子電極３，４は、他の部材とチップ部品１０Ａ，１０Ｂとを電気的に接続するための部分である。端子電極３，４は、本体部３ａ，４ａと、回り込み部３ｂ，４ｂと、を有する。本体部３ａ，４ａは、素体２の端面２ａ，２ｂに形成される。本体部３ａ，４ａは、端面２ａ，２ｂの全面を覆うように形成される。回り込み部３ｂ，４ｂは、本体部３ａ，４ａから側面２ｃ，２ｄ，２ｅ，２ｆへ回り込むように形成される。回り込み部３ｂは、側面２ｃ，２ｄ，２ｅ，２ｆのうち、端面２ａ付近の一部を覆うように形成される。回り込み部４ｂは、側面２ｃ，２ｄ，２ｅ，２ｆのうち、端面２ｂ付近の一部を覆うように形成される。 The terminal electrodes 3 and 4 are provided so as to cover the end surfaces 2a and 2b of the element body 2. As shown in FIG. Terminal electrodes 3 and 4 are portions for electrically connecting other members and chip components 10A and 10B. The terminal electrodes 3 and 4 have body portions 3a and 4a and wrapping portions 3b and 4b. The body portions 3 a and 4 a are formed on the end faces 2 a and 2 b of the element body 2 . The body portions 3a, 4a are formed so as to cover the entire surfaces of the end faces 2a, 2b. Wrap-around portions 3b and 4b are formed so as to wrap around from body portions 3a and 4a to side surfaces 2c, 2d, 2e and 2f. Wrap-around portion 3b is formed so as to cover part of side surfaces 2c, 2d, 2e, and 2f near end surface 2a. Wrap-around portion 4b is formed so as to cover part of side surfaces 2c, 2d, 2e, and 2f near end surface 2b.

図２に示すように、チップ部品１０Ａ，１０Ｂは、素体２内でＹ軸方向において互いに対向する内部電極６及び内部電極７で形成される。内部電極６は、素体２内においてＸＺ平面と平行に広がり、端子電極３と接続される。内部電極７は、素体２内においてＸＺ平面と平行に広がり、端子電極４と接続される。内部電極６と内部電極７とが、誘電体層５を挟んで交互に複数枚積層されることによって、コンデンサが構成される。内部電極６，７は、例えばＮｉ又はＣｕなどの導電性材料により形成される。 As shown in FIG. 2, the chip components 10A and 10B are formed of internal electrodes 6 and internal electrodes 7 facing each other in the Y-axis direction within the base body 2. As shown in FIG. The internal electrodes 6 extend parallel to the XZ plane within the element body 2 and are connected to the terminal electrodes 3 . The internal electrodes 7 extend parallel to the XZ plane within the element body 2 and are connected to the terminal electrodes 4 . A plurality of internal electrodes 6 and 7 are alternately laminated with dielectric layers 5 interposed therebetween to form a capacitor. The internal electrodes 6 and 7 are made of a conductive material such as Ni or Cu.

図１に示すように、チップ部品１０Ａとチップ部品１０Ｂとは、Ｙ軸方向において互いに隣り合い、且つ、Ｘ軸方向において互いにずれた配置となる。チップ部品１０Ａの端子電極４のうち、側面２ｆに対応する回り込み部４ｂと、チップ部品１０Ｂの端子電極３のうち、側面２ｅに対応する回り込み部３ｂとは、Ｙ軸方向において互いに対向するように配置される。 As shown in FIG. 1, the chip component 10A and the chip component 10B are arranged adjacent to each other in the Y-axis direction and offset from each other in the X-axis direction. The wrap portion 4b corresponding to the side surface 2f of the terminal electrode 4 of the chip component 10A and the wrap portion 3b corresponding to the side surface 2e of the terminal electrode 3 of the chip component 10B are arranged to face each other in the Y-axis direction. placed.

端子部材２０Ａは、チップ部品１０Ａの端子電極３に接続される。端子部材２０Ｂは、チップ部品１０Ａの端子電極４及びチップ部品１０Ｂの端子電極３に接続される。端子部材２０Ｃは、チップ部品１０Ｂの端子電極４に接続される。端子部材２０Ａは、接続部２１，２２，２３と、実装部２４と、を有する。接続部２１，２２，２３は、端子電極３，４の少なくとも何れかに電気的に接続される部分である。実装部２４は、回路基板５０（図３（ｂ）参照）に実装される部分である。実装部２４は、回路基板５０の電極と接合される接合部２４ａと、接合部２４ａから立ち上がる足部２４ｂと、を有する。足部２４ｂは、チップ部品１０Ａ，１０Ｂを回路基板５０（図３（ｂ）参照）の表面から浮かせるように、チップ部品１０Ａ，１０Ｂを持ち上げるための部分である。端子部材２０Ａ，２０Ｂ，２０Ｃは、互いに同一な形状を有している。 The terminal member 20A is connected to the terminal electrode 3 of the chip component 10A. The terminal member 20B is connected to the terminal electrode 4 of the chip component 10A and the terminal electrode 3 of the chip component 10B. The terminal member 20C is connected to the terminal electrode 4 of the chip component 10B. The terminal member 20A has connecting portions 21 , 22 , 23 and a mounting portion 24 . The connecting portions 21 , 22 , 23 are portions electrically connected to at least one of the terminal electrodes 3 , 4 . The mounting portion 24 is a portion mounted on the circuit board 50 (see FIG. 3B). The mounting portion 24 has a joint portion 24a that is joined to the electrode of the circuit board 50, and a leg portion 24b that rises from the joint portion 24a. The leg portion 24b is a portion for lifting the chip components 10A and 10B so as to float the chip components 10A and 10B from the surface of the circuit board 50 (see FIG. 3B). The terminal members 20A, 20B, 20C have the same shape.

接続部２２は、Ｚ軸方向に延びる帯状の金属片である。接続部２１は、接続部２２のＺ軸方向の正側の端部から、Ｙ軸方向の一方へ延びる帯状の金属片である。接続部２３は、接続部２２のＺ軸方向の負側の端部から、Ｙ軸方向の他方へ延びる帯状の金属片である。足部２４ｂは、接続部２３のＹ軸方向の他方の端部から、Ｚ軸方向の負側へ延びる帯状の金属片である。接合部２４ａは、足部２４ｂのＺ軸方向の負側の端部から、Ｙ軸方向の一方へ延びる帯状の金属片である。このような構成により、実装部２４は、素体２の延在方向であるＸ軸方向に対する垂直方向（ここではＹ軸方向）に延びる構成となる。接続部２１，２２，２３、足部２４ｂ及び接合部２４ａは、いずれもＸ軸方向を幅方向として広がっている。接続部２１，２３及び接合部２４ａのＹ軸方向の長さは同一である。 The connecting portion 22 is a strip-shaped metal piece extending in the Z-axis direction. The connecting portion 21 is a strip-shaped metal piece extending from the positive end of the connecting portion 22 in the Z-axis direction to one side in the Y-axis direction. The connecting portion 23 is a strip-shaped metal piece extending from the negative end of the connecting portion 22 in the Z-axis direction to the other side in the Y-axis direction. The leg portion 24b is a strip-shaped metal piece extending from the other end of the connecting portion 23 in the Y-axis direction to the negative side in the Z-axis direction. The joint portion 24a is a strip-shaped metal piece extending from the negative end of the leg portion 24b in the Z-axis direction to one side in the Y-axis direction. With such a configuration, the mounting portion 24 is configured to extend in a direction perpendicular to the X-axis direction, which is the extension direction of the base body 2 (here, the Y-axis direction). The connecting portions 21, 22, 23, the leg portion 24b, and the joint portion 24a are all widened with the X-axis direction as the width direction. The connecting portions 21, 23 and the joint portion 24a have the same length in the Y-axis direction.

端子部材２０Ａ，２０Ｂ，２０Ｃは、例えば、銅、リン青銅、ＮｉＦｅ合金などの金属によって形成される。端子部材２０Ａ，２０Ｂ，２０Ｃは、帯状の金属材料を屈曲させることで上記各部を形成してもよく、上記各部に対応する金属片を互いに固定することで構成されてもよい。 The terminal members 20A, 20B, 20C are made of metal such as copper, phosphor bronze, NiFe alloy, for example. The terminal members 20A, 20B, and 20C may be formed by bending a belt-shaped metal material to form the respective portions, or may be configured by fixing metal pieces corresponding to the respective portions to each other.

端子部材２０Ａは、接続部２３が接続部２２からＹ軸方向の正側へ延びるような向きに配置される。端子部材２０Ａは、接続部２２，２３にてチップ部品１０Ａの端子電極３に接続される。接続部２２は、側面２ｆに対応する回り込み部３ｂと接続される。接続部２３は、実装面である側面２ｄに対応する回り込み部３ｂと接続される。これにより、端子部材２０Ａは、端子電極３のうち、複数の側面に対応する回り込み部３ｂに接続される状態となる。また、チップ部品１０Ａの端子電極３の本体部３ａは、端子部材２０Ａと接続されることなく、露出された状態となる。 20 A of terminal members are arrange|positioned so that the connection part 23 may extend from the connection part 22 to the positive side of a Y-axis direction. The terminal member 20A is connected to the terminal electrode 3 of the chip component 10A at the connecting portions 22 and 23. As shown in FIG. The connecting portion 22 is connected to the wrapping portion 3b corresponding to the side surface 2f. The connecting portion 23 is connected to the wrapping portion 3b corresponding to the side surface 2d, which is the mounting surface. As a result, the terminal member 20A is connected to the winding portions 3b of the terminal electrode 3 corresponding to the plurality of side surfaces. Also, the body portion 3a of the terminal electrode 3 of the chip component 10A is exposed without being connected to the terminal member 20A.

端子部材２０Ｂは、接続部２３が接続部２２からＹ軸方向の負側へ延びるような向きに配置される。端子部材２０Ｂは、接続部２１，２２にてチップ部品１０Ａの端子電極４に接続される。接続部２１は、側面２ｃに対応する回り込み部４ｂと接続される。接続部２２は、側面２ｆに対応する回り込み部４ｂと接続される。これにより、端子部材２０Ｂは、チップ部品１０Ａの端子電極４のうち、複数の側面に対応する回り込み部４ｂに接続される状態となる。また、チップ部品１０Ａの端子電極４の本体部４ａは、端子部材２０Ｂと接続されることなく、露出された状態となる。 The terminal member 20B is arranged in such a direction that the connection portion 23 extends from the connection portion 22 toward the negative side in the Y-axis direction. Terminal member 20B is connected to terminal electrode 4 of chip component 10A at connecting portions 21 and 22 . The connecting portion 21 is connected to the wrapping portion 4b corresponding to the side surface 2c. The connecting portion 22 is connected to the wrapping portion 4b corresponding to the side surface 2f. As a result, the terminal member 20B is connected to the winding portions 4b corresponding to the plurality of side surfaces of the terminal electrodes 4 of the chip component 10A. Also, the body portion 4a of the terminal electrode 4 of the chip component 10A is exposed without being connected to the terminal member 20B.

更に、端子部材２０Ｂは、接続部２２，２３にてチップ部品１０Ｂの端子電極３に接続される。接続部２２は、側面２ｅに対応する回り込み部３ｂと接続される。接続部２３は、実装面である側面２ｄに対応する回り込み部３ｂと接続される。これにより、端子部材２０Ｂは、チップ部品１０Ｂの端子電極３のうち、複数の側面に対応する回り込み部３ｂに接続される状態となる。また、チップ部品１０Ｂの端子電極３の本体部３ａは、端子部材２０Ｂと接続されることなく、露出された状態となる。 Further, the terminal member 20B is connected to the terminal electrodes 3 of the chip component 10B at the connecting portions 22 and 23. As shown in FIG. The connecting portion 22 is connected to the wrapping portion 3b corresponding to the side surface 2e. The connecting portion 23 is connected to the wrapping portion 3b corresponding to the side surface 2d, which is the mounting surface. As a result, the terminal member 20B is connected to the winding portions 3b corresponding to the plurality of side surfaces of the terminal electrodes 3 of the chip component 10B. Also, the body portion 3a of the terminal electrode 3 of the chip component 10B is exposed without being connected to the terminal member 20B.

上述のような構成により、端子部材２０Ｂは、チップ部品１０Ａの端子電極４の回り込み部４ａと、チップ部品１０Ｂの端子電極３の回り込み部３ｂとの間に配置され、それぞれの回り込み部４ｂ，３ｂと接続された状態となる。すなわち、チップ部品１０Ａの端子電極４とチップ部品１０Ｂの端子電極３とは、回り込み部３ｂ，４ｂの箇所にて、端子部材２０Ｂを介して互いに接続される。 With the configuration as described above, the terminal member 20B is arranged between the wraparound portion 4a of the terminal electrode 4 of the chip component 10A and the wraparound portion 3b of the terminal electrode 3 of the chip component 10B. is connected to the That is, the terminal electrode 4 of the chip component 10A and the terminal electrode 3 of the chip component 10B are connected to each other via the terminal member 20B at the wrapping portions 3b and 4b.

端子部材２０Ｃは、接続部２３が接続部２２からＹ軸方向の負側へ延びるような向きに配置される。端子部材２０Ｃは、接続部２２，２３にてチップ部品１０Ｂの端子電極４に接続される。接続部２２は、側面２ｅに対応する回り込み部４ｂと接続される。接続部２３は、実装面である側面２ｄに対応する回り込み部４ｂと接続される。これにより、端子部材２０Ｃは、チップ部品１０Ｃの端子電極４のうち、複数の側面に対応する回り込み部４ｂに接続される状態となる。また、チップ部品１０Ｂの端子電極４の本体部４ａは、端子部材２０Ｃと接続されることなく、露出された状態となる。 20 C of terminal members are arrange|positioned so that the connection part 23 may extend from the connection part 22 to the negative side of a Y-axis direction. Terminal member 20C is connected to terminal electrode 4 of chip component 10B at connecting portions 22 and 23 . The connecting portion 22 is connected to the wrapping portion 4b corresponding to the side surface 2e. The connecting portion 23 is connected to the wrapping portion 4b corresponding to the side surface 2d, which is the mounting surface. As a result, the terminal member 20C is connected to the winding portions 4b corresponding to the plurality of side surfaces of the terminal electrodes 4 of the chip component 10C. Also, the body portion 4a of the terminal electrode 4 of the chip component 10B is exposed without being connected to the terminal member 20C.

電子部品１００のＸ軸方向における中心位置及びＹ軸方向における中心位置に該当する箇所に、中心軸線ＣＬを設定する。このとき、中心軸線ＣＬは、端子部材２０Ｂの接続部２２の幅方向（Ｘ軸方向）における中央位置にて、Ｚ軸方向に延びる。Ｚ軸方向から見て、中心軸線ＣＬは点で示されるが、当該中心軸線ＣＬによる点を基準としたときに、チップ部品１０Ａ及び端子部材２０Ａの位置関係と、チップ部品１０Ｂ及び端子部材２０Ｃの位置関係は、点対称の関係にある。チップ部品１０Ａ及び端子部材２０Ａの位置関係と、チップ部品１０Ｂ及び端子部材２０Ｃの位置関係は、中心軸線ＣＬを基準軸とした回転対称な関係にあると言ってもよい。 A center axis CL is set at a location corresponding to the center position in the X-axis direction and the center position in the Y-axis direction of the electronic component 100 . At this time, the central axis CL extends in the Z-axis direction at the center position in the width direction (X-axis direction) of the connection portion 22 of the terminal member 20B. When viewed from the Z-axis direction, the central axis CL is indicated by a point, but when the point by the central axis CL is used as a reference, the positional relationship between the chip component 10A and the terminal member 20A, and the relationship between the chip component 10B and the terminal member 20C. The positional relationship is point symmetrical. It can be said that the positional relationship between the chip component 10A and the terminal member 20A and the positional relationship between the chip component 10B and the terminal member 20C are rotationally symmetrical with respect to the central axis CL as a reference axis.

電流の流れを考慮した場合、端子部材２０Ａから流れた電流は、チップ部品１０Ａの端子電極３からチップ部品１０Ａ内部のコンデンサ部を介してチップ部品１０Ａの端子電極４及び端子部材２０Ｂへ流れる。そして、電流は、チップ部品１０Ｂの端子電極３からチップ部品１０Ｂ内部のコンデンサ部を介してチップ部品１０Ｂの端子電極４及び端子部材２０Ｃへ流れる。あるいは、電流の流れは逆でもよい（端子部材２０Ｃから端子部材２０Ａへの流れ）。このように、チップ部品１０Ａとチップ部品１０Ｂとは、直列に接続されている。 When the current flow is considered, the current flowing from the terminal member 20A flows from the terminal electrode 3 of the chip component 10A to the terminal electrode 4 of the chip component 10A and the terminal member 20B via the capacitor section inside the chip component 10A. Current then flows from the terminal electrode 3 of the chip component 10B to the terminal electrode 4 of the chip component 10B and the terminal member 20C through the capacitor section inside the chip component 10B. Alternatively, the current flow may be reversed (from terminal member 20C to terminal member 20A). Thus, chip component 10A and chip component 10B are connected in series.

次に、本実施形態に係る電子部品１００の作用・効果について説明する。 Next, functions and effects of the electronic component 100 according to this embodiment will be described.

まず、図３（ａ）を参照して、比較例に係る電子部品について説明する。この電子部品は、比較例に係る電子部品の端子部材１２０Ａ，１２０Ｂは、断面Ｌ字状に構成されている。また、端子部材１２０Ａ，１２０Ｂは、素体２の延在方向における端面に対応する箇所にて、端子電極３，４と接続されている。比較例に係る電子部品は、端子部材１２０Ａ，１２０Ｂを介して、回路基板５０に実装される。このような構成では、端子部材１２０Ａ，１２０Ｂは、端面に対向して広がるような板状の形状を有している。従って、回路基板５０にたわみが生じた場合（たわんだ後の回路基板５０の上面を「Ｆ」で示す）、端子部材１２０Ａ，１２０Ｂは、当該たわみに対して変形し易い。従って、端子部材１２０Ａ，１２０Ｂが、端子電極３，４から剥離されるような変形をすることで、端子部材１２０Ａ，１２０Ｂと端子電極３，４との間に応力が加わる。これにより、端子部材１２０Ａ，１２０Ｂと端子電極３，４との間の接続の安定性に影響が及ぼされるという問題が生じる。 First, an electronic component according to a comparative example will be described with reference to FIG. In this electronic component, the terminal members 120A and 120B of the electronic component according to the comparative example are configured to have an L-shaped cross section. The terminal members 120A and 120B are connected to the terminal electrodes 3 and 4 at locations corresponding to the end surfaces of the element body 2 in the extending direction. The electronic component according to the comparative example is mounted on the circuit board 50 via the terminal members 120A, 120B. In such a configuration, the terminal members 120A and 120B have a plate-like shape that extends toward the end faces. Therefore, when the circuit board 50 is flexed (the upper surface of the circuit board 50 after flexing is indicated by "F"), the terminal members 120A and 120B are easily deformed by the flexing. Therefore, stress is applied between the terminal members 120A and 120B and the terminal electrodes 3 and 4 by deforming the terminal members 120A and 120B so as to separate them from the terminal electrodes 3 and 4. FIG. This causes a problem that the stability of connection between the terminal members 120A, 120B and the terminal electrodes 3, 4 is affected.

これに対し、本実施形態に係る電子部品１００では、チップ部品１０Ａ及びチップ部品１０Ｂの素体２は、当該素体２が延びる延在方向の両端側に形成された一対の端面２ａ，２ｂと、一対の端面２ａ，２ｂの間に形成された側面２ｃ，２ｄ，２ｅ，２ｆと、を有する。端子電極３，４は、素体２の端面２ａ，２ｂに形成された本体部３ａ、４ａ、及び本体部３ａ，４ａから側面２ｃ，２ｄ，２ｅ，２ｆへ回り込む回り込み部３ｂ、４ｂを有する。これらの端子電極３，４には、複数の端子部材２０がそれぞれ接続される。ここで、複数の端子部材２０のうちの一の端子部材２０Ｂは、チップ部品１０Ａの端子電極４の回り込み部４ａと、チップ部品１０Ｂの端子電極３の回り込み部３ｂとの間に配置されている。更に、一の端子部材２０Ｂは、チップ部品１０Ａの端子電極４、及びチップ部品１０Ｂの端子電極３のそれぞれの回り込み部４ｂ，３ｂと接続されている。この場合、端子部材２０Ｂは、端子電極４のうちの素体２の側面２ｆ、端子電極３のうちの素体２の側面２ｅに対応する箇所に接続されるため、比較例のように端面２ａ，２ｂに対応する箇所に接続される場合に比して、回路基板５０のたわみによって受ける影響を低減することができる。例えば、図３（ｂ）に示すように、端子部材２０Ａ，２０Ｂはたわみに抗するように板状に広がるため、比較例に比して、端子部材２０Ａ，２０Ｂと端子電極３，４との間の応力を低減できる。また、端子部材２０Ｂは、チップ部品１０Ａの端子電極４及びチップ部品１０Ｂの端子電極３に挟まれるように保持された状態で接続される。この場合、端子電極３，４と端子部材２０Ｂとの間の接続性は、比較例に比して、高くなる。従って、端子部材２０Ｂと端子電極３，４との間の接続の安定性を向上することができる。 On the other hand, in the electronic component 100 according to the present embodiment, the element bodies 2 of the chip parts 10A and 10B have a pair of end surfaces 2a and 2b formed on both end sides in the extension direction of the element body 2. , and side surfaces 2c, 2d, 2e, 2f formed between the pair of end surfaces 2a, 2b. The terminal electrodes 3 and 4 have body portions 3a and 4a formed on the end faces 2a and 2b of the element body 2, and wraparound portions 3b and 4b extending from the body portions 3a and 4a to the side surfaces 2c, 2d, 2e and 2f. A plurality of terminal members 20 are connected to these terminal electrodes 3 and 4, respectively. Here, one terminal member 20B of the plurality of terminal members 20 is arranged between the wrap-around portion 4a of the terminal electrode 4 of the chip component 10A and the wrap-around portion 3b of the terminal electrode 3 of the chip component 10B. . Further, one terminal member 20B is connected to wraparound portions 4b and 3b of the terminal electrode 4 of the chip component 10A and the terminal electrode 3 of the chip component 10B. In this case, the terminal member 20B is connected to a portion of the terminal electrode 4 corresponding to the side surface 2f of the element body 2 and to a portion of the terminal electrode 3 corresponding to the side surface 2e of the element body 2. , 2b, the influence of the bending of the circuit board 50 can be reduced. For example, as shown in FIG. 3(b), the terminal members 20A and 20B spread out in a plate-like shape so as to resist the bending, so that the terminal members 20A and 20B and the terminal electrodes 3 and 4 are more easily separated than in the comparative example. can reduce the stress between Further, the terminal member 20B is connected while being held between the terminal electrode 4 of the chip component 10A and the terminal electrode 3 of the chip component 10B. In this case, the connectivity between the terminal electrodes 3 and 4 and the terminal member 20B is higher than in the comparative example. Therefore, the stability of connection between the terminal member 20B and the terminal electrodes 3 and 4 can be improved.

端子部材２０Ａは、端子電極３のうち、複数の側面２ｆ，２ｄに対応する回り込み部３ｂに接続される。端子部材２０Ｂは、端子電極４のうち、複数の側面２ｆ，２ｃに対応する回り込み部４ａに接続され、端子電極３のうち、複数の側面２ｅ，２ｄに対応する回り込み部３ｂに接続される。端子部材２０Ｃは、端子電極４のうち、複数の側面２ｅ，２ｄに対応する回り込み部４ａに接続される。この場合、端子部材２０Ａ，２０Ｂ，２０Ｃが複数の側面に対して接続されることで、端子部材２０Ａ，２０Ｂ，２０Ｃと端子電極３，４との間の接続の安定性を向上できる。 The terminal member 20A is connected to wraparound portions 3b of the terminal electrode 3 corresponding to the plurality of side surfaces 2f and 2d. The terminal member 20B is connected to the winding portions 4a of the terminal electrode 4 corresponding to the side surfaces 2f and 2c, and is connected to the winding portions 3b of the terminal electrode 3 corresponding to the side surfaces 2e and 2d. The terminal member 20C is connected to wraparound portions 4a of the terminal electrode 4 corresponding to the plurality of side surfaces 2e and 2d. In this case, the terminal members 20A, 20B, 20C are connected to a plurality of side surfaces, so that the stability of connection between the terminal members 20A, 20B, 20C and the terminal electrodes 3, 4 can be improved.

チップ部品１０Ａの端子電極３に接続される端子部材２０Ａ、及びチップ部品１０Ａの位置関係と、チップ部品１０Ｂの端子電極４に接続される端子部材２０Ｃ、及びチップ部品１０Ｂの位置関係は、点対称の関係にある。この場合、チップ部品１０Ａの端子電極４とチップ部品１０Ｂの端子電極３を一の端子部材２０Ｂに接続することが可能となるため、製造が容易となる。 The positional relationship between the terminal member 20A connected to the terminal electrode 3 of the chip component 10A and the chip component 10A and the positional relationship between the terminal member 20C connected to the terminal electrode 4 of the chip component 10B and the chip component 10B are point symmetrical. in a relationship. In this case, the terminal electrode 4 of the chip component 10A and the terminal electrode 3 of the chip component 10B can be connected to one terminal member 20B, which facilitates manufacturing.

例えば、後述の図６に示す電子部品４００は点対称な構造を有しておらず、チップ部品１０Ａ及び端子部材４２０Ａの構造体と、チップ部品１０Ｂ及び端子部材４２０Ｂによる構造体は、部品として見た時に、互いに異なる形状を有している。従って、構造体同士を端子部材２０Ｂで接続する際には、端子部材４２０Ａと端子部材４２０Ｂとを区別して作業を行わなくてはならない。これに対し、電子部品１００が点対称の関係を有している場合、チップ部品１０Ａと端子部材２０Ａによる構造体、及びチップ部品１０Ｂと端子部材２０Ｃによる構造体は、部品としては同じ形状を有することとなる。例えば、図１に示すチップ部品１０Ｂ及び端子部材２０Ｃが中心軸線ＣＬ周りに１８０°回転した場合、チップ部品１０Ａ及び端子部材２０Ａと全く同じ構造となる。従って、一のチップ部品１０に対して一の端子部材２０を接続した構造体を複数作っておけば、いずれの構造体も、チップ部品１０Ａと端子部材２０Ａによる構造体、及びチップ部品１０Ｂと端子部材２０Ｃによる構造体として用いることができる。このように、チップ部品１０Ａと端子部材２０Ａによる構造体、及びチップ部品１０Ｂと端子部材２０Ｃによる構造体を区別する必要がなくなるため、電子部品１００の製造が容易となる。 For example, the electronic component 400 shown in FIG. 6, which will be described later, does not have a point-symmetrical structure, and the structure of the chip component 10A and terminal members 420A and the structure of the chip component 10B and terminal members 420B are regarded as components. have different shapes from each other. Therefore, when connecting the structures with the terminal member 20B, it is necessary to distinguish between the terminal member 420A and the terminal member 420B. On the other hand, when the electronic component 100 has a point-symmetrical relationship, the structure formed by the chip component 10A and the terminal member 20A and the structure formed by the chip component 10B and the terminal member 20C have the same shape as components. It will happen. For example, when the chip component 10B and the terminal member 20C shown in FIG. 1 are rotated by 180° around the central axis CL, they have exactly the same structure as the chip component 10A and the terminal member 20A. Therefore, if a plurality of structures in which one terminal member 20 is connected to one chip component 10 are prepared, any structure can be composed of the chip component 10A and the terminal member 20A, or the chip component 10B and the terminal. It can be used as a structure by the member 20C. In this way, the electronic component 100 can be manufactured easily because there is no need to distinguish between the structure composed of the chip component 10A and the terminal member 20A and the structure composed of the chip component 10B and the terminal member 20C.

端子部材２０Ａ，２０Ｂ，２０Ｃは、側面のうち、回路基板５０に対する実装面に対応する側面２ｄの回り込み部３ｂ，４ｂと接続される。この場合、端子部材２０Ａ，２０Ｂ，２０Ｃは、実装面側でチップ部品１０Ａ，１０Ｂを保持することができる。従って、端子部材２０Ａ，２０Ｂ，２０Ｃは、チップ部品１０Ａ，１０Ｂが回路基板５０に脱落することを抑制できる。 The terminal members 20A, 20B, 20C are connected to the winding portions 3b, 4b of the side surface 2d corresponding to the mounting surface for the circuit board 50 among the side surfaces. In this case, the terminal members 20A, 20B, 20C can hold the chip components 10A, 10B on the mounting surface side. Therefore, the terminal members 20A, 20B, and 20C can prevent the chip components 10A and 10B from dropping onto the circuit board 50. FIG.

チップ部品１０Ａとチップ部品１０Ｂとは、直列に接続されている。このように、端子部材２０Ｂを用いて複数のチップ部品１０Ａ，１０Ｂを直列に接続することができる。 Chip component 10A and chip component 10B are connected in series. Thus, a plurality of chip components 10A and 10B can be connected in series using the terminal member 20B.

端子部材２０Ａ，２０Ｂ，２０Ｃは、回路基板５０に実装される実装部２４を有し、実装部２４の接合部２４ａは、延在方向に対する垂直方向（ここではＹ軸方向）に延びている。例えば、図３（ａ）の比較例のように、実装部１２４が延在方向に延びる場合、当該実装部１２４は、回路基板５０のたわみに伴って変形し易くなる。この場合、実装部１２４は、回路基板５０のたわみに起因する応力を回避することができるが、その分、応力の影響が端子部材１２０Ａ，１２０Ｂと端子電極３，４との接続部分に及ぼされてしまう可能性がある。これに対し、本実施形態のように、実装部２４の接合部２４ａが延在方向に対する垂直方向に延びている場合、実装部２４自体が回路基板５０のたわみに起因する応力を受け持つ分、端子部材２０Ａ，２０Ｂと端子電極３，４との接続部分に対する応力を低減できる。 The terminal members 20A, 20B, and 20C have mounting portions 24 mounted on the circuit board 50, and the joint portions 24a of the mounting portions 24 extend in the direction perpendicular to the extension direction (here, the Y-axis direction). For example, when the mounting portion 124 extends in the extending direction as in the comparative example of FIG. In this case, the mounting portion 124 can avoid the stress caused by the bending of the circuit board 50, but the stress affects the connection portions between the terminal members 120A and 120B and the terminal electrodes 3 and 4. There is a possibility that On the other hand, when the joint portion 24a of the mounting portion 24 extends in the direction perpendicular to the extending direction as in the present embodiment, the mounting portion 24 itself bears the stress caused by the bending of the circuit board 50, and the terminal It is possible to reduce the stress applied to the connecting portions between the members 20A and 20B and the terminal electrodes 3 and 4.

以上、本発明の実施形態について説明してきたが、本発明は必ずしも上述した実施形態に限定されるものではなく、その要旨を逸脱しない範囲で様々な変更が可能である。 Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

電子部品が有するチップ部品の数は限定されず、３つ以上であってもよい。例えば、図４に示すように、電子部品２００は、四つのチップ部品１０Ａ，１０Ｂ，１０Ｃ，１０Ｄを有してよい。この場合、電子部品２００は、端子部材２０Ａ，２０Ｂ，２０Ｃ，２０Ｄ，２０Ｅを備える。端子部材２０Ａは、チップ部品１０Ａの端子電極３に接続される。端子部材２０Ｂは、チップ部品１０Ａの端子電極４及びチップ部品１０Ｂの端子電極３に挟まれるように接続される。端子部材２０Ｃは、チップ部品１０Ｂの端子電極４及びチップ部品１０Ｃの端子電極３に挟まれるように接続される。端子部材２０Ｄは、チップ部品１０Ｃの端子電極４及びチップ部品１０Ｄの端子電極３に挟まれるように接続される。端子部材２０Ｅは、チップ部品１０Ｄの端子電極４に接続される。端子部材２０Ａ，２０Ｂは、図１の端子部材２０Ａ，２０Ｂと同様な方向を向く姿勢となっている。端子部材２０Ｃは、端子部材２０Ａと同じ方向を向く姿勢となっている。端子部材２０Ｄ，２０Ｅは、端子部材２０Ｂと同じ方向を向く姿勢となっている。チップ部品１０Ａ及び端子部材２０Ａの構造体と、チップ部品１０Ｄ及び端子部材２０Ｅの構造体とは、中心軸線ＣＬを基準として、点対称な構成を有している。 The number of chip components that the electronic component has is not limited, and may be three or more. For example, as shown in FIG. 4, electronic component 200 may have four chip components 10A, 10B, 10C, and 10D. In this case, electronic component 200 includes terminal members 20A, 20B, 20C, 20D, and 20E. The terminal member 20A is connected to the terminal electrode 3 of the chip component 10A. The terminal member 20B is connected so as to be sandwiched between the terminal electrode 4 of the chip component 10A and the terminal electrode 3 of the chip component 10B. The terminal member 20C is connected so as to be sandwiched between the terminal electrode 4 of the chip component 10B and the terminal electrode 3 of the chip component 10C. The terminal member 20D is connected so as to be sandwiched between the terminal electrode 4 of the chip component 10C and the terminal electrode 3 of the chip component 10D. The terminal member 20E is connected to the terminal electrode 4 of the chip component 10D. The terminal members 20A and 20B are oriented in the same direction as the terminal members 20A and 20B in FIG. The terminal member 20C is oriented in the same direction as the terminal member 20A. The terminal members 20D and 20E are oriented in the same direction as the terminal member 20B. The structure of the chip component 10A and the terminal member 20A and the structure of the chip component 10D and the terminal member 20E have point-symmetrical configurations with respect to the central axis CL.

また、複数のチップ部品は、必ずしも直列に接続されていなくともよい。例えば、図５に示す電子部品３００は、チップ部品１０Ａとチップ部品１０Ｂとが並列に接続されている。端子部材２０Ａは、チップ部品１０Ａの端子電極３とチップ部品１０Ｂの端子電極３とに挟まれるように接続される。端子部材２０Ｂは、チップ部品１０Ａの端子電極４とチップ部品１０Ｂの端子電極４とに挟まれるように接続される。 Also, the plurality of chip components may not necessarily be connected in series. For example, in an electronic component 300 shown in FIG. 5, a chip component 10A and a chip component 10B are connected in parallel. The terminal member 20A is connected so as to be sandwiched between the terminal electrode 3 of the chip component 10A and the terminal electrode 3 of the chip component 10B. The terminal member 20B is connected so as to be sandwiched between the terminal electrode 4 of the chip component 10A and the terminal electrode 4 of the chip component 10B.

また、端子部材の形状は、上述の実施形態に限定されるものではない。例えば、図６に示す電子部品４００のような端子部材４２０Ａ，４２０Ｂが採用されてもよい。電子部品４００は、図１に示す電子部品１００の端子部材２０Ａ，２０Ｃに代えて、端子部材４２０Ａ，４２０Ｂを用い、端子部材２０Ｂはそのまま用いている。端子部材４２０Ａ，４２０Ｂは、接続部４２１，４２２，４２３と、足部４２４ｂ及び接合部４２４ａを有する実装部４２４と、を有する。端子部材４２０Ａ，４２０Ｂは、接続部４２１が接続部４２３と同方向に延びている点において、端子部材２０Ａ，２０Ｃと相違している。また、端子部材４２０Ｂは、端子部材４２０Ａと同方向を向いた姿勢にて、チップ部品１０Ｂの端子電極４と接続される。なお、端子部材２０Ｂは、図１に示すものとは逆向きである。このような電子部品４００は、端子部材４２０Ａ，４２０Ｂの接続部４２０が宙に浮いた状態となることを防止できる。 Also, the shape of the terminal member is not limited to the above embodiment. For example, terminal members 420A and 420B like electronic component 400 shown in FIG. 6 may be employed. In electronic component 400, terminal members 420A and 420B are used instead of terminal members 20A and 20C of electronic component 100 shown in FIG. 1, and terminal member 20B is used as it is. The terminal members 420A, 420B have connection portions 421, 422, 423, and a mounting portion 424 having a leg portion 424b and a joint portion 424a. The terminal members 420A and 420B differ from the terminal members 20A and 20C in that the connecting portion 421 extends in the same direction as the connecting portion 423. As shown in FIG. Also, the terminal member 420B is connected to the terminal electrode 4 of the chip component 10B in a posture facing the same direction as the terminal member 420A. Note that the terminal member 20B is oriented in the opposite direction to that shown in FIG. Such an electronic component 400 can prevent the connecting portions 420 of the terminal members 420A and 420B from floating in the air.

また、三つ以上のチップ部品を接続する構成において、端子部材４２０Ａ，４２０Ｂが用いられてもよい。図７に示す電子部品５００は、四つのチップ部品１０Ａ，１０Ｂ，１０Ｃ，１０Ｄと、五つの端子部材４２０Ａ，２０Ｂ，２０Ｃ，２０Ｄ，４２０Ｂと、を備える。端子部材４２０Ａは、チップ部品１０Ａの端子電極３に接続される。端子部材２０Ｂは、チップ部品１０Ａの端子電極４及びチップ部品１０Ｂの端子電極３に挟まれるように接続される。端子部材２０Ｃは、チップ部品１０Ｂの端子電極４及びチップ部品１０Ｃの端子電極３に挟まれるように接続される。端子部材２０Ｄは、チップ部品１０Ｃの端子電極４及びチップ部品１０Ｄの端子電極３に挟まれるように接続される。端子部材４２０Ｂは、チップ部品１０Ｄの端子電極４に接続される。端子部材４２０Ａは、図６の端子部材４２０Ａとは逆向きの姿勢となっている。端子部材４２０Ｂは、図６の端子部材４２０Ｂと同様な方向を向く姿勢となっている。端子部材２０Ｂは、図６の端子部材２０Ｂと同様な方向を向く姿勢となっている。端子部材２０Ｃは、端子部材２０Ｂと逆向きの姿勢となっている。端子部材２０Ｄは、端子部材２０Ｂと同じ方向を向く姿勢となっている。 Moreover, the terminal members 420A and 420B may be used in a configuration in which three or more chip components are connected. The electronic component 500 shown in FIG. 7 includes four chip components 10A, 10B, 10C and 10D and five terminal members 420A, 20B, 20C, 20D and 420B. The terminal member 420A is connected to the terminal electrode 3 of the chip component 10A. The terminal member 20B is connected so as to be sandwiched between the terminal electrode 4 of the chip component 10A and the terminal electrode 3 of the chip component 10B. The terminal member 20C is connected so as to be sandwiched between the terminal electrode 4 of the chip component 10B and the terminal electrode 3 of the chip component 10C. The terminal member 20D is connected so as to be sandwiched between the terminal electrode 4 of the chip component 10C and the terminal electrode 3 of the chip component 10D. The terminal member 420B is connected to the terminal electrode 4 of the chip component 10D. The terminal member 420A has a posture opposite to that of the terminal member 420A in FIG. The terminal member 420B is oriented in the same direction as the terminal member 420B in FIG. The terminal member 20B is oriented in the same direction as the terminal member 20B in FIG. The terminal member 20C has a posture opposite to that of the terminal member 20B. The terminal member 20D is oriented in the same direction as the terminal member 20B.

また、端子部材は、必ずしも複数の側面で接続される構造でなくともよく、一つの側面のみで接続される構造であってもよい。また、実装部は、素体の延在方向に延びるような形状であってもよい。 Moreover, the terminal member does not necessarily have to be connected on a plurality of side surfaces, and may be connected on only one side surface. Further, the mounting portion may have a shape extending in the extension direction of the base body.

素体２の形状は、互いに対向する一対の主面、及び主面間に延びる側面を有していればよく、直方体形状に限定されない。 The shape of the element body 2 is not limited to a rectangular parallelepiped shape as long as it has a pair of main surfaces facing each other and side surfaces extending between the main surfaces.

２…素体、２ａ，２ｂ…端面、２ｃ，２ｄ，２ｅ，２ｆ…側面、３，４…端子電極、３ａ，４ａ…本体部、３ｂ，４ｂ…回り込み部、１０Ａ，１０Ｂ，１０Ｃ，１０Ｄ…チップ部品、２０Ａ，２０Ｂ，２０Ｃ，２０Ｄ，２０Ｅ，４２０Ａ，４２０Ｂ…端子部材、２４，４２４…実装部、５０…回路基板。 2 Element body 2a, 2b End surface 2c, 2d, 2e, 2f Side surface 3, 4 Terminal electrode 3a, 4a Body portion 3b, 4b Wrapping portion 10A, 10B, 10C, 10D Chip parts 20A, 20B, 20C, 20D, 20E, 420A, 420B... Terminal members 24, 424... Mounting part 50... Circuit board.

Claims (7)

素体及び端子電極を備える第１のチップ部品及び第２のチップ部品と、
前記第１のチップ部品及び前記第２のチップ部品のそれぞれの前記端子電極に接続される複数の端子部材と、を備える電子部品であって、
前記素体は、当該素体が延びる延在方向の両端側に形成された一対の端面と、一対の前記端面の間に形成された側面と、を有し、
前記端子電極は、前記素体の前記端面に形成された本体部、及び前記本体部から前記側面へ回り込む回り込み部を有し、
複数の前記端子部材のうちの一の端子部材は、前記第１のチップ部品の前記端子電極の前記回り込み部と、前記第２のチップ部品の前記端子電極の前記回り込み部との間に配置され、それぞれの前記回り込み部と接続されており、
前記側面のうち、回路基板に対する実装面に対応する側面と平行であって、前記延在方向と垂直な方向を第１の方向とした場合、前記第１のチップ部品と前記第２のチップ部品とは前記第１の方向に互いに隣り合い、
前記端子部材は、前記第１の方向及び前記延在方向と直交する第２の方向に延びる第１の接続部を有し、
前記第１の接続部は、前記第１のチップ部品及び前記第２のチップ部品における前記側面前記実装面と垂直な前記側面の前記回り込み部の間に配置される、電子部品。 a first chip component and a second chip component having an element body and terminal electrodes;
and a plurality of terminal members connected to the terminal electrodes of the first chip component and the second chip component,
The element has a pair of end faces formed on both end sides in the extension direction of the element and a side surface formed between the pair of end faces,
the terminal electrode has a body portion formed on the end face of the element body and a wrapping portion extending from the body portion to the side surface;
One of the plurality of terminal members is arranged between the wrap-around portion of the terminal electrode of the first chip component and the wrap-around portion of the terminal electrode of the second chip component. , are connected to the respective wraparound portions ,
When a direction parallel to the side surface corresponding to the mounting surface of the circuit board and perpendicular to the extending direction is defined as a first direction, the first chip component and the second chip component are adjacent to each other in the first direction,
The terminal member has a first connecting portion extending in a second direction orthogonal to the first direction and the extending direction,
The electronic component , wherein the first connecting portion is arranged between the winding portions of the side surfaces of the first chip component and the second chip component that are perpendicular to the side mounting surfaces . 前記端子部材は、前記端子電極のうち、複数の前記側面に対応する前記回り込み部に接続されている、請求項１に記載の電子部品。 2. The electronic component according to claim 1, wherein said terminal member is connected to said winding portions corresponding to a plurality of said side surfaces of said terminal electrodes. 前記端子部材は、 The terminal member is
前記第１の接続部から前記第１の方向における一方側に延びて、前記第１のチップ部品の前記第１の方向に平行な前記側面に対応する前記回り込み部に接続される第２の接続部と、 A second connection extending from the first connection portion to one side in the first direction and connected to the winding portion corresponding to the side surface of the first chip component parallel to the first direction. Department and
前記第１の接続部から前記第１の方向における他方側に延びて、前記第２のチップ部品の前記第１の方向に平行な前記側面に対応する前記回り込み部に接続される第３の接続部と、を更に有する、請求項１又は２に記載の電子部品。 A third connection extending from the first connection portion to the other side in the first direction and connected to the winding portion corresponding to the side surface of the second chip component parallel to the first direction. 3. The electronic component according to claim 1, further comprising: 素体及び端子電極を備える第１のチップ部品及び第２のチップ部品と、
前記第１のチップ部品及び前記第２のチップ部品のそれぞれの前記端子電極に接続される複数の端子部材と、を備える電子部品であって、
前記素体は、当該素体が延びる延在方向の両端側に形成された一対の端面と、一対の前記端面の間に形成された側面と、を有し、
前記端子電極は、前記素体の前記端面に形成された本体部、及び前記本体部から前記側面へ回り込む回り込み部を有し、
複数の前記端子部材のうちの一の端子部材は、前記第１のチップ部品の前記端子電極の前記回り込み部と、前記第２のチップ部品の前記端子電極の前記回り込み部との間に配置され、それぞれの前記回り込み部と接続されており、
前記第１のチップ部品の前記端子電極に接続される前記端子部材、及び前記第１のチップ部品の位置関係と、前記第２のチップ部品の前記端子電極に接続される前記端子部材、及び前記第２のチップ部品の位置関係は、点対称の関係にある電子部品。 a first chip component and a second chip component having an element body and terminal electrodes;
and a plurality of terminal members connected to the terminal electrodes of the first chip component and the second chip component,
The element has a pair of end faces formed on both end sides in the extension direction of the element and a side surface formed between the pair of end faces,
the terminal electrode has a body portion formed on the end face of the element body and a wrapping portion extending from the body portion to the side surface;
One terminal member among the plurality of terminal members is arranged between the wraparound portion of the terminal electrode of the first chip component and the wraparound portion of the terminal electrode of the second chip component. , are connected to the respective wraparound portions,
positional relationship between the terminal member connected to the terminal electrode of the first chip component and the first chip component; the terminal member connected to the terminal electrode of the second chip component; The positional relationship of the second chip component is an electronic component having a point-symmetrical relationship. 前記端子部材は、前記側面のうち、回路基板に対する実装面に対応する側面の前記回り込み部と接続される、請求項１～４の何れか一項に記載の電子部品。 The electronic component according to any one of claims 1 to 4 , wherein the terminal member is connected to the winding portion of the side surface corresponding to the mounting surface for the circuit board among the side surfaces. 素体及び端子電極を備える第１のチップ部品及び第２のチップ部品と、
前記第１のチップ部品及び前記第２のチップ部品のそれぞれの前記端子電極に接続される複数の端子部材と、を備える電子部品であって、
前記素体は、当該素体が延びる延在方向の両端側に形成された一対の端面と、一対の前記端面の間に形成された側面と、を有し、
前記端子電極は、前記素体の前記端面に形成された本体部、及び前記本体部から前記側面へ回り込む回り込み部を有し、
複数の前記端子部材のうちの一の端子部材は、前記第１のチップ部品の前記端子電極の前記回り込み部と、前記第２のチップ部品の前記端子電極の前記回り込み部との間に配置され、それぞれの前記回り込み部と接続されており、
前記第１のチップ部品と前記第２のチップ部品とは、直列に接続されている電子部品。 a first chip component and a second chip component having an element body and terminal electrodes;
and a plurality of terminal members connected to the terminal electrodes of the first chip component and the second chip component,
The element has a pair of end faces formed on both end sides in the extension direction of the element and a side surface formed between the pair of end faces,
the terminal electrode has a body portion formed on the end face of the element body and a wrapping portion extending from the body portion to the side surface;
One of the plurality of terminal members is arranged between the wrap-around portion of the terminal electrode of the first chip component and the wrap-around portion of the terminal electrode of the second chip component. , are connected to the respective wraparound portions,
The first chip component and the second chip component are electronic components connected in series. 前記端子部材は、回路基板に実装される実装部を有し、
前記実装部は、前記延在方向に対する垂直方向に延びている、請求項１～６の何れか一項に記載の電子部品。
The terminal member has a mounting portion mounted on a circuit board,
The electronic component according to any one of claims 1 to 6 , wherein said mounting portion extends in a direction perpendicular to said extending direction.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185446A (en) 1999-12-24 2001-07-06 Tokin Corp Laminated ceramic capacitor
JP2004335963A (en) 2003-05-12 2004-11-25 Tdk Corp Ceramic capacitor
JP2016139787A (en) 2015-01-27 2016-08-04 サムソン エレクトロ−メカニックス カンパニーリミテッド． Surface mounting electronic component and mounting board of electronic component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6136989A (en) * 1984-07-30 1986-02-21 日本電気株式会社 Block combination type circuit element
JPH0541128U (en) * 1991-11-05 1993-06-01 日本電気株式会社 Surface mount type parallel connection cap

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185446A (en) 1999-12-24 2001-07-06 Tokin Corp Laminated ceramic capacitor
JP2004335963A (en) 2003-05-12 2004-11-25 Tdk Corp Ceramic capacitor
JP2016139787A (en) 2015-01-27 2016-08-04 サムソン エレクトロ−メカニックス カンパニーリミテッド． Surface mounting electronic component and mounting board of electronic component

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