JP7266400B2 - Cooling system, its control method, control program, and waste heat utilization system - Google Patents

Description

The present disclosure relates to a cooling system and its control method and control program.

2. Description of the Related Art Conventionally, in cooling electronic devices and the like, for example, a cooling system is used in which a refrigerant circulation system is provided and heat generated in a heat generating portion of the electronic device or the like is released to the atmosphere or the like.

For example, Patent Literature 1 describes a cooling system that uses liquid to cool power semiconductors.

JP-A-2013-84648

By the way, since the heat generated by an electronic device is proportional to the square of the value of the passing current, the amount of heat generated tends to fluctuate greatly depending on the operating conditions, ie, the amount of current applied, and the response time tends to be short. On the other hand, for example, a refrigerating cycle such as a chiller has a longer response time to temporal fluctuations in cooling capacity than an electronic device, and it is difficult to adjust the load according to fluctuations in the amount of heat generated by the electronic device. For this reason, the chiller must be operated continuously at a constant load, which poses a problem of large energy loss.
In this respect, the cooling system disclosed in Patent Document 1 does not disclose any specific configuration for solving the above problems.

In view of the problems described above, at least one embodiment of the present disclosure aims to provide a cooling system capable of suppressing energy loss.

(1) A cooling system according to at least one embodiment of the present disclosure,
A cooling system for cooling an electronic device, comprising:
a tank that stores a refrigerant;
a first cooling line capable of circulating the coolant between the tank and the electronic device;
a second cooling line for cooling the refrigerant, which is provided in a system separate from the first cooling line from the tank;
a first pump capable of adjusting the flow rate of the refrigerant in the first cooling line;
a flow controller capable of adjusting the flow rate of the refrigerant in the second cooling line;
It has

According to the configuration (1) above, the first cooling line that circulates the coolant to cool the electronic device and the second cooling line that cools the coolant are provided in separate systems via the tank. Each cooling line can independently regulate the refrigerant flow rate by the first pump on the first cooling line and the flow regulator on the second cooling line. Therefore, the cooling system can be operated by making the refrigerant flow rate of the first cooling line and its adjustment timing different from the refrigerant flow rate of the second cooling line and its adjustment timing. As a result, for example, the operating load of the second cooling line for the refrigerant with a slow response time can be adjusted according to the long-period fluctuation component of the electronic device with a fast fluctuation period. As a result, it is possible to reduce running costs and save energy, and to provide a cooling system capable of suppressing energy loss.

(2) In some embodiments, in the configuration described in (1) above,
the cooling system comprises a controller connected to the first pump;
The controller may be configured to drive the first pump so as to adjust the flow rate of coolant flowing through the first cooling line according to the amount of heat generated by the electronic device.

With configuration (2) above, the controller adjusts the flow rate of the coolant in the first cooling line according to the amount of heat generated by the electronic device. Therefore, for example, depending on the driving state of the electronic device, the first pump can be quickly driven with high output at the timing when the electronic device generates a large amount of heat, and the electronic device can be cooled appropriately. In this way, the response speed of adjusting the coolant flow rate of the first cooling line can be appropriately controlled in accordance with the driving conditions of the electronic device.

(3) In some embodiments, in the configuration described in (2) above,
The controller may be configured to drive the first pump to adjust the flow rate of the coolant flowing through the first cooling line based on the amount of power supplied to the electronic device.

With configuration (3) above, the controller adjusts the flow rate of the coolant in the first cooling line based on the amount of power supplied to the electronic device. Since the amount of heat generated by an electronic device is proportional to the square of the value of the current passing through the electronic device, the amount of heat generated by the electronic device can be matched to the amount of heat generated by the electronic device by adjusting the coolant flow rate based on the amount of current flowing through the electronic device. can be properly cooled. Further, by controlling the flow rate based on the amount of electricity, it is possible to adjust the flow rate more quickly without delaying the heat generation timing of the electronic device.

(4) In some embodiments, in the configuration described in (2) or (3) above,
The cooling system includes a first temperature sensor capable of detecting the amount of heat generated by the electronic device,
The controller may be configured to drive the first pump to adjust the flow rate of the coolant flowing through the first cooling line based on the detection signal from the first temperature sensor.

With configuration (4) above, the controller can adjust the coolant flow rate in the first cooling line according to the amount of heat generated by the electronic device detected by the first temperature sensor. Therefore, it is possible to perform flow rate control appropriately corresponding to the driving situation of the electronic device.

(5) In some embodiments, in the configuration according to any one of (1) to (4) above,
a cooling system comprising a plurality of said electronic devices;
the first cooling line includes a plurality of sub-passages that are parallel to each other and each can individually cool a plurality of the electronic devices;
The first pump may be arranged in each of the sub-paths so as to be able to individually adjust the flow rate of the refrigerant.

According to the configuration (5) above, the first cooling line includes a plurality of parallel sub-paths, and the first pump and the electronic device are arranged in each sub-path. That is, each electronic device has different operating conditions depending on the processing operation required for each at a certain timing, and thus the amount of heat generated is also different. can appropriately adjust the flow rate of the refrigerant flowing through the sub-path corresponding to .

(6) In some embodiments, in the configuration described in any one of (1) to (5) above,
The second cooling line is
a primary circulation line for returning the refrigerant from the tank to the tank;
a second pump as the flow controller arranged in the primary circulation line;
a first heat exchanger through which the primary circulation line passes;
a secondary circulation line for cooling the refrigerant in the primary circulation line via the first heat exchanger;
and a second heat exchanger for cooling the refrigerant in the secondary circulation line.

According to the configuration (6) above, the refrigerant flowing from the tank into the primary circulation line of the second cooling line is cooled by the refrigerant flowing through the secondary circulation line via the first heat exchanger. Then, the refrigerant in the secondary circulation line is cooled by the second heat exchanger. With such a configuration, a large amount of heat can be transferred between the second cooling line and the refrigerant until the refrigerant is returned to the tank, so a cooling system with high cooling efficiency can be realized.

(7) In some embodiments, in the configuration described in any one of (1) to (6) above,
The second cooling line is
a first heat exchanger disposed within the tank;
and a second heat exchanger for cooling the refrigerant from the tank.

According to the configuration of (7) above, the first heat exchanger and the tank can be configured integrally by arranging the first heat exchanger in the tank. Therefore, a compact cooling system can be realized by downsizing the second cooling line.

(8) In some embodiments, in the configuration described in any one of (1) to (7) above,
A non-condensable gas may be sealed in the tank.

According to the above configuration (8), since the non-condensable gas is sealed in the tank, the tank can have the function of buffering the pressure of the refrigerant in the cooling system. This non-condensable gas causes the tank to act like a buffer or accumulator for pressure fluctuations in the refrigerant. As a result, for example, even if the refrigerant boils in the first cooling line due to the heat generation of the electronic device, it is possible to effectively prevent large pressure fluctuations in the piping system of the first cooling line. can be done.

(9) In some embodiments, in the configuration according to any one of (1) to (8) above,
the cooling system includes a second temperature sensor capable of detecting the temperature of the refrigerant in the tank;
The controller may be configured to drive the flow controller to adjust the flow rate of the coolant flowing through the second cooling line based on the detection signal from the second temperature sensor.

With configuration (9) above, the controller can adjust the flow rate of refrigerant in the second cooling line according to the temperature of the refrigerant in the tank detected by the second temperature sensor. Therefore, it is possible to perform flow rate control appropriately corresponding to the temperature of the coolant in the tank and the amount of heat generated by the electronic device, that is, the driving state of the electronic device.

(10) In some embodiments, in the configurations described in (1) to (9) above,
It further comprises pressure adjusting means for adjusting the pressure of the coolant inside the cooling section for cooling the electronic device, which is provided in the first cooling line.

When the electronic device is a power device, the large amount of energy loss that occurs in the power device (power control device) raises the temperature of the power device and causes equipment failure. It is cooled by a coolant such as water) or gas (eg air). For example, when a liquid such as water is used as a coolant to cool a power device, if air bubbles are generated inside the cooling unit that cools the power device, uneven flow distribution will occur in the cooling unit that directly cools the electronic device. , the electronic device may not be properly cooled.

With configuration (10) above, the pressure regulating means increases the pressure of the refrigerant inside the cooling section. As a result, the boiling point of the coolant can be made higher, and the generation of air bubbles inside the cooling section can be suppressed. Therefore, the flow of the coolant in the cooling section can be made uniform, and electronic devices such as power devices can be cooled more appropriately.

(11) In some embodiments, in the configuration described in (10) above,
The pressure adjusting means is a first adjusting means provided between the downstream side of the electronic device and the tank in the first cooling line and capable of making the pressure on the upstream side higher than the pressure on the downstream side. including.

According to the configuration (11) above, the pressure on the side of the first cooling line where the electronic device exists is adjusted by the first adjusting means provided between the downstream side of the electronic device and the tank in the first cooling line. can be enhanced. Therefore, the pressure of the refrigerant inside the cooling section can be increased.

(12) In some embodiments, in the configuration described in (11) above,
The first adjusting means is a control valve.

According to the configuration (12) above, by adjusting the valve opening of the control valve, the pressure on the upstream side of the control valve in the first cooling line can be adjusted, and the pressure of the refrigerant inside the cooling unit can be adjusted. can be adjusted.

(13) In some embodiments, in the configuration described in (11) to (12) above,
The pressure adjusting means is a second adjusting means provided between the upstream side of the electronic device and the tank in the first cooling line and capable of making the pressure on the downstream side higher than the pressure on the upstream side. further including
The pressure regulating means are adapted to regulate the pressure between the first regulating means and the second regulating means in the first cooling line.

According to the configuration (13) above, the pressure on the upstream side of the control valve in the first cooling line is made higher than that on the downstream side by the first adjustment means, and then the adjustment means (for example, the above-mentioned first 1 pump, etc.), the pressure of the refrigerant inside the cooling unit can be adjusted.

(14) In some embodiments, in the configuration described in (11) to (13) above,
further comprising a second controller connected to the pressure regulating means;
The second controller is
a pressure acquisition unit that acquires a measured value of the pressure of the refrigerant inside the cooling unit;
and a control unit that controls the pressure adjusting means so that the measured value becomes equal to or greater than a specified value.

With configuration (14) above, the pressure adjusting means is automatically controlled based on the measured value of the pressure of the refrigerant inside the cooling unit and the prescribed value (threshold value). Accordingly, by appropriately increasing the pressure of the refrigerant inside the cooling unit, it is possible to suppress the generation of air bubbles inside the cooling unit.

(15) In some embodiments, in the configuration described in (14) above,
The pressure acquisition unit is connected to a pressure gauge installed between the upstream side of the electronic device and the first adjustment means in the first cooling line.

According to the configuration (15) above, the second controller adjusts the pressure based on the pressure measured by the pressure gauge installed between the upstream side of the electronic device in the first cooling line and the first adjusting means. Control means. This makes it possible to easily obtain the pressure of the refrigerant inside the cooling unit.

(16) In some embodiments, in the configuration described in (10) to (15) above,
A gas-liquid separator for separating a gas phase and a liquid phase of the refrigerant flowing downstream of the electronic device in the first cooling line is further provided.

For example, at present, in factories with steam boilers and ships with large engines, waste heat from the boilers and engines is used to generate low-temperature, low-pressure steam, which is used for heating and humidification. In the future, as the spread of renewable energy progresses along with the global demand for _CO2 reduction, and the main energy source changes from fossil fuels to electric power (an electrified society), waste heat from boilers and engines as described above will disappear. When steam is generated using a dedicated device, the cost and energy are required accordingly.

According to configuration (16) above, steam is generated using waste heat from an electronic device such as a power device as a heat source. As a result, steam can be generated without, for example, providing a dedicated device for generating steam or impairing the cooling performance of the cooling system. Therefore, steam can be efficiently generated even in an electrified society.

(17) A cooling system control method according to at least one embodiment of the present disclosure includes:
A method of controlling a cooling system for cooling an electronic device, comprising:
adjusting the flow rate of coolant flowing through a first cooling line through which the coolant can be circulated between a tank storing the coolant and the electronic device, according to the amount of heat generated by the electronic device;
A second cooling line provided in a system separate from the first cooling line from the tank, the flow rate of the refrigerant flowing through the second cooling line for cooling the refrigerant, the temperature of the refrigerant in the tank and adjusting according to.

According to the method (17), as described in (1) above, the first cooling line for circulating the coolant to cool the electronic device and the second cooling line for cooling the coolant are connected to the tank. provided in a separate system via Since the refrigerant flow rate of each cooling line can be adjusted independently, the cooling system can be operated by making the refrigerant flow rate of the first cooling line and its adjustment timing different from the refrigerant flow rate of the second cooling line and its adjustment timing. can be operated. As a result, for example, the operating load of the second cooling line for the refrigerant with a slow response time can be adjusted according to the long-period fluctuation component of the electronic device with a fast fluctuation period, thereby reducing running costs and saving energy. It is possible to provide a cooling system capable of suppressing energy loss.

(18) A control program for a cooling system according to at least one embodiment of the present disclosure,
A control program for a cooling system for cooling an electronic device,
adjusting the flow rate of coolant flowing through a first cooling line through which the coolant can be circulated between a tank storing the coolant and the electronic device, according to the amount of heat generated by the electronic device;
A second cooling line provided in a system separate from the first cooling line from the tank, the flow rate of the refrigerant flowing through the second cooling line for cooling the refrigerant, the temperature of the refrigerant in the tank and adjusting according to.

According to the configuration (18) above, as described in (1) and (17) above, the first cooling line that circulates the coolant to cool the electronic device and the second cooling line that cools the coolant is provided in a separate system via a tank. Since each cooling line can independently adjust the refrigerant flow rate, the cooling system can be operated by making the refrigerant flow rate of the first cooling line and its adjustment timing different from the refrigerant flow rate of the second cooling line and its adjustment timing. can be operated. As a result, for example, the operating load of the second cooling line for the refrigerant with a slow response time can be adjusted according to the long-period fluctuation component of the electronic device with a fast fluctuation period, thereby reducing running costs and saving energy. It is possible to provide a cooling system capable of suppressing energy loss.

(19) A cooling system according to at least one embodiment of the present disclosure,
A cooling system for cooling an electronic device, comprising:
a tank that stores a refrigerant;
a first cooling line capable of circulating the coolant between the tank and the electronic device;
pressure adjusting means for adjusting the pressure of the coolant inside the cooling section for cooling the electronic device, provided in the first cooling line.
According to the configuration of (19) above, the same effect as that of (10) above is achieved.

(20) A cooling system control method according to at least one embodiment of the present disclosure includes:
A method of controlling a cooling system for cooling an electronic device, comprising:
Obtaining a measurement value of the pressure of the coolant inside a cooling unit for cooling the electronic device provided in a first cooling line capable of circulating the coolant between a tank storing the coolant and the electronic device and
and controlling pressure adjusting means for adjusting the pressure of the refrigerant inside the cooling unit so that the measured value becomes equal to or greater than a specified value.
According to the configuration of (20) above, the same effect as that of (14) above is achieved.

(21) A control program for a cooling system according to at least one embodiment of the present disclosure,
A control program for a cooling system for cooling an electronic device,
to the computer,
Obtaining a measurement value of the pressure of the coolant inside a cooling unit for cooling the electronic device provided in a first cooling line capable of circulating the coolant between a tank storing the coolant and the electronic device and
and a step of controlling pressure adjusting means for adjusting the pressure of the refrigerant inside the cooling unit so that the measured value becomes equal to or greater than a specified value.
According to the configuration of (21) above, the same effect as that of (14) above is achieved.

(22) A waste heat utilization system according to at least one embodiment of the present disclosure,
The cooling system according to (16) above;
and a vapor utilization device to which the vapor phase of the refrigerant separated by the gas-liquid separator provided in the cooling system is supplied.

According to the above configuration (22), steam generated by waste heat of an electronic device such as a power device is configured to be supplied to the steam utilization apparatus. As a result, the waste heat of the electronic device can be appropriately utilized (recovered).

According to at least one embodiment of the present disclosure, it is possible to provide a cooling system capable of suppressing energy loss.

1 is a schematic diagram illustrating a configuration example of a cooling system according to at least one embodiment of the present disclosure; FIG. 2 is a block diagram showing the configuration of a control system in a cooling system according to at least one embodiment of the present disclosure; FIG. FIG. 3 is a schematic diagram showing a configuration example of a cooling system according to another embodiment; FIG. 3 is a schematic diagram showing a configuration example of a cooling system according to another embodiment; FIG. 3 is a schematic diagram showing a configuration example of a cooling system according to another embodiment; FIG. 6 is a schematic view extracting and showing a part of a first cooling line provided in the cooling system of FIG. 5, wherein the first adjusting means of the pressure adjusting means is a valve; FIG. 6 is a schematic view extracting and showing a part of a first cooling line provided in the cooling system of FIG. 5, and the pressure adjusting means are the first adjusting means and the second adjusting means (first pump). FIG. 6 is a schematic view extracting and showing a part of a first cooling line provided in the cooling system of FIG. 5, wherein the first adjusting means of the pressure adjusting means is a control valve; It is an illustration which shows the relationship between the temperature of a refrigerant|coolant, and saturation pressure. [0014] Fig. 4 is a block diagram illustrating the functionality of a second controller in accordance with at least one embodiment of the present disclosure;

Several embodiments of the present disclosure will be described below with reference to the accompanying drawings. However, unless there is a specific description, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the following embodiments are not meant to limit the scope of the present invention, but are merely illustrative examples. It's nothing more than

FIG. 1 is a schematic diagram showing a configuration example of a cooling system according to at least one embodiment of the present disclosure. FIG. 2 is a block diagram showing the configuration of the control system in the cooling system according to at least one embodiment of the present disclosure. FIG. 3 is a schematic diagram showing a configuration example of a cooling system according to another embodiment. FIG. 4 is a schematic diagram showing a configuration example of a cooling system according to another embodiment.

As non-limitingly illustrated in FIG. 1 (as well as in FIGS. 3 to 8 described later), the cooling system 1 according to at least one embodiment of the present disclosure is the cooling system 1 for cooling the electronic device 5. The tank 6 for storing the coolant 60, the first cooling line 40 capable of circulating the coolant 60 between the tank 6 and the electronic device 5, and the first cooling line 40 from the tank 6 are provided in separate systems, A second cooling line 50 for cooling the refrigerant 60, a first pump 7A capable of adjusting the flow rate of the refrigerant 60 in the first cooling line 40, and a flow rate adjustment capable of adjusting the flow rate of the refrigerant 60 in the second cooling line 50 A vessel 8 is provided.
One or more electronic devices 5 may be included, and the first cooling line 40 for cooling the electronic device 5 may be composed of at least one or more circulation paths. The base 5b is a substrate or the like on which the electronic device 5 is installed.
The first cooling line 40 and the second cooling line 50 may be any line that can guide the fluid (for example, liquid or gas) as the refrigerant 60 in an airtight or liquid-tight manner. can be configured.
The flow regulator 8 may, for example, include a second pump 7B.
Various configurations capable of transferring fluid can be applied to the first pump 7A and the second pump 7B.

According to the above configuration, the first cooling line 40 for cooling the electronic device 5 by circulating the coolant 60 and the second cooling line 50 for cooling the coolant 60 are provided in separate systems via the tank 6. . Each cooling line 40 , 50 can independently adjust the flow rate of the refrigerant 60 by the first pump 7A of the first cooling line 40 and the second pump 7B of the second cooling line 50 . Therefore, the cooling system 1 can be operated by making the coolant flow rate of the first cooling line 40 and its adjustment timing different from the coolant flow rate of the second cooling line 50 and its adjustment timing. As a result, for example, the operating load of the second cooling line 50 for the refrigerant 60 with a slow response time can be adjusted according to the long-period fluctuation component of the electronic device 5 with a fast fluctuation period. As a result, it is possible to reduce running costs and save energy, and to provide the cooling system 1 capable of suppressing energy loss.

In some embodiments, the configuration described above may include a controller 10 connected to the first pump 7A and the second pump 7B. The controller 10 may be configured to drive the first pump 7A so as to adjust the flow rate of the coolant 60 flowing through the first cooling line 40 according to the amount of heat generated by the electronic device 5 .

Details of the controller 10 in at least one embodiment of the present disclosure will now be described.
FIG. 2 is a block diagram showing the configuration of the control system in the controller 10 according to some embodiments.
As non-limitingly illustrated in FIG. 2, the controller 10 is, for example, a computer, and includes a CPU 11 and a ROM (Read Only Memory) as a storage unit for storing various programs executed by the CPU 11 and data such as tables. ) 13. In addition to a RAM (Random Access Memory) 12 that functions as a development area and a work area as an operation area when executing each program, a hard disk drive (HDD) as a large-capacity storage device (not shown) and a communication network are connected. A communication interface for doing so, an access unit to which an external storage device is attached, and the like may be provided.

In some embodiments, the controller 10 may include various databases 17, and the databases 17 may store, for example, various tables 18 for adjusting the flow rate of refrigerant. All of these are connected via bus 14 . Further, the controller 10 may be connected to, for example, an input unit (not shown) such as a keyboard and a mouse, and a display unit (not shown) such as a liquid crystal display device for displaying data.

In some embodiments, detection signals regarding the coolant temperature are transmitted to the controller 10 from each of the first temperature sensor 31 provided in the first cooling line 40 and the second temperature sensor 32 provided in the tank 6. may be

In some embodiments, the ROM 13 may store a coolant flow rate management program 15 or the like for the controller 10 to appropriately control the coolant flow rate in any of the embodiments of the present disclosure.

According to the above configuration, the controller 10 adjusts the coolant flow rate in the first cooling line 40 according to the amount of heat generated by the electronic device 5 . Therefore, for example, the first pump 7A can be rapidly driven with high output to appropriately cool the electronic device 5 at the timing when the electronic device 5 generates a large amount of heat, depending on the driving state of the electronic device 5 . In this way, the response speed of adjusting the flow rate of the coolant in the first cooling line 40 can be appropriately controlled according to the driving conditions of the electronic device 5 .

In some embodiments, in the above configuration, the controller 10 is configured to drive the first pump 7A so as to adjust the flow rate of the coolant 60 flowing through the first cooling line 40 based on the amount of power supplied to the electronic device 5. may be

According to the above configuration, the controller 10 adjusts the coolant flow rate in the first cooling line 40 based on the amount of electricity supplied to the electronic device 5 . Since the amount of heat generated by the electronic device 5 is proportional to the square of the value of the electric current passing through the electronic device 5, the amount of heat generated by the electronic device 5 can be The electronic device 5 can be cooled appropriately. Further, by controlling the flow rate based on the amount of power supplied, the flow rate can be adjusted more quickly without delaying the heat generation timing of the electronic device 5 .

In some embodiments, any one of the above configurations includes a first temperature sensor 31 capable of detecting the amount of heat generated by the electronic device 5, and the controller 10, based on the detection signal from the first temperature sensor 31, It may be configured to drive the first pump 7A so as to adjust the flow rate of the coolant 60 flowing through the first cooling line 40 .

According to the above configuration, the controller 10 can adjust the coolant flow rate of the first cooling line 40 according to the amount of heat generated by the electronic device 5 detected by the first temperature sensor 31 . Therefore, it is possible to perform the flow rate control appropriately corresponding to the driving situation of the electronic device 5 .

In some embodiments, in any of the configurations described above, the cooling system 1 may include a plurality of electronic devices 5, and the first cooling lines 40 each individually control the plurality of electronic devices 5. A plurality of sub-paths 42 capable of cooling and parallel to each other may be included, and the first pump 7</b>A may be arranged in each of the sub-paths 42 such that the flow rate of the refrigerant 60 can be individually adjusted.

According to the above configuration, the first cooling line 40 includes a plurality of sub-paths 42 parallel to each other, and the first pump 7A and the electronic device 5 are arranged in each of the sub-paths 42 . That is, each electronic device 5 has a different operating condition depending on the processing operation required for each at a certain timing, and thus the amount of heat generated is also different. Correspondingly, the refrigerant flow rate flowing through the sub-path 42 can be appropriately adjusted.

In some embodiments, in any one of the configurations described above, the second cooling line 50 includes a primary circulation line 51 for returning the refrigerant 60 from the tank 6 to the tank 6 and a The second pump 7B as the arranged flow rate regulator 8, the first heat exchanger 53 through which the primary circulation line 51 passes, and the refrigerant in the primary circulation line 51 is cooled through the first heat exchanger 53. and a second heat exchanger 54 for cooling the refrigerant in the secondary circulation line 52 (see FIGS. 1 and 4).
The first heat exchanger 53 can function as a so-called subcooler, and the second heat exchanger 54 can function as a so-called chiller.

According to the above configuration, the refrigerant 60 flowing from the tank 6 into the primary circulation line 51 of the second cooling line 50 is cooled by the refrigerant 60 flowing through the secondary circulation line 52 via the first heat exchanger 53. . Refrigerant 60 in secondary circulation line 52 is cooled by second heat exchanger 54 . With such a configuration, a large amount of heat can be transferred between the second cooling line 50 and the refrigerant 60 until the refrigerant is returned to the tank 6, so that the cooling system 1 with high cooling efficiency can be realized.

In some embodiments, as non-limitingly illustrated in FIG. 3, in any of the above configurations, the second cooling line 50 comprises a first heat exchanger 53 located within the tank 6; and a second heat exchanger 54 for cooling the refrigerant 60 from the tank 6 .
The second heat exchanger 54 may be a so-called chiller, which circulates the refrigerant in the second cooling line 50 and functions as the flow controller 8 capable of adjusting the flow rate.

According to the above configuration, the first heat exchanger 53 and the tank 6 can be integrated by disposing the first heat exchanger 53 inside the tank 6 . Therefore, the second cooling line 50 can be downsized to realize a compact cooling system 1 .

FIG. 4 is a schematic diagram showing a configuration example of a cooling system 1 according to another embodiment.
As non-limitingly illustrated in FIG. 4, in some embodiments, in any of the configurations described above, the tank 6 may be filled with a non-condensable gas 65 .

In this way, the non-condensable gas 65 is enclosed in the tank 6 , so that the tank 6 in the cooling system 1 can function as a buffer region for the pressure of the refrigerant. That is, the noncondensable gas 65 causes the tank 6 to function as a buffer or accumulator for pressure fluctuations of the refrigerant 60 . As a result, for example, even if the refrigerant 60 boils in the first cooling line 40 due to the heat generation of the electronic device 5, it is possible to effectively prevent large pressure fluctuations in the piping system of the first cooling line 40. can be prevented.

In some embodiments, in any of the configurations described above, the cooling system 1 includes a second temperature sensor 32 (see FIG. 2) capable of detecting the temperature of the refrigerant 60 in the tank 6, and the controller 10 Based on the detection signal from the second temperature sensor 32, the second pump 7B (flow rate regulator 8) may be driven so as to adjust the flow rate of the coolant 60 flowing through the second cooling line 50.

According to the above configuration, the controller 10 can adjust the refrigerant flow rate of the second cooling line 50 according to the refrigerant temperature in the tank 6 detected by the second temperature sensor 32 . Therefore, it is possible to perform flow rate control appropriately corresponding to the temperature of the coolant in the tank 6 and the amount of heat generated by the electronic device 5 , that is, the driving state of the electronic device 5 .
It should be noted that the cooling system 1 according to at least one embodiment of the present disclosure is effective for use in, for example, cooling technology for high-density heating elements (including, for example, power semiconductors (power devices)).

Next, an embodiment related to a waste heat utilization system S that utilizes waste heat generated by an electronic device 5 such as an electronic device 5 such as an improvement in cooling performance by the cooling system 1 as described above and a power device (power control device) will be described with reference to FIG. 10 will be described.
FIG. 5 is a schematic diagram showing a configuration example of a cooling system 1 according to another embodiment. 6 to 8 are schematic diagrams extracting and showing a part of the first cooling line 40 provided in the cooling system 1 of FIG. FIG. 9 is an illustration showing the relationship between the temperature of the refrigerant 60 and the saturation pressure. Also, FIG. 10 is a block diagram illustrating the functionality of the second controller 2 according to at least one embodiment of the present disclosure.

In some embodiments, the cooling system 1 is capable of circulating a coolant 60 between the tank 6 and the electronic device 5, as non-limitingly illustrated in FIGS. To adjust the pressure of the coolant 60 inside the first cooling line 40 and the cooling unit 44 for cooling the electronic device 5 provided in the first cooling line 40 (hereinafter, the internal pressure P of the cooling unit 44) and a pressure adjusting means 9 of .

The cooling part 44 is a part that directly cools the electronic device 5 with the coolant 60 that circulates through the first cooling line 40 , and is provided in the vicinity of the heat generating part of the electronic device 5 . That is, the coolant 60 circulating through the first cooling line 40 exchanges heat with the electronic device 5 via the cooling section 44 . Therefore, the temperature of the coolant 60 on the downstream side of the cooling section 44 in the first cooling line 40 (after passing through the cooling section 44) is higher than on the upstream side of the cooling section 44 (before flowing into the cooling section 44). become.

The cooling unit 44 may be provided inside the electronic device 5, such as by forming a flow path p for the coolant 60 in the electronic device 5 (semiconductor), or may be provided in contact with the outside of the heat generating portion of the electronic device 5. It may be provided outside the electronic device 5, such as. At this time, the cooling part 44 may be subjected to insulation treatment. Specifically, the inner surface or the outer surface of the portion forming the flow path p may be insulated by forming a diamond coating layer, for example. This makes it possible to provide the cooling part 44 in the conducting part of the electronic device 5 .

In the embodiment shown in FIGS. 6-8, the cooling section 44 has a plurality of channels p. The coolant 60 is distributed to the plurality of flow paths p inside the cooling unit 44 or at the inlet thereof, and is joined after passing through the plurality of flow paths p to flow downstream. However, the present invention is not limited to this embodiment, and in some other embodiments, the cooling unit 44 may have one flow path p.

On the other hand, the pressure adjusting means 9 is configured to adjust the internal pressure P of the cooling part 44, so that the heat generated by the electronic device 5 causes the coolant 60 to boil, and the bubbles due to the vaporization of the coolant 60 are cooled. Suppress the occurrence inside the unit 44 . In general, the boiling point of a liquid depends on the pressure, such that the higher the pressure, the higher the boiling point (see FIG. 9). Since the generation of air bubbles in the coolant 60 inside the cooling unit 44 also depends on the pressure of the cooling unit 44, the internal pressure P of the cooling unit 44 is adjusted to be higher than the saturation pressure (see FIG. 9) by the pressure adjusting means 9. By adjusting, it is possible to suppress the generation of air bubbles inside the cooling part 44 .

For example, when the cross-sectional area (hereinafter referred to as the flow area) of the flow path p of the cooling part 44 is extremely small, such as on the order of microns, the coolant 60 in the flow path p is vaporized by heat exchange with the heat generating part of the electronic device 5. Then, the air bubbles generated by the vaporization may stick to the inner wall surface of the flow path p due to surface tension, and may not escape to the outside. In such a case, for example, when there are a plurality of flow paths p, there are flow paths p in which the coolant 60 flows smoothly and flow paths p in which the coolant 60 does not flow smoothly due to air bubbles. Non-uniformity in flow distribution of the coolant 60 to p may result in inadequate cooling of the electronic device 5 . Therefore, by suppressing the generation of air bubbles inside the cooling unit 44, uneven flow distribution inside the cooling unit 44 can be prevented, and the electronic device 5 such as a power device can be cooled more appropriately. Become.

Specifically, the pressure regulating means 9 is, in some embodiments, a first regulating pressure provided between the downstream side of the electronic device 5 and the tank 6 in the first cooling line 40, as shown in FIG. Means 91 are included. This first adjusting means 91 is a means capable of making the pressure on the upstream side higher than the pressure on the downstream side. Here, the cooling section 44 is positioned upstream of the first adjustment means 91 in the first cooling line 40 . Therefore, by increasing the pressure of the refrigerant 60 in the first cooling line 40 on the upstream side of the first adjusting means 91 by the first adjusting means 91, the cooling portion 44 located in the portion where the pressure in the first cooling line 40 is increased The internal pressure P of is also increased.

In the embodiment shown in FIG. 6, the pressure regulating means 9 (first regulating means 91) is a valve 91m, and the flow area when passing through the valve 91m is less than the flow area of the first cooling line 40 on the upstream side thereof. is also made smaller, the pressure on the upstream side of the valve 91m is increased. Specifically, the degree of opening of the valve 91m is kept larger than 0 (fully closed). Even when the degree of opening of the valve 91m is 100% (fully open), if the passage area of the valve 91m at that time is smaller than the passage area of the first cooling line 40 on the upstream side of the valve, the valve 91m The degree of opening may be 100%.

In some embodiments, the valve 91m, which is the first adjustment means 91, may be configured such that the degree of opening thereof can be manually set. In some other embodiments, the valve 91m may be a control valve 91c whose degree of opening can be set according to a command value from a second controller 2 or the like (see FIG. 8, which will be described later). ). The control valve 91c may be an ON-OFF valve that can switch between two positions, fully closed and fully open, or a control valve that can set the degree of opening between fully closed and fully open, for example, continuously. can be Then, the degree of opening of the control valve may be adjusted so that the internal pressure P of the cooling section 44 reaches a target pressure (pressure higher than a specified value Pc, which will be described later) at which the generation of air bubbles can be suppressed. In some other embodiments, the first adjustment means 91 is a pressure difference forming means (not shown) such as an orifice formed so that the flow passage area becomes narrower than that on the upstream side and becomes wider again. ) may be

In some other embodiments, the pressure adjusting means 9 is provided on the downstream side of the first cooling line 40 between the upstream side of the electronic device 5 and the tank 6, as shown in FIG. A second adjustment means 92 may also be included which allows the pressure to be higher than the pressure on the upstream side. That is, the pressure adjusting means 9 is composed of the first adjusting means 91 and the second adjusting means 92 described above, and the pressure between the first adjusting means 91 and the second adjusting means 92 in the first cooling line 40 is It is designed to regulate pressure. In the embodiment shown in FIG. 7, the second adjusting means 92 is the above-described first pump 7A, the first adjusting means 91 is positioned downstream of the electronic device 5, and adjusts the rotation speed of the first pump 7A. It is possible to increase the pressure of the refrigerant 60 flowing downstream of the first pump 7A in the first cooling line 40 by adjusting the height, for example. Therefore, the internal pressure P of the cooling part 44 located in the portion where the pressure in the first cooling line 40 is increased is also increased. The second adjusting means 92 may be another pump different from the first pump 7A, which is installed downstream of the first pump 7A.

In this embodiment, since the pressure adjusting means 9 is the first pump 7A, the first adjusting means 91 includes a control valve 91c set to a predetermined degree of opening, and a flow passage area of the first cooling line 91c even in a fully open state. It may be either an ON-OFF valve smaller than that of 40, or a pressure differential forming means (not shown) as described above. In some embodiments, the internal pressure P of the cooling section 44 may be adjusted to the target pressure by adjusting the rotational speed of the first pump 7A. In some other embodiments, the first adjustment means 91 is a control valve 91c, and by adjusting the valve opening degree of the control valve 91c and the rotation speed of the first pump 7A, the internal pressure of the cooling section 44 is P may be set to the target pressure.

According to the above configuration, the internal pressure P of the cooling section 44 is increased by the pressure adjusting means 9 . Thereby, the boiling point of the refrigerant 60 inside the cooling section 44 can be made higher. Therefore, by increasing the internal pressure P of the cooling part 44 , it is possible to suppress the generation of air bubbles in the coolant 60 inside the cooling part 44 . Therefore, it is possible to appropriately cool the electronic device 5 such as a power device.

Also, in some embodiments, the pressure adjusting means 9 described above may be automatically controlled.
That is, in some embodiments, as shown in FIGS. 7-8, the cooling system 1 further comprises a second controller 2 connected to the pressure regulation means 9 described above. As shown in FIG. 10, the second controller 2 includes a pressure acquisition unit 21 that acquires a measured value Pm of the pressure of the refrigerant 60 inside the cooling unit 44 (the internal pressure P of the cooling unit 44 described above); and a control unit 22 for controlling the pressure adjusting means 9 so that the measured value Pm becomes equal to or greater than the specified value Pc. In addition, the second controller 2 is, for example, a computer as described above.

In some embodiments, the specified value Pc may be determined based on the amount of heat generated by the electronic device 5 and the flow rate of the coolant 60 supplied to the cooling section 44 . More specifically, the temperature inside the cooling unit 44 is predicted based on the amount of heat generated by the electronic device 5 and the flow rate (coolant flow rate) of the coolant 60 supplied to the cooling unit 44 . Then, the saturation pressure corresponding to the predicted temperature is obtained based on the relationship between the temperature and the saturation pressure as shown in FIG. pressure).

It should be noted that the maximum value of the amount of heat generated by the electronic device 5 is preferably used for the calculation of the predicted value. Also, when the rotational speed of the first pump 7A changes, it is preferable to use the minimum value of the flow rate of the coolant 60 supplied to the cooling section 44. FIG. This allows for more accurate temperature prediction. Also, the amount of heat generated by the electronic device 5 and the flow rate of the coolant to the cooling unit 44 may be predicted values or measured values. Also, instead of the amount of heat generated by the electronic device 5, the amount of power supplied to the electronic device 5 having a correlation with the amount of heat generated may be used (the same applies hereinafter).

Also, the above specified value Pc may be a fixed value in some embodiments. In this case, the second controller 2 acquires a specified value Pc input by an operator or the like. In some other embodiments, the prescribed value Pc described above may be updated according to driving conditions. In this case, the second controller 2 acquires an index value (measured value or predicted value) such as the amount of heat generated by the electronic device 5 or the flow rate of the coolant to the cooling unit 44 during operation at a predetermined timing, such as periodically. A specified value Pc is determined based on the temperature obtained from the result.

Also, in embodiments where the specified value Pc is updated (not a fixed value), in some embodiments, the second controller 2 changes the temperature of the coolant 60 inside the cooling unit 44 instead of the above index. Measured values may be obtained. By obtaining the measured value of the temperature, the pressure capable of suppressing the generation of air bubbles according to the measured value can be obtained using the relationship shown in FIG. 9 or the like. Therefore, by setting the specified value Pc to a pressure value higher than the saturation pressure corresponding to the temperature measurement value, it is possible to more reliably suppress the generation of air bubbles inside the cooling unit 44 . In this case, the second controller 2 further includes a temperature acquisition unit that acquires the measured temperature of the refrigerant 60 inside the cooling unit 44 described above, and the control unit 22 or the like updates the specified value Pc based on the measured temperature. do. The thermometer may be installed between the downstream side of the electronic device 5 and the first adjusting means 91, or may be installed in the cooling section 44, for example.

In the embodiment shown in FIG. 10, the pressure acquisition unit 21 is connected to a pressure gauge 26 for measuring the internal pressure P of the cooling unit 44, and the pressure measurement value Pm by the pressure gauge 26 is input. It's like This pressure gauge 26 may in some embodiments be installed between the upstream side of the electronic device 5 and the first adjustment means 91 in the first cooling line 40, as shown in FIGS. . This makes it possible to easily measure the internal pressure P of the cooling section 44 . However, the present invention is not limited to this embodiment. The pressure gauge 26 should be able to measure the internal pressure P of the cooling unit 44, a pressure that can be regarded as the internal pressure P, or a pressure that allows the internal pressure P to be estimated by a predetermined calculation or the like. For example, the internal pressure P of the cooling section 44 may be measured directly.

In addition, in the embodiment shown in FIG. 10, the control unit 22 is connected to the pressure acquisition unit 21, and when this pressure measurement value Pm is input, the pressure adjustment means 9 is controlled based on the pressure measurement value Pm. A command value I is generated and transmitted to the pressure adjusting means 9 . Then, the pressure adjusting means 9 operates according to the command value I received. That is, when the pressure adjusting means 9 is the control valve 91c, the opening commanded by the command value I is set. When the pressure adjusting means 9 is the first pump 7A, the rotation speed commanded by the command value I is set.

More specifically, in the embodiment shown in FIG. 7, the pressure regulating means 9 comprises at least a first pump 7A as adjustable means. Therefore, when the measured value Pm is input from the pressure gauge 26, the second controller 2 transmits a command value I (such as a rotation speed command) calculated based on the measured value Pm to at least the first pump 7A. It has become. In some other embodiments, when the pressure regulating means 9 is composed of the first pump 7A and the control valve 91c, which is the first regulating means 91, the second controller 2 The command value I may be transmitted to at least one of the pump 7A and the first adjusting means 91.

On the other hand, in the embodiment shown in FIG. 8, the pressure regulating means 9 includes a control valve 91c, which is the first regulating means 91. As shown in FIG. Therefore, when the measured value Pm is input from the pressure gauge 26, the second controller 2 transmits a command value I (such as a valve opening command) calculated based on the measured value Pm to the control valve 91c. It's becoming

According to the above configuration, the pressure adjusting means 9 is automatically controlled based on the measured value Pm of the refrigerant pressure (internal pressure P) inside the cooling section 44 and the specified value (threshold value). Accordingly, by appropriately increasing the pressure of the coolant 60 inside the cooling portion 44 , it is possible to suppress the generation of air bubbles inside the cooling portion 44 .
It should be noted that in some other embodiments the adjustment of the pressure adjusting means 9 may be manual.

Next, an embodiment related to the waste heat utilization system S that utilizes the waste heat of the electronic device 5 will be described.
Currently, in factories with steam boilers and ships with large engines, waste heat from the boilers and engines is used to generate low-temperature, low-pressure steam, which is used for heating and humidification. In the future, as the spread of renewable energy advances along with the global demand for _CO2 reduction, and the main energy source shifts from fossil fuels to electric power (an electrified society), waste heat from boilers and engines as described above will disappear. At this time, for example, if steam is generated using a dedicated device, costs and energy are required accordingly. Therefore, since the electronic device 5 such as a power device generates heat from 200° C. to 300° C. or more, the amount of heat generated is high, so the waste heat is used as a heat source to generate steam.

Specifically, in some embodiments, as shown in FIGS. 5 to 8, the cooling system 1 is configured such that the refrigerant 60 flowing downstream of the electronic device 5 in the first cooling line 40 has a vapor phase and a liquid phase. It further comprises a gas-liquid separator 72 for separating the Here, the pressure of the refrigerant 60 in the first cooling line 40 (inside the pipe) is configured to be lower than that on the upstream side of the first adjusting means 91 after passing through the first adjusting means 91 . Then, when the pressure becomes smaller, the refrigerant 60 becomes easier to evaporate. By utilizing this phenomenon, the refrigerant 60 is actively vaporized on the downstream side of the first adjusting means 91 to generate a gas-liquid two-phase flow. The gas-liquid two-phase flow generated in this way is supplied to the gas-liquid separator 72 and separated into a gas phase (vapor) and a liquid phase (hot water), whereby the gas phase (vapor) can be extracted. On the other hand, the liquid phase separated in the gas-liquid separator 72 is configured to circulate to the tank 6 through the first cooling line 40 .

5 to 8, the vapor phase of the refrigerant 60 separated by the gas-liquid separator 72 is supplied to the vapor utilization device 74 connected to the gas-liquid separator 72 by piping or the like. ing. The steam utilization device 74 may be, for example, a heating system, a hot water supply system, or a system that performs heating or humidification. Also, the steam utilization device 74 may be a system installed in a factory, ship, or the like. A waste heat utilization system S is configured by the cooling system 1 and the steam utilization device 74 .

According to the above configuration, steam is generated using waste heat from the electronic device 5 such as a power device as a heat source. As a result, steam can be generated without, for example, providing a dedicated device for generating steam or impairing the cooling performance of the cooling system 1 . Therefore, steam can be efficiently generated even in an electrified society.

Next, a method of controlling the cooling system will be described.
A control method of a cooling system according to at least one embodiment of the present disclosure is a control method of a cooling system 1 for cooling an electronic device 5, wherein a coolant 60 is stored between a tank 6 storing coolant 60 and the electronic device 5. adjusting the flow rate of the coolant 60 flowing through the first cooling line 40 that can circulate through the 60 according to the amount of heat generated by the electronic device 5; and adjusting the flow rate of the refrigerant 60 flowing through the second cooling line 50 for cooling the refrigerant 60 according to the temperature of the refrigerant 60 in the tank 6 .

According to the above method, the first cooling line 40 for cooling the electronic device 5 by circulating the coolant 60 and the second cooling line 50 for cooling the coolant 60 are provided in separate systems via the tank 6. . Since each cooling line 40, 50 can independently adjust the refrigerant flow rate, the refrigerant flow rate of the first cooling line 40 and its adjustment timing and the refrigerant flow rate of the second cooling line 50 and its adjustment timing can be adjusted. The cooling system 1 can be operated differently. As a result, for example, the operating load of the second cooling line 50 for the refrigerant with a slow response time can be adjusted according to the long-period fluctuation component of the electronic device 5 with a fast fluctuation period, thereby reducing running costs and saving energy. can be achieved, and the cooling system 1 capable of suppressing energy loss can be provided.

A cooling system control program (for example, the coolant flow rate management program 15) according to at least one embodiment of the present disclosure is a control program for the cooling system 1 for cooling the electronic device 5, and is a tank that stores the coolant 60. adjusting the flow rate of the coolant 60 flowing through the first cooling line 40 through which the coolant 60 can be circulated between 6 and the electronic device 5 according to the amount of heat generated by the electronic device 5; A second cooling line 50 provided in a separate system, and the flow rate of the refrigerant 60 flowing through the second cooling line 50 for cooling the refrigerant 60 is changed according to the temperature of the refrigerant 60 in the tank 6 and adjusting.

With such a configuration, as described in any of the above embodiments, the first cooling line 40 that circulates the coolant 60 to cool the electronic device 5 and the second cooling line 50 that cools the coolant 60. is provided in another system through the tank 6. Since each cooling line 40, 50 can independently adjust the refrigerant flow rate, the refrigerant flow rate of the first cooling line 40 and its adjustment timing and the refrigerant flow rate of the second cooling line 50 and its adjustment timing can be adjusted. The cooling system 1 can be operated differently. As a result, for example, the operating load of the second cooling line 50 for the refrigerant with a slow response time can be adjusted according to the long-period fluctuation component of the electronic device 5 with a fast fluctuation period, thereby reducing running costs and saving energy. can be achieved, and the cooling system 1 capable of suppressing energy loss can be provided.

Further, a method for controlling a cooling system according to at least one embodiment of the present disclosure is a method for controlling a cooling system 1 for cooling an electronic device 5, and is provided in the first cooling line 40 described above. A step of acquiring a measured value Pm of the pressure of the refrigerant 60 inside the cooling unit 44 for cooling the 5 (pressure acquisition step), and the above pressure adjusting means 9 so that the measured value Pm is equal to or greater than the specified value Pc and a step of controlling (control step).

Note that the cooling system 1 according to some of the embodiments described above may include a plurality of information processing devices, and these information processing devices may perform each process in a distributed manner.
In addition, by recording a program for executing each process of the above-described several embodiments on a computer-readable recording medium and causing a computer system to read and execute the program recorded on the recording medium, Various processes described above may be performed.

Note that the “computer system” referred to here may include hardware such as an OS (Operating System) and peripheral devices. Also, the "computer system" includes a home page providing environment (or display environment) if the WWW (World Wide Web) system is used. In addition, "computer-readable recording medium" means flexible disk, magneto-optical disk, ROM (Read-only Memory), writable non-volatile memory such as flash memory, portable such as CD (Compact Disc)-ROM It refers to a storage device such as a hard disk built into a medium or computer system.

Furthermore, "computer-readable recording medium" means a volatile memory (e.g., DRAM (Dynamic Random Access Memory)), which holds a program for a certain period of time. Further, the above program may be transmitted from a computer system storing this program in a storage device or the like to another computer system via a transmission medium or by a transmission wave in a transmission medium. Here, the "transmission medium" for transmitting the program refers to a medium having a function of transmitting information, such as a network (communication network) such as the Internet or a communication line (communication line) such as a telephone line. Further, the program may be for realizing part of the functions described above. Further, it may be a so-called difference file (difference program) that can realize the above-described functions in combination with a program already recorded in the computer system.

According to at least one embodiment of the present disclosure described above, it is possible to provide the cooling system 1 capable of suppressing energy loss.

The present invention is not limited to the above-described embodiments, and includes modifications of the above-described embodiments and combinations of these embodiments.

1 cooling system 10 controller 11 CPU
12 RAMs
13 ROMs
14 Bus 15 Refrigerant Flow Control Program 17 Database 18 Table 2 Second Controller 21 Pressure Acquisition Unit 22 Control Unit 26 Pressure Gauge 31 First Temperature Sensor 32 Second Temperature Sensor 40 First Cooling Line (Electronic Device Cooling Line)
42 Subpath 44 Cooling unit 5 Electronic device (object to be cooled)
5b base 50 second cooling line (refrigerant cooling line)
51 primary circulation line 52 secondary circulation line 53 first heat exchanger (subcooler)
54 second heat exchanger (chiller)
6 tank (refrigerant container)
60 refrigerant (cooling fluid)
65 non-condensable gas 7A first pump (second)
7B Second pump 72 Gas-liquid separator 74 Steam utilizing device 8 Flow controller 9 Pressure adjusting means 91 First adjusting means 91c Control valve 91m Valve 92 Second adjusting means

S Waste heat utilization system I Command value P Refrigerant pressure Pm inside the cooling unit Measured pressure value Pc Specified value p Flow path

Claims (21)

A cooling system for cooling an electronic device, comprising:
a tank that stores a refrigerant;
a first cooling line capable of circulating the coolant between the tank and the electronic device;
a second cooling line for cooling the refrigerant, which is provided in a system separate from the first cooling line from the tank;
a first pump capable of adjusting the flow rate of the refrigerant in the first cooling line;
a flow controller capable of adjusting the flow rate of the refrigerant in the second cooling line;
a controller connected to the first pump and the flow regulator;
a second temperature sensor capable of detecting the temperature of the refrigerant in the tank;
with
The first cooling line is configured to return the refrigerant whose temperature has increased due to heat exchange with the electronic device to the tank without cooling,
The controller drives the first pump so as to adjust the flow rate of the coolant flowing through the first cooling line according to the amount of heat generated by the electronic device, and based on the detection signal from the second temperature sensor, the By driving the flow controller to adjust the flow rate of the refrigerant flowing through the second cooling line, the flow rate of the refrigerant in the first cooling line and the flow rate of the refrigerant in the second cooling line are independently adjusted. configured,
The cooling system, wherein the controller is configured to increase the flow rate of the coolant flowing through the first cooling line by driving the first pump at a high output when the amount of heat generated by the electronic device is large. . A cooling system for cooling an electronic device, comprising:
a tank that stores a refrigerant;
a first cooling line capable of circulating the coolant between the tank and the electronic device;
a second cooling line for cooling the refrigerant, which is provided in a system separate from the first cooling line from the tank;
a first pump capable of adjusting the flow rate of the refrigerant in the first cooling line;
a flow controller capable of adjusting the flow rate of the refrigerant in the second cooling line;
pressure adjusting means for adjusting the pressure of the coolant inside the cooling section for cooling the electronic device, provided in the first cooling line;
a second controller connected to the pressure regulating means;
with
The pressure adjusting means is a first adjusting means provided between the downstream side of the electronic device and the tank in the first cooling line and capable of making the pressure on the upstream side higher than the pressure on the downstream side. including
The second controller is
a pressure acquisition unit that acquires a measured value of the pressure of the refrigerant inside the cooling unit;
and a control unit that controls the pressure adjustment means such that the measured value becomes equal to or greater than a specified value so as to suppress the generation of air bubbles inside the cooling unit. the cooling system comprises a controller connected to the first pump;
The controller may be configured to drive the first pump so as to adjust the flow rate of coolant flowing through the first cooling line in accordance with the amount of heat generated by the electronic device. 3. The cooling system according to 2. The controller may be configured to drive the first pump so as to adjust the flow rate of the coolant flowing through the first cooling line based on the amount of power supplied to the electronic device. 4. The cooling system according to 1 or 3. The cooling system includes a first temperature sensor capable of detecting the amount of heat generated by the electronic device,
The controller may be configured to drive the first pump so as to adjust the flow rate of the coolant flowing through the first cooling line based on the detection signal from the first temperature sensor. 5. The cooling system of claim 4, wherein a cooling system comprising a plurality of said electronic devices;
the first cooling line includes a plurality of sub-passages that are parallel to each other and each can individually cool a plurality of the electronic devices;
The cooling system according to any one of claims 1 to 5, wherein the first pump may be arranged in each of the sub-paths so as to be able to individually adjust the flow rate of the refrigerant. The second cooling line is
a primary circulation line for returning the refrigerant from the tank to the tank;
a second pump as the flow controller arranged in the primary circulation line;
a first heat exchanger through which the primary circulation line passes;
a secondary circulation line for cooling the refrigerant in the primary circulation line via the first heat exchanger;
and a second heat exchanger for cooling the refrigerant in the secondary circulation line. The second cooling line is
a first heat exchanger disposed within the tank;
and a second heat exchanger for cooling the refrigerant from the tank. The cooling system according to any one of claims 1 to 8, wherein non-condensable gas may be enclosed in said tank. the cooling system includes a second temperature sensor capable of detecting the temperature of the refrigerant in the tank;
The controller may be configured to drive the flow controller to adjust the flow rate of the refrigerant flowing through the second cooling line based on the detection signal from the second temperature sensor. 4. The cooling system of claim 3, wherein 2. The apparatus according to claim 1, further comprising pressure adjusting means for adjusting the pressure of the coolant inside the cooling unit for cooling the electronic device, provided in the first cooling line. cooling system. The pressure adjusting means is a first adjusting means provided between the downstream side of the electronic device and the tank in the first cooling line and capable of making the pressure on the upstream side higher than the pressure on the downstream side. 12. The cooling system of claim 11, comprising: 13. The cooling system of claim 12, wherein said first adjusting means is a control valve. The pressure adjusting means is a second adjusting means provided between the upstream side of the electronic device and the tank in the first cooling line and capable of making the pressure on the downstream side higher than the pressure on the upstream side. further including
14. Cooling according to claim 12 or 13, characterized in that the pressure regulating means are adapted to regulate the pressure between the first regulating means and the second regulating means in the first cooling line. system. 3. The cooling system according to claim 2, wherein the pressure acquisition unit is connected to a pressure gauge installed between the upstream side of the electronic device and the first adjustment means in the first cooling line. . Any one of claims 11 to 15, further comprising a gas-liquid separator for separating a gas phase and a liquid phase of the refrigerant flowing downstream of the electronic device in the first cooling line. A cooling system as described in Clause. A method of controlling a cooling system for cooling an electronic device, comprising:
The heat generation of the electronic device is performed so that the flow rate of the coolant flowing through the first cooling line in which the coolant can be circulated between the tank storing the coolant and the electronic device increases at the timing when the electronic device generates a large amount of heat. adjusting the flow rate of the refrigerant flowing through the first cooling line according to the amount;
a step of returning the coolant whose temperature has been raised by heat exchange with the electronic device in the first cooling line to the tank from the first cooling line without cooling;
A second cooling line provided in a system separate from the first cooling line from the tank, the flow rate of the refrigerant flowing through the second cooling line for cooling the refrigerant, the temperature of the refrigerant in the tank and adjusting according to
A control method for a cooling system, comprising independently adjusting flow rates of the refrigerant in the first cooling line and the second cooling line. A control program for a cooling system for cooling an electronic device,
The heat generation of the electronic device is performed so that the flow rate of the coolant flowing through the first cooling line in which the coolant can be circulated between the tank storing the coolant and the electronic device increases at the timing when the electronic device generates a large amount of heat. adjusting the flow rate of the refrigerant flowing through the first cooling line according to the amount;
a step of returning the coolant whose temperature has been raised by heat exchange with the electronic device in the first cooling line to the tank from the first cooling line without cooling;
A second cooling line provided in a system separate from the first cooling line from the tank, the flow rate of the refrigerant flowing through the second cooling line for cooling the refrigerant, the temperature of the refrigerant in the tank A cooling system characterized in that it is configured to independently adjust the flow rate of the refrigerant in the first cooling line and the second cooling line by causing a computer to execute a step of adjusting according to control program. A method of controlling a cooling system for cooling an electronic device, comprising:
Obtaining a measurement value of the pressure of the coolant inside a cooling unit for cooling the electronic device provided in a first cooling line capable of circulating the coolant between a tank storing the coolant and the electronic device and
a step of controlling a pressure adjusting means for adjusting the pressure of the refrigerant inside the cooling unit so that the measured value becomes equal to or higher than a specified value so as to suppress the generation of air bubbles inside the cooling unit; A control method for a cooling system, comprising: A control program for a cooling system for cooling an electronic device,
to the computer,
Obtaining a measurement value of the pressure of the coolant inside a cooling unit for cooling the electronic device provided in a first cooling line capable of circulating the coolant between a tank storing the coolant and the electronic device and
a step of controlling a pressure adjusting means for adjusting the pressure of the refrigerant inside the cooling unit so that the measured value becomes equal to or higher than a specified value so as to suppress the generation of air bubbles inside the cooling unit; , the control program for the cooling system. a cooling system according to claim 16;
A waste heat utilization system, comprising: a vapor utilization device to which the vapor phase of the refrigerant separated by the gas-liquid separator provided in the cooling system is supplied.

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