JP7262249B2 - SUBSTRATE HOLDER, INSPECTION APPARATUS, AND INSPECTION METHOD - Google Patents

Description

Exemplary embodiments of the present disclosure relate to a substrate holder, an inspection apparatus, and an inspection method.

For example, Patent Document 1 discloses a technique for adjusting a substrate to a desired temperature during inspection of a plurality of semiconductor devices formed on the substrate. A board inspection apparatus disclosed in Patent Document 1 includes a prober. A prober has a stage, a test head, a temperature control system, and a temperature control channel. The stage carries a wafer on which semiconductor devices are formed. The test head inspects the electrical characteristics of the semiconductor devices on the wafer placed on the stage. A temperature control channel passes through the stage. A temperature control system regulates the temperature of the stage. The temperature regulation system has a hot chiller, a cold chiller and a mixing valve unit. A high temperature chiller supplies a high temperature medium to the temperature control channel. A low-temperature chiller supplies a low-temperature medium to the temperature control channel. The mixing valve unit mixes the hot medium and the cold medium supplied to the temperature control passage.

JP 2014-209536 A

The present disclosure provides techniques for removing heat generated from a substrate under test during testing of devices formed on the substrate under test.

In one exemplary embodiment, a substrate holder is provided. A substrate holding table is provided in an inspection apparatus used for inspecting a device formed on a substrate to be inspected and used to hold the substrate to be inspected. A substrate holding table includes a stage and a support. The stage is supported by a support and has a main surface and a back surface. A substrate to be inspected comes into contact with the main surface during inspection of the device. The back surface is opposite the major surface. The support has a heat exchange chamber. The heat exchange chamber has its rear surface exposed and is filled with a refrigerant. The back surface is continuously covered by liquid coolant during device testing. Heat generated from the substrate to be inspected is absorbed by the latent heat of the coolant.

According to the present disclosure, it is possible to provide a technique for removing heat generated from a substrate to be inspected during inspection of devices formed on the substrate to be inspected.

FIG. 1 is a diagram schematically showing an example configuration of an inspection system 100 including an inspection apparatus 1 according to one exemplary embodiment. FIG. 2 is a diagram illustrating the operating state of the inspection apparatus 1 shown in FIG. FIG. 3 is a flowchart illustrating method MT according to one exemplary embodiment. FIG. 4 is a diagram schematically showing an example of another configuration of the inspection apparatus 1 shown in FIG. 1. As shown in FIG. FIG. 5 is a diagram schematically showing an example of another configuration of the inspection apparatus 1 shown in FIG. 1. As shown in FIG. FIG. 6 is a diagram schematically showing an example of the configuration of the substrate holding table 2 when equipped with the heater HT.

Various exemplary embodiments are described below.
In one exemplary embodiment, a substrate holder is provided. A substrate holding table is provided in an inspection apparatus used for inspecting a device formed on a substrate to be inspected and used to hold the substrate to be inspected. A substrate holding table includes a stage and a support. The stage is supported by a support and has a major surface and a back surface opposite the major surface. A substrate to be inspected comes into contact with the main surface during inspection of the device. The support has a heat exchange chamber. The heat exchange chamber has its rear surface exposed and is filled with a refrigerant. The back surface is continuously covered by liquid coolant during device testing. Heat generated from the substrate to be inspected is absorbed by the latent heat of the coolant. Therefore, heat generated in the substrate under test during device testing can be absorbed by the coolant, primarily using the coolant's latent heat.

In the substrate holding table according to one exemplary embodiment, the support is provided on the stage facing vertically upward. The stage is placed on the substrate to be inspected vertically upward when the substrate to be inspected is in contact with the stage during device inspection. Therefore, in the coolant in the heat exchange chamber, a plurality of bubbles generated on the back side by the heat from the substrate to be inspected can move vertically upward.

In the substrate holding table according to one exemplary embodiment, the back surface exposed to the heat exchange chamber has a porous structure including a porous member, a fin structure including a plurality of fins, a plurality of concave portions and a plurality of convex portions. and a concave-convex structure including With any of the above structures of the back surface, the coolant can be efficiently vaporized, and the bubbles generated in the coolant can be finer.

The substrate holding table according to one exemplary embodiment further comprises a heater. A heater is provided inside the stage and extends along the main surface. Therefore, even if the substrate to be inspected is cooled by the coolant during device inspection and falls below the preset reference temperature, the temperature of the substrate to be inspected can be raised to the reference temperature by the heater.

In one exemplary embodiment, an inspection device is provided. An inspection apparatus includes any one of the substrate holding tables described above, and a probe card used to inspect a device formed on a substrate to be inspected held by the substrate holding table. Therefore, the inspection apparatus can make the coolant absorb the heat generated in the substrate under inspection during device inspection, mainly by using the latent heat of the coolant.

The inspection device according to one exemplary embodiment further comprises a circulation device used to circulate the coolant through the heat exchange chamber. The circulation device comprises a chiller device, a first coolant flow path and a second coolant flow path. A first refrigerant flow path connects the output end of the chiller device and the heat exchange chamber. A second refrigerant flow path connects the input end of the chiller device and the heat exchange chamber. Therefore, by providing the testing apparatus with a circulation device, the refrigerant in the heat exchange chamber is continuously circulated during testing of the device, so that the heat exchange chamber can be continuously supplied with the liquid refrigerant.

In an inspection device according to one exemplary embodiment, the circulation device further comprises a condenser. A condenser is provided in the second refrigerant flow path. Therefore, the condenser can return bubble-free liquid refrigerant to the chiller device even if the refrigerant returned from the heat exchange chamber through the second refrigerant flow path contains bubbles.

The inspection device according to one exemplary embodiment further comprises a cooling device. A support is positioned between the stage and the cooling device. Therefore, by providing the inspection device with a cooling device, the rear surface of the heat exchange chamber can be continuously covered with the liquid coolant.

In one exemplary embodiment, an inspection method is provided for inspecting devices formed on a substrate under inspection. In this inspection method, a stage and a heat exchange chamber used for device inspection are arranged vertically upward in the order of the stage and the heat exchange chamber, the substrate to be inspected is held on the stage, and the device is inspected. The heat exchange chamber is filled with liquid refrigerant. The stage has a main surface with which the substrate to be inspected abuts, and a back surface opposite to the main surface and exposed to the heat exchange chamber. The back surface is continuously covered by the coolant during testing of the device. Heat generated from the substrate to be inspected is absorbed by the latent heat of the coolant. Therefore, the heat generated in the substrate under test during device testing can be absorbed by the coolant, primarily using the coolant's latent heat.

Various exemplary embodiments are described in detail below with reference to the drawings. In addition, suppose that the same code|symbol is attached|subjected to the part which is the same or equivalent in each drawing.

FIG. 1 shows the configuration of an inspection system 100 according to one exemplary embodiment. The inspection system 100 includes an inspection device 1 and a control device Cnt. The inspection apparatus 1 is used to inspect a plurality of devices DV formed on the surface of a wafer W (an example of a substrate to be inspected). An inspection apparatus 1 includes a substrate holding table 2 and a probe card 3 .

The substrate holding table 2 is used to hold the wafer W and is provided in the inspection apparatus 1 . The substrate holder 2 has a stage 2A and a support 2B.

The stage 2A is supported by a support 2B and has a main surface 2A1 and a back surface 2A2. A wafer W comes into contact with the main surface 2A1 during the inspection of the device DV. The back surface 2A2 is on the opposite side of the main surface 2A1.

The support 2B has a heat exchange chamber 2C. The support 2B is provided on the stage 2A facing vertically upward DR. The stage 2A is placed on the wafer W facing vertically upward DR when the wafer W is in contact with the stage 2A during the inspection of the device DV.

The back surface 2A2 is exposed in the heat exchange chamber 2C, and is filled with the refrigerant FL. The inspection apparatus 1 can absorb the heat generated in the wafer W during the inspection of the device DV in the coolant FL mainly by using the latent heat of the coolant FL. The latent heat used in the inspection device 1 is heat required when the refrigerant FL changes from liquid to gas (phase transition).

As shown in FIG. 2, the heat generated in the wafer W during the inspection of the device DV moves from the wafer W in a direction MD1 directed vertically upward DR and reaches the liquid coolant FL via the stage 2A. A plurality of bubbles AB may be generated on the back surface 2A2 side in the liquid coolant FL due to the heat reaching the coolant FL. Air bubbles AB are generated by vaporization of coolant FL.

Thus, the heat generated in the wafer W can generate a plurality of bubbles AB in the liquid coolant FL as latent heat. The heat generated in the wafer W can be absorbed by the coolant FL while suppressing the temperature rise of the coolant FL by generating a plurality of bubbles AB in the coolant FL as latent heat.

During inspection of the device DV, the wafer W, the stage 2A, and the heat exchange chamber 2C are arranged facing vertically upward DR. In the coolant FL of the heat exchange chamber 2C, a plurality of bubbles AB generated on the back surface 2A2 side by the heat from the wafer W can move in the vertically upward direction MD2. Therefore, the back surface 2A2 can be continuously covered with the liquid coolant FL during inspection of the device DV.

Therefore, the heat generated in the wafer W during the inspection of the device DV can continuously generate a plurality of bubbles AB in the liquid coolant FL as latent heat during the inspection of the device DV. During the inspection of the device DV, the heat generated in the wafer W continuously generates a plurality of bubbles AB in the coolant FL as latent heat. can be absorbed. As a result, it is possible to control the temperature of the wafer W in response to the recent trend of increased heat generation during inspection of the device DV.

In the heat exchange chamber 2C, the rear surface 2A2 of the stage 2A exposed to the heat exchange chamber 2C has a porous structure including a porous member, a fin structure including a plurality of fins, a plurality of concave portions and a plurality of convex portions. a concave-convex structure including: The refrigerant FL is efficiently vaporized by any of the above structures that the back surface 2A2 has. Also, the bubbles AB generated in the refrigerant FL can be finer.

The coolant FL may be water, for example, but it may be replaced by other liquids other than water depending on the heat generated during the inspection of the device DV, the preset temperature of the wafer W during the inspection of the device DV, and the like. .

Returning to FIG. 1, description will be made. The probe card 3 has a plurality of probes 3A. The plurality of probes 3A are provided so as to be in contact with the electrode pads of each of the plurality of devices DV formed on the wafer W held by the substrate holding table 2 during testing of the devices DV.

The control device Cnt is a computer or the like having a CPU, ROM, RAM, and the like. The control device Cnt comprehensively controls the inspection system 100 by causing the CPU to execute a computer program stored in a memory such as RAM. The controller Cnt inspects the devices formed on the wafer W using the probe card 3, for example.

A method MT according to one exemplary embodiment is described with reference to FIG. A flow chart of method MT shown in FIG. 3 is an example of a testing method for testing the device DV.

First, in step ST1, the stage 2A and the heat exchange chamber 2C used for testing the device DV are arranged in the order of the stage 2A and the heat exchange chamber 2C facing vertically upward DR (step ST1). The heat exchange chamber 2C is filled with a liquid refrigerant FL.

In step ST2 following step ST2, wafer W is held on stage 2A (step ST2). Wafer W is in contact with main surface 2A1 of stage 2A. The back surface 2A2 on the opposite side of the main surface 2A1 is exposed to the heat exchange chamber 2C and covered with the refrigerant FL in the heat exchange chamber 2C.

In step ST3 following step ST2, the device DV is inspected (step ST3).
Back surface 2A2 is continuously covered with coolant FL during inspection of device DV.

According to the method MT, the heat generated in the wafer W during the inspection of the device DV can be absorbed by the coolant FL mainly by using the latent heat of the coolant FL. More specifically, the heat generated in the wafer W during the inspection of the device DV can continuously generate a plurality of bubbles AB in the liquid coolant FL as latent heat during the inspection of the device DV. During the inspection of the device DV, the heat generated in the wafer W continuously generates a plurality of bubbles AB in the coolant FL as latent heat. can be absorbed. Also, since the generated air bubble AB is gas, it moves upward without remaining on the rear surface 2A2. Therefore, the heat generated in the wafer W is continuously absorbed by the coolant FL.

The inspection apparatus 1 shown in FIG. 1 may have the configuration shown in FIG. The inspection device 1 shown in FIG. 4 further includes a circulation device 4, a first coolant channel 4B1, and a second coolant channel 4B2 in addition to the configuration shown in FIG.

The circulation device 4 is used to circulate the coolant FL through the heat exchange chamber 2C. The circulation device 4 includes a chiller device 4A, a first coolant channel 4B1, and a second coolant channel 4B2.

The first refrigerant flow path 4B1 connects the output end 4A1 of the chiller device 4A and the heat exchange chamber 2C. The second refrigerant flow path 4B2 connects the input end 4A2 of the chiller device 4A and the heat exchange chamber 2C.

A liquid refrigerant FL is sent out from the output end 4A1 of the chiller device 4A and supplied to the heat exchange chamber 2C via the first refrigerant flow path 4B1. The refrigerant FL in the heat exchange chamber 2C is returned from the input end 4A2 to the chiller device 4A via the second refrigerant flow path 4B2. The chiller device 4A cools the refrigerant FL returned from the heat exchange chamber 2C.

Since the inspection apparatus 1 includes the circulation device 4, the refrigerant FL in the heat exchange chamber 2C is continuously circulated during the inspection of the device DV, so the liquid refrigerant FL is continuously supplied to the heat exchange chamber 2C. can be supplied.

Therefore, when the device DV is inspected over a relatively long period of time, when the heat generated from the wafer W per unit time is relatively large, the total amount of heat that can be absorbed by the coolant FL is It may be relatively large. Even in such a case, the circulation device 4 can cause the coolant FL to continuously absorb the heat generated from the wafer W as latent heat during the inspection of the device DV.

The circulation device 4 shown in FIG. 4 may further include a condenser 4C. 4 C of condensers are provided in 2nd refrigerant|coolant flow path 4B2. Even if the refrigerant FL returned from the heat exchange chamber 2C through the second refrigerant flow path 4B2 contains air bubbles, the condenser 4C returns the liquid refrigerant FL containing no air bubbles to the chiller device 4A. obtain.

The inspection apparatus 1 shown in FIG. 1 may have the configuration shown in FIG. The inspection apparatus 1 shown in FIG. 5 further includes a cooling device 5 in addition to the configuration shown in FIG. In the case of the inspection apparatus 1 shown in FIG. 5, the support 2B is arranged between the stage 2A and the cooling device 5. As shown in FIG.

The cooling device 5 is a heat sink or the like, and is used to absorb excess heat applied to the coolant FL in the heat exchange chamber 2C (heat that can vaporize all of the coolant FL). The cooling device 5 can efficiently return the vaporized refrigerant FL to a liquid state. can continuously cover the back surface 2A2.

By including the cooling device 5 in the inspection device 1, the back surface 2A2 of the heat exchange chamber 2C can be continuously covered with the liquid coolant FL. Therefore, when the device DV is inspected over a relatively long period of time, when the heat generated from the wafer W per unit time is relatively large, the total amount of heat that can be absorbed by the coolant FL is It may be relatively large. Even in such a case, the cooling device 5 can cause the coolant FL to continuously absorb the heat generated from the wafer W as latent heat during the inspection of the device DV.

While various exemplary embodiments have been described above, various omissions, substitutions, and modifications may be made without being limited to the exemplary embodiments described above. Also, elements from different exemplary embodiments can be combined to form other exemplary embodiments.

For example, the substrate holder 2 can have the configuration shown in FIG. A stage 2A of the substrate holding table 2 shown in FIG. 6 includes a heater HT. The inspection device 1 includes a heating power source HP. The heater HT is connected to a heating power source HP and generates heat by electric power supplied from the heating power source HP. The heating power source HP is controlled by the controller Cnt. The heater HT is provided inside the stage 2A and extends along the main surface 2A1.

When the wafer W having the devices DV is in contact with the main surface 2A1 during inspection of the devices DV, the heater HT is arranged in such a shape and position that it overlaps the wafer W as viewed from above the main surface 2A1. . In this case, even if the wafer W is cooled by the coolant FL during the inspection of the device DV and falls below the preset reference temperature, the temperature of the wafer W can be raised to the reference temperature by the heater HT. Thus, by using the heater HT together with the coolant FL, the temperature of the wafer W can be freely lowered and raised during inspection of the device DV, and the temperature can be adjusted in a wide range.

From the foregoing description, it will be appreciated that various exemplary embodiments of the present disclosure have been set forth herein for purposes of illustration, and that various changes may be made without departing from the scope and spirit of the present disclosure. will be done. Accordingly, the various exemplary embodiments disclosed herein are not intended to be limiting, with a true scope and spirit being indicated by the following claims.

DESCRIPTION OF SYMBOLS 1... Inspection apparatus, 100... Inspection system, 2... Substrate holder, 2A... Stage, 2A1... Main surface, 2A2... Back surface, 2B... Support body, 2C... Heat exchange chamber, 3... Probe card, 3A... Probe, 4 Circulation device 4A Chiller device 4A1 Output end 4A2 Input end 4B1 First refrigerant flow path 4B2 Second refrigerant flow path 4C Condenser 5 Cooling device AB Bubbles , Cnt... control device, DR... vertically upward, DV... device, FL... refrigerant, HP... heating power source, HT... heater, MD1... direction, MD2... direction, MT... method, W... wafer.

Claims (8)

A substrate holding base provided in an inspection apparatus used for inspecting a device formed on a substrate to be inspected and used to hold the substrate to be inspected,
a stage;
a support;
with
the stage is supported by the support and has a major surface and a back surface opposite the major surface;
The substrate to be inspected is in contact with the main surface during inspection of the device,
the support comprises a heat exchange chamber,
The heat exchange chamber has the back surface exposed and is filled with a refrigerant,
the back surface is continuously covered by the liquid coolant during testing of the device;
heat generated from the substrate to be inspected is absorbed by the latent heat of the coolant , and a plurality of bubbles are generated as the latent heat in the coolant;
The support is provided on the stage facing vertically upward,
the stage is arranged on the substrate to be inspected so as to face vertically upward when the substrate to be inspected is in contact with the stage during inspection of the device;
bubbles generated in the refrigerant move upward without remaining on the back surface in the heat exchange chamber ;
Substrate holder. The back surface exposed to the heat exchange chamber has any one of a porous structure including a porous member, a fin structure including a plurality of fins, and a concavo-convex structure including a plurality of concave portions and a plurality of convex portions. have
The substrate holding table according to claim 1 . further comprising a heater,
The heater is provided inside the stage and extends along the main surface,
The substrate holding table according to claim 1 or 2 . a substrate holding table according to any one of claims 1 to 3 ;
a probe card used for testing a device formed on the substrate to be inspected held on the substrate holding table;
comprising
inspection equipment. Further comprising a circulation device used for circulation of the refrigerant through the heat exchange chamber,
The circulation device comprises a chiller device, a first coolant channel and a second coolant channel,
The first refrigerant flow path connects the output end of the chiller device and the heat exchange chamber,
The second refrigerant flow path connects the input end of the chiller device and the heat exchange chamber,
The inspection device according to claim 4 . The circulation device further comprises a condenser,
The condenser is provided in the second refrigerant flow path,
The inspection device according to claim 5 . further comprising a cooling device,
the support is positioned between the stage and the cooling device;
The inspection device according to claim 4 . An inspection method for inspecting a device formed on a substrate to be inspected,
The stage and the heat exchange chamber used for testing the device are arranged vertically upward in the order of the stage and the heat exchange chamber,
holding the substrate to be inspected on the stage;
inspecting the device;
The heat exchange chamber is filled with a liquid refrigerant,
The stage has a main surface with which the substrate to be inspected abuts, and a back surface opposite to the main surface and exposed to the heat exchange chamber,
the back surface is continuously covered by the coolant during testing of the device;
heat generated from the substrate to be inspected is absorbed by the latent heat of the coolant , and a plurality of bubbles are generated as the latent heat in the coolant;
A support including the heat exchange chamber is provided on the stage facing vertically upward,
the stage is arranged on the substrate to be inspected so as to face vertically upward when the substrate to be inspected is in contact with the stage during inspection of the device;
bubbles generated in the refrigerant move upward without remaining on the back surface in the heat exchange chamber ;
Inspection method.

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